WO2021218395A1 - 显示面板及显示装置 - Google Patents

显示面板及显示装置 Download PDF

Info

Publication number
WO2021218395A1
WO2021218395A1 PCT/CN2021/079697 CN2021079697W WO2021218395A1 WO 2021218395 A1 WO2021218395 A1 WO 2021218395A1 CN 2021079697 W CN2021079697 W CN 2021079697W WO 2021218395 A1 WO2021218395 A1 WO 2021218395A1
Authority
WO
WIPO (PCT)
Prior art keywords
display panel
layer
film layer
base substrate
electrode
Prior art date
Application number
PCT/CN2021/079697
Other languages
English (en)
French (fr)
Inventor
赵天龙
朴叙俊
王子峰
史大为
Original Assignee
京东方科技集团股份有限公司
重庆京东方显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司, 重庆京东方显示技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/629,573 priority Critical patent/US20240049531A1/en
Publication of WO2021218395A1 publication Critical patent/WO2021218395A1/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED

Definitions

  • the present disclosure relates to the field of display technology, in particular to a display panel and a display device.
  • OLED Organic Light-Emitting Diode
  • FMLOC Flexible Multi-Layer On Cell
  • the OLED display panel can be electrically connected to the control chip through the contact electrodes.
  • the control chip is very difficult to control in a high temperature and high humidity environment. Easy to fall off.
  • a plurality of contact electrodes located on the base substrate in the non-display area of the display panel;
  • the inorganic film layer is located on the side of the contact electrode close to the base substrate; the inorganic film layer includes an inorganic material;
  • the organic film layer is located on the side of the contact electrode away from the base substrate;
  • the organic film layer is provided with openings.
  • the barrier layer in at least a part of the gap between the adjacent contact electrodes, is in contact with the inorganic film layer through the opening.
  • the barrier layer in the gap between any two adjacent contact electrodes, is in contact with the inorganic film layer through the opening.
  • the organic film layer includes: a plurality of first through holes respectively corresponding to each of the contact electrodes in a one-to-one correspondence;
  • the barrier layer includes: a plurality of second through holes respectively corresponding to each of the first through holes one-to-one;
  • the contact electrode is exposed through the corresponding first through hole and the second through hole.
  • the organic film layer is attached to the side of the contact electrode to protect the contact electrode.
  • the organic film layer covers the edge of the surface of the contact electrode on the side facing away from the base substrate.
  • the orthographic projection of the organic film layer on the base substrate is at the same level as the orthographic projection of the barrier layer on the base substrate. Within range.
  • the contact electrode includes at least: a first sub-electrode and a second sub-electrode arranged in a layered manner;
  • the second sub-electrode is located on a side of the first sub-electrode away from the base substrate.
  • it further includes: a thin film transistor located in the display area;
  • the first sub-electrode and the source of the thin film transistor are located in the same film layer.
  • it further includes: a gate line coupled with the gate of the thin film transistor;
  • the contact electrode is coupled with the gate line.
  • it further includes: a plurality of light-emitting devices located in the display area of the display panel, an encapsulation layer, and a touch electrode layer;
  • the light-emitting device is located on the base substrate, the packaging layer covers a plurality of the light-emitting devices, the barrier layer extends into the display area, and the barrier layer is located on the packaging layer away from the On one side of the base substrate, the touch electrode layer is located on the side of the barrier layer away from the base substrate.
  • the barrier layer and the interlayer insulating layer include the same inorganic material.
  • the base substrate includes: at least one layer of flexible substrate.
  • an embodiment of the present disclosure also provides a display device, which includes: the above-mentioned display panel.
  • it further includes: a control chip
  • the control chip includes: a plurality of contact terminals;
  • the contact terminal is directly bound and connected with the contact electrode in the display panel.
  • it further includes: a flexible circuit board and a control chip;
  • the control chip is bound and connected with the contact electrode through the flexible circuit board.
  • FIG. 1 is a schematic top view of the structure of a display panel provided by the implementation of the present disclosure
  • FIG. 2 is a partial enlarged schematic diagram of the binding area C in FIG. 1;
  • Fig. 3 is a schematic cross-sectional view at the dotted line TT′ in Fig. 2;
  • FIG. 4 is a schematic cross-sectional view at the dotted line L in FIG. 1;
  • Fig. 5 is another schematic cross-sectional view at the dotted line TT′ in Fig. 2;
  • FIG. 6 is a schematic diagram of the structure after forming each contact electrode
  • FIG. 7 is a schematic top view of the structure after the organic film layer is formed.
  • Fig. 8 is a schematic cross-sectional view at the dotted line TT′ in Fig. 7;
  • FIG. 9 is one of the cross-sectional schematic diagrams of the display device provided by the embodiment of the disclosure.
  • FIG. 10 is the second cross-sectional schematic diagram of the display device provided by the embodiment of the disclosure.
  • the OLED display panel includes a display area A and a non-display area B.
  • the non-display area B has a binding area C, and there are multiple contact electrodes 11 in the binding area C.
  • the OLED display panel can be contacted
  • the electrode 11 is electrically connected to the control chip.
  • an organic film layer and a barrier layer covering the organic film layer are provided in the gap between adjacent touch electrodes 11, an organic film layer and a barrier layer covering the organic film layer are provided.
  • the barrier layer may include a silicon nitride material, so the adhesion between the organic film layer and the barrier layer is poor, and the organic film layer has better water absorption In a high temperature and high humidity environment, for example, during the reliability verification process, the OLED display panel will be placed in a high temperature and high humidity environment. The organic film layer will absorb a lot of water and generate bubbles between the organic film layer and the barrier layer.
  • the embodiments of the present disclosure provide a display panel and a display device.
  • the specific implementations of the display panel and the display device provided by the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.
  • the thickness and shape of each film layer in the drawings do not reflect the true ratio, and the purpose is only to illustrate the content of the present invention schematically.
  • FIG. 1 is a schematic top view of the structure of the display panel provided by the implementation of the present disclosure
  • FIG. 2 is a partial enlarged schematic view of the binding area C in FIG. 1
  • FIG. 3 is a schematic cross-sectional view at the dotted line TT' in FIG.
  • the display panel provided by the embodiment of the present disclosure includes:
  • a plurality of contact electrodes 11 are located on the base substrate 10 in the non-display area B of the display panel;
  • the inorganic film layer 12 is located on the side of the contact electrode 11 close to the base substrate 10; the inorganic film layer 12 includes inorganic materials;
  • the organic film layer 13 is located on the side of the contact electrode 11 away from the base substrate 10;
  • the barrier layer 14 is located on the side of the organic film layer 13 away from the base substrate 10; the barrier layer 14 includes an inorganic material;
  • the organic film layer 13 is provided with an opening U.
  • the organic film layer in the gap between the adjacent contact electrodes is removed, so that the organic film layer has openings in the gap between the adjacent contact electrodes, and the organic film is reduced.
