WO2015068654A1 - Procédé de formation de motif conducteur, procédé de fabrication pour un panneau tactile de type sur cellule utilisant ce dernier, film de transfert utilisé dans ce dernier, et panneau tactile de type sur cellule - Google Patents

Procédé de formation de motif conducteur, procédé de fabrication pour un panneau tactile de type sur cellule utilisant ce dernier, film de transfert utilisé dans ce dernier, et panneau tactile de type sur cellule Download PDF

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WO2015068654A1
WO2015068654A1 PCT/JP2014/079073 JP2014079073W WO2015068654A1 WO 2015068654 A1 WO2015068654 A1 WO 2015068654A1 JP 2014079073 W JP2014079073 W JP 2014079073W WO 2015068654 A1 WO2015068654 A1 WO 2015068654A1
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conductive
layer
transfer film
adhesive layer
metal
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PCT/JP2014/079073
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English (en)
Japanese (ja)
Inventor
内田　博
泰直 宮村
恵理 岡▲崎▼
英樹 大籏
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昭和電工株式会社
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Priority to JP2015546625A priority Critical patent/JPWO2015068654A1/ja
Publication of WO2015068654A1 publication Critical patent/WO2015068654A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present invention relates to a method for forming a conductive pattern, a method for producing an on-cell touch panel using the same, a transfer film and an on-cell touch panel used therefor.
  • Transparent electrodes capable of transmitting light are indispensable constituent elements for driving electrodes, organic EL (electroluminescence) elements, solar cell elements, touch panels, and the like constituting liquid crystal displays.
  • ITO indium tin oxide
  • ITO indium tin oxide
  • a sputtering method, a vapor deposition method, or the like is used for forming an ITO film, a vacuum manufacturing apparatus is required, which requires a long manufacturing time and a high cost.
  • ITO is difficult to be applied to a substrate provided with flexibility because cracks are generated due to physical stress such as bending and are easily broken. Therefore, search for an ITO alternative material that has solved these problems has been underway.
  • poly (3,4-ethylenedioxythiophene) / poly (4-styrenesulfone) can be used as a coating film forming material that does not require the use of a vacuum manufacturing apparatus.
  • Acid) PEDOT: PSS
  • conductive materials containing metal nanowires for example, see Patent Document 2 and Non-Patent Document 1
  • carbon A conductive material containing a nanostructured conductive component such as a conductive material containing nanotubes (see, for example, Patent Document 3) has been reported.
  • the conductive material containing the metal nanowire (ii) has been reported to exhibit low surface resistance and high light transmittance (for example, see Patent Document 2 and Non-Patent Document 1), and further has flexibility. Therefore, it is suitable as an “ITO substitute material”.
  • metal nanowires there is a method of heating at a high temperature (200 ° C. or higher) in order to develop conductivity or improve conductivity, but by forming a conductive film on a resin film with poor heat resistance or by lowering the temperature There is a problem that it is difficult to form an inexpensive conductive film (for example, see Patent Document 4). Therefore, a method for expressing and improving conductivity by light irradiation is disclosed (for example, see Patent Document 5).
  • the touch panel includes an external type and a built-in type
  • the built-in type includes an on-cell type and an in-cell type.
  • a built-in type (especially on-cell type) touch panel first forms a liquid crystal display element and then forms a transparent electrode of the touch panel using the conductive material containing the metal nanowire.
  • the conductive material containing the metal nanowire needs to be irradiated with light or subjected to heat treatment (higher than 200 ° C.) or pressurization as described above in order to develop or improve conductivity.
  • the liquid crystal or the like incorporated in the display element is subjected to light irradiation or high-temperature (200 ° C. or higher) heat treatment, it may be affected by decomposition of the liquid crystal or changes in TFT characteristics, so that a liquid crystal display element and a touch panel are formed.
  • An object of the present invention is to provide a method for forming a conductive pattern on a substrate that cannot be directly irradiated with light or subjected to high-temperature heat treatment or pressure treatment, such as an on-cell touch panel, and a method for producing an on-cell touch panel using the same.
  • An object of the present invention is to provide a transfer film and an on-cell touch panel.
  • an embodiment of the present invention is a conductive pattern forming method, comprising: a support film; an adhesive layer formed on the support film; and a predetermined layer formed on the adhesive layer.
  • a conductive preliminary layer is formed by applying a conductive ink containing metal nanowires and / or metal nanotubes on the adhesive layer in a predetermined pattern. And forming a conductive layer containing metal nanowires and / or metal nanotubes by irradiating the conductive preliminary layer with pulsed light.
  • a step of forming a conductive preliminary layer by applying a conductive ink containing metal nanowires and / or metal nanotubes on the adhesive layer in a solid form a step of forming a conductive layer containing metal nanowires and / or metal nanotubes by irradiating the conductive preliminary layer with pulsed light and a pattern processing step of processing the conductive layer into a predetermined pattern may be provided.
  • the method includes a step of forming a protective layer on the main surface opposite to the main surface including the adhesive layer of the conductive layer, and the protective layer removing step of removing the protective layer after the bonding step It is good also as having.
  • Another embodiment of the present invention is a method for forming a conductive pattern, wherein the support film includes a conductive layer including metal nanowires and / or metal nanotubes having a predetermined pattern shape, and an adhesive layer formed on the conductive layer. And a step of preparing a transfer film comprising: a bonding step of bonding an adhesive layer of the transfer film on a substrate; and a step of removing the support film.
  • Another embodiment of the present invention is a method for manufacturing an on-cell touch panel, wherein in the conductive pattern forming method, the substrate is a transparent substrate that encloses liquid crystal of a liquid crystal display element, and the adhesive layer includes The transparent substrate is bonded to the surface opposite to the side on which the liquid crystal is sealed.
