WO2015188402A1 - 掩膜板以及紫外线掩膜板、阵列基板的制造方法 - Google Patents

掩膜板以及紫外线掩膜板、阵列基板的制造方法 Download PDF

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Publication number
WO2015188402A1
WO2015188402A1 PCT/CN2014/080822 CN2014080822W WO2015188402A1 WO 2015188402 A1 WO2015188402 A1 WO 2015188402A1 CN 2014080822 W CN2014080822 W CN 2014080822W WO 2015188402 A1 WO2015188402 A1 WO 2015188402A1
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Prior art keywords
mask
region
layer pattern
semi
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2014/080822
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English (en)
French (fr)
Inventor
徐向阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US14/416,784 priority Critical patent/US9329445B2/en
Publication of WO2015188402A1 publication Critical patent/WO2015188402A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76—Patterning of masks by imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/71—Etching of wafers, substrates or parts of devices using masks for conductive or resistive materials
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
    • G02F1/136236—Active matrix addressed cells for reducing the number of lithographic steps using a grey or half tone lithographic process
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G02F1/136295—Materials; Compositions; Manufacture processes

Definitions

  • the present invention relates to the field of display technology, and in particular to a mask and an ultraviolet mask, and a method of fabricating the array substrate. Background technique
  • liquid crystal displays have become the most common flat panel display devices.
  • the liquid crystal forming process is an important step in the manufacture of liquid crystal displays.
  • the array substrate and the color filter substrate are paired, and the sealant between the array substrate and the color filter substrate is irradiated with ultraviolet rays to cure the sealant.
  • the thin film transistor (TFT) on the array substrate is irradiated with ultraviolet rays, the electrical properties are affected. Therefore, when the frame glue is irradiated with ultraviolet rays, the ultraviolet shielding mask is used to block the TFT and the like, and only the frame rubber is exposed.
  • the existing Ziwei line mask includes a glass substrate, and a metal shielding layer formed on the glass substrate, which is also formed by a patterning process using a mask. Since the ultraviolet mask can be repeatedly used, the use rate of the mask for manufacturing the ultraviolet mask is very low. Therefore, in the prior art, the manufacturing cost of the ultraviolet mask is relatively high. Summary of the invention
  • An object of the present invention is to provide a mask, a purple ray mask, and a method of manufacturing an array substrate to reduce the manufacturing cost of the ultraviolet mask.
  • the invention provides a mask comprising a fully transparent region, a semi-transmissive region and an opaque region;
  • the fully transparent region corresponds to a sealant region of the liquid crystal panel
  • the opaque region corresponds to a layer map of the liquid crystal panel
  • the remaining area of the mask is the semi-transmissive area.
  • the semi-transmissive region has a light transmittance of between 1/2 and 1/2.
  • the layer pattern is a «polar metal layer pattern
  • the source/drain metal layer pattern and the transparent electrode layer pattern of the liquid crystal panel correspond to the semi-transmissive region.
  • the layer pattern is a source drain metal layer pattern
  • the gate metal layer pattern and the transparent electrode layer pattern of the liquid crystal panel correspond to the semi-transmissive region.
  • the layer pattern is a transparent electrode layer pattern
  • the gate metal layer pattern and the source/drain metal layer pattern of the liquid crystal panel correspond to the semi-transmissive region.
  • the invention also provides a method for manufacturing an ultraviolet mask, comprising:
  • the mask is coated with the first light intensity to expose the photoresist
  • the remaining photoresist is removed.
  • the present invention also provides a method of fabricating an array substrate, comprising: forming a layer of material to be etched on a substrate;
  • the remaining photoresist is removed.
  • the material layer to be etched is a metal layer
  • the layer pattern is a gate metal layer pattern or a source/drain metal layer pattern.
  • the material layer to be etched is a transparent electrode layer -
  • the layer pattern is a transparent electrode layer pattern.
