WO2016043292A1

WO2016043292A1 - Pellicle, production method thereof, exposure method

Info

Publication number: WO2016043292A1
Application number: PCT/JP2015/076568
Authority: WO
Inventors: 高村　一夫; 大樹種市; 陽介小野; 比佐子石川; 恒明美谷島; 敦大久保; 泰之佐藤; 俊明廣田
Original assignee: 三井化学株式会社
Priority date: 2014-09-19
Filing date: 2015-09-17
Publication date: 2016-03-24
Also published as: TW201612622A; CN106662806B; CN113917783B; JP6275270B2; SG11201701805QA; EP3196699A1; KR101915912B1; CN106662806A; JPWO2016043292A1; KR20170038907A; US20170184956A1; US10488751B2; TWI693467B; CN113917783A; EP3196699A4

Abstract

A pellicle for use in extreme ultraviolet lithography, a production method thereof and an exposure method are provided. This pellicle comprises: a first frame body on which a pellicle film is arranged; a second frame body which encompasses the pellicle film and the first frame body and which comprises a thick portion including a first surface that receives the surface of the first frame body opposite of the surface where the aforementioned pellicle film is arranged, and a second surface which is connected to the first surface and receives a lateral surface of the first frame body; a through-hole which is arranged in the thick portion of the second frame body; and a filter which is arranged on an outer lateral surface of the second frame body which intersects with the surface of the first frame body where the pellicle film is arranged and which covers the through-hole.

Description

Pellicle, manufacturing method thereof and exposure method

The present invention relates to a pellicle used in a photolithography process, a manufacturing method thereof, and an exposure method. In particular, the present invention relates to a pellicle for extreme ultraviolet (EUV) lithography, a method for manufacturing the pellicle, and an exposure method using the pellicle.

In the photolithography process, a pellicle is used in which a pellicle film is stretched on one end of a frame that surrounds the mask pattern in order to prevent dust or the like from adhering to the mask or reticle. When such a pellicle is mounted on the mask, the inside of the pellicle is extremely airtight, and a thin pellicle film may be slackened or swelled due to changes in atmospheric pressure or temperature. When the pellicle film loses smoothness in this way, not only the optical characteristics of the pellicle film are changed, but also when the unevenness is severe, the pellicle film contacts the mask or houses the pellicle. The pellicle membrane may be damaged by hitting the case lid.

In order to solve such a problem, for example, in Patent Document 1, at least one vent hole is formed in a pellicle frame, and a filter member that prevents passage of dust and the like is provided in the vent hole. A pellicle provided so as not to drop out in a space surrounded by a pellicle film is described. Patent Documents 2 and 3 describe a pellicle in which an opening is provided on at least a part of the side surface of the pellicle frame and the inner surface thereof is made adhesive. Patent Document 4 describes a pellicle that provides a cavity inside the frame and captures foreign matter in the aeration gas.

On the other hand, in a pellicle provided with a filter, it is necessary to make the filter finer in order to reliably capture minute dust and the like. Therefore, the gas permeation rate of the filter is slow and it takes time until the pressure difference is relaxed. There was a problem that it took. In order to solve this, Patent Document 5 discloses that the pellicle frame is divided into an inner member and an outer member, the inner member is made of naturally colored anodized aluminum or ceramic having excellent light resistance, and the outer member is made of aluminum having a high yield strength. A pellicle is described which is made of alloy 7075-T6, has two vent holes with three bent portions inside the pellicle frame, and has an adhesive layer for adsorbing dust on the inner surface of the vent hole. .

By the way, the wavelength of lithography has been shortened, and EUV lithography has been developed as a next generation lithography technique. EUV light refers to light having a wavelength in the soft X-ray region or the vacuum ultraviolet region, and refers to light having a wavelength of about 13.5 nm ± 0.3 nm. In photolithography, the resolution limit of a pattern is about 1/2 of the exposure wavelength, and it is said to be about 1/4 of the exposure wavelength even when the immersion method is used. The immersion of ArF laser (wavelength: 193 nm) Even if the method is used, the exposure wavelength is expected to be about 45 nm. Therefore, EUV lithography is expected as an innovative technology that can be greatly miniaturized from conventional lithography.

On the other hand, EUV light is easily absorbed by all substances. Therefore, in EUV lithography, it is necessary to perform exposure with the inside of the exposure apparatus being evacuated. In addition, since the refractive index of EUV light is close to 1 for all materials, a refractive optical system using a lens and a transmission type photomask cannot be used as in conventional photolithography using visible light or ultraviolet light. For this reason, in EUV lithography, exposure with a reflective optical system using a reflective photomask and a mirror is required. For example, as described in Patent Document 6, the reflective photomask has a multilayer reflective film in which Mo layers and Si layers are alternately stacked a plurality of times on a substrate, and EUV light is emitted on the reflective layer. It has a structure in which an absorbing layer for absorbing is formed.

Japanese Utility Model Publication No. 63-39703 Japanese Patent Laid-Open No. 5-113658 Japanese Patent Laid-Open No. 2001-312048 Japanese Patent Laid-Open No. 5-107747 JP 2003-107678 A Japanese Patent Application Laid-Open No. 2014-160752

As described above, EUV lithography differs from conventional lithography in that exposure is performed under vacuum, and therefore, it has been considered that mounting of a pellicle on a photomask is not essential. However, since it is an unprecedented fine process, it has become clear that the pellicle must be attached to the photomask. However, since EUV light is easily absorbed by all substances, the pellicle film disposed on the pellicle needs to be a nanometer-order film that has not been conventionally used.

In addition, since it was initially considered that the mounting of the pellicle on the photomask was not indispensable, the currently developed EUV exposure apparatus has a space for mounting the pellicle on the photomask as high as 2.5 mm. Does not exist. However, in order to secure a space for mounting a conventional pellicle having a height of 5 mm or more in the exposure apparatus, it is necessary to change the design of the optical system, which delays the development of EUV lithography.

It is assumed that the pellicle film sags or swells because it is exposed under vacuum, but it is greatly limited by the installation space of the pellicle, so to prevent damage to the nanometer-order pellicle film Therefore, it is necessary to ensure sufficient ventilation through the ventilation holes arranged in the frame of the pellicle. Although it is necessary to place a filter in the ventilation hole, since the space allowed for the pellicle is greatly limited, the height allowed for the frame is also greatly limited. No design is required.

The present invention solves the above-described problems, and an object thereof is to provide a pellicle for extreme ultraviolet light lithography, a manufacturing method thereof, and an exposure method.

Moreover, since the pellicle for extreme ultraviolet light lithography has a very thin pellicle film attached to the frame, it is applied by applying force from the top of the frame as in the past when attaching to a photomask. There is a risk of damage to the pellicle membrane. For this reason, a pellicle for extreme ultraviolet lithography needs to be attached to a photomask in a non-contact manner using a dedicated attaching device. The non-contact here means that a strong force is not applied from the top of the frame, and the standard of the strong force is about 1 kgf or more which is applied when a conventional photomask is applied. In addition to the above-described problems, the present invention also provides a pellicle for extreme ultraviolet light lithography that can be attached to a photomask in a non-contact manner and a method for manufacturing the pellicle.

According to one embodiment of the present invention, a first frame body on which a pellicle film is disposed, and a first surface that receives a surface of the first frame body opposite to the surface on which the pellicle film is disposed are included. A second portion having a thick portion and a second surface connected to the first surface and receiving a side surface of the first frame, and surrounding the pellicle film and the first frame Of the second frame that intersects the surface of the first frame on which the pellicle film is disposed, and the through-hole disposed in the thick part of the second frame. There is provided a pellicle including a filter disposed on a side surface and covering the through hole.

In the pellicle, the second surface of the second frame engaged with the first frame is perpendicular to the surface of the first frame on which the pellicle film is disposed. Also good.

In the pellicle, the second surface of the second frame engaged with the first frame is inclined inward with respect to the surface of the first frame on which the pellicle film is disposed. May be.

In the pellicle, the second frame body further includes a third surface connected to the first surface and facing the second surface, and the third surface of the second frame body is The first frame may be disposed to face the inner side surface.

In the pellicle, the third surface of the second frame that engages with the first frame is perpendicular to the surface of the first frame on which the pellicle film is disposed. Also good.

In the pellicle, the third surface of the second frame that engages with the first frame is from the first surface to the surface of the first frame on which the pellicle film is disposed. Inclination may be performed so that the distance from the second surface increases.

In the pellicle, the thick portion of the first frame and the second frame may be bonded via an adhesive layer.

In the pellicle, the pellicle film may have a transmittance of 90.0% or more for light having a wavelength of 5 nm or more and 30 nm or less, and a film thickness of 20 nm or more and 50 nm or less.

In the pellicle, the sum of the height of the second frame and the height of the adhesive layer disposed on the lower surface of the second frame may be 2 mm or less.

In the pellicle, the first frame may be made of a material selected from the group consisting of silicon, sapphire, and silicon carbide.

In the pellicle, the ratio of the total area of the vent portion of the filter for the internal volume of the pellicle may be 0.007 mm ^-1 or 0.026 mm ^-1 or less.

According to an embodiment of the present invention, a pellicle film is formed on a substrate, and the first frame body is formed by exposing the pellicle film so that the substrate has a frame shape. A thick portion including a first surface that receives a surface opposite to the surface on which the pellicle film of the frame is disposed, and a second portion that is connected to the first surface and receives a side surface of the first frame. A second frame having a surface of the second frame, forming a through hole in the thick portion of the second frame, and being parallel to a height direction of the second frame. A filter that covers the through-hole is bonded to an outer surface of the body, and the first frame is fixed to the second frame via an adhesive layer so as to surround the first frame. A method for manufacturing a pellicle is provided.

In the method for manufacturing the pellicle, the second frame in which the pellicle film is exposed by dry etching and the second surface is perpendicular to the surface of the first frame body on which the pellicle film is formed. A body may be prepared, and the first frame may be fixed to the second frame via the adhesive layer.

In the pellicle manufacturing method, the second pellicle film is exposed by wet etching, and the second surface is inclined inward with respect to the surface of the first frame body on which the pellicle film is formed. A frame body may be prepared, and the first frame body may be fixed to the second frame body via the adhesive layer.

In the method for manufacturing the pellicle, the pellicle film is exposed by dry etching, the second surface, and the third surface connected to the first surface and facing the second surface are the pellicle film And preparing the second frame that is perpendicular to the surface of the first frame on which is formed, and fixing the first frame to the second frame via the adhesive layer. May be.

In the pellicle manufacturing method, the pellicle film is exposed by wet etching, and a second surface that is inclined inward with respect to a surface of the first frame body on which the pellicle film is formed, and the first surface The second frame having a third surface inclined so as to increase the distance from the second surface toward the surface of the first frame on which the pellicle film is disposed is prepared. The first frame body may be fixed to the second frame body via the adhesive layer.

In the pellicle manufacturing method, the pellicle film having a thickness of 20 nm to 50 nm is formed on the substrate, and the pellicle film has a transmittance of 90.0% or more for light having a wavelength of 5 nm to 30 nm. May be.

In the method for manufacturing the pellicle, the total of the height of the second frame body and the height of the adhesive layer disposed on the lower surface of the second frame body may be 2 mm or less.

In the method for manufacturing the pellicle, the substrate may be a substrate selected from the group consisting of a silicon substrate, a sapphire substrate, and a silicon carbide substrate.

In the method for manufacturing the pellicle, the ratio may be used as 0.007 mm ^-1 or 0.026 mm ^-1 or less of the total area of the vent portion of the filter for the internal volume of said pellicle.

Any of the pellicles is disposed on a reticle surface of a photomask, the photomask is disposed at a predetermined position of an exposure apparatus, and the pellicle is accommodated in a gap having a distance of 3 mm or less from the reticle surface. Then, the photomask having the pellicle disposed thereon is irradiated with light having a wavelength of 5 nm or more and 30 nm or less, and the light emitted from the reticle surface of the photomask having the pellicle disposed thereon is irradiated onto the substrate on which the resist layer is formed. An exposure method is provided.

According to the present invention, a pellicle for extreme ultraviolet light lithography, a method for manufacturing the pellicle, and an exposure method are provided. In addition, a pellicle for extreme ultraviolet light lithography that can be attached to a photomask in a non-contact manner and a method for manufacturing the pellicle can be provided.

According to the present invention, there are provided a pellicle for extreme ultraviolet lithography, a method for manufacturing the same, and an exposure method for reducing deterioration of an adhesive layer due to extreme ultraviolet light.