  • the water absorption of the layer prevents the barrier layer from falling off and reduces the risk of the control chip falling off.
  • the display panel includes a display area A and a non-display area B.
  • the contact electrodes 11 may be located in the binding area C in the non-display area B.
  • the contact electrodes 11 in the binding area C are used for bonding and connection with the control chip. Therefore, the number and arrangement of the contact electrodes 11 in the binding area C can be determined according to needs.
  • the number and distribution of the contact terminals of the bound control chip are set, and the number and arrangement of the contact electrodes are not limited here.
  • the above-mentioned display panel may be an organic electroluminescence display panel.
  • Each light-emitting device 21 may be an organic electroluminescent diode.
  • a driving circuit 24 is also provided between the base substrate and the light-emitting device.
  • the driving circuit 24 may include multiple thin film transistors and multiple For signal traces, the above-mentioned organic film layer 13 can extend to the display area A and cover the driving circuit 24 in the display area A to function as a flat layer, thereby providing a flatter substrate for the light-emitting device 21.
  • the above-mentioned inorganic film layer 12 can extend to the display area A, can isolate the source electrode and the active layer in the thin film transistor, and function as an interlayer insulating layer.
  • the organic film layer 13 generally includes organic materials, the organic film layer 13 has water absorption.
  • a barrier layer 14 is provided on the side of the organic film layer 13 away from the base substrate 10, which can protect the organic film layer 13, and play a role in waterproofing and improving mechanical properties. The role of performance.
  • the size of the contact electrode 11 in the binding area C is relatively small.
  • the gap D is shown to be relatively narrow. In practical applications, the size of the contact electrode 11 should be smaller than the size of the gap D. Therefore, in the embodiments of the present disclosure, removing at least part of the organic film layer 13 in the gap can significantly reduce the water absorption of the organic film layer, and can greatly improve the adhesion of the barrier layer, thereby preventing the barrier layer from falling off. In turn, the risk of the control chip falling off is reduced.
  • a larger opening can be provided in the flat layer, or, according to actual needs, multiple openings can be provided in the flat layer in the same gap. There is no limit to the number of openings in the flat layer of the same gap.
  • the organic film layer 13 By removing at least part of the organic film layer 13 in the gap D between the adjacent contact electrodes 11, the organic film layer 13 has an opening U in the gap D between the adjacent contact electrodes 11, so that the barrier layer 14 Contact with the inorganic film layer 12 through the opening U. Since the barrier layer 14 and the inorganic film layer 12 both include inorganic materials, the adhesion between the barrier layer 14 and the inorganic film layer 12 is better, thereby increasing the adhesion of the barrier layer 14. Efforts are made to reduce the risk of the control chip falling off.
  • the barrier layer 14 and the inorganic film layer 12 include the same inorganic material, so that the adhesion between the barrier layer 14 and the inorganic film layer 12 can be improved. Even better, the adhesion of the barrier layer 14 is further enhanced.
  • the above-mentioned inorganic film layer 12 may include a first inorganic layer and a second inorganic layer.
  • the first inorganic layer may be made of silicon oxide material, and the second inorganic layer is located on the side of the first inorganic layer away from the base substrate.
  • the second inorganic layer can be made of silicon nitride material, and the above-mentioned barrier layer can also be made of silicon nitride material, and the barrier layer is in contact with the second inorganic layer, and the adhesion between the barrier layer and the second inorganic layer is good.
  • the barrier layer in at least part of the gap between adjacent contact electrodes, can also be bonded to the inorganic film layer through the adhesive layer, which can also make the barrier layer have strong adhesion. To prevent the barrier layer from falling off.
  • the barrier layer 14 passes through the opening U and the inorganic film Layer 12 contacts.
  • the organic film layer in other positions in the binding area can also be removed, such as The organic film layer at the edge of the binding area can be removed.
  • the organic film layer 13 includes: a plurality of first through holes V1 respectively corresponding to each contact electrode 11 in a one-to-one manner;
  • the barrier layer 14 includes: a plurality of second through holes V2 respectively corresponding to each of the first through holes V1 in a one-to-one manner;
  • the contact electrode 11 is exposed through the corresponding first through hole V1 and the second through hole V2.
  • the contact electrode 11 can be exposed through the corresponding first through hole V1 and the second through hole V2 for subsequent The contact electrode 11 is coupled to the control chip.
  • the contact electrode 11 includes at least: a first sub-electrode 111 and a second sub-electrode 112 that are stacked;
  • the second sub-electrode 112 is located on the side of the first sub-electrode 111 away from the base substrate 10.
  • the above-mentioned contact electrode 11 includes at least a first sub-electrode 111 and a second sub-electrode 112 that are stacked, and a contact electrode 11 with a corresponding thickness can be obtained.
  • the thickness of the sub-electrode can be set according to the thickness of the contact electrode 11 actually required.
  • the above-mentioned contact electrode 11 may also include more sub-electrodes arranged in a stack, or the contact electrode 11 may also include only one sub-electrode, and the number of sub-electrodes is not limited here.
  • the sub-electrodes in the above-mentioned contact electrode 11 may include three stacked metal film layers, wherein the metal film layer located in the middle includes metal aluminum, for example, the first sub-electrode 111 and/or the second sub-electrode 112 includes three A metal film layer arranged in a laminated layer, wherein the metal film layer located in the middle includes metal aluminum.
  • an anode film layer needs to be formed on the organic film layer 13 (the anode film layer is located in the display area, not shown in the figure), and then the anode film layer is wet-processed Multiple anode patterns are obtained by etching. Since the anode film layer contains metallic silver, during the wet etching process of the anode film layer, the anode film layer is immersed in the etching solution, and the silver ions in the anode film layer It will dissolve into the etching solution.
  • the metal film layer located in the middle of the first sub-electrode 111 and the second sub-electrode 112 generally includes metal aluminum, if the side of the contact electrode 11 is exposed, the silver ions in the etching solution will It will undergo a substitution reaction with the metallic aluminum on the side of the contact electrode 11, and metallic silver will be precipitated. The precipitated metallic silver will drift to various positions of the display panel through the etching solution, and ultimately affect the display performance of the display panel.
  • the organic film layer 13 is attached to the side of the contact electrode 11. During the wet etching process of the anode film, the side of the contact electrode 11 is no longer exposed, so that precipitation can be avoided. Metallic silver ensures that the display panel has better display performance.
  • the organic film layer 13 covers the edge of the surface of the contact electrode 11 facing away from the base substrate 10, so that the side edge of the contact electrode 11 can be completely wrapped In order to ensure that during the wet etching process of the anode film, no metallic silver will be precipitated.
