WO2016112638A1 - 基板支撑装置、基板支撑方法以及真空干燥设备 - Google Patents

基板支撑装置、基板支撑方法以及真空干燥设备 Download PDF

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Publication number
WO2016112638A1
WO2016112638A1 PCT/CN2015/081732 CN2015081732W WO2016112638A1 WO 2016112638 A1 WO2016112638 A1 WO 2016112638A1 CN 2015081732 W CN2015081732 W CN 2015081732W WO 2016112638 A1 WO2016112638 A1 WO 2016112638A1
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WIPO (PCT)
Prior art keywords
substrate
flat plate
plate portion
supporting device
support
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PCT/CN2015/081732
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English (en)
French (fr)
Inventor
王曼
翟玉漫
Original Assignee
京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 合肥京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/899,913 priority Critical patent/US20160372343A1/en
Publication of WO2016112638A1 publication Critical patent/WO2016112638A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/001—Handling, e.g. loading or unloading arrangements
    • F26B25/003—Handling, e.g. loading or unloading arrangements for articles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/06—Chambers, containers, or receptacles
    • F26B25/08—Parts thereof
    • F26B25/10—Floors, roofs, or bottoms; False bottoms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/04—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
    • F26B5/042—Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum for drying articles or discrete batches of material in a continuous or semi-continuous operation, e.g. with locks or other air tight arrangements for charging/discharging
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Definitions

  • the present invention relates to the field of display panel manufacturing technology, and in particular, to a substrate supporting device, a substrate supporting method, and a vacuum drying device including the substrate supporting device.
  • the film layer In the fabrication process of the array substrate and the color filter substrate, most of the film layers involve the coating, exposure and development processes of the photoresist. After the coating of the photoresist is completed, the film layer needs to be vacuum dried. That is, the volatilization of the solvent is carried out at room temperature and the atmospheric pressure is close to 0 Pa, so that the film layer maintains a certain degree of uniformity and hardness for preparation for subsequent exposure and development processes.
  • Figure 1 shows the internal structure of a chamber of a conventional vacuum drying apparatus. As shown in Fig. 1, a certain number of movable supporting pins 2 are arranged at the bottom of the chamber 1, and the supporting pin 2 is fixed by magnet adsorption. 2a-2f illustrate the operational flow of an existing vacuum drying apparatus.
  • the robot 3 transports the substrate 4 coated with the film layer to the inside of the chamber 1; then, as shown in FIG. 2b, the robot 3 is lowered, and the substrate 4 is placed on the support Pin 2 and Supported by Pin 2; then, as shown in Fig. 2c, the robot 3 is withdrawn, and vacuum drying is performed inside the chamber 1; next, as shown in Fig. 2d and Fig. 2e, after the drying is finished, the robot 3 is extended. The space between the support pins 2 is pushed to raise the substrate 4; finally, as shown in Fig. 2f, the robot 3 is withdrawn and the substrate 4 is taken out.
  • the support pin 2 In the above support mode, the support pin 2 must be located in the non-display area of the substrate 4 when supporting. As shown in FIGS. 3 and 4, the support pin 2 is distributed around the display area of the substrate 4. This is because the position on the substrate 4 in contact with the support pin 2 is lifted up to form a small protrusion as shown in FIG. The film layer 5 coated on the surface of the substrate 4 flows, so that the film thickness at the protrusion position is thinner than the surrounding area. During the drying process, moiré is formed due to uneven film thickness. After the end of the vacuum drying, since most of the solvent in the film layer 5 has volatilized, the fluidity is greatly lowered. Therefore, the small protrusion formed by supporting Pin 2 cannot be recovered. That is to say, the display of moire still exists, and thus the shadow The effect is displayed.
  • the distribution of supporting Pins depends on the layout of the substrate, and therefore the contact point for supporting the pin must be sufficiently considered in designing the substrate. While ensuring that the distribution of the contact points is relatively uniform, it is necessary to ensure that the support Pin does not interfere with the movement of the robot. This not only increases the design difficulty of the substrate, but also limits the utilization of the substrate.
  • An object of the present invention is to provide a substrate supporting device, a supporting method, and a vacuum drying device, which solve the problems of complicated design and operation of the existing supporting device and high risk of failure.
  • a substrate supporting device for a vacuum drying apparatus includes a fixing mechanism and a lifting mechanism
  • the fixing mechanism includes a table surface
  • the table surface is provided with a plurality of through holes
  • the lifting mechanism includes a plurality of flat plate portions corresponding to the through holes, and a plurality of The flat plate portion can be respectively moved into the corresponding through holes and form a support surface for supporting the substrate together with the mesa, and the flat plate portion can also move to a position above the corresponding through hole.
  • the mesa is composed of a plurality of sub-mesa, and a strip-shaped space is formed between two adjacent sub-tables, and the strip-shaped space serves as the through-hole.
  • the through hole has a closed shape.
  • the closed shape is rectangular or circular.
  • a plurality of the through holes are evenly distributed in the mesa, and the shape of the flat portion matches the shape of the through hole at a corresponding position.
  • the shape of the flat portion includes a rectangle or a circle.
  • the lifting mechanism comprises an elevation driving unit, a plurality of support rods and a plurality of support columns, each of the support rods is provided with a support column for supporting the flat plate portion, and the lifting drive unit is used for driving The support rod is raised and lowered.
  • the lifting mechanism further comprises a plurality of support rods connected together a connecting rod connected to an output shaft of the lifting drive unit.
  • each of the support columns is for supporting one of the flat portions.
  • the plurality of support columns collectively support one of the flat portions.
