WO2017145289A1 - Module de transmission optique, endoscopes et procédé de fabrication de module de transmission optique - Google Patents

Module de transmission optique, endoscopes et procédé de fabrication de module de transmission optique Download PDF

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Publication number
WO2017145289A1
WO2017145289A1 PCT/JP2016/055452 JP2016055452W WO2017145289A1 WO 2017145289 A1 WO2017145289 A1 WO 2017145289A1 JP 2016055452 W JP2016055452 W JP 2016055452W WO 2017145289 A1 WO2017145289 A1 WO 2017145289A1
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WO
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Prior art keywords
optical
transmission module
optical transmission
wiring board
optical waveguide
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PCT/JP2016/055452
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English (en)
Japanese (ja)
Inventor
洋志 祝迫
悠輔 中川
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オリンパス株式会社
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Publication date
Application filed by オリンパス株式会社 filed Critical オリンパス株式会社
Priority to PCT/JP2016/055452 priority Critical patent/WO2017145289A1/fr
Priority to JP2018501472A priority patent/JPWO2017145289A1/ja
Publication of WO2017145289A1 publication Critical patent/WO2017145289A1/fr

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/06—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with illuminating arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present invention relates to an optical transmission module including an optical waveguide plate to which a wiring board on which an optical element is mounted is bonded, and an optical transmission including an optical waveguide plate to which a wiring board on which the optical element is mounted is bonded.
  • the present invention relates to a method of manufacturing an optical transmission module including an endoscope in which a module is disposed at a distal end hard portion of an insertion portion, and an optical waveguide plate to which a wiring board on which an optical element is mounted is bonded.
  • the endoscope has an image sensor such as a CCD at the distal rigid portion of the elongated insertion portion.
  • an imaging device having a high pixel number for an endoscope has been studied.
  • an optical transmission module can be used instead of electric signal transmission via metal wiring by electric signals.
  • Optical signal transmission through a thin optical fiber by the used optical signal is preferable.
  • the optical transmission module is a photoelectric module. That is, the optical transmission module includes an optical element, a wiring board on which the optical element is surface-mounted, an optical waveguide board bonded to the wiring board, and an optical fiber.
  • the optical element generates an optical signal by a drive signal from a signal cable connected to a wiring board. The optical signal is guided to the optical fiber through the optical waveguide.
  • the optical transmission module can be reduced in size by bonding the flexible wiring board to the optical waveguide board.
  • the polymer type optical waveguide plate is suitable for a small optical transmission module because it is easier to process and more flexible than an optical waveguide plate made of an inorganic material such as quartz.
  • JP2013-228467A discloses an optical transmission module in which a flexible printed wiring board on which an optical element is mounted and a polymer type optical waveguide board are bonded.
  • the electrode portion of the optical element is ultrasonically bonded to the pad portion of the wiring board.
  • a polymer type optical waveguide plate is made of a soft material with low hardness. For this reason, in an optical transmission module having a polymer-type optical waveguide plate, since the lower part of the joint is made of a resin material having low hardness, the ultrasonic wave is not effectively propagated to the joint and the optical element is poorly bonded. May occur and reliability may be reduced.
  • Embodiments of the present invention relate to an optical transmission module with high bonding reliability between an optical element and a wiring board, an endoscope having an optical transmission module with high bonding reliability between an optical element and a wiring board, and an optical element and a wiring board. It is an object of the present invention to provide a method for manufacturing an optical transmission module having high bonding reliability.
  • An optical transmission module includes a light emitting unit that outputs light of an optical signal or a light receiving unit that receives light of an optical signal, and an external electrode connected to the light emitting unit or the light receiving unit.
  • a first main surface and a second main surface opposite to the first main surface; a resin as a base; and the external electrode of the optical element as a bonding electrode of the first main surface Are connected to each other, and the upper surface is bonded to the second main surface of the wiring board via a resin adhesive layer, and the upper surface is bonded to the upper surface.
  • a polymer-type optical waveguide plate in which an optical waveguide formed in a parallel direction is optically coupled to the optical element by a reflecting portion, and an end surface and a front end surface of the optical waveguide of the optical waveguide plate are disposed to face each other, An optical fiber optically coupled to the optical waveguide, and the external electrode and the junction electrode Under the joint hardness is 10 times more rigid member of the wiring board and the optical waveguide plate is disposed with.
