WO2016080520A1 - 電子部品搭載用放熱基板 - Google Patents
電子部品搭載用放熱基板 Download PDFInfo
- Publication number
- WO2016080520A1 WO2016080520A1 PCT/JP2015/082703 JP2015082703W WO2016080520A1 WO 2016080520 A1 WO2016080520 A1 WO 2016080520A1 JP 2015082703 W JP2015082703 W JP 2015082703W WO 2016080520 A1 WO2016080520 A1 WO 2016080520A1
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- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- lead frame
- heat dissipation
- substrate
- component mounting
- Prior art date
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
Definitions
- the present invention relates to a substrate for mounting or mounting an electronic component with reduced wiring resistance and improved heat dissipation, and more specifically, a circuit for mounting the electronic component by punching or the like.
- the present invention relates to a heat dissipating board for mounting electronic components, in which an insulator is filled between the lead frames of a conductor plate formed on a pattern-shaped lead frame, and the whole is formed in a planar shape.
- an electronic circuit that handles a large amount of power such as a power supply circuit or an inverter circuit using a so-called power semiconductor is an electronic device including the electronic circuit.
- the power board is formed as a power board that combines these power semiconductors, etc., and the electronic circuit that handles the high power and the electronic circuit that handles the low power are separate boards.
- such a dedicated substrate is formed by bonding a conductive foil (made of copper) to a surface of a metal support plate made of a material such as aluminum via a thin insulator layer and etching the conductive foil.
- a substrate for forming a wiring pattern is used, and a power semiconductor and various electronic components are mounted on the substrate to form a circuit.
- Patent Document 1 Japanese Patent No. 3855306
- Patent Document 2 Japanese Patent Application Laid-Open No. 2014-72316
- Patent Document 3 Japanese Patent Application Laid-Open No. 2013-125848
- Patent Document 4 techniques described in International Publication No. 2009/110376
- Patent Document 1 relates to a heat dissipation board for mounting electronic components, and the heat dissipation board for mounting electronic components is formed of a metal plate punched into a predetermined wiring pattern, and integrally formed with the metal plate. And at least a component mounting portion in the metal plate is exposed from the composite insulating material, and a stepped portion is provided in the heat generating component arrangement portion in the component mounting portion. It has a structure.
- the composite insulating material formed at the lower portion of the heat generating component placement portion is thinned by the step processed portion, and as a result, after heat diffusion by the metal plate, high heat conduction It is described that heat dissipation is improved because heat is radiated by the insulating material.
- Patent Document 3 when the size of the power module is reduced when the size of the power device package case using a silicon carbide device or the like is reduced, the distance between the terminals is reduced.
- the purpose is to solve problems such as a high possibility of occurrence of a discharge phenomenon.
- Patent Document 3 discloses that “a substrate, a low-voltage side gate terminal electrode disposed on a first side of the substrate, a low-voltage side gate electrode disposed on the first side, and the low-voltage side” A low voltage side source terminal electrode disposed adjacent to the gate terminal electrode; and a high voltage side gate disposed on the first side and spaced apart from the low voltage side gate terminal electrode and the low voltage side source terminal electrode.
- Patent Document 4 relates to a lead frame substrate or the like, and is filled with a plurality of independent patterns for holding electronic components and a gap between adjacent patterns so as to be adjacent to each other. And a resin bonding material for connecting the patterns to each other.
- the resin bonding material protrudes in the thickness direction from the surface position of the pattern, and a heat conductive resin sheet is provided on the back surface of the substrate. It is described that a metal base plate and a metal cooling fin are provided.
- Patent Document 1 includes a metal plate punched into a predetermined wiring pattern and a highly thermally conductive composite insulating material integrally molded with the metal plate, the metal The plate portion is covered with the composite insulating material, and a structure is adopted in which only the component mounting portion of the metal plate is exposed from the composite insulating material. For this reason, depending on the structure, there is a problem that heat is not sufficiently released from the entire substrate including the metal plate portion to the external environment, and heat is likely to accumulate in the composite insulating material.
- Patent Document 2 and Patent Document 3 described above is a method in which a circuit including a switching element or the like or a power device element itself is mounted or created on a lead frame, and is connected to a wiring and a solder joint or a bus bar or the like. A method of connecting by wire bonding or the like is adopted.
- the substrate on which the circuit of Patent Document 2 is mounted is a general substrate in which an insulating layer is provided on the lower layer on which a wiring pattern is formed, similar to that described in Patent Document 1.
- the problem of heat accumulation occurs.
- the technology described in Patent Document 3 forms the elements constituting the power module by a transfer mold package, heat accumulation is the same as in Patent Document 1 and Patent Document 2. It was a problem.
- the present invention aims to solve the above problems, and even in a circuit using a power semiconductor or the like through which a large current flows, the wiring resistance can be reduced and the heat dissipation can be improved by the high power operation. It is an object of the present invention to provide an electronic component mounting heat dissipation board capable of achieving the above.
- the present invention comprises a conductor plate formed on a lead frame having a wiring pattern shape, and an insulating material provided between the lead frames having the wiring pattern shape on the conductor plate.
- the component placement surface plate surface and the insulation material component placement surface side surface form one continuous surface, and the conductor plate has a back surface plate surface of the component placement surface and the insulation material component placement surface.
- the plate surface on the back surface of the component placement surface of the lead frame having a shape and the surface on the back surface side of the component placement surface side of the insulating material are the back of the component placement surface of the lead frame having the largest thickness among the lead frames.
- the lead frame is formed on the same surface in accordance with the plate surface, the thick lead frame is used for a large current signal, and the thin lead frame is used for a small current signal. Providing a substrate.
- the solution of the above-described problem can be achieved more effectively by arranging the lead frames having different thicknesses from each other in a mixed manner.
- the solution of the above-mentioned problem is to cover the plate surface of the component placement surface of the lead frame with the insulating material by providing a concave portion on the plate surface of the component placement surface on the portion of the plate surface of the component placement surface,
- the surface of the insulating material covering the surface-side concave portion is formed by forming one surface continuous with the plate surface of the component placement surface of the lead frame and the surface of the insulation material on the component placement surface side,
- a back-side concave portion is provided on the back plate surface of the component placement surface that corresponds to the back surface of the part placement surface of the lead frame where the component is not placed.
- the surface of the insulating material that is covered with the material and covers the concave portion on the back surface is continuous between the plate surface on the back surface of the component placement surface of the lead frame and the surface on the back surface side of the insulation material on the component placement surface side. Forming one surface By it is more effectively achieved.
- a locking portion is provided between the lead frame having the wiring pattern shape and the insulating material from the side surface side of the lead frame to the insulating material side.
- a step between the insulating material on the front side and the back side of the side surface of the frame, or a part of the lead frame of the wiring pattern shape formed on the conductor plate is made of the insulator.
- the portion is more effectively achieved by being formed to be bendable outside the periphery of the insulating material.
- the solution to the above problem is more effective when all or part of the wiring pattern shaped lead frame formed on the conductor plate is in contact with the heat conductor outside the peripheral edge of the insulating material. To be achieved.
- the solution to the above problem is that a plurality of exothermic electronic component groups having a functional unit take a maximum distance that can be taken on the heat dissipation board for mounting electronic components, and the exothermic electronic component group This is achieved more effectively by arranging the current paths from the entrance to the exit of the heat-generating electronic component group to be substantially the same.
- the power device that controls each phase of the electric motor driven by the multiphase alternating current can be taken at the maximum distance on the electronic component mounting heat dissipation board for each phase.
- the length of the current path from the power device to the connection portion of the electric motor is substantially the same for each phase, or the electric motor is a three-phase AC motor, Distributing the power devices for controlling each phase of the electric motor around each vertex of an equilateral triangle centered on the substantially central portion of the electronic component mounting heat dissipation board, and connecting the electric motor from the power device
- the length of the current path to the section is substantially the same as that in the three-phase system, which is more effectively achieved.
- the output direction from the power devices arranged in a distributed manner is such that the lead wire is drawn out from the power device in the extending direction of each vertex of the equilateral triangle from the center of the equilateral triangle. This is achieved more effectively.
- the two heat dissipating boards for mounting electronic parts are configured as one heat dissipating board for mounting electronic parts via an insertion sheet, and the one heat dissipating board for mounting electronic parts is configured.
- the interposer constituting the one electronic component mounting heat dissipation substrate This is achieved more effectively by using the lower surface of the other electronic component mounting heat dissipation board with the sheet interposed therebetween as the back surface side of the one electronic component mounting heat dissipation substrate.
- the solution to the above problem is that the plurality of heat-generating electronic component groups having the functional unit are distributed on the front surface side when the electronic component mounting heat dissipation board is distributed on the front surface side and the back surface side.
- the heat generating electronic component group distributed and arranged on the back surface side with respect to the heat generating electronic component group is a plate of the heat dissipating board for mounting electronic components on the front side and the back side of the heat dissipating substrate for mounting electronic components. This is achieved more effectively by dispersively arranging so as not to be symmetrical with respect to the plane.
- the solution to the above problem is when power devices for controlling the electric motor are distributed around each apex of the equilateral triangle centered on the substantially central portion of the surface side of the electronic component mounting heat dissipation board.
- the distributed arrangement is similarly performed on the back side of the electronic component mounting heat dissipation board, and when performing the distributed arrangement on the back side, positions corresponding to the vertices of the equilateral triangle are set on the front side and the back side.
- the solution to the above problem is a heat dissipation structure using the heat dissipation board for mounting electronic components, wherein the back surface of the component placement surface of at least two of the heat dissipation boards for mounting electronic components is attached via a heat conductor. This is achieved effectively by the heat dissipation structure using the electronic component mounting heat dissipation board that performs heat dissipation from the electronic component mounting heat dissipation substrate.
- the solution to the above problem is a power module of an electric power steering apparatus using the heat dissipation board for mounting electronic components, wherein the lead frame having a large thickness is used for a large current signal of the power module, and the lead having a small thickness is used.
- the frame is effectively achieved by the power module of the electric power steering apparatus used for the small current signal of the power module.
- connection structure of a shunt resistor used for the electronic component mounting heat dissipation board, the heat dissipation structure, or the power module wherein the electronic component mounting heat dissipation board is the thick lead frame.
- There are two connection portions for connecting the two terminals of the shunt resistor and one end of the thin lead frame is disposed in the vicinity of each of the two connection portions, or One end of the thin lead frame is disposed in a notch provided in a part of each of the two connecting portions, and the connection of the two terminals of the shunt resistor is connected to the shunt resistor on the two connecting portions.
- the solution to the above problem is that the electric power steering device using the heat dissipation board for mounting electronic components, the electric power steering device using the heat dissipation structure, or the electric power having the connection structure of the shunt resistor. This is achieved more effectively by the steering device.
- a circuit board for mounting electronic components by punching a conductor plate using a metal such as aluminum or copper by pressing or by a laser processing method or the like.
- a pattern-shaped lead frame is formed. And since the gap between the lead frames is hardened with a heat conductive resin or the like and fixed as a whole, there is no need to provide a special step processing portion on the mounting or mounting portion of the heat-generating electronic component etc. It has become.
- the electronic component mounting heat dissipation board of the present invention it is possible to configure a circuit by directly soldering an electronic component such as a power semiconductor on a lead frame having a wiring pattern formed by the conductor plate, Since it is possible to increase the thickness of the conductor plate forming the lead frame, even when used in a circuit through which a large current flows, the amount of heat generation can be effectively suppressed by reducing the circuit wiring resistance.
