WO2016129200A1 - 構造体および配線基板 - Google Patents
構造体および配線基板 Download PDFInfo
- Publication number
- WO2016129200A1 WO2016129200A1 PCT/JP2016/000019 JP2016000019W WO2016129200A1 WO 2016129200 A1 WO2016129200 A1 WO 2016129200A1 JP 2016000019 W JP2016000019 W JP 2016000019W WO 2016129200 A1 WO2016129200 A1 WO 2016129200A1
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- WIPO (PCT)
- Prior art keywords
- transmission line
- conductor plane
- conductor
- slit
- plane
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/2005—Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
Definitions
- the present invention relates to a structure and a wiring board.
- a magnetic field is induced by a current flowing into a circuit at the time of switching of a digital circuit, or an electric field is induced by a voltage fluctuation generated at the time of switching, thereby generating an electromagnetic wave.
- the electromagnetic wave becomes electromagnetic noise propagating through a parallel plate line composed of a conductor plane. Electromagnetic noise causes problems such as destabilizing the operation of other circuits and degrading the wireless performance of devices. For this reason, if the technique which suppresses electromagnetic noise can be established, the stability of a circuit and the radio
- Patent Documents 1, 2, and 3 have an EBG (Electromagnetic Band Gap) characteristic having a dispersion relationship with a band gap that prohibits propagation of an electromagnetic wave at a characteristic frequency (hereinafter, referred to as an electromagnetic band gap). , which is described as an EBG structure), and enables suppression of propagation of electromagnetic wave noise between power planes.
- EBG Electromagnetic Band Gap
- the EBG structure that is a structure for suppressing electromagnetic noise is preferably as small as possible.
- the structure described in Patent Document 1 has a problem that the size of the structure itself is large.
- an object of the present invention is to provide a structure and a wiring board that enable a small EBG structure.
- the structure and the wiring board according to the present invention mainly adopt the following characteristic configuration.
- the structure according to the present invention is: A first conductor plane; A second conductor plane disposed to face the first conductor plane; The first transmission line, wherein the first conductor plane and the second conductor plane are formed in different layers, are disposed opposite to the second conductor plane, and one end is an open end.
- a conductor via connecting the other end of the first transmission line and the first conductor plane; A slit formed on the second conductor plane and extending to both sides of the first transmission line, starting from a position overlapping the first transmission line in plan view; It is characterized by comprising at least.
- a wiring board comprises: A first conductor plane; A second conductor plane disposed to face the first conductor plane; The first transmission line, wherein the first conductor plane and the second conductor plane are formed in different layers, are disposed opposite to the second conductor plane, and one end is an open end.
- a conductor via connecting the other end of the first transmission line and the first conductor plane; A slit formed on the second conductor plane and extending to both sides of the first transmission line, starting from a position overlapping the first transmission line in plan view; It has the structure comprised at least, It is characterized by the above-mentioned.
- the EBG structure which aimed at can be implement
- FIG. 4 is a circuit diagram showing an example of an equivalent circuit in a direction along an arbitrary straight line in an xy plane in the structure shown in FIG. 3 as the first embodiment. It is explanatory drawing which shows an example of the dispersion
- FIG. 1 It is a perspective view which shows the external appearance of the structure in the 1st modification of 1st Embodiment which concerns on this invention. It is a top view which shows an example of the upper surface of the structure shown in FIG. It is sectional drawing which shows an example of the cross-section of the structure shown in FIG. It is a characteristic view which shows an example of the electromagnetic field analysis result showing the effect of the 1st modification of 1st Embodiment which concerns on this invention. It is a perspective view which shows the external appearance of the structure in the 2nd modification of 1st Embodiment which concerns on this invention. It is a top view which shows an example of the upper surface of the structure shown in FIG.
- FIG. 1 It is a perspective view which shows the external appearance of the structure in the 3rd modification of 1st Embodiment which concerns on this invention. It is sectional drawing which shows an example of the cross-section of the structure shown in FIG. It is a perspective view which shows the example which the slit of the structure shown in FIG. 1 and a 1st transmission line overlap in the position different from FIG. 1 as 1st Embodiment based on this invention. It is a perspective view which shows the example by which the slit of the structure shown in FIG. 1 is arrange
- the same reference numerals are assigned to the same components, and the description thereof is omitted as appropriate.
