WO2016035633A1 - 赤外光遮蔽組成物、赤外光カットフィルタ、固体撮像素子 - Google Patents
赤外光遮蔽組成物、赤外光カットフィルタ、固体撮像素子 Download PDFInfo
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Classifications
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- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2258—Oxides; Hydroxides of metals of tungsten
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
Definitions
- the present invention relates to an infrared light shielding composition, an infrared light cut filter, and a solid-state imaging device.
- Patent Document 1 discloses a photosensitive resin composition containing a predetermined tungsten oxide and / or composite tungsten oxide as a composition for forming an infrared light cut filter.
- diacetone alcohol, ⁇ -butyrolactone, or the like is used as a solvent contained in the photosensitive resin composition.
- the infrared light cut filter When the infrared light cut filter is arranged in the solid-state image sensor, it may be desired to arrange the infrared light cut filter in a place where there is a fine step. In such a case, it is necessary that the formed infrared light cut filter is applied flatly regardless of a minute step.
- coating intends that the surface of the coating film arrange
- the present inventors use a composition specifically described in Patent Document 1 (a composition in which diacetone alcohol (boiling point: 168 ° C.) is used as a solvent), and a red portion is formed in a portion having a fine step.
- the resulting infrared light cut filter was not sufficiently flat and required further improvement. Further, it was confirmed that when the above composition was stored for a predetermined time, solid matter sometimes adhered to the wall surface of the container in which the composition was placed. The solid content is expected to be generated by the volatilization of the solvent, and if such a solid content is included in the composition, there is a possibility that a defect may occur in the formed infrared light cut filter.
- Patent Document 1 a composition in which ⁇ -butyrolactone (boiling point: 204 ° C.) is used as a solvent
- an annular (ring-shaped) pattern was generated on the surface of the formed infrared light cut filter. If there is such a pattern, an error may be recognized as a defect during the surface inspection, which is not desirable.
- a pattern is generated on the surface of the infrared light cut filter as described above and a defect is caused in the surface inspection is also referred to as poor surface characteristics.
- the present invention is capable of forming an infrared light cut filter that is excellent in flat coating properties and has suppressed generation of patterns on the surface thereof, and has an infrared light shielding composition that is excellent in drying resistance. It is an issue to provide. Moreover, this invention makes it a subject to provide the solid-state image sensor containing the infrared-light cut filter formed using an infrared-light shielding composition, and an infrared-light cut filter.
- the present inventors have found that the above problem can be solved by using a solvent having a predetermined boiling point. That is, it has been found that the above object can be achieved by the following configuration.
- An infrared light shielding composition A metal-containing tungsten oxide particle, a resin binder, a solvent A having a boiling point of 170 ° C. or more and 200 ° C. or less at 1 atmosphere, and a solvent B different from the solvent A, An infrared light shielding composition, wherein the content of the solvent A is 0.1 to 20% by mass relative to the total mass of the infrared light shielding composition.
- the solvent B includes at least one selected from the group consisting of a solvent B1 having a boiling point at 1 atm of 100 ° C. or more and 130 ° C. or less and a solvent B2 having a boiling point at 1 atm of more than 130 ° C. and less than 170 ° C.
- the infrared light shielding composition according to (6) wherein the mass ratio of the solvent B1 to the solvent B2 is 0.010 to 0.200. In addition, the said mass ratio represents the mass of solvent B1 / mass of solvent B2.
- a filter layer comprising at least one selected from the group consisting of: A solid-state imaging device comprising: the infrared light cut filter according to (17) or (18), which is disposed on the light incident side of the filter layer.
- an infrared light cut filter excellent in flat coatability and having a pattern suppressed on the surface thereof it is possible to form an infrared light shielding composition excellent in drying resistance. Can do.
- the solid-state image sensor containing the infrared-light cut filter formed using an infrared-light shielding composition and an infrared-light cut filter can also be provided.
- the infrared light shielding composition infrared light shielding layer forming composition
- the infrared light cut filter and the solid-state imaging device of the present invention
- substitution and non-substitution includes those having no substituent and those having a substituent.
- the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
- “to” is used in the sense of including the numerical values described before and after it as lower and upper limits.
- (meth) acrylate represents acrylate and methacrylate
- (meth) acryl represents acryl and methacryl
- (meth) acryloyl” represents acryloyl and methacryloyl.
- “monomer” and “monomer” are synonymous.
- a monomer is distinguished from an oligomer and a polymer and refers to a compound having a weight average molecular weight of 2,000 or less.
- the polymerizable compound means a compound having a polymerizable functional group, and may be a monomer or a polymer.
- the polymerizable functional group refers to a group that participates in a polymerization reaction.
- the total solid content refers to the total mass of the components excluding the solvent from the total composition of the composition.
- the solid content in the present invention is a solid content at 25 ° C.
- a feature of the present invention is that a solvent having a boiling point of 170 ° C. or higher and 200 ° C. or lower at 1 atmosphere is used.
- the solvent gradually evaporates, but the final stage of drying is achieved by setting the boiling point of the solvent to a predetermined value or more.
- the solvent tends to remain, and as a result, the fluidity of the coated product is easily maintained. Therefore, an infrared light cut filter excellent in surface flatness is easily formed.
- it is a solvent of the said boiling point volatilization will be suppressed from a composition and generation
- the boiling point of the solvent has an influence as a factor that allows a pattern to be formed on the surface of the infrared light cut filter. That is, when the boiling point of the solvent is too high, it is found that the above-mentioned pattern is generated, and it has been found that the above problem can be solved by using a solvent having a predetermined boiling point or less.
- the infrared light shielding composition contains at least a metal-containing tungsten oxide particle, a resin binder, a solvent A having a boiling point of 170 ° C. or more and 200 ° C. or less at 1 atm, and a solvent B different from the solvent A.
- a metal-containing tungsten oxide particle a resin binder
- solvent A having a boiling point of 170 ° C. or more and 200 ° C. or less at 1 atm
- solvent B different from the solvent A.
- the metal-containing tungsten oxide particles are tungsten oxide particles containing metal atoms.
- the tungsten oxide fine particles selectively shield infrared light (light having a wavelength of about 800 to 1200 nm), and thus have an effect as an infrared absorber. Therefore, by including such fine particles in the filter, it is possible to form an infrared light cut filter having a high light blocking property in the infrared region and a high light transmitting property in the visible light region.
- the tungsten oxide fine particles have less absorption even for light having a shorter wavelength than the visible range used for exposure of a high-pressure mercury lamp, KrF, ArF or the like used for image formation. Therefore, as will be described later, such a composition has excellent pattern forming properties, and the shape of the infrared light cut filter can be finely controlled.
- the type of metal atom contained in the tungsten oxide fine particles is not particularly limited, but an alkali metal can be mentioned because it is more excellent in the shielding property of infrared light.
- the tungsten oxide fine particles are preferably represented by the following general formula (composition formula) (I).
- Composition formula) (I) M x W y O z (I) M represents an alkali metal, W represents tungsten, and O represents oxygen. 0.001 ⁇ x / y ⁇ 1.1 2.2 ⁇ z / y ⁇ 3.0
- the alkali metal of M may be one type or two or more types.
- the alkali metal of M is preferably Rb or Cs, and more preferably Cs.
- x / y is 0.001 or more, infrared light can be sufficiently shielded, and when it is 1.1 or less, an impurity phase is more reliably generated in the tungsten oxide fine particles. Can be avoided.
- z / y is 2.2 or more, chemical stability as a material can be further improved, and when it is 3.0 or less, infrared light can be further shielded.
- tungsten oxide fine particles containing the alkali metal represented by the general formula (I) include Cs 0.33 WO 3 , Rb 0.33 WO 3 , K 0.33 WO 3 and the like.
- the average particle diameter of the tungsten oxide fine particles is not particularly limited, but is preferably 800 nm or less, more preferably 400 nm or less, and further preferably 200 nm or less.
- the average particle diameter is in such a range, it becomes difficult for the tungsten oxide fine particles to block visible light by light scattering, and thus the translucency in the visible light region can be further ensured.
- the average particle size is preferably as small as possible, but for reasons such as ease of handling during production, the average particle size of the tungsten oxide fine particles is preferably 1 nm or more.
- an average particle diameter it is the value which measured the particle diameter (diameter) of at least 50 microparticles
- the major axis is measured as the particle diameter.
- the content of the tungsten oxide fine particles in the composition is not particularly limited, but is preferably 1 to 20% by mass, and preferably 3 to 15% by mass with respect to the total mass of the composition in terms of better infrared light shielding properties. Is more preferable. Two or more kinds of tungsten oxide fine particles can be used, and in that case, the total content is preferably in the above range.
- Tungsten oxide fine particles are commercially available, but can be obtained by a method in which a tungsten compound containing an alkali metal is heat-treated in an inert gas atmosphere or a reducing gas atmosphere (see Japanese Patent No. 4096205). Further, for example, a dispersion of fine particles of tungsten oxide containing an alkali metal such as YMF-02A, YMS-01A-2, or YMF-10A-1 manufactured by Sumitomo Metal Mining Co., Ltd. is also available.
- the resin binder can be appropriately selected according to the purpose. For example, or (meth) acrylic resin, urethane resin, polyvinyl alcohol, polyvinyl butyral, polyvinyl formal, polyamide, polyester, polyimide, polybenzoxazole, etc. (Meth) acrylic resins or urethane resins are preferred.
- the resin binder is preferably an alkali-soluble binder (alkali-soluble resin). By containing an alkali-soluble binder, when exposure is performed to form a pattern on the cured film obtained from the composition, the unexposed area can be removed with an alkali developer, and an excellent pattern can be obtained by alkali development. Can be formed.
- the alkali-soluble binder can be appropriately selected according to the purpose.
- the polyimide, polybenzoxazole or precursors thereof the description in the columns 0012 to 0046 of WO2011 / 066798 and the description of the polyimide resin described in paragraphs 0020 to 0054 of JP2013-050593A can be referred to. These contents are incorporated herein.
- the alkali-soluble binder preferably has an acid group.
- the acid group include a carboxylic acid group, a sulfonic acid group, a phosphonic acid group, a phosphoric acid group, and a sulfonamide group.
- a carboxylic acid group is preferable from the viewpoint of obtaining raw materials.
- the type of the alkali-soluble binder having an acid group is not particularly limited, but is preferably a polymer obtained by using a polymerizable compound having an acid group as a monomer component, and from the viewpoint of adjusting the acid value, an acid group. More preferred is a copolymer obtained by copolymerizing a polymerizable compound having an acid group and a polymerizable compound having no acid group.
- the polymerizable compound having an acid group is not particularly limited and may be appropriately selected depending on the intended purpose.
- acrylic acid, methacrylic acid, itaconic acid, crotonic acid, incrotonic acid, maleic acid, p-carboxylstyrene acrylic acid, methacrylic acid, and p-carboxylstyrene are preferable. These may be used individually by 1 type and may use 2 or more types together.
- (meth) acrylic acid ester (an alkyl ester, an aryl ester, an aralkyl ester etc.) can be mentioned suitably.
- the alkyl group in the alkyl ester moiety of the (meth) acrylic acid ester may be linear or branched, and is preferably an alkyl group having 1 to 10 carbon atoms, and 1 to 6 carbon atoms.
- the alkyl group is more preferably.
- the aryl group in the aryl ester moiety of the (meth) acrylate is preferably an aryl group having 6 to 14 carbon atoms, and more preferably an aryl group having 6 to 10 carbon atoms.
- the aralkyl group in the aralkyl ester moiety of the (meth) acrylic acid ester is preferably an aralkyl group having 7 to 20 carbon atoms, and more preferably an aralkyl group having 7 to 12 carbon atoms.
- the molar ratio of the monomer corresponding to the polymerizable compound having an acid group and the monomer corresponding to the polymerizable compound having no acid group is usually 1:99 to 99: 1, and 1:99 to 65:35. It is preferable that the ratio is 5:95 to 30:70.
- the content of acid groups in the alkali-soluble binder is not particularly limited, but is preferably 0.5 meq / g to 4.0 meq / g, and preferably 0.5 meq / g to 3.0 meq / g. More preferred. When the content is 0.5 meq / g or more, alkali developability is sufficiently obtained, and an excellent pattern can be obtained more reliably. When the content is 4.0 meq / g or less, it is possible to reliably avoid the possibility that the strength of the infrared light cut filter on which the pattern is formed is impaired.
- the alkali-soluble binder further has a crosslinkable group, which can improve both the curability of the exposed area and the alkali developability of the unexposed area, and provides a highly durable pattern.
- the crosslinkable group is a group that crosslinks the resin binder in the course of a polymerization reaction that occurs in the coating layer when the coating layer obtained from the composition is exposed or heated.
- a polymeric group For example, an ethylenically unsaturated bond group as a functional group which can be addition-polymerized
- an amino group, an epoxy group, etc. are mentioned.
- the functional group which can become a radical by light irradiation may be sufficient,
- a crosslinkable group a thiol group, a halogen group, etc. are mentioned, for example.
- an ethylenically unsaturated bond group is preferable.
- a styryl group, a (meth) acryloyl group, and an allyl group are preferable. From the viewpoint of achieving both the stability of the crosslinkable group before exposure and the strength of the patterned infrared light cut filter. Is more preferably a (meth) acryloyl group.
- Alkali-soluble binders are, for example, free radicals (polymerization initiation radicals or growth radicals in the polymerization process of a polymerizable compound) added to the crosslinkable group, and addition polymerization is performed directly between polymers or via a polymerization chain of a polymerizable compound.
- a crosslink is formed between the polymer molecules to be cured.
- atoms in the polymer eg, hydrogen atoms on carbon atoms adjacent to the functional bridging group
- the content of the crosslinkable group in the alkali-soluble binder is not particularly limited, but is preferably 0.5 to 3.0 meq / g, more preferably 1.0 to 3.0 meq / g, and 1.5 to 2. 8 meq / g is particularly preferred.
- the content is 0.5 meq / g or more, the curing reaction amount is sufficient and high sensitivity is obtained, and when the content is 3.0 meq / g or less, the drying resistance of the composition can be increased. it can.
- the content (meq / g) can be measured by, for example, iodine value titration.
- the alkali-soluble binder having a crosslinkable group is described in detail in JP-A No. 2003-262958, and the compounds described therein can be used in the present invention.
- alkali-soluble binder is a polymer obtained by polymerizing a monomer component containing a compound represented by the following general formula (ED) (hereinafter sometimes referred to as “ether dimer”). It is done. If this polymer is used, the pattern forming property of the infrared light cut filter is more excellent.
- ED general formula
- R 1 and R 2 each represents a hydrogen atom or a hydrocarbon group having 1 to 25 carbon atoms which may have a substituent.
- Examples of the hydrocarbon group having 1 to 25 carbon atoms which may have a substituent represented by R 1 and R 2 include a linear or branched alkyl group; an aryl group; an alicyclic group; A substituted alkyl group; an alkyl group substituted with an aryl group such as benzyl; and the like.
- a primary or secondary carbon substituent which is difficult to be removed by an acid or heat such as a methyl group, an ethyl group, a cyclohexyl group, or a benzyl group, is particularly preferable in terms of heat resistance.
- ether dimer examples include specific examples of the ether dimer described in paragraph [0565] of JP2012-208494A (corresponding to [0694] of the corresponding US Patent Application Publication No. 2012/235099), These contents are incorporated herein.
- dimethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, diethyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate, dicyclohexyl-2,2′- [Oxybis (methylene)] bis-2-propenoate and dibenzyl-2,2 ′-[oxybis (methylene)] bis-2-propenoate are preferred.
- These ether dimers may be only one kind or two or more kinds.
- the structure derived from the compound represented by the general formula (ED) may be copolymerized with other monomers.
- the constitutional unit derived from the ether dimer is preferably 1 to 50 mol%, more preferably 1 to 20 mol% of the whole.
- Other monomers may be copolymerized with the ether dimer.
- Other monomers that can be copolymerized with the ether dimer include, for example, a monomer for introducing an acid group, a monomer for introducing a radical polymerizable double bond, and an epoxy group. Monomers and other copolymerizable monomers other than these may be mentioned. Only 1 type may be used for such a monomer and it may use 2 or more types.
- Examples of the monomer for introducing an acid group include monomers having a carboxyl group such as (meth) acrylic acid and itaconic acid, monomers having a phenolic hydroxyl group such as N-hydroxyphenylmaleimide, maleic anhydride, and anhydride. And monomers having a carboxylic anhydride group such as itaconic acid.