  • a support method using the above substrate supporting device comprising:
  • the flat plate portion of the elevating mechanism is moved into the through hole of the fixing mechanism to support the substrate together with the mesa of the fixing mechanism.
  • the supporting method comprises:
  • the flat plate portion When the substrate is dried, the flat plate portion is lowered into the through hole such that the flat plate portion is flush with the table surface of the fixing mechanism;
  • the flat plate portion After drying the substrate, the flat plate portion is raised to a position above the through hole to take out the substrate.
  • the supporting method comprises:
  • the flat plate portion When drying the substrate, the flat plate portion is raised into the through hole such that the flat plate portion is flush with the mesa of the fixing mechanism;
  • the flat plate portion After drying the substrate, the flat plate portion is lowered to a position below the through hole to take out the substrate.
  • a vacuum drying apparatus comprising the above substrate supporting device.
  • the substrate is placed on a flat surface during the entire drying process by means of a fixing mechanism and a lifting mechanism. Therefore, compared with the prior art, the contact mode of the substrate with the substrate supporting device changes from point contact to surface contact, which reduces the risk of display failure of the product. In addition, for different models of products, it is not necessary to consider the layout of the substrate. If you change the model number of the product, you do not need to adjust the support device. In summary, the present invention has the following advantages:
  • FIG. 1 is a schematic view showing an internal structure of a chamber of a conventional vacuum drying apparatus
  • FIGS. 2a-2f are flow charts showing an operation process of a conventional vacuum drying apparatus
  • Figure 3 is a schematic view showing the distribution of support rods in the prior art
  • Figure 4 is a schematic view showing another distribution of the support rod in the prior art
  • Figure 5 is a schematic view showing a moiré formed by supporting Pin
  • Figure 6 is a schematic view of a substrate supporting device according to a first embodiment of the present invention.
  • 7a-7c are a side view, a top view, and a bottom view, respectively, of the fixing mechanism of the substrate supporting device shown in Fig. 6;
  • 8a to 8c are a side view, a plan view, and a bottom view, respectively, of the lifting mechanism of the substrate supporting device shown in Fig. 6;
  • 9a to 9c are a side view, a plan view, and a bottom view, respectively, of a combination of a fixing mechanism and a lifting mechanism of the substrate supporting device shown in Fig. 6;
  • FIG. 10a-10h are flowcharts showing the operation of the substrate supporting device shown in Fig. 6, respectively;
  • Figure 11 is a schematic view of a substrate supporting device according to a second embodiment of the present invention.
  • 12a to 12c are a side view, a plan view, and a bottom view, respectively, of the fixing mechanism of the substrate supporting device shown in Fig. 11;
  • 13a to 13c are respectively side of the lifting mechanism of the substrate supporting device shown in Fig. 11 View, top view and bottom view;
  • 14a to 14c are a side view, a plan view, and a bottom view, respectively, of a combination of a fixing mechanism and a lifting mechanism of the substrate supporting device shown in Fig. 11;
  • 15a to 15h are flowcharts showing the operation of the substrate supporting device shown in Fig. 11, respectively.
  • 1 chamber; 2: support Pin; 3: robot; 4: substrate; 5: film; 6: fixing mechanism; 61: table; 611: sub-table; 612: strip-shaped interval; Through hole; 63: post; 7: lifting mechanism; 71: flat portion; 72: lifting drive unit; 73: support rod; 731: connecting rod; 74: support column.
  • the present invention provides a substrate supporting device for a vacuum drying apparatus.
  • Fig. 6 is a schematic structural view of a substrate supporting device according to a first embodiment of the present invention.
  • the substrate supporting device includes a fixing mechanism 6 and a lifting mechanism 7.
  • the fixing mechanism 6 includes a table 61 on which a plurality of through holes are provided (as shown in Fig. 7b).
  • the lifting mechanism 7 includes a plurality of flat plate portions 71.
  • the position and shape of the flat plate portion 71 correspond to the position and shape of the through hole, and thus the flat plate portion 71 can be respectively moved into the corresponding through holes and together with the table top 61 form a support surface for supporting the substrate.
  • the flat plate portion 71 can be further moved to a position above the corresponding through hole.
  • the present invention allows the substrate to be placed on a flat surface during the entire drying process by using the fixing mechanism 6 and the lifting mechanism 7 in cooperation. Therefore, compared with the prior art, the contact mode of the substrate with the substrate supporting device changes from point contact to surface contact, which reduces the risk of display failure of the product.
  • the present invention avoids the risk of introducing particulate matter into the interior of the device when the person adjusts the supporting device, and also avoids display defects caused by human error due to human error. And improve the quality of the product.
  • the contact method since the contact method is changed from point contact to surface contact, it is not necessary to consider the position of the contact point, and the utilization ratio of the substrate can be fully utilized, and the design difficulty is lowered.
  • Figures 7a - 7c schematically show a fastening mechanism 6 according to a first embodiment of the invention
  • Figures 8a - 8c schematically show a lifting mechanism 7 according to a first embodiment of the invention
  • Figure 9a - Figure 9c shows a schematic view of the combination of the fixing mechanism 6 and the lifting mechanism 7.
  • the substrate supporting device includes a fixing mechanism 6 and a lifting mechanism 7.
  • the fixing mechanism 6 includes a through hole 62 and a land 61.
  • the through hole 62 has a closed shape, and the plurality of through holes 62 are evenly distributed in the mesa 61.
  • the lifting mechanism 7 includes a lifting drive unit 72, a plurality of horizontal support bars 73, and a plurality of vertical support columns 74.
