WO2016056269A1 - Ruban adhésif pour protection de surface de tranche semi-conductrice, et procédé d'usinage de tranche semi-conductrice - Google Patents

Ruban adhésif pour protection de surface de tranche semi-conductrice, et procédé d'usinage de tranche semi-conductrice Download PDF

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Publication number
WO2016056269A1
WO2016056269A1 PCT/JP2015/062946 JP2015062946W WO2016056269A1 WO 2016056269 A1 WO2016056269 A1 WO 2016056269A1 JP 2015062946 W JP2015062946 W JP 2015062946W WO 2016056269 A1 WO2016056269 A1 WO 2016056269A1
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semiconductor wafer
pressure
sensitive adhesive
adhesive layer
group
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PCT/JP2015/062946
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English (en)
Japanese (ja)
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啓時 横井
具朗 内山
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古河電気工業株式会社
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Priority to CN201580056130.XA priority Critical patent/CN107075322B/zh
Priority to KR1020177011335A priority patent/KR101840179B1/ko
Publication of WO2016056269A1 publication Critical patent/WO2016056269A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • a semiconductor package is manufactured by slicing a high-purity silicon single crystal or the like into a semiconductor wafer, and then forming an integrated circuit on the wafer surface by ion implantation, etching, or the like.
  • the semiconductor wafer is processed into a desired thickness.
  • a semiconductor wafer surface protective adhesive tape (hereinafter also simply referred to as “surface protective tape”) is used.
  • the back-ground semiconductor wafer is accommodated in a wafer cassette after the back-side grinding is completed, transported to a dicing process, and processed into semiconductor chips.
  • the thickness of the semiconductor wafer be about 200 to 400 ⁇ m by back grinding or the like.
  • the semiconductor wafers are becoming thinner.
  • large wafers tend to be used to increase the number of semiconductor chips that can be manufactured by a single process.
  • wafers with diameters of 5 inches and 6 inches have been mainstream, but in recent years, processing of semiconductor wafers with diameters of 8 to 12 inches into semiconductor chips has become mainstream.
  • a semiconductor wafer is taken out one by one from a dedicated case called a wafer cassette by a robot arm, held by a semiconductor wafer fixing jig in a grinding machine, and backside grinding is performed.
  • the back-ground semiconductor wafer is stored in a wafer cassette by a robot arm and transferred to the next process.
  • problems such as suction failure may occur, and in the worst case, the wafer may fall off the suction arm during the transfer and fall.
  • this problem is being solved by the advent of a thin film grinding machine called an inline system and the development of a special tape (for example, see Patent Documents 1 and 2). Therefore, it is considered that the trend toward thin film wafers will accelerate further in the future.
  • the wafer after grinding is mounted on a dicing tape or a dicing die bonding film, and then the surface protection tape is peeled off.
  • the surface protective tape that is applied to the front surface of the wafer is not restrained, the load applied to the wafer when the surface protective tape is peeled off It takes too much and the wafer breaks easily.
  • the film thickness is gradually increasing. Since these discrete wafers are subjected to special surface treatments and various surface step sizes, it is easy for adhesive residue to remain when the surface protection tape is peeled off, and improving peelability is a major issue. It has become one.
  • the surface protection tape is required to have a high wafer holding force in the grinding process on the backside of the wafer and to have a low adhesive force during peeling. Therefore, conventionally, a tape having an ultraviolet curable pressure-sensitive adhesive layer has been widely used as a surface protective tape.
  • a surface protection tape having an ultraviolet curable pressure-sensitive adhesive layer can be bonded to a semiconductor wafer in a state having a high adhesive force, and thus has excellent adhesion and high wafer holding power.
  • Patent Document 4 discloses that the property of the pressure-sensitive adhesive layer surface is adjusted using the contact angle with diiodomethane (methylene iodide) as an index. It is described to do.
  • Patent Document 5 describes not only the contact angle with diiodomethane (methylene iodide) but also the surface free energy of the pressure-sensitive adhesive layer. It is described that it is adjusted as an index.
  • the semiconductor wafer may be used during a transport process or storage in a wafer cassette.
  • the outer peripheral portion (edge) of the film is easily peeled off from the tape (that is, the edge is liable to be lifted).
  • edge lifting occurs, there is a risk that edge cracking or wafer cracking may occur due to pressure applied by a roller during pasting of the dicing tape.
  • the surface protective tape is applied to a semiconductor wafer with bumps (electrodes), sufficient adhesion to the wafer surface having the bumps may not be obtained. Air (air) becomes easy to mix.
  • Patent Document 5 since the surface protection tape described in Patent Document 5 omits an ultraviolet irradiation process that is complicated in process management, the pressure-sensitive adhesive used for the pressure-sensitive adhesive layer is pressure-sensitive. For this reason, in Patent Document 5, attention is not paid to the improvement of the radiation curable surface protective tape in which the pressure-sensitive adhesive used in the pressure-sensitive adhesive layer is ultraviolet rays or the like.
  • the present invention has excellent adhesion even when applied to an uneven surface of a semiconductor wafer with bumps, is less likely to cause edge lifting, and there is an insulating layer or conductor wiring pattern on the surface protective tape bonding surface of the semiconductor wafer. Even if it is a case, it can be easily peeled without damaging the wafer, there is little adhesive residue on the wafer surface after peeling, the pressure sensitive adhesive used for the pressure sensitive adhesive layer is a radiation curable adhesive tape for semiconductor wafer surface protection, It is another object of the present invention to provide a method for processing a semiconductor wafer using the tape.
  • the present inventors have intensively studied in view of the above problems.
  • the UV curable adhesive has the property that the surface free energy increases after UV irradiation and the contact angle of diiodomethane is reduced, it is sufficient even on uneven surfaces such as semiconductor wafers with bumps. Adhesion and edge lift are unlikely to occur, and even if an insulating layer or conductor wiring pattern is present on the surface of the semiconductor wafer, the tape can be easily peeled off from the semiconductor wafer. The adhesive residue on the wafer surface was found to be suppressed.
  • the present invention has been further studied based on these findings and has been completed.
  • the gist of the present invention is as follows.
  • a bumped semiconductor wafer surface protecting adhesive tape having an ultraviolet curable adhesive layer on a substrate film contains a (meth) acrylic polymer having a weight average molecular weight of 10,000 to 2,000,000 and having a radiation-curable carbon-carbon double bond-containing group, a hydroxyl group, and a carboxy group.
  • the surface free energy of the pressure-sensitive adhesive layer surface before ultraviolet irradiation is 25.5 mN / m or more and less than 35 mN / m,
  • the surface of the pressure-sensitive adhesive layer after curing by ultraviolet irradiation has a surface free energy higher by 5 mN / m or more than the surface of the pressure-sensitive adhesive layer before ultraviolet irradiation,
  • the surface of the pressure-sensitive adhesive layer after curing by ultraviolet irradiation has a smaller contact angle with respect to diiodomethane than the surface of the pressure-sensitive adhesive layer before ultraviolet irradiation
  • the (meth) acrylic polymer is obtained by reacting a polymer having a hydroxyl group and a carboxy group before introduction of a radiation-curable carbon-carbon double bond group with a compound having a radiation-curable carbon-carbon double bond group.
  • the amount of the 2- (meth) acryloyloxyethyl isocyanate is 1 part by mass to 20 parts by mass with respect to 100 parts by mass of the (meth) acrylic polymer. Bumped semiconductor wafer surface protective adhesive tape.