- (meth) acrylic acid is particularly preferable.
- the monomer for introducing an acid group may be a monomer that can give an acid group after polymerization, such as a monomer having a hydroxyl group such as 2-hydroxyethyl (meth) acrylate, Examples thereof include monomers having an epoxy group such as glycidyl (meth) acrylate, and monomers having an isocyanate group such as 2-isocyanatoethyl (meth) acrylate.
- a monomer capable of imparting an acid group after polymerization it is necessary to perform a treatment for imparting an acid group after polymerization.
- the treatment for adding an acid group after polymerization varies depending on the type of monomer, and examples thereof include the following treatment.
- a treatment of adding an acid anhydride such as succinic anhydride, tetrahydrophthalic anhydride, maleic anhydride or the like can be mentioned.
- a monomer having an epoxy group for example, a compound having an amino group and an acid group such as N-methylaminobenzoic acid and N-methylaminophenol is added, or, for example, (meth) acrylic
- a treatment of adding an acid anhydride such as succinic acid anhydride, tetrahydrophthalic acid anhydride, maleic acid anhydride to the hydroxyl group generated after adding an acid such as an acid can be mentioned.
- a monomer having an isocyanate group for example, a treatment of adding a compound having a hydroxyl group and an acid group such as 2-hydroxybutyric acid can be mentioned.
- the content ratio is not particularly limited, In the monomer component, the content is preferably 5 to 70% by mass, more preferably 10 to 60% by mass.
- Examples of the monomer for introducing a radical polymerizable double bond include monomers having a carboxyl group such as (meth) acrylic acid and itaconic acid; and carboxylic acid anhydride groups such as maleic anhydride and itaconic anhydride. Monomers having an epoxy group such as glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o- (or m-, or p-) vinylbenzyl glycidyl ether, and the like. When using a monomer for introducing a radical polymerizable double bond, it is necessary to perform a treatment for imparting a radical polymerizable double bond after polymerization.
- a monomer for introducing a radical polymerizable double bond it is necessary to perform a treatment for imparting a radical polymerizable double bond after polymerization.
- the treatment for imparting a radical polymerizable double bond after polymerization differs depending on the type of monomer that can impart a radical polymerizable double bond to be used, and examples thereof include the following treatment.
- a monomer having a carboxyl group such as (meth) acrylic acid or itaconic acid
- Treatment of adding a compound having an epoxy group such as vinylbenzyl glycidyl ether and a radically polymerizable double bond.
- a treatment for adding a compound having a hydroxyl group and a radical polymerizable double bond such as 2-hydroxyethyl (meth) acrylate Is mentioned.
- a monomer having an epoxy group such as glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o- (or m-, or p-) vinylbenzyl glycidyl ether is used, (meth)
- the process which adds the compound which has acid groups, such as acrylic acid, and a radically polymerizable double bond is mentioned.
- the content ratio is particularly limited. However, it is preferably 5 to 70% by mass, more preferably 10 to 60% by mass in the total monomer components.
- Examples of the monomer for introducing an epoxy group include glycidyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, o- (or m-, or p-) vinylbenzyl glycidyl ether, and the like. Can be mentioned.
- the content ratio is not particularly limited, In the monomer component, the content is preferably 5 to 70% by mass, more preferably 10 to 60% by mass.
- copolymerizable monomers include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n (meth) acrylate -Butyl, isobutyl (meth) acrylate, t-butyl (meth) acrylate, methyl 2-ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, 2- (meth) acrylic acid 2- (Meth) acrylic acid esters such as hydroxyethyl; aromatic vinyl compounds such as styrene, vinyltoluene and ⁇ -methylstyrene; N-substituted maleimides such as N-phenylmaleimide and N-cyclohexylmaleimide; butadiene, isoprene and the like Butad
- the content ratio is not particularly limited, but is 95% by mass. The following is preferable, and it is more preferable that it is 85 mass% or less.
- the weight average molecular weight of the polymer obtained by polymerizing the monomer component containing the compound represented by the general formula (ED) is not particularly limited, but preferably from the viewpoint of the heat resistance of the coating film formed from the composition. It is 2000 to 200000, more preferably 5000 to 100,000, and still more preferably 5000 to 20000.
- the acid value is preferably 30 to 500 mgKOH / g, more preferably 50 It should be ⁇ 400 mg KOH / g.
- a polymer obtained by polymerizing a monomer component containing a compound represented by the general formula (ED) can be easily obtained by polymerizing at least a monomer essential to an ether dimer. At this time, the cyclization reaction of the ether dimer proceeds simultaneously with the polymerization to form a tetrahydropyran ring structure.
- the polymerization method applied to the synthesis of the polymer obtained by polymerizing the monomer component containing the compound represented by the general formula (ED) is not particularly limited, and various conventionally known polymerization methods can be adopted. However, it is particularly preferable to use a solution polymerization method.
- exemplary compounds of a polymer obtained by polymerizing a monomer component containing a compound represented by the general formula (ED) are shown, but the present invention is not limited to these.
- the composition ratio of the exemplary compounds shown below is mol%.
- Examples of commercially available products include ACRYCURE RD-F8 (acrylic resin) (manufactured by Nippon Shokubai Co., Ltd.).
- the content of the resin binder (especially alkali-soluble binder) in the composition is not particularly limited, but the strength of the infrared light cut filter is more excellent, and the photolithographic properties and residue improvement are based on the total mass of the composition. 5 to 50% by mass is preferable, and 10 to 25% by mass is more preferable.
- the solvent A is a solvent having a boiling point of 170 ° C. or more and 200 ° C. or less at 1 atmosphere.
- the boiling point of the solvent A is 170 ° C. or more and 200 ° C. or less, and at least one of the flat coatability of the infrared light cut filter, the surface characteristics of the infrared light cut filter, and the drying resistance of the composition is more excellent (hereinafter referred to as “a”). It is simply referred to as “the point where the effect of the present invention is more excellent”), and is preferably 180 ° C. or higher and 193 ° C. or lower.
- the boiling point of the solvent A is less than 170 ° C.
- the flat coatability of the infrared light cut filter or the drying resistance of the composition is inferior.
- the boiling point of the solvent A exceeds 200 ° C., a pattern is likely to occur on the surface of the infrared light cut filter.
- the solvent A contains 3 or more oxygen atoms in the molecule, and the number of oxygen atoms is 3 to 5 in that the effect of the present invention is more excellent. Is more preferable, and 3 is more preferable.
- equation (X) or a formula (Y) is mentioned.
- R 1 represents a hydrogen atom or an alkyl group.
- the number of carbon atoms contained in the alkyl group is not particularly limited, but is preferably 1 to 3, and more preferably 1.
- R 2 represents an alkyl group.
- the number of carbon atoms contained in the alkyl group is not particularly limited, but is preferably 1 to 3, and more preferably 1.
- L represents an alkylene group.
- the number of carbon atoms contained in the alkylene group is not particularly limited, but is preferably 3 to 5, and more preferably 3.
- n represents an integer of 2 to 4.
- m represents an integer of 1 to 2.
- the solvent A examples include dipropylene glycol monomethyl ether (boiling point 188 ° C.), cyclohexanol acetate (boiling point 173 ° C.), dipropylene glycol dimethyl ether (boiling point 171 ° C.), ethylene glycol monobutyl ether acetate (boiling point 192 ° C.), diethylene glycol Diethyl ether (boiling point 189 ° C.), diethylene glycol monomethyl ether (boiling point 194 ° C.), propylene glycol diacetate (boiling point 190 ° C.), 3-methoxybutyl acetate (boiling point 171 ° C.), propylene glycol-n-butyl ether (boiling point 170 ° C.), Examples include diethylene glycol ethyl methyl ether (boiling point 176 ° C.) and diethylene glycol isopropyl
- the solvent A contains the solvent represented by the formula (X) or the formula (Y) as a main component.
- the main component intends that the content of the solvent represented by the formula (X) or the formula (Y) is more than 50% by mass with respect to the total mass of the solvent A.
- the solvent A preferably contains a solvent (for example, dipropylene glycol monomethyl ether) mentioned as a specific example of the solvent A as a main component.
- the main component means that the content of the solvent mentioned as a specific example of the solvent A is more than 50% by mass with respect to the total mass of the solvent A.
- the content of the solvent A with respect to the total mass of the infrared light shielding composition is 0.1 to 20% by mass. It is more preferably 7 to 5.0% by mass, and further preferably 2.0 to 4.0% by mass.
- the content of the solvent A is less than 0.1% by mass, the flat coating property of the infrared light cut filter or the drying resistance of the composition is inferior.
- content of the solvent A exceeds 20 mass%, the above-mentioned pattern is easy to generate
- the solvent B is a solvent different from the solvent A. By mixing two solvents different from the solvent A and the solvent B, it is expected that the uniformity of the composition is improved and the generation of the annular pattern is suppressed.
- the solvent B an embodiment in which the boiling point at 1 atmosphere is less than 170 ° C. can be mentioned.
- the solvent B include a solvent B1 having a boiling point at 1 atm of 100 ° C. or more and 130 ° C. or less, or a solvent B2 having a boiling point at 1 atm of more than 130 ° C. and less than 170 ° C. because the effect of the present invention is more excellent.
- the boiling point of the solvent B1 at 1 atm is 100 ° C.
- the boiling point of the solvent B2 at 1 atm is more than 130 ° C. and less than 170 ° C., preferably 140 to 150 ° C.
- the difference between the boiling point of the solvent A and the boiling point of the solvent B2 is preferably 20 ° C. or higher.
- the difference between the boiling point of the solvent B2 and the boiling point of the solvent B1 is preferably 10 to 45 ° C, more preferably 15 to 30 ° C.
- solvent B1 examples include butyl acetate (boiling point 126 ° C.), ethylene glycol monomethyl ether (boiling point 125 ° C.), methyl-n-butyl ketone (boiling point 127 ° C.), tetrahydrofuran (boiling point 126 ° C.) and the like.
- solvent B2 examples include propylene glycol 1-monomethyl ether 2-acetate (boiling point 145 ° C.), ethylene glycol monomethyl ether acetate (boiling point 145 ° C.), ethyl lactate (boiling point 155 ° C.), diethylene glycol dimethyl ether (boiling point 162 ° C.), Examples include 3-methoxybutanol (boiling point 161 ° C.) and propylene glycol-n-propyl ether (boiling point 150 ° C.).
- the content of the solvent B with respect to the total mass of the infrared light shielding composition is not particularly limited, but is preferably 20 to 90% by mass and more preferably 40 to 70% by mass from the viewpoint that the effect of the present invention is more excellent.
- the mass ratio of solvent A and solvent B in the infrared light shielding composition is not particularly limited, but is 0.005 to 0.00 in terms of more excellent effects of the present invention. 500 is preferable, and 0.010 to 0.200 is more preferable.
- the content of the solvent B1 with respect to the total mass of the infrared light shielding composition is not particularly limited, but is 0.1 to 10 masses because the effects of the present invention are more excellent. % Is preferable, and 0.5 to 5.0% by mass is more preferable.
- the solvent B2 is contained in the infrared light shielding composition, the content of the solvent B2 with respect to the total weight of the infrared light shielding composition is not particularly limited. Preferably, 30 to 70% by mass is more preferable.
- the solvent B may use only 1 type and may use 2 or more types together. Especially, it is preferable to use the said solvent B1 and the said solvent B2 together by the point which the effect of this invention is more excellent.
- the mass ratio of solvent B1 to solvent B2 is not particularly limited, but is 0.005 to 0.500 is preferable, and 0.010 to 0.200 is more preferable.
- the composition may contain other components than the tungsten oxide fine particles, the resin binder, the solvent A and the solvent B.
- a polymerizable compound e.g., ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, ethylene glycol dimethacrylate, acrylate, acrylate, acrylate
- any compound may be used as long as it is a compound having a polymerizable group (a group that reacts with at least one of acid, radical, and heat) in the molecule.
- a polyfunctional polymerizable compound having a polymerizable group is preferred.
- Suitable examples of the polymerizable compound having a polymerizable functional group that reacts with at least one of acid, radical, and heat include an unsaturated ester functional group, an unsaturated amide group, a vinyl ether group, and an allyl group.
- Examples include ethylenically unsaturated group-containing compounds having an ethylenically unsaturated group; methylol compounds, bismaleimide compounds, benzocyclobutene compounds, bisallyl nadiimide compounds, and benzoxazine compounds.
- polymerizable compound examples include general radical polymerizable compounds, and compounds widely known as compounds having an ethylenically unsaturated double bond in the industrial field can be used without particular limitation. These have chemical forms such as monomers, prepolymers, that is, dimers, trimers and oligomers, or mixtures thereof and copolymers thereof.
- Examples of monomers and copolymers thereof include unsaturated carboxylic acids (eg, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.), esters, amides, and copolymers thereof Examples thereof include unsaturated carboxylic acid esters, esters of unsaturated carboxylic acids and aliphatic polyhydric alcohol compounds, and amides of unsaturated carboxylic acids and aliphatic polyvalent amine compounds.
- unsaturated carboxylic acids eg, acrylic acid, methacrylic acid, itaconic acid, crotonic acid, isocrotonic acid, maleic acid, etc.
- esters, amides, and copolymers thereof examples thereof include unsaturated carboxylic acid esters, esters of unsaturated carboxylic acids and aliphatic polyhydric alcohol compounds, and amides of unsaturated carboxylic acids and aliphatic polyvalent amine compounds.
- an ester of an unsaturated carboxylic acid and an aliphatic polyhydric alcohol compound can exhibit high hydrophobicity in the exposed area, so that it is easy to form a pattern having a desired shape by alkali development, and a highly durable pattern. Is preferable in that it is obtained.
- a dehydration condensation reaction product of a carboxylic acid ester or amide with a monofunctional or polyfunctional carboxylic acid is also preferably used.
- an addition reaction product of an unsaturated carboxylic acid ester or amide having an electrophilic substituent such as an isocyanate group or an epoxy group with a monofunctional or polyfunctional alcohol, amine or thiol, and a halogen group A substitution reaction product of an unsaturated carboxylic acid ester or amide having a leaving substituent such as a tosyloxy group and a monofunctional or polyfunctional alcohol, amine or thiol is also suitable.
- a methacrylic acid ester is preferable, and tetramethylene glycol dimethacrylate, triethylene glycol dimethacrylate, neopentyl glycol dimethacrylate, trimethylolpropane trimethacrylate, trimethylolethane trimethacrylate, ethylene glycol dimethacrylate, 1 , 3-butanediol dimethacrylate, hexanediol dimethacrylate, pentaerythritol dimethacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol dimethacrylate, dipentaerythritol hexamethacrylate, sorbitol trimethacrylate, sorbitol tetramethacrylate, bis [ p- (3 Methacryloxy-2-hydroxypropoxy)
- itaconic acid ester is also preferable, and ethylene glycol diitaconate, propylene glycol diitaconate, 1,3-butanediol diitaconate, 1,4-butanediol diitaconate, tetramethylene
- examples include glycol diitaconate, pentaerythritol diitaconate, sorbitol tetritaconate, and the like.
- crotonic acid esters include ethylene glycol dicrotonate, tetramethylene glycol dicrotonate, pentaerythritol dicrotonate, and sorbitol tetradicrotonate.
- isocrotonic acid esters include ethylene glycol diisocrotonate, pentaerythritol diisocrotonate, and sorbitol tetraisocrotonate.
- maleic acid esters include ethylene glycol dimaleate, triethylene glycol dimaleate, pentaerythritol dimaleate, and sorbitol tetramaleate.
- the monomer of an ester of an aliphatic polyhydric alcohol compound and an unsaturated carboxylic acid include (meth) acrylic acid ester, ethylene glycol diacrylate, triethylene glycol diacrylate, 1,3-butanediol diacrylate, Tetramethylene glycol diacrylate, propylene glycol diacrylate, neopentyl glycol diacrylate, trimethylolpropane triacrylate, trimethylolpropane tri (acryloyloxypropyl) ether, trimethylolethane triacrylate, hexanediol diacrylate, 1,4-cyclohexane Diol diacrylate, tetraethylene glycol diacrylate, tricyclodecane dimethanol diacrylate, tricyclodecane Methanol dimethacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipenta
- esters examples include, for example, aliphatic alcohol esters described in JP-B-51-47334 and JP-A-57-196231, JP-A-59-5240, JP-A-59- Those having an aromatic skeleton described in Japanese Patent No. 5241 and JP-A-2-226149, those containing an amino group described in JP-A-1-165613, and the like are also preferably used. Furthermore, the ester monomers described above can also be used as a mixture.
