WO2016106428A1 - Bouchon de trou pour stratifié mince - Google Patents

Bouchon de trou pour stratifié mince Download PDF

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Publication number
WO2016106428A1
WO2016106428A1 PCT/US2015/067736 US2015067736W WO2016106428A1 WO 2016106428 A1 WO2016106428 A1 WO 2016106428A1 US 2015067736 W US2015067736 W US 2015067736W WO 2016106428 A1 WO2016106428 A1 WO 2016106428A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
less
dielectric layer
laminate structure
conductive foil
Prior art date
Application number
PCT/US2015/067736
Other languages
English (en)
Inventor
Shinichi Iketani
Dale Kersten
Original Assignee
Sanmina Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanmina Corporation filed Critical Sanmina Corporation
Priority to CN201580075279.2A priority Critical patent/CN107211539A/zh
Priority to JP2017533823A priority patent/JP2018500770A/ja
Priority to KR1020177018501A priority patent/KR102594179B1/ko
Priority to EP15874375.7A priority patent/EP3238512A4/fr
Publication of WO2016106428A1 publication Critical patent/WO2016106428A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0207—Partly drilling through substrate until a controlled depth, e.g. with end-point detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0713—Plating poison, e.g. for selective plating or for preventing plating on resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement

Definitions

  • Various features relate to laminate structures, and more particularly, to a method of forming hole plugs within thin laminate structures.
  • Laminate structures such as printed circuit boards, are typically prepared by first laminating a sub-composite structure with additional exterior sheets/layers and/or other sub- composite structures.
  • One or more holes may be formed (e.g. drilled) within the sub- composite for via holes.
  • a first aspect provides a method for forming a hole plug in a laminate structure.
  • a laminate structure is formed, including at least a dielectric layer and a first conductive foil on a first side of the dielectric layer.
  • An unpierced or blind hole is formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the hole having a hole depth to hole diameter aspect ratio of less than ten (10) to one (1).
  • the hole aspect ratio e.g., hole depth to hole diameter ratio
  • the hole aspect ratio is less than three (3) to one (1).
  • the hole aspect ratio may be less than one (1) to one (1).
  • Via fill ink may then be deposited in the hole. The via fill ink is then dried and/or cured to form a hole plug.
  • the laminate structure may further include a second conductive foil on the second side of the dielectric layer, wherein the second conductive foil is pierced by the hole. Additionally, the laminate structure may further include a disposable layer on the second conductive foil.
  • a multilayer printed circuit board may then be formed with the laminate structure.
  • a plated through hole may be formed through the hole plugged material.
  • the hole may be formed with a drill having a point angle equal or greater than 125 degrees.
  • the hole may be formed with a drill having a point angle equal or greater than 155 degrees. That is, the hole may have a bottom portion having corners with a point angle equal or greater than 155 degrees. In this manner, the drill may be configured to form a trimmed bottom corner within the hole. The bottom of the hole may be flat between the trimmed bottom corner (i.e., not a point).
  • the via fill ink may be deposited by at least one of: (a) screen printing, (b) stencil printing, or (c) squeezing the via fill ink into the hole.
  • the via fill ink deposition is assisted by vacuum.
  • the via fill ink may be debubbled in a vacuum chamber (e.g., prior to curing).
  • the via fill ink may be dried and/or cured within an oven.
  • the vacuum drying and heat curing processes may be performed simultaneously to cure the via fill ink.
  • the first conductive foil may have a thickness of 12 ounce or less, 2 ounce or less, or 1 ounce or less.
  • the dielectric layer may have a thickness of 20 mil or less, 16 mil or less, or 12 mil or less.
  • the hole plug may be made from a plating resist or a material that prevents metal plating.
  • a second aspect provides a laminate structure with a hole plug.
  • the laminate structure may include at least a dielectric layer and a first conductive foil on a first side of the dielectric layer.
  • An unpierced or blind hole in the laminate structure may extend toward the first conductive foil from a second side of the dielectric layer, the hole having a hole depth to hole diameter aspect ratio of less than ten (10) to one (1).
  • Via fill ink may be deposited in the hole to form a hole plug.
