WO2016105146A1 - 발광소자 및 이를 포함하는 발광소자 어레이 - Google Patents

발광소자 및 이를 포함하는 발광소자 어레이 Download PDF

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Publication number
WO2016105146A1
WO2016105146A1 PCT/KR2015/014236 KR2015014236W WO2016105146A1 WO 2016105146 A1 WO2016105146 A1 WO 2016105146A1 KR 2015014236 W KR2015014236 W KR 2015014236W WO 2016105146 A1 WO2016105146 A1 WO 2016105146A1
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Prior art keywords
electrode
layer
semiconductor layer
light emitting
conductive semiconductor
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PCT/KR2015/014236
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English (en)
French (fr)
Korean (ko)
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이건화
최병균
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LG Innotek Co Ltd
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LG Innotek Co Ltd
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Priority to EP15873673.6A priority Critical patent/EP3240050B1/en
Priority to JP2017529607A priority patent/JP6934812B2/ja
Priority to CN201580071060.5A priority patent/CN107112394B/zh
Priority to US15/532,349 priority patent/US10186640B2/en
Publication of WO2016105146A1 publication Critical patent/WO2016105146A1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • H10H20/8142—Bodies having reflecting means, e.g. semiconductor Bragg reflectors forming resonant cavity structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
    • H10H20/835—Reflective materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/032—Manufacture or treatment of electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/034—Manufacture or treatment of coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • Embodiments relate to a light emitting device and a light emitting device array including the same.
  • Group 3-5 compound semiconductors such as GaN and AlGaN, are widely used for optoelectronics and electronic devices due to many advantages, such as having a wide and easy to adjust band gap energy.
  • light emitting devices such as light emitting diodes or laser diodes using semiconductors of Group 3-5 or 2-6 compound semiconductor materials of semiconductors have been developed through the development of thin film growth technology and device materials such as red, green, blue and ultraviolet light.
  • Various colors can be realized, and efficient white light can be realized by using fluorescent materials or combining colors.
  • Low power consumption, semi-permanent life, fast response speed, safety and environment compared to conventional light sources such as fluorescent and incandescent lamps can be realized. Has the advantage of affinity.
  • a white light emitting device that can replace a fluorescent light bulb or an incandescent bulb that replaces a Cold Cathode Fluorescence Lamp (CCFL) constituting a backlight of a transmission module of an optical communication means and a liquid crystal display (LCD) display device.
  • CCFL Cold Cathode Fluorescence Lamp
  • LCD liquid crystal display
  • a light emitting structure including an n-type semiconductor layer, an active layer, and a p-type half layer is formed, and electrons injected through the n-type semiconductor layer and holes injected through the p-type semiconductor layer meet each other to form an active layer. It emits light with energy determined by the energy band inherent in the material.
  • the above-described light emitting structure is grown on a substrate such as sapphire, a horizontal light emitting device in which the substrate remains as it is after the growth of the light emitting structure, a vertical type in which a metal support is coupled to one side of the light emitting structure and the substrate is removed.
  • a substrate such as sapphire
  • a horizontal light emitting device in which the substrate remains as it is after the growth of the light emitting structure
  • a vertical type in which a metal support is coupled to one side of the light emitting structure and the substrate is removed.
  • the thickness of a substrate or a metal support is large, making it difficult to form an ultra thin pixel.
  • Embodiments provide an ultra-thin light emitting device in which a growth substrate or a metal support is omitted.
  • Embodiments may include a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer; A first electrode disposed in a portion of the first conductive semiconductor layer; An insulating layer disposed on a portion of the first electrode, the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer, and having a DBR structure; And a second electrode disposed on the second conductivity type semiconductor layer, wherein the first electrode contacts the insulating layer on a first surface and is exposed at a second surface facing the first surface.
  • a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer; A first electrode disposed in a portion of the first conductive semiconductor layer; An insulating layer disposed on a portion of the first electrode, the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer, and having a DBR structure; And a
  • the light emitting structure may include a first mesa region, the first conductive semiconductor layer may include a second mesa region, and the first electrode may be disposed on the first conductive semiconductor layer of the second mesa region.
  • the first electrode may be disposed on a side surface of the first conductive semiconductor layer in the second mesa region.
  • the first electrode may be disposed to extend at an edge of the second mesa region.
