WO2016017205A1 - 超電導線材 - Google Patents
超電導線材 Download PDFInfo
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- WO2016017205A1 WO2016017205A1 PCT/JP2015/057645 JP2015057645W WO2016017205A1 WO 2016017205 A1 WO2016017205 A1 WO 2016017205A1 JP 2015057645 W JP2015057645 W JP 2015057645W WO 2016017205 A1 WO2016017205 A1 WO 2016017205A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
- H01B12/06—Films or wires on bases or cores
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F6/00—Superconducting magnets; Superconducting coils
- H01F6/06—Coils, e.g. winding, insulating, terminating or casing arrangements therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Definitions
- Such an oxide superconducting wire generally has an intermediate layer formed on an oriented metal substrate, an oxide superconducting material layer formed on the intermediate layer, and silver (Ag) or copper (Cu ) Stabilization layer (see, for example, JP-A-2013-12406 (Patent Document 1)).
- FIG. 5 is a schematic cross-sectional view for illustrating the method for manufacturing the superconducting wire according to Embodiment 1.
- FIG. It is a figure which shows typically the structure of the slitter used for a thin wire
- FIG. 10 is a flowchart showing another example of a method for manufacturing a superconducting wire according to Embodiment 3. It is a cross-sectional schematic diagram which shows the structure of the board
- the superconducting material layer is preferably provided so as to cover the entire side surface of the substrate in at least part of the direction in which the superconducting wire extends.
- the substrate 1 has a first main surface 1a and a second main surface 1b. Second main surface 1b is located on the side opposite to first main surface 1a.
- the substrate 1 further includes a first side surface 1c and a second side surface 1d facing the first side surface 1c.
- the substrate 1 is preferably made of, for example, metal and has a long shape (tape shape) having a rectangular cross section. In order to wind around a coil, it is preferable that the board
- substrate 1 is lengthened to about 2 km.
- these materials have extremely low reactivity with the superconducting material layer 5 and do not deteriorate the superconducting characteristics of the superconducting material layer 5 even at the interface in contact with the superconducting material layer 5.
- the difference in orientation between the substrate 1 having crystal orientation on the surface and the superconducting material layer 5 is relaxed, and the superconducting material layer 5 is formed at a high temperature. At this time, it is possible to prevent metal atoms from flowing out from the substrate 1 to the superconducting material layer 5.
- middle layer 3 is not specifically limited to this.
- the intermediate layer 3 may be composed of a plurality of layers.
- each layer constituting the intermediate layer 3 may be composed of a different material or a part of the same material.
- FIG. 9 is a schematic diagram for explaining the mechanical slit processing using the slitter 30 shown in FIG.
- the right side of FIG. 9 shows the configuration of the stacked body 20 that is slit by the slitter 30.
- the laminate 20 is configured by laminating the intermediate layer 3, the superconducting material layer 5, and the protective layer 7 in this order on the substrate 1.
- the first main surface 1a of the substrate 1 has a curved portion, so that the first main surface 1a is compared with the substrate 1 in which the first main surface 1a is flat.
- the surface area can be increased.
- middle layer 3 and the superconducting material layer 5 is formed so that the whole region of the 1st main surface 1a which has a curved-surface part may be formed, the junction area in the interface of the board
- the curved portion may be formed over the entire area of the first main surface 1a or may be partially formed on the first main surface 1a.
- the curved portion may have a convex shape on the intermediate layer 3 side or a concave shape on the second main surface 1b side.
- FIG. 19 is a flowchart showing a method of manufacturing a superconducting wire according to the fourth embodiment.
- a substrate preparation step S10 is performed. Specifically, a substrate 1 made of an oriented metal substrate and having a tape shape with a desired width (for example, 4 mm width) is prepared. As shown in FIG. 18, the substrate 1 includes a first main surface 1a, a second main surface 1b located on the opposite side of the first main surface 1a, a first side surface 1c, And a second side surface 1d facing the side surface 1c.
- FIG. 20 is a schematic cross-sectional view showing the configuration of the superconducting wire according to Embodiment 5 of the present invention.
- FIG. 20 shows a cross section cut in a direction crossing the extending direction of the superconducting wire according to the fifth embodiment.
- the configuration in which the intermediate layer and the superconducting material layer cover at least a part of the side surface of the substrate can improve the orientation of the superconducting material layer also on the side surface of the substrate, and can prevent the intermediate layer from peeling off. It is preferable in terms.
