WO2015106863A1 - Sic-trench-transistor und verfahren zu dessen herstellung - Google Patents
Sic-trench-transistor und verfahren zu dessen herstellung Download PDFInfo
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- WO2015106863A1 WO2015106863A1 PCT/EP2014/075277 EP2014075277W WO2015106863A1 WO 2015106863 A1 WO2015106863 A1 WO 2015106863A1 EP 2014075277 W EP2014075277 W EP 2014075277W WO 2015106863 A1 WO2015106863 A1 WO 2015106863A1
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- Prior art keywords
- compensation layer
- terminal
- layer
- doping
- sic trench
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 20
- 229910010271 silicon carbide Inorganic materials 0.000 description 20
- 230000005684 electric field Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/063—Reduced surface field [RESURF] pn-junction structures
- H01L29/0634—Multiple reduced surface field (multi-RESURF) structures, e.g. double RESURF, charge compensation, cool, superjunction (SJ), 3D-RESURF, composite buffer (CB) structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0843—Source or drain regions of field-effect devices
- H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66053—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide
- H01L29/66068—Multistep manufacturing processes of devices having a semiconductor body comprising crystalline silicon carbide the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
Definitions
- the present invention relates to a SiC trench transistor and a method of manufacturing the same.
- the gate oxide In the case of SiC-based components, the gate oxide generally has a lower band offset in the conduction band than comparable components made of silicon, so that degradation due to tunnel currents already occurs at lower
- Gate field strengths occurs.
- SiC transistors in particular MOSFETs (metal oxide semiconductor field effect transistor)
- MOSFETs metal oxide semiconductor field effect transistor
- a meaningful field strength in the gate oxide will be 3 MV / cm. Compliance with this limit is particularly critical in lock-up and makes design measures required, especially in
- the field strength at the gate oxide can be reduced, for example, by introducing a double trench with a low p implantation.
- the lower-lying p regions constitute a JFET (junction field effect transistor), which shields the actual trench MOSFET structure.
- the field strengths at the gate oxide can also be reduced to about 4 MV / cm by introducing p-type p-type regions (p-bubbles) below the gate oxide (J. Tan et al., High Voltage Accumulation Layer, UMOSFETs in 4H-SiC, IEEE ELECTRON DEVICE LETTERS, VOL 19, NO 12, DECEMBER 1998).
- Double trenches also significantly increased the resistance in the current path.
- a SiC trench transistor having a first terminal, an epitaxial layer arranged vertically between a gate trench and a second terminal is provided, wherein a horizontally extending compensation layer is provided in the epitaxial layer, which provides an effective doping of opposite type having the doping of the epitaxial layer.
- the compensation layer allows a reduction of the electric gate field strength without increased space requirement.
- the core of the invention is a semiconductor structure which reduces the gate field strength and is inserted vertically into the SiC trench structure. Due to the vertical integration, the trench structures can be packed significantly denser and the surface resistivity between drain and source
- the field strength in the gate region can be adjusted by appropriate choice of doping and spacing. By decoupling the gate-near field region from the epitaxial layer or the drift region, higher n-type dopants can be used in the channel near the drift region without significant disadvantages for the
- the arithmetic mean of the doping of the compensation layer may correspond to the doping of opposite type. This allows manifold
- Embodiments of the doping of the compensation layer since only the means must correspond to a certain doping value. Thus, irregular doping is possible.
- the transistor it is provided that the transistor
- the first terminal is a source terminal
- the second terminal is a drain structure
- the epitaxial layer is a drift zone.
- the adaptation or adjustment of the gate field strength according to the invention is important.
- the compensation layer can have passages with a doping of the type of drift zone. These passages allow current to pass through the MOSFET so that the functionality or functionality of the MOSFET is not restricted.
- the passages may have round or angular outlines and may be arranged at regular or irregular intervals or patterns.
- the compensation layer has an alternating sequence of p-doped and n-doped regions in a planar direction of the compensation layer.
- This variant is easy to manufacture and allows a good passage of electricity as well as a simple calculation and Production of the doping of the compensation layer, in particular the
- the compensation layer comprises an alternating pattern of p-doped and n-doped regions in two
- the transistor is a SiC trench IGBT (insulated-gate bipolar transistor), the first terminal is a cathode terminal, the second terminal is an anode terminal and the epitaxial layer is a base zone.