- the reference numerals given in the drawings are the components for the purpose of facilitating understanding. Needless to say, the elements are added for convenience, and the present invention is not intended to be limited to the illustrated embodiments.
- the substrate thickness direction that is, for example, the vertical direction in FIG. 1 and the z-axis direction
- the present invention is provided with a first conductor plane, a second conductor plane provided to face the first conductor plane, and to face the second conductor plane, and one end is A first transmission line that is an open end (open end), a conductor via that connects the other end of the first transmission line and the first conductor plane, and the second conductor plane; And providing a structure including at least a slit extending on both sides of the first transmission line starting from a position overlapping the first transmission line in plan view. It is a feature. Thus, it is possible to realize a small EBG structure.
- FIG. 1 is a perspective view showing the appearance of the structure according to the first embodiment of the present invention, and shows an example of the EBG structure according to the first embodiment.
- 2 is a cross-sectional view showing an example of a cross-sectional structure of the structure shown in FIG.
- the cross-sectional view of FIG. 2 shows a cross-section between II and II shown in FIG.
- the structure in the first embodiment includes a first conductor plane 101 (first conductor) and a second conductor plane 102 (second conductor). ), The first transmission line 104, the conductor via 106 (first conductor via), and the slit 105 (inductance imparting member).
- the second conductor plane 102 is opposed to the first conductor plane 101.
- the first transmission line 104 is provided in a region sandwiched between the first conductor plane 101 and the second conductor plane 102, and is a different layer from the first conductor plane 101 and the second conductor plane 102. Is formed.
- the first transmission line 104 is disposed so as to face the second conductor plane 102 and extends linearly in the y-axis direction of FIG. 1. One end is an open end (open end) and the other end is It is connected to the first conductor plane 101 via the conductor via 106 and functions as an open stub.
- the first transmission line 104 is provided between the first conductor plane 101 and the second conductor plane 102, as shown in FIG.
- the distance t 1 between the first transmission line 104 and the first transmission line 104 is preferably smaller than the distance t 2 between the first conductor plane 101 and the first transmission line 104.
- the distance t 1 between the second conductor plane 102 and the first transmission line 104 is (1 ⁇ 2) the distance t 2 between the first conductor plane 101 and the first transmission line 104. It is desirable that it is less than twice (t 1 ⁇ (1/2) ⁇ t 2 ).
- the conductor via 106 extends in the z-axis direction (thickness direction) in order to connect the other end of the first transmission line 104 and the first conductor plane 101.
- the first dielectric layer 107 extends from the upper surface to the lower surface.
- the slit 105 is provided on the second conductor plane 102 and overlaps the first transmission line 104 in plan view, that is, the other end of the first transmission line 104 and the z-axis direction (thickness direction).
- the first transmission line 104 is provided on both sides of the first transmission line 104 so as to extend in the x-axis direction perpendicular to the y-axis direction.
- the structure according to the first embodiment is formed in a wiring board such as a printed wiring board, for example, and behaves as a structure having an EBG (Electromagnetic Band Gap) characteristic (hereinafter referred to as an EBG structure).
- the EBG structure has at least a first conductor plane 101 and a second conductor plane 102 which are arranged in parallel at a distance in the thickness direction (z-axis direction in FIG. 1), as described below.
- the unit structure 103 is configured.
- the unit structure 103 is a set of components of the structure shown in FIG. 1, and as described above with reference to FIG. 1, in addition to the first conductor plane 101 and the second conductor plane 102, The first transmission line 104 disposed in a different layer from the first conductor plane 101 and the second conductor plane 102, the slit 105 formed in the second conductor plane 102, and the first transmission line 104 And at least a conductor via 106 that electrically connects the other end of the first conductor plane 101 to the first conductor plane 101.
- the slit 105 is provided on the second conductor plane 102, and starts from the position overlapping the first transmission line 104 in the z-axis direction (thickness direction). Stretched on both sides.
- the slit length L is usually 2 of the transmission line length D of the first transmission line 104.
- the first transmission line 104 overlaps the slit 105 in a plan view at a position within (D / 8) or less from the connection point between the first transmission line 104 and the conductor via 106.
- the first band gap is more desirable because the size reduction effect by the slit 105 can be further increased.
- the EBG structure illustrated in FIGS. 1 and 2 further includes one side (upper surface side: first side) in the thickness direction of the first conductor plane 101 between the first conductor plane 101 and the second conductor plane 102.
