WO2016114105A1 - 導電性ペーストおよびそれを用いた導電膜の製造方法 - Google Patents
導電性ペーストおよびそれを用いた導電膜の製造方法 Download PDFInfo
- Publication number
- WO2016114105A1 WO2016114105A1 PCT/JP2016/000032 JP2016000032W WO2016114105A1 WO 2016114105 A1 WO2016114105 A1 WO 2016114105A1 JP 2016000032 W JP2016000032 W JP 2016000032W WO 2016114105 A1 WO2016114105 A1 WO 2016114105A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive paste
- conductive film
- mass
- conductive
- substrate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title abstract description 25
- 239000012789 electroconductive film Substances 0.000 title abstract 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 95
- 239000010949 copper Substances 0.000 claims abstract description 80
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 150000001805 chlorine compounds Chemical class 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000002245 particle Substances 0.000 claims abstract description 19
- 239000002904 solvent Substances 0.000 claims abstract description 19
- -1 azole compound Chemical class 0.000 claims abstract description 18
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims abstract description 13
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000010419 fine particle Substances 0.000 claims description 36
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 24
- 239000012964 benzotriazole Substances 0.000 claims description 22
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 21
- 239000011362 coarse particle Substances 0.000 claims description 18
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims description 14
- 239000011780 sodium chloride Substances 0.000 claims description 12
- 239000002270 dispersing agent Substances 0.000 claims description 10
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 10
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 10
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 10
- 230000001678 irradiating effect Effects 0.000 claims description 8
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 6
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 5
- YNJBWRMUSHSURL-UHFFFAOYSA-N trichloroacetic acid Chemical compound OC(=O)C(Cl)(Cl)Cl YNJBWRMUSHSURL-UHFFFAOYSA-N 0.000 claims description 5
- 239000001110 calcium chloride Substances 0.000 claims description 4
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- 238000003860 storage Methods 0.000 abstract description 6
- 238000010304 firing Methods 0.000 abstract description 2
- 239000011859 microparticle Substances 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000000460 chlorine Substances 0.000 description 25
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 24
- 238000004220 aggregation Methods 0.000 description 24
- 230000002776 aggregation Effects 0.000 description 24
- 239000000243 solution Substances 0.000 description 21
- 239000011231 conductive filler Substances 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- 239000006185 dispersion Substances 0.000 description 10
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000002835 absorbance Methods 0.000 description 5
- 229920000298 Cellophane Polymers 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000011164 primary particle Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine hydrate Chemical compound O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 150000004045 organic chlorine compounds Chemical class 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- GPRLSGONYQIRFK-MNYXATJNSA-N triton Chemical compound [3H+] GPRLSGONYQIRFK-MNYXATJNSA-N 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- DTCCVIYSGXONHU-CJHDCQNGSA-N (z)-2-(2-phenylethenyl)but-2-enedioic acid Chemical compound OC(=O)\C=C(C(O)=O)\C=CC1=CC=CC=C1 DTCCVIYSGXONHU-CJHDCQNGSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- BIAAQBNMRITRDV-UHFFFAOYSA-N 1-(chloromethoxy)-2-methoxyethane Chemical compound COCCOCCl BIAAQBNMRITRDV-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 235000013162 Cocos nucifera Nutrition 0.000 description 1
- 244000060011 Cocos nucifera Species 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 241000982822 Ficus obtusifolia Species 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 241000047703 Nonion Species 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000000349 field-emission scanning electron micrograph Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- NVVZQXQBYZPMLJ-UHFFFAOYSA-N formaldehyde;naphthalene-1-sulfonic acid Chemical compound O=C.C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 NVVZQXQBYZPMLJ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- SAMYCKUDTNLASP-UHFFFAOYSA-N hexane-2,2-diol Chemical compound CCCCC(C)(O)O SAMYCKUDTNLASP-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- GSGDTSDELPUTKU-UHFFFAOYSA-N nonoxybenzene Chemical compound CCCCCCCCCOC1=CC=CC=C1 GSGDTSDELPUTKU-UHFFFAOYSA-N 0.000 description 1
- ZPIRTVJRHUMMOI-UHFFFAOYSA-N octoxybenzene Chemical compound CCCCCCCCOC1=CC=CC=C1 ZPIRTVJRHUMMOI-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D129/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
- C09D129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D139/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Coating compositions based on derivatives of such polymers
- C09D139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
- C09D139/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
- C09D5/10—Anti-corrosive paints containing metal dust
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
- C09D7/62—Additives non-macromolecular inorganic modified by treatment with other compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2200/00—Printing processes
- B41P2200/40—Screen printing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/095—Carboxylic acids containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0266—Size distribution
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Definitions
- the present invention relates to a conductive paste, and more particularly to a conductive paste used for manufacturing a conductive film for forming an electrode or a circuit of an electronic component and a method for manufacturing a conductive film using the conductive paste.
- a photosensitive paste containing inorganic fine particles such as glass fine particles, a photosensitive organic component, and a compound having an azole structure such as benzotriazole is applied to a substrate. Then, after exposure, development is performed, and then baking is performed to form a pattern (of a conductive film) (see, for example, Patent Document 1). Also, after printing a copper ink solution containing copper nanoparticles on the surface of the substrate and drying it, the copper nanoparticles are fused by photo-sintering by exposure to a pulse, and a photo-sintered copper nano-particle film (conductive film) Has been proposed (see, for example, Patent Document 2). Furthermore, a conductive ink using copper fine particles with benzotriazole deposited on the surface as a conductive filler has been proposed as an oxidation resistant treatment (see, for example, Patent Document 3).