  • Each of the support rods 73 is provided with a plurality of support columns 74 for supporting the flat plate portion 71.
  • the lift drive unit 72 is used to drive the support rod 73 to move up and down.
  • the shape of the flat portion 71 matches the shape of the through hole 62 at the corresponding position.
  • the shapes of the through hole 62 and the flat plate portion 71 are shown as rectangles in the drawing, it is conceivable that the through hole 62 and the flat plate portion 71 may take other shapes such as a circular shape, an elliptical shape, a polygonal shape, or the like. Preferably, the through hole 62 and the flat plate portion 71 are rectangular or circular.
  • the table 61 is supported by a plurality of posts 63, and the bottom end of the post 63 is fixed to the inner bottom surface of the chamber 1 of the vacuum drying apparatus (refer to Fig. 6).
  • the lifting mechanism 7 further includes a connecting rod 731 for connecting the plurality of support rods 73 together.
  • the connecting rod 731 is connected to the output shaft of the elevation drive unit 72. That is, the driving force of the elevation drive unit 72 is output to the plurality of support bars 73 through the drive connecting rod 731, so that the flat plate portion 71 is raised or lowered.
  • the lift drive unit 72 may be a cylinder.
  • the extending direction of the connecting rod 731 is perpendicular to the extending direction of the support rod 73.
  • a plurality of support rods 73 are evenly distributed on the connecting rod 731, thereby increasing the balance of the support rods and enhancing the structural strength.
  • each of the support columns 74 may be provided to support one flat plate portion 71.
  • FIG. 10a to 10h are flowcharts showing the operation of the substrate supporting device according to the first embodiment. Specific steps are as follows:
  • the substrate supporting device is set to an initial state such that the flat plate portion 71 is higher than the mesa 61, and then the substrate 4 is carried by the robot 3 to the upper side of the substrate supporting device;
  • the elevation driving unit 72 drives the flat plate portion 71 to descend until the flat plate portion 71 protrudes into the through hole at the corresponding position and is flush with the table 61.
  • the substrate 4 is located at the flat plate portion 71 and the table 61. a support surface formed together, and then vacuum drying the substrate 4;
  • the elevation driving unit 72 drives the flat plate portion 71 to rise, so that the substrate 4 after the drying process is higher than the mesa 61;
  • the substrate 4 is always supported by the horizontal mesas 61 and the flat portions 71 together. Further, the gap between the mesa 61 and the flat portion 71 is preferably within 2 mm. This slit is sufficiently small with respect to the size of the substrate 4, so that it does not have any influence on the levelness of the substrate 4, thereby ensuring the quality of the product.
  • the flat plate portion 71 and the through hole 62 are evenly distributed.
  • the position and size of the flat plate portion 71 and the through hole 62 can refer to the width and moving path (horizontal moving path and vertical moving path) of the manipulator 3 as long as the movement (horizontal movement and vertical movement) of the manipulator 3 is not spatially disturbed.
  • the substrate supporting device may be used.
  • a plurality of clamping portions may be provided at positions corresponding to the edges of the substrate 4 of the mesa 61. .
  • the nip is in a released state before the substrate 4 is placed on the table 61.
  • the nip portion can fix the substrate 4 on the mesa 61 and remain in a fixed state throughout the drying process.
  • the clamping portion can be released again so that it can be removed from the table 61 The substrate 4 is removed.
  • Fig. 11 schematically shows a substrate supporting device according to a second embodiment of the present invention.
  • 12a to 12c schematically show a fixing mechanism 6 according to a second embodiment of the present invention
  • Figs. 13a to 13c schematically show a lifting mechanism 7 according to a second embodiment of the present invention
  • Figs. 14a- 14c shows a schematic view of the combination of the fixing mechanism 6 and the lifting mechanism 7.
  • the substrate supporting device includes a fixing mechanism 6 and a lifting mechanism 7.
  • the securing mechanism 6 comprises a table 61.
  • the table 61 is composed of a plurality of sub-tables 611.
  • a strip-shaped spacing 612 is formed between adjacent two sub-tables 611 (shown clearly in Figure 12b).
  • the stripe interval 612 in the present embodiment corresponds to the through hole 62 in the first embodiment of the present invention.
  • a plurality of strip intervals 612 are evenly distributed in the mesas 61, thereby dividing the mesas 61 into a plurality of sub-tables 611.
  • the shape of the flat portion 71 matches the shape of the strip spacing 612 at the corresponding position.
  • Each sub-mount 611 is supported by at least one post 63. The bottom end of the post 63 is fixed to the inner bottom surface of the chamber 1 of the vacuum drying apparatus (refer to Fig. 11).
  • the width of the strip spacing 612 is preferably greater than the width of the robot, so that the robot can pass through the strip spacing 612 unobstructed during lifting. In this way, the working mode of the substrate supporting device can be made more flexible.
  • the lifting mechanism 7 includes a lifting drive unit 72, a plurality of horizontal support bars 73, and a plurality of vertical support columns 74. Each of the support rods 73 is provided with a support post 74 for supporting the flat plate portion 71.
  • the lift drive unit 72 is used to drive the support rod 73 to move up and down.
  • the lifting mechanism 7 further includes a connecting rod 731 for connecting the plurality of support rods 73 together.
  • the connecting rod 731 is connected to the output shaft of the elevation drive unit 72. That is, the driving force of the elevation drive unit 72 is output to the plurality of support bars 73 through the drive connecting rod 731, so that the flat plate portion 71 is raised or lowered.
  • the lift drive unit 72 may be a cylinder.
