WO2015083257A1 - 貼合デバイスの製造装置 - Google Patents

貼合デバイスの製造装置 Download PDF

Info

Publication number
WO2015083257A1
WO2015083257A1 PCT/JP2013/082620 JP2013082620W WO2015083257A1 WO 2015083257 A1 WO2015083257 A1 WO 2015083257A1 JP 2013082620 W JP2013082620 W JP 2013082620W WO 2015083257 A1 WO2015083257 A1 WO 2015083257A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
chamber
hole
holding member
pressure chamber
Prior art date
Application number
PCT/JP2013/082620
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
義和 大谷
Original Assignee
信越エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越エンジニアリング株式会社 filed Critical 信越エンジニアリング株式会社
Priority to JP2014509968A priority Critical patent/JP5523646B1/ja
Priority to PCT/JP2013/082620 priority patent/WO2015083257A1/ja
Priority to CN201380070869.7A priority patent/CN104937652A/zh
Priority to KR1020157018877A priority patent/KR20160093539A/ko
Priority to TW103140669A priority patent/TWI576246B/zh
Publication of WO2015083257A1 publication Critical patent/WO2015083257A1/ja

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Definitions

  • the present invention may be a flat panel display (FPD) or a sensor device such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, or a touch panel type FPD or 3D (three-dimensional).
  • a sensor device such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, or a touch panel type FPD or 3D (three-dimensional).
  • Another plate-like workpiece such as a touch panel, cover glass, cover film, or FPD is used for a plate-like workpiece such as a liquid crystal module (LCM) or flexible printed wiring board (FPC) such as a display or an electronic book. It is related with the manufacturing apparatus of the bonding device bonded together.
  • the lift pins for transferring the upper substrate and the lower substrate can be moved up and down along the through holes provided in the upper substrate holder and the lower substrate holder, respectively.
  • the upper and lower substrates held and transferred by the arm of the transfer robot at the time of carrying in at atmospheric pressure are lift pins that move up and down so as to protrude from the surfaces of the upper and lower substrate holders, respectively.
  • the upper substrate holder and the lower substrate holder move closer to bring the inside of the vacuum container into a vacuum state, and then the upper substrate and the lower substrate are overlapped and temporarily fixed.
  • the bonded substrates are transferred to the arm of the transfer robot by lift pins and are carried out.
  • a seal member such as an O-ring is provided between the through hole of the upper substrate holder and the lower substrate holder described in Patent Document 1 and the lift pin so as to be slidably contacted with the lift pin.
  • an elastically deformable seal member such as a bellows is provided across the chamber in which the through hole is provided and the lift pins for transferring the upper substrate and the lower substrate so that the lift pins can move up and down.
  • a substrate laminating apparatus that maintains a sealed state in the chamber by being connected (see, for example, Patent Document 2).
  • Patent Document 1 in which a seal member such as an O-ring is slidably contacted with a lift pin, it rubs against the O-ring or the like every time the lift pin moves.
  • Some parts such as O-rings are generated as dust from these sliding parts, which adversely affects the bonding of workpieces, wears the O-rings etc., has a short life, and requires regular replacement of parts. There was a problem of becoming. If a lubricant such as sliding grease is supplied to the sliding portion in order to suppress the generation of dust, there is a problem not only in terms of gas generation or volatilization but also in maintainability in vacuum.
  • Patent Document 2 in which a lift pin is movably connected with a seal member that can be elastically deformed, such as a bellows, the stroke that can be expanded and contracted with the movement of the lift pin is limited and exceeds that range. And remarkably lead to a shortened life of bellows. Therefore, in order to increase the movement stroke of the lift pin, it is necessary to extend the size of the sealing member itself such as the bellows in the movement direction of the lift pin. .
  • An object of the present invention is to cope with such a problem, and the transfer member can be moved without contact and without limitation without using a seal member between the variable pressure chamber or the through hole and the transfer member.
  • the object is to provide a sealing structure.
  • the present invention transfers the first work and the second work carried into the variable pressure chamber to the first holding member and the second holding member, respectively, and the first pressure is reduced in the variable pressure chamber.
  • Either one or both of the holding member and the second holding member relatively move to move, and is a manufacturing apparatus for a bonding device that bonds the first work and the second work, the first work and The variable pressure chamber in which the second workpiece is accommodated in a freely removable manner, the first holding member and the second holding member provided in the variable pressure chamber so as to face each other in the workpiece bonding direction, and the first holding member
  • a laminating drive unit that moves either one or both of the second holding members so as to relatively approach or separate from each other in the workpiece laminating direction, and provided in the variable pressure chamber.
  • a workpiece transfer member provided movably in the workpiece bonding direction through the through hole, a closing member movably provided to open and close the through hole of the variable pressure chamber, and the bonding
  • a control unit for controlling the operation of each of the alignment drive unit, the transfer drive unit for the transfer member, and the drive unit for closing the closing member, and the control unit opens the through-hole when the workpiece is loaded.
  • the closing member is moved and the transfer member is moved for transferring the workpiece, and when the workpiece is bonded, the transfer member is extracted from the through hole so that the through hole is closed in an airtight manner.
  • the closing member is closed.
  • the transfer member can be moved by opening the through-hole of the variable pressure chamber by opening the through hole of the variable pressure chamber by opening the through-hole of the variable pressure chamber when the work is carried into the variable pressure chamber.
  • Either one or both of the second workpieces are received by the transfer member, and transferred from the transfer member to either one or both of the first holding member and the second holding member.
  • the closing member is closed and the through hole is closed in an airtight manner, so that the pressure can be reduced until the variable pressure chamber becomes highly vacuumed.
  • the first work and the second work are pasted together.
