WO2015178405A1 - ガスバリアー性フィルムの製造方法、ガスバリアー性フィルム、電子デバイスの製造方法及び電子デバイス - Google Patents
ガスバリアー性フィルムの製造方法、ガスバリアー性フィルム、電子デバイスの製造方法及び電子デバイス Download PDFInfo
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- WO2015178405A1 WO2015178405A1 PCT/JP2015/064410 JP2015064410W WO2015178405A1 WO 2015178405 A1 WO2015178405 A1 WO 2015178405A1 JP 2015064410 W JP2015064410 W JP 2015064410W WO 2015178405 A1 WO2015178405 A1 WO 2015178405A1
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- hard coat
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- coat layer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/007—After-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
- B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Definitions
- the present invention relates to a method for producing a gas barrier film, a gas barrier film, a method for producing an electronic device, and an electronic device.
- a method for producing a gas barrier film in which breakage and cracking of the film substrate are suppressed using a film substrate containing a cycloolefin polymer or a cycloolefin copolymer, a method for producing a gas barrier film in which breakage and cracking of the film substrate are suppressed, and a gas barrier film produced by the method
- the present invention relates to an electronic device provided with the gas barrier film and a method for producing the same.
- a gas barrier film formed by laminating a plurality of layers including a thin film of a metal oxide such as aluminum oxide, magnesium oxide, or silicon oxide on the surface of a plastic substrate or film is made of various gases such as water vapor and oxygen. It is widely used for packaging of articles that need to be blocked, for example, packaging for preventing deterioration of food, industrial goods, pharmaceuticals, and the like.
- gas barrier films can be applied to flexible electronic devices such as flexible solar cell elements, organic electroluminescence (hereinafter also referred to as “organic EL”) elements, and liquid crystal display elements. Many requests have been made.
- organic EL organic electroluminescence
- PET Polyethylene Terephthalate
- PEN Polyethylene Naphthalate
- COP Cyclo-Olefin® Polymer
- COC Cyclo-Olefin® Copolymer
- This invention is made
- the solution subject used the film base material containing a cycloolefin polymer or a cycloolefin copolymer, and generation
- a gas barrier in which a clear hard coat layer and a gas barrier layer are provided in this order on a film substrate containing a cycloolefin polymer or a cycloolefin copolymer.
- a process for providing a protective laminate member on the surface of the film base opposite to the surface on which the clear hard coat layer is provided before the clear hard coat layer is provided, The step of cutting the width direction end of the laminate including the film base material and the protective laminate member such that the width direction dimension of the film base material and the width direction of the protective laminate member are the same.
- a film base material containing a cycloolefin polymer or a cycloolefin copolymer is used, and a method for producing a gas barrier film in which the occurrence of breakage and cracking of the film base material is suppressed, is produced by the method.
- a gas barrier film, an electronic device including the gas barrier film, and a method for manufacturing the electronic device can be provided.
- the expression mechanism or action mechanism of the effect of the present invention is as follows. That is, before the clear hard coat layer is provided, a protective laminate member is provided on the surface of the film base opposite to the face on which the clear hard coat layer is provided in advance, so that the strength of the film base is increased and the clear hard coat layer is provided.
- the film substrate can be prevented from being broken or cracked.
- a protective laminate member in advance before providing the clear hard coat layer, every time any treatment is performed on the opposite surface of the film base (the surface on which the protective laminate member is not provided) There is no need to provide a protective laminate member, and an increase in the number of processes and costs can be suppressed.
- the width direction edge part of the laminated body containing a film base material and a protective laminate member is cut, without improving the bonding accuracy of the film base material and the protective laminate member, The lengths in the width direction can be made the same, and the occurrence of cracks and the like at the end of the film substrate can be suppressed with a simple configuration.
- the method for producing a gas barrier film of the present invention is a method for producing a gas barrier film in which a clear hard coat layer and a gas barrier layer are provided in this order on a film substrate containing a cycloolefin polymer or a cycloolefin copolymer, Before providing the clear hard coat layer, a step of providing a protective laminate member on the surface of the film base opposite to the face on which the clear hard coat layer is provided, and the width dimension of the film base Cutting the width direction end of the laminate including the film substrate and the protective laminate member so that the width of the protective laminate member is the same in the width direction. .
- This feature is a technical feature common to or corresponding to each of claims 1 to 7.
- the thickness of the clear hard coat layer is preferably in the range of 0.5 to 1 ⁇ m.
- the strength of the film substrate can be further increased after the formation of the clear hard coat layer, and the occurrence of breakage, cracks, and the like of the film substrate can be more effectively suppressed.
- the thickness of the film base is preferably in the range of 30 to 100 ⁇ m from the viewpoint of obtaining the effects of the present invention.
- ⁇ is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value.
- a gas barrier film 1 of the present invention includes a film substrate 2 containing a cycloolefin polymer or a cycloolefin copolymer, and clear hard coat layers 3 and 4 provided on both surfaces of the film substrate 2.
- a gas barrier layer 5 provided on the clear hard coat layer 3 a second gas barrier layer 6 provided on the gas barrier layer 5 by a coating method, and a protective laminate provided on the clear hard coat layer 4 And a member 7.
- the gas barrier film 1 of the present invention may not be provided with the clear hard coat layer 4.
- the protective laminate member 7 is one of the film bases 2. It is provided directly on the surface.
- the gas barrier film 1 of the present invention shown in FIG. 1A or 1B is generally used in a state where the protective laminate member 7 is removed. Therefore, the gas barrier film of the present invention may be a film after the protective laminate member is peeled off. Moreover, although the gas barrier film 1 of the present invention shown in FIG. 1A or 1B is provided with the second gas barrier layer 6, the second gas barrier layer may not be provided. .
- the width in the width direction of the film substrate and the width in the width direction of the protective laminate member are the same means that the width in the width direction of the film substrate and the width in the width direction of the protective laminate member are the same. It means that the difference is within 0.5 mm.
- FIGS. 2A to 2I a method for producing a gas barrier film of the present invention will be described.
- 2A to 2I are process charts showing an example of the method for producing a gas barrier film of the present invention.
- 2A to 2I show a process of manufacturing the gas barrier film 1 shown in FIG. 1A, in which the second gas barrier layer 6 is not provided.
- a film substrate 2 containing a cycloolefin polymer or a cycloolefin copolymer is prepared.
- a protective film 8 is preferably provided on one surface of the film base 2 from the viewpoint of protecting the film base 2 until a protective laminate member described later is provided.
- the protective film 8 any film may be used as long as it is configured to protect the film substrate 2.
- the protective film 8 may be configured similarly to a protective laminate member 9 described later. .
- corona treatment on the surface of the film base 2 on which the protective laminate member 9 is provided in the next step (the surface opposite to the surface on which the protective film 8 is provided).
- Corona treatment can be performed using a commercially available corona surface treatment apparatus.
- the protective laminate member 9 is bonded to the surface opposite to the surface on which the clear hard coat layer is provided (the surface subjected to the corona treatment) among both surfaces of the film substrate 2.
- the dimension in the width direction of the protective laminate member 9 is configured to be shorter than the dimension in the width direction of the film substrate 2, but may be longer than the dimension in the width direction of the film substrate 2. It may be the same length as the dimension of the film base 2 in the width direction.
- the width direction end of the laminate of the film substrate 2, the protective film 8, and the protective laminate member 9 is cut at, for example, the broken line portion of FIG. 2B, so that the film substrate 2, as shown in FIG. 2C,
- the dimensions in the width direction of the protective film 8 and the protective laminate member 9 are made the same. Since such a cutting process is performed, the width direction dimensions of the film substrate 2 and the protective laminate member 9 can be made the same without improving the bonding accuracy between the film substrate 2 and the protective laminate member 9. it can.
- the dimension in the width direction of the protective laminate member 9 and the dimension in the width direction of the film substrate 2 are substantially the same, it is possible to reduce the cutting amount at the width direction end of the laminate. From the viewpoint of cost reduction, it is preferable.
- the protective film 8 is peeled from the film base 2 and the corona treatment is performed on the surface of the film base 2 on which the protective film 8 is provided in the same manner as in FIG. 2A. Apply. Thereby, the adhesiveness of the film base material 2 and the clear hard-coat layer 4 can be improved.
- a clear hard coat layer 4 is provided on the surface of the film substrate 2 that has been subjected to corona treatment.
- coating and drying with a wet application system using the coating liquid for clear hard-coat layer formation is preferable.
- a clear hard coat layer forming coating solution is applied to form a coating film, and the formed coating film is cured.
- the clear hard coat layer 4 is formed of a thermosetting resin, it is cured by applying thermal energy as a curing means using a heater or the like.
- the clear hard coat layer 4 is formed of an actinic ray (for example, ultraviolet ray) curable resin, it is cured by irradiating ultraviolet rays or the like using an ultraviolet irradiation device or the like as a curing means, and clear hard A coat layer 4 is formed.