- amide monomers of aliphatic polyvalent amine compounds and unsaturated carboxylic acids include methylene bis-acrylamide, methylene bis-methacrylamide, 1,6-hexamethylene bis-acrylamide, 1,6-hexamethylene bis. -Methacrylamide, diethylenetriamine trisacrylamide, xylylene bisacrylamide, xylylene bismethacrylamide and the like.
- examples of other preferable amide monomers include those having a cyclohexylene structure described in JP-B No. 54-21726.
- urethane-based addition polymerizable compounds produced by using an addition reaction of isocyanate and hydroxyl group are also suitable. Specific examples thereof include, for example, one molecule described in JP-B-48-41708.
- a vinyl urethane containing two or more polymerizable vinyl groups in one molecule obtained by adding a vinyl monomer containing a hydroxyl group represented by the following general formula (E) to a polyisocyanate compound having two or more isocyanate groups.
- E general formula
- urethane acrylates such as those described in JP-A-51-37193, JP-B-2-32293, and JP-B-2-16765, JP-B-58-49860, JP-B-56-17654, Urethane compounds having an ethylene oxide skeleton described in JP-B-62-39417 and JP-B-62-39418 are also suitable.
- addition polymerizable compounds having an amino structure or a sulfide structure in the molecule described in JP-A-63-277653, JP-A-63-260909, and JP-A-1-105238 can also be used.
- polyester acrylates examples include polyester acrylates, epoxy resins and (meth) acrylic acid described in JP-A-48-64183, JP-B-49-43191, JP-B-52-30490, and JP-B-52-30490. Mention may be made of polyfunctional acrylates and methacrylates such as reacted epoxy acrylates.
- specific unsaturated compounds described in JP-B-46-43946, JP-B-1-40337, and JP-B-1-40336, and vinyl phosphonic acid compounds described in JP-A-2-25493 are also included. Can do.
- a structure containing a perfluoroalkyl group described in JP-A-61-22048 is preferably used.
- Journal of Japan Adhesion Association vol. 20, no. 7, pages 300 to 308 (1984), which are introduced as photocurable monomers and oligomers can also be used.
- a radically polymerizable compound when added, it is preferable to use a polyfunctional polymerizable compound containing two or more ethylenically unsaturated bonds, from the viewpoint of curing sensitivity, and to contain three or more. Further preferred. Especially, it is preferable to contain 2 or more (meth) acrylic acid ester structures, it is more preferable to contain 3 or more, and it is most preferable to contain 4 or more. Further, from the viewpoint of curing sensitivity and developability of the unexposed area, a compound containing an EO-modified product is preferable, and from the viewpoint of curing sensitivity and exposed area strength, a compound containing a urethane bond is also preferably used. . Furthermore, from the viewpoint of developability during pattern formation, a compound having an acid group is preferably used.
- Preferable examples include relate, tri (acryloyloxyethyl) isocyanurate, pentaerythritol tetraacryl
- bisphenol A diacrylate EO modified product pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, tri (acryloyloxyethyl) isocyanurate, pentaerythritol tetraacrylate EO modified product, Dipentaerythritol hexaacrylate EO modified products such as DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600 (Manufactured by Kyoeisha) and A-DCP (manufactured by Shin-Nakamura Chemical Co., Ltd.) are more preferred.
- DPHA-40H manufactured by Nippon Kayaku Co., Ltd.
- ethylenically unsaturated compounds having an acid group are also suitable.
- examples of commercially available products include TO-756 containing a carboxyl group-containing trifunctional acrylate manufactured by Toagosei Co., Ltd., and a carboxyl group-containing pentafunctional acrylate. Including TO-1382 and the like.
- examples of the highly heat-resistant polymerizable compound include benzocyclobutene (BCB), bisallylnadiimide (BANI), benzoxazine, melamine, and analogs thereof.
- bifunctional compounds include NK ester A-BPE-20 manufactured by Shin-Nakamura Chemical Co., Ltd., and light acrylate DCP-A manufactured by Kyoei Chemical Co., Ltd.
- Examples include Aronix M-305 and M-510 manufactured by Toagosei Co., Ltd.
- four functional groups include KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd. and NK ester A-TMMT manufactured by Shin Nakamura Scientific Co., Ltd.
- KAYARAD DPHA manufactured by Nippon Kayaku Co., Ltd.
- KAYARAD DPCA-20 manufactured by Nippon Kayaku Co., Ltd.
- NK Ester A-DPH-12E manufactured by Shin-Nakamura Kagaku Co., Ltd.
- Aronix TO-756 manufactured by Toagosei Co., Ltd. may be mentioned. Two or more polymerizable compounds can be used.
- the content of the polymerizable compound in the composition is not particularly limited, but is preferably from 1 to 20% by mass, preferably from 3 to 10% by mass, based on the total mass of the composition, from the viewpoint of more excellent strength of the infrared light cut filter. Is more preferable.
- the composition may contain a surfactant from the viewpoint of further improving applicability.
- a surfactant various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant can be used.
- the composition contains at least one of a fluorine-based surfactant and a silicone-based surfactant, the liquid properties (particularly, fluidity) when prepared as a coating solution are further improved. Thereby, the uniformity of coating thickness and the liquid-saving property are further improved.
- the fluorine content of the fluorosurfactant is preferably 3 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 7 to 25% by mass.
- a fluorosurfactant having a fluorine content within the above range is effective in terms of uniformity of coating film thickness and liquid-saving properties, and has good solubility in the composition.
- fluorosurfactant examples include, for example, Megafac F171, F172, F173, F176, F177, F141, F142, F142, F143, F144, R30, F437, F475, F479, F482, F554, F780, F780, F781, F781, F781F (above DIC Corporation), Florad FC430, FC431, FC171 (above, Sumitomo 3M Limited), Surflon S-382 SC-101, SC-103, SC-104, SC-105, SC1068, SC-381, SC-383, S393, KH-40 (above, manufactured by Asahi Glass Co., Ltd.) PF636, PF656, PF6320, PF6520, PF7002 (manufactured by OMNOVA) and the like.
- Nonionic surfactants include polyoxyethylene alkyl ether, polyoxyethylene alkyl allyl ether, polyoxyethylene fatty acid ester, sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester, polyoxyethylene alkylamine, glycerin fatty acid ester, oxyethylene Examples thereof include oxypropylene block copolymers, acetylene glycol surfactants, and acetylene polyoxyethylene oxide. These can be used alone or in combination of two or more.
- Specific product names include Surfinol 61, 82, 104, 104E, 104H, 104A, 104BC, 104DPM, 104PA, 104PG-50, 104S, 420, 440, 465, 485, 504, CT-111, CT- 121, CT-131, CT-136, CT-141, CT-151, CT-171, CT-324, DF-37, DF-58, DF-75, DF-110D, DF-210, GA, OP- 340, PSA-204, PSA-216, PSA-336, SE, SE-F, TG, GA, Dinol 604 (above, Nissin Chemical Co., Ltd.
- nonionic surfactants include nonionic surfactants described in paragraph 0553 of Japanese Patent Application Laid-Open No. 2012-208494 (corresponding to US Patent Application Publication No. 2012/0235099 [0679]). Agents, the contents of which are incorporated herein.
- Specific examples of the cationic surfactant include the cationic surfactant described in paragraph 0554 of JP2012-208494A (corresponding to [0680] of the corresponding US Patent Application Publication No. 2012/0235099). The contents of which are incorporated herein by reference.
- Specific examples of the anionic surfactant include W004, W005, W017 (manufactured by Yusho Co., Ltd.) and the like.
- silicone-based surfactant examples include silicone-based surfactants described in paragraph 0556 of JP2012-208494A (corresponding to [0682] of the corresponding US Patent Application Publication No. 2012/0235099). The contents of which are incorporated herein by reference. Also, “Toray Silicone SF8410”, “Same SF8427”, “Shi8400”, “ST80PA”, “ST83PA”, “ST86PA” manufactured by Toray Dow Corning Co., Ltd. “TSF-400” manufactured by Momentive Performance Materials, Inc.
- the content of the surfactant in the composition is not particularly limited, but is preferably 0.0001 to 0.1000% by mass with respect to the total mass of the composition in terms of more excellent strength of the infrared light cut filter. More preferred is from .0010 to 0.0700 mass%.
- the composition may contain a dispersant.
- a dispersant By including the dispersant, the dispersion stability of the tungsten oxide fine particles in the composition is improved.
- a dispersing agent functions also as a binder mentioned above.
- the dispersant include polymer dispersants [for example, polyamidoamine and its salt, polycarboxylic acid and its salt, high molecular weight unsaturated acid ester, modified polyurethane, modified polyester, modified poly (meth) acrylate, (meth) acrylic type Copolymer, naphthalenesulfonic acid formalin condensate], and surfactants such as polyoxyethylene alkyl phosphate ester, polyoxyethylene alkyl amine, and alkanol amine.
- the polymer dispersant can be further classified into a linear polymer, a terminal-modified polymer, a graft polymer, and a block polymer from the structure thereof.
- terminal-modified polymer having an anchor site to the surface examples include polymers having a phosphate group at the terminal described in JP-A-3-112992, JP-T2003-533455, and the like.
- Examples thereof include a polymer produced by modifying an oligomer or polymer having a hydroxyl group or an amino group at one end and an acid anhydride.
- anchor sites (acid groups, basic groups, partial skeletons of organic dyes, heterocycles, etc.) to the surface of two or more tungsten oxide fine particles were introduced at the polymer ends described in JP-A-2007-277514. Polymers are also preferred because of their excellent dispersion stability.
- graft polymer having an anchor site on the surface examples include poly (lower alkyleneimine) described in JP-A-54-37082, JP-A-8-507960, JP-A-2009-258668, and the like.
- macromonomer used for producing the graft polymer having an anchor site on the surface by radical polymerization a known macromonomer can be used, and macromonomer AA-6 (terminal group) manufactured by Toa Gosei Co., Ltd. can be used. Is a methacryloyl group polymethyl methacrylate), AS-6 (polystyrene whose terminal group is a methacryloyl group), AN-6S (a copolymer of styrene and acrylonitrile whose terminal group is a methacryloyl group), AB-6 (terminal Polybutyl acrylate having a methacryloyl group), Plaxel FM5 manufactured by Daicel Chemical Industries, Ltd.
- polyester-based macromonomers described in No. 9 publication.
- a polyester-based macromonomer that is particularly flexible and excellent in solvophilicity is particularly preferable from the viewpoint of dispersibility and dispersion stability of tungsten oxide fine particles in the composition, and further disclosed in JP-A-2-272009.
- Most preferred are polyester macromonomers represented by the polyester macromonomer described.
- block type polymer having an anchor site to the surface block type polymers described in JP-A No. 2003-49110, JP-A No. 2009-52010 and the like are preferable.
- dispersant for example, a known dispersant or surfactant can be appropriately selected and used. Specific examples include “Disperbyk-101 (polyamidoamine phosphate), 107 (carboxylic acid ester), 110 (copolymer containing an acid group), 130 (polyamide), 161, 162, 163 manufactured by BYK Chemie.
- Nikkor T106 polyoxyethylene sorbitan monooleate
- MYS-IEX polyoxyethylene monostearate
- Nonionic surfactants such as polyoxyethylene nonylphenyl ether, polyethylene glycol dilaurate, polyethylene glycol distearate, sorbitan fatty acid ester, anionic surfactants such as “W004, W005, W017”, manufactured by Morishita Sangyo Co., Ltd.
- dispersants may be used alone or in combination of two or more.
- the dispersant may be used in combination with an alkali-soluble resin together with a terminal-modified polymer, a graft polymer, or a block polymer having an anchor site.
- Alkali-soluble resins include (meth) acrylic acid copolymer, itaconic acid copolymer, crotonic acid copolymer, maleic acid copolymer, partially esterified maleic acid copolymer, etc., and carboxylic acid in the side chain.
- the acid cellulose derivative include a resin having a hydroxyl group modified with an acid anhydride, and a (meth) acrylic acid copolymer is particularly preferable.
- N-substituted maleimide monomer copolymers described in JP-A-10-300922, an alkali-soluble resin containing a polymerizable group described in JP-A-7-319161, and 0173 in JP2012-122045 are also preferable.
- a dispersant In the case of using a dispersant, first, after preparing a dispersion composition with tungsten oxide fine particles (and other infrared light shielding agents if necessary), a dispersant, and an appropriate solvent, It is preferable to mix
- the composition may or may not contain a dispersant, but when it is included, it is preferably 10 to 70% by mass, more preferably 30 to 60% by mass, based on the total mass of the tungsten oxide fine particles.
- the composition may contain a polymerization initiator.
- a polymerization initiator When a polymerization initiator is included, polymerization of a polymerizable compound or the like proceeds more efficiently, and an infrared light cut filter having excellent film strength can be obtained.
- the polymerization initiator is not particularly limited as long as it has the ability to initiate polymerization of a polymerizable compound by either or both of light and heat, and can be appropriately selected according to the purpose. It is preferable that When polymerization is initiated by light, those having photosensitivity to visible light from the ultraviolet region are preferred. In addition, when the polymerization is initiated by heat, an initiator that decomposes at 150 ° C. to 250 ° C. is preferable.
- the polymerization initiator is preferably a compound having at least an aromatic group.
- oxime compounds hydroxyacetophenone compounds, aminoacetophenone compounds, acylphosphine compounds, ⁇ -aminoketone compounds, trihalomethyl compounds, hexaarylbiimidazole compounds, and thiol compounds are preferred.
- an oxime compound or an ⁇ -aminoketone compound is more preferable, and an oxime compound is more preferable.
- the hydroxyacetophenone compound IRGACURE-184, DAROCUR-1173, IRGACURE-500, IRGACURE-2959, IRGACURE-127 (trade names: all manufactured by BASF) can be used.
- aminoacetophenone compounds commercially available products IRGACURE-907, IRGACURE-369, and IRGACURE-379 (trade names: all manufactured by BASF) can be used.
- acylphosphine compound commercially available products such as IRGACURE-819 and DAROCUR-TPO (trade names: both manufactured by BASF) can be used.
- oxime compounds include IRGACURE OXE 01 (1.2-octanedione, 1- [4- (phenylthio)-, 2- (o-benzoyloxime)]), IRGACURE OXE 02 (Ethanone, 1) manufactured by BASF Preferred examples include-[9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl]-, 1- (o-acetyloxime)) and the like.
- Examples of the oxime compound include those represented by the formula (OX-1), (OX-2) or (0) of paragraph 0513 of JP2012-208494A (corresponding to [0632] of the corresponding US Patent Application Publication No. 2012/235099). The description of the compound represented by OX-3) can be referred to, and the contents thereof are incorporated herein.
- oxime compound examples include polymerization initiators described in paragraphs [0092] to [0096] of JP2012-113104A, the contents of which are incorporated herein.
- commercially available oxime compounds are TRONLY TR-PBG-304, TRONLY TR-PBG-309, TRONLY TR-PBG-305 (manufactured by CHANGZHOU TRONLY NEW ELECTRONIC MATERIALS CO., LTD) ) And the like.
- the content of the polymerization initiator in the composition is not particularly limited, but is preferably 0.1 to 10% by mass, preferably 0.5 to 5.0% by mass with respect to the total mass of the composition in terms of excellent drying resistance. % Is more preferable.
- the composition may contain a polymerization inhibitor.
- a polymerization inhibitor When the polymerization inhibitor is contained, unnecessary thermal polymerization of the polymerizable compound can be prevented during the production or storage of the composition.
- known compounds can be used. For example, hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogallol, t-butylcatechol, benzoquinone, 4,4′-thiobis (3-methyl -6-t-butylphenol), 2,2'-methylenebis (4-methyl-6-t-butylphenol), N-nitrosophenylhydroxyamine primary cerium salt and the like.
- the content of the polymerization inhibitor in the composition is not particularly limited, but is preferably 0.05 to 0.0001% by mass and more preferably 0.01 to 0.0005% by mass with respect to the total solid content.
- the composition may contain an ultraviolet absorber.
- the ultraviolet absorber refers to one that does not have a function of initiating polymerization of a polymerizable compound by light or heat (that is, does not correspond to a polymerization initiator).
