JP6934812B2 - 発光素子及びそれを含む発光素子アレイ - Google Patents
発光素子及びそれを含む発光素子アレイ Download PDFInfo
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- JP6934812B2 JP6934812B2 JP2017529607A JP2017529607A JP6934812B2 JP 6934812 B2 JP6934812 B2 JP 6934812B2 JP 2017529607 A JP2017529607 A JP 2017529607A JP 2017529607 A JP2017529607 A JP 2017529607A JP 6934812 B2 JP6934812 B2 JP 6934812B2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
- H10H20/8142—Bodies having reflecting means, e.g. semiconductor Bragg reflectors forming resonant cavity structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/034—Manufacture or treatment of coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140187884A KR102322841B1 (ko) | 2014-12-24 | 2014-12-24 | 발광소자 및 이를 포함하는 발광소자 어레이 |
| KR10-2014-0187884 | 2014-12-24 | ||
| PCT/KR2015/014236 WO2016105146A1 (ko) | 2014-12-24 | 2015-12-24 | 발광소자 및 이를 포함하는 발광소자 어레이 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018501650A JP2018501650A (ja) | 2018-01-18 |
| JP2018501650A5 JP2018501650A5 (enExample) | 2019-02-07 |
| JP6934812B2 true JP6934812B2 (ja) | 2021-09-15 |
Family
ID=56151069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017529607A Active JP6934812B2 (ja) | 2014-12-24 | 2015-12-24 | 発光素子及びそれを含む発光素子アレイ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10186640B2 (enExample) |
| EP (1) | EP3240050B1 (enExample) |
| JP (1) | JP6934812B2 (enExample) |
| KR (1) | KR102322841B1 (enExample) |
| CN (1) | CN107112394B (enExample) |
| WO (1) | WO2016105146A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018137139A1 (en) * | 2017-01-24 | 2018-08-02 | Goertek. Inc | Micro-led device, display apparatus and method for manufacturing a micro-led device |
| JP7233859B2 (ja) * | 2017-06-20 | 2023-03-07 | 旭化成エレクトロニクス株式会社 | 赤外線発光ダイオード |
| TWI630729B (zh) * | 2017-08-28 | 2018-07-21 | 友達光電股份有限公司 | 發光裝置 |
| US10515998B2 (en) * | 2017-09-29 | 2019-12-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Metal-insulator-semiconductor-insulator-metal (MISIM) device, method of operation, and memory device including the same |
| US12100696B2 (en) | 2017-11-27 | 2024-09-24 | Seoul Viosys Co., Ltd. | Light emitting diode for display and display apparatus having the same |
| CN108511569B (zh) * | 2018-03-28 | 2019-12-06 | 厦门乾照光电股份有限公司 | 一种led芯片及制作方法 |
| CN111933771B (zh) * | 2018-07-28 | 2023-02-17 | 厦门三安光电有限公司 | 微发光二极管及其显示装置 |
| JP7425618B2 (ja) * | 2020-02-10 | 2024-01-31 | アオイ電子株式会社 | 発光装置の製造方法、および発光装置 |
| CN113066915B (zh) * | 2021-04-27 | 2022-10-11 | 厦门三安光电有限公司 | 一种led芯片及一种半导体发光器件 |
| CN113659050B (zh) * | 2021-08-17 | 2023-07-04 | 天津三安光电有限公司 | 一种发光二极管及其制备方法 |
| CN114651337B (zh) * | 2021-12-10 | 2025-08-19 | 天津三安光电有限公司 | 发光二极管及发光装置 |
| CN114551675B (zh) * | 2021-12-30 | 2025-04-04 | 京东方华灿光电(浙江)有限公司 | 红光微型发光二极管芯片及其制备方法 |
| WO2024005341A1 (ko) * | 2022-06-29 | 2024-01-04 | 삼성전자주식회사 | 발광 다이오드와 기판 간 접속 구조 및 이를 포함하는 디스플레이 모듈 |
| KR102664236B1 (ko) * | 2022-07-21 | 2024-05-08 | 주식회사 엘포톤 | 반도체 발광소자 |
| US20250294928A1 (en) * | 2022-09-19 | 2025-09-18 | Wavelord Co., Ltd | Epitaxial die enabling easy detection of electrical defects, semiconductor light-emitting device using same, and manufacturing methods thereof |
| KR102566048B1 (ko) * | 2022-09-19 | 2023-08-14 | 웨이브로드 주식회사 | 반도체 발광 소자용 에피택시 다이, 이를 포함하는 반도체 발광 소자 및 그 제조 방법 |
| KR102545077B1 (ko) * | 2022-09-19 | 2023-06-21 | 웨이브로드 주식회사 | 반도체 발광 소자용 에피택시 다이, 이를 포함하는 반도체 발광 소자 및 그 제조 방법 |