- an electric power steering device for example, to suppress a temperature rise due to a transient phenomenon such as a sudden heat generation caused by a high current flowing through the power device to cope with a sudden steering. Is also possible.
- a conventional aluminum substrate 2100 has an insulating layer formed on the upper surface of an aluminum layer, and pattern wiring by a copper foil layer or the like formed on the upper surface of the insulating layer.
- An electronic component EC such as an FET or a capacitor is mounted, and the lower surface of the aluminum layer is disposed in the case via a TIM as will be described later.
- a substrate 2200 according to the present invention as shown in FIG. 24B is composed of a lead frame 110 and an insulating material 130, and each electronic component EC is directly mounted on the lead frame 110 by SMT. It is possible to manufacture with a conventional reflow apparatus.
- the insulating layer is only TIM, and in addition, the lead frame serves as a heat spreader. Improved characteristics.
- custom parts (terminal terminals) or the like can be eliminated when connecting to another control board or the like, so that the cost can be reduced.
- a large-capacity electrolytic capacitor can be mounted on the substrate of the present invention, so that the electrical characteristics are improved and the large-capacity electrolytic capacitor is used. There is also an advantage that it is not necessary to provide a separate substrate.
- the control device that houses the board as necessary. It is a highly heat conductive material (TIM, (Thermal Interface Material)) provided in the case, and can be radiated to an external heat mass through an insulating composite insulating material, etc. It is possible to further improve heat dissipation by a synergistic action with the casing of the control device in which the substrate is accommodated.
- TIM Thermal Interface Material
- the insulating material of the present invention is composed of a high thermal conductive composite insulating material or the like, and the insulating layer formed between the lead frames having the circuit pattern shape can also be formed thick, the insulating property is improved. This has the effect of improving the distribution capacity such as the electrostatic capacity between the patterns.
- the conductor plate for example, the lead frame 110 having a wiring pattern shape having at least two or more kinds of mutually different thicknesses. It is also possible to form In this case, the lead frames having different thicknesses can be mixed with each other. Therefore, by adopting a configuration in which lead frames having different plate thicknesses are mixed and used as described above, it is possible to arrange the lead frames in a high density according to the amount of current supplied to the mounted electronic component. Yes, it is possible to reduce the related costs through reductions in materials used and dimensions.
- FIG. 1 It is the figure which showed the general structure of the electric power steering apparatus.
- the example of the heat sink for electronic component mounting of this invention is illustrated, (A) is a top view, (B) is a side view.
- (A) is a cross-sectional view of the substrate of the present invention constituted by lead frames having the same thickness as viewed from the extending direction of the lead frame, and (B) is based on lead frames having different thicknesses. It is sectional drawing seen from the extending
- (A) is the top view which comprised the circuit on the board
- (B) uses two kinds of lead frames which have different thickness and width
- (A) is the top view which comprised the circuit on the board
- (B) is the side view
- (C) is a lead which has a different kind of thickness It is a side view which shows the example which used the upper and lower surfaces of the board
- FIG. (A) is a perspective view showing a configuration example when a recess is provided in the lead frame
- (B) is a cross section of the cross section taken along the line XX of (A) as seen from the direction of the arrow in FIG.
- FIG. (A) shows the example which mounted electronic components EC etc. on the upper surface side of the heat sink for electronic component mounting
- (B) is the side view.
- It is the perspective view which showed the example which provided the recessed part in the lead frame, and formed the board surface of the board
- (A) is a perspective view which shows the state of the lead frame before filling with an insulating material
- FIG. 5 is a perspective view showing a state of a substrate after filling with an insulating material.
- FIG. 2 shows an example in which an edge portion is provided on an outer edge of a substrate according to the present invention
- (A) is a top view thereof
- (B) is a case where a lead frame having the same thickness is used for the substrate. It is a side view
- (C) is a side view at the time of using the lead frame which has mutually different thickness for the said board
- (A) is a top view when a component is mounted on the substrate shown in FIG. 9,
- (B) is a side view when a lead frame having the same thickness is used on the substrate, and (C).
- FIG. 4 is a side view when lead frames having different thicknesses are used for the substrate.
- (A) is the sectional side view which illustrated the case where the heat sink board for electronic component mounting by this invention was accommodated in the housing
- (B) is the case where the conventional type
- (A) is a perspective view showing an example in which a part of a lead frame having a wiring pattern shape according to the present invention is formed by bending in an arbitrary direction above or below a plate surface on the inner peripheral side or outer peripheral side of an insulator. It is a figure, (B), (C) is the sectional side view which illustrated the example of the latching
- FIG. (A) is a perspective view showing an example in which the lead frame is bent above the component placement surface of the substrate according to the present invention
- (B) is a perspective view showing an example in which the lead frame is folded below the component placement surface of the substrate.
- FIG. (A) is sectional drawing which shows the example which formed the latching
- (I) is a top view which shows the other example of a latching
- (J) and (K) are the examples which provided the resin sealing shape inward from the side surface of the lead frame.
- FIG. 17 is a top view showing an example different from FIG.
- FIG. 16 in which a heat-generating electronic component group of each phase of a three-phase AC electric motor is dispersedly arranged at each apex portion of an equilateral triangle on a heat dissipation board for mounting electronic components according to the present invention.
- (A) is a top view showing an outline when a plurality of heat-generating electronic component groups (UP, VP, WP) are dispersedly arranged on a plate surface on the surface side of a substrate according to the present invention
- (B) Similarly, it is a top view schematically showing a case where a plurality of heat-generating electronic component groups (UP ⁇ , VP ⁇ , WP ⁇ ) are dispersedly arranged on the back surface of the substrate according to the present invention.
- FIG. 4 is a side sectional view illustrating an example in which two electronic component mounting heat dissipating boards according to the present invention are configured as one electronic component mounting heat dissipating board using an insertion sheet, and electronic components EC are mounted on both surfaces thereof.
- (A) is side sectional drawing which shows the example which formed the insertion sheet
- (A) is the perspective view showing the composition before connecting the shunt resistor to the electronic component mounting heat dissipation board concerning the present invention.
- (B) is a perspective view showing the configuration after connecting a shunt resistor to the substrate.
- (A) is sectional drawing which shows the example of the conventional type aluminum substrate
- (B) is sectional drawing which shows the example of the board
- (A) is a top view showing a case in which a carrier is left on both ends of the frame after forming a thick lead frame, and (B) shows a carrier after forming a thin lead frame in the same manner.
- FIG. 22A is a side sectional view illustrating an example in which two types of lead frames combined as shown in FIG. 22C are assembled in a mold and combined with an insulating material such as a resin material
- (C) is a top view after removing the said carrier after the said combination.
- FIG. 3 is a flowchart for forming a substrate (multiple lead frame substrate) according to the present invention in which a thin lead frame and a thin lead frame are combined.
- the electric power steering device applies steering assist force (assist force) to the steering mechanism of the vehicle by the rotational force of the electric motor, and the driving force of the motor is applied to a gear or belt via a speed reduction mechanism.
- a steering assist force is applied to the steering shaft or the rack shaft by the transmission mechanism.
- EPS electric power steering device
- Such feedback control adjusts the electric motor applied voltage so that the difference between the steering assist command value (current command value) and the electric motor current detection value is small. This is done by adjusting the duty of PWM (pulse width modulation) control.
- PWM pulse width modulation
- a column shaft (steering shaft, handle shaft) 2 of the handle 1 is a reduction gear of a reduction mechanism 3, universal joints 4a and 4b, a pinion rack mechanism. 5, via tie rods 6a and 6b, and further connected to steered wheels 8L and 8R via hub units 7a and 7b.
- the column shaft 2 is provided with a torque sensor 10 for detecting the steering torque of the handle 1 and a steering angle sensor 14 for detecting the steering angle ⁇ , and the motor 20 for assisting the steering force of the handle 1 is provided with the speed reduction mechanism 3.
- a reduction gear gear ratio n
- MCU micro control unit
- the control device 30 configured as described above calculates a current command value of an assist (steering assist) command based on the steering torque Th detected by the torque sensor 10 and the vehicle speed Vel detected by the vehicle speed sensor 12.
- the current supplied to the electric motor 20 is controlled by a voltage control command value Vref obtained by compensating the current command value.
- the steering angle sensor 14 is not essential and may not be provided, and the steering angle can be obtained from a rotational position sensor such as a resolver connected to an electric motor.
- the control device 30 is connected to a CAN (Controller Area Network) 50 that transmits and receives various types of vehicle information, and the vehicle speed Vel can also be received from the CAN 50.
- the control device 30 is also connected to a non-CAN 51 that exchanges communications other than the CAN 50, analog / digital signals, radio waves, and the like.
- the electronic component mounting heat dissipating board of the present invention provided inside the control apparatus 30 is configured as follows. Note that, in the following description, the same constituent elements that may take other forms are denoted by the same symbols, and overlapping descriptions and configurations may be partially omitted. Also, the size and ratio of each component shown in the drawings may be different from the actual ones for convenience of explanation.
- FIG. 2 illustrates an example of an electronic component mounting heat dissipation board 100 (s) according to the present invention, where (A) is a top view and (B) is a side view.
- the electronic component mounting heat dissipation board 100 (s) of the present invention basically includes a lead frame 110 formed by means such as punching into a wiring pattern shape, and the lead frame 110.
- the insulating material 130 is integrally formed between the frames 110. 2
- the portion surrounded by the white closed curve represents the lead frame 110
- the gray shaded portion in FIG. 2A to the hatched portion in FIG. 2B represents the insulating material 130. .
- the lead frame 110 is formed of a conductor plate, and thus is formed in a flat plate shape as a whole. It is formed in the wiring pattern shape of the circuit to be mounted.
- the means for forming the wiring pattern shape of the conductor plate on the lead frame 110 is not particularly limited. For example, it is made of a metal (for example, made of aluminum) that has been press-cut, punched, or laser-processed and cut. It is possible to employ a plate material such as copper).
- the thickness of the lead frame 110 formed by the conductor is increased, thereby reducing the wiring resistance.
- the thickness of the lead frame 110 formed by the conductor is increased, thereby reducing the wiring resistance.
- the thickness of the conductor plate is, for example, when copper is used. Is more preferably at least 300 ⁇ m or more.
- the plate thickness of the conductor plate can be arbitrarily set, so that the signal line of the lead frame formed by the conductor plate is made to flow a small current and a large current. In this case, it is also possible to change the feed width in the press working or the like depending on the plate thickness.
- the present invention is not limited to this, and the wiring is increased by increasing the volume by increasing the plate thickness. It is possible to reduce the resistance and improve the heat dissipation, and as a result, it is possible to further improve the mounting density of the components.
- the lead frame 110 having a wiring pattern shape having at least two types of different thicknesses is used, for example, by using at least two types of different thicknesses as the conductor plate. It is also possible to form. In this case, the lead frames having different thicknesses can be mixed with each other.
- the lead frame is formed by, for example, punching as described above, an operation of creating a contour shape of the lead frame wiring portion by pressing is performed, which is called blanking.
- the material used is larger than that of the final molded product, and the enlarged part is called “bridge”.
- the necessary minimum width of the above-mentioned width is, when the plate thickness is t (mm), the “feed width” is about 1.0 to 1.5 tmm, and the “edge width” is 1.5 ⁇ “feed width”, and it is said that if the width is too small, normal removal cannot be performed, and the wear of the punch and die is accelerated, causing burrs.