  • FIG. 5 is another schematic cross-sectional view at the dotted line TT′ in FIG. 2. As shown in FIG. Therefore, during the wet etching process of the anode film layer, the metal aluminum on the side of the first sub-electrode 111 is no longer exposed, which can further prevent the silver ions in the etching solution from contacting the metal in the electrode 11 Aluminum contact further reduces the risk of metallic silver precipitation.
  • FIG. 6 is a schematic diagram of the structure after forming each contact electrode 11
  • FIG. 7 is a schematic diagram of the top structure after forming the organic film layer 13
  • FIG. 8 is a schematic cross-sectional view at the dotted line TT' in FIG.
  • Figures 6 to 8 in actual applications, in order to increase the adhesion of the barrier layer 14 to a greater extent, in addition to leaving part of the organic film layer 13 covering the side of the contact electrode 11, you can add The remaining organic film layer 13 in the gap D between the adjacent contact electrodes 11 is removed.
  • the organic film layer 13 is completely wrapped by the barrier layer 14, thereby preventing the organic film layer 13 from absorbing water.
  • the above-mentioned display panel provided by the embodiment of the present disclosure may further include: a thin film transistor located in the display area A, as shown in FIG. 4, the thin film transistor may be located in the driving circuit 24;
  • the first sub-electrode 111 and the source of the thin film transistor are located in the same film layer.
  • the first sub-electrode and the source of the thin film transistor can be fabricated in the same patterning process. Specifically, a metal film layer can be formed, and the metal film layer can be patterned using the same mask to obtain the first sub-electrode and the thin film transistor source. The pattern of the sub-electrode and the source of the thin film transistor can save the manufacturing process and reduce the manufacturing cost.
  • the display panel may further include: a gate line 15 coupled with the gate of the thin film transistor;
  • the contact electrode 11 is coupled with the gate line 15.
  • the thin film transistor is generally located in the display area, one end of the gate line 15 is coupled to the gate of the thin film transistor, and the other end extends to the non-display area to be coupled to the contact electrode 11, and the control chip is tied to the contact electrode 11. After the connection is made, the control chip can be coupled to the gate of the thin film transistor. Therefore, the contact electrode 11 can transmit the control signal sent by the control chip to the gate, so that the control chip can control whether the thin film transistor is turned on. Control the light-emitting device to emit light.
  • the above-mentioned display panel provided by the embodiment of the present disclosure may further include: a plurality of light-emitting devices 21 located in the display area A of the display panel, an encapsulation layer 22, and a touch electrode layer 23;
  • the light emitting device 21 is located on the base substrate 10, the packaging layer 22 covers a plurality of light emitting devices 21, the barrier layer 14 extends into the display area A, and the barrier layer 14 is located on the side of the packaging layer 22 away from the base substrate 10.
  • the electrode layer 23 is located on the side of the barrier layer 14 away from the base substrate 10.
  • the above-mentioned barrier layer 14 functions to isolate the touch electrode layer 23 and the encapsulation layer 22 in the display area A, and the barrier layer 14 extends to the binding area of the non-display area B, and can also protect the organic film layer 13 and waterproof , The role of improving mechanical properties.
  • the above-mentioned encapsulation layer may include an inorganic layer 221 and an organic layer 222 that are stacked and alternately arranged, wherein the inorganic layer 221 functions to block water vapor and oxygen, and the organic layer 222 functions to relieve stress.
  • the touch electrode layer 23 may include a plurality of self-capacitance electrodes that are independent of each other; or, the touch electrode layer 23 may also include a plurality of first touch electrodes and a plurality of second touch electrodes. The second touch electrodes are insulated.
  • At least one barrier wall 25 surrounding the display area A can also be provided, and the inorganic film layer 221 in the encapsulation layer 22 can cover the barrier.
  • the wall 25 increases the area of the inorganic film layer 221, extends the transmission path of water vapor and oxygen, and prevents the transmission of water vapor and oxygen into the display area A.
  • the above-mentioned base substrate 10 may include: at least one layer of flexible substrate 101.
  • the display panel can be made to have a certain degree of flexibility, or bendable performance can be achieved.
  • the base substrate 10 includes two layers of flexible substrates 101 as an example for illustration. In specific implementation, the number of layers of the flexible substrate 101 can be set according to actual needs, which is not limited here.
  • a buffer layer 102 may also be provided on the side of each flexible substrate 101 close to the contact electrode 11.
  • the above-mentioned display panel may further include: a first gate insulating layer 16 between the base substrate 10 and the gate line 15, and a first gate insulating layer 16 between the first gate insulating layer 16 and the inorganic film layer 12. Between the second gate insulating layer 17.
  • embodiments of the present disclosure also provide a display device, including the above-mentioned display panel.
  • the display device can be applied to mobile phones, tablet computers, televisions, monitors, notebook computers, digital photo frames, navigators, etc. Functional products or components. Since the principle of solving the problem of the display device is similar to the above-mentioned display panel, the implementation of the display device can refer to the implementation of the above-mentioned display panel, and the repetition will not be repeated.
  • the above-mentioned display device provided by the embodiment of the present disclosure may further include: a control chip 31;
  • the control chip 31 includes: a plurality of contact terminals P1;
  • the contact terminal P1 is directly bonded and connected to the contact electrode 11 in the display panel.
  • control chip 31 is directly bound and connected to the contact electrode 11 through the contact terminal P1, so the control chip 31 can be coupled to the signal traces (such as gate lines) in the display panel through the contact electrode 11 to control the display panel to perform images. Display, and the structure is simple, the production cost is low.
  • the above-mentioned display device may further include: a flexible circuit board 32 and a control chip (not shown in the figure);
  • the control chip is bonded and connected to the contact electrode 11 through the flexible circuit board 32.
  • the flexible circuit board 32 may include contact pins P2, the flexible circuit board 32 can be bound and connected to the contact electrodes 11 through the contact pins P2, and one end of the flexible circuit board 32 can be bound and connected to the touch electrode 11, The other end is bent to the side of the display panel away from the display surface, and is coupled to the control chip, so that the frame of the display panel on one side of the display surface can be reduced, and a narrow frame of the display device can be realized.
  • the barrier layer and the inorganic film layer are brought into contact by removing at least part of the organic film layer in the gap between the adjacent contact electrodes. Therefore, the adhesion between the barrier layer and the inorganic film layer is better, thereby increasing the adhesion of the barrier layer. In addition, by removing part of the organic film layer, the water absorption of the organic film layer is reduced, and the occurrence of the barrier layer is avoided. Falling off reduces the risk of the control chip falling off.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本公开提供了一种显示面板及显示装置，该显示面板，包括：衬底基板；多个接触电极，位于显示面板的非显示区域内的衬底基板之上；无机膜层，位于接触电极靠近衬底基板的一侧；无机膜层包括无机材料；有机膜层，位于接触电极背离衬底基板的一侧；阻挡层，位于有机膜层背离衬底基板的一侧；阻挡层包括无机材料；在相邻的接触电极之间的至少部分间隙中，有机膜层设有开口。

