WO2016112595A1 - Oled器件及其封装方法和封装装置 - Google Patents

Oled器件及其封装方法和封装装置 Download PDF

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Publication number
WO2016112595A1
WO2016112595A1 PCT/CN2015/076835 CN2015076835W WO2016112595A1 WO 2016112595 A1 WO2016112595 A1 WO 2016112595A1 CN 2015076835 W CN2015076835 W CN 2015076835W WO 2016112595 A1 WO2016112595 A1 WO 2016112595A1
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Prior art keywords
graphene film
oled device
copper foil
roller
packaging
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PCT/CN2015/076835
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English (en)
French (fr)
Inventor
冯翔
王涛
邱云
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京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/321,347 priority Critical patent/US10319942B2/en
Priority to EP15877513.0A priority patent/EP3246962B1/en
Publication of WO2016112595A1 publication Critical patent/WO2016112595A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED device, a packaging method thereof, and a packaging device.
  • OLED organic electroluminescent
  • OLED devices Because water and oxygen are natural enemies of organic materials, they can not only open the unsaturated bonds of the polymer, but also accelerate the aging of the organic materials, and also cause damage to the electrodes in the device.
  • the package level of OLED devices determines device lifetime and environmental reliability.
  • UV adhesive packaging is a relatively common packaging method for OLED devices in the laboratory. It has low cost and simple operation. However, UV adhesives will contact the device during UV curing, which will adversely affect the device and cannot be applied in practical industries.
  • Frit (Glass Glue) encapsulation method is a packaging method in which the glass frit is cured to connect the encapsulating glass and the substrate, which is an industrially mature packaging method. The disadvantage of this method is that the curing effect of the glass powder cannot be controlled, and cracks may occur during the curing of the glass powder, thereby affecting the packaging effect, and air may enter the device from the crack and affect the life of the device.
  • the advantages of the thin film package began to be encapsulated by preparing organic and inorganic alternating multilayer films on the cathode surface of the OLED device, but the packaging process of this method is too complicated, and The process is immature and the productivity is low.
  • embodiments of the present invention provide an OLED device, a packaging method thereof, and a packaging device.
  • the encapsulation method introduces a graphene film into a package of an OLED device, and can fully utilize the high light transmittance of the graphene film. Rate, ultra-thin, flexible, highly water-tight oxygen barrier, and easy to transfer between substrates (ie, easy to separate from copper foil and connect with OLED devices), not only improve the packaging effect of OLED devices, but also simplify the packaging of OLED devices. Process and increase production efficiency.
  • Embodiments of the present invention provide a packaging method for packaging an OLED device formed on a base substrate, and including: separating a graphene film formed on a copper foil from the copper foil, and using the The OLED device is packaged with a graphene film.
  • the method of separating a graphene film formed on a copper foil from the copper foil and packaging the OLED device using the graphene film may include: step S10, One side of the copper foil on which the graphene film is not formed is bonded to the fixed substrate by a double-sided tape; in step S11, the viscous polymer is processed into a fluid state, and the copper foil is poured thereon to be formed thereon.
  • step S12 after the adhesive polymer is cured, the adhesive polymer is adhered with a tape, and then a composite film composed of the graphene film and the adhesive polymer is removed from the copper Stripping on the foil; step S13, forming a passivation layer on the OLED device, coating a transparent adhesive on the passivation layer, and coating one side of the graphene film of the composite film before the transparent adhesive is cured Pasting onto the transparent adhesive; and step S14, curing the transparent adhesive.
  • the viscous polymer may be processed into a fluid state by melting.
  • the fixed substrate may be made of a glass, quartz or silicon wafer material.
  • the method of separating a graphene film formed on a copper foil from the copper foil and packaging the OLED device using the graphene film may include: step S20, in the Forming a passivation layer on the OLED device, coating a transparent adhesive on the passivation layer; and step S21, pasting the side of the copper foil on which the graphene film is formed before the curing of the transparent adhesive Step S22, curing the transparent adhesive; and step S23, fixing the substrate of the step S22, and tape the side of the copper foil on which the graphene film is not formed.
  • the copper foil is separated from the graphene film.
  • the method of separating a graphene film formed on a copper foil from the copper foil and packaging the OLED device using the graphene film may include: step S30, in the Forming a passivation layer on the OLED device; step S31, attaching a side of the copper foil on which the graphene film is not formed to a heatable roller; and step S32, completing the lining of step S30
  • the base substrate is fixed to the base, and the OLED device faces away from the base; in step S33, the transparent glue is dripped on the first side of the OLED device on the base substrate, and the roller is One side edge of the graphene film corresponds to the transparent glue and contacts; in step S34, the roller is heated to cause the transparent glue to be in an incompletely cured state, and the roller is rolled to the OLED device a second side opposite the first side, the transparent adhesive is applied to the passivation layer under the traction of the roller, and the passivation layer is bonded to the graphene film While the copper foil is
  • the size of the graphene film may be larger than the size of the OLED device, and the graphene film may completely cover the OLED device.
  • the transparent glue may be made of the same material as the viscous polymer.
  • the viscous polymer may include polyethylene terephthalate, polydimethylsiloxane, polypropylene, epoxy resin, ABS plastic, polyvinyl chloride, polyoxymethylene, polycarbonate, phenolic Any one or more of plastic, polyurethane plastic, epoxy resin, unsaturated polyester plastic, furan plastic, silicone resin, and propylene-based resin.
  • the curing temperature of the transparent adhesive may be less than or equal to the heat treatment critical temperature of the OLED device.
  • the encapsulation method may further include forming a protective layer on the graphene film.
  • the protective layer may be formed by solution spin coating or chemical vapor deposition.
  • the protective layer may be made of a transparent organic insulating material or a transparent inorganic insulating material.
  • the substrate substrate completing the step S30 may be fixed to the base by a sticker method or a vacuum adsorption method.
  • the passivation layer may be formed by low temperature chemical vapor deposition (LTPECVD), atomic layer deposition (ALD) or room temperature bonding (RTB). Using the low temperature The temperature at which the passivation layer is deposited by vapor deposition may be less than or equal to the heat treatment critical temperature of the OLED device.
  • the passivation layer may be made of silicon nitride, silicon dioxide, aluminum oxide or silicon oxynitride.
  • the embodiment of the invention further provides an OLED device, which is packaged by the above packaging method.
  • Embodiments of the present invention also provide a packaging device for packaging an OLED device formed on a base substrate, and including a packaging mechanism for using a graphene film formed on a copper foil The copper foil is separated and the OLED device is packaged using the graphene film.
  • the packaging device may further include a base for carrying the base substrate and the OLED device, the base substrate being attached to a bearing surface of the base.
  • the packaging mechanism may include a cylindrical roller, a driving portion, and a heating portion, the cylindrical surface of the roller for attaching the copper foil on which the graphene film is formed, the copper foil not being formed thereon
  • One side of the graphene film is bonded to the cylindrical surface of the roller.
