JP6934812B2 - 発光素子及びそれを含む発光素子アレイ - Google Patents

発光素子及びそれを含む発光素子アレイ Download PDF

Info

Publication number
JP6934812B2
JP6934812B2 JP2017529607A JP2017529607A JP6934812B2 JP 6934812 B2 JP6934812 B2 JP 6934812B2 JP 2017529607 A JP2017529607 A JP 2017529607A JP 2017529607 A JP2017529607 A JP 2017529607A JP 6934812 B2 JP6934812 B2 JP 6934812B2
Authority
JP
Japan
Prior art keywords
layer
electrode
light emitting
semiconductor layer
conductive semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017529607A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018501650A (ja
JP2018501650A5 (enExample
Inventor
イ,コンファ
チェ,ビョンキョン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Innotek Co Ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of JP2018501650A publication Critical patent/JP2018501650A/ja
Publication of JP2018501650A5 publication Critical patent/JP2018501650A5/ja
Application granted granted Critical
Publication of JP6934812B2 publication Critical patent/JP6934812B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841Reflective coatings, e.g. dielectric Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/814Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/814Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • H10H20/8142Bodies having reflecting means, e.g. semiconductor Bragg reflectors forming resonant cavity structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8314Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/832Electrodes characterised by their material
    • H10H20/835Reflective materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/032Manufacture or treatment of electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/034Manufacture or treatment of coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0364Manufacture or treatment of packages of interconnections
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2017529607A 2014-12-24 2015-12-24 発光素子及びそれを含む発光素子アレイ Active JP6934812B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020140187884A KR102322841B1 (ko) 2014-12-24 2014-12-24 발광소자 및 이를 포함하는 발광소자 어레이
KR10-2014-0187884 2014-12-24
PCT/KR2015/014236 WO2016105146A1 (ko) 2014-12-24 2015-12-24 발광소자 및 이를 포함하는 발광소자 어레이

Publications (3)

Publication Number Publication Date
JP2018501650A JP2018501650A (ja) 2018-01-18
JP2018501650A5 JP2018501650A5 (enExample) 2019-02-07
JP6934812B2 true JP6934812B2 (ja) 2021-09-15

Family

ID=56151069

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017529607A Active JP6934812B2 (ja) 2014-12-24 2015-12-24 発光素子及びそれを含む発光素子アレイ

Country Status (6)

Country Link
US (1) US10186640B2 (enExample)
EP (1) EP3240050B1 (enExample)
JP (1) JP6934812B2 (enExample)
KR (1) KR102322841B1 (enExample)
CN (1) CN107112394B (enExample)
WO (1) WO2016105146A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018137139A1 (en) * 2017-01-24 2018-08-02 Goertek. Inc Micro-led device, display apparatus and method for manufacturing a micro-led device
JP7233859B2 (ja) * 2017-06-20 2023-03-07 旭化成エレクトロニクス株式会社 赤外線発光ダイオード
TWI630729B (zh) * 2017-08-28 2018-07-21 友達光電股份有限公司 發光裝置
US10515998B2 (en) * 2017-09-29 2019-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. Metal-insulator-semiconductor-insulator-metal (MISIM) device, method of operation, and memory device including the same
US12100696B2 (en) 2017-11-27 2024-09-24 Seoul Viosys Co., Ltd. Light emitting diode for display and display apparatus having the same
CN108511569B (zh) * 2018-03-28 2019-12-06 厦门乾照光电股份有限公司 一种led芯片及制作方法
CN111933771B (zh) * 2018-07-28 2023-02-17 厦门三安光电有限公司 微发光二极管及其显示装置
JP7425618B2 (ja) * 2020-02-10 2024-01-31 アオイ電子株式会社 発光装置の製造方法、および発光装置
CN113066915B (zh) * 2021-04-27 2022-10-11 厦门三安光电有限公司 一种led芯片及一种半导体发光器件
CN113659050B (zh) * 2021-08-17 2023-07-04 天津三安光电有限公司 一种发光二极管及其制备方法
CN114651337B (zh) * 2021-12-10 2025-08-19 天津三安光电有限公司 发光二极管及发光装置
CN114551675B (zh) * 2021-12-30 2025-04-04 京东方华灿光电(浙江)有限公司 红光微型发光二极管芯片及其制备方法
WO2024005341A1 (ko) * 2022-06-29 2024-01-04 삼성전자주식회사 발광 다이오드와 기판 간 접속 구조 및 이를 포함하는 디스플레이 모듈
KR102664236B1 (ko) * 2022-07-21 2024-05-08 주식회사 엘포톤 반도체 발광소자
US20250294928A1 (en) * 2022-09-19 2025-09-18 Wavelord Co., Ltd Epitaxial die enabling easy detection of electrical defects, semiconductor light-emitting device using same, and manufacturing methods thereof
KR102566048B1 (ko) * 2022-09-19 2023-08-14 웨이브로드 주식회사 반도체 발광 소자용 에피택시 다이, 이를 포함하는 반도체 발광 소자 및 그 제조 방법
KR102545077B1 (ko) * 2022-09-19 2023-06-21 웨이브로드 주식회사 반도체 발광 소자용 에피택시 다이, 이를 포함하는 반도체 발광 소자 및 그 제조 방법
KR102867533B1 (ko) * 2022-12-21 2025-10-14 엘지전자 주식회사 화소용 반도체 발광 소자 및 이를 포함하는 디스플레이 장치

