WO2016143151A1 - 発光素子及び映像表示装置 - Google Patents
発光素子及び映像表示装置 Download PDFInfo
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- WO2016143151A1 WO2016143151A1 PCT/JP2015/067203 JP2015067203W WO2016143151A1 WO 2016143151 A1 WO2016143151 A1 WO 2016143151A1 JP 2015067203 W JP2015067203 W JP 2015067203W WO 2016143151 A1 WO2016143151 A1 WO 2016143151A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Definitions
- the present invention relates to a light emitting element and an image display device including the light emitting element.
- a large video display device in which a large number of light emitting elements are arranged in a matrix in the vertical and horizontal directions on a display screen is often installed outdoors such as sports facilities and building walls.
- the video display device displays characters, figures, and other images on the display screen by changing the luminance and emission color of each light emitting element according to a video signal input from the outside (for example, Patent Document 1). , 2).
- a light-emitting element used in a video display device is configured by arranging a light source such as an LED (light emitting diode) in a concave portion of a case and filling the concave portion with a transparent resin.
- the light rays emitted from the light source are transmitted to the outside through the transparent resin.
- the boundary surface of the transparent resin in contact with the space outside the case, that is, the light emitting surface of the light emitting element is formed flat (for example, Patent Documents 3 and 4).
- a bowl-shaped member is disposed between the horizontal arrangements of the light emitting elements to block sunlight incident on the display screen from obliquely above, Occurrence is suppressed.
- the saddle-shaped member arranged in this way can effectively block sunlight when the sun is at a high position.
- the sun when the sun is at a low position, the sunlight is incident at a shallow angle, dives under the bowl-shaped member, and reaches the display screen.
- the bowl-shaped member is made high, the incidence of sunlight can be blocked even if the sun is at a low position.
- the bowl-shaped member is made high, it becomes difficult to visually recognize the light emission of the light emitting element from obliquely below or obliquely above, so the range (viewing angle) in which the image displayed on the display screen can be visually recognized becomes narrow. Therefore, there is a limit to the height of the bowl-shaped member. Therefore, when the sun is at a low position, such as in the morning or evening, the sunlight incident on the display screen cannot be blocked by the bowl-shaped member.
- the light emitting surface of the light emitting element is formed flat like the light emitting elements described in Patent Documents 3 and 4. Therefore, all sunlight incident on the light emitting surface of the light emitting element is reflected in the same direction. All reflected light is incident on the viewer's eyes in the direction in which sunlight is reflected, together with the light emitted from the light emitting element, so the light emitted from the light emitting element is buried in the reflected light and the display screen is uniform. Looks bright. That is, the contrast of the image is lowered and the entire image looks bright. This makes it difficult for the viewer to visually recognize the image on the display screen.
- the present invention has been made based on such a background, and an object thereof is to provide a light emitting element in which all external light is not reflected in the same direction when external light is incident on the light emitting element. It is another object of the present invention to provide a video display device in which the visibility of an image on the display screen is unlikely to deteriorate even when external light is incident on the display screen.
- the present invention provides a case having a recess, a light source disposed in the recess of the case, a light source of the light source, and a boundary surface in contact with a space outside the case on the outside of the case. And a transparent member having a convex curved surface that swells to constitute a light emitting element.
- the external light incident on the light emitting element is reflected by the convex curved surface and diverges in various directions. Therefore, no matter what direction the viewer views the light emitting element, all reflected light is reflected by the viewer. It does not enter the eye. Therefore, the phenomenon in which the light emitted from the light emitting element is buried in the reflected light and the display screen appears uniformly bright is suppressed. That is, a decrease in image contrast is suppressed. As a result, the visibility of the image of the video display device in an environment where external light is incident is improved.
- FIG. 1 is a configuration diagram of a video display device according to an embodiment of the present invention. It is a block diagram which shows the use condition of the video display apparatus shown in FIG. It is a side view explaining the effect
- FIG. 1C It is a side view which shows the magnitude
- FIG. 1A to 1C are configuration diagrams of a light emitting device 1 according to an embodiment of the present invention.
- FIG. 1A is a plan view of the light emitting element 1
- FIG. 1B is a side view of the light emitting element 1.