  • the seal structure in which the transfer member can be moved without contact and without limitation without using a seal member between the variable pressure chamber or the through hole and the transfer member.
  • the seal structure has no sliding part compared to the conventional one in which a seal member such as an O-ring is slidably in contact with the lift pin.
  • the replacement of the parts and the deformation of the seal member due to the change in the pressure difference can be prevented, and stable operation can be achieved for a long time.
  • the delivery member can be moved freely, so that the life of parts can be prevented and the overall size of the apparatus can be prevented. Cost reduction can be achieved.
  • the manufacturing apparatus A for the bonding device W transforms the first work W1 and the second work W2 carried from the outside toward the variable pressure chamber 1, The first holding member 2 and the second holding member 3 disposed opposite to the chamber 1, respectively, and then either the first holding member 2 or the second holding member 3 in the pressure-reducing chamber 1 decompressed or It is a vacuum bonding apparatus in which the first workpiece W1 and the second workpiece W2 are bonded (bonded) to produce the bonding device W by moving both relatively close to each other in the facing direction.
  • manufacturing device A of pasting device W concerning an embodiment of the present invention will be the 1st work W1 and the 2nd work W2 which are stored in the transformer room 1 which can be put in and out freely, and the work pasting to the transformer room 1
  • the first holding member 2 and the second holding member 3 provided so as to face each other in the direction (the bonding direction of the first workpiece W1 and the second workpiece W2), and either the first holding member 2 or the second holding member 3 Either or both of them can be moved in the laminating direction through a laminating drive unit 4 that moves so as to be relatively close to or separated from the laminating direction, and a through hole 12 provided in the variable pressure chamber 1.
  • a control unit 7 is provided so as to be in electrical communication with the part 4 and the delivery drive part 5D of the delivery member 5 and the closure drive part 6D of the closure member 6 and controls their operation. I have.
  • the bonding device W is a thin plate-like structure in which a plurality of components such as an FPD and a sensor device are integrally assembled.
  • the second workpiece W2 constitutes an FPD, a sensor device, or the like by being bonded so as to cover the first workpiece W1, such as a touch panel, a cover glass, or a cover film.
  • a sealing material (not shown) is applied to one or both of W1f and W2f made of a film surface or the like in the first workpiece W1 and the second workpiece W2 using a fixed discharge nozzle such as a dispenser.
  • a photo-curing adhesive such as a UV curable optical transparent resin (OCR) which is cured by absorbing light energy such as ultraviolet rays and develops as polymerization progresses is used.
  • OCR optical transparent resin
  • the first work W1 and the second work W2 are usually arranged so as to face each other in the vertical direction, and the lower first work W1 and the upper second work W2 are arranged.
  • the direction in which the workpieces are bonded, that is, the workpiece bonding direction is referred to as the “Z direction”.
  • the variable pressure chamber 1 is formed inside the chamber 10, and the first workpiece W1 and the second workpiece W2 are outside of the variable pressure chamber 1 inside the chamber 10 and the outside of the chamber 10 in the atmospheric atmosphere by using the transfer means B such as a transfer robot.
  • the whole or part of the chamber 10 is configured to be openable and closable by drive means 13 and 14 to be described later so that it can be taken in and out over the space.
  • the chamber 10 is provided with intake / exhaust means (not shown) such as a vacuum pump for communicating with the variable pressure chamber 1 and adjusting its internal pressure from the atmospheric atmosphere to a predetermined degree of vacuum.
  • the intake / exhaust means is controlled by a control unit 7 described later.
  • the transfer means B such as a transfer robot has a pair of a first transfer portion Ba and a second transfer portion Bb.
  • the first workpiece W1 is carried into the variable pressure chamber 1 in the chamber 10 by the first carrier Ba from the outside of the chamber 10, and at the same time, the second workpiece W2 is brought into the chamber by the second carrier Bb of the carrier means B. It is carried into the transformer room 1 in 10.
  • the variable pressure chamber 1 is closed and the pressure is reduced to a predetermined vacuum level by the intake / exhaust means, and the first workpiece W1 and the second workpiece W2 are overlapped.
  • variable pressure chamber 1 is opened to the atmosphere, and the first workpiece W1 and the second workpiece W2 are crushed to a predetermined gap by the atmospheric atmosphere to form the bonding device W. Then, although this bonding device W is not shown in figure, it is carried out from the variable pressure chamber 1 to the exterior of the chamber 10 using the delivery member 5 and the 2nd conveyance part Bb of the conveyance means B which are mentioned later.
  • a through hole 12 is opened in the Z direction in one or both of the bottom wall portion 11a and the ceiling portion 11b of the chamber 10 in which the variable pressure chamber 1 is formed.
  • a plurality of first through holes 12a are formed in the bottom wall portion 11a of the chamber 10 at predetermined intervals in the XY direction intersecting (orthogonal) with the Z direction.
  • a plurality of second through holes 12b are opened in the XY direction at predetermined intervals in the ceiling portion 11b of the chamber 10, and both the first through holes 12a and the second through holes 12b are closed as described later.
  • Each member 6 is preferably opened and closed.
  • a sealing member 12s such as an O-ring is provided at the opening edge of the first through hole 12a and the opening edge of the second through hole 12b in order to seal between the closing member 6 described later.
  • the number of through holes 12 (the first through hole 12a and the second through hole 12b) is changed to a single number, or either the bottom wall portion 11a or the ceiling portion 11b of the chamber 10 is used. Only one of the through holes 12 is opened, the first through hole 12a is opened in the bottom wall portion 11a of the chamber 10, or the second through hole 12b is opened in the ceiling portion 11b of the chamber 10. Only one of them can be opened / closed or changed by a closing member 6 described later. In addition, if it is a structure which can seal between the through-hole 12 and the closing member 6 mentioned later, it is not necessary to use the sealing member 12s.
  • the chamber 10 As the opening / closing structure of the chamber 10, as shown in FIGS. 1A and 1B, the chamber 10 is divided into a first chamber 10 a and a second chamber 10 b in the Z direction.