  • the extending direction of the connecting rod 731 is perpendicular to the extending direction of the support rod 73.
  • a plurality of support rods 73 are evenly distributed on the connecting rod 731, thereby increasing the balance of the support rods and enhancing the structural strength.
  • due to the tablet The portion 71 is elongated, so that the plurality of support columns 74 located on the plurality of support bars 73 may be disposed to collectively support one flat plate portion 71.
  • 15a to 15h are flowcharts showing the operation of the substrate supporting device according to the second embodiment. Specific steps are as follows:
  • the substrate supporting device is set to an initial state such that the flat plate portion 71 is lower than the mesa 61, and then the substrate 4 is carried by the robot 3 to the upper side of the substrate supporting device;
  • the elevation driving unit 72 drives the flat plate portion 71 to rise until the flat plate portion 71 protrudes into the strip-shaped space 612 and is flush with the table surface 61.
  • the substrate 4 is located at the flat plate portion 71 and the table surface 61. Forming the support surface, and then vacuum drying the substrate 4;
  • the flat plate portion 71 may be initially located above and below the table 61.
  • the workflow thereof is the same as that of the first embodiment, and details are not described herein again.
  • the substrate 4 is always supported by the horizontal mesas 61 and the flat portions 71 together. Further, the gap between the mesa 61 and the flat portion 71 is preferably within 2 mm. This slit is sufficiently small with respect to the size of the substrate 4, so that it does not have any influence on the levelness of the substrate 4, thereby ensuring the quality of the product.
  • the position and size of the flat plate portion 71 can refer to the width and moving path of the robot 3 (horizontal moving path and vertical moving path) as long as it is ensured
  • the movement (horizontal movement and vertical movement) of the robot 3 does not spatially interfere with the substrate supporting device.
  • a plurality of clamping portions may be provided at positions corresponding to the edges of the substrate 4 of the mesa 61. .
  • the nip is in a released state before the substrate 4 is placed on the table 61.
  • the nip portion can fix the substrate 4 on the mesa 61 and remain in a fixed state throughout the drying process.
  • the clamping portion can be released again so that the substrate 4 can be removed from the table 61.
  • the present invention also provides a supporting method using the above substrate supporting device, the supporting method mainly comprising: moving a flat plate portion of the lifting mechanism into a through hole of the fixing mechanism when drying the substrate, thereby The substrate is supported together with the mesa of the fixing mechanism.
  • the substrate is placed on a flat countertop throughout the drying process. Therefore, compared with the prior art, the contact mode of the substrate with the substrate supporting device changes from point contact to surface contact, thereby reducing the risk of display failure of the product.
  • the supporting method includes:
  • the flat plate portion of the lifting mechanism is disposed above the through hole of the fixing mechanism, and the substrate is placed on the flat plate portion;
  • the flat plate portion When the substrate is dried, the flat plate portion is lowered into the through hole such that the flat plate portion is flush with the table surface of the fixing mechanism;
  • the flat plate portion After drying the substrate, the flat plate portion is raised to a position above the through hole to take out the substrate.
  • the supporting method includes:
  • the flat plate portion of the lifting mechanism is disposed under the through hole of the fixing mechanism, and the substrate is placed on the table surface;
  • the flat plate portion When drying the substrate, the flat plate portion is raised into the through hole such that the flat plate portion is flush with the mesa of the fixing mechanism;
  • the flat plate portion After drying the substrate, the flat plate portion is lowered to a position below the through hole to take out the substrate.
  • the present invention also provides a vacuum drying apparatus including the substrate supporting apparatus provided by the present invention.
  • the substrate is placed on a flat countertop throughout the drying process. Therefore, compared with the prior art, the contact mode of the substrate with the substrate supporting device changes from point contact to surface contact, thereby reducing the risk of display failure of the product. In addition, for different models of products, it is not necessary to consider the layout of the substrate. If the model of the product is replaced, the support device does not need to be adjusted, thereby reducing the workload of the personnel and reducing the design difficulty of the device.