- 1C is a cross-sectional view of the light-emitting element 1 taken along the line A-A ′ of FIG. 1A.
- the light emitting element 1 accommodates three LED chips 3 r, 3 g, and 3 b that function as a light source of the light emitting element 1 inside the case 2.
- the LED chips 3r, 3g, and 3b include light emitting diodes that emit red, green, and blue light, respectively.
- the light-emitting element 1 can obtain various emission colors by changing the emission intensity (luminance) of the LED chips 3r, 3g, and 3b. Further, the ends of the three sets of extraction electrodes 4r, 5r, 4g, 5g, 4b, and 5b are exposed outside the case 2.
- the case 2 is a resin molded product that holds the LED chips 3r, 3g, 3b and the like and constitutes the outer shell of the light emitting element 1.
- the material of the case 2 is, for example, a thermoplastic resin such as a polyphthalamide resin, or a thermosetting resin such as a silicone resin or an epoxy resin, but is not limited thereto.
- the case 2 has a recess 6 formed therein.
- extraction electrodes 4 g and 5 g are arranged in the recess 6, extraction electrodes 4 g and 5 g are arranged.
- the extraction electrodes 4g and 5g extend to the outside of the case 2, and the end portions thereof are exposed to the outside of the case 2 as described above.
- the extraction electrodes 4r, 5r, 4b, and 5b are similarly arranged.
- the LED chip 3g disposed inside the recess 6 is placed on the extraction electrode 4g and electrically connected to the extraction electrode 4g.
- One end of the bonding wire 7 is electrically connected to the upper surface of the LED chip 3g, and the other end of the bonding wire 7 is electrically connected to the extraction electrode 5g.
- the LED chips 3r and 3b are also mounted on the extraction electrodes 4r and 4b, respectively, and are electrically connected to the extraction electrodes 4r and 4b.
- the LED chips 3r and 3b are also electrically connected to the extraction electrodes 5r and 5b via the bonding wires 7, respectively.
- the concave portion 6 is filled with a transparent resin to form a sealing member 8.
- the sealing member 8 is a member that closes the concave portion 6 and seals the LED chips 3r, 3g, and 3b inside the concave portion 6, and is an example of the transparent member of the present invention.
- the sealing member 8 is also a member that transmits light emitted from the LED chips 3r, 3g, and 3b.
- the material of the sealing member 8 is, for example, an epoxy resin or a silicone resin, but is not limited thereto.
- the sealing member 8 bulges outside the case 2, and the boundary surface 9 with the space outside the light emitting element 1 forms a convex curved surface having a convex lens shape.
- the boundary surface 9 is farthest from the bottom surface 6a of the recess 6 at the center thereof, that is, the intersection point 11 of the optical axis 10 of the LED chip 3g and the boundary surface 9, and away from the center (intersection point 11). Accordingly, it is inclined so as to approach the bottom surface 6a of the recess 6 asymptotically. Further, the inclination of the boundary surface 9 increases as the distance from the intersection 11 increases.
- the sealing member 8 is an example of the transparent member of the present invention. As described above, the sealing member 8 is made of a transparent resin, and light emitted from the LED chips 3r, 3g, and 3b is transmitted through the sealing member 8 and emitted outside the case 2. The sealing member 8 closes the opening on the upper surface of the case 2, that is, the entrance of the recess 6.
- the light emitting element 1 is manufactured by the following process. First, the extraction electrodes 4r, 5r, 4g, 5g, 4b, and 5b are arranged inside a molding die (not shown), resin is injected into the molding die to mold the case 2, and at the same time, the extraction electrodes 4r and 5r. 4g, 5g, 4b and 5b are fixed to the case 2.
- the material of the case 2 is, for example, a thermoplastic resin such as a polyphthalamide resin, or a thermosetting resin such as a silicone resin or an epoxy resin.
- light reflecting particles such as titanium dioxide may be mixed in the resin.
- the LED chips 3r, 3g, and 3b are joined to the extraction electrodes 4r, 4g, and 4b in the recess 6 of the case 2. Then, the LED chips 3r, 3g, 3b and the extraction electrodes 5r, 5g, 5b are electrically connected via the bonding wires 7.
