WO2015101121A1 - 掩模板面型整形装置及采用其的光刻机 - Google Patents

掩模板面型整形装置及采用其的光刻机 Download PDF

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Publication number
WO2015101121A1
WO2015101121A1 PCT/CN2014/092425 CN2014092425W WO2015101121A1 WO 2015101121 A1 WO2015101121 A1 WO 2015101121A1 CN 2014092425 W CN2014092425 W CN 2014092425W WO 2015101121 A1 WO2015101121 A1 WO 2015101121A1
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WO
WIPO (PCT)
Prior art keywords
mask
suction
suction cup
shaping device
control system
Prior art date
Application number
PCT/CN2014/092425
Other languages
English (en)
French (fr)
Inventor
李玲雨
李玉龙
Original Assignee
上海微电子装备有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 上海微电子装备有限公司 filed Critical 上海微电子装备有限公司
Priority to JP2016543692A priority Critical patent/JP6392356B2/ja
Priority to KR1020167020789A priority patent/KR101880646B1/ko
Priority to US15/108,663 priority patent/US9983488B2/en
Publication of WO2015101121A1 publication Critical patent/WO2015101121A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the present invention relates to the field of integrated circuit manufacturing, and in particular to a mask face shaping device, and to a lithography machine using the mask face shaping device.
  • the size of the TFT (Thin Film Field Effect Transistor) substrate increases accordingly. From the original 6-inch mask to the 5.5-generation TFT lithography machine, the mask size has reached 920 mm. ⁇ 800mm, to 8.5 generation mask size has reached 1320mm ⁇ 1108mm. A mask having such a large size is adsorbed on the mask table, and is inevitably affected by its own weight, and the deformation in the vertical direction is more than 40 ⁇ m. For high-generation TFT lithography equipment of 5.5 generations or higher, multi-lens stitching or large field of view technology is an inevitable trend. However, the deflection of the mask has a great influence on the exposure accuracy, especially affecting the depth of focus of the projection objective. The range makes image quality difficult to guarantee.
  • One way to correct the deflection of the reticle is to add a mechanism to adjust the object plane in the objective lens to accommodate the self-weight deformation of the mask.
  • this makes the structure of the objective lens more complicated, and the introduction of too many movable elements is disadvantageous to the reliability of the entire lithography machine.
  • Another way is to use vacuum sealing technology, that is, to install a glass plate between the mask and the illumination system, so that the mask, the mask table and the glass plate form a space, and the space and the air suction path of the pneumatic device
  • the air introduction passage is connected to adjust the pressure inside the space to be equal to the pressure of the mask plate, so that the mask plate is deflected in a direction opposite to the gravity direction to offset the self-weight deflection of the mask.
  • the illumination system affects the exposure quality of the mask, and the glass plate also has its own weight deformation, which reduces the quality of the exposure.
  • the mask plate and the glass plate and the pneumatic device are all on one structure, increasing the mask vibration. And the weight of the load.
  • the invention provides a mask surface shaping device to overcome the problem of the self-weight deformation of the mask in the prior art.
  • the present invention provides a mask surface shaping device comprising: a plurality of suction cups, a suction cup mounting frame, and a pneumatic control system; wherein the suction cup mounting frame is disposed above the mask, and the plurality of suction cups Dispersively mounted at the bottom of the suction cup mounting frame; the pneumatic control system is for controlling the action of the suction cup to pick up or release the mask.
  • the suction cup is fixed to the bottom of the suction cup mounting frame by an adjusting bolt or a movable snap.
  • the vertical projection position of said plurality of suction cups on said reticle is located in a region other than the trapezoidal exposure field of view on said reticle.
  • the suction cup adsorbs the mask in a non-contact manner.
  • the pneumatic control system includes a plurality of pneumatic lines connected to the plurality of suction cups, and a pressure reducing valve, an opening and closing valve, and a pressure sensor disposed in each of the pneumatic lines.
  • the suction force of each of the suction cups is monitored by the pressure sensor in real time and is controlled by the pressure reducing valve and the switching valve.
  • a mounting plate is also included for use in adjusting the distance between the bottom of the chuck and the mask.
  • the mask is of a large size of 920 mm ⁇ 800 mm or more. That is, a mask used in a high-generation TFT lithography apparatus of 5.5 generations or more.
  • the present invention further provides a lithography machine comprising a light source, an illumination system, a mask table, an objective lens and a workpiece stage, the mask table being used for carrying and moving a mask for the illumination system Forming one or more illumination fields of view in a plane in which the reticle is located
  • the lithography machine further includes a reticle type shaping device, including: a frame, located above the mask table; a suction cup disposed at a bottom of the frame; a pneumatic control system for controlling an operation of adsorbing or releasing the plurality of suction cups, wherein the plurality of suction cups are in a plane in which the mask is located
  • the vertical projection does not overlap the one or more illumination fields of view, and the plurality of suction cups are not connected
  • the mask is sucked in a touch manner.