- “has no function of initiating polymerization of the polymerizable compound” means that the ultraviolet absorber substantially initiates polymerization of the polymerizable compound even when it receives light or heat energy. This means that no active species are generated.
- the ultraviolet absorber has no photosensitivity to ultraviolet rays or visible light (more specifically, light having a wavelength of 300 to 450 nm), and heat (more specifically, For example, those having no heat sensitivity to heat of 150 ° C. to 250 ° C. are preferable.
- photosensitivity and thermosensitivity mean that an intended function is exhibited with a change in chemical structure by ultraviolet rays, visible light, or heat.
- the ultraviolet absorber not only does not have the function of initiating polymerization of the polymerizable compound but also does not have the characteristics of a sensitizer described later.
- the characteristic of the sensitizer refers to a characteristic that initiates polymerization by passing energy obtained by absorbing light to another substance (such as a polymerization initiator).
- the ultraviolet absorber preferably has a maximum absorption wavelength between 300 nm and 430 nm, and particularly preferably has a maximum absorption wavelength between 330 nm and 420 nm.
- the ultraviolet absorber is more preferably in at least one of (I) a wavelength range of 340 nm to 380 nm, (II) a wavelength range of 380 nm to 420 nm, and (III) a wavelength range of 420 nm to 450 nm. It is preferable to have a maximum absorption wavelength.
- the type of the ultraviolet absorber is not particularly limited, and for example, an ultraviolet absorber such as salicylate, benzophenone, benzotriazole, substituted acrylonitrile, or triazine can be preferably used.
- an ultraviolet absorber such as salicylate, benzophenone, benzotriazole, substituted acrylonitrile, or triazine
- salicylate-based UV absorbers include phenyl salicylate, p-octylphenyl salicylate, pt-butylphenyl salicylate, and the like.
- benzophenone-based UV absorbers examples include 2,2′-dihydroxy-4- Methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2 ', 4,4'-tetrahydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2,4-dihydroxybenzophenone, 2- And hydroxy-4-octoxybenzophenone.
- benzotriazole ultraviolet absorbers examples include 2- (2′-hydroxy-3 ′, 5′-di-tert-butylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3′- tert-butyl-5′-methylphenyl) -5-chlorobenzotriazole, 2- (2′-hydroxy-3′-tert-amyl-5′-isobutylphenyl) -5-chlorobenzotriazole, 2- (2 ′ -Hydroxy-3'-isobutyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3'-isobutyl-5'-propylphenyl) -5-chlorobenzotriazole, 2- ( 2'-hydroxy-3 ', 5'-di-tert-butylphenyl) benzotriazole, 2- (2'-hydroxy-5'-methylphenyl) benzotriazo Le, 2- [2'-hydroxy-5 '
- substituted acrylonitrile ultraviolet absorbers examples include ethyl 2-cyano-3,3-diphenyl acrylate, 2-ethylhexyl 2-cyano-3,3-diphenyl acrylate, and the like.
- triazine-based ultraviolet absorbers examples include 2- [4-[(2-hydroxy-3-dodecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl).
- diethylamino-phenylsulfonyl-pentadienoate UV absorber (manufactured by Fuji Film Fine Chemical Co., Ltd., trade name: DPO) is also preferably used.
- DPO diethylamino-phenylsulfonyl-pentadienoate UV absorber
- compounds represented by any one of the general formulas (1) to (8) after paragraph 0103 of JP 2012-32556 A (corresponding to page 30 of the specification of WO 2012/015076) and specific examples thereof (1-1) to (8-3) can be referred to, and the contents thereof are incorporated in the present specification.
- the content of the ultraviolet absorber in the composition is not particularly limited, but is preferably 0.01 to 10.0% by mass with respect to the total mass of the composition in terms of excellent drying resistance and residue control. More preferably, the content is from 05 to 1.50% by mass.
- the composition may contain a sensitizer.
- a sensitizer what sensitizes with the electron transfer mechanism or an energy transfer mechanism with respect to the photoinitiator mentioned above is preferable.
- the type of the sensitizer used is not particularly limited, and examples thereof include compounds exemplified in paragraph [0202] of JP2012-122045.
- the content of the sensitizer in the composition is not particularly limited, but is preferably 0.01 to 10.0% by mass, more preferably 0.10 to 4.00% by mass with respect to the total solid content in the composition. preferable.
- the composition may contain a crosslinking agent. Inclusion of the crosslinking agent can be expected to improve the strength of the infrared light cut filter.
- the crosslinking agent is preferably a compound having a crosslinkable group, and more preferably a compound having two or more crosslinkable groups. Specific examples of the crosslinkable group include oxetane groups, cyanate groups, and the same groups as those described above for the crosslinkable groups that the alkali-soluble binder may have. , An oxetane group or a cyanate group is preferred. That is, the crosslinking agent is particularly preferably an epoxy compound, an oxetane compound or a cyanate compound.
- the type of the crosslinking agent to be used is not particularly limited, and examples thereof include compounds exemplified in paragraphs [0204] to [0209] of JP2012-122045.
- the composition may contain a curing accelerator.
- the type of the curing accelerator used is not particularly limited, and examples thereof include compounds exemplified in paragraph [0211] of JP2012-122045.
- the composition may contain a filler.
- a filler By including a filler in the composition, an infrared light cut filter having high scratch resistance and high wear resistance can be obtained.
- spherical silica surface-treated with a silane coupling agent is preferably exemplified.
- the type of filler used is not particularly limited, and examples thereof include fillers exemplified in paragraphs [0212] to [0222] of JP2012-122045.
- the composition may contain an elastomer.
- an elastomer By including an elastomer in the composition, the adhesiveness of the infrared light cut filter is improved, and the heat resistance, thermal shock resistance, flexibility, and toughness can be further improved.
- the type of elastomer used is not particularly limited, and examples thereof include elastomers exemplified in paragraphs [0225] to [0235] of JP2012-122045.
- thermosetting accelerators for example, thermosetting accelerators, plasticizers, colorants (color pigments or dyes), and further adhesion promoters to the substrate surface and other auxiliaries (for example, Conductive particles, fillers, antifoaming agents, flame retardants, leveling agents, peeling accelerators, antioxidants, perfumes, surface tension modifiers, chain transfer agents, etc.) may be used.
- Examples of the usable pigment described above include at least one organic pigment selected from the group consisting of a red organic pigment, a yellow organic pigment, a purple organic pigment, and an orange organic pigment. By using the pigment together, the color is improved.
- organic pigments include diketopyrrolopyrrole pigments, perylene pigments, benzimidazolone pigments, perinone pigments, naphthol AS pigments, anthraquinone pigments, pyrazolone pigments, or isoindolinone pigments. It is done. More specifically, pigments described in JP-A-2011-057964, paragraphs 0031 to 0033 (paragraphs 0045 to 0051 in the corresponding US Patent Application Publication No. 2012/0104529) can be mentioned, and their contents Is incorporated herein.
- a near-infrared absorbing dye may be used in the composition.
- a first wavelength region a dye having a maximum absorption wavelength in 800 to 869 nm
- a second wavelength region a dye having a maximum absorption wavelength in 870 to 909 nm
- a third wavelength region A dye having a maximum absorption wavelength in the range of 910 to 949 nm or a dye having a maximum absorption wavelength in the fourth wavelength region: 950 to 1000 nm is preferable.
- Examples of the phthalocyanine-based dye having a maximum absorption wavelength in the first wavelength region are “EEX COLOR IR-14” ( ⁇ max: 819 nm), “EEX COLOR IR-10A” ( ⁇ max) under the trade names of Nippon Shokubai Co., Ltd. : 849 nm). Note that ⁇ max shown in parentheses after the product name is the maximum absorption wavelength.
- Examples of the phthalocyanine dye having a maximum absorption wavelength in the second wavelength region include “e-ex color IR-28” ( ⁇ max: 880 nm), “e-ex color IR-12” ( ⁇ max: 883 nm), and “TX-EX-”. 820 ”( ⁇ max: 891 nm) and the like.
- Examples of the phthalocyanine dye having a maximum absorption wavelength in the third wavelength region include “TX-EX-906” ( ⁇ max: 922 nm).
- Examples of the phthalocyanine dye having a maximum absorption wavelength in the fourth wavelength region include “e-ex color IR-915” ( ⁇ max: 963 nm), “e-ex color IR-910” ( ⁇ max: 968 nm), and “e-ex color IR. -906 "( ⁇ max: 968 nm).
- Excat IR-28, Excolor 815K (phthalocyanine pigment) of Nippon Shokubai is preferably mentioned.
- the composition of the present invention can be prepared by mixing the above components.
- an infrared light shielding layer can be formed, and for example, it can be used for an infrared light cut filter.
- it can also be used for an infrared light cut filter on the light receiving side of the solid-state image sensor, an infrared light cut filter on the back surface side (the side opposite to the light receiving side) of the solid-state image sensor, and the like.
- the composition of the present invention may be used by directly coating on a color filter or a planarizing layer to form a coating film. Since the composition of this invention can be supplied in the state which can be apply
- the infrared light cut filter of the present invention is formed using the above-described composition of the present invention.
- the film thickness of the infrared light cut filter can be appropriately selected according to the purpose, but is preferably 20 ⁇ m or less, more preferably 10 ⁇ m or less, and even more preferably 5 ⁇ m or less.
- the lower limit of the film thickness is, for example, preferably 0.1 ⁇ m or more, more preferably 0.2 ⁇ m or more, and more preferably 0.3 ⁇ m or more in order to maintain the light shielding ability.
- the film thickness of an infrared-light cut filter can be made thin.
- the maximum transmittance at a wavelength of 400 to 1300 nm of the infrared light cut filter is not particularly limited, but is preferably 60% or more, and more preferably 65% or more.
- the maximum transmittance of the infrared light cut filter at a wavelength of 900 to 1300 nm is not particularly limited, but is preferably 20% or less, more preferably 10% or less, and most preferably 5% or less.
- the infrared light cut filter is a lens having a function of absorbing / cutting infrared light (camera lenses such as digital cameras, mobile phones, and in-vehicle cameras, optical lenses such as f- ⁇ lenses and pickup lenses) and semiconductor light receiving elements.
- a step of forming a film by applying the composition of the present invention to a support preferably a dropping method, coating or printing
- a step of drying the film can be manufactured.
- a film thickness, laminated structure, etc. it can select suitably according to the objective.
- a step of forming a pattern may be performed.
- the step of forming a film can be performed, for example, by using the composition of the present invention on a support by a dropping method (drop cast), a spin coater, a slit spin coater, a slit coater, screen printing, applicator application, or the like.
- the support to which the composition of the present invention is applied may be a transparent substrate made of glass or the like.
- each base material in a solid-state image sensor may be sufficient.
- substrate provided in the light-receiving side of the solid-state image sensor may be sufficient. Further, it may be a layer such as a flattening layer provided on the light receiving side of the solid-state imaging device.
- the procedure for producing the patterned infrared light cut filter is not particularly limited.
- the step of applying the composition of the present invention on a support to form a film-like composition layer, and the patterning of the composition layer For example, a method including a step of exposing to a shape and a step of developing and removing an unexposed portion to form a pattern.
- a pattern formation method a pattern may be formed by a photolithography method, or a pattern may be formed by a dry etching method.
- other steps may be included.
- the surface treatment process of a base material, a pre-heating process (pre-baking process), a hardening process, a post-heating process (post-baking process), etc. are mentioned.
- the heating temperature in the preheating step and the postheating step is usually 80 ° C. to 200 ° C., and preferably 90 ° C. to 150 ° C.
- the heating time in the preheating step and the postheating step is usually 30 seconds to 240 seconds when a hot plate is used, and preferably 60 seconds to 180 seconds.
- the curing treatment step is a step of performing a curing treatment on the formed film as necessary. By performing this treatment, the mechanical strength of the infrared light cut filter is improved.
- exposure is used to include not only light of various wavelengths but also irradiation of radiation such as electron beams and X-rays.
- the exposure is preferably performed by irradiation of radiation, and as the radiation that can be used for the exposure, ultraviolet rays such as electron beams, KrF, ArF, g rays, h rays, i rays and visible light are particularly preferably used.
- ultraviolet rays such as electron beams, KrF, ArF, g rays, h rays, i rays and visible light are particularly preferably used.
- Examples of the exposure method include stepper exposure and exposure with a high-pressure mercury lamp. Exposure is preferably 5 ⁇ 3000mJ / cm 2, more preferably 10 ⁇ 2000mJ / cm 2, particularly preferably 50 ⁇ 1000mJ / cm 2.
- Examples of the exposure processing method include a method of exposing the entire surface of the formed film.
- the composition of the present invention contains a polymerizable compound, curing of the polymerization component in the film is promoted by exposure, and the curing of the film further proceeds to improve mechanical strength and durability.
- an apparatus which performs the said exposure Although it can select suitably according to the objective, For example, UV exposure machines, such as an ultrahigh pressure mercury lamp, are mentioned suitably.
- a method of the whole surface heat treatment a method of heating the entire surface of the formed film can be given. By heating the entire surface, the film strength of the pattern is increased.
- the heating temperature in the entire surface heating is preferably 120 ° C.
- the heating time in the entire surface heating is preferably 3 minutes to 180 minutes, more preferably 5 minutes to 120 minutes.
- an apparatus which performs whole surface heating According to the objective, it can select suitably from well-known apparatuses, For example, a dry oven, a hot plate, IR (infrared) heater etc. are mentioned.
- the infrared light cut filter can be suitably applied to a solid-state image sensor.
- reference numeral 110 denotes a solid-state imaging device substrate.
- An infrared light cut filter 111 and a color filter 112 are disposed on the solid-state image sensor substrate 110.
- a region 114 is provided between the infrared light transmission filter (color filter that transmits infrared light) 113 and the solid-state imaging device substrate 110.
- a resin layer (for example, a transparent resin layer) that can transmit light having a wavelength that has passed through the infrared light transmission filter 113 is disposed.
- An infrared light transmission filter 113 may be formed in the region 114. That is, the infrared light transmission filter 113 may be formed on the solid-state image sensor substrate 110.
- a micro lens 115 is disposed on the incident light h ⁇ side of the color filter 112 and the infrared light transmission filter 113.
- a planarization layer 116 is formed so as to cover the microlens 115.
- the film thickness of the color filter 112 and the film thickness of the infrared light transmission filter 113 are the same, but the film thickness of both may be different.
- FIG. 1 the film thickness of the color filter 112 and the film thickness of the infrared light transmission filter 113 are the same, but the film thickness of both may be different.
- the color filter 112 is provided on the incident light h ⁇ side with respect to the infrared light cut filter 111, but the order of the infrared light cut filter 111 and the color filter 112 is changed to reduce the infrared light cut.
- the filter 111 may be provided closer to the incident light h ⁇ than the color filter 112.
- Another layer may be formed between the infrared light cut filter 111 and the color filter 112.
- the color filter 112 is selected from the group consisting of a color filter that transmits light in the red wavelength region, a color filter that transmits light in the green wavelength region, and a color filter that transmits light in the blue wavelength region. Preferably at least one is included.
- the color filter 112 may contain an infrared light absorbing material, and the color filter 112 may have a function as an infrared light cut filter.
- the solid-state imaging device of the present invention has an infrared light cut filter therein, an infrared light cut filter as a member of the camera module is unnecessary, the number of parts of the camera module can be reduced, and the camera module can be downsized. Can be achieved.
- the color filter 112 is not particularly limited, and a conventionally known color filter for forming a pixel can be used.
- a conventionally known color filter for forming a pixel can be used.
- the description in paragraphs 0214 to 0263 in JP-A-2014-043556 can be referred to.
- the contents are incorporated herein.
- the characteristics of the infrared light transmission filter 113 are selected according to the emission wavelength of the light source.
- a color filter that transmits light in the red wavelength region red color filter
- a color filter that transmits light in the green wavelength region green color filter
- a blue wavelength region A filter layer including at least one selected from the group consisting of a color filter that transmits light (blue color filter) and a color filter that transmits infrared light (infrared light transmission filter); It is preferable to include an infrared light cut filter disposed on the light incident side.
- examples thereof include a solid-state imaging device including a filter.
- the infrared light cut filter only needs to be disposed on the light incident side of the solid-state image sensor substrate 110.
- an infrared light cut filter may be disposed on a red color filter, a green color filter, and a blue color filter
- an infrared light cut filter may be disposed on the infrared light transmission filter.