  • An exposed open region of the second conductive semiconductor layer may be disposed on a first mesa region, and at least a portion of the second electrode may be disposed on the open region.
  • At least a portion of the second conductivity-type semiconductor layer, the insulating layer, and the second electrode may overlap at the outside of the open region.
  • the DBR structure may be a structure in which TiO 2 and SiO 2 or Ta 2 O 5 and SiO 2 are repeatedly arranged at least twice.
  • the first electrode may include a bonding layer on the ohmic layer and the reflective layer.
  • the bonding layer may include titanium (Ti).
  • the second electrode may include an ohmic layer and a reflective layer.
  • the ohmic layer of the second electrode may include chromium (Cr) or silver (Ag) or titanium (Ti).
  • the ohmic layer of the second electrode may have a thickness of 1 nanometer or less.
  • the reflective layer is made of platinum (Pt), gold (Au), nickel (Ni), gold (Au), aluminum (Al), platinum (Au), gold (Au), aluminum (Al), nickel (Ni), gold ( Au) may have a structure.
  • Another embodiment is a circuit board; A light emitting structure disposed on the circuit board, the light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer; A first electrode disposed in a portion of the first conductive semiconductor layer; An insulating layer disposed on a portion of the first electrode, the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer, and having a DBR structure; And a second electrode disposed on the second conductivity type semiconductor layer, wherein the first electrode contacts the insulating layer on a first surface and is exposed at a second surface facing the first surface.
  • ACF anisotropic conductive film
  • the insulating layer may be disposed on a portion of the first surface of the first electrode, the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer.
  • the second surface of the first electrode may contact the upper side and the side surface of the first conductivity-type semiconductor layer of the second mesa region.
  • Yet another embodiment includes a circuit board; A light emitting structure disposed on the circuit board, the light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer; A first electrode disposed in a portion of the first conductive semiconductor layer; An insulating layer disposed on a portion of the first electrode, the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer, and having a DBR structure; And a second electrode disposed on the second conductivity type semiconductor layer, wherein the first electrode contacts the insulating layer on a first surface and is exposed at a second surface facing the first surface.
  • ACF anisotropic conductive film
  • the first electrodes of the plurality of light emitting devices may be connected to one wire in a direction opposite to the circuit board.
  • the light emitted from the active layer is disposed on the upper surface of the light emitting structure, a part of the upper surface of the second electrode and the upper surface of the first electrode is disposed in the DBR structure It may be reflected to the lower surface of the light emitting device.
  • the light extraction effect may be improved by reflection of the insulating layer of the DBR structure in addition to the first electrode and the second electrode.
  • the second electrode can be formed wider than the open area of the transparent conductive layer to prevent light leakage.
  • FIG. 1 is a cross-sectional view of an embodiment of a light emitting device
  • FIG. 2 is a view showing in detail the structure of the first electrode.
  • 3 is a view showing in detail the structure of the second electrode.
  • 5A to 5J are views illustrating a manufacturing process of a light emitting device.
  • FIG. 6 is a top view of the light emitting device of FIG. 1;
  • FIG. 7A and 7B are perspective and side cross-sectional views of the light emitting device of FIG. 1,
  • FIG. 8 is a diagram illustrating an embodiment of a smart watch including a light emitting device array.
  • the above (on) or below (on) or under) when described as being formed on the "on or under” of each element, the above (on) or below (on) or under) includes both two elements being directly contacted with each other or one or more other elements are formed indirectly between the two elements.
  • the above (on) or below when expressed as “on” or “under”, it may include the meaning of the downward direction as well as the upward direction based on one element.
  • FIG. 1 is a cross-sectional view of an embodiment of a light emitting device.
  • the light emitting device 100 includes a light emitting structure 120 including a first conductive semiconductor layer 122, an active layer 124, and a second conductive semiconductor layer 126, and a second conductive semiconductor layer.
  • the light emitting structure 120 has a first mesa region and a second mesa region, wherein the first mesa region includes the first conductive semiconductor layer 122, the active layer 124, and the second conductive region.
  • the second mesa region may be disposed on the semiconductor layer 126, and the second mesa region may be disposed only on the first conductive semiconductor layer 122.
  • the first mesa region is formed in the first etching process of exposing the top surface of the first conductivity-type semiconductor layer 122 to form the region where the first electrode 142 is disposed, and the first mesa region is formed. This is because the second mesa region may be formed in the second etching process of etching the edge region of the exposed first conductive semiconductor layer 122 again to increase the arrangement region of the electrode 142.