- disconnecting laminated bodies, such as above-mentioned film base material 2 is good also as what is performed after forming the clear hard-coat layer 4, a fracture
- the width in the width direction of the protective laminate member 7 is shorter than the width in the width direction of the film substrate 2 or the clear hard coat layer 4. It may be longer than the above-mentioned dimension, or may be approximately the same length as the dimension in the width direction of the film substrate 2 or the like.
- the film base 2, the protective laminate member 9, the clear hard coat layer 4, and the laminate of the protective laminate member 7 are cut off in the width direction end,
- the dimensions in the width direction of the protective laminate member 9, the clear hard coat layer 4 and the protective laminate member 7 are made the same. Since such a cutting process is performed, the width direction dimensions of the film substrate 2 and the protective laminate member 7 can be made the same without improving the bonding accuracy between the film substrate 2 and the protective laminate member 7. it can.
- the dimension in the width direction of the protective laminate member 7 and the dimension in the width direction of the film substrate 2 are substantially the same, it is possible to reduce the cutting amount at the width direction end of the laminate. From the viewpoint of cost reduction, it is preferable.
- the protective laminate member 9 is peeled from the film substrate 2 and the clear hard coat layer 3 is provided on the surface on which the protective laminate member 9 is provided.
- the same method as the method of forming the clear hard coat layer 4 can be used.
- disconnecting laminated bodies, such as above-mentioned film base material 2 may be performed after forming the clear hard-coat layer 3, a fracture
- the step of cutting the laminate such as the film base 2 described above is performed before the protective laminate member 9 is peeled off, but is not limited thereto, and after the protective laminate member 9 is peeled off, The laminate may be cut to form the clear hard coat layer 3.
- a gas barrier layer 5 is formed on the formed clear hard coat layer 3 to produce a gas barrier film 1.
- a vapor deposition method or a wet coating method for example, a method in which perhydroxypolysilazane (PHPS) is used to modify by vacuum ultraviolet irradiation treatment
- PHPS perhydroxypolysilazane
- the gas barrier layer has a desired composition. And the element distribution in the layer can be precisely controlled. Details of the plasma CVD method and the like will be described later.
- a gas barrier film can be produced as described above.
- the clear hard coat layers 3 and 4 are provided on both sides of the film substrate 2, but the clear hard coat layer is provided only on one side of the film substrate 2. Also good. In this case, each process is similarly performed from FIG. 2A to FIG. 2E, and the gas barrier layer 5 is formed on the clear hard coat layer 4 after FIG. 2E.
- the second gas barrier layer is not provided.
- the second gas barrier layer is further formed by a wet coating method. It is also good. In this case, a gas barrier film having higher gas barrier performance can be produced.
- the gas barrier film 1 is formed immediately after the gas barrier layer 5 is formed as shown in FIG. 2I.
- the protective laminate is formed.
- a member from which the member 7 is peeled off may be used as a gas barrier film.
- the gas barrier layer 5 is formed on the clear hard coat layer 4 and then the protective laminate member 9 is peeled off as a gas barrier film. It is preferable to do.
- the film base material according to the present invention contains a cycloolefin polymer (COP) or a cycloolefin copolymer (COC) as a main component, and the main component referred to here is a COP and a resin component constituting the film base material.
- the constituent ratio of COC is 60% by mass or more, preferably 80% by mass or more, more preferably 90% by mass or more, and particularly preferably 95% by mass or more.
- the film substrate formed by the cycloolefin polymer or cycloolefin copolymer according to the present invention has relatively low moisture permeability and superior light transmittance as compared with a polyethylene terephthalate film that has been widely used conventionally. (Transparency), and when it is provided in an organic EL element, it has a feature that luminous efficiency is improved. Furthermore, the birefringence is low, and when the organic EL device is provided, the color viewing angle dependency is small.
- Method A for addition polymerization with ⁇ -olefin and the like
- method B by ring-opening polymerization of a cyclic olefin.
- the polymer of Method A is referred to as a cycloolefin copolymer (COC)
- COC cycloolefin copolymer
- COP cycloolefin polymer
- the cycloolefin polymer applicable to the present invention is a polymer resin containing an alicyclic structure.
- a preferred cycloolefin polymer is a resin obtained by polymerizing or copolymerizing a cyclic olefin.
- cyclic olefin examples include norbornene, dicyclopentadiene, tetracyclododecene, ethyltetracyclododecene, ethylidenetetracyclododecene, tetracyclo [7.4.0.110, 13.02,7] trideca-2, Unsaturated hydrocarbons having a polycyclic structure such as 4,6,11-tetraene and derivatives thereof; cyclobutene, cyclopentene, cyclohexene, 3,4-dimethylcyclopentene, 3-methylcyclohexene, 2- (2-methylbutyl) -1-cyclohexene Monocyclic unsaturated hydrocarbons such as cyclooctene, 3a, 5,6,7a-tetrahydro-4,7-methano-1H-indene, cycloheptene, cyclopentadiene, cyclohexadiene,
- cyclic olefins may have a polar group as a substituent.
- the polar group include a hydroxy group, a carboxy group, an alkoxy group, an epoxy group, a glycidyl group, an oxycarbonyl group, a carbonyl group, an amino group, an ester group, and a carboxylic acid anhydride group.
- a carboxy group or a carboxylic anhydride group is preferred.
- a preferred cycloolefin polymer may be a cycloolefin copolymer obtained by addition copolymerization of a monomer other than a cyclic olefin.
- the addition copolymerizable monomer include ethylene or ⁇ -olefin such as ethylene, propylene, 1-butene and 1-pentene; 1,4-hexadiene, 4-methyl-1,4-hexadiene, 5- And dienes such as methyl-1,4-hexadiene and 1,7-octadiene.
- the cyclic olefin can be obtained by an addition polymerization reaction or a metathesis ring-opening polymerization reaction.
- the polymerization reaction is usually performed in the presence of a catalyst.
- the cycloolefin polymer is preferably a polymer obtained by polymerizing or copolymerizing a cyclic olefin, followed by a hydrogenation reaction to convert unsaturated bonds in the molecule into saturated bonds.
- the hydrogenation reaction is performed by blowing hydrogen in the presence of a known hydrogenation catalyst.
- examples of the cycloolefin polymer include the following norbornene resins.
- the norbornene-based resin preferably has a norbornene skeleton as a repeating unit. Specific examples thereof include, for example, JP-A-62-252406, JP-A-62-2252407, and JP-A-2-133413. JP, 63-145324, JP 63-264626, JP 1-2240517, JP 57-8815, JP 5-2108, JP 5-39403. JP-A-5-43663, JP-A-5-43834, JP-A-5-70655, JP-A-5-279554, JP-A-6-206985, JP-A-7-62028.
- the cycloolefin polymer according to the present invention can be obtained as a commercially available product, for example, Essina (trade name) manufactured by Sekisui Chemical Co., Ltd., ZEONEX, ZEONOR (trade name) manufactured by ZEON CORPORATION, Artron (trade name) manufactured by JSR Corporation, Optretz (trade name) manufactured by Hitachi Chemical Co., Ltd., Appell (trade names, APL8008T, APL6509T, APL6013T, APL5014DP, APL6015T) manufactured by Mitsui Chemicals, Inc. are preferably used. .
- a method for producing the COP film or COC film according to the present invention for example, a usual inflation method, T-die method, calendar method, cutting method, casting method, emulsion method, hot press method, etc. can be used.
- a film forming method a conventionally known solution casting film forming method or melt casting film forming method can be selected.
- the thickness of the film substrate is preferably in the range of 30 to 100 ⁇ m from the viewpoint of obtaining the effects of the present invention.
- a film base material containing COP or COC as a main component is generally weak in strength, and breakage or cracking of the film base material occurs when other functional layers are formed on the film base material.
- a protective film is provided on the film substrate before the formation of the clear hard coat layer, and the width direction end of the laminate is cut, thereby improving the strength of the film substrate, The end of the film substrate can be completely covered by the protective laminate member. For this reason, when manufacturing a gas barrier film, it is particularly effective to reduce damage to the film substrate when forming a clear hard coat layer or a gas barrier layer, and to cause the film substrate to break or crack. Can be suppressed.
- the protective laminate member preferably has heat resistance.
- a process in which excessive thermal energy is applied to the film substrate for example, a heat drying process after coating when a clear hard coat layer is formed by a coating method Reduces the damage of the film substrate to the heat energy applied in each treatment, such as thermosetting treatment or ultraviolet irradiation treatment when using a thermosetting resin or ultraviolet curable resin as the material of the clear hard coat layer 4 Therefore, it is possible to obtain a film substrate that is always excellent in flatness.
- the protective laminate member is used in a removed form.
- the protective laminate member according to the present invention mainly comprises a heat-resistant film, an adhesive layer, a release sheet, etc., and in use, the release sheet is peeled off and the adhesive layer is bonded to the film substrate according to the present invention. And use it.
- the heat-resistant film constituting the protective laminate member is not particularly limited, but the glass transition temperature of the cycloolefin polymer or cycloolefin copolymer constituting the film base is about 100 to 160 ° C. It is preferable to form with the film material which has a glass transition temperature (Tg).