  • a crosslinking agent is added in an amount of 0.1 to 5 parts by mass with respect to 100 parts by mass of the (meth) acrylic polymer.
  • the bumped semiconductor wafer surface protecting device according to any one of (1) to (4), wherein the acid value of the polymer constituting the pressure-sensitive adhesive layer surface is 10 to 35 mgKOH / g Adhesive tape.
  • a method for processing a semiconductor wafer with bumps comprising: Step (A) Step of bonding the bumped semiconductor wafer surface protecting adhesive tape to the bump-formed surface of the semiconductor wafer with bumps Step (B) For protecting the bumped semiconductor wafer surface of the semiconductor wafer with bumps Step of grinding the surface opposite to the bonding surface of the adhesive tape Step (C) Step of curing the bumped semiconductor wafer surface protecting adhesive tape by irradiating the bumped semiconductor wafer surface protecting adhesive tape with ultraviolet rays And (D) peeling the bumped semiconductor wafer surface protecting adhesive tape from the bumped semiconductor wafer (7) bonding the bumped semiconductor wafer with the bumped semiconductor wafer surface protecting adhesive tape.
  • the term “surface of the pressure-sensitive adhesive layer” or “surface of the pressure-sensitive adhesive layer” means a surface opposite to the bonding surface of the base film unless otherwise specified.
  • bonding a semiconductor wafer surface protective adhesive tape to a semiconductor wafer means bonding the adhesive layer surface toward the semiconductor wafer surface.
  • (meth) acryl is used to mean including one or both of acrylic and methacrylic. The same applies to the terms “(meth) acryloyl” and “(meth) acrylamide”.
  • the adhesive tape for protecting a semiconductor wafer surface of the present invention is applied to an uneven surface of a bumped semiconductor wafer such as a solder bump or a gold bump, the air is hardly mixed and the adhesiveness is excellent, and the edge is hardly lifted.
  • the adhesive tape for protecting the surface of a semiconductor wafer of the present invention is excellent in releasability, and even when it is bonded to the surface of a large semiconductor wafer and the back surface of the wafer is ground and processed into a thin film wafer of 100 ⁇ m or less, the wafer is damaged. Can be easily peeled off, and adhesive residue on the wafer surface after peeling can be suppressed.
  • the adhesive tape for protecting the surface of a semiconductor wafer according to the present invention is applied to a semiconductor wafer having a relatively large surface difference, such as a discrete wafer, a semiconductor wafer with a bump electrode comprising an insulating layer and a conductor wiring pattern, and a flip chip mounting method. It is suitable as an adhesive tape for surface protection such as a solder bump or a semiconductor wafer with a gold bump.
  • a thin film semiconductor wafer can be obtained with a high yield. That is, the semiconductor wafer processing method of the present invention is suitable as a method for manufacturing a thin film semiconductor wafer.
  • FIG. 1 is a cross-sectional view showing an embodiment of the adhesive tape for protecting a semiconductor wafer surface according to the present invention.
  • the pressure-sensitive adhesive tape 10 of the present invention is used by forming a pressure-sensitive adhesive layer 12 on at least one surface of a base film 11 and bonding the pressure-sensitive adhesive layer 12 to a semiconductor wafer 13. .
  • the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape of the present invention may be a single layer or a multilayer structure in which two or more types of pressure-sensitive adhesive layers having different compositions are laminated. It is preferable that at least the surface of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape of the present invention is ultraviolet curable, and all the pressure-sensitive adhesive layers are ultraviolet curable.
  • the surface of the pressure-sensitive adhesive layer after curing by ultraviolet irradiation has a surface free energy higher by 5 mN / m or more than the surface of the pressure-sensitive adhesive layer before ultraviolet irradiation, and the surface of the pressure-sensitive adhesive layer before ultraviolet irradiation. Is smaller in contact angle with diiodomethane (CH 2 I 2 ).
  • the surface free energy of the pressure-sensitive adhesive layer surface is a value obtained by using the Owens and Wendt method, and the contact angle of the pressure-sensitive adhesive layer surface with pure water and diiodomethane is measured (droplet volume: pure water). 2 ⁇ L, 3 ⁇ L of diiodomethane, reading time: 30 seconds after dropping, measurement atmosphere: temperature 23 ° C., relative humidity 50%), and solving the simultaneous equations of the following formula 1.
  • the “solid surface” in the following refers to the pressure-sensitive adhesive layer surface in this specification.
  • the surface free energy gamma s is the polar component of the surface free energy gamma s p (London forces only) and surface free energy Of the dispersion component ⁇ s d (including Debye force and hydrogen bonding force).
  • the above formulas (2a) and (2b) are relational expressions obtained by combining Young's formula with the relational expression of the extended Fowkes model for the interfacial tension ⁇ sl of the interface such as the solid s and the liquid l.
  • Expression (2a) is a relational expression in the case of pure water
  • Expression (2b) is a relational expression in the case of diiodomethane.
  • the surface tension ⁇ l , the surface tension polar component ⁇ l p , and the surface tension dispersion component ⁇ l d of pure water are 72.8 mN / m, 51.0 mN / m, and 21.8 mN / m, respectively.
  • the surface tension ⁇ l , surface tension polar component ⁇ l p , and surface tension dispersion component ⁇ l d are 50.8 mN / m, 2.3 mN / m, and 48.5 mN / m, respectively. These values are incorporated in 2a) and (2b).
  • the polar component can be changed by adding a hydroxyl group or a carboxy group to the polymer.
  • the contact angle with respect to water changes, surface free energy can be changed.
  • the adhesive tape is peeled off, if the adhesive remains due to insufficient aggregation, the dispersed component is dominant, and if the adhesive remains on the surface subjected to special activation treatment, the polar component is dominant. Guessed. Therefore, in order to solve the problem of adhesive residue on surfaces having various properties, it is important to control the contact angle with water or diiodomethane, that is, the surface free energy on the surface of the pressure-sensitive adhesive layer.
  • An ultraviolet curable pressure sensitive adhesive has a reduced adhesive strength when irradiated with ultraviolet light, thereby improving the peelability from the semiconductor wafer.
  • the UV curable adhesive layer undergoes changes in physical properties and structure of the adhesive layer before and after UV irradiation.
  • the ultraviolet curable pressure-sensitive adhesive layer usually contains a photopolymerization initiator, it may react and adhere to the wafer surface, for example, under the influence of heat or light even before ultraviolet curing. This adhesion causes glue residue at the time of peeling.
  • the present inventors suppress the reaction before UV irradiation while maintaining the adhesiveness, and the wafer and the pressure-sensitive adhesive tape over time It has been found that adhesion of can be prevented.
  • the edge free energy on the surface of the pressure-sensitive adhesive layer after being cured by ultraviolet irradiation is preferably 6 mN / m or more higher than the surface free energy on the surface of the pressure-sensitive adhesive layer before ultraviolet irradiation, and is 7 mN / m or higher. Higher is more preferable.
  • the difference between the surface free energy on the surface of the pressure-sensitive adhesive layer after curing by ultraviolet irradiation and the surface free energy of the pressure-sensitive adhesive layer before ultraviolet irradiation is usually 15 mN / m or less, It is also preferable that it is 12 mN / m or less.
  • the surface free energy on the surface of the pressure-sensitive adhesive layer before ultraviolet irradiation is 25.5 mN / m or more and less than 35 mN / m, more preferably 28 to 33 mN / m.