  • the plurality of suction cups are arranged in a plurality of rows, and the length of the middle row is greater than the stroke length of the mask, and the length of the suction row on the side of the row 2 is smaller than the stroke length of the mask.
  • said pneumatic control system is operative to control adsorption of said reticle by a suction cup located directly above the reticle, said pneumatic control system further for controlling the amount of absorbing force of the suction cup of each of the absorbing reticle, such that said The viscous force experienced by the reticle is substantially balanced with the gravity of the reticle.
  • the pneumatic control system includes a plurality of pneumatic lines respectively connected to the plurality of suction cups, the pneumatic control system further comprising a pressure reducing valve, an on-off valve and a pressure sensor disposed in each of the pneumatic lines .
  • the suction force of each of the suction pads of the adsorption mask is monitored by a corresponding pressure sensor and adjusted by a corresponding pressure reducing valve.
  • the frame is not connected to the light source, the illumination system, the mask table, the objective lens and the workpiece stage.
  • the size of the mask is 920 mm ⁇ 800 mm or more.
  • the suction cup is secured to the bottom of the frame by an adjustment bolt or a movable snap.
  • the mask face shaping device further comprises a mounting plate for adjusting the distance between the bottom of the chuck and the mask.
  • the invention has the following advantages: the setting of the suction cup of the invention avoids the trapezoidal illumination field of view on the mask plate, so that the light beam is 100% irradiated onto the mask, thereby improving the exposure efficiency; the mask surface type
  • the suction force of the suction device of the shaping device can effectively reduce the weight load of the mask, and avoid deformation of the mask due to its own weight;
  • the mask face shaping device is relatively independent, and the light source, the illumination system, the mask table, the objective lens and the workpiece in the lithography machine The components such as the table are not connected to each other and are not in contact with each other, and the vibration outside the lithography machine is not brought to the above components.
  • FIG. 1 is a schematic structural view of a lithography machine according to an embodiment of the present invention.
  • FIG. 2 is a top plan view of a mask type face shaping device according to an embodiment of the present invention.
  • FIG. 3 is a partial enlarged view of a mask masking device according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing the working principle of a suction cup according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing the working principle of a mask type face shaping device according to an embodiment of the present invention.
  • 6 to 7 are schematic diagrams showing the layout of a suction cup according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram showing the force distribution of a suction cup according to an embodiment of the present invention.
  • 9a-9b are respectively a simulation result of a mask plate refurbishing in an embodiment of the present invention.
  • 10-mask face shaping device 100-sucker, 200-sucker mounting frame, 300-adjusting bolt, 400-pneumatic interface, 500-mounting plate, 600-mask, 610-trapezoidal field of view, 700 - Mask table.
  • the mask blanking device 10 of the present invention comprises: a suction cup 100, a suction cup mounting frame 200, and a pneumatic control system (not shown); wherein the suction cup mounting frame 200 is disposed.
  • the chuck 100 is dispersedly mounted at the bottom of the chuck mounting frame 200 and corresponds to a region other than the trapezoidal exposure field 610 (see FIGS. 6 and 7) on the mask 600;
  • the control system is used to control the action of the suction cup 100 to effect the action of sucking or releasing the mask 600.
  • the objective lens may be configured in multiples, and the specific number of illumination paths does not affect the implementation of the present invention.
  • Installed between the mask 600 and the lighting system The suction cup 100 and the arrangement of the suction cups 100 avoid the exposed areas of the mask 600 (see FIGS. 6 and 7 in detail) without affecting the exposure quality of the illumination system to the mask 600.
  • the suction cup 100 is fixed to the bottom of the suction cup mounting frame 200 by an adjusting bolt 300.
  • each suction cup 100 is provided with a pneumatic interface 400 and is connected to the pneumatic line through the pneumatic interface 400, through which the suction cup 100 is connected to the pneumatic control system.
  • the pneumatic control system includes a pressure reducing valve, a pressure sensor and an on-off valve, which can adjust the pressure formed by each suction cup 100 in real time.
  • the pneumatic control system also includes a compression power system, a compression pump, for providing a driving force for rushing a positive pressure gas into the pneumatic line.
  • the on-off valve is used to control the on and off of the suction cup 100
  • the pressure relief valve is used to adjust the pressure of each suction cup 100, so that the suction cup 100 reaches the required stable pressure value
  • the pressure sensor is used to detect the pressure, thereby achieving the right Real-time control of each sucker 100.