It is a mimetic diagram (perspective view) of pellicle 100 concerning one embodiment. It is sectional drawing in line segment AA 'of FIG. 1 of the pellicle 100 which concerns on one Embodiment. 2 is an enlarged view of the frame body shown in FIG. 2 of the pellicle 100 according to an embodiment, FIG. It is a schematic diagram which shows. It is a mimetic diagram showing a manufacturing process of pellicle 100 concerning one embodiment. It is a mimetic diagram showing a manufacturing process of pellicle 100 concerning one embodiment. It is sectional drawing in line segment AA 'of FIG. 1 of the pellicle 200 which concerns on one Embodiment. It is sectional drawing in line segment AA 'of FIG. 1 of the pellicle 300 which concerns on one Embodiment. It is a schematic diagram which shows the manufacturing process of the pellicle 300 which concerns on one Embodiment. It is a schematic diagram which shows the manufacturing process of the pellicle 300 which concerns on one Embodiment. It is sectional drawing in line segment AA 'of FIG. 1 of the pellicle 400 based on one Embodiment. It is sectional drawing in line segment AA 'of FIG. 1 of the pellicle 500 based on one Embodiment. 2A and 2B are schematic views of a pellicle 600 according to an embodiment, where FIG. 1A is a cross-sectional view taken along a line segment AA ′ in FIG. 1, and FIGS. It is a schematic diagram of the 2nd frame 713 used for the pellicle 700 which concerns on one Embodiment. It is a schematic diagram which shows the manufacturing process of the pellicle 700 using the pellicle manufacturing apparatus 1000 which concerns on one Embodiment. It is sectional drawing which shows notionally the photomask manufacturing apparatus 2000 which concerns on one Embodiment. It is sectional drawing which shows notionally the photomask manufacturing apparatus 3000 which concerns on one Embodiment. 2A and 2B are diagrams illustrating an example of study of an embodiment, in which FIG. 1A is a cross-sectional view of a pellicle 800, and FIG.

In this specification, EUV light refers to light having a wavelength of 5 nm to 30 nm. The wavelength of EUV light is preferably about 5 nm to 13.5 nm, and more preferably 13.5 ± 0.3 nm. Since EUV light is easily absorbed by any substance, in the present invention, the pellicle film needs to be a nanometer order film. The pellicle film according to the present invention has a transmittance of 90.0% or more for light having a wavelength of 5 nm or more and 30 nm or less. The pellicle film according to the present invention preferably transmits 90.0% or more of light with a wavelength of about 5 nm to 13.5 nm, more preferably with respect to light with a wavelength of 13.5 ± 0.3 nm. Have a rate. In order to obtain such transmittance, the pellicle film according to the present invention has a thickness of 10 nm to 100 nm, more preferably 10 nm to 50 nm.

The EUV transmittance T of the pellicle film is defined by the following formula (1).

In the formula (1), I represents transmitted light intensity, and I ₀ represents incident light intensity. The relationship expressed by the following formula (2) holds among the transmitted light intensity I and the incident light intensity I ₀ , the pellicle film thickness d, the density ρ, and the pellicle film mass absorption coefficient μ.

The density ρ in the formula (2) is a density specific to the substance constituting the pellicle film. Further, the mass absorption coefficient μ in the above formula (2) is obtained as follows. When the photon energy is greater than about 30 eV and the photon energy is sufficiently away from the absorption edge of the atoms, the mass absorption coefficient μ does not depend on the bonding state of the atoms. The photon energy at a wavelength of 13.5 nm is around 92.5 eV, and is sufficiently away from the absorption edge of atoms. Therefore, the mass absorption coefficient μ does not depend on the bonding state between the atoms of the compound constituting the pellicle film. Therefore, the mass absorption coefficient μ of the pellicle film is calculated from the mass absorption coefficient μ _{1 of} each element (1, 2,..., I) constituting the pellicle film and the mass fraction W _{i of} each element as follows: It is calculated | required by Formula (3).

The W _i is _a value obtained by W _i = n _i A _i / Σn _i A _i . A _i is the atomic weight of each element i, and n _i is the number of each element i.

As the mass absorption coefficient μ _i of each element in the above formula (3), the values of the following references summarized by Henke et al. Can be applied. (BL Henke, EM Gullikson, and JC Davis, “X-Ray Interactions: Photoabsorption, Scattering, Transmission, and Reflection at E = 50-30,000 eV, Z = 1-92,” At. Data Nucl. Data Tables 54, 181 (1993) The latest version of these numbers is available at http://wwwcxro.lbl.gov/optical_constants/.)

If the mass absorption coefficient μ of the pellicle film, the density ρ of the pellicle film, and the thickness d of the pellicle film can be specified, the light transmittance of the wavelength of 13.5 nm of the pellicle film is calculated based on the expressions (1) and (2). it can. The transmittance can also be calculated from the optical constant website of the X-ray Optical Center at Lawrence Berkeley National Laboratory.

In order to increase the film thickness and increase the transmittance, it is desirable to use a material having a low absorption coefficient as the material of the pellicle film. Specifically, when the mass absorption coefficient μ _i of hydrogen is relatively expressed as 1, it is desirable to use a material composed of 100 or less elements. In particular, elements such as H, Be, B, C, N, O, Si, P, S, Cl, K, Ca, Sc, Br, Rb, Sr, Y, Zr, Nb, Mo, Tc, Ru, etc. are used. It is desirable.

Specific compounds constituting the pellicle film include polymer compounds such as fluoropolymers, polyolefins, and polyimides, metals such as ruthenium, nickel, zirconium, titanium, molybdenum, and niobium, and crystalline silicon (for example, single crystal silicon, Polycrystalline silicon, etc.), amorphous silicon, diamond-like carbon (DLC), graphite, amorphous carbon, graphene, silicon carbide, silicon nitride, and the like.

The pellicle film may include an antioxidant film and a heat dissipation film. The antioxidant film may be a film made of SiOx (x ≦ 2), SixNy (x / y is 0.7 to 1.5), SiON, SiC, Y ₂ O ₃ , YN, Mo, Ru, or Rh. .

The heat dissipation film is preferably a film made of a material having a high thermal emissivity or a material having a high thermal conductivity. Specifically, it may be a film made of the same material as the antioxidant film, a film made of Rb, Sr, Y, Zr, Nb, graphite, graphene, or the like. The antioxidant film and the heat dissipation film may be formed on one surface of the pellicle film or on both surfaces. The pellicle film may contain one or more of the above elements and compounds, or may contain two or more.

In a conventional pellicle for ArF lithography, a frame body made of aluminum, ceramics, or the like is used, and the pellicle film is bonded to the frame body through an adhesive layer. However, since the pellicle film according to the present invention for EUV lithography has a very thin film thickness of 20 nm to 50 nm, it is difficult to fix the pellicle film to the frame body by adhesion. Therefore, by using a semiconductor manufacturing process, for example, a pellicle film is formed on the substrate by vapor deposition, and the substrate is back-etched into a frame shape, thereby exposing the pellicle film and obtaining a frame body on which the pellicle film is arranged. . As the substrate according to the present invention, for example, a silicon substrate, a sapphire substrate, a silicon carbide substrate, or the like can be used. Although not limited thereto, the substrate is preferably a silicon substrate, a sapphire substrate, or a silicon carbide substrate, and more preferably a silicon substrate.

As described above, since the space for mounting the pellicle on the photomask has a height of only 2.5 mm, the height of the pellicle is preferably 2 mm or less in order to prevent the pellicle film from being damaged. When a very thin pellicle film is formed by the method described above, it is difficult to form a through hole as a vent on the side surface of the frame. For this reason, a method is conceivable in which a first frame having a pellicle film and a second frame having through holes formed on the side surfaces are separately formed and bonded via an adhesive layer. The thickness of the first frame is preferably 1 mm or less from the viewpoint of formation and handling of the pellicle film, but it is difficult to reduce the thickness to 100 μm or less. In addition, since the adhesive layer between the first frame and the second frame and the adhesive layer between the pellicle and the mask are provided, the height allowed for the second frame in which the through hole is arranged is 1 to 1.5 mm. However, when the through hole is covered with a filter for dust prevention, it is difficult to arrange a filter of 1.5 mm or less on the side surface of the second frame from the viewpoint of adhesion and handling.

For this reason, it is possible to arrange | position a filter of about 2 mm on the side surface of the 1st frame body and 2nd frame body which were adhere | attached through the contact bonding layer. However, in this case, a problem as shown in FIG. 17 occurs. FIG. 17 is a schematic view of a pellicle in which a filter of about 2 mm is arranged on the side surfaces of the first frame and the second frame bonded through an adhesive layer. FIG. 17A shows the first frame by dry etching. FIG. 17B is a schematic view of a pellicle 900 in which a first frame is formed by wet etching.

The pellicle 800 includes a first frame body 811 on which a pellicle film 801 is disposed, and a second frame body 813 that is fixed to the first frame body 811 via an adhesive layer 841. The second frame body 813 is formed with a through hole 821 penetrating the outer side surface and the inner side surface. A filter 831 covering the through-hole 821 is bonded to the side surfaces of the first frame body 811 and the second frame body 813 bonded through the bonding layer 841 through the bonding layer (not shown). Further, an adhesive layer 843 for fixing the pellicle 800 to the photomask is formed on the bottom surface of the second frame 813, and the adhesive layer 843 is protected by the liner 851 until the pellicle 800 is fixed to the photomask. At this time, a gap 890 is generated in the adhesive layer 841 for bonding the first frame body 811 and the second frame body 813.

Further, such a gap formed on the back surface (adhesion surface) of the filter becomes prominent when the first frame is formed by wet etching. The pellicle 900 includes a first frame body 911 in which a pellicle film 901 is disposed, and a second frame body 913 that is fixed to the first frame body 911 via an adhesive layer 941. The second frame 913 is formed with a through hole 921 that penetrates the outer side surface and the inner side surface. A filter 931 covering the through-hole 921 is bonded to the side surfaces of the first frame body 911 and the second frame body 913 bonded through the bonding layer 941 through the bonding layer (not shown). In addition, an adhesive layer 943 for fixing the pellicle 900 to the photomask is formed on the bottom surface of the second frame body 913, and the adhesive layer 943 is protected by the liner 951 until the pellicle 900 is fixed to the photomask. Here, in the pellicle 900, since the first frame body 911 is formed by wet etching, the side surface of the first frame body 911 is inclined as shown in FIG. become. At this time, a gap 990 is generated between the first frame body 911 and the adhesive layer 941, and sufficient adhesion of the filter 931 cannot be obtained.

Therefore, the present inventors have studied the configuration of a pellicle that obtains sufficient adhesion without generating a gap on the back surface of the filter. The pellicle, its manufacturing method and exposure method according to the present invention will be described below with reference to the drawings. However, the pellicle of the present invention, its manufacturing method and exposure method can be implemented in many different modes, and should not be construed as being limited to the description of the embodiments and examples shown below. Note that in the drawings referred to in this embodiment mode and examples, the same portions or portions having similar functions are denoted by the same reference numerals, and repetitive description thereof is omitted.

(Embodiment 1)
FIG. 1 is a schematic view (perspective view) of a pellicle 100 according to an embodiment of the present invention. 2 is a cross-sectional view of the pellicle 100 taken along line AA ′ in FIG. The pellicle 100 includes a first frame body 111 on which the pellicle film 101 is disposed, and a second frame body 113 on which the first frame body 111 is fixed. The second frame 113 is connected to the first surface 113A and the thick portion 115 including the first surface 113A that receives the surface opposite to the surface on which the pellicle film 101 of the first frame 111 is disposed. The pellicle film 101 and the first frame 111 are surrounded by a second surface 113B that receives the side surface of the first frame 111. The second frame 113 has an L-shaped cross section orthogonal to the pellicle film 101. The pellicle 100 includes a through hole 121 disposed in the second frame 113 and a filter 131 that covers the through hole 121. The through hole 121 is disposed in the thick portion 115 of the second frame 113 having a thickness in a direction intersecting the surface of the first frame 111 on which the pellicle film 101 is disposed. The filter 131 is disposed on the outer side surface of the second frame 113 that intersects the surface of the first frame 111 on which the pellicle film 101 is disposed via an adhesive layer (not shown).

Since the pellicle film and the substrate described above can be used as the pellicle film 101 and the first frame body 111, detailed description is omitted. Silicon, sapphire, and silicon carbide are preferable as the material constituting the first frame 111, and silicon is more preferable. As the second frame 113, a material having resistance to EUV light, high flatness, and low ion elution is preferable. In order to remove carbon-derived dirt, hydrogen gas is allowed to flow through the exposure apparatus, so that it is preferably made of a material having resistance to hydrogen radicals.

There is no restriction | limiting in particular in the material of the 2nd frame 113 (pellicle frame), It can be set as the normal material used for a pellicle frame. Specific examples of the material of the second frame 113 include aluminum, aluminum alloys (5000 series, 6000 series, 7000 series, etc.), stainless steel, silicon, silicon alloys, iron, iron alloys, carbon steel, tool steel, Examples thereof include ceramics, metal-ceramic composite materials, and resins. Among these, aluminum and aluminum alloys are more preferable from the viewpoint of light weight and rigidity. The second frame 113 may have a protective film on its surface.

