WO2016035229A1 - Cellule solaire et son procédé de fabrication - Google Patents

Cellule solaire et son procédé de fabrication Download PDF

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WO2016035229A1
WO2016035229A1 PCT/JP2015/002959 JP2015002959W WO2016035229A1 WO 2016035229 A1 WO2016035229 A1 WO 2016035229A1 JP 2015002959 W JP2015002959 W JP 2015002959W WO 2016035229 A1 WO2016035229 A1 WO 2016035229A1
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silicon substrate
solar cell
silicon
main surface
substrate
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PCT/JP2015/002959
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English (en)
Japanese (ja)
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渡部　武紀
大塚　寛之
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信越化学工業株式会社
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Priority to KR1020177003896A priority Critical patent/KR102420807B1/ko
Priority to CN201580044524.3A priority patent/CN106796964B/zh
Priority to BR112017003041A priority patent/BR112017003041A2/pt
Priority to US15/503,854 priority patent/US20170263791A1/en
Priority to EP15838584.9A priority patent/EP3190628B1/fr
Priority to SG11201701418RA priority patent/SG11201701418RA/en
Priority to RU2017105087A priority patent/RU2017105087A/ru
Priority to ES15838584T priority patent/ES2780048T3/es
Publication of WO2016035229A1 publication Critical patent/WO2016035229A1/fr

