WO2015141577A1 - Élément de maintien de fibre optique, endoscope et procédé de production d'élément de maintien de fibre optique - Google Patents

Élément de maintien de fibre optique, endoscope et procédé de production d'élément de maintien de fibre optique Download PDF

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Publication number
WO2015141577A1
WO2015141577A1 PCT/JP2015/057463 JP2015057463W WO2015141577A1 WO 2015141577 A1 WO2015141577 A1 WO 2015141577A1 JP 2015057463 W JP2015057463 W JP 2015057463W WO 2015141577 A1 WO2015141577 A1 WO 2015141577A1
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Prior art keywords
optical fiber
holding member
wafer
fiber holding
hole
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Application number
PCT/JP2015/057463
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English (en)
Japanese (ja)
Inventor
和也 前江田
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オリンパス株式会社
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Publication of WO2015141577A1 publication Critical patent/WO2015141577A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00163—Optical arrangements
    • A61B1/00165—Optical arrangements with light-conductive means, e.g. fibre optics
    • A61B1/0017—Details of single optical fibres, e.g. material or cladding
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/0011—Manufacturing of endoscope parts
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material

Definitions

  • the present invention relates to an optical fiber holding member having a through hole into which an optical fiber is inserted, an endoscope in which an optical transmission module disposed at a distal end portion of the insertion portion has the optical fiber holding member, and the optical fiber holding member It relates to the manufacturing method.
  • an optical transmission module including an optical element and an optical fiber that transmits light of an optical signal output from the light emitting unit of the optical element
  • accurate positioning of the light emitting unit and the optical fiber is important.
  • JP2013-025092A discloses an optical fiber holding member having an optical element, a substrate on which the optical element is mounted, and an optical fiber insertion through hole for transmitting an optical signal output from the optical element (A optical transmission module including a holding member or a ferrule) is disclosed. By positioning the optical fiber into the through hole of the holding member, the light emitting portion of the optical element and the optical fiber are positioned.
  • the holding member has a circular through hole, and the optical fiber inserted into the through hole is fixed by an adhesive.
  • the inner diameter of the through hole the same as the outer diameter of the optical fiber.
  • the fixing with the adhesive is insufficient and the reliability is deteriorated.
  • a sufficient gap is provided around the optical fiber, the positioning accuracy of the optical fiber is lowered.
  • the optical transmission module disposed at the distal end portion of the endoscope is required to be reduced in size and particularly reduced in diameter because of minimal invasiveness, its holding member is extremely small and must be manufactured in large quantities with high accuracy. could not be easy.
  • An embodiment of the present invention includes an optical fiber holding member that can fix an optical fiber with high accuracy and has excellent reliability, and an optical transmission module in which the optical fiber holding member is disposed at a distal end portion of an insertion portion. It is an object of the present invention to provide a endoscope and a method for manufacturing the optical fiber holding member.
  • An optical fiber holding member has a through hole in which an optical fiber is inserted and fixed with a resin, and a rectangular parallelepiped first base material having a square or triangular groove on its main surface, A rectangular parallelepiped second base material having a joint surface having the same size as the main surface and joined to the main surface of the first base material.
  • An endoscope includes a first base member having a rectangular parallelepiped shape having a through-hole into which an optical fiber is inserted and fixed with a resin, and having a cross section of a square or a triangle on a main surface thereof, and the first An optical fiber holding member having a rectangular parallelepiped second base material joined to the main surface of the base material and having a joint surface of the same size as the main surface is disposed at the distal end of the insertion portion.
  • the optical transmission module has.
  • a groove forming step of forming a plurality of grooves having a square or triangular cross section on the main surface of the first wafer, and the main surface of the first wafer A bonding step of bonding the bonding surface of the second wafer and the bonding surface of the second wafer, and dividing the bonding wafer into individual optical fiber holding members having a rectangular parallelepiped shape having through holes into which the optical fibers are inserted and fixed with resin.
  • an optical fiber holding member that can fix an optical fiber with high accuracy and has excellent reliability, and an optical transmission module in which the optical fiber holding member is disposed at a distal end portion of an insertion portion are provided.
  • An endoscope and a method for manufacturing the optical fiber holding member can be provided.