  • the contact angle to the diiodomethane on the surface of the pressure-sensitive adhesive layer is small, the intermolecular force of the polymer constituting the pressure-sensitive adhesive is weak. Even when peeling off the protrusions, the glue does not hold the protrusions such as the bumps, and it is easy to come off. Therefore, after the pressure-sensitive adhesive layer is cured by ultraviolet irradiation, the contact angle of the pressure-sensitive adhesive layer surface with diiodomethane is preferably small to some extent.
  • the surface protection tape when the surface protection tape is bonded to a wafer having large protrusions such as bumps or high steps on the surface, if the adhesion between the wafer and the adhesive layer is insufficient, air is involved and the wafer is bonded. Sometimes. When air is entrained, it may not be cured even when irradiated with ultraviolet rays due to inhibition of curing by oxygen in the air. In such a case, cross-linking between polymer molecules constituting the pressure-sensitive adhesive becomes insufficient, and therefore, if the intermolecular force of the polymer before ultraviolet irradiation is not high, the polymer is easily agglomerated and broken.
  • the contact angle of the surface of the pressure-sensitive adhesive layer with diiodomethane is large to some extent.
  • the contact angle (I) with respect to diiodomethane on the surface of the pressure-sensitive adhesive layer before ultraviolet irradiation and the contact angle (II) with respect to diiodomethane on the surface of the pressure-sensitive adhesive layer after cured by ultraviolet irradiation are (I)> ( II) is satisfied, and the difference (I-II) is preferably 5 to 20 degrees.
  • the contact angle with respect to diiodomethane on the surface of the pressure-sensitive adhesive layer before ultraviolet irradiation is preferably 50 to 80 degrees, more preferably 55 to 75 degrees, and particularly preferably 55 to 66.5 degrees.
  • “ultraviolet irradiation” for curing the pressure-sensitive adhesive layer which is performed to measure the surface free energy of the pressure-sensitive adhesive layer after curing and the contact angle with diiodomethane, is an integrated irradiation dose of 500 mJ / cm 2 for ultraviolet light.
  • the entire pressure-sensitive adhesive layer is irradiated so that For example, a high-pressure mercury lamp can be used for the ultraviolet irradiation.
  • the pressure-sensitive adhesive layer has a composition curable by ultraviolet irradiation.
  • the pressure-sensitive adhesive layer contains a polymer, and preferably contains a photopolymerization initiator and a crosslinking agent.
  • the pressure-sensitive adhesive layer may contain additives or plasticizers for preventing wetting or improving slipping properties, if necessary.
  • the pressure-sensitive adhesive used in the pressure-sensitive adhesive layer in the pressure-sensitive adhesive tape of the present invention is not particularly limited as long as it is cured by ultraviolet irradiation, but a polymer having at least one reactive group capable of undergoing a polymerization reaction by ultraviolet irradiation (hereinafter, At least one kind of “ultraviolet curable polymer”.
  • the pressure-sensitive adhesive preferably contains an ultraviolet curable polymer as a main component. More specifically, the ultraviolet curable polymer is preferably contained in an amount of 50% by mass or more, more preferably 80% by mass or more, and further preferably 90% by mass or more.
  • the reactive group capable of undergoing a polymerization reaction upon irradiation with ultraviolet rays is preferably an ethylenically unsaturated group, that is, a group having a carbon-carbon double bond, such as a vinyl group, an allyl group, a styryl group, (Meth) acryloyloxy group, (meth) acryloylamino group, etc. are mentioned.
  • the ultraviolet curable polymer is not particularly limited, and examples thereof include (meth) acrylic polymer, polyester, ethylene or styrene copolymer, and polyurethane. In the present invention, these ultraviolet curable polymers may be used alone or in combination.
  • the pressure-sensitive adhesive layer in the present invention contains, as an essential component, a (meth) acrylic polymer having a weight average molecular weight of 10,000 to 2,000,000 as an ultraviolet curable polymer. Has a double bond, hydroxyl group and carboxy group.
  • the (meth) acrylic polymer having a weight average molecular weight of 10,000 to 2,000,000 a commercially available product may be used, or a polymer synthesized by a conventional method may be used.
  • a (meth) acrylic polymer reacts with a polymer having a hydroxyl group and a carboxy group before the introduction of the radiation curable carbon-carbon double bond group and a compound having a radiation curable carbon-carbon double bond group. It is preferable that it is the polymer obtained by making it. In this case, it is preferable that 1 mol% to 10 mol% of (meth) acrylic acid is contained in all the monomer components forming the polymer before the introduction of the radiation curable carbon-carbon double bond group.
  • the compound having a radiation-curable carbon-carbon double bond group a compound obtained by reacting a hydroxyl group-containing polymer described later with a later-described 2- (meth) acryloyloxyethyl isocyanate is preferable.
  • the blending amount of 2- (meth) acryloyloxyethyl isocyanate is preferably 1 part by mass to 20 parts by mass and more preferably 6 parts by mass to 20 parts by mass with respect to 100 parts by mass of the (meth) acrylic polymer. preferable.
  • the compound having the ethylenically unsaturated group is reacted with the polymer to introduce the ethylenically unsaturated group
  • a method using an oligomer having an ethylenically unsaturated group for example, a urethane (meth) acryl oligomer which is a kind of a crosslinking agent
  • the method (a) is preferred.
  • a compound having a structure having a reactive group (referred to as a reactive group ⁇ ) different from the ethylenically unsaturated group is used as the compound having an ethylenically unsaturated group, and the ethylenically unsaturated group is used.
  • a polymer having a structure having a reactive group ⁇ that reacts with the reactive group ⁇ of the compound having an ethylenically unsaturated group hereinafter referred to as “polymer having a reactive group ⁇ ”). Is used to react the reactive groups ⁇ and ⁇ .
  • reactive groups ⁇ and ⁇ for example, one is preferably a group that undergoes a nucleophilic attack, and the other is a group that undergoes a nucleophilic attack or a group that undergoes an addition reaction.
  • reactive groups include hydroxyl groups, amino groups, mercapto groups, carboxy groups, epoxy groups, oxetanyl groups, isocyanate groups, groups forming cyclic acid anhydrides, halogen atoms, alkoxy or aryloxycarbonyls. Groups and the like.
  • one of the reactive groups ⁇ and ⁇ is a hydroxyl group, an amino group, a mercapto group, or a carboxy group
  • the other reactive group forms an epoxy group, an oxetane group, an isocyanate group, or a cyclic acid anhydride.
  • the reactive group ⁇ of the compound having an ethylenically unsaturated group is preferably a group that undergoes a nucleophilic attack or a group that undergoes an addition reaction.
  • an epoxy group, an oxetanyl group, an isocyanate group, or a cyclic acid anhydride is preferable, an epoxy group, an oxetane group, an isocyanate group, or a group that forms a cyclic acid anhydride is more preferable, and an epoxy group, an oxetanyl group, or an isocyanate group further Preferred is an isocyanate group.
  • the reactive group ⁇ of the polymer into which the ethylenically unsaturated group is introduced is preferably a group that undergoes nucleophilic attack, for example, preferably a hydroxyl group, an amino group, a mercapto group, or a carboxy group, and a hydroxyl group, an amino group, or A mercapto group is more preferable, a hydroxyl group, an amino group, or a carboxy group is more preferable, a hydroxyl group or a carboxy group is further preferable, and a hydroxyl group is particularly preferable.
  • Examples of the compound having a reactive group ⁇ used for the synthesis of a compound having an ethylenically unsaturated group and a reactive group ⁇ or a polymer having a reactive group ⁇ include the following compounds.
