WO2016026208A1 - 柔性显示器的制造方法和柔性显示器 - Google Patents

柔性显示器的制造方法和柔性显示器 Download PDF

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WO2016026208A1
WO2016026208A1 PCT/CN2014/089576 CN2014089576W WO2016026208A1 WO 2016026208 A1 WO2016026208 A1 WO 2016026208A1 CN 2014089576 W CN2014089576 W CN 2014089576W WO 2016026208 A1 WO2016026208 A1 WO 2016026208A1
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flexible display
substrate
sacrificial layer
flexible
preparing
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PCT/CN2014/089576
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English (en)
French (fr)
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刘陆
谢明哲
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京东方科技集团股份有限公司
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Priority to US14/769,163 priority Critical patent/US20160246084A1/en
Publication of WO2016026208A1 publication Critical patent/WO2016026208A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • Embodiments of the present invention relate to a method of fabricating a flexible display and a flexible display manufactured by the method.
  • Liquid crystal display (LCD) technology has developed rapidly in the past decade, and has made great progress from the size of the screen to the quality of the display. Due to the flexible nature of its flexible display, it has a lot of special user experience. It is known that a relatively large application in the manufacture of a flexible display is a cover removal method.
  • a method of fabricating a flexible display comprising:
  • the sacrificial layer is irradiated with a laser to separate the base substrate from the flexible substrate;
  • the material for preparing the protective layer is coated on the flexible substrate by a method of multiple melt extrusion, and after cooling, a protective layer is formed.
  • the material of the sacrificial layer is a-Si, or silicon dioxide, or silicon nitride, or indium tin oxide.
  • the step of irradiating the sacrificial layer with the laser to separate the base substrate from the flexible substrate comprises: absorbing the components of the flexible display with a vacuum adsorption robot and flipping the flexible display by 180°, and then irradiating the sacrificial layer with a laser To separate the flexible substrate from the substrate.
  • the base substrate is a glass substrate.
  • the sacrificial layer is irradiated with a laser to separate the substrate from the components of the flexible display;
  • a material for preparing the protective layer is coated on the flexible display by a method of multiple melt extrusion, and after cooling, a protective layer is formed.
  • the material of the sacrificial layer is a-Si, or silicon dioxide, or silicon nitride, or indium tin oxide.
  • the step of illuminating the sacrificial layer with a laser to separate the substrate from the components of the flexible display comprises: absorbing the components of the flexible display with a vacuum adsorption robot and flipping the flexible display 180 degrees, then using the laser The sacrificial layer is illuminated to separate the various components of the flexible display from the substrate substrate.
  • the base substrate is a glass substrate.
  • the present invention also provides a flexible display manufactured by the method of any of the above.
  • FIGS. 1a-1d are schematic structural diagrams of a display corresponding to a process for manufacturing a flexible display according to an embodiment of the present invention.
  • Known attachment removal methods include: preparing a sacrificial layer on a glass substrate, and setting the flexible substrate On the sacrificial layer, the components of the flexible display are prepared on the flexible substrate. After the preparation, the flexible display and the sacrificial layer and the glass substrate are separated by a laser, and finally the protective film is pressed on the flexible substrate to form a flexible display.
  • the adhesive film adhered to the flexible display is usually pressed onto the flexible display by a coating machine, and the components in the flexible display are easily damaged during the pressing process, and bubbles are easily generated, which may result in a flexible display.
  • Pressure which causes damage to a component in a flexible display, affects the quality of the entire flexible display.
  • Embodiments of the present invention provide a method of manufacturing a flexible display, the method comprising:
  • Step S101 preparing a sacrificial layer on the substrate
  • Step S102 preparing a flexible substrate on the sacrificial layer
  • Step S103 preparing components of the flexible display on the flexible substrate
  • Step S104 irradiating the sacrificial layer with a laser to separate the substrate from the flexible substrate;
  • Step S105 coating the material for preparing the protective layer on the flexible substrate by a method of multiple melt extrusion, and forming a protective layer after cooling.