  • Another embodiment of the present invention is a transfer film, in which a support film, an adhesive layer, and a conductive layer including metal nanowires and / or metal nanotubes having a predetermined pattern are sequentially stacked. It is characterized by that.
  • Another embodiment of the present invention is an on-cell touch panel, wherein the transfer film is bonded to a surface of a transparent substrate enclosing liquid crystal of a liquid crystal display element, on the side opposite to the side enclosing the liquid crystal. It is characterized by.
  • FIG. 6 It is a figure which shows the example of the on-cell type touch panel using the conductive layer formed as a transparent electrode for on-cell type touch panels by the conductive pattern formation method concerning embodiment.
  • FIGS. 1A to 1H are cross-sectional views showing process examples of a conductive pattern forming method according to one of the embodiments, and the same constituent elements are denoted by the same reference numerals.
  • An adhesive layer 12 is formed on one main surface of the support film 10 shown in FIG. 1 (a) as shown in FIG. 1 (b) (adhesive layer forming step).
  • the method for forming the adhesive layer 12 include, but are not limited to, application using a die coater, a gravure coater, screen printing, gravure offset printing, or adhesion layer film application.
  • a conductive ink containing metal nanowires and / or metal nanotubes is applied to the adhesive layer 12 in a predetermined pattern (application process) to form a conductive preliminary layer 14 (FIG. 1C).
  • application process includes printing.
  • solid means that the entire surface is applied to a certain region.
  • the conductive preliminary layer 14 (metal nanowires and / or metal nanotubes) is irradiated with pulsed light to fire the metal nanowires and / or metal nanotubes (peripheral intersections between the metal nanowires and / or metal nanotubes).
  • the conductive preliminary layer 14 is made electrically conductive, or the conductive preliminary layer 14 is improved in conductivity to convert the conductive preliminary layer 14 into the conductive layer 16 (light irradiation step, FIG. 1D). .
  • a protective layer 18 is formed on the conductive layer 16 as necessary (protective layer forming step, FIG. 1E).
  • the substrate 20 may be, for example, an array substrate and a color filter substrate sandwiching liquid crystals in a liquid crystal display element (see FIG. 5). Adhesion to the substrate 20 can be performed using, for example, a laminator device or a film sticking machine. Thereby, the conductive layer 16 can be transferred to the substrate 20 and a conductive pattern can be provided on the substrate 20.
  • the protective layer 18 on the said conductive layer 16 is removed after that (FIG.1 (g)), and the conductive layer 16 is exposed (protective layer removal process).
  • the conductive layer 16 is processed into a predetermined pattern such as a transparent electrode by an etching process such as photolithography as necessary when forming a transparent electrode of a touch panel (pattern processing step, FIG. 1 (h)).
  • a predetermined pattern such as a transparent electrode by an etching process such as photolithography as necessary when forming a transparent electrode of a touch panel.
  • a pattern processing process is unnecessary when using the transfer film by which the conductive layer was processed into the pattern shape previously.
  • a conductive pattern having a conductive portion and a non-conductive portion can be formed by pulsed light irradiation through a mask pattern exemplified in examples described later.
  • a transparent conductive polymer layer may be formed on the conductive layer 16 after the light irradiation step.
  • the transfer film manufactured from the adhesive layer forming step to the protective layer forming step is often in the form of a scroll around a cylindrical core of resin or the like in consideration of mass productivity during use. Is assumed.
  • judged in the sheet form may be sufficient. The form is not particularly limited.
  • the conductive preliminary layer 14 is formed in a desired pattern on one main surface of the support film 10 shown in FIG. 1A (in the state where there is no adhesive layer 12 in FIG. 1C), and pulse light is applied thereto.
  • the conductive preliminary layer 14 is made conductive, or the conductive preliminary layer 14 is improved in conductivity to convert the conductive preliminary layer 14 into the conductive layer 16 (the adhesive layer 12 is not present in FIG. 1D).
  • the adhesive layer 12 is formed on the conductive layer 16, and the support film 10 and the conductive layer 16 formed on the support film 10 are bonded to the substrate 20 through the adhesive layer 12. Thereafter, by removing the support film 10, the state shown in FIG. In this case, the smoothness of the surface of the conductive layer 16 transferred to the substrate 20 (the surface opposite to the substrate 20) can be improved.
  • FIG. 5 shows an example of an on-cell type touch panel using the conductive layer 16 formed as a transparent electrode for an on-cell type touch panel by the conductive pattern forming method.
  • a liquid crystal layer 30 and a TFT (thin film transistor) 32 are formed between a glass substrate (color filter substrate 26 and array substrate 28) as a transparent substrate to constitute a liquid crystal display element.
  • the liquid crystal phase 30 is sealed between the color filter substrate 26 and the array substrate 28 with a sealing agent (not shown).
  • the transparent electrode (conductive layer 16) as the on-cell touch panel transparent electrode 34 is bonded to the color filter substrate 26 via the adhesive layer 12 (not shown) by the conductive pattern forming method according to the present embodiment.
  • a type touch panel is formed.
  • the conductive layer 16 is bonded to the surface of the color filter substrate 26 opposite to the side on which the liquid crystal layer 30 is sealed.
  • the polarizing plates 36 and 38 required for the liquid crystal display element of the on-cell type touch panel are respectively formed outside the array substrate 28 and the on-cell type touch panel transparent electrode 34.
  • a film that is chemically and thermally stable and can be formed into a film, a sheet, or a plate can be used. Moreover, what gave the surface the mold release process in order to provide peelability is also contained.