As the protective film, a protective film having resistance to hydrogen radicals and EUV light present in the exposure atmosphere is preferable. An example of the protective film is an oxide film. The oxide film can be formed by a known method such as anodic oxidation.

The first frame body 111 and the second frame body 113 are fixed via an adhesive layer 141. In FIG. 2, the adhesive layer 141 is formed on the first surface 113A of the thick portion 115 of the second frame 113 having a thickness in a direction intersecting the surface of the first frame 111 on which the pellicle film 101 is disposed. Be placed. In order to reinforce the adhesive layer 141, for example, between the side surface of the first frame body 111 and the second surface 113B of the thin portion 117 of the second frame body 113 in contact with the side surface of the first frame body 111. An adhesive layer may be further disposed.

The thickness of the adhesive layer 141 is preferably as thin as possible within a range in which sufficient adhesion between the first frame body 111 and the second frame body 113 can be secured, and is, for example, 10 μm or more and 300 μm or less. The adhesive used for the adhesive layer 141 is preferably a material that has resistance to EUV light and generates a small amount of gas. In order to remove carbon-derived dirt, hydrogen gas is allowed to flow through the exposure apparatus, so that it is preferably made of a material having resistance to hydrogen radicals.

In this embodiment, “adhesive” refers to an adhesive in a broad sense, and the concept of “adhesive” includes an adhesive. Adhesives include acrylic resin adhesives, epoxy resin adhesives, polyimide resin adhesives, silicone resin adhesives, inorganic adhesives, double-sided adhesive tapes, silicone resin adhesives, acrylic adhesives, polyolefin adhesives, etc. Is mentioned.

Examples of the adhesive used for bonding the first frame 111 and the second frame 113 include an acrylic resin adhesive, an epoxy resin adhesive, a polyimide resin adhesive, a silicone resin adhesive, and an inorganic adhesive. preferable. As an adhesive used for adhesion to a photomask, a double-sided pressure-sensitive adhesive tape, a silicone resin pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, and a polyolefin-based pressure-sensitive adhesive are preferable.

The through hole 121 is disposed in the thick portion 115 of the second frame 113 having a thickness in a direction intersecting the surface of the first frame 111 on which the pellicle film 101 is disposed. Due to the limitations of the exposure apparatus, the upper limit of the height of the pellicle 100 is 2.5 mm, and the higher the height of the pellicle 100 is better from the prevention of foreign object image formation. However, according to known information, it is said that the height of the pellicle needs to be 2 mm (for example, Non-Patent Document 1). In view of the above, when the pressure is reduced from the normal pressure (0.1 MPa) to the vacuum state during exposure (10 ⁻⁴ to 10 ⁻⁶ Pa), the through-hole 121 expands the pellicle film 101 due to the differential pressure inside and outside the pellicle 100. The diameter is less than 0.5 mm. In the present embodiment, the diameter of the through hole 121 is set in consideration of the upper limit value of the pressure loss generated in the through hole 121 when the pressure is reduced.

The pressure loss generated in the through hole 121 when the pressure is reduced is desirably 1 Pa or less, and more desirably 0.5 Pa or less. Here, it is preferable that the filter 131 is installed so as to cover the through hole 121, and most of the pressure loss when the pressure is reduced is generated in the filter 131, and almost no pressure loss occurs in the through hole 121. For example, the size of the through hole 121 and the number of the through holes 121 are adjusted so that the pressure loss in the through hole 121 is 1 Pa or less, more preferably about 0.1 Pa.

For example, when the pressure is reduced at a rate of 350 Pa / sec, the diameter of the through-hole 121 when the pressure loss inside and outside the pellicle 100 generated in the through-hole 121 is 1 Pa is 480 μm and the number is four, or the diameter is 300 μm and the number Is 40 pieces. The shape of the through hole 121 is not particularly limited, and may be a circle, an ellipse, a rectangle, a polygon, a trapezoid, or the like. The diameter of the through hole 121 is not particularly limited, but is desirably about 10 to 500 μm within a range in which the strength of the frame does not decrease. The number of the through holes 121 is not particularly limited, and can be selected according to the length of the filter 131 and the width of the filter 131. When providing a plurality of through holes 121, the positions and intervals of the through holes 121 are not particularly limited, but it is preferable to arrange them at equal intervals in the filter 131.

The filter 131 is formed of a material that can prevent the inflow of dust or the like into the pellicle 100 fixed to the photomask, and has an initial pressure loss of 100 Pa to 550 Pa and a particle size of 0.15 μm to 0.3 μm. On the other hand, it is desirable to use a filter having a particle collection rate of 99.7% or more and 100% or less. As the type of filter, for example, an ULPA filter (Ultra Low Penetration Air Filter) can be used. The ULPA filter is an air filter having a particle collection rate of 99.9995% or more with respect to particles having a rated air volume of 0.15 μm and an initial pressure loss of 245 Pa or less. Further, a HEPA filter (High Efficiency Particulate Air Filter) may be used as the filter 131. The HEPA filter is an air filter having a particle collection rate of 99.97% or more with respect to particles having a rated air volume and a particle size of 0.3 μm and an initial pressure loss of 245 Pa or less. The filter 131 preferably has a width (height) approximately equal to the height of the second frame 113 from the viewpoint of ensuring adhesion to the second frame 113.

The filter 131 includes a ventilation part 135 and a glue margin part 137 (FIG. 3). The margin portion 137 surrounds the periphery of the filter 131 so as to cover the ventilation portion 135. The glue margin part 137 plays a role of bonding the second frame body 113 and the ventilation part 135 without any gap. Gas does not pass through the margin portion 137. The width | variety of the margin part 137 is 0.2 mm or more and 1.0 mm or less. In order to increase the area of the ventilation part 135, it is desirable that the width of the adhesive margin part 137 is as narrow as possible.

The ventilation portion 135 refers to a portion that is not covered with the adhesive margin portion 137 of the filter 131. A gas passes through the ventilation portion 135 and traps particles contained in the gas. Since pressure loss occurs in the ventilation portion 135, the ventilation performance of the filter is determined by the ventilation performance of the ventilation portion 135.

The total area of the ventilation part 135 of the filter 131 is set in consideration of the upper limit value of the pressure loss generated in the filter when the pressure is reduced. It is desirable that the pressure loss generated in the ventilation part 135 of the filter 131 when the pressure is reduced is 2 Pa or less. The length of the ventilation part 135 of the filter 131 can be calculated by dividing the area of the ventilation part 135 of the filter 131 by the width of the ventilation part 135 of the filter 131. The range of the length of the ventilation portion 135 per filter is not particularly limited, but is preferably in the range of 1 cm to 15 cm, more preferably 2 cm to 10 cm.

Currently, a pellicle for EUV exposure is assumed to have a long side of 152 mm or less, a short side of 120 mm or less, and a height of 2 mm or less, and decompression and pressurization at 350 Pa / sec are assumed. Difference between inside and outside of the pellicle 100 when the pressure is reduced from normal pressure (0.1 MPa) to the vacuum state (10 ⁻⁴ to 10 ⁻⁶ Pa) during exposure and when the pressure is increased when returning from the vacuum state to the normal pressure. In order that the expansion of the pellicle membrane 101 due to the pressure is less than 0.5 mm, the ratio of the total area of the ventilation part 135 of the filter 131 to the volume inside the pellicle 100 (filter ventilation area / pellicle internal volume) is 0.007 mm. ⁻¹ or more and 0.026 mm ⁻¹ or less is preferable. When this ratio is 0.007 mm ⁻¹ or more, the flow rate of the gas passing through the filter ventilation portion does not become too fast when decompressing and pressurizing, so that an increase in the differential pressure inside and outside the pellicle 100 is suppressed, and the pellicle film 101 Expansion can be suppressed to less than 0.5 mm. Further, because of the restriction due to the size of the vent portion 135 that can be formed, when the ratio is 0.026 mm ⁻¹ or less, the vent portion 135 and the glue margin portion 137 of the filter 131 can be sufficiently provided.

In the present embodiment, the second surface 113B inside the second frame 113 that engages with the first frame 111 and intersects the surface of the first frame 111 on which the pellicle film 101 is disposed is: This is perpendicular to the surface of the first frame 111 on which the pellicle film 101 is disposed. The side surface of the first frame 111 is at right angles to the surface on which the pellicle film 101 is disposed, and the second frame inside the thin portion 117 of the second frame 113 that engages with the first frame 111. Since the surface 113B is perpendicular to the first surface 113A of the second frame 113, high adhesion between the first frame 111 and the second frame 113 can be obtained. At this time, it is preferable that the upper surface of the pellicle film 101 and the upper surface of the second frame 113 be arranged on the same plane.

An adhesive layer 143 is disposed on the bottom surface of the thick portion 115 of the second frame 113. The adhesive layer 143 is a means for fixing the pellicle 100 to the photomask. The thickness of the adhesive layer 143 is preferably as thin as possible within a range in which sufficient adhesion between the photomask and the second frame 113 can be ensured, for example, 10 μm or more and 300 μm or less. The adhesive used for the adhesive layer 143 is preferably a material that has resistance to EUV light and generates a small amount of gas. In order to remove carbon-derived dirt, hydrogen gas is allowed to flow through the exposure apparatus, so that it is preferably made of a material having resistance to hydrogen radicals.

Adhesives include acrylic resin adhesives, epoxy resin adhesives, polyimide resin adhesives, silicone resin adhesives, inorganic adhesives, double-sided adhesive tapes, silicone resin adhesives, acrylic adhesives, polyolefin adhesives, etc. Is mentioned. The material of the adhesive layer 143 may be the same as that of the adhesive layer 141 or may be different.

In the pellicle 100, the total of the height of the second frame 113 and the height of the adhesive layer 143 disposed on the lower surface of the second frame 113 is preferably 2 mm or less. As described above, since the space for mounting the pellicle on the photomask has a height of only 2.5 mm, the height of the pellicle 100 may be 2 mm or less in order to prevent the pellicle film 101 from being damaged. preferable.

In order to prevent dust and the like from adhering to the adhesive layer 143 of the pellicle 100 before use, the adhesive layer 143 is protected by a peelable liner 151.

In the present invention, a member having an L-shaped cross section is used as the second frame 113, and the height of the filter 131 is approximately equal to the height of the second frame 113, so that The filter 131 can be disposed with sufficient adhesion without generating a void other than the through hole 121.

(Method for manufacturing pellicle 100)
The pellicle 100 according to the present embodiment can be manufactured as follows with reference to FIGS. 4 and 5, for example. In addition, the following manufacturing processes are an example, Comprising: The order of a manufacturing process can also be changed as needed. 4 and 5 are diagrams showing a manufacturing process of the pellicle 100. FIG. A substrate 105 is prepared, and a pellicle film 101 is formed on the substrate 105 (FIG. 4A). As described above, for example, a silicon substrate, a sapphire substrate, a silicon carbide substrate, or the like can be used as the substrate 105, but the substrate 105 is not limited thereto.

The pellicle film 101 is formed on the substrate 105 so as to have a thickness of 20 nm to 50 nm by vapor deposition. Since EUV light is easily absorbed by any substance, the pellicle film 101 is preferably formed thin so as to have a transmittance of 90.0% or more for light with a wavelength of 5 nm to 30 nm. The pellicle film 101 according to the present invention is preferably 90.0% or more for light having a wavelength of about 5 nm to 13.5 nm, more preferably for light having a wavelength of 13.5 ± 0.3 nm. It has transmittance.

The substrate 105 on which the pellicle film 101 is formed is dry-etched to expose the pellicle film 101 so that the substrate 105 has a frame shape, thereby forming a first frame body 111 (FIG. 4B). The side surface of the first frame 111 formed by dry etching is substantially perpendicular to the surface on which the pellicle film 101 is formed.

Separately, a second frame body 113 having a L-shaped cross section in the height direction of the frame is prepared (FIG. 4C). In the present embodiment, in the second frame 113, the second surface 113B, which is the side surface inside the thin portion 117, is substantially perpendicular to the first surface 113A. That is, the second surface 113B inside the second frame 113 that intersects the surface of the first frame 111 on which the pellicle film 101 is disposed is the first frame 111 on which the pellicle film 101 is formed. It is perpendicular to the surface.

A through hole 121 is formed in the thick portion 115 having a thickness in a direction intersecting the height direction of the second frame 113 (FIG. 4D). Due to the limitations of the exposure apparatus, the upper limit of the height of the pellicle 100 is 2.5 mm. However, according to known information, it is said that the height of the pellicle 100 is 2 mm (for example, Non-Patent Document 1). In view of the above, when the pressure is reduced from the normal pressure (0.1 MPa) to the vacuum state during exposure (10 ⁻⁴ to 10 ⁻⁶ Pa), the through-hole 121 expands the pellicle film 101 due to the differential pressure inside and outside the pellicle 100. The diameter is less than 0.5 mm. In the present embodiment, since the through hole 121 is covered with the filter 131, the diameter of the through hole 121 is set in consideration of the resistance due to the filter 131.