  • the protective layer is formed by a melt extrusion coating method, and the pressure on the inner parts of the flexible display is reduced as compared with the known pressure-sensitive protective film, thereby reducing the The components in the flexible display cause damage and avoid the generation of bubbles between the layers; in addition, the protective layer formed by the melt extrusion coating method is convenient for adjusting the thickness of the film layer.
  • the manufacturing method of the flexible display provided by the present invention can improve the production efficiency of the flexible display and the quality of the flexible display.
  • the thickness of the above protective layer can be controlled according to the number of layers applied, for example, the thickness of the protective layer is 10 to 150 ⁇ m.
  • the specific material of the sacrificial layer may be various as long as it is easy to remove, for example, the material of the sacrificial layer is a-Si (amorphous silicon), or silicon dioxide, or silicon nitride, or indium tin oxide.
  • the material of the sacrificial layer is a-Si (amorphous silicon), or silicon dioxide, or silicon nitride, or indium tin oxide.
  • the above step S104 includes: absorbing the components of the flexible display with a vacuum suction robot and inverting the flexible display by 180 degrees, and irradiating the sacrificial layer with a laser to separate the flexible substrate from the substrate. After flipping the flexible display 180 degrees, the components of the flexible display are located on the bottom layer, and the sacrificial layer is irradiated with laser light, and the sacrificial layer will be removed, so that the flexible substrate will be separated from the substrate.
  • step S105 is performed, the protective layer is coated on the flexible substrate.
  • the specific material of the above substrate may also be variously selected, for example, the substrate is a glass substrate.
  • FIG. 1a-1d are schematic structural diagrams of a flexible substrate in a method of manufacturing a flexible display according to an embodiment of the present invention.
  • a method for manufacturing a flexible display according to an embodiment of the present invention includes:
  • Step S201 preparing a sacrificial layer 2 on the substrate 1;
  • Step S202 preparing each component 3 of the flexible display on the sacrificial layer 2, as shown in FIG. 1a;
  • Step S203 irradiating the sacrificial layer 2 with a laser to separate the substrate 1 from the components 3 of the flexible display, as shown in FIG. 1b;
  • Step S204 The material for preparing the protective layer is coated on the flexible display by multiple melt extrusion, and after cooling, the protective layer 6 is formed, as shown in FIG. 1c.
  • the material from which the protective layer is prepared is first melted, and then the melted material is coated on the flexible display by the extrusion coating device 5.
  • the present embodiment eliminates the preparation process of the flexible substrate, and directly prepares the components 3 of the flexible display directly on the sacrificial layer 2, which can further save the preparation time of the flexible display, because the flexible substrate is in the preparation process. It is necessary to wait for the flexible substrate to solidify into a film. In addition, since the flexible substrate is yellow, it will be disadvantageous for preparing the components of the bottom-emitting flexible display.
  • the thickness of the above protective layer can be controlled according to the number of layers applied, for example, the protective layer 6 has a thickness of 10 to 150 ⁇ m.
  • the specific material of the above sacrificial layer may be various as long as it is easy to remove.
  • the material of the sacrificial layer is a-Si (amorphous silicon), or silicon dioxide, or silicon nitride, or indium tin oxide.
  • the above step S203 includes: absorbing the components 3 of the flexible display with the vacuum suction robot 4 and inverting the flexible display by 180 degrees, irradiating the sacrificial layer 2 with a laser to connect the components 3 of the flexible display with the flexible substrate. 1 separation.
  • the components 3 of the flexible display are located on the bottom layer, and the sacrificial layer is irradiated with laser light, and the sacrificial layer will be removed, so that the components 3 of the flexible display will be separated from the substrate.
  • the protective layer is coated on the side of the respective components 3 of the flexible display that is attached to the front of the sacrificial layer 2.
  • the specific material of the above-mentioned base substrate 1 may also be variously selected, for example, the base substrate is a glass substrate.
  • the embodiment of the invention provides a manufacturing method by using the manufacturing method of the first embodiment or the second embodiment.
  • the flexible display because of any of the above manufacturing methods, reduces the pressure on the components of the flexible display, thereby reducing damage to components in the flexible display and avoiding the generation of bubbles between the layers, so that the method is manufactured according to the above method.
  • Flexible displays have better quality.

