WO2016082354A1 - 有机电致发光器件及其制备方法、显示装置 - Google Patents

有机电致发光器件及其制备方法、显示装置 Download PDF

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Publication number
WO2016082354A1
WO2016082354A1 PCT/CN2015/073014 CN2015073014W WO2016082354A1 WO 2016082354 A1 WO2016082354 A1 WO 2016082354A1 CN 2015073014 W CN2015073014 W CN 2015073014W WO 2016082354 A1 WO2016082354 A1 WO 2016082354A1
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Prior art keywords
trace
organic electroluminescent
layer
peripheral
substrate
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PCT/CN2015/073014
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English (en)
French (fr)
Inventor
藤野诚治
黄国东
曾庆慧
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/786,036 priority Critical patent/US9608230B2/en
Priority to EP15763809.9A priority patent/EP3226321B1/en
Publication of WO2016082354A1 publication Critical patent/WO2016082354A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/302—Details of OLEDs of OLED structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Embodiments of the present invention relate to an organic electroluminescent device, a method of fabricating the same, and a display device.
  • organic electroluminescent devices are an important structure for achieving flexible display.
  • the organic electroluminescent device includes a substrate substrate 01, a buffer layer 02, a thin film transistor switching TFT trace located in the effective display region, and a peripheral trace located in the non-display region.
  • an organic electroluminescent structure 04 formed in the effective display region, a package substrate 06, an oxidation preventing structure 05 formed between the package substrate 06 and the organic electroluminescent structure 04, and a peripheral routing structure having a peripheral trace 031
  • the soldering portion 032 and the connecting circuit trace 033 connecting the soldering portion 032 and the peripheral wiring 031, and the soldering end 08 of the flexible circuit board 07 are soldered to the soldering portion 032 to realize electrical connection between the flexible circuit board 07 and the peripheral wiring 031.
  • the soldering end 08 of the flexible circuit board 07 is soldered to the side of the soldering portion 032 away from the base substrate 01, so the flexible circuit board 07 needs to be bent to the side of the base substrate 01 facing away from the package substrate 06. Further, the side of the organic electroluminescent device opposite to the flexible circuit board 07 needs to reserve the bending width of the flexible circuit board 07, as shown in FIG. 1, which results in a wider frame width of the organic electroluminescent device. Big.
  • An embodiment of the invention provides an organic electroluminescent device comprising a substrate substrate, a package structure, an organic electroluminescent structure between the substrate substrate and the package structure, and a flexible circuit board;
  • the base substrate is provided with a peripheral routing structure electrically connected to an internal trace of the organic electroluminescent structure;
  • the peripheral routing structure includes a soldering portion, wherein the soldering portion has a first surface facing the substrate substrate At least a portion of the first surface is exposed to electrically engage a solder terminal of the flexible circuit board.
  • Another embodiment of the present invention provides a display device including the above organic electroluminescent device.
  • a further embodiment of the present invention provides a method of fabricating the above organic electroluminescent device, comprising:
  • peripheral trace structure and an organic electroluminescent structure on the base substrate, and mating the package structure with the base substrate package, wherein the peripheral routing structure has a soldering portion;
  • a solder terminal of the flexible circuit board is inserted into the recess, and the solder terminal of the flexible circuit board is soldered to the solder portion.
  • FIG. 1 is a schematic structural view of an organic electroluminescent device in the related art
  • FIG. 2 is a schematic view showing the distribution of a peripheral wiring structure and a flexible circuit board in the organic electroluminescent device of the structure shown in FIG. 1;
  • FIG. 3 is a schematic structural view of an organic electroluminescent device according to a first embodiment of the present invention.
  • FIG. 4a is a schematic structural view of an organic electroluminescent device according to a second embodiment of the present invention.
  • FIG. 4b is a schematic view showing the distribution of traces in the second trace layer in the organic electroluminescent device of the structure shown in FIG. 4a;
  • 4c is a schematic view showing the distribution of traces in the first trace layer in the organic electroluminescent device of the structure shown in FIG. 4a;
  • FIG. 5a is a schematic structural diagram of an organic electroluminescent device according to a third embodiment of the present invention.
  • Figure 5b is a schematic view showing the distribution of traces in the second wiring layer in the organic electroluminescent device of the structure shown in Figure 5a;
  • Figure 5c is a schematic view showing the distribution of traces in the first trace layer in the organic electroluminescent device of the structure shown in Figure 5a;
  • 6a is a schematic structural view of an organic electroluminescent device according to a fourth embodiment of the present invention.
  • 6b is a schematic view showing the distribution of traces in the fifth trace layer in the organic electroluminescent device of the structure shown in FIG. 6a;
  • 6c is a schematic view showing the distribution of traces in the fourth trace layer in the organic electroluminescent device of the structure shown in FIG. 6a;
  • Fig. 6d is a schematic view showing the distribution of traces in the third wiring layer in the organic electroluminescent device of the structure shown in Fig. 6a.
  • Embodiments of the present invention provide an organic electroluminescence device, a preparation method thereof, and a display device.
  • the bezel in the organic electroluminescent device does not need to reserve space for the bending of the flexible circuit board, thereby enabling the frame width of the organic electroluminescent device to be reduced.
  • an organic electroluminescent device includes a substrate substrate 1, a package structure 7, an organic electroluminescent structure 5 between the substrate substrate 1 and the package structure 7, and flexibility.
  • a circuit board FPC 4 ; the base substrate 1 is provided with a peripheral wiring structure 3 electrically connected to the internal wiring of the organic electroluminescent structure 5; the peripheral wiring structure 3 includes a soldering portion 32; and the substrate substrate 1 is provided with an opening on the substrate
  • the substrate 1 faces away from the surface of the organic electroluminescent structure 5 to expose the depressed portion of the solder portion 32, and the solder terminal 41 of the FPC 4 is located in the recess and is soldered to the solder portion 32.
  • the base substrate 1 is provided with a recess in which the surface of the base substrate 1 faces away from the surface of the organic electroluminescent structure 5 to expose the solder portion 32, and the solder terminal 41 of the flexible circuit board 4 is directly lining
  • the side of the base substrate 1 facing away from the organic electroluminescent structure 5 extends into the recess and is soldered to the soldering portion 32 to realize electrical connection between the flexible circuit board 4 and the peripheral wiring structure 3; therefore, the flexible circuit board 4 does not need the self-welding portion 32.