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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Manufacturing & Machinery (AREA)
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Abstract

一种基板支撑装置、支撑方法以及真空干燥设备。所述基板支撑装置包括固定机构(6)和升降机构(7)，所述固定机构包括台面(61)，所述台面上设置有多个通孔(62)，所述升降机构包括多个与所述通孔相对应的平板部(71)，多个所述平板部能够分别移动至相应置通孔中并与所述台面共同形成用于支撑基板的支撑面，并且，所述平板部还能够移动至对应通孔上方的位置。本发明通过固定机构和升降机构相配合的方式，使基板在整个干燥过程中均放置在平坦的台面上。因此，与现有相比，基板与基板支撑装置的接触方式由点接触变成面接触，降低了产品出现显示不良的风险。此外，如果更换产品的型号，不需要对支撑装置进行调整，因而减少了人员的工作量，降低了装置的设计难度。

Description

基板支撑装置、基板支撑方法以及真空干燥设备 技术领域
本发明涉及显示面板制造技术领域，尤其涉及一种基板支撑装置、基板支撑方法以及包括该基板支撑装置的真空干燥设备。
背景技术
在阵列基板和彩膜基板的制作过程中，大部分膜层均涉及到光刻胶的涂布、曝光和显影工艺。在完成光刻胶的涂布之后，需要对膜层进行真空干燥处理。即，在室温并且大气压接近0Pa的条件下进行溶剂的挥发，使得膜层保持一定的均匀度和硬度，为后续的曝光和显影工艺做准备。
图1示出了现有真空干燥设备的腔室的内部结构。如图1所示，腔室1的底部布置有一定数量的可移动的支撑Pin 2，支撑Pin 2通过磁铁吸附的方式固定。图2a-图2f示出了现有真空干燥设备的操作流程。
首先，如图2a所示，机械手3将表面涂布有膜层的基板4运送到腔室1的内部；然后，如图2b所示，机械手3下降，使基板4放置在支撑Pin 2上并被支撑Pin 2支撑；然后，如图2c所示，机械手3撤出，在腔室1的内部进行真空干燥处理；接下来，如图2d和图2e所示，在干燥结束后，机械手3伸入支撑Pin 2之间的空隙，使基板4上升；最后，如图2f所示，机械手3撤出并将基板4取出。
在上述支撑方式中，支撑Pin 2在支撑时必须位于基板4的非显示区域。如图3和图4所示，支撑Pin 2分布在基板4的显示区域的周围。这是由于基板4上与支撑Pin 2接触的位置会被顶起而形成如图5中所示的小突起。涂布在基板4表面的膜层5会发生流动，从而使突起位置的膜厚较周围区域变薄。在干燥过程中，由于膜厚不均匀，因此会形成云纹(Mura)。在真空干燥结束后，由于膜层5中大部分溶剂已经挥发，流动性大大降低。因此，由支撑Pin 2而形成的小突起将无法恢复。也就是说，显示云纹(Mura)依然存在，从而影 响显示效果。
在实际生产中，不同的基板布局不同，因此支撑Pin的分布也相应地不同。如果更换产品的型号，操作人员必须对支撑Pin的位置进行调整以避开基板的显示区域。在支撑Pin的调整过程中容易引入粉尘和颗粒物。同时，人为失误使得支撑Pin的位置错误也会造成产品显示不良。此外，支撑Pin的分布取决于基板的布局，因此在设计基板时必须充分考虑支撑Pin的接触点。在保证接触点的分布相对均匀的同时，需要保证支撑Pin不会干扰机械手的动作。这样不但增加了基板的设计难度，而且还限制了基板的利用率。
发明内容
本发明的目的在于提供一种基板支撑装置、支撑方法以及真空干燥设备，以解决现有支撑装置设计和操作复杂、不良风险高的问题。
为解决上述技术问题，作为本发明的第一个方面，提供一种用于真空干燥设备的基板支撑装置。所述基板支撑装置包括固定机构和升降机构，所述固定机构包括台面，所述台面上设置有多个通孔，所述升降机构包括多个与所述通孔相对应的平板部，多个所述平板部能够分别移动至相应通孔中并与所述台面共同形成用于支撑基板的支撑面，并且，所述平板部能还够移动至相应通孔上方的位置。
优选地，所述台面由多个子台面组成，相邻两个所述子台面之间形成有条形间隔，所述条形间隔用作所述通孔。
优选地，所述通孔呈闭合形状。
优选地，所述闭合形状为矩形或圆形。
优选地，多个所述通孔均匀分布在所述台面中，所述平板部的形状与相应位置的所述通孔的形状匹配。
优选地，所述平板部的形状包含矩形或圆形。
优选地，所述升降机构包括升降驱动单元、多根支撑杆以及多根支撑柱，每个所述支撑杆上均设置有用于支撑所述平板部的支撑柱，所述升降驱动单元用于驱动所述支撑杆升降。
优选地，所述升降机构还包括用于将多根支撑杆连接在一起的 连接杆，所述连接杆与所述升降驱动单元的输出轴相连。
优选地，每根支撑柱用于支撑一个所述平板部。
优选地，多根支撑柱共同支撑一个所述平板部。
作为本发明的第二个方面，还提供一种利用上述基板支撑装置的支撑方法，所述支撑方法包括：
在对基板进行干燥时，将所述升降机构的平板部移动至所述固定机构的通孔中，从而与所述固定机构的台面一起支撑基板。
优选地，所述支撑方法包括：
在对所述基板进行干燥之前，将所述升降机构的平板部移动至所述固定机构的通孔上方，并将所述基板放置在所述平板部上；
在对所述基板进行干燥时，将所述平板部下降至所述通孔中，使得所述平板部与固定机构的台面齐平；
在对所述基板进行干燥之后，使所述平板部上升至所述通孔上方的位置以取出所述基板。
优选地，所述支撑方法包括：
在对所述基板进行干燥之前，将所述升降机构的平板部移动至所述固定机构的通孔下方，并将所述基板放置在所述台面上；