Description

显示面板及显示装置 技术领域
本公开涉及显示技术领域，尤指一种显示面板及显示装置。
背景技术
有机电致发光器件(Organic Light-Emitting Diode，OLED)具有自发光、反应快、视角广、亮度高、色彩艳、轻薄等优点，被认为是下一代显示技术。其中，柔性多层触控技术(Flexible Multi-Layer On Cell，FMLOC)能够将触控电极层设置在OLED显示面板内部，以实现触控功能，使得OLED显示面板更轻薄，因而逐渐成为主流触控技术。
在OLED显示面板的非显示区域中设有绑定区域，绑定区域内具有多个接触电极，OLED显示面板可以通过接触电极与控制芯片实现电连接，然而，在高温高湿环境下控制芯片很容易脱落。
发明内容
本公开实施例提供的显示面板，其中，包括：
衬底基板；
多个接触电极，位于所述显示面板的非显示区域内的所述衬底基板之上；
无机膜层，位于所述接触电极靠近所述衬底基板的一侧；所述无机膜层包括无机材料；
有机膜层，位于所述接触电极背离所述衬底基板的一侧；
阻挡层，位于所述有机膜层背离所述衬底基板的一侧；所述阻挡层包括无机材料；
在相邻的所述接触电极之间的至少部分间隙中，所述有机膜层设有开口。
可选地，在本公开实施例中，在相邻的所述接触电极之间的至少部分间隙中，所述阻挡层通过所述开口与所述无机膜层接触。
可选地，在本公开实施例中，在任意两个相邻的所述接触电极之间的间隙中，所述阻挡层均通过所述开口与所述无机膜层接触。
可选地，在本公开实施例中，所述有机膜层包括：多个分别与各所述接触电极一一对应的第一通孔；
所述阻挡层，包括：多个分别与各所述第一通孔一一对应的第二通孔；
所述接触电极通过对应的所述第一通孔和所述第二通孔露出。
可选地，在本公开实施例中，所述有机膜层贴合设置在所述接触电极的侧边，以保护所述接触电极。
可选地，在本公开实施例中，所述有机膜层覆盖所述接触电极背离所述衬底基板一侧的表面的边缘。
可选地，在本公开实施例中，在所述非显示区域内，所述有机膜层在所述衬底基板上的正投影位于所述阻挡层在所述衬底基板上的正投影的范围内。
可选地，在本公开实施例中，所述接触电极，至少包括：层叠设置的第一子电极和第二子电极；
所述第二子电极位于所述第一子电极背离所述衬底基板的一侧。
可选地，在本公开实施例中，还包括：位于所述显示区域的薄膜晶体管；
所述第一子电极与所述薄膜晶体管的源极位于同一膜层。
可选地，在本公开实施例中，还包括：与所述薄膜晶体管的栅极耦接的栅极线；
所述接触电极与所述栅极线耦接。
可选地，在本公开实施例中，还包括：位于所述显示面板的显示区域内的多个发光器件，封装层，以及触控电极层；
所述发光器件位于所述衬底基板之上，所述封装层覆盖多个所述发光器件，所述阻挡层延伸至所述显示区域内，且所述阻挡层位于所述封装层背离所述衬底基板的一侧，所述触控电极层位于所述阻挡层背离所述衬底基板的一侧。
可选地，在本公开实施例中，所述阻挡层与所述层间绝缘层包括的无机 材料相同。
可选地，在本公开实施例中，所述衬底基板，包括：至少一层柔性基板。
相应地，本公开实施例还提供了一种显示装置，其中，包括：上述显示面板。
可选地，在本公开实施例中，还包括：控制芯片；
所述控制芯片，包括：多个接触端子；
所述接触端子与所述显示面板中的接触电极直接绑定连接。
可选地，在本公开实施例中，还包括：柔性电路板，以及控制芯片；
所述控制芯片通过所述柔性电路板与所述接触电极绑定连接。
附图说明
图1为本公开实施提供的显示面板的俯视结构示意图；
图2为图1中绑定区域C的局部放大示意图；
图3为图2中虚线TT′处的一种截面示意图；
图4为图1中虚线L处的截面示意图；
图5为图2中虚线TT′处的另一种截面示意图；
图6为形成各接触电极后的结构示意图；
图7为形成有机膜层后的俯视结构示意图；
图8为图7中虚线TT′处的截面示意图；
图9为本公开实施例提供的显示装置的截面示意图之一；
图10为本公开实施例提供的显示装置的截面示意图之二。
具体实施方式
如图1所示，OLED显示面板包括显示区域A及非显示区域B，在非显示区域B内具有绑定区域C，在绑定区域C内具有多个接触电极11，OLED显示面板可以通过接触电极11与控制芯片实现电连接。在相邻的触控电极11之间的间隙中，设有有机膜层以及覆盖有机膜层的阻挡层。
由于有机膜层包括有机材料，阻挡层包括无机材料，例如，阻挡层可以包括氮化硅材料，因而有机膜层与阻挡层之间的粘合性较差，并且有机膜层的吸水性较好，在高温高湿的环境下，例如在信赖性验证过程中会将OLED显示面板置于高温高湿的环境中，有机膜层会吸收很多水分，并在有机膜层与阻挡层之间产生气泡，导致有机膜层与阻挡层之间的粘合性变差，使阻挡层与有机膜层之间逐渐分离，最终导致阻挡层脱落，甚至会导致绑定在接触电极处的控制芯片也脱落下来，从而导致与控制芯片连接的信号走线断线，在显示区域出现亮线等显示不良。
基于此，本公开实施例提供了一种显示面板及显示装置。下面结合附图，对本公开实施例提供的显示面板及显示装置的具体实施方式进行详细地说明。附图中各膜层的厚度和形状不反映真实比例，目的只是示意说明本发明内容。
图1为本公开实施提供的显示面板的俯视结构示意图，图2为图1中绑定区域C的局部放大示意图，图3为图2中虚线TT′处的截面示意图，如图1至图3所示，本公开实施例提供的显示面板，包括：
衬底基板10；
多个接触电极11，位于显示面板的非显示区域B内的衬底基板10之上；
无机膜层12，位于接触电极11靠近衬底基板10的一侧；无机膜层12包括无机材料；
有机膜层13，位于接触电极11背离衬底基板10的一侧；
阻挡层14，位于有机膜层13背离衬底基板10的一侧；阻挡层14包括无机材料；
在相邻的接触电极11之间的至少部分间隙D中，有机膜层13设有开口U。
本公开实施例提供的显示面板，通过去除相邻的接触电极之间的间隙中的至少部分有机膜层，使有机膜层在相邻的接触电极之间的间隙中具有开口，降低了有机膜层的吸水性，避免了阻挡层发生脱落，降低了控制芯片脱落的风险。