  • the pneumatic control system of each suction cup 100 is the same, but when the mask 600 is shaped, not every suction cup 100 is in operation, so to achieve real-time control of each suction cup 100, automatic The pneumatic control system can be controlled either manually or manually.
  • the suction cup 100 is a non-contact type suction cup, that is, the relationship between the suction cup 100 and the mask sheet 600 is non-contact type.
  • the bottom air outlet of the non-contact type suction cup of the present invention is annular, and the air outlet direction is discharged from the circumference of the ring, so that the center of the bottom of the suction cup 100 forms a negative pressure, thereby adsorbing the mask 600.
  • the non-contact type suction cup realizes the function of non-contact conveyance adsorption according to Bernoulli's theorem.
  • a plurality of non-contact chucks are disposed above the mask 600, and the negative pressure lifting force (F1, F2, F3, . . . Fn) generated between the chuck 100 and the mask 600 is utilized to adsorb the mask 600, thereby effectively balancing the mask 600.
  • Gravity (G) suppresses gravity sinking.
  • a mounting plate 500 for adjusting the distance between the bottom of the chuck 100 and the mask 600 is also included.
  • the mounting plate 500 is mainly used when the suction cup 100 is integrally installed, and the function is mainly to adjust the distance between the plurality of suction cups 100 and the mask plate 600.
  • the mounting plate 500 can be implemented using a tooling plate, which is used as follows: The mounting plate 500 is first placed on the mask plate 600 and is positioned directly below the position of the suction cup 100. When the suction cup 100 is integrated, all the suction cups 100 are integrated and installed with the suction cup 100 based on the height of the mounting plate 500, thus ensuring that all the suction cups are hidden after installation.
  • the height of the template 600 is the same height.
  • the layout of the suction cup 100 is as shown in FIGS. 6-7.
  • a total of three rows of suction cups 100 do not block the trapezoidal exposure field 610 during the entire exposure process of the mask, and the mask is mounted and fixed on the mask 600.
  • the suction cup 100 is mounted on the suction cup mounting frame 200 by the adjusting bolt 300, and the bottom surface of the suction cup 100 is adjustable from the height of the mask 600.
  • the bottom of the suction cup 100 can be controlled to be 2 mm away from the mask 600, and the tolerance is 2 um; the suction cup 100 is connected pneumatically.
  • the mechanical interface of the control system is tubular. The force of each suction cup 100 is controlled and maintained by the respective pneumatic control system.
  • the trapezoidal exposure field 610 of the mask over the entire stroke is considered, ensuring that the position of the suction cup 100 does not affect the exposure of the mask; secondly, the number of the suction cups 100 may be increased or decreased according to a specific situation. If it is necessary to reduce the number of the suction cups 100, it can adopt the layout manner as shown in FIG. 6, and the force distribution relationship of the suction cups 100 is as shown in FIG.
  • the force of each suction cup can be determined by the following factors: 1. The number of suction cups around the suction cup; 2. The position of the suction cup adsorption mask, and 3. The working condition of the mask scanning full stroke.
  • the magnitude of the force of each suction cup 100 is determined experimentally on the basis of simulation. Therefore, the distribution principle of the chuck 100 in the present invention can be applied to the flexural deformation of a mask of any size. If there is no limit on the number of suction cups 100, as shown in Fig. 7, three rows of suction cups 100 may be placed above the mask, and the three rows of suction cups 100 may be staggered. With the device of the invention, the mask has a good repairing effect, and the mask shaping repair control can be realized within ⁇ 1 um.
  • the large mask surface shaping device 10 of the present invention is not limited by the size of the mask 600, and can be applied to the mask 600 of any size.
  • the chuck 100 can be controlled by simulation analysis to correct the mask 600.
  • a mask 600 having a mask size of 920 mm ⁇ 800 mm, wherein the effective pattern area is 750 mm ⁇ 650 mm, and an exposure field of view area of 280 mm ⁇ 650 mm is taken as an example.
  • suction cup 100 of Figure 6 is numbered first (from left to right):
  • Second row 201, 202, 203, 204, 205, 206, 207, 208, 209, 210, 211, 212, 213, 214;
  • the simulation analysis can cover the full stroke of the mask motion, when the mask is moved to different positions in the stroke, the lifting force is provided by the different suction cups 100; due to the mask stroke, the partial suction cup 100 overlaps the mask edge. In the case where the partial overlap, the lifting force of the suction cup 100 can be substituted into the simulation software by the measured value. Then, during the entire scanning process of the mask, the correction effect of the mask is as shown in Table 2 and Figs. 9a to 9b.