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3129384B2 (ja) * 1995-02-08 2001-01-29 日亜化学工業株式会社 窒化物半導体レーザ素子
JP4644947B2 (ja) * 2001-02-05 2011-03-09 日亜化学工業株式会社 窒化物半導体素子及びその製造方法
US6967981B2 (en) * 2002-05-30 2005-11-22 Xerox Corporation Nitride based semiconductor structures with highly reflective mirrors
JP3993475B2 (ja) * 2002-06-20 2007-10-17 ローム株式会社 Ledチップの実装構造、およびこれを備えた画像読み取り装置
KR100891403B1 (ko) * 2002-08-01 2009-04-02 니치아 카가쿠 고교 가부시키가이샤 반도체 발광 소자 및 그 제조 방법과 그것을 이용한 발광장치
JP2005175212A (ja) * 2003-12-11 2005-06-30 Lite-On Technology Corp 発光ダイオード結晶粒子固定方法
JP4632697B2 (ja) * 2004-06-18 2011-02-16 スタンレー電気株式会社 半導体発光素子及びその製造方法
JP2008172040A (ja) * 2007-01-12 2008-07-24 Sony Corp 半導体発光素子、半導体発光素子の製造方法、バックライト、ディスプレイおよび電子機器
CN101226981B (zh) * 2008-01-29 2011-05-04 中山大学 一种半导体发光器件及其制造方法
KR100991939B1 (ko) * 2008-05-26 2010-11-04 한국광기술원 발광다이오드 및 그의 제조방법
JP5057398B2 (ja) * 2008-08-05 2012-10-24 シャープ株式会社 窒化物半導体発光素子およびその製造方法
JP5286045B2 (ja) * 2008-11-19 2013-09-11 スタンレー電気株式会社 半導体発光素子の製造方法
US8384114B2 (en) 2009-06-27 2013-02-26 Cooledge Lighting Inc. High efficiency LEDs and LED lamps
JP5101645B2 (ja) * 2010-02-24 2012-12-19 株式会社東芝 半導体発光装置
JP5356312B2 (ja) * 2010-05-24 2013-12-04 株式会社東芝 半導体発光装置
KR20110139445A (ko) * 2010-06-23 2011-12-29 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법, 발광 소자 패키지 및 조명 시스템
KR101169036B1 (ko) * 2010-10-21 2012-07-26 갤럭시아포토닉스 주식회사 전류 저지층을 포함하는 발광 다이오드 및 발광 다이오드 패키지
KR101707532B1 (ko) * 2010-10-29 2017-02-16 엘지이노텍 주식회사 발광 소자
US9478719B2 (en) * 2010-11-08 2016-10-25 Bridgelux, Inc. LED-based light source utilizing asymmetric conductors
US8834114B2 (en) 2011-09-29 2014-09-16 General Electric Company Turbine drum rotor retrofit
KR101412011B1 (ko) * 2011-12-06 2014-06-27 엘이디라이텍(주) 발광소자 어레이 및 이를 포함하는 조명장치
TW201347141A (zh) * 2012-05-04 2013-11-16 奇力光電科技股份有限公司 發光二極體結構及其製造方法
US20140091330A1 (en) 2012-10-02 2014-04-03 Helio Optoelectronics Corporation Led package structure with transparent electrodes
KR102087933B1 (ko) * 2012-11-05 2020-04-14 엘지이노텍 주식회사 발광 소자 및 이를 포함하는 발광 소자 어레이
KR101992366B1 (ko) * 2012-12-27 2019-06-24 엘지이노텍 주식회사 발광 소자
JP6133076B2 (ja) * 2013-02-16 2017-05-24 星和電機株式会社 半導体発光素子及び発光装置
CN108400214A (zh) * 2013-10-11 2018-08-14 世迈克琉明有限公司 半导体发光元件
CN103956419B (zh) * 2014-04-28 2018-01-16 深圳大学 一种led芯片及其制作方法