  • the side surfaces of the first mesa region and the second mesa region are shown to be perpendicular to each other, but may actually be disposed at an angle.
  • the first conductive semiconductor layer 122 may be formed of a compound semiconductor such as a group III-V group or a group II-VI.
  • the first conductive semiconductor layer 122 may be doped with a first conductive dopant to be a first conductive semiconductor layer.
  • the first conductivity type semiconductor layer 122 is made of a semiconductor material having a composition formula of Al x In y Ga (1-xy) N (0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ x + y ⁇ 1).
  • it may be formed of any one or more of AlGaN, GaN, InAlGaN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP.
  • the first conductivity type dopant may include an n type dopant such as Si, Ge, Sn, Se, Te, or the like.
  • the first conductivity type semiconductor layer 122 may be formed as a single layer or a multilayer, but is not limited thereto.
  • the first conductive semiconductor layer 122 forms a second mesa region on one side (right side in FIG. 1) around the first mesa region and forms a step on the right side of the second mesa region.
  • the active layer 124 is disposed on the top surface of the first conductivity-type semiconductor layer 122 on the first mesa region, and has a single well structure, a multi well structure, a single quantum well structure, and a multi quantum well (MQW) structure. It may include any one of a quantum dot structure or a quantum line structure.
  • the active layer 124 is formed of a well layer and a barrier layer, for example AlGaN / AlGaN, InGaN / GaN, InGaN / InGaN, AlGaN / GaN, InAlGaN / GaN, GaAs (InGaAs) using a compound semiconductor material of group III-V elements.
  • a barrier layer for example AlGaN / AlGaN, InGaN / GaN, InGaN / InGaN, AlGaN / GaN, InAlGaN / GaN, GaAs (InGaAs) using a compound semiconductor material of group III-V elements.
  • / AlGaAs, GaP (InGaP) / AlGaP may be formed of any one or more pair structure, but is not limited thereto.
  • the well layer may be formed of a material having an energy band gap smaller than the energy band gap of the barrier layer.
  • the second conductivity-type semiconductor layer 126 may be formed of a semiconductor compound on the surface of the active layer 124.
  • the second conductive semiconductor layer 126 may be formed of a compound semiconductor such as a group III-V group or a group II-VI, and may be doped with a second conductive dopant.
  • the second conductivity-type semiconductor layer 126 is made of, for example, a semiconductor material having a composition formula of In x Al y Ga 1-xy N (0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ x + y ⁇ 1). It may be formed of any one or more of AlGaN, GaN AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP.
  • the second conductivity-type semiconductor layer 126 may be doped with a second conductivity-type dopant.
  • the second conductivity-type dopant may be Mg, Zn, Ca, Sr, P-type dopants such as Ba and the like.
  • the second conductivity-type semiconductor layer 126 may be formed as a single layer or a multilayer, but is not limited thereto.
  • a translucent conductive layer 130 is formed on the second conductive semiconductor layer 126c by using indium tin oxide (ITO) or the like, and current spreading is performed from the second electrode 146 to the second conductive semiconductor layer 126. ) Can improve the effect.
  • ITO indium tin oxide
  • Mesa etching is performed to the second conductive semiconductor layer 126, the active layer 124, and a portion of the first conductive semiconductor layer 122, thereby exposing the first conductive semiconductor layer 122 to expose the first electrode 146.
  • the area to be formed can be secured.
  • the first electrode 142 and the second electrode 146 may be disposed on the first conductive semiconductor layer 122 and the second conductive semiconductor layer 126, respectively.
  • An insulating layer 150 is formed on the exposed surfaces of the light emitting structure 120 and the first electrode 142.
  • the insulating layer 150 is partially opened on the transparent conductive layer 130 to expose the transparent conductive layer 130.
  • the insulating layer 150 may be formed of at least two layers, and a detailed structure will be described later.
  • the second electrode 146 may directly contact the transparent conductive layer.
  • the ratio of the width (w1, w2) of may be 1 to 1 to 3 to 5, w0 may be greater than w1 or w2, w1 and w2 may be the same.
  • the width w0 of the region in which the second electrode 146 is in direct contact with the translucent conductive layer 130 may be 10 micrometers to 30 micrometers, and specifically 22 micrometers.