  • the simulation number is the name of each simulation model, and has no special meaning
  • the X position is the position in the full stroke scan of the mask, the unit is mm
  • the full stroke of the mask is 1200mm, because the suction cup layout is symmetrical.
  • the X position is the position of the mask in the scanning direction in the 600mm stroke; the sinking amount min and the sinking amount max are expressed at the corresponding X position
  • the measured minimum and maximum values of the sinking amount of the mask, the unit is um, the sinking amount is positive, indicating that the compensation is excessive, and the sinking amount is negative, indicating that the compensation is insufficient.
  • the suction amount of the mask 600 can be controlled to be -3.6 to 0.35 um and -0.5 to 2.2 um by suction of the suction cup 100, which respectively correspond to each position in the full stroke of the scanning exposure, and the compensation effect is the worst.
  • Two locations In one position, the maximum amount of mask sinking is -3.6um, the minimum is 0.35um (indicating overcompensation), and in another position, the maximum amount of mask sinking is -0.5um, and the minimum is 2.2um; However, if the workpiece stage vertical closed-loop servo is considered, the gravity sink of the mask in the exposure field of view can be controlled within ⁇ 2 um.
  • the large mask surface shaping device of the present invention comprises: a suction cup 100, a suction cup mounting frame 200 and a pneumatic control system; wherein the suction cup mounting frame 200 is disposed above the mask table 700, the suction cup 100 Dispersingly mounted at the bottom of the suction cup mounting frame 200; the pneumatic control system is for controlling the action of the suction cup 100 to suck or release the mask.
  • the present invention has the following advantages:
  • the suction cup 100 avoids the trapezoidal exposure field of view 610 of the mask 600, so that the light beam is 100% irradiated onto the mask, thereby improving the exposure efficiency;
  • suction control panel 100 independently controlled by the pneumatic control system is beneficial to the correction effect of the mask deflection