  • An endoscope includes a light emitting unit that outputs light of an optical signal or a light receiving unit that receives light of an optical signal, and an external electrode connected to the light emitting unit or the light receiving unit.
  • a first main surface and a second main surface opposite to the first main surface; a resin as a base; and the external electrode of the optical element as a bonding electrode of the first main surface Are connected to each other, and the upper surface is bonded to the second main surface of the wiring board via a resin adhesive layer, and the upper surface is bonded to the upper surface.
  • a polymer-type optical waveguide plate in which an optical waveguide formed in a parallel direction is optically coupled to the optical element by a reflecting portion, and an end surface and a front end surface of the optical waveguide of the optical waveguide plate are disposed to face each other,
  • Under the hardness is an optical transmission module is more than 10 times the hard member is disposed in the wiring board and the optical waveguide plate is arranged at the distal end rigid portion of the insertion portion.
  • a method of manufacturing an optical transmission module includes: a light emitting unit that outputs light of an optical signal or a light receiving unit that receives light of an optical signal; and an external electrode connected to the light emitting unit or the light receiving unit.
  • An optical element having a first main surface and a second main surface opposite to the first main surface, a resin as a base, and a bonding electrode of the first main surface on the bonding electrode of the optical element
  • a wiring board to which an external electrode is bonded ; and an upper surface and a lower surface opposite to the upper surface, wherein the upper surface is bonded to the second main surface of the wiring board via a resin adhesive layer,
  • an optical fiber optically coupled to the optical waveguide In the manufacturing method, a step of disposing a hard member having a hardness 10 times or more that of the wiring board and the optical waveguide plate below the bonding electrode, and ultrasonic bonding the external electrode and the bonding electrode. A process.
  • an optical transmission module with high bonding reliability between an optical element and a wiring board an endoscope having an optical transmission module with high bonding reliability between an optical element and a wiring board, and an optical element; It is possible to provide a method for manufacturing an optical transmission module having high bonding reliability with a wiring board.
  • FIG. 3 is a cross-sectional view of the optical transmission module according to the first embodiment taken along line III-III in FIG. 1.
  • FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1 of the optical transmission module according to the first embodiment.
  • It is a perspective view of the micro pin of the optical transmission module of a 1st embodiment.
  • It is a perspective view of the micro pin of the optical transmission module of a 1st embodiment.
  • the micro pin of the optical transmission module of a 1st embodiment is a perspective view of the micro pin of the optical transmission module of a 1st embodiment.
  • FIG. 11 is a cross-sectional view taken along line XII-XII in FIG. 10 of the optical transmission module according to the fourth embodiment. It is a top view of the light transmission module of 5th Embodiment.
  • FIG. 14 is a cross-sectional view taken along line XIV-XIV in FIG. 13 of the optical transmission module according to the fifth embodiment. It is a top view of the light transmission module of 6th Embodiment. It is an external view of the endoscope of 7th Embodiment.
  • an optical transmission module 1 includes an optical element 30, a wiring board 20, a polymer-type optical waveguide plate 10, an optical fiber 40, a substrate 29, And a micro pin 25.
  • the direction in which the Y-axis value in the figure increases is referred to as the upward direction.
  • the drawings based on each embodiment are schematic, and it should be noted that the relationship between the thickness and width of each part, the ratio of the thickness of each part, the relative angle, and the like are different from the actual ones. In some cases, the drawings may include portions having different dimensional relationships and ratios. Furthermore, illustration of some components may be omitted.
  • the optical element 30 is a light emitting element. That is, the optical element 30 is, for example, a VCSEL (Vertical Cavity Surface Emitting LASER: vertical cavity surface emitting laser) having a light emitting unit 31 that outputs light of an optical signal to the light emitting surface 30SA.
  • the ultra-small optical element 30 having a dimension in plan view of 250 ⁇ m ⁇ 300 ⁇ m includes a light emitting unit 31 having a diameter of 20 ⁇ m and two external electrodes 32 for supplying a driving signal to the light emitting unit 31 on the light emitting surface 30SA.
  • the optical element 30 emits light in a direction perpendicular to the light emitting surface 30SA (Y-axis direction).
  • the wiring board 20 and the substrate 29 are flexible FPC (Flexible Printed Circuits) wiring boards based on a resin such as polyimide.
  • FPC Flexible Printed Circuits
  • the wiring board 20 has a first main surface 20SA and a second main surface 20SB opposite to the first main surface 20SA, and the optical element 30 is ultrasonically bonded to the bonding electrode 24 of the first main surface 20SA. ing. Note that electronic components 39 such as a chip capacitor and a driving IC are also mounted on the first main surface 20SA.