- the superconducting wire according to the second embodiment can be manufactured by the same manufacturing method as the superconducting wire according to the fourth embodiment. That is, by forming an intermediate layer, a superconducting material layer, and a stabilizing layer in this order on one main surface of a substrate having a tape shape with a desired width, the intermediate layer and the superconducting material layer cover the entire side surface of the substrate. And a stabilizing layer can be formed.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
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- Physical Vapour Deposition (AREA)
Abstract
Description
最初に本発明の実施態様を列記して説明する。
以下、本発明の実施の形態について図に基づいて説明する。なお、以下の図面において、同一または相当する部分には同一の参照番号を付し、その説明は繰り返さない。
(超電導線材の構成)
図1は、本発明の実施の形態1に係る超電導線材の構成を示す断面模式図である。図1は、実施の形態1に係る超電導線材10の延在する方向に交差する方向に切断した断面を示している。このため、紙面に交差する方向が超電導線材の長手方向であり、超電導材料層5の超電導電流は紙面に交差する方向に沿って流れるものとする。また、図1および以降の断面模式図においては、図を見やすくするために矩形状の断面における上下方向(以下、「厚み方向」とも称する)と左右方向(以下、「幅方向」とも称する)との長さの差を小さくしているが、実際は当該断面の厚み方向の長さは幅方向の長さに比べて十分に小さい。
次に、図3~図8を参照して、実施の形態1に係る超電導線材の製造方法について説明する。以下では、30mm幅に作製された積層体20から4mm幅に細線加工された積層体20を用いて超電導線材10を製造する方法を例に挙げ、本実施の形態を具体的に説明する。
図13は、本発明の実施の形態2に係る超電導線材の構成を示す断面模式図である。図13は、実施の形態2に係る超電導線材10の延在する方向に交差する方向に切断した断面を示している。
図14は、本発明の実施の形態3に係る超電導線材の構成を示す断面模式図である。図14は、実施の形態3に係る超電導線材の延在する方向に交差する方向に切断した断面を示している。
図18は、本発明の実施の形態4に係る超電導線材の構成を示す断面模式図である。図18は、実施の形態4に係る超電導線材の延在する方向に交差する方向に切断した断面を示している。
図20は、本発明の実施の形態5に係る超電導線材の構成を示す断面模式図である。図20は、実施の形態5に係る超電導線材の延在する方向に交差する方向に切断した断面を示している。
Claims (8)
- 超電導線材であって、
第1の主面と、前記第1の主面と反対側の第2の主面とを有する基板と、
前記基板の前記第1の主面上に配置された超電導材料層とを備え、
前記超電導材料層は、前記基板の幅方向における前記基板の側面の少なくとも一部を覆うように設けられる、超電導線材。 - 前記超電導線材が延在する方向の少なくとも一部において、前記超電導材料層は、前記基板の前記側面の全部を覆うように設けられる、請求項1に記載の超電導線材。
- 前記超電導線材が延在する方向の少なくとも一部において、前記超電導材料層は、前記基板の前記側面上部から前記第2の主面の少なくとも一部上にまで延びるように形成される、請求項1または請求項2に記載の超電導線材。
- 前記基板の前記第1の主面は、曲面状の部分を含む、請求項1から請求項3のいずれか1項に記載の超電導線材。
- 前記曲面状の部分は、前記基板の前記第1の主面において前記基板の幅方向における端部に位置する、請求項4に記載の超電導線材。
- 前記基板の前記側面上部に位置する前記超電導材料層の厚みは、0.5μm以上5μm以下である、請求項1から請求項5のいずれか1項に記載の超電導線材。
- 前記基板の前記第1の主面と前記超電導材料層との間に配置された中間層をさらに備え、
前記中間層は、前記基板の前記側面の少なくとも一部を覆うように設けられる、請求項1から請求項6のいずれか1項に記載の超電導線材。 - 前記超電導材料層は、酸化物超電導材料からなる、請求項1から請求項7のいずれか1項に記載の超電導線材。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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DE112015003518.4T DE112015003518B4 (de) | 2014-07-31 | 2015-03-16 | Supraleitender Draht |
CN201580039086.1A CN106537523B (zh) | 2014-07-31 | 2015-03-16 | 超导线材 |
US15/320,923 US10497494B2 (en) | 2014-07-31 | 2015-03-16 | Superconducting wire |
KR1020177005486A KR102288552B1 (ko) | 2014-07-31 | 2015-03-16 | 초전도 선재 |
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JP2014156615A JP6256244B2 (ja) | 2014-07-31 | 2014-07-31 | 超電導線材 |
JP2014-156615 | 2014-07-31 |
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WO2016017205A1 true WO2016017205A1 (ja) | 2016-02-04 |
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US (1) | US10497494B2 (ja) |
JP (1) | JP6256244B2 (ja) |
KR (1) | KR102288552B1 (ja) |
CN (1) | CN106537523B (ja) |
DE (1) | DE112015003518B4 (ja) |
WO (1) | WO2016017205A1 (ja) |
Cited By (1)
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CN110392915A (zh) * | 2017-03-07 | 2019-10-29 | 住友电气工业株式会社 | 超导线材、超导线圈和超导电缆导体 |
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JP6225851B2 (ja) | 2014-07-31 | 2017-11-08 | 住友電気工業株式会社 | 超電導線材 |
KR102315482B1 (ko) * | 2015-11-11 | 2021-10-20 | 스미토모 덴키 고교 가부시키가이샤 | 초전도 선재 |
JP6721100B2 (ja) * | 2017-02-14 | 2020-07-08 | 住友電気工業株式会社 | 超電導線材及び超電導コイル |
TWI767129B (zh) * | 2018-07-11 | 2022-06-11 | 台虹科技股份有限公司 | 複合材料 |
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JP4055489B2 (ja) | 2002-06-26 | 2008-03-05 | 住友電気工業株式会社 | 超電導薄膜線材の製造方法 |
US20040023810A1 (en) | 2002-07-26 | 2004-02-05 | Alex Ignatiev | Superconductor material on a tape substrate |
JP2012014883A (ja) * | 2010-06-30 | 2012-01-19 | Railway Technical Research Institute | 高温超電導線材およびそれを用いた高温超電導コイル |
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- 2015-03-16 US US15/320,923 patent/US10497494B2/en active Active
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KR102288552B1 (ko) | 2021-08-10 |
US10497494B2 (en) | 2019-12-03 |
US20170140852A1 (en) | 2017-05-18 |
CN106537523B (zh) | 2018-06-12 |
CN106537523A (zh) | 2017-03-22 |
JP6256244B2 (ja) | 2018-01-10 |
DE112015003518B4 (de) | 2024-03-28 |
JP2016033882A (ja) | 2016-03-10 |
KR20170038031A (ko) | 2017-04-05 |
DE112015003518T5 (de) | 2017-04-27 |
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