  • Specific examples include polyolefins such as polyethylene and polypropylene, polyvinyl halides such as polyvinyl chloride and polyvinylidene chloride, cellulose derivatives such as cellulose acetate, nitrocellulose and cellophane, polyamide, polystyrene, polycarbonate, polyimide and polyester. It is done.
  • a biaxially stretched polyethylene terephthalate film which is a kind of polyester that has excellent dimensional stability and can transmit light when irradiated with light, is particularly preferable.
  • the function of the adhesive layer 12 is to secure adhesion between the conductive layer 16 and the substrate 20 (transfer object). Moreover, the purpose of the transparent conductive polymer layer provided as needed is to improve the surface smoothness without degrading the conductivity of the conductive layer 16.
  • the film thicknesses of the adhesive layer 12 and the transparent conductive polymer layer are each preferably 0.1 to 50 ⁇ m, more preferably 0.3 to 30 ⁇ m, and particularly preferably 0.5 to 10 ⁇ m. . If the film thickness is too thick, the device cannot be made thinner. Moreover, since the transparent conductive polymer layer is colored in the conductive polymer itself, the light transmittance decreases when the film thickness is large. If the adhesive layer 12 is too thin, the adhesion to the substrate 20 (transfer object) will be insufficient, and if the conductive polymer is too thin, the surface smoothing effect will not be exhibited.
  • the adhesive layer 12 can be obtained, for example, by a reaction of acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, phenol resin, ester resin, urethane resin, epoxy resin and (meth) acrylic acid.
  • acrylic resin means a polymer mainly having a monomer unit derived from a polymerizable monomer having a (meth) acryloyl group.
  • (meth) acryloyl group means an acryloyl group and a methacryloyl group.
  • (meth) acryl means acrylic and methacrylic.
  • acrylic resin those produced by radical polymerization of a polymerizable monomer having a (meth) acryloyl group can be used.
  • This acrylic resin can be used individually by 1 type or in combination of 2 or more types.
  • Examples of the polymerizable monomer having a (meth) acryloyl group include acrylamide such as diacetone acrylamide, (meth) acrylic acid alkyl ester, (meth) acrylic acid tetrahydrofurfuryl ester, and (meth) acrylic acid dimethylamino.
  • acrylamide such as diacetone acrylamide
  • (meth) acrylic acid alkyl ester (meth) acrylic acid tetrahydrofurfuryl ester, and (meth) acrylic acid dimethylamino.
  • the acrylic resin is substituted at the ⁇ -position or aromatic ring such as styrene, vinyltoluene, ⁇ -methylstyrene and the like.
  • One or two or more polymerizable monomers such as polymerizable styrene derivatives, acrylonitrile, ethers of vinyl alcohol such as vinyl-n-butyl ether may be copolymerized.
  • These resins preferably have a weight average molecular weight of 3,000 to 1,000,000.
  • the transparent conductive polymer layer is made of a material containing a conductive polymer.
  • the conductive polymer include polythiophene, polyacetylene, polyparaphenylene, polyaniline, polyparaphenylene vinylene, and polypyrrole.
  • poly (3) doped with polystyrene sulfonic acid (PSS), polyvinyl sulfonic acid (PVS), or p-toluenesulfonic acid (TSO) is used as a transparent conductive polymer.
  • PSS polystyrene sulfonic acid
  • PVS polyvinyl sulfonic acid
  • TSO p-toluenesulfonic acid
  • PEDOT 4-ethylenedioxythiophene
  • polythiophene-based conductive polymer for example, an undoped polymer having a main chain composed of a polythiophene-based polymer represented by the following chemical formula is doped with a halogen such as iodine or another oxidizing agent, thereby Those obtained by partially oxidizing the polymer to form a cation structure can be used.
  • a halogen such as iodine or another oxidizing agent
  • the groups R 1 and R 2 can be selected independently from each other, and options include a hydrogen atom; a halogen atom such as a fluorine atom, a chlorine atom, a bromine atom, an iodine atom; a cyano group; a methyl group A linear alkyl group such as ethyl group, propyl group, butyl (n-butyl) group, pentyl (n-pentyl) group, hexyl group, octyl group, dodecyl group, hexadecyl group, octadecyl group; isopropyl group, isobutyl group, Branched alkyl groups such as sec-butyl group, tert-butyl group, isopentyl group, neopentyl group; methoxy group, ethoxy group, propoxy group, isopropoxy group, butoxy group, isobutoxy group
  • PEDOT 3,4-ethylenedioxythiophene
  • PSS polystyrene sulfonic acid
  • H. C. Examples include Startron Baytron (registered trademark) P and Heraeus Clevios (registered trademark) SV3, Nagase Chemtex, Denatron (registered trademark) # 5002LA, Agfagebalt Orgacon (registered trademark) S300, and Orgacon 3040. be able to.
  • the metal nanowires and / or metal nanotubes are dispersed in a solution (dispersion medium) containing a thermosetting or thermoplastic binder resin having no fluidity in the range of 5 to 40 ° C. to form a conductive ink.
  • the conductive preliminary layer 14 is formed by performing pattern printing in a predetermined shape on the adhesive layer 12 formed on the surface of the support film 10 by means of gravure printing, screen printing, gravure offset printing, flexographic printing, etc. To do.
  • the pattern printing includes solid coating (solid pattern formation) on the entire surface of the adhesive layer 12.
  • the above 5 to 40 ° C. means a room temperature at which normal printing is performed.
  • the conductive preliminary layer 14 is converted into the conductive layer 16 when irradiated with pulsed light.
  • a transparent and conductive layer 16 is formed by fusing the intersecting outer peripheries of the metal nanowires and / or metal nanotubes.
  • thermosetting or thermoplastic binder resin having no fluidity in the range of 5 to 40 ° C., it is a transparent resin and is not particularly limited as long as it itself is not fluid and dissolves in a solvent. However, those having high heat resistance and low hygroscopicity are more preferable.