- FIG. 3A shows a cross-sectional view of the substrate of the present invention constituted by the lead frame having the same thickness as viewed from the extending direction of the lead frame
- FIG. 3 Shows a cross-sectional view of the substrate of the present invention constituted by lead frames having different thicknesses as viewed from the extending direction of the lead frame.
- two large current lines 110H widths W4 and W6, respectively
- small signal lines 110L width W5
- two large current lines 110H widths W1 and W3, respectively
- small signal lines 110L width W2
- the mutual interval between the plurality of lead frames is determined by the large current line. Since the small current line 110L can be arranged between 110H, the total of the arrangement of the widths of the plurality of lead frames 110 and the feed widths (portions filled with the filler) is approximately ⁇ ( ⁇ + W1 + W3).
- the width formed by the plurality of lead frames 110 and the front edge material is compared as a result of the configuration as described above, ⁇ > ⁇ is satisfied, and the thickness of the small signal line 110L is set to a large current line.
- the lead frame 110L for the small current line can use a conductor plate with a thinner plate thickness, It is also possible to reduce costs by saving.
- the circuit mounted on the substrate is made denser than the substrate using a single-thickness lead frame. It is possible to reduce the size.
- FIG. 4A is a top view in which a circuit is formed on the electronic component mounting heat dissipation substrate 400 of the present invention using the lead frame 110 having a single type of thickness
- FIG. It is a top view which shows the example which comprised the same circuit in the heat sink board 450 for electronic component mounting of this invention using two types, the lead frames 110H and 110L which have such different thickness and width.
- FIG. 4 shows a state in which the electronic component EC or the like is mounted on the substrate, and the circuit shows an example of an inverter circuit of a three-phase brushless motor used in the electric power steering device described above.
- a wiring system through which a relatively large current such as an FET used in the above circuit flows and a wiring system through which a relatively small current used for these control signals flow are simply used.
- the lead frame 110 having one type of thickness for example, 1 mm
- the substrate surface area is about 4800 mm 2 .
- a thick lead (eg, about 1 mm) is used in a wiring system through which a relatively large current flows, such as an FET used in the circuit, using different lead frames 110.
- a high power lead frame 110H is used, and a thin (for example, about 0.25 mm) low power lead frame 110L is used for a wiring system through which a relatively small current used for these control signals flows. Since it is possible to reduce the width of the lead frame in accordance with the thickness of the lead frame, the circuit board surface area of the circuit similar to the above can be reduced to about 4032 mm 2 .
- the surface area of the substrate 450 can be reduced by about 15 percent compared to the substrate 400.
- the conductor plate material forming the lead frame is formed of a relatively good metal good conductor such as copper or aluminum as described above, and the cost can be reduced. Since the lead frame 110 is formed and the electronic component is mounted by soldering or the like, it is desirable that the thermal conductivity is high and at the same time, the electronic component is suitable for mounting.
- the insulating material 130 is a gap between the lead frames 110 having the wiring pattern shape formed by the conductor plate. It is configured to fill the space, and by filling the gap between the lead frames, the lead frames are bonded to each other, and the entire structure is basically stably held on a flat plate. Yes.
- the electronic components of the lead frame 110 are mounted.
- the front side is the front side perpendicular to the paper surface of FIG. 2A (the upper direction in the case of FIG. 2B) is the upper surface side
- the plate on the upper surface side of the lead frame 110 The surface and the plate surface (front surface) on the upper surface side of the insulating material 130 are formed to form the same plane, and the back surface of the plate surface formed by the lead frame 110 and the insulating material 130 are formed.
- the back surface is formed so as to form the same plane.
- the side on which the electronic component is mounted can be arbitrarily selected, and the electronic component can be mounted on both sides of the electronic component mounting heat dissipation substrate 100.
- the embodiment 100 (s) in FIG. 5 when the plate thicknesses of the lead frames 110 formed from the conductor plates are different from each other, the embodiment 100 (s) in FIG. Similarly to the case, the side on which the electronic component of the lead frame 110 is mounted is the front side perpendicular to the paper surface of FIG. 5A (the upper direction in the case of FIG. 5B) is the upper surface side. In this case, the plate surface on the upper surface side of the lead frame 110 and the plate surface (surface) on the upper surface side of the insulating material 130 are formed to form the same plane.
- the thickness of the lead frame 110 is different as described above for the plate surface on the back side from the side on which the electronic components of the lead frame 110 are mounted, between the back surfaces constituted by the lead frame 110. Then, the same plane cannot be constructed. Therefore, the plate surface on the back surface of the component placement surface of the lead frame 110 formed by the conductor plate and the plate surface (front surface) on the back surface side on the component placement surface side of the insulating material 130 are described in the lead frame.
- the insulating material is filled in accordance with the back surface of the component placement surface of the lead frame having the largest thickness, and is formed by the back surface of the thickest lead frame and the insulator.
- the plate surface (front surface) on the back surface side is formed on the same surface.
- the back surface of the substrate when the lead frame having the plurality of thicknesses is used is formed so that the back surface of the component placement surface of the thickest lead frame and the insulating material constitute the same plane. Will be.
- the side on which the electronic component is mounted can be arbitrarily selected.
- the electronic component mounting heat dissipation substrate 100 (s ) Or 100 (d) (hereinafter collectively referred to as 100 (s, d) or 100), the electronic component may be mounted.
- the configuration of the insulating material 130 and the lead frame 110 is not limited to the configuration in which the insulating material 130 is provided between the lead frames 110 as described above, and the component arrangement of the lead frame 110 as shown in FIG. It is also possible to adopt a configuration in which a recess 113 is provided in addition to the component mounting portion on the surface side, and the recess 113 is also covered with the insulator 130.
- FIG. 6A is a perspective view showing a configuration example when the recess 113 is provided in the lead frame 110
- FIG. 6B is a cross-sectional view taken along the line XX of FIG. 6A. It is sectional drawing seen from the direction of the arrow in the figure. 6 does not show the entire substrate, but shows only some examples of the lead frame 110 and the insulating material 130. With respect to the entire substrate, a configuration example 400 is shown in FIG. 8 to be described later. Yes.
- the electronic component EC is included in the plate surface (the upper surface shown in the perspective view of FIG. 6A) of the component placement surface on which the electronic component EC of the lead frame 110 is mounted.
- a surface-side recess 113 (u) is provided on the plate surface of the component placement surface, and the insulating material 130 is provided in the surface-side recess 113 (u).
- a configuration is adopted in which the surface side recess 113 (u) is covered with the insulating material 130 by filling.
- the surface of the insulating material 130 covering the surface-side recess 113 (u) is a continuous surface between the component placement surface of the lead frame 110 and the surface of the insulation material 130 on the component placement surface side. Configured to form one surface.
- the plate surface on the back surface of the component placement surface for mounting the electronic component EC of the lead frame 110 (the lower surface shown in the perspective view of FIG. 6A). ) And the portion corresponding to the back surface of the portion where the electronic component EC is not disposed in the component placement surface, as shown in FIG.
- a recess 113 (d) is provided and covered with the insulating material 130, and the surface of the insulating material 130 covering the back-side recess 113 (d) is a plate on the back side of the component placement surface of the lead frame 110.
- a single continuous surface is formed by the surface and the back surface of the insulating material 130 on the component placement surface side.
- the method for forming the recess 113 as described above is not particularly limited. However, when the lead frame 110 is formed, it can be simultaneously formed by means such as a press.
- the insulating material 130 is not only filled and joined to the side surfaces between the lead frames 110, but also in the axial direction of the lead frame 110 (for example, FIG. 6 ( Since the insulating material 130 can be communicated from both side surfaces of the lead frame 110 in a direction perpendicular to the XX line in A), the upper surface to the lower surface side of the lead frame 110. In this case, the lead frame can be joined in contact with the lead frame.
- the insulating material 130 is formed so that the plate surface of the component placement surface of the lead frame 110 and the back surface side thereof form the same plane as described above, including the material that fills the recess 113. Yes.
- the lead frame 110 and the insulating material 130 It is possible to improve the bonding strength.
- the concave portion 113 is filled with the plate surface of the component placement surface of the lead frame 110 and the surface of the insulating material 130 as described above.
- the form and arrangement of the recess 113 are not limited to the configuration example shown in FIG. 6 according to the electronic circuit, but may be arranged near some electronic components, or the surface-side recess 113 (u) or Only the back-side recess 113 (d) may be provided, or the configuration of the recess 113 may be formed by a curve or the like.
- the depth of the concave surface of the concave portion can be determined in consideration of adhesiveness to the lead frame 110, heat dissipation, and the like.
- the constituent elements of the insulating material 130 are formed of a composite insulating resin material such as heat-dissipating polycarbonate or engineering plastic, but are not limited thereto.
- the selection can be made in consideration of heat dissipation and compatibility with the material of the conductor plate constituting the lead frame 110.
- the insulating material 130 is filled in the space between the lead frames 110 having the wiring pattern shape by the conductor plate and the periphery thereof. For this reason, the insulating material 130 can improve the rigidity of the electronic component mounting heat dissipation board 100 as a whole, and can effectively absorb the heat from the electronic components mounted as described above together with the lead frame 110. It is possible to dissipate heat.
- the lead frame 110 formed in the wiring pattern and the insulating material 130 are integrally formed by a technique such as insert molding.
- the electronic component mounting heat dissipation board 100 (s, d) can be configured.
- the substrate 100 (d) can be configured by mixing the lead frames having different thicknesses as described above. It is. Therefore, the lead frame having a large thickness and the lead frame having a thin thickness are alternately arranged, or a plurality of the lead frames having a small thickness are arranged between the lead frames having a large thickness. For example, it is possible to arrange the circuit in consideration of the circuit configuration or the like and the dispersion of the heat generation area.
- the lead frame 110 having the wiring pattern shape of the electronic circuit can be formed by press molding or the like, so that the cost can be reduced by tact reduction. It is. In addition, for the same reason, it is not necessary to mount a terminal or the like, and it is possible to reduce costs by reducing the number of parts.
- transfer molding is not used, but in the present invention, compared to the above-described transfer molding, electrolytic capacitors and choke coils that require countermeasures against high temperatures can be arranged in the same row, and wire bonding In addition to the necessity of the above process, since it is possible to effectively prevent warping of the substrate due to sudden heat generation, there is an advantage that an expensive ceramic substrate used for a transfer module or the like is not necessary.
- FIG. 7A illustrates an example in which an electronic component EC or the like is mounted on the upper surface side of the electronic component mounting heat dissipation substrate 100 (s, d) of the present invention formed as described above.
- 7B and 7C are side views thereof.
- FIG. 7A shows the case where the lead frames 110 having the same thickness 100 (s) as described above are used, or different ones 100 (d). Even if it is a case where it uses), it is possible to comprise similarly.
- 7B illustrates the case where the lead frames 110 have the same thickness as the substrate 100 (s)
- FIG. 7C illustrates the lead frame 110 as described above. The case of the substrates 100 (d) having different thicknesses is illustrated.
- the electronic component EC or the like mounted on the upper surface side of the electronic component mounting heat dissipation board 100 includes a semiconductor switching element for current control, a shunt resistor for detecting control current, and ripple absorption.
- Exothermic parts such as large-capacity capacitors for use, and in addition, bus bars bb made of a metal plate such as copper or aluminum and jumper pins for connecting between the lead frames as required Etc. are also included.