  • the substrate 29 is a base of the optical waveguide plate 10.
  • the polymer type optical waveguide plate 10 has an upper surface 10SA and a lower surface 10SB facing the upper surface 10SA. That is, the optical waveguide plate 10 includes a core 11 made of a first resin having a refractive index n1 and a clad 12 made of a second resin having a refractive index n2 surrounding the core 11 as main constituent members. And n1> n2. For efficient optical transmission, the difference between the refractive index n1 of the core 11 and the refractive index n2 of the cladding 12 is preferably 0.05 or more and 0.20 or less.
  • the core 11 constitutes a first optical waveguide that is an optical path for guiding an optical signal.
  • the core (optical waveguide) 11 is formed in a direction parallel to the upper surface 10SA.
  • the core 11 and the cladding 12 are made of a fluorinated polyimide resin having a refractive index of 1.60 to 1.75, which is excellent in heat resistance, transparency, and isotropic properties.
  • the second main surface 20SB of the wiring board 20 is bonded to the upper surface 10SA of the optical waveguide plate 10 via the resin adhesive layer 21.
  • a substrate 29 is disposed on the lower surface 10SB.
  • the substrate 29 is a support substrate for producing the optical waveguide plate, and may be peeled off from the optical waveguide plate 10 after production. That is, the substrate 29 is not an essential component of the light transmission module 1.
  • the optical waveguide plate 10 has a concave portion T10 having an opening on the upper surface 10SA and the side surface 10SS.
  • the optical fiber 40 is a multimode fiber having a core diameter of 50 ⁇ m and a cladding diameter of 125 ⁇ m.
  • the optical fiber 40 is inserted into and bonded to the recess T10 of the optical waveguide plate 10. That is, the optical fiber 40 has a distal end face opposed to the end face of the optical waveguide and is optically coupled to the optical waveguide.
  • the cross-sectional area of the optical waveguide 11, that is, the size of the core 11 is preferably equal to or slightly smaller than the core diameter of the optical fiber 40. For example, when the core diameter of the optical fiber 40 is 50 ⁇ m, the cross-sectional shape of the core 11 is a 45 ⁇ m square.
  • a prism 15 serving as a reflection portion is disposed on the core (optical waveguide) 11 immediately below the optical element 30 (light emitting portion 31).
  • the prism 15 reflects the optical signal of the optical path O1 emitted from the optical element 30 in the direction orthogonal to the upper surface 10SA of the optical waveguide plate 10, that is, in the direction orthogonal to the extending direction of the core (optical waveguide) 11.
  • the light is guided to the optical path O2 in the extending direction of the core (optical waveguide) 11.
  • the optical signal enters the optical fiber 40 and is guided through the core 11 of the optical waveguide plate 10.
  • the portions of the wiring board 20 and the optical waveguide plate 10 that become the optical path O1 are hollow.
  • the reflection portion may be, for example, a wall surface of a V-groove formed on the lower surface 10SB of the optical waveguide plate 10 as long as the optical path O1 and the optical path O2 can be optically coupled.
  • the micropin 25 is punctured in the bonding electrode 24 of the wiring board 20.
  • the micro pin 25 is disposed under the external electrode 32 of the optical element 30.
  • the micro pin 25 is a hard member whose hardness is 10 times or more that of the wiring board 20 and the optical waveguide board 10.
  • the hardness is Vickers hardness (JIS Z 2244, ASTM E384), and more specifically, micro Vickers hardness at a measurement load of 2 g.
  • the wiring board 20 and the polymer type optical waveguide board 10 are made of, for example, a resin having a Vickers hardness Hv of 0.5 GP.
  • the micro pin 25 is made of a metal, glass, or ceramic having a Vickers hardness Hv of 5 GPa or more (that is, 10 times or more of the Vickers hardness Hv of the wiring board 20 and the polymer type optical waveguide plate 10).
  • a metal, glass, or ceramic having a Vickers hardness Hv of 5 GPa or more (that is, 10 times or more of the Vickers hardness Hv of the wiring board 20 and the polymer type optical waveguide plate 10).
  • silicon 10 GPa
  • gold 22 GPa
  • copper 50 GPa
  • the upper limit of the hardness of the micropin 25 is not particularly defined, but is 300 times or less of the hardness of the optical waveguide plate 10 and the like in consideration of cost and the like.