在对所述基板进行干燥时，将所述平板部上升至所述通孔中，使得所述平板部与固定机构的台面齐平；
在对所述基板进行干燥之后，使所述平板部下降至所述通孔下方的位置以取出所述基板。
作为本发明的第三个方面，还提供一种真空干燥设备，所述真空干燥设备包括上述基板支撑装置。
本发明通过固定机构和升降机构相配合的方式，使基板在整个干燥过程中均放置在平坦的台面上。因此，与现有相比，基板与基板支撑装置的接触方式由点接触变成面接触，降低了产品出现显示不良的风险。此外，对于不同型号的产品，不必考虑基板的布局。如果更换产品的型号，不需要对支撑装置进行调整。综上所述，本发明具有如下优点：
1、在更换产品的型号时，无需调整支撑部位，减少了人员的工 作量；
2、避免了在人员调整支撑装置时将颗粒物引入设备内部的风险，也避免了由于人为失误造成支撑部位错误而引起显示不良，从而提升了产品的品质；
3、在产品设计方面，由于接触方式由点接触变成面接触，因此不必考虑接触点的位置，可以充分发挥基板的利用率，并降低装置的设计难度。
附图说明
结合附图进一步理解本发明的优选实施方式。应当注意的是，附图构成说明书的一部分并且与下面的具体实施方式一起用于解释本发明，但不构成对本发明的限制。
图1是示出现有真空干燥设备的腔室的内部结构的示意图；
图2a-图2f是示出现有真空干燥设备的操作过程的流程图；
图3是示出现有技术中支撑杆的分布的示意图；
图4是示出现有技术中支撑杆的另一种分布的示意图；
图5是示出由支撑Pin形成的云纹的示意图；
图6是根据本发明第一实施方式的基板支撑装置的示意图；
图7a-图7c分别是图6所示的基板支撑装置的固定机构的侧视图、俯视图和仰视图；
图8a-图8c分别是图6所示的基板支撑装置的升降机构的侧视图、俯视图和仰视图；
图9a-图9c分别是图6所示的基板支撑装置的固定机构和升降机构组合的侧视图、俯视图和仰视图；
图10a-图10h分别是图6所示的基板支撑装置的工作过程的流程图；
图11是根据本发明第二实施方式的基板支撑装置的示意图；
图12a-图12c分别是图11所示的基板支撑装置的固定机构的侧视图、俯视图和仰视图；
图13a-图13c分别是图11所示的基板支撑装置的升降机构的侧 视图、俯视图和仰视图；
图14a-图14c分别是图11所示的基板支撑装置的固定机构和升降机构组合的侧视图、俯视图和仰视图；以及
图15a-图15h分别是图11所示的基板支撑装置的工作过程的流程图。
在附图中，1：腔室；2：支撑Pin；3：机械手；4：基板；5：膜层；6：固定机构；61：台面；611：子台面；612：条形间隔；62：通孔；63：台柱；7：升降机构；71：平板部；72：升降驱动单元；73：支撑杆；731：连接杆；74：支撑柱。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
本发明提供了一种用于真空干燥设备的基板支撑装置。图6是根据本发明第一实施方式的基板支撑装置的结构示意图。所述基板支撑装置包括固定机构6和升降机构7。固定机构6包括台面61，台面61上设置有多个通孔(如图7b所示)。升降机构7包括多个平板部71。平板部71的位置和形状与通孔的位置和形状相对应，因此平板部71能够分别移动至相应通孔中并与台面61共同形成用于支撑基板的支撑面。在本实施方式中，平板部71能够进一步移动至相应通孔上方的位置。
本发明通过采用固定机构6和升降机构7相配合的方式，使基板在整个干燥过程中均放置在平坦的台面上。因此，与现有相比，基板与基板支撑装置的接触方式由点接触变成面接触，降低了产品出现显示不良的风险。
此外，对于不同型号的产品，不必考虑基板的布局。如果更换产品的型号，不需要对支撑装置进行调整，因而减少了人员的工作量。同时，本发明避免了在人员调整支撑装置时将颗粒物引入设备内部的风险，也避免了由于人为失误造成支撑部位错误而引起显示不良，从 而提升了产品的品质。在产品设计方面，由于接触方式由点接触变成面接触，因此不必考虑接触点的位置，可以充分发挥基板的利用率，降低了设计难度。
图7a-图7c示意性示出了根据本发明的第一实施方式的固定机构6，图8a-图8c示意性示出了根据本发明的第一实施方式的升降机构7，而图9a-图9c示出了固定机构6与升降机构7的组合的示意图。
根据第一实施方式的基板支撑装置包括固定机构6和升降机构7。在本发明的第一实施方式中，固定机构6包括通孔62和台面61。通孔62呈闭合形状，并且多个通孔62均匀分布在台面61中。升降机构7包括升降驱动单元72、多根水平支撑杆73以及多根竖直支撑柱74。每根支撑杆73上均设置有用于支撑平板部71的若干支撑柱74。升降驱动单元72用于驱动支撑杆73升降。平板部71的形状与相应位置的通孔62的形状匹配。虽然在通孔62和平板部71的形状在图中显示为矩形，但是可以预期的是，通孔62和平板部71也可以采用其他形状，例如圆形、椭圆形、多边形等。优选的是，通孔62和平板部71采用矩形或圆形。台面61由多根台柱63支撑，台柱63的底端固定在真空干燥设备的腔室1的内侧底面上(参考图6)。
进一步地，升降机构7还包括用于将多根支撑杆73连接在一起的连接杆731。连接杆731与升降驱动单元72的输出轴相连。即，升降驱动单元72的驱动力通过驱动连接杆731输出至多根支撑杆73，从而使平板部71实现上升或者下降。在本发明中，升降驱动单元72可以是气缸。
优选地，如图8b所示，连接杆731的延伸方向与支撑杆73的延伸方向垂直。多根支撑杆73均匀分布在连接杆731上，从而增加了支撑杆的平衡性并且增强了结构强度。在本实施方式中，由于平板部71的面积较小，所以每根支撑柱74可以设置成支撑一个平板部71。
