WO2016074381A1 - Oled面板及制作方法、丝网印刷版、显示装置 - Google Patents

Oled面板及制作方法、丝网印刷版、显示装置 Download PDF

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Publication number
WO2016074381A1
WO2016074381A1 PCT/CN2015/073737 CN2015073737W WO2016074381A1 WO 2016074381 A1 WO2016074381 A1 WO 2016074381A1 CN 2015073737 W CN2015073737 W CN 2015073737W WO 2016074381 A1 WO2016074381 A1 WO 2016074381A1
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Prior art keywords
oled
oled panel
encapsulant
supporting
glue
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PCT/CN2015/073737
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English (en)
French (fr)
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孙亮
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京东方科技集团股份有限公司
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Priority to US14/784,640 priority Critical patent/US9722214B2/en
Publication of WO2016074381A1 publication Critical patent/WO2016074381A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/02—Manually-operable devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/34—Screens, Frames; Holders therefor
    • B41F15/36—Screens, Frames; Holders therefor flat
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED panel and a manufacturing method thereof, a screen printing plate, and a display device.
  • an OLED mother board (including a display area, a driving circuit, a glass encapsulant, a glass substrate, etc.) having a complete layer structure is generally formed, and then the OLED mother board is subjected to an OLED mother board. Each OLED panel is cut.
  • the OLED mother board includes an upper substrate 1 (package substrate), a lower substrate (backplane) 2, and a display region 3 between the upper and lower substrates
  • the encapsulating glue 4 the encapsulating glue 4 of the two OLED panels is a hollow region containing a length of 2L
  • the cutter wheel 5 is cut in a hollow region between the corresponding encapsulants of the two OLED panels, and after the cutting is completed.
  • the OLED panel shown in FIG. 2, the encapsulant 4 and the area between the secant to the encapsulant 4 (width L) constitute the frame area of the OLED panel.
  • the pressure of the cutter wheel on the OLED mother board causes the upper and lower substrates of the OLED mother board to be deformed, and such deformation reduces the running precision of the cutter wheel 5, so as to avoid cutting to the package.
  • the glue 4 requires a wide area of the hollow area, which is disadvantageous for the narrow frame of the OLED panel.
  • the present invention provides a method for fabricating an OLED mother board, including:
  • the OLED mother board formed with the supporting glue between the upper and lower substrates comprises:
  • a supporting glue is printed under the cutting line.
  • the material of the supporting glue is glass powder.
  • the present invention provides a screen printing plate comprising a stencil suitable for use in an OLED A first pattern area of the encapsulant is printed on an edge region of each OLED panel on the motherboard, wherein the screen printing plate further includes a second pattern area adapted to print a support under the cutting line.
  • a gap of a preset distance exists between the first graphic area and the second graphic area.
  • an opening ratio of a region corresponding to an edge of the encapsulant or the supporting adhesive is larger than other regions.
  • the invention further provides an OLED panel, further comprising a supporting glue between the upper and lower substrates on the outer side of the encapsulant of the OLED panel, the outer side of the supporting glue being flush with the side edges of the upper and lower substrates.
  • a distance between an outer side edge of the encapsulant and a side edge of the upper and lower substrates is smaller than a distance between an outer side edge of the encapsulant in the OLED panel having no supporting glue and an edge of the upper and lower substrates.
  • the present invention also provides an OLED display device comprising the OLED panel of any of the above.
  • a support adhesive is formed under the dicing line before cutting the OLED mother board.
  • the cutter wheel cuts the OLED mother board
  • the upper and lower substrates of the OLED mother board are less deformed due to the support of the support glue, and the walking precision of the cutter wheel is improved, so that the distance between the cutting line and the package rubber can be greatly reduced.
  • the width of the frame of the fabricated OLED panel can be greatly reduced compared to the width of the frame of the OLED panel produced by the conventional manufacturing method.
  • FIG. 1 is a schematic view of a OLED motherboard in a prior art OLED panel manufacturing method
  • FIG. 2 is a schematic structural view of a partial region of an OLED panel obtained by using a method for fabricating an OLED panel of the prior art
  • FIG. 3 is a schematic flow chart of a method for fabricating an OLED panel according to the present invention.