  • the optical transmission module 1 including the optical fiber holding member (hereinafter referred to as “holding member”) 40 according to the first embodiment will be described with reference to FIG.
  • the optical transmission module 1 is, for example, a so-called E / O module that converts an electrical signal into an optical signal and transmits the optical signal.
  • the optical transmission module 1 includes an optical element 10, a wiring board 20, a holding member 40, and an optical fiber 50.
  • the optical element 10, the wiring board 20, and the holding member 40 are arranged side by side in the thickness direction (Z direction) of the optical element 10.
  • the optical element 10 is a surface emitting laser chip having a light emitting unit 11 that outputs light of an optical signal.
  • the ultra-small optical element 10 has a light emitting part 11 having a planar view size of 250 ⁇ m ⁇ 300 ⁇ m, a diameter of 20 ⁇ m, and an electrode 12 that supplies a drive signal to the light emitting part 11 on the main surface (light emitting surface).
  • the flat wiring board 20 having the first main surface 20SA and the second main surface 20SB has a hole (through hole) 20H through which the optical fiber 50 is inserted.
  • the size and shape of the hole 20H are not particularly limited as long as the optical fiber 50 can be inserted.
  • As the substrate of the wiring board 20 an FPC substrate, a ceramic substrate, a glass epoxy substrate, a glass substrate, a silicon substrate, or the like is used.
  • the optical element 10 is flip-chip mounted on the first main surface 20SA of the wiring board 20 in a state where the light emitting portion 11 is disposed at a position facing the hole 20H of the wiring board 20. That is, the wiring board 20 has an electrode pad 21 connected to the electrode 12 of the optical element 10.
  • an Au bump that is the electrode 12 of the optical element 10 is ultrasonically bonded to the electrode pad 21 of the wiring board 20.
  • an adhesive such as an underfill material or a sidefill material may be injected into the joint portion.
  • the wiring board 20 has an electrode pad (not shown) connected to the imaging unit 2A (see FIG. 15) and a wiring (not shown) for transmitting a drive signal to the electrode pad 21.
  • the wiring board 20 may include a processing circuit for converting an electrical signal into a drive signal for the optical element 10.
  • the optical fiber 50 having an outer diameter D50 of 125 ⁇ m includes a core that transmits light and an outer diameter of 50 ⁇ m, and a clad that covers the outer periphery of the core.
  • the holding member 40 is joined to the optical element 10 via the wiring board 20.
  • the tip of the optical fiber 50 is inserted into the through hole 40H of the holding member 40. Since the optical element 10 and the wiring board 20, and the wiring board 20 and the holding member 40 are aligned, by inserting the optical fiber 50 into the through hole 40H, the light emitting unit 11 and the optical fiber 50 of the optical element 10 Is positioned with high accuracy.
  • the resin 30 (see FIG. 3) injected for fixing the optical fiber 50 is filled in the corners of the four corners of the through hole 40H having a substantially square cross section. That is, the corner portion becomes the resin filling portion. For this reason, the optical transmission module 1 is highly reliable because it can be reliably fixed with an adhesive.
  • the holding member 40 includes a rectangular parallelepiped first base member 41 and a rectangular parallelepiped second base member 42 joined to the first base member 41 without interposing other members. . Since it is produced by dicing of the bonded wafer as will be described later, there is no step on the bonding surface between the first base material 41 and the second base material 42 of the holding member 40, and they have the same size.
  • the first base 41 is a so-called SOI (Silicon On Insulator) substrate composed of a silicon layer having a three-layer structure. That is, in the first base material 41, an active layer (SOI layer) 41C is disposed on a support substrate layer (substrate layer) 41A via a buried silicon oxide film (Buried Oxide: BOX layer) 41B. .
  • the thickness D41C of the active layer 41C is, for example, 20 ⁇ m to 300 ⁇ m
  • the thickness D41B of the BOX layer 41B is 1 ⁇ m to several tens of ⁇ m
  • the thickness D41A of the substrate layer 41A is 10 ⁇ m to several hundreds of ⁇ m.
  • the thickness D42 of the second base material 42 made of silicon is 10 ⁇ m to several hundred ⁇ m.
  • the holding member 40 has a through hole 40H having a substantially square cross section in which the active layer 41C and the BOX layer 41B of the first base material 41 are partially etched.