如图1所示，显示面板包括显示区域A和非显示区域B，接触电极11可以位于非显示区域B中的绑定区域C中，图1中以有限数量的接触电极11，且各接触电极11位于同一行为例进行示意，在实际应用中，绑定区域C中接触电极11用于与控制芯片绑定连接，因而，绑定区域C中接触电极11的数量和排布方式，可以根据需要绑定的控制芯片的接触端子数量和分布进行设置，此处不对接触电极的数量和排列方式进行限定。
图4为图1在虚线L处的截面示意图，如图4所示，本公开实施例中，上述显示面板可以为有机电致发光显示面板，具体地，在显示面板的显示区域A中具有多个发光器件21，发光器件21可以为有机电致发光二极管，为了驱动各发光器件发光，在衬底基板与发光器件之间还设有驱动电路24，驱动电路24可以包括多个薄膜晶体管及多条信号走线，上述有机膜层13可以延伸至显示区域A，并覆盖位于显示区域A内的驱动电路24，以起到平坦层的作用，从而为发光器件21提供较平坦的基底。上述无机膜层12可以延伸至显示区域A，可以隔绝薄膜晶体管中的源极与有源层，起到层间绝缘层的作用。
由于有机膜层13一般包括有机材料，有机膜层13具有吸水性，在有机膜层13背离衬底基板10的一侧设置阻挡层14，可以保护有机膜层13，并起到防水、提高机械性能的作用。
应该说明的是，绑定区域C中的接触电极11的尺寸较小，在本公开实施例的各附图中为了更清楚的示意接触电极11的结构，将相邻的接触电极11之间的间隙D示意的较窄，在实际应用中，接触电极11的尺寸应小于间隙D的尺寸。因此，在本公开实施例中，去除间隙中的至少部分有机膜层13，可以明显降低有机膜层的吸水性，并且可以很大程度提高阻挡层的附着力，从而避免了阻挡层发生脱落，进而降低了控制芯片脱落的风险。
在具体实施时，在相邻的接触电极之间的间隙中，平坦层中可以设置一个较大的开口，或者，也可以根据实际需求，在同一个间隙的平坦层中设置多个开口，此处不对同一个间隙的平坦层中开口的数量进行限定。
进一步地，本公开实施例提供的上述显示面板中，如图3所示，在相邻的接触电极11之间的至少部分间隙D中，阻挡层14通过开口U与无机膜层12接触。
通过去除相邻的接触电极11之间的间隙D中的至少部分有机膜层13，使有机膜层13在相邻的接触电极11之间的间隙D中具有开口U，从而，使阻挡层14通过开口U与无机膜层12接触，由于阻挡层14与无机膜层12均包括无机材料，因而阻挡层14与无机膜层12之间的粘合性较好，从而增加了阻挡层14的附着力，降低了控制芯片脱落的风险。
具体地，本公开实施例提供的上述显示面板中，参照图3，阻挡层14与无机膜层12包括的无机材料相同，从而，可以使阻挡层14与无机膜层12之间的粘合性更好，进一步增强阻挡层14的附着力。具体地，上述无机膜层12可以包括第一无机层和第二无机层，其中第一无机层可以采用氧化硅材料制作，第二无机层位于第一无机层背离衬底基板的一侧，第二无机层可以采用氮化硅材料制作，上述阻挡层也可以采用氮化硅材料制作，并且阻挡层与第二无机层接触，阻挡层与第二无机层的粘合性较好。
此外，在另一种实现方式中，在相邻的接触电极之间的至少部分间隙中，阻挡层也可以通过粘合层与无机膜层贴合，也能使阻挡层具有较强的粘附力，避免阻挡层脱落。
更进一步地，本公开实施例提供的上述显示面板中，同样参照图1至图3，在任意两个相邻的接触电极11之间的间隙D中，阻挡层14均通过开口U与无机膜层12接触。
也就是说，在任意两个相邻的接触电极11之间的间隙D中，均去除部分有机膜层13，使阻挡层14与无机膜层12接触，从而可以进一步降低有机膜层的吸水性，并进一步提高阻挡层的附着力。
在具体实施时，为了更进一步的提高阻挡层的附着力，除了去除相邻的接触电极之间的间隙中的有机膜层外，还可以去除绑定区域中其他位置处的有机膜层，例如可以去除绑定区域边缘处的有机膜层。
具体地，本公开实施例提供的上述显示面板中，如图1所示，有机膜层13包括：多个分别与各接触电极11一一对应的第一通孔V1；
阻挡层14，包括：多个分别与各第一通孔V1一一对应的第二通孔V2；
接触电极11通过对应的第一通孔V1和第二通孔V2露出。
通过在有机膜层13中设置第一通孔V1，并在阻挡层14中设置第二通孔V2，可以使接触电极11通过对应的第一通孔V1和第二通孔V2露出，以便后续通过接触电极11与控制芯片实现耦接。
在具体实施时，本公开实施例提供的上述显示面板中，如图3所示，接触电极11，至少包括：层叠设置的第一子电极111和第二子电极112；
第二子电极112位于第一子电极111背离衬底基板10的一侧。
上述接触电极11至少包括层叠设置的第一子电极111和第二子电极112，可以得到相应厚度的接触电极11，在具体实施时，可以根据实际需要的接触电极11的厚度来设置子电极的层数，上述接触电极11还可以包括更多叠层设置的子电极，或者，接触电极11也可以仅包括一个子电极，此处不对子电极的数量进行限定。
进一步地，本公开实施例提供的上述显示面板中，如图3所示，上述有机膜层13贴合设置在接触电极11的侧边，以保护接触电极11，从而可以防止接触电极11的侧边被腐蚀。
具体地，上述接触电极11中的子电极可以包括三层叠层设置的金属膜层，其中位于中间的金属膜层包括金属铝，例如，第一子电极111和/或第二子电极112包括三层叠层设置的金属膜层，其中位于中间的金属膜层包括金属铝。
在实际工艺过程中，在形成有机膜层13之后，需要在有机膜层13之上形成阳极膜层(阳极膜层位于显示区域中，图中未示出)，然后对阳极膜层进行湿法刻蚀得到多个阳极的图形，由于阳极膜层中含有金属银，在对阳极膜层进行湿法刻蚀的过程中，将阳极膜层浸泡在刻蚀液中，阳极膜层中的银离子就会溶解到刻蚀液中，由于第一子电极111和第二子电极112中位于中间的金属膜层一般包括金属铝，如果接触电极11的侧边裸露，刻蚀液中的银离子 就会与接触电极11侧边的金属铝发生置换反应，而析出金属银，析出的金属银会通过刻蚀液漂到显示面板的各个位置处，最终影响显示面板的显示性能。
本公开实施例中，通过有机膜层13贴合设置在接触电极11的侧边，在对阳极膜层进行湿法刻蚀的过程中，接触电极11的侧边不再裸露，从而可以避免析出金属银，保证显示面板具有较好的显示性能。