  • the external electrode 32 of the optical element 30 is ultrasonically bonded to the bonding electrode 24 of the wiring board 20.
  • the micro pin 25 that is a hard member is disposed under the external electrode 32. For this reason, since the applied ultrasonic wave is effectively propagated to the bonded portion, bonding reliability is ensured.
  • the micro pin 25 penetrates the wiring board 20. That is, the length of the rod-shaped micro pin 25 is longer than the thickness of the wiring board 20. However, the micro pins 25 do not have to penetrate the wiring board 20. However, in order to more effectively apply ultrasonic waves to the joint, the length of the micropins 25 is preferably 20% or more of the thickness of the wiring board 20, and more preferably 50% or more. . For example, when the thickness of the wiring board 20 is 20 ⁇ m, the length of the micropin 25 is preferably 4 ⁇ m or more, and more preferably 10 ⁇ m or more.
  • the upper limit of the length of the micro pin 25 may be equal to or less than the thickness of the optical transmission module 1.
  • the micro pin 25 may reach not only the wiring board 20 but also the optical waveguide board 10 and reach the substrate 29.
  • the bonding area with the external electrode 32 is reduced when the bonding electrode 24 is punctured.
  • the bonding electrode 24 is not an essential component. That is, if the punctured micropin 25 is electrically connected to the wiring of the first main surface 20SA of the wiring board 20, the upper surface of the micropin 25 can be regarded as the bonding electrode 24.
  • a guide hole (cut or cut) for defining the puncture position of the micropin 25 and assisting puncture may be formed in the wiring board 20 before puncturing.
  • the guide hole for puncturing has an outer dimension in plan view that is less than the outer dimension of the micro pin 25.
  • the outer dimension is, for example, the length of the side or the diagonal when the cross section of the micropin 25 is rectangular, and the diameter when the cross section is circular.
  • the guide hole can be formed by a method such as mechanical processing, physical etching, or chemical etching.
  • the optical element 30, the wiring board 20, the optical waveguide board 10, and the optical fiber are manufactured.
  • the optical element 30 is manufactured by cutting a wafer on which a large number of light emitting portions 31 and the like are formed by a known semiconductor technology.
  • the optical waveguide plate 10 is manufactured by arranging a lower clad / core / upper clad in this order on a substrate 29.
  • the optical waveguide plate 10 is formed with a recess T15 for inserting the prism 15 into the upper surface 10SA and a recess T10 for fixing the optical fiber 40. Then, the prism 15 is inserted into the recess T15.
  • the recessed part T15 may be filled with transparent resin.
  • the optical waveguide plate 10 can also be manufactured by a so-called 3D printer method using an ink jet method. If it is 3D printer method, the recessed hole T15, the recessed part T10, and the guide hole for inserting the micro pin 25 can be formed at the time of preparation.
  • the electronic component 39 is mounted on the first main surface 20SA of the wiring board 20.
  • the electronic component 39 is mounted by solder bonding.
  • the second main surface 20SB of the wiring board 20 is bonded to the upper surface 10SA of the optical waveguide plate 10 via the adhesive layer 21.
  • the adhesive layer 21 is made of, for example, an ultraviolet curable resin having a Vickers hardness Hv of 0.5 GP.
  • a through hole is formed in a region serving as an optical path.
  • the wiring board is made of a material that does not significantly attenuate an optical signal. It is not necessary to form a through hole.
  • the micropin 25 is punctured into the bonding electrode 24 of the wiring board 20, and the bonding electrode 24 into which the micropin 25 is punctured and the external electrode 32 of the optical element 30 are bonded.
  • the optical element 30 may be deteriorated by high temperature processing such as solder bonding. For this reason, for the joining of the external electrode 32 of the optical element 30 and the joining electrode 24 of the wiring board 20, ultrasonic joining is used that provides a strong joining at a low temperature. In order to reliably perform ultrasonic bonding, it is necessary to fix the wiring board 20 held by the receiving jig (anvil) of the ultrasonic bonding apparatus so as not to vibrate due to ultrasonic vibration.
  • the optical waveguide plate 10 to which the wiring board 20 is bonded is fixed to a receiving jig, and the external electrode 32 of the optical element 30 mechanically connected to the ultrasonic transducer is crimped to the bonding electrode 24 of the wiring board 20.