- the first transmission line 104 is formed between the other side (lower surface side) of the second dielectric layer 108 in the thickness direction and one side (upper surface side) of the first dielectric layer 107. It is arranged in between. Furthermore, the slit 105 is provided in the second conductor plane 102, and as shown in FIGS. 1 and 2, starting from a position overlapping the first transmission line 104 in the z-axis direction (thickness direction), Both sides of the first transmission line 104 extend in the x-axis direction perpendicular to the y-axis direction of the first transmission line 104.
- the conductor via 106 extends in the z-axis direction (thickness direction) and extends from one side (upper surface side) to the other side (lower surface side) of the first dielectric layer 107.
- the other end of the first transmission line 104 and the first conductor plane 101 are electrically connected.
- a large number of the above-described components are repeatedly arranged by the first conductor plane 101, the second conductor plane 102, the first transmission line 104, the slit 105, and the conductor via 106.
- a unit structure 103 that can be configured is configured.
- FIG. 3 is a perspective view of the structure according to the first embodiment of the present invention when a plurality of the structures shown in FIG. 1 are arranged, and shows the region of the unit structure 103 of FIG. ing. 3 shows the case where the unit structures 103 are regularly arranged.
- the present invention does not require the arrangement of the unit structures 103 to be regularly arranged as shown in FIG. You can arrange them randomly. Further, in the structure shown in FIG.
- FIG. 4 is a circuit diagram showing an example of an equivalent circuit in the direction along an arbitrary straight line in the xy plane in the structure shown in FIG. 3 as the first embodiment.
- 2 shows an equivalent circuit diagram of the EBG structure in FIG.
- FIG. 5 is an explanatory diagram showing an example of the dispersion relationship (relationship between wave number and frequency) of the EBG structure in the first embodiment, and the effect of the EBG structure in the first embodiment is described. is doing.
- the repeating unit 301 corresponding to the unit structure 103 includes a first conductor plane 101 and a second conductor plane 102.
- Parallel plate line 302 transmission line 303 corresponding to first transmission line 104 of an open stub, inductance 304 by slit 105 attached in the middle of first transmission line 104, inductance 305 by conductor via 106, It is made up of.
- the repeating unit 301 is one equivalent circuit of the unit structure 103 shown in FIG. 3. By assuming a situation in which this structure is periodically arranged infinitely, the repeating unit 301 of the first embodiment is used. The dispersion relation of the parallel plate lines in which the structures are arranged can be calculated.
- the inductance added by the slit 105 is derived from the short stub formed by the slit 105, and the slit 105 extending on both sides of the first transmission line 104 along the x-axis direction behaves as a short stub.
- the length 1 of the short stub is ⁇ ⁇ 2 (n ⁇ 1) / 4 or more and ⁇ ⁇ (2n ⁇ 1) / 4.
- the short stub formed by the slit 105 behaves as an inductance. Therefore, the structure in the first embodiment can be described by the equivalent circuit shown in FIG.
- a block boundary condition of Bloch is imposed on the ABCD matrix of the repeating unit 301 calculated from the equivalent circuit diagram shown in FIG. 4, and the infinite number of structures of the unit structure 103 are periodically arranged.
- the band gap frequency can be calculated.
- FIG. 5 is an explanatory diagram showing an example of the dispersion relationship (relationship between wave number and frequency) of the EBG structure in the first embodiment.
- the structure of the unit structure 103 shown in FIG. The dispersion relation obtained as a result of calculating the dispersion relation of the parallel plate lines when an infinite number of bodies are periodically arranged is shown.
- the vertical axis in FIG. 5 indicates the frequency
- the horizontal axis indicates a value obtained by multiplying the wave number by the repeating unit 301 (unit structure 103), and how much the phase of the electromagnetic wave propagating in each repeating unit (unit structure 103) rotates. Indicates what to do.
- FIG. 5A shows the dispersion relation of the structure when there is no slit 105
- FIG. 5B shows the first implementation when a value of 1 nH is used as the value of the inductance 304 added by the slit 105.
- the dispersion relation of the structure in the form of is shown.
- FIG. 5C shows the dispersion relationship of the structures in the first embodiment when a value of 2 nH is used as the inductance value added by the slit 105.
- a value of 0 mm is used as the position of the slit 105, that is, the transmission line length l 1 from the connection portion with the conductor via 106 to the slit 105.