- a liquid transparent resin is injected into the recess 6 to form the sealing member 8.
- an amount of resin exceeding the volume of the recess 6 is injected into the recess 6 at a low injection rate.
- the resin is injected at a low speed, the liquid level of the resin overflowing from the concave portion 6 rises like a convex lens due to the action of surface tension.
- a convex lens-shaped boundary surface 9 is formed.
- the material of the sealing member 8 is, for example, an epoxy resin or a silicone resin.
- the operation of the light-emitting element 1 will be described with reference to FIG.
- the sunlight 12 is parallel light
- the sunlight 12 is incident on all the boundary surfaces 9 of the sealing member 8 of the light emitting element 1 from the same direction.
- the boundary surface 9 of the sealing member 8 is formed with a convex curved surface that swells outside the case 2, so that the sunlight 12 is reflected in various directions.
- the direction of the reflected light 13 differs depending on where the sunlight 12 hits the boundary surface 9. That is, the reflected light 13 generated at the boundary surface 9 diverges.
- all sunlight 12 does not reflect in the same direction. Therefore, no reflected light 13 enters the eyes of the viewer no matter which direction the light emitting element 1 is viewed.
- FIG. 3 is a block diagram of the video display device 14 according to the embodiment of the present invention.
- the display screen 15 of the video display device 14 is configured by arranging a large number of light emitting elements 1 on a substrate 16 in a matrix form in the vertical and horizontal directions. That is, a large number of light emitting elements 1 are arranged in the horizontal direction to form a light emitting element row 17, and a large number of light emitting element rows 17 are arranged in the vertical direction.
- a wiring pattern (not shown) is formed on the substrate 16, and the extraction electrodes 4 r, 5 r, 4 g, 5 g, 4 b, and 5 b (not shown in FIG. 3) of each light emitting element 1 are respectively connected to the wiring pattern. Connected.
- the video display device 14 includes a driver 18.
- the driver 18 is an electric circuit that is connected to each light emitting element 1 via the wiring pattern described above, and distributes the power supplied from the power source to each light emitting element 1 to individually adjust the luminance and color of the light emitting element 1. .
- the video display device 14 is used by being connected to a video signal source 20 via a host controller 19.
- the video signal source 20 is, for example, a server that outputs a video signal stored in advance to the host controller 19.
- the host controller 19 converts the video signal input from the video signal source 20 according to the arrangement of the light emitting elements 1 in the video display device 14, determines the luminance and color development of each light emitting element 1, and instructs the driver 18. Computer.
- the video display device 14 individually adjusts the luminance and color of the light emitting elements 1 arranged on the substrate 16 and displays an image on the display screen 15. Further, the moving image (video) is displayed by changing the image as time elapses.
- a display screen 15 of the video display device 14 corresponds to a small video display device, for example, a screen of a liquid crystal display, and one light emitting element 1 corresponds to one pixel.
- the reflected light 13 of the sunlight 12 incident on the image display device 14 varies as shown in FIG. Diverges in the direction. Therefore, all the sunlight 12 incident on the video display device 14 is not reflected in the same direction.
- the boundary surface 9 is drawn with a large curvature, but the convex curved surface provided on the boundary surface 9 may not be conspicuous.
- the convex curved surface with which the boundary surface 9 is provided is not restricted to a spherical surface.
- the convex curved surface may be an aspherical surface.
- the reflected light is diverged in various directions.
- the light emitting elements according to the present invention are arranged in a matrix in the vertical and horizontal directions on the substrate to constitute a video display device
- the reflected light is various. Diverged in the direction. Therefore, the contrast of the image does not decrease no matter what direction the video display device is viewed.
- the said embodiment is an illustration of the specific embodiment of this invention, and the technical scope of this invention is not limited by description of the said embodiment.
- the present invention can be freely modified or improved within the scope of the technical idea shown in the claims.
- the addition of the component which is not disclosed by the said embodiment is arbitrary.
- the central axis of the sealing member 8 and the optical axis 10 are arranged coaxially is shown, but the relationship between the two is not limited to coaxial.