  • the large mask surface shaping device of the present invention is separately provided and is not mounted on the lithography machine, thereby reducing the weight load of the reticle;
  • the large mask surface shaping device does not contact any of the components in the lithography machine, and does not bring external vibration to the lithography machine;
  • the suction cup 100 adopts the filling of the gas, and takes away the thermal load caused by the irradiation of the mercury lamp on the surface of the mask, thereby reducing the thermal deformation of the mask, and is beneficial to improving the image quality;

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Library & Information Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种掩模板面型整形装置(10)，包括：吸盘(100)、吸盘安装框架(200)以及气动控制系统。吸盘安装框架(200)设置在掩模台(700)上方，吸盘(100)分散安装在吸盘安装框架(200)的底部，气动控制系统用于控制吸盘(100)吸取或释放掩模板(600)。吸盘(100)的设置避开了掩模板上的梯形曝光视场(610)，使得光束100％照射到掩模上，提高了曝光效率。掩模板面型整形装置(10)单独设置，不安装在光刻机上，减少了掩模板(600)的重量负荷。掩模板面型整形装置(10)不与光刻机中的任何部件接触，不会给光刻机带来外部的震动。

Description

掩模板面型整形装置及采用其的光刻机 技术领域
本发明涉及集成电路制造领域，特别涉及一种掩模板面型整形装置，还涉及采用了该掩模板面型整形装置的光刻机。
背景技术
随着TFT(薄膜场效应晶体管)基板尺寸的增加，TFT光刻机掩模板的尺寸也相应增大，由最初的6寸掩模板，到5.5代TFT光刻机中，掩模板尺寸已达920mm×800mm，到8.5代掩模板尺寸更是达到了1320mm×1108mm。尺寸如此巨大的掩模板，吸附在掩模台上，不可避免地将受其自重影响，在垂向产生的形变达40um以上。对于5.5代以上的高世代TFT光刻设备，多镜头拼接或超大视场技术已是必然趋势，然而，掩模板的挠曲对曝光精度有着极大的影响，特别极大影响投影物镜的焦深范围，使成像质量难以得到保证。
为修正掩模板的挠曲，一种方式是在物镜中加入调节物面的机构以适应掩模的自重变形。然而，这会使物镜的结构变得更为复杂，同时引入过多的可动元件，不利于整个光刻机的可靠性。
另外一种方式是采用真空密封技术，即在掩模板与照明系统之间安装一玻璃板，使掩模板、掩模台和玻璃板构成一个空间，并将该空间与气动装置的空气抽吸通路及空气导入通路相连接，调节该空间内部的压力，使其与掩模板的自重相平衡的压力相同，从而使掩模板向与重力方向相反的方向挠曲，抵消掩模板的自重挠曲。由于玻璃板的存在，导致了照明系统对掩模的曝光质量造成影响，且玻璃板也有自重变形，降低了曝光的质量，掩模板与玻璃板以及气动装置都在一个架构上，增加掩模震动以及重量的负荷。
发明内容
本发明提供一种掩模板面型整形装置，以克服现有技术中掩模板自重变形的问题。
为解决上述技术问题，本发明提供一种掩模板面型整形装置，包括：若干吸盘、吸盘安装框架以及气动控制系统；其中，所述吸盘安装框架设置在所述掩模板上方，若干所述吸盘分散安装在所述吸盘安装框架的底部；所述气动控制系统用于控制所述吸盘吸取或释放所述掩模板的动作。
作为优选，所述吸盘通过调节螺栓或活动卡扣固定在吸盘安装框架底部。
作为优选，若干所述吸盘在所述掩模板上的垂直投影位置位于所述掩模板上梯形曝光视场以外的区域内。
作为优选，所述吸盘采用非接触的方式吸附所述掩模板。
作为优选，所述气动控制系统包括若干气动管路分别连接至所述若干吸盘，还包括设置在每条所述气动管路中的减压阀、开关阀以及压力传感器。
作为优选，每个所述吸盘的吸附力可实时被所述压力传感器监测并由所述减压阀和开关阀控制调整。
作为优选，还包括安装板，用于调节所述吸盘底部与掩模板的间距时使用。
作为优选，所述掩模板为920mm×800mm以上的大尺寸型。即，5.5代以上的高世代TFT光刻设备中使用的掩模板。
为解决上述技术问题，本发明还提供一种光刻机，包括光源、照明系统、掩模台、物镜和工件台，所述掩模台用于承载并移动一掩模板，所述照明系统用于在掩模板所在的平面内形成一个或多个照明视场，其中，所述光刻机还包括一掩模板面型整形装置，其包括：框架，位于所述掩模台的上方；多个吸盘，设置于所述框架的底部；气动控制系统，用于控制所述多个吸盘的吸附或释放所述掩模板的操作，其中，所述多个吸盘在所述掩模板所在的平面内的垂直投影与所述一个或多个照明视场不交叠，且所述多个吸盘以非接 触方式吸取所述掩模板。