  • thermosetting resin means a resin that is dissolved in a solvent in an uncured state.
  • the thermosetting resin is preferably one that is thermoset by light irradiation described below.
  • binder resins examples include acrylic resins, epoxy resins, epoxy acrylate resins, urethane acrylate resins, unsaturated polyester resins, allyl ester resins, diallyl phthalate (DAP) resins, urethane resins, silicone resins, polyester resins, polycarbonate resins, Examples thereof include polyamide resin (nylon), amorphous polyolefin resin, polystyrene, polyvinyl acetate, poly N-vinyl amide, poly-4-methylpentene-1.
  • DAP diallyl phthalate
  • silicone resins examples include polyamide resin (nylon), amorphous polyolefin resin, polystyrene, polyvinyl acetate, poly N-vinyl amide, poly-4-methylpentene-1.
  • poly N-vinyl amides such as poly N-vinyl pyrrolidone, poly N-vinyl caprolactam, poly N-vinyl acetamide, poly N-vinyl formamide, epoxy resins and urethane acrylate resins are particularly excellent in affinity with silver.
  • Insulating resins such as urethane resins and cycloolefin polymers (COP) and cycloolefin copolymers (COC) having excellent transparency can be used, and known conductive resins can be used as necessary.
  • poly N-vinyl amides such as poly N-vinyl pyrrolidone, poly N-vinyl caprolactam, poly N-vinyl acetamide, poly N-vinyl formamide, etc. were used during the synthesis of nanowires, and also served to prevent aggregation after synthesis. Since it can be added as a protective film material, it is more preferable to use it excessively in the nanowire production stage because it is easy to produce and the quality of the electrode can be improved.
  • the metal nanowire or the metal nanotube is a metal having a diameter of nanometer order size
  • the metal nanowire is a conductive material having a wire shape
  • the metal nanotube is a porous or non-porous tube shape.
  • both “wire shape” and “tube shape” are linear, but the former is intended to have a hollow center, and the latter is intended to have a hollow center.
  • the property may be flexible or rigid. Either the metal nanowire or the metal nanotube may be used, or a mixture of both may be used.
  • the metal constituting the metal nanowire or the metal nanotube is at least one selected from the group consisting of gold, silver, platinum, copper, nickel, iron, cobalt, zinc, ruthenium, rhodium, palladium, cadmium, osmium and iridium. And alloys of these metals in combination.
  • An optimal embodiment includes silver nanowires.
  • the thickness of the diameter, the length of the major axis, and the aspect ratio of the metal nanowire and / or metal nanotube constituting the conductive layer 16 have a constant distribution. This distribution is selected so that the total light transmittance of the conductive pattern (transparent electrode) according to this embodiment is high and the surface resistance is low.
  • the average diameter of the metal nanowire and the metal nanotube is preferably 1 to 500 nm, more preferably 5 to 200 nm, still more preferably 5 to 100 nm, and particularly preferably 10 to 80 nm.
  • the average length of the major axis of the metal nanowire and the metal nanotube is preferably 1 to 100 ⁇ m, more preferably 1 to 50 ⁇ m, further preferably 2 to 50 ⁇ m, and particularly preferably 5 to 30 ⁇ m.
  • the average diameter thickness and the average long axis length satisfy the above range, and the average aspect ratio is preferably larger than 5, more preferably 10 or more, More preferably, it is more preferably 200 or more.
  • the aspect ratio is a value obtained by a / b when the average diameter of the metal nanowire and the metal nanotube is approximated to b and the average length of the major axis is approximated to a.
  • a and b can be arbitrarily measured using a scanning electron microscope and obtained as an average value.
  • a known production method can be used.
  • silver nanowires can be synthesized by reducing silver nitrate in the presence of polyvinylpyrrolidone using the Poly-ol method (see Chem. Mater., 2002, 14, 4736).
  • gold nanowires can be synthesized by reducing chloroauric acid hydrate in the presence of polyvinylpyrrolidone (see J. Am. Chem. Soc., 2007, 129, 1733).
  • Detailed techniques for the synthesis and purification of silver nanowires and gold nanowires are described in detail in International Publication Nos. WO2008 / 073143 and International Publication No. 2008/046058.
  • Gold nanotubes having a porous structure can be synthesized by reducing a chloroauric acid solution using silver nanowires as a template.
  • the silver nanowire used as the template is dissolved into the solution by a redox reaction with chloroauric acid, and as a result, a gold nanotube having a porous structure is formed.
  • the conductive ink for forming a conductive pattern applied to the embodiment of the present invention is obtained by dissolving a thermosetting or thermoplastic binder resin having no fluidity in the aforementioned range of 5 to 40 ° C. (room temperature) in a solvent. It can be prepared by dispersing metal nanowires and / or metal nanotubes therein.
  • a solvent any solvent that can generally be used for gravure printing, screen printing, gravure offset printing, flexographic printing and the like can be used without particular limitation. In the case of gravure printing, a solvent having a relatively low boiling point is used, and in the case of screen printing, a solvent having a relatively high boiling point is used.
  • the solvent having a relatively low boiling point that can be used for gravure printing has a boiling point of 50 ° C. or higher and 200 ° C. or lower, more preferably 150 ° C. or lower.
  • aromatic hydrocarbons such as toluene and xylene, ketones such as acetone and methyl ethyl ketone
  • An organic solvent such as a solvent, an ester solvent such as ethyl acetate or N-propyl acetate, or an alcohol solvent such as isopropanol, normal propanol, 2-butanol, isobutyl alcohol or n-butyl alcohol can be used.