  • the roller is disposed above the base, and a rolling start position of the roller corresponds to a first side of the OLED device on the base substrate, the roller and the substrate A gap is formed between the substrates for accommodating the transparent glue.
  • the heating portion is disposed inside the roller for heating a cylindrical surface of the roller to place the transparent adhesive in an incompletely cured state.
  • the driving portion is coupled to an end of the roller for driving the roller to roll to a second side of the OLED device opposite to the first side, the roller being capable of pulling when rolling
  • the transparent adhesive extends in the rolling direction of the roller.
  • the axial direction of the roller may be parallel to a side edge of the base substrate corresponding to the first side of the OLED device, and the length of the roller may be greater than or equal to one side of the substrate substrate The length of the edge.
  • the graphene film is introduced into the package of the OLED device by separating the graphene film formed on the copper foil from the copper foil and encapsulating the OLED device with the graphene film.
  • This can make full use of graphene film with high light transmittance, ultra-thin flexible, high water-proof and oxygen barrier, and easy to
  • the transfer between substrates ie, easy to separate from the copper foil and connected to the OLED device not only improves the packaging effect of the OLED device, but also simplifies the packaging process of the OLED device and improves the production efficiency.
  • the OLED device provided by the embodiment of the invention is packaged by adopting the above packaging method, and the package effect is more excellent, thereby improving the quality and life of the OLED device.
  • the packaging device provided by the embodiment of the invention, by providing a packaging mechanism, the quick and easy separation of the graphene film and the copper foil can be realized, and at the same time, the graphene film can encapsulate the OLED device, thereby not only improving the OLED device.
  • the packaging effect simplifies the packaging process of the OLED device and improves the production efficiency.
  • Example 1 is a schematic view showing the separation of a copper foil and a graphene film in Example 1 of the present invention.
  • FIG. 2 is a schematic view showing the encapsulation of an OLED device by a graphene film in Embodiment 1 of the present invention.
  • FIG 3 is a schematic view showing the separation of a copper foil from a graphene film and the encapsulation of an OLED device by a graphene film according to Embodiment 2 of the present invention.
  • Example 4 is a schematic view showing the formation of a protective layer on a graphene film in Example 2 of the present invention.
  • FIG. 5 is a schematic view showing the separation of a copper foil from a graphene film and the encapsulation of an OLED device by a graphene film in Embodiment 3 of the present invention.
  • FIG. 6 is a schematic structural diagram of a package device for packaging an OLED device according to Embodiment 5 of the present invention.
  • This embodiment provides a packaging method for an OLED formed on a substrate The device is packaged, the method comprising: separating a graphene film formed on a copper foil from a copper foil, and encapsulating the OLED device with a graphene film.
  • the encapsulation method introduces a graphene film into a package of an OLED device, and can fully utilize the graphene film with high transmittance, ultra-thin, flexibility, high water-insulating oxygen barrier, and easy transfer between substrates (ie, easy to separate from the copper foil)
  • the characteristics of the connection with the OLED device not only improve the packaging effect of the OLED device, but also simplify the packaging process of the OLED device and improve the production efficiency.
  • the method of separating the graphene film formed on the copper foil from the copper foil and encapsulating the OLED device using the graphene film includes the following steps S10 to S14.
  • step S10 the side of the copper foil 1 on which the graphene film 2 is not formed is bonded to the fixed substrate 4 by the double-sided tape 3.
  • the fixed substrate 4 is usually made of a glass, quartz or silicon wafer material, that is, the fixed substrate 4 is usually made of a hard substrate to firmly fix the copper foil 1.
  • the position of the fixed substrate 4 is fixed. This step is for fixing the copper foil 1 on which the graphene film 2 is formed to separate the graphene film 2 from the copper foil 1.
  • step S11 the viscous polymer 5 is processed into a fluid state and poured onto the side of the copper foil 1 on which the graphene film 2 is formed.
  • the viscous polymer 5 is processed into a fluid state by melting. Compared with the processing method of dissolving the viscous polymer 5 in a solvent, the adverse consequences caused by incomplete evaporation of the solvent during the curing of the viscous polymer 5 are avoided.
  • step S12 after the viscous polymer 5 is cured, the viscous polymer 5 is adhered with the tape 6, and then the composite film composed of the graphene film 2 and the viscous polymer 5 is peeled off from the copper foil 1.
  • the bonding force between the viscous polymer 5 and the graphene film 2 is stronger than the bonding force between the graphene film 2 and the copper foil 1, the setting of the viscous polymer 5 enables the graphene film 2 and copper.
  • the foil 1 is easy to separate. In this step, the graphene film 2 can be easily peeled off from the copper foil 1 by the tape 6, thereby facilitating subsequent encapsulation of the OLED device using the graphene film 2.
  • step S13 a passivation layer 8 is formed on the OLED device 7, in the passivation layer 8
  • the transparent rubber 9 is applied thereon, and one side of the graphene film 2 of the composite film is attached to the transparent rubber 9 before the transparent rubber 9 is cured.
  • the passivation layer 8 is capable of isolating the electrodes of the OLED device 7 from the graphene film 2, thereby providing a preliminary encapsulation and protection of the OLED device 7.
  • the passivation layer 8 is formed by low temperature chemical vapor deposition (LEPECVD), normal temperature bonding (ALD) or atomic layer deposition (RTB).
  • the temperature of the passivation layer 8 deposited by low temperature chemical vapor deposition is less than or equal to the heat treatment criticality of the OLED device. Temperature (usually 90°).
  • the passivation layer 8 is made of an insulating material such as silicon nitride, silicon dioxide, aluminum oxide or silicon oxynitride.
  • the viscous polymer 5 in the composite film can form a good protection for the graphene film 2, and can further form a package for the OLED device 7.
  • step S14 the transparent adhesive 9 is cured.
  • the curing temperature of the transparent adhesive 9 is less than or equal to the heat treatment critical temperature of the OLED device 7, thereby preventing the higher curing temperature from causing damage to the performance of the OLED device 7.
  • the heat treatment critical temperature of the OLED device 7 is 90°, and therefore, the curing temperature of the transparent rubber 9 is usually 90° or less.
  • the transparent rubber 9 is made of the same material as the viscous polymer 5, and since the adhesive force of the viscous polymer 5 and the graphene film 2 is strong, the transparent rubber 9 can be firmly bonded to the graphene film 2, Thereby, the graphene film 2 forms a good package for the OLED device 7.
  • the size of the graphene film 2 is larger than that of the OLED device 7, and the graphene film 2 can completely cover the OLED device 7, so that the graphene film 2 can form a good package for the OLED device 7.