  • the ultrasonic vibrator vibrates, the external electrode 32 of the optical element 30 also vibrates and is bonded to the bonding electrode 24 of the fixed wiring board 20.
  • the oxide film and dirt at the interface between the external electrode 32 and the bonding electrode 24 are removed by ultrasonic vibration, and a strong attractive force works by bringing the crystal grains closer to the interatomic distance, and a metallurgical bond is generated. .
  • the bonding electrode 24 vibrates together with the external electrode 32 if not firmly fixed. That is, the bonding electrode 24 is disposed on the soft (low hardness) wiring board 20 and the optical waveguide board 10. For this reason, the ultrasonic vibration applied to the bonding electrode 24 is absorbed by the wiring board 20 or the like, which may result in insufficient bonding.
  • the optical transmission module 1 since the high-hardness micro pin 25 is disposed under the joint, the applied ultrasonic wave is efficiently applied to the joint. For this reason, the optical transmission module 1 has high bonding reliability.
  • the method of manufacturing the optical transmission module 1 includes the step of disposing a hard member having a hardness 10 times or more that of the wiring board and the optical waveguide plate immediately below the external electrode 23, and bonding to the external electrode 32. And ultrasonically bonding the electrode 24 to the electrode 24.
  • the micropin 25 is a rectangular parallelepiped whose lower surface is an inclined surface and whose upper side is elongated.
  • various types of micro pins can be used for the optical transmission module 1.
  • the micropin 25A shown in FIG. 5A is provided with a holding portion for handling at the top.
  • a micro pin 25B shown in FIG. 5B is formed of a rectangular parallelepiped having an apex angle of 90 degrees on the lower side and an elongated rectangular parallelepiped on the upper side.
  • the micropin 25C shown in FIG. 5C has a cut-out surface formed below the cylinder.
  • the optical element 30 is a light emitting element, that is, the E / O optical transmission module 1 that converts an electrical signal into an optical signal has been described.
  • the optical element is a light-receiving element such as a PD having a light-receiving unit that receives light of an optical signal, that is, an O / E optical transmission module that converts an optical signal into an electrical signal, the optical transmission module 1 has the same effect.
  • an optical transmission module having a light emitting element and a light receiving element has the same effect as the optical transmission module 1.
  • the joint is an ultrasonic joint by the structure or characteristics of the object. Also, it is impossible or impractical to analyze that the joint is an ultrasonic joint, not another joint, such as a room temperature joint.
  • ⁇ Variation 1 of the first embodiment> In the optical transmission module 1 ⁇ / b> A shown in FIG. 6, dummy micro pins 26 having the same configuration as the micro pins 25 are punctured around the joint portion, that is, around the micro pins 25.
  • the optical transmission module 1A having the same configuration of the micro pin 25 and the dummy micro pin 26 has a simple manufacturing process and a low cost.
  • a plurality of dummy micro pins 26 are preferably pierced so as to surround one micro pin 25. On the contrary, even if only one dummy micro pin 26 is punctured between two micro pins 25, there is an effect.
  • the optical transmission module 1 ⁇ / b> A has higher bonding reliability than the optical transmission module 1.
  • the dummy micro pin 26 does not have to have the same configuration as the micro pin 25.
  • a dummy micro pin 26 made of ceramic may be used for the micro pin 25 made of metal. That is, the dummy micropin 26 only needs to have a configuration for efficiently applying an ultrasonic wave to the joint, as with the micropin 25.
  • the micropin 25 ⁇ / b> B ⁇ b> 1 is made of a conductive material and constitutes a through wiring that penetrates the wiring board 20.
  • the micro pin 25B1 made of gold connects the bonding electrode 24 of the first main surface 20SA and the electrode 27 of the second main surface 20SB.
  • the micro pin 25B2 made of copper whose upper surface is gold-plated penetrates not only the wiring board 20 but also the optical waveguide plate 10 and the substrate 29, and the tip reaches the electrode 29A on the lower surface of the substrate 29.
  • the micro pins 25B1 and 25B2 not only improve the reliability of the ultrasonic bonding part but also constitute a part of the electric circuit, so that it is easy to improve the function.
  • micro pins 25B1 and 25B2 which are through wirings are mechanically fitted to the flat electrodes 27 and 29A. For this reason, ultrasonic vibration that vibrates in a direction parallel to the first main surface 20SA of the wiring board 20 can be more reliably applied to the joint.