  • the all-transmission region corresponds to the sealant region of the liquid crystal panel, that is, the region other than the metal shielding layer on the ultraviolet mask
  • the semi-transmissive region The area corresponding to the opaque area corresponds to the area of the metal occlusion layer on the ultraviolet ray mask.
  • the mask plate is used for manufacturing an ultraviolet mask, and the photoresist can be exposed by using a lower first light intensity, so that the photoresist in the completely transparent region is completely removed, and the photoresist portion in the semi-transmissive region is partially removed.
  • the photoresist in the opaque region is retained and then etched to form an ultraviolet mask.
  • the opaque region corresponds to the layer pattern region of the liquid crystal panel.
  • the photoresist can be exposed with a higher second light intensity to make the fully transparent region and the semi-transparent light.
  • the photoresist in the region is completely removed, the photoresist in the opaque region is retained, and then the corresponding layer pattern on the array substrate is formed by etching.
  • the mask provided by the present invention can be used for manufacturing an ultraviolet mask or an array substrate, thereby realizing the sharing of a mask in the manufacture of the ultraviolet mask and the array substrate without It is necessary to separately provide a mask for manufacturing an ultraviolet mask, thereby reducing the manufacturing cost of the ultraviolet mask.
  • Other features and advantages of the invention will be set forth in part in the description which follows. The objectives and other advantages of the invention may be realized and obtained by the structure of the invention.
  • Embodiment 1 is a schematic view of a mask provided in Embodiment 1 of the present invention.
  • FIGS. 3a to 3d are schematic views showing a manufacturing process of the array substrate provided by the embodiment of the present invention.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • an embodiment of the present invention provides a mask 1 including a fully transparent region I I , a semi-transmissive region 12 and an opaque region 13 .
  • the fully transparent region ⁇ corresponds to the sealant region of the liquid crystal panel
  • the opaque region 13 corresponds to the layer pattern region of the liquid crystal panel
  • the remaining region of the mask panel is the semi-transmissive region 12.
  • the mask provided by the embodiment of the invention can be used for manufacturing an ultraviolet mask or an array substrate, and can realize a mask in the piercing of the ultraviolet mask and the array substrate without It is necessary to separately provide a mask for manufacturing an ultraviolet mask, thereby reducing the manufacturing cost of the ultraviolet mask.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • the embodiment of the invention provides a method for manufacturing an ultraviolet mask, in which the mask in the first embodiment is used. As shown in Figures 2a to 2d, the manufacturing method includes:
  • a metal layer 3 is formed on the base substrate 2.
  • a metal layer 3 may be deposited on the substrate 2 of the glass substrate by a conventional deposition process.
  • a layer of photoresist 4 may be coated on the metal layer 3 by a conventional coating process.
  • the semi-transmissive region of the mask 1 has a light transmittance of between 1/2 and 2/3.
  • the photoresist 4 is exposed at a lower first light intensity by using the mask 1 so that the photoresist 4 of the semi-transmissive region 12 can be not completely removed in the subsequent step S14.
  • the photoresist 4 that has been exposed can be removed by an ashing process.
  • the photoresist 4 of the fully transparent region 1 is completely removed; since the lower first light intensity is used for exposure in step S13, only the photoresist 4 of the semi-transmissive region 12 is partially removed; The photoresist 4 of the light-transmitting region 13 is completely retained.
  • the metal layer 3 is etched as shown in Fig. 2c.
  • the metal layer 3 is wet etched. Since the photoresist 4 of the semi-transmissive region 12 and the opaque region 13 is also covered on the metal layer 3, only the gold of the fully transparent region 1 (corresponding to the sealant region of the liquid crystal panel) The genus layer 3 is etched away, and the semi-transmissive region 12 and the metal layer 3 of the opaque region 13 are retained to form the metal occlusion layer 30 on the ultraviolet ray mask.
  • Embodiment 3 The embodiment of the invention provides a method for manufacturing an array substrate, wherein the mask plate of the first embodiment is used.