  • the side facing away from the base substrate 1 is bent to the side of the base substrate 1 facing away from the organic electroluminescent structure 5, and the bent space of the flexible circuit board 4 is not required to be reserved at the frame of the organic electroluminescent device, so that it can be reduced The border width of the small organic electroluminescent device.
  • the package structure 7 may be a package substrate, a buffer layer 2 is disposed between the substrate substrate 1 and the peripheral trace structure 3 , and the organic electroluminescent structure 5 and the package structure 7 are
  • the cavity 6 is formed therebetween, and the cavity can be filled with nitrogen gas, an inert gas, a resin, a desiccant or the like to improve the barrier property against water oxygen and the like.
  • the above substrate substrate 1 may be a flexible substrate substrate, and at the same time, the package structure 7 is a flexible package film, so that the organic electroluminescent device forms a flexible display device.
  • the base substrate may be a PI film having a carrier structure, and the package structure 7 may be a package film formed by overlapping a plurality of organic thin films and inorganic thin films.
  • the peripheral routing structure 3 further includes a peripheral trace 31 that is directly electrically coupled to the internal traces of the organic electroluminescent structure 5, a diffusion circuit trace that connects the solder portion 32 and the peripheral traces 31.
  • a second embodiment of the present invention provides an organic electroluminescent device, as shown in Figures 4a-4c.
  • 4a is a schematic structural view of an organic electroluminescent device according to a second embodiment of the present invention
  • FIG. 4b is a schematic diagram of a trace distribution in a second trace layer of the organic electroluminescent device of the structure shown in FIG. 4a
  • Fig. 4a is a schematic view showing the distribution of traces in the first wiring layer in the organic electroluminescent device of the structure shown in Fig. 4a.
  • the substrate substrate 1, the package structure 7, the organic electroluminescent structure 5 located between the substrate substrate 1 and the package structure 7, and the flexible circuit board FPC 4 are similar. It is set in the first embodiment and will not be described here.
  • differences between the organic electroluminescent device provided in the second embodiment and the organic electroluminescent device provided in the first embodiment will be described in detail.
  • the peripheral wiring structure 3 is disposed in two layers, that is, the first wiring layer 34 and the second wiring layer 33.
  • the first trace layer 34 is located between the second trace layer 33 and the base substrate 1.
  • An insulating layer 8 is disposed between the first trace layer 34 and the second trace layer 33; as shown in FIG. 4c,
  • the first portion of the solder portion 32, the diffusion circuit traces, and the peripheral traces are formed on the first trace layer 34; the second portion of the peripheral traces and the contact portions are disposed on the second trace layer 33.
  • the peripheral wiring structure 3 disposed on the first wiring layer 34 and the peripheral wiring structure 3 disposed on the second wiring layer 33 are electrically connected through the contact portion.
  • the electric shock portion includes a contact portion 331, a contact portion 332, and a contact portion 333.
  • the first portion of the perimeter trace includes perimeter traces 341, 342, and 343; the second portion of the perimeter trace includes perimeter trace 334.
  • the contact portion 331 in the second wiring layer 33 is electrically connected to the trace 341 in the first wiring layer 34, and the contact portion 332 in the second wiring layer 33 and the trace in the first wiring layer 34 342 is electrically connected, the contact portion 333 in the second wiring layer 33 is electrically connected to the trace 343 in the first wiring layer 34, and the flexible circuit board 4 transmits an electrical signal to the second wiring layer 33 through the soldering portion 32.
  • the inner perimeter is 334.
  • the soldering portion 32 in the peripheral wiring structure 3 of the organic electroluminescent device is used. It is disposed in the first wiring layer 34, thereby further reducing the size occupied by the soldering portion 32 on the frame width of the organic electroluminescent device, thereby further reducing the frame of the organic electroluminescent device.
  • the organic electroluminescent device provided by the second embodiment can be manufactured by first forming a buffer layer 2 made of an insulating material on the base substrate 1, forming a peripheral wiring structure 3 on the buffer layer 2, and an organic electroluminescent structure. 5. Then, the package structure 7 is packaged with the base substrate 1, and then a substrate facing substrate substrate 1 facing away from the organic electroluminescent structure 5 is processed by a laser process to form a depressed portion, and then the flexible portion is formed. The soldering terminal 41 of the circuit board 4 is soldered to the soldering portion 32 of the peripheral wiring structure 3.
  • the solder portion 32 may be located in the middle of the first wiring layer 34.
  • a third embodiment of the present invention provides an organic electroluminescent device, as shown in Figures 5a-5c.
  • 5a is a schematic structural view of an organic electroluminescent device according to a third embodiment of the present invention
  • FIG. 5b is a schematic diagram of a trace distribution in a second trace layer of the organic electroluminescent device of the structure shown in FIG. 5a
  • Fig. 5a is a schematic view showing the distribution of traces in the first wiring layer in the organic electroluminescent device of the structure shown in Fig. 5a.
  • the substrate substrate 1, the package structure 7, the organic electroluminescent structure 5 located between the substrate substrate 1 and the package structure 7, and the flexible circuit board FPC 4 are similar. It is set in the first embodiment and will not be described here.
  • the difference between the organic electroluminescent device provided in the third embodiment and the organic electroluminescent device provided in the first embodiment will be described in detail.
  • the peripheral trace structure 3 is disposed in two layers, that is, the first trace layer 35 and the second trace layer 36, wherein A trace layer 35 is located between the second trace layer 36 and the substrate 1;
  • the soldering portion 32 is formed on the first wiring layer 35, and the second wiring layer 36 is provided with a contact portion, and the peripheral routing structure on the first wiring layer 35 and the second wiring layer 36.
  • the upper peripheral trace structures are electrically connected through the contact portions; in the peripheral trace structure 3, as shown in FIG. 5c, the diffusion circuit traces are disposed on the first trace layer 35, and at least a portion of the peripheral traces are disposed on a first trace layer 35; as shown in FIG. 5b, the second trace layer 36 is provided with a contact portion electrically connected to the first portion of the peripheral trace disposed on the first trace layer, and is organically A contact portion electrically connected to the wiring within the light emitting structure.
  • the diffusion circuit trace includes a diffusion circuit trace 3511 and a diffusion circuit as shown in FIG. 5c.
  • the first portion of the peripheral trace disposed at the first trace layer 35 includes a peripheral trace 352, a peripheral trace 353, and a peripheral trace 354; as shown in FIG. 5b, disposed in the second pass
  • the contact portion of the wire layer 36 includes a contact portion 361, a contact portion 362, a contact portion 363, a contact portion 364, and a second portion 3611 of the peripheral trace is disposed on the second trace layer 36;
  • the solder portion 32 is, for example
  • An integrated circuit 351 is provided, and:
  • the diffusion circuit trace 3511 is electrically connected to the integrated circuit 351 provided in the soldering portion 32, and is electrically connected to the contact portion 361.