  • the driving means 13 By reciprocating the second chamber 10b on the upper side so as to be relatively close to or away from each other in the Z direction by the driving means 13, the variable pressure chamber 1 can be opened and closed through a sealing material 10s such as packing and has a sealed structure. It is preferable to configure as described above.
  • the driving means 13 is composed of an actuator or the like, and is moved away from the lower first chamber 10a and the upper second chamber 10b by the control unit 7 which will be described later when the workpiece shown in FIG.
  • the chamber 10 is opened, and then the chamber 10 is closed by moving the lower first chamber 10a and the upper second chamber 10b close to each other at the time of workpiece bonding shown in FIG.
  • the operation is controlled to be in a sealed state.
  • only the upper second chamber 10b is moved toward or away from the lower first chamber 10a.
  • only the first chamber 10a or both the first chamber 10a and the second chamber 10b can be changed so as to approach or separate by the driving means 13.
  • an opening 10d is formed in a part of a box-shaped chamber 10c, and a door 10e is connected to the opening 10d by a driving means 14. It is also possible to change the variable pressure chamber 1 so that it can be opened and closed and has a sealed structure.
  • a first holding member 2 and a second holding member 3 are provided inside the chamber 10 so as to face each other in the Z direction.
  • the first holding member 2 and the second holding member 3 are composed of a platen having a thickness that does not deform (bend) with a rigid body such as metal or ceramics, for example.
  • the holding surfaces 2a and 3a are arranged in parallel.
  • the holding surfaces 21 and 31 of the first holding member 2 and the second holding member 3 are adhesive in order to hold the back surface W1r of the first work W1 and the back surface W2r of the second work W2 detachably and immovably.
  • Holding chucks 22 and 32 made of a chuck, an electrostatic chuck, a suction chuck, or a combination thereof are provided.
  • the first holding member 2 and the second holding member 3 are flat plates such as a surface plate. It is preferable to comprise.
  • FIGS. 1A and 1B when the chamber 10 is divided into the first chamber 10a and the second chamber 10b in the Z direction, A first holding member 2 for detachably holding the first work W1 on the side is provided, and a second holding member 3 for detachably holding the second work W2 on the upper side is provided in the upper second chamber 10b. Has been.
  • a plurality of adhesive chucks are arranged at predetermined intervals in the XY direction on the holding surface 31 of the flat plate serving as the second holding member 3. It is preferable that the second workpiece W2 is configured to be adhered and held so as not to drop.
  • the plurality of adhesive chucks are supported so as to be able to reciprocate in the Z direction with respect to the flat plate of the second holding member 3, and all of the adhesive chucks are moved into and out of the flat plate of the second holding member 3. It is preferable to configure so as to be peeled off from the workpiece W2.
  • the work attaching / detaching structure by the adhesive chuck will be described in detail. As shown in FIGS.
  • a plurality of adhesive chucks are integrated by a connecting portion 33, and the connecting portion 33 is formed on a flat plate of the second holding member 3.
  • the adhesive surface of the adhesive chuck is substantially flush with or slightly protruding from the holding surface 31 of the second holding member 3 so as to contact the surface of the second workpiece W2.
  • the connecting portion 33 of the adhesive chuck moves away from the flat plate of the second holding member 3 (not shown)
  • the adhesive surface of the adhesive chuck is made to immerse from the holding surface 31 of the second holding member 3.
  • the second work W2 is peeled off from the surface.
  • the second holding member 3 is composed of a plurality of pins instead of a flat plate, It is also possible to provide a mechanism that can be held in a vacuum, such as an adhesive chuck or an electrostatic chuck, as the holding chuck 32 on the holding surface 31 serving as the tip surface of these pins.
  • a vacuum such as an adhesive chuck or an electrostatic chuck
  • the holding chuck 22 of the first holding member 2 may have the same structure as the holding chuck 32 of the second holding member 3 as shown.
  • first holding member 2 or the second holding member 3, or both the first holding member 2 and the second holding member 3 are Z with respect to the bottom wall portion 11 a or the ceiling portion 11 b of the chamber 10.
  • the first holding member 2 and the second holding member 3 are moved so as to approach or separate from each other by the laminating drive unit 4.
  • the laminating drive unit 4 is composed of an actuator or the like, and an adhesive (illustrated) in which the first work W1 and the second work W2 are applied to either or both of the holding surfaces by the control unit 7 described later.
  • the first holding member 2 and the second holding member 3 are controlled to move relatively close to each other in the Z direction so as to overlap each other.
  • the second holding member 3 is lowered toward the first holding member 2 in the case shown in FIGS.
  • the first holding member 2 is raised, or both the first holding member 2 and the second holding member 3 are moved closer to each other. It is also possible to change.
  • first holding member 2 and the second holding member 3 include a through-hole 12 that is opened in one or both of the bottom wall portion 11a and the ceiling portion 11b of the chamber 10 and It is preferable to open the through holes 2H and 3H arranged in the same axial line in the Z direction. More specifically, as shown in FIGS. 1A and 1B, when the first holding member 2 and the second holding member 3 are formed of flat plates such as a surface plate, the first holding member 2 is used. And the second holding member 3 have through holes 2H and 3H. As another example, as shown in FIGS.
  • the second holding member 3 is constituted by a plurality of pins instead of a flat plate, and a holding surface 31 serving as a tip surface of these pins is provided.
  • a mechanism capable of holding in vacuum such as an adhesive chuck or an electrostatic chuck may be provided.
  • a through hole 3H is opened in the connecting portion 33 so that a delivery member 5 described later does not contact the connecting portion 33 of the adhesive chuck in the Z direction. It is configured so that it can be reciprocated by being inserted through.
  • first holding member 2, the second holding member 3, or the connecting portion 33 of the adhesive chuck is not a flat plate, it is formed in a shape that does not interfere with a delivery member 5 described later, such as a comb-like shape. Does not need to open the through holes 2H and 3H.