  • a relatively high boiling point solvent that can be used for screen printing has a boiling point of 360 ° C. or lower and 120 ° C. or higher, more preferably 150 ° C. or higher.
  • solvents can be used alone or in combination of two or more.
  • the content of the metal nanowires and / or metal nanotubes in the conductive ink according to this embodiment is good dispersibility and good pattern forming property of the coating film obtained from the conductive ink, high conductivity and good optical properties.
  • the amount of metal nanowires and / or metal nanotubes is 0.01 to 10% by mass, and more preferably 0.05 to 2% by mass with respect to the total mass of the conductive ink. If the metal nanowires and / or metal nanotubes are less than 0.01% by mass, it is necessary to print the transparent conductive layer very thick in order to ensure the desired conductivity, and the difficulty of printing increases. It becomes difficult to maintain the pattern when drying. On the other hand, if it exceeds 10% by mass, it is necessary to print very thinly in order to ensure the desired transparency. In this case, printing becomes difficult.
  • the optimum compounding amount of the thermosetting or thermoplastic binder resin having no fluidity at room temperature added to the metal nanowire and / or metal nanotube varies depending on the resin to be used. And / or 100 parts by weight to 2500 parts by weight, and more preferably 150 parts by weight to 2000 parts by weight with respect to 100 parts by weight of the metal nanotubes. Surface smoothness will become it low that binder resin is 100 mass parts or less. On the other hand, when the amount exceeds 2500 parts by mass, the surface resistance cannot be lowered even by irradiation with pulsed light.
  • the conductive ink applied to the present embodiment is a wet dispersant that improves wettability with any component other than the above components (metal nanowires, metal nanotubes, binder resin), for example, a base material, as long as the properties are not impaired. , Surface conditioning agents, antifoaming agents, thixotropic agents, leveling agents, corrosion inhibitors, adhesion promoters, surfactants, rheology control agents, and the like.
  • DISPERBYK registered trademark
  • DISPERBYK registered trademark
  • DISPERBYK registered trademark
  • DISPERBYK registered trademark
  • -108 manufactured by Big Chemie Japan Co., Ltd.
  • BYK registered trademark
  • BYK registered trademark
  • BYK registered trademark
  • the conductive ink according to the present embodiment can be produced by appropriately selecting the above-described components by stirring, mixing, heating, cooling, dissolution, dispersion, or the like by a known method.
  • the preferred viscosity of the conductive ink according to this embodiment varies depending on the printing method, but in the case of gravure printing, the viscosity at 25 ° C. is preferably 50 to 10,000 mPa ⁇ s, more preferably 300 to 5000 mPa ⁇ s. It is. In the case of screen printing, the viscosity at 25 ° C. is preferably 100 to 2 ⁇ 10 5 mPa ⁇ s, more preferably 1 ⁇ 10 3 to 5 ⁇ 10 4 mPa ⁇ s. The viscosity is a value measured using a rotational viscometer.
  • Brookfield HBDV-II + Pro plate type CP-40 (26 to 87,200 mPa ⁇ s when low viscosity) or CP-52 (800 to 2,620,000 mPa ⁇ when high viscosity) s) was used.
  • pattern printing of a desired shape is performed on the adhesive layer 12 by application using a die coater or gravure coater, gravure printing, screen printing, ink jet printing, flexographic printing, or the like.
  • the amount of conductive ink applied is determined in consideration of the thickness of the conductive layer 16 required by the application.
  • the thickness of the conductive layer 16 can be adjusted by adjusting the application amount of the conductive ink and the conditions of the application method.
  • a preferred thickness is 60 nm to 3 ⁇ m.
  • the conductive ink that has been printed (coated) is dried by heating the coated material as necessary.
  • the heating temperature varies depending on the liquid component constituting the dispersion medium, but if the drying temperature is too high, the formed pattern may not be retained. Therefore, the drying temperature is at most 120 ° C., more preferably 100 ° C. or less. Since the initial drying temperature is particularly important, it is particularly preferable to start the drying from about 40 to 80 ° C. and raise the temperature stepwise within a range not exceeding 120 ° C. as necessary.
  • the surface resistance, total light transmittance, and haze value of the conductive layer 16 should be set to desired values by adjusting the film thickness, that is, appropriately selecting the composition, coating amount, coating method, and the like of the conductive ink to be used. Can do.
  • the thicker the film the lower the surface resistance and the total light transmittance.
  • the higher the concentration of metal nanowires or metal nanotubes in the conductive ink the lower the surface resistance and total light transmittance, and the higher the haze.
  • the conductive preliminary layer 14 formed of conductive ink is irradiated with pulsed light and converted to the conductive layer 16.
  • pulsed light refers to a light irradiation period (irradiation time).
  • Is short-time light and when light irradiation is repeated a plurality of times, light is irradiated between the first light irradiation period (on) and the second light irradiation period (on) as shown in FIG. It means light irradiation having a period (irradiation interval (off)) that is not performed.
  • FIG. 2 shows that the light intensity of the pulsed light is constant, the light intensity may change within one light irradiation period (on).
  • the pulsed light is emitted from a light source including a flash lamp such as a xenon flash lamp.
  • a light source including a flash lamp such as a xenon flash lamp.
  • the metal nanowires and / or metal nanotubes of the conductive preliminary layer 14 are irradiated with pulsed light.
  • one cycle (on + off) in FIG. 2 is repeated n times.
  • an electromagnetic wave having a wavelength range of 1 pm to 1 m can be used, preferably an electromagnetic wave having a wavelength range of 10 nm to 1000 ⁇ m (from far ultraviolet to far infrared), more preferably 100 nm to 2000 nm.