  • the contact portion 361 is electrically connected to the peripheral trace 3611 disposed in the second trace layer 36. Electrically connecting to internal wiring of the organic electroluminescent structure 5;
  • the diffusion circuit trace 3512 is electrically connected to the integrated circuit 351 provided in the soldering portion 32 and electrically connected to the peripheral trace 352.
  • the peripheral trace 352 is electrically connected to the contact portion 362 disposed in the second trace layer 36 to realize Electrically connecting to internal wiring of the organic electroluminescent structure 5;
  • the diffusion circuit trace 3513 is electrically connected to the integrated circuit 351 provided in the soldering portion 32 and electrically connected to the peripheral trace 353; the peripheral trace 353 is electrically connected to the contact portion 363 disposed in the second trace layer 36 to realize Electrically connecting to internal wiring of the organic electroluminescent structure 5;
  • the diffusion circuit trace 3514 is electrically connected to the integrated circuit 351 provided in the soldering portion 32 and electrically connected to the peripheral trace 354.
  • the peripheral trace 354 is electrically connected to the contact portion 364 disposed in the second trace layer 36 to realize Electrically connected to the traces within the organic electroluminescent structure 5.
  • the diffusion circuit trace and at least a portion of the peripheral traces are prepared in the first trace layer 35, thereby enabling the diffusion circuit to be traced and disposed in the first trace layer 35.
  • the width of the peripheral traces does not occupy the size around the effective display area in the organic electroluminescent device, thereby further reducing the width of the corresponding bezel in the organic electroluminescent device.
  • an insulating layer 9 is disposed between the first wiring layer 35 and the second wiring layer 36, and the insulating layer 9 is provided corresponding to the contact portion provided by the second wiring layer 36.
  • a portion of the peripheral wiring structure disposed on the first wiring layer 35 corresponding to the contact portion is electrically connected to the contact portion through the insulating layer 9 through a via region of the insulating layer.
  • the solder portion 32 may be located in the middle of the first wiring layer 35.
  • FIG. 6a is a schematic structural view of an organic electroluminescent device according to a fourth embodiment of the present invention
  • 6c is a schematic diagram of the distribution of traces in the fourth trace layer in the organic electroluminescent device of the structure shown in FIG. 6a
  • FIG. 6d is a trace in the third trace layer of the organic electroluminescent device of the structure shown in FIG. 6a; Distribution diagram.
  • the substrate substrate 1, the package structure 7, the organic electroluminescent structure 5 located between the substrate substrate 1 and the package structure 7, and the flexible circuit board FPC 4 are similar. It is set in the first embodiment and will not be described here. Hereinafter, the difference between the organic electroluminescent device provided in the third embodiment and the organic electroluminescent device provided in the first embodiment will be described in detail.
  • the peripheral wiring structure 3 may be disposed in three layers, that is, the third wiring layer 39 and the fourth layer which are sequentially arranged along the substrate substrate 1 in the direction of the organic electroluminescent structure 5. a trace layer 37 and a fifth trace layer 38, wherein:
  • soldering portion 32 is disposed on the third trace layer 39;
  • the diffusion circuit traces and the peripheral traces are disposed on the fourth trace layer 37, and the fourth trace layer 37 is further provided with a contact portion electrically connected to the third trace layer 39;
  • the fourth wiring layer 37 is provided with a diffusion circuit trace 3711, a diffusion circuit trace 3721, a diffusion circuit trace 3731, a diffusion circuit trace 3741, a peripheral trace 371, a peripheral trace 372, and a peripheral trace 373.
  • a contact portion electrically connected to the peripheral trace and electrically connected to the internal trace of the organic electroluminescent structure 5 is disposed in the fifth trace layer 38; the electric shock portion is as shown in FIG. 6b.
  • the contact portion 381, the contact portion 382, the contact portion 383, and the contact portion 384 are included.
  • the diffusion circuit traces, the peripheral traces, and the soldering portions in the peripheral trace structure 3 are disposed between the organic electroluminescent structure 5 and the base substrate 1, and thus, the peripheral traces are The diffusion circuit traces, the peripheral traces, and the soldered portions in the structure 3 do not occupy the size of the periphery of the effective display region, so that the width of the bezel in the organic electroluminescent device can be further reduced.
  • An insulating layer 10 is disposed between the third wiring layer 39 and the fourth wiring layer 37, and the peripheral routing structure disposed on the third wiring layer 39 and the contact portion provided by the fourth wiring layer 37 are worn.
  • the insulating layer 10 is electrically connected to the contact portion provided by the fourth wiring layer 37;
  • An insulating layer 11 is disposed between the fourth wiring layer 37 and the fifth wiring layer 38, and the peripheral wiring structure disposed on the fourth wiring layer 37 and the contact portion on the fifth wiring layer 38 are worn.
  • the insulating layer 11 is electrically connected to the contact portion provided by the fifth wiring layer 38.
  • the solder portion 32 may be located in the middle of the third wiring layer 39.
  • the embodiment of the invention further provides a display device comprising the organic electroluminescent device provided by any one of the above embodiments.
  • Another embodiment of the present invention provides a method for fabricating an organic electroluminescent device according to any of the above embodiments, comprising:
  • peripheral trace structure and an organic electroluminescent structure on the base substrate, and mating the package structure with the base substrate package, wherein the peripheral routing structure has a soldering portion;
  • the soldering terminal of the flexible circuit board is inserted into the recessed portion, and the soldering terminal of the flexible circuit board is soldered to the soldering portion.
  • the method before forming the peripheral trace structure and the organic electroluminescent structure on the base substrate and mating the package structure with the base substrate package, the method further includes:
  • Forming an opening on the base substrate before the base substrate faces away from the side surface of the organic electroluminescent structure to expose the recess of the soldering portion further includes:
  • peripheral wiring structure and the organic electroluminescence structure are formed on the base substrate, and the structure after the package structure is mated with the base substrate package is peeled off from the glass substrate.
  • An organic electroluminescence device comprising a substrate substrate, a package structure, an organic electroluminescence structure between the substrate substrate and the package structure, and a flexible circuit board; the base substrate Providing a peripheral routing structure electrically connected to an internal trace of the organic electroluminescent structure; the peripheral routing structure includes a soldering portion, wherein the soldering portion has a first surface facing the substrate substrate, At least a portion of the first surface is exposed to electrically engage the solder terminals of the flexible circuit board.