- the slit 105 In order to effectively operate the slit 105 as an inductance, it is necessary to excite the electromagnetic wave propagating through the first transmission line 104 so that the slit 105 operates as a slot line. For this purpose, it is necessary that a current flows so as to induce electric charges at both ends of the slit 105 provided in the planar second conductor plane 102 that becomes the return path of the first transmission line 104. .
- Different current standing waves are generated according to the frequency in the first transmission line 104 and the second conductor plane 102 which is a return path of the first transmission line 104.
- the first band gap is shown as the band gap frequency band in the filled portion in FIG.
- a current standing wave is generated such that the current intensity changes from an antinode to a node as it proceeds from the connection portion with the conductor via 106 to the open end.
- the current standing so that the electric field current intensity changes from antinode, node, antinode and node to the open end from the connection portion with the conductor via 106.
- the electric current intensity is such that the electric field current intensity changes from node to node, antinode, node, antinode and node as it goes from the connection portion with the conductor via 106 to the open end.
- a standing wave is generated.
- n th BG (n: natural number)
- the electric field current intensity increases from the connection to the conductor via 106 toward the open end.
- a standing current wave including n repetitions is generated, and at the upper limit frequency, the electric field current strength starts from the connection point with the conductor via 106 to the open end, and then repeats the antinode-to-node repetition.
- Current standing waves are generated that include n.
- the second conductor plane 102 is placed at the lower limit frequency of the n- th band gap (n th BG).
- the slit 105 is provided at the antinode position of the generated current standing wave, and the slit 105 can be effectively operated as an inductance.
- the addition of inductance to the series portion of the equivalent circuit model of the first transmission line 104 means that the electrical length of the first transmission line 104 is extended.
- the band gap frequency is determined by the electrical length of the first transmission line 104. That is, by adding the inductance 304 by the slit 105, the band gap frequency can be lowered. This means that when the structure with the slit 105 is compared with the structure without the slit 105, the same band gap frequency can be realized with a shorter transmission line length, that is, a smaller structure. ing.
- the lower limit frequency decreases as the values of B and C and the additional inductance increase from A to B in FIG.
- the upper limit frequency of the second band gap (2 nd BG) also decreases as the values of A and B and C and the additional inductance in FIG. 5 increase.
- the first transmission line 104 may have any arrangement and shape as long as one end is an open end and the other end is connected to the conductor via 106.
- FIG. 2, and FIG. 3 in the first embodiment described above show the case where the first transmission line 104 has a linear shape. For example, even if it has a spiral shape as shown in FIG. It may be a meander shape, or may be an irregular shape.
- the shape of the first transmission line 104 is spiral as shown in FIG. 6, it is desirable that the shape of the slit 105 is also spiral. Further, when the shape of the first transmission line 104 is a spiral shape, it is desirable that the conductor via 106 be disposed on the outer periphery of the spiral-shaped first transmission line 104 as shown in FIG.
- FIG. 6 is a perspective view showing the appearance of the structure in the first modification of the first embodiment according to the present invention, and an example in which the first transmission line 104 and the slit 105 are formed in a spiral shape.
- FIG. 7 is a top view showing an example of the top surface of the structure shown in FIG.
- FIG. 8 is a cross-sectional view showing an example of the cross-sectional structure of the structure shown in FIG. 6, and shows an xy cross-section at the position indicated as A in FIG. That is, as shown in FIGS. 6 and 7, the slit 105 has a spiral shape according to the spiral shape of the first transmission line 104.
- the transmission line length can be secured with a small mounting area by making the shape of the first transmission line 104 into a spiral shape as shown in FIGS. 6 and 7 or a meander shape.
- the EBG structure can be efficiently arranged in a small area.
- the shape of the first transmission line 104 can be routed around other structures and the EBG structure in a limited region. It can be arranged efficiently.
- FIG. 9 is a characteristic diagram showing an example of an electromagnetic field analysis result representing the effect of the first modification of the first embodiment according to the present invention, where the horizontal axis represents frequency and the vertical axis represents propagation characteristic S 21. (Insertion loss).
- the solid line in the graph in FIG. 9, FIG. 6 shows the propagation characteristics S 21 of the parallel plate line arrangement where structures are arranged as shown in FIG. 7 or 8 into five columns, the broken line graph in FIG. 9, Figure 6 shows the propagation characteristics S 21 of the parallel plate line are arranged from the structure shown in FIG. 7 or FIG. 8 the structure in the case of removing only the slit 105 in five columns.