更进一步地，本公开实施例提供的上述显示面板中，参照图3，有机膜层13覆盖接触电极11背离衬底基板10一侧的表面的边缘，从而可以将接触电极11的侧边完全包裹住，保证在对阳极膜层进行湿法刻蚀的过程中，不会有金属银析出。
图5为图2中虚线TT′处的另一种截面示意图，如图5所示，上述触控电极11中，第二子电极112的边缘可以设置为贴合设置在第一子电极111的侧边，从而在对阳极膜层进行湿法刻蚀的过程中，第一子电极111的侧边的金属铝不再裸露，可以进一步防止刻蚀液中的银离子与接触电极11中的金属铝接触，进一步降低金属银析出的风险。
以图5所示的结构为例，图6为形成各接触电极11后的结构示意图，图7为形成有机膜层13后的俯视结构示意图，图8为图7中虚线TT′处的截面示意图，如图6至图8所示，在实际应用中，为了更大程度的提高阻挡层14的附着力，除了留下用于覆盖接触电极11的侧边的部分有机膜层13外，可以将位于相邻的接触电极11之间的间隙D中的其余有机膜层13均去除。
在具体实施时，本公开实施例提供的上述显示面板中，如图3所示，在非显示区域内，有机膜层13在衬底基板10上的正投影位于阻挡层14在衬底基板10上的正投影的范围内，也就是说，在非显示区域内，有机膜层13被阻挡层14完全包裹住，从而防止有机膜层13吸水。
可选地，本公开实施例提供的上述显示面板中，参照图3和图4，还可以包括：位于显示区域A的薄膜晶体管，如图4所示，薄膜晶体管可以位于驱动电路24内；
第一子电极111与薄膜晶体管的源极位于同一膜层。
在实际工艺过程中，可以同一次构图工艺制作第一子电极与薄膜晶体管的源极，具体地，可以形成金属膜层，采用同一个掩膜版对金属膜层进行图形化，以得到第一子电极与薄膜晶体管的源极的图形，从而可以节省制作工序，降低制作成本。
在具体实施时，本公开实施例提供的上述显示面板中，参照图3，还可以包括：与薄膜晶体管的栅极耦接的栅极线15；
接触电极11与栅极线15耦接。
在本公开实施例中，薄膜晶体管一般位于显示区域，栅极线15的一端与薄膜晶体管的栅极耦接，另一端延伸至非显示区域与接触电极11耦接，控制芯片与接触电极11绑定连接后，可以实现控制芯片与薄膜晶体管的栅极之间耦接，因而，接触电极11可以将控制芯片发出的控制信号传输至栅极，从而可以通过控制芯片控制薄膜晶体管是否导通，以控制发光器件发光。
具体地，本公开实施例提供的上述显示面板中，如图4所示，还可以包括：位于显示面板的显示区域A内的多个发光器件21，封装层22，以及触控电极层23；
发光器件21位于衬底基板10之上，封装层22覆盖多个发光器件21，阻挡层14延伸至显示区域A内，且阻挡层14位于封装层22背离衬底基板10的一侧，触控电极层23位于阻挡层14背离衬底基板10的一侧。
上述阻挡层14在显示区域A中起到隔离触控电极层23与封装层22的作用，阻挡层14延伸至非显示区域B的绑定区域中，还可以起到保护有机膜层13、防水、提高机械性能的作用。
上述封装层可以包括层叠且交替设置的无机层221和有机层222，其中，无机层221起到阻隔水汽和氧气的作用，有机层222起到释放应力的作用。上述触控电极层23可以包括多个相互独立的自电容电极；或者，上述触控电极层23也可以包括多个第一触控电极及多个第二触控电极，第一触控电极与第二触控电极相绝缘。
如图4所示，为了避免切割工艺过程中产生的裂纹延伸至显示区域A内， 还可以设置围绕显示区域A的至少一个挡墙25，并且，封装层22中的无机膜层221可以覆盖挡墙25，从而增大无机膜层221的面积，延长水汽和氧气的传输路径，避免水汽和氧气传输至显示区域A内。
在实际应用中，本公开实施例提供的上述显示面板中，如图3所示，上述衬底基板10，可以包括：至少一层柔性基板101。这样，可以使显示面板具有一定的柔性，或者实现可弯折的性能。图3中以衬底基板10包括两层柔性基板101为例进行示意，在具体实施时，可以根据实际需要来设置柔性基板101的层数，此处不做限定。在每个柔性基板101靠近接触电极11的一侧，还可以设置缓冲层102。
如图3所示，上述显示面板，还可以包括：位于衬底基板10与栅极线15之间的第一栅极绝缘层16，以及位于第一栅极绝缘层16与无机膜层12之间的第二栅极绝缘层17。
基于同一发明构思，本公开实施例还提供了一种显示装置，包括上述显示面板，该显示装置可以应用于手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。由于该显示装置解决问题的原理与上述显示面板相似，因此该显示装置的实施可以参见上述显示面板的实施，重复之处不再赘述。
在具体实施时，本公开实施例提供的上述显示装置中，如图9所示，还可以包括：控制芯片31；
控制芯片31，包括：多个接触端子P1；
接触端子P1与显示面板中的接触电极11直接绑定连接。
上述控制芯片31通过接触端子P1与接触电极11直接绑定连接，因而控制芯片31可以通过接触电极11与显示面板中的信号走线(例如栅极线)实现耦接，以控制显示面板进行画面显示，并且结构简单，制作成本较低。
此外，本公开实施例提供的上述显示装置中，如图10所示，还可以包括：柔性电路板32，以及控制芯片(图中未示出)；
控制芯片通过柔性电路板32与接触电极11绑定连接。
在实际应用中，柔性电路板32可以包括接触引脚P2，柔性电路板32可以通过接触引脚P2与接触电极11绑定连接，将柔性电路板32的一端与触控电极11绑定连接，将另一端弯折至显示面板背离显示面的一侧，并与控制芯片耦接，从而可以减小显示面板在显示面一侧的边框，实现显示装置的窄边框化。
本公开实施例提供的显示面板及显示装置，通过去除相邻的接触电极之间的间隙中的至少部分有机膜层，使阻挡层与无机膜层接触，由于阻挡层与无机膜层均包括无机材料，因而阻挡层与无机膜层之间的粘合性较好，从而增加了阻挡层的附着力，另外，通过去除部分有机膜层，降低了有机膜层的吸水性，避免了阻挡层发生脱落，降低了控制芯片脱落的风险。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (16)