- the electronic component EC is not limited to a packaged one, and may be mounted by bare chip mounting.
- the electronic component EC is directly arranged on the lead frame 110 formed in the wiring pattern shape of the electronic circuit. Can be implemented.
- the mirror of the mounted electronic component EC Although not shown in FIG. 7 above, it is possible to arrange the mirror of the mounted electronic component EC. Therefore, particularly when used in the control device of the electric power steering device, the specifications of the right handle, the left handle, etc. are easily achieved. Correspondence is possible. Furthermore, according to the electronic component mounting heat dissipation substrate 100 (s, d) of the present invention, it is also possible to mount the electronic component EC on both the upper surface and the lower surface of the lead frame 110 formed by the conductor plate. . Therefore, there is an advantage that a three-dimensional substrate can be arranged.
- FIG. 8A is a perspective view showing a state of the lead frame 110 before filling with the insulating material 130
- FIG. 8B is a perspective view showing an example in which the plate surface is formed. It is a perspective view which shows the state of the board
- FIG. In addition, about the said recessed part 113, although only the surface side recessed part 113 (u) is displayed here, it is also possible to provide the back surface side recessed part 113 (d).
- the lead frame 110 is bent upward at the outer edge of the substrate, as in the example of FIG.
- the recess 113 is provided in advance in the portion of the lead frame 110 constituting the substrate 400 that is to be reinforced by the insulating material 130, while the electron in the lead frame 110 is electronic.
- the thickness of the lead frame material 110 can be partially changed.
- the lead frame 110 and the insulating material 130 constitute the same plane.
- the soldering range can be easily controlled.
- FIG. 9 shows an example of an electronic component mounting heat dissipation substrate 200 (s, d) in which the following edge portion is provided on the outer edge of the substrate of the present invention
- FIG. FIG. 9B is a side view when a lead frame having the same thickness is used as the substrate 200 (s)
- FIG. 9C is a different thickness as the substrate 200 (d). It is a side view at the time of using the lead frame which has thickness.
- the lead frame has a thickness 110H having a large current thickness, a thickness 110L having a small signal thickness, and a medium current thickness through which an intermediate current flows.
- a display including three types of 110M having the display is displayed.
- the electronic component mounting heat dissipation board 200 (s, d) shown in FIG. 9 is arranged on the peripheral portion of the insulating material 130 constituting the present invention by the insulator 130.
- the edge part 150 comprised in the shape of a closed curve is formed in the surface side.
- the edge 150 of the closed curve shape is formed in a rectangular shape according to the contour of the outer edge of the insulator 130, but the contour is arbitrarily selected according to the form of the substrate to be selected. It is also possible to configure.
- the edge 150 is configured and provided as described above, so that the joint portion between the lead frame 110 and the insulating material 130 is not further peeled off, and the electronic component mounting is provided. It is possible to further improve the rigidity of the heat dissipation substrate 200 (s, d).
- FIG. 10 is a top view when components are mounted on the board shown in FIG. 9, and FIG. 10B is a side view when a lead frame having the same thickness is used on the board.
- (C) is a side view when lead frames having different thicknesses are used for the substrate.
- FIG. 10 The example described in FIG. 10 is formed as described above after the electronic component EC is mounted on the electronic component mounting heat dissipation board 200 (s, d) as shown in FIGS. 7 (A) to (C).
- the border 150 is provided only on the upper surface side of the electronic component mounting heat dissipation substrate 200 (s, d), but it can be provided not only on the upper surface side but also on the lower surface side. Alternatively, it can be provided only on the lower surface side.
- the electronic component mounting heat dissipating board of the present invention can be used by being housed in a casing of a control device such as the above-described electric power steering device.
- a part of the casing of the control device is made of a good heat conductor, and the back surface of the electronic component mounting heat dissipation board on the electronic component arrangement side and the portion of the good heat conductor of the casing of the control device
- FIG. 11A is a side sectional view illustrating the case where the electronic component mounting heat dissipation board 100 (s) of the present invention as described above is housed in the casing of the control device 1000 as described above.
- 11B is a side cross-sectional view showing an example in which the conventional substrate 5000 is stored in the control device 2000.
- FIG. 11A is a side sectional view illustrating the case where the electronic component mounting heat dissipation board 100 (s) of the present invention as described above is housed in the casing of the control device 1000 as described above.
- 11B is a side cross-sectional view showing an example in which the conventional substrate 5000 is stored in the control device 2000.
- the basic laminated structure is as follows: 1. Heat dissipation surface of electronic parts (FET etc.) 2. solder layer; 3. Copper foil pattern layer 4. insulating layer; Aluminum base substrate, 6. TIM layer 1100,7. It is an aluminum die casting 1300 that doubles as a case of the control device 1000 and a radiator.
- the control apparatus 1000 that houses the electronic component mounting heat dissipation board 100 (s) of the present invention as shown in FIG. 1. Heat dissipation surface of electronic parts (FET etc.) 2. solder layer; 3. Wiring pattern (copper with a plate thickness of about 0.3 mm) TIM layer 1100, 5. It is an aluminum die casting 1300 that doubles as a case of the control device 1000 and a radiator.
- the board of the lead frame 110 having the wiring pattern shape formed from the conductor plate at the same time as the laminated structure is simplified as compared with the conventional board 5000. It is possible to increase the thickness, and it is possible to more effectively dissipate heat from the heat-generating electronic component EC.
- the example of the substrate 100 (s) in which the lead frames 110 have the same thickness is used as the electronic component mounting heat dissipation substrate, but the lead frames 110 have different thicknesses. The same applies to the substrate 100 (d) using a substrate.
- a part of the lead frame 110 having a wiring pattern shape formed by the above-described conductor plate is connected to the inner peripheral side of the insulator or the like. It is also possible to bend it in an arbitrary direction above or below the plate surface of the conductor plate on the outer peripheral side. Therefore, when formed in this way, it is possible to facilitate connection with a connection terminal, another substrate, or the like existing outside the electronic component mounting heat dissipation substrate 100 (s, d).
- FIG. 13 is a perspective view showing an example of an electronic component mounting heat dissipation board 800 in which the lead frame 110 is formed as described above.
- FIG. 13A shows a lead above the component placement surface of the board 800.
- FIG. 13B is a perspective view showing an example in which the lead frame is bent below the component placement surface of the substrate 800.
- the substrate 800 is assumed to be a power module of the EPS three-phase control inverter.
- a module substrate in which a plurality of electronic components are combined into one package and molded with resin or the like is usually electrically connected to another resin substrate or the like via a lead.
- the lead portion of the module substrate is oriented in a predetermined direction and cannot be freely changed later. Therefore, the freedom of design and handling has been hindered.
- the above-described embodiment of the present invention is characterized in that the lead portion (a portion outside the periphery of the insulator of the lead frame 110) is bent in an arbitrary direction by post-processing.
- the lead portion without bending, and provide the electronic component mounting heat dissipation board as a common component.
- the lead portion can be bent later according to these specifications.
- combinations with various ECUs and the like are possible, and it is possible to have a degree of design freedom when determining the mounting position of the electronic component mounting heat dissipation board.
- the means or structure for forming the lead frame 110 so that it can be bent.
- brittle fracture caused by bending at least several degrees. It is desirable that it does not generate.
- the side surface of the lead frame 110 having the wiring pattern shape on the insulating material 130 side. It is also possible to provide a locking portion 115 that engages with the insulating material 130.
- the locking portion 115 is configured from the side surface side of the lead frame 110 to the insulating material side 130, and the locking portion 115 is closer to the insulating material 130 than the side surface side of the lead frame 110 of the locking portion 115. Also, the area viewed from the side of the lead frame 110 is increased.
- the engaging portion 115 strengthens the joining of the joint portion of the lead frame 110 and the insulating material 130, and peeling or the like based on the difference in thermal expansion coefficient between the lead frame 110 and the insulating material 130 or the like. It is possible to adopt a configuration that does not easily occur.
- the wiring pattern-shaped lead frame 110 is provided with a locking portion 115 that engages with the insulating material 130 on the side surface on the insulating material 130 side. It is also possible to make the pattern-shaped lead frame 110 into a shape on the premise of mass production by press working.
- all the outer shapes of the engaging portions 115 of the lead frame 110 are characterized by combining straight lines, and are characterized by starting from a taper shape over the entire side edge and ending in a straight shape from the center to the protruding portion. Yes.
- the surface area of the lead frame 110 having the wiring pattern shape can be increased, so that the heat transfer and heat dissipation surface can be increased, the area of engagement with the insulating material 130 can also be increased, and the coupling can be made denser. There is an effect. Thereby, it is possible to further improve the bonding strength and heat dissipation.
- the locking portion 115 can further take the forms described in FIGS. 14B to 14I and the following.
- 14 (B) to 14 (D) are cross-sectional views of the engaging portion 115 of the lead frame so that the side surfaces on both sides of the plate surface of the lead frame can be seen.
- FIG. ) To (H) are also sectional views so that one side of the plate surface of the lead frame can be seen.
- FIG. 14I is a top view of the side surface of the plate surface of the lead frame. It is represented by.
- the slope 14 (B) and 14 (C) are examples of slopes formed to protrude toward the insulating material from the front surface side and back surface side of the lead frame to the central portion side of the side surface.
- the slope has a triangular cross section, and a locking shape such as a circular or elliptical cross section is smoothly formed from the slope at the joint portion of the slope. That is, for example, in the example described in FIG. 14B among the above, the engaging portion 115 that engages with the insulating material 130 is provided on the side surface of the lead frame 110 having the wiring pattern shape on the insulating material 130 side.
- the lead pattern 110 having the wiring pattern shape is assumed to be mass-produced by press working.
- the outer shape of the engaging portion of the lead frame 110 is characterized by a combination of a plurality of curves and a curved surface shape of the engaging portion 115 over the entire side edge. It is characterized in that the insulating material 130 is smoothly spread to the periphery, whereby the coupling between the insulating material 130 and the locking portion becomes stronger. Further, in the example described in FIG. 14C among the above, the outer shape of the engaging portion of the lead frame 110 is a dharma shape, and is characterized by combining a plurality of curves, which is similar to the above case.
- the insulating material 130 is smoothly spread around the locking portion 115 due to the daruma-shaped curved surface over the entire side edge portion, so that the coupling between the insulating material 130 and the locking portion becomes stronger. . Therefore, in the example described in FIG. 14B and FIG. 14C, the surface area of the lead frame 110 having the wiring pattern shape can be increased by adopting the loofah shape or the dharma shape as described above. The heat transfer and heat dissipation surfaces can be enlarged, and the area of engagement with the insulating material 130 is increased and the recess in the central part of the loofah shape works so that the coupling between the lead frame 110 and the insulating material 130 becomes dense. Yes.
- the slope formed from one plate surface of the lead frame to the other plate surface and the other plate surface are formed in parallel.
- the locking portion is formed from a stop piece (a protruding portion formed by a stepped step). That is, in the above example, similar to the above, etc., the lead pattern 110 having the wiring pattern shape is assumed to be mass-produced by press working, and the outer shape of the engaging portion of the lead frame is all linear. Is characterized by the fact that it ends in a straight line up to a protruding part composed of a stepped step extending substantially from the center of the side edge.
- a locking portion is formed by providing a step between the insulating material on the front surface side and the back surface side of the side surface of the lead frame.
- the depth of the step of the locking portion (that is, the length formed by extending the insulating material from the side surface of the lead frame to the center of the plate surface of the lead frame due to the shape of the step) is the lead.
