WO2015113890A3 - Verfahren zur erzeugung von texturen oder von polituren auf der oberfläche von monokristallinen siliziumwafern - Google Patents
Verfahren zur erzeugung von texturen oder von polituren auf der oberfläche von monokristallinen siliziumwafern Download PDFInfo
- Publication number
- WO2015113890A3 WO2015113890A3 PCT/EP2015/051251 EP2015051251W WO2015113890A3 WO 2015113890 A3 WO2015113890 A3 WO 2015113890A3 EP 2015051251 W EP2015051251 W EP 2015051251W WO 2015113890 A3 WO2015113890 A3 WO 2015113890A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- silicon wafers
- monocrystalline silicon
- polishes
- textures
- wafers
- Prior art date
Links
- 235000012431 wafers Nutrition 0.000 title abstract 7
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 4
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 abstract 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 abstract 2
- 229910017604 nitric acid Inorganic materials 0.000 abstract 2
- 239000007800 oxidant agent Substances 0.000 abstract 2
- 239000012286 potassium permanganate Substances 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- KZBUYRJDOAKODT-UHFFFAOYSA-N Chlorine Chemical compound ClCl KZBUYRJDOAKODT-UHFFFAOYSA-N 0.000 abstract 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract 1
- 229910004882 Na2S2O8 Inorganic materials 0.000 abstract 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract 1
- 239000012670 alkaline solution Substances 0.000 abstract 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 abstract 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 abstract 1
- 239000012935 ammoniumperoxodisulfate Substances 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 239000000460 chlorine Substances 0.000 abstract 1
- 229910052801 chlorine Inorganic materials 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 231100001231 less toxic Toxicity 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 231100000252 nontoxic Toxicity 0.000 abstract 1
- 230000003000 nontoxic effect Effects 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 239000002351 wastewater Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/08—Etching
- C30B33/10—Etching in solutions or melts
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Electromagnetism (AREA)
- Weting (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112015000568.4T DE112015000568B4 (de) | 2014-01-31 | 2015-01-22 | Verfahren zur Erzeugung von Texturen oder von Polituren auf der Oberfläche von monokristallinen Siliziumwafern und entsprechende Ätzlösung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201410001363 DE102014001363B3 (de) | 2014-01-31 | 2014-01-31 | Verfahren zur Erzeugung von Texturen oder von Polituren auf der Oberfläche von monokristallinen Siliciumwafern |
DE102014001363.4 | 2014-01-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2015113890A2 WO2015113890A2 (de) | 2015-08-06 |
WO2015113890A3 true WO2015113890A3 (de) | 2015-11-12 |
Family
ID=52395073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2015/051251 WO2015113890A2 (de) | 2014-01-31 | 2015-01-22 | Verfahren zur erzeugung von texturen oder von polituren auf der oberfläche von monokristallinen siliziumwafern |
Country Status (2)
Country | Link |
---|---|
DE (2) | DE102014001363B3 (de) |
WO (1) | WO2015113890A2 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104962999A (zh) * | 2015-07-08 | 2015-10-07 | 中国科学院宁波材料技术与工程研究所 | 基于金刚线切割的硅片的制绒方法、硅片制绒品及硅片制绒预处理液 |
CN105154982A (zh) * | 2015-07-08 | 2015-12-16 | 中国科学院宁波材料技术与工程研究所 | 多晶黑硅制绒处理液、应用其进行多晶硅片制绒的方法以及多晶黑硅制绒品 |
CN104962998A (zh) * | 2015-07-08 | 2015-10-07 | 中国科学院宁波材料技术与工程研究所 | 基于金刚线切割的硅片的制绒预处理方法及硅片制绒方法 |
DE102016105866B3 (de) * | 2016-03-31 | 2017-07-06 | Technische Universität Bergakademie Freiberg | Siliziumwafer, Verfahren zum Strukturieren eines Siliziumwafers und Solarzelle |
CN106340569A (zh) * | 2016-09-27 | 2017-01-18 | 南昌大学 | 一种金刚石线锯切割太阳电池用多晶硅片制绒的预处理方法 |