  • peripheral wiring structure further comprises a peripheral trace electrically connected to an internal trace of the organic electroluminescent structure, and a connection
  • the soldering portion and the diffusion circuit of the peripheral trace are routed, the peripheral trace structure is divided into a first trace layer and a second trace layer, and the first trace layer is located at the second trace Between the layer and the substrate; the soldering portion is disposed on the first wiring layer.
  • the organic electroluminescent device according to any one of (3) to (5), wherein an insulating layer is provided between the first wiring layer and the second wiring layer, The insulating layer is provided with a via area corresponding to the contact portion on the second trace layer, and the peripheral trace structure disposed on the first trace layer and the portion corresponding to the contact portion pass The via region is electrically connected to the contact portion through the insulating layer.
  • the organic electroluminescent device according to any one of (3) to (6), wherein the soldering portion is located in a middle portion of the first wiring layer.
  • peripheral wiring structure further comprises a peripheral trace electrically connected to an internal trace of the organic electroluminescent structure, and a connection
  • the soldering portion and the diffusion circuit of the peripheral trace are routed, and the peripheral trace structure is divided into a third trace layer and a fourth layer which are sequentially arranged along the base substrate toward the organic electroluminescent structure.
  • the trace layer and the fifth trace layer where:
  • the soldering portion is disposed on the third wiring layer
  • the diffusion circuit trace and the peripheral trace are disposed on the fourth trace layer, and the fourth trace layer is provided with a contact portion electrically connected to the third trace layer;
  • the fifth wiring layer is electrically connected to the peripheral trace, and the organic electroluminescence
  • the internal wiring of the structure is electrically connected to the contact portion.
  • An insulating layer is disposed between the fourth wiring layer and the fifth wiring layer, and the peripheral routing structure disposed on the fourth wiring layer and the contact on the fifth wiring layer The corresponding portion of the portion is electrically connected to the contact portion provided by the fifth wiring layer through the insulating layer.
  • the organic electroluminescent device according to any one of (1) to (10), wherein the substrate substrate is a flexible substrate substrate, and the package structure is a flexible package structure.
  • a display device comprising the organic electroluminescent device according to any one of (1) to (13).
  • peripheral trace structure and an organic electroluminescent structure on the base substrate, and mating the package structure with the base substrate package, wherein the peripheral routing structure has a soldering portion;
  • a solder terminal of the flexible circuit board is inserted into the recess, and the solder terminal of the flexible circuit board is soldered to the solder portion.
  • the forming the peripheral trace structure and the organic electroluminescent structure on the base substrate and combining the package structure with the base substrate package further includes:
  • the forming an opening on the substrate substrate before the substrate substrate faces away from the surface of the organic electroluminescent structure to expose the recess of the soldering portion further includes:
  • peripheral wiring structure and the organic electroluminescence structure are formed on the base substrate, and the structure after the package structure is mated with the base substrate package is peeled off from the glass substrate.

Abstract

一种有机电致发光器件及其制备方法、显示装置。有机电致发光器件包括衬底基板（1）、封装结构（7）、位于衬底基板（1）和封装结构（7）之间的有机电致发光结构（5）、以及柔性电路板（4）。衬底基板（1）设有与有机电致发光结构（5）的内部走线电连接的周边走线结构（3）。周边走线结构（3）包括焊接部（32）。焊接部（32）具有面向衬底基板（1）的第一表面，第一表面的至少一部分露出以与柔性电路板（4）的焊接端子电性接合。

Description

有机电致发光器件及其制备方法、显示装置 技术领域
本发明实施例涉及有机电致发光器件及其制备方法、显示装置。
背景技术
在显示技术领域，有机电致发光器件是实现柔性显示的一种重要结构。
与其他显示装置相同，有机电致发光器件的窄边框设计也是本领域技术人员研究的一个重要方向。
在相关技术中，如图1和图2所示，有机电致发光器件包括衬底基板01、缓冲层02、位于有效显示区域内的薄膜晶体管开关TFT走线、位于非显示区域的周边走线结构、形成于有效显示区域内的有机电致发光结构04、封装基板06、形成于封装基板06与有机电致发光结构04之间的防氧化结构05，周边走线结构具有周边走线031、焊接部032以及连接焊接部032与周边走线031的连接电路走线033，柔性电路板07的焊接端08焊接于焊接部032上，以实现柔性电路板07与周边走线031的电连接。
但是，在此相关技术中，柔性电路板07的焊接端08焊接于焊接部032背离衬底基板01的一侧，因此柔性电路板07需要弯转至衬底基板01背离封装基板06的一侧，进而导致有机电致发光器件与柔性电路板07相对的侧边需要预留出柔性电路板07的弯转宽度，如图1中所示宽度D，进而导致有机电致发光器件的边框宽度较大。
发明内容
本发明的一实施例提供一种有机电致发光器件，包括衬底基板、封装结构、位于所述衬底基板和所述封装结构之间的有机电致发光结构、以及柔性电路板；所述衬底基板设有与所述有机电致发光结构的内部走线电连接的周边走线结构；所述周边走线结构包括焊接部，其中所述焊接部具有面向所述衬底基板的第一表面，所述第一表面的至少一部分露出以与所述柔性电路板的焊接端子电性接合。
本发明的另一实施例提供一种显示装置，包括上述有机电致发光器件。
本发明的又一实施例提供上述有机电致发光器件的制备方法，包括：
在衬底基板上形成周边走线结构和有机电致发光结构、并将封装结构与衬底基板封装配合，其中所述周边走线结构具有焊接部；
在衬底基板上形成开口位于所述衬底基板背离所述有机电致发光结构一侧表面上以露出所述焊接部的凹陷部；
将柔性电路板的焊接端子伸入所述凹陷部内，将柔性电路板的焊接端子焊接在焊接部上。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例或相关技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，并非对本公开的限制。
图1为相关技术中有机电致发光器件的结构示意图；
图2为图1所示结构的有机电致发光器件中周边走线结构以及柔性电路板的分布示意图；
图3为本发明第一实施例提供的有机电致发光器件的结构示意图；
图4a为本发明第二实施例提供的有机电致发光器件的结构示意图；
图4b为图4a所示结构的有机电致发光器件中第二走线层中的走线分布示意图；
图4c为图4a所示结构的有机电致发光器件中第一走线层中的走线分布示意图；
图5a为本发明第三实施例提供的有机电致发光器件的结构示意图；
图5b为图5a所示结构的有机电致发光器件中第二走线层中的走线分布示意图；
图5c为图5a所示结构的有机电致发光器件中第一走线层中的走线分布示意图；
图6a为本发明第四实施例中提供的有机电致发光器件的结构示意图；
图6b为图6a所示结构的有机电致发光器件中第五走线层中的走线分布示意图；
图6c为图6a所示结构的有机电致发光器件中第四走线层中的走线分布示意图；
图6d为图6a所示结构的有机电致发光器件中第三走线层中的走线分布示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明实施例提供一种有机电致发光器件及其制备方法、显示装置。该有机电致发光器件中的边框不需要为柔性电路板的弯转预留空间，进而能够减小有机电致发光器件的边框宽度。
如图3所示，本发明第一实施例提供的有机电致发光器件包括衬底基板1、封装结构7、位于衬底基板1和封装结构7之间的有机电致发光结构5、以及柔性电路板FPC 4；衬底基板1设有与有机电致发光结构5内部走线电连接的周边走线结构3；周边走线结构3包括焊接部32；衬底基板1设有开口位于衬底基板1背离有机电致发光结构5一侧表面以露出焊接部32的凹陷部，FPC 4的焊接端子41位于凹陷部内、且焊接于焊接部32。
上述有机电致发光器件中，衬底基板1设有开口位于衬底基板1背离有机电致发光结构5一侧表面以露出焊接部32的凹陷部，柔性电路板4的焊接端子41直接从衬底基板1背离有机电致发光结构5的一侧伸入凹陷部内且与焊接部32焊接，实现柔性电路板4与周边走线结构3的电连接；因此，柔性电路板4无需自焊接部32背离衬底基板1的一侧弯折至衬底基板1背离有机电致发光结构5的一侧，有机电致发光器件的边框处无需预留出柔性电路板4的弯转空间，因此可以减小有机电致发光器件的边框宽度。
请继续参考图3，在一个示例中，上述封装结构7可以为封装基板，衬底基板1与周边走线结构3之间设有缓冲层2，且有机电致发光结构5与封装结构7之间形成容腔6，容腔内可以填充氮气、惰性气体、树脂、或干燥剂等，以提高对水氧等的阻隔性。
当然，上述衬底基板1可以为柔性衬底基板，同时，封装结构7为柔性封装薄膜，以使有机电致发光器件形成柔性显示器件。其中，衬底基板可以为具有载板结构的PI膜，封装结构7可以为由多层有机薄膜和无机薄膜交叠形成的封装薄膜。
在一个示例中，上述周边走线结构3还包括与有机电致发光结构5的内部走线直接电连接的周边走线31、连接焊接部32和周边走线31的扩散电路走线。
本发明第二实施例提供一种有机电致发光器件，如图4a-图4c所示。图4a为本发明第二实施例提供的有机电致发光器件的结构示意图；图4b为图4a所示结构的有机电致发光器件中第二走线层中的走线分布示意图；图4c为图4a所示结构的有机电致发光器件中第一走线层中的走线分布示意图。本发明第二实施例提供的有机电致发光器件中，衬底基板1、封装结构7、位于衬底基板1和封装结构7之间的有机电致发光结构5、以及柔性电路板FPC 4类似于第一实施例设置，在此不做赘述。以下，就第二实施例提供的有机电致发光器件与的第一实施例提供的有机电致发光器件的不同之处做详细描述。