- the depth of the step of the engaging portion is larger on the back side of the side surface of the lead frame. It may be configured to be a thing.
- the engaging portion is placed on the insulating material side from the front surface side and the back surface side of the lead frame to the central portion side of the side surface.
- FIG. 14 (G) shows that the cross section of the slope is triangular
- FIG. 14 (H) shows the front side and the back side of the slope.
- the base point portion from the side is formed so as to be shifted from the position on the vertical line of the plate surface of the lead frame on the front surface side and the back surface side.
- the locking portion as described in FIGS. 13A to 13H can be easily formed by press working or the like as described above.
- the formation of demarcation, loofah, or stepped steps on the interface between the lead frame and the insulating material as described above causes condensation on the substrate. It is also possible to have an effect of suppressing moisture intrusion due to the above.
- the example described in FIG. 14 (I) among the above is that the locking portion is provided on the side surface of the lead frame by forming a recess along the plate surface of the lead frame,
- the recess is formed wider on the back side (that is, in the center direction of the plate surface of the lead frame) than the release end side of the recess. Therefore, when the locking portion is formed in a keyhole shape in this way, the locking portion is formed along the side surface of the plate surface when the plate surface of the lead frame is viewed from the top surface. Therefore, it is possible to increase heat dissipation and mechanical bond strength by increasing the locking area as described above.
- the above description shows an example of the locking portion
- the above-described lead frame will be configured by appropriately changing the parameters of the locking portion described above (for example, the depth of the step). It is possible to adjust according to the characteristics of the circuit.
- the upper drawing of 14 (J) is a top view of the plate surface of the lead frame
- the lower drawing of 14 (J) is a cross-sectional view taken along the line XX of the top view.
- 14 (K) is a top view of the plate surface of the lead frame
- the lower view of 14 (K) is a cross-sectional view taken along the line YY of the top view. Is shown.
- the resin sealing shape Rs is a hole formed so as to penetrate the front and back surfaces of the lead frame as described above, and has a rectangular shape as shown in FIGS. 14J and 14K. However, it may be circular or the like, and there is no particular limitation on the size or shape.
- FIG. 15 is a perspective view showing an example in which the heat conductor 8000 is in contact with the lead frame 110 of the electronic component mounting heat dissipation board 810 according to the present invention outside the periphery of the insulating material 130.
- the thermal conductor 8000 is provided with 8000A and 8000B along two rows formed by the lead frame 110, and the relationship with the substrate 810 is clear for 8000B. As indicated by dotted lines). Since the lead frame 110 is connected to another substrate at the end, the heat conductor 8000 is in contact with the lead frame 110 but not at the end of the lead frame 110. .
- the heat conductor 8000 can be made of an arbitrary heat conductive material. Basically, in order to ensure insulation from the lead frame 110, at least the heat conductor 8000 is in contact with the lead frame. It is necessary to form so as to ensure electrical insulation at the contact portion. Therefore, even if the entire heat conductor is composed of an insulator, or even if the entire heat conductor is composed of a conductor, the surface of the heat conductor has an insulating heat conductive material (TIM). Must be used.
- TIM insulating heat conductive material
- the thermal conductor 8000 is formed of a conductor. Even in such a case, the thermal conductivity and the insulating property may be ensured by means such as applying an insulating coating to the lead frame 110 at the portion in contact with the thermal conductor 8000.
- the heat generated from the electronic component EC is transferred as follows. That is, the electronic component EC is mounted on the lead frame 110 on the component placement surface of the electronic component mounting heat dissipation board 810 according to the present invention. Therefore, as shown in FIG. 15, a structure in which all or a part of the lead frame 110 having the wiring pattern shape formed on the conductor plate is brought into contact with the heat conductor 8000 outside the peripheral edge of the insulator 130. It is possible to conduct the heat generated from the electronic component EC to the outside through the heat conductor 8000.
- the structure in which the lead frame 110 is brought into contact with the heat conductor 8000 is not particularly limited. However, as shown in FIG. 15, the plate constituting the row of the lead frames 110 is configured. When the heat conductor 8000 is brought into contact with the surface, the heat transfer area is increased, so that heat conduction can be performed efficiently.
- two thermal conductors (8000A and 8000B) are provided so as to stand upright on the two side surfaces of the peripheral edge of the substrate 800.
- the four side surfaces of the peripheral edge of the substrate 810 are provided. It is also possible to extend the lead frame 110 to provide the thermal conductor 8000 on the four side surfaces.
- the lead frame 110 is bent upward, but it is not necessarily whether the lead frame 110 is bent or whether it is bent upward or downward. Regardless, it is possible to conduct heat conduction by bringing the thermal conductor 8000 into contact with the lead frame 110. In addition, when it is necessary to consider a combination with a housing for housing the substrate or another substrate, a structure in which the heat conductor 8000 is brought into contact with a part of the lead frame 110 may be adopted. It is.
- a plurality of exothermic electronic component groups having a functional group are taken at the maximum distance that can be taken on the plate of the electronic component mounting heat dissipation board, and the exothermic electronic components are taken.
- FIG. 16 for example, the heat generation property of each phase of the three-phase AC electric motor is formed on the heat dissipating board 830 for mounting the electronic component of the present invention having a substantially rectangular shape.
- FIG. 4 is a top view showing an example in which an electronic component group is dispersedly arranged at each vertex portion of an equilateral triangle and the output ends of the three phases are arranged from the center of gravity of the equilateral triangle toward the extending direction of each vertex. .
- the lines L0a, L0b, and L0c indicated by bold arrows indicate current paths from the power source to the electrolytic capacitor 911 before each phase (L0a for the V phase, L0b for the U phase, and L0b for the W phase).
- L0c), and a line connected so as to extend from L1b indicated by bold arrows to L3b via L2b indicates the current path of the U phase, and similarly, via L1a to L2a indicated by bold arrows
- the line connected to extend to L3a indicates the V-phase current path
- the line connected to extend from L1c to L3c via L2c indicated by a bold arrow indicates the W-phase current path. ing.
- a line connected so as to extend from L4b to L6b via L5b indicated by a bold arrow indicates a current path from the U phase to the ground side of the three-phase AC electric motor.
- a line connected so as to extend from L4a indicated by a bold arrow to L6a via L5a indicates a current path from the V phase to the ground side of the three-phase AC electric motor, and L4c indicated by a bold arrow.
- a line connected so as to extend to L6c via L5c indicates a current path from the W phase to the ground side of the three-phase AC electric motor.
- UP is the inverter circuit of the three-phase AC electric motor (three-phase brushless motor or the like) composed of the U phase, the V phase, and the W phase.
- the U-phase drive region is similarly shown.
- VP indicates the V-phase drive region and WP indicates the W-phase drive region.
- substrate is shown by making the approximate center part on the heat dissipation board 830 into a gravity center.
- a functionally single unit has a heat generation such as an FET.
- An assembly of electronic components (a group of heat-generating electronic components) composed of a plurality of electronic components including heat-generating electronic components is divided into the heat-generating electronic component group (here, three of U, V, and W (as described above)
- the heat-generating electronic component group here, three of U, V, and W (as described above)
- the lengths of the current paths from the current inlet to the heat generating electronic component group to the current outlet from the heat generating electronic component group should be substantially the same.
- the inverter circuit 910 used in the three-phase AC electric motor or the like is connected to the motor 950 via a motor relay unit 930. .
- FIG. 17 is a diagram showing an inverter circuit and each phase current path of the three-phase AC electric motor (three-phase brushless motor or the like), via L1 to L2 indicated by chain lines in the figure.
- the continuous line extending to L3 represents the current path (U phase here) Ui on the input side to the electric motor 950 as in the case of FIG. 16, and Wi indicated by the alternate long and short dash line is also the W phase. This shows a current path on the input side.
- the current path (U phase in this case) Uo from each phase of the electric motor 950 to the ground side is represented as a continuous line extending from L4 to L6 via L5.
- the current path to the ground side is also expressed as Wo.
- the said inverter circuit 910 is a circuit which comprises the motor drive part which inputs the gate drive signal formed based on the electric current command value etc. in the gate drive part which is not shown here, and drives a motor.
- the inverter circuit 910 is composed of an upper and lower arm composed of an upper FET 1 and a lower FET 4 of a U phase, an upper and lower arm composed of an upper FET 2 and a lower FET 5 of a V phase, and an upper and lower arm composed of an upper FET 3 and a lower FET 6 of a W phase.
- Each phase is connected via an electrolytic capacitor 911 from the power supply side, and each phase is connected via a shunt resistor 913 to the ground side.
- the output of each phase by the upper and lower arms is output to each of the electric motors 950 via FETs (935 for the U phase, 937 for the V phase, and 939 for the U phase) constituting the motor relay unit 930. It is connected to the phase input terminals (U, V, W).
- the inverter circuit 910, the motor relay unit 930, and the motor 950 connected in this way are configured such that the path lengths of the current paths of the U phase, V phase, and W phase are substantially equal. ing.
- the U-phase current path includes a path (L1b) from the electrolytic capacitor 911 to the FET 1 and a path (L2b) from the FET 1 to the FET 935 of the motor relay. And from the motor relay FET 935 to the U-phase input terminal U of the motor 950 (L1b + L2b + L3b).
- the V-phase current path is (L1a + L2a + L3a)
- the W-phase The current path is (L1c + L2c + L3c).
- the path lengths of the current paths of the respective phases are configured to be substantially equal to each other.
- the current path to the ground side is also the distance from the motor 950 to the device of the motor relay unit 930 (L4: L4a, L4b, L4c for each phase)
- the path lengths of the currents including the distance are configured to be substantially equal to each other.
- the adjustment of the path length of such a current path can be appropriately adjusted by devising the form of the lead frame and the component arrangement according to the present invention.
- the impedance characteristics from the inverter circuit 910 to the motor 950 can be easily matched by configuring the lengths of the current paths of the phases to be substantially equal between the phases. Through this, ripple accuracy such as torque and speed of the motor 950 can be improved.
- the output line from each phase is adjusted from the virtual equilateral triangle center to the outside of each apex of the equilateral triangle in accordance with the adjustment of the distributed arrangement and the current path length to be substantially the same between the phases.
- the heat-dissipating electronic component group including the power device such as the FET is distributed on the substrate of the electronic component mounting heat dissipation substrate, whereby the distributed arrangement and the heat dissipation for electronic component mounting are performed. It is possible to further improve the driving performance of the motor while improving heat dissipation by a synergistic action with the substrate.
- the electronic component group constituting the inverter circuit of each phase of the three-phase AC electric motor composed of the U phase, the V phase, and the W phase is described as the exothermic electronic component group.
- the electronic component mounting of the present invention as described above is not limited as long as it is an assembly of electronic components composed of a plurality of electronic components including a heat-generating electronic component such as a FET having a single functional group. By disposing the heat dissipating board on the substrate, the same effects as described above can be exhibited.
- the dispersive arrangement allows the exothermic electronic component group to be spaced apart from each other by the maximum distance that can be taken on the substrate, the electronic component mounting is possible.
- Various forms can be adopted according to the form of the heat dissipation board (rectangular shape, polygonal shape, etc.) and the number of the heat generating electronic component groups.
- a plurality of heat-generating electronic component groups having the functional group as described above are not only the upper surface side (front surface side) but also the lower surface side (rear surface) of the electronic component mounting heat dissipation board of the present invention. It is also possible to disperse them on the side.