  • Electromagnetic waves in the wavelength range can be used. Examples of such electromagnetic waves include gamma rays, X-rays, ultraviolet rays, visible light, infrared rays and the like. In consideration of conversion to thermal energy, if the wavelength is too short, damage to the support film 10 (resin substrate), the adhesive layer 12 and the like on which pattern printing is performed is not preferable.
  • the wavelength range is preferably the ultraviolet to infrared range, more preferably the wavelength range of 100 to 2000 nm, among the wavelengths described above.
  • the irradiation time (on) of one pulsed light is preferably in the range of 20 microseconds to 50 milliseconds, although it depends on the light intensity. If it is shorter than 20 microseconds, the sintering of the metal nanowires and / or metal nanotubes does not proceed and the effect of improving the performance of the conductive layer 16 is reduced. If it is longer than 50 milliseconds, the support film 10, the adhesive layer 12 and the like may be adversely affected by light deterioration and heat deterioration, and the metal nanowires and / or metal nanotubes are likely to blow off. More preferably, it is 40 microseconds to 10 milliseconds. For this reason, pulse light is used instead of continuous light in this embodiment.
  • Irradiation with pulsed light is effective even if performed in a single shot, but can also be performed repeatedly as described above.
  • the irradiation interval (off) is preferably in the range of 20 microseconds to 5 seconds, more preferably 2 milliseconds to 2 seconds. If it is shorter than 20 microseconds, it becomes close to continuous light and is irradiated without being allowed to cool after being irradiated once, so that the support film 10, the adhesive layer 12 and the like are heated and the temperature becomes high. There is a possibility of deterioration. Further, if it is longer than 5 seconds, the process time becomes longer, which is not preferable.
  • a pulse width (on) of 20 microseconds to 50 milliseconds is more preferable by using a xenon pulse irradiation lamp or the like for the conductive preliminary layer 14 as described above. Irradiates pulsed light having a duration of 40 microseconds to 10 milliseconds to join the outer circumferential intersections of metal nanowires and / or metal nanotubes.
  • the term “bonding” means that the nanowire or nanotube material (metal) absorbs pulsed light, internal heat is generated, and the crossing portion is fused and more firmly connected, which lowers the surface resistance. It seems to be. By this bonding, the connection area between the nanowires at the intersection increases and the surface resistance can be lowered.
  • the conductive layer 16 in which the metal nanowires and / or the metal nanotubes are formed in a network is formed by irradiating the pulsed light to join the intersections of the metal nanowires and / or the metal nanotubes. For this reason, the electroconductivity of a conductive pattern can be improved.
  • the network formed by the metal nanowires and / or the metal nanotubes is not preferable in a state where the meshes are densely spaced. This is because the light transmittance decreases if the interval is not provided.
  • the conductive layer 16 obtained as described above preferably has a surface resistivity value of 5 to 1000 ⁇ / ⁇ , a total light transmittance of 80% or more, and a surface resistivity value of 10 to More preferably, it is 200 ⁇ / ⁇ and the total light transmittance is 90% or more.
  • a protective film can be applied as a protective layer 18 on the conductive layer 16 to protect the conductive layer 16.
  • the protective film is preferably chemically and thermally stable and easily peelable from the conductive layer 16.
  • a thin sheet-like material such as polyethylene, polypropylene, polyethylene terephthalate, polyvinyl alcohol or the like having a high surface smoothness is preferable. What gave the surface the mold release process in order to provide peelability is also contained.
  • the thickness of the protective film is preferably 5 to 500 ⁇ m, more preferably 10 to 188 ⁇ m, since it is difficult to handle if the thickness is too thin and the protective effect cannot be sufficiently exhibited. In addition, it can also irradiate pulse light after sticking a protective film on the upper part of a conductive layer.
  • the silver nanowire is linear
  • the diameter of the linear wire is about 70 nm
  • the length is about 10 to 20 ⁇ m
  • the ethylene glycol, poly N-vinylpyrrolidone K-90, AgNO 3 and FeCl 3 are manufactured by Wako Pure Chemical Industries, Ltd.
  • the length and diameter of the silver nanowires were measured with SEM and TEM.
  • the TEM used was a TEM manufactured by JEOL Ltd .; JEOL, JEM-2100 transmission electron microscope.
  • Example 1 Preparation of transfer film As a support film, a silicone-coated release PET film (manufactured by Panac Corporation, SP-PET-100-01BU, 100 ⁇ m PET film with release layer, release layer content not disclosed) is used on this surface. A polymer A layer was formed as an adhesive layer.
  • a solution obtained by dissolving Eslek KS-3 (polyacetal resin manufactured by Sekisui Chemical Co., Ltd.) in ethyl acetate (about 10% by mass) was coated on a silicone-coated release PET film with a bar coater so as to have a thickness of 10 ⁇ m. Thereafter, it was formed by drying at 80 ° C. for 1 hour.
  • the conductive preliminary layer was formed by apply
  • the conductive ink used was a solution prepared by dissolving polyN-vinylpyrrolidone K-30 in isopropanol so as to be 1% by mass so that the silver nanowire content was 0.1% by mass.
  • the conductive ink was applied onto the adhesive layer using a glass rod and then dried at 80 ° C. for 1 hour to form a conductive preliminary layer.
  • a xenon irradiation device Pulse Forge 3300 manufactured by NovaCentrix was used for this conductive preliminary layer, and the conductive preliminary layer was made into a conductive layer by performing pulsed light irradiation.
  • the irradiation conditions of the pulsed light were one irradiation at a light source driving voltage of 600 V and an irradiation time of 60 ⁇ sec.
  • the surface resistivity was 80 ⁇ / ⁇ .
  • the surface resistance value was measured using a LORESTA-GP MCP-T610 4 probe method surface resistivity / volume resistivity measuring device manufactured by Mitsubishi Chemical Corporation.