  • first holding member 2 and the second holding member 3 has an alignment means (not shown). It is preferable to align the first workpiece W1 and the second workpiece W2 by relatively moving the first holding member 2 and the second holding member 3 in the XY ⁇ directions.
  • the delivery member 5 is either the first work W1 or the second work W2 across the transport means B such as a transport robot and either the first holding member 2 or the second holding member 3 or both. Or a lift pin that delivers both of them, and has a chuck portion 51 for holding a workpiece and a shaft portion 52 that is connected to the chuck portion 51.
  • the chuck portion 51 includes a suction chuck that communicates with a suction source (not shown) and detachably sucks and holds the surface of the first workpiece W1 or the second workpiece W2, and one of the first workpiece W1 and the second workpiece W2. Or, both or a plurality of surfaces are provided at predetermined intervals in the XY direction.
  • the shaft portion 52 is provided at the tip of the shaft portion 52 so as to extend in the Z direction from the chuck portion 51, and is inserted into the variable pressure chamber 1 in the chamber 10 at least through the through hole 12 of the variable pressure chamber 1 without contact. It communicates with an external suction source (not shown) and is configured to reciprocate in the Z direction by a delivery drive unit 5D.
  • the delivery drive unit 5D is composed of an actuator or the like, and when a work is loaded as shown in FIG.
  • the transfer means B (first transfer unit Ba, first transfer unit Ba, etc.)
  • the chuck 51 and the shaft 52 are moved toward one or both of the first workpiece W1 and the second workpiece W2 carried in by the second conveying section Bb), and the workpiece is transferred from the conveying means B to the chuck section 51.
  • the workpiece is transferred from the chuck portion 51 to one or both of the first holding member 2 and the second holding member 3, and after the workpiece transfer is completed.
  • the operation is controlled so that the chuck portion 51 and the shaft portion 52 are moved in the opposite directions so as to be extracted from the through hole 12 of the variable pressure chamber 1.
  • the shaft portion 52 has a first through hole 12 a in the bottom wall portion 11 a of the chamber 10 and a through hole in the first holding member 2.
  • the upper second delivery member 5b moves the lower chamber 10b closer to the first chamber 10a by the driving means 13 (lowering), so that the chuck portion 51 of the upper second delivery member 5b becomes the second through hole. 12b and the 2nd holding member 3 are comprised so that it may extract from 3H.
  • the upper second delivery member 5b is used to deliver the chuck portion 51 from the second through hole 12b and the through hole 3H of the second holding member 3 in the delivery drive unit 5D.
  • both the lower first delivery member 5a and the upper second delivery member 5b are delivered.
  • the closing member 6 has a lid 61 that can be opened and closed with respect to either or both of the bottom wall portion 11a and the ceiling portion 11b of the chamber 10 in which the variable pressure chamber 1 is formed.
  • the lid body 61 is formed in a shape that is larger than the opening of the through hole 12 and can be covered, and is configured to be movable in a predetermined direction with respect to the through hole 12 by the closing drive unit 6D.
  • the closing drive unit 6D of the lid 61 is composed of a slide actuator or the like, and the lid 61 is moved by the control unit 7 to be described later so that the through hole 12 is opened when the workpiece is loaded. After the delivery member 5 is extracted from the through hole 12, the operation is controlled so that the lid 61 is moved in the opposite direction so that the through hole 12 is closed in an airtight manner.
  • the first through hole 12 a opened in the bottom wall portion 11 a of the chamber 10 has a flat plate shape as the lid 61.
  • the first lid 6a is supported so as to reciprocate in the X direction along the bottom wall portion 11a, and a flat plate-like second lid is used as the lid body 61 for the second through hole 12b opened in the ceiling portion 11b.
  • the body 6b is supported so as to reciprocate at least in the X direction along the ceiling portion 11b.
  • the first through hole 12a and the second through hole 12b are closed in an airtight manner by moving all of the first lid 6a and the second lid 6b simultaneously in the X direction by the closing drive unit 6D. .
  • a plurality of second lids 6b for opening and closing the second through hole 12b of the ceiling portion 11b communicate with each other.
  • the parts 62 are integrally connected.
  • the closing drive unit 6D of the second lid body 6b includes a drive unit 6D1 for moving in the X direction and a drive unit 6D2 for moving in the Z direction made of a slide actuator, and the drive units 6D1 and Z for moving in the X direction.
  • the direction moving drive unit 6D2 is integrally assembled with the second chamber 10b.
  • the driving unit 6D1 for moving in the X direction and the driving unit 6D2 for moving in the Z direction are composed of a slide actuator or the like, and are moved in the X direction by the control unit 7 to be described later when the workpiece is loaded as shown in FIG.
  • the drive unit 6D1 for driving and the drive unit 6D2 for moving in the Z direction make the second lid 6b stand by at an open position away from the second through hole 12b in the X direction and the Z direction.
  • the second workpiece W2 is transferred to the holding chuck 32 of the second holding member 3 by the upper second transfer member 5b, and the chuck portion 51 of the upper second transfer member 5b is transferred by the transfer drive unit 5D.
  • the second through-holes 12b are arranged so that the second lid 6b is not brought into contact with the ceiling 11b of the chamber 10 together with the connecting part 62 by the driving unit 6D1 for moving in the X direction. Is slid in the X direction up to the upper position.
  • the driving unit 6D2 for moving in the Z direction is used at the same time as the lowering timing of the second chamber 10b by the driving means 13 or before the lowering timing.
  • the second lid 6b together with the connecting portion 62 is lowered and closed in the Z direction toward the second through hole 12b, and is closed in an airtight manner.
  • the second lid 6b is returned to the standby position in the reverse procedure.
  • the plurality of first lid bodies 6a for opening and closing the first through hole 12a of the bottom wall portion 11a are integrally connected by a connecting portion (not shown) and are used for moving in the X direction (not shown) as a closing drive portion 6D.
  • the drive unit By sliding the drive unit in the X direction, the first through hole 12a is closed in an airtight manner, as in the case shown in FIGS.