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    • H—ELECTRICITY
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264—Inorganic materials
    • H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
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    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264—Inorganic materials
    • H01L31/028—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
    • H01L31/0288—Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table characterised by the doping material
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    • H01L31/02—Details
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
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    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
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    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a solar cell and a method for manufacturing a solar cell.
  • a solar cell using a silicon substrate with boron (B) as a dopant has a problem that its conversion efficiency is lowered by light irradiation, whereas a silicon substrate with gallium (Ga) as a dopant is used. It is known that solar cells do not undergo photodegradation (see, for example, Patent Document 1).
  • a silicon thermal oxide film has excellent characteristics as a surface passivation method for a silicon substrate.
  • gallium-doped substrate silicon substrate doped with gallium
  • the dopant concentration on the surface of the substrate increases due to the difference in diffusion coefficient and solubility between gallium silicon and silicon oxide. It has the property of greatly degrading. Therefore, when a gallium-doped substrate is used for a solar cell, there is a problem that it is difficult to apply thermal oxidation to a gallium-doped substrate because conversion efficiency is lowered due to a decrease in dopant concentration on the substrate surface.
  • the present invention has been made in view of the above-described problems, and has a silicon thermal oxide film as a substrate surface passivation film, and can have high conversion efficiency while suppressing photodegradation. And to provide a method for producing such a solar cell.
  • the present invention provides a solar cell having a silicon substrate doped with gallium and having a pn junction, wherein the first surface has at least a p-type region in the main surface of the silicon substrate.
  • a solar cell is provided, wherein a silicon thermal oxide film is provided on a main surface, and the silicon substrate is further doped with boron.
  • the silicon substrate is doped with gallium, so that photodegradation can be suppressed.
  • the silicon substrate is further doped with boron, even if a silicon thermal oxide film is provided on the first main surface having at least the p-type region among the main surfaces of the silicon substrate, The dopant concentration can be prevented from greatly decreasing, and the initial conversion efficiency can be prevented from decreasing.
  • a silicon thermal oxide film having excellent characteristics as a substrate surface passivation film is provided on the surface of the silicon substrate, conversion efficiency can be improved and a high-quality solar cell with high reliability can be obtained.
  • the present invention can be suitably applied to a solar cell in which the entire first main surface of a silicon substrate provided with a silicon thermal oxide film is p-type.
  • the boron concentration in the silicon substrate is preferably 5 ⁇ 10 14 atoms / cm 3 or more and 1 ⁇ 10 16 atoms / cm 3 or less.
  • the boron concentration in the silicon substrate is in the above range, the initial characteristics of the solar cell can be improved more effectively, and the conversion efficiency after light irradiation can be maintained high.
  • the present invention also provides a step of preparing a silicon substrate doped with gallium and boron, a step of forming a pn junction in the silicon substrate, and a first having at least a p-type region in the main surface of the silicon substrate. And a method of forming a silicon thermal oxide film on a main surface.
  • the silicon substrate doped with gallium the photodegradation of the manufactured solar cell can be suppressed.
  • the silicon substrate to be used is further doped with boron, even if a silicon thermal oxide film is formed on at least the first main surface having the p-type region, the dopant concentration on the substrate surface is greatly reduced. It is possible to prevent the deterioration of the initial conversion efficiency of the solar cell.
  • a silicon thermal oxide film having excellent characteristics as a substrate surface passivation film on the surface of the silicon substrate, it is possible to improve the conversion efficiency and manufacture a high-quality solar cell with high reliability.
  • the boron concentration of the prepared silicon substrate is 5 ⁇ 10 14 atoms / cm 3 or more and 1 ⁇ 10 16 atoms / cm 3 or less.
  • the initial characteristics of the manufactured solar cell can be improved more effectively, and the conversion efficiency after light irradiation can be kept high.
  • the solar cell of the present invention has a silicon thermal oxide film as a substrate surface passivation film, and can have high conversion efficiency while suppressing photodegradation. Moreover, the manufacturing method of the solar cell of this invention can manufacture such a solar cell.
  • the solar cell using a silicon substrate with boron as a dopant has a problem that its conversion efficiency is reduced by light irradiation, whereas the solar cell using a silicon substrate with gallium as a dopant is used. It is known that batteries do not photodegrade.
  • a surface passivation method of a silicon substrate it has been known for a long time that a silicon thermal oxide film has excellent characteristics.
  • a gallium doped substrate is thermally oxidized, the dopant concentration on the substrate surface is greatly reduced. Therefore, it is difficult to apply thermal oxidation to a gallium-doped substrate because conversion efficiency decreases due to a decrease in dopant concentration on the substrate surface.
  • the inventors have intensively studied a solar cell that has a silicon thermal oxide film as a substrate surface passivation film, but can have high conversion efficiency while suppressing photodegradation.
  • a silicon substrate doped with boron in addition to being doped with gallium is used as a substrate for a photoelectric conversion layer of a solar cell, and a silicon thermal oxide film is provided on the surface of the substrate, thereby providing a substrate surface passivation film. It has been found that it can have high conversion efficiency while suppressing photodegradation while having a silicon thermal oxide film, and has led to the present invention.
  • the 1 includes a silicon substrate (for example, p-type silicon substrate) 11 doped with gallium and boron, an emitter layer 15 provided on the surface (second main surface 19) of the silicon substrate 11, silicon A silicon thermal oxide film 12 provided on the back surface (first main surface 18) of the substrate 11; a p-type silicon substrate 11; an emitter layer 15 formed on the surface portion of the silicon substrate 11; Thus, a pn junction is formed.
  • the emitter layer 15 is, for example, an n-type diffusion layer.
  • Silicon thermal oxide films 12 and 12 ′ may be provided on both surfaces (first main surface 18 and second main surface 19) of the silicon substrate 11. Further, silicon nitride films 13 and 13 'may be provided on the silicon thermal oxide films 12 and 12' for the purpose of preventing reflection.
  • first main surface refers to the main surface having the p-type region of the silicon substrate
  • second main surface is the main surface opposite to the “first main surface”.
  • the p-type region may be on both main surfaces.
  • one of the surfaces is defined as a “first main surface”
  • the opposite main surface is defined as a “second main surface”.
  • the present invention has a silicon thermal oxide film on the main surface having the p-type region.
  • the solar cell 10 in FIG. 1 can have a surface electrode 14 electrically connected to the emitter layer 15 via the opening 21 on the surface (second main surface 19) side of the silicon substrate 11. It is possible to have the back electrode 16 electrically connected to the silicon substrate 11 via the opening 22 on the back surface (first main surface 18) side.
  • the solar cell 10 can suppress photodegradation. Further, since the silicon substrate 11 is further doped with boron, even if the silicon thermal oxide film 12 is provided on the first main surface 18 having at least the p-type region in the main surface of the silicon substrate 11, the dopant on the substrate surface The concentration can be prevented from greatly decreasing, and the initial conversion efficiency can be prevented from decreasing. Furthermore, by providing a silicon thermal oxide film 12 having excellent characteristics as a substrate surface passivation film on the surface of the silicon substrate 11, a highly reliable and high quality solar cell can be obtained.
  • At least the first main surface 18 of the silicon substrate 11 of the solar cell 10 is p-type.
  • the present invention can be suitably applied to a solar cell in which the entire surface of the first main surface 18 of the silicon substrate 11 provided with the silicon thermal oxide film 12 is p-type.
  • the boron concentration in the silicon substrate 11 is 5 ⁇ 10 14 atoms / cm 3 or more and 1 ⁇ 10 16 atoms / cm 3 or less.
  • the initial characteristics of the solar cell can be more effectively improved, and the conversion efficiency after light irradiation can be maintained high.
  • the boron concentration exceeds 5 ⁇ 10 14 atoms / cm 3
  • the conversion efficiency is lowered (photodegradation) due to light irradiation due to the presence of boron dopant.
  • photodegradation occurs when the boron concentration is in the range of 5 ⁇ 10 14 atoms / cm 3 or more and 1 ⁇ 10 16 atoms / cm 3 or less.