  • the opaque region of the mask corresponds to a layer pattern region of the liquid crystal panel, and the layer pattern may be a gate metal layer pattern, a source/drain metal layer pattern or a transparent electrode layer pattern.
  • the layer pattern is a gate metal layer pattern, that is, the anode metal layer pattern of the array substrate is formed by using the mask, and the source/drain metal layer pattern and the transparent electrode layer pattern of the liquid crystal panel correspond to each other in a semi-transparent manner. Within the light area.
  • the manufacturing method includes:
  • a material layer to be etched is formed on the base substrate 2. Since the present embodiment is to form the gate metal layer pattern by using the mask in the first embodiment, the material layer to be etched in this embodiment is the gate metal layer 5. In this step, a deposition metal layer 5 is deposited on the base substrate 2 by a deposition process.
  • a layer of photoresist 4 is coated on the anode metal layer 5.
  • a layer of photoresist 4 may be coated on the gate metal layer 5 by a conventional coating process.
  • the mask 4 is used to expose the photoresist 4 with a higher second light intensity.
  • the second illumination intensity should be at least a times the first illumination intensity, and a is the reciprocal of the transmittance of the semi-transmissive region 12.
  • the light transmittance of the semi-transmissive region 2 is 1/2, and the second light intensity is at least twice the first light intensity.
  • the light transmittance of the semi-transmissive region 12 is 2/3, and the second light intensity is at least 1.5 times the first light intensity.
  • step S24 As shown in FIG. 3b, the photoresist 4 corresponding to the all-transmissive region 11 and the semi-transmissive region 12 of the mask 1 is removed. Specifically, the photoresist 4 that has been exposed can be removed by an ashing process. Since the exposure is performed with a higher second light intensity in step S23, the photoresist 4 of the fully transparent region 11 and the semi-transmissive region 12 is completely removed; the photoresist 4 of the opaque region 13 is completely removed. Reserved.
  • the gate metal layer 5 can be wet-etched. Since the photoresist 4 of the all-transmissive region 11 and the semi-transmissive region 12 is completely removed, and only the photoresist 4 of the opaque region 13 is retained, after the gate metal layer 5 is etched, Only the gate metal layer 5 of the opaque region 13 (corresponding to the pattern of the gate metal layer) is retained.
  • the manufacturing method of the array substrate further includes forming a subsequent step of forming an insulating layer, an active layer, a source/drain metal layer pattern, a pixel electrode, a passivation layer, etc., and may be performed in any conventional manner, and in a subsequent step.
  • the mask provided in the first embodiment is generally not used again, and thus will not be described in detail in this embodiment.
  • the opaque regions of the reticle may also correspond to other layer patterns of the array substrate.
  • the opaque region may correspond to the source/drain metal layer pattern of the array substrate, and the polar metal layer pattern and the transparent electrode layer pattern of the liquid crystal slab (array substrate) correspond to the semi-transmissive region, then step S21
  • the layer of material to be engraved is a source-drain metal layer.
  • the opaque region may also correspond to the transparent electrode layer pattern of the array substrate, and the »electrode metal layer pattern and the source/drain metal layer pattern of the liquid crystal panel (array substrate) correspond to the semi-transmissive region, then step S21
  • the layer of material to be etched is a transparent electrode layer.
  • the mask provided by the embodiment of the present invention can be used for manufacturing an ultraviolet mask or an array substrate, and can share a mask in the manufacture of the ultraviolet mask and the array substrate.