- the compensation layer allows a reduction of the field strength in the gate oxide, which opens up new fields of application for IGBTs.
- the compensation layer may have a low homogeneous dopant of the opposite type to the doping of the base region. This doping can be easily produced.
- the compensation layer has a maximum distance of 25% of the drift zone thickness to the gate channel. It has been shown that this
- Distance range allows an optimal field strength in the gate oxide.
- the inventive method for producing a SiC trench transistor basically comprises the following steps:
- the introduction of the compensation layer according to the invention advantageously permits control of the electric field characteristic in the gate trench and / or in the gate Epitaxial layer, so that the transistor can be adjusted exactly to its use.
- Figure 1 is a schematic sectional view of a SiC trench MOSFETs with compensation layer and associated electric field characteristic
- Figure 2 shows an embodiment of the compensation layer in one
- FIG. 3 shows a further embodiment of the compensation layer in a surface direction
- FIG. 4 shows a further embodiment of the compensation layer in another surface direction
- FIG. 5 shows a further embodiment of the compensation layer in two surface directions
- Figure 6 is a schematic sectional view of a SiC trench IGBT with compensation layer and associated electric field profile.
- Figure 1 shows in cross-section an SIC trench transistor 1 with a
- an epitaxial layer in the form of a drift zone 4 is arranged below the source terminal 2 and the gate trench 3.
- a drain connection or a drain structure 5 is arranged below the drift zone 4 .
- a compensation layer 6 is provided which extends horizontally. The directions given here, such as below or horizontally, refer to the pictorial representation in the figures. Should the transistor 1 be oriented differently than in FIG. 1, these are relative terms
- the directional references may be more specifically referred to with reference to the gate trench 3
- Main extension which runs here from top to bottom, to be defined.
- the compensation layer 6 is perpendicular to the gate trench. 3
- the drift zone 4 is n-doped and the compensation layer 6 is effectively p-doped, ie with the opposite type or charge type to the drift zone 4.
- the dopants can also be selected in reverse.
- the effective doping may be exemplified as the arithmetic mean of the
- Extension of the compensation layer 6 in a plane, for example the x and y direction, is then usually limited to the cell or the region of the transistor 1.
- the second curve 8 shows the field intensity profile of the illustrated SIC trench transistor 1 according to the invention.
- the compensation layer 6 effects a step in the vertical field profile, with the lower level of the field profile lying between the gate 3 and the compensation layer 6 the high field level below the compensation layer 6 more precisely lies in the region of the pn junction between the compensation layer 6 and the drift zone 4.
- the vertical arrangement of the compensation layer 6, that is in particular the Distance between the compensation layer 6 and the gate trench 3 and / or the thickness of the compensation layer 6 in the vertical direction, the
- Field strength profile of the transistor 1 can be adjusted or adjusted individually to the respective purposes.
- FIG. 2 shows a first realization of the compensation layer 6.
- the compensation layer consists of an alternating sequence of n-doped regions 6a and p-doped regions 6b.
- the n-doped regions 6a form passages for the current of the transistor 1.
- the distances of the individual regions or their width or length are greater than that
- Drift zone length that is the distance between the gate 3 and the
- Drain structure 5 This results in a typical structure size of 0.1 ... 5 ⁇ .
- the doped regions 6a and 6b extend in the form of a strip in the direction of the strip-shaped gate trench 3, in this case into the plane of the page.
- the highest possible doping level is to be striven for under the boundary condition that the effective doping or average doping or, in other words, the volume-weighted difference between the n and the p-
- Dopant concentration is maintained according to the vertical field strength target profile including the manufacturing tolerances.
- the design of the pn junctions of the compensation layer 6 can be largely free, that is to pass properties or
- the periodicity of the compensation layer 6, that is to say the alternating sequence of the n-doped regions 6a and the p-doped regions 6b, is to be selected smaller or in the order of magnitude of the drift zone (typically 1... 10 ⁇ m).
- FIG. 3 shows a SiC trench transistor 1 with a compensation layer 6 which has a greater periodicity, that is to say that the layer 6 has more pn junctions per cell in comparison to FIG.