- JP-A-9-218508 (paragraph numbers 0010-0056) Japanese translation of PCT international publication 2010-528428 (paragraph number 0009-0014) JP 2008-285761 A (paragraph number 0008-0010)
- Patent Document 1 it is necessary to apply a photosensitive paste to a substrate, expose it, develop it using a developer, and then bak it at a high temperature (520 to 610 ° C.). It is complicated and cannot be fired by light irradiation, and a pattern cannot be formed on a heat-sensitive substrate such as paper or PET (polyethylene terephthalate) film.
- a high temperature 520 to 610 ° C.
- the storage stability of the copper ink solution containing copper nanoparticles is not sufficient, and the adhesion to a substrate such as paper is not sufficient.
- the conductive ink of Patent Document 3 when used as a conductive paste for light baking, the conductive film cracks when the conductive film is formed by applying it to a substrate and drying it, followed by baking by light irradiation. Sexuality gets worse.
- the present invention is capable of forming a conductive film having good adhesion and conductivity with a substrate by photo-baking and a conductive paste having good storage stability and the same. It aims at providing the manufacturing method of the electrically conductive film using this.
- the present inventors have found that copper fine particles having an average particle diameter of 1 to 100 nm coated with an azole compound, copper coarse particles having an average particle diameter of 0.3 to 20 ⁇ m, a resin, If a chlorine compound is added to the glycol solvent, a conductive paste having good adhesion and conductivity with the substrate can be formed by photo-baking, and a conductive paste having good storage stability is produced. As a result, the present invention has been completed.
- the conductive paste according to the present invention comprises copper fine particles having an average particle diameter of 1 to 100 nm coated with an azole compound, copper coarse particles having an average particle diameter of 0.3 to 20 ⁇ m, a resin, a chlorine compound, and a glycol-based paste. And a solvent.
- the chlorine compound is preferably at least one selected from the group consisting of sodium chloride, calcium chloride, chloroform and trichloroacetic acid.
- the total amount of copper fine particles and copper coarse particles in the conductive paste is preferably 50 to 90% by mass, and the ratio of the mass of copper fine particles to the mass of copper coarse particles in the conductive paste is 1: 9 to 5%. : 5 is preferred.
- the azole compound is preferably benzotriazole, and the glycol solvent is preferably ethylene glycol.
- the resin is preferably at least one of a polyvinyl pyrrolidone resin and a polyvinyl butyral resin, and the conductive paste preferably contains a dispersant.
- the conductive film manufacturing method according to the present invention is characterized in that the conductive film is formed on the substrate by applying the conductive paste to the substrate and pre-baking, and then irradiating and baking the light. .
- the conductive paste is preferably applied by screen printing, and pre-baking is preferably performed by vacuum drying at 50 to 200 ° C. Further, the light irradiation is preferably performed by irradiating light having a pulse period of 500 to 2000 ⁇ s, a pulse voltage of 1600 to 3800 V and a wavelength of 200 to 800 nm, and the thickness of the conductive film is 1 to 30 ⁇ m. preferable.
- the electroconductive paste which can form the electrically conductive film with favorable adhesiveness and electroconductivity with photo-baking, and has favorable storage stability, and the manufacturing method of an electrically conductive film using the same are provided. can do.
- FIG. 1 It is a top view which shows the shape of the electrically conductive paste apply
- 3 is a graph showing the absorbance of a dispersion of copper fine particles of Example 1.
- Embodiments of the conductive paste according to the present invention include copper fine particles having an average particle diameter of 1 to 100 nm coated with an azole compound, copper coarse particles having an average particle diameter of 0.3 to 20 ⁇ m, a resin, a chlorine compound, And glycol-based solvent.
- Copper fine particles with an average particle size of 1 to 100 nm are particles that are easy to oxidize and sinter.
- the storage stability is improved and the light absorption is improved. Makes it easier to sinter.
- the azole compound has a conjugated double bond in the molecule, so that the copper fine particles are easily sintered by absorbing light in the ultraviolet wavelength region (200 to 400 nm) and converting it into heat.
- the coarse copper particles having an average particle size of 0.3 to 20 ⁇ m relax the shrinkage of the conductive film accompanying the sintering of the copper fine particles and crack the conductive film when fired by light irradiation to form the conductive film. To prevent the conductivity from deteriorating and to prevent the conductivity from deteriorating even when the conductive film becomes thicker.
- the total amount of copper fine particles and copper coarse particles is preferably 50 to 90% by mass, and more preferably 60 to 80% by mass.
- the ratio of the mass of the copper fine particles to the mass of the copper coarse particles is preferably 1: 9 to 5: 5, and more preferably 2: 8 to 4: 6.
- the azole compound is preferably benzotriazole.
- the conductive paste solvent is preferably water-soluble in order to improve the wettability of the substrate, and copper is easily oxidized. It preferably has a functional hydroxyl group, and preferably has a boiling point of 180 ° C. or higher so that it can be continuously printed on the substrate.
- a glycol solvent made of glycol or a derivative thereof is used as the solvent having such properties.
- glycol solvent examples include ethylene glycol, isopropylene glycol, 1,6-hexanediol, 1,3-propanediol, 1,4-butanediol, dipropylene glycol, 1,5-pentanediol, diethylene glycol, (molecular weight 200 Polyethylene glycol, methylpentanediol, triethylene glycol, etc. can be used, and ethylene glycol is preferably used.
- the chlorine compound may be an inorganic chlorine compound or an organic chlorine compound.
- the inorganic chlorine compound sodium chloride, calcium chloride, potassium chloride and the like can be used.
- the organic chlorine compound chloroform, trichloroacetic acid, 2-methoxyethoxymethyl chloride, trimethylstearyl ammonium chloride and the like can be used. it can.
- These chlorine compounds are preferably added so that the mass ratio of Cl to Cu (Cl / Cu) is 0.1 to 1.5 mass%, and the mass ratio of Cl to the conductive paste is 0.00. It is preferable to add 1 to 1.0% by mass.