- a planarization layer may be disposed between the filter layer and the infrared light cut filter.
- FIG. 2 is a functional block diagram of the imaging apparatus.
- the imaging apparatus emits infrared light, the lens optical system 1, the solid-state imaging device 10, the signal processing unit 20, the signal switching unit 30, the control unit 40, the signal storage unit 50, the light emission control unit 60, and the like.
- Infrared LED 70 of the light emitting element and image output units 80 and 81 are provided.
- the solid-state image sensor 10 the above-described solid-state image sensor 100 can be used.
- the configuration other than the solid-state imaging device 10 and the lens optical system 1 can be formed entirely or partially on the same semiconductor substrate.
- paragraphs 0032 to 0036 of JP 2011-233983 A can be referred to, and the contents thereof are incorporated in the present specification.
- the imaging device include a motion sensor, a proximity sensor, and a gesture sensor.
- Resin binder Acrylure RD-F8 made by Nippon Shokubai
- Resin B FUJIFILM Fine Chemicals B-1050K (Formula below)
- Resin C Acrybase FF-426 manufactured by Fujikura Chemical Co., Ltd. (formula below)
- Resin D DB-1305 manufactured by FUJIFILM Fine Chemicals (formula below)
- Polyamic acid 1 Polyamic acid polyamic acid 2 described in Example 1 (paragraph 0113) of JP 2013-50593 A: Polyhydroxy acid polyhydroxy described in Example 2 (paragraph 0118) of JP 2013-50593 A Amide: polyhydroxyamide obtained by the method described in paragraph 0106 of JP-A-2007-199606
- UV absorber ultraviolet absorber (ultraviolet absorber)
- UV absorber A the following compounds DPO: DPO (manufactured by FUJIFILM Fine Chemical)
- the tungsten oxide fine particles in Table 1 are supplied using YMS-01A-2 (manufactured by Sumitomo Metal Mining Co., Ltd.), and YMS-01A-2 contains a predetermined amount of dispersant.
- YMS-01A-2 manufactured by Sumitomo Metal Mining Co., Ltd.
- YMS-01A-2 contains a predetermined amount of dispersant.
- Excolor IR-28 a Japanese catalyst, was used in combination with Excolor 815K (phthalocyanine pigment) together with tungsten oxide fine particles in Example 35.
- a silicon substrate is prepared in which four concave portions (depth: 2.2 ⁇ m) having a square shape (length of one side: 5 ⁇ m) are arranged in one direction at intervals of 5 ⁇ m.
- Each of the compositions of Examples and Comparative Examples was applied, dried at 100 ° C. for 2 minutes, and then irradiated with light using an exposure apparatus UX3100-SR (USHIO INC.) (Exposure amount: 500 mJ / second). cm 2 ) to form an infrared light shielding layer (thickness: 2.7 ⁇ m).
- the surface of the infrared light shielding layer disposed on the concave portion of the silicon substrate is measured with an atomic force microscope (AFM) (D3100, manufactured by Vecco, Japan) along one direction in which the concave portions of the silicon substrate are arranged.
- AFM atomic force microscope
- the maximum height difference (nm) was determined and evaluated according to the following criteria. In practice, “A” or “B” is desirable. “A”: When the maximum height difference is within 200 nm “B”: When the maximum height difference is more than 200 nm and less than 400 nm “C”: When the maximum height difference is more than 400 nm
- “A” indicates that the liquid surface does not change
- “B” indicates that a solid matter is slightly visible in the periphery of the liquid surface but no film is formed
- “C” indicates that a film is formed on the top of the liquid by drying. It was. In practice, “A” or “B” is desirable.
- the infrared light cut filter formed using the composition of the above example had a maximum transmittance of 60% or more at 400 nm to 1300 nm and a maximum transmittance of 20% or less at 900 to 1300 nm.
- the compositions of the examples and comparative examples were applied on a glass substrate, dried at 100 ° C. for 2 minutes, and then exposed to an exposure apparatus UX3100-SR ( It was produced by performing light irradiation (exposure amount: 1000 mJ / cm 2 ) using USHIO INC.
- the infrared light shielding composition of the present invention when used, the flat coating property, the surface property, and the drying resistance were excellent. From comparison of Examples 1 to 6, it was confirmed that when the boiling point of the solvent A was 180 ° C. or higher and 193 ° C. or lower, a more excellent effect was obtained. Further, from the comparison of Examples 12 to 14, when the surfactant content is 0.001 to 0.070 mass% with respect to the total mass of the infrared light shielding composition, a more excellent effect is obtained. It was confirmed that Further, from comparison between Example 17 and Example 18, it was confirmed that when the boiling point of the solvent B1 was 120 to 130 ° C., a more excellent effect was obtained.
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Abstract
Description
例えば、特許文献1においては、赤外光カットフィルタを形成するための組成物として、所定のタングステン酸化物および/または複合タングステン酸化物を含む感光性樹脂組成物が開示されている。特に、特許文献1の実施例欄においては、感光性樹脂組成物中に含まれる溶剤として、ジアセトンアルコールやγ-ブチロラクトンなどが使用されている。
本発明者らは、特許文献1に具体的に記載されている組成物(溶剤としてジアセトンアルコール(沸点:168℃)が使用される組成物)を用いて、微細な段差がある部分に赤外光カットフィルタの製造を試みたところ、得られた赤外光カットフィルタの平坦塗布性は十分でなく、さらなる改良が必要であった。
また、上記組成物を所定時間保管すると、組成物を入れる容器の壁面などに固形物の付着が生じる場合があることが確認された。固形分は溶剤の揮発によって生じていると予想され、このような固形分が組成物中に含まれると、形成される赤外光カットフィルタ内において欠陥が生じるおそれがある。
また、本発明は、赤外光遮蔽組成物を用いて形成される赤外光カットフィルタ、および、赤外光カットフィルタを含む固体撮像素子も提供することを課題とする。
すなわち、以下の構成により上記目的を達成することができることを見出した。
金属含有タングステン酸化物粒子、樹脂バインダー、1気圧における沸点が170℃以上200℃以下の溶剤A、および、溶剤Aとは異なる溶剤B、を少なくとも含み、
溶剤Aの含有量が、赤外光遮蔽組成物全質量に対して、0.1~20質量%である、赤外光遮蔽組成物。
(2) 溶剤Aの沸点が180℃以上193℃以下である、(1)に記載の赤外光遮蔽組成物。
(3) 溶剤Aが分子内に3つ以上の酸素原子を含む、(1)または(2)に記載の赤外光遮蔽組成物。
(4) 溶剤Aがジプロピレングリコールモノメチルエーテルを含む、(1)~(3)のいずれかに記載の赤外光遮蔽組成物。
(5) 溶剤Bが、1気圧における沸点が100℃以上130℃以下の溶剤B1、および、1気圧における沸点が130℃超170℃未満の溶剤B2からなる群から選択される少なくとも1種を含む、(1)~(4)のいずれかに記載の赤外光遮蔽組成物。
(6) 溶剤Bが、溶剤B1および溶剤B2の両方を含む、(5)に記載の赤外光遮蔽組成物。
(7) 溶剤B1と溶剤B2との質量比が0.010~0.200である、(6)に記載の赤外光遮蔽組成物。なお、上記質量比は、溶剤B1の質量/溶剤B2の質量を表す。
(8) 溶剤B1の1気圧における沸点が120℃以上130℃以下である、(5)~(7)のいずれかに記載の赤外光遮蔽組成物。
(9) 溶剤B1が、酢酸ブチルを含む、(7)または(8)に記載の赤外光遮蔽組成物。
(10) 溶剤Aの含有量が、赤外光遮蔽組成物全質量に対して、0.7~5.0質量%である、(1)~(9)のいずれかに記載の赤外光遮蔽組成物。
(11) さらに、重合性化合物、重合開始剤、界面活性剤、および、紫外線吸収剤からなる群から選択される少なくとも1つを含む、(1)~(10)のいずれかに記載の赤外光遮蔽組成物。
(12) 重合開始剤が、オキシム化合物またはα-アミノケトン化合物を含む、(11)に記載の赤外光遮蔽組成物。
(13) 樹脂バインダーが、アルカリ可溶性バインダーを含む、(1)~(12)のいずれかに記載の赤外光遮蔽組成物。
(14) アルカリ可溶性バインダーが酸基を有する、(13)に記載の赤外光遮蔽組成物。
(15) アルカリ可溶性バインダーが重合性基を有する、(13)または(14)に記載の赤外光遮蔽組成物。
(16) さらに、界面活性剤を含み、界面活性剤の含有量が、赤外光遮蔽組成物全質量に対して、0.001~0.070質量%である、(11)に記載の赤外光遮蔽組成物。
(17) (1)~(16)のいずれかに記載の赤外光遮蔽組成物を用いて形成された赤外光カットフィルタ。
(18) 400nm~1300nmにおける最大透過率が60%以上であり、900~1300nmにおける最大透過率が20%以下である、(17)に記載の赤外光カットフィルタ。
(19) (17)または(18)に記載の赤外光カットフィルタを有する固体撮像素子。
(20) 赤色の波長領域の光を透過するカラーフィルタ、緑色の波長領域の光を透過するカラーフィルタ、青色の波長領域の光を透過するカラーフィルタ、および、赤外光を透過するカラーフィルタからなる群から選択される少なくとも一つを含むフィルタ層と、
フィルタ層よりも光入射側に配置される(17)または(18)に記載の赤外光カットフィルタと、を有する固体撮像素子。
また、本発明によれば、赤外光遮蔽組成物を用いて形成される赤外光カットフィルタ、および、赤外光カットフィルタを含む固体撮像素子も提供することができる。
本明細書に於ける基(原子団)の表記に於いて、置換および無置換を記していない表記は、置換基を有さないものと共に置換基を有するものをも包含するものである。例えば、「アルキル基」とは、置換基を有さないアルキル基(無置換アルキル基)のみならず、置換基を有するアルキル基(置換アルキル基)をも包含するものである。本明細書において「~」とはその前後に記載される数値を下限値および上限値として含む意味で使用される。
本明細書中において、“(メタ)アクリレート”はアクリレートおよびメタクリレートを表し、“(メタ)アクリル”はアクリルおよびメタクリルを表し、“(メタ)アクリロイル”はアクリロイルおよびメタクリロイルを表す。
また、本明細書中において、“単量体”と“モノマー”とは同義である。単量体は、オリゴマーおよびポリマーと区別され、重量平均分子量が2,000以下の化合物をいう。
本明細書中において、重合性化合物とは、重合性官能基を有する化合物のことをいい、単量体であっても、ポリマーであってもよい。重合性官能基とは、重合反応に関与する基をいう。
本明細書において、全固形分とは、組成物の全組成から溶剤を除いた成分の総質量をいう。本発明における固形分は、25℃における固形分である。
以下、赤外光遮蔽組成物(以後、単に「組成物」とも称する)に含まれる各成分について詳述する。
金属含有タングステン酸化物粒子(以後、単にタングステン酸化物微粒子、または、微粒子とも称する)とは、金属原子が含まれるタングステン酸化物粒子である。
このタングステン酸化物微粒子は、結晶構造によっては赤外光(波長が約800~1200nmの光)を選択的に遮蔽するため、赤外線吸収剤としての効能を有する。よって、このような微粒子をフィルタに含有させることで、赤外領域における遮光性が高く、可視光領域における透光性が高い赤外光カットフィルタを形成することができる。また、タングステン酸化物微粒子は、画像形成に用いられる、高圧水銀灯、KrF、ArFなどの露光に用いられる可視域より短波の光に対しても吸収が小さい。よって、後述するように、このような組成物は優れたパターン形成性を有し、赤外光カットフィルタの形状を微細に制御することができる。