  • the widths w1 and w2 of the regions in which the light-transmissive conductive layer 130 and the insulating layer 150 contact each other may be 10 micrometers to 50 micrometers, and in detail, may be 30 micrometers.
  • the first electrode 142 is disposed on a portion and a side surface of the upper surface of the first conductive semiconductor layer 122 forming the second mesa region, and the first electrode 142 is formed of the first conductive semiconductor layer ( 122 may extend outward from the side.
  • the first electrode 142 may also be disposed on the first conductive semiconductor layer 122 forming a step with the second mesa region.
  • FIG. 2 is a view showing in detail the structure of the first electrode.
  • the first electrode 142 may include an ohmic layer 142a, a reflective layer 142b, and a bonding layer 142c.
  • the ohmic layer 142a may include chromium (Cr) or silver (Ag)
  • the reflective layer 142b may include platinum (Pt), gold, nickel (Ni), gold, aluminum (Al), platinum (Au), and the like.
  • Gold (Au) and aluminum (Al) and may have any one of the structures of nickel (Ni) and gold (Au) or an alloy thereof, and the bonding layer 142c may include titanium (Ti). .
  • the ohmic layer 142a is a thin film for bonding the first conductivity type semiconductor layer 122 and the reflective layer 142b and is disposed at a thickness t1 of 0.5 nanometers to 3 nanometers, for example, may be 1 nanometer. have.
  • a thickness t1 of 0.5 nanometers to 3 nanometers for example, may be 1 nanometer. have.
  • the thickness t1 of the ohmic layer 142a is smaller than 0.5 nanometers, ohmic contact between the first conductive semiconductor layer 122 and the reflective layer 142b may not be performed well, and the ohmic layer 142a If the thickness t1 is greater than 3 nanometers, light absorption may occur and the light reflectivity of the first electrode 142 may be reduced.
  • the bonding layer 142c is disposed at a thickness t2 of 10 nanometers to 200 nanometers for bonding the reflective layer 142b and the insulating layer 150, and may be, for example, 50 nanometers.
  • the thickness t2 of the bonding layer 142c is smaller than 10 nanometers, the insulating layer 150 and the reflective layer 142b may not be properly bonded, and the thickness t2 of the bonding layer 142c is 200 nanometers. If it is larger than the meter, the stress of the bonding layer 142c may increase, resulting in deterioration of the quality.
  • the thickness t3 of the entire first electrodes 142 may be about 1 micrometer.
  • 3 is a view showing in detail the structure of the second electrode.
  • the second electrode 146 may include an ohmic layer 146a and a reflective layer 146b.
  • the ohmic layer 146a may be made of chromium, silver, or titanium, and is a thin film for bonding the transmissive conductive layer 130 and the reflective layer 146b and is disposed at a thickness t4 of 0.5 nanometers to 3 nanometers. For example, it may be 1 nanometer.
  • the thickness t4 of the ohmic layer 142a is smaller than 0.5 nanometers, ohmic contact between the first conductive semiconductor layer 142 and the reflective layer 142b may not be performed well, and the ohmic layer 142a When the thickness t4 of the s) is greater than 3 nanometers, light absorption may occur and the light reflectivity of the first electrode 142 may be reduced.
  • the reflective layer 146b has a structure of platinum (Pt), gold, nickel (Ni), gold, aluminum (Al), platinum (Au), gold (Au), aluminum (Al), nickel (Ni), and gold (Au). Any one or an alloy thereof.
  • the total thickness t5 of the second electrode 146 may be equal to the total thickness t3 of the first electrode 142.
  • the second electrode 146 is disposed on the open region of the transparent conductive layer 130, and may overlap the insulating layer 150 in some regions as shown in FIG. 1. This is because in the process of forming the second electrode 146, forming the second electrode 146 wider than the open area of the transparent conductive layer 130 may prevent light leakage.
  • an insulating layer 150 is disposed in an upper surface direction, and a second electrode 146 made of metal is disposed in an open area of the transparent conductive layer 130. Both the insulating layer 150 and the second electrode 146 act as a reflecting film to reflect light downward in FIG. 1.
  • FIG. 4 is a view showing in detail the structure of the insulating layer.
  • the insulating layer 150 covers the upper portions of the first mesa etching region and the second mesa etching region in the light emitting device 100 of FIG. 1, and an open region is formed to partially expose the transparent conductive layer 130. .