  • the viscous polymer 5 comprises polyethylene terephthalate, polydimethylsiloxane, polypropylene, epoxy resin, ABS plastic, polyvinyl chloride, polyoxymethylene, polycarbonate.
  • the packaging of the OLED device 7 is completed.
  • the packaging method is simple in process and convenient in operation, and can improve production efficiency. It should be noted that when the OLED device 7 is packaged using a composite film composed of the graphene film 2 and the viscous polymer 5, the composite film may be uneven after being covered on the OLED device 7 due to improper operation. In addition, when the size of the base substrate and the OLED device 7 becomes large, since the size of the desired graphene film 2 also needs to be correspondingly large, this increases the difficulty in separating the graphene film 2 from the copper foil 1.
  • the present embodiment provides a packaging method.
  • the method for separating a graphene film formed on a copper foil from a copper foil and packaging the OLED device using the graphene film includes the following steps S20 to S23. .
  • step S20 a passivation layer 8 is formed on the OLED device 7, and a transparent paste 9 is coated on the passivation layer 8.
  • the material of the transparent rubber 9 is the same as that in the first embodiment.
  • the material and formation method of the passivation layer 8 are the same as in the first embodiment.
  • step S21 the side of the copper foil 1 on which the graphene film 2 is formed is attached to the transparent adhesive 9 before the transparent adhesive 9 is cured.
  • step S22 the transparent adhesive 9 is cured.
  • the curing temperature of the transparent rubber 9 was the same as in Example 1.
  • step S23 the base substrate on which step S22 is completed (on which the OLED device 7 is formed) is fixed, and the side of the copper foil 1 on which the graphene film 2 is not formed is adhered with the tape 6, and the copper foil 1 and the graphite are bonded.
  • the ene film 2 is separated.
  • the size of the graphene film 2 is larger than the size of the OLED device 7.
  • step S22 and step S23 may also be interchanged, that is, the copper foil 1 is first separated from the graphene film 2, and the transparent rubber 9 is cured. At this time, it is necessary to ensure that the bonding force between the graphene film 2 and the uncured transparent rubber 9 is stronger than the bonding force between the graphene film 2 and the copper foil 1 in the case where the transparent rubber 9 has not been cured. Strong so that the graphene film 2 can be smoothly separated from the copper foil 1.
  • the protective layer 10 is further formed on the graphene film 2.
  • the protective layer 10 can protect the graphene film 2 from damage, so that the graphene film 2 forms a good package and protection for the OLED device 7.
  • the protective layer 10 is formed by solution spin coating or chemical vapor deposition.
  • the solution spin coating method dissolves the organic insulating material forming the protective layer 10 in a solvent to form a solution, and then applies the solution onto the graphene film 2 to form the protective layer 10.
  • the chemical vapor deposition method is to form an inorganic insulating material on the graphene film 2 by chemical vapor deposition to form the protective layer 10.
  • the protective layer 10 is made of a transparent organic insulating material or a transparent inorganic insulating material.
  • the side of the copper foil 1 on which the graphene film 2 is formed is first attached to the transparent adhesive 9, and the graphene film 2 is separated from the copper foil 1 to complete the OLED.
  • the package of device 7. Compared with the first embodiment, the packaging method is simpler in process, more convenient and quicker to operate, and can further improve production efficiency. Compared with the packaging method in Embodiment 1, the packaging method in this embodiment can greatly reduce the unevenness of the graphene film 2 covering the OLED device 7 due to improper operation, and at the same time, for a large-sized substrate and The OLED device 7 can reduce the difficulty in separating the graphene film 2 from the copper foil 1.
  • the present embodiment provides a packaging method.
  • a method of separating a graphene film formed on a copper foil from a copper foil and packaging the OLED device with a graphene film includes the following steps S30 to S35.
  • step S30 a passivation layer 8 is formed on the OLED device 7.
  • the material and formation method of the passivation layer 8 are the same as in the first embodiment.
  • step S31 the side of the copper foil 1 on which the graphene film 2 is not formed is attached to the roller 11 which can be heated.
  • a heating device is provided inside the roller 11, and the heating device can heat the axial surface of the roller 11.
  • step S32 the base substrate 12 completing the step S30 is fixed to the base 13 Above, and the OLED device 7 faces away from the base 13.
  • the base substrate 12 of the step S30 is fixed to the base 13 by a glue method or a vacuum adsorption method to facilitate subsequent packaging of the OLED device 7.
  • step S33 the transparent adhesive 9 is dropped on the first side 71 of the OLED device 7 on the base substrate 12, and one side edge of the graphene film 2 on the roller 11 is made to correspond to and contact with the transparent adhesive 9.
  • the material of the transparent rubber 9 is the same as that in the first embodiment.
  • step S34 the heating roller 11 causes the transparent adhesive 9 to be in an incompletely cured state, the rolling roller 11 is applied to the second side 72 of the OLED device 7 opposite to the first side 71, and the transparent rubber 9 is coated under the traction of the roller 11.
  • the paste is applied to the passivation layer 8, and the passivation layer 8 is bonded to the graphene film 2 through the transparent adhesive 9, while the copper foil 1 is separated from the graphene film 2.
  • the size of the graphene film 2 is larger than the size of the OLED device 7.
  • step S35 the transparent adhesive 9 is cured.
  • the curing temperature of the transparent rubber 9 was the same as in Example 1.
  • a protective layer is further formed on the graphene film 2.
  • the protective layer can protect the graphene film 2 from damage to the graphene film 2, so that the graphene film 2 forms a good package and protection for the OLED device 7.
  • the material and formation method of the protective layer are the same as in the second embodiment.
  • the encapsulation of the OLED device 7 by the graphene film 2 and the separation of the copper foil 1 and the graphene film 2 can be simultaneously performed in one step, thereby making the packaging of the OLED device 7 faster and easier.
  • the encapsulation method in this embodiment can prevent the unevenness of the graphene film 2 from covering the OLED device 7 after the encapsulation method in any one of the embodiments 1 and 2, and the encapsulation method in the embodiment can Making the separation of graphene film 2 and copper foil 1 more difficult Step down.
  • the packaging method in the present embodiment is not limited by the size of the base substrate 12 and the OLED device 7, that is, regardless of the size of the base substrate 12 and the OLED device 7, the roller 11 can be rolled over the corresponding area.
  • the packaging of the OLED device 7 as long as the size of the graphene film 2 is larger than the size of the OLED device 7, the OLED device 7 can be completely covered.
  • the graphene film is introduced by separating the graphene film formed on the copper foil from the copper foil and encapsulating the OLED device with a graphene film.
  • this can make full use of the high transmittance of the graphene film, ultra-thin, flexible, highly water-insulating oxygen barrier and easy to transfer between substrates (ie, easy to separate from the copper foil and connect with the OLED device). It not only improves the packaging effect of the OLED device, but also simplifies the packaging process of the OLED device and improves the production efficiency.