  • the diaphragm is not required to be separately provided with a mask for manufacturing an ultraviolet mask, thereby reducing the manufacturing cost of the ultraviolet mask.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)

Abstract

一种掩膜板（1）以及紫外线掩膜板、阵列基板的制造方法，属于显示技术领域，能够降低紫外线掩膜板的制造成本。该掩膜板（1），包括全透光区域（11）、半透光区域（12）和不透光区域（13）；所述全透光区域（11）对应于液晶面板的框胶区域，所述不透光区域（13）对应液晶面板的图层图案区域，所述掩膜板（1）的其余区域为所述半透光区域（12）。上述掩膜板可用于液晶电视、液晶显示器、手机、平板电脑等显示装置的制造，并可节约掩膜成本。

Description

阵難板的纖雄 本申请要求享有 2014年 6月 10日提交的名称为 "掩膜板以及紫外线掩膜板、阵列基 板的制造方法" 的中国专利申请 CN201410255565.4的优先权， 其全部内容通过引用并入 本文中。 技术领域
本发明涉及显示技术领域， 具体地说， 涉及一种掩膜板以及紫外线掩膜板、 阵列基板 的制造方法。 背景技术
随着显示技术的发展， 液晶显示器已经成为最为常见的平板显示装置。
在液晶显示器的制造过程中， 液晶成盒工艺是一项重要步骤。在液晶成盒工艺中， 将 阵列基板和彩膜基板进行对盒,还要对位于阵列基板和彩膜基板之间的框胶进行紫外线照 射， 使框胶固化。 阵列基板上的薄膜晶体管 （TFT) 被紫外线照射后， 电性能会受影响， 所以对框胶进行紫外线照射时， 要利用紫外线掩膜板遮挡住 TFT等部分， 而只将框胶暴 露在外。
现有的紫夕卜线掩膜板包括玻璃基板， 以及形成在玻璃基板上的金属遮挡层， 也是利用 掩膜板通过构图工艺制成的。因为紫外线掩膜板可以反复使] 所以用于制造紫外线掩膜 板的掩膜板的使用率非常低。 因此， 现有技术中， 紫外线掩膜板的制造成本相对较高。 发明内容
本发明的目的在于提供一种掩膜板以及紫夕卜线掩膜板、阵列基板的制造方法， 以降低 紫外线掩膜板的制造成本。
本发明提供一种掩膜板， 包括全透光区域、 半透光区域和不透光区域；
所述全透光区域对应于液晶面板的框胶区域，所述不透光区域对应液晶面板的图层图 案区域， 所述掩膜板的其余区域为所述半透光区域。
优选的， 所述半透光区域的透光率在 1/2至 之间。
其中， 所述图层图案为«极金属层图案；
所述液晶面板的源漏极金属层图案和透明电极层图案对应在所述半透光区域之内。 或者， 所述图层图案为源漏极金属层图案；
所述液晶面板的栅极金属层图案和透明电极层图案对应在所述半透光区域之内。 或者， 所述图层图案为透明电极层图案；
所述液晶面板的栅极金属层图案和源漏极金属层图案对应在所述半透光区域之内。 本发明还提供一种紫外线掩膜板的制造方法， 包括：
在衬底基板上形成金属层；
在所述金属层上涂覆一层光刻胶；
利^上述的掩膜板， 以第一光照强度对所述光刻胶进行曝光；
去除对应于所述掩膜板的全透光区域的光刻胶；
对所述金属层进行刻蚀；
去除剩余的光刻胶。
本发明还提供一种阵列基板的制造方法， 包括- 在衬底基板上形成待刻蚀材料层；
在所述待刻蚀材料层上涂覆一层光刻胶- 利^上述的掩膜板， 以第二光照强度对所述光刻胶进行曝光；
去除对应于所述掩膜板的全透光区域和半透光区域的光刻胶；