  • the second lid 6b is opened and closed by a closing drive unit 6D having the same structure as the first lid 6a to close the second through hole 12b in an airtight manner
  • a closing drive unit 6D having the same structure as the second lid 6b
  • the closing member 6 is either the bottom wall portion 11a or the ceiling portion 11b of the chamber 10 in which the variable pressure chamber 1 is formed. It is also possible to provide the lid 61 so as to be pivotable toward one or both, and to close the lid 61 toward the through hole 12 from which the delivery member 5 has been extracted and moved by the closing drive unit 6D. . More specifically, the lid body 61 is formed in a shape that is larger than the opening of the through hole 12 and can be covered like the lid body 61, and one side of the lid body 61 with respect to the bottom wall portion 11 a and the ceiling portion 11 b of the chamber 10.
  • the lid 61 is rotatably supported in the Z direction or the like, and the lid 61 is rotated and opened toward the through hole 12 by the closing drive unit 6D.
  • the closing drive unit 6D of the lid 61 is composed of a rotary actuator or the like.
  • the second lid 6b is supported as a lid 61 so as to be rotatable in the Z direction with respect to the ceiling 11b of the chamber 10, and the ceiling drive unit 6D closes the ceiling.
  • the second lid 6b is rotated toward the second through hole 12b of the portion 11b to open and close.
  • the first lid 6 a is rotatably supported in the Z direction with respect to the bottom wall portion 11 a of the chamber 10, and the first penetration of the bottom wall portion 11 a is performed.
  • the hole 12a is opened and closed by the first lid body 6a, or the lid body 61 is rotatably supported in the XY direction along the bottom wall portion 11a and the ceiling portion 11b of the chamber 10, and the through hole 12 is driven by the closing drive portion 6D. It is also possible to open and close the cover body 61 by turning the cover body 61 toward the side, or to change to an opening / closing structure other than the illustrated example.
  • the control unit 7 includes an opening / closing drive means 13 and 14 for the chamber 10, a bonding drive unit 4 for the first holding member 2 and the second holding member 3, a delivery drive unit 5D for the delivery member 5, and a closing member.
  • the transfer means B (Ba, Bb) for taking in and out the first work W1 and the second work W2 with respect to the variable pressure chamber 1, and the chamber 10 Intake / exhaust means, a positioning drive unit (not shown) for positioning means for relatively moving the first work W1 and the second work W2 in the XY ⁇ direction, and a hardening means (not shown) for hardening the sealing material.
  • the controller serving as the controller 7 sequentially controls the operation at a preset timing in accordance with a preset program in its control circuit (not shown). More specifically, when the workpiece is carried in, the control unit 7 controls the operation so that the closing member 6 is opened so that the through-hole 12 is opened and the delivery member 5 is moved for workpiece delivery. At the time of subsequent workpiece bonding, the delivery member 5 is extracted from the through hole 12, and the closing member 6 is closed so that the through hole 12 is closed in an airtight manner, and the first holding member 2 and the second holding member. The operation is controlled so as to relatively move 3.
  • the manufacturing apparatus A for the bonding device W according to the embodiment of the present invention, as shown in FIG. 1A and the like, the first work W1 and the inside of the chamber 10 in which the variable pressure chamber 1 is formed and At the time of loading the workpiece into which the second workpiece W2 is loaded, the closing member 6 is opened by the control unit 7 to open the through hole 12 of the variable pressure chamber 1. Thereby, the delivery member 5 becomes movable, and either one or both of the first work W1 and the second work W2 are received by the delivery member 5, and from the delivery member 5, the first holding member 2 or the second holding member is received. Transfer to one or both of the members 3. After the workpiece is transferred, as shown in FIG.
  • the control member 7 pulls out the transfer member 5 from the through hole 12 of the variable pressure chamber 1, and then the closing member 6 is closed to open the through hole 12. Close in an airtight manner. Accordingly, the pressure can be reduced until the variable pressure chamber 1 is in a high vacuum state. In this reduced pressure state, one or both of the first holding member 2 and the second holding member 3 move relatively close together, and the first workpiece W1 and the second workpiece W2 are bonded together. Accordingly, it is possible to provide a seal structure in which the transfer member 5 can be moved without contact and without limitation without using a seal member between the variable pressure chamber 1 or the through hole 12 and the transfer member 5.
  • the seal structure since the seal structure has no sliding parts, it is possible to prevent adverse effects on workpiece bonding due to the generation of dust, replacement of parts due to wear, and deformation of the seal member due to changes in pressure difference. Stable operation can be achieved. Furthermore, since the delivery member 5 can be moved freely, it is possible to prevent a reduction in the service life of parts and an increase in the size of the entire apparatus, thereby reducing costs.
  • one or both of the first holding member 2 and the second holding member 3 are connected to the through hole 12 of the variable pressure chamber 1 and the workpiece bonding direction ( ZH), and the delivery member 5 has a chuck part 51 for holding a workpiece, and the chuck part 51 is connected to the through-hole 12 and the through-hole 12D by the delivery drive part 5D.
  • the chuck portion 51 is completed.
  • the through holes 2H and 3H and the through holes 12 are preferably extracted and moved.
  • the chuck portion 51 of the delivery member 5 is received. Moves through the through-holes 2H and 3H toward one or both of the first holding member 2 and the second holding member 3 in a contactless manner, so that one or both of the first workpiece W1 and the second workpiece W2 are moved. Is delivered to one or both of the first holding member 2 and the second holding member 3.
  • the chuck portion 51 is pulled out from the through holes 2H and 3H and the through hole 12 for bonding the workpieces, and the pressure is reduced until the variable pressure chamber 1 is in a highly airtight state by the closing member 6 being closed. . Therefore, the transfer member 5 can be contacted with the first holding member 2 and the second holding member 3 without contact and without limitation. As a result, the delivery of the first workpiece W1 and the second workpiece W2 to the first holding member 2 and the second holding member 3 can be performed reliably and with a simple structure, further downsizing the entire device and further cost. Can be reduced.