A filter 131 that covers the through hole 121 is bonded to the outer surface of the second frame 113 parallel to the height direction of the second frame 113 (FIG. 5A). The filter 131 is preferably a filter having the above-described characteristics, and the width (height) is preferably substantially equal to the height of the second frame 113 from the viewpoint of ensuring adhesion to the second frame 113.

As described above, from the viewpoint of ensuring adhesion of the filter 131 and increasing the filter area, the upper limit of the width of the filter 131 is the same as the width (height) of the second frame 113. However, if the width (height) of the filter 131 exceeds the height of the second frame 113, the adhesive margin 137 protrudes from the second frame 113, which is not preferable because the adhesion is reduced.

An adhesive layer 143 is formed on the bottom surface of the thick portion 115 of the second frame 113. Further, a liner 151 for protecting the adhesive layer 143 is disposed (FIG. 5B). Here, the liner 151 in which the adhesive layer 143 is formed may be prepared, and the liner 151 may be attached to the bottom surface of the thick portion 115 of the second frame 113 via the adhesive layer 143.

An adhesive layer 141 is formed on the first surface 113A of the thick portion 115 of the second frame 113 (FIG. 5C). The first frame 111 is fixed to the second frame 113 via the formed adhesive layer 141 so as to surround the first frame 111 (FIG. 5D). At this time, in order to reinforce the adhesive layer 141, for example, the side surface of the first frame body 111 and the second surface 113B of the thin portion 117 of the second frame body 113 in contact with the side surface of the first frame body 111 An adhesive layer may be further disposed between the two. Since the space for mounting the pellicle on the photomask has a height of only 2.5 mm, in this embodiment, the space is arranged on the second frame 113 and on the lower surface of the second frame 113. The total height of the adhesive layer 143 is preferably 2 mm or less.

In the present invention, a member having an L-shaped cross section is used as the second frame 113, and the height of the filter 131 is approximately equal to the height of the second frame 113, so that The filter 131 can be disposed with sufficient adhesion without generating a void other than the through hole 121. In addition, the side surface of the first frame body 111 is perpendicular to the surface on which the pellicle film 101 is disposed, and the first frame body 111 inside the thin portion 117 of the second frame body 113 that engages with the first frame body 111. Since the second surface 113B is perpendicular to the first surface 113A of the second frame 113, high adhesion between the first frame 111 and the second frame 113 can be obtained.

In the pellicle 100 of this embodiment, the side surface of the first frame 111 is perpendicular to the surface on which the pellicle film 101 is disposed, and the second frame 113 is the pellicle of the first frame 111. A thick portion 115 including a first surface 113A that receives a surface opposite to the surface on which the film 101 is disposed, and a second surface that is connected to the first surface 113A and receives a side surface of the first frame 111. 113B, which surrounds the pellicle film 101 and the first frame 111, and the second surface 113B of the second frame 113 that engages with the first frame 111 is the pellicle film 101. It suffices if it is a right angle with respect to the first surface 113A on which is arranged. Therefore, this embodiment also includes a modified example such as a pellicle 200 shown in FIG.

In the pellicle 200, the shape of the second frame 213 is different from that of the second frame 113. The second frame 213 is connected to the first surface 213A and the thick portion 215 including the first surface 213A that receives the surface opposite to the surface on which the pellicle film 201 of the first frame 211 is disposed. And the second surface 213B that receives the side surface of the first frame 211, and surrounds the pellicle film 201 and the first frame 211. The second frame 213 is connected to the first thin portion 217A of the second frame 213 that contacts the side surface of the first frame 211 and the lower surface of the thick portion 215, and the second frame 213 is connected. And a second thin portion 217B including the bottom surface. Accordingly, the second frame body 213 has a shape that is a T-shape. Since the other configuration is the same as that of the pellicle 100, a detailed description thereof is omitted.

(Embodiment 2)
As shown in the pellicle 900 of FIG. 17B, when the first frame 111 is formed by wet etching, the side surface of the first frame 911 is inclined, and the cross section becomes trapezoidal. In this case, when the second frame body 113 shown in the first embodiment is used, a gap is generated between the first frame body side surface and the inner side surface of the second frame body. In the present embodiment, an example using a second frame that is compatible with the first frame formed by wet etching will be described.

FIG. 7 is a cross-sectional view of the pellicle 300 according to one embodiment of the present invention, taken along line AA ′ in FIG. The pellicle 300 includes a first frame 311 in which the pellicle film 301 is disposed, and a second frame 313 in which the first frame 311 is fixed. The second frame 313 is connected to the first surface 313A and the thick portion 315 including the first surface 313A that receives the surface opposite to the surface on which the pellicle film 301 of the first frame 311 is disposed. The pellicle film 301 and the first frame 311 are surrounded by a second surface 313B that receives the side surface of the first frame 311. The second frame 313 has a substantially L-shaped cross section orthogonal to the pellicle film 301. The pellicle 300 includes a through hole 321 disposed in the second frame 313 and a filter 331 that covers the through hole 321. The through hole 321 is disposed in the thick portion 315 of the second frame 313 having a thickness in a direction intersecting the surface of the first frame 311 on which the pellicle film 301 is disposed. The filter 331 is disposed on the outer side surface of the second frame body 313 intersecting the surface of the first frame body 311 on which the pellicle film 301 is disposed via an adhesive layer (not shown).

In the present embodiment, since the first frame 311 is formed by wet etching, the side surface of the first frame 311 is inclined, and the cross section is trapezoidal. Therefore, the second frame 313 that engages with the first frame 311 has an inner surface of the second frame 313 that intersects the surface of the first frame 311 on which the pellicle film 301 is disposed. The pellicle film 301 has a structure inclined inward with respect to the surface of the first frame 311 on which the pellicle film 301 is disposed. That is, the thin portion 317 of the second frame 313 has a substantially L-shaped cross section having an inclination such that the width on the upper surface side is small and the width on the thick portion 315 side is large.

The pellicle 300 is engaged with the first frame 311, and the inner surface of the second frame 313 intersecting the surface of the first frame 311 on which the pellicle film 301 is disposed is disposed on the pellicle film 301. By inclining inward with respect to the surface of the formed first frame body 311, the second frame body 313 can obtain high adhesion with the first frame body 311 formed by wet etching. .

Since the pellicle film 301, the first frame body 311 and the second frame body 313 can be made of the same material as the pellicle film, the substrate and the second frame body 113 described above, detailed description is omitted. .

The first frame body 311 and the second frame body 313 are fixed via an adhesive layer 341. In FIG. 7, the adhesive layer 341 is formed on the first surface 313A of the thick portion 315 of the second frame 313 having a thickness in a direction intersecting the surface of the first frame 311 on which the pellicle film 301 is disposed. Be placed. In order to reinforce the adhesive layer 341, for example, the side surface (inclined surface) of the first frame body 311 and the side surface of the thin portion 317 of the second frame body 313 in contact with the side surface (inclined surface) of the first frame body 311. An adhesive layer may be further disposed between the second surface 313 B which is an (inclined surface).

The thickness of the adhesive layer 341 is preferably as thin as possible within a range in which sufficient adhesion between the first frame body 311 and the second frame body 313 can be secured, and is, for example, 10 μm or more and 300 μm or less. Further, as the adhesive used for the adhesive layer 341, the same adhesive as that of the adhesive layer 141 can be used, and thus detailed description thereof is omitted.

The through hole 321 is disposed in the thick portion 315 of the second frame 313 having a thickness in a direction intersecting the surface of the first frame 311 on which the pellicle film 301 is disposed. Due to the limitations of the exposure apparatus, the upper limit of the height of the pellicle 300 is 2.5 mm, and the higher the height of the pellicle 300 is better from the prevention of foreign object image formation. However, according to known information, it is said that the height of the pellicle needs to be 2 mm (for example, Non-Patent Document 1). In view of the above, when the pressure is reduced from the normal pressure (0.1 MPa) to the vacuum state during exposure (10 ⁻⁴ to 10 ⁻⁶ Pa), the through-hole 321 expands the pellicle film 301 due to the differential pressure inside and outside the pellicle 300. The diameter is less than 0.5 mm. In the present embodiment, since the through hole 321 is covered with the filter 331, the diameter of the through hole 321 is set in consideration of the upper limit value of the pressure loss generated in the through hole 321 when the pressure is reduced.

The pressure loss generated in the through hole 321 when the pressure is reduced is desirably 1 Pa or less, and more desirably 0.5 Pa or less. For example, when the pressure is reduced at a rate of 350 Pa / sec, the diameter of the through-hole 321 when the pressure loss inside and outside the pellicle 300 generated in the through-hole 321 is 1 Pa is 480 μm, and the number is four.

The shape of the through hole 321 is not particularly limited, and may be a shape such as a circle, an ellipse, a rectangle, a polygon, and a trapezoid. The diameter of the through hole 321 is not particularly limited, but is desirably about 10 to 500 μm within a range in which the strength of the frame does not decrease. The number of the through holes 321 is not particularly limited, and can be selected according to the length of the filter 331 and the width of the filter 331.

Since the filter 331 can use the same filter as the filter 131, detailed description thereof is omitted. The filter 331 preferably has a width (height) approximately equal to the height of the second frame 313 from the viewpoint of securing adhesiveness to the second frame 313.

Here, like the filter 131, the filter 331 includes a ventilation portion and an adhesive margin portion (not shown). The margin part surrounds the periphery of the filter so as to cover the ventilation part. The glue margin part serves to bond the second frame body and the ventilation part without any gap. Gas does not pass through the glue margin. The width | variety of a margin part is 0.2 mm or more and 1.0 mm or less. In order to increase the area of the ventilation portion, it is desirable that the width of the adhesive margin is as narrow as possible.

A ventilation part refers to the part which is not covered with the glue margin part of a filter. A gas passes through the ventilation part and traps particles contained in the gas. Since pressure loss occurs in the ventilation part, the ventilation performance of the filter is determined by the ventilation performance of the ventilation part.

The total area of the ventilation part of the filter 331 is set in consideration of the upper limit value of the pressure loss generated in the ventilation part of the filter 331 when the pressure is reduced. It is desirable that the pressure loss generated in the ventilation portion of the filter 331 when the pressure is reduced is 2 Pa or less. The length of the ventilation part of the filter 331 can be calculated by dividing the area of the ventilation part of the filter 331 by the width of the ventilation part of the filter 331. The range of the length per filter is not particularly limited, but is preferably in the range of 1 cm to 15 cm, more preferably 2 cm to 10 cm.

In the present embodiment, the second surface 313B inside the second frame 313 that engages with the first frame 311 and intersects the surface of the first frame 311 on which the pellicle film 301 is disposed is: Inclined inward with respect to the surface of the first frame 311 on which the pellicle film 301 is disposed. Since the first frame body 311 has an inclination in which the width on the bottom surface side becomes narrower than the surface on which the pellicle film 301 is disposed, the thin frame of the second frame body 313 that engages with the first frame body 311. The second surface 313B inside the portion 317 is inclined so that the thick portion 315 side is wider than the first surface 313A of the second frame 313, and the first frame 311 and the second frame 313 are inclined. High adhesion can be obtained. At this time, it is preferable that the upper surface of the pellicle film 301 and the upper surface of the second frame 313 are arranged on the same plane.

An adhesive layer 343 is disposed on the bottom surface of the thick portion 315 of the second frame 313. The adhesive layer 343 is a means for fixing the pellicle 300 to the photomask. The thickness of the adhesive layer 343 is preferably as thin as possible within a range in which sufficient adhesion between the photomask and the second frame 313 can be secured, and is, for example, 10 μm or more and 300 μm or less. Since the adhesive used for the adhesive layer 343 can be the same adhesive as the adhesive layer 143, detailed description thereof is omitted.

In the pellicle 300, the total of the height of the second frame 313 and the height of the adhesive layer 343 disposed on the lower surface of the second frame 313 is preferably 2 mm or less. As described above, since the space for mounting the pellicle on the photomask has a height of only 2.5 mm, the height of the pellicle 300 may be 2 mm or less in order to prevent the pellicle film 301 from being damaged. preferable.

In order to prevent dust and the like from adhering to the adhesive layer 343 of the pellicle 300 before use, the adhesive layer 343 is protected by a peelable liner 351.

In the present invention, a member having a substantially L-shaped cross section is used as the second frame 313, and the height of the filter 331 is approximately equal to the height of the second frame 313, whereby the back surface of the filter 331 is obtained. Therefore, the filter 331 can be disposed with sufficient adhesion without generating a void other than the through hole 321.