上記タングステン酸化物微粒子は、下記一般式(組成式)(I)で表されることが好ましい。
MxWyOz・・・(I)
Mはアルカリ金属、Wはタングステン、Oは酸素を表す。
0.001≦x/y≦1.1
2.2≦z/y≦3.0
Mのアルカリ金属としては、RbまたはCsであることが好ましく、Csであることがより好ましい。
x/yが0.001以上であることにより、赤外光を十分に遮蔽することができ、1.1以下であることにより、タングステン酸化物微粒子中に不純物相が生成されることをより確実に回避することできる。
z/yが2.2以上であることにより、材料としての化学的安定性をより向上させることができ、3.0以下であることにより赤外光をより遮蔽することができる。
なお、平均粒子径の測定方法としては、公知の電子顕微鏡(例えば、透過型電子顕微鏡)にて、少なくとも50個の微粒子の粒子径(直径)を測定し、それらを算術平均した値である。なお、微粒子が真円でない場合は、長径を粒子径として測定する。
また、タングステン酸化物微粒子は2種以上を使用することが可能であり、その場合、合計含有量が上記範囲であることが好ましい。
また、例えば、住友金属鉱山株式会社製のYMF-02A、YMS-01A-2、YMF-10A-1などのアルカリ金属を含有するタングステン酸化物の微粒子の分散物としても、入手可能である。
樹脂バインダーとしては、目的に応じて適宜選択することができるが、例えば、または(メタ)アクリル系樹脂、ウレタン系樹脂、ポリビニルアルコール、ポリビニルブチラール、ポリビニルホルマール、ポリアミド、ポリエステル、ポリイミド、ポリベンゾオキサゾールなどを挙げることができ、(メタ)アクリル系樹脂、または、ウレタン系樹脂などが好ましく挙げられる。また、樹脂バインダーとしては、アルカリ可溶性バインダー(アルカリ可溶性樹脂)であることが好ましい。アルカリ可溶性バインダーを含有することにより、組成物から得られる硬化膜にパターン形成をするべく、露光を行った場合、未露光部をアルカリ現像液で除去することができ、アルカリ現像によって優れたパターンを形成できる。
アルカリ可溶性バインダーとしては、目的に応じて適宜選択することができるが、例えば、(メタ)アクリル系樹脂、ウレタン系樹脂、ポリビニルアルコール、ポリビニルブチラール、ポリビニルホルマール、ポリアミド、ポリエステル、ポリイミド、ポリベンゾオキサゾールまたはそれらの前駆体などを挙げることができ、(メタ)アクリル系樹脂、または、ウレタン系樹脂であることが好ましい。
ポリイミド、ポリベンゾオキサゾールまたはそれらの前駆体としては、WO2011/067998号公報の0012~0046欄の記載や、特開2013-050593号公報の段落0020~0054に記載のポリイミド樹脂の説明を参酌でき、これらの内容は本願明細書に組み込まれる。
酸基としては、カルボン酸基、スルホン酸基、ホスホン酸基、リン酸基、スルホンアミド基等が挙げられるが、原料入手の点からカルボン酸基が好ましい。
酸基を有するアルカリ可溶性バインダーの種類は特に限定されないが、モノマー成分として、酸基を有する重合性化合物を用いて得られた重合体であることが好ましく、酸価の調節の観点から、酸基を有する重合性化合物と、酸基を有さない重合性化合物とを共重合することよって得られた共重合体であることがより好ましい。
酸基を有する重合性化合物としては特に制限はなく、目的に応じて適宜選択することができ、例えば、アクリル酸、メタクリル酸、イタコン酸、クロトン酸、インクロトン酸、マレイン酸、p-カルボキシルスチレン等が挙げられ、これらの中でも、アクリル酸、メタクリル酸、p-カルボキシルスチレンが好ましい。これらは、1種単独で用いてもよいし、2種以上を併用してもよい。
(メタ)アクリル酸エステルのアルキルエステル部位におけるアルキル基は、直鎖状であっても分枝状であってもよく、炭素数1~10のアルキル基であることが好ましく、炭素数1~6のアルキル基であることがより好ましい。
(メタ)アクリル酸エステルのアリールエステル部位におけるアリール基は、炭素数6~14のアリール基であることが好ましく、炭素数6~10のアリール基であることがより好ましい。
(メタ)アクリル酸エステルのアラルキルエステル部位におけるアラルキル基は、炭素数7~20のアラルキル基であることが好ましく、炭素数7~12のアラルキル基であることがより好ましい。
アルカリ可溶性バインダー中における酸基の含有量は、特に制限はないが、0.5meq/g~4.0meq/gであることが好ましく、0.5meq/g~3.0meq/gであることがより好ましい。含有量が0.5meq/g以上であることによりアルカリ現像性が十分に得られ、優れたパターンをより確実に得ることができる。含有量が4.0meq/g以下であることにより、パターンが形成された赤外光カットフィルタの強度が損なわれるおそれを確実に回避できる。
ここで架橋性基とは、組成物から得られた塗布層を露光または加熱した際に、塗布層中で起こる重合反応の過程で樹脂バインダーを架橋させる基のことである。このような機能の基であれば特に限定されないが、例えば、重合性基(例えば、付加重合反応し得る官能基としてエチレン性不飽和結合基)、アミノ基、エポキシ基等が挙げられる。また、光照射によりラジカルになり得る官能基であってもよく、そのような架橋性基としては、例えば、チオール基、ハロゲン基等が挙げられる。なかでも、エチレン性不飽和結合基が好ましい。エチレン性不飽和結合基としては、スチリル基、(メタ)アクリロイル基、アリル基が好ましく、露光前の架橋性基の安定性と、パターン形成された赤外光カットフィルタの強度との両立の観点からは、(メタ)アクリロイル基であることがより好ましい。
ここで、含有量(meq/g)は、例えば、ヨウ素価滴定により測定することができる。
架橋性基を有するアルカリ可溶性バインダーは、特開2003-262958号公報に詳細に記載され、ここに記載の化合物を本発明にも使用することができる。
R1およびR2で表される置換基を有していてもよい炭素数1~25の炭化水素基としては、直鎖状または分岐状のアルキル基;アリール基;脂環式基;アルコキシで置換されたアルキル基;ベンジル等のアリール基で置換されたアルキル基;等が挙げられる。これらの中でも特に、メチル基、エチル基、シクロヘキシル基、ベンジル基等のような酸や熱で脱離しにくい1級または2級炭素の置換基が耐熱性の点で好ましい。
エーテルダイマーと共に、その他の単量体を共重合させてもよい。
エーテルダイマーと共に共重合しうるその他の単量体としては、例えば、酸基を導入するための単量体、ラジカル重合性二重結合を導入するための単量体、エポキシ基を導入するための単量体、および、これら以外の他の共重合可能な単量体が挙げられる。このような単量体は、1種のみを用いてもよいし、2種以上を用いてもよい。
また、酸基を導入するための単量体は、重合後に酸基を付与しうる単量体であってもよく、例えば、2-ヒドロキシエチル(メタ)アクリレート等の水酸基を有する単量体、グリシジル(メタ)アクリレート等のエポキシ基を有する単量体、2-イソシアナートエチル(メタ)アクリレート等のイソシアネート基を有する単量体等が挙げられる。重合後に酸基を付与しうる単量体を用いる場合、重合後に酸基を付与する処理を行う必要がある。重合後に酸基を付与する処理は、単量体の種類によって異なり、例えば、次の処理が挙げられる。水酸基を有する単量体を用いる場合であれば、例えば、コハク酸無水物、テトラヒドロフタル酸無水物、マレイン酸無水物等の酸無水物を付加させる処理が挙げられる。エポキシ基を有する単量体を用いる場合であれば、例えば、N-メチルアミノ安息香酸、N-メチルアミノフェノール等のアミノ基と酸基を有する化合物を付加させか、または、例えば(メタ)アクリル酸のような酸を付加させた後に生じた水酸基に、例えば、コハク酸無水物、テトラヒドロフタル酸無水物、マレイン酸無水物等の酸無水物を付加させる処理が挙げられる。イソシアネート基を有する単量体を用いる場合であれば、例えば、2-ヒドロキシ酪酸等の水酸基と酸基を有する化合物を付加させる処理が挙げられる。
一般式(ED)で表される化合物を含む単量体成分を重合してなる重合体が、エポキシ基を導入するための単量体を含む場合、その含有割合は、特に制限されないが、全単量体成分中、5~70質量%が好ましく、より好ましくは10~60質量%である。
また、一般式(ED)で表される化合物を含む単量体成分を重合してなる重合体が酸基を有する場合には、酸価が、好ましくは30~500mgKOH/g、より好ましくは50~400mgKOH/gであるのがよい。
一般式(ED)で表される化合物を含む単量体成分を重合してなる重合体の合成に適用される重合方法としては、特に制限はなく、従来公知の各種重合方法を採用することができるが、特に、溶液重合法によることが好ましい。詳細には、例えば、特開2004-300204号公報に記載されるポリマー(a)の合成方法に準じて、一般式(ED)で表される化合物を含む単量体成分を重合してなる重合体を合成することができる。
溶媒Aは、1気圧における沸点が170℃以上200℃以下の溶剤である。
溶媒Aの沸点は170℃以上200℃以下であり、赤外光カットフィルタの平坦塗布性、赤外光カットフィルタの表面特性、および、組成物の耐乾燥性の少なくとも一つがより優れる点(以後、単に「本発明の効果がより優れる点」とも称する)で、180℃以上193℃以下が好ましい。
溶媒Aの沸点が170℃未満の場合、赤外光カットフィルタの平坦塗布性、または、組成物の耐乾燥性に劣る。また、溶媒Aの沸点が200℃超の場合、赤外光カットフィルタの表面にて模様が発生しやすい。
溶剤Aの好適態様としては、以下の式(X)または式(Y)で表される溶剤が挙げられる。
式(X) R1O-(L-O)n-R2
式(Y) R1O-(L-O)m-CO-R2
式(X)および式(Y)中、R1は、水素原子またはアルキル基を表す。アルキル基に含まれる炭素数は特に制限されないが、1~3が好ましく、1がより好ましい。
R2は、アルキル基を表す。アルキル基に含まれる炭素数は特に制限されないが、1~3が好ましく、1がより好ましい。
Lは、アルキレン基を表す。アルキレン基に含まれる炭素数は特に制限されないが、3~5が好ましく、3がより好ましい。
nは、2~4の整数を表す。
mは、1~2の整数を表す。
溶剤Aの具体例としては、ジプロピレングリコールモノメチルエーテル(沸点188℃)、シクロヘキサノールアセテート(沸点173℃)、ジプロピレングリコールジメチルエーテル(沸点171℃)、エチレングリコールモノブチルエーテルアセテート(沸点192℃)、ジエチレングリコールジエチルエーテル(沸点189℃)、ジエチレングリコールモノメチルエーテル(沸点194℃)、プロピレングリコールジアセテート(沸点190℃)、3-メトキシブチルアセテート(沸点171℃)、プロピレングリコール-n-ブチルエーテル(沸点170℃)、ジエチレングリコールエチルメチルエーテル(沸点176℃)、ジエチレングリコールイソプロピルメチルエーテル(沸点179℃)が挙げられる。
なお、溶剤Aの好適態様の一つとして、溶剤A中において、上記式(X)または式(Y)で表される溶剤が主成分として含まれていることが好ましい。主成分とは、溶剤A全質量に対して、式(X)または式(Y)で表される溶剤の含有量が50質量%超であることを意図する。
なお、溶剤Aの他の好適態様の一つとして、溶剤A中において、上記溶剤Aの具体例として挙げた溶剤(例えば、ジプロピレングリコールモノメチルエーテル)が主成分として含まれていることが好ましい。主成分とは、溶剤A全質量に対して、上記溶剤Aの具体例として挙げた溶剤の含有量が50質量%超であることを意図する。
溶剤Aの含有量が0.1質量%未満の場合、赤外光カットフィルタの平坦塗布性、または、組成物の耐乾燥性に劣る。また、溶剤Aの含有量が20質量%超の場合、赤外光カットフィルタ表面にて上述の模様が発生しやすい。
溶剤Bは、上記溶剤Aとは異なる溶剤である。溶剤Aと溶剤Bと異なる2種の溶剤を混合することで、組成物の均一性が向上し、環状の模様の発生を抑制していると予想される。溶剤Bの好適態様の一つとしては、1気圧における沸点が170℃未満である態様が挙げられる。
溶剤Bとしては、本発明の効果がより優れる点で、1気圧における沸点が100℃以上130℃以下の溶剤B1、または、1気圧における沸点が130℃超170℃未満の溶剤B2が挙げられる。
溶剤B1の1気圧における沸点は100℃以上130℃以下であり、120~130℃が好ましい。
溶剤B2の1気圧における沸点は130℃超170℃未満であり、140~150℃が好ましい。
なお、組成物の乾燥の終局状態においても流動性を保持することが好ましいため、同一の温度近傍で溶剤が一律に蒸発するよりは、徐々に揮発する方が良いと考えられる。従って、溶剤Aの沸点と溶剤B2の沸点との差は20℃以上があることが好ましい。同様に、溶剤B2の沸点と溶剤B1の沸点との差は10~45℃であることが好ましく、15~30℃であることがより好ましい。
溶剤B2の具体例としては、プロピレングリコール1-モノメチルエーテル2-アセタート(沸点145℃)、エチレングリコールモノメチルエーテルアセテート(沸点145℃)、乳酸エチル(沸点155℃)、ジエチレングリコールジメチルエーテル(沸点162℃)、3-メトキシブタノール(沸点161℃)、プロピレングリコール-n-プロピルエーテル(沸点150℃)などが挙げられる。
赤外光遮蔽組成物中における溶剤Aと溶剤Bとの質量比(溶剤Aの質量/溶剤Bの質量)は特に制限されないが、本発明の効果がより優れる点で、0.005~0.500が好ましく、0.010~0.200がより好ましい。
赤外光遮蔽組成物に溶剤B1が含まれる場合、赤外光遮蔽組成物全質量に対する溶剤B1の含有量は特に制限されないが、本発明の効果がより優れる点で、0.1~10質量%が好ましく、0.5~5.0質量%がより好ましい。
赤外光遮蔽組成物に溶剤B2が含まれる場合、赤外光遮蔽組成物全質量に対する溶剤B2の含有量は特に制限されないが、本発明の効果がより優れる点で、20~80質量%が好ましく、30~70質量%がより好ましい。
溶剤Bは1種のみを使用してもよいし、2種以上を併用してもよい。なかでも、本発明の効果がより優れる点で、上記溶剤B1および上記溶剤B2を併用することが好ましい。
溶剤B1および溶剤B2を併用する場合、溶剤B1と溶剤B2との質量比(溶剤B1の質量/溶剤B2の質量)は特に制限されないが、本発明の効果がより優れる点で、0.005~0.500が好ましく、0.010~0.200がより好ましい。
上記組成物には、タングステン酸化物微粒子、樹脂バインダー、溶剤Aおよび溶剤B以外の他の成分が含まれていてもよく、例えば、重合性化合物、界面活性剤、分散剤、重合開始剤、重合禁止剤、紫外線吸収剤、増感剤、架橋剤、硬化促進剤、フィラー、エラストマーなどが挙げられる。
以下、それぞれの成分について詳述する。
重合性化合物としては、重合性基(酸、ラジカル、および、熱の少なくとも1種により反応する基)を分子内に有する化合物であればいずれを用いてもよく、好ましくは、分子内に複数の重合性基を有する多官能重合性化合物であることが好ましい。
好適に用いられる、酸、ラジカル、および、熱の少なくともいずれかに反応する重合性の官能基を有する重合性化合物としては、不飽和エステル官能基、不飽和アミド基、ビニルエーテル基、アリル基等のエチレン性不飽和基を有するエチレン性不飽和基含有化合物;メチロール化合物、ビスマレイミド化合物、ベンゾシクロブテン化合物、ビスアリルナジイミド化合物、およびベンゾオキサジン化合物などが挙げられる。
これらは、例えば、モノマー、プレポリマー、すなわち2量体、3量体およびオリゴマー、またはそれらの混合物並びにそれらの共重合体などの化学的形態をもつ。
モノマーおよびその共重合体の例としては、不飽和カルボン酸(例えば、アクリル酸、メタクリル酸、イタコン酸、クロトン酸、イソクロトン酸、マレイン酸など)、そのエステル類、アミド類、およびこれらの共重合体が挙げられ、好ましくは、不飽和カルボン酸エステル、不飽和カルボン酸と脂肪族多価アルコール化合物とのエステル、不飽和カルボン酸と脂肪族多価アミン化合物とのアミド類が用いられる。
特に、不飽和カルボン酸と脂肪族多価アルコール化合物とのエステルは、露光部において高い疎水性を発現できるので、アルカリ現像によって所望の形状を有するパターンを形成しやすく、また、耐久性の高いパターンが得られる点で好ましい。
また、ヒドロキシル基、アミノ基、メルカプト基等の求核性置換基を有する不飽和カルボン酸エステル或いはアミド類と、単官能若しくは多官能イソシアネート類或いはエポキシ類との付加反応物、または、上記不飽和カルボン酸エステル或いはアミド類と、単官能若しくは多官能のカルボン酸との脱水縮合反応物等も好適に使用される。
〔ただし、R4およびR5は、各々独立に、HまたはCH3を示す。〕
また、硬化感度、および、未露光部の現像性の観点からは、EO変性体を含有する化合物が好ましく、硬化感度、および、露光部強度の観点からは、ウレタン結合を含む化合物も好ましく用いられる。更に、パターン形成時の現像性の観点からは、酸基を有する化合物が好ましく用いられる。
また、酸基を有するエチレン性不飽和化合物類も好適であり、市販品としては、例えば、東亞合成株式会社製のカルボキシル基含有3官能アクリレートを含むTO-756、およびカルボキシル基含有5官能アクリレートを含むTO-1382などが挙げられる。
その他、高耐熱性の重合性化合物として、例えば、ベンゾシクロブテン(BCB)、ビスアリルナジイミド(BANI)、ベンゾオキサジン、メラミンおよびその類縁体などが挙げられる。
また、重合性化合物は2種以上を使用することが可能である。
組成物には、塗布性をより向上させる観点から、界面活性剤が含まれていてもよい。
界面活性剤としては、フッ素系界面活性剤、ノニオン系界面活性剤、カチオン系界面活性剤、アニオン系界面活性剤、シリコーン系界面活性剤などの各種界面活性剤を使用できる。特に、組成物は、フッ素系界面活性剤、およびシリコーン系界面活性剤の少なくともいずれかを含有することで、塗布液として調製したときの液特性(特に、流動性)がより向上する。これによって、塗布厚の均一性や省液性がより改善する。