- the first band gap (1 st BG) Frequency (frequency pass characteristics or transmission characteristics S 21 was defined as the frequency at which the minimum) is shifted to a lower frequency side I understand that.
- the shape of the slit 105 can be any shape as long as it extends in the x-axis direction on both sides of the first transmission line 104, starting from a position overlapping the first transmission line 104 in the z-axis direction (thickness direction). Arrangement and shape may be sufficient. 1, FIG. 2, and FIG. 3 in the first embodiment described above show the case where the slit 105 has a linear shape. For example, the meander shape as shown in FIG. Alternatively, it may have a spiral shape, or may have a completely irregular shape. At this time, the slit 105 may be arranged to intersect the first transmission line 104 a plurality of times.
- FIG. 14 is a perspective view showing an example in which the slit 105 and the first transmission line 104 of the structure shown in FIG. 1 are overlapped at a position different from FIG. 1 as the first embodiment according to the present invention.
- the number of slits 105 is not necessarily one.
- a plurality of slits 105 a and 105 b may be arranged for the same first transmission line 104.
- FIG. 15 is a perspective view showing an example in which a plurality of slits 105 of the structure shown in FIG. 1 are arranged as the first embodiment according to the present invention.
- each of the plurality of slits 105a and 105b functions as an inductance added to the first transmission line 104.
- the slit 105a is more than the case of only the slit 105a. The effect of lowering the band gap frequency can be expected.
- the case where there are two slits 105 is shown.
- the number of slits 105 is not necessarily two, and three, four, or more slits 105 are arranged. Also good.
- FIG. 10 is a perspective view showing the appearance of the structure in the second modification of the first embodiment according to the present invention, and shows an example in which the slit 105 has a meander shape.
- FIG. 11 is a top view showing an example of one surface (upper surface) of the structure shown in FIG.
- the shape of the first transmission line 104 is a linear shape as in the case of FIGS. 1, 2, and 3 described above. .
- the first transmission line 104 is the other side (lower surface side) of the second conductor plane 102, that is, the first conductor plane 101. As shown in FIG. 12, for example, the first transmission line 104 is disposed on one side (upper surface side) of the second conductor plane 102. ) May be provided. However, when the first transmission line 104 is disposed on one side (upper surface side) of the second conductor plane 102, the second conductor plane 102 and the conductor via 106 interposed in the middle are separated in a DC manner. In addition, it is necessary to dispose the clearance 121 in the second conductor plane 102.
- FIG. 12 is a perspective view showing the appearance of the structure in the third modification of the first embodiment according to the present invention, in which the first transmission line 104 is on the other side (lower surface side) of the conductor plane 102. Instead, an example in which the conductor plane 102 is provided on one side (upper surface side) is shown.
- FIG. 13 is a cross-sectional view showing an example of the cross-sectional structure of the structure shown in FIG. Here, the cross-sectional view of FIG. 13 shows a cross section between XIII and XIII shown in FIG.
- the EBG structure shown in FIGS. 12 and 13 is similar to the EBG structure shown in FIGS. 1 and 2 between the first transmission line 104 and the first conductor plane 101. And a second dielectric layer 108 laminated on one side (upper surface side) of the first dielectric layer 107 in the thickness direction.
- the first conductor plane 101 is disposed on the other side (lower surface side) of the first dielectric layer 107 in the thickness direction, similarly to the EBG structure shown in FIGS.
- the conductor plane 102 is disposed on one side (upper surface side) of the second dielectric layer 108
- one side It is disposed between the upper surface side) and the other side (lower surface side) of the second dielectric layer 108.
- the first transmission line 104 is different from the EBG structure shown in FIGS. 1 and 2 formed between the first conductor plane 101 and the second conductor plane 102, unlike the EBG structure shown in FIGS.
- the EBG structure shown in FIGS. Although disposed on one side (upper surface side) of the thickness direction (z-axis direction) of the layer 108, like the EBG structure shown in FIGS. 1 and 2, facing the second conductor plane 102, 12 extends in the y-axis direction, one end is an open end (open end), and the other end is connected to the first conductor plane 101 via the conductor via 106, and functions as an open stub.