  • urethane acrylate oligomer examples include hydroxyalkyl (meth) having a hydroxyl group in an alcohol part such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, pentaerythritol tri (meth) acrylate, and the like.
  • Isocyanates obtained by reacting acrylates with diisocyanates such as toluene diisocyanate, methylene bisphenyl diisocyanate, hexamethylene diisocyanate, naphthalene diisocyanate, methylene biscyclohexyl isocyanate, isophorone diisocyanate or trifunctional or higher isocyanates
  • diisocyanates such as toluene diisocyanate, methylene bisphenyl diisocyanate, hexamethylene diisocyanate, naphthalene diisocyanate, methylene biscyclohexyl isocyanate, isophorone diisocyanate or trifunctional or higher isocyanates
  • Oligomers having at least one group are preferred.
  • an oligomer obtained by reacting a polyol compound, a polyether diol compound or a polyester diol compound may be used.
  • the compound having the ethylenically unsaturated group and the reactive group ⁇ is preferably a compound in which the reactive group is an isocyanate group, while the monomer used for the synthesis of the polymer having the reactive group ⁇ is the above-described monomer.
  • a compound in which the reactive group is a carboxy group or a compound in which the reactive group is a hydroxyl group is preferred, and a compound in which the reactive group is a hydroxyl group is more preferred.
  • the method (b) uses the urethane (meth) acrylate oligomer (the oligomer is also a kind of crosslinking agent as described later), and a (meth) acrylic copolymer and a urethane (meth) acrylate oligomer. Can coexist with the UV curable pressure-sensitive adhesive layer.
  • the (meth) acrylic copolymer is preferably obtained by polymerizing (meth) acrylic acid and (meth) acrylic acid ester.
  • the preferable form of the (meth) acrylic acid ester component constituting the (meth) acrylic copolymer is the same as that described as the copolymerizing component in the polymer having the reactive group ⁇ described later.
  • the ratio of the monomer component having the reactive group ⁇ to the total monomer component constituting the polymer having the reactive group ⁇ is preferably 5 to 50 mol%, and more preferably 20 to 40 mol%.
  • the compound having an ethylenically unsaturated group and a reactive group ⁇ is reacted with a polymer having a reactive group ⁇ to introduce an ethylenically unsaturated group into the polymer having a reactive group ⁇
  • the compound having a reactive group ⁇ is preferably reacted in an amount of 1 to 40 parts by mass, more preferably 1 to 30 parts by mass, with respect to 100 parts by mass of the polymer having a reactive group ⁇ . It is more preferable to carry out a partial reaction, and it is particularly preferred to carry out a reaction of 1 to 10 parts by mass.
  • the polymer having the reactive group ⁇ preferably has a (meth) acrylic acid ester component as a copolymer component together with the monomer component having the reactive group ⁇ as a constituent component.
  • the (meth) acrylic acid ester one or more alkyl (meth) acrylates are preferable.
  • the alcohol part of the (meth) acrylic acid ester does not have the reactive group ⁇ .
  • the alcohol part of the (meth) acrylic acid ester is unsubstituted.
  • the alcohol part preferably has 1 to 12 carbon atoms.
  • the number of carbon atoms in the alcohol part is more preferably 1 to 10, more preferably 4 to 10, and the alcohol part is preferably a branched alkyl group, and 2-ethylhexyl (meth) acrylate is particularly preferable.
  • the (meth) acrylic acid ester component contains (meth) acrylic having 1 to 8 carbon atoms in the alcohol part. It is preferable that an acid ester component is contained, and among them, an ethyl (meth) acrylate component is preferably contained.
  • alkyl ester of (meth) acrylic acid those having 1 to 12 carbon atoms in the alcohol part are preferable.
  • monomers other than (meth) acrylic acid alkyl esters include vinyl acetate, styrene, and (meth) acrylic acid amides such as N, N-diethylacrylic acid amide, N, N-diethylacrylic acid amide, and N-isopropylacrylic acid.
  • acid amides and N-acryloylmorpholine may be used singly or in combination of two or more.
  • the ratio of the copolymerization component to the total monomer components constituting the polymer having the reactive group ⁇ is preferably 5 to 50 mol%, more preferably 20 to 40 mol%.
  • the surface free energy and the contact angle of the pressure-sensitive adhesive layer surface with diiodomethane or water can be freely controlled by adjusting the type and content of the ultraviolet curable polymer and the polymer used in combination with the polymer.
  • control by adjusting the monomer component having a reactive group ⁇ constituting the ultraviolet curable polymer, a copolymer component such as an alkyl (meth) acrylate component, a (meth) acrylic acid component, and the content ratio is preferable. .
  • the reactive group ⁇ of the polymer having the reactive group ⁇ is a hydroxyl group, a carboxy group, or an amino group (an amide-containing group)
  • the reactive group ⁇ includes a reactive group ⁇ and an ethylenically unsaturated group. Although it reacts with the compound it has, unreacted hydroxyl groups, carboxy groups, or amino groups can remain.
  • there are two types of reactive groups ⁇ for example, a carboxy group and a hydroxyl group in a polymer having a reactive group ⁇ , and only one of them (for example, only a part of a hydroxyl group) is a reactive group.
  • the carboxy group has a higher polarity than the hydroxyl group and amino group, and the surface free energy and the contact angle change greatly.
  • the cohesive force is improved by pseudo-crosslinking including association by hydrogen bonding between carboxy groups and amino groups (amide-containing groups), so that the contact angle with diiodomethane can also be adjusted.
  • the remaining reactive group ⁇ is mainly a hydroxyl group, the polarity is not as high as that of the carboxy group.
  • the amount of the reactive group ⁇ remaining in the ultraviolet curable polymer depends on the compounding amount of the compound having the reactive group ⁇ , but can also be adjusted by the type and the compounding amount of the crosslinking agent described later. That is, the surface free energy of the pressure-sensitive adhesive layer surface can be adjusted by the crosslinking agent.
  • the crosslinking agent is preferably added in an amount of 0.1 to 5 parts by mass with respect to 100 parts by mass of the (meth) acrylic polymer.
  • the ultraviolet curable polymer contained in the pressure-sensitive adhesive layer is a hydroxyl group, a hydroxyl group and a carboxy group, or a hydroxyl group and an amino group (amide-containing amide). Group). Especially, it is preferable to contain a hydroxyl group and a carboxy group.
  • the hydroxyl value of the polymer constituting the pressure-sensitive adhesive layer surface is preferably 5 to 100 mgKOH / g, more preferably 10 to 100 mgKOH / g, still more preferably 20 to 100 mgKOH / g, and particularly preferably 30 to 100 mgKOH / g.
  • the acid value of the polymer constituting the surface of the pressure-sensitive adhesive layer is preferably 0 to 70 mgKOH / g, more preferably 5 to 65 mgKOH / g, further preferably 10 to 65 mgKOH / g or 5 to 35 mgKOH / g, and more preferably 10 to 35 mgKOH / g. / G is particularly preferred, and 15 to 35 mg KOH / g is most preferred.
  • the hydroxyl value of the polymer constituting the surface of the pressure-sensitive adhesive layer is preferably 10 to 100 mgKOH / g
  • the acid value is preferably 5 to 65 mgKOH / g
  • the hydroxyl value of the polymer is 20 to 100 mgKOH / g
  • the acid value is 10 to 10 mg.