  • FIG. 4 is a schematic view of a method for fabricating an OLED motherboard in a method for fabricating an OLED panel according to the present invention
  • FIG. 5 is a schematic structural view of a region of an OLED panel obtained by using the OLED panel manufacturing method provided by the present invention.
  • FIG. 6 is a schematic structural view of a screen printing plate provided by the present invention.
  • the present invention provides a method for fabricating an OLED panel. As shown in FIG. 3, the method includes:
  • step 301 an OLED mother board having a supporting glue formed between the upper and lower substrates is formed, and the supporting glue is located below the cutting line.
  • the glass powder may be deposited on the lower substrate at a position corresponding to the cutting line by using a screen printing method, and then after the upper substrate and the lower substrate are packaged, the glass powder is cured by laser irradiation to obtain a cutting line.
  • An OLED mother board with a support paste is formed underneath.
  • the above steps 301 can also be implemented in other ways, or other materials can be deposited as the supporting glue, and the corresponding technical solutions should fall within the protection scope of the present invention.
  • Step 302 cutting the OLED motherboard along the cutting line to obtain an OLED panel.
  • FIG. 4 a schematic diagram of the OLED mother board formed in step 301 is cut in step 302.
  • the cutter wheel 5 is located directly above or directly below the support rubber 6.
  • the deformation of the substrate is relatively small, and microcracks due to cracking of the substrate due to deformation can be prevented.
  • the running accuracy of the cutter wheel 5 can be greatly improved, so that the distance L' between the encapsulant 4 and the cutting line can be greatly reduced.
  • the panel produced by the method for fabricating the OLED panel provided by the present invention has a frame having a small width.
  • the support glue can be printed under the cutting line in the same process of printing the encapsulant.
  • the size of the preset distance herein can be set according to the needs of those skilled in the art. In this way, it is possible to avoid support when cutting the support glue.
  • the crack generated by the glue extends toward the encapsulant.
  • the encapsulant and the supporting adhesive can be connected, that is, the encapsulant and the supporting adhesive are integrated, and the corresponding solution can also solve the problem of avoiding large deformation of the substrate, and a preferred embodiment of the present invention It is not to be understood as limiting the scope of the invention.
  • the material of the supporting glue is glass powder.
  • the material of the supporting adhesive pattern is used as the glass frit, and on the one hand, the supporting strength to the substrate can be increased, and the deformation of the substrate can be better prevented.
  • the encapsulant is generally made of glass frit, the encapsulant and the support legs can be formed by the glass frit in one process, further reducing the difficulty of fabrication.
  • the invention also provides a screen printing plate, as shown in FIG. 6, the screen printing plate comprises:
  • the first graphic area A1, the second graphic area A2, and the non-graphic area B refers to an area having an opening through which printed toner can be deposited onto the lower substrate.
  • the non-graphic area B refers to an area having no opening. There is a preset gap between the first graphic area A1 and the second graphic area A2, and there is no opening in the gap, that is, the area between the first graphic area A1 and the second graphic area A2 is a non-graphic area B. .
  • the first pattern area A1 is used to print the encapsulant, and the second pattern area A2 is used to print the support glue.
  • the support paste printed by the second pattern area A2 is located below the cut line of the fabricated OLED mother board.
  • the screen printing plate provided by the invention can print the supporting glue under the cutting line while printing the encapsulant, so that the corresponding OLED mother board is less prone to micro cracks during cutting, and can reduce the frame of the fabricated OLED panel.
  • the width At the same time, it is possible to avoid the microcracks generated on the supporting glue from spreading to the encapsulant when the supporting glue is cut.
  • each of the A1 regions includes an A11 region and an A12 region, wherein the A12 region is located on both sides of the A11 region, and is used to form an edge region of the corresponding encapsulant, and the aperture ratio of the A12 region is larger than the opening of the A11 region. rate.
  • each A2 region includes an A21 region and an A22 region, wherein the A22 region is located on both sides of the A21 region for forming an edge region of the corresponding encapsulant, and the aperture ratio of the A22 region is larger than the opening of the A21 region. rate.
  • the first graphics area A1 and the second graphics area A2 may also be used.
  • A2 is connected, which can reduce the difficulty of making the screen printing plate, but it may cause the microcracks generated by the supporting glue to spread to the encapsulant when the supporting glue is cut.