  • the laminate may further include a second conductive foil, wherein the second conductive foil is pierced by the hole. Multiple conductive and dielectric layers coupled to the laminate structure to form a multilayer printed circuit board.
  • the laminate structure may include a plated through hole through the hole plugged material.
  • the hole aspect ratio may be three (3) to one (1) or less, or one (1) to one (1) or less.
  • the hole may have a trimmed bottom corner.
  • the trimmed bottom corner of the via hole may have a point angle equal or greater than 125 degrees.
  • the trimmed bottom corner of the via hole may have a point angle equal or greater than 155 degrees.
  • the first conductive foil may have a thickness of 12 ounce or less, 2 ounce or less, or 3 micron or less.
  • the dielectric layer may have a thickness of 20 mil or less, 16 mil or less, or 12 mil or less.
  • the hole plug may be a plating resist or a material that prevents metal plating.
  • a third aspect provides a method for forming a hole plug in a laminate structure.
  • a laminate structure may be formed including a dielectric layer, a first conductive foil on a first side of the dielectric layer, and a second conductive foil on a second side of the dielectric layer.
  • the second conductive foil may be masked and etched to form an opening on the second conductive foil that exposes a portion of the dielectric layer.
  • Laser drilling may be done through the exposed portion of the laminate structure to form an unpierced or blind hole extending toward the first conductive foil and at least partially through the dielectric layer, the hole having a hole depth to hole diameter aspect ratio of less than ten (10) to one (1).
  • Via fill ink is deposited in the hole and cured to form a hole plug.
  • the second conductive foil may be pierced by the hole.
  • the laminate structure may include a disposable layer on the second conductive foil.
  • FIG. 1 illustrates a cross-section view of the construction of an unpierced laminate structure having a filled via hole.
  • FIG. 2 is a flow diagram illustrating a method for forming an unpierced thin laminate structure with a hole plug.
  • FIG. 3 illustrates a cross-section view of the construction of an unpierced laminate structure having a laser-drilled filled via hole.
  • FIG. 4 is a flow diagram illustrating a method for forming a thin laminate structure with a hole plug.
  • FIG. 5 illustrates an exemplary drill that may be used to for a hole in accordance with FIGS. 1 and 2.
  • FIG. 1 illustrates a cross-section view of the construction of an unpierced laminate structure 100 having a filled via hole.
  • the laminate structure 100 may be formed by including a dielectric layer 102 sandwiched between a first conductive layer or foil 106 (e.g., cooper foil) and/or a second conductive layer or foil 104. While a double sided laminate 100 is illustrated, a single sided laminate (i.e., one dielectric layer and one conductive layer or foil) and/or unclad laminate are also contemplated to be used.
  • the first conductive layer or foil 106 and a second conductive layer or foil 104 may be selected from commonly available copper foil thickness, for example, approximately between 12 oz (approx.. 420 micron thick or less) and 3 micron thick or less.
  • the dielectric layer 102 may have a thickness of 20 mil or less.
  • a drill 108 may be used to form an unpierced or blind hole 110 through the second conductive layer or foil 104 and the dielectric layer 102, but not drill through or only partially drill through the first conductive layer or foil 106.
  • the drill point angle may be equal to or greater than 125 degrees.
  • the drilling machine used may have a depth sensor from the surface of the laminate structure 100 or drill depth.
  • the drill machine may have sensors to sense when the drill contacts the first and/or the second conductive layer or foil.
  • the hole 110 has been formed within the unpierced laminate structure 100.
  • the aspect ratio of the hole depth to the hole diameter may be 10: 1 or less, 5: 1 or less, 4: 1 or less, 3: 1 or less, 2: 1 or less, 1 : 1 or less, 1 :2 or less, 1:3 or less, or 1 : 10 or less.
  • the aspect ratio i.e., hole depth to hole diameter ratio
  • Conventional via fill ink and hole filler machines are designed to work with through holes having aspect ratios of 5: 1 or higher.
  • a via fill ink 112 (or other similarly via fill material of similar viscosity) is deposited into the hole 110 using a hole filler machine.
  • the hole filler machine may be feature a vacuum assisted process to prevent bubbles in the via fill ink.
  • the via fill ink 112 may form a hole plug.
  • the via fill ink 112 may be a plating resist material.