(Method for manufacturing pellicle 300)
The pellicle 300 according to the present embodiment can be manufactured as follows with reference to FIGS. 8 and 9, for example. In addition, the following manufacturing processes are an example, Comprising: The order of a manufacturing process can also be changed as needed. 8 and 9 are diagrams showing a manufacturing process of the pellicle 300. FIG. A substrate 305 is prepared, and a pellicle film 301 is formed on the substrate 305 (FIG. 8A). As described above, for example, a silicon substrate, a sapphire substrate, a silicon carbide substrate, or the like can be used for the substrate 305, but the substrate 305 is not limited thereto.

The pellicle film 301 is formed on the substrate 305 so as to have a film thickness of 20 nm to 50 nm by vapor deposition. Since EUV light is easily absorbed by any substance, the pellicle film 301 is preferably formed thin so as to have a transmittance of 90.0% or more for light with a wavelength of 5 nm to 30 nm. The pellicle film 301 according to the present invention is preferably 90.0% or more for light having a wavelength of about 5 nm to 13.5 nm, more preferably for light having a wavelength of 13.5 ± 0.3 nm. It has transmittance.

The substrate 305 on which the pellicle film 301 is formed is wet-etched to expose the pellicle film 301 so that the substrate 305 has a frame shape, thereby forming a first frame 311 (FIG. 8B). The side surface of the first frame 311 formed by wet etching is inclined on the side surface of the first frame 311 so that the surface side on which the pellicle film 301 is formed is wide, and the cross section becomes trapezoidal.

Separately, a second frame body 313 having a substantially L-shaped cross section in the height direction of the frame is prepared (FIG. 8C). In the present embodiment, the second frame 313 has a second surface 313B that is a side surface inside the thin portion 317 so that the width of the first surface 313A on the thick portion 315 side is larger than the upper surface. Tilt. That is, the second surface 313B inside the second frame 313 that intersects the surface of the first frame 311 on which the pellicle film 301 is disposed is the first frame 311 on which the pellicle film 301 is formed. Inclined inward relative to the surface.

A through-hole 321 is formed in the thick portion 315 having a thickness in a direction intersecting the height direction of the second frame 313 (FIG. 8D). Due to the limitations of the exposure apparatus, the upper limit of the height of the pellicle 300 is 2.5 mm. However, according to known information, it is said that the height of the pellicle needs to be 2 mm (for example, Non-Patent Document 1). In view of the above, when the pressure is reduced from the normal pressure (0.1 MPa) to the vacuum state during exposure (10 ⁻⁴ to 10 ⁻⁶ Pa), the through-hole 321 expands the pellicle film 301 due to the differential pressure inside and outside the pellicle 300. The diameter is less than 0.5 mm. In the present embodiment, since the through hole 321 is covered with the filter 331, the diameter of the through hole 321 is set in consideration of the resistance due to the filter 331.

A filter 331 that covers the through-hole 321 is adhered to the outer surface of the second frame 313 parallel to the height direction of the second frame 313 (FIG. 9A). The filter having the above-described characteristics is preferable as the filter 331, and the width (height) is preferably approximately equal to the height of the second frame 313 from the viewpoint of securing adhesiveness to the second frame 313.

As described above, from the viewpoint of ensuring adhesion of the filter 331 and increasing the filter area, the upper limit of the width of the filter 331 is the same as the width (height) of the second frame 313. However, when the width (height) of the filter 331 exceeds the height of the second frame 313, the adhesive margin protrudes from the second frame 313, which is not preferable.

An adhesive layer 343 is formed on the bottom surface of the thick portion 315 of the second frame 313. In addition, a liner 351 for protecting the adhesive layer 343 is disposed (FIG. 9B). Here, the liner 351 on which the adhesive layer 343 is formed may be prepared, and the liner 351 may be attached to the bottom surface of the thick portion 315 of the second frame body 313 via the adhesive layer 343.

An adhesive layer 341 is formed on the first surface 313A of the thick portion 315 of the second frame 313 (FIG. 9C). The first frame 311 is fixed to the second frame 313 via the formed adhesive layer 341 so as to surround the first frame 311 (FIG. 9D). At this time, in order to reinforce the adhesive layer 341, for example, the side surface (inclined surface) of the first frame body 311 and the thin portion of the second frame body 313 in contact with the side surface (inclined surface) of the first frame body 311. An adhesive layer may be further disposed between the second surface 313B of the side surface (inclined surface) 317.

In the present invention, a member having a substantially L-shaped cross section is used as the second frame 313, and the height of the filter 331 is approximately equal to the height of the second frame 313, whereby the back surface of the filter 331 is obtained. Therefore, the filter 331 can be disposed with sufficient adhesion without generating a void other than the through hole 321. In addition, the second surface 313B inside the second frame 313 that is engaged with the first frame 311 and intersects the surface of the first frame 311 on which the pellicle film 301 is disposed is the pellicle film 301. The second frame 313 obtains high adhesion to the first frame 311 formed by wet etching by inclining inward with respect to the surface of the first frame 311 on which the Can do.

In the pellicle 300 of this embodiment, the side surface of the first frame 311 is inclined inward with respect to the bottom surface, and the pellicle film 301 of the first frame 311 is disposed on the second frame 313. A thick portion 315 including a first surface 313A that receives a surface opposite to the surface, and a second surface 313B that is connected to the first surface 313A and receives a side surface of the first frame 311. The second surface 313B of the second frame 313 that surrounds the pellicle film 301 and the first frame 311 and engages the first frame 311 is the first surface on which the pellicle film 301 is disposed. What is necessary is just to incline inside with respect to the surface of the frame 311. Therefore, this embodiment also includes a modified example such as a pellicle 400 shown in FIG.

In the pellicle 400, the shape of the second frame 413 is different from that of the second frame 313. The second frame 413 is connected to the first surface 413A and the thick portion 415 including the first surface 413A that receives the surface opposite to the surface on which the pellicle film 401 of the first frame 411 is disposed. And a second surface 413B that receives the side surface of the first frame body 411, and surrounds the pellicle film 401 and the first frame body 411. The second frame body 413 is connected to the first thin portion 417A of the second frame body 413 that is in contact with the side surface of the first frame body 411, and the lower surface of the thick portion 415, and the second frame body 413 is connected. The second thin portion 417B including the bottom surface of the first thin portion 417B.

In FIG. 10, the second thin portion 417B of the second frame body 413 has a structure that is inclined toward the side surface on the outer side of the second frame body 413 toward the bottom surface. As another deformability, the inner side surface of the second thin portion 417B is parallel to the outer side surface of the second frame body 413, like the second frame body 213 of the pellicle 200 described above. It may be.

Further, the second frame 213 of the pellicle 200, which is a modification of the above-described first embodiment, is moved toward the bottom like the second thin portion 417B of the second frame 413. It is also possible to adopt a structure that is inclined in the lateral direction of the outer side.

(Embodiment 3)
In the embodiment described above, the second frame body surrounds the pellicle film and the first frame body on the first surface and the second surface, and fixes the first frame body via the adhesive layer. On the other hand, in the pellicle according to the present invention, the extreme ultraviolet light is transmitted through the pellicle film and is incident on the photomask with the second frame disposed, and the incident extreme ultraviolet light corresponds to the extreme ultraviolet light according to the photomask pattern. Light and extreme ultraviolet light as stray light due to higher-order reflection or diffuse reflection are emitted. When extreme ultraviolet light incident on and / or emitted from the photomask hits the adhesive layer, the adhesive layer deteriorates.

In this embodiment, a pellicle that suppresses deterioration of an adhesive layer by using a second frame body that has a third surface that is connected to the first surface and faces the second surface will be described. FIG. 11 is a cross-sectional view of the pellicle 500 according to one embodiment of the present invention, taken along line AA ′ in FIG.

The pellicle 500 includes a first frame body 511 in which the pellicle film 501 is disposed, and a second frame body 513 in which the first frame body 511 is fixed. The second frame 513 is connected to the first surface 513A and the thick portion 515 including the first surface 513A that receives the surface opposite to the surface on which the pellicle film 501 of the first frame 511 is disposed. And a second surface 513B for receiving the side surface of the first frame body 511. In the present embodiment, the second frame 513 further includes a third surface 513C that is connected to the first surface 513A and faces the second surface 513B, and the third frame 513 has a third surface 513C. The surface 513C is disposed to face the inner side surface of the first frame 511.

The pellicle 500 includes a through hole 521 disposed in the second frame 513 and a filter 531 that covers the through hole 521. The through hole 521 is disposed in the thick part 515 of the second frame 513 having a thickness in a direction intersecting the surface of the first frame 511 where the pellicle film 501 is disposed. The filter 531 is disposed on the outer side surface of the second frame body 513 intersecting the surface of the first frame body 511 on which the pellicle film 501 is disposed via an adhesive layer (not shown).

As the pellicle film 501, the first frame body 511, and the second frame body 513, materials similar to those of the above-described pellicle film, substrate, and second frame body 113 can be used, and thus detailed description thereof is omitted. .

The first frame body 511 and the second frame body 513 are fixed via an adhesive layer 541. The adhesive layer 541 is disposed on the first surface 513A of the thick portion 515 of the second frame 513 having a thickness in a direction intersecting the surface of the first frame 511 on which the pellicle film 501 is disposed. In order to reinforce the adhesive layer 541, for example, the side surface of the first frame body 511, the second surface 513 B of the thin portion 517 of the second frame body 513 that contacts the side surface of the first frame body 511, and the third surface An adhesive layer may be further disposed between the surface 513C.

In the present embodiment, the second frame 513 includes a protrusion that has a third surface 513C that is connected to the first surface 513A and faces the second surface 513B. The protruding portion having the third surface 513C can block the extreme ultraviolet light incident on and / or emitted from the photomask, and can be prevented from hitting the adhesive layer 541. For this reason, deterioration of the adhesive layer 541 due to extreme ultraviolet light can be suppressed.

Since the configuration of the adhesive layer 541, the through hole 521, and the filter 531 has been described above, detailed description thereof is omitted.

The manufacturing method of the pellicle 500 is different from the pellicle 100 only in the manufacturing process of the second frame 513. That is, the second surface 513B and the third surface 513C connected to the first surface 513A and facing the second surface 513B are in relation to the surface of the first frame 511 on which the pellicle film is formed. A second frame body 513 having a right angle is prepared, and the first frame body 511 is fixed to the second frame body 513 through an adhesive layer 541. Since other manufacturing processes are the same as those of the pellicle 100, a detailed description thereof is omitted.

In addition, the configuration including the protruding portion having the third surface of the second frame can be combined with the first frame in which the pellicle film is exposed by the wet etching described in the second embodiment. 12 is a schematic diagram of a pellicle 600 according to an embodiment, FIG. 12 (a) is a cross-sectional view taken along line AA ′ of FIG. 1, and FIGS. 12 (b) to 12 (d) are views of a second frame. This is a modification of the body 613.

The pellicle 600 includes a first frame body 611 on which the pellicle film 601 is disposed, and a second frame body 613 on which the first frame body 611 is fixed. The second frame 613 is connected to the first surface 613A and a thick portion 615 including a first surface 613A that receives the surface opposite to the surface on which the pellicle film 601 of the first frame 611 is disposed. And a second surface 613B that receives the side surface of the first frame body 611. In the present embodiment, the second frame 613 further includes a third surface 613C that is connected to the first surface 613A and faces the second surface 613B, and the third frame 613 has a third surface 613C. The surface 613C is disposed to face the inner side surface of the first frame 611.

The second frame 613 has a substantially L-shaped cross section orthogonal to the pellicle film 601. The pellicle 600 includes a through hole 621 disposed in the second frame 613 and a filter 631 that covers the through hole 621. The through hole 621 is disposed in the thick portion 615 of the second frame 613 having a thickness in a direction intersecting the surface of the first frame 611 where the pellicle film 601 is disposed. The filter 631 is disposed on the outer side surface of the second frame body 613 intersecting the surface of the first frame body 611 on which the pellicle film 601 is disposed via an adhesive layer (not shown).

In the present embodiment, since the first frame 611 is formed by wet etching, the side surface of the first frame 611 is inclined and the cross section becomes trapezoidal. Therefore, the second frame 613 that engages with the first frame 611 has an inner surface of the second frame 613 that intersects the surface of the first frame 611 on which the pellicle film 601 is disposed. The third surface 613C of the second frame body 613 that is inclined inward with respect to the surface of the first frame body 611 on which the pellicle film 601 is disposed is engaged with the first frame body 611. The first surface 613A is inclined toward the surface of the first frame 611 on which the pellicle film 601 is disposed so that the distance from the second surface 613B increases.