作为优选，所述多个吸盘排列成多行，且中间一行的长度大于所述掩模板的行程长度，并排2侧的吸盘行的长度小于所述掩模板的行程长度。
作为优选，相邻两行的吸盘之间有空隙。
作为优选，所述气动控制系统用于控制位于掩模板正上方的吸盘对所述掩模板进行吸附，所述气动控制系统还用于控制每一个吸附掩模板的吸盘的吸附力大小，使得所述掩模板受到的吸附力大致与所述掩模板的重力平衡。
作为优选，所述气动控制系统包括多条气动管路分别连接至所述多个吸盘，所述气动控制系统还包括设置在每条所述气动管路中的减压阀、开关阀以及压力传感器。
作为优选，每一个吸附掩模板的吸盘的吸附力大小由相应的压力传感器监测并通过相应的减压阀调整。
作为优选，所述框架与所述光源、照明系统、掩模台、物镜和工件台都不相连。
作为优选，所述掩模板的尺寸为920mm×800mm以上。
作为优选，所述吸盘通过调节螺栓或活动卡扣固定在所述框架底部。
作为优选，所述掩模板面型整形装置还包括安装板，用于调节所述吸盘底部与掩模板的间距。
与现有技术相比，本发明具有以下优点：本发明的吸盘的设置避开了掩模板上的梯形照明视场，使得光束100％照射到掩模上，提高了曝光效率；掩模板面型整形装置的吸盘吸附力可有效减少掩模板的重量负荷，避免掩模板因自重产生变形；掩模板面型整形装置相对独立，与光刻机中的光源、照明系统、掩模台、物镜和工件台等部件互不相连也互不接触，不会将光刻机外部的震动带给上述这些部件。
附图说明
图1为本发明一具体实施方式中光刻机的结构示意图；
图2为本发明一具体实施方式中掩模板面型整形装置的俯视图；
图3为本发明一具体实施方式中掩模板面型整形装置的局部放大图；
图4为本发明一具体实施方式中吸盘的工作原理图；
图5为本发明一具体实施方式中掩模板面型整形装置的工作原理图；
图6～7分别为本发明一具体实施方式中吸盘的布局示意图；
图8为本发明一具体实施方式中吸盘的作用力分布示意图；
图9a～9b分别为本发明一具体实施方式中掩模板整修仿真效果图。
图中：10-掩模板面型整形装置、100-吸盘、200-吸盘安装框架、300-调节螺栓、400-气动接口、500-安装板、600-掩模板、610-梯形曝光视场、700-掩模台。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。需说明的是，本发明附图均采用简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
如图1～3所示，本发明提供的掩模板面型整形装置10，包括：吸盘100、吸盘安装框架200以及气动控制系统(图中未示出)；其中，所述吸盘安装框架200设置在掩模台700上方，所述吸盘100分散安装在所述吸盘安装框架200的底部，并与掩模板600上梯形曝光视场610(见图6和图7)以外的区域对应；所述气动控制系统用于控制所述吸盘100动作，实现吸取或释放掩模板600的动作。具体地，照明光从灯室出射，依次经过镜片、渐变衰减以及位于掩模台700上的掩模板600、物镜组、最终成像在工件台与基底上。当然，照明系统中的照明光路可以有多条，相应地物镜也可以配置多个，照明光路的具体数量不影响本发明的实施。在掩模板600与照明系统之间安装 吸盘100，且吸盘100的排列方式，避开了掩模板600的曝光区域(详见图6和图7)，不影响照明系统对掩模板600的曝光质量。较佳的，所述吸盘100通过调节螺栓300固定在吸盘安装框架200底部。
进一步的，每个吸盘100均设置有气动接口400，并通过所述气动接口400连接至气动管路，吸盘100通过所述气动管路连接到气动控制系统。气动控制系统内包括有减压阀、压力传感器和开关阀，可对每个吸盘100形成的压力进行实时调整。气动控制系统还包括压缩动力系统，即压缩泵，用于提供向气动管路冲入正压气体的驱动力。所述开关阀用于控制吸盘100的通断，减压阀用来调节每个吸盘100的压力，使吸盘100达到所需要的稳定压力值，压力传感器用于检测压力的大小，从而实现了对每个吸盘100的实时控制。需要说明的是，每个吸盘100的气动控制系统都一样，但是对掩模板600整形时，并不是每个吸盘100都在工作中，所以要达到对每个吸盘100的实时控制，可以采用自动或手动两种方式控制气动控制系统。
较佳的，所述吸盘100为非接触式吸盘，即吸盘100与掩模板600的关系为非接触式。具体如图4所示，本发明的非接触式吸盘的底部出气口为环形，出气方向由环形四周排出，使得吸盘100底部中心形成负压，从而吸附掩模板600。如图5所示，所述非接触式吸盘根据伯努利定理实现了非接触搬运吸附的功能。在掩模板600的上方布置若干非接触式吸盘，利用吸盘100与掩模板600之间产生的负压提升力(F1、F2、F3…Fn)，从而吸附掩模板600，有效地平衡掩模板600重力(G)，抑制重力下沉。
作为优选，还包括用于调节所述吸盘100底部与掩模板600距离的安装板500。安装版500主要在所述吸盘100集成安装的时候使用，作用主要是为调节多个吸盘100与掩模板600之间的距离一致。安装版500可采用工装板实现，其使用方法如下：安装板500首先放在掩模板600上不动，并且在吸盘100位置的正下方。在集成吸盘100时，所有的吸盘100以安装板500的高度为基准，集成和安装吸盘100，这样保证所有的吸盘在安装后距离掩 模板600的高度是同一高度。