- the heat-generating electronic component group dispersedly arranged on the surface side of the electronic component mounting heat dissipation board of the present invention is used.
- the exothermic electronic component group distributed and arranged on the back surface side is not symmetrically positioned with respect to the plate surface of the electronic component mounting heat dissipation substrate on the front surface side and the back surface side of the substrate.
- FIG. 18 is similar to FIG.
- the heat-generating electronic components are dispersedly arranged on the surface side of the electronic component mounting heat dissipation board, and then, in FIG. 19 (B).
- the heat generating electronic components may be arranged in a distributed manner on the back surface side of the electronic component mounting heat dissipation board.
- FIG. 19 is a concept showing the difference in the arrangement of the heat-generating electronic component groups on the front side and the back side of the substrate 870, taking the electronic component mounting heat dissipation substrate 870 of the present invention as an example.
- FIG. 19A shows a case where a plurality of heat-generating electronic component groups (UP, VP, WP) as shown in FIG. 18 are distributed on the surface of the substrate 870.
- FIG. 19B shows a case where a plurality of heat-generating electronic component groups (UP ⁇ , VP ⁇ , WP ⁇ ) are arranged in a distributed manner on the back surface of the substrate 870. It is.
- the inverter circuit portion of the three-phase driven electric motor illustrated in FIG. 18 is divided into the constituent elements U phase, V phase, and W phase.
- UP, VP, WP heat generating electronic component groups
- FIG. 19 the circuit pattern formed on the electronic component mounting heat dissipation substrate 870, the electronic components to be mounted, the terminals formed outward from the substrate, and the like are omitted.
- the configuration of the plurality of exothermic electronic component groups is also expressed in a simplified manner.
- FIG. 19 (B) shows a case where heat-generating electronic component groups are distributed and arranged at the apex portion of a virtual equilateral triangle T ′ on the back surface of the substrate 870 in the same manner as the front surface side.
- the center of gravity of the hypothetical triangle T is 60 as the center.
- the position of the equilateral triangle T ′ is shifted to the position rotated by a predetermined degree.
- the positions of the centers of gravity of the virtual equilateral triangle T and equilateral triangle T ′ on the plate surface are symmetrical with respect to the plate surface on the front surface and the back surface.) That is, when seen through the top surface of the substrate 870, the midpoint of each side constituting the virtual equilateral triangle T from the center of gravity of the virtual equilateral triangle T on the top surface side of the substrate 870 It is arranged so that each vertex of the equilateral triangle T ′ formed virtually on the back side is positioned on the direction extension line.
- the exothermic electronic component groups when the exothermic component groups are dispersedly arranged on the front surface side and the back surface side of the substrate 870 as described above, the exothermic electronic component groups (UP, VP, The heat generating electronic component group (UP ⁇ , VP ⁇ , WP ⁇ ) arranged on the back side is not arranged in the portion directly behind the plate surface of (WP), and the plate surface of the heat dissipating board 870 for mounting electronic components is arranged.
- the heat-generating electronic component group is formed in a distributed manner through the front surface and the back surface.
- the uneven distribution of the heat source is prevented through the front surface and the back surface of the substrate, and the generated heat is quickly conducted and dissipated. It is possible.
- An insertion sheet (1800 or 1900) is provided between the two heat dissipating boards for mounting electronic components (900U and 900D) to constitute one board 900, and the insertion sheet (1800 or 1800 or 1900) of the board 1100 is configured. 1900) is used as the upper surface side (front surface side) of the substrate 900, and the lower surface of the other substrate (900D) is used as the lower surface side (back surface side) of the substrate 900. It is also possible.
- FIG. 20 uses the insertion sheet (1800 and 1900) configured as described above to form two electronic component mounting heat dissipating substrates (900U and 900D) as one electronic component mounting heat dissipating substrate 900.
- FIG. 20A illustrates an example in which the insertion sheet 1800 is formed in the same manner as the planar form of the plate surface of the substrate 900.
- FIG. 20B shows an example in which the insertion sheet 1900 is formed by enlarging the peripheral portion as compared with the planar shape of the plate surface of the substrate 900.
- the insertion sheet has a function of electrically insulating between the two substrates at the same time as joining the two electronic component mounting heat dissipating substrates of the present invention. For this reason, it is desirable that the material of the insertion sheet is a material having sufficient adhesiveness to hold the two substrates and having an insulating property. However, since the insertion sheet is not necessarily composed of a single layer, the insertion sheet is formed in a multilayer structure including an adhesive insulating layer and the like to realize the above functions. It does not matter.
- the insertion sheet can be configured by selecting either one or both of a material having high thermal conductivity and a material having low thermal conductivity (heat insulating material) as necessary.
- the heat generation amount and thermal environment of the electronic components mounted on the substrate are considered between the electronic component mounting heat dissipation substrate constituting the front surface side and the electronic component mounting heat dissipation substrate constituting the back surface side.
- the heat generated on the substrate on one surface is conducted to the substrate on the other surface between the front and back surfaces of the heat dissipation substrate for mounting electronic components as in the case of mounting a spare circuit described later. If this is not desirable, it is possible to use a material having low thermal conductivity (a heat insulating material) for the interposition sheet, and by using such a configuration, for example, in the example described later, it is mounted on the surface side. It is also possible to prevent the above-described spare circuit mounted on the back surface from being deteriorated due to the heat generated by driving the normal circuit or the like.
- the insertion sheet 1900 is formed using a material having high thermal conductivity, and as shown in FIG. 20 (B), the plate surface of the substrate 900 on the front side and the back side has a planar shape.
- the peripheral portion 1900E of the insertion sheet 1900 can be used for fixing the substrate 900 or connected to a heat sink for heat dissipation.
- the exothermic electronic component group (UP ⁇ , VP ⁇ , WP ⁇ ) distributed on the back side is included in a plurality of electronic components EC constituting one or a plurality of circuits. It is also possible to use one formed as a part of a circuit constituting a redundant system or a spare circuit of the above three-phase AC electric motor (such as a three-phase brushless motor). By adopting a redundant circuit or the like, it is possible to improve reliability when performing control using the three-phase AC electric motor.
- the circuits formed on the front side and the back side are assigned to normal use and spare use, respectively. If a failure is detected in the circuit, it can be used for a control circuit that drives a spare circuit. In this case, the spare circuit is deteriorated due to heat generated by driving a normal circuit. It is also possible to arrange them in a distributed manner.
- the electric motor is constituted by a double-system winding, and the parallel driving is performed so that the current for driving the motor in each system is halved, the above 2 It is also possible to disperse the heat radiation amount and the heat radiation area by forming the circuits of each of the multiple systems on the front side and the back side of the substrate.
- the space between the front surface side and the back surface side of the substrate is considered in consideration of the driving timing of the heat-generating electronic component group.
- the typical heat generating area dispersion arrangement it is possible to adopt a configuration that takes into account the temporal heat generation dispersion.
- the heat generating electronic component group when the heat generating electronic component group is mounted or distributed and mounted, even if the heat generating electronic component group must be disposed in a relatively close area, the heat generating electronic component group is not provided.
- the heat generation electronic components groups are arranged or driven so that the operation timings do not coincide with each other. Dispersion can be achieved, thereby making it possible to make the heat distribution of the substrate uniform or to improve heat dissipation.
- the heat generating electronic parts group (UP).
- the lengths of current paths from the current inlet to ⁇ , VP ⁇ , WP ⁇ ) to the current outlet from the exothermic electronic component group (UP ⁇ , VP ⁇ , WP ⁇ ) are substantially the same. It is possible to arrange as follows. Therefore, by making such an arrangement, it is possible to easily match the impedance characteristics of the current path from the redundant inverter circuit as exemplified above to the three-phase AC electric motor. It is possible to improve the reliability of ripple accuracy such as torque and speed of the three-phase AC electric motor.
- the positive regular triangle shape T ' is used as the positive regular triangle shape T'.
- Output from the exothermic electronic component group (UP ⁇ , VP ⁇ , WP ⁇ ) in the direction of the line extending the line connecting the vertices of the triangle T 'or in the direction parallel to the edge (side face) of the substrate It is also possible to arrange the wires (lead wires) (UI ⁇ , VI ⁇ , WI ⁇ ) by extending them.
- output lines from the heat generating electronic component groups (UP, VP, WP) arranged between the output lines (UI ⁇ , VI ⁇ , WI ⁇ ) and on the surface side of the substrate 1000. (UI, VI, WI) It is possible to secure an appropriate distance between each other, preventing mutual interference of the output lines of each phase, and further improving the accuracy and stability. It is possible to control the motor.
- an example of a three-phase AC electric motor composed of a U-phase, a V-phase, and a W-phase is shown as an example of dispersive arrangement on the back surface side.
- the electronic component group constituting the inverter circuit of each phase of the motor has been described, the present invention is not limited to this, and a plurality of electronic components including a heat generating electronic component such as a FET having a single functional group.
- the dispersive arrangement may be arranged such that the exothermic electronic component group is separated by a maximum distance that can be taken on the substrate by the dispersive arrangement. If possible, the above electron Depending on the number of goods mounting heat dissipation substrate of the form (rectangular or polygonal shape, etc.) and the heat generating electronic component groups, it is possible to adopt various forms.
- the present invention not only can the heat generated from the heat-generating electronic component group disposed on the surface side of the electronic component mounting heat dissipation substrate of the present invention be dispersed, but also the electronic component mounting heat dissipation substrate of the present invention can be dispersed.
- Heat generated from the heat-generating electronic component group disposed on the back side can be similarly distributed, and the heat generating areas are arranged differently on the front side and the back side of the plate surface of the substrate as described above. Therefore, it is possible to achieve a three-dimensional distribution of the heat generation region over the entire substrate including the front surface side and the back surface side of the substrate.
- the electronic component mounting heat dissipation board of the present invention by arranging the components, it is possible to further prevent the uneven distribution of heat in the electronic component mounting board and to quickly conduct and dissipate the generated heat. .
- FIG. 21 a structure as shown in FIG. 21 can be adopted as a heat dissipation structure using the heat dissipation board for mounting electronic components.
- two electronic component mounting heat dissipating boards according to the present invention are attached to the rear surface of the component placement surface via a heat conductor (heat dissipating plate), and the two substrates are integrated to dissipate heat.
- heat conductor heat dissipating plate
- the heat dissipating structure shown in FIG. 21 is configured such that at least two or more back surfaces of component disposition surfaces of the electronic component mounting heat dissipating substrate according to the present invention are attached via a heat conductor to dissipate heat from the electronic component mounting heat dissipating substrate. Is to do.
- the electronic component heat dissipation substrate for example, the electronic component mounting heat dissipation substrate 800 shown in FIG. 13
- two sheets for example, two of 800A and 800B
- TIM 310 and the like are respectively disposed on the rear surfaces of the component placement surfaces of the two substrates (800A and 800B) (although not necessarily arranged), and the upper and lower surfaces of the heat conductor (heat radiating plate) 1500 through this.
- the substrate 800 it is possible to constitute by attaching the substrate 800 to the above.
- the plurality of substrates may be disposed on one surface of the heat conductor 1500.
- the lead frame 110A of the substrate 800A is bent upward outside the outer edge of the insulating material of the substrate, and the lead frame 110B of the substrate 800B is similarly upward. It is configured so that it can be bent and connected to a connector or the like (not shown) above the two substrates.
- the heat conductor 1500 is connected to a radiator (heat sink) or the like of the control device at a portion that does not interfere with the lead frame 110.