  • the present invention also provides an OLED panel.
  • the structure of the OLED panel can be as shown in FIG. 5 .
  • the OLED panel further includes a supporting adhesive 6 between the upper and lower substrates. The outer side of the 6 is flush with the side of the upper and lower substrates.
  • the distance between the outer side of the encapsulant and the side of the upper and lower substrates is smaller than the distance between the outer side of the encapsulant in the OLED panel without the supporting glue and the edge of the upper and lower substrates.
  • the present invention also provides an OLED display device comprising the OLED panel of any of the above.
  • the display device here can be: electronic paper, mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator and the like with any display product or component.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种OLED面板及制作方法、丝网印刷版、显示装置，该方法包括：制作在上下基板（1）和（2）之间形成有支撑胶（6）的OLED母板，支撑胶（6）位于切割线的下方；沿切割线对所述OLED母板进行切割得到OLED面板。制作方法中，在刀轮对OLED母板进行切割时，由于支撑胶的支撑，OLED母板的上下基板形变较小，刀轮的行走精度得以提升，可以使得切割线与封装胶之间的距离大大降低，进而能够使得制作的OLED面板的边框的宽度相比与传统的制作方法制作的OLED面板的边框的宽度大大降低。

Description

OLED面板及制作方法、丝网印刷版、显示装置 技术领域
本发明涉及显示技术领域，尤其涉及一种OLED面板及制作方法、丝网印刷版、显示装置。
背景技术
在发光二极管(Light-Emitting Diode，OLED)面板制作时，一般是先形成具有完整层结构的OLED母板(包括显示区域、驱动电路、玻璃封装胶以及玻璃基板等)，之后对OLED母板进行切割得到各个OLED面板。图1示出了现有技术中对OLED母板进行切割时的情形，该OLED母板包括上基板1(封装基板)，下基板(背板)2，位于上下基板之间的显示区域3，以及封装胶4，两个OLED面板的封装胶4之间为包含有长度为2L的中空区域，刀轮5在两个OLED面板对应的封装胶之间中空区域进行切割，切割完成后，得到如图2所示的OLED面板，封装胶4以及割线到封装胶4之间的区域(宽度为L)构成OLED面板的边框区域。在刀轮5对OLED母板进行切割时，刀轮对OLED母板的压力会导致OLED母板的上下基板发生形变，而这样的形变会降低刀轮5的行走精度，这样为了避免切割到封装胶4，需要中空区域足够的宽，不利于OLED面板的窄边框化。
发明内容
本发明的目的是提供一种可以降低OLED面板的边框宽度的方法。
为了达到上述目的，本发明提供了一种OLED母板的制作方法，包括：
制作在上下基板之间形成有支撑胶的OLED母板，所述支撑胶位于切割线的下方；
沿所述切割线对所述OLED母板进行切割得到OLED面板。
进一步的，所述制作在上下基板之间形成有支撑胶的OLED母板，包括：
在印刷封装胶的同一道工序中，在切割线的下方印刷支撑胶。
进一步的，所述封装胶与所述支撑胶之间存在预设距离的缝隙。
进一步的，所述支撑胶的材质为玻璃粉。