- the slit 105 is provided in the second conductor plane 102 as in the EBG structure shown in FIGS. 1 and 2, and extends in the z-axis direction (thickness direction) from the other end of the first transmission line 104. Starting from the overlapping position, both sides of the first transmission line 104 are extended in the x-axis direction perpendicular to the y-axis direction of the first transmission line 104. As in the EBG structure shown in FIGS. 1 and 2, the conductor via 106 is arranged in the z-axis direction (thickness direction) to connect the other end of the first transmission line 104 and the first conductor plane 101.
- the second conductor plane 102 has one side (upper surface side) of the first dielectric layer 107 and the other side (lower surface side) of the second dielectric layer 108.
- the second conductor through which the conductor via 106 passes is disposed. It is necessary to provide a clearance 121 at the position of the plane 102.
- the upper surface of the second conductor plane 102 and the lower surface of the first conductor plane 101 are free from any substance.
- a dielectric or a metal pattern is further provided in order to increase the effective relative permittivity of the first transmission line 104 or to prevent unnecessary electromagnetic waves from being radiated from the first transmission line 104.
- a dielectric or a metal pattern is further provided in order to increase the effective relative permittivity of the first transmission line 104 or to prevent unnecessary electromagnetic waves from being radiated from the first transmission line 104.
- a dielectric or a metal pattern is further provided in order to increase the effective relative permittivity of the first transmission line 104 or to prevent unnecessary electromagnetic waves from being radiated from the first transmission line 104.
- a dielectric or a metal pattern is further provided in order to increase the effective relative permittivity of the first transmission line 104 or to prevent unnecessary electromagnetic waves from being radiated from the first transmission line 104.
- a dielectric or a metal pattern is further disposed.
- FIG. 16 is a perspective view showing the appearance of the structure in the fourth modified example of the first embodiment according to the present invention.
- the transmission line 104 two first transmission lines 104a and second In this example, the transmission line 104b is present.
- the first transmission line 104a and the second transmission line 104b are arranged so as to extend in opposite directions along the y-axis, respectively.
- the slit 105a is arrange
- a slit 105b is arranged for the second transmission line 104b.
- FIG. 17 is a perspective view showing an appearance of an arrangement example different from FIG. 16 of the structure in the fourth modification example of the first embodiment according to the present invention.