  • 65 mgKOH is more preferable
  • the hydroxyl value of the polymer is 30 to 100 mgKOH / g
  • the acid value is more preferably 10 to 35 mgKOH
  • the hydroxyl value of the polymer is 30 to 100 mgKOH / g
  • the acid value is particularly preferably 15 to 35 mgKOH.
  • the acid value of the polymer is preferably 5 to 65 mgKOH / g (preferably 5 to 35 mgKOH / g).
  • the carboxy group is preferable as the acid group mainly contained in the polymer constituting the pressure-sensitive adhesive layer surface.
  • the acid value is measured in accordance with JIS K5601-2-1: 1999 using a polymer before ultraviolet irradiation (before curing) as a sample.
  • the hydroxyl value is measured according to JIS K 0070.
  • the “hydroxyl value” is a hydroxyl value of solid content of a polymer before ultraviolet irradiation (before curing), that is, a hydroxyl value obtained by KOH of a hydroxyl group necessary for acylation.
  • the acid value of the solid content of the polymer before ultraviolet irradiation (before curing) that is, the acid value determined with KOH, which is an alkali necessary for neutralizing acidic groups such as carboxy groups.
  • the weight average molecular weight of the ultraviolet curable polymer used in the pressure-sensitive adhesive layer is 10,000 to 2,000,000, preferably 50,000 to 2,000,000.
  • the weight average molecular weight of the polymer used in combination is also It is preferable to be within the range.
  • the weight average molecular weight of the polymer used for the pressure-sensitive adhesive layer is too large, polymerization is difficult and the degree of dispersion becomes high, and a low molecular weight polymer is contained, so that the cohesive force may be lowered.
  • the molecular weight is too small, the cohesive force of the polymer itself is lowered, and this tends to cause adhesive residue.
  • the polymer used for the pressure-sensitive adhesive layer preferably has a weight average molecular weight of 200,000 to 800,000.
  • the weight average molecular weight is a value obtained by dissolving a 1% solution obtained by dissolving in tetrahydrofuran by gel permeation chromatography (trade name: 150-C ALC / GPC, manufactured by Waters Co., Ltd.) as a weight average molecular weight in terms of polystyrene. It is calculated.
  • the pressure-sensitive adhesive layer of the present invention particularly preferably contains a photopolymerization initiator.
  • the adhesive force after crosslinking can be controlled by adjusting the blending amount of the photopolymerization initiator in the adhesive layer.
  • a photopolymerization initiator include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl diphenyl sulfide, tetramethyl thiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, ⁇ -chloranthraquinone and the like can be mentioned.
  • the photopolymerization initiator is usually used at a ratio of 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the polymer having an ethylenically unsaturated group and the compound having an ethylenically unsaturated group.
  • the reactive group that is the crosslinkable group of the crosslinker is preferably a crosslinker that reacts with the reactive group ⁇ of the polymer having the reactive group ⁇ .
  • the reactive group that is a crosslinking group of the crosslinking agent is a cyclic acid anhydride, an isocyanate group, an epoxy group, or a halogen atom. It is preferable that it is an isocyanate group or an epoxy group.
  • the residual amount of the reactive group ⁇ of the polymer having the reactive group ⁇ can be adjusted depending on the blending amount, and the surface free energy can be controlled within a desired range.
  • the cohesive force of an adhesive layer can also be controlled by using a crosslinking agent.
  • crosslinking agent preferably used for the pressure-sensitive adhesive layer examples include polyvalent isocyanate compounds, polyvalent epoxy compounds, polyvalent aziridine compounds, chelate compounds and the like.
  • Specific examples of the polyvalent isocyanate compound include toluylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, and adduct types thereof.
  • polyvalent epoxy compound examples include ethylene glycol diglycidyl ether and terephthalic acid diglycidyl ester acrylate.
  • Polyvalent aziridine compounds include tris-2,4,6- (1-aziridinyl) -1,3,5-triazine, tris [1- (2-methyl) -aziridinyl] phosphine oxide, hexa [1- (2- Methyl) -aziridinyl] triphosphatriazine and the like.
  • the chelate compound examples include ethyl acetoacetate aluminum diisopropylate and aluminum tris (ethyl acetoacetate).
  • the pressure-sensitive adhesive used in the present invention uses a crosslinking agent having at least two ethylenically unsaturated groups in the molecule, preferably an oligomer or polymer crosslinking agent, and the crosslinking agent itself is used as an ultraviolet curable resin. May be.
  • low molecular weight compounds having at least two ethylenically unsaturated groups in the molecule include trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, and dipentaerythritol monohydroxypentaacrylate. And dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6 hexanediol diacrylate, polyethylene glycol diacrylate, oligoester acrylate, and the like.
  • urethane acrylate oligomers can also be used.
  • a polyol compound such as a polyester type or a polyether type and a polyvalent isocyanate compound [for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, etc.
  • the content of the crosslinking agent is preferably 0.1 to 5.0 parts by mass, more preferably 0.5 to 4.0 parts by mass with respect to 100 parts by mass of the polymer constituting the pressure-sensitive adhesive layer.
  • the storage elastic modulus of the pressure-sensitive adhesive or pressure-sensitive adhesive layer of the present invention is not particularly limited, but considering the followability to the adhesive residue and uneven shape, the storage elastic modulus before ultraviolet irradiation is preferably 30000-75000 Pa, More preferably, it is 35000 to 60000 Pa.
  • the storage elastic modulus of the pressure-sensitive adhesive after curing by ultraviolet irradiation (after curing the whole pressure-sensitive adhesive layer so that the total irradiation amount is 500 mJ / cm 2 ) is preferably 100,000 Pa or more.
  • the pressure-sensitive adhesive tape of the present invention may have a release liner on the pressure-sensitive adhesive layer.
  • a release liner a polyethylene terephthalate film subjected to silicone release treatment or the like is used. If necessary, a polypropylene film that is not subjected to silicone release treatment may be used.
  • the material of the base film used in the present invention is mainly intended to protect against impact when grinding the back surface of a semiconductor wafer, and is particularly resistant to water washing and the like and retainability of processed parts. It is important to have Examples of such a base film include those described in JP-A No. 2004-186429. As the base film used in the present invention, those usually used for an adhesive tape can be used.
  • an ethylene-vinyl acetate copolymer, an ethylene-acrylic acid ester copolymer, and a copolymer of a urethane acrylate oligomer and isobornyl acrylate are preferable.
  • the copolymer of a urethane acrylate oligomer and isobornyl acrylate can manufacture a urethane acrylate oligomer and isobornyl acrylate with a photoinitiator as demonstrated in the adhesive layer.
  • the base film is preferably visible light transmissive, and more preferably UV transmissive.
  • the thickness of the base film is not particularly limited, but is preferably 50 to 500 ⁇ m. When the thickness of the substrate film is 50 ⁇ m or less, the thickness accuracy is liable to be deteriorated during the production, and the rigidity is low, so that the wafer holding ability is insufficient, and a conveyance error may occur. On the other hand, if the thickness of the base film exceeds 500 ⁇ m, warpage after grinding becomes large, which may cause a conveyance error or may not be taped because the rigidity is too strong.
  • the thickness of the base film is more preferably 80 to 300 ⁇ m, and further preferably 100 to 300 ⁇ m.
  • the base film may be a film obtained by UV curing an adhesive.
  • those produced by a method such as JP-A-11-343469 can be used.
  • a semiconductor wafer processing method using the adhesive tape of the present invention includes at least the following steps (A) to (D).