对所述待刻蚀材料层进行刻蚀， 形成图层图案；
去除剩余的光刻胶。
优选的， 所述待刻蚀材料层为金属层；
所述图层图案为機极金属层图案或源漏极金属层图案。
或者， 所述待刻蚀材料层为透明电极层- 所述图层图案为透明电极层图案。
本发明带来了以下有益效果：本发明提供的掩膜板中，全透光区域对应于液晶面板的 框胶区域， 即紫外线掩膜板上的金属遮挡层以外的区域，而半透光区域和不透光区域共同 对应于紫外线掩膜板上的金属遮档层的区域。该掩膜板^于制造紫外线掩膜板 、可以利 用较低的第一光照强度对光刻胶进行曝光，使全透光区域的光刻胶完全去除，半透光区域 的光刻胶部分去除， 不透光区域的光刻胶保留， 再经过刻蚀即可形成紫外线掩膜板。
另一方面， 本发明提供的掩膜板中， 不透光区域对应液晶面板的图层图案区域。 该掩 膜板用于制造阵列基板上的相应图层图案（例如栅极金属层图案）时， 可以利用较高的第 二光照强度对光刻胶进行曝光，使全透光区域和半透光区域的光刻胶完全去除，不透光区 域的光刻胶保留， 再经过刻蚀即 形成阵列基板上的相应图层图案。
因此,本发明提供的掩膜板既可以用于制造紫外线掩膜板，又可以用于制造阵列基板.， 实现了在紫外线掩膜板及阵列基板的制造中能够共用一个掩膜板，而不需要单独配备用于 制造紫外线掩膜板的掩膜板， 从而降低了紫外线掩膜板的制造成本。 本发明的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显 而易见， 或者通过实施本发明而了解。本发明的目的和其他优点可通过在说明书、权利要 求书以及 W图中所特别指出的结构来实现和获得。 附图说明
为了更清楚地说明本发明实施 ί到中的技术方案，下面将对实施例描述中所需要的 W图 做简单的介绍：
图 1是本发明实施例一提供的掩膜板的示意图；
图 2a至图 2d是本发明实施例二提供的紫外线掩膜板的制造过程的示意图； 图 3a至图 3d是本发明实施例≡提供的阵列基板的制造过程的示意图。 具体实肺式
以下将结合附图及实施例来详细说明本发明的实施方式,借此对本发明如何应 ^技术 手段来解决技术问题，并达成技术效果的实现过程能充分理解并据以实施。需要说明的是， 只要不构成冲突，本发明中的各个实施例以及各实施例中的各个特征可以相互结合，所形 成的技术方案均在本发明的保护范围之内。
实施例一：
如图〗所示， 本发明实施例提供一种掩膜板 1， 包括全透光区域 I I、 半透光区域 12 和不透光区域 13。 全透光区域 Π对应于液晶面板的框胶区域， 不透光区域 13对应液晶 面板的图层图案区域， 掩膜板〗的其余区域为半透光区域 12。
本发明实施例提供的掩膜板既可以用于制造紫外线掩膜板， 又可以用于制造阵列基 板，实现了在紫外线掩膜板及阵列基板的刺造中能够共用一个掩膜板，而不需要单独配备 用于制造紫外线掩膜板的掩膜板， 从而降低了紫外线掩膜板的制造成本。
实施例二：
本发明实施例提供一种紫外线掩膜板的制造方法， 其中使用了实施例一中的掩膜板。 如图 2a至图 2d所示， 该制造方法包括：
S11 : 在衬底基板 2上形成金属层 3。
具体的， 可以利用常规的沉积工艺， 在玻璃村料的衬底基板 2上沉积一层金属层 3。
S12: 在金属层 3上涂覆一层光刻胶 4。
具体的， 可以利用常规的涂覆工艺， 在金属层 3上涂覆一层光刻胶 4。
S13 : 如图 2a所示， 利用实施 ί到一中的掩膜板 1 , 以第一光照强度对光刻胶 4进行曝 光。
作为一个优选方案， 掩膜板 1的半透光区域的透光率在 1/2至 2/3之间。 利用掩膜板 1 , 以较低的第一光照强度对光刻胶 4进行曝光，使半透光区域 12的光刻胶 4能够在后续 步骤 S 14中不被完全去除。