即ち、フッ素系界面活性剤およびシリコーン系界面活性剤の少なくともいずれかを含有する組成物をする場合、被塗布面への濡れ性が改善され、被塗布面への塗布性が向上する。このため、少量の液量で数μm程度の薄膜を形成した場合であっても、厚みムラの小さい均一厚の膜形成をより好適に行える点で有効である。
ノニオン系界面活性剤としては、ポリオキシエチレンアルキルエーテル、ポリオキシエチレンアルキルアリルエーテル、ポリオキシエチレン脂肪酸エステル、ソルビタン脂肪酸エステル、ポリオキシエチレンソルビタン脂肪酸エステル、ポリオキシエチレンアルキルアミン、グリセリン脂肪酸エステル、オキシエチレンオキシプロピレンブロックコポリマー、アセチレングリコール系界面活性剤、アセチレン系ポリオキシエチレンオキシド等が挙げられる。これらは単独あるいは2種以上を用いることができる。
具体的な商品名としては、サーフィノール61、82、104、104E、104H、104A、104BC、104DPM、104PA、104PG-50、104S、420、440、465、485、504、CT-111、CT-121、CT-131、CT-136、CT-141、CT-151、CT-171、CT-324、DF-37、DF-58、DF-75、DF-110D、DF-210、GA、OP-340、PSA-204、PSA-216、PSA-336、SE、SE-F、TG、GA、ダイノール604(以上、日信化学(株)およびAirProducts&Chemicals社)、オルフィンA、B、AK-02、CT-151W、E1004、E1010、P、SPC、STG、Y、32W、PD-001、PD-002W、PD-003、PD-004、EXP.4001、EXP.4036、EXP.4051、AF-103、AF-104、SK-14、AE-3(以上、日信化学(株))アセチレノールE00、E13T、E40、E60、E81、E100、E200(以上全て商品名、川研ファインケミカル(株)社製)等を挙げることができる。
その他、ノニオン系界面活性剤として具体的には、特開2012-208494号公報の段落0553(対応する米国特許出願公開第2012/0235099号明細書の[0679])等に記載のノニオン系界面活性剤が挙げられ、これらの内容は本願明細書に組み込まれる。
カチオン系界面活性剤として具体的には、特開2012-208494号公報の段落0554(対応する米国特許出願公開第2012/0235099号明細書の[0680])に記載のカチオン系界面活性剤が挙げられ、これらの内容は本願明細書に組み込まれる。
アニオン系界面活性剤として具体的には、W004、W005、W017(裕商(株)社製)等が挙げられる。
組成物には、分散剤が含まれていてもよい。分散剤が含まれることにより、タングステン酸化物微粒子の組成物中での分散安定性が向上する。なお、分散剤は、上述したバインダーとしても機能する。
分散剤としては、高分子分散剤〔例えば、ポリアミドアミンとその塩、ポリカルボン酸とその塩、高分子量不飽和酸エステル、変性ポリウレタン、変性ポリエステル、変性ポリ(メタ)アクリレート、(メタ)アクリル系共重合体、ナフタレンスルホン酸ホルマリン縮合物〕、および、ポリオキシエチレンアルキルリン酸エステル、ポリオキシエチレンアルキルアミン、アルカノールアミン等の界面活性剤等を挙げることができる。
高分子分散剤は、その構造から更に直鎖状高分子、末端変性型高分子、グラフト型高分子、ブロック型高分子に分類することができる。
表面へのアンカー部位を有するブロック型高分子としては、特開2003-49110号公報、特開2009-52010号公報等に記載のブロック型高分子が好ましい。
そのような具体例としては、BYKChemie社製「Disperbyk-101(ポリアミドアミン燐酸塩)、107(カルボン酸エステル)、110(酸基を含む共重合物)、130(ポリアミド)、161、162、163、164、165、166、170(高分子共重合物)」、「BYK-P104、P105(高分子量不飽和ポリカルボン酸)」、EFKA社製「EFKA4047、4050、4010(ポリウレタン系)、EFKA4330、4340(ブロック共重合体)、4400~4402(変性ポリアクリレート)、5010(ポリエステルアミド)、6220(脂肪酸ポリエステル)、6745(フタロシアニン誘導体)」、味の素ファンテクノ社製「アジスパーPB821、PB822、PB880、PB881」、共栄社化学社製「フローレンTG-710(ウレタンオリゴマー)」、「ポリフローNo.50E、No.300(アクリル系共重合体)」、楠本化成社製「ディスパロンKS-860、873SN、874、#2150(脂肪族多価カルボン酸)、#7004(ポリエーテルエステル)、DA-703-50、DA-705、DA-725」、花王社製「デモールRN、N(ナフタレンスルホン酸ホルマリン重縮合物)、MS、C、SN-B(芳香族スルホン酸ホルマリン重縮合物)」、「ホモゲノールL-18(高分子ポリカルボン酸)」、「エマルゲン920、930、935、985(ポリオキシエチレンノニルフェニルエーテル)」、「アセタミン86(ステアリルアミンアセテート)」、日本ルーブリゾール(株)製「ソルスパース5000(フタロシアニン誘導体)、13240(ポリエステルアミン)、3000、17000、27000(末端部に機能部を有する高分子)、24000、28000、32000、38500(グラフト型高分子)」、日光ケミカル社製「ニッコールT106(ポリオキシエチレンソルビタンモノオレート)、MYS-IEX(ポリオキシエチレンモノステアレート)」、川研ファインケミカル(株)製 ヒノアクトT-8000E等、信越化学工業(株)製 オルガノシロキサンポリマーKP341、裕商(株)製「W001:カチオン系界面活性剤」、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンステアリルエーテル、ポリオキシエチレンオレイルエーテル、ポリオキシエチレンオクチルフェニルエーテル、ポリオキシエチレンノニルフェニルエーテル、ポリエチレングリコールジラウレート、ポリエチレングリコールジステアレート、ソルビタン脂肪酸エステル等のノニオン系界面活性剤、「W004、W005、W017」等のアニオン系界面活性剤、森下産業(株)製「EFKA-46、EFKA-47、EFKA-47EA、EFKAポリマー100、EFKAポリマー400、EFKAポリマー401、EFKAポリマー450」、サンノプコ(株)製「ディスパースエイド6、ディスパースエイド8、ディスパースエイド15、ディスパースエイド9100」等の高分子分散剤、(株)ADEKA製「アデカプルロニックL31、F38、L42、L44、L61、L64、F68、L72、P95、F77、P84、F87、P94、L101、P103、F108、L121、P-123」、および三洋化成(株)製「イオネット(商品名)S-20」等が挙げられる。
組成物は、分散剤を含んでいてもいなくてもよいが、含む場合、タングステン酸化物微粒子の総質量に対して、10~70質量%が好ましく、30~60質量%がより好ましい。
組成物には、重合開始剤が含まれていてもよい。重合開始剤が含まれる場合、重合性化合物などの重合がより効率的に進行し、膜強度に優れた赤外光カットフィルタが得られる。
重合開始剤としては、光、熱のいずれか或いはその双方により重合性化合物の重合を開始する能力を有する限り、特に制限はなく、目的に応じて適宜選択することができるが、光重合開始剤であることが好ましい。光で重合を開始させる場合、紫外線領域から可視の光線に対して感光性を有するものが好ましい。
また、熱で重合を開始させる場合には、150℃~250℃で分解する開始剤が好ましい。
感度の観点から、オキシム化合物、ヒドロキシアセトフェノン化合物、アミノアセトフェノン化合物、アシルホスフィン化合物、α-アミノケトン化合物、トリハロメチル化合物、ヘキサアリールビイミダゾール化合物、および、チオール化合物が好ましい。なかでも、オキシム化合物またはα-アミノケトン化合物がより好ましく、オキシム化合物がさらに好ましい。
ヒドロキシアセトフェノン化合物としては、IRGACURE-184、DAROCUR-1173、IRGACURE-500、IRGACURE-2959,IRGACURE-127(商品名:いずれもBASF社製)を用いることができる。アミノアセトフェノン化合物としては、市販品であるIRGACURE-907、IRGACURE-369、および、IRGACURE-379(商品名:いずれもBASF社製)を用いることができる。アシルホスフィン化合物としては市販品であるIRGACURE-819やDAROCUR-TPO(商品名:いずれもBASF社製)を用いることができる。
オキシム化合物の市販品としては、BASF社製 IRGACURE OXE 01(1.2-オクタンジオン,1-[4-(フェニルチオ)-,2-(o-ベンゾイルオキシム)])、IRGACURE OXE 02(エタノン,1-[9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル]-,1-(o-アセチルオキシム))等が好適なものとして挙げられる。
オキシム化合物としては、特開2012-208494号公報の段落0513(対応する米国特許出願公開第2012/235099号明細書の[0632])以降の式(OX-1)、(OX-2)または(OX-3)で表される化合物の説明を参酌でき、これらの内容は本願明細書に組み込まれる。
また、オキシム化合物の市販品としては、TRONLY TR-PBG-304、TRONLY TR-PBG-309、TRONLY TR-PBG-305(常州強力電子新材料有限公司(CHANGZHOU TRONLY NEW ELECTRONIC MATERIALS CO.,LTD)製)などが挙げられる。
組成物には、重合禁止剤が含まれていてもよい。重合禁止剤が含まれると、組成物の製造中または保存中において、重合性化合物の不要な熱重合を阻止することができる。
重合禁止剤としては公知の化合物が使用でき、例えば、ハイドロキノン、p-メトキシフェノール、ジ-t-ブチル-p-クレゾール、ピロガロール、t-ブチルカテコール、ベンゾキノン、4,4’-チオビス(3-メチル-6-t-ブチルフェノール)、2,2’-メチレンビス(4-メチル-6-t-ブチルフェノール)、N-ニトロソフェニルヒドロキシアミン第一セリウム塩等が挙げられる。
組成物中における重合禁止剤の含有量は特に制限されないが、全固形分質量に対して、0.05~0.0001質量%が好ましく、0.01~0.0005質量%がより好ましい。
組成物には、紫外線吸収剤が含まれていてもよい。紫外線吸収剤が含まれることにより、基板上に残る残渣を低減することができる。
紫外線吸収剤は、光や熱により重合性化合物の重合を開始する機能を持たない(すなわち、重合開始剤には該当しない)ものを指す。ここで、「重合性化合物の重合を開始する機能を持たない」とは、実質的には、紫外線吸収剤が、光や熱のエネルギーを受けても、重合性化合物の重合を開始するための活性種を発生しないことを意味する。
より具体的には、紫外線吸収剤は、紫外線または可視光線(より具体的には、波長300~450nmの波長の光)に対して感光性を有さず、また、熱(より具体的には、例えば、150℃~250℃の熱)に対する感熱性を有さないものが好ましい。ここで、「感光性」、「感熱性」とは、紫外線または可視光線、あるいは、熱により、化学構造の変化を伴って目的の機能を発現することを意味する。
紫外線吸収剤は、より好ましくは、(I)波長340nm~380nmの範囲、(II)波長380nm~420nmの範囲、および、(III)波長420nm~450nmの範囲、のいずれか少なくとも1つの範囲に、極大吸収波長を有することが好ましい。
サリシレート系紫外線吸収剤の例としては、フェニルサリシレート、p-オクチルフェニルサリシレート、p-t-ブチルフェニルサリシレートなどが挙げられ、ベンゾフェノン系紫外線吸収剤の例としては、2,2’-ジヒドロキシ-4-メトキシベンゾフェノン、2,2’-ジヒドロキシ-4,4’-ジメトキシベンゾフェノン、2,2’,4,4’-テトラヒドロキシベンゾフェノン、2-ヒドロキシ-4-メトキシベンゾフェノン、2,4-ジヒドロキシベンゾフェノン、2-ヒドロキシ-4-オクトキシベンゾフェノンなどが挙げられる。
ベンゾトリアゾール系紫外線吸収剤の例としては、2-(2’-ヒドロキシ-3’,5’-ジ-tert-ブチルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’-tert-ブチル-5’-メチルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’-tert-アミル-5’-イソブチルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’-イソブチル-5’-メチルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’-イソブチル-5’-プロピルフェニル)-5-クロロベンゾトリアゾール、2-(2’-ヒドロキシ-3’,5’-ジ-tert-ブチルフェニル)ベンゾトリアゾール、2-(2’-ヒドロキシ-5’-メチルフェニル)ベンゾトリアゾール、2-[2’-ヒドロキシ-5’-(1,1,3,3-テトラメチル)フェニル]ベンゾトリアゾールなどが挙げられる。
他にジエチルアミノ-フェニルスルホニル-ペンタジエノエイト系紫外線吸収剤(富士フイルムファインケミカル製、商品名:DPO)なども好適に用いられる。
また、特開2012-32556号公報の段落0103(対応するWO2012/015076号明細書の30頁目))以降の一般式(1)~(8)のいずれかで表される化合物やその具体例(1-1)~(8-3)を参酌でき、これらの内容は本願明細書に組み込まれる。
組成物には、増感剤が含まれていてもよい。
増感剤としては、上述した光重合開始剤に対し、電子移動機構またはエネルギー移動機構で増感させるものが好ましい。
使用される増感剤の種類は特に制限されないが、例えば、特開2012-122045号公報の段落[0202]に例示される化合物が挙げられる。
組成物中における増感剤の含有量は特に制限されないが、組成物中の全固形分に対して、0.01~10.0質量%が好ましく、0.10~4.00質量%がより好ましい。
組成物には、架橋剤が含まれていてもよい。架橋剤が含まれることにより、赤外光カットフィルタの強度の向上が期待できる。
架橋剤は、架橋性基を有する化合物であることが好ましく、架橋性基を2個以上で有する化合物であることがより好ましい。架橋性基の具体例としては、オキセタン基、シアネート基、および、アルカリ可溶性バインダーが有していてもよい架橋性基について挙げたものと同様の基を好適に挙げることができ、中でも、エポキシ基、オキセタン基またはシアネート基であることが好ましい。すなわち、架橋剤は、特にエポキシ化合物、オキセタン化合物またはシアネート化合物が好ましい。
使用される架橋剤の種類は特に制限されないが、例えば、特開2012-122045号公報の段落[0204]~[0209]に例示される化合物が挙げられる。
組成物には、硬化促進剤が含まれていてもよい。
使用される硬化促進剤の種類は特に制限されないが、例えば、特開2012-122045号公報の段落[0211]に例示される化合物が挙げられる。
組成物には、フィラーが含まれていてもよい。組成物にフィラーが含まれることにより、耐傷性、耐摩耗性の高い赤外光カットフィルタが得られる。
フィラーとしては、シランカップリング剤で表面処理された球状のシリカが好適に挙げられる。
使用されるフィラーの種類は特に制限されないが、例えば、特開2012-122045号公報の段落[0212]~[0222]に例示されるフィラーが挙げられる。
組成物には、エラストマーが含まれていてもよい。組成物にエラストマーが含まれることにより、赤外光カットフィルタの密着性が向上すると共に、耐熱性、耐熱衝撃性、柔軟性および強靭性をより向上させることができる。
使用されるエラストマーの種類は特に制限されないが、例えば、特開2012-122045号公報の段落[0225]~[0235]に例示されるエラストマーが挙げられる。
併用可能なその他の成分としては、例えば、熱硬化促進剤、可塑剤、着色剤(着色顔料あるいは染料)などが挙げられ、更に基材表面への密着促進剤およびその他の助剤類(例えば、導電性粒子、充填剤、消泡剤、難燃剤、レベリング剤、剥離促進剤、酸化防止剤、香料、表面張力調整剤、連鎖移動剤など)を使用してもよい。
有機顔料としては、例えば、ジケトピロロピロール系顔料、ペリレン系顔料、ベンズイミダゾロン系顔料、ペリノン系顔料、ナフトールAS系顔料、アンスラキノン系顔料、ピラゾロン系顔料、またはイソインドリノン系顔料が挙げられる。より具体的には、特開2011-057964号公報の段落0031~0033(対応する米国特許出願公開第2012/0104529号明細書においては段落0045~0051)に記載の顔料が挙げられ、これらの内容は本願明細書に組み込まれる。
近赤外線吸収色素の好適態様としては、第1の波長領域:800~869nmに極大吸収波長を有する色素、第2の波長領域:870~909nmに極大吸収波長を有する色素、第3の波長領域:910~949nmに極大吸収波長を有する色素、または、第4の波長領域:950~1000nmに極大吸収波長を有する色素が好ましい。
第1の波長領域に極大吸収波長を有するフタロシアニン系色素としては、日本触媒社製の商品名で、「イーエクスカラーIR-14」(λmax:819nm)、「イーエクスカラーIR-10A」(λmax:849nm)等が挙げられる。なお、商品名の後ろの括弧内に示すλmaxは極大吸収波長である。
第2の波長領域に極大吸収波長を有するフタロシアニン系色素としては、「イーエクスカラーIR-28」(λmax:880nm)、「イーエクスカラーIR-12」(λmax:883nm)、「TX-EX-820」(λmax:891nm)等が挙げられる。
第3の波長領域に極大吸収波長を有するフタロシアニン系色素としては、「TX-EX-906」(λmax:922nm)等が挙げられる。