- the compensation layer 6 also has a stripe design parallel to the gate orientation, ie, a surface direction of the stripe design Compensation layer 6 on.
- the n-regions 6a of the compensation layer 6 are advantageously aligned below the channel region.
- FIG. 4 shows another example of a SiC trench transistor 1 with a compensation layer 6. Again, there is the compensation layer
- the doped regions 6a and 6b extend transversely or perpendicularly to the extent of the strip-shaped gate 3
- the doped regions 6a and 6b may also be arranged at a different angle.
- FIG. 5 shows a SiC trench transistor with a compensation layer 6, in which an alternating pattern of p-doped regions 6b and n-doped regions 6a is provided in two surface directions of the compensation layer 6.
- the pattern here is a two-dimensional periodic lattice that is particularly suitable for two-dimensional MOS designs, such as hexagonal cell structures.
- a checkerboard design is also possible.
- the n-regions 6a of the compensation layer 6 are advantageously aligned below the channel region, at least as regards the
- FIG. 6 shows a SiC trench IGBT 10 with a cathode terminal 12 and a gate trench 13. Beneath the gate trench 13 and the cathode terminal 12, a base zone 14 is arranged in the form of an epitaxial layer. Again below the base zone 14, an anode terminal 15 is provided. In the base zone 14 is a horizontally extending
- Compensating layer 16 is provided to reduce the field strength in the gate oxide. As before, the compensation layer 16 has an effective doping of an opposite type to the doping of the base region 14. In this case,
- the base region 14 is n-doped while the compensation layer 16 is p-doped. Since no unipolar through-current is required in an IGBT, the compensation layer 16 may be formed as a low-doped homogeneous layer.
- the field strength curve shown on the right in FIG. 6 corresponds to the profile shown in FIG.
- the curve 17 shows the course of the field strength for a known IGBT without compensation layer 16. Clearly For example, the amount of field strength in the region of the gate oxide is highest.
- the curve 18 shows the field strength profile optimized by the compensation layer 16 with significantly lower field strength in the region of the gate oxide.
- the transistor 10 includes below the base region 14 an optional heavily n-doped layer 19 for limiting or stopping the electric field. Between the layer 19 and the anode 15, a p-doped layer 20 is arranged. Also in this area, the compensation layer 16 changes the course of the field strength. Thus, the field strength course extends through the
- the compensation layer 6 or 16 is implanted or structured implanted.
- the gate region body, source or cathode
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Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14802057.1A EP3095136A1 (de) | 2014-01-15 | 2014-11-21 | Sic-trench-transistor und verfahren zu dessen herstellung |
JP2016546822A JP6305547B2 (ja) | 2014-01-15 | 2014-11-21 | SiCトレンチトランジスタ及びその製造方法 |
US15/110,180 US9761706B2 (en) | 2014-01-15 | 2014-11-21 | SiC trench transistor and method for its manufacture |
CN201480073301.5A CN105917470A (zh) | 2014-01-15 | 2014-11-21 | 碳化硅沟槽晶体管以及用于制造碳化硅沟槽晶体管的方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE102014200613.9A DE102014200613A1 (de) | 2014-01-15 | 2014-01-15 | SiC-Trench-Transistor und Verfahren zu dessen Herstellung |
DE102014200613.9 | 2014-01-15 |
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WO2015106863A1 true WO2015106863A1 (de) | 2015-07-23 |
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PCT/EP2014/075277 WO2015106863A1 (de) | 2014-01-15 | 2014-11-21 | Sic-trench-transistor und verfahren zu dessen herstellung |
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Country | Link |
