WO2015097728A1 - Partie bobine d'induction - Google Patents

Partie bobine d'induction Download PDF

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Publication number
WO2015097728A1
WO2015097728A1 PCT/JP2013/007676 JP2013007676W WO2015097728A1 WO 2015097728 A1 WO2015097728 A1 WO 2015097728A1 JP 2013007676 W JP2013007676 W JP 2013007676W WO 2015097728 A1 WO2015097728 A1 WO 2015097728A1
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WO
WIPO (PCT)
Prior art keywords
coil element
resin substrate
coil
layer
electrode
Prior art date
Application number
PCT/JP2013/007676
Other languages
English (en)
Japanese (ja)
Inventor
佐野　孝史
常徳 寺田
Original Assignee
株式会社Ｌｅａｐ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｌｅａｐ filed Critical 株式会社Ｌｅａｐ
Priority to JP2014512967A priority Critical patent/JP5584844B1/ja
Priority to PCT/JP2013/007676 priority patent/WO2015097728A1/fr
Priority to TW103144251A priority patent/TW201546842A/zh
Publication of WO2015097728A1 publication Critical patent/WO2015097728A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers

Definitions

  • the present invention relates to a coil component produced in a resin substrate, and more particularly to a coil component configured by laminating a plurality of resin substrates.
  • a plurality of resin substrates each having a patterned coil element are prepared, and these coil elements formed on each resin substrate are stacked and connected in series. It is common to make them.
  • Patent Document 1 a resin intaglio having irregularities corresponding to a conductor pattern of a coil element is filled with a conductive paste, the pattern of the filled conductive paste is transferred to a ceramic substrate, and N (N is It is described that a coil component is produced by laminating two layers. Further, Patent Document 2 describes that a chip coil is manufactured by laminating a plurality of sheet-like laminates having coil conductors formed on both surfaces.
  • the coil parts described in Patent Documents 1 and 2 described above have a complicated via connection structure between the coil elements formed in each layer and have a large bonding area between the coil elements in each layer. There is a problem that the occupied area of becomes large. Moreover, since the thickness per layer is large, when the laminated coil components are produced, there is also a problem that the entire thickness is further increased.
  • the present invention has been made to solve the above-described problem, and by simply laminating a resin substrate having a coil element formed by stamping, each coil element is alternately connected in series to constitute a power inductor.
  • An object is to provide a small coil component having a small chip area and a thin laminated thickness.
  • a first coil element pattern wound in a spiral shape in the clockwise (or counterclockwise) direction from one end to the other end is imprinted on the surface at a predetermined depth
  • a first resin substrate on which the first coil element pattern engraved is filled with a conductive layer by electroplating to form the first coil element, and outward in the clockwise (or counterclockwise) direction from one end to the other end.
  • the second coil element pattern wound in a spiral shape is engraved on the surface at a predetermined depth, and the engraved second coil element pattern is filled with a conductive layer by electroplating to form a second coil element.
  • the first resin element and the second resin element are alternately laminated and bonded so that the front surface and the rear surface face each other.
  • the first position and the second position of the first resin substrate in the lowermost layer are imprinted through the substrate and filled with the conductive layer by electroplating.
  • a second electrode, and a second electrode of the first resin substrate and the second resin substrate in the upper layer is imprinted through the substrate and filled with a conductive layer by electroplating are arranged, and the through electrodes of each layer are connected to each other and electrically connected to the second electrode in the lowermost layer, and one end of the first coil element formed on the first resin substrate in the lowermost layer is connected to the first electrode The other end of the second coil element formed on the second resin substrate on the uppermost layer is connected to the through electrode, and the first electrode and the second electrode are used as power inductor electrodes. It is characterized by that.
  • the coil component according to the present invention is characterized in that the first and second resin substrates are made of a thermosetting resin.
  • a power inductor having a sufficiently small thickness and a small chip area can be obtained.
  • FIG. 3 is a structural diagram of a lowermost resin substrate according to the present invention.
  • FIG. 3 is a structural diagram of an even-numbered resin substrate according to the present invention.
  • FIG. 3 is a structural diagram of an odd-numbered resin substrate according to the present invention.
  • FIG. 3 is a structural diagram of the uppermost resin substrate according to the present invention.
  • FIG. 3 is an exploded perspective view of laminated coil elements according to the present invention.
  • the process flow figure which shows the preparation procedure of a 1st metal mold
  • the coil component according to the present invention has a structure of a laminated molded body in which a plurality of resin substrates on which coil elements are formed are laminated and bonded. Coil elements formed in each resin substrate are connected in series between the layers via a through hole to form a power inductor, formed on one end of the coil element formed on the resin substrate in the lowermost layer and the resin substrate in the uppermost layer The other end of the coil element thus formed is drawn out of the laminated molded body and used as an electrode of a power inductor.
  • FIG. 1 to 4 are a plan view (a) and sectional views (b) and (c) showing the structure of a resin substrate on which a coil element is formed.
  • FIG. 1 shows the first layer (lowermost layer), and FIG. , 4 and 6,