- the heat resistant film that can be used in the protective laminate member include, for example, a polyethylene naphthalate film (for example, Q83 (trade name) manufactured by Teijin DuPont, Tg: 262 ° C.), a polyethylene terephthalate film (for example, manufactured by Toyobo Co., Ltd., Toyobo Polyester).
- Neoprim L-3430 (Tg: 303 ° C.), L-1000 (Tg: 260 ° C.), L-9000 (manufactured by Mitsubishi Gas Co., Ltd.) Tg: 315 ° C.)
- polyamide film manufactured by Unitika Ltd., Tg: 280 ° C.
- the configuration of the adhesive layer applicable to the present invention is not particularly limited, and for example, any of a dry laminating agent, a wet laminating agent, an adhesive, a heat seal agent, a hot melt agent, and the like is used.
- the adhesive for example, a polyester resin, a urethane resin, a polyvinyl acetate resin, an acrylic resin, a nitrile rubber, or the like is used.
- a gel or sol of a polymer compound and an organic solvent or oil, an aqueous emulsion of the polymer compound, a sol or gel in which the polymer compound and a water-soluble polymer are dissolved and dispersed in a hydrophilic solvent, and the like can be given.
- the release sheet examples include an acrylic film or sheet, a polycarbonate film or sheet, a polyarylate film or sheet, a polyethylene naphthalate film or sheet, a polyethylene terephthalate film or sheet, a plastic film or sheet such as a fluorine film, or titanium oxide.
- Resin film or sheet kneaded with silica, aluminum powder, copper powder, etc., and resin film or sheet subjected to surface treatment such as coating the resin kneaded with these or metal depositing metal such as aluminum A material is used.
- a commercially available product can be used as it is as the protective laminate member.
- a heat-resistant protective film Masudak (registered trademark) PC manufactured by Fujimori Kogyo Co., Ltd. (for example, product type: normal type PC-542PA, adhesive low-migration type PC-751, PC-801) can be mentioned.
- This heat-resistant protective film has a structure in which an adhesive layer (layer thickness 4 to 10 ⁇ m) and a release film (thickness 40 ⁇ m) are laminated on a low heat-shrinkable polyester film having a thickness of 50 ⁇ m.
- Fujimori Kogyo Co., Ltd. may include optical surface protective films, Masudak (registered trademark) TFB (for example, product names ZBO-0421, NBO-0424, TFB-4T3-367AS).
- a clear hard coat layer is formed on a film substrate provided with a protective laminate member.
- a clear hard coat layer is provided on the film substrate, and a gas barrier layer is provided on the clear hard coat layer, whereby the gas barrier layer can be provided with good adhesion to the film substrate.
- Examples of the curable resin used for the formation of the clear hard coat layer according to the present invention include a thermosetting resin and an active energy ray curable resin. It can be preferably used.
- thermosetting resin is not particularly limited. Specifically, epoxy resin, cyanate ester resin, phenol resin, bismaleimide-triazine resin, polyimide resin, acrylic resin, vinylbenzyl resin, etc. Various thermosetting resins are mentioned.
- Any epoxy resin may be used as long as it has an average of two or more epoxy groups per molecule, and specifically, bisphenol A type epoxy resin, biphenyl type epoxy resin, biphenyl aralkyl type epoxy resin, naphthol type epoxy resin.
- the active energy ray-curable resin that can be suitably used in the present invention refers to a resin that is cured through a crosslinking reaction or the like by irradiation with active rays such as ultraviolet rays and electron beams.
- active energy ray curable resin a component containing a monomer having an ethylenically unsaturated double bond is preferably used.
- the active energy ray curable resin is cured by irradiation with an active ray such as an ultraviolet ray or an electron beam.
- a resin layer is formed.
- Typical examples of the active energy ray curable resin include an ultraviolet curable resin and an electron beam curable resin, and an ultraviolet curable resin that is cured by ultraviolet irradiation is preferable.
- the ultraviolet curable resin examples include an ultraviolet curable urethane acrylate resin, an ultraviolet curable polyester acrylate resin, an ultraviolet curable epoxy acrylate resin, an ultraviolet curable polyol acrylate resin, and an ultraviolet curable epoxy resin. be able to.
- UV curable acrylic urethane resins are obtained by reacting a polyester polyol with an isocyanate monomer or a prepolymer and further adding a hydroxy group such as 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, etc. It can be easily obtained by reacting an acrylate monomer having a group.
- a resin described in JP-A-59-151110 can be used.
- UV curable polyester acrylate resins include those that are easily formed by reacting polyester polyols with 2-hydroxyethyl acrylate and 2-hydroxy acrylate monomers, generally as disclosed in JP-A-59-151112. The resin described in the publication can be used.
- ultraviolet curable epoxy acrylate resin examples include those produced by reacting epoxy acrylate with an oligomer, a reactive diluent and a photoinitiator added thereto, and reacting them. Those described in Japanese Patent No. 105738 can be used.
- an ultraviolet curable polyol acrylate resin examples include polyfunctional acrylate resins.
- the polyfunctional acrylate resin is a compound having two or more acryloyloxy groups or methacryloyloxy groups in the molecule.
- Examples of the monomer of the polyfunctional acrylate resin include ethylene glycol diacrylate, diethylene glycol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, and tetramethylolmethane.
- UV curable resins examples include ADEKA OPTMER KR / BY series: KR-400, KR-410, KR-550, KR-566, KR-567, BY-320B ( ADEKA Co., Ltd.); KOHEI HARD A-101-KK, A-101-WS, C-302, C-401-N, C-501, M-101, M-102, T-102, D -102, NS-101, FT-102Q8, MAG-1-P20, AG-106, M-101-C (manufactured by Guangei Chemical Co., Ltd.); Seika Beam PHC2210 (S), PHC X-9 (K- 3), PHC2213, DP-10, DP-20, DP-30, P1000, P1100, P1200, P1300, P1400, P1500, P1600, SCR 00 (above, manufactured by Dainichi Seika Kogyo Co., Ltd.
- the photopolymerization initiator In order to accelerate the curing of the ultraviolet curable resin, the photopolymerization initiator is preferably contained in the range of 2 to 30% by mass with respect to the ultraviolet curable resin.
- the photopolymerization initiator a group of double salts of onium salts that release a Lewis acid that initiates cationic polymerization by light irradiation is particularly preferable.
- an onium salt it is particularly effective to use an aromatic onium salt as a cationic polymerization initiator.
- Group VIA aromatic onium salts described in JP-A-50-151997, JP-A-52-30899, JP-A-59-55420, JP-A-55-125105, etc., JP-A-56-8428 Oxosulfonium salts described in Japanese Patent Publication Nos. 56-149402 and 57-192429, aromatic diazonium salts described in Japanese Patent Publication No. 49-17040, US Pat. No. 4,139,655, etc.
- thiopyrylium salts are preferred.
- group polymerization initiator, etc. can be mentioned.
- the cationic polymerization initiator can be used in combination with a photosensitizer such as benzophenone, benzoin isopropyl ether, or thioxanthone.
- the clear hard coat layer may contain fine particles of an inorganic compound or an organic compound in order to adjust the scratch resistance, slipperiness and refractive index.
- Inorganic fine particles used in the clear hard coat layer include silicon oxide, titanium oxide, aluminum oxide, tin oxide, indium oxide, indium tin oxide (ITO), zinc oxide, zirconium oxide, magnesium oxide, calcium carbonate Calcium carbonate, talc, clay, calcined kaolin, calcined calcium silicate, hydrated calcium silicate, aluminum silicate, magnesium silicate and calcium phosphate.
- silicon oxide, titanium oxide, aluminum oxide, zirconium oxide, magnesium oxide and the like are preferably used.
- Organic particles include polymethacrylic acid methyl acrylate resin powder, acrylic styrene resin powder, polymethyl methacrylate resin powder, silicone resin powder, polystyrene resin powder, polycarbonate resin powder, benzoguanamine resin powder, melamine resin.
- An ultraviolet curable resin composition such as powder, polyolefin resin powder, polyester resin powder, polyamide resin powder, polyimide resin powder, or polyfluorinated ethylene resin powder can be added.
- Particularly preferred are cross-linked polystyrene particles (for example, SX-130H, SX-200H, SX-350H manufactured by Soken Chemical), polymethyl methacrylate particles (for example, MX150, MX300 manufactured by Soken Chemical), and fluorine-containing acrylic resin fine particles.
- Examples of the fluorine-containing acrylic resin fine particles include commercially available products such as FS-701 manufactured by Nippon Paint.
- Examples of the acrylic particles include Nippon Paint: S-4000, and examples of the acrylic-styrene particles include Nippon Paint: S-1200, MG-251.
- an antioxidant that does not inhibit the photocuring reaction can be selected and used.
- the clear hard coat layer forming coating solution used for forming the clear hard coat layer may contain a solvent, or may be appropriately contained and diluted as necessary.