The pellicle 600 is connected to the first surface 613A, and faces the surface of the first frame body 611 on which the pellicle film 601 is disposed, and the second surface 613B and the third surface are inclined so as to increase in distance from each other. By having the surface 613C, the second frame 613 can obtain high adhesion with the first frame 611 formed by wet etching.

Further, in the present embodiment, the second frame 613 has a distance from the second surface toward the surface of the first frame on which the pellicle film is disposed from the first surface. A protrusion having a third surface 613C that is inclined to be larger is provided. The protruding portion having the third surface 613C can block extreme ultraviolet light incident on and / or emitted from the photomask and can prevent the ultraviolet light from hitting the adhesive layer 641. For this reason, deterioration of the adhesive layer 641 due to extreme ultraviolet light can be suppressed.

Note that the projecting portion having the third surface 613C of the second frame 613 includes a modification of the tip shape as shown in FIGS. 12 (b) to 12 (d). Therefore, in the pellicle 600 according to the present embodiment, the cross-sectional shape of the tip of the protruding portion having the third surface 613C of the second frame 613 may be an acute angle as shown in FIG. It may be trapezoidal as shown in FIG. 12C, or may have an R shape as shown in FIG. 12D, and is not limited thereto.

The manufacturing method of the pellicle 600 is different from the pellicle 300 only in the manufacturing process of the second frame 613. That is, a second surface 613B that is inclined inward with respect to the surface of the first frame body 611 on which the pellicle film 601 is formed, and the first frame body 611 on which the pellicle film 601 is disposed from the first surface 613A. A second frame body 613 having a third surface 613C that is inclined so as to increase the distance from the second surface 613B toward the surface of the first surface 613B is prepared, and the first frame body 611 is provided via the adhesive layer 641. Is fixed to the second frame 613. Since other manufacturing processes are the same as those of the pellicle 300, detailed description thereof is omitted.

Note that, in the pellicle 500 and the pellicle 600, the second frame body faces the bottom surface in the lateral direction toward the bottom surface, like the second thin portion 417B of the second frame body 413 described above. It may have an inclined structure. Further, as another deformability, like the above-described second frame 213 of the pellicle 200, the inner side surface of the second thin portion is made parallel to the outer side surface of the second frame body. Also good.

(Embodiment 4)
In the above-described embodiment, the pellicle film of the pellicle according to the present invention is an unprecedented thin film having a film thickness of 20 nm to 50 nm, and thus it is difficult to fix it to a photomask by hand like a conventional pellicle. . Therefore, non-contact sticking to a photomask is required using a dedicated sticking device. In the present embodiment, an example in which a non-contact sticking means to a photomask is provided in the second frame will be described.

FIG. 13 is a schematic view of the second frame 713 used in the pellicle 700 according to one embodiment of the present invention, and the upper diagram is a perspective view of the upper surface side of the second frame 713 and the lower diagram. The figure is a perspective view of the second frame body 713 on the bottom side. As shown in FIG. 14, the pellicle 700 includes a first frame 711 on which the pellicle film 701 is arranged, and a second frame 713 on which the first frame 711 is fixed. The second frame 713 surrounds the pellicle film 701 and the first frame 711, and a cross section orthogonal to the pellicle film 701 has an L shape. In addition, the pellicle 700 includes a through hole 721 disposed in the second frame 713 and a filter 731 that covers the through hole 721. The through hole 721 is disposed in the thick part 715 of the second frame 713 having a thickness in a direction intersecting with the surface of the first frame 711 on which the pellicle film 701 is disposed. The filter 731 is disposed on the outer surface of the second frame 713 intersecting the surface of the first frame 711 on which the pellicle film 701 is disposed via an adhesive layer (not shown).

The second frame body 713 is provided with a groove 714 on the upper surface of the thick portion 715. In the present embodiment, the shape of the groove 714 viewed from the upper surface (thickness direction) of the second frame 713 is an endless shape that goes around the shape of the second frame 713.

The second frame 713 has a through hole 714A and a through hole 714B. The through hole 714A and the through hole 714B penetrate between the bottom surface of the groove 714 and the outer surface of the second frame body 713, respectively.

Here, the through holes 714 A and 714 B may respectively penetrate between the side surface of the groove 714 and the outer surface of the second frame body 713. Further, either one of the through

holes

714A and 714B may be omitted. That is, in the second frame 713, two through holes (through

holes

714A and 714B) are connected to one groove (groove 714), but the present embodiment is not limited to this mode. In the present embodiment, it is sufficient that at least one through hole is connected to one groove (groove 714, groove 716).

As shown in FIGS. 13 and 14, a groove 716 is provided on the bottom surface of the second frame 713 opposite to the upper surface of the thick portion 715. In the present embodiment, similarly to the shape of the groove 714, the shape of the groove 716 is an endless shape that makes a round along the shape of the second frame 713 when viewed from the thickness direction.

The second frame 713 has a through hole 716A and a through hole 716B. The through hole 716 A and the through hole 716 B each penetrate between the bottom surface of the groove 716 and the outer surface of the second frame body 713. The variations of the through

holes

716A and 716B are the same as the variations of the through

holes

714A and 714B.

The second frame 713 is suitable for an application in which the pellicle 700 is manufactured by fixing (supporting) the pellicle film 701 and the first frame 711. The second frame 713 is provided with a groove 714 on the upper surface of the thick portion 715 that is a surface facing the first frame 711 and through

holes

714A and 714B connected to the groove 714. Yes. For this reason, when fixing the first frame 711 to the thick part 715 of the second frame 713, the inside of the groove 714 is decompressed (for example, by an evacuation unit such as a vacuum pump) through the through

holes

714A and 714B. Thus, the pressure between the second frame 713 and the first frame 711 can be reduced. By this pressure reduction, a pressing force can be applied between the second frame body 713 and the first frame body 711, so that the front and back surfaces of the second frame body 713 and the first frame body 711 (that is, Without contacting the upper surface and the bottom surface of the thick portion 715 of the second frame body 713 and the surface of the first frame body 711 on which the pellicle film 701 is disposed and the bottom surface of the first frame body 711). Can be fixed.

The second frame body 713 and the first frame body 711 are fixed through an adhesive layer 741. By reducing the pressure, the second frame body 713 and the pellicle film can be pressed through the adhesive layer 741, so that the second frame body 713 and the first frame body 711 can be firmly fixed. .

Other configurations are the same as those described in the first and second embodiments, and thus detailed description thereof is omitted. In addition, in FIGS. 13 and 14, the case where the side surface and the bottom surface of the first frame body 711 are substantially orthogonal to each other has been described, like the first frame body 111 illustrated in the first embodiment. The present embodiment can also be applied to a second frame body that engages with a first frame body having an inclined side surface as shown in the second embodiment.

(Manufacturing method of pellicle 700)
The basic steps of the method for manufacturing the pellicle 700 of this embodiment are the same as those of the first and second embodiments. Similar to the first or second embodiment, the first frame 711 is formed.

Separately, a second frame 713 having a L-shaped cross section in the height direction of the frame is prepared. In the present embodiment, in the second frame 713, the inner side surface of the thin portion 717 is substantially perpendicular to the upper surface. That is, the inner surface of the second frame 713 intersecting the surface of the first frame 711 on which the pellicle film 701 is arranged is in relation to the surface of the first frame 711 on which the pellicle film 701 is formed. It becomes a right angle.

A through hole 721 is formed in the thick portion 715 having a thickness in a direction intersecting with the height direction of the second frame 713. The upper limit of the height of the pellicle 700 is 2.5 mm due to the limitations of the exposure apparatus, and the higher the height of the pellicle 700 is better from the prevention of foreign object image formation. However, according to known information, the height of the pellicle 700 is said to be 2 mm (for example, Non-Patent Document 1). In view of the above, when the pressure is reduced from normal pressure (0.1 MPa) to the vacuum state during exposure (10 ⁻⁴ to 10 ⁻⁶ Pa), the through-hole 721 expands the pellicle film 701 due to the differential pressure inside and outside the pellicle 700. The diameter is less than 0.5 mm. In the present embodiment, since the through hole 721 is covered with the filter 731, the diameter of the through hole 721 is set in consideration of the resistance due to the filter 731.

Further, a groove 714 is formed on the upper surface of the thick portion 715 of the second frame 713, and through

holes

714A and 714B penetrating between the side surface of the groove 714 and the outer surface of the second frame 713 are formed. . Similarly, a groove 716 is formed on the bottom surface of the thick portion 715 of the second frame 713, and through

holes

716A and 716B penetrating between the side surface of the groove 716 and the outer surface of the second frame 713 are formed. To do.

A filter 731 that covers the through-hole 721 is bonded to the outer surface of the second frame 713 parallel to the height direction of the second frame 713. The filter 731 is preferably a filter having the above-described characteristics, and the width (height) is preferably substantially equal to the height of the second frame body 713 from the viewpoint of securing adhesiveness to the second frame body 713.

Here, like the filter 131, the filter 731 includes a ventilation portion and an adhesive margin portion (not shown). The margin part surrounds the periphery of the filter so as to cover the ventilation part. The glue margin part serves to bond the second frame body and the ventilation part without any gap. Gas does not pass through the glue margin. The width | variety of a margin part is 0.2 mm or more and 1.0 mm or less. In order to increase the area of the ventilation portion, it is desirable that the width of the adhesive margin is as narrow as possible.

An adhesive layer 743 is formed on the bottom surface of the thick portion 715 of the second frame 713. At this time, the adhesive layer 743 is formed so that the groove 716 provided on the bottom surface of the thick portion 715 of the second frame 713 is not covered with the adhesive layer 743. In addition, a liner 751 for protecting the adhesive layer 743 is provided. Here, the liner 751 in which the adhesive layer 743 is formed may be prepared, and the liner 751 may be attached to the bottom surface of the thick portion 715 of the second frame body 713 via the adhesive layer 743.

An adhesive layer 741 is formed on the upper surface of the thick portion 715 of the second frame 713. At this time, the adhesive layer 741 is formed so that the groove 714 provided on the upper surface of the thick portion 715 of the second frame 713 is not covered with the adhesive layer 741. The first frame 711 is fixed to the second frame 713 via the formed adhesive layer 741 so as to surround the first frame 711. At this time, in order to reinforce the adhesive layer 741, for example, an adhesive layer is provided between the side surface of the first frame body 711 and the thin portion 717 of the second frame body 713 in contact with the side surface of the first frame body 711. Further, it may be arranged. Since the space for mounting the pellicle on the photomask has a height of only 2.5 mm, in this embodiment, the space is arranged on the height of the second frame 713 and the lower surface of the second frame 713. The total height of the adhesive layer 743 is preferably 2 mm or less.

The step of fixing the first frame 711 to the second frame 713 is performed using, for example, the pellicle manufacturing apparatus 1000 shown in FIG. The pellicle manufacturing apparatus 1000 includes a vacuum chamber 1100, a mounting table 1200 disposed in the vacuum chamber 1100, a supply pipe 1110 for supplying gas to the vacuum chamber 1100, and the gas in the vacuum chamber 1100 outside the vacuum chamber 1100.

Discharge pipes

1120A and 1120B. Ends (not shown) of the

discharge pipes

1120A and 1120B outside the vacuum chamber 1100 are connected to exhaust means (not shown) such as a vacuum pump.

On the mounting table 1200 in the vacuum chamber 1100, the second frame 713 is mounted. Specifically, the liner 751 of the second frame 713 and the mounting table 1200 are placed in contact with each other. A composite member of the pellicle film 701 and the first frame body 711 is disposed on the adhesive layer 741 of the second frame body 713.

As an example, a composite member of a first frame body 711 that is a silicon wafer (for example, an 8-inch silicon wafer) and a pellicle film 701 that is a polycrystalline silicon film (p-Si film) is used as a composite member. . A notch for cutting the first frame 711 into a predetermined size is provided at a predetermined position of the composite member. The first frame body 711 is preferably cut into a predetermined size before being bonded to the second frame body 713 (hereinafter, this operation is also referred to as “trimming”).

Further, the

discharge pipes

1120A and 1120B each have an end portion in the vacuum chamber 1100. These end portions can be connected to two through

holes

714A and 714B for decompressing the inside of the groove 714 of the second frame 713, respectively.

Hereinafter, an example of a method for manufacturing a pellicle using the above-described pellicle manufacturing apparatus 1000 will be described. First, the second frame 713 is mounted on the mounting table 1200 in the vacuum chamber 1100, and the first frame 711 is disposed above the second frame 713. At this stage, the adhesive layer 741 and the first frame 711 are arranged so as not to contact each other.

Next, the second frame 713 and the first frame 711 are positioned by a known means. By positioning, the first frame body 711 is arranged to be fitted by the opening surrounded by the second frame body 713. Next, the respective end portions of the

discharge pipes

1120A and 1120B are connected to two through

holes

714A and 714B for decompressing the inside of the groove 714 of the second frame body 713 (frame body), respectively.