- the central axis of the sealing member 8 and the optical axis 10 may be shifted.
- the cubic curved surface like a convex lens was illustrated as a convex curved surface with which the boundary surface 9 of the sealing member 8 is provided, a convex curved surface is not limited to a cubic curved surface.
- the convex curved surface may be a quadric surface.
- the transparent member is a sealing member manufactured by such a process.
- the member 8 is not limited.
- a transparent member 21 manufactured in another process, that is, solidified in advance, may be fitted into the recess 6.
- another member having a convex curved surface may be added to the upper surface of the sealing member 8.
- an additional member 22 made of a transparent material and having an upper surface raised like a convex lens may be attached on the sealing member 8 whose upper surface is finished flat.
- the additional member 22 may be formed in advance in the shape shown in the figure, and may be placed on the sealing member 8 after forming and bonded.
- the additional member 22 may be formed by dripping the resin liquid onto the sealing member 8, raising the surface of the resin liquid by the action of surface tension, and curing it in the raised state.
- the additional member 22 may be formed by placing a mold on the sealing member 8 and injecting a resin material into the mold.
- a plurality of additional members 22 as shown in FIG. 9 may be formed on the sealing member 8 by dropping the resin liquid onto a plurality of locations on the sealing member 8. In this case, since the amount of the resin liquid dripped at one place is small, the surface tension becomes larger than the weight of the resin liquid. Therefore, it becomes easy to raise the additional member 22 high.
- a plurality of additional members 22 may be configured in advance and pasted on the sealing member 8 to be configured as shown in FIG.
- a plurality of additional members 22 may be formed by placing a mold on the sealing member 8 and injecting a resin material into the mold.
- the number of LED chips 3r, 3g, 3b provided in the light emitting element 1 is not limited to three. One or two may be sufficient, and four or more may be sufficient. Further, the emission color of the light emitting element 1 is not limited. The combination of luminescent colors is arbitrary. A chip provided with a plurality of light emitting diodes with different colors on one substrate may be provided as a light source.
- the host controller 19 is an external device of the video display device 14, but the host controller 19 may be incorporated in the video display device 14.
- the external light in this invention is not limited to sunlight.
- a light beam incident on the light emitting element 1 or the image display device 14 from artificial lighting such as an indoor lighting device or an outdoor lighting device also corresponds to external light.
- 1 light emitting element 2 case, 3r, 3g, 3b LED chip, 4r, 4g, 4b, 5r, 5g, 5b extraction electrode, 6 recess, 6a bottom surface, 7 bonding wire, 8 sealing member, 9 boundary surface, 10 light Axis, 11 intersection, 12 sunlight, 13 reflected light, 14 video display device, 15 display screen, 16 substrate, 17 light emitting element array, 18 driver, 19 host controller, 20 video signal source, 21 transparent member, 22 additional member
Abstract
Description
Claims (4)
- 凹部を備えるケースと、
前記ケースの前記凹部に配置された光源と、
前記光源の発光を透過させるとともに、前記ケースの外部の空間と接する境界面に前記ケースの外側に膨らむ凸曲面を備える透明部材と、
を備える発光素子。 - 前記透明部材は、
前記凹部に充填されて、前記光源を前記凹部に封止する封止部材の表面に、前記ケースの外側に膨らむ凸曲面を備える追加部材を取り付けて構成される
請求項1に記載の発光素子。 - 前記透明部材は、
前記封止部材の表面に、複数個の前記追加部材を取り付けて構成される