  • the insulating layer 150 may be disposed in both A region, B region, C region, and D region in Table 1 to be described later.
  • the insulating layer 150 is made of an insulating material to prevent electrical contact between the first conductive semiconductor layer 122 and the second conductive semiconductor layer 126, and reflects light emitted from the active layer 124. In order to achieve a highly reflective material, for example, a DBR structure.
  • two materials having different refractive indices may be repeatedly arranged several times to several tens to form a DBR structure.
  • the first layer 150a and the second layer 150b are repeatedly arranged.
  • the first layer 150a and the second layer 150b may be, for example, TiO 2 and SiO 2 or Ta 2 O 5 and SiO 2 .
  • the first layer 150a and the second layer 150b may be alternately disposed three by three.
  • the thickness of the first layer 150a may be 0.70 nanometers to 0.90 nanometers, and more specifically, may be 0.75 nanometers and 0.82 nanometers and 0.75 nanometers, respectively, and the thickness of the second layer 150b may be 0.35 nanometers. Meters to 0.55 nanometers and more specifically 0.50 nanometers and 0.43 nanometers and 0.50 nanometers, respectively.
  • the insulating layer 150 may be disposed on the exposed surface of the first electrode 142 and the light emitting structure 120, and may be opened to expose only a part of the transparent conductive layer 130. Therefore, in the first mesa etching region of FIG. 1, at least a portion of the second conductivity-type semiconductor layer 126, the insulating layer 150, and the second electrode 146 is located outside the region where the light transmissive conductive layer 130 is opened. Overlapping.
  • the light emitting device 100 having the above-described structure reflects light from the first electrode 142, the second electrode 146, and the insulating layer 150 when the light emitted from the active layer 124 is directed upward and sideward in FIG. 1, it may proceed downward in FIG. 1.
  • 5A to 5J are views illustrating a manufacturing process of a light emitting device. Although a plurality of light emitting devices are manufactured in one process on a wafer-level substrate, only one light emitting device is shown in some drawings for convenience of understanding.
  • the light emitting structure 120 and the transparent conductive layer 130 are grown on the substrate 110.
  • the substrate 110 includes a conductive substrate or an insulating substrate, for example, sapphire (Al 2 O 3 ) or SiO 2 , SiC, Si, GaAs, GaN, ZnO, GaP, InP, Ge, Ga 2 0 3 You can use one.
  • a conductive substrate or an insulating substrate for example, sapphire (Al 2 O 3 ) or SiO 2 , SiC, Si, GaAs, GaN, ZnO, GaP, InP, Ge, Ga 2 0 3 You can use one.
  • the lattice mismatch between the light emitting structure 120 made of gallium nitride-based material and the substrate 110 is very large and thermal expansion therebetween Since the coefficient difference is also very large, dislocations, melt-backs, cracks, pits, surface morphology defects, etc., which deteriorate crystallinity may occur, such as AlN or the like.
  • the buffer layer may be formed.
  • the light emitting structure 120 including the first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer may include, for example, metal organic chemical vapor deposition (MOCVD) and chemical vapor deposition (CVD). ), Plasma-Enhanced Chemical Vapor Deposition (PECVD), Molecular Beam Epitaxy (MBE), Hydride Vapor Phase Epitaxy (HVPE), and the like. It does not limit to this.
  • MOCVD metal organic chemical vapor deposition
  • CVD chemical vapor deposition
  • PECVD Plasma-Enhanced Chemical Vapor Deposition
  • MBE Molecular Beam Epitaxy
  • HVPE Hydride Vapor Phase Epitaxy
  • the transparent conductive layer 130 made of ITO may be grown to, for example, a thickness of 40 nanometers.
  • the thickness of the substrate 110 may be several times to several hundred times that of the light emitting structure 120 and the light transmissive conductive layer 130. However, the thickness of the substrate 110 is smaller than the actual thickness for convenience of description. .
  • a portion of the light emitting structure 120 is first etched to partially expose the upper surface of the first conductive semiconductor layer 122.
  • the thickness t6 of the light emitting structure 120 that is primarily etched is about 1 micrometer, and the active layer 124 and the second conductivity-type semiconductor layer 126 may be removed in a region other than the first mesa region. have.