  • the closing member 6 is either one or both of the bottom wall portion 11a and the ceiling portion 11b of the variable pressure chamber 1.
  • the lid 61 is provided so as to freely open and close in the direction (X direction) intersecting the workpiece laminating direction (Z direction), and the transfer member 5 is extracted and moved by the closing drive unit 6D. It is preferable to make it close toward the through-hole 12 made.
  • the lid 61 of the closing member 6 is closed in the X direction along the bottom wall portion 11a and the ceiling portion 11b of the variable pressure chamber 1. It moves and the through-hole 12 is covered. Therefore, the through-hole 12 can be reliably opened and closed, and the variable pressure chamber 1 can be completely sealed.
  • the first workpiece W1 and the second workpiece W2 can be bonded together in a complete vacuum state with a simple structure.
  • the closing member 6 is a lid that is rotatably provided toward one or both of the bottom wall portion 11a and the ceiling portion 11b of the variable pressure chamber 1.
  • the lid 61 is moved toward the through hole 12 from which the delivery member 5 has been extracted and moved by the closing drive unit 6D, the delivery member 5 is removed from the through hole 12 of the variable pressure chamber 1.
  • the cover 61 of the closing member 6 is rotated toward the bottom wall portion 11a and the ceiling portion 11b of the variable pressure chamber 1 so that the through hole 12 is covered. Therefore, the through-hole 12 can be reliably opened and closed, and the variable pressure chamber 1 can be completely sealed.
  • the first workpiece W1 and the second workpiece W2 can be bonded together in a complete vacuum state with a simple structure.
  • the guide member 53 for guiding the shaft portion 52 of the delivery member 5 to be movable in the Z direction is provided with the through hole 12 of the variable pressure chamber 1. It is provided coaxially in the Z direction.
  • the guide member 53 is configured by a linear guide using rolling, and supports the outer surface of the shaft portion 52 of the delivery member 5 in the XY direction so as to be movable only in the Z direction.
  • the guide member 53 is placed outside the second chamber 10 b by the plate-like member 54, and is coaxial with the second through hole 12 b of the ceiling portion 11 b of the chamber 10 in the Z direction. It is assembled in one piece that is fixedly arranged.
  • the guide member 53 is aligned with the first through hole 12a of the bottom wall portion 11a of the chamber 10 in the same direction in the Z direction with respect to the first chamber 10a or the box-shaped chamber 10c. It is also possible to assemble them fixedly.
  • the guide member 53 is guided so as to be movable only in the Z direction even when the shaft portion 52 of the delivery member 5 becomes long.
  • the shaft portion 52 moves in the Z direction, there is no wobbling movement in the XY direction that intersects with the Z portion. Therefore, the shaft portion 52 of the delivery member 5 can be moved smoothly and reliably without contacting the through hole 12 or the wall surface of the variable pressure chamber 1. As a result, there is an advantage of excellent stability.
  • the second embodiment includes a first chamber 10a in which a first holding member 2 is provided inside a chamber 10 in which a variable pressure chamber 1 is formed in the Z direction.
  • a reversing means 8 is provided for reversing one of the first chamber 10a and the second chamber 10b toward the other, divided into second chambers 10b in which the second holding member 3 is provided.
  • the first workpiece W1 is loaded toward the first holding member 2 in the first chamber 10a at the opening position where the one chamber 10a and the second chamber 10b are reversed so as to open in the Z direction, and the second chamber
  • the loading position P1 into which the second workpiece W2 is loaded toward the second holding member 3 in 10b is set, and the first chamber 10a and the second chamber 10b are overlapped in the Z direction by the reversing means 8.
  • the configuration in which the closed moving position reversed is a bonding position P2 where the first workpiece W1 and the second workpiece W2 are bonded is different from that of the first embodiment shown in FIGS. 6 (a) and 6 (b).
  • the second embodiment can also be configured as in the first embodiment shown in FIGS. 6 (a) and 6 (b).
  • the reversing means 8 is connected to either the first chamber 10a or the second chamber 10b, and the reversing drive source 15 moves one of the first chamber 10a or the second chamber 10b from the open position where it becomes the loading position P1. It is configured to be movable in a reverse direction in the Z direction toward the closing position that becomes the bonding position P2. Furthermore, the reversing means 8 preferably has a function of moving up or down in the Z direction toward one of the first chamber 10a or the second chamber 10b as necessary.
  • the reversing drive source 15 is composed of an actuator or the like, and the control unit 7 opens the first chamber 10a so that the holding chuck 22 of the first holding member 2 is exposed in the Z direction at the loading position P1 when the workpiece is loaded.
  • the operation of the second chamber 10b is controlled to open so that the holding chuck 32 of the second holding member 3 is exposed in the Z direction.
  • the chamber 10 is closed and sealed, and at the bonding position P2, the first holding member 2 A bonding surface W1f including a film surface of the first workpiece W1 held by the holding chuck 22 and a bonding surface W2f including a film surface of the second workpiece W2 held by the holding chuck 32 of the second holding member 3 Are controlled so as to face each other in the Z direction.
  • the upper second chamber 3a provided with the second holding member 3 is provided in the lower first chamber 10a provided with the first holding member 2 therein.
  • the chamber 10b is supported by the reversing means 8 so as to be reversible.
  • 7A the first chamber 10a and the second chamber 10b are both opened so as to open upward, and the second delivery member 5b causes the second workpiece W2 to move to the second holding member 3.
  • the reversing means 8 reversely moves the upper second chamber 10 b toward the lower first chamber 10 a, and the first transferring member 5 a moves the holding chuck 22 of the first holding member 2.
  • the reversing means 8 lowers the second chamber 10b that has been reversed and brought into contact with the lower first chamber 10a so that the chamber 10 is closed. Yes.
  • the upper second chamber 10b is reversed by the reversing means 8 toward the lower first chamber 10a, and then the lower first chamber 10a is raised by the driving means 13. It is also possible to change so that the chamber 10 is closed in contact with the upper second chamber 10b.
  • the first chamber 10a and the first chamber 10a are moved by the reversing unit 8 at the loading position P1.