- the organic solvent contained in the clear hard coat layer forming coating solution include hydrocarbons (eg, toluene, xylene, etc.), alcohols (eg, methanol, ethanol, isopropanol, butanol, cyclohexanol, etc.), ketones. (For example, acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.), esters (for example, methyl acetate, ethyl acetate, methyl lactate, etc.), glycol ethers, other organic solvents, or a mixture thereof.
- hydrocarbons eg, toluene, xylene, etc.
- alcohols eg, methanol, ethanol, isopropanol, butanol, cyclohexanol, etc.
- Propylene glycol monoalkyl ether (1 to 4 carbon atoms in the alkyl group) or propylene glycol monoalkyl ether acetate ester (1 to 4 carbon atoms in the alkyl group) is 5% by mass or more, more preferably 5 to 80%. It is preferable to use the organic solvent containing at least mass%.
- the clear hard coat layer can contain a silicone surfactant or a polyoxyether compound.
- the clear hard coat layer may contain a fluorine-siloxane graft polymer.
- These clear hard coat layers are coated by a known wet coating method such as a gravure coater, a dip coater, a reverse coater, a wire bar coater, a die coater, and an ink jet method using a clear hard coat layer forming coating solution. be able to.
- the coating amount of the hard coat layer coating solution is suitably 0.1 to 40 ⁇ m as a wet layer thickness, and preferably 0.5 to 30 ⁇ m.
- the layer thickness is 0.1 to 30 ⁇ m, preferably 1 to 10 ⁇ m.
- any light source that generates ultraviolet light can be used without any limitation.
- a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, a carbon arc lamp, a metal halide lamp, a xenon lamp, or the like can be used.
- Irradiation conditions vary depending on each lamp, but the irradiation amount of active energy rays is preferably in the range of 5 to 350 mJ / cm 2 , particularly preferably in the range of 250 to 300 mJ / cm 2 .
- a gas barrier layer is formed on the clear hard coat layer.
- the gas barrier layer according to the present invention has a water vapor permeability (25 ⁇ 0.5 ° C., 90 ⁇ 2% RH) of 0.01 g / (m 2 ) measured by a method according to JIS-K-7129-1992. 24 hours) or less is preferable.
- the oxygen permeability measured by a method according to JIS-K-7126-1987 is 1 ⁇ 10 ⁇ 3 ml / (m 2 ⁇ 24 hours ⁇ atm) or less
- the water vapor permeability is 1 ⁇ 10 ⁇ 5 g / (M 2 ⁇ 24 hours) or less is preferable.
- a material for forming the gas barrier layer a material having a function of suppressing the intrusion of elements such as moisture and oxygen that cause performance deterioration of the organic EL element having the film base material and the gas barrier film, for example, silicon oxide, Silicon oxynitride, silicon dioxide, silicon nitride, or the like can be used.
- the method for forming the gas barrier layer is not particularly limited.
- a formation method by a dry process such as a combination method, a plasma CVD method, a laser CVD method, a thermal CVD method, or a formation method using a wet coating method can be used.
- a coating liquid containing a polysilazane compound such as perhydroxypolysilazane is applied on a film substrate using a wet coating method, and then vacuum ultraviolet light (excimer light) is applied.
- a gas barrier layer is formed by irradiating and subjecting an inorganic film such as silicon oxide, silicon oxynitride, or silicon nitride to a modification treatment.
- JP 2012-024933 A JP 2012-121149 A
- JP 2013-022799 A Reference can be made to the descriptions in JP 2013-039786 A, JP 2013-025661 A, JP 2013-086445 A, and the like.
- the chemical vapor deposition method is preferably a discharge plasma chemical vapor deposition method (plasma CVD method).
- a discharge plasma chemical vapor deposition method plasma CVD method
- a resin substrate On one surface of the substrate, discharge plasma chemical vapor deposition having a discharge space between rollers to which a magnetic field having a structure as shown in FIG. 3 described later is applied using a source gas containing an organosilicon compound and oxygen gas
- a method of forming a gas barrier layer by a method is particularly preferable.
- Element profile of a gas barrier layer A gas barrier layer constituting a gas barrier film, which is formed by using a discharge plasma processing apparatus having a discharge space between rollers to which a magnetic field as shown in FIG. 3 is applied. It is preferable that the element profile is composed of an inorganic film having a refractive index distribution in the layer thickness direction and having one or more extreme values in the refractive index distribution.
- the gas barrier layer is made of a material containing silicon, oxygen, and carbon, and has a laminated structure including a plurality of layers having different silicon, oxygen, and carbon contents.
- the gas barrier layer is designed to have an arbitrary element profile with the relationship between the distance from the surface of the gas barrier layer in the layer thickness direction and the atomic weight ratio (atomic ratio) of each of the above elements (silicon, oxygen or carbon). can do.
- the gas barrier layer may further contain nitrogen in addition to silicon, oxygen and carbon.
- nitrogen By containing nitrogen, the refractive index of the gas barrier layer can be controlled.
- the refractive index of SiO 2 is 1.5
- the refractive index of SiN is about 1.8 to 2.0. Therefore, a preferable refractive index value of 1.6 to 1.8 can be obtained by containing nitrogen in the gas barrier layer and forming SiON in the gas barrier layer.
- the layer thickness of the gas barrier layer is preferably in the range of 5 to 3000 nm, more preferably in the range of 10 to 2000 nm, and particularly preferably in the range of 100 to 1000 nm. preferable.
- the total thickness of the gas barrier layer is set in the range of 10 to 10,000 nm, preferably in the range of 10 to 5000 nm, and preferably in the range of 100 to 3000 nm. Is more preferable, and a range of 200 to 2000 nm is particularly preferable.
- the gas barrier layer is preferably a layer formed by plasma chemical vapor deposition.
- a gas barrier layer formed by the plasma chemical vapor deposition method for example, a discharge plasma processing apparatus as shown in FIG. 3 is used, and a film substrate having a clear hard coat layer formed on one surface is formed as a pair of components.
- the layer is formed by a plasma chemical vapor deposition method that is disposed on a film roller and discharges between the pair of film forming rollers to generate plasma.
- the plasma enhanced chemical vapor deposition method may be a Penning discharge plasma type chemical vapor deposition method.
- the plasma chemical vapor deposition method by the opposed roller method uses a pair of film forming rollers, and arranges a film base material on which a clear hard coat layer is formed on each of the pair of film forming rollers, A gas barrier layer is formed by generating a plasma by discharging between a pair of film forming rollers.
- the film substrate having a clear hard coat layer By disposing a film substrate having a clear hard coat layer on a pair of film forming rollers and discharging between the film forming rollers, the film substrate existing on one film forming roller It can be formed into a film. At the same time, it is possible to form a film on the film substrate on the other film forming roller. For this reason, the film-forming rate can be doubled and a thin film can be manufactured efficiently. Furthermore, the film
- a film forming gas containing an organosilicon compound and oxygen for the plasma chemical vapor deposition method.
- the oxygen content in the film forming gas is preferably less than or equal to the theoretical oxygen amount necessary for complete oxidation of the entire amount of the organosilicon compound in the film forming gas.
- the gas barrier layer is preferably a layer formed by a continuous film forming process.
- the gas barrier layer is preferably formed on a film substrate having a clear hard coat layer in a roll-to-roll manner from the viewpoint of productivity as described above.
- An apparatus capable of producing a gas barrier layer by plasma enhanced chemical vapor deposition is not particularly limited, and may include at least a pair of film forming rollers and a plasma power source, and discharge between the film forming rollers. It is preferable that the device has a possible configuration.
- a discharge plasma processing apparatus capable of forming a discharge space between rollers to which a magnetic field is applied as shown in FIG. 3
- it is continuously manufactured by a roll-to-roll method using a plasma chemical vapor deposition method. Is also preferable from the viewpoint of enabling.
- FIG. 3 is a schematic view showing an example of a discharge plasma processing apparatus suitable for forming a gas barrier layer according to the present invention.
- the discharge plasma processing apparatus 30 shown in FIG. 3 is a discharge plasma processing apparatus that can form a discharge space between rollers to which a magnetic field is applied.
- the discharge plasma processing apparatus 30 includes a feed roller 11, transport rollers 21, 22, 23, and 24, Film rollers 31 and 32, a gas supply pipe 41, a plasma generation power source 51, magnetic field generators 61 and 62 installed inside the film formation rollers 31 and 32, and a winding roller 71 are provided.
- a gas supply pipe 41, a plasma generation power source 51, and magnetic field generation apparatuses 61 and 62 are disposed in a vacuum chamber (not shown).
- the vacuum chamber is connected to a vacuum pump (not shown), and the pressure in the vacuum chamber can be adjusted by the vacuum pump.
- a second gas barrier layer is preferably formed on the gas barrier layer.
- the second gas barrier layer irradiates the coating film formed by applying a coating liquid containing polysilazane on the gas barrier layer with vacuum ultraviolet light having a wavelength of 200 nm or less. It is formed by a method (coating method) formed by modification treatment.