  • the via fill ink 112 may be deposited in the hole 110 by screen or stencil printing, by an ink dispenser, by a squeezing in on the surface and these process may be assisted by vacuum.
  • the via formed on the surface of the laminate substrate 100 may be prepared with a disposable layer, so that after the via fill ink is deposited in the hole 110, the disposable layer can be removed to clean the surface of the laminate structure 100.
  • the low aspect ratio of the hole depth to the hole diameter e.g., aspect ratio of 10: 1 or less, 5: 1 or less, 4: 1 or less, 3: 1 or less, 2: 1 or less, 1: 1 or less, 1:2 or less, or 1: 10 or less.
  • conventional via fill material may not properly fill the hole 110 and a conventional filler machine may be a cause for bubbles in the hole plug.
  • a proper viscosity and thixotropic property prepared via fill ink is used that allows it to flow in and fill the hole 110.
  • the via fill ink 112 may have a viscosity of 100-10000 deciPascal-second (dps-s) at 25 degrees Celsius, 200-1000 deciPascal-second (dps-s) at 25 degrees Celsius, and/or 200-500 deciPascal-second (dps-s) at 25 degrees Celsius, etc.
  • the thixotropic index, the ratio of static viscosity to dynamic viscosity may be 2 or greater, preferably 3 or greater.
  • the via fill ink 112 may also be screen printable, stencil printable, and/or squeeze fillable.
  • the ink filler machine may feature vacuum assist and/or a heater to prevent bubbles in the ink.
  • the via fill ink 112 may prevent conductive material from being plated between the first conductive layer or foil 106 and the second conductive layer or foil 104.
  • the via fill ink 112 may be cured or semi-cured.
  • a vacuum dry process may be applied prior to via fill ink 112 heat cure process. Heat may be applied during vacuum dry to assist via fill ink debubbling.
  • the via fill ink made with a solvent 112 may be vacuum dried.
  • the vacuum drying conditions may be a pressure of 360 millimeters of mercury (mmHg) or less, or 150 mmHg or less, for a length of time greater than 30 seconds at a set pressure or greater than 90 seconds at the set pressure.
  • heat may be applied to the via fill ink for curing. Vacuum and heat curing processes may be performed simultaneously to perform debubbling and cure of the via fill ink.
  • the laminate structure 100 may be added or laminated onto additional layers 120 and 122, such as one or more core structure and/or additional laminate structures with prepreg, on either one side or both sides of the laminate structure 100 to form a multilayer structure 130.
  • the additional laminate structures may include dielectric and conductive layers or foils.
  • the conductive layers e.g., conductive foils
  • the conductive layers may be patterned to form electrical paths or traces.
  • a through-hole 124 may be drilled through the multilayer structure 130, including through the via fill ink 112.
  • the through-hole 124 may have a diameter smaller than the diameter of the first formed hole 110 and or the via fill ink 112.
  • the through-hole 124 may then be plated, for example, by placing the panel into a seed bath, followed by immersion in an electroless copper bath, followed by electrolytic plating.
  • FIG. 2 is a flow diagram illustrating a method for forming an unpierced thin laminate structure with a via fill hole plug.
  • a laminate structure is formed including at least a dielectric layer and a first conductive foil on a first side of the dielectric layer 202.
  • An unpierced or blind hole is formed in the laminate structure extending toward the first conductive foil and at least partially through the dielectric layer, the hole having a hole depth to hole diameter aspect ratio of less than ten (10) to one (1) 204.
  • the aspect ratio i.e., hole depth to hole diameter
  • the aspect ratio may be, for example, 10: 1 or less, 5: 1 or less, 4: 1 or less, 3: 1 or less, 2: 1 or less, 1: 1 or less, 1:2 or less, or 1 : 10 or less.
  • a drill is used to form the hole, the drill having a point angle equal or greater than 125 degrees or more or 155 degrees or more. Via fill ink may then be deposited in the hole 206.
  • the via fill ink may be dried and/or cured to form a hole plug 208.
  • a plated through hole may be subsequently formed through the hole plugged material.
  • the hole plug may be a plating resist or a material that prevents metal plating.
  • the laminate structure may further include a second conductive foil on the second side of the dielectric layer, wherein the second conductive foil is pierced by the hole.
  • the laminate structure may further include a disposable layer on the second conductive foil.
  • a multilayer printed circuit board may be formed with the laminate structure.