  1. 一种显示面板，其中，包括：
    衬底基板；
    多个接触电极，位于所述显示面板的非显示区域内的所述衬底基板之上；
    无机膜层，位于所述接触电极靠近所述衬底基板的一侧；所述无机膜层包括无机材料；
    有机膜层，位于所述接触电极背离所述衬底基板的一侧；
    阻挡层，位于所述有机膜层背离所述衬底基板的一侧；所述阻挡层包括无机材料；
    在相邻的所述接触电极之间的至少部分间隙中，所述有机膜层设有开口。
  2. 如权利要求1所述的显示面板，其中，在相邻的所述接触电极之间的至少部分间隙中，所述阻挡层通过所述开口与所述无机膜层接触。
  3. 如权利要求2所述的显示面板，其中，在任意两个相邻的所述接触电极之间的间隙中，所述阻挡层均通过所述开口与所述无机膜层接触。
  4. 如权利要求1所述的显示面板，其中，所述有机膜层包括：多个分别与各所述接触电极一一对应的第一通孔；
    所述阻挡层，包括：多个分别与各所述第一通孔一一对应的第二通孔；
    所述接触电极通过对应的所述第一通孔和所述第二通孔露出。
  5. 如权利要求1所述的显示面板，其中，所述有机膜层贴合设置在所述接触电极的侧边，以保护所述接触电极。
  6. 如权利要求5所述的显示面板，其中，所述有机膜层覆盖所述接触电极背离所述衬底基板一侧的表面的边缘。
  7. 如权利要求6所述的显示面板，其中，在所述非显示区域内，所述有机膜层在所述衬底基板上的正投影位于所述阻挡层在所述衬底基板上的正投影的范围内。
  8. 如权利要求1所述的显示面板，其中，所述接触电极，至少包括：层 叠设置的第一子电极和第二子电极；
    所述第二子电极位于所述第一子电极背离所述衬底基板的一侧。
  9. 如权利要求8所述的显示面板，其中，还包括：位于所述显示区域的薄膜晶体管；
    所述第一子电极与所述薄膜晶体管的源极位于同一膜层。
  10. 如权利要求9所述的显示面板，其中，还包括：与所述薄膜晶体管的栅极耦接的栅极线；
    所述接触电极与所述栅极线耦接。
  11. 如权利要求1所述的显示面板，其中，还包括：位于所述显示面板的显示区域内的多个发光器件，封装层，以及触控电极层；
    所述发光器件位于所述衬底基板之上，所述封装层覆盖多个所述发光器件，所述阻挡层延伸至所述显示区域内，且所述阻挡层位于所述封装层背离所述衬底基板的一侧，所述触控电极层位于所述阻挡层背离所述衬底基板的一侧。
  12. 如权利要求1～11任一项所述的显示面板，其中，所述阻挡层与所述层间绝缘层包括的无机材料相同。
  13. 如权利要求1～11任一项所述的显示面板，其中，所述衬底基板，包括：至少一层柔性基板。
  14. 一种显示装置，其中，包括：如权利要求1～13任一项所述的显示面板。
  15. 如权利要求14所述的显示装置，其中，还包括：控制芯片；
    所述控制芯片，包括：多个接触端子；
    所述接触端子与所述显示面板中的接触电极直接绑定连接。
  16. 如权利要求14所述的显示装置，其中，还包括：柔性电路板，以及控制芯片；
    所述控制芯片通过所述柔性电路板与所述接触电极绑定连接。
PCT/CN2021/079697 2020-04-28 2021-03-09 显示面板及显示装置 WO2021218395A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US17/629,573 US20240049531A1 (en) 2020-04-28 2021-03-09 Display panel and display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202010348086.2 2020-04-28
CN202010348086.2A CN111524908A (zh) 2020-04-28 2020-04-28 显示面板及显示装置