- the structure as described above it is possible to efficiently dissipate heat from the plate surface of the substrate (800A and 800B) through the heat conductor 1500, and further as described above.
- the circuit can be made compact.
- a plurality of substrates are mounted on the front and back surfaces via the thermal conductor 1500, and as described above, the lead frame 110 is bent outside the periphery of the insulator of the substrate.
- the lead frame 110 is bent outside the periphery of the insulator of the substrate.
- the amount of heat released from the electronic components EC mounted on each of the substrates increases, but such heat is radiated to the outside through the heat conductor 1500.
- the size in the vertical direction increases.
- the space that can be mounted varies depending on the vehicle type.
- Such a laminated structure in the vertical direction can be selected as appropriate, and a design corresponding to the structure can be made.
- FIG. 21B shows an example of the thermal conductor 1500 different from that described in FIG. 21B.
- the thermal conductor 1500 shown in FIG. 21B is further provided with a horizontal portion 1500H interposed between the substrates 800A and 800B and the lead frame 110 such as an end of the horizontal portion. It is comprised from the vertical part 1500V provided so that it may stand on the side surface of a board
- the horizontal portion 1500H of the heat conductor 1500 is connected to a heat sink (heat sink) or the like of the control device at a portion that does not interfere with the lead frame 110, as in the case of the heat conductor 1000 described above.
- the horizontal portion 1500H of the body 1500 can be fixed to a control device case or the like to radiate heat.
- the shunt resistor generally means a resistor (a shunt) for detecting a current applied to a load.
- the shunt resistor is an electric motor current value (electric motor current detection for the feedback control of the motor current for the purpose of accurately generating the steering assist torque.
- the feedback control is performed by adjusting the electric motor applied voltage so that the difference between the steering assist command value (current instruction value) and the electric motor current detection value becomes small. .
- the transmission line connected to the electric motor as described above is used.
- the transmission line (signal line) to the current detection circuit that is mounted and detects current via the shunt resistor is connected by a thin wire such as a wire by wire bonding or the like.
- FIG. 22 is a perspective view illustrating the connection structure of the shunt resistor SR according to the present invention
- FIG. 22 (A) shows, for example, the electronic component mounting heat dissipation board 100 (d) according to the present invention. It is the perspective view which showed the structure before connecting shunt resistance SR, (B) is the perspective view which showed the structure after connecting shunt resistance SR to the said board
- the electronic component mounting heat dissipation substrate 100 (d) described above includes the lead frames 110 having different thicknesses, Furthermore, these lead frames 110 are composed of a thick lead frame 110H that is assumed to pass a relatively large current and a thin lead frame 110L that is assumed to pass a relatively small current. Has been.
- connection portion CP for connecting the two terminals of the shunt resistor SR, as shown by the dotted line in FIG. ing.
- the connecting portion CP is a region set as a portion to which the shunt resistor SR is connected, and an appropriate position is determined according to the circuit arrangement.
- a notch LP is provided at a part of the connecting portion CP set on the lead frame 110H and facing each other, and the notch LP has a small thickness.
- One end of the lead frame 110L is disposed.
- the thin lead frame 110L is connected as a signal line to a current detection circuit using the shunt resistor SR.
- the notch portion LP in the connection portion CP When the shunt resistor SR is disposed in the connection portion CP of the substrate 100 (d) configured as described above as shown in FIG. 22B, the notch portion LP in the connection portion CP.
- the shunt resistor SR is mounted on the two types of lead frames 110L and 110H of the substrate 100 (d) by placing and connecting the two terminals of the shunt resistor so as to cover the top from above. Is possible.
- solder is applied to the connection portion CP and the notch portion LP. Printing can also be performed, and solder connection can be performed by performing reflow after SMT (Surface Mount Technology).
- connection structure of the shunt resistor using the electronic component mounting heat dissipation board according to the present invention configured as described above, since the current detection signal can be directly drawn from the shunt resistor SR, only the reflow after SMT is performed. Therefore, it is possible to supply at low cost without requiring a wire bonding process. Moreover, since a thin wire such as a wire is not used for current detection as described above, it is possible to further improve current detection accuracy. Furthermore, in the present invention, a strong structure can be formed by mounting directly on the substrate surface with solder as described above. Therefore, after performing wire bonding or wire bonding as described above, a resin is used.
- the method of filling and fixing is not necessary, and the durability is remarkably improved as compared with the connection by the wire bonding or the like. For example, there is no problem from the vehicle body or the road surface transmitted from the vehicle equipped with the ECU of the electric power steering device. It is possible to maintain a stable structure over a long period even in a harsh environment where regular vibrations and temperature changes are large.
- connection structure of the shunt resistor using the heat dissipation board for mounting electronic components described above is an example of the configuration example, and other configuration examples can be used within the scope of the present invention. . Therefore, as shown in FIG. 23, without providing the notch portion LP in the connection portion CP as described above, one end of the thin lead frame 110L is disposed in the vicinity of the connection portion CP. It doesn't matter.
- FIG. 23 shows the other configuration example as in the case of FIG.
- connection between the two terminals of the shunt resistor SR is performed by placing the two terminals of the shunt resistor on the two connection portions set on the upper surface side of the lead frame 110H.
- the vicinity means that one end of the lead frame 110L is arranged below the two terminals of the shunt resistor when the two terminals of the shunt resistor are arranged in the connection portion with the lead frame 110H. This is an area that can be configured so that it can be directly connected to the shunt resistor and the lead frame 110L.
- the cost reduction and the improvement of the current detection accuracy can be achieved as described above also by the other configuration example of the shunt resistor connection structure using the heat dissipation board for mounting electronic components according to the present invention. Is possible.
- the present invention by providing the configuration as described above, even in a circuit using a power semiconductor or the like through which a large current flows, the wiring resistance can be reduced and the heat dissipation can be improved by the high power operation.
- the electronic component mounting heat dissipating board of the present invention for the electric power steering apparatus or the like, it is possible to operate these apparatuses more effectively.
- the substrate constituted by the lead frame 110 and the insulating material 130 according to the present invention can be formed as follows, for example, with reference to the description of FIGS. 25 to 28.
- FIG. 25 to FIG. 28 are diagrams for explaining an example of producing a substrate when the thickness of the lead frame 110 among the substrates is different
- FIG. 25A shows a thick lead frame 110H formed.
- (B) shows a case where the carrier (Car) is placed at both ends of the frame after forming a lead frame 110L having a similarly thin thickness.
- (C) is a top view at the time of combining the two types of lead frames described in the above (B) and (C) through the carrier.
- FIG. 26A is a side sectional view illustrating an example in which two types of lead frames combined as shown in FIG. 25C are assembled in a mold and combined with an insulating material 130 such as a resin material.
- FIG. 4B is a side sectional view after molding by the mold, and
- FIG. 4C is a top view after the carrier is removed after the combination.
- the insulating material 130 is omitted.
- FIG. 27 shows a means for filling the insulating material 130 when the thick lead frame 110H and the thin lead frame 110L are arranged on both sides of the substrate.
- FIG. 28 is a flowchart for forming a substrate (multiple lead frame substrate) in which a thin lead frame and a thin lead frame are combined.
- the lead frame is processed into a shape (step S1).
- a thick lead frame 110H and a thin lead frame 110L are prepared separately, and both sides of each lead frame are prepared.
- a carrier Car is formed for later processing.
- the carrier Car is a band-shaped portion formed on both side ends of the lead frame as shown above, and maintains the form before the lead frames 110 are bonded to the insulating material 130 and leads frames described later. It is formed for the purpose of alignment.
- the lead frames having different thicknesses are aligned as shown in FIGS. 25A and 25B (step S2). .
- the lead frames having different thicknesses are overlapped to fix the position.
- the alignment is shown in FIGS. 25A and 25B.
- the carrier Car of such two lead frames is processed in advance for positioning, and the position of the carrier Car is fixed by caulking the carrier Car portion by using the processed part. Prevent (step S3).
- the lead frame whose position has been fixed as described above is set in a resin molding die as shown in FIG. 26A (step S4).
- the resin molding mold is composed of upper and lower molds (upper mold and lower mold), and is intended to maintain the shape of the lead frame when filling the resin constituting the insulating material 130. is there. Therefore, an upward pin (height direction positioning pin (P23)) is also disposed below the thin lead frame 110L of the lead frame, and the thin lead frame 110L is disposed on the lower side. It is comprised so that it can hold down toward the upper side.
- Step S5 molding is performed by pouring the resin constituting the insulating material 130 into the mold in which the lead frame is set as described above (step S5), and after the molding is performed, the mold is removed.
- Step S6 As shown in FIGS. 26B and 26C, a completed substrate of the present invention can be obtained.
- the insulating material 130 is not formed in the portion where the pin P23 is disposed, but the insulating material 130 is newly added to the portion according to the use of the substrate according to the present invention or in combination with other components. It is also possible to select filling or not filling. Further, when burrs are generated on the substrate surface (component mounting surface), it is possible to obtain a completed substrate by removing the burrs as necessary (step S7).
- the substrate according to the present invention can be formed as described above. Further, as shown in FIGS. 3C and 5C, both sides of the substrate of the present invention are formed. In the case of forming a thin lead frame, for example, it can be formed as follows.
- step S6 when the thin lead frame 110L is set in the mold, as shown in FIG. 27, components such as FETs on the upper substrate and the lower substrate are arranged.
- the board surface that is the mounting surface does not completely overlap the position on the vertical line passing through the board surface of the board, in other words, it does not completely overlap each other when seen through the back surface from the top surface.
- the lead frame 110L is formed with a slight shift in advance.
- FIG. 27 the lower (back side) lead frame 110L is held by the downward-facing pin P23 ′ newly provided from the upper mold, and similarly, as shown in FIG.
- the insulating material 130 made of the resin or the like is filled in such a structure that the upper (front side) lead frame 110L is held by the upward pin P23 provided on the lower mold by using the portion thus formed. Is possible.