- the resin contained in the conductive paste can improve adhesion to the substrate and dissolves in a glycol-based solvent at a high concentration. It is preferable that the resin be capable of imparting appropriate viscosity and sagging and capable of forming a flexible conductive film.
- the resin having such properties it is preferable to use at least one of polyvinyl pyrrolidone (PVP) resin and polyvinyl butyral (PVB) resin.
- the amount of polyvinyl pyrrolidone resin in the conductive paste is preferably 3 to 9% by mass with respect to the total amount of copper fine particles and copper coarse particles.
- the amount of polyvinyl butyral resin in the conductive paste is preferably 3 to 6% by mass with respect to the total amount of copper fine particles and copper coarse particles.
- polyvinylpyrrolidone resin examples include Pitzkor K-30 (weight average molecular weight 45,000), Pitzkor K-90 (weight average molecular weight 1,200,000) manufactured by DKS Corporation, Wako Pure Chemical Industries, Ltd. PVP K-25 (weight average molecular weight 20,000) manufactured by Sekisui Chemical Co., Ltd., for example, S-LEC B series, S-LEC K series, Co., Ltd., can be used. Kuraray's Mowital B series can be used.
- the conductive paste it is preferable to add a dispersant to the solvent in order to improve the dispersibility of the copper fine particles.
- the amount of the dispersing agent added is preferably 0.1 to 10% by mass, more preferably 0.1 to 2% by mass with respect to the conductive paste. Any dispersant may be used as long as it has an affinity for the surface of the copper fine particles and also has an affinity for the glycol solvent.
- dispersant having such properties examples include nonionic polyoxyethylene (for example, TRITON X-100 manufactured by Sigma Aldrich), polyoxyethylene (8) octylphenyl ether (for example, TRITON X manufactured by Sigma Aldrich).
- nonionic polyoxyethylene for example, TRITON X-100 manufactured by Sigma Aldrich
- polyoxyethylene (8) octylphenyl ether for example, TRITON X manufactured by Sigma Aldrich
- high molecular weight block copolymer for example, DISPERBYK-190 manufactured by Big Chemie Japan Co., Ltd.
- modified acrylic block copolymer for example, DISPERBYK-2000, DISPERBYK-2001 manufactured by Big Chemie Japan Co., Ltd.
- non- Ion fluorinated polyoxyethylene for example, Zonyl FS300 manufactured by DuPont Co., Ltd.
- fluorine-containing group / hydrophilic group-containing oligomer for example, Megafac EXP TF-1540 manufactured by DIC Corporation, Fax EXP TF-1878, MegaFuck F-480SF
- lauryltrimethylammonium chloride for example, Cotamin 24P manufactured by Kao Corporation
- polyoxyethylene coconut alkylamine for example, Amate 102 manufactured by Kao Corporation
- polyoxyethylene Distyrenated phenyl ether for example, Emulgen A-60 manufactured by Kao Corporation
- special polycarboxylic acid type surfact for example,
- the conductive paste may contain additives such as a rheology control agent, an adhesion imparting agent, and a defoaming agent.
- the conductive paste according to the present invention it is preferable to perform kneading and defoaming with a stirring defoaming mixer, a three-roll mill, a planetary ball mill, a bead mill, a mortar and the like.
- the conductive paste is applied to the substrate and pre-baked, and then the conductive film is formed on the substrate by irradiating with light and baking.
- the conductive paste is preferably applied by screen printing.
- the pre-baking is preferably performed by heating with a vacuum dryer or an IR lamp heater.
- vacuum drying is preferably performed at 50 to 200 ° C. for 10 to 180 minutes, and when pre-baking is performed with an IR lamp heater, a heat amount of 140 to 600 J in the atmosphere is 5 to Heating for 20 seconds is preferred.
- the light irradiation is preferably performed by irradiating light having a wavelength of 200 to 800 nm with a pulse period of 500 to 2000 ⁇ s and a pulse voltage of 1600 to 3800 V.
- This light irradiation can be performed by irradiating light with a xenon flash lamp or the like, can be performed in a short time (about 1 to 2 pulses) in the atmosphere, and may be performed a plurality of times.
- a conductive film having a thickness of 1 to 30 ⁇ m and good conductivity can be formed.
- average particle diameter refers to an average primary particle diameter calculated from a field emission scanning electron microscope (FE-SEM). This “average primary particle diameter” is determined by, for example, using copper fine particles or copper coarse particles at a predetermined magnification (100,000 for copper fine particles) using a field emission scanning electron microscope (FE-SEM) (S-4700 manufactured by Hitachi, Ltd.).
- FE-SEM field emission scanning electron microscope
- Coarse particles can be selected at random, and the particle size (major axis on the image) of these particles (primary particles) can be measured and calculated by calculating the number average (as the number average diameter).
- Example 1 First, as a copper source, a solution A in which 280 g of copper sulfate pentahydrate (manufactured by JX Nippon Mining & Metals) and 1 g of benzotriazole (BTA) (manufactured by Wako Pure Chemical Industries, Ltd.) are dissolved in 1330 g of pure water; Solution B obtained by diluting 200 g of a 50% by weight aqueous caustic soda solution (manufactured by Wako Pure Chemical Industries, Ltd.) as a neutralizing agent with 900 g of pure water, and 80% by weight hydrazine monohydrate (manufactured by Otsuka Chemical Co., Ltd.) ) Solution C was prepared by diluting 150 g with 1300 g of pure water.
- BTA benzotriazole
- the solution A and the solution B are mixed with stirring, adjusted to a temperature of 60 ° C., and with the stirring maintained, the entire amount of the solution C is added to the mixed solution within 30 seconds.
- the reaction was complete.
- FE-SEM field emission scanning electron microscope
- S-4700 field emission scanning electron microscope
- content of the electrically conductive filler in the electrically conductive paste obtained in this way is 70 mass%, and the ratio of the mass of Cl with respect to an electrically conductive paste is 0.24 mass%.