本发明提供了一种丝网印刷版，所述丝网印刷版包括适于在OLED 母板上各个OLED面板的边缘区域印刷封装胶的第一图形区域，其特征在于，所述丝网印刷版还包括适于在切割线下方印刷支撑胶的第二图形区域。
进一步的，所述第一图形区域和所述第二图形区域之间存在预设距离的缝隙。
进一步的，所述第一图形区域和/或所述第二图形区域中，对应于封装胶或者支撑胶边缘的区域的开口率大于其他区域。
本发明还提供了一种OLED面板，在所述OLED面板的封装胶的外侧，还包括位于上下基板之间的支撑胶，所述支撑胶的外侧侧边与上下基板的侧边齐平。
进一步的，所述封装胶的外侧侧边与上下基板的侧边之间的距离小于不具有支撑胶的OLED面板中封装胶的外侧侧边与上下基板的边缘之间的距离。
本发明还提供了一种OLED显示装置，包括上述任一项所述的OLED面板。
本发明提供的OLED面板的制作方法中，在对OLED母板进行切割之前，在切割线的下方形成支撑胶。这样在刀轮对OLED母板进行切割时，由于支撑胶的支撑，OLED母板的上下基板形变较小，刀轮的行走精度得以提升，可以使得切割线与封装胶之间的距离大大降低，进而能够使得制作的OLED面板的边框的宽度相比与传统的制作方法制作的OLED面板的边框的宽度大大降低。
附图说明
图1为现有技术的OLED面板制作方法中对OLED母板进行切割时的示意图；
图2为利用现有技术的OLED面板制作方法得到的OLED面板的部分区域的结构示意图；
图3为本发明提供的OLED面板的制作方法的流程示意图；
图4为本发明提供的OLED面板制作方法中对OLED母板进行切割时的示意图；
图5为利用本发明提供的OLED面板制作方法得到的OLED面板的区域的结构示意图；
图6为本发明提供的丝网印刷版的结构示意图。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作进一步描述。以下实施例仅用于更加清楚地说明本发明的技术方案，而不能以此来限制本发明的保护范围。
本发明提供了一种OLED面板的制作方法，如图3所示，该方法包括：
步骤301，制作在上下基板之间形成有支撑胶的OLED母板，所述支撑胶位于切割线的下方。
在具体实施时，可以采用丝网印刷的方法，在下基板上对应于切割线的位置沉积玻璃粉，之后在将上基板与下基板对盒封装之后，采用激光照射使玻璃粉固化，得到切割线下方形成有支撑胶的OLED母板。当然在实际应用中，也可以采用其他方式实现上述的步骤301，或者也可以沉积其他材料作为支撑胶，在能够达到同等效果的前提爱，相应的技术方案均应该落入本发明的保护范围。
步骤302，沿所述切割线对所述OLED母板进行切割得到OLED面板。
下面结合图4和图5对本发明提供的制作方法对本发明的技术效果进行说明：如图4所示，为步骤302中，对步骤301中所形成的OLED母板进行切割时的示意图。此时刀轮5位于支撑胶6的正上方或者正下方。这样，在进行切割时，由于支撑胶起到支撑基板的作用，基板的形变相对较小，能够避免由于形变导致的基板的破裂产生微裂纹。另一方面，由于基板的形变较小，刀轮5的行走精度可以大大提高，这样封装胶4与切割线之间的距离L’可以大大缩小。如图5所示，利用本发明提供的OLED面板的制作方法所制作的面板具有较小宽度的边框。
进一步的，可以在印刷封装胶的同一道工序中，在切割线的下方印刷支撑胶。
通过这种方式，无需为了印刷支撑胶而专门多出一道工序，降低支撑胶制作的复杂度。
进一步的，如图4所示，所述封装胶与所述支撑胶之间存在预设距离的缝隙。
在具体实施时，这里的预设距离的大小可以根据本领域技术人员的需要进行设定。通过这种方式，能够避免对支撑胶进行切割时支撑 胶所产生的裂纹向封装胶延伸。当然，如果不考虑对封装胶的影响，封装胶与支撑胶可以相连，即封装胶与支撑胶为一体结构，相应的方案同样能够解决避免基板产生较大形变的问题，本发明优选的实施方式不能理解为对本发明保护范围的限定。
进一步的，所述支撑胶的材质为玻璃粉。
使支撑胶图形的材质作为玻璃粉，一方面能够增加对基板的支撑强度，更好的防止基板的形变。另一方面，由于封装胶一般也由玻璃粉制作，可以在一道工序中通过玻璃粉形成封装胶和支撑脚，进一步降低制作的难度。
本发明还提供了一种丝网印刷版，如图6所示，该丝网印刷版包括：
第一图形区域A1、第二图形区域A2和非图形区域B。这里的图形区域是指具有开口的区域，印刷的墨粉可以经过开口沉积到下基板上。相应的，非图形区域B是指没有开口的区域。在第一图形区域A1和第二图形区域A2之间存在预设的间隙，在该间隙内也不具有开口，即第一图形区域A1和第二图形区域A2之间的区域为非图形区域B。