  • the effect of improving the initial efficiency is greater than that. Therefore, the conversion efficiency after light deterioration is high even when the boron doping amount is smaller than this (that is, when there is no light deterioration due to boron doping).
  • the solar cell of the present invention described above can have high conversion efficiency while suppressing photodegradation while having a silicon thermal oxide film as a substrate surface passivation film.
  • a silicon substrate (for example, a p-type silicon substrate) 11 doped with gallium and boron is prepared (see FIG. 2A).
  • a silicon substrate doped with gallium and boron can be obtained by, for example, growing a silicon single crystal ingot by doping gallium and boron by the CZ method or the FZ method, slicing this, and then performing predetermined processing. it can.
  • the silicon substrate 11 is subjected to a texture process for forming fine irregularities called textures on the light receiving surface side (that is, the second main surface 19 side in FIG. 1) when it is a solar cell in order to reduce reflectance. It is preferable.
  • a pn junction is formed by forming the emitter layer 15 on the second main surface 19 side of the silicon substrate 11 (see FIG. 2B).
  • the emitter layer 15 can be formed, for example, by forming an n-type diffusion layer by phosphorus diffusion.
  • the surface on which the emitter layer 15 is formed is a main surface opposite to the first main surface 18.
  • a silicon thermal oxide film 12 is formed on at least the first main surface 18 of the silicon substrate 11 by thermally oxidizing the silicon substrate 11 in an oxygen gas atmosphere (see FIG. 2C).
  • Silicon thermal oxide films 12 and 12 ′ may be formed on both surfaces of the silicon substrate 11 (that is, the first main surface 18 and the second main surface 19).
  • a silicon substrate doped with gallium has the property that, when thermally oxidized, the gallium concentration on the surface of the substrate is greatly reduced due to the difference in the diffusion coefficient and solubility in the silicon single crystal of gallium. Due to the thermal oxidation, the gallium concentration in the vicinity of the first main surface 18 and the second main surface 19 of the silicon substrate 11 becomes smaller than the gallium concentration in the silicon substrate 11.
  • the silicon substrate 11 is also doped with boron, which is a p-type dopant, the total concentration of p-type dopants in the vicinity of the first main surface 18 and the second main surface 19 of the silicon substrate 11 is doped only with gallium. It can be larger than the case.
  • silicon thermal oxide film 12 After the formation of the silicon thermal oxide film, antireflection is performed on the silicon thermal oxide film 12 formed on the first main surface 18 of the silicon substrate 11 and on the silicon thermal oxide film 12 ′ formed on the second main surface 19.
  • silicon nitride films 13 and 13 ′ may be formed respectively (see FIG. 3A).
  • a metal for forming the surface electrode 14 can be formed on the second main surface 19 of the silicon substrate 11 (see FIG. 3B).
  • the surface electrode 14 is preferably formed of silver.
  • a known method can be used. For example, a paste containing Ag can be screen-printed, dried, and fired. At this time, without opening the silicon thermal oxide film 12 ′ and the silicon nitride film 13 ′, a silver paste is printed on the film surface, and these films are penetrated during firing, whereby the surface electrode 14 and the emitter layer 15 are formed. It can be electrically connected.
  • the silicon thermal oxide film 12 and the silicon nitride film 13 formed on the first main surface 18 of the silicon substrate 11 are partially removed, and then the back surface is formed on the first main surface 18 of the silicon substrate 11.
  • a metal for forming the electrode 16 can be formed.
  • the back electrode 16 is preferably formed of aluminum.
  • a known method can be used. For example, Al can be deposited on the entire surface. Thus, the back surface electrode 16 is formed, and the solar cell 10 of FIG. 1 can be obtained.
  • photodegradation can be suppressed by using a silicon substrate doped with gallium. Further, since the silicon substrate is further doped with boron, even if a silicon thermal oxide film is formed on at least the first main surface having the p-type region in the main surface of the silicon substrate, the dopant concentration on the substrate surface is greatly reduced. This can prevent the deterioration of the initial conversion efficiency. Furthermore, by forming a silicon thermal oxide film having excellent characteristics as a substrate surface passivation film on the surface of the silicon substrate, a highly reliable and high quality solar cell can be manufactured.
  • the boron concentration of the silicon substrate to be used is preferably 5 ⁇ 10 14 atoms / cm 3 or more and 1 ⁇ 10 16 atoms / cm 3 or less.
  • the initial characteristics of the manufactured solar cell can be improved more effectively, light degradation can be reduced, and conversion efficiency after light irradiation can be maintained high. can do.
  • the surface electrode 14 of the solar cell 10 ′ in FIG. 4 is preferably made of Al, and the back electrode 16 is preferably made of Ag.
  • the solar cell 10 ′ of FIG. 4 can also have high conversion efficiency while suppressing photodegradation while having a silicon thermal oxide film as a substrate surface passivation film as in the solar cell 10 of FIG. .
  • the solar cell 10 of the present invention shown in FIG. 1 was produced by the manufacturing process shown in FIGS.
  • a plurality of gallium and boron-doped p-type as-cut silicon substrates having a thickness of 200 ⁇ m, a specific resistance of 1 ⁇ ⁇ cm, and a plane orientation of ⁇ 100 ⁇ were prepared (see FIG. 2A).
  • a plurality of silicon single crystal ingots are produced by changing the boron doping amount by the CZ method, and a silicon substrate is cut out from the produced silicon single crystal ingot, and the silicon substrate of any boron doping amount has a specific resistance of 1 ⁇ ⁇ cm.
  • the specific resistance was measured in advance so that the silicon substrate was selected.
  • the gallium doping amount was adjusted based on the boron doping amount so that the specific resistance was 1 ⁇ ⁇ cm.
  • texture processing was performed as follows. After removing the damaged layer of the silicon substrate 11 with a hot concentrated potassium hydroxide aqueous solution, it was immersed in an aqueous solution of potassium hydroxide and 2-propanol to form a texture.
  • phosphorus diffusion was performed by heat-treating the silicon substrate 11 at 870 ° C. in a phosphorus oxychloride atmosphere. At this time, heat treatment was performed in a state where the back surfaces of the plurality of silicon substrates 11 were overlapped. The phosphorus glass layer after the diffusion was removed with hydrofluoric acid, washed and dried. In this way, the emitter layer 15 which is an n-type diffusion layer was formed on the second main surface 19 side of the silicon substrate 11 (see FIG. 2B).
  • thermal oxidation was performed as follows. After cleaning in a hydrochloric acid / hydrogen peroxide mixed solution, heat treatment is performed in an oxygen gas atmosphere at 900 ° C. for 40 minutes to form a silicon thermal oxide film 12 having a thickness of 15 nm on the back surface (first main surface 18) of the silicon substrate 11. (See FIG. 2 (c)). At this time, a silicon thermal oxide film 12 ′ was also formed on the surface (second main surface 19) of the silicon substrate 11.
  • silicon nitride film formation was performed as follows. Using a plasma CVD apparatus, in a mixed gas atmosphere of SiH 4 , NH 3 , and H 2 , silicon nitride films 13 and 13 ′ having a thickness of 80 nm are formed on the back side (first main surface 18 side) of silicon substrate 11 and the silicon substrate. 11 on the silicon thermal oxide films 12 and 12 'on the surface side (second main surface 19 side) (see FIG. 3A).
  • a silver film for forming the surface electrode 14 was dried by screen-printing Ag paste.
  • the surface electrode 14 penetrated the silicon nitride film 13 ′ and the silicon thermal oxide film 12 ′ and was in contact with the emitter layer 15 (see FIG. 3B).
  • the silicon nitride film 13 and the silicon thermal oxide film 12 on the back surface (first main surface 18) side of the silicon substrate 11 were removed in a line shape with an interval of 1 mm by a laser.
  • the back electrode 16 was formed by vapor-depositing Al on the entire back surface (first main surface 18) of the silicon substrate 11. Thereby, the solar cell 10 shown in FIG. 1 was manufactured.
  • the electrical property at the time of 25 degreeC irradiance amount of 100 mW / cm ⁇ 2 >, spectrum AM1.5 global pseudo-sunlight irradiation was measured.
  • the electrical characteristics were measured for initial characteristics (that is, initial conversion efficiency) and post-degradation characteristics (that is, post-degradation conversion efficiency measured under the same conditions as the initial conversion efficiency after 2 hours of continuous light irradiation).
  • the conversion efficiency is (output from the solar cell / light energy incident on the solar cell) ⁇ 100.
  • the measurement results are shown in FIG. In FIG. 5, the deterioration rate was set to (conversion efficiency after deterioration / initial conversion efficiency) ⁇ 100.
  • the initial conversion efficiency is increased due to the increase in the p-type dopant concentration in the vicinity of the substrate surface and the effect of improving the passivation by the oxide film. Although it improves, light deterioration also begins.
  • the boron concentration in the silicon substrate is in the range of 5 ⁇ 10 14 to 1 ⁇ 10 16 atoms / cm 3 , the effect of improving the initial characteristics is greater than that of light deterioration, so that the boron amount is small (not deteriorated). It can be seen that the conversion efficiency is high even after deterioration, and the boron concentration in the above range is particularly preferable.
  • the present invention is not limited to the above embodiment.
  • the above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