  • the depth D40 of the through hole 40H is the same as (the thickness D41C of the active layer 41C + the thickness D41B of the BOX layer 41B).
  • the depth D40 is substantially the same as the outer diameter D50 of the optical fiber 50.
  • (D50 + 10 ⁇ m) ⁇ D40 ⁇ D50 preferably (D50 + 2 ⁇ m) ⁇ D40 ⁇ (D50 + 1 ⁇ m).
  • the thickness D41C of the active layer 41C and the thickness D41B of the BOX layer 41B can be managed extremely accurately when the wafer 41W (see FIG. 5) is manufactured.
  • the width W40 of the through hole 40H is set to be the same as the depth D40. Since the width W40 is determined by the dimensional accuracy of the mask pattern provided by photolithography when forming the groove 40T (see FIG. 5) to be the through hole 40H as described later, it can be managed very accurately.
  • the width W40 may be slightly different from the depth D40.
  • the cross-sectional shape of the through hole 40H may be a substantially square shape of (1.1 ⁇ W40) ⁇ D40 ⁇ (0.9 ⁇ W40).
  • both the bonding surface 41SA of the first base material 41 and the bonding surface 42SA of the second base material 42 have a high flatness with a flatness ttv (total thickness variation) of 1 ⁇ m or less, preferably 0.5 ⁇ m or less, for example. It is a part of the surface of the wafers 41W and 40W (see FIGS. 5 and 6) having the property.
  • the flatness ttv is the difference between the maximum value and the minimum value of the entire height measured in the thickness direction with the back surface as the reference surface.
  • the optical fiber 50 is inserted into the through-hole 40 ⁇ / b> H having a cross-sectional shape of the holding member 40 that is substantially square and fixed with the resin 30.
  • the holding member 40 has high reliability because the first base material 41 and the second base material 42 are directly joined instead of being joined indirectly through another member (such as an adhesive).
  • the outer periphery of the optical fiber 50 inserted in the through hole 40H is in contact with the through hole 40H and the wall surface at four places. There are spaces (resin filling portions) filled with the resin 30 at the corners of the four corners of the through hole 40H.
  • the holding member 40 is excellent in reliability while being able to fix the optical fiber 50 with high accuracy.
  • the projection surface S ⁇ b> 40 of the optical fiber holding member 40 is included in the projection surface S ⁇ b> 1 on the long axis vertical surface (XY plane) of the light transmission module 1. That is, the projection plane S1 on the long axis vertical plane of the wiring board 20 determines the thickness (diameter) of the optical transmission module 1. For this reason, the optical transmission module 1 has a small diameter.
  • a plurality of grooves 40T having a square cross section are formed on the main surface 41SA of the first wafer 41W that is an SOI wafer.
  • an active layer (SOI layer) 41CW is disposed on a support substrate layer (substrate layer) 41AW via a buried silicon oxide film (BOX layer) 41BW.
  • the thickness of the active layer 41CW is, for example, 20 ⁇ m to 300 ⁇ m
  • the thickness of the BOX layer 41BW is 1 ⁇ m to several tens of ⁇ m
  • the thickness of the substrate layer 41AW is 10 ⁇ m to several hundred ⁇ m.
  • a mask layer (not shown) is formed on the entire main surface 41SA of the active layer 41CW of the first wafer 41W, and the mask layer is patterned by photolithography and is not covered with the mask pattern.
  • the active layer 41CW is anisotropically etched by RIE (Reactive Ion Etching), for example, ICP-RIE (Inductively Coupled Plasma -RIE), so that a plurality of grooves are formed on the main surface 41SA. 40T is formed.
  • RIE Reactive Ion Etching
  • ICP-RIE Inductively Coupled Plasma -RIE
  • the mask layer it is preferable to use a silicon oxide film (SiO 2 ) in order to perform highly accurate processing.
  • SiO 2 silicon oxide film
  • the photoresist is patterned by photolithography, and then the silicon oxide film not covered with the resist pattern is removed.
  • a desired mask pattern consisting of Note that a photoresist pattern may be used as the mask pattern for cost reduction.
  • the BOX layer 41B becomes a so-called etching stop layer with an extremely low etching rate, high-precision processing is possible. That is, the depth D40 of the groove 40T can be easily and accurately managed.
  • the width W40 of the groove 40T is reduced. This is preferable because it can be managed accurately.