  • the process of bonding the adhesive tape of this invention on the surface of a semiconductor wafer (B) The process of grinding the surface (back surface of a wafer) on the opposite side to the bonding surface of the adhesive tape of this invention of the said semiconductor wafer. (C) Step of irradiating the pressure-sensitive adhesive tape of the present invention with radiation to cure the pressure-sensitive adhesive tape of the present invention (D) Step of peeling the pressure-sensitive adhesive tape of the present invention from the semiconductor wafer;
  • the radiation irradiated in the step (C) refers to light rays such as ultraviolet rays or ionizing radiations such as electron beams. It is preferable that the radiation irradiated at the said process (C) is an ultraviolet-ray.
  • the cumulative radiation dose in the step (C) is preferably about 300 to 1000 mJ / cm 2 .
  • the pressure-sensitive adhesive tape of the present invention is also suitable as a surface protection tape for a semiconductor wafer having an insulating layer on the bonding surface of the pressure-sensitive adhesive tape. That is, even if an insulating layer containing a polyimide resin or the like is present on the surface of the semiconductor wafer, both good adhesion and good peelability can be achieved. Moreover, even if it has bumps, such as an electrode, on the bonding surface of an adhesive tape, it can make favorable adhesiveness and favorable peelability compatible. For example, even when the height of bumps such as electrodes is 15 ⁇ m or more, and even 50 ⁇ m or more, both good adhesion and good peelability can be achieved. The height of the bump is practically 300 ⁇ m or less.
  • the thickness of the thin film semiconductor wafer ground by the processing method of the present invention is preferably 20 to 500 ⁇ m, and more preferably 50 to 200 ⁇ m.
  • the semiconductor wafer processing method of the present invention is suitable as a method for manufacturing a thin film semiconductor wafer.
  • Example 1 50 parts by mass of urethane acrylate oligomer having a weight average molecular weight of 3500 (manufactured by Shin-Nakamura Chemical Co., Ltd.), 50 parts by mass of isobornyl acrylate, and 5.0 parts by mass of Irgacure 184 (manufactured by BASF) as a photopolymerization initiator.
  • An ultraviolet curable resin composition was obtained by blending.
  • the obtained ultraviolet curable resin composition was coated on a PET film (Toray Industries, Inc .: thickness 38 ⁇ m) as a process sheet for casting by a fountain die method so as to have a thickness of 270 ⁇ m.
  • a layer was formed.
  • the same PET film is further laminated on the resin composition layer, and then UV irradiation is performed using a high-pressure mercury lamp (160 W / cm, height 10 cm) under the condition of a light amount of 500 mJ / cm 2.
  • a high-pressure mercury lamp 160 W / cm, height 10 cm
  • the resin composition layer was crosslinked and cured to obtain a base film having a thickness of 270 ⁇ m.
  • a polymer solution was obtained by blending 1.5 mol% of methacrylic acid, 64 mol% of 2-ethylhexyl acrylate and 34.5 mol% of 2-hydroxyethyl acrylate, and polymerizing in solution.
  • 2-Methacryloyloxyethyl isocyanate is mixed in 18 parts by mass (Showa Denko Co., Ltd., Karenz MOI) solution with respect to 100 parts by mass of this polymer, and ethylenically unsaturated groups are introduced into hydroxy groups.
  • a group-containing acrylic copolymer polymer (weight average molecular weight: 400,000, hydroxyl value 99.1 mgKOH / g, acid value 10.5 mgKOH / g) was synthesized.
  • Example 2 A polymer solution was obtained by blending 2.0 mol% of methacrylic acid, 70 mol% of 2-ethylhexyl acrylate, and 28 mol% of 2-hydroxyethyl acrylate, and polymerizing in solution. Ethylenically unsaturated by introducing 10 parts by mass of 2-methacryloyloxyethyl isocyanate in 100 parts by mass of this polymer (Showen Denko Co., Ltd., Karenz MOI) solution and introducing ethylenically unsaturated groups into hydroxy groups.
  • a group-containing acrylic copolymer polymer (weight average molecular weight: 500,000, hydroxyl value: 50.8 mgKOH / g, acid value: 10.5 mgKOH / g) was synthesized.
  • this ethylenically unsaturated group-containing acrylic copolymer polymer 0.5 parts by mass of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) as a crosslinking agent and 5.0 parts by mass of Irgacure 184 (manufactured by BASF) as a photopolymerization initiator. Partially blended to obtain a pressure-sensitive adhesive composition.
  • the obtained pressure-sensitive adhesive composition was coated on a transparent release liner (thickness 50 ⁇ m) so that the thickness of the pressure-sensitive adhesive was 130 ⁇ m, and was bonded to an ethylene vinyl acetate (EVA) film having a thickness of 100 ⁇ m.
  • EVA ethylene vinyl acetate
  • Example 3 A polymer solution was obtained by blending 4.0 mol% of methacrylic acid, 76 mol% of 2-ethylhexyl acrylate, and 20 mol% of 2-hydroxyethyl acrylate, and polymerizing in solution.
  • 2-acryloyloxyethyl isocyanate is mixed in 10 parts by mass (Showa Denko Co., Ltd., Karenz AOI) solution with respect to 100 parts by mass of this polymer, and ethylenically unsaturated groups are introduced into the hydroxy groups.
  • An acrylic copolymer polymer containing a saturated group (weight average molecular weight: 350,000, hydroxyl value: 33.8 mgKOH / g, acid value: 19.9 mgKOH / g) was synthesized.
  • a crosslinking agent 1.5 parts by mass of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) and 0.3 parts by mass of TETRAD-X (manufactured by Mitsubishi Gas Chemical Co., Ltd.) are used as a crosslinking agent for the ethylenically unsaturated group-containing acrylic copolymer polymer.
  • a photopolymerization initiator As a photopolymerization initiator, 5.0 parts by mass of Irgacure 651 (manufactured by BASF) was blended to obtain a pressure-sensitive adhesive composition. The obtained pressure-sensitive adhesive composition was applied onto a transparent release liner so that the thickness of the pressure-sensitive adhesive was 130 ⁇ m, and the formed pressure-sensitive adhesive layer was bonded to a low-density polyethylene (LDPE) film having a thickness of 100 ⁇ m. An adhesive tape having a thickness of 230 ⁇ m was obtained.
  • LDPE low-density polyethylene
  • a polymer solution was obtained by blending 6.0 mol% of methacrylic acid, 74 mol% of ethyl acrylate, and 20 mol% of 2-hydroxyethyl acrylate, and polymerizing in solution. Ethylenically unsaturated by introducing 10 parts by mass of 2-methacryloyloxyethyl isocyanate in 100 parts by mass of this polymer (Showen Denko Co., Ltd., Karenz MOI) solution and introducing ethylenically unsaturated groups into hydroxy groups.
  • a group-containing acrylic copolymer polymer (weight average molecular weight: 700,000, hydroxyl value: 33.7 mgKOH / g, acid value: 33.1 mgKOH / g) was synthesized.
  • this ethylenically unsaturated group-containing acrylic copolymer polymer 0.9 part by mass of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) as a crosslinking agent, and 5.0 of Esacure KIP-150 (manufactured by Lamberte) as a photopolymerization initiator.
  • An adhesive composition was obtained by blending parts by mass.
  • the obtained pressure-sensitive adhesive composition was coated on a transparent release liner (thickness 50 ⁇ m) so that the thickness of the pressure-sensitive adhesive was 130 ⁇ m, and bonded to a 100 ⁇ m-thick EVA film, and a 230 ⁇ m-thick pressure-sensitive adhesive tape was attached. Obtained.