  • FIG. 3 shows the third, fifth and seventh layers, and
  • FIG. 4 shows the eighth (uppermost) resin substrate.
  • FIG. 1 shows the structure of the first (lowermost) resin substrate 100.
  • A) is a plan view
  • (b) is a sectional view taken along line AA in (a)
  • (c) is a sectional view taken along line BB in (a).
  • a first coil element pattern wound spirally inward in the clockwise direction from one end 102 to the other end 104 is engraved on the surface of the resin substrate 100 at a predetermined depth (d1).
  • the first coil element pattern is filled with a conductive layer by electroplating to form the first coil element 106.
  • the first position I and the second position II of the resin substrate 100 are stamped (d2) through the substrate and filled with a conductive layer by electroplating, and the second electrode 110 are arranged. Note that one end 102 of the first coil element 106 is connected to the first electrode 108.
  • a rectangular opening 120 penetrating the substrate is formed at the center of the resin substrate 100.
  • a laminated molded body is formed in the opening 120, and when it is attached to the printed wiring board, other electronic components can be arranged.
  • the winding direction of the first coil element 106 may be counterclockwise.
  • the line width and film thickness of the first coil element 106 can be 40 ⁇ m, the thickness of the resin substrate can be 50 ⁇ m, and the size can be about 3.0 mm ⁇ 4.0 mm.
  • the line width of the other end 104 of the first coil element 106 is preferably increased to about 80 to 100 ⁇ m so as to be connected to one end of the second coil element formed on the upper resin substrate.
  • FIG. 2 shows the structure of an even-numbered (2, 4, 6) -thick resin substrate 200 excluding the eighth (uppermost) layer.
  • (A) is a plan view
  • (b) is a sectional view taken along line CC of (a)
  • (c) is a sectional view taken along line DD of (a).
  • a second coil element pattern wound spirally from the one end 202 to the other end 204 in the clockwise direction is engraved on the surface of the resin substrate 200 at a predetermined depth (d1).
  • the second coil element pattern is filled with a conductive layer by electroplating to form a second coil element 206.
  • a penetrating electrode 208 that is imprinted (d2) through the substrate and filled with a conductive layer by electroplating is disposed at the second position II of the resin substrate 200.
  • One end 202 is provided with a through hole 210 penetrating the substrate, and the through hole 210 is filled with a conductive layer by electroplating. Note that the winding direction of the second coil element 206 is the same as the winding direction of the first coil 106.
  • first resin substrates and first coil elements odd-numbered resin substrates and coil elements are referred to as first resin substrates and first coil elements, respectively, and even-numbered resin substrates and coil elements are referred to as second resin substrates and second coil elements, respectively.
  • first resin substrate 100 shown in FIG. 1 and the second resin substrate shown in FIG. 2 are laminated and bonded so that the front surface 100F of the first resin substrate 100 and the back surface 200R of the second resin substrate 200 face each other.
  • solder bumps may be formed on the respective connection portions and then welded.
  • FIG. 3 shows the structure of the first resin substrate 100a of odd-numbered layers (3, 5, and 7 layers) excluding the first layer.
  • (A) is a plan view
  • (b) is a sectional view taken along line EE of (a)
  • (c) is a sectional view taken along line FF of (a).
  • the element arrangement is almost the same as that of the first resin substrate 100 of the first layer shown in FIG. 1, the position of one end 102a of the first coil element 106a is different, and the through hole 112a is connected to the one end 102a.
  • the configuration is slightly different in that no electrode is provided at the first position I.
  • the other end 204 of the second coil element 206 in the lower layer and the one end 102a of the first coil element 106a in the upper layer are electrically connected via the through hole 112a, and the first resin substrate 100a in the upper layer is first connected.
  • the through electrode 110a at the second position II and the through electrode 208 at the second position II of the lower second resin substrate 200 are also electrically connected.
  • FIG. 4 shows the structure of the second resin substrate 200a in the eighth layer (uppermost layer).
  • (A) is a plan view
  • (b) is a sectional view taken along line GG in (a)
  • (c) is a sectional view taken along line HH in (a).
  • the element arrangement is almost the same as that of the second resin substrate 200 in the second, fourth, and sixth layers shown in FIG. 2, the position of the other end 204a of the second coil element 206a is different from the other end 204a.
  • the configuration is slightly different in that it is connected and a through hole 208a is provided.
  • the other end 104a of the first coil element 106a in the lower layer and one end 202a of the second coil element 206a in the uppermost layer are electrically connected via the through hole 210a, and the second resin substrate 200a in the uppermost layer is connected.
  • the through hole 208a at the second position II is also electrically connected to the through electrode 110a at the second position II of the first resin substrate 100a in the lower layer.
  • a laminated molded body composed of eight layers is configured, and the first electrode 108 at the first position I and the second electrode 110 at the second position II of the first resin substrate 100 in the lowermost layer.
  • the first electrode 108 at the first position I and the second electrode 110 at the second position II of the first resin substrate 100 in the lowermost layer. are drawn out of the laminated molded body as both electrodes of a power inductor configured by alternately connecting four first coil elements and four second coil elements in series.