  • This embodiment provides an OLED device that is packaged by the packaging method in any of Embodiments 1 to 3.
  • the package effect is more excellent, thereby improving the quality and life of the OLED device.
  • the embodiment provides a packaging device for packaging an OLED device formed on a base substrate, and includes a packaging mechanism for separating a graphene film formed on the copper foil from the copper foil, and The OLED device is packaged using a graphene film.
  • the packaging mechanism Through the setting of the packaging mechanism, the quick and easy separation of the graphene film and the copper foil can be realized, and the graphene film can be packaged for the OLED device, thereby not only improving the packaging effect of the OLED device, but also simplifying the packaging process of the OLED device. And improve production efficiency.
  • the packaging device further includes a base 13 for carrying the base substrate 12 and the OLED device 7, the bearing surface of the base substrate 12 and the base 13 fit.
  • the packaging mechanism includes a cylindrical roller 11, a driving portion (not shown in FIG. 6), and a heating portion 14, and a cylindrical surface of the roller 11 is used to attach the copper foil 1 on which the graphene film 2 is formed, the copper foil 1 thereof One surface on which the graphene film 2 is not formed is bonded to the cylindrical surface of the roller 11.
  • the roller 11 is disposed above the base 13 and the rolling start position of the roller 11 corresponds to the first side 71 of the OLED device 7 on the base substrate 12, and a gap is formed between the roller 11 and the base substrate 12. 15.
  • the gap 15 is for accommodating the transparent glue 9.
  • the heating portion 14 is disposed inside the roller 11 for heating the cylindrical surface of the roller 11 so that the transparent rubber 9 is in an incompletely cured state.
  • the driving portion is connected to the end of the roller 11 for driving the roller 11 to roll to the second side 72 of the OLED device 7 opposite to the first side 71.
  • the roller 11 can pull the transparent rubber 9 to the roller 11 when rolling. The direction of the scroll extends.
  • the packaging device can package the OLED device 7 according to the packaging method in Embodiment 3, thereby greatly simplifying the packaging process of the OLED device and improving the production efficiency.
  • the axial direction of the roller 11 is parallel to a side edge of the base substrate 12 corresponding to the first side 71 of the OLED device 7, and the length of the roller 11 is greater than or equal to one side edge of the base substrate 12. length.
  • the quick and easy separation of the graphene film and the copper foil can be realized by the arrangement of the packaging mechanism, and the graphene film can also encapsulate the OLED device, thereby not only improving the packaging of the OLED device.