Also Published As

Publication number Publication date
CN107112394B (zh) 2020-02-14
JP2018501650A (ja) 2018-01-18
WO2016105146A1 (ko) 2016-06-30
KR102322841B1 (ko) 2021-11-08
EP3240050A1 (en) 2017-11-01
KR20160077686A (ko) 2016-07-04
EP3240050B1 (en) 2021-05-19
CN107112394A (zh) 2017-08-29
EP3240050A4 (en) 2017-11-01
US10186640B2 (en) 2019-01-22
US20170338380A1 (en) 2017-11-23

Similar Documents

Publication Publication Date Title
JP6934812B2 (ja) 発光素子及びそれを含む発光素子アレイ
KR102322842B1 (ko) 발광 소자 어레이
CN102097561B (zh) 半导体发光设备及其制造方法
US20130015465A1 (en) Nitride semiconductor light-emitting device
KR101047720B1 (ko) 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
CN110494992B (zh) 半导体器件以及包括该半导体器件的发光器件封装
JP2016092411A (ja) 発光素子
US11329204B2 (en) Micro light emitting diode and manufacturing method of micro light emitting diode
KR101747349B1 (ko) 반도체 발광소자
KR101081129B1 (ko) 발광소자 및 그 제조방법
US20080265272A1 (en) Light Emitting Device Having Zener Diode Therein And Method Of Fabricating The Same
KR102294318B1 (ko) 발광 소자 및 이를 포함하는 발광 소자 어레이
KR101158077B1 (ko) 고효율 발광 다이오드 및 그것을 제조하는 방법
KR102427280B1 (ko) 발광소자 및 이를 포함하는 발광소자 어레이 모듈
KR100631970B1 (ko) 플립칩용 질화물 반도체 발광소자
KR20140019521A (ko) 발광소자
KR100730752B1 (ko) 초격자층을 갖는 화합물 반도체, 이를 이용한 발광 다이오드 및 이의 제조 방법
KR102462717B1 (ko) 발광소자
KR20140131695A (ko) 질화물 반도체 발광소자 및 그 제조방법
KR102404760B1 (ko) 발광소자
JP2012142626A (ja) 発光素子及び発光素子の製造方法
KR20120015882A (ko) 발광소자 패키지
KR20160055494A (ko) 발광소자 및 조명시스템
KR20120033294A (ko) 고효율 발광 다이오드 및 그것을 제조하는 방법
KR20120022092A (ko) 발광소자, 발광소자 제조방법, 발광소자 패키지 및 조명 시스템

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170626

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181220

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20181220

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191225

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200204

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20200428

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200501

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201020

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210120

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210803

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210824

R150 Certificate of patent or registration of utility model

Ref document number: 6934812

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250