  • the hole may be formed with a drill having a point angle equal or greater than 125 degrees.
  • the hole may be formed with a drill having a point angle equal or greater than 155 degrees.
  • the drill may be configured to form a trimmed bottom corner within the hole.
  • the via fill ink may be deposited by at least one of: (a) screen printing, (b) stencil printing, or (c) squeezing the via fill ink into the hole.
  • the via fill ink deposition may be assisted by vacuum (e.g., in a vacuum chamber), to debbubble the via fill ink (i.e., remove bubbles from the via fill ink).
  • vacuum e.g., in a vacuum chamber
  • the drying and/or curing of the via fill ink may be done, for example, within an oven.
  • thermal cure process is simultaneously proceeded.
  • the first conductive foil may have a thickness of 12 ounce or less, 2 ounce or less, or 1 ounce (oz) or less.
  • the dielectric layer may have a thickness of 20 mil or less, 16 mil or less, or 12 mil or less.
  • FIG. 3 illustrates a cross-section view of the construction of an unpierced laminate structure 300 having a laser-drilled filled via hole.
  • the laminate structure 300 may be formed by including a dielectric layer 302 sandwiched between a first conductive layer or foil 306 (e.g., cooper foil) and/or a second conductive layer or foil 304. While a double sided laminate 300 is illustrated, a single sided laminate (i.e., one dielectric layer and one conductive layer or foil) and/or unclad laminate are also contemplated to be used.
  • the first conductive layer or foil 306 and a second conductive layer or foil 304 may be selected from commonly available copper foil thickness, for example, approximately 12 oz (420 micron) thick or less, 2 oz (70 micron) thick or less, or 1 oz (35 micron) thick or less.
  • the dielectric layer 302 may have a thickness of 20 mil or less (e.g., 16 mil or less, 12 mil or less, 8 mil or less).
  • a conformal mask formation process may be achieved by etching process of chemical etchant or laser abrasion to form an opening 308 on the second conductive layer or foil 304 which exposes the dielectric layer 302.
  • laser drilling may be used to form an unpierced or blind hole 310 through the dielectric layer 302 of the laminate structure 300.
  • the laser may be a C02 laser, a UV laser, or a complex C02 and UV laser. If the laser aperture is not sufficient for the hole size, a common trepanning method may be used. The laser drill will be stopped by adjacent copper foil and it makes the hole is unpierced or blind.
  • a via fill ink 312 (or other similarly via fill material of similar viscosity) is deposited into the hole 310 using a hole filler machine.
  • the hole filler machine may be featured vacuum assisted process to prevent bubbles in the via fill ink.
  • the via fill ink 312 may form a hole plug.
  • the via fill ink 312 may be a plating resist material.
  • the via fill ink 312 may be deposited in the hole 310 by screen or stencil printing, by an ink dispenser, by a squeezing in on the surface and these process may be assisted by use of a vacuum.
  • the surface of the laminate substrate 300 through which the via is formed may be prepared with a disposable layer, so that after the via fill ink 312 is deposited in the hole 310, the disposable layer can be removed to clean the surface of the laminate structure 300.
  • conventional/thicker via fill material may not properly fill the hole 310 and a conventional filler machine may be a cause for bubbles in the hole plug.
  • a proper viscosity and thixotropic property prepared via fill ink is used that allows it to flow in and fill the hole 310.
  • the via fill ink 312 may have a viscosity of 100- 10000 deciPascal-second (dps-s) at 25 degrees Celsius, 200-1000 deciPascal-second (dps-s) at 25 degrees Celsius, and/or 200-500 deciPascal-second (dps-s) at 25 degrees Celsius, etc.
  • the via fill ink 312 may also be screen printable, stencil printable, and/or squeeze fillable.
  • the ink filler machine may feature vacuum assist and/or heater to prevent bubbles in the ink.
  • the void fill ink 312 may prevent conductive material from being plated between the second conductive layer or foil 304 and the first conductive layer or foil 306.
  • the via fill ink 312 may then be cured or semi-cured. Vacuum dry process may be applied prior to via fill ink 312 heat cure process. Heat may be applied during vacuum dry to assist via fill ink debubbling.
  • the via fill ink 312 may be vacuum dried.
  • the vacuum drying conditions may be a pressure of 360 millimeters of mercury (mmHg) or less, or 150 mmHg or less, for a length of time greater than 30 seconds at a set pressure or greater than 90 seconds at the set pressure.