814： 如图 2b所示， 去除对应于掩膜板 1的全透光区域 1的光刻胶 4。
具体的， 可以利用灰化工艺去除已被曝光的光刻胶 4。 其中， 全透光区域】 1 的光刻 胶 4完全被去除； 因为步骤 S13 中采用了较低的第一光照强度进行曝光， 所以半透光区 域 12的光刻胶 4只有部分被去除； 不透光区域 13的光刻胶 4完全被保留。
815： 如图 2c所示， 对金属层 3进行刻蚀。
具体的， 以对金属层 3进行湿法刻蚀。因为半透光区域 12和不透光区域 13的光刻 胶 4还覆盖在金属层 3上， 所以只有全透光区域 1 (对应于液晶面板的框胶区域） 的金 属层 3被刻蚀掉，而半透光区 12域和不透光区域 13的金属层 3被保留，形成紫外线掩膜 板上的金属遮挡层 30。
S16: 如图 2d所示， 去除剩余的光刻胶 4。 利用湿法剥离工艺去除半透光区域 12和不透光区域 13剩余的光刻胶 4， 即可制成紫 外线掩膜板。
实施例三:： 本发明实施例提供一种阵列基板的制造方法，其中使用了实施例一中的掩膜板。该掩 膜板的不透光区域对应液晶面板的图层图案区域， 图层图案可以为栅极金属层图案、源漏 极金属层图案或透明电极层图案。本实施例中， 图层图案为栅极金属层图案， 即利用该掩 膜板形成阵列基板的楊极金属层图案,而液晶面板的源漏极金属层图案和透明电极层图案 对应在半透光区域之内。
如图 3a至图 3d所示， 该制造方法包括：
821： 在衬底基板 2上形成待刻蚀材料层。 因为本实施例是利用实施例一中的掩膜板〗形成栅极金属层图案，所以本实施例中的 待刻蚀材料层为栅极金属层 5。本歩骤中可利用沉积工艺， 在衬底基板 2上沉积一层概极 金属层 5。
822： 在楊极金属层 5上涂覆一层光刻胶 4。
具体的， 可以利用常规的涂覆工艺， 在栅极金属层 5上涂覆一层光刻胶 4。
S23 : 如图 33所示， 利用实施例一中的掩膜板 1， 以第二光照强度对光刻胶 4进行曝 光。
具体的， 利用该掩膜板 1 , 以较高的第二光照强度对光刻胶 4进行曝光。 为使半透光 区域 12的光刻胶 4能够在后续步骤 S24中被完全去除， 第二光照强度应当至少为第一光 照强度的 a倍， a为半透光区域 12的透光率的倒数。例如，半透光区域 2的透光率为 1/2 , 则第二光照强度至少为第一光照强度的 2倍。 又如， 半透光区域 12的透光率为 2/3， 则 第二光照强度至少为第一光照强度的 1.5倍。
S24: 如图 3b所示， 去除对应于掩膜板 1的全透光区域 11和半透光区域 12的光刻 胶 4。 具体的， 可以利用灰化工艺去除已被曝光的光刻胶 4。 因为步骤 S23中采用了较高的 第二光照强度进行曝光， 所以全透光区域 11和半透光区域 12的光刻胶 4都被完全去除； 不透光区域 13的光刻胶 4被完全保留。
S25 : 如图 3c所示， 对機极金属层 5进行刻蚀， 形成栅极金属层图案。
具体的， 可以对栅极金属层 5进行湿法刻饨。 因为全透光区域 11 和半透光区域 12 的光刻胶 4都被完全去除了， 而只有不透光区域 13的光刻胶 4被保留， 所以对搠极金属 层 5进行刻饨之后， 只有不透光区域 13 (对应于機极金属层图案） 的栅极金属层 5被保 留。
S26: 如图 3d所示， 去除剩余的光刻胶 4。
利 ^湿法剥离工艺去除不透光区域 13的光刻胶 4, 即可在衬底基板 2上形成包括栅 线 51、 公共电极线 52的楊极金属层图案。 此外， 阵列基板的制造方法还包括形成 »绝缘层、 有源层、 源漏极金属层图案、 像素 电极、钝化层等后续步骤， 均可采用任意的常规方式进行， 并旦在后续步骤中通常不会再 使用实施例一提供的掩膜板， 因此本实施例中不再详细描述。