  • the effect is to simplify the packaging process of the OLED device and improve the production efficiency.

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Abstract

一种OLED器件及其封装方法和封装装置。该封装方法对形成在衬底基板（12）上的OLED器件（7）进行封装，并且包括：将形成在铜箔（1）上的石墨烯薄膜（2）与该铜箔（1）分离、并采用石墨烯薄膜（2）对OLED器件（7）进行封装。该封装方法将石墨烯薄膜（2）引入到OLED器件（7）的封装中，不仅提高了OLED器件（7）的封装效果，而且简化了OLED器件（7）的封装工艺，并提高了生产效率。

Description

OLED器件及其封装方法和封装装置 技术领域
本发明涉及显示技术领域，具体地，涉及OLED器件及其封装方法和封装装置。
背景技术
随着有机电致发光(OLED)技术的不断成熟，OLED设备的不断进化、对于OLED器件的封装方法和封装水平，一直是业内重点探讨的话题。
因为水和氧是有机材料的天敌，它们不但可以打开聚合物的不饱和键，让有机材料加速老化，也会对器件中的电极造成伤害。OLED器件的封装水平决定了器件的寿命和环境信赖性。
UV胶封装是实验室中比较常见的OLED器件的封装方法，它成本低，操作简单，但UV胶在紫外固化时会接触到器件，对器件造成不良影响，无法在实际的产业中应用。Frit(玻璃胶)封装法是一种用玻璃粉固化，从而将封装玻璃和基底相连的封装方法，是工业上比较成熟的封装方法。此方法的缺点是，无法控制玻璃粉的固化效果，在玻璃粉固化过程中会出现龟裂，从而影响封装效果，空气会从裂缝中进入器件，影响器件寿命。针对Frit封装的缺陷，薄膜封装的优势开始展现出来，薄膜封装是通过在OLED器件的阴极表面制备有机、无机交替的多层薄膜对OLED器件进行封装，但是这种方法的封装工艺过于复杂，而且工艺不成熟、生产率低。
发明内容
针对现有技术中存在的上述技术问题，本发明实施例提供OLED器件及其封装方法和封装装置。该封装方法将石墨烯薄膜引入到OLED器件的封装中，能够充分利用石墨烯薄膜的高透光 率、超薄、柔性、高度隔水隔氧以及易于在基底间转移(即容易与铜箔分离并与OLED器件连接)的特点，不仅提高了OLED器件的封装效果，而且简化了OLED器件的封装工艺，并提高了生产效率。
本发明实施例提供一种封装方法，其用于对形成在衬底基板上的OLED器件进行封装，并且包括：将形成在铜箔上的石墨烯薄膜与所述铜箔分离、并采用所述石墨烯薄膜对所述OLED器件进行封装。
在一个实施例中，所述将形成在铜箔上的石墨烯薄膜与所述铜箔分离、并采用所述石墨烯薄膜对所述OLED器件进行封装的方法可以包括：步骤S10，将所述铜箔的其上未形成有所述石墨烯薄膜的一面通过双面胶粘结到固定衬底上；步骤S11，将粘性聚合物加工成流体状态，浇筑到所述铜箔的其上形成有所述石墨烯薄膜的一面；步骤S12，待所述粘性聚合物固化后，用胶带粘住所述粘性聚合物，然后将由所述石墨烯薄膜和所述粘性聚合物组成的复合膜从所述铜箔上剥离下来；步骤S13，在所述OLED器件上形成钝化层，在钝化层上涂布透明胶，在所述透明胶固化前，将所述复合膜的所述石墨烯薄膜的一面粘贴到所述透明胶上；以及步骤S14，固化所述透明胶。
在所述步骤S11中，可以采用熔融的方式将所述粘性聚合物加工成流体状态。
所述固定衬底可以采用玻璃、石英或硅片材料制成。
在一个实施例中，所述将形成在铜箔上的石墨烯薄膜与所述铜箔分离、并采用所述石墨烯薄膜对所述OLED器件进行封装的方法可以包括：步骤S20，在所述OLED器件上形成钝化层，在钝化层上涂布透明胶；步骤S21，在所述透明胶固化前，将所述铜箔的其上形成有所述石墨烯薄膜的一面粘贴到所述透明胶上；步骤S22，固化所述透明胶；以及步骤S23，将完成步骤S22的所述衬底基板固定，用胶带粘住所述铜箔的其上未形成有所述石墨烯薄膜的一面，将所述铜箔与所述石墨烯薄膜分离。
在一个实施例中，所述将形成在铜箔上的石墨烯薄膜与所述铜箔分离、并采用所述石墨烯薄膜对所述OLED器件进行封装的方法可以包括：步骤S30，在所述OLED器件上形成钝化层；步骤S31，将所述铜箔的其上未形成有所述石墨烯薄膜的一面贴附到能够加热的滚轴上；步骤S32，将完成步骤S30的所述衬底基板固定到基台上，且所述OLED器件背向所述基台；步骤S33，在所述衬底基板上的所述OLED器件的第一侧滴注透明胶，并使所述滚轴上所述石墨烯薄膜的一侧边缘与所述透明胶相对应并接触；步骤S34，加热所述滚轴使所述透明胶处于不完全固化状态，滚动所述滚轴至所述OLED器件的与所述第一侧相对的第二侧，所述透明胶在所述滚轴的牵引下涂布至所述钝化层上，且所述钝化层与所述石墨烯薄膜粘接在一起，同时所述铜箔与所述石墨烯薄膜分离；以及步骤S35，固化所述透明胶。
所述石墨烯薄膜的尺寸可以大于所述OLED器件的尺寸，且所述石墨烯薄膜可以完全覆盖所述OLED器件。
所述透明胶可以采用与所述粘性聚合物相同的材料制成。所述粘性聚合物可以包括聚对苯二甲酸乙二醇酯、聚二甲基硅氧烷、聚丙烯、环氧树脂类聚乙烯、ABS塑料、聚氯乙烯、聚甲醛、聚碳酸酯、酚醛塑料、聚氨酯塑料、环氧树脂、不饱和聚酯塑料、呋喃塑料、有机硅树脂和丙烯基树脂中的任意一种或多种。
所述透明胶的固化温度可以小于等于所述OLED器件的热处理临界温度。
在所述铜箔与所述石墨烯薄膜分离之后，所述封装方法还可以包括在所述石墨烯薄膜上形成保护层。
所述保护层可以采用溶液旋涂法或化学气相沉积法形成。所述保护层可以采用透明有机绝缘材料或透明无机绝缘材料制成。
在所述步骤S32中，完成步骤S30的所述衬底基板可以通过胶贴法或真空吸附法固定到所述基台上。
所述钝化层可以采用低温化学气相沉积法(LTPECVD)、原子层沉积法(ALD)或常温键合法(RTB)形成。采用所述低温化 学气相沉积法沉积所述钝化层的温度可以小于等于所述OLED器件的热处理临界温度。所述钝化层可以采用氮化硅、二氧化硅、三氧化二铝或氮氧化硅材料制成。
本发明实施例还提供一种OLED器件，所述OLED器件采用上述封装方法进行封装。
本发明实施例还提供一种封装装置，其用于对形成在衬底基板上的OLED器件进行封装，并且包括封装机构，所述封装机构用于将形成在铜箔上的石墨烯薄膜与所述铜箔分离、并采用所述石墨烯薄膜对所述OLED器件进行封装。
所述封装装置还可以包括基台，所述基台用于承载所述衬底基板以及所述OLED器件，所述衬底基板与所述基台的承载面贴合。
所述封装机构可以包括圆柱形滚轴、带动部和加热部，所述滚轴的圆柱面用于贴附形成有所述石墨烯薄膜的所述铜箔，所述铜箔的其上未形成有所述石墨烯薄膜的一面与所述滚轴的圆柱面贴合。所述滚轴设置在所述基台上方，且所述滚轴的滚动起始位置与所述衬底基板上的所述OLED器件的第一侧相对应，所述滚轴与所述衬底基板之间形成有间隙，所述间隙用于容纳透明胶。所述加热部设置在所述滚轴内部，用于加热所述滚轴的圆柱面，以使所述透明胶处于不完全固化状态。所述带动部与所述滚轴的端部连接，用于带动所述滚轴滚动至所述OLED器件的与所述第一侧相对的第二侧，所述滚轴在滚动时能牵引所述透明胶向所述滚轴的滚动方向延伸。
所述滚轴的轴向可以平行于所述衬底基板的与所述OLED器件的第一侧相对应的一侧边缘，且所述滚轴的长度可以大于等于所述衬底基板的一侧边缘的长度。
在本发明实施例所提供的封装方法中，通过将形成在铜箔上的石墨烯薄膜与铜箔分离、并采用石墨烯薄膜对OLED器件进行封装而将石墨烯薄膜引入到OLED器件的封装中，这能够充分利用石墨烯薄膜高透光率、超薄可柔性、高度隔水隔氧以及易于在 基底间转移(即容易与铜箔分离并与OLED器件连接)的特点，不仅提高了OLED器件的封装效果，而且简化了OLED器件的封装工艺，并提高了生产效率。
本发明实施例所提供的OLED器件通过采用上述封装方法进行封装，封装效果更加优良，从而能提高OLED器件的品质和寿命。
在本发明实施例所提供的封装装置中，通过设置封装机构，能够实现石墨烯薄膜与铜箔的快速简便分离，同时还能使石墨烯薄膜对OLED器件进行封装，从而不仅提高了OLED器件的封装效果，而且简化了OLED器件的封装工艺，并提高了生产效率。
附图说明
图1为本发明实施例1中铜箔与石墨烯薄膜的分离示意图。
图2为本发明实施例1中石墨烯薄膜对OLED器件进行封装的示意图。
图3为本发明实施例2中铜箔与石墨烯薄膜分离以及石墨烯薄膜对OLED器件进行封装的示意图。
图4为本发明实施例2中在石墨烯薄膜上形成保护层的示意图。
图5为本发明实施例3中铜箔与石墨烯薄膜分离以及石墨烯薄膜对OLED器件进行封装的示意图。
图6为本发明实施例5中封装装置对OLED器件进行封装的结构示意图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案，下面结合附图和具体实施方式对本发明所提供的一种OLED器件及其封装方法和封装装置作进一步详细描述。
[实施例1]
本实施例提供一种封装方法，对形成在衬底基板上的OLED 器件进行封装，所述方法包括：将形成在铜箔上的石墨烯薄膜与铜箔分离、并采用石墨烯薄膜对OLED器件进行封装。
该封装方法将石墨烯薄膜引入到OLED器件的封装中，能够充分利用石墨烯薄膜高透光率、超薄、柔性、高度隔水隔氧以及易于在基底间转移(即容易与铜箔分离并与OLED器件连接)的特点，不仅提高了OLED器件的封装效果，而且简化了OLED器件的封装工艺，并提高了生产效率。
本实施例中，参照图1和图2，将形成在铜箔上的石墨烯薄膜与铜箔分离、并采用石墨烯薄膜对OLED器件进行封装的方法包括以下步骤S10至步骤S14。
步骤S10中，将铜箔1的其上未形成有石墨烯薄膜2的一面通过双面胶3粘结到固定衬底4上。
固定衬底4通常采用玻璃、石英或硅片材料制成，即固定衬底4通常采用硬质衬底，以便对铜箔1进行稳固的固定。固定衬底4的位置固定。该步骤用于对在其表面上形成有石墨烯薄膜2的铜箔1进行固定，以便后续将石墨烯薄膜2与铜箔1分离开来。
步骤S11中，将粘性聚合物5加工成流体状态，浇筑到铜箔1的其上形成有石墨烯薄膜2的一面上。
在该步骤中，采用熔融的方式将粘性聚合物5加工成流体状态。与将粘性聚合物5溶解在溶剂中的加工方式相比，避免了粘性聚合物5固化过程中溶剂蒸发不彻底所导致的不良后果。
步骤S12中，待粘性聚合物5固化后，用胶带6粘住粘性聚合物5，然后将由石墨烯薄膜2和粘性聚合物5组成的复合膜从铜箔1上剥离下来。
由于粘性聚合物5与石墨烯薄膜2之间的粘结作用力比石墨烯薄膜2与铜箔1之间的粘结作用力强，所以粘性聚合物5的设置能使石墨烯薄膜2与铜箔1很容易分离。在该步骤中，通过胶带6就能将石墨烯薄膜2从铜箔1上很容易地剥离下来，从而便于后续采用石墨烯薄膜2对OLED器件进行封装。
步骤S13中，在OLED器件7上形成钝化层8，在钝化层8 上涂布透明胶9，在透明胶9固化前，将复合膜的石墨烯薄膜2的一面粘贴到透明胶9上。
钝化层8能够将OLED器件7的电极与石墨烯薄膜2隔离开来，从而起到对OLED器件7的初步封装和保护作用。钝化层8采用低温化学气相沉积法(LEPECVD)、常温键合法(ALD)或原子层沉积法(RTB)形成，采用低温化学气相沉积法沉积钝化层8的温度小于等于OLED器件的热处理临界温度(通常为90°)。钝化层8的这些制备方法均为现有的比较成熟的制备方法，具体不再赘述。钝化层8采用氮化硅、二氧化硅、三氧化二铝或氮氧化硅等绝缘材料制成。另外，复合膜中的粘性聚合物5能够对石墨烯薄膜2形成很好的保护，还能对OLED器件7形成进一步的封装。
步骤S14中，固化透明胶9。
在该步骤中，透明胶9的固化温度小于等于OLED器件7的热处理临界温度，从而避免较高的固化温度对OLED器件7的性能造成破坏。通常，OLED器件7的热处理临界温度为90°，因此，透明胶9的固化温度通常小于等于90°。透明胶9采用与粘性聚合物5相同的材料制成，鉴于粘性聚合物5与石墨烯薄膜2的粘结作用力较强，所以透明胶9能与石墨烯薄膜2牢固地粘结在一起，从而使石墨烯薄膜2对OLED器件7形成很好的封装。
至此，便完成了采用石墨烯薄膜2对OLED器件7的封装。
本实施例中，石墨烯薄膜2的尺寸大于OLED器件7的尺寸，且石墨烯薄膜2能够完全覆盖OLED器件7，从而使石墨烯薄膜2能够对OLED器件7形成很好的封装。
本实施例中，粘性聚合物5包括聚对苯二甲酸乙二醇酯、聚二甲基硅氧烷、聚丙烯、环氧树脂类聚乙烯、ABS塑料、聚氯乙烯、聚甲醛、聚碳酸酯、酚醛塑料、聚氨酯塑料、环氧树脂、不饱和聚酯塑料、呋喃塑料、有机硅树脂和丙烯基树脂中的任意一种或多种的混合物。
在本实施例所提供的封装方法中，通过采用物理剥离的方式 将铜箔1上的石墨烯薄膜2连同粘性聚合物5一起剥离，再将由石墨烯薄膜2与粘性聚合物5组成的复合膜通过透明胶9与OLED器件7上的钝化层8进行粘结，从而完成了对OLED器件7的封装。该封装方法工艺简单，操作起来非常便捷，能够提高生产效率。需要说明的是，当采用由石墨烯薄膜2和粘性聚合物5组成的复合膜对OLED器件7进行封装时，可能会因为操作不当导致复合膜覆盖到OLED器件7上后不平整。另外，当衬底基板以及OLED器件7的尺寸变大时，由于所需的石墨烯薄膜2的尺寸也需相应地变大，这会增大石墨烯薄膜2与铜箔1的分离难度。
[实施例2]
本实施例提供一种封装方法，参照图3和图4，将形成在铜箔上的石墨烯薄膜与铜箔分离、并采用石墨烯薄膜对OLED器件进行封装的方法包括以下步骤S20至步骤S23。
步骤S20中，在OLED器件7上形成钝化层8，在钝化层8上涂布透明胶9。
透明胶9的材质与实施例1中相同。钝化层8的材质及形成方法与实施例1中相同。
步骤S21中，在透明胶9固化前，将铜箔1的其上形成有石墨烯薄膜2的一面粘贴到透明胶9上。
步骤S22中，固化透明胶9。
透明胶9的固化温度与实施例1中相同。
步骤S23中，将完成步骤S22的衬底基板(其上形成有OLED器件7)固定，用胶带6粘住铜箔1的其上未形成有石墨烯薄膜2的一面，将铜箔1与石墨烯薄膜2分离。
同样地，石墨烯薄膜2的尺寸大于OLED器件7的尺寸。
至此，便完成了采用石墨烯薄膜2对OLED器件7的封装。
需要说明的是，步骤S22和步骤S23也可以互换，即先将铜箔1与石墨烯薄膜2分离，再固化透明胶9。此时，需要确保在透明胶9还未固化的情况下，石墨烯薄膜2与未固化的透明胶9之间的粘结作用力比石墨烯薄膜2与铜箔1之间的粘结作用力 强，以使石墨烯薄膜2能够与铜箔1顺利分离。
本实施例中，在铜箔1与石墨烯薄膜2分离之后，还包括在石墨烯薄膜2上形成保护层10。保护层10能对石墨烯薄膜2形成保护，以使石墨烯薄膜2免受损坏，从而使石墨烯薄膜2对OLED器件7形成很好的封装和保护。
保护层10采用溶液旋涂法或化学气相沉积法形成。溶液旋涂法即将形成保护层10的有机绝缘材料溶解于溶剂中形成溶液，然后将溶液涂布于石墨烯薄膜2上形成保护层10。化学气相沉积法则是将无机绝缘材料通过化学气相沉积制备于石墨烯薄膜2上，以形成保护层10。本实施例中，保护层10采用透明有机绝缘材料或透明无机绝缘材料制成。
在本实施例所提供的封装方法中，先将铜箔1的其上形成有石墨烯薄膜2的一面粘贴到透明胶9上，再将石墨烯薄膜2与铜箔1分离，从而完成对OLED器件7的封装。该封装方法相比于实施例1，工艺更加简单，操作起来也更加方便快捷，能进一步提高生产效率。本实施例中的封装方法相比于实施例1中的封装方法，能大大减少因操作不当导致的石墨烯薄膜2覆盖到OLED器件7上后的不平整，同时对于大尺寸的衬底基板以及OLED器件7，能够降低石墨烯薄膜2与铜箔1的分离难度。
[实施例3]
本实施例提供一种封装方法，参照图5，将形成在铜箔上的石墨烯薄膜与铜箔分离、并采用石墨烯薄膜对OLED器件进行封装的方法包括以下步骤S30至步骤S35。
步骤S30中，在OLED器件7上形成钝化层8。
钝化层8的材质及形成方法与实施例1中相同。
步骤S31中，将铜箔1的其上未形成有石墨烯薄膜2的一面贴附到能够加热的滚轴11上。
滚轴11内部设置有加热装置，加热装置能对滚轴11的轴面加热。
步骤S32中，将完成步骤S30的衬底基板12固定到基台13 上，且OLED器件7背向基台13。
该步骤中，完成步骤S30的衬底基板12通过胶贴法或真空吸附法固定到基台13上，以方便后续对OLED器件7的封装。
步骤S33中，在衬底基板12上的OLED器件7的第一侧71滴注透明胶9，并使滚轴11上石墨烯薄膜2的一侧边缘与透明胶9相对应并接触。
透明胶9的材质与实施例1中相同。
步骤S34中，加热滚轴11使透明胶9处于不完全固化状态，滚动滚轴11至OLED器件7的与第一侧71相对的第二侧72，透明胶9在滚轴11的牵引下涂布至钝化层8上，且钝化层8通过透明胶9与石墨烯薄膜2粘接在一起，同时铜箔1与石墨烯薄膜2分离。
在该步骤中，石墨烯薄膜2的尺寸大于OLED器件7的尺寸。滚轴11从OLED器件7的第一侧71滚动至第二侧72的过程中，能够同时完成石墨烯薄膜2对OLED器件7的封装和铜箔1与石墨烯薄膜2的分离，从而使OLED器件7的封装更加快捷简便。
步骤S35中，固化透明胶9。
透明胶9的固化温度与实施例1中相同。
至此，便完成了采用石墨烯薄膜2对OLED器件7的封装。
本实施例中，在铜箔1与石墨烯薄膜2分离之后，还包括在石墨烯薄膜2上形成保护层。保护层能对石墨烯薄膜2形成保护，以使石墨烯薄膜2免受损坏，从而使石墨烯薄膜2对OLED器件7形成很好的封装和保护。保护层的材质及形成方法与实施例2中相同。
在本实施例所提供的封装方法中，能够在一步中同时完成石墨烯薄膜2对OLED器件7的封装和铜箔1与石墨烯薄膜2的分离，从而使OLED器件7的封装更加快捷简便。本实施例中的封装方法相比于实施例1和2中任意一个中的封装方法，能够避免石墨烯薄膜2覆盖到OLED器件7上后出现不平整现象，且本实施例中的封装方法能使石墨烯薄膜2与铜箔1的分离难度更进一 步降低。
另外，本实施例中的封装方法不受衬底基板12以及OLED器件7的尺寸的限制，即无论衬底基板12和OLED器件7尺寸有多大，都能够通过使滚轴11滚过相应的面积而实现OLED器件7的封装，只要确保石墨烯薄膜2的尺寸大于OLED器件7的尺寸，能够将OLED器件7完全覆盖即可。
在本发明实施例1至3中所提供的封装方法中，通过将形成在铜箔上的石墨烯薄膜与铜箔分离、并采用石墨烯薄膜对OLED器件进行封装，从而将石墨烯薄膜引入到OLED器件的封装中，这能够充分利用石墨烯薄膜高透光率、超薄、柔性、高度隔水隔氧以及易于在基底间转移(即容易与铜箔分离并与OLED器件连接)的特点，不仅提高了OLED器件的封装效果，而且简化了OLED器件的封装工艺，并提高了生产效率。
[实施例4]
本实施例提供一种OLED器件，该OLED器件采用实施例1至3任意一个中的封装方法进行封装。
通过采用实施例1至3任意一个中的封装方法封装而成的OLED器件，封装效果更加优良，从而能提高OLED器件的品质和寿命。
[实施例5]
本实施例提供一种封装装置，其用于对形成在衬底基板上的OLED器件进行封装，并且包括封装机构，封装机构用于将形成在铜箔上的石墨烯薄膜与铜箔分离、并采用石墨烯薄膜对OLED器件进行封装。
通过封装机构的设置，能够实现石墨烯薄膜与铜箔的快速简便分离，同时还能使石墨烯薄膜对OLED器件进行封装，从而不仅提高了OLED器件的封装效果，而且简化了OLED器件的封装工艺，并提高了生产效率。
如图6所示，该封装装置还包括基台13，基台13用于承载衬底基板12以及OLED器件7，衬底基板12与基台13的承载面 贴合。封装机构包括圆柱形滚轴11、带动部(图6中未示出)和加热部14，滚轴11的圆柱面用于贴附形成有石墨烯薄膜2的铜箔1，铜箔1的其上未形成石墨烯薄膜2的一面与滚轴11的圆柱面贴合。
滚轴11设置在基台13上方，且滚轴11的滚动起始位置与衬底基板12上的OLED器件7的第一侧71相对应，滚轴11与衬底基板12之间形成有间隙15，间隙15用于容纳透明胶9。
加热部14设置在滚轴11内部，用于加热滚轴11的圆柱面，以使透明胶9处于不完全固化状态。带动部与滚轴11的端部连接，用于带动滚轴11滚动至OLED器件7的与第一侧71相对的第二侧72，滚轴11在滚动时能牵引透明胶9向滚轴11的滚动方向延伸。
如此设置，能使封装装置按照实施例3中的封装方法对OLED器件7进行封装，从而大大简化了OLED器件的封装工艺，并提高了生产效率。
本实施例中，滚轴11的轴向平行于衬底基板12的与OLED器件7的第一侧71相对应的一侧边缘，且滚轴11的长度大于等于衬底基板12的一侧边缘的长度。如此设置，使滚轴11滚过整个衬底基板12后能实现对整个OLED器件7的完全覆盖，从而完成对OLED器件7的良好封装。
在本实施例中的封装装置中，通过封装机构的设置，能够实现石墨烯薄膜与铜箔的快速简便分离，同时还能使石墨烯薄膜对OLED器件进行封装，从而不仅提高了OLED器件的封装效果，而且简化了OLED器件的封装工艺，并提高了生产效率。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (17)

  1. 一种封装方法，用于对形成在衬底基板上的OLED器件进行封装，并且包括：将形成在铜箔上的石墨烯薄膜与所述铜箔分离、并采用所述石墨烯薄膜对所述OLED器件进行封装。
  2. 根据权利要求1所述的封装方法，其中，所述将形成在铜箔上的石墨烯薄膜与所述铜箔分离、并采用所述石墨烯薄膜对所述OLED器件进行封装的方法包括：
    步骤S10，将所述铜箔的其上未形成有所述石墨烯薄膜的一面通过双面胶粘结到固定衬底上；
    步骤S11，将粘性聚合物加工成流体状态，浇筑到所述铜箔的其上形成有所述石墨烯薄膜的一面；
    步骤S12，待所述粘性聚合物固化后，用胶带粘住所述粘性聚合物，然后将由所述石墨烯薄膜和所述粘性聚合物组成的复合膜从所述铜箔上剥离下来；
    步骤S13，在所述OLED器件上形成钝化层，在钝化层上涂布透明胶，在所述透明胶固化前，将所述复合膜的所述石墨烯薄膜的一面粘贴到所述透明胶上；以及
    步骤S14，固化所述透明胶。
  3. 根据权利要求2所述的封装方法，其中，在所述步骤S11中，采用熔融的方式将所述粘性聚合物加工成流体状态。
  4. 根据权利要求2所述的封装方法，其中，所述固定衬底采用玻璃、石英或硅片材料制成。
  5. 根据权利要求1所述的封装方法，其中，所述将形成在铜箔上的石墨烯薄膜与所述铜箔分离、并采用所述石墨烯薄膜对所述OLED器件进行封装的方法包括：
    步骤S20，在所述OLED器件上形成钝化层，在钝化层上涂 布透明胶；
    步骤S21，在所述透明胶固化前，将所述铜箔的其上形成有所述石墨烯薄膜的一面粘贴到所述透明胶上；
    步骤S22，固化所述透明胶；以及
    步骤S23，将完成步骤S22的所述衬底基板固定，用胶带粘住所述铜箔的其上未形成有所述石墨烯薄膜的一面，将所述铜箔与所述石墨烯薄膜分离。
  6. 根据权利要求1所述的封装方法，其中，所述将形成在铜箔上的石墨烯薄膜与所述铜箔分离、并采用所述石墨烯薄膜对所述OLED器件进行封装的方法包括：
    步骤S30，在所述OLED器件上形成钝化层；
    步骤S31，将所述铜箔的其上未形成有所述石墨烯薄膜的一面贴附到能够加热的滚轴上；
    步骤S32，将完成步骤S30的所述衬底基板固定到基台上，且所述OLED器件背向所述基台；
    步骤S33，在所述衬底基板上的所述OLED器件的第一侧滴注透明胶，并使所述滚轴上所述石墨烯薄膜的一侧边缘与所述透明胶相对应并接触；
    步骤S34，加热所述滚轴使所述透明胶处于不完全固化状态，滚动所述滚轴至所述OLED器件的与所述第一侧相对的第二侧，所述透明胶在所述滚轴的牵引下涂布至所述钝化层上，且所述钝化层与所述石墨烯薄膜粘接在一起，同时所述铜箔与所述石墨烯薄膜分离；以及
    步骤S35，固化所述透明胶。
  7. 根据权利要求2、5或6所述的封装方法，其中，所述石墨烯薄膜的尺寸大于所述OLED器件的尺寸，且所述石墨烯薄膜完全覆盖所述OLED器件。
  8. 根据权利要求2、5或6所述的封装方法，其中，所述透明胶采用与所述粘性聚合物相同的材料制成；所述粘性聚合物包括聚对苯二甲酸乙二醇酯、聚二甲基硅氧烷、聚丙烯、环氧树脂类聚乙烯、ABS塑料、聚氯乙烯、聚甲醛、聚碳酸酯、酚醛塑料、聚氨酯塑料、环氧树脂、不饱和聚酯塑料、呋喃塑料、有机硅树脂和丙烯基树脂中的任意一种或多种。
  9. 根据权利要求2、5或6所述的封装方法，其中，所述透明胶的固化温度小于等于所述OLED器件的热处理临界温度。
  10. 根据权利要求5或6所述的封装方法，其中，在所述铜箔与所述石墨烯薄膜分离之后，还包括在所述石墨烯薄膜上形成保护层。
  11. 根据权利要求10所述的封装方法，其中，所述保护层采用溶液旋涂法或化学气相沉积法形成；所述保护层采用透明有机绝缘材料或透明无机绝缘材料制成。
  12. 根据权利要求6所述的封装方法，其中，在所述步骤S32中，完成步骤S30的所述衬底基板通过胶贴法或真空吸附法固定到所述基台上。
  13. 根据权利要求2、5或6所述的封装方法，其中，所述钝化层采用低温化学气相沉积法、原子层沉积法或常温键合法形成；采用所述低温化学气相沉积法沉积所述钝化层的温度小于等于所述OLED器件的热处理临界温度；所述钝化层采用氮化硅、二氧化硅、三氧化二铝或氮氧化硅材料制成。
  14. 一种OLED器件，采用权利要求1至13中任意一项所述的封装方法进行封装。
  15. 一种封装装置，用于对形成在衬底基板上的OLED器件进行封装，并且包括封装机构，所述封装机构用于将形成在铜箔上的石墨烯薄膜与所述铜箔分离、并采用所述石墨烯薄膜对所述OLED器件进行封装。
  16. 根据权利要求15所述的封装装置，还包括基台，其中，
    所述基台用于承载所述衬底基板以及所述OLED器件，所述衬底基板与所述基台的承载面贴合；
    所述封装机构包括圆柱形滚轴、带动部和加热部，所述滚轴的圆柱面用于贴附形成有所述石墨烯薄膜的所述铜箔，所述铜箔的其上未形成有所述石墨烯薄膜的一面与所述滚轴的圆柱面贴合；
    所述滚轴设置在所述基台上方，且所述滚轴的滚动起始位置与所述衬底基板上的所述OLED器件的第一侧相对应，所述滚轴与所述衬底基板之间形成有间隙，所述间隙用于容纳透明胶；
    所述加热部设置在所述滚轴内部，用于加热所述滚轴的圆柱面，以使所述透明胶处于不完全固化状态；
    所述带动部与所述滚轴的端部连接，用于带动所述滚轴滚动至所述OLED器件的与所述第一侧相对的第二侧，所述滚轴在滚动时能牵引所述透明胶向所述滚轴的滚动方向延伸。
  17. 根据权利要求16所述的封装装置，其中，所述滚轴的轴向平行于所述衬底基板的与所述OLED器件的第一侧相对应的一侧边缘，且所述滚轴的长度大于等于所述衬底基板的一侧边缘的长度。
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