- the gas barrier performance of the gas barrier film can be improved.
- the gas barrier layer is preferably formed by a forming method other than the coating method, whereby the forming method is composed of the gas barrier layer and the second gas barrier layer. A gas barrier film excellent in gas barrier performance can be obtained.
- Polysilazane-containing coating solution In the polysilazane-containing coating solution, there are few defects such as film formability and cracks, and from the viewpoint of a small amount of residual organic matter, for example, polysilazane such as perhydropolysilazane and organopolysilazane, polysiloxane such as silsesquioxane, and the like. Contained. Among them, polysilazane is more preferable, and perhydropolysilazane is particularly preferable because the gas barrier performance is high and the gas barrier performance is maintained even when bent and under high temperature and high humidity conditions.
- Polysilazane is a polymer having a silicon-nitrogen bond, such as SiO 2 , Si 3 N 4 having a bond such as Si—N, Si—H, or N—H, and ceramics such as both intermediate solid solutions SiO x N y. It is a precursor inorganic polymer. More preferred are polysilazanes described in paragraphs 0051 to 0058 of JP2013-022799A.
- Modification process The modification treatment of the second gas barrier layer formed by the coating method refers to the conversion reaction of a silicon compound to silicon oxide or silicon oxynitride, and specifically, the polysilazane-containing coating solution of the present invention is applied.
- the process which changes the obtained coating film into the inorganic thin film of the grade which can express gas barrier property is said.
- modification treatment for promoting the conversion reaction of the silicon compound to silicon oxide or silicon oxynitride examples include plasma treatment, ultraviolet irradiation treatment, heat treatment, etc., but the gas barrier film of the present invention In the manufacturing method, irradiation with vacuum ultraviolet light having a wavelength of 200 nm or less is used.
- the gas barrier film of the present invention described above is preferably provided in an electronic element such as an organic EL element, a solar cell element, or a liquid crystal display element to constitute an electronic device.
- the method for producing an electronic device according to the present invention is a production of an electronic device comprising a gas barrier film in which a clear hard coat layer and a gas barrier layer are provided in this order on a film substrate containing a cycloolefin polymer or a cycloolefin copolymer.
- the electronic device of the present invention is manufactured by the method for manufacturing an electronic device of the present invention.
- the protective film was peeled off from the film base material, and the surface of the film base material on which the protective film was bonded was subjected to corona treatment.
- the film substrate subjected to the corona treatment was wound up to obtain a film substrate in which the corona treatment was performed on both sides and the protective laminate member-1 was bonded to one side.
- an ultraviolet curable resin (Opster Z7527 manufactured by JSR) mainly composed of acrylic acid ester and amorphous silica using a micro gravure and A clear hard coat layer forming coating solution containing a surfactant (Surflon S-651 manufactured by AGC Seimi Chemical Co., Ltd.) was applied to a dry film thickness of 0.7 ⁇ m and dried.
- a surfactant Surflon S-651 manufactured by AGC Seimi Chemical Co., Ltd.
- a gas barrier layer was formed and wound on the clear hard coat layer-1 according to the following method.
- the film base material on which the clear hard coat layer-1 is formed has the clear hard coat layer-1 by using a discharge plasma processing apparatus capable of forming a discharge space between rollers to which a magnetic field shown in FIG. 3 is applied.
- a roll of a film base was mounted, and a gas barrier layer 101 was formed on the clear hard coat layer-1 of the film base with a layer thickness of 100 nm under the following film forming conditions to produce a gas barrier film 101. .
- ⁇ Film formation conditions Supply amount of raw material gas (HMDSO): 50 sccm (Standard Cubic Centimeter per Minute) Supply amount of oxygen gas (O 2 ): 500 sccm Degree of vacuum in the vacuum chamber: 3Pa Applied power from the power source for plasma generation: 1.2 kW Frequency of power source for plasma generation: 80 kHz Film transport speed: 0.5 m / min
- a gas barrier film 102 was produced in the same manner except that the protective laminate member was bonded and the surface treatment of the film substrate was performed as follows.
- the width direction edge part of the film base material was cut so that the prepared film base material had a width of 1280 mm.
- Corona treatment is applied to the surface of the cut film base opposite to the surface provided with the protective film, and a protective laminate member-1 (thickness 50 ⁇ m, width 1275 mm) made of PET is bonded to the treated surface. Winded up.
- the protective film was peeled from the film base material, and the surface of the film base material on which the protective film was bonded was subjected to corona treatment.
- the film substrate subjected to the corona treatment was wound up to obtain a film substrate in which the corona treatment was performed on both sides and the protective laminate member-1 was bonded to one side.
- a gas barrier film 103 was produced in the same manner as in the production of the gas barrier film 101 except that the gas barrier layer-2 was further provided on the gas barrier layer-1 as described below.
- a gas barrier layer-2 was formed on the gas barrier layer-1 by the following wet coating method.
- a polysilazane-containing coating solution a 10% by mass dibutyl ether solution of perhydropolysilazane (PHPS: Aquamica NN120-10, non-catalytic type, manufactured by AZ Electronic Materials Co., Ltd.) was prepared.
- the prepared polysilazane-containing coating solution is applied by dip coating onto the gas barrier layer-1 so that the average layer thickness after drying is 300 nm, and dried for 1 minute in an atmosphere at a temperature of 85 ° C. and a humidity of 55% RH. I let you.
- the coating film containing polysilazane was formed by holding for 10 minutes in an atmosphere of a temperature of 25 ° C. and a humidity of 10% RH (dew point temperature ⁇ 8 ° C.) to perform dehumidification. Thereafter, excimer light irradiation treatment was performed under the following conditions to form a coating-type gas barrier layer-2 as a second gas barrier layer on the gas barrier layer-1.
- the conditions for the excimer light irradiation treatment are as follows. Irradiation wavelength: 172 nm Lamp filled gas: Xe Excimer lamp light intensity: 130 mW / cm 2 (172 nm) Distance between sample and light source: 1mm Film heating temperature: 70 ° C Oxygen concentration in the irradiation device: 1.0% Excimer lamp irradiation time: 5 seconds
- the gas barrier film 105 was formed in the same manner as in the preparation of the gas barrier film 103 except that the gas barrier layer-2 was provided on the gas barrier layer-1. Produced.
- gas barrier films 106 and 107 were produced.
- a clear hard coat layer-2 was formed (referred to as “Method A” in Table 1).
- a gas barrier film 111 was produced in the same manner as in the production of the gas barrier film 110 except that the method for forming the clear hard coat layer-2 was changed as follows.
- the protective laminate member-2 (thickness 50 ⁇ m, width) is formed on the clear hard coat layer-1 without peeling off the protective laminate member-1 from the film substrate. 1250 mm). Subsequently, the widthwise end of the laminate was cut and wound so that the width dimension of the film substrate and the width dimension of the protective laminate member-2 were the same (width 1230 mm). .
- the layer forming coating solution was applied to a dry film thickness of 0.7 ⁇ m and dried.
- a clear hard coat layer-2 was formed (referred to as “Method B” in Table 1).
- a gas barrier film 112 was produced in the same manner as in the production of the gas barrier film 101 except that the thickness of the film substrate was changed to 100 ⁇ m.
- a gas barrier film 113 was produced in the same manner except that the clear hard coat layer-1 was formed without bonding the protective laminate member-1 to the film substrate.
- a gas barrier film 114 was produced in the same manner as in the production of the gas barrier film 102 except that the clear hard coat layer-1 was formed without bonding the protective laminate member-1 to the film substrate.
- an organic EL element was manufactured as follows using the prepared gas barrier films 101 to 114.
- the protective laminate member-1 or the protective laminate member-2 was removed from each of the gas barrier films 101 to 114, and cut into a predetermined size from an area 20 mm from the end in the width direction.
- the gas barrier film was fixed to a substrate holder of a commercially available vacuum deposition apparatus, and the following compound No. 10 was put in a resistance heating boat made of tungsten, and the base material holder and the resistance heating boat were mounted in a first vacuum chamber of a vacuum evaporation apparatus.
- silver (Ag) was put into the resistance heating boat made from tungsten, and it attached in the 2nd vacuum chamber of a vacuum evaporation system.
- a heating boat containing 10 was energized and heated, and the base layer of the first electrode was provided with a layer thickness of 10 nm at a deposition rate of 0.1 to 0.2 nm / second.
- the gas barrier film on which the underlayer was formed was transferred to the second vacuum chamber while being vacuumed, and after the pressure in the second vacuum chamber was reduced to 4 ⁇ 10 ⁇ 4 Pa, the heating boat containing silver was energized and heated.
- a first electrode made of silver having a thickness of 8 nm was formed at a deposition rate of 0.1 to 0.2 nm / second.
- HT-1 was deposited on the formed first electrode while moving the gas barrier film.
- Vapor deposition was performed at 0.1 nm / second, and a 20 nm hole transport layer (HTL) was provided.