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  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne une cellule solaire qui possède un substrat en silicium qui est dopé avec du gallium et dans lequel est formée une jonction pn. La cellule solaire est caractérisée : en ce qu'un film de silicium thermiquement oxydé est formé au moins sur une première surface principale du substrat en silicium parmi les surfaces principales du substrat en silicium, ladite première surface principale ayant une zone du type p ; en ce que le substrat en silicium est également dopé avec du bore. Par conséquent, l'invention concerne une cellule solaire pouvant avoir un rendement de conversion élevé, tout en supprimant la détérioration optique, même en utilisant le film de silicium thermiquement oxydé comme film de passivation de surface de substrat, et un procédé de fabrication de ladite cellule solaire.
PCT/JP2015/002959 2014-09-04 2015-06-12 Cellule solaire et son procédé de fabrication WO2016035229A1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020177003896A KR102420807B1 (ko) 2014-09-04 2015-06-12 태양전지 및 태양전지의 제조 방법
CN201580044524.3A CN106796964B (zh) 2014-09-04 2015-06-12 太阳能电池及太阳能电池的制造方法
BR112017003041A BR112017003041A2 (pt) 2014-09-04 2015-06-12 célula solar e método de manufatura de célula solar
US15/503,854 US20170263791A1 (en) 2014-09-04 2015-06-12 Solar cell and manufacturing method of solar cell
EP15838584.9A EP3190628B1 (fr) 2014-09-04 2015-06-12 Cellule solaire et son procédé de fabrication
SG11201701418RA SG11201701418RA (en) 2014-09-04 2015-06-12 Solar cell and manufacturing method of solar cell
RU2017105087A RU2017105087A (ru) 2014-09-04 2015-06-12 Солнечный элемент и способ его изготовления
ES15838584T ES2780048T3 (es) 2014-09-04 2015-06-12 Célula solar y método de fabricación de células solares