第4の波長領域に極大吸収波長を有するフタロシアニン系色素としては、「イーエクスカラーIR-915」(λmax:963nm)、「イーエクスカラーIR-910」(λmax:968nm)、「イーエクスカラーIR-906」(λmax:968nm)等が挙げられる。
なお、850~950nmの光を遮光するためには、日本触媒のExcolor IR-28, Excolor 815K(フタロシアニン系顔料)が好適に挙げられる。
本発明の組成物の用途は、特に限定されないが、赤外光遮蔽層を形成することができ、例えば、赤外光カットフィルタに用いることができる。例えば、固体撮像素子の受光側における赤外光カットフィルタ、固体撮像素子の裏面側(受光側とは反対側)における赤外光カットフィルタなどに用いることもできる。
また、本発明の組成物を、カラーフィルタ上または平坦化層上に直接塗布し塗膜形成して用いてもよい。
本発明の組成物は、塗布可能な状態で供給できることから、固体撮像素子の所望の部材や位置に赤外光カットフィルタを容易に形成できる。
次に、本発明の赤外光カットフィルタについて説明する。
本発明の赤外光カットフィルタは、上述した本発明の組成物を用いて形成される。
赤外光カットフィルタの膜厚は、目的に応じて適宜選択することができるが、20μm以下が好ましく、10μm以下がより好ましく、5μm以下がさらに好ましい。膜厚の下限は、遮光能を維持するため、例えば、0.1μm以上が好ましく、0.2μm以上がより好ましく、0.3μm以上がより好ましい。本発明によれば、高い赤外光遮蔽性を有することから、赤外光カットフィルタの膜厚を薄くすることができる。
赤外光カットフィルタの波長400~1300nmにおける最大透過率は特に制限されないが、60%以上が好ましく、65%以上がより好ましい。
また、赤外光カットフィルタの波長900~1300nmにおける最大透過率は特に制限されないが、20%以下が好ましく、10%以下がより好ましく、5%以下が最も好ましい。
本発明の組成物を適用する支持体は、ガラスなどからなる透明基板であってもよい。また、固体撮像素子中の各基材であってもよい。また、固体撮像素子の受光側に設けられた別の基板であってもよい。また、固体撮像素子の受光側に設けられた平坦化層等の層であってもよい。
赤外光カットフィルタの製造方法において、その他の工程を含んでいてもよい。その他の工程としては、特に制限はなく、目的に応じて適宜選択することができる。例えば、基材の表面処理工程、前加熱工程(プリベーク工程)、硬化処理工程、後加熱工程(ポストベーク工程)などが挙げられる。
硬化処理工程は、必要に応じ、形成された上記膜に対して硬化処理を行う工程であり、この処理を行うことにより、赤外光カットフィルタの機械的強度が向上する。
上記硬化処理としては、特に制限はなく、目的に応じて適宜選択することができるが、例えば、露光処理、全面加熱処理などが好適に挙げられる。ここで、本発明において「露光」とは、各種波長の光のみならず、電子線、X線などの放射線照射をも包含する意味で用いられる。
露光は放射線の照射により行うことが好ましく、露光に際して用いることができる放射線としては、特に、電子線、KrF、ArF、g線、h線、i線等の紫外線や可視光が好ましく用いられる。
露光方式としては、ステッパー露光や、高圧水銀灯による露光などが挙げられる。
露光量は5~3000mJ/cm2が好ましく、10~2000mJ/cm2がより好ましく、50~1000mJ/cm2が特に好ましい。
露光処理の方法としては、例えば、形成された上記膜の全面を露光する方法が挙げられる。本発明の組成物が重合性化合物を含有する場合、露光により、膜中の重合成分の硬化が促進され、上記膜の硬化が更に進行し、機械的強度、耐久性が改良される。
上記露光を行う装置としては、特に制限はなく、目的に応じて適宜選択することができるが、例えば、超高圧水銀灯などのUV露光機が好適に挙げられる。
また、全面加熱処理の方法としては、形成された上記膜の全面を加熱する方法が挙げられる。全面加熱により、パターンの膜強度が高められる。
全面加熱における加熱温度は、120℃~250℃が好ましく、160℃~220℃がより好ましい。加熱温度が120℃以上であれば、加熱処理によって膜強度が向上し、250℃以下であれば、膜成分の分解を抑制できる。
全面加熱における加熱時間は、3分~180分が好ましく、5分~120分がより好ましい。
全面加熱を行う装置としては、特に制限はなく、公知の装置の中から、目的に応じて適宜選択することができ、例えば、ドライオーブン、ホットプレート、IR(赤外線)ヒーターなどが挙げられる。
上記赤外光カットフィルタは、固体撮像素子に好適に適用できる。
以下、本発明の固体撮像素子の一実施形態について、図1を用いて説明する。
図1に示す固体撮像素子(赤外光センサ)100において、図番110は、固体撮像素子基板である。
固体撮像素子基板110上には、赤外光カットフィルタ111とカラーフィルタ112とが配置される。
赤外光透過フィルタ(赤外光を透過するカラーフィルタ)113と固体撮像素子基板110との間には領域114が設けられている。領域114には、赤外光透過フィルタ113を透過した波長の光が透過可能な樹脂層(例えば、透明樹脂層など)が配置されている。領域114に赤外光透過フィルタ113を形成してもよい。すなわち、固体撮像素子基板110上に、赤外光透過フィルタ113を形成してもよい。
カラーフィルタ112および赤外光透過フィルタ113の入射光hν側には、マイクロレンズ115が配置されている。マイクロレンズ115を覆うように平坦化層116が形成されている。
図1では、カラーフィルタ112の膜厚と、赤外光透過フィルタ113の膜厚が同一であるが、両者の膜厚は異なっていてもよい。
図1では、カラーフィルタ112が、赤外光カットフィルタ111よりも入射光hν側に設けられているが、赤外光カットフィルタ111と、カラーフィルタ112との順序を入れ替えて、赤外光カットフィルタ111を、カラーフィルタ112よりも入射光hν側に設けてもよい。赤外光カットフィルタ111と、カラーフィルタ112との間に他の層が形成されてもよい。
カラーフィルタ112としては、赤色の波長領域の光を透過するカラーフィルタ、緑色の波長領域の光を透過するカラーフィルタ、および、青色の波長領域の光を透過するカラーフィルタからなる群から選択される少なくとも1つが含まれることが好ましい。
なお、カラ-フィルタ112に赤外光吸収物質を含有させて、カラ-フィルタ112に赤外光カットフィルタとしての機能を持たせてもよい。
赤外光透過フィルタ113は、光源の発光波長によりその特性は選択される。
例えば、赤色カラーフィルタ、緑色カラーフィルタ、青色カラーフィルタおよび赤外光透過フィルタを同一平面上に有するフィルタ層と、フィルタ層よりも光入射側に配置され、フィルタ層全面配置される赤外光カットフィルタとを備える固体撮像素子などが挙げられる。
なお、赤外光カットフィルタは、固体撮像素子基板110よりも光入射側に配置されていればよい。例えば、赤色カラーフィルタ上、緑色カラーフィルタ上、および、青色カラーフィルタ上に赤外光カットフィルタが配置され、赤外光透過フィルタ上に赤外光カットフィルタが配置されていてもよい。
また、上記フィルタ層と赤外光カットフィルタとの間には、平坦化層が配置されていてもよい。
図2は、撮像装置の機能ブロック図である。撮像装置は、レンズ光学系1と、固体撮像素子10と、信号処理部20と、信号切替部30と、制御部40と、信号蓄積部50と、発光制御部60と、赤外光を発光する発光素子の赤外LED70と、画像出力部80および81とを備える。なお、固体撮像素子10としては、上述した固体撮像素子100を用いることができる。また、固体撮像素子10とレンズ光学系1以外の構成は、そのすべてが、または、その一部が、同一の半導体基板に形成することもできる。撮像装置の各構成については、特開2011-233983号公報の段落0032~0036を参酌することができ、この内容は本願明細書に組み込まれる。
撮像装置としては、モーションセンサ、近接センサ、ジェスチャーセンサなどが存在する。
以下、本発明の実施例を説明するが、本発明は、これらの実施例に何ら限定されるものではない。なお、特に断りのない限り、「部」、「%」は、質量基準である。<組成物(赤外光遮蔽組成物)の調製>
下記表1に示す成分を同表に示す溶剤に溶解させて、赤外光遮蔽組成物を調製した。表1中の「質量部」欄での、「A/B」という記載は使用されている各成分の質量部を意図する。例えば、実施例21の「樹脂バインダー」では、「樹脂A」と「樹脂B」とがそれぞれ14.7質量部および0.8質量部使用されることを意図する。
樹脂A:日本触媒製アクリキュアーRD-F8
ポリアミック酸2:特開2013-50593号公報の実施例2(段落0118)に記載のポリアミック酸
ポリヒドロキシアミド:特開2007-199606号公報の段落0106に記載の方法で得たポリヒドロキシアミド
DPHA:KAYARAD DPHA(日本化薬社製)
モノマーA:ライトアクリレートDCP-A(共栄社化学社製)
モノマーB:アロニックスTO-756(東亞合成株式会社製)
トリメチロールプロパントリアクリレート:A-TMPT(新中村化学社製)
モノアクリレートMOI-BP(昭和電工株式会社製)
(重合開始剤)
IRGACURE 369:IRGACURE 369(BASF社製)
IRGACURE OXE-02:IRGACURE OXE-02(BASF社製)
(増感剤)
DETX-S:Kayacure DETX-S(2,4-ジエチルチオキサントン)(荘司産業株式会社製)
(溶剤)
PGMEA:1-メトキシ-2-プロパノールアセテート
PGME:1-メトキシ-2-プロパノール
EEP:エチル-3-エトキシプロピオネート(界面活性剤)
Megafac F-781-F(DIC社製)
Megafac R-30(DIC社製)
Megafac F-475(DIC社製)
KF-6003(信越シリコーン社製)
オルフィンE1010(日信化学工業社製)
polyfox PF656(BASF社製)
polyfox PF6320(BASF社製)
polyfox PF6520(BASF社製)
また、実施例34では日本触媒のExcolor IR-28を、実施例35ではExcolor 815K(フタロシアニン系顔料)をタングステン酸化物微粒子と共に併用した。
開口部の形状が正方形(一辺の長さ:5μm)である凹部(深さ:2.2μm)が5μmの間隔で一方向に4個配置されたシリコン基板を用意し、このシリコン基板上に各実施例および比較例の組成物をそれぞれ塗布して、100℃で2分間乾燥処理を施した後、露光装置UX3100-SR(ウシオ電機(株)製)を用いて光照射(露光量:500mJ/cm2)を行い、赤外光遮蔽層(厚み:2.7μm)を形成した。
シリコン基板の凹部が並んだ一方向に沿って、シリコン基板の凹部上に配置される赤外光遮光層の表面を原子間力顕微鏡(AFM)(日本Vecco社製、D3100)にて測定し、最大高低差(nm)を求め、以下の基準に沿って評価した。実用上、「A」または「B」であることが望ましい。
「A」:最大高低差が200nm以内である場合
「B」:最大高低差が200nm超400nm以下である場合
「C」:最大高低差が400nm超である場合
シリコン基板上に各実施例および比較例の組成物をそれぞれ塗布して、100℃で2分間乾燥処理を施した後、露光装置UX3100-SR(ウシオ電機(株)製)を用い、フォトマスク(マスクパターン:50μmラインアンドスペース)を介して光照射(露光量:500mJ/cm2)を行った。パターン露光された塗布膜は、有機アルカリ性現像液CD-2000(富士フィルムエレクトロニクスマテリアルズ(株)製)の60%水溶液を用いて、室温にて60秒間、パドル現像した後、さらに20秒間スピンシャワーにて純水でリンスを行なった。その後更に、純水にて水洗を行なった。その後、水滴を高圧のエアーで飛ばし、基板を自然乾燥させ、220℃で300秒間、ホットプレートでポストベーク処理し、ライン部として赤外光遮蔽層(厚み:2.7μm)を形成した。
得られた赤外光遮蔽層表面の任意の5か所を光学顕微鏡(倍率200倍)にて測定し、以下の基準に沿って評価した。実用上、「A」または「B」であることが望ましい。
「A」:いずれの箇所においても、円環状の模様が確認されない場合
「B」:いずれの箇所においても、円環状の模様は確認できないが、表面にやや荒れがある場合
「C」:いずれかの箇所において、円環状の模様が確認できる場合、または、表面に著しい塗布ムラ(広範囲における線状の模様、光学ムラ)が確認できる場合
上記実施例および比較例に記載の組成物10mLを、100mLディスコカップに入れ、室温下で1日放置した。
液表面が変化しないものを「A」、液表面周辺部にわずかに固形物は見えるが、膜ができていないものを「B」、乾燥により液上部に膜ができているものを「C」とした。実用上、「A」または「B」であることが望ましい。
なお、赤外光カットフィルタの製造方法としては、ガラス基板上に各実施例および比較例の組成物をそれぞれ塗布して、100℃で2分間乾燥処理を施した後、露光装置UX3100-SR(ウシオ電機(株)製)を用いて光照射(露光量:1000mJ/cm2)を行うことにより作製した。
なお、実施例1~6の比較より、溶剤Aの沸点が180℃以上193℃以下である場合、より優れた効果が得られることが確認された。
また、実施例12~14の比較より、界面活性剤の含有量が、赤外光遮蔽組成物全質量に対して、0.001~0.070質量%である場合、より優れた効果が得られることが確認された。
また、実施例17と実施例18との比較より、溶剤B1の沸点が120~130℃である場合、より優れた効果が得られることが確認された。
また、実施例18と実施例19との比較より、溶剤B1と溶剤B2との質量比(溶剤B1の質量/溶剤B2の質量)が0.010~0.200の場合、より優れた効果が得られることが確認された。
一方、所定の溶剤Aを使用していない比較例に記載の組成物では、所望の効果が得られなかった。
Claims (20)
- 赤外光遮蔽組成物であって、
金属含有タングステン酸化物粒子、樹脂バインダー、1気圧における沸点が170℃以上200℃以下の溶剤A、および、前記溶剤Aとは異なる溶剤B、を少なくとも含み、
前記溶剤Aの含有量が、赤外光遮蔽組成物全質量に対して、0.1~20質量%である、赤外光遮蔽組成物。 - 前記溶剤Aの沸点が180℃以上193℃以下である、請求項1に記載の赤外光遮蔽組成物。
- 前記溶剤Aが分子内に3つ以上の酸素原子を含む、請求項1または2に記載の赤外光遮蔽組成物。
- 前記溶剤Aがジプロピレングリコールモノメチルエーテルを含む、請求項1~3のいずれか1項に記載の赤外光遮蔽組成物。
- 前記溶剤Bが、1気圧における沸点が100℃以上130℃以下の溶剤B1、および、1気圧における沸点が130℃超170℃未満の溶剤B2からなる群から選択される少なくとも1種を含む、請求項1~4のいずれか1項に記載の赤外光遮蔽組成物。
- 前記溶剤Bが、前記溶剤B1および前記溶剤B2の両方を含む、請求項5に記載の赤外光遮蔽組成物。
- 前記溶剤B1と前記溶剤B2との質量比が0.010~0.200である、請求項6に記載の赤外光遮蔽組成物。なお、上記質量比は、溶剤B1の質量/溶剤B2の質量を表す。
- 前記溶剤B1の1気圧における沸点が120℃以上130℃以下である、請求項5~7のいずれか1項に記載の赤外光遮蔽組成物。
- 前記溶剤B1が、酢酸ブチルを含む、請求項5~8のいずれか1項に記載の赤外光遮蔽組成物。
- 前記溶剤Aの含有量が、赤外光遮蔽組成物全質量に対して、0.7~5.0質量%である、請求項1~9のいずれか1項に記載の赤外光遮蔽組成物。
- さらに、重合性化合物、重合開始剤、界面活性剤、および、紫外線吸収剤からなる群から選択される少なくとも1つを含む、請求項1~10のいずれか1項に記載の赤外光遮蔽組成物。
- 前記重合開始剤が、オキシム化合物またはα-アミノケトン化合物を含む、請求項11に記載の赤外光遮蔽組成物。
- 前記樹脂バインダーが、アルカリ可溶性バインダーを含む、請求項1~12のいずれか1項に記載の赤外光遮蔽組成物。
- 前記アルカリ可溶性バインダーが酸基を有する、請求項13に記載の赤外光遮蔽組成物。
- 前記アルカリ可溶性バインダーが重合性基を有する、請求項13または14に記載の赤外光遮蔽組成物。
- さらに、前記界面活性剤を含み、
前記界面活性剤の含有量が、赤外光遮蔽組成物全質量に対して、0.001~0.070質量%である、請求項11に記載の赤外光遮蔽組成物。 - 請求項1~16のいずれか1項に記載の赤外光遮蔽組成物を用いて形成された赤外光カットフィルタ。
- 400nm~1300nmにおける最大透過率が60%以上であり、900~1300nmにおける最大透過率が20%以下である、請求項17に記載の赤外光カットフィルタ。
- 請求項17または18に記載の赤外光カットフィルタを有する固体撮像素子。
- 赤色の波長領域の光を透過するカラーフィルタ、緑色の波長領域の光を透過するカラーフィルタ、青色の波長領域の光を透過するカラーフィルタ、および、赤外光を透過するカラーフィルタからなる群から選択される少なくとも一つを含むフィルタ層と、
前記フィルタ層よりも光入射側に配置される請求項17または18に記載の赤外光カットフィルタと、を有する固体撮像素子。
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JP6326142B2 (ja) | 2018-05-16 |
JPWO2016035633A1 (ja) | 2017-06-29 |
US10975250B2 (en) | 2021-04-13 |
US20170166762A1 (en) | 2017-06-15 |
KR101925820B1 (ko) | 2018-12-06 |
TW201612257A (en) | 2016-04-01 |
KR20170038049A (ko) | 2017-04-05 |
TWI693264B (zh) | 2020-05-11 |
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