- the following compound A-3 blue light emitting dopant
- the following compound A-1 green light emitting dopant
- the following compound A-2 red light emitting dopant
- the following compound H-1 host compound
- -3 changes the deposition rate so that the content is linear with respect to the layer thickness direction and the gradient is 35% to 5%, and the compound A-1 and the compound A-2 do not depend on the layer thickness.
- the compound H-1 has a gradient concentration of 64.6% to 94.6% in the layer thickness direction so that each concentration is constant at 0.2% by mass.
- the vapor deposition rate was changed so that a co-deposited light emitting layer having a layer thickness of 70 nm was formed.
- the following compound ET-1 was deposited on the light emitting layer to form an electron transport layer having a thickness of 30 nm, and potassium fluoride (KF) was further deposited to form an electron injection layer having a thickness of 2 nm. Furthermore, aluminum was vapor-deposited to form a second electrode having a layer thickness of 110 nm.
- KF potassium fluoride
- thermosetting sheet adhesive epoxy resin
- a sealing resin layer on one surface of the aluminum foil with a thickness of 20 ⁇ m.
- the resin base material prepared up to the second electrode was superposed.
- the adhesive forming surface of the sealing member and the organic functional layer surface of the element were continuously overlapped so that the ends of the lead wires of the first electrode and the second electrode were exposed.
- the sample containing the gas barrier film was placed in a decompression device, and held for 5 minutes under a reduced pressure condition of 90 ° C. and 0.1 MPa with pressure applied to the stacked sample and the sealing member. . Subsequently, the sample including the gas barrier film was returned to the atmospheric pressure environment, and further heated at 120 ° C. for 30 minutes to cure the adhesive.
- the sealing process is performed under atmospheric pressure and in a nitrogen atmosphere with a moisture content of 1 ppm or less in accordance with JIS B 9920.
- the measured cleanliness is class 100, the dew point temperature is ⁇ 80 ° C. or less, and the oxygen concentration is 0.8 ppm or less. At atmospheric pressure.
- the organic EL element was produced by the above process.
- the area of the light emitting region was set to 5 cm ⁇ 5 cm.
- the gas barrier film produced by the method defined in the present invention can suppress the occurrence of breakage more than the gas barrier film of the comparative example. Moreover, it turns out that generation
- the timing of cutting the laminate such as the film base after the formation of the first clear hard coat layer may be when the protective laminate member is provided on both sides of the film base. It can be seen that the protective laminate member may be provided only on one side of the material.
- the present invention uses a film base material containing a cycloolefin polymer or a cycloolefin copolymer, and a method for producing a gas barrier film in which breakage and cracking of the film base material are suppressed, by the method It is suitable for providing a manufactured gas barrier film, an electronic device including the gas barrier film, and a method for manufacturing the electronic device.
Abstract
Description
本発明の効果の発現機構ないし作用機構については、以下のとおりである。
すなわち、クリアハードコート層を設ける前に、あらかじめフィルム基材のクリアハードコート層が設けられる面と反対側の面に保護ラミネート部材を設けるので、フィルム基材の強度が高められ、クリアハードコート層等の他の層を形成する際にフィルム基材に破断やひびが発生することを抑制することができる。また、クリアハードコート層を設ける前にあらかじめ保護ラミネート部材を設けておくことで、フィルム基材の反対側の面(保護ラミネート部材が設けられていない面)に対して何らかの処理を施すたびにその都度保護ラミネート部材を設ける必要がなく、工程数やコストの上昇を抑えることができる。
また、フィルム基材と保護ラミネート部材とを含む積層体の幅手方向端部を裁断するので、フィルム基材と保護ラミネート部材の貼合精度を向上させることなく、フィルム基材と保護ラミネート部材の幅手方向の長さを同一にすることができ、簡易な構成でフィルム基材端部のひび等の発生を抑制することができる。
本発明においては、前記クリアハードコート層の層厚が、0.5~1μmの範囲内であることが好ましい。これにより、クリアハードコート層形成後においてフィルム基材の強度を更に高めることができ、フィルム基材の破断やひび等の発生をより効果的に抑制することができる。
また、本発明においては、前記フィルム基材の厚さが、30~100μmの範囲内であることが、本発明の効果を得る観点から好ましい。
また、本発明においては、前記ガスバリアー層上に、塗布法により第2のガスバリアー層を設ける工程を更に有することが好ましい。これにより、更にガスバリアー性の高いガスバリアー性フィルムを得ることができる。
図1A及び図1Bはそれぞれ、本発明のガスバリアー性フィルムの構成の一例を示す概略断面図である。
図1Aに示すように、本発明のガスバリアー性フィルム1は、シクロオレフィンポリマー又はシクロオレフィンコポリマーを含有するフィルム基材2と、当該フィルム基材2の両面に設けられるクリアハードコート層3、4と、クリアハードコート層3上に設けられるガスバリアー層5と、当該ガスバリアー層5上に塗布法により設けられる第2のガスバリアー層6と、クリアハードコート層4上に設けられた保護ラミネート部材7と、を備えている。
また、図1A又は図1Bに示す本発明のガスバリアー性フィルム1は、第2のガスバリアー層6を備えているものとしたが、第2のガスバリアー層は設けられていないものとしても良い。
本発明において「フィルム基材の幅手方向の寸法と保護ラミネート部材の幅手方向の寸法が同一」とは、フィルム基材の幅手方向の寸法と保護ラミネート部材の幅手方向の寸法とが略同一であって、その差が0.5mm以内であることをいう。
なお、上記したフィルム基材2等の積層体を裁断する工程(図2B、図2C)は、クリアハードコート層4を形成した後に行うものとしても良いが、フィルム基材2の破断やひび等の発生をより効果的に抑制する観点からは、フィルム基材2等の積層体を裁断した後にクリアハードコート層4を形成することが好ましい。