Applications Claiming Priority (2)

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JP2014180220A JP5830147B1 (ja) 2014-09-04 2014-09-04 太陽電池及び太陽電池の製造方法
JP2014-180220 2014-09-04

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WO2016035229A1 true WO2016035229A1 (fr) 2016-03-10

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EP (1) EP3190628B1 (fr)
JP (1) JP5830147B1 (fr)
KR (1) KR102420807B1 (fr)
CN (1) CN106796964B (fr)
BR (1) BR112017003041A2 (fr)
ES (1) ES2780048T3 (fr)
MY (1) MY180755A (fr)
RU (1) RU2017105087A (fr)
SG (1) SG11201701418RA (fr)
TW (1) TWI673886B (fr)
WO (1) WO2016035229A1 (fr)

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JP6946706B2 (ja) * 2017-04-18 2021-10-06 市光工業株式会社 光変換装置の製造方法及び光変換装置
CN108133976A (zh) * 2018-01-29 2018-06-08 泰州隆基乐叶光伏科技有限公司 一种单晶掺镓背钝化太阳电池及其制备方法
CN108172637A (zh) * 2018-01-29 2018-06-15 泰州隆基乐叶光伏科技有限公司 一种多晶掺镓背钝化太阳电池及其制备方法
CN108133975B (zh) * 2018-01-29 2024-06-07 泰州隆基乐叶光伏科技有限公司 一种多晶掺镓太阳电池及其制备方法
CN111509082B (zh) * 2020-03-20 2024-05-24 中国科学院宁波材料技术与工程研究所 掺镓多晶硅薄膜制备方法及其在太阳电池的应用

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EP3190628B1 (fr) 2020-01-15
RU2017105087A (ru) 2018-10-04
EP3190628A4 (fr) 2018-08-22
KR102420807B1 (ko) 2022-07-13
ES2780048T3 (es) 2020-08-21
BR112017003041A2 (pt) 2017-11-21
TW201626593A (zh) 2016-07-16
CN106796964B (zh) 2018-11-20
EP3190628A1 (fr) 2017-07-12
JP5830147B1 (ja) 2015-12-09
KR20170053614A (ko) 2017-05-16
JP2016054255A (ja) 2016-04-14
CN106796964A (zh) 2017-05-31
MY180755A (en) 2020-12-08
US20170263791A1 (en) 2017-09-14
TWI673886B (zh) 2019-10-01
SG11201701418RA (en) 2017-03-30

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