  • a portion of the first conductive semiconductor layer 122 that is first etched and exposed is secondarily etched as illustrated in FIG. 5C, and the thickness of the first conductive semiconductor layer 122 that is removed in the secondary etching process is etched.
  • t7 may be on the order of 2 micrometers.
  • the first conductive semiconductor layer 122 may be exposed on the upper surface of the second mesa region.
  • the first electrode 142 may be formed on the substrate.
  • the composition of the first electrode 142 is as described above, and the first electrode 142 is spaced apart from the side surface of the light emitting structure 120 in the first mesa region, and the insulating layer is described later in the spaced region. 150 may be disposed.
  • the first electrode 142 may be grown to a thickness of 50 nanometers of Ti as an ohmic layer, 50 nanometers and 900 nanometers of Ni / Au as a reflective layer, and 50 nanometers of Ti as a bonding layer, respectively. have.
  • the insulating layer 150 may be grown on the surface of the first electrode 142, the transparent conductive layer 130, and the exposed light emitting structure 120 by deposition or the like.
  • the insulating layer 150 may have the above-described DBR structure and may have a thickness of, for example, 300 nanometers.
  • the insulating layer 150 is formed on the second mesa region.
  • the insulating layer 150 may be disposed on the edge region of the transparent conductive layer 130 on the first mesa region, but may be disposed to expose the central region.
  • the second electrode 146 may be grown in the exposed central region of the transparent conductive layer 130 described above.
  • the second electrode 146 may be disposed to have a thickness of 50 nanometers Ti and 50 nanometers Ni / Au, respectively, as the ohmic layer and 50 nm / 900 nm, respectively.
  • the circuit board 200 is bonded to the light emitting device array to connect the second electrode 146 and the circuit board 200.
  • an anisotropic conductive film (ACF), which will be described later, may be used to electrically couple the second electrode 146 and the circuit board.
  • the first electrode may be disposed below the insulating layer 150.
  • the ACF 210 includes a conductive ball 212 in the substrate 211.
  • the substrate 211 is compressed to emit light from the light emitting device 100 and the circuit board 200.
  • the conductive balls 212 may electrically connect the second electrode 146 of the light emitting device 200 to the circuit board 200.
  • the substrate 110 and the first conductivity-type semiconductor layer 122 are removed.
  • the substrate may be removed by a laser lift off (LLO) method, or may be a dry or wet etching method.
  • LLO laser lift off
  • the laser lift-off method focuses and irradiates excimer laser light having a predetermined wavelength in the direction of the substrate 110, thermal energy is concentrated on the interface between the substrate 110 and the light emitting structure 120. As the interface is separated into gallium and nitrogen molecules, the substrate 110 is instantaneously separated at the portion where the laser light passes.
  • a part of the first conductivity-type semiconductor layer 122 is removed by etching, for example, until the first electrode 142 is exposed, for example, 2 micrometers.
  • the first conductivity type semiconductor layer 122 having a thickness t8 of about 3 micrometers may be removed.
  • the light emitting device array in which the plurality of light emitting devices 100 are connected to the circuit board is completed.
  • the first electrode 142 and the second electrode 146 of the plurality of light emitting devices 100 may be connected to the circuit board 200, respectively.
  • the second electrode 146 of the light emitting device 100 may be connected to the upper circuit board 200 through the ACF 210, and the first electrode 142 may be exposed in the lower direction.
  • the first electrodes 142 of the 200 may be connected to the circuit board 200 by connecting one wire in a lower direction.
  • Such a light emitting device array may have a height of several micrometers excluding a circuit board, a light emitting device may have a horizontal length and a vertical length within 100 micrometers, and may form pixels in various display devices. For example, 400 and 1080 light emitting elements each in the horizontal and vertical directions may form pixels.
  • the entire light emitting device array may implement a light emitting device array capable of bending due to the flexibility of the supporting FPCB.
  • FIG. 6 is a top view of the light emitting device of FIG. 1.
  • This figure shows the scale of each component of the light emitting device of FIG.
  • the longitudinal length W21 and the horizontal length W22 of the insulating layer 150 may be 10 micrometers to 40 micrometers and 10 micrometers to 90 micrometers, respectively, and in detail, 26 micrometers and 73 micrometers. It can be meters.
  • the outer margin of the insulating layer 150 is shown in the vertical margin (a) and the horizontal margin (b), respectively, a and b may be 4.5 micrometers and 2.0 micrometers, respectively.