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Abstract
Description
本発明では、このように、後加工により上記リードフレーム110を折り曲げることを可能とする事により、次のような利点を有する。
すなわち、本発明では、上記図18又は図19(A)において示すように、本発明の電子部品搭載用放熱基板の表面側の板面上に複数の発熱性電子部品群を分散して配置する構成を選択することが可能である。そして、上記本発明の電子部品搭載用放熱基板では、上記表面側のみならず裏面側にも上記発熱性電子部品群を含む電子部品を実装することが可能である。
すなわち、上記基板870の上面から透視して見た場合に、上記基板870の上面側の上記仮想的な正三角形状Tの重心から上記仮想的な正三角形状Tを構成する各辺の中点方向の延長線上に上記裏面側に仮想的に形成した正三角形状T`の各頂点が位置するように配置したものとなっている。
そのため、上記近傍とは、上記シャント抵抗の2つの端子を上記リードフレーム110Hとの接続部に接続部に配置した場合に、上記シャント抵抗の2つの端子の下方に上記リードフレーム110Lの一端が配設されるように構成可能な領域であって、上記シャント抵抗と上記リードフレーム110Lとの直接接続が可能な領域のことを意味している。
2 コラム軸(ステアリングシャフト、ハンドル軸)
3 減速機構
4a 4b ユニバーサルジョイント
5 ピニオンラック機構
6a 6b タイロッド
7a 7b ハブユニット
8L 8R 操向車輪
10 トルクセンサ
11 イグニションキー
12 車速センサ
13 バッテリ
14 舵角センサ
20 電動モータ
30 制御装置(コントロールユニット、ECU)
100(s) 200(s) 300 同一の厚みを有するリードフレーム電子部品搭載用放熱基板
100(d) 200(d) 350 異なる厚みを有するリードフレーム電子部品搭載用放熱基板
100(s、d) 200(s、d) 電子部品搭載用放熱基板(リードフレームの厚みが相互に同じものと異なるものとの双方を含む)
110 リードフレーム
110C 環状リードフレーム
110H リードフレーム(大電流ライン用)
110M リードフレーム(中電流ライン用)
110L リードフレーム(小電流ライン用(信号線用))
t リードフレームの厚さ
113 凹部
113(u) 凹部(表面側)
113(d) 凹部(裏面側)
115 係止部
130 絶縁材
150 縁取り部
400 電子部品搭載用放熱基板(凹部形成例)
800 810 電子部品搭載用放熱基板(リードフレーム折り曲げ可能)
830 850 870 電子部品搭載用放熱基板(分散配置したもの)
900 電子部品搭載用放熱基板(介挿シートを含むもの)
910 インバータ回路
911 電解コンデンサ
913 SR シャント抵抗
930 モータリレー部
935 モータリレー部のU相FET
937 モータリレー部のV相FET
939 モータリレー部のW相FET
950 電動モータ
1000 制御装置
1100 制御装置に設けられるTIM層
1300 制御装置の筐体を構成するアルミダイカスト
1800 1900 介挿シート
1900E 介挿シートの周縁部分
5000 従来型の基板
8000 熱伝導体
EC 電子部品
bb バスバー
CP 接続部
LP 切り欠き部
T T` 仮想的な正三角形状
UP UP` U相領域部品群
VP VP` V相領域部品群
WP WP` W相領域部品群
Ui 電源側U相ライン
Uo グランド側U相ライン
Wi 電源側W相ライン
Wo グランド側W相ライン
Ul Ul` U相のリード線引出し方向
Vl Vl` V相のリード線引出し方向
Wl Wl` W相のリード線引出し方向
Claims (21)
- 配線パターン形状のリードフレームに形成した導体板と、前記導体板の前記配線パターン形状のリードフレーム間に設けられた絶縁材とにより構成され、前記導体板の部品配置面の板面と前記絶縁材の部品配置面側の表面とが連続した一つの面を形成し、
前記導体板の前記部品配置面の裏面の板面と前記絶縁材の部品配置面側の裏面側の表面とを同一面上に形成した電子部品搭載用放熱基板であって、
前記配線パターン形状のリードフレームは、少なくとも2種類以上の相互に異なる厚さを有し、
前記配線パターン形状のリードフレームの前記部品配置面の裏面の板面と前記絶縁材の部品配置面側の裏面側の表面とは、前記リードフレームのうち最も厚みを有するリードフレームの前記部品配置面の裏面の板面に合わせて、同一面上に形成し、
厚みの厚い前記リードフレームは大電流信号用とし、厚みの薄い前記リードフレームは小電流信号用として用いることを特徴とする電子部品搭載用放熱基板。 - 前記相互に厚さの異なるリードフレームは、相互に混在して配置される請求項1に記載の電子部品搭載用放熱基板。
- 前記リードフレームの部品配置面の板面のうち、前記部品を配置しない部分には前記部品配置面の板面に表面側凹部を設けて前記絶縁材により被覆し、
前記表面側凹部を被覆する前記絶縁材の表面は、前記リードフレームの前記部品配置面の板面と前記絶縁材の前記部品配置面側の表面とで連続した一つの面を形成する請求項1又は2に記載の電子部品搭載用放熱基板。 - 前記リードフレームの部品配置面の裏面の板面であって、前記部品配置面のうち前記部品を配置しない部分の裏面に当たる部分に、前記裏面の板面に裏面側凹部を設けて前記絶縁材により被覆し、
前記裏面側凹部を被覆する前記絶縁材の表面は、前記リードフレームの部品配置面の裏面の板面と前記絶縁材の前記部品配置面側の裏面側の表面とで連続した一つの面を形成した請求項1乃至3のいずれか1項に記載の電子部品搭載用放熱基板。 - 前記配線パターン形状のリードフレームと前記絶縁材との間で、前記リードフレームの側面側から前記絶縁材側にかけて係止部を設け、
前記係止部は、前記リードフレームの側面の表面側と裏面側に前記絶縁材との間に段差を形成したものである請求項1乃至4のいずれか1項に記載の電子部品搭載用放熱基板。 - 前記導体板に形成した配線パターン形状のリードフレームの一部は、前記絶縁体の周縁より内側又は外側で、その一部を前記導体板の板面に対して上方又は下方に屈曲した形状を有する請求項1乃至5のいずれか1項に記載の電子部品搭載用放熱基板。
- 前記導体板に形成した配線パターン形状のリードフレームの全部又は一部は、前記絶縁材の周縁より外側で、折り曲げ可能に形成された請求項1乃至6のいずれか1項に記載の電子部品搭載用放熱基板。
- 前記導体板に形成した配線パターン形状のリードフレームの全部又は一部は、前記絶縁材の周縁より外側で、熱伝導体に当接される請求項1乃至7のいずれか1項に記載の電子部品搭載用放熱基板。
- 機能的なまとまりを有する複数の発熱性電子部品群が、前記電子部品搭載用放熱基板上で相互に採り得る最大の距離を採り、
かつ、前記発熱性電子部品群への入口から前記発熱性電子部品群の出口までの電流経路の長さが相互に略同一となるように配置した請求項1乃至8のいずれか1項に記載の電子部品搭載用放熱基板。 - 多相交流電流により駆動される電動モータの各相の制御を行うパワーデバイスを、前記各相ごとに前記電子部品搭載用放熱基板上で相互に採り得る最大の距離を採るように配置し、
前記パワーデバイスから前記電動モータの接続部までの電流経路の長さが、前記各相とも略同一である請求項1乃至9のいずれか1項に記載の電子部品搭載用放熱基板。 - 前記電動モータは3相交流モータであり、前記電子部品搭載用放熱基板の略中央部を重心とした正三角形の各頂点部周辺に前記電動モータの各相の制御を行う前記パワーデバイスを分散配置し、
前記パワーデバイスから前記電動モータの接続部までの電流経路の長さが、前記3相系統とも略同一である請求項10に記載の電子部品搭載用放熱基板。 - 前記分散配置された前記パワーデバイスからの出力方向は、前記パワーデバイスからのリード線の引出し方向が、前記正三角形の重心から前記正三角形の各頂点の延長方向に向いている請求項11に記載した電子部品搭載用放熱基板。
- 前記電子部品搭載用放熱基板2枚を介挿シートを介して1枚の電子部品搭載用放熱基板として構成し、前記1枚の電子部品搭載用放熱基板を構成する前記介挿シートを挟んだ一方の電子部品搭載用放熱基板の上面を前記1枚の電子部品搭載用放熱基板の表面側として用い、前記1枚の電子部品搭載用放熱基板を構成する前記介挿シートを挟んだ他の一方の電子部品搭載用放熱基板の下面を前記1枚の電子部品搭載用放熱基板の裏面側として用いる請求項1乃至12のいずれか1項に記載の電子部品搭載用放熱基板。
- 前記機能的なまとまりを有する複数の発熱性電子部品群を前記電子部品搭載用放熱基板の表面側及び裏面側に分散配置する場合に、
前記表面側に分散配置される前記発熱性電子部品群に対して、前記裏面側に分散配置される発熱性電子部品群が、前記電子部品搭載用放熱基板の表面側と裏面側とで前記電子部品搭載用放熱基板の板面に対して対称の位置にならないように分散配置される、請求項1乃至13のいずれか1項に記載の電子部品搭載用放熱基板。 - 前記電子部品搭載用放熱基板の表面側の略中央部を重心とした正三角形状の各頂点部周辺に前記電動モータの制御を行うパワーデバイスを分散配置した場合に、
前記分散配置を前記電子部品搭載用放熱基板の裏面側についても同様に行い、
前記裏面側に分散配置を行う際には、前記正三角形状の頂点に相当する位置を上記表面側と裏面側とで、前記正三角形状の重心を基準にして相互に略60度回転させた異なる位置で行う請求項11乃至14のいずれか1項に記載の電子部品搭載用放熱基板。 - 請求項1乃至15のいずれか1項に記載の電子部品搭載用放熱基板を用いる放熱構造であって、少なくとも2枚以上の前記電子部品搭載用放熱基板の部品配置面の裏面を熱伝導体を介して取り付けて前記電子部品搭載用放熱基板からの放熱を行う前記電子部品搭載用放熱基板を用いる放熱構造。
- 請求項1乃至15のいずれか1項に記載の電子部品搭載用放熱基板を用いる電動パワーステアリング装置のパワーモジュールであって、厚みの厚い前記リードフレームは前記パワーモジュールの大電流信号用とし、厚みの薄い前記リードフレームは前記パワーモジュールの小電流信号用として用いる電動パワーステアリング装置のパワーモジュール。
- 請求項1乃至15のいずれか1項に記載の電子部品搭載用放熱基板、請求項16に記載の放熱構造、又は請求項17に記載のパワーモジュールに用いるシャント抵抗の接続構造であって、
前記電子部品搭載用放熱基板は、前記厚みの厚いリードフレーム上に、前記シャント抵抗の2つの端子を接続する2つの接続部を有し、
前記2つの接続部のそれぞれの近傍に前記厚みの薄いリードフレームの一端を配設するか、若しくは、前記厚みの薄いリードフレームの一端を、前記2つの接続部の一部にそれぞれ設けられた切り欠き部に配置し、
前記シャント抵抗の2つの端子の接続は、前記2つの接続部の上に前記シャント抵抗の2つの端子をそれぞれ載置することにより行うシャント抵抗の接続構造。 - 請求項1乃至15のいずれか1項に記載の電子部品搭載用放熱基板を用いた電動パワーステアリング装置。
- 請求項16に記載の放熱構造を用いた電動パワーステアリング装置。
- 請求項18に記載のシャント抵抗の接続構造を有する電動パワーステアリング装置。
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JP2019041110A (ja) | 2019-03-14 |
JP2018152614A (ja) | 2018-09-27 |
JP6573001B2 (ja) | 2019-09-11 |
JPWO2016080520A1 (ja) | 2017-09-07 |
US10388596B2 (en) | 2019-08-20 |
JP6409923B2 (ja) | 2018-10-24 |
CN107004647A (zh) | 2017-08-01 |
JP6508400B2 (ja) | 2019-05-08 |
JP2017224839A (ja) | 2017-12-21 |
JP2019009465A (ja) | 2019-01-17 |
JP2018152613A (ja) | 2018-09-27 |
JP2018201020A (ja) | 2018-12-20 |
US20170309555A1 (en) | 2017-10-26 |
CN107004647B (zh) | 2019-05-03 |
JP6191784B2 (ja) | 2017-09-06 |
JP6573013B2 (ja) | 2019-09-11 |
EP3223307A4 (en) | 2018-08-29 |
JP6573015B2 (ja) | 2019-09-11 |
JP6508399B2 (ja) | 2019-05-08 |
JP6361806B2 (ja) | 2018-07-25 |
JP2019009466A (ja) | 2019-01-17 |
EP3223307A1 (en) | 2017-09-27 |
JP2018011062A (ja) | 2018-01-18 |
JP6573014B2 (ja) | 2019-09-11 |
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