图10a-图10h是根据第一实施方式的基板支撑装置的工作过程的流程图。具体步骤如下：
S11：如图10a所示，将所述基板支撑装置设置成初始状态，使得平板部71高于台面61，然后通过机械手3将基板4搬运至所述基板支撑装置的上方；
S12：如图10b所示，机械手3下降，将基板4放置在平板部71上；
S13：如图10c所示，机械手3撤出；
S14：如图10d所示，升降驱动单元72驱动平板部71下降，直到平板部71伸入相应位置的通孔中并与台面61相平齐，此时，基板4位于平板部71与台面61共同形成的支撑面上，然后对基板4进行真空干燥处理；
S15：如图10e所示，在干燥处理完毕后，升降驱动单元72驱动平板部71上升，使得干燥处理后的基板4高于台面61；
S16：如图10f所示，机械手3伸入所述基板的下方，使得机械手3位于平板部71和台面61之间的位置；
S17：如图10g所示，机械手3上升以取出基板4；
S18：如图10h所示，将所述基板支撑装置恢复到初始状态。
在本发明的干燥过程中，基板4始终由水平的台面61和平板部71一起支撑。另外，台面61和平板部71之间的缝隙优选在2mm之内。该缝隙相对于基板4的尺寸而言足够小，因此不会对基板4的水平度造成任何影响，从而保证了产品的质量。
在设计基板支撑装置时，平板部71和通孔62是均匀分布的。平板部71和通孔62的位置和尺寸可以参考机械手3的宽度和移动路径(水平移动路径和竖直移动路径)，只要确保机械手3的移动(水平移动和竖直移动)在空间上不干扰所述基板支撑装置即可。
进一步地，由于在真空干燥过程中腔室内部的气流较强，为了防止基板4在台面61上漂移，可以在台面61的与基板4边缘对应的位置设置若干个夹持部(未示出)。在基板4放置到台面61之前，所述夹持部处于释放状态。当基板4放置到台面61上后，所述夹持部可以使基板4固定在台面61上并在整个干燥过程中保持固定状态。在干燥过程结束后，所述夹持部可以再次释放，从而可以从台面61 上取下基板4。
图11示意性示出了根据本发明的第二实施方式的基板支撑装置。图12a-图12c示意性示出根据本发明的第二实施方式的固定机构6，图13a-图13c示意性示出了根据本发明的第二实施方式的升降机构7，而图14a-图14c示出了固定机构6与升降机构7的组合的示意图。
根据第二实施方式的基板支撑装置包括固定机构6和升降机构7。在本发明的第二实施方式中，固定机构6包括台面61。台面61由多个子台面611组成。相邻两个子台面611之间形成有条形间隔612(如图12b清晰地示出)。本实施方式中的条形间隔612相当于本发明的第一实施方式中的通孔62。
在本发明的第二实施方式中，多个条形间隔612均匀分布在台面61中，从而将台面61划分为多个子台面611。平板部71的形状与相应位置的条形间隔612的形状匹配。每个子台面611通过至少一根台柱63支撑。台柱63的底端固定在真空干燥设备的腔室1的内侧底面上(参考图11)。
需要说明的是，在第二种实施方式中，条形间隔612的宽度优选大于机械手的宽度，使得机械手能够在升降过程中无障碍地通过条形间隔612。这样，可以使所述基板支撑装置的工作方式更加灵活。
升降机构7包括升降驱动单元72、多根水平支撑杆73以及多根竖直支撑柱74。每根支撑杆73上均设置有用于支撑平板部71的支撑柱74。升降驱动单元72用于驱动支撑杆73升降。
进一步地，升降机构7还包括用于将多根支撑杆73连接在一起的连接杆731。连接杆731与升降驱动单元72的输出轴相连。即，升降驱动单元72的驱动力通过驱动连接杆731输出至多根支撑杆73，从而使平板部71实现上升或者下降。在本发明中，升降驱动单元72可以是气缸。
优选地，如图13b所示，连接杆731的延伸方向与支撑杆73的延伸方向垂直。多根支撑杆73均匀分布在连接杆731上，从而增加了支撑杆的平衡性并且增强了结构强度。在本实施方式中，由于平板 部71为长条形，所以位于多根支撑杆73上的多根支撑柱74可以设置成共同支撑一个平板部71。
图15a-图15h是根据第二实施方式的基板支撑装置的工作过程的流程图。具体步骤如下：
S21：如图15a所示，将所述基板支撑装置设置成初始状态，使得平板部71低于台面61，然后通过机械手3将基板4搬运至所述基板支撑装置的上方；
S22：如图15b所示，机械手3下降，将基板4放置在台面61上，其中，机械手3在下降过程中通过条形间隔612并且停留在台面61与平板部71之间；
S23：如图15c所示，机械手3撤出；
S24：如图15d所示，升降驱动单元72驱动平板部71上升，直到平板部71伸入条形间隔612中并与台面61相平齐，此时，基板4位于平板部71与台面61共同形成的支撑面上，然后对基板4进行真空干燥处理；
S25：如图15e所示，在干燥处理完毕后，升降驱动单元72驱动平板部71下降至初始高度；
S26：如图15f所示，机械手3伸入到台面61与平板部71之间的对应于条形间隔612的位置；
S27：机如图15g所示，械手3上升以取出基板4；
S28：如图15h所示，将所述基板支撑装置恢复到初始状态。
需要说明的是，在第二实施方式中，平板部71初始位于台面61的上方和下方均可。当平板部71初始位于台面61的上方时，其工作流程与第一实施方式相同，此处不再赘述。
在本发明的干燥过程中，基板4始终由水平的台面61和平板部71一起支撑。另外，台面61和平板部71之间的缝隙优选在2mm之内。该缝隙相对于基板4的尺寸而言足够小，因此不会对基板4的水平度造成任何影响，从而保证了产品的质量。