  • the bottom surface of the groove 40T is the substrate layer 41A.
  • the BOX layer 41B may not be removed depending on the specifications of the holding member 40 and the like.
  • the depth D40 of the groove 40T is the thickness D41 of the active layer 41CW
  • the bottom surface of the groove 40T is the BOX layer 41B.
  • the main surface 41SA of the first wafer 41W which is an SOI wafer
  • the bonding surface 42SA of the second wafer 42W made of silicon are directly bonded without interposing other members. Then, the bonded wafer 40W is manufactured.
  • An elongated space serving as a through hole 40H is formed by the three side surfaces of the groove portion 40T of the first wafer 41W and the bonding surface 42SA of the second wafer 42W. Since the bonding surface 42SA of the second wafer 42W is a flat surface, high accuracy is not required for alignment at the time of bonding, and therefore alignment is easy.
  • the bonding surface 42SA of the second wafer 42W is processed to have the same high flatness ttv as the main surface 41SA of the first wafer 41W.
  • the main surface 41SA of the first wafer 41W and the bonding surface 42SA of the second wafer 42W are irradiated with an ion beam in a high vacuum, and the surface oxide film and adsorbed substances are removed, and the both are pasted.
  • the direct bonding method is not limited to the above-described room temperature bonding method in vacuum, and a diffusion bonding method in which heat treatment is performed after bonding at room temperature in the atmosphere may be used.
  • a thin oxide film is formed by slightly oxidizing the surface of the main surface 41SA and the bonding surface 42SA in a hydrophilic treatment process including cleaning and surface treatment using a chemical such as acid and pure water. After the hydrophilic surface main surface 41SA and the bonding surface 42SA are bonded to each other by hydrogen bonding, the two are strongly bonded by, for example, heat treatment at 1000 ° C.
  • an anodic bonding method can also be used.
  • the main surface 41SA and the bonding surface 42SA are bonded together in the atmosphere and heated while applying a voltage of, for example, about 400 V to 500 V, so that ions in the glass move to the bonding interface and are covalently bonded. Occurs and is joined.
  • the bonded wafer 40W is divided by dicing, and a plurality of rectangular parallelepiped optical fiber holding members having through holes 40H into which the optical fibers 50 are inserted and fixed by the resin 30. It is divided into 40 pieces.
  • stealth dicing For dicing, cutting with a dicing saw, fluorine plasma etching, laser dicing, or the like is used. In particular, so-called stealth dicing is preferable because processing damage can be reduced.
  • laser light having a wavelength that is transparent to the wafer is condensed by the objective lens optical system so as to focus on the inside of the wafer, and scanned along a cutting line.
  • a reforming layer is formed in the light condensing region, and cracks perpendicular to the front surface and the back surface of the wafer are generated starting from the modified region, and are separated into individual pieces.
  • the manufacturing method of the optical fiber holding member 40 of the present embodiment can be mass-produced by a batch process and can be produced at low cost.
  • the second wafer is the second wafer 42W, and the second base material 42 is made of silicon.
  • the second wafer, that is, the second substrate 42 may be glass.
  • the optical fiber holding member of the modified example has particularly high productivity. high.
  • the optical fiber holding member 40A of the second embodiment and the method for manufacturing the holding member 40A will be described. Since the holding member 40A and the like are similar to the holding member 40 and the like, the same components are denoted by the same reference numerals and description thereof is omitted.
  • the groove forming step S10 becomes a groove on the third wafer 44W made of silicon.
  • a through hole forming step (step S12) for forming a hole 44H having a square cross section passing through the two main surfaces and the third wafer 44W and the fourth wafer 43W made of silicon are directly joined without any other member. Then, the first wafer 45 is manufactured (step S13).
  • Both the bonding surface of the third wafer 44W and the bonding surface of the fourth wafer 43W have high flatness, for example, a flatness ttv of 1 ⁇ m or less, preferably 0.5 ⁇ m or less.
  • a flatness ttv of 1 ⁇ m or less, preferably 0.5 ⁇ m or less.
  • a different method may be used.
  • a diffusion bonding method may be used in step S13, and a room temperature bonding method may be used in step S20.