なお、上記したフィルム基材2等の積層体を裁断する工程(図2F、図2G)は、クリアハードコート層3を形成した後に行うものとしても良いが、フィルム基材2の破断やひび等の発生をより効果的に抑制する観点からは、フィルム基材2等の積層体を裁断した後にクリアハードコート層3を形成することが好ましい。
また、上記したフィルム基材2等の積層体を裁断する工程は、保護ラミネート部材9を剥離する前に行うものとしたが、これに限られるものではなく、保護ラミネート部材9を剥離した後に、積層体を裁断して、クリアハードコート層3を形成するものとしても良い。
ガスバリアー層5の形成方法としては、蒸着法あるいは湿式塗布法(例えば、パーヒドロキシポリシラザン(PHPS)を用い、真空紫外線照射処理で改質する方法)等を適用することができるが、本発明においては、化学気相成長法(CVD法)を適用すること、更には、化学気相成長法として放電プラズマ化学気相成長法(プラズマCVD法)を適用することが、ガスバリアー層を所望の組成で形成でき、かつ層内の元素分布を精緻に制御することが可能となる観点から好ましい。プラズマCVD法等の詳細については後述する。
〔フィルム基材〕
本発明に係るフィルム基材は、シクロオレフィンポリマー(COP)又はシクロオレフィンコポリマー(COC)を主成分として含有し、ここでいう主成分とは、フィルム基材を構成する樹脂成分のうち、COP及びCOCの構成比率が60質量%以上であることをいい、好ましくは80質量%以上であり、より好ましくは90質量%以上であり、特に好ましくは95質量%以上で構成されていることである。
本発明のガスバリアー性フィルムの製造方法においては、フィルム基材上にクリアハードコート層が形成される前に、当該フィルム基材のクリアハードコート層が形成される面と反対側の面に、保護ラミネート部材が設けられる。また、当該保護ラミネート部材とフィルム基材とは、その積層体の幅手方向端部が裁断されることで、両者の幅手方向の寸法が同一となっている。
本発明では、クリアハードコート層形成前にフィルム基材に保護ラミネート部材を設け、その積層体の幅手方向端部が裁断されることにより、フィルム基材の強度を向上させることができるとともに、フィルム基材の端部を保護ラミネート部材によって完全に覆うことができる。このため、ガスバリアー性フィルムの製造時において、特に、クリアハードコート層やガスバリアー層を形成する際のフィルム基材へのダメージを低減し、フィルム基材の破断やひび等の発生を効果的に抑制することが可能となる。
本発明のガスバリアー性フィルムの製造方法においては、保護ラミネート部材が設けられたフィルム基材に、クリアハードコート層が形成される。フィルム基材にクリアハードコート層が設けられ、当該クリアハードコート層上にガスバリアー層が設けられることで、フィルム基材に対してガスバリアー層を密着性良く設けることが可能となる。
熱硬化型樹脂は、特に制限はなく、具体的には、エポキシ樹脂、シアネートエステル樹脂、フェノール樹脂、ビスマレイミド-トリアジン樹脂、ポリイミド樹脂、アクリル樹脂、ビニルベンジル樹脂等の種々の熱硬化性樹脂が挙げられる。
本発明において好適に用いることができる活性エネルギー線硬化型樹脂とは、紫外線や電子線のような活性線照射により架橋反応等を経て硬化する樹脂をいう。活性エネルギー線硬化型樹脂としては、エチレン性不飽和二重結合を有するモノマーを含む成分が好ましく用いられ、紫外線や電子線のような活性線を照射することによって硬化させて、活性エネルギー線硬化型樹脂層が形成される。活性エネルギー線硬化型樹脂としては、紫外線硬化型樹脂や電子線硬化型樹脂等が代表的なものとして挙げられるが、紫外線照射によって硬化する紫外線硬化型樹脂が好ましい。
以下、本発明に係るクリアハードコート層の形成に好適な紫外線硬化型樹脂について説明する。
また、紫外線硬化型樹脂の硬化促進のために、光重合開始剤を紫外線硬化型樹脂に対して2~30質量%の範囲内で含有することが好ましい。光重合開始剤としては、光照射によりカチオン重合を開始させるルイス酸を放出するオニウム塩の複塩の一群が特に好ましい。
また、クリアハードコート層には、耐傷性、滑り性や屈折率を調整するために無機化合物又は有機化合物の微粒子を含んでも良い。
フィルム基材上に、クリアハードコート層を形成した後、当該クリアハードコート層に活性エネルギー線、好ましくは紫外線を照射して、最終的にクリアハードコート層を硬化する。
本発明のガスバリアー性フィルムの製造方法においては、上記クリアハードコート層上にガスバリアー層が形成される。
ガスバリアー性フィルムを構成するガスバリアー層で、図3で示すような磁場を印加したローラー間に放電空間を有する放電プラズマ処理装置を用いて形成したガスバリアー層は、その元素プロファイルとして、層厚方向において屈折率の分布を有し、この屈折率分布において一つ以上の極値を持つ無機膜から構成されていることが好ましい。ガスバリアー層は、ケイ素、酸素及び炭素を含む材料から構成され、ケイ素、酸素及び炭素の含有率が異なる複数の層による積層構造を有する。
ガスバリアー層の層厚は、5~3000nmの範囲であることが好ましく、10~2000nmの範囲であることがより好ましく、100~1000nmの範囲であることが特に好ましい。
本発明においては、ガスバリアー層がプラズマ化学気相成長法により形成された層であることが好ましい。プラズマ化学気相成長法により形成されるガスバリアー層としては、例えば、図3に示すような放電プラズマ処理装置を用い、一方の面にクリアハードコート層が形成されたフィルム基材を一対の成膜ローラー上に配置し、この一対の成膜ローラー間に放電してプラズマを発生させるプラズマ化学気相成長法で形成された層であることがより好ましい。プラズマ化学気相成長法は、ペニング放電プラズマ方式のプラズマ化学気相成長法であっても良い。また、一対の成膜ローラー間に放電する際には、一対の成膜ローラーの極性を交互に反転させることが好ましい。
ガスバリアー層は、上述のように生産性の観点からロールtoロール方式でクリアハードコート層を有するフィルム基材上に形成されることが好ましい。プラズマ化学気相成長法によりガスバリアー層を製造することができる装置としては、特に制限されないが、少なくとも一対の成膜ローラーと、プラズマ電源とを備え、かつ、成膜ローラー間において放電することが可能な構成となっている装置であることが好ましい。
図3は、本発明に係るガスバリアー層の形成に好適な放電プラズマ処理装置の一例を示す模式図である。
本発明のガスバリアー性フィルムの製造方法においては、上記ガスバリアー層上に第2のガスバリアー層が形成されることが好ましい。
ポリシラザン含有塗布液には、成膜性、クラック等の欠陥が少ないこと、残留有機物の少なさの観点から、例えば、パーヒドロポリシラザン、オルガノポリシラザン等のポリシラザン、シルセスキオキサン等のポリシロキサン等が含有されている。中でも、ガスバリアー性能が高く、屈曲時及び高温高湿条件下においてもガスバリアー性能が維持されることから、ポリシラザンがより好ましく、パーヒドロポリシラザンが特に好ましい。
塗布法により形成された第2のガスバリアー層の改質処理は、ケイ素化合物の酸化ケイ素又は酸窒化ケイ素等への転化反応を指し、具体的には本発明のポリシラザン含有塗布液を塗布して得られた塗膜を、ガスバリアー性が発現できる程度の無機薄膜に変化させる処理をいう。
本発明のガスバリアー性フィルムには、上記説明した各構成層の他に、本発明の目的効果を損なわない範囲で、他の機能性層を設けても良い。例えば、ブリードアウト防止層、平滑層、アンチグレア層等を挙げることができる。
上記した本発明のガスバリアー性フィルムは、例えば、有機EL素子、太陽電池素子、液晶表示素子等の電子素子に設けられて電子デバイスを構成することが好ましい。
また、本発明の電子デバイスは、上記本発明の電子デバイスの製造方法により製造されたことを特徴としている。
(フィルム基材の準備)
あらかじめ片面に保護フィルムが貼り合わされた、シクロオレフィンポリマーからなるフィルム基材(厚さ50μm、幅1350mm)のロールを準備した。
上記準備したフィルム基材の保護フィルムが設けられた面の反対側の面に、コロナ処理を施し、当該処理面にPET製の保護ラミネート部材-1(厚さ50μm、幅1300mm)を貼合した。続いて、フィルム基材の幅手方向の寸法と保護ラミネート部材-1の幅手方向の寸法が同一(幅1280mm)となるように、積層体の幅手方向端部を裁断し巻き取った。
次いで、フィルム基材の両面のうち保護ラミネート部材-1が設けられていない面に、マイクログラビアを用いてアクリル酸エステル及びアモルファスシリカを主成分とした紫外線硬化型樹脂(JSR社製オプスターZ7527)及び界面活性剤(AGCセイミケミカル社製サーフロンS-651)を含有したクリアハードコート層形成用塗布液を、ドライ膜厚0.7μmになるように塗布し、乾燥した。
次いで、高圧水銀ランプを使用して、大気下で当該塗膜に光量270mJ/cm2で紫外線照射して硬化し、クリアハードコート層-1を形成した。
次いで、下記の方法に従って、クリアハードコート層-1上にガスバリアー層を形成し巻き取った。
上記クリアハードコート層-1を形成したフィルム基材を、図3に示す磁場を印加したローラー間に放電空間を形成することができる放電プラズマ処理装置を用い、上記クリアハードコート層-1を有するフィルム基材のロールを装着し、下記製膜条件にて、フィルム基材のクリアハードコート層-1上にガスバリアー層-1を、層厚100nmで形成してガスバリアー性フィルム101を作製した。
原料ガス(HMDSO)の供給量:50sccm(Standard Cubic Centimeter per Minute)
酸素ガス(O2)の供給量:500sccm
真空チャンバー内の真空度:3Pa
プラズマ発生用電源からの印加電力:1.2kW
プラズマ発生用電源の周波数:80kHz
フィルムの搬送速度:0.5m/min
上記ガスバリアー性フィルム101の作製において、保護ラミネート部材の貼合、フィルム基材の表面処理を以下のように行った以外は同様にして、ガスバリアー性フィルム102を作製した。
次に、フィルム基材から保護フィルムを剥離し、フィルム基材の当該保護フィルムが貼り合わせられていた面に、コロナ処理を施した。コロナ処理を施したフィルム基材を巻き取り、両面にコロナ処理が施され片面には保護ラミネート部材-1が貼り合わされたフィルム基材を得た。
上記ガスバリアー性フィルム101の作製において、ガスバリアー層-1上に、更に下記のようにしてガスバリアー層-2を設けた以外は同様にして、ガスバリアー性フィルム103を作製した。