优选地，本实施例，吸盘100的布局如图6～7所示，共3排吸盘100，在整个掩模的曝光过程中，不遮挡梯形曝光视场610，掩模安装固定在掩模板600上，吸盘100通过调节螺栓300安装固定在吸盘安装框架200上，且吸盘100底面距离掩模板600的高度可调，例如可以控制吸盘100底部与掩模板600距离2mm，公差2um；吸盘100连接气动控制系统的机械接口为管螺纹状。每个吸盘100的作用力都由各自的气动控制系统控制并保持。
吸盘100的布局过程中，首先，考虑掩模在整个行程中的梯形曝光视场610，确保吸盘100的位置不影响掩模的曝光；其次，可以根据具体的情况，增加或减少吸盘100的数量，若需要减少吸盘100的数目，其可以采用如图6所示的布局方式，且吸盘100的作用力大小分布关系如图8所示。每个吸盘作用力的大小可以由以下因素决定：1、该吸盘周围吸盘的数目；2、吸盘吸附掩模的位置，以及3、掩模扫描全行程的工况。在本实施例中，各吸盘100的作用力大小是在仿真的基础上通过实验测校确定的。因此，本发明中吸盘100的分布原理可适用任何大小的掩模的挠曲变形。若没有吸盘100数量的限制，也可如图7所示，在掩模的上方布满3排吸盘100，并使3排吸盘100交错排列。采用本发明的装置，掩模的修复效果好，并可实现掩模整形修复控制在±1um内。当然，本发明的大掩模板面型整形装置10，不受掩模板600的大小限制，可适用任意尺寸的掩模板600。
较佳的，可以通过仿真分析来控制吸盘100，从而修正掩模板600。本实施例，以掩模大小为920mm×800mm，其中有效图形区为750mm×650mm，曝光视场区域大小为280mm×650mm的掩模板600为例。
具体地，先对图6吸盘100编号(从左至右)：
第一排：101，102，103；
第二排：201，202，203，204，205，206，207，208，209，210，211，212，213，214；
第三排：301，302，303。
则，相对应不同编号的吸盘100所需要的提升力如表1所示。
表1
吸盘编号 提升力(N)
101 6.53
102 6.53
103 6.03
201 14.8
202 14.8
203 14.8
204 14.8
205 12.3
206 11.8
207 7.28
208 7.28
209 11.8
210 12.3
211 14.8
212 14.8
213 14.8
214 14.8
301 6.03
302 6.53
303 6.53
由于仿真分析可以覆盖掩模运动的全行程，当掩模运动到行程中的不同位置处时，由不同的吸盘100提供提升力；由于掩模行程中，会出现部分吸盘100与掩模边缘重叠的情况，该部分重叠时吸盘100的提升力可以由实测值代入仿真软件中。则在掩模的整个扫描过程中，掩模的修正效果如表2和图9a～9b所示。表2中：仿真编号是每个仿真模型的名字，没有特殊含义；X位置是掩模全行程扫描中的各个位置，单位为mm，掩模全行程扫描距离为1200mm，由于吸盘布局是对称的，所以只需考虑半行程，即600mm,另外600mm结果一样，X位置就是这600mm行程中，掩模在扫描方向上的各个位置；下沉量min和下沉量max表示在对应的X位置处测得的掩模的下沉量的最小值和最大值，单位为um，下沉量是正，表示补偿过量，下沉量为负，表示补偿不足。
由此可知，采用吸盘100吸附可以将掩模板600的下沉量控制在-3.6～0.35um与-0.5～2.2um，其分别对应在扫描曝光全行程中的各个位置中，补偿效果最糟糕的两个位置。其中一个位置，掩模下沉量最大处为-3.6um，最小处为0.35um(表示过度补偿)，在另一个位置，掩模下沉量最大处为-0.5um，最小处为2.2um；而如果考虑工件台垂向闭环伺服，则可以将掩模在曝光视场区域的重力下沉控制在±2um内。
表2
仿真编号 X位置 下沉量min 下沉量max
09—04—01 -160    
09—04—02 -140 -1.3531 2.2
09—04—03 -120 -1.6768 1.37
09—04—04 -100 -1.8 0.9
09—04—05 -80 -3 0
09—04—06 -60 -1.7 0.5
09—04—07 -40 -1.7 1.8
09—04—08 -20 -2.2 0.5
09—04—09 0 -2.6 0.5
09—04—10 20 -1 0.5
09—04—11 40 -1 1.45
09—04—12 60 -1.5 0.65
09—04—13 80 -2.6 0.4703
09—04—14 100 -1 1
09—04—15 120 -0.5 1.8
09—04—16 140 -2.1 1.2
09—04—17 160 -3.6 0.35
09—04—18 180 -3.6 0.33
09—04—19 200 -1.7 0.456
09—04—20 220 -1 0.5
09—04—21 240 -0.5 0.589
09—04—22 260 -2 0.65
09—04—23 280 -1.75 1
09—04—24 300 -1.4 1.4
09—04—25 320 -2 2
09—04—26 340 -1.6 0.6
09—04—27 360 -1.6 0.02
09—04—28 380 -1.6 0.02
09—04—29 400 -1.6 0.2
09—04—30 420 -1 1.1
09—04—31 440 -1.4 2