  • the hard member is the through wiring 25 ⁇ / b> C of the wiring board 20. That is, the wiring board 20 penetrates the first main surface 20SA and the second main surface 20SB, and the through wiring 25C connected to the electrode 27 of the second main surface 20SB is formed immediately below the joint portion. ing.
  • the through wiring 25C is made of copper, gold, or the like whose hardness is 10 times or more that of the wiring board 20 and the optical waveguide board 10.
  • the hard member does not need to be connected to the electrode of the second main surface 20SB, and may have the same configuration as the through wiring, that is, a columnar shape made of a high-hardness conductor metal.
  • the hard members are the internal wiring 25D1 of the wiring board 20 and the conductor 25D2 of the second main surface 20SB.
  • the hard member is at least one of the through wiring 25C of the wiring board 20, the internal wiring 25D1, or the conductor 25D2 of the second main surface 20SB.
  • the internal wiring 25D1 and the conductor 25D2 are preferably thicker than the wiring, electrodes, and the like in order to exhibit not only a wiring function but also a function as a hard member.
  • the wiring film as the hard member is preferably 5 ⁇ m or more in thickness, more preferably 10 ⁇ m or more, unlike other wirings only for transmitting electrical signals.
  • the wiring film as the hard member is preferably larger than at least the external electrode of the optical element 30.
  • the optical transmission modules 1C and 1D since a part of the wiring board 20 is a hard member, it is not necessary to provide a hard member separately from the wiring board. For this reason, the optical transmission modules 1 ⁇ / b> C and 1 ⁇ / b> D of the second embodiment have a simpler configuration than the optical transmission module 1.
  • the hard member is the prism 15E constituting the reflecting portion.
  • the concave portion T15 in which the prism 15E is accommodated is filled with a transparent resin 16.
  • the length (dimension in the X direction) of the prism 15E extends to below the two joints.
  • the prism 15E is a rectangular parallelepiped that has extending portions extending from both sides of the central portion constituting the reflecting portion and is long in the lateral direction.
  • the extending portion may or may not function as a reflecting portion that is an optical portion, but at least functions as a hard member.
  • the optical transmission module 1E has a simple configuration because the prism is a hard member. Furthermore, as shown in FIG. 10, the elongated prism 15E always optically couples with the core (optical waveguide) 11 efficiently even if it is moved in the left-right direction (X direction). For this reason, manufacture is easy.
  • optical transmission module 1F of the fifth embodiment is similar to the optical transmission module 1 and has the same function, the same components are denoted by the same reference numerals and description thereof is omitted.
  • the hard member is the optical fiber 40F.
  • the optical fiber 40F has a ribbon shape in which three optical fibers are arranged, and the optical fiber at the center constitutes the optical path.
  • the left and right optical fibers are positioned below the joint.
  • the optical fiber 40F is inserted into the optical waveguide plate 10 and the periphery of the optical fiber 40F is fixed with resin. Since it is a hard member, the configuration is simple.
  • the optical transmission module 1G shown in FIG. 15 has two optical elements A and 30B that generate light of different wavelengths.
  • the wavelength ⁇ 1 of the first light generated by the optical element A is 850 nm
  • the wavelength ⁇ 2 of the second light generated by the optical element B is 1300 nm.
  • the light generated by the light emitting portion 31A of the optical element A is reflected by the reflecting portion 15G1 and guided to the optical waveguide 11.
  • the reflecting portion 15G1 is an inclined surface of the groove T10B having an opening on the lower surface of the optical waveguide plate 10G.
  • the light generated by the light emitting portion 31B of the optical element B is reflected by the prism 15G2.
  • the prism 15G2 transmits the first light and reflects the second light. The first light and the second light are combined by the prism 15G2 and guided through the optical fiber 40.
  • a micro pin 25 is disposed as a hard member under the two external electrodes 32 of the optical element A and one external electrode 32 of the optical element B (joint portion).
  • An optical fiber 40 is disposed as a hard member under the other external electrode 32 of the optical element B.
  • the hard member of a different structure may be arrange
  • the hard member may be a metal film or a ceramic film disposed on the lower surface of the substrate 29, or a metal film that covers the outer periphery of the wiring board 20, the optical waveguide plate 10 and the substrate 29, and the lower surface of the substrate 29. .
  • the hard member film may be a metal, glass, or ceramic having a Vickers hardness Hv of 5 GPa or more.
  • quartz glass, silicon, alumina, SiC, aluminum alloy, titanium alloy, stainless steel, nickel, copper, gold, or the like can be used as the hard member film.