如图4a所示，本发明第二实施例提供的有机电致发光器件中，周边走线结构3分两层设置，即，第一走线层34和第二走线层33。其中，第一走线层34位于第二走线层33与衬底基板1之间，第一走线层34与第二走线层33之间设有绝缘层8；如图4c所示，焊接部32、扩散电路走线以及周边走线的第一部分形成于第一走线层34；周边走线的第二部分和触点部设置于第二走线层33。设置于第一走线层34的周边走线结构3与设置于第二走线层33的周边走线结构3之间通过触点部电连接。如图4b所示，所述触电部包括触点部331、触点部332以及触点部333。所述周边走线的第一部分包括周边走线341、342和343；所述周边走线的第二部分包括周边走线334。第二走线层33中的触点部331与第一走线层34中的走线341电连接，第二走线层33中的触点部332与第一走线层34中的走线342电连接，第二走线层33中的触点部333与第一走线层34中的走线343电连接，柔性电路板4通过焊接部32将电信号传输给第二走线层33内的周边走线334。
在第二实施例中，将有机电致发光器件周边走线结构3中的焊接部32 设置在第一走线层34中，从而进一步减小了焊接部32在有机电致发光器件的边框宽度上所占的尺寸，进而有利于进一步地减小有机电致发光器件的边框。
第二实施例提供的有机电致发光器件可通过如下方法制造：先在衬底基板1上形成绝缘材料制备的缓冲层2、在缓冲层2上形成周边走线结构3以及有机电致发光结构5，然后将封装结构7与衬底基板1封装配合，然后，采用激光工艺在衬底基板1背离有机电致发光结构5的一面对衬底基板1进行处理以形成凹陷部，然后将柔性电路板4的焊接端子41焊接在周边走线结构3的焊接部32上。
在第二实施例提供的有机电致发光器件中，焊接部32可以位于第一走线层34的中部。
本发明第三实施例提供一种有机电致发光器件，如图5a-图5c所示。图5a为本发明第三实施例提供的有机电致发光器件的结构示意图；图5b为图5a所示结构的有机电致发光器件中第二走线层中的走线分布示意图；图5c为图5a所示结构的有机电致发光器件中第一走线层中的走线分布示意图。本发明第三实施例提供的有机电致发光器件中，衬底基板1、封装结构7、位于衬底基板1和封装结构7之间的有机电致发光结构5、以及柔性电路板FPC 4类似于第一实施例设置，在此不做赘述。以下，就第三实施例提供的有机电致发光器件与的第一实施例提供的有机电致发光器件的不同之处做详细描述。
如图5a所示，本发明第三实施例提供的有机电致发光器件中，周边走线结构3分两层设置，即，第一走线层35和第二走线层36，其中，第一走线层35位于第二走线层36与衬底基板1之间；
如图5c所示，焊接部32形成于第一走线层35，第二走线层36上设有触点部，第一走线层35上的周边走线结构与第二走线层36上的周边走线结构之间通过触点部电连接；周边走线结构3中，如图5c所示，扩散电路走线设置于第一走线层35，且周边走线的至少一部分设置于第一走线层35；如图5b所示，第二走线层36设有的触点部中包括与设置于第一走线层的周边走线的第一部分电连接、且与有机电致发光结构内走线电连接的触点部。
例如，扩散电路走线如图5c中所示包括扩散电路走线3511、扩散电路 走线3512、扩散电路走线3513、扩散电路走线3514。如图5c中所示，设置在第一走线层35的周边走线的第一部分包括周边走线352、周边走线353以及周边走线354；如图5b中所示，设置在第二走线层36的触点部包括触点部361、触点部362、触点部363、触点部364，且周边走线的第二部分3611设置在第二走线层36；焊接部32例如设有集成电路351，且：
扩散电路走线3511与焊接部32设有的集成电路351电连接、且与触点部361电连接，触点部361与第二走线层36内设置的周边走线3611电连接，以实现与有机电致发光结构5的内部走线电连接；
扩散电路走线3512与焊接部32设有的集成电路351电连接、且与周边走线352电连接；周边走线352与第二走线层36内设置的触点部362电连接，以实现与有机电致发光结构5的内部走线电连接；
扩散电路走线3513与焊接部32设有的集成电路351电连接、且与周边走线353电连接；周边走线353与第二走线层36内设置的触点部363电连接，以实现与有机电致发光结构5的内部走线电连接；
扩散电路走线3514与焊接部32设有的集成电路351电连接、且与周边走线354电连接；周边走线354与第二走线层36内设置的触点部364电连接，以实现与有机电致发光结构5内的走线电连接。
上述实施方式提供的有机电致发光器件中，将扩散电路走线和至少一部分周边走线制备在第一走线层35中，进而能够使扩散电路走线和设置在第一走线层35中的周边走线的宽度不占用有机电致发光器件中的有效显示区域周围的尺寸，进而进一步减小有机电致发光器件中相应边框的宽度。
例如，如图5a所示，第一走线层35与第二走线层36之间设有绝缘层9，绝缘层9设有与第二走线层36设有的触点部对应的过孔区域，设置于第一走线层35的周边走线结构与触点部对应的部位通过绝缘层的过孔区域穿过绝缘层9与触点部电连接。
在第三实施例提供的有机电致发光器件中，焊接部32可以位于第一走线层35的中部。
本发明第四实施例提供一种有机电致发光器件，如图图6a-图6d所示，图6a为本发明第四实施例中提供的有机电致发光器件的结构示意图；图6b为图6a所示结构的有机电致发光器件中第五走线层中的走线分布示意图；图 6c为图6a所示结构的有机电致发光器件中第四走线层中的走线分布示意图；图6d为图6a所示结构的有机电致发光器件中第三走线层中的走线分布示意图。本发明第四实施例提供的有机电致发光器件中，衬底基板1、封装结构7、位于衬底基板1和封装结构7之间的有机电致发光结构5、以及柔性电路板FPC 4类似于第一实施例设置，在此不做赘述。以下，就第三实施例提供的有机电致发光器件与的第一实施例提供的有机电致发光器件的不同之处做详细描述。
本实施方式提供的有机电致发光器件中，周边走线结构3可分三层设置，即，沿衬底基板1朝向有机电致发光结构5方向依次排列的第三走线层39、第四走线层37和第五走线层38，其中：
如图6d所示，焊接部32设置于第三走线层39；
如图6c所示，扩散电路走线和周边走线设置于第四走线层37，且第四走线层37还设有与第三走线层39电连接的触点部；如图6c中所示，第四走线层37设有扩散电路走线3711、扩散电路走线3721、扩散电路走线3731、扩散电路走线3741、周边走线371、周边走线372、周边走线373、周边走线374、触点部375、触点部376、触点部377，其中，触点部375用于与第三走线层39内的走线391连接，触点部376用于与第三走线层39内的走线392连接，触点部377用于与第三走线层39内的走线393连接；
如图6b所示，第五走线层38内设有与周边走线电连接、且与有机电致发光结构5的内部走线电连接的触点部；所述触电部，如图6b中所示，包括触点部381、触点部382、触点部383和触点部384。
上述结构的有机电致发光器件中，周边走线结构3中的扩散电路走线、周边走线以及焊接部均设置在有机电致发光结构5与衬底基板1之间，因此，周边走线结构3中的扩散电路走线、周边走线以及焊接部均不会占用有效显示区域周边的尺寸，从而能够进一步地减小有机电致发光器件中边框的宽度。
例如，如图6a所示，第四实施例提供的有机电致发光器件的周边走线结构3中：
第三走线层39与第四走线层37之间设有绝缘层10，设置在第三走线层39的周边走线结构与第四走线层37设置的触点部对应的部位穿过绝缘层10与第四走线层37设置的触点部电连接；
第四走线层37与第五走线层38之间设有绝缘层11，设置在第四走线层37的周边走线结构与第五走线层38上的触点部对应的部位穿过绝缘层11与第五走线层38设置的触点部电连接。
在第四实施例提供的有机电致发光器件中，焊接部32可以位于第三走线层39的中部。
本发明实施例还提供了一种显示装置，该显示装置包括上述任意一种实施例提供的有机电致发光器件。
本发明另一实施例还提供了一种上述任意一种实施方式中提供的有机电致发光器件的制备方法，包括：