  • FIG. 5 is an exploded perspective view showing the arrangement by taking out the coil elements and the electrodes of the coil component produced as described above. Both electrodes 108 and 110 of the power inductor are taken out from the back surface 100R of the lowermost first resin substrate 100 and connected to electrodes (not shown) provided on the printed wiring board 300.
  • the first and second resin substrates are formed with a plurality of coil elements arranged in a matrix. After lamination, they are separated by dicing to form a single coil component.
  • the resin substrate is used as it is after the coil element and the power inductor are formed.
  • a thermosetting resin such as epoxy, phenol, polyimide, or polyurethane can be used.
  • the electroplating for forming the conductive layer is preferably copper plating.
  • the first mold having the reverse coil element pattern 35 and the reverse through hole pattern 45 formed by reversing the coil element pattern 30 and the through hole pattern 40 on the surface, and the side wall portion are formed.
  • a desired resin mold and a resin substrate are produced by using a combination of a mold that defines and a second mold that includes a mold that defines a bottom surface portion.
  • FIG. 6 is a process flow diagram showing the procedure for producing the first mold.
  • a metal mold 1 made of Ni, SUS, Ni alloy or the like having a coil element pattern 30 having a depth d1 and a through-hole pattern 40 having a depth d2 imprinted on the surface thereof is prepared.
  • a release layer such as NiO is formed on the surface of the mold 1, and then Ni is laminated and transferred by electroplating to produce the Ni mold 2.
  • the Ni mold 2 is peeled off from the metal mold 1 to form a first mold 2 as shown in FIG.
  • a reverse coil element pattern 35 having a height d1 and a reverse through-hole pattern 45 having a height d2 are formed on the surface of the first mold 2.
  • FIG. 7 is a diagram showing the configuration of the second mold.
  • the second mold is called a casting mold, and is formed by bonding a mold 4 that defines a side wall portion and a mold 3 that defines a bottom surface portion.
  • the material of the mold 4 is not particularly limited, and may be a resin or a metal.
  • a seed layer for a plating process in a later step can be formed on the surface, and a thin layer for peeling or dissolving. It is preferable to use a resin such as acrylic.
  • FIG. 8 is a diagram showing a process flow for producing the resin substrate 5 using the first mold 2 shown in FIG. 6 and the second mold shown in FIG.
  • the first mold 2 is placed in the second mold into which the casting resin film F has been poured so that the reverse through-hole pattern 45 is in close contact with the bottom surface of the casting mold 3. And pressurize. At this time, the reverse through-hole pattern 45 is sufficiently adhered to the bottom surface portion of the casting mold 3 so that the resin film F does not enter the adhesion portion.
  • the resin film F is uniformly filled in the recesses of the first mold 2 and then cured.
  • the resin mold 5 having the coil element pattern 30 and the through-hole pattern 40 is produced on the casting mold 3 as shown in FIG.
  • the casting mold 4 defining the side wall portion of the second mold is removed.
  • the seed layer is formed in the region of the coil element pattern 30 and the region of the through-hole pattern 40 and the pattern portion is filled with a conductive layer by electroplating
  • the coil element 30a and the through-hole 40a are made of resin as shown in FIG. It is formed in the mold 5.
  • the casting mold 3 is peeled from the resin mold 5
  • a resin substrate is completed as shown in FIG. 8e.
  • the resin mold is produced by the first mold and the second mold.
  • the coil element pattern and the through hole pattern are formed directly on the resin substrate by imprinting or hot pressing. It is also possible to engrave a resin mold.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Des premiers substrats de résine et des seconds substrats de résine adhèrent les uns aux autres tout en étant disposés en couches alternatives de sorte qu'une surface avant et une surface arrière se font face pour former une forme stratifiée dans laquelle un premier élément de bobine et un second élément de bobine se chevauchent en alternance. Une seconde extrémité d'un premier élément de bobine d'induction présent dans une couche inférieure et une première extrémité d'un second élément de bobine d'induction présent dans une couche supérieure sont électriquement connectées par le biais d'un trou traversant disposé au niveau d'une première extrémité du second substrat de résine présent dans la couche supérieure. La première extrémité d'un premier élément de bobine d'induction présent dans une couche supérieure et la seconde extrémité d'un second élément de bobine d'induction présent dans une couche inférieure sont connectées électriquement par le biais d'un trou traversant disposé au niveau d'une première extrémité du premier substrat de résine présent dans la couche supérieure. De cette manière, un inducteur électrique est constitué, des premier éléments de bobine d'induction et des seconds éléments de bobine d'induction disposés en alternance étant raccordés en série dans la forme stratifiée. À partir de la première extrémité du premier élément de bobine d'induction formé dans le premier substrat de résine présent dans la couche la plus inférieure et à partir de la seconde extrémité du second élément de bobine d'induction formé dans le second substrat de résine présent dans la couche la plus supérieure, des électrodes sont attirées à l'extérieur de la forme stratifiée pour servir d'électrodes pour l'inducteur électrique.
PCT/JP2013/007676 2013-12-27 2013-12-27 Partie bobine d'induction WO2015097728A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014512967A JP5584844B1 (ja) 2013-12-27 2013-12-27 コイル部品
PCT/JP2013/007676 WO2015097728A1 (fr) 2013-12-27 2013-12-27 Partie bobine d'induction
TW103144251A TW201546842A (zh) 2013-12-27 2014-12-18 線圈元件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/007676 WO2015097728A1 (fr) 2013-12-27 2013-12-27 Partie bobine d'induction