第一图形区域A1用于印刷封装胶，第二图形区域A2用于印刷支撑胶。利用第二图形区域A2印刷得到的支撑胶位于所制作的OLED母板的切割线的下方。
利用本发明提供的丝网印刷版能够在印刷封装胶的同时在切割线的下方印刷支撑胶，使得相应的OLED母板在切割时不易产生微裂纹，并能允许降低所制作的OLED面板的边框的宽度。同时，可以避免对支撑胶进行切割时支撑胶上产生的微裂纹向封装胶蔓延。
作为一种优选的方式，每一个A1区域包括A11区域和A12区域，其中A12区域位于A11区域的两侧，用于形成相应的封装胶的边缘区域，且A12区域的开口率大于A11区域的开口率。
作为一种优选的方式，每一个A2区域包括A21区域和A22区域，其中A22区域位于A21区域的两侧，用于形成相应的封装胶的边缘区域，且A22区域的开口率大于A21区域的开口率。
这样能够使封装胶或者支撑胶边缘沉积更多的玻璃粉，这样能够使得所制作的封装胶或者支撑胶的截面更接近矩形(参见图5)。相应的，增大了封装胶或者支撑胶与上下基板的接触面积，起到更好的密封或者支撑效果。当然在实际应用中，每一个图形区域中的开口率均 相同也能够达到降低基板形变以及支撑胶上产生的微裂纹向封装胶蔓延的效果，相应的技术方案也应该落入本发明的保护范围。
需要指出的是，图6中示出的是第一图形区域A1和第二图形区域A2之间存在预设间隙的情况，但是在实际应用中，第一图形区域A1也可以与第二图形区域A2相连，这样能够降低丝网印刷版的制作难度，但是可能会导致对支撑胶进行切割时支撑胶产生的微裂纹向封装胶蔓延。
本发明还提供了一种OLED面板，该OLED面板的结构可以如图5所示，在所述OLED面板的封装胶4之外，还包括位于上下基板之间的支撑胶6，所述支撑胶6的外侧侧边与上下基板的侧边齐平。
优选的，所述封装胶的外侧侧边与上下基板的侧边之间的距离小于不具有支撑胶的OLED面板中封装胶的外侧侧边与上下基板的边缘之间的距离。
本发明还提供了一种OLED显示装置，包括上述任一项所述的OLED面板。
这里的显示装置可以为：电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
以上所述仅是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明技术原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。

Claims (10)

  1. 一种OLED面板的制作方法，其特征在于，包括：
    制作在上下基板之间形成有支撑胶的OLED母板，所述支撑胶位于切割线的下方；
    沿所述切割线对所述OLED母板进行切割得到OLED面板。
  2. 如权利要求1所述的方法，其特征在于，所述制作在上下基板之间形成有支撑胶的OLED母板，包括：
    在印刷封装胶的同一道工序中，在切割线的下方印刷支撑胶。
  3. 如权利要求2所述的方法，其特征在于，所述封装胶与所述支撑胶之间存在预设距离的缝隙。
  4. 如权利要求3所述的方法，其特征在于，所述支撑胶的材质为玻璃粉。
  5. 一种丝网印刷版，所述丝网印刷版包括适于在OLED母板上各个OLED面板的边缘区域印刷封装胶的第一图形区域，其特征在于，所述丝网印刷版还包括适于在切割线下方印刷支撑胶的第二图形区域。
  6. 如权利要求5所述的丝网印刷版，其特征在于，所述第一图形区域和所述第二图形区域之间存在预设距离的缝隙。
  7. 如权利要求6所述的丝网印刷版，其特征在于，所述第一图形区域和/或所述第二图形区域中，对应于封装胶或者支撑胶边缘的区域的开口率大于其他区域。
  8. 一种OLED面板，其特征在于，在所述OLED面板的封装胶的外侧，还包括位于上下基板之间的支撑胶，所述支撑胶的外侧侧边与上下基板的侧边齐平。
  9. 如权利要求8所述的OLED面板，其特征在于，所述封装胶的外侧侧边与上下基板的侧边之间的距离小于不具有支撑胶的OLED面板中封装胶的外侧侧边与上下基板的边缘之间的距离。
  10. 一种OLED显示装置，其特征在于，包括如权利要求8或9所述的OLED面板。
PCT/CN2015/073737 2014-11-10 2015-03-06 Oled面板及制作方法、丝网印刷版、显示装置 WO2016074381A1 (zh)

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