  • the holding member 40A includes a third base material 44 made of silicon having a hole penetrating between two main surfaces in which the first base material 45 has a square cross section, a third base material 44, and the like. And a fourth base material 43 made of silicon having a joint surface having the same size as the joint surface of the third base material 44 and joined without using any member.
  • the manufacturing method of the holding member 40A and the holding member 40A has the effect of the holding member 40 and the like, and furthermore, since no SOI wafer is used, it can be manufactured at low cost. Further, since the depth D40 of the through hole 40H is determined by the thickness of the third wafer 44W, it can be easily and accurately managed.
  • the third wafer 43W and the fourth wafer 44W were silicon.
  • the fourth wafer 44W may be glass.
  • the fourth wafer made of glass can be bonded by anodic bonding without using other members in the first wafer manufacturing process.
  • the optical fiber holding member 40B is joined to the first base member 46 having a rectangular parallelepiped groove 46V on the main surface 46SA and the main surface 46SA of the first base member 46. And a rectangular parallelepiped second base material 42 having a joint surface 42SA having the same size as the main surface 46SA.
  • the groove forming step is formed by anisotropic wet etching.
  • a (100) silicon wafer is used as the first wafer serving as the first substrate.
  • an alkaline solution such as a KOH (potassium hydroxide) solution or a TMAH (tetramethylammonium hydroxide) solution is used.
  • the (111) plane formed by anisotropic wet etching of the silicon wafer becomes the wall surface of the triangular groove 46V.
  • a resist patterned by photolithography is used as an etching mask.
  • the depth D46 of the V groove formed on the silicon (100) surface by anisotropic etching is uniquely determined by the width of the opening. Since the width of the opening, that is, the opening of the etching mask can be accurately arranged by photolithography, the depth D46 of the groove 46V can be accurately managed.
  • the optical fiber 50 comes into contact with the three side surfaces of the through hole 40BH, that is, the two wall surfaces of the groove 46V and the bonding surface 4 of the second base material 42, respectively.
  • the three corners on the outer periphery of the through hole 40BH serve as the resin adhesive filling portion.
  • the manufacturing method of the optical fiber holding member 40B and the holding member 40B has the effect of the holding member 40 and the like, and the groove 46V is formed by wet etching, so the productivity is high.
  • the optical fiber holding member 40C has two grooves 47V (47V1, 47V2) having a triangular cross section parallel to the groove 47T on both sides of the groove 47T of the main surface 47SA of the first base material 47.
  • the optical fiber holding member 40C has two second through holes 40CH1 and 40CH2 having a triangular cross section parallel to the through hole 40CH on both sides of the through hole 40CH into which the optical fiber is inserted.
  • the second through holes 40CH1 and 40CH2 are used as alignment marks when the optical fiber holding member 40C is mounted on the wiring board 20.
  • the second through holes 40CH1 and 40CH2 may have a cross section other than a triangle.
  • the second through holes 40CH1 and 40CH2, that is, the two grooves 47V may be formed in the second base material 42C, but are formed in the first base material 47 from the viewpoint of positional accuracy. Is preferred.
  • the groove 47V is preferably anisotropic wet etching from the viewpoint of accuracy improvement and processability, but other etching means may be used.
  • optical fiber holding member 40C and the manufacturing method of the optical fiber holding member 40C have the effect of the holding member 40 and the like, and can be mounted with high accuracy by the alignment marks (second through holes 40CH1, 40CH2).
  • the cross-sectional area of the opening at the end where the optical fiber 50 of the through hole 40DH is inserted is larger than the cross-sectional area at the center, and the wall surface of the end is tapered. Is.
  • the side surface of the groove 48T of the main surface 48SA of the first base material 48 is tapered.
  • a groove 42T having a tapered side surface is also formed on the bonding surface 42SA of the second base material 42D. Note that it is easy to process by using a (100) silicon wafer as the second wafer to be the second base material 42D and forming a tapered surface by exposing the (111) surface by anisotropic wet etching. It is preferable from the viewpoint.
  • the groove 42T of the second base material 42D may not be formed.
  • the cross-sectional area of the opening at the end opposite to the end where the optical fiber 50 is inserted may be larger than the cross-sectional area at the center, and the wall surface of the end may be tapered.
  • the optical fiber holding member 40D and the manufacturing method of the holding member 40D have the effect of the holding member 40 and the like, and are easy to insert into the through hole 40DH at the tip of the optical fiber 50, and are high in productivity and inexpensive.