- maximum particle diameter by the grind gauge of the obtained electrically conductive paste was 15 micrometers or less.
- a screen plate (ST250-30-60 manufactured by Sonocom Co., Ltd.) having a mesh number of 250 LPI, a wire diameter of 30 ⁇ m, a cocoon thickness of 60 ⁇ m, and an emulsion thickness of 5 ⁇ m was used as a screen plate.
- the above conductive paste is screen-printed in the shape of an antenna having a conductive length of 240 mm (shaped as shown in FIG. 1), and preliminarily baked at 100 ° C.
- a conductive film is obtained by firing by irradiating one pulse (2000 ⁇ s) of light having a wavelength of 200 to 800 nm with a xenon flash lamp at a pulse period of 2000 ⁇ s and a pulse voltage of 2700 V. It was.
- the film thickness of this conductive film was measured using a laser microscope (VK-9700 manufactured by Keyence Corporation), and the height difference between the surface of the substrate on which the conductive film was formed and the surface of the conductive film was measured at 100 locations, and the average was measured.
- the film thickness of the electrically conductive film was 13.0 micrometers.
- the line width of the conductive film (the part indicated by A in FIG. 1) was 572 ⁇ m.
- the electric resistance (between B and C in FIG. 1) of this conductive film was measured with a tester (model CDM-03D manufactured by CUSTOM) and found to be 11.3 ⁇ .
- the volume resistivity of this conductive film was determined from the film thickness, electrical resistance and area of the conductive film, and found to be 35.0 ⁇ ⁇ cm.
- a cellophane tape having a width of 24 mm (manufactured by Nichiban Co., Ltd.) was applied to the conductive film formed on the substrate, and a load of about 5 kg was applied.
- a load of about 5 kg was applied.
- the air bubbles are removed and the cellophane tape and the substrate are brought into close contact, and then the substrate is fixed and the cellophane tape is lifted. It was peeled off at a speed of about 0.6 seconds while paying attention to 90 degrees, and when the peeling of the conductive film did not adhere to the tape, it was evaluated that the adhesion was very good and almost adhered.
- Example 2 8.00 g of a chlorine compound solution containing 5% by mass of calcium chloride obtained by dissolving calcium chloride (CaCl 2 ) (manufactured by Wako Pure Chemical Industries, Ltd.) in ethylene glycol as a chlorine compound (ratio of mass of Cl to Cu)
- a conductive paste was obtained in the same manner as in Example 1 except that (Cl / Cu) was 0.37% by mass).
- content of the electrically conductive filler in this electrically conductive paste is 70 mass%, and the ratio of the mass of Cl with respect to an electrically conductive paste is 0.26 mass%.
- a conductive film was produced in the same manner as in Example 1, the film thickness and line width were determined, the electrical resistance (line resistance) was measured, and the volume resistivity was determined.
- the adhesion with the substrate was evaluated.
- the film thickness of the conductive film was 13.2 ⁇ m
- the line width was 578 ⁇ m
- the electric resistance (line resistance) was 13.5 ⁇
- the volume resistivity was 43.0 ⁇ ⁇ cm
- Example 3 8.00 g of a chlorine compound solution containing 5% by mass of chloroform obtained by dissolving chloroform (CHCl 3 ) (manufactured by Wako Pure Chemical Industries, Ltd.) as a chlorine compound in ethylene glycol (the ratio of the mass of Cl to Cu (Cl A conductive paste was obtained in the same manner as in Example 1 except that 0.51% by mass of / Cu) was used.
- content of the electrically conductive filler in this electrically conductive paste is 70 mass%, and the ratio of the mass of Cl with respect to an electrically conductive paste is 0.36 mass%.
- a conductive film was prepared by the same method as in Example 1 except that this conductive paste was used and the pulse voltage was set to 2500 V, the film thickness and the line width were determined, and the electrical resistance (line resistance) was measured. While calculating
- Example 4 8.00 g of chlorine compound solution containing 5% by mass of trichloroacetic acid obtained by dissolving trichloroacetic acid (CCl 3 COOH) (manufactured by Wako Pure Chemical Industries, Ltd.) in ethylene glycol as the chlorine compound (the mass of Cl relative to Cu)
- CCl 3 COOH trichloroacetic acid
- ethylene glycol ethylene glycol
- the ratio (Cl / Cu) was 0.37% by mass
- content of the electrically conductive filler in this electrically conductive paste is 70 mass%, and the ratio of the mass of Cl with respect to an electrically conductive paste is 0.26 mass%.
- a conductive film was prepared in the same manner as in Example 1, the film thickness and the line width were determined, the electrical resistance (line resistance) was measured, While calculating
- the film thickness of the conductive film was 11.5 ⁇ m
- the line width was 613 ⁇ m
- the electric resistance (line resistance) was 13.6 ⁇
- the volume resistivity was 40.0 ⁇ ⁇ cm
- Example 5 4.00 g of a chlorine compound solution containing 5% by mass of sodium chloride (NaCl) obtained by dissolving sodium chloride (manufactured by Wako Pure Chemical Industries, Ltd.) in ethylene glycol as a chlorine compound (ratio of mass of Cl to Cu ( Cl / Cu) was 0.17% by mass), and a conductive paste was obtained in the same manner as in Example 1 except that 7.90 g of ethylene glycol was added as an additional solvent.
- content of the electrically conductive filler in this electrically conductive paste is 70 mass%, and the ratio of the mass of Cl with respect to an electrically conductive paste is 0.12 mass%.
- a conductive film was prepared in the same manner as in Example 1, the film thickness and the line width were determined, the electrical resistance (line resistance) was measured, While calculating
- the film thickness of the conductive film was 15.0 ⁇ m
- the line width was 612 ⁇ m
- the electric resistance (line resistance) was 11.2 ⁇
- the volume resistivity was 43.0 ⁇ ⁇ cm
- Example 6 6 mass% sodium chloride (NaCl) obtained by dissolving 26.25 g of 80 mass% BTA-coated copper fine particles and dissolving sodium chloride (manufactured by Wako Pure Chemical Industries, Ltd.) as a chlorine compound in ethylene glycol.