Abstract

一种柔性显示器的制造方法和柔性显示器。该方法包括：在衬底基板上制备牺牲层；在牺牲层上制备柔性基板；在柔性基板上制备柔性显示器的各部件；用激光照射牺牲层以将衬底基板与柔性基板分离；采用多次熔融挤压的方法将制备保护层的材料涂布在柔性基板上，冷却后形成保护层。采用熔融挤压涂覆的方法形成保护层，减小了对柔性显示器内部件的压力，从而可以减小对柔性显示器内的部件造成伤害，避免膜层之间气泡的产生。

Description

柔性显示器的制造方法和柔性显示器 技术领域
本发明实施例涉及一种柔性显示器的制造方法和由通过该方法制造的柔性显示器。
背景技术
液晶显示器(LCD)技术在近十年有了飞速地发展，从屏幕的尺寸到显示的质量都取得了很大进步。由于柔性显示其本身特有的可弯曲的特点，决定了它会有很多特殊的用户体验。已知在制造柔性显示器时应用比较多的是贴覆取下法。
发明内容
根据本发明的第一方面，提供了一种柔性显示器的制造方法，包括：
在衬底基板上制备牺牲层；
在牺牲层上制备柔性基板；
在柔性基板上制备柔性显示器的各部件；
用激光照射牺牲层以将衬底基板与柔性基板分离；以及
采用多次熔融挤压的方法将制备保护层的材料涂布在所述柔性基板上，冷却后形成保护层。
在一个示例中，所述牺牲层的材料为a-Si、或二氧化硅、或氮化硅、或氧化铟锡。
在一个示例中，所述用激光照射牺牲层以将衬底基板与柔性基板分离的步骤包括：用真空吸附机械手吸附住柔性显示器的各部件并将柔性显示器翻转180°，然后用激光照射牺牲层以将柔性基板和衬底基板分离。
在一个示例中，所述衬底基板为玻璃基板。
根据本发明的第一方面，还提供了柔性显示器的另一种制造方法，包括：
在衬底基板上制备牺牲层；
在牺牲层上制备柔性显示器的各部件；
用激光照射牺牲层以将衬底基板与柔性显示器的各部件分离；以及
采用多次熔融挤压的方法将制备保护层的材料涂布在所述柔性显示器上，冷却后形成保护层。
在一个示例中，所述牺牲层的材料为a-Si、或二氧化硅、或氮化硅、或氧化铟锡。
在一个示例中，所述用激光照射牺牲层以将衬底基板与柔性显示器的各部件分离的步骤包括：用真空吸附机械手吸附住柔性显示器的各部件并将柔性显示器翻转180度，然后用激光照射牺牲层以将柔性显示器的各部件和衬底基板分离。
在一个示例中，所述衬底基板为玻璃基板。
本发明还提供了一种柔性显示器，所述柔性显示器采用上述任一项所述的方法制造而成。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1a～1d为本发明实施例提供的柔性显示器制造方法过程对应的显示器结构示意图。
附图标记：
1-衬底基板              2-牺牲层
3-柔性显示器的各部件    4-真空吸附手
5-挤压涂覆装置          6-保护层
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
已知的贴附取下方法包括：在玻璃基板上制备牺牲层，将柔性基板设置 在牺牲层上，再在柔性基板上制备柔性显示器的各部件，制备完后，再用激光将柔性显示器和牺牲层以及玻璃基板分离，最后在柔性基板上压覆保护膜以形成柔性显示器。
但是，在压覆保护膜时，通常采用涂覆机将粘有背胶的保护膜压覆到柔性显示器上，压覆过程中容易损坏柔性显示器内的部件并且容易产生气泡，会对柔性显示器产生压力，造成柔性显示器中某个部件的损坏，影响整个柔性显示器的质量。
实施例一
本发明实施例提供了一种柔性显示器的制造方法，该方法包括：
步骤S101：在衬底基板上制备牺牲层；
步骤S102：在牺牲层上制备柔性基板；
步骤S103：在柔性基板上制备柔性显示器的各部件；
步骤S104：用激光照射牺牲层以将衬底基板与柔性基板分离；
步骤S105：采用多次熔融挤压的方法将制备保护层的材料涂布在柔性基板上，冷却后形成保护层。
本发明提供的柔性显示器的制造方法中，采用熔融挤压涂覆的方法形成保护层，与已知的压覆保护膜相比，减小了对柔性显示器内部件的压力，从而可以减小对柔性显示器内的部件造成伤害，避免膜层之间气泡的产生；另外采用熔融挤压涂覆的方法形成的保护层，便于调整膜层的厚度。
所以，本发明提供的柔性显示器的制造方法，可以提高柔性显示器的生产效率，以及柔性显示器的质量。
上述保护层的厚度可以根据涂覆的层数来控制，例如保护层的厚度为10～150微米。
上述牺牲层的具体材料可以有多种，只要便于去除即可，例如牺牲层的材料为a-Si(无定型硅)、或二氧化硅、或氮化硅、或氧化铟锡。
在一个示例中，上述步骤S104包括：用真空吸附机械手吸附住柔性显示器的各部件并将柔性显示器翻转180度，用激光照射牺牲层以将柔性基板和衬底基板分离。将柔性显示器翻转180度后，柔性显示器的各部件便位于底层，用激光照射牺牲层，牺牲层将被去除，这样柔性基板将和衬底基板分离。执行步骤S105时，保护层被涂覆在柔性基板上。
上述衬底基板的具体材料也可以有多种选择，例如衬底基板为玻璃基板。
实施例二
图1a～1d为本发明实施例提供的柔性显示器制造方法中柔性基板的结构示意图。如图1a～1d所示，本发明实施例提供的柔性显示器的制造方法包括：
步骤S201：在衬底基板1上制备牺牲层2；
步骤S202：在牺牲层2上制备柔性显示器的各部件3，如图1a所示；
步骤S203：用激光照射牺牲层2以将衬底基板1与柔性显示器的各部件3分离，如图1b所示；
步骤S204：采用多次熔融挤压的方法将制备保护层的材料涂布在柔性显示器上，冷却后形成保护层6，如图1c所示。例如，先将制备保护层的材料熔解，再用挤压涂覆装置5将熔解的材料涂覆在柔性显示器上。
上述步骤完成后形成的柔性显示器如图1d所示。
本实施例与实施例一相比，省去了柔性基板的制备过程，直接在牺牲层2上制备柔性显示器的各部件3，可以进一步节省柔性显示器的制备时间，因为柔性基板在制备过程中，需要等待柔性基板固化成膜。另外，由于柔性基板为黄色，将不利于制备底发射的柔性显示器的各部件。
上述保护层的厚度可以根据涂覆的层数来控制，例如保护层6的厚度为10～150微米。
上述牺牲层的具体材料可以有多种，只要便于去除即可。例如，牺牲层的材料为a-Si(无定型硅)、或二氧化硅、或氮化硅、或氧化铟锡。
在一个示例中，上述步骤S203包括：用真空吸附机械手4吸附住柔性显示器的各部件3并将柔性显示器翻转180度，用激光照射牺牲层2以将柔性显示器的各部件3与柔衬底基板1分离。其中，将柔性显示器翻转180度后，柔性显示器的各部件3便位于底层，用激光照射牺牲层，牺牲层将被去除，这样柔性显示器的各部件3将和衬底基板分离。执行步骤S204时，保护层被涂覆在柔性显示器的各部件3的与牺牲层2之前贴合的一面上。
上述衬底基板1的具体材料也可以有多种选择，例如衬底基板为玻璃基板。
实施例三
本发明实施例提供了一种采用上述实施例一或二中的制造方法制造而成 的柔性显示器，由于上述任一制造方法，减小了对柔性显示器内部件的压力，从而可以减小对柔性显示器内的部件造成伤害，避免膜层之间气泡的产生，所以根据上述方法制造的柔性显示器具有较好的质量。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请基于并且要求于2014年8月21日递交的中国专利申请第201410415163.6号的优先权，在此全文引用上述中国专利申请公开的内容。