| KR102867533B1 (ko) * | 2022-12-21 | 2025-10-14 | 엘지전자 주식회사 | 화소용 반도체 발광 소자 및 이를 포함하는 디스플레이 장치 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3129384B2 (ja) * | 1995-02-08 | 2001-01-29 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子 |
| JP4644947B2 (ja) * | 2001-02-05 | 2011-03-09 | 日亜化学工業株式会社 | 窒化物半導体素子及びその製造方法 |
| US6967981B2 (en) * | 2002-05-30 | 2005-11-22 | Xerox Corporation | Nitride based semiconductor structures with highly reflective mirrors |
| JP3993475B2 (ja) * | 2002-06-20 | 2007-10-17 | ローム株式会社 | Ledチップの実装構造、およびこれを備えた画像読み取り装置 |
| KR100891403B1 (ko) * | 2002-08-01 | 2009-04-02 | 니치아 카가쿠 고교 가부시키가이샤 | 반도체 발광 소자 및 그 제조 방법과 그것을 이용한 발광장치 |
| JP2005175212A (ja) * | 2003-12-11 | 2005-06-30 | Lite-On Technology Corp | 発光ダイオード結晶粒子固定方法 |
| JP4632697B2 (ja) * | 2004-06-18 | 2011-02-16 | スタンレー電気株式会社 | 半導体発光素子及びその製造方法 |
| JP2008172040A (ja) * | 2007-01-12 | 2008-07-24 | Sony Corp | 半導体発光素子、半導体発光素子の製造方法、バックライト、ディスプレイおよび電子機器 |
| CN101226981B (zh) * | 2008-01-29 | 2011-05-04 | 中山大学 | 一种半导体发光器件及其制造方法 |
| KR100991939B1 (ko) * | 2008-05-26 | 2010-11-04 | 한국광기술원 | 발광다이오드 및 그의 제조방법 |
| JP5057398B2 (ja) * | 2008-08-05 | 2012-10-24 | シャープ株式会社 | 窒化物半導体発光素子およびその製造方法 |
| JP5286045B2 (ja) * | 2008-11-19 | 2013-09-11 | スタンレー電気株式会社 | 半導体発光素子の製造方法 |
| US8384114B2 (en) | 2009-06-27 | 2013-02-26 | Cooledge Lighting Inc. | High efficiency LEDs and LED lamps |
| JP5101645B2 (ja) * | 2010-02-24 | 2012-12-19 | 株式会社東芝 | 半導体発光装置 |
| JP5356312B2 (ja) * | 2010-05-24 | 2013-12-04 | 株式会社東芝 | 半導体発光装置 |
| KR20110139445A (ko) * | 2010-06-23 | 2011-12-29 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법, 발광 소자 패키지 및 조명 시스템 |
| KR101169036B1 (ko) * | 2010-10-21 | 2012-07-26 | 갤럭시아포토닉스 주식회사 | 전류 저지층을 포함하는 발광 다이오드 및 발광 다이오드 패키지 |
| KR101707532B1 (ko) * | 2010-10-29 | 2017-02-16 | 엘지이노텍 주식회사 | 발광 소자 |
| US9478719B2 (en) * | 2010-11-08 | 2016-10-25 | Bridgelux, Inc. | LED-based light source utilizing asymmetric conductors |
| US8834114B2 (en) | 2011-09-29 | 2014-09-16 | General Electric Company | Turbine drum rotor retrofit |
| KR101412011B1 (ko) * | 2011-12-06 | 2014-06-27 | 엘이디라이텍(주) | 발광소자 어레이 및 이를 포함하는 조명장치 |
| TW201347141A (zh) * | 2012-05-04 | 2013-11-16 | 奇力光電科技股份有限公司 | 發光二極體結構及其製造方法 |
| US20140091330A1 (en) | 2012-10-02 | 2014-04-03 | Helio Optoelectronics Corporation | Led package structure with transparent electrodes |
| KR102087933B1 (ko) * | 2012-11-05 | 2020-04-14 | 엘지이노텍 주식회사 | 발광 소자 및 이를 포함하는 발광 소자 어레이 |
| KR101992366B1 (ko) * | 2012-12-27 | 2019-06-24 | 엘지이노텍 주식회사 | 발광 소자 |
| JP6133076B2 (ja) * | 2013-02-16 | 2017-05-24 | 星和電機株式会社 | 半導体発光素子及び発光装置 |
| CN108400214A (zh) * | 2013-10-11 | 2018-08-14 | 世迈克琉明有限公司 | 半导体发光元件 |
| CN103956419B (zh) * | 2014-04-28 | 2018-01-16 | 深圳大学 | 一种led芯片及其制作方法 |
-
2014
- 2014-12-24 KR KR1020140187884A patent/KR102322841B1/ko active Active
-
2015
- 2015-12-24 JP JP2017529607A patent/JP6934812B2/ja active Active
- 2015-12-24 EP EP15873673.6A patent/EP3240050B1/en active Active
- 2015-12-24 US US15/532,349 patent/US10186640B2/en active Active
- 2015-12-24 CN CN201580071060.5A patent/CN107112394B/zh active Active
- 2015-12-24 WO PCT/KR2015/014236 patent/WO2016105146A1/ko not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN107112394B (zh) | 2020-02-14 |
| JP2018501650A (ja) | 2018-01-18 |
| WO2016105146A1 (ko) | 2016-06-30 |
| KR102322841B1 (ko) | 2021-11-08 |
| EP3240050A1 (en) | 2017-11-01 |
| KR20160077686A (ko) | 2016-07-04 |
| EP3240050B1 (en) | 2021-05-19 |
| CN107112394A (zh) | 2017-08-29 |
| EP3240050A4 (en) | 2017-11-01 |
| US10186640B2 (en) | 2019-01-22 |
| US20170338380A1 (en) | 2017-11-23 |
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