  • a polymer solution was obtained by mixing 1.0 mol% of methacrylic acid, 78 mol% of 2-ethylhexyl acrylate, and 21 mol% of 2-hydroxyethyl acrylate, and polymerizing in solution. Ethylenically unsaturated by introducing 10 parts by mass of 2-methacryloyloxyethyl isocyanate in 100 parts by mass of this polymer (Showen Denko Co., Ltd., Karenz MOI) solution and introducing ethylenically unsaturated groups into hydroxy groups.
  • a group-containing acrylic copolymer polymer (weight average molecular weight: 750,000, hydroxyl value: 33.7 mgKOH / g, acid value: 5.6 mgKOH / g) was synthesized.
  • To this ethylenically unsaturated group-containing acrylic copolymer polymer 2.0 parts by mass of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) as a crosslinking agent and 5.0 of Esacure KIP-150 (manufactured by Lamberte) as a photopolymerization initiator are used.
  • An adhesive composition was obtained by blending parts by mass.
  • the obtained pressure-sensitive adhesive composition was coated on a transparent release liner (thickness 50 ⁇ m) so that the thickness of the pressure-sensitive adhesive was 150 ⁇ m, and bonded to a polypropylene (PP) film having a thickness of 80 ⁇ m.
  • An adhesive tape was obtained.
  • Example 6 A polymer solution was obtained by mixing 1.0 mol% of methacrylic acid, 78 mol% of 2-ethylhexyl acrylate, and 21 mol% of 2-hydroxyethyl acrylate, and polymerizing in solution.
  • 2-Methacryloyloxyethyl isocyanate is mixed in 6 parts by mass (Showa Denko Co., Ltd., Karenz MOI) solution with 100 parts by mass of this polymer, and ethylenically unsaturated groups are introduced into the hydroxy groups.
  • a group-containing acrylic copolymer polymer (weight average molecular weight: 600,000, hydroxyl value: 55.6 mgKOH / g, acid value: 5.9 mgKOH / g) was synthesized.
  • a group-containing acrylic copolymer polymer (weight average molecular weight: 600,000, hydroxyl value: 55.6 mgKOH / g, acid value: 5.9 mgKOH / g) was synthesized.
  • 0.5 parts by mass of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) as a crosslinking agent, and 5.0 of Esacure KIP-150 (manufactured by Lamberte) as a photopolymerization initiator are used.
  • An adhesive composition was obtained by blending parts by mass.
  • the obtained pressure-sensitive adhesive composition was coated on a transparent release liner (thickness 50 ⁇ m) so that the thickness of the pressure-sensitive adhesive was 150 ⁇ m, and bonded to an EVA film having a thickness of 150 ⁇ m, and a pressure-sensitive adhesive tape having a thickness of 300 ⁇ m was attached. Obtained.
  • a polymer solution having a weight average molecular weight of 700,000 was obtained by blending 78 mol% of 2-ethylhexyl acrylate, 21 mol% of 2-hydroxyethyl acrylate, and 1 mol% of methacrylic acid, followed by polymerization in the solution.
  • Ethylenically unsaturated by introducing 10 parts by mass of 2-methacryloyloxyethyl isocyanate in 100 parts by mass of this polymer (Showen Denko Co., Ltd., Karenz MOI) solution and introducing ethylenically unsaturated groups into hydroxy groups.
  • a group-containing acrylic copolymer polymer (weight average molecular weight: 600,000, hydroxyl value: 50.1 mgKOH / g, acid value: 6.1 mgKOH / g) was synthesized.
  • this ethylenically unsaturated group-containing acrylic copolymer polymer 1.5 parts by mass of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) as a crosslinking agent and 3.0 parts by mass of Irgacure 184 (manufactured by BASF) as a photopolymerization initiator
  • 0.3 part by mass of Ebecryl 350 (manufactured by Daicel Ornex Co., Ltd.) was blended to obtain an adhesive composition.
  • the obtained pressure-sensitive adhesive composition was coated on a transparent release liner so that the thickness of the pressure-sensitive adhesive became 130 ⁇ m, and the formed pressure-sensitive adhesive layer was bonded to an EVA film having a thickness of 100 ⁇ m, and a pressure-sensitive adhesive having a thickness of 230 ⁇ m. I got a tape.
  • the polymer had a hydroxyl value of 28.1 mgKOH / g and an acid value of 60.8 mgKOH / g.
  • the obtained pressure-sensitive adhesive composition was applied onto a transparent release liner so that the thickness of the pressure-sensitive adhesive was 130 ⁇ m, and the formed pressure-sensitive adhesive layer was bonded to a 100 ⁇ m-thick LDPE (low density polyethylene) film, An adhesive tape having a thickness of 230 ⁇ m was obtained.
  • LDPE low density polyethylene
  • the polymer had a hydroxyl value of 33.5 mgKOH / g and an acid value of 48.6 mgKOH / g.
  • the polymer had a hydroxyl value of 5.5 mgKOH / g and an acid value of 60.8 mgKOH / g.
  • the obtained pressure-sensitive adhesive composition was coated on a transparent release liner so that the thickness of the pressure-sensitive adhesive was 150 ⁇ m, and the formed pressure-sensitive adhesive layer was bonded to an LDPE film having a thickness of 100 ⁇ m, and a pressure-sensitive adhesive having a thickness of 250 ⁇ m. I got a tape.
  • the polymer had a hydroxyl value of 0 mgKOH / g and an acid value of 48.8 mgKOH / g.
  • the polymer solution contains 1.0 part by mass of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) and 1.0 part by mass of TETRAD-X (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as crosslinks with respect to 100 parts by mass of the polymer.
  • a pressure-sensitive adhesive composition was obtained.
  • the obtained pressure-sensitive adhesive composition was applied onto a transparent release liner so that the thickness of the pressure-sensitive adhesive was 130 ⁇ m, and the formed pressure-sensitive adhesive layer was bonded to an LDPE film having a thickness of 100 ⁇ m, and a pressure-sensitive adhesive having a thickness of 230 ⁇ m. I got a tape.
  • a polymer solution having a weight average molecular weight of 700,000 was obtained by blending 78 mol% of 2-ethylhexyl acrylate, 21 mol% of 2-hydroxyethyl acrylate, and 1 mol% of methacrylic acid, followed by polymerization in the solution.
  • crosslinking agent 1.0 part by mass of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) and 0.5 part by mass of TETRAD-X (manufactured by Mitsubishi Gas Chemical Co., Ltd.) are used as a crosslinking agent for the ethylenically unsaturated group-containing acrylic copolymer polymer.
  • 5.0 parts by mass of Irgacure 184 (manufactured by BASF) as a photopolymerization initiator was blended to obtain a pressure-sensitive adhesive composition.
  • the obtained pressure-sensitive adhesive composition was coated on a transparent release liner so that the thickness of the pressure-sensitive adhesive became 130 ⁇ m, and the formed pressure-sensitive adhesive layer was bonded to an EVA film having a thickness of 100 ⁇ m, and a pressure-sensitive adhesive having a thickness of 230 ⁇ m. I got a tape.
  • ⁇ Comparative Example 7 95 parts by mass of 2-ethylhexyl acrylate, 5 parts by mass of 2-hydroxyethyl acrylate, 0.2 parts by mass of Irgacure 651 (manufactured by BASF, 50% ethyl acetate solution) as a photo radical generator, and 0.01 parts by mass of lauryl mercaptan was dissolved in ethyl acetate to obtain a solution. Polymerization was performed by irradiating this solution with ultraviolet rays to obtain an ethyl acetate solution of the polymer.