Claims (11)

  1. 一种柔性显示器制造方法，包括：
    在衬底基板上制备牺牲层；
    在牺牲层上制备柔性基板；
    在柔性基板上制备柔性显示器的各部件；
    用激光照射牺牲层以将衬底基板与柔性基板分离；以及
    采用多次熔融挤压的方法将制备保护层的材料涂布在所述柔性基板上，冷却后形成保护层。
  2. 如权利要求1所述的方法，其中所述牺牲层的材料为a-Si、或二氧化硅、或氮化硅、或氧化铟锡。
  3. 如权利要求2所述的方法，其中所述牺牲层的材料为氧化铟锡。
  4. 如权利要求1所述的方法，所述用激光照射牺牲层以将衬底基板与柔性基板分离的步骤，包括：用真空吸附机械手吸附住柔性显示器的各部件并将柔性显示器翻转180度，然后用激光照射牺牲层以将柔性基板和衬底基板分离。
  5. 如权利要求1～4任一项所述的方法，其中所述衬底基板为玻璃基板。
  6. 一种柔性显示器制造方法，包括：
    在衬底基板上制备牺牲层；
    在牺牲层上制备柔性显示器的各部件；
    用激光照射牺牲层以将衬底基板与柔性显示器的各部件分离；
    采用多次熔融挤压的方法将制备保护层的材料涂布在所述柔性显示器上，冷却后形成保护层。
  7. 如权利要求6所述的方法，其中所述牺牲层的材料为a-Si、或二氧化硅、或氮化硅、或氧化铟锡。
  8. 如权利要求7所述的方法，其中所述牺牲层的材料为氧化铟锡。
  9. 如权利要求6所述的方法，其中所述用激光照射牺牲层以将衬底基板与柔性显示器的各部件分离的步骤包括：用真空吸附机械手吸附住柔性显示器的各部件并将柔性显示器翻转180度，然后用激光照射牺牲层以将柔性显示器的各部件和衬底基板分离。
  10. 如权利要求6～9任一项所述的方法，其中所述衬底基板为玻璃基板。
  11. 一种柔性显示器，其中所述柔性显示器采用如权利1～5或6～10任一项所述的方法制造而成。
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