Publications (1)

Publication Number Publication Date
WO2021218395A1 true WO2021218395A1 (zh) 2021-11-04

Family

ID=71910992

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/079697 WO2021218395A1 (zh) 2020-04-28 2021-03-09 显示面板及显示装置

Country Status (3)

Country Link
US (1) US20240049531A1 (zh)
CN (1) CN111524908A (zh)
WO (1) WO2021218395A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114582253A (zh) * 2022-03-07 2022-06-03 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111524908A (zh) * 2020-04-28 2020-08-11 京东方科技集团股份有限公司 显示面板及显示装置
CN111796718A (zh) 2020-07-06 2020-10-20 京东方科技集团股份有限公司 触控显示面板及其制备方法、显示装置
CN114530474A (zh) * 2020-10-30 2022-05-24 京东方科技集团股份有限公司 显示面板、显示装置及显示面板的制造方法
WO2022099507A1 (zh) * 2020-11-11 2022-05-19 京东方科技集团股份有限公司 显示面板的制作方法及显示基板
CN113346031B (zh) * 2021-05-28 2023-05-23 京东方科技集团股份有限公司 显示装置
CN114023794B (zh) * 2021-10-27 2023-05-05 深圳市华星光电半导体显示技术有限公司 显示面板及显示面板的制作方法
CN115361855A (zh) * 2022-08-11 2022-11-18 合肥维信诺科技有限公司 导电结构和显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109309101A (zh) * 2018-10-25 2019-02-05 昆山国显光电有限公司 显示面板及显示装置
CN110970484A (zh) * 2019-12-20 2020-04-07 京东方科技集团股份有限公司 显示基板及显示装置
CN111524908A (zh) * 2020-04-28 2020-08-11 京东方科技集团股份有限公司 显示面板及显示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109309101A (zh) * 2018-10-25 2019-02-05 昆山国显光电有限公司 显示面板及显示装置
CN110970484A (zh) * 2019-12-20 2020-04-07 京东方科技集团股份有限公司 显示基板及显示装置
CN111524908A (zh) * 2020-04-28 2020-08-11 京东方科技集团股份有限公司 显示面板及显示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114582253A (zh) * 2022-03-07 2022-06-03 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
CN114582253B (zh) * 2022-03-07 2023-11-10 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置

Also Published As

Publication number Publication date
US20240049531A1 (en) 2024-02-08
CN111524908A (zh) 2020-08-11

Similar Documents

Publication Publication Date Title
WO2021218395A1 (zh) 显示面板及显示装置
US20210193777A1 (en) Display substrate and display device
CN109801949B (zh) 有机发光显示面板和显示装置
CN108538852B (zh) 柔性显示面板及柔性显示装置
CN111710691B (zh) 柔性Micro-LED显示面板及其制作方法
JP6989494B2 (ja) 表示装置およびビアホールの電気接続構造
US20170221981A1 (en) Display device and method of manufacturing display device
WO2019073678A1 (ja) 表示装置
CN109148529B (zh) 基板及显示装置
KR20180047536A (ko) 유기발광 표시장치
WO2017105637A1 (en) Organic light-emitting diode displays with reduced border area
US8890151B2 (en) Organic light-emitting display apparatus
WO2021190034A1 (zh) 显示基板、其制备方法及显示装置
US20200403047A1 (en) Display device and manufacturing method thereof
WO2021168828A1 (zh) 柔性显示面板、显示装置及制备方法
JP6399801B2 (ja) 有機エレクトロルミネッセンス表示装置
WO2022213582A1 (zh) 显示面板和显示装置
CN110473895B (zh) 一种oled显示基板及其制作方法、显示装置
CN111796718A (zh) 触控显示面板及其制备方法、显示装置
CN109326625A (zh) 显示设备
WO2023065433A1 (zh) 显示面板及显示装置
TW202018992A (zh) 畫素結構
KR20210074549A (ko) 유기발광 표시장치
KR102061529B1 (ko) 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법
WO2022099507A1 (zh) 显示面板的制作方法及显示基板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21796425

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 17629573

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21796425

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 21796425

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 30.06.2023)