上記ガスバリアー層-1を形成したのち、ガスバリアー層-1上に下記湿式塗布法にてガスバリアー層-2を形成した。
まず、ポリシラザン含有塗布液として、パーヒドロポリシラザン(PHPS:アクアミカ NN120-10、無触媒タイプ、AZエレクトロニックマテリアルズ(株)製)の10質量%ジブチルエーテル溶液を調製した。
調製したポリシラザン含有塗布液をディップコートにて、乾燥後の平均層厚が300nmとなるように上記ガスバリアー層-1上に塗布し、温度85℃、湿度55%RHの雰囲気下で1分間乾燥させた。更に、温度25℃、湿度10%RH(露点温度-8℃)の雰囲気下に10分間保持し、除湿処理を行ってポリシラザンを含有する塗布膜を形成した。その後下記の条件でエキシマ光照射処理を行い、ガスバリアー層-1上に、第2のガスバリアー層として塗布型のガスバリアー層-2を形成した。
照射波長:172nm
ランプ封入ガス:Xe
エキシマランプ光強度:130mW/cm2(172nm)
試料と光源の距離:1mm
フィルム加熱温度:70℃
照射装置内の酸素濃度:1.0%
エキシマランプ照射時間:5秒
上記ガスバリアー性フィルム101の作製において、クリアハードコート層-1の形成時に、クリアハードコート層形成用塗布液をドライ層厚が0.5μmになるように塗布した以外は同様にして、ガスバリアー性フィルム104を作製した。
上記ガスバリアー性フィルム104の作製において、ガスバリアー層-1上に、上記ガスバリアー性フィルム103の作製と同様にしてガスバリアー層-2を設けた以外は同様にして、ガスバリアー性フィルム105を作製した。
上記ガスバリアー性フィルム103の作製において、クリアハードコート層-1の形成時に、クリアハードコート層形成用塗布液をドライ層厚がそれぞれ0.3μm、1.0μmになるように塗布した以外は同様にして、ガスバリアー性フィルム106、107を作製した。
上記ガスバリアー性フィルム101の作製において、クリアハードコート層-1の形成時に、クリアハードコート層形成用塗布液をドライ層厚が2.0μmになるように塗布した以外は同様にして、ガスバリアー性フィルム108を作製した。
上記ガスバリアー性フィルム108の作製において、ガスバリアー層-1上に、上記ガスバリアー性フィルム103の作製と同様にしてガスバリアー層-2を設けた以外は同様にして、ガスバリアー性フィルム109を作製した。
上記ガスバリアー性フィルム101の作製において、クリアハードコート層-1を設けた後に、フィルム基材の他方の面に、更に下記のようにしてクリアハードコート層-2を設けた以外は同様にして、ガスバリアー性フィルム110を作製した。
なお、ガスバリアー層-1は、クリアハードコート層-2上に設けた。
クリアハードコート層-1を設けた後、フィルム基材から保護ラミネート部材-1を剥離し、クリアハードコート層-1上にPET製の保護ラミネート部材-2(厚さ50μm、幅1250mm)を貼合した。続いて、フィルム基材の幅手方向の寸法と保護ラミネート部材-2の幅手方向の寸法が同一(幅1230mm)となるように、積層体の幅手方向端部を裁断した。
上記ガスバリアー性フィルム110の作製において、クリアハードコート層-2の形成方法を下記のように変更した以外は同様にして、ガスバリアー性フィルム111を作製した。
上記ガスバリアー性フィルム101の作製において、フィルム基材の厚さを100μmに変更した以外は同様にして、ガスバリアー性フィルム112を作製した。
上記ガスバリアー性フィルム101の作製において、フィルム基材に保護ラミネート部材-1を貼り合わせることなくクリアハードコート層-1の形成を行った以外は同様にして、ガスバリアー性フィルム113を作製した。
上記ガスバリアー性フィルム102の作製において、フィルム基材に保護ラミネート部材-1を貼り合わせることなくクリアハードコート層-1の形成を行った以外は同様にして、ガスバリアー性フィルム114を作製した。
上記作製した各ガスバリアー性フィルムについて、以下の観点でガスバリアー性フィルムとしての機能を評価した。
作製したガスバリアー性フィルムを、長さ100mm、幅1230mmに切り出し、幅手方向両端部から10mmまでの範囲内において、ひびや破断等のダメージの有無を目視により確認した。確認結果を下記の基準で評価した。
3:フィルム基材の幅手方向全体にひび及び破断は見られず、使用可能
2:フィルム基材の両端部から10mmまでの範囲内の一部にひび又は破断が見られる
1:フィルム基材の両端部から10mmまでの範囲内のほとんどにひび又は破断が見られる
まず、作製したガスバリアー性フィルム101~114を用いて、以下のようにして有機EL素子を作製した。
各ガスバリアー性フィルム101~114から保護ラミネート部材-1又は保護ラミネート部材-2を取り除き、幅手方向端部から20mmの領域から所定のサイズに切り出した。当該ガスバリアー性フィルムを市販の真空蒸着装置の基材ホルダーに固定し、下記化合物No.10をタングステン製の抵抗加熱ボートに入れ、これら基材ホルダーと抵抗加熱ボートとを真空蒸着装置の第1真空槽内に取り付けた。また、タングステン製の抵抗加熱ボートに銀(Ag)を入れ、真空蒸着装置の第2真空槽内に取り付けた。
作製した有機EL素子について、1mA/cm2の電流を印加して発光させた。次いで、印加直後と、50℃、80%RHの環境下で発光時間として、300時間及び500時間で連続発光させた後の発光状態について、100倍の光学顕微鏡(株式会社モリテックス製 MS-804、レンズMP-ZE25-200)で、有機EL素子の一部分を拡大して撮影した。次いで、撮影画像を2mm四方に切り抜き、それぞれの画像について、ダークスポット発生の有無を観察した。観察結果より、発光面積に対するダークスポットの発生面積比率を求め、下記の基準に従って、ダークスポット耐性を評価した。
5:500時間発光後の試料でも、ダークスポットの発生は全く認められない
4:300時間発光後の試料でも、ダークスポットの発生は全く認められないが、500時間発光後の試料で、僅かにダークスポットの発生が認められる(発生面積0.1%以上、3.0%未満)
3:300時間発光後の試料で、僅かにダークスポットの発生が認められる(発生面積0.1%以上、3.0%未満)
2:300時間発光後の試料で、明らかなダークスポットの発生が認められる(発生面積3.0%以上、6.0%未満)
1:300時間発光後の試料で、多数のダークスポットの発生が認められる(発生面積6.0%以上)
したがって、本発明の製造方法によれば、シクロオレフィンポリマー又はシクロオレフィンコポリマーを含有するフィルム基材を用い、当該フィルム基材の破断やひびの発生を抑制することができているものといえる。
また、クリアハードコート層の層厚が0.5~1.0μmであると、ガスバリアー性フィルムの有機EL素子搭載時に、ダークスポットの発生が抑制されていることが分かる。これは、クリアハードコート層の層厚を当該範囲内とすることで、フィルム基材の強度をより向上させることができているためと考えている。
また、クリアハードコート層をフィルム基材の両面に設けた場合にも、フィルム基材の破断やひびの発生を抑制することができていることが分かる。また、その場合、1層目のクリアハードコート層形成後にフィルム基材等の積層体を裁断するタイミングは、フィルム基材の両面側に保護ラミネート部材が設けられているときでも良いし、フィルム基材の片面側のみに保護ラミネート部材が設けられているときでも良いことが分かる。
2 フィルム基材
3 クリアハードコート層
4 クリアハードコート層
5 ガスバリアー層
6 第2のガスバリアー層
7 保護ラミネート部材
8 保護フィルム
9 保護ラミネート部材
11 送り出しローラー
21、22、23、24 搬送ローラー
30 放電プラズマ処理装置
31、32 成膜ローラー
41 ガス供給管
51 プラズマ発生用電源
61、62 磁場発生装置
71 巻取りローラー
Claims (7)
- シクロオレフィンポリマー又はシクロオレフィンコポリマーを含有するフィルム基材上にクリアハードコート層及びガスバリアー層をこの順に設けるガスバリアー性フィルムの製造方法であって、
前記クリアハードコート層を設ける前に、前記フィルム基材の前記クリアハードコート層が設けられる面とは反対側の面に、保護ラミネート部材を設ける工程と、
前記フィルム基材の幅手方向の寸法と前記保護ラミネート部材の幅手方向の寸法が同一となるように、前記フィルム基材及び前記保護ラミネート部材を含む積層体の幅手方向端部を裁断する工程と、を有することを特徴とするガスバリアー性フィルムの製造方法。 - 前記クリアハードコート層の層厚が、0.5~1μmの範囲内であることを特徴とする請求項1に記載のガスバリアー性フィルムの製造方法。
- 前記フィルム基材の厚さが、30~100μmの範囲内であることを特徴とする請求項1又は請求項2に記載のガスバリアー性フィルムの製造方法。
- 前記ガスバリアー層上に、塗布法により第2のガスバリアー層を設ける工程を更に有することを特徴とする請求項1から請求項3までのいずれか一項に記載のガスバリアー性フィルムの製造方法。
- 請求項1から請求項4までのいずれか一項に記載のガスバリアー性フィルムの製造方法により製造されたことを特徴とするガスバリアー性フィルム。
- シクロオレフィンポリマー又はシクロオレフィンコポリマーを含有するフィルム基材上にクリアハードコート層及びガスバリアー層がこの順に設けられたガスバリアー性フィルムを備えた電子デバイスの製造方法であって、
前記クリアハードコート層を設ける前に、前記フィルム基材の前記クリアハードコート層が設けられる面とは反対側の面に、保護ラミネート部材を設ける工程と、
前記フィルム基材の幅手方向の寸法と前記保護ラミネート部材の幅手方向の寸法が同一となるように、前記フィルム基材及び前記保護ラミネート部材を含む積層体の幅手方向端部を裁断する工程と、
前記フィルム基材から前記保護ラミネート部材を剥離して除去する工程と、
前記フィルム基材を電子素子に設ける工程と、を有することを特徴とする電子デバイスの製造方法。 - 請求項6に記載の電子デバイスの製造方法により製造されたことを特徴とする電子デバイス。
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CN110225823A (zh) * | 2017-01-18 | 2019-09-10 | 柯尼卡美能达株式会社 | 功能性膜层叠体及电子器件的制造方法 |
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