综上所述，本发明的大掩模板面型整形装置，包括：吸盘100、吸盘安装框架200以及气动控制系统；其中，所述吸盘安装框架200设置在掩模台700上方，所述吸盘100分散安装在所述吸盘安装框架200的底部；所述气动控制系统用于控制所述吸盘100吸取或释放掩模板的动作。与现有技术相比，本发明具有以下优点：
1.吸盘100避开掩模板600的梯形曝光视场610，使得光束100％照射到掩模上，提高了曝光效率；
2.气动控制系统独立控制的吸盘100，有利于掩模挠曲的修正效果；
3.本发明的大掩模板面型整形装置单独设置，不安装在光刻机上，减少了掩模板的重量负荷；
4.大掩模板面型整形装置不与光刻机中的任何部件接触，不会给光刻机带来外部的震动；
5.吸盘100采用气体的充入，带走掩模表面由汞灯照射带来的热负荷，从而减小掩模的热变形，有利于提高成像质量；
6.气体的充入，净化掩模上可能存在的颗粒杂质或其他，提高了曝光的精度。
显然，本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包括这些改动和变型在内。

Claims (18)

  1. 一种掩模板面型整形装置，其特征在于，包括：若干吸盘、吸盘安装框架以及气动控制系统；其中，所述吸盘安装框架设置在所述掩模板上方，若干所述吸盘分散安装在所述吸盘安装框架的底部；所述气动控制系统用于控制所述吸盘吸取或释放所述掩模板的动作。
  2. 如权利要求1所述的掩模板面型整形装置，其特征在于，所述吸盘通过调节螺栓或活动卡扣固定在所述吸盘安装框架底部。
  3. 如权利要求1所述的掩模板面型整形装置，其特征在于，若干所述吸盘在所述掩模板上的垂直投影位置位于所述掩模板上梯形曝光视场以外的区域内。
  4. 如权利要求1所述的掩模板面型整形装置，其特征在于，所述吸盘采用非接触的方式吸附所述掩模板。
  5. 如权利要求1所述的掩模板面型整形装置，其特征在于，所述气动控制系统包括若干气动管路分别连接至所述若干吸盘，还包括设置在每条所述气动管路中的减压阀、开关阀以及压力传感器。
  6. 如权利要求5所述的掩模板面型整形装置，其特征在于，每个所述吸盘的吸附力可实时被所述压力传感器监测并由所述减压阀和开关阀控制调整。
  7. 如权利要求1所述的掩模板面型整形装置，其特征在于，还包括安装板，用于调节所述吸盘底部与掩模板的间距。
  8. 如权利要求1所述的掩模板面型整形装置，其特征在于，所述掩模板规格尺寸为920mm×800mm以上。
  9. 一种光刻机，包括光源、照明系统、掩模台、物镜和工件台，所述掩模台用于承载并移动一掩模板，所述照明系统用于在掩模板所在的平面内形成一个或多个照明视场，其特征在于，所述光刻机还包括一掩模板面型整形 装置，其包括：
    框架，位于所述掩模台的上方；
    多个吸盘，设置于所述框架的底部；
    气动控制系统，用于控制所述多个吸盘的吸附或释放所述掩模板的操作，
    其中，所述多个吸盘在所述掩模板所在的平面内的垂直投影与所述一个或多个照明视场不交叠，且所述多个吸盘以非接触方式吸取所述掩模板。
  10. 如权利要求9所述的光刻机，其特征在于，所述多个吸盘排列成多行，且中间一行的长度大于所述掩模板的行程长度，并排在所述中间一行2侧的吸盘行的长度均小于所述掩模板的行程长度。
  11. 如权利要求10所述的光刻机，其特征在于，相邻两行的吸盘之间有空隙。
  12. 如权利要求9所述的光刻机，其特征在于，所述气动控制系统用于控制位于掩模板正上方的吸盘对所述掩模板进行吸附，所述气动控制系统还用于控制每一个吸附掩模板的吸盘的吸附力大小，使得所述掩模板受到的吸附力大致与所述掩模板的重力平衡。
  13. 如权利要求12所述的光刻机，其特征在于，所述气动控制系统包括多条气动管路分别连接至所述多个吸盘，所述气动控制系统还包括设置在每条所述气动管路中的减压阀、开关阀以及压力传感器。
  14. 如权利要求13所述的光刻机，其特征在于，每一个吸附掩模板的吸盘的吸附力大小由相应的压力传感器监测并通过相应的减压阀调整。
  15. 如权利要求9所述的光刻机，其特征在于，所述框架与所述光源、照明系统、掩模台、物镜和工件台都不相连。
  16. 如权利要求9所述的光刻机，其特征在于，所述掩模板的尺寸为920mm×800mm以上。
  17. 如权利要求9所述的光刻机，其特征在于，所述吸盘通过调节螺栓或活动卡扣固定在所述框架底部。
  18. 如权利要求9所述的光刻机，其特征在于，所述掩模板面型整形装置还包括安装板，用于调节所述吸盘底部与掩模板的间距。
PCT/CN2014/092425 2013-12-31 2014-11-28 掩模板面型整形装置及采用其的光刻机 WO2015101121A1 (zh)

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CN114956587B (zh) * 2022-04-06 2023-12-26 杭州佳龙光学玻璃有限公司 一种ag玻璃蚀刻方法及其设备

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KR20160105472A (ko) 2016-09-06
JP2017503207A (ja) 2017-01-26
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