  • the longitudinal length W11 of the entire area including the above-mentioned margins a and b may be 10 micrometers to 50 micrometers and in detail 30 micrometers, and the horizontal length W12 may be It may be from 10 micrometers to 100 micrometers and specifically 82 micrometers.
  • the length in the longitudinal direction and the length in the horizontal direction may be 10 micrometers to 30 micrometers and 10 micrometers to 70 micrometers, respectively, in detail 20 micrometers and 50 micrometers 6, a portion of the edge region including the insulating layer 150 may be removed in the structure illustrated in FIG. 6.
  • the longitudinal length W31 of the first mesa region may be between 10 micrometers and 20 micrometers and in detail may be 14 micrometers and the transverse length W32 may be between 10 micrometers and 50 micrometers In detail, it may be 30 micrometers, and the shape or size of the first mesa region may be the same as the shape or size of the second electrode.
  • the longitudinal length W41 and the horizontal length W42 of the second mesa region may be greater than the first mesa region and may be 10 micrometers to 30 micrometers and 10 micrometers to 70 micrometers, respectively. Can be 20 micrometers and 50 micrometers.
  • the transparent conductive layer 130 is formed as the second electrode.
  • 146 may be an area in contact with, and the longitudinal length W61 of the above-mentioned area may be from 2 micrometers to 10 micrometers, in particular 6 micrometers, and the horizontal length W62 may be It may be from 10 micrometers to 30 micrometers and specifically 22 micrometers.
  • the longitudinal length W51 of the first electrode 142 may be between 5 micrometers and 20 micrometers and in detail may be 10 micrometers and the longitudinal length W52 may be between 10 micrometers and 40 micrometers. And specifically 27 micrometers.
  • the distance d of the first electrode 142 from the first mesa region may be 2 micrometers to 10 micrometers, and in detail, may be about 7 micrometers.
  • the first electrode 142 may be actually disposed under the insulating layer 150 disposed in the second mesa region, and thus may not be visible in the top view. After the dicing process described above, all edges of the second mesa region may be removed, and the first electrode 142 may be exposed in the lower direction of the insulating layer 150.
  • FIG. 7A and 7B are perspective and side cross-sectional views of the light emitting device of FIG. 1.
  • FIG. 7A and 7B are diagrams for showing light extraction efficiency of the light emitting device according to the composition of the insulating layer described above.
  • A represents an edge of the first mesa region, and the insulating layer and the second electrode are sequentially disposed on the light emitting structure.
  • B is an insulating layer disposed on the light emitting structure to the side of the first mesa region
  • C is an insulating layer disposed on the light emitting structure to the upper surface of the second mesa region
  • D is a light emitting structure to the side of the second mesa region
  • An insulating layer is disposed on the substrate
  • E is an upper region of the light emitting device
  • ACF is disposed as illustrated in FIG. 5H, and F may be disposed in an air downward direction of the light emitting structure.
  • Table 1 shows light emitting efficiency (LEE) when the compositions of A to F are different in FIGS. 7A and 7B.
  • the light emitting device array may form pixels in various display devices as described above, and may also be used as a light source of an illumination device.
  • the FPCB when used as a circuit board, it can be used as a light source of a wearable device such as a smart watch by implementing a light emitting device array that can be bent due to the flexibility of the FPCB.
  • FIG. 8 is a diagram illustrating an embodiment of a smart watch including a light emitting device array.
  • the smart watch 300 may perform pairing with an external digital device, and the external digital device may be a digital device capable of communication connection with the smart watch 300.
  • the illustrated smart phone 400 a notebook computer ( 410, Internet Protocol Television (IPTV) 420, and the like.
  • IPTV Internet Protocol Television
  • the above-described light emitting device array 310 may be used as the light source of the smart watch 300, may be wearable on the wrist due to the flexibility of the FPCB, and fine pixels may be implemented due to the fine size of the light emitting device.
  • the light emitting device according to the embodiment and the light emitting device array including the same may be used in a display device, in particular, a flexible wearable device such as a smart watch.

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JP2017529607A JP6934812B2 (ja) 2014-12-24 2015-12-24 発光素子及びそれを含む発光素子アレイ
CN201580071060.5A CN107112394B (zh) 2014-12-24 2015-12-24 发光二极管和包括发光二极管的发光二极管阵列
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