Publications (1)

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WO2015097728A1 true WO2015097728A1 (fr) 2015-07-02

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PCT/JP2013/007676 WO2015097728A1 (fr) 2013-12-27 2013-12-27 Partie bobine d'induction

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JP (1) JP5584844B1 (fr)
TW (1) TW201546842A (fr)
WO (1) WO2015097728A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220111423A1 (en) * 2020-10-13 2022-04-14 Regenesis Bioremediation Products Methods for Cleaning-in-Place

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114551063B (zh) * 2022-04-02 2023-09-15 电子科技大学 一种树脂型电感结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008108882A (ja) * 2006-10-25 2008-05-08 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
JP2008166391A (ja) * 2006-12-27 2008-07-17 Tdk Corp 導体パターンの形成方法および電子部品
JP5294286B1 (ja) * 2012-10-30 2013-09-18 株式会社Ｌｅａｐ コイル素子の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745477A (ja) * 1993-07-26 1995-02-14 Murata Mfg Co Ltd 電子部品およびその製造方法
JP3472329B2 (ja) * 1993-12-24 2003-12-02 株式会社村田製作所 チップ型トランス
JP2005191408A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd コイル導電体とその製造方法およびこれを用いた電子部品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008108882A (ja) * 2006-10-25 2008-05-08 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
JP2008166391A (ja) * 2006-12-27 2008-07-17 Tdk Corp 導体パターンの形成方法および電子部品
JP5294286B1 (ja) * 2012-10-30 2013-09-18 株式会社Ｌｅａｐ コイル素子の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220111423A1 (en) * 2020-10-13 2022-04-14 Regenesis Bioremediation Products Methods for Cleaning-in-Place

Also Published As

Publication number Publication date
JP5584844B1 (ja) 2014-09-03
TW201546842A (zh) 2015-12-16
JPWO2015097728A1 (ja) 2017-03-23

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