  • the obtained pressure-sensitive adhesive composition was coated on a transparent release liner so that the thickness of the pressure-sensitive adhesive became 130 ⁇ m, and the formed pressure-sensitive adhesive layer was bonded to an EVA film having a thickness of 100 ⁇ m, and a pressure-sensitive adhesive having a thickness of 230 ⁇ m. I got a tape.
  • a polymer solution having a weight average molecular weight of 200,000 was obtained by blending 2.0 mol% of methacrylic acid, 71 mol% of 2-ethylhexyl acrylate and 27 mol% of 2-hydroxyethyl acrylate, and polymerizing in the solution.
  • 2-acryloyloxyethyl isocyanate is mixed in a solution of 20 parts by mass (produced by Showa Denko KK, Karenz AOI) with respect to 100 parts by mass of this polymer, and an ethylenically unsaturated group is introduced into the hydroxy group.
  • An acrylic copolymer polymer containing a saturated group (weight average molecular weight: 300,000, hydroxyl value 12.3 mg KOH / g, acid value 7.8 mg KOH / g) was synthesized.
  • this ethylenically unsaturated group-containing acrylic copolymer polymer 1.5 parts by mass of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) as a crosslinking agent and 5.0 parts by mass of Irgacure 184 (manufactured by BASF) as a photopolymerization initiator. Partially blended to obtain a pressure-sensitive adhesive composition.
  • the obtained pressure-sensitive adhesive composition was coated on a transparent release liner so that the thickness of the pressure-sensitive adhesive was 150 ⁇ m, and the formed pressure-sensitive adhesive layer was bonded to an LDPE film having a thickness of 100 ⁇ m, and a pressure-sensitive adhesive having a thickness of 250 ⁇ m. I got a tape.
  • the polymer had a hydroxyl value of 16.7 mgKOH / g and an acid value of 0 mgKOH / g.
  • To 100 parts by mass of the polymer 2.5 parts by mass of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd.) was blended into the polymer solution to obtain an adhesive composition.
  • the obtained pressure-sensitive adhesive composition was applied onto a transparent release liner so that the thickness of the pressure-sensitive adhesive was 130 ⁇ m, and the formed pressure-sensitive adhesive layer was bonded to an LDPE film having a thickness of 100 ⁇ m, and a pressure-sensitive adhesive having a thickness of 230 ⁇ m. I got a tape.
  • UV irradiation was performed from the release liner side using a high-pressure mercury lamp so that the integrated irradiation amount was 500 mJ / cm 2 .
  • the release liner is peeled off, diiodomethane and pure water are dropped at different positions, and the respective contact angles ⁇ are measured using the FACE contact angle meter CA-S150 type manufactured by Kyowa Chemical Industry Co., Ltd. Measured.
  • the value of the contact angle ⁇ obtained above was substituted into the simultaneous equations of ⁇ Formula 1> described above, and the surface free energy of the pressure-sensitive adhesive layer surface was calculated.
  • Hydroxyl value The measurement was performed according to JIS K 0070.
  • Acid value It was measured according to JIS K5601-2-1: 1999.
  • the adhesive tapes of Examples 1 to 6 and Comparative Examples 1 to 4 and 6 to 10 to which the ultraviolet curable adhesive was applied were irradiated with ultraviolet rays using a high-pressure mercury lamp so that the cumulative irradiation amount was 500 mJ / cm 2. And then peeled off.
  • Test Example 3 Evaluation of adhesive residue The wafer surface of the wafer with solder bumps and the wafer with copper pillar bumps from which the adhesive tape was peeled in Test Example 2 was observed with an optical microscope to evaluate the presence or absence of adhesive residue.
  • Adhesive residue evaluation criteria A: No adhesive residue B: Adhesive residue on either wafer with copper pillar bump or solder bump C: Adhesive residue on either solder bump wafer or wafer with copper pillar bump
  • Adhesion evaluation criteria A: No air mixing even after 48 hours after bonding B: Air mixing between 24 and 48 hours after bonding C: Air mixing between 24 and 24 hours after bonding
  • the pressure-sensitive adhesive tapes of Comparative Examples 1 to 4 are examples in which the surface free energy of the pressure-sensitive adhesive surface after ultraviolet (UV) irradiation is reduced.
  • UV ultraviolet
  • the adhesive tapes of Comparative Examples 1 to 4 were inferior in at least one of the evaluation items of peelability, adhesive residue and adhesion.
  • the pressure-sensitive adhesives of Comparative Examples 5 and 10 use a pressure-sensitive adhesive, and edge floating tends to occur (Comparative Example 5), and a large amount of adhesive residue is generated at the time of peeling (Comparative Examples 5 and 10). As a result.
  • the pressure-sensitive adhesive tapes of Comparative Examples 6 to 8 are examples in which the surface free energy of the pressure-sensitive adhesive surface after UV irradiation increases, but the degree thereof is smaller than specified in the present invention.
  • the pressure-sensitive adhesive tapes of Comparative Examples 6 to 8 were used, adhesive residue was generated after peeling. Furthermore, the adhesive tapes of Comparative Examples 6 to 8 were inferior in at least one of the evaluation items of edge floating, peelability, and adhesion.
  • the surface free energy of the pressure-sensitive adhesive before UV irradiation is lower than the value specified in the present invention.

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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne un ruban adhésif pour protection de surface de tranche semi-conductrice à bosses qui possède sur un film de matériau de base une couche d'agent adhésif durcissable sous l'effet d'un rayonnement ultraviolet, et qui comprend sur cette couche d'agent adhésif, un polymère (méth)acrylique de masse moléculaire moyenne en poids supérieure ou égale à 10000 et inférieure ou égale à 2000000, et possédant un groupe comprenant une liaison double carbone-carbone durcissable par rayonnement, un groupe hydrogène et un groupe carboxy. L'énergie libre superficielle de la couche d'agent adhésif avant irradiation par rayonnement ultraviolet, est supérieure ou égale à 25,5mN/m et inférieure à 35mN/m. La surface de la couche d'agent adhésif après durcissement sous l'effet de l'irradiation par rayonnement ultraviolet, est telle que l'énergie libre superficielle élevée à un niveau supérieur ou égal à 5mN/m en comparaison avec la surface de la couche d'agent adhésif avant irradiation par rayonnement ultraviolet, et son angle de contact avec un diiodométhane est petit. L'indice d'hydroxyle d'un polymère configurant la surface de ladite couche d'agent adhésif, est compris entre 30 et 100mgKOH/g, et l'indice d'acide du polymère configurant la surface de ladite couche d'agent adhésif, est compris entre 5 et 65mgKOH/g. L'invention concerne également un procédé d'usinage de tranche semi-conductrice à bosses.
PCT/JP2015/062946 2014-01-23 2015-04-30 Ruban adhésif pour protection de surface de tranche semi-conductrice, et procédé d'usinage de tranche semi-conductrice WO2016056269A1 (fr)

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KR1020177011335A KR101840179B1 (ko) 2014-01-23 2015-04-30 반도체 웨이퍼 표면 보호용 점착 테이프 및 반도체 웨이퍼의 가공 방법

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CN107075322A (zh) 2017-08-18
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KR20170055552A (ko) 2017-05-19

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