  • the taper part of through-hole 40DH also has a function as an adhesive absorption region for preventing excessive adhesive from overflowing.
  • the cross-sectional area of the opening at the end on the side to be inserted is preferably 1.5 to 5 times the cross-sectional area of the central part.
  • the holding member 40E As shown in FIG. 14, in the holding member 40E, a first base member 46 having a rectangular parallelepiped groove 46V on the main surface 46SA and a second base member having a triangular cross-section groove 46AV on the main surface 46ASA.
  • the material 46A is joined.
  • the through hole 45EH of the holding member 40E includes a through hole 46H having a triangular cross section and 46AH having a triangular cross section.
  • the holding member 40E is similar to the holding member 40, but the through hole 45EH cannot hold the optical fiber 50 reliably unless the alignment accuracy between the through hole 46H and the through hole 46AH is high.
  • the optical transmission module 1 and the like of the embodiment already described has a second substrate, that is, the bonding surface of the second wafer is a flat surface, the holding member 40 and the like can be easily bonded. Productivity is high.
  • the endoscope 9 includes an insertion unit 3 in which the imaging unit 2 ⁇ / b> A is disposed at the distal end portion 2, and an operation unit 4 that is disposed on the proximal end side of the insertion unit 3. And a universal cord 5 extending from the operation unit 4.
  • a signal output from the imaging unit 2A is converted into an optical signal by the optical transmission module 1, and transmitted to the proximal end side through the optical fiber 50 into which the insertion unit 3 is inserted.
  • the optical transmission module 1 has any one of the optical fiber holding members 40 and 40A to 40E of the embodiment already described.
  • the optical fiber holding member 40 has the optical element 10, the wiring board 20 on which the optical element 10 is mounted, the optical fiber holding member 40, and the like.
  • the projection plane S40 of the optical fiber holding member 40 is included in the projection plane S1 onto the long axis vertical plane (XY plane). That is, the projection plane S1 on the long axis vertical plane of the wiring board 20 determines the thickness (diameter) of the optical transmission module 1. For this reason, the optical transmission module 1 has a small diameter.
  • the endoscope 9 Since the endoscope 9 has the optical fiber holding member 40 and the like with high reliability, the endoscope 9 has high reliability. Since the optical fiber holding member 40 and the like have a small diameter, the distal end portion 2 of the endoscope 9 has a small diameter and is less invasive.

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Abstract

Selon l'invention, un élément de maintien de fibre optique (40) comprend : une première base qui est un cuboïde (41) ayant une surface principale (41SA) pourvue d'une rainure (40T) ayant une section transversale carrée et a un trou traversant (40H) dans lequel une fibre optique (50) est insérée et fixée au moyen d'une résine (30) ; et une seconde base (42) qui est un cuboïde ayant une surface de liaison (42SA) qui est liée à la surface principale (41SA) de la première base et (41) et présente la même taille que la surface principale (41SA).
PCT/JP2015/057463 2014-03-19 2015-03-13 Élément de maintien de fibre optique, endoscope et procédé de production d'élément de maintien de fibre optique WO2015141577A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014056878A JP2015179207A (ja) 2014-03-19 2014-03-19 光ファイバ保持部材、内視鏡、および光ファイバ保持部材の製造方法
JP2014-056878 2014-03-19

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WO2015141577A1 true WO2015141577A1 (fr) 2015-09-24

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CN108697312A (zh) * 2016-02-17 2018-10-23 奥林巴斯株式会社 光传送模块和内窥镜
JPWO2017158721A1 (ja) * 2016-03-15 2019-01-24 オリンパス株式会社 光伝送モジュール及び内視鏡
US11971534B2 (en) 2019-03-05 2024-04-30 Olympus Corporation Optical transducer for endoscope, endoscope, and manufacturing method of optical transducer for endoscope

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WO2017145289A1 (fr) * 2016-02-24 2017-08-31 オリンパス株式会社 Module de transmission optique, endoscopes et procédé de fabrication de module de transmission optique
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US11971534B2 (en) 2019-03-05 2024-04-30 Olympus Corporation Optical transducer for endoscope, endoscope, and manufacturing method of optical transducer for endoscope

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