在衬底基板上形成周边走线结构和有机电致发光结构、并将封装结构与衬底基板封装配合，其中周边走线结构具有焊接部；
在衬底基板上形成开口位于衬底基板背离有机电致发光结构一侧表面上以露出焊接部的凹陷部；
将柔性电路板的焊接端子伸入凹陷部内，将柔性电路板的焊接端子焊接在焊接部上。
在一个示例中，在衬底基板上形成周边走线结构和有机电致发光结构、并将封装结构与衬底基板封装配合之前还包括：
在玻璃基板上涂覆PI液；
对玻璃基板上涂覆的PI液进行烘烤以形成衬底基板；
在衬底基板上形成开口位于衬底基板背离有机电致发光结构一侧表面上以露出焊接部的凹陷部之前还包括：
将在衬底基板上形成周边走线结构和有机电致发光结构、并将封装结构与衬底基板封装配合之后的结构从玻璃基板上剥离。
根据上述描述，根据本公开的实施例至少可以提供以下结构和方法：
(1)、一种有机电致发光器件，包括衬底基板、封装结构、位于所述衬底基板和所述封装结构之间的有机电致发光结构、以及柔性电路板；所述衬底基板设有与所述有机电致发光结构的内部走线电连接的周边走线结构；所述周边走线结构包括焊接部，其中所述焊接部具有面向所述衬底基板的第一表面，所述第一表面的至少一部分露出以与所述柔性电路板的焊接端子电性接合。
(2)、根据(1)所述的有机电致发光器件，其中，所述衬底基板设有凹陷部以暴露出所述焊接部的第一表面的所述至少一部分。
(3)、根据(1)或(2)所述的有机电致发光器件，其中，所述周边走线结构还包括与有机电致发光结构的内部走线电连接的周边走线、以及连接所述焊接部和所述周边走线的扩散电路走线，所述周边走线结构分为第一走线层和第二走线层，所述第一走线层位于所述第二走线层与所述衬底基板之间；所述焊接部设置于所述第一走线层。
(4)、根据(1)至(3)中任一项所述的有机电致发光器件，其中，所述扩散电路走线和所述周边走线的至少一部分设置于所述第一走线层，所述第二走线层上设有触点部，设置于所述第一走线层的所述周边走线结构与设置于所述第二走线层的所述周边走线结构之间通过所述触点部电连接。
(5)、根据(4)所述的有机电致发光器件，所述第二走线层设有的触点部中包括与所述周边走线中设置于所述第一走线层的至少一部分电连接、且与所述有机电致发光结构内走线电连接的触点部。
(6)、根据(3)至(5)中任一项所述的有机电致发光器件，其中，所述第一走线层与所述第二走线层之间设有绝缘层，所述绝缘层设有对应于所述第二走线层上的触点部的过孔区域，设置于所述第一走线层的所述周边走线结构与所述触点部对应的部位通过所述过孔区域穿过所述绝缘层与所述触点部电连接。
(7)、根据(3)至(6)中任一项所述的有机电致发光器件，其中，所述焊接部位于所述第一走线层的中部。
(8)、根据(1)或(2)所述的有机电致发光器件，其中，所述周边走线结构还包括与有机电致发光结构的内部走线电连接的周边走线、以及连接所述焊接部和所述周边走线的扩散电路走线，所述周边走线结构分为沿所述衬底基板朝向所述有机电致发光结构方向依次排列的第三走线层、第四走线层和第五走线层，其中：
所述焊接部设置于所述第三走线层；
所述扩散电路走线和所述周边走线设置于所述第四走线层，且所述第四走线层设有与所述第三走线层电连接的触点部；
所述第五走线层内设有与所述周边走线电连接、且与所述有机电致发光 结构的内部走线电连接的触点部。
(9)、根据(8)所述的有机电致发光器件，其中，所述第三走线层与所述第四走线层之间设有绝缘层，设置于所述第三走线层的所述周边走线结构与所述第四走线层上的触点部对应的部位穿过绝缘层与第四走线层设置的触点部电连接；
所述第四走线层与所述第五走线层之间设有绝缘层，设置于所述第四走线层的所述周边走线结构与所述第五走线层上的触点部对应的部位穿过绝缘层与第五走线层设置的触点部电连接。
(10)、根据(8)或(9)所述的有机电致发光器件，其中，所述焊接部位于所述第三走线层的中部。
(11)、根据(1)至(10)中任一项所述的有机电致发光器件，其中，所述衬底基板为柔性衬底基板，且所述封装结构为柔性封装结构。
(12)、根据(11)所述的有机电致发光器件，其中，所述衬底基板为PI膜。
(13)、根据(11)所述的有机电致发光器件，其中，所述封装结构为由多层有机薄膜和无机薄膜交叠形成的封装薄膜。
(14)、一种显示装置，包括如(1)至(13)任一项所述的有机电致发光器件。
(15)、一种如(1)至(13)任一项所述的有机电致发光器件的制备方法，包括：
在衬底基板上形成周边走线结构和有机电致发光结构、并将封装结构与衬底基板封装配合，其中所述周边走线结构具有焊接部；
在衬底基板上形成开口位于所述衬底基板背离所述有机电致发光结构一侧表面上以露出所述焊接部的凹陷部；
将柔性电路板的焊接端子伸入所述凹陷部内，将柔性电路板的焊接端子焊接在焊接部上。
(16)、根据(15)所述的制备方法，其中，
所述在衬底基板上形成周边走线结构和有机电致发光结构、并将封装结构与衬底基板封装配合之前还包括：
在玻璃基板上涂覆PI液；
对玻璃基板上涂覆的PI液进行烘烤以形成衬底基板；
(17)、根据(15)或(16)所述的制备方法，其中，
所述在衬底基板上形成开口位于所述衬底基板背离所述有机电致发光结构一侧表面上以露出所述焊接部的凹陷部之前还包括：
将在衬底基板上形成周边走线结构和有机电致发光结构、并将封装结构与衬底基板封装配合之后的结构从玻璃基板上剥离。
虽然上文中已经用一般性说明及具体实施方式，对本公开作了详尽的描述，但在本公开基础上，可以对之作一些修改或改进，这对本领域技术人员而言是显而易见的。因此，在不偏离本公开精神的基础上所做的这些修改或改进，均属于本公开要求保护的范围。
本申请要求于2014年11月27日递交的中国专利申请第201410708765.0号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (17)

  1. 一种有机电致发光器件，包括衬底基板、封装结构、位于所述衬底基板和所述封装结构之间的有机电致发光结构、以及柔性电路板；所述衬底基板设有与所述有机电致发光结构的内部走线电连接的周边走线结构；所述周边走线结构包括焊接部，其中所述焊接部具有面向所述衬底基板的第一表面，所述第一表面的至少一部分露出以与所述柔性电路板的焊接端子电性接合。
  2. 根据权利要求1所述的有机电致发光器件，其中，所述衬底基板设有凹陷部以暴露出所述焊接部的第一表面的所述至少一部分。
  3. 根据权利要求1或2所述的有机电致发光器件，其中，所述周边走线结构还包括与有机电致发光结构的内部走线电连接的周边走线、以及连接所述焊接部和所述周边走线的扩散电路走线，所述周边走线结构分为第一走线层和第二走线层，所述第一走线层位于所述第二走线层与所述衬底基板之间；所述焊接部设置于所述第一走线层。
  4. 根据权利要求1至3中任一项所述的有机电致发光器件，其中，所述扩散电路走线和所述周边走线的至少一部分设置于所述第一走线层，所述第二走线层上设有触点部，设置于所述第一走线层的所述周边走线结构与设置于所述第二走线层的所述周边走线结构之间通过所述触点部电连接。
  5. 根据权利要求4所述的有机电致发光器件，所述第二走线层设有的触点部中包括与所述周边走线中设置于所述第一走线层的至少一部分电连接、且与所述有机电致发光结构内走线电连接的触点部。
  6. 根据权利要求3至5中任一项所述的有机电致发光器件，其中，所述第一走线层与所述第二走线层之间设有绝缘层，所述绝缘层设有对应于所述第二走线层上的触点部的过孔区域，设置于所述第一走线层的所述周边走线结构与所述触点部对应的部位通过所述过孔区域穿过所述绝缘层与所述触点部电连接。
  7. 根据权利要求3至6中任一项所述的有机电致发光器件，其中，所述焊接部位于所述第一走线层的中部。
  8. 根据权利要求1或2所述的有机电致发光器件，其中，所述周边走线结构还包括与有机电致发光结构的内部走线电连接的周边走线、以及连接所 述焊接部和所述周边走线的扩散电路走线，所述周边走线结构分为沿所述衬底基板朝向所述有机电致发光结构方向依次排列的第三走线层、第四走线层和第五走线层，其中：