  • the two chambers 10b are reversed so as to open upward, the first workpiece W1 and the second workpiece W2 carried into the variable pressure chamber 1 are rearwardly connected to the rear surfaces W1r, W1f, W2f so that the respective bonding surfaces W1f, W2f are upward. While being supported by W2r from below, it can be received by the transfer member 5 and transferred to the first holding member 2 and the second holding member 3.
  • the first workpiece W1 and the second workpiece W2 carried into the variable pressure chamber 1 can be easily transferred to the first holding member 2 and the second holding member 3 without contacting the bonding surfaces W1f and W2f. it can.
  • the structure of the transfer system for the first workpiece W1 and the second workpiece W2 can be simplified, including not only the delivery member 5 but also a transfer robot used as a means for carrying into the variable pressure chamber 1, thus reducing costs.
  • the quality of the bonding device W can be improved because it is possible to completely prevent damage to the bonding surfaces W1f and W2f made of the film surfaces and the like accompanying the conveyance.
  • the first workpiece W1 or the second delivery member 5b received by the first delivery member 5a serving as the delivery member 5 at the loading position P1 is received.
  • the second workpiece W2 is provided with alignment means 9 that moves in the XY ⁇ direction relative to the other to align in the Z direction, and the alignment means 9 is received by the first delivery member 5a.
  • the configuration having the alignment driving unit 92 that relatively moves either or both in the XY ⁇ direction is the same as that of the second embodiment shown in FIGS.
  • the detection unit 91 of the alignment means 9 includes a camera that detects a mark, a corner portion, and the like previously attached to the first workpiece W1 and the second workpiece W2 by photographing.
  • the alignment driving unit 92 includes an XY ⁇ stage, an XY table, and the like that are connected to the first delivery member 5a and the second delivery member 5b.
  • the detection unit 91 and the alignment drive unit 92 are electrically connected via the control unit 7 and operate the alignment drive unit 92 based on the position data input from the detection unit 91. Yes.
  • the alignment means 9 uses the position data input from the detection unit 91 to determine the position in the XY direction of the first workpiece W1 supported by the first delivery member 5a and the second position supported by the second delivery member 5b.
  • the positional deviation state with respect to the position of the workpiece W2 in the XY direction is detected, and the positional deviation amount is output to the alignment driving unit 92 to be operated.
  • the alignment driving section 92 moves either the first delivery member 5a or the second delivery member 5b or both in the XY ⁇ direction relative to the first displacement member 5a according to the amount of displacement.
  • the XY direction position of the 2nd delivery member 5b is adjusted and moved relatively.
  • the control unit 7 starts the operation of the first delivery member 5a after the adjustment movement by the positioning drive unit 92 is completed, and the first workpiece W1 is delivered to the holding chuck 22 of the first holding member 2. Then, the operation of the second delivery member 5b is started, and the second workpiece W2 is delivered to the holding chuck 32 of the second holding member 3. At the time of this delivery, either the first delivery member 5a or the second delivery member 5b or both of the first workpiece W1 and the second workpiece W2 are maintained while maintaining the position in the XY direction by the positioning drive unit 92. By performing the delivery, the XY direction positions of the first workpiece W1 and the second workpiece W2 are aligned in the Z direction at the bonding position P2.
  • the first chamber 10a and the second chamber 10b are both opened upward at the loading position P1 shown in FIG.
  • the state in which the first workpiece W1 is transferred from the transport unit Ba to the chuck portion 51 of the first transfer member 5a is photographed by the plurality of detection units 91, and the position in the XY direction of the first workpiece W1 is detected.
  • the state in which the second workpiece W2 is transferred from the second conveying portion Bb to the chuck portion 51 of the second transfer member 5b is photographed by the plurality of detection portions 91, and the position in the XY direction of the second workpiece W2 is detected.
  • the second delivery member 5b is provided with an alignment driving unit 92, and only the second delivery member 5b is connected to the second through-hole 12b and the second delivery member 5b according to the positional deviation amount based on the position data output from the plurality of detection units 91.
  • the second workpiece W2 is transferred to the holding chuck 32 of the second holding member 3 while adjusting and moving in the XY ⁇ direction inside the through hole 3H and maintaining the adjusted and moved position in the XY direction.
  • only the first delivery member 5a is provided with an alignment driving unit 92 instead of the second delivery member 5b, and only the first delivery member 5a is provided in accordance with the amount of displacement.
  • the detection unit 91 of the alignment means 9 at the carry-in position P1 receives the first workpiece W1 received by the first delivery member 5a,
  • the position of the second workpiece W2 received by the second delivery member 5b is detected, and based on the position data, either one or both of the first delivery member 5a and the second delivery member 5b is detected by the positioning drive unit 92.
  • the delivery position with respect to the first holding member 2 and the second holding member 3 by the subsequent operation of the first delivery member 5a and the second delivery member 5b is the first at the bonding position P2.
  • Adjustment is made so that the positions of the workpiece W1 and the second workpiece W2 in the X and Y directions are aligned in the Z direction. Therefore, the first workpiece W1 and the second workpiece W2 can be accurately bonded even if a positional deviation occurs during loading. As a result, there is an advantage that the bonding accuracy of the bonding device W is improved and the stability of quality is excellent.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Manipulator (AREA)
PCT/JP2013/082620 2013-12-04 2013-12-04 貼合デバイスの製造装置 WO2015083257A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014509968A JP5523646B1 (ja) 2013-12-04 2013-12-04 貼合デバイスの製造装置
PCT/JP2013/082620 WO2015083257A1 (ja) 2013-12-04 2013-12-04 貼合デバイスの製造装置
CN201380070869.7A CN104937652A (zh) 2013-12-04 2013-12-04 贴合器件的制造装置
KR1020157018877A KR20160093539A (ko) 2013-12-04 2013-12-04 첩합 디바이스의 제조 장치
TW103140669A TWI576246B (zh) 2013-12-04 2014-11-24 A device for manufacturing a bonded device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/082620 WO2015083257A1 (ja) 2013-12-04 2013-12-04 貼合デバイスの製造装置