- Example 1 except that 15.00 g of a chlorine compound solution containing) (the ratio of the mass of Cl to Cu (Cl / Cu) is 0.78% by mass) and 0.65 g of ethylene glycol was added as an additional solvent.
- a conductive paste was obtained by the same method. In addition, content of the electrically conductive filler in this electrically conductive paste is 70 mass%, and the ratio of the mass of Cl with respect to an electrically conductive paste is 0.55 mass%.
- a conductive film was prepared by the same method as in Example 1 except that this conductive paste was used and the pulse voltage was set to 2500 V, the film thickness and the line width were determined, and the electrical resistance (line resistance) was measured. While calculating
- Example 7 8.00 g of a chlorine compound solution containing 10% by mass of chloroform obtained by dissolving chloroform (CHCl 3 ) (manufactured by Wako Pure Chemical Industries, Ltd.) as a chlorine compound in ethylene glycol (ratio of mass of Cl to Cu (Cl A conductive paste was obtained in the same manner as in Example 1, except that 1.02% by mass of / Cu) was used.
- content of the electrically conductive filler in this electrically conductive paste is 70 mass%, and the ratio of the mass of Cl with respect to an electrically conductive paste is 0.71 mass%.
- a conductive film was prepared in the same manner as in Example 1, the film thickness and the line width were determined, the electrical resistance (line resistance) was measured, While calculating
- the film thickness of the conductive film was 12.7 ⁇ m
- the line width was 590 ⁇ m
- the electric resistance (line resistance) was 8.0 ⁇
- the volume resistivity was 25.0 ⁇ ⁇ cm
- Example 8 Using the conductive paste obtained in Example 6, using cast coated paper (Miraco Chemical Co., Ltd. manufactured by Marusho Chemical Co., Ltd.) as a substrate, and using a pulse voltage of 2600 V, the same method as in Example 1, A conductive film was prepared, its film thickness and line width were determined, electric resistance (line resistance) was measured, volume resistivity was determined, and adhesion with the substrate was evaluated. As a result, the film thickness of the conductive film was 15.5 ⁇ m, the line width was 600 ⁇ m, the electric resistance (line resistance) was 8.8 ⁇ , the volume resistivity was 34.0 ⁇ ⁇ cm, and the adhesion to the substrate was good. It was.
- Example 9 Except for using the conductive paste obtained in Example 6 and using coated paper (Thunderbird Co., Ltd., manufactured by Chuetsu Pulp Co., Ltd.) as the substrate and setting the pulse voltage to 2600 V, the same method as in Example 1 was used.
- the conductive film was prepared, the film thickness and the line width were determined, the electrical resistance (line resistance) was measured, the volume resistivity was determined, and the adhesion with the substrate was evaluated.
- the film thickness of the conductive film was 15.7 ⁇ m
- the line width was 608 ⁇ m
- the electric resistance (line resistance) was 10.8 ⁇
- the volume resistivity was 43.0 ⁇ ⁇ cm
- the adhesion to the substrate was good. It was.
- Example 1 A conductive paste was obtained in the same manner as in Example 1 except that the chlorine compound solution was not added and the amount of ethylene glycol added was 11.9 g. In addition, content of the electrically conductive filler in this electrically conductive paste is 70 mass%, and the ratio of the mass of Cl with respect to an electrically conductive paste is 0 mass%.
- a conductive film was prepared by the same method as in Example 1 except that this conductive paste was used and the pulse voltage was set to 2800 V, the film thickness and the line width were determined, and the electrical resistance (line resistance) was measured. While calculating
- Example 2 A conductive paste was obtained in the same manner as in Example 1 except that no resin was used and 10.90 g of ethylene glycol was added as an additional solvent.
- a conductive film was prepared by the same method as in Example 1 except that this conductive paste was used and the pulse voltage was set to 2400 V, the film thickness and the line width were determined, and the electrical resistance (line resistance) was measured. While calculating
- Tables 1 to 3 show the manufacturing conditions of the conductive pastes of these examples and comparative examples, and the film thickness, line resistance, volume resistivity, and adhesion of the conductive films prepared using the conductive pastes.
- Example 1 it obtained by the method similar to Example 1 (BTA) except that the copper fine particles (coated with BTA) obtained in Example 1 and Solution A did not contain benzotriazole (BTA) as a dispersant.
- the absorbance increases at a wavelength of 300 nm or less due to the presence of the conjugated double bond that absorbs the ultraviolet region, and the solution of Example 1 (coated with BTA) Even in the dispersion of copper fine particles, the absorbance is increased at a wavelength of 300 nm or less by BTA coating the copper fine particles, but in the dispersion of copper fine particles not coated with BTA, the absorbance is not increased at a wavelength of 300 nm or less.