DE102017110297A1 (de) | 2016-12-30 | 2018-07-05 | RENA Technologies GmbH | Verfahren und Vorrichtung zur Behandlung einer Objektoberfläche mittels einer Behandlungslösung |
CN107195705A (zh) * | 2017-06-16 | 2017-09-22 | 苏州阿特斯阳光电力科技有限公司 | 一种太阳能电池的制备方法 |
DE102017212442A1 (de) | 2017-07-20 | 2019-01-24 | Singulus Technologies Ag | Verfahren und Vorrichtung zum Texturieren einer Oberfläche eines multikristallinen Diamantdraht-gesägten Siliziumsubstrats unter Verwendung von ozonhaltigem Medium |
CN107275445A (zh) * | 2017-08-04 | 2017-10-20 | 常州天合光能有限公司 | 一种多晶硅太阳能电池片隔离返工工艺 |
CN107675263A (zh) * | 2017-09-15 | 2018-02-09 | 东方环晟光伏(江苏)有限公司 | 单晶硅金字塔结构绒面的优化方法 |
CN109326683A (zh) * | 2018-09-16 | 2019-02-12 | 苏州润阳光伏科技有限公司 | 单晶硅片碱抛清洗方法 |
CN110098107A (zh) * | 2019-05-13 | 2019-08-06 | 浙江贝盛光伏股份有限公司 | 一种实现多晶硅印刷工序异常片品质合格的工艺 |
DE102019133386A1 (de) * | 2019-12-06 | 2021-06-10 | Hanwha Q Cells Gmbh | Verfahren zur Behandlung eines Halbleiterwafers |
CN112599634A (zh) * | 2020-12-03 | 2021-04-02 | 江苏日托光伏科技股份有限公司 | 一种太阳能晶硅电池制绒方法、混合酸洗方法及混合酸洗药液 |
CN113451444B (zh) * | 2021-06-30 | 2024-03-01 | 安徽华晟新能源科技股份有限公司 | 太阳能电池片的制造方法 |
DE102022122705A1 (de) | 2022-09-07 | 2024-03-07 | Technische Universität Bergakademie Freiberg, Körperschaft des öffentlichen Rechts | Verfahren zur Erzeugung von Texturen, Strukturen oder von Polituren auf der Oberfläche von Silizium |
Citations (3)
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DE102009014562A1 (de) * | 2009-03-16 | 2010-09-23 | Schmid Silicon Technology Gmbh | Aufreinigung von metallurgischem Silizium |
DE102011050136A1 (de) * | 2010-09-03 | 2012-03-08 | Schott Solar Ag | Verfahren zum nasschemischen Ätzen einer Siliziumschicht |
US20130192303A1 (en) * | 2012-01-27 | 2013-08-01 | Memc | Qualitative crystal defect evaluation method |
Family Cites Families (9)
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DE4325543A1 (de) * | 1993-07-29 | 1995-02-02 | Wacker Chemitronic | Verfahren und Vorrichtung zur naßchemischen Behandlung von Siliciummaterial |
DE19962136A1 (de) * | 1999-12-22 | 2001-06-28 | Merck Patent Gmbh | Verfahren zur Rauhätzung von Siliziumsolarzellen |
DE102008014166B3 (de) * | 2008-03-14 | 2009-11-26 | Rena Gmbh | Verfahren zur Herstellung einer Siliziumoberfläche mit pyramidaler Textur |
KR101539047B1 (ko) | 2008-12-24 | 2015-07-23 | 인텔렉츄얼 키스톤 테크놀로지 엘엘씨 | 광기전력 변환 소자 및 그의 제조방법 |
US20110079250A1 (en) | 2009-10-01 | 2011-04-07 | Mt Systems, Inc. | Post-texturing cleaning method for photovoltaic silicon substrates |
KR20120015484A (ko) * | 2010-08-12 | 2012-02-22 | 동우 화인켐 주식회사 | 결정성 실리콘 웨이퍼의 텍스쳐 에칭액 조성물 및 텍스쳐 에칭 방법 |
US20120295447A1 (en) | 2010-11-24 | 2012-11-22 | Air Products And Chemicals, Inc. | Compositions and Methods for Texturing of Silicon Wafers |
US20130252427A1 (en) | 2012-03-26 | 2013-09-26 | Sunpreme, Ltd. | Method for cleaning textured silicon wafers |
US20130130508A1 (en) * | 2011-09-02 | 2013-05-23 | Air Products And Chemicals, Inc. | Compositions and Methods for Texturing of Silicon Wafers |
-
2014
- 2014-01-31 DE DE201410001363 patent/DE102014001363B3/de active Active
-
2015
- 2015-01-22 DE DE112015000568.4T patent/DE112015000568B4/de active Active
- 2015-01-22 WO PCT/EP2015/051251 patent/WO2015113890A2/de active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009014562A1 (de) * | 2009-03-16 | 2010-09-23 | Schmid Silicon Technology Gmbh | Aufreinigung von metallurgischem Silizium |
DE102011050136A1 (de) * | 2010-09-03 | 2012-03-08 | Schott Solar Ag | Verfahren zum nasschemischen Ätzen einer Siliziumschicht |
US20130192303A1 (en) * | 2012-01-27 | 2013-08-01 | Memc | Qualitative crystal defect evaluation method |
Also Published As
Publication number | Publication date |
---|---|
DE112015000568B4 (de) | 2023-01-19 |
DE102014001363B3 (de) | 2015-04-09 |
DE112015000568A5 (de) | 2016-12-08 |
WO2015113890A2 (de) | 2015-08-06 |
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