    所述焊接部设置于所述第三走线层；
    所述扩散电路走线和所述周边走线设置于所述第四走线层，且所述第四走线层设有与所述第三走线层电连接的触点部；
    所述第五走线层内设有与所述周边走线电连接、且与所述有机电致发光结构的内部走线电连接的触点部。
  9. 根据权利要求8所述的有机电致发光器件，其中，所述第三走线层与所述第四走线层之间设有绝缘层，设置于所述第三走线层的所述周边走线结构与所述第四走线层上的触点部对应的部位穿过绝缘层与第四走线层设置的触点部电连接；
    所述第四走线层与所述第五走线层之间设有绝缘层，设置于所述第四走线层的所述周边走线结构与所述第五走线层上的触点部对应的部位穿过绝缘层与第五走线层设置的触点部电连接。
  10. 根据权利要求8或9所述的有机电致发光器件，其中，所述焊接部位于所述第三走线层的中部。
  11. 根据权利要求1至10中任一项所述的有机电致发光器件，其中，所述衬底基板为柔性衬底基板，且所述封装结构为柔性封装结构。
  12. 根据权利要求11所述的有机电致发光器件，其中，所述衬底基板为PI膜。
  13. 根据权利要求11所述的有机电致发光器件，其中，所述封装结构为由多层有机薄膜和无机薄膜交叠形成的封装薄膜。
  14. 一种显示装置，包括如权利要求1至13任一项所述的有机电致发光器件。
  15. 一种如权利要求1至13任一项所述的有机电致发光器件的制备方法，包括：
    在衬底基板上形成周边走线结构和有机电致发光结构、并将封装结构与衬底基板封装配合，其中所述周边走线结构具有焊接部；
    在衬底基板上形成开口位于所述衬底基板背离所述有机电致发光结构一 侧表面上以露出所述焊接部的凹陷部；
    将柔性电路板的焊接端子伸入所述凹陷部内，将柔性电路板的焊接端子焊接在焊接部上。
  16. 根据权利要求15所述的制备方法，其中，
    所述在衬底基板上形成周边走线结构和有机电致发光结构、并将封装结构与衬底基板封装配合之前还包括：
    在玻璃基板上涂覆PI液；
    对玻璃基板上涂覆的PI液进行烘烤以形成衬底基板。
  17. 根据权利要求15或16所述的制备方法，其中，
    所述在衬底基板上形成开口位于所述衬底基板背离所述有机电致发光结构一侧表面上以露出所述焊接部的凹陷部之前还包括：
    将在衬底基板上形成周边走线结构和有机电致发光结构、并将封装结构与衬底基板封装配合之后的结构从玻璃基板上剥离。
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Publication number Priority date Publication date Assignee Title
CN104992956B (zh) * 2015-05-15 2018-11-09 深圳市华星光电技术有限公司 无边框显示装置及其制作方法
CN109509402B (zh) * 2017-09-14 2022-03-18 广州国显科技有限公司 一种柔性显示装置
CN108198950B (zh) * 2017-12-28 2019-11-22 武汉华星光电半导体显示技术有限公司 柔性显示面板的边缘区结构、柔性显示面板
CN111542942A (zh) 2018-01-09 2020-08-14 Oled工厂有限责任公司 超薄oled照明面板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040232418A1 (en) * 2003-05-21 2004-11-25 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and manufacturing method of the same
CN102082163A (zh) * 2010-09-16 2011-06-01 昆山维信诺显示技术有限公司 一种有机电致发光器件，制备方法、显示模组及其应用
CN103268883A (zh) * 2012-06-29 2013-08-28 上海天马微电子有限公司 Oled显示器及其制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101938125B1 (ko) * 2008-12-17 2019-01-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
US9214507B2 (en) * 2012-08-17 2015-12-15 Apple Inc. Narrow border organic light-emitting diode display
US9454025B2 (en) * 2012-08-31 2016-09-27 Apple Inc. Displays with reduced driver circuit ledges
KR101469487B1 (ko) * 2012-09-18 2014-12-05 엘지디스플레이 주식회사 유기 발광 표시 장치
JP2014086314A (ja) * 2012-10-24 2014-05-12 Japan Display Inc 有機エレクトロルミネッセンス表示装置
JP6490901B2 (ja) * 2013-03-14 2019-03-27 株式会社半導体エネルギー研究所 発光装置の作製方法
KR102049735B1 (ko) * 2013-04-30 2019-11-28 엘지디스플레이 주식회사 유기전계발광표시장치 및 그 제조방법
US9876064B2 (en) * 2013-08-30 2018-01-23 Lg Display Co., Ltd. Flexible organic electroluminescent device and method for fabricating the same
KR102112649B1 (ko) * 2013-11-25 2020-05-19 엘지디스플레이 주식회사 유기전계 발광소자 및 이의 리페어 방법
KR20150105585A (ko) * 2014-03-07 2015-09-17 삼성디스플레이 주식회사 디스플레이 장치의 접합 방법
CN204179114U (zh) * 2014-11-27 2015-02-25 京东方科技集团股份有限公司 一种有机电致发光器件及显示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040232418A1 (en) * 2003-05-21 2004-11-25 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and manufacturing method of the same
CN102082163A (zh) * 2010-09-16 2011-06-01 昆山维信诺显示技术有限公司 一种有机电致发光器件，制备方法、显示模组及其应用
CN103268883A (zh) * 2012-06-29 2013-08-28 上海天马微电子有限公司 Oled显示器及其制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3226321A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112542468A (zh) * 2016-07-05 2021-03-23 群创光电股份有限公司 显示装置

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