  • a silicone-coated release PET film is laminated on the conductive layer as a protective film (protective layer) so that the silicone-coated surface faces the conductive layer, and a glass rod is rolled over the protective film to form a silver nanowire. A transfer film was obtained.
  • Example 2 Conductive pattern formation method The transfer film obtained in Example 1 was cut into a 5 cm square, laminated so that the adhesive layer exposed after peeling off the support film was opposed to the glass substrate, and the glass rod was end-mounted from above Then, the conductive layer (solid pattern) was transferred onto the glass substrate through an adhesive layer by rolling on the film. After the transfer, the protective film was peeled off and the surface resistivity value of the conductive layer was measured. As a result, it was confirmed that the surface resistivity of the conductive film of the transfer film before the transfer was maintained as it was.
  • FIG. Silicone-coated release PET film (SP-PET-100-01BU, 100 ⁇ m PET film with release layer, release layer contents not disclosed) manufactured by Panac Co., Ltd. is used as a support film.
  • a layer was formed.
  • a solution obtained by dissolving Eslek KS-3 (polyacetal resin manufactured by Sekisui Chemical Co., Ltd.) in ethyl acetate (about 10% by mass) was coated on a silicone-coated release PET film with a bar coater so as to have a thickness of 10 ⁇ m. Thereafter, it was formed by drying at 80 ° C. for 1 hour.
  • the conductive preliminary layer was formed by apply
  • the conductive ink used was a solution prepared by dissolving polyN-vinylpyrrolidone K-30 in isopropanol so as to be 1% by mass so that the silver nanowire content was 0.1% by mass.
  • the conductive ink was applied onto the adhesive layer using a glass rod and then dried at 80 ° C. for 1 hour to form a conductive preliminary layer.
  • the transfer film 22 was cut into 13 cm ⁇ 6 cm. Thereafter, two stainless steel plates 24 having a thickness of 2 cm ⁇ 8 cm ⁇ 3 mm were stacked as shown in FIG. 4, and pulse light irradiation was performed using a xenon irradiation device Pulse Forge 3300 manufactured by NovaCentrix. Note that the irradiation conditions of the pulsed light were one irradiation at a light source driving voltage of 600 V and an irradiation time of 60 ⁇ sec. The surface resistivity of the Ag nanowire layer was measured in the same manner as in Example 2.
  • the protective film was applied on the conductive layer in the same manner as in Example 1, and the support film was peeled off, and then the transfer film 22 was applied on the glass substrate through the adhesive layer in the same manner as in Example 2. The pattern was transferred to a glass substrate. After the transfer, the protective film was peeled off again and the surface resistivity of the conductive layer was measured. As a result, it was confirmed that the insulating portion was maintained and the surface resistivity was maintained at 80 ⁇ / ⁇ . did.

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Abstract

Le problème décrit par la présente invention est de fournir un procédé de formation de motif conducteur configuré pour être facilement appliqué à des éléments d'affichage à cristaux liquides et d'autres éléments ; et un film de transfert utilisé dans ce dernier. La solution selon l'invention porte sur une couche d'adhésif (12) qui est formée sur une surface principale d'un film de support (10) ; une encre conductrice comprenant un nanofil métallique et/ou un nanotube métallique est appliquée dans un motif prescrit sur la couche d'adhésif (12) ; et une couche de conduction préliminaire (14) est formée. Ce motif comprend un enrobage solide de la surface entière de la couche d'adhésif (12). Une lumière pulsée est rayonnée sur la couche de conduction préliminaire (14), une conductivité est amenée à être exprimée ou à augmenter, et la couche de conduction préliminaire (14) est convertie en une couche de conduction (16). Si nécessaire, une couche de protection (18) est formée sur la couche de conduction (16) et un film de transfert est obtenu. Le film de support (10) est détaché et la couche de conduction (16) est fixée sur un substrat (20) par l'intermédiaire de la couche d'adhésif (12). Lors de l'utilisation du film de transfert ayant la couche de protection (18), la couche de protection (18) est retirée, la couche de conduction (16) est présentée, et, si nécessaire, la couche de conduction formée de manière solide (16) est usinée, par gravure, etc., dans un motif prescrit.
PCT/JP2014/079073 2013-11-05 2014-10-31 Procédé de formation de motif conducteur, procédé de fabrication pour un panneau tactile de type sur cellule utilisant ce dernier, film de transfert utilisé dans ce dernier, et panneau tactile de type sur cellule WO2015068654A1 (fr)

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105185431A (zh) * 2015-10-09 2015-12-23 重庆文理学院 一种超高防护的银导电薄膜的制备方法
CN105487279A (zh) * 2016-02-18 2016-04-13 昆山龙腾光电有限公司 触控显示面板的制造方法
WO2017163615A1 (fr) * 2016-03-23 2017-09-28 昭和電工株式会社 Résine de liant pour composition conductrice, composition pour formation de motif conducteur contenant celle-ci, et polyuréthane
JP2018109962A (ja) * 2016-12-28 2018-07-12 エルジー ディスプレイ カンパニー リミテッド 表示装置
KR20180121638A (ko) * 2016-05-31 2018-11-07 쇼와 덴코 가부시키가이샤 투명 도전 패턴의 형성 방법
KR20180121639A (ko) * 2016-05-31 2018-11-07 쇼와 덴코 가부시키가이샤 투명 도전 패턴의 형성 방법
KR20180122002A (ko) * 2016-05-02 2018-11-09 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법 및 이방성 도전 필름
KR20210048602A (ko) * 2016-05-02 2021-05-03 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법 및 이방성 도전 필름
JPWO2020137284A1 (ja) * 2018-12-27 2021-11-04 富士フイルム株式会社 導電性転写材料、パターンつき基板の製造方法、回路基板の製造方法、積層体、及びタッチパネル
JPWO2020137797A1 (ja) * 2018-12-27 2021-11-11 富士フイルム株式会社 導電性転写材料、パターンつき基板の製造方法、積層体、及びタッチパネル
JP2022160982A (ja) * 2021-04-07 2022-10-20 カンブリオス フィルム ソリューションズ（シアメン） コーポレーション オンセルタッチディスプレイ及びその製造方法
US20220371310A1 (en) * 2019-10-18 2022-11-24 Showa Denko K.K. Transparent conducting film laminate and processing method thereof
WO2023070699A1 (fr) * 2021-11-01 2023-05-04 东南大学 Tissu à changement de couleur à motif coloré à base d'encre électronique et procédé de préparation

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003016842A (ja) * 2001-06-28 2003-01-17 Tdk Corp 透明導電フィルム及びその製造方法
JP2010044968A (ja) * 2008-08-13 2010-02-25 Nissha Printing Co Ltd 導電性パターン被覆体の製造方法および導電性パターン被覆体
JP2013054599A (ja) * 2011-09-05 2013-03-21 Oji Holdings Corp 導電体、導電性シートおよびタッチパネル
WO2013133420A1 (fr) * 2012-03-09 2013-09-12 昭和電工株式会社 Procédé de fabrication d'un motif conducteur transparent

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004185914A (ja) * 2002-12-02 2004-07-02 Morimura Chemicals Ltd 透明導電膜、透明導電膜形成用複合シート及び表面に透明導電膜を有する透明プラスチック部材
JP2011251406A (ja) * 2010-05-31 2011-12-15 Nissha Printing Co Ltd 転写箔、および電子機器
JP2013077435A (ja) * 2011-09-30 2013-04-25 Oji Holdings Corp 導電性転写シートおよび導電性積層体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003016842A (ja) * 2001-06-28 2003-01-17 Tdk Corp 透明導電フィルム及びその製造方法
JP2010044968A (ja) * 2008-08-13 2010-02-25 Nissha Printing Co Ltd 導電性パターン被覆体の製造方法および導電性パターン被覆体
JP2013054599A (ja) * 2011-09-05 2013-03-21 Oji Holdings Corp 導電体、導電性シートおよびタッチパネル
WO2013133420A1 (fr) * 2012-03-09 2013-09-12 昭和電工株式会社 Procédé de fabrication d'un motif conducteur transparent

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* Cited by examiner, † Cited by third party
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CN105185431A (zh) * 2015-10-09 2015-12-23 重庆文理学院 一种超高防护的银导电薄膜的制备方法
CN105487279A (zh) * 2016-02-18 2016-04-13 昆山龙腾光电有限公司 触控显示面板的制造方法
CN105487279B (zh) * 2016-02-18 2018-12-18 昆山龙腾光电有限公司 触控显示面板的制造方法
CN109071938A (zh) * 2016-03-23 2018-12-21 昭和电工株式会社 导电性组合物用粘合剂树脂、包含该导电性组合物用粘合剂树脂的导电图案形成用组合物及聚氨酯
KR20180107283A (ko) * 2016-03-23 2018-10-01 쇼와 덴코 가부시키가이샤 도전성 조성물용 바인더 수지, 이것을 포함하는 도전 패턴 형성용 조성물 및 폴리우레탄
CN109071938B (zh) * 2016-03-23 2022-03-04 昭和电工株式会社 导电性组合物用粘合剂树脂、包含该粘合剂树脂的导电图案形成用组合物及聚氨酯
WO2017163615A1 (fr) * 2016-03-23 2017-09-28 昭和電工株式会社 Résine de liant pour composition conductrice, composition pour formation de motif conducteur contenant celle-ci, et polyuréthane
JPWO2017163615A1 (ja) * 2016-03-23 2019-03-07 昭和電工株式会社 導電性組成物用バインダー樹脂、これを含む導電パターン形成用組成物及びポリウレタン
JP6994455B2 (ja) 2016-03-23 2022-01-14 昭和電工株式会社 導電性組成物用バインダー樹脂、これを含む導電パターン形成用組成物及びポリウレタン
KR102121758B1 (ko) 2016-03-23 2020-06-11 쇼와 덴코 가부시키가이샤 도전성 조성물용 바인더 수지, 이것을 포함하는 도전 패턴 형성용 조성물 및 폴리우레탄
KR102445646B1 (ko) 2016-05-02 2022-09-21 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법 및 이방성 도전 필름
KR20180122002A (ko) * 2016-05-02 2018-11-09 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법 및 이방성 도전 필름
KR102246259B1 (ko) 2016-05-02 2021-04-29 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법 및 이방성 도전 필름
KR20210048602A (ko) * 2016-05-02 2021-05-03 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름의 제조 방법 및 이방성 도전 필름
KR20180121639A (ko) * 2016-05-31 2018-11-07 쇼와 덴코 가부시키가이샤 투명 도전 패턴의 형성 방법
KR102228232B1 (ko) 2016-05-31 2021-03-16 쇼와 덴코 가부시키가이샤 투명 도전 패턴의 형성 방법
KR102188996B1 (ko) 2016-05-31 2020-12-09 쇼와 덴코 가부시키가이샤 투명 도전 패턴의 형성 방법
KR20180121638A (ko) * 2016-05-31 2018-11-07 쇼와 덴코 가부시키가이샤 투명 도전 패턴의 형성 방법
US10490610B2 (en) 2016-12-28 2019-11-26 Lg Display Co., Ltd. Display device
JP2018109962A (ja) * 2016-12-28 2018-07-12 エルジー ディスプレイ カンパニー リミテッド 表示装置
JPWO2020137284A1 (