Next, the inside of the vacuum chamber 1100 is pressurized by supplying gas from the supply pipe 1110 into the vacuum chamber 1100. At the same time, by operating a vacuum pump (not shown) connected to the outside of the vacuum chamber 1100 of the

discharge pipes

1120A and 1120B, the two penetrations of the

discharge pipes

1120A and 1120B and the second frame 713 The inside of the groove 714 provided on the upper surface of the thick portion 715 of the second frame 713 is decompressed through the

holes

714A and 714B. The degree of pressurization and depressurization is between the first frame 711 and the second frame 713 caused by the difference (differential pressure) between the total pressure in the vacuum chamber 1100 and the pressure in the groove 714. The pressing force (the force applied to the entire second frame 713) is adjusted to be, for example, about 2N. Due to the differential pressure, a pressing force is generated between the first frame 711 and the second frame 713, and the adhesive layer 741 of the second frame 713 and the first frame 711 are bonded. .

As described above, the first frame body 711 and the second frame body 713 can be bonded together without contacting the front surface and the back surface. Note that the order of the above operations can be changed as appropriate.

(Pellicle placement method on photomask)
As an example, the method of arranging the pellicle on the photomask of the present embodiment is a surface that supports the first frame body 711 in which at least the pellicle film 701 of the second frame body 713 is disposed in the pellicle 700 of the present embodiment. Disposing the pellicle provided with the groove 716 on the opposite surface to the photomask and the photomask so that the surface of the second frame 713 provided with the groove 716 and the photomask face each other. And a fixing step of fixing the pellicle 700 and the photomask by decompressing the inside of the groove 716 through the through

holes

716A and 716B.

According to the method for disposing the pellicle on the photomask of this embodiment, the pressing force between the pellicle 700 and the photomask can be exerted by reducing the pressure inside the groove 716. And it can fix both, without contacting a back surface.

In the method for arranging the pellicle on the photomask of the present embodiment, the pressure reduction in the fixing step is preferably performed in a state where the pellicle 700 and the photomask are arranged in a pressurized atmosphere. According to this aspect, since the difference (differential pressure) between the pressure of the entire atmosphere in which the pellicle 700 and the photomask are disposed and the pressure inside the groove 716 can be increased, the pellicle 700 and the photomask The pressing force between the two can be increased. For this reason, both can be fixed more easily.

The pressing force between the pellicle 700 and the photomask (the force applied to the entire second frame 713) is preferably 1N or more, and more preferably 2N or more. The pressing force between the pellicle 700 and the photomask (the force applied to the entire second frame 713) is more preferably 10N or more, and particularly preferably 20N or more. The upper limit of the pressing force between the pellicle 700 and the photomask (the force applied to the entire second frame 713) is not particularly limited, but is, for example, 500 N, preferably 400 N from the viewpoint of productivity. .

Next, an example of a method for arranging the pellicle on the photomask of this embodiment will be described with reference to FIG. However, the method of arranging the pellicle on the photomask of this embodiment is not limited to this example. FIG. 15 is a cross-sectional view conceptually showing an example of a photomask manufacturing apparatus 2000 suitable for the pellicle placement method on the photomask of this embodiment.

A photomask manufacturing apparatus 2000 shown in FIG. 15 includes a vacuum chamber 2100, a supply pipe 2110 for supplying gas to the vacuum chamber 2100, and a discharge pipe 2120A for discharging the gas in the vacuum chamber 2100 to the outside of the vacuum chamber 2100. And 2120B. Ends (not shown) of the

discharge pipes

2120A and 2120B outside the vacuum chamber 2100 are connected to exhaust means (not shown) such as a vacuum pump.

A photomask 2500 is disposed in the vacuum chamber 2100. As the photomask 2500, a photomask including a support substrate, a reflective layer stacked over the support substrate, and an absorber layer formed over the reflective layer is used. The photomask 2500 has a front surface (light irradiation surface; that is, a surface on which the reflection layer and the absorber layer are provided) in the vacuum chamber 2100 and a back surface (surface opposite to the light irradiation surface; , The support substrate side surface).

Then, a pellicle 700 from which the liner 751 has been removed is disposed above the reflective layer and the absorption layer of the photomask 2500. Specifically, the adhesive layer 743 side of the pellicle 700 is arranged in a direction facing the front surface (light irradiation surface) of the photomask 2500.

Further, the

discharge pipes

2120A and 2120B each have an end portion in the vacuum chamber 2100. Each of these end portions can be connected to two through holes for decompressing the inside of the groove 716 provided on the bottom surface of the second frame body 713.

Hereinafter, an example of a method for arranging the pellicle on the photomask using the photomask manufacturing apparatus 2000 will be described. First, a pellicle 700 obtained by removing the liner 751 is prepared. Next, the photomask 2500 is disposed in the vacuum chamber 2100 so that the front surface (light irradiation surface) faces upward. At this time, in order to prevent foreign matters from adhering to the front surface and the back surface of the photomask 2500, for example, by supporting only the side surface of the photomask 2500, the machine, jig, Arrange so that hands do not touch.

Next, the pellicle 700 is disposed above the photomask 2500. At this time, in order to prevent foreign matter from adhering to the film surface of the pellicle 700, for example, by supporting only the side surface (outer peripheral surface) of the second frame 713, the film surface of the pellicle 700 is , Arrange them so that jigs, hands, etc. do not touch. At this stage, the adhesive layer 743 and the photomask 2500 are arranged so as not to contact each other. Next, the pellicle 700 and the photomask 2500 are positioned by a known means.

Next, the respective end portions of the

discharge pipes

2120A and 2120B are connected to two through holes for decompressing the inside of the groove 716 on the bottom side of the second frame body 713, respectively. Next, the inside of the vacuum chamber is pressurized by supplying gas from the supply pipe 2110 into the vacuum chamber 2100. At the same time, by operating a vacuum pump (not shown) connected to the outside of the vacuum chamber 2100 of the

discharge pipes

2120A and 2120B, the two penetrations of the

discharge pipes

2120A and 2120B and the second frame 713 The inside of the groove 716 provided in the bottom surface of the second frame 713 is decompressed through the

holes

716A and 716B. The degree of pressurization and depressurization depends on the pressing force between the pellicle 700 and the photomask 2500 (second pressure) generated by the difference (differential pressure) between the total pressure in the vacuum chamber 2100 and the pressure in the groove 716. The force applied to the entire frame 713 is adjusted to be about 2N, for example. The pressure difference causes a pressing force between the pellicle 700 and the photomask 2500, and the adhesive layer 743 of the pellicle 700 and the photomask 2500 are bonded.

As described above, the pellicle 700 and the photomask 2500 can be bonded together without contacting the front and back surfaces. Thereby, both can be adhered while suppressing adhesion of foreign matter to the pellicle 700 and the photomask 2500. Note that the order of the above operations can be changed as appropriate.

(Variation of how to place pellicle on photomask)
In the above-described method for arranging the pellicle on the photomask, the pellicle 700 is formed by bonding the first frame body 711 and the second frame body 713 and then arranged on the photomask 2500. However, the method of arranging the pellicle on the photomask according to the present invention is not limited to this, and the order can be changed. As an example, an example in which a pellicle is completed by bonding the first frame to the second frame after the second frame is arranged on the photomask will be described.

In the present embodiment, the second frame 713 in which the groove 716 is provided on the surface opposite to the surface that supports the first frame 711 on which the pellicle film 701 is disposed, and the photomask are provided. The step of disposing the frame 713 of the second frame 713 so that the surface on which the groove 716 is provided and the photomask face each other, and the inside of the groove 716 is decompressed through the through

holes

716A and 716B. And a step of fixing the first frame body 711 on which the pellicle film 701 is disposed to the second frame body 713.

Note that, as described in the fourth embodiment, the second frame 713 surrounds the pellicle film 701 and the first frame 711, and the cross section orthogonal to the pellicle film 701 has an L shape. A through hole 721 arranged in the second frame 713 and a filter 731 covering the through hole 721 are provided. The second frame 713 includes a groove 714 provided on the upper surface of the thick portion 715, a through hole 714 A penetrating between the bottom surface of the groove 714 and the outer surface of the second frame 713, and the through hole 714 A. The through hole 716A and the through hole that penetrate between the hole 714B, the groove 716 provided on the bottom surface opposite to the upper surface of the thick portion 715, and the bottom surface of the groove 716 and the outer surface of the second frame 713 716B.

According to the method for arranging the pellicle on the photomask of the present embodiment, the pressing force between the second frame body 713 and the photomask can be exerted by reducing the pressure inside the groove 716. Both can be fixed via the adhesive layer 743 without contacting the frame 713 and the front and back surfaces of the photomask.

In the method of arranging the pellicle on the photomask of this embodiment, the pressure reduction in the fixing process of the second frame 713 is performed in a state where the second frame 713 and the photomask are arranged in a pressurized atmosphere. preferable. According to this aspect, since the difference (differential pressure) between the pressure of the entire atmosphere in which the second frame 713 and the photomask are arranged and the pressure inside the groove 716 can be increased, the second The pressing force between the frame body 713 and the photomask can be increased. For this reason, both can be fixed more easily.

The pressing force between the second frame 713 and the photomask is preferably 1N or more, and more preferably 2N or more. The pressing force between the second frame 713 and the photomask is more preferably 10N or more, and particularly preferably 20N or more. The upper limit of the pressing force between the second frame 713 and the photomask is not particularly limited, but is, for example, 500 N, preferably 400 N from the viewpoint of productivity.

Further, the pressure between the second frame body 713 and the first frame body 711 is reduced by reducing the pressure inside the groove 714 through the through

holes

714A and 714B (for example, by exhaust means such as a vacuum pump). Can do. By this pressure reduction, a pressing force can be applied between the second frame body 713 and the first frame body 711, so that the front and back surfaces of the second frame body 713 and the first frame body 711 (that is, Without contacting the upper surface and the bottom surface of the thick portion 715 of the second frame body 713 and the surface of the first frame body 711 on which the pellicle film 701 is disposed and the bottom surface of the first frame body 711). Can be fixed.

Next, a modification of the method for arranging the pellicle on the photomask of this embodiment will be described with reference to FIG. However, the method of arranging the pellicle on the photomask of this embodiment is not limited to this example. FIG. 16 is a cross-sectional view conceptually showing an example of a photomask manufacturing apparatus 3000 suitable for the method of arranging the pellicle on the photomask of this embodiment.

A photomask manufacturing apparatus 3000 shown in FIG. 16 includes a vacuum chamber 3100, a supply pipe 3110 for supplying gas to the vacuum chamber 3100, and a discharge pipe 3120A for discharging the gas in the vacuum chamber 3100 to the outside of the vacuum chamber 3100. And 3120B. Ends (not shown) of the

discharge pipes

3120A and 3120B outside the vacuum chamber 3100 are connected to exhaust means (not shown) such as a vacuum pump.

A photomask 3500 is disposed in the vacuum chamber 3100. As the photomask 3500, a photomask including a supporting substrate, a reflective layer stacked over the supporting substrate, and an absorber layer formed over the reflective layer is used. The photomask 3500 has a front surface (light irradiation surface; that is, a surface on which the reflection layer and the absorber layer are provided) in the vacuum chamber 3100 and a back surface (surface opposite to the light irradiation surface; , The support substrate side surface).

Then, a second frame 713 from which the liner 751 has been removed is disposed above the reflective layer and the absorption layer of the photomask 3500. Specifically, the adhesive layer 743 side of the second frame 713 is arranged in a direction facing the front surface (light irradiation surface) of the photomask 3500.

Further, the

discharge pipes

3120A and 3120B each have an end portion in the vacuum chamber 3100. Each of these end portions can be connected to two through holes for decompressing the inside of the groove 716 provided on the bottom surface of the second frame body 713.

Hereinafter, an example of a method for arranging the pellicle on the photomask using the photomask manufacturing apparatus 3000 will be described. First, a second frame 713 obtained by removing the liner 751 is prepared. Next, the photomask 3500 is disposed in the vacuum chamber 3100 so that the front surface (light irradiation surface) faces upward. At this time, in order to prevent foreign matters from adhering to the front surface and the back surface of the photomask 3500, for example, by supporting only the side surface of the photomask 3500, a machine, a jig, Arrange so that hands do not touch.

Next, the second frame body 713 is disposed above the photomask 3500. At this stage, the adhesive layer 743 and the photomask 3500 are arranged so as not to contact each other. Next, the second frame 713 and the photomask 3500 are positioned by a known means.