在设计基板支撑装置时，平板部71的位置和尺寸可以参考机械手3的宽度和移动路径(水平移动路径和竖直移动路径)，只要确保 机械手3的移动(水平移动和竖直移动)在空间上不干扰所述基板支撑装置即可。
进一步地，由于在真空干燥过程中腔室内部的气流较强，为了防止基板4在台面61上漂移，可以在台面61的与基板4边缘对应的位置设置若干个夹持部(未示出)。在基板4放置到台面61之前，所述夹持部处于释放状态。当基板4放置到台面61上后，所述夹持部可以使基板4固定在台面61上并在整个干燥过程中保持固定状态。在干燥过程结束后，所述夹持部可以再次释放，从而可以从台面61上取下基板4。
本发明还提供了一种利用上述基板支撑装置的支撑方法，所述支撑方法主要包括：在对基板进行干燥时，将所述升降机构的平板部移动至所述固定机构的通孔中，从而与所述固定机构的台面一起支撑基板。
根据本发明，基板在整个干燥过程中均放置在平坦的台面上。因此，与现有相比，基板与基板支撑装置的接触方式由点接触变成面接触，从而降低了产品出现显示不良的风险。
作为第一实施方式，所述支撑方法包括：
在对所述基板进行干燥之前，将所述升降机构的平板部设置在所述固定机构的通孔上方，并将所述基板放置在所述平板部上；
在对所述基板进行干燥时，将所述平板部下降至所述通孔中，使得所述平板部与固定机构的台面齐平；
在对所述基板进行干燥之后，使所述平板部上升至所述通孔上方的位置以取出所述基板。
作为第二实施方式，所述支撑方法包括：
在对所述基板进行干燥之前，将所述升降机构的平板部设置在所述固定机构的通孔下方，并将所述基板放置在所述台面上；
在对所述基板进行干燥时，将所述平板部上升至所述通孔中，使得所述平板部与固定机构的台面齐平；
在对所述基板进行干燥之后，使所述平板部下降至所述通孔下方的位置以取出所述基板。
本发明还提供了一种包括本发明所提供的基板支撑装置的真空干燥设备。
根据本发明，基板在整个干燥过程中均放置在平坦的台面上。因此，与现有相比，基板与基板支撑装置的接触方式由点接触变成面接触，从而降低了产品出现显示不良的风险。此外，对于不同型号的产品，不必考虑基板的布局。如果更换产品的型号，不需要对支撑装置进行调整，因而减少了人员的工作量，降低了设备的设计难度。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (13)

  1. 一种用于真空干燥设备的基板支撑装置，其特征在于，
    所述基板支撑装置包括固定机构和升降机构，所述固定机构包括台面，所述台面上设置有多个通孔，所述升降机构包括多个与所述通孔相对应的平板部，多个所述平板部能够分别移动至相应通孔中并与所述台面共同形成用于支撑基板的支撑面，并且，所述平板部还能够移动至相应通孔上方的位置。
  2. 根据权利要求1所述的基板支撑装置，其特征在于，
    所述台面由多个子台面组成，相邻两个所述子台面之间形成有条形间隔，所述条形间隔用作通孔。
  3. 根据权利要求1所述的基板支撑装置，其特征在于，
    所述通孔呈闭合形状。
  4. 根据权利要求3所述的基板支撑装置，其特征在于，
    所述闭合形状为矩形或圆形。
  5. 根据权利要求1至4中任意一项所述的基板支撑装置，其特征在于，
    多个所述通孔均匀分布在所述台面中，所述平板部的形状与相应位置的所述通孔的形状匹配。
  6. 根据权利要求1至4中任意一项所述的基板支撑装置，其特征在于，
    所述升降机构包括升降驱动单元、多根支撑杆以及多根支撑柱，每个所述支撑杆上均设置有用于支撑所述平板部的支撑柱，所述升降驱动单元用于驱动所述支撑杆升降。
  7. 根据权利要求6所述的基板支撑装置，其特征在于，
    所述升降机构还包括用于将多根支撑杆连接在一起的连接杆，所述连接杆与所述升降驱动单元的输出轴相连。
  8. 根据权利要求6所述的基板支撑装置，其特征在于，
    每根支撑柱用于支撑一个所述平板部。
  9. 根据权利要求6所述的基板支撑装置，其特征在于，
    多根支撑柱共同支撑一个所述平板部。
  10. 一种利用权利要求1至9中任意一项所述的基板支撑装置的支撑方法，其特征在于，
    所述支撑方法包括：
    在对基板进行干燥时，将所述升降机构的平板部移动至所述固定机构的通孔中，从而与所述固定机构的台面一起支撑基板。
  11. 根据权利要求10所述的支撑方法，其特征在于，所述支撑方法包括：
    在对所述基板进行干燥之前，将所述升降机构的平板部移动至所述固定机构的通孔上方，并将所述基板放置在所述平板部上；
    在对所述基板进行干燥时，将所述平板部下降至所述通孔中，使得所述平板部与固定机构的台面齐平；
    在对所述基板进行干燥之后，使所述平板部上升至所述通孔上方的位置以取出所述基板。
  12. 根据权利要求10所述的支撑方法，其特征在于，所述支撑方法包括：
    在对所述基板进行干燥之前，将所述升降机构的平板部移动至所述固定机构的通孔下方，并将所述基板放置在所述台面上；
    在对所述基板进行干燥时，将所述平板部上升至所述通孔中， 使得所述平板部与固定机构的台面齐平；
    在对所述基板进行干燥之后，使所述平板部下降至所述通孔下方的位置以取出所述基板。
  13. 一种真空干燥设备，其特征在于，所述真空干燥设备包括权利要求1至9中任意一项所述的基板支撑装置。
PCT/CN2015/081732 2015-01-12 2015-06-18 基板支撑装置、基板支撑方法以及真空干燥设备 WO2016112638A1 (zh)

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