- an inlay consisting of an IC chip and an antenna
- an RFID tag antenna such as an IC tag antenna formed using a conductive film manufactured from the conductive paste according to the present invention
- a practical communication distance RFID tags such as IC tags can be manufactured.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Nanotechnology (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Conductive Materials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
Description
まず、銅源として硫酸銅五水和物(JX日鉱日石金属株式会社製)280gと、ベンゾトリアゾール(BTA)(和光純薬工業株式会社製)1gとを純水1330gに溶解した溶液Aと、中和剤として50質量%の苛性ソーダ水溶液(和光純薬工業株式会社製)200gを純水900gで希釈した溶液Bと、還元剤として80質量%のヒドラジン一水和物(大塚化学株式会社製)150gを純水1300gで希釈した溶液Cを用意した。
塩素化合物として塩化カルシウム(CaCl2)(和光純薬工業株式会社製)をエチレングリコールに溶解して得られた5質量%の塩化カルシウムを含む塩素化合物溶液8.00g(Cuに対するClの質量の割合(Cl/Cu)は0.37質量%)を使用した以外は、実施例1と同様の方法により、導電性ペーストを得た。なお、この導電性ペースト中の導電フィラーの含有量は70質量%であり、導電性ペーストに対するClの質量の割合は0.26質量%である。
塩素化合物としてクロロホルム(CHCl3)(和光純薬工業株式会社製)をエチレングリコールに溶解して得られた5質量%のクロロホルムを含む塩素化合物溶液8.00g(Cuに対するClの質量の割合(Cl/Cu)は0.51質量%)を使用した以外は、実施例1と同様の方法により、導電性ペーストを得た。なお、この導電性ペースト中の導電フィラーの含有量は70質量%であり、導電性ペーストに対するClの質量の割合は0.36質量%である。
塩素化合物としてトリクロロ酢酸(CCl3COOH)(和光純薬工業株式会社製)をエチレングリコールに溶解して得られた5質量%のトリクロロ酢酸を含む塩素化合物溶液8.00g(Cuに対するClの質量の割合(Cl/Cu)は0.37質量%)を使用した以外は、実施例1と同様の方法により、導電性ペーストを得た。なお、この導電性ペースト中の導電フィラーの含有量は70質量%であり、導電性ペーストに対するClの質量の割合は0.26質量%である。
塩素化合物として塩化ナトリウム(和光純薬工業株式会社製)をエチレングリコールに溶解して得られた5質量%の塩化ナトリウム(NaCl)を含む塩素化合物溶液4.00g(Cuに対するClの質量の割合(Cl/Cu)は0.17質量%)を使用し、追加溶媒としてエチレングリコール7.90gを添加した以外は、実施例1と同様の方法により、導電性ペーストを得た。なお、この導電性ペースト中の導電フィラーの含有量は70質量%であり、導電性ペーストに対するClの質量の割合は0.12質量%である。
80質量%のBTA被覆銅微粒子の分散液26.25gを使用し、塩素化合物として塩化ナトリウム(和光純薬工業株式会社製)をエチレングリコールに溶解して得られた6質量%の塩化ナトリウム(NaCl)を含む塩素化合物溶液15.00g(Cuに対するClの質量の割合(Cl/Cu)は0.78質量%)を使用し、追加溶媒としてエチレングリコール0.65gを添加した以外は、実施例1と同様の方法により、導電性ペーストを得た。なお、この導電性ペースト中の導電フィラーの含有量は70質量%であり、導電性ペーストに対するClの質量の割合は0.55質量%である。
塩素化合物としてクロロホルム(CHCl3)(和光純薬工業株式会社製)をエチレングリコールに溶解して得られた10質量%のクロロホルムを含む塩素化合物溶液8.00g(Cuに対するClの質量の割合(Cl/Cu)は1.02質量%)を使用した以外は、実施例1と同様の方法により、導電性ペーストを得た。なお、この導電性ペースト中の導電フィラーの含有量は70質量%であり、導電性ペーストに対するClの質量の割合は0.71質量%である。
実施例6で得られた導電性ペーストを使用し、基板としてキャストコート紙(丸昌化学工業株式会社製のミラコート)を使用し、パルス電圧2600Vとした以外は、実施例1と同様の方法により、導電膜を作製し、その膜厚および線幅を求め、電気抵抗(ライン抵抗)を測定し、体積抵抗率を求めるともに、基板との密着性を評価した。その結果、導電膜の膜厚は15.5μm、線幅は600μm、電気抵抗(ライン抵抗)は8.8Ω、体積抵抗率は34.0μΩ・cmであり、基板との密着性は良好であった。
実施例6で得られた導電性ペーストを使用し、基板として塗工紙(中越パルプ工業株式会社製の雷鳥コート)を使用し、パルス電圧2600Vとした以外は、実施例1と同様の方法により、導電膜を作製し、その膜厚および線幅を求め、電気抵抗(ライン抵抗)を測定し、体積抵抗率を求めるともに、基板との密着性を評価した。その結果、導電膜の膜厚は15.7μm、線幅は608μm、電気抵抗(ライン抵抗)は10.8Ω、体積抵抗率は43.0μΩ・cmであり、基板との密着性は良好であった。
塩素化合物溶液を添加せず、エチレングリコールの添加量を11.9gとした以外は、実施例1と同様の方法により、導電性ペーストを得た。なお、この導電性ペースト中の導電フィラーの含有量は70質量%であり、導電性ペーストに対するClの質量の割合は0質量%である。
樹脂を使用せず、追加溶媒としてエチレングリコール10.90gを添加した以外は、実施例1と同様の方法により、導電性ペーストを得た。
BTA被覆銅微粒子の分散液の添加量を80.00gとし、フレーク状銅粗粒子を添加せず、分散剤の添加量を5.60g、樹脂の添加量を5.60g、追加溶媒としてのエチレングリコールの添加量を0.8gとした以外は、実施例1と同様の方法により、導電性ペーストを得た。なお、この導電性ペースト中の導電フィラーの含有量は56質量%である。
Claims (13)
- アゾール化合物で被覆された平均粒径1~100nmの銅微粒子と、平均粒径0.3~20μmの銅粗粒子と、樹脂と、塩素化合物と、グリコール系溶剤とを含むことを特徴とする、導電性ペースト。
- 前記塩素化合物が塩化ナトリウム、塩化カルシウム、クロロホルムおよびトリクロロ酢酸からなる群から選ばれる少なくとも一種であることを特徴とする、請求項1に記載の導電性ペースト。
- 前記導電性ペースト中の前記銅微粒子と前記銅粗粒子の総量が50~90質量%であることを特徴とする、請求項1に記載の導電性ペースト。
- 前記導電性ペースト中の前記銅微粒子の質量と前記銅粗粒子の質量の割合が1:9~5:5であることを特徴とする、請求項1に記載の導電性ペースト。
- 前記アゾール化合物がベンゾトリアゾールであることを特徴とする、請求項1に記載の導電性ペースト。
- 前記グリコール系溶剤がエチレングリコールであることを特徴とする、請求項1に記載の導電性ペースト。
- 前記樹脂がポリビニルピロリドン樹脂およびポリビニルブチラール樹脂の少なくとも一方であることを特徴とする、請求項1に記載の導電性ペースト。
- 前記導電性ペーストが分散剤を含むことを特徴とする、請求項1に記載の導電性ペースト。