- one transmission line 104a and the second transmission line 104b exist in the same direction along the y-axis.
- FIG. 18 is a perspective view showing the appearance of an arrangement example further different from FIGS. 16 and 17 of the structure in the fourth modification example of the first embodiment according to the present invention. Shows an example of branching on the way. According to the position branched from the first transmission line 104 by the branch line 104c, the interval between the first band gap and the second band gap is adjusted, the width of the first band gap, the second band gap The width can be adjusted.
- the first transmission line 104 of the main line is provided with inductance by the slit 105, while the inductance is added by the slit 105c on the first transmission line side of the branch line 104c. Yes.
- the example in which the first transmission line 104 is two or the first transmission line 104 is divided into two is shown. Naturally, instead of two, three, four, or It may be more than that.
- First conductor plane (first conductor) 102 Second conductor plane (second conductor) 103 Unit structure 104 First transmission line 104a First transmission line 104b Second transmission line 104c Branch line 105 Slit (inductance imparting member) 105a slit 105b slit 105c slit 106 conductor via (first conductor via) 107 First dielectric 108 Second dielectric 121 Clearance 301 Repeat unit 302 Parallel plate line 303 Transmission line 304 Inductance (Inductance by slit 105) 305 Inductance (Inductance by conductor via 106)
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
Abstract
Description
したがって、本発明の目的は、小型のEBG構造を可能にする構造体および配線基板を提供することにある。
第1の導体プレーンと、
前記第1の導体プレーンと対向するように配設された第2の導体プレーンと、
前記第1の導体プレーンと前記第2の導体プレーンとは異なる層に形成され、かつ、前記第2の導体プレーンに対向して配設され、かつ、一端が開放端である第1の伝送線路と、
前記第1の伝送線路の他端と前記第1の導体プレーンとを接続する導体ビアと、
前記第2の導体プレーン上に形成され、かつ、前記第1の伝送線路と平面視で重なる位置を起点として、前記第1の伝送線路の両側に延伸しているスリットと、
を少なくとも備えて構成されることを特徴とする。
第1の導体プレーンと、
前記第1の導体プレーンと対向するように配設された第2の導体プレーンと、
前記第1の導体プレーンと前記第2の導体プレーンとは異なる層に形成され、かつ、前記第2の導体プレーンに対向して配設され、かつ、一端が開放端である第1の伝送線路と、
前記第1の伝送線路の他端と前記第1の導体プレーンとを接続する導体ビアと、
前記第2の導体プレーン上に形成され、かつ、前記第1の伝送線路と平面視で重なる位置を起点として、前記第1の伝送線路の両側に延伸しているスリットと、
を少なくとも備えて構成される構造体を有していることを特徴とする。
本発明の実施形態の説明に先立って、本発明の特徴についてその概要をまず説明する。本発明は、第1の導体プレーンと、前記第1の導体プレーンと対向するように設けられた第2の導体プレーンと、前記第2の導体プレーンに対向するように設けられ、かつ、一端が開放端(オープン端)である第1の伝送線路と、前記第1の伝送線路の他端と前記第1の導体プレーンとを接続する導体ビアと、前記第2の導体プレーン上に形成され、かつ、前記第1の伝送線路と平面視で重なる位置を起点として、前記第1の伝送線路の両側に延伸しているスリットと、を少なくとも備えて構成される構造体を提供することを主要な特徴としている。而して、小型のEBG構造を実現することを可能にしている。
(第1の実施の形態の構成例)
まず、第1の実施の形態に係る構造体の構成について、図1ないし図13の各図面に基づいて説明する。図1は、本発明に係る第1の実施の形態における構造体の外観を示す斜視図であり、本第1の実施の形態におけるEBG構造の一例を示している。また、図2は、図1に示した構造体の断面構造の一例を示す断面図である。ここで、図2の断面図は、図1に示したII-II間の断面を示している。
次に、前述したEBG構造の基本的な動作原理について説明する。
図4は、本第1の実施の形態として図3に示した構造体におけるxy平面内の任意の直線に沿った方向の等価回路の一例を示す回路図であり、本第1の実施の形態におけるEBG構造の等価回路図を示している。また、図5は、本第1の実施の形態におけるEBG構造の分散関係(波数と周波数との関係)の一例を示す説明図であり、本第1の実施の形態におけるEBG構造の効果について説明している。
次に、第1の実施の形態の変形例について説明する。