  • the via fill ink may be applied heat for further cure. Vacuum dry and heat cure process may be proceeded simultaneously.
  • the laminate structure 300 may be added or laminated onto additional layers 320 and 322, such as a core structure and/or additional laminate structures, on either one side or both sides of the laminate structure 300 to form a multilayer structure 330.
  • the additional laminate structures may include dielectric and conductive layers or foils.
  • the conductive layers e.g., conductive foils
  • the conductive layers may be patterned to form electrical paths or traces.
  • a through-hole 324 may be drilled through the multilayer structure 330, including through the via fill ink 312.
  • the through-hole 324 may have a diameter smaller than the diameter of the first formed hole 310 and or the via fill ink 312.
  • the through-hole 324 may then be plated, for example, by placing the panel into a seed bath, followed by immersion in an electroless copper bath, followed by electrolytic plating.
  • FIG. 4 is a flow diagram illustrating a method for forming a thin laminate structure with a filled hole plug.
  • a laminate structure is formed including a dielectric layer, a first conductive foil on a first side of the dielectric layer, and a second conductive foil on a second side of the dielectric layer 402.
  • the second conductive foil may then be partially removed (e.g., masked and etched) to form an opening on the second conductive foil that exposes a portion of the dielectric layer 404.
  • the exposed portion of the laminate structure may then be laser drilled to form an unpierced or blind hole extending toward the first conductive foil and at least partially through the dielectric layer, the hole having a hole depth to hole diameter aspect ratio of less than ten (10) to one (1) 406.
  • Via fill ink may then be deposited in the hole 408 and cured to form a hole plug 410.
  • the second conductive foil is pierced by the hole.
  • a plated through hole may be formed through the hole plugged material.
  • the hole plug may be a plating resist or a material that prevents metal plating.
  • the laminate structure may further include a disposable layer on the second conductive foil.
  • a multilayer printed circuit board may be formed with the laminate structure.
  • the hole aspect ratio (via hole depth to diameter ratio) may be, for instance, ten (10) to one (1) or less, five (5) to one (1) or less, four (4) to one (1) or less, three (3) to one (1) or less, or two (2) to one or less, or one (1) to one (1) or less, or one (1) to two (2) or less.
  • the hole aspect ratio may be, for instance, between ten (10) to one (1) and one (1) to one (1), between ten (10) to one (1) and one (1) to one (1), between five (5) to one (1) and one (1) to one (1), between four (4) to one (1) and one (1) to one (1), between three (3) to one (1) and one (1) to two (2), or between two (2) to one (1) and one (1) to one (1) or one (1) to two (2).
  • the via fill ink may be deposited by at least one of: (a) screen printing, (b) stencil printing, and (c) squeezing the via fill ink into the hole.
  • the via fill ink deposition may be assisted by vacuum (e.g., done within a vacuum chamber) to debubble the via fill ink (i.e., to remove bubbles from the via fill ink).
  • vacuum e.g., done within a vacuum chamber
  • the via fill ink may be cured within an oven.
  • the thermal cure process may be simultaneously proceeded.
  • each of the first conductive foil and second conductive foils may have a thickness of 12 ounce or less, 2 ounce or less, or 1 ounce or less.
  • the dielectric layer has a thickness of 20 mil or less, 16 mil or less, or 12 mil or less.
  • FIG. 5 illustrates an exemplary drill that may be used to for a hole in accordance with FIGS. 1 and 2.
  • a laminate structure 502 e.g., comprising a dielectric layer and no conductive layers, or a dielectric layer and one or more conductive layers or foils
  • a drill 504 may have a hole formed by a drill 504 that is shaped or configured to form a trimmed bottom comer within the hole.
  • the trimmed bottom corner minimize potential bubble trap.
  • the drill may have a point angle ⁇ equal or greater than 125 degrees or a point angle ⁇ equal or greater than 155 degrees. Because the hole depth may be rather shallow (relative to the hole diameter), such drill point angle may be necessary to form a hole capable of accepting the via fill ink.
  • a process is terminated when its operations are completed.
  • a process may correspond to a method, a function, a procedure, a subroutine, a subprogram, etc.
  • a process corresponds to a function
  • its termination corresponds to a return of the function to the calling function or the main function.