- 前記請求項1に記載の導電性ペーストを基板に塗布して予備焼成した後、光を照射して焼成することにより基板上に導電膜を形成することを特徴とする、導電膜の製造方法。
- 前記導電性ペーストの塗布がスクリーン印刷によって行われることを特徴とする、請求項9に記載の導電膜の製造方法。
- 前記予備焼成が50~200℃で真空乾燥することによって行われることを特徴とする、請求項9に記載の導電膜の製造方法。
- 前記光の照射が、パルス周期500~2000μs、パルス電圧1600~3800Vで波長200~800nmの光を照射することによって行われることを特徴とする、請求項9に記載の導電膜の製造方法。
- 前記導電膜の厚さが1~30μmであることを特徴とする、請求項9に記載の導電膜の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201680005619.9A CN107112068A (zh) | 2015-01-13 | 2016-01-06 | 导电性糊料以及使用该糊料的导电膜的制造方法 |
EP16737178.0A EP3244420A4 (en) | 2015-01-13 | 2016-01-06 | Electroconductive paste and method for manufacturing electroconductive film using same |
KR1020177022288A KR20170104557A (ko) | 2015-01-13 | 2016-01-06 | 도전성 페이스트 및 그것을 사용한 도전막의 제조 방법 |
US15/540,660 US20170362455A1 (en) | 2015-01-13 | 2016-01-06 | Conductive paste and method for producing conductive film using same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-004425 | 2015-01-13 | ||
JP2015004425A JP2016131078A (ja) | 2015-01-13 | 2015-01-13 | 導電性ペーストおよびそれを用いた導電膜の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016114105A1 true WO2016114105A1 (ja) | 2016-07-21 |
Family
ID=56405659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2016/000032 WO2016114105A1 (ja) | 2015-01-13 | 2016-01-06 | 導電性ペーストおよびそれを用いた導電膜の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20170362455A1 (ja) |
EP (1) | EP3244420A4 (ja) |
JP (1) | JP2016131078A (ja) |
KR (1) | KR20170104557A (ja) |
CN (1) | CN107112068A (ja) |
WO (1) | WO2016114105A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023054220A1 (ja) * | 2021-09-30 | 2023-04-06 | 大陽日酸株式会社 | 導電性ペースト、導電膜付き基材、および導電膜付き基材の製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019167365A1 (ja) * | 2018-02-27 | 2019-09-06 | 富士フイルム株式会社 | 導電膜形成用組成物および導電膜の製造方法 |
JP2020119737A (ja) * | 2019-01-23 | 2020-08-06 | 大陽日酸株式会社 | 導電性ペースト、導電膜付き基材、導電膜付き基材の製造方法 |
CN111261342B (zh) * | 2020-03-09 | 2021-03-30 | 广东四维新材料有限公司 | 一种rfid射频标签用低温快速固化卷对卷印刷导电银浆的制备方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339057A (ja) * | 2005-06-03 | 2006-12-14 | Nec Corp | 樹脂金属複合導電材料、その製造方法およびそれを用いた電子デバイス |
WO2009116349A1 (ja) * | 2008-03-21 | 2009-09-24 | 旭硝子株式会社 | 銅ナノ粒子被覆銅フィラー、その製造方法、銅ペーストおよび金属膜を有する物品 |
JP2009253196A (ja) * | 2008-04-10 | 2009-10-29 | Tokuyama Corp | 配線基板の製造方法 |
WO2011114747A1 (ja) * | 2010-03-18 | 2011-09-22 | 古河電気工業株式会社 | 導電性ペースト、及び該ペーストから得られる導電接続部材 |
JP2014011006A (ja) * | 2012-06-29 | 2014-01-20 | Arakawa Chem Ind Co Ltd | 導電性ペースト |
JP2014026968A (ja) * | 2012-06-20 | 2014-02-06 | Cemedine Co Ltd | 導電性ペースト |
WO2014104032A1 (ja) * | 2012-12-25 | 2014-07-03 | 戸田工業株式会社 | 銅粉末の製造方法及び銅粉末、銅ペースト |
JP2014150048A (ja) * | 2013-01-11 | 2014-08-21 | Jsr Corp | 銅膜形成用組成物、銅膜形成方法、銅膜、配線基板および電子機器 |
JP2015133317A (ja) * | 2013-12-10 | 2015-07-23 | Dowaエレクトロニクス株式会社 | 導電性ペーストおよびそれを用いた導電膜の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001118425A (ja) * | 1999-10-21 | 2001-04-27 | Murata Mfg Co Ltd | 導電性ペースト |
JP4204849B2 (ja) * | 2002-11-12 | 2009-01-07 | Dowaエレクトロニクス株式会社 | 微粒子銅粉の製法 |
US8404160B2 (en) * | 2007-05-18 | 2013-03-26 | Applied Nanotech Holdings, Inc. | Metallic ink |
JP5087384B2 (ja) * | 2007-12-14 | 2012-12-05 | 三菱製紙株式会社 | 導電性部材の製造方法および導電性部材 |
US8883046B2 (en) * | 2009-08-28 | 2014-11-11 | Lg Chem, Ltd. | Conductive metal ink composition and method for forming a conductive pattern |
JP5633285B2 (ja) * | 2010-01-25 | 2014-12-03 | 日立化成株式会社 | 電極用ペースト組成物及び太陽電池 |
KR101796339B1 (ko) * | 2010-10-06 | 2017-11-09 | 아사히 가라스 가부시키가이샤 | 도전성 구리 입자 및 도전성 구리 입자의 제조 방법, 도전체 형성용 조성물, 그리고 도전체가 형성된 기재 |