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US (1) | US9761706B2 (de) |
EP (1) | EP3095136A1 (de) |
JP (1) | JP6305547B2 (de) |
CN (1) | CN105917470A (de) |
DE (1) | DE102014200613A1 (de) |
TW (1) | TWI641053B (de) |
WO (1) | WO2015106863A1 (de) |
Cited By (1)
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JP2022010387A (ja) * | 2018-01-29 | 2022-01-14 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102016205331A1 (de) | 2016-03-31 | 2017-10-05 | Robert Bosch Gmbh | Vertikaler SiC-MOSFET |
CN106876470A (zh) * | 2017-03-23 | 2017-06-20 | 深圳基本半导体有限公司 | 一种沟槽栅金属氧化物场效应晶体管及其制造方法 |
JP6870547B2 (ja) * | 2017-09-18 | 2021-05-12 | 株式会社デンソー | 半導体装置およびその製造方法 |
JP6981890B2 (ja) * | 2018-01-29 | 2021-12-17 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP7140642B2 (ja) * | 2018-11-15 | 2022-09-21 | トヨタ自動車株式会社 | スイッチング素子 |
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WO1999026296A2 (en) * | 1997-11-13 | 1999-05-27 | Abb Research Ltd. | A SEMICONDUCTOR DEVICE OF SiC AND A TRANSISTOR OF SiC HAVING AN INSULATED GATE |
US20040094798A1 (en) * | 2002-09-02 | 2004-05-20 | Kabushiki Kaisha Toshiba | Semiconductor device |
US20050161732A1 (en) * | 2004-01-23 | 2005-07-28 | Makoto Mizukami | Semiconductor device |
DE102009017358A1 (de) * | 2008-04-17 | 2009-10-22 | Denso Corporation, Kariya-City | Halbleitervorrichtung aus Siliciumcarbid mit Tiefschicht |
EP2626905A2 (de) * | 2012-02-13 | 2013-08-14 | Sumitomo Electric Industries, Ltd. | Siliciumkarbid-Halbleitervorrichtung und Verfahren zur Herstellung einer Siliciumkarbid-Halbleitervorrichtung |
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JP2727481B2 (ja) | 1992-02-07 | 1998-03-11 | キヤノン株式会社 | 液晶素子用ガラス基板の洗浄方法 |
US6037632A (en) * | 1995-11-06 | 2000-03-14 | Kabushiki Kaisha Toshiba | Semiconductor device |
JP2006332607A (ja) * | 2005-04-28 | 2006-12-07 | Nec Electronics Corp | 半導体装置 |
JP2008177335A (ja) | 2007-01-18 | 2008-07-31 | Fuji Electric Device Technology Co Ltd | 炭化珪素絶縁ゲート型半導体装置。 |
US7875951B2 (en) * | 2007-12-12 | 2011-01-25 | Infineon Technologies Austria Ag | Semiconductor with active component and method for manufacture |
JP5728992B2 (ja) * | 2011-02-11 | 2015-06-03 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
JP2013155670A (ja) | 2012-01-30 | 2013-08-15 | Daihatsu Motor Co Ltd | ヒートインシュレータ |
CN102842612A (zh) * | 2012-09-11 | 2012-12-26 | 电子科技大学 | 具有埋岛结构的绝缘栅双极型晶体管 |
JP6171678B2 (ja) * | 2013-07-26 | 2017-08-02 | 住友電気工業株式会社 | 炭化珪素半導体装置およびその製造方法 |
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2014
- 2014-01-15 DE DE102014200613.9A patent/DE102014200613A1/de active Pending
- 2014-11-21 JP JP2016546822A patent/JP6305547B2/ja active Active
- 2014-11-21 EP EP14802057.1A patent/EP3095136A1/de not_active Ceased
- 2014-11-21 WO PCT/EP2014/075277 patent/WO2015106863A1/de active Application Filing
- 2014-11-21 CN CN201480073301.5A patent/CN105917470A/zh active Pending
- 2014-11-21 US US15/110,180 patent/US9761706B2/en active Active
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2015
- 2015-01-13 TW TW104101057A patent/TWI641053B/zh active
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2022010387A (ja) * | 2018-01-29 | 2022-01-14 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP7277546B2 (ja) | 2018-01-29 | 2023-05-19 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
Also Published As
Publication number | Publication date |
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EP3095136A1 (de) | 2016-11-23 |
US20160329424A1 (en) | 2016-11-10 |
DE102014200613A1 (de) | 2015-07-16 |
TW201539581A (zh) | 2015-10-16 |
TWI641053B (zh) | 2018-11-11 |
JP2017504213A (ja) | 2017-02-02 |
CN105917470A (zh) | 2016-08-31 |
JP6305547B2 (ja) | 2018-04-04 |
US9761706B2 (en) | 2017-09-12 |
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