在其他实施方式中，掩膜板的不透光区域也可以对应阵列基板的其他图层图案。例如， 不透光区域可以对应阵列基板的源漏极金属层图案， 而液晶靣板（阵列基板）的極极金属 层图案和透明电极层图案对应在半透光区域之内， 则步骤 S21 中的待刻饨材料层为源漏 极金属层。 或者， 不透光区域也可以对应阵列基板的透明电极层图案， 而液晶面板（阵列 基板） 的»极金属层图案和源漏极金属层图案对应在半透光区域之内， 则歩骤 S21 中的 待刻蚀材料层为透明电极层。
根据上述实施例可知，本发明实施例提供的掩膜板既可以用于制造紫外线掩膜板，又 可以用于制造阵列基板， 实现了在紫外线掩膜板及阵列基板的制造中能够共用一个掩膜 板，而不需要单独配备用于制造紫外线掩膜板的掩膜板，从而降低了紫外线掩膜板的制造 成本。
虽然本发明所公开的实施方式如上,但所述的内容只是为了便于理解本发明而采用的 实施方式， 并非用以限定本发明。任何本发明所属技术领域内的技术人员， 在不脱离本发 明所公开的精神和范围的前提下，可以在实施的形式上及细节上作任何的修改与变化，但 本发明的专利保护范围， 仍须以所附的权利要求书所界定的范围为准。

Claims

棚要求书
1、 一种掩膜板， 包括全透光区域、 半透光区域和不透光区域；
所述全透光区域对应于液晶面板的框胶区域,所述不透光区域对应液晶面板的图层图 案区域， 所述掩膜板的其余区域为所述半透光区域。
2、 如权利要求 1所述的掩膜板， 其中， 所述半透光区域的透光率在 1/2至 之间。
3、 如权利要求 1所述的掩膜板， 其中， 所述图层图案为機极金属层图案； 所述液晶面板的源漏极金属层图案和透明电极层图案对应在所述半透光区域之内。
4、 如权利要求 1所述的掩膜板， 其中， 所述图层图案为源漏极金属层图案； 所述液晶面板的栅极金属层图案和透明电极层图案对应在所述半透光区域之内。
5、 如权利要求 1所述的掩膜板， 其中， 所述图层图案为透明电极层图案- 所述液晶面板的栅极金属层图案和源漏极金属层图案对应在所述半透光区域之内。
6、 一种紫外线掩膜板的制造方法， 包括：
在衬底基板上形成金属层；
在所述金属层上涂覆一层光刻胶；
利用掩膜板， 以第一光照强度对所述光刻胶进行曝光， 其中， 所述掩膜板包括全透光 区域、半透光区域和不透光区域， 所述全透光区域对应于液晶面板的框胶区域， 所述不透 光区域对应液晶面板的图层图案区域， 所述掩膜板的其余区域为所述半透光区域；
去除对应于所述掩膜板的全透光区域的光刻胶；
对所述金属层进行刻蚀；
去除剩余的光刻胶。
7、 一种阵列基板的制造方法， 包括： 在衬底基板上形成待刻蚀材料层；
在所述待刻蚀材料层上涂覆一层光刻胶- 利^掩膜板， 以第二光照强度对所述光刻胶进行曝光， 其中， 所述掩膜板包括全透光 区域、半透光区域和不透光区域， 所述全透光区域对应于液晶面板的框胶区域， 所述不透 光区域对应液晶面板的图层图案区域， 所述掩膜板的其余区域为所述半透光区域； 去除对应亍所述掩膜板的全透光区域和半透光区域的光刻胶； 对所述待刻蚀材料层进行刻蚀， 形成图层图案；
去除剩余的光刻胶。
8、 如权利要求 7所述的方法， 其中， 所述待刻蚀材料层为金属层； 所述图层图案为機极金属层图案或源漏极金属层图案。
9、 如权利要求 7所述的方法， 其中， 所述待刻蚀材料层为透明电极层； 所述图层图案为透明电极层图案。
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