JP2012182111A (ja) * | 2011-02-28 | 2012-09-20 | Samsung Electro-Mechanics Co Ltd | 導電性金属ペースト組成物及びその製造方法 |
KR20140094690A (ko) * | 2013-01-21 | 2014-07-31 | 엘에스전선 주식회사 | 전도성 잉크 조성물 및 이로부터 전극을 형성하는 방법 |
-
2015
- 2015-01-13 JP JP2015004425A patent/JP2016131078A/ja active Pending
-
2016
- 2016-01-06 US US15/540,660 patent/US20170362455A1/en not_active Abandoned
- 2016-01-06 WO PCT/JP2016/000032 patent/WO2016114105A1/ja active Application Filing
- 2016-01-06 CN CN201680005619.9A patent/CN107112068A/zh active Pending
- 2016-01-06 KR KR1020177022288A patent/KR20170104557A/ko unknown
- 2016-01-06 EP EP16737178.0A patent/EP3244420A4/en not_active Withdrawn
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006339057A (ja) * | 2005-06-03 | 2006-12-14 | Nec Corp | 樹脂金属複合導電材料、その製造方法およびそれを用いた電子デバイス |
WO2009116349A1 (ja) * | 2008-03-21 | 2009-09-24 | 旭硝子株式会社 | 銅ナノ粒子被覆銅フィラー、その製造方法、銅ペーストおよび金属膜を有する物品 |
JP2009253196A (ja) * | 2008-04-10 | 2009-10-29 | Tokuyama Corp | 配線基板の製造方法 |
WO2011114747A1 (ja) * | 2010-03-18 | 2011-09-22 | 古河電気工業株式会社 | 導電性ペースト、及び該ペーストから得られる導電接続部材 |
JP2014026968A (ja) * | 2012-06-20 | 2014-02-06 | Cemedine Co Ltd | 導電性ペースト |
JP2014011006A (ja) * | 2012-06-29 | 2014-01-20 | Arakawa Chem Ind Co Ltd | 導電性ペースト |
WO2014104032A1 (ja) * | 2012-12-25 | 2014-07-03 | 戸田工業株式会社 | 銅粉末の製造方法及び銅粉末、銅ペースト |
JP2014150048A (ja) * | 2013-01-11 | 2014-08-21 | Jsr Corp | 銅膜形成用組成物、銅膜形成方法、銅膜、配線基板および電子機器 |
JP2015133317A (ja) * | 2013-12-10 | 2015-07-23 | Dowaエレクトロニクス株式会社 | 導電性ペーストおよびそれを用いた導電膜の製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP3244420A4 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023054220A1 (ja) * | 2021-09-30 | 2023-04-06 | 大陽日酸株式会社 | 導電性ペースト、導電膜付き基材、および導電膜付き基材の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2016131078A (ja) | 2016-07-21 |
EP3244420A4 (en) | 2018-08-22 |
EP3244420A1 (en) | 2017-11-15 |
KR20170104557A (ko) | 2017-09-15 |
CN107112068A (zh) | 2017-08-29 |
US20170362455A1 (en) | 2017-12-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2015087989A1 (ja) | 導電性ペーストおよびそれを用いた導電膜の製造方法 | |
WO2015068826A1 (ja) | 銅粒子分散液およびそれを用いた導電膜の製造方法 | |
JP2021167425A (ja) | 融着ネットワークを有する透明導電性フィルムの形成のための金属ナノワイヤーインク | |
JP6387021B2 (ja) | 融着金属ナノ構造化ネットワーク、および還元剤を有する融着溶液 | |
WO2016114105A1 (ja) | 導電性ペーストおよびそれを用いた導電膜の製造方法 | |
JP5632852B2 (ja) | 低温焼結性銀ナノ粒子組成物および該組成物を用いて形成された電子物品 | |
WO2013161996A2 (ja) | 透明導電性インク及び透明導電パターン形成方法 | |
JP2017505509A (ja) | 金属ナノワイヤおよびポリマーバインダーを主成分とする透明導電性コーティング、その溶液処理、およびパターン化方法 | |
WO2018169012A1 (ja) | 分散体並びにこれを用いた導電性パターン付構造体の製造方法及び導電性パターン付構造体 | |
JP2007194122A (ja) | 導電性ペーストおよびそれを用いた配線基板 | |
JP2017069012A (ja) | 導電性ペーストおよびそれを用いた導電膜の製造方法 | |
TW201407636A (zh) | 導電膏組成物 | |
WO2020153101A1 (ja) | 導電性ペースト、導電膜付き基材、および導電膜付き基材の製造方法 | |
TWI754695B (zh) | 光燒結型組成物、使用其的導電膜的形成方法及氧化亞銅粒子糊 | |
JP2016062732A (ja) | 導電膜の製造方法 | |
JP6740932B2 (ja) | 導電性組成物 | |
EP3693109A1 (en) | Silver microparticle dispersion liquid | |
TW201703901A (zh) | 處理奈米粒子的方法 | |
US11227702B2 (en) | Fine silver particle dispersion | |
TW201946982A (zh) | 光燒結型組成物及使用其的導電膜的形成方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16737178 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15540660 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20177022288 Country of ref document: KR Kind code of ref document: A |
|
REEP | Request for entry into the european phase |
Ref document number: 2016737178 Country of ref document: EP |