JP4972753B2 - 印刷回路基板の製造方法 - Google Patents
印刷回路基板の製造方法 Download PDFInfo
- Publication number
- JP4972753B2 JP4972753B2 JP2009004838A JP2009004838A JP4972753B2 JP 4972753 B2 JP4972753 B2 JP 4972753B2 JP 2009004838 A JP2009004838 A JP 2009004838A JP 2009004838 A JP2009004838 A JP 2009004838A JP 4972753 B2 JP4972753 B2 JP 4972753B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- circuit pattern
- resin layer
- insulating layer
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
212、212' 樹脂層
21 第2基材
23 第1基材
232 第1絶縁層
231 第1回路パターン
22 第2絶縁層
24 貫通孔
26 シード層
27 メッキレジスト
28 第2回路パターン
29 ビア
Claims (2)
- 第1絶縁層及び第1回路パターンが積層された第1基材を提供するステップと、
樹脂層及び金属層が積層された第2基材を提供するステップと、
第2絶縁層を介在して、前記第1回路パターンと前記樹脂層とが対向するように、前記第1基材及び前記第2基材を圧着するステップと、
湿式エッチングで前記金属層を除去するステップと、
前記金属層を除去するステップの後に、前記第1絶縁層、前記第1回路パターン、前記第2絶縁層及び前記樹脂層を貫通する貫通孔を形成するステップと、
デスミア(desmear)処理で前記樹脂層に粗さを形成するステップと、
前記貫通孔を介して層間導通を行うビアを形成するステップと、
前記粗さが形成された樹脂層に第2回路パターンを形成するステップと、
を含み、
前記ビアを形成するステップ及び前記第2回路パターンを形成するステップは、
前記粗さを形成するステップの後に、
前記樹脂層及び前記貫通孔の内壁にシード層を形成するステップと、
前記シード層に前記ビア及び前記第2回路パターンに対応するメッキレジストを形成するステップと、
電解メッキを行うステップと、
前記メッキレジストを除去するステップと、
フラッシュエッチングを行うステップと、
を含んで同時に行われることを特徴とする印刷回路基板の製造方法。 - 前記第2絶縁層は、半硬化(B-stage)状態であることを特徴とする請求項1に記載の印刷回路基板の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080004387A KR101070798B1 (ko) | 2008-01-15 | 2008-01-15 | 인쇄회로기판 및 그 제조방법 |
KR10-2008-0004387 | 2008-01-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009170911A JP2009170911A (ja) | 2009-07-30 |
JP4972753B2 true JP4972753B2 (ja) | 2012-07-11 |
Family
ID=40849677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009004838A Expired - Fee Related JP4972753B2 (ja) | 2008-01-15 | 2009-01-13 | 印刷回路基板の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7992296B2 (ja) |
JP (1) | JP4972753B2 (ja) |
KR (1) | KR101070798B1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6144003B2 (ja) * | 2011-08-29 | 2017-06-07 | 富士通株式会社 | 配線構造及びその製造方法並びに電子装置及びその製造方法 |
JP7376509B2 (ja) * | 2018-12-25 | 2023-11-08 | 寿屋フロンテ株式会社 | 制振材 |
CN112312659B (zh) * | 2019-07-29 | 2021-09-21 | 庆鼎精密电子(淮安)有限公司 | 电路板的除胶方法 |
KR102686710B1 (ko) * | 2021-11-29 | 2024-07-19 | 와이엠티 주식회사 | 표면조도가 낮은 금속박을 이용한 기판의 회로패턴 형성방법 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY144573A (en) * | 1998-09-14 | 2011-10-14 | Ibiden Co Ltd | Printed circuit board and method for its production |
JP2002246730A (ja) | 2001-02-13 | 2002-08-30 | Mitsubishi Electric Corp | プリント配線板のデスミア方法及びデスミア装置 |
CN100477891C (zh) * | 2003-01-16 | 2009-04-08 | 富士通株式会社 | 多层布线基板及其制造方法、纤维强化树脂基板制造方法 |
JP2004319887A (ja) | 2003-04-18 | 2004-11-11 | Mitsubishi Gas Chem Co Inc | アディティブ用樹脂組成物基板へのレーザーによる孔形成方法及びプリント配線板の製造方法。 |
US7345350B2 (en) * | 2003-09-23 | 2008-03-18 | Micron Technology, Inc. | Process and integration scheme for fabricating conductive components, through-vias and semiconductor components including conductive through-wafer vias |
US7199970B2 (en) * | 2003-11-03 | 2007-04-03 | Material Sciences Corporation | Damped disc drive assembly, and method for damping disc drive assembly |
JP2005236067A (ja) | 2004-02-20 | 2005-09-02 | Dainippon Printing Co Ltd | 配線基板と配線基板の製造方法、および半導パッケージ |
TW200602427A (en) * | 2004-03-30 | 2006-01-16 | Taiyo Ink Mfg Co Ltd | Thermosetting resin composition and multilayered printed wiring board comprising the same |
TWI241007B (en) * | 2004-09-09 | 2005-10-01 | Phoenix Prec Technology Corp | Semiconductor device embedded structure and method for fabricating the same |
JP4319976B2 (ja) * | 2004-12-27 | 2009-08-26 | 日本シイエムケイ株式会社 | 多層プリント配線板及びその製造方法 |
JP2007073834A (ja) * | 2005-09-08 | 2007-03-22 | Shinko Electric Ind Co Ltd | 絶縁樹脂層上の配線形成方法 |
TWI384908B (zh) | 2006-01-25 | 2013-02-01 | Mitsubishi Gas Chemical Co | 樹脂複合銅箔,印刷線路板,及其等之製造方法 |
IL175011A (en) * | 2006-04-20 | 2011-09-27 | Amitech Ltd | Coreless cavity substrates for chip packaging and their fabrication |
-
2008
- 2008-01-15 KR KR1020080004387A patent/KR101070798B1/ko not_active IP Right Cessation
-
2009
- 2009-01-09 US US12/351,333 patent/US7992296B2/en not_active Expired - Fee Related
- 2009-01-13 JP JP2009004838A patent/JP4972753B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20090078518A (ko) | 2009-07-20 |
KR101070798B1 (ko) | 2011-10-06 |
US7992296B2 (en) | 2011-08-09 |
JP2009170911A (ja) | 2009-07-30 |
US20090178840A1 (en) | 2009-07-16 |
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