まず、第1の変形例として、第1の伝送線路104の配置・形状に関する変形例について説明する。第1の伝送線路104は、一端がオープン端になっており、かつ、他端が導体ビア106に接続されていれば、どのような配置・形状であっても良い。前述の第1の実施の形態における図1、図2、図3においては、第1の伝送線路104が直線形状の場合を示したが、例えば、図6に示すようなスパイラル形状であっても良いし、あるいは、ミアンダ形状であっても良いし、あるいは、全く不規則な形状としても良い。なお、かくのごとき第1の伝送線路104の変形形状の場合には、第1の伝送線路104の形状に応じて、スリット105の形状も変えることが望ましい。例えば、図6に示すような、第1の伝送線路104の形状がスパイラル形状の場合においては、スリット105の形状もスパイラル形状とすることが望ましい。また、第1の伝送線路104の形状がスパイラル形状の場合においては、図6に示すように、導体ビア106は、スパイラル形状の第1の伝送線路104の外周に配置することが望ましい。
次に、第2の変形例として、スリット105の配置・形状に関する変形例について説明する。スリット105の形状は、第1の伝送線路104とz軸方向(厚さ方向)に重なる位置を起点として、第1の伝送線路104の両側にx軸方向に延伸していれば、どのような配置・形状であっても良い。前述の第1の実施の形態における図1、図2、図3においては、スリット105が直線形状の場合を示したが、例えば、図10に示すようなミアンダ形状であっても良いし、あるいは、スパイラル形状をしていても良いし、あるいは、全く不規則な形状としても良い。また、この際、スリット105は第1の伝送線路104と複数回交差するように配置されていても良い。
次に、第3の変形例として、第1の伝送線路104の配置に関する変形例について説明する。前述の第1の実施の形態における図1、図2、図3においては、第1の伝送線路104が、第2の導体プレーン102の他方側(下面側)、すなわち、第1の導体プレーン101と第2の導体プレーン102との間に配置されている場合を示したが、例えば、図12に示すように、第1の伝送線路104が、第2の導体プレーン102の一方側(上面側)に設けられる構造とすることもできる。ただし、第1の伝送線路104を第2の導体プレーン102の一方側(上面側)に配置する場合には、途中に介在する第2の導体プレーン102と導体ビア106とを直流的に切り離すために、第2の導体プレーン102にクリアランス121を配置することが必要になる。
次に、第4の変形例として、第1の伝送線路104の変形例について記載する。本第4の変形例においては、第1の伝送線路104として2つの第1の伝送線路104a、第2の伝送線路104bが存在し、第1の伝送線路104aの一端および第2の伝送線路104bの一端のそれぞれが、同一の第1の導体ビア106により第1の導体プレーン101に接続されている。図16は、本発明に係る第1の実施の形態の第4の変形例における構造体の外観を示す斜視図であり、第1の伝送線路104として2つの第1の伝送線路104a、第2の伝送線路104bが存在する例を示している。
102 第2の導体プレーン(第2の導体)
103 単位構造
104 第1の伝送線路
104a 第1の伝送線路
104b 第2の伝送線路
104c 分岐線路
105 スリット(インダクタンス付与部材)
105a スリット
105b スリット
105c スリット
106 導体ビア(第1の導体ビア)
107 第1の誘電体
108 第2の誘電体
121 クリアランス
301 繰り返し単位
302 平行平板線路
303 伝送線路
304 インダクタンス(スリット105によるインダクタンス)
305 インダクタンス(導体ビア106によるインダクタンス)
Claims (10)
- 第1の導体プレーンと、
前記第1の導体プレーンと対向するように配設された第2の導体プレーンと、
前記第1の導体プレーンと前記第2の導体プレーンとは異なる層に形成され、かつ、前記第2の導体プレーンに対向して配設され、かつ、一端が開放端である第1の伝送線路と、
前記第1の伝送線路の他端と前記第1の導体プレーンとを接続する導体ビアと、
前記第2の導体プレーン上に形成され、かつ、前記第1の伝送線路と平面視で重なる位置を起点として、前記第1の伝送線路の両側に延伸しているスリットと、
を少なくとも備えて構成されることを特徴とする構造体。 - 前記第1の導体プレーン、前記第2の導体プレーン、前記第1の伝送線路、前記導体ビア、および、前記スリットは、EBG(Electromagnetic Band Gap)構造を構成していることを特徴とする請求項1に記載の構造体。
- 前記第2の導体プレーンと前記第1の伝送線路との間の距離が、前記第1の導体プレーンと前記第1の伝送線路との間の距離の(1/2)倍以下であることを特徴とする請求項1または2に記載の構造体。
- 前記スリットのスリット長が、前記第1の伝送線路の伝送線路長の2倍以下であることを特徴とする請求項1ないし3のいずれかに記載の構造体。
- 前記スリットのスリット長をLとしたとき、前記スリットが、少なくとも、当該スリットのスリット端から(L/2-L/4)以上かつ(L/2+L/4)以下の位置において前記第1の伝送線路と平面視で重なっていることを特徴とする請求項1ないし4のいずれかに記載の構造体。
- 前記第1の伝送線路の伝送線路長をDとしたとき、前記第1の伝送線路が、少なくとも、当該第1の伝送線路と前記導体ビアとの接続点から(D/8)以下の範囲内の位置において前記スリットと平面視で重なっていることを特徴とする請求項1ないし4のいずれかに記載の構造体。
- 前記第1の伝送線路がスパイラル形状をしていることを特徴とする請求項1ないし4のいずれかに記載の構造体。
- 前記導体ビアが、スパイラル形状をした前記第1の伝送線路の外周にあることを特徴とする請求項7に記載の構造体。
- 第1の導体プレーンと、
前記第1の導体プレーンと対向するように配設された第2の導体プレーンと、
前記第1の導体プレーンと前記第2の導体プレーンとは異なる層に形成され、かつ、前記第2の導体プレーンに対向して配設され、かつ、一端が開放端である第1の伝送線路と、
前記第1の伝送線路の他端と前記第1の導体プレーンとを接続する導体ビアと、
前記第2の導体プレーン上に形成され、かつ、前記第1の伝送線路と平面視で重なる位置を起点として、前記第1の伝送線路の両側に延伸しているスリットと、
を少なくとも備えて構成される構造体を有していることを特徴とする配線基板。 - 前記第1の導体プレーン、前記第2の導体プレーン、前記第1の伝送線路、前記導体ビア、および、前記スリットは、EBG(Electromagnetic Band Gap)構造を構成していることを特徴とする請求項9に記載の配線基板。
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