Publications (1)

Publication Number Publication Date
WO2015083257A1 true WO2015083257A1 (ja) 2015-06-11

Family

ID=51175681

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/082620 WO2015083257A1 (ja) 2013-12-04 2013-12-04 貼合デバイスの製造装置

Country Status (5)

Country Link
JP (1) JP5523646B1 (zh)
KR (1) KR20160093539A (zh)
CN (1) CN104937652A (zh)
TW (1) TWI576246B (zh)
WO (1) WO2015083257A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021007155A (ja) * 2016-07-12 2021-01-21 東京エレクトロン株式会社 接合装置
JP2021007154A (ja) * 2020-09-09 2021-01-21 東京エレクトロン株式会社 接合装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5797863B1 (ja) * 2015-05-29 2015-10-21 オリジン電気株式会社 接合部材製造装置及び接合部材の製造方法
JP6049820B1 (ja) * 2015-07-24 2016-12-21 信越エンジニアリング株式会社 貼合デバイスの製造装置及び製造方法
JP6079925B1 (ja) * 2016-03-30 2017-02-15 第一精工株式会社 樹脂封止装置及び樹脂封止装置の異常検知方法
JP6696036B1 (ja) * 2019-08-01 2020-05-20 信越エンジニアリング株式会社 ワーク転写装置及びワーク転写チャック並びにワーク転写方法
JP7057336B2 (ja) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 基板保持部材、基板保持装置、基板処理装置、基板保持方法、成膜方法、及び電子デバイスの製造方法
KR102154685B1 (ko) * 2020-05-19 2020-09-10 ㈜ 엘에이티 정전력을 이용한 폴더블 디스플레이 제조용 라미네이터
KR102154686B1 (ko) * 2020-05-19 2020-09-10 ㈜ 엘에이티 정전척 방식의 폴더블 디스플레이 제조용 라미네이터

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002040398A (ja) * 2000-07-19 2002-02-06 Nec Corp 液晶表示装置の製造装置及びその製造方法
JP2006178476A (ja) * 2005-12-26 2006-07-06 Fujitsu Ltd 貼合せ基板製造装置
JP2007234965A (ja) * 2006-03-02 2007-09-13 Toto Ltd 静電吸着方法
WO2008041293A1 (fr) * 2006-09-29 2008-04-10 Shin-Etsu Engineering Co., Ltd. Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte
JP2009237287A (ja) * 2008-03-27 2009-10-15 Toshiba Mobile Display Co Ltd 平面表示装置の製造方法及び製造装置
JP2010262271A (ja) * 2009-04-08 2010-11-18 Shibaura Mechatronics Corp 基板貼り合わせ装置及び基板貼り合わせ方法
JP2012247507A (ja) * 2011-05-25 2012-12-13 Shibaura Mechatronics Corp 基板の貼り合せ装置
JP2013117713A (ja) * 2011-12-02 2013-06-13 Lg Display Co Ltd 基板の貼り合わせ方法及び基板の貼り合わせシステム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4690572B2 (ja) 2000-11-30 2011-06-01 キヤノンアネルバ株式会社 基板重ね合わせ装置
JP2006119286A (ja) * 2004-10-20 2006-05-11 Ran Technical Service Kk 基板の貼り合わせ装置及び貼り合わせ方法
WO2008114337A1 (ja) 2007-02-22 2008-09-25 Shin-Etsu Engineering Co., Ltd. 真空貼り合わせ方法及び真空貼り合わせ装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002040398A (ja) * 2000-07-19 2002-02-06 Nec Corp 液晶表示装置の製造装置及びその製造方法
JP2006178476A (ja) * 2005-12-26 2006-07-06 Fujitsu Ltd 貼合せ基板製造装置
JP2007234965A (ja) * 2006-03-02 2007-09-13 Toto Ltd 静電吸着方法
WO2008041293A1 (fr) * 2006-09-29 2008-04-10 Shin-Etsu Engineering Co., Ltd. Procédé de transfert de pièce, dispositif à mandrin électrostatique et procédé de jonction de carte
JP2009237287A (ja) * 2008-03-27 2009-10-15 Toshiba Mobile Display Co Ltd 平面表示装置の製造方法及び製造装置
JP2010262271A (ja) * 2009-04-08 2010-11-18 Shibaura Mechatronics Corp 基板貼り合わせ装置及び基板貼り合わせ方法
JP2012247507A (ja) * 2011-05-25 2012-12-13 Shibaura Mechatronics Corp 基板の貼り合せ装置
JP2013117713A (ja) * 2011-12-02 2013-06-13 Lg Display Co Ltd 基板の貼り合わせ方法及び基板の貼り合わせシステム

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021007155A (ja) * 2016-07-12 2021-01-21 東京エレクトロン株式会社 接合装置
JP2021007154A (ja) * 2020-09-09 2021-01-21 東京エレクトロン株式会社 接合装置
JP7012798B2 (ja) 2020-09-09 2022-01-28 東京エレクトロン株式会社 接合装置

Also Published As

Publication number Publication date
JPWO2015083257A1 (ja) 2017-03-16
CN104937652A (zh) 2015-09-23
TW201529326A (zh) 2015-08-01
JP5523646B1 (ja) 2014-06-18
KR20160093539A (ko) 2016-08-08
TWI576246B (zh) 2017-04-01

Similar Documents

Publication Publication Date Title
JP5523646B1 (ja) 貼合デバイスの製造装置
JP4657387B1 (ja) 表示パネルの製造方法及びその製造システム
JP5095876B2 (ja) 貼合装置及びその制御方法
JP4661716B2 (ja) 基板貼合装置
KR101213199B1 (ko) 터치패널용 기판 진공 부착 시스템
JP2016008985A (ja) 表示装置用部材の製造装置及び表示装置用部材の製造方法
CN106313858B (zh) 贴合设备的制造装置及制造方法
JP5837247B1 (ja) 基板組立装置とそれを用いた基板組立方法
JP5996566B2 (ja) ワーク用チャック装置及びワーク貼り合わせ機並びにワーク貼り合わせ方法
JP5512259B2 (ja) 平面表示装置の製造方法及びこのための貼り付け装置
WO2010095215A1 (ja) ワーク搬送装置及び真空貼り合わせ方法
JP6049820B1 (ja) 貼合デバイスの製造装置及び製造方法
JP2014194520A (ja) 基板貼り合わせ装置及び基板貼り合わせ用具
JP4028752B2 (ja) 統合型液晶ディスプレイパネル組立装置及び基板重ね合わせ装置
JP5877264B1 (ja) 貼合デバイスの製造装置及び製造方法
JP6404586B2 (ja) 製造方法及び製造装置
JP6453741B2 (ja) 基板組立装置とそれを用いた基板組立方法
JP2019082693A (ja) 基板組立装置とそのテーブル構造
JP4711466B2 (ja) 基板製造装置及び基板製造方法
JP2022075731A (ja) 基板組立装置

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2014509968

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20157018877

Country of ref document: KR

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13898732

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13898732

Country of ref document: EP

Kind code of ref document: A1