請求項2に記載の発光素子。 - 縦方向及び横方向にマトリクス状に配列された、請求項1から請求項3のいずれか一項に記載の複数個の発光素子を備える映像表示装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15884637.8A EP3270427A1 (en) | 2015-03-12 | 2015-06-15 | Light-emitting element and image display device |
US15/556,409 US20180108819A1 (en) | 2015-03-12 | 2015-06-15 | Light-emitting element and image display device |
JP2017504548A JPWO2016143151A1 (ja) | 2015-03-12 | 2015-06-15 | 発光素子及び映像表示装置 |
CN201580077398.1A CN107408609A (zh) | 2015-03-12 | 2015-06-15 | 发光元件及视频显示装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2015048979 | 2015-03-12 | ||
JP2015-048979 | 2015-03-12 |
Publications (1)
Publication Number | Publication Date |
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WO2016143151A1 true WO2016143151A1 (ja) | 2016-09-15 |
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PCT/JP2015/067203 WO2016143151A1 (ja) | 2015-03-12 | 2015-06-15 | 発光素子及び映像表示装置 |
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US (1) | US20180108819A1 (ja) |
EP (1) | EP3270427A1 (ja) |
JP (1) | JPWO2016143151A1 (ja) |
CN (1) | CN107408609A (ja) |
TW (1) | TWI601316B (ja) |
WO (1) | WO2016143151A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2022104258A (ja) * | 2020-12-28 | 2022-07-08 | 三菱電機株式会社 | 表示ユニット、表示装置、及び表示ユニットの製造方法 |
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JPH1187780A (ja) * | 1997-09-04 | 1999-03-30 | Sharp Corp | 発光装置 |
JP2007123437A (ja) * | 2005-10-26 | 2007-05-17 | Toyoda Gosei Co Ltd | 蛍光体板及びこれを備えた発光装置 |
JP2008147513A (ja) * | 2006-12-12 | 2008-06-26 | Sanyo Electric Co Ltd | 発光装置 |
JP2008172140A (ja) * | 2007-01-15 | 2008-07-24 | Stanley Electric Co Ltd | ハウジングと上部の硬質保護材の間に緩衝材を持つ発光装置 |
JP2015023219A (ja) * | 2013-07-22 | 2015-02-02 | ローム株式会社 | Led発光装置およびled発光装置の製造方法 |
Family Cites Families (4)
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US7910938B2 (en) * | 2006-09-01 | 2011-03-22 | Cree, Inc. | Encapsulant profile for light emitting diodes |
US20120098006A1 (en) * | 2010-10-22 | 2012-04-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light emitting diode package with photoresist reflector and method of manufacturing |
CN102185082B (zh) * | 2011-04-08 | 2013-03-27 | 深圳市华星光电技术有限公司 | 发光二极管构造及其制造方法 |
US9532464B2 (en) * | 2013-07-22 | 2016-12-27 | Rohm Co., Ltd. | LED lighting apparatus |
-
2015
- 2015-06-15 WO PCT/JP2015/067203 patent/WO2016143151A1/ja active Application Filing
- 2015-06-15 JP JP2017504548A patent/JPWO2016143151A1/ja active Pending
- 2015-06-15 EP EP15884637.8A patent/EP3270427A1/en not_active Withdrawn
- 2015-06-15 CN CN201580077398.1A patent/CN107408609A/zh active Pending
- 2015-06-15 US US15/556,409 patent/US20180108819A1/en not_active Abandoned
- 2015-07-27 TW TW104124219A patent/TWI601316B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1187780A (ja) * | 1997-09-04 | 1999-03-30 | Sharp Corp | 発光装置 |
JP2007123437A (ja) * | 2005-10-26 | 2007-05-17 | Toyoda Gosei Co Ltd | 蛍光体板及びこれを備えた発光装置 |
JP2008147513A (ja) * | 2006-12-12 | 2008-06-26 | Sanyo Electric Co Ltd | 発光装置 |
JP2008172140A (ja) * | 2007-01-15 | 2008-07-24 | Stanley Electric Co Ltd | ハウジングと上部の硬質保護材の間に緩衝材を持つ発光装置 |
JP2015023219A (ja) * | 2013-07-22 | 2015-02-02 | ローム株式会社 | Led発光装置およびled発光装置の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022104258A (ja) * | 2020-12-28 | 2022-07-08 | 三菱電機株式会社 | 表示ユニット、表示装置、及び表示ユニットの製造方法 |
Also Published As
Publication number | Publication date |
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TWI601316B (zh) | 2017-10-01 |
EP3270427A1 (en) | 2018-01-17 |
TW201633566A (zh) | 2016-09-16 |
CN107408609A (zh) | 2017-11-28 |
JPWO2016143151A1 (ja) | 2017-09-14 |
US20180108819A1 (en) | 2018-04-19 |
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