Next, the respective end portions of the

discharge pipes

3120A and 3120B are connected to two through holes for decompressing the inside of the groove 716 on the bottom side of the second frame body 713, respectively. Next, the inside of the vacuum chamber 3100 is pressurized by supplying gas from the supply pipe 3110 into the vacuum chamber 3100. At the same time, by operating a vacuum pump (not shown) connected to the end of the

discharge pipes

3120A and 3120B outside the vacuum chamber 3100, the two penetrations of the

discharge pipes

3120A and 3120B and the second frame 713 are performed. The inside of the groove 716 provided in the bottom surface of the second frame 713 is decompressed through the

holes

716A and 716B. The degree of pressurization and depressurization is the pressing force between the second frame 713 and the photomask 3500 generated by the difference (differential pressure) between the total pressure in the vacuum chamber 3100 and the pressure in the groove 716. Is adjusted to be, for example, about 2N. The pressure difference causes a pressing force between the second frame 713 and the photomask 3500, and the adhesive layer 743 of the pellicle 700 and the photomask 3500 are bonded.

Next, the first frame body 711 is disposed above the second frame body 713. At this stage, the adhesive layer 741 and the first frame 711 are arranged so as not to contact each other. Further, the second frame 713 and the first frame 711 are positioned by a known means. By positioning, the first frame body 711 is arranged to be fitted by the opening surrounded by the second frame body 713. Next, the respective end portions of the

discharge pipes

3220A and 3220B are connected to the two through

holes

Next, the inside of the vacuum chamber 3100 is pressurized by supplying gas from the supply pipe 3110 into the vacuum chamber 3100. At the same time, by operating a vacuum pump (not shown) connected to the end of the

discharge pipes

3220A and 3220B outside the vacuum chamber 3100, the two penetrations of the

discharge pipes

3220A and 3220B and the second frame 713 are performed. The inside of the groove 714 provided on the upper surface of the thick portion 715 of the second frame 713 is decompressed through the

holes

714A and 714B. The degree of pressurization and depressurization is between the first frame 711 and the second frame 713 caused by the difference (differential pressure) between the overall pressure in the vacuum chamber 3100 and the pressure in the groove 714. The pressing force (the force applied to the entire second frame 713) is adjusted to be, for example, about 2N. Due to the differential pressure, a pressing force is generated between the first frame 711 and the second frame 713, and the adhesive layer 741 of the second frame 713 and the first frame 711 are bonded. .

As described above, the pellicle 700 and the photomask 3500 can be bonded together without contacting the front and back surfaces. Thereby, both can be adhered while suppressing adhesion of foreign matter to the pellicle 700 and the photomask 3500. Note that the order of the above operations can be changed as appropriate.

(Exposure method)
Using the pellicle according to the above-described embodiment, fine processing by extreme ultraviolet light lithography can be realized. The pellicle according to the present invention is disposed on the reticle surface of a photomask, the photomask is disposed at a predetermined position of the exposure apparatus, and the pellicle is accommodated in a gap having a distance of 3 mm or less from the reticle surface. The pattern is exposed to the resist by irradiating the photomask on which the resist is formed with light of 5 nm to 30 nm and irradiating the substrate on which the resist layer is formed with the light emitted from the reticle surface of the photomask on which the pellicle is disposed. be able to.

Since the pellicle film of the pellicle according to the present invention is an unprecedented thin film having a thickness of 20 nm to 50 nm, it is difficult to fix the pellicle film to the photomask by hand like the conventional pellicle. Therefore, non-contact pasting is required using a dedicated pasting device.

The photomask with the pellicle according to the present invention is disposed at a predetermined position of the exposure apparatus. The pellicle is accommodated in a gap having a distance of 3 mm or less, particularly 2.5 mm, from the reticle surface.

A base material on which a resist layer is formed is introduced into the exposure apparatus, and the exposure apparatus is evacuated to about 10 ⁻⁴ to 10 ⁻⁶ Pa. At this time, air flows out from the inside of the pellicle according to the present invention attached to the photomask. As described above, the pellicle according to the present invention uses a member having a L-shaped cross section as the second frame, and makes the height of the filter approximately equal to the height of the second frame. Since the filter is disposed with sufficient adhesion without generating a void other than the through hole on the back surface of the pellicle, the inside of the pellicle can be evacuated without damaging the pellicle film.

Thereafter, EUV light of 5 nm to 30 nm is irradiated onto the photomask on which the pellicle is arranged. Since the photomask has a multilayer reflective film formed below the reticle surface, EUV light incident on the reticle surface is reflected by the multilayer reflective film, and EUV light reflecting the pattern formed by the absorber on the reticle surface is reflected. The light passes through the pellicle from the reticle surface and exits.

By irradiating the light emitted from the reticle surface of the photomask onto the substrate on which the resist layer is formed, the pattern can be exposed on the resist. Thereby, unprecedented fine processing is realized.

100: Pellicle, 101: Pellicle film, 105: Substrate, 111: First frame, 113: Second frame, 113A: First surface, 113B: Second surface, 115: Thick part, 117: Thin section, 121: through hole, 131: filter, 135: ventilation section, 137: adhesive margin section, 141: adhesive layer, 143: adhesive layer, 151: liner, 200: pellicle, 201: pellicle film, 205: substrate, 211: 1st frame, 213: 2nd frame, 213A: 1st surface, 213B: 2nd surface, 215: Thick part, 217: Thin part, 221: Through hole, 231: Filter, 241 : Adhesive layer, 243: adhesive layer, 251: liner, 300: pellicle, 301: pellicle film, 305: substrate, 311: first frame, 313: second frame, 313A: first surface, 313B : Second surface, 315 Thick portion, 317: thin portion, 321: through-hole, 331: filter, 341: adhesive layer, 343: adhesive layer, 351: liner, 400: pellicle, 401: pellicle film, 411: first frame, 413: Second frame, 413A: first surface, 413B: second surface, 415: thick portion, 417: thin portion, 421: through-hole, 431: filter, 441: adhesive layer, 443: adhesive layer, 451 : Liner, 500: pellicle, 501: pellicle film, 511: first frame, 513: second frame, 513A: first surface, 513B: second surface, 513C: third surface, 515 : Thick part, 517: Thin part, 521: Through hole, 531: Filter, 541: Adhesive layer, 543: Adhesive layer, 551: Liner, 600: Pellicle, 601: Pellicle film, 611: First frame, 613 : No. 613A: first surface, 613B: second surface, 613C: third surface, 615: thick portion, 617: thin portion, 621: through-hole, 631: filter, 641: adhesive layer, 643 : Adhesive layer, 651: liner, 700: pellicle, 701: pellicle film, 711: first frame, 713: second frame, 713A: first surface, 713B: second surface, 714: groove , 714A: through hole, 714B: through hole, 715: thick part, 716: groove, 716A: through hole, 716B: through hole, 717: thin part, 721: through hole, 731: filter, 741: adhesive layer, 743 : Adhesive layer, 751: liner, 800: pellicle, 801: pellicle film, 811: first frame, 813: second frame, 821: through-hole, 831: filter, 841: adhesive layer, 843: adhesion Layer, 851: Liner, 890: gap, 900: pellicle, 901: pellicle film, 911: first frame, 913: second frame, 921: through-hole, 931: filter, 941: adhesive layer, 943: adhesive layer, 951: liner, 990: gap, 1000: pellicle manufacturing apparatus, 1100: vacuum chamber, 1200: mounting table, 1110: supply pipe, 1120A: discharge pipe, 1120B: discharge pipe _, 2000: photomask manufacturing apparatus, 2100: vacuum chamber 2110: supply pipe, 2120A: discharge pipe, 2120B: discharge pipe, 2500: photomask, 3000: photomask manufacturing apparatus, 3100: vacuum chamber, 3110: supply pipe, 3120A: discharge pipe, 3120B: discharge pipe, 3220A: Discharge tube, 3220B: Discharge tube, 3500: Photomask

Claims

A first frame having a pellicle film disposed thereon;
A thick portion including a first surface that receives a surface opposite to the surface on which the pellicle film of the first frame is disposed, and a side surface of the first frame that is connected to the first surface A second surface for receiving,
A second frame surrounding the pellicle film and the first frame;
A through hole disposed in the thick part of the second frame,
A pellicle comprising: a filter disposed on an outer side surface of the second frame that intersects a surface of the first frame on which the pellicle film is disposed, and covering the through hole.
The second surface of the second frame engaged with the first frame is perpendicular to the surface of the first frame on which the pellicle film is disposed. The pellicle according to claim 1.
The second surface of the second frame engaged with the first frame is inclined inward with respect to the surface of the first frame on which the pellicle film is disposed. The pellicle according to claim 1.
The second frame further has a third surface connected to the first surface and facing the second surface;
2. The pellicle according to claim 1, wherein the third surface of the second frame is disposed to face an inner side surface of the first frame.
The third surface of the second frame engaged with the first frame is perpendicular to the surface of the first frame on which the pellicle film is disposed. The pellicle according to claim 4.
The third surface of the second frame engaged with the first frame is directed from the first surface toward the surface of the first frame on which the pellicle film is disposed. The pellicle according to claim 4, wherein the pellicle is inclined so as to increase a distance from the second surface.
2. The pellicle according to claim 1, wherein the first frame body and the thick part of the second frame body are bonded to each other through an adhesive layer.
2. The pellicle according to claim 1, wherein the pellicle film has a transmittance of 90.0% or more for light having a wavelength of 5 nm or more and 30 nm or less and a film thickness of 20 nm or more and 50 nm or less.
2. The pellicle according to claim 1, wherein the total of the height of the second frame and the height of the adhesive layer disposed on the lower surface of the second frame is 2 mm or less.
The pellicle according to claim 1, wherein the first frame is made of a material selected from the group consisting of silicon, sapphire, and silicon carbide.
The pellicle according to claim 1, the ratio of the total area of the vent portion of the filter for the internal volume of the pellicle is equal to or less than 0.007 mm -1 or 0.026 mm -1.
A pellicle film is formed on the substrate,
Forming a first frame by exposing the pellicle film so that the substrate has a frame shape;
A thick portion including a first surface that receives a surface opposite to the surface on which the pellicle film of the first frame is disposed, and a side surface of the first frame that is connected to the first surface A second frame having a second surface for receiving,
A through hole is formed in the thick part of the second frame,
Adhering a filter that covers the through hole to the outer surface of the second frame parallel to the height direction of the second frame,
A method for manufacturing a pellicle, comprising fixing the first frame to the second frame through an adhesive layer so as to surround the first frame.
Exposing the pellicle film by dry etching,
Preparing the second frame in which the second surface is perpendicular to the surface of the first frame on which the pellicle film is formed;
The method for manufacturing a pellicle according to claim 12, wherein the first frame body is fixed to the second frame body via the adhesive layer.
The pellicle film is exposed by wet etching,
Preparing the second frame in which the second surface is inclined inward with respect to the surface of the first frame on which the pellicle film is formed;
The method for manufacturing a pellicle according to claim 12, wherein the first frame body is fixed to the second frame body via the adhesive layer.
Exposing the pellicle film by dry etching,
The second surface and the third surface connected to the first surface and facing the second surface are perpendicular to the surface of the first frame on which the pellicle film is formed. Preparing the second frame,
The method for manufacturing a pellicle according to claim 12, wherein the first frame body is fixed to the second frame body via the adhesive layer.
The pellicle film is exposed by wet etching,
A second surface inclined inward with respect to the surface of the first frame body on which the pellicle film is formed, and a surface of the first frame body on which the pellicle film is disposed from the first surface To prepare the second frame body having a third surface inclined so as to increase the distance from the second surface,
The method for manufacturing a pellicle according to claim 12, wherein the first frame body is fixed to the second frame body via the adhesive layer.
Forming the pellicle film having a thickness of 20 nm to 50 nm on the substrate;
The method for producing a pellicle according to claim 12, wherein the pellicle film has a transmittance of 90.0% or more for light having a wavelength of 5 nm or more and 30 nm or less.
The method for manufacturing a pellicle according to claim 12, wherein the sum of the height of the second frame and the height of the adhesive layer disposed on the lower surface of the second frame is 2 mm or less.
The method for manufacturing a pellicle according to claim 12, wherein the substrate is a substrate selected from the group consisting of a silicon substrate, a sapphire substrate, and a silicon carbide substrate.
The method of producing a pellicle according to claim 12, characterized in that the ratio of the total area of the vent portion of the filter for the internal volume of the pellicle and 0.007 mm -1 or 0.026 mm -1 or less.
The pellicle according to claim 1 is arranged on a reticle surface of a photomask,
Placing the photomask at a predetermined position of an exposure apparatus, and housing the pellicle in a gap having a distance of 3 mm or less from the reticle surface;
Irradiate light having a wavelength of 5 nm or more and 30 nm or less to the photomask on which the pellicle is disposed under vacuum,
An exposure method comprising irradiating a base material on which a resist layer is formed with light emitted from the reticle surface of the photomask having the pellicle disposed thereon.