  • the light transmission module of the embodiment may include a light emitting element having a light emitting part and a light receiving element having a light receiving part.
  • a bidirectional communication module can be configured by arranging a light receiving element instead of the light emitting element 31B.
  • the optical transmission module includes a first optical element having a light emitting unit that outputs light of an optical signal and a first external electrode connected to the light emitting unit, and a light receiving unit that receives light of the optical signal. And a second optical element having a second external electrode connected to the light receiving portion.
  • the endoscope 9 includes an insertion unit 9B in which an imaging unit having an imaging element having a high number of pixels is arranged in the distal end portion 9A, and an operation in which the imaging unit is arranged on the proximal end side of the insertion unit 9B.
  • the electrical signal output from the imaging unit is converted into an optical signal by the optical transmission module 1 whose optical element is a surface emitting laser, and the optical element disposed in the operation unit 9C via the optical fiber 40 is an optical transmission. It is converted again into an electric signal by the module 1X and transmitted through a metal wiring (not shown). That is, a signal is transmitted through the optical fiber 40 in the small-diameter insertion portion 9B.
  • the optical transmission module 1 is very small and easy to manufacture. For this reason, the endoscope 9 is easy to manufacture although the distal end portion 9A and the insertion portion 9B have a small diameter.
  • optical transmission module 1X preferably has the same configuration as the optical transmission module 1 though the arrangement space is relatively wide.

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  • Instruments For Viewing The Inside Of Hollow Bodies (AREA)

Abstract

La présente invention concerne un module de transmission optique 1 qui est pourvu d'un élément optique 30 comportant une électrode externe 32 ; une carte de câblage 20 qui comporte un corps de base formé d'une résine, et dans lequel l'électrode externe 32 de l'élément optique 30 est fixée à une électrode de liaison 24 d'une première surface principale 20SA ; une plaque de guide d'ondes optiques de type polymère 10, dans laquelle une surface supérieure 10SA est liée à une deuxième surface principale 20SB de la carte de câblage 20, et un guide d'ondes optiques 11 est optiquement couplé à l'élément optique 30 au moyen d'une section réfléchissante 15 ; et une fibre optique 40 optiquement couplée au guide d'ondes optiques 11. Sous une section de liaison entre l'électrode externe 32 et l'électrode de liaison 24, un élément dur 25 ayant une dureté de dix fois ou plus la dureté de la carte de câblage 20 et celle de la plaque de guide d'ondes optiques 10 est disposé.
PCT/JP2016/055452 2016-02-24 2016-02-24 Module de transmission optique, endoscopes et procédé de fabrication de module de transmission optique WO2017145289A1 (fr)

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PCT/JP2016/055452 WO2017145289A1 (fr) 2016-02-24 2016-02-24 Module de transmission optique, endoscopes et procédé de fabrication de module de transmission optique
JP2018501472A JPWO2017145289A1 (ja) 2016-02-24 2016-02-24 光伝送モジュール、内視鏡、及び光伝送モジュールの製造方法

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009008769A (ja) * 2007-06-26 2009-01-15 Panasonic Electric Works Co Ltd 光電気変換装置の製造方法
JP2013228467A (ja) * 2012-04-24 2013-11-07 Nippon Mektron Ltd 光電気混載フレキシブルプリント配線板、及びその製造方法
JP2014106355A (ja) * 2012-11-27 2014-06-09 Nitto Denko Corp 光電気混載基板およびその製法
WO2015141577A1 (fr) * 2014-03-19 2015-09-24 オリンパス株式会社 Élément de maintien de fibre optique, endoscope et procédé de production d'élément de maintien de fibre optique

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100864829B1 (ko) * 2007-03-13 2008-10-23 한국전자통신연구원 광전 인터페이스 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009008769A (ja) * 2007-06-26 2009-01-15 Panasonic Electric Works Co Ltd 光電気変換装置の製造方法
JP2013228467A (ja) * 2012-04-24 2013-11-07 Nippon Mektron Ltd 光電気混載フレキシブルプリント配線板、及びその製造方法
JP2014106355A (ja) * 2012-11-27 2014-06-09 Nitto Denko Corp 光電気混載基板およびその製法
WO2015141577A1 (fr) * 2014-03-19 2015-09-24 オリンパス株式会社 Élément de maintien de fibre optique, endoscope et procédé de production d'élément de maintien de fibre optique

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