Abstract

La présente invention concerne procédé de formation d'un bouchon de trou dans une structure stratifiée. Une structure stratifiée est formée comprenant au moins une couche diélectrique et une première feuille conductrice sur un premier côté de la couche diélectrique. Un trou non percé ou borgne est formé dans la structure stratifiée s'étendant vers la première feuille conductrice à partir d'un second côté de la couche diélectrique et au moins en partie à travers la couche diélectrique, le trou ayant un rapport de forme, de profondeur de trou à diamètre de trou, inférieur à dix (10) à un (1). Dans encore un autre exemple, le rapport de forme de trou peut être inférieur à un (1) à un (1). De l'encre de remplissage de trou d'interconnexion peut ensuite être déposée dans le trou. L'encre de remplissage de trou d'interconnexion est ensuite séchée et/ou durcie pour former un bouchon de trou.
PCT/US2015/067736 2014-12-23 2015-12-28 Bouchon de trou pour stratifié mince WO2016106428A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201580075279.2A CN107211539A (zh) 2014-12-23 2015-12-28 薄层压板的孔塞
JP2017533823A JP2018500770A (ja) 2014-12-23 2015-12-28 薄型積層体用ホールプラグ
KR1020177018501A KR102594179B1 (ko) 2014-12-23 2015-12-28 얇은 라미네이트를 위한 홀 플러그
EP15874375.7A EP3238512A4 (fr) 2014-12-23 2015-12-28 Bouchon de trou pour stratifié mince

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462096011P 2014-12-23 2014-12-23
US62/096,011 2014-12-23
US201462096817P 2014-12-24 2014-12-24
US62/096,817 2014-12-24

Publications (1)

Publication Number Publication Date
WO2016106428A1 true WO2016106428A1 (fr) 2016-06-30

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PCT/US2015/067736 WO2016106428A1 (fr) 2014-12-23 2015-12-28 Bouchon de trou pour stratifié mince

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JP (1) JP2018500770A (fr)
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JP2001274204A (ja) * 2000-03-24 2001-10-05 Hitachi Cable Ltd ２メタル基板とｂｇａ構造
JP2002344144A (ja) * 2001-03-14 2002-11-29 Toppan Printing Co Ltd 多層配線板の製造方法および多層配線板および表面保護用フィルム
JP2002319763A (ja) * 2001-04-24 2002-10-31 Matsushita Electric Ind Co Ltd 多層配線基板、およびその製造方法
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CN107211539A (zh) 2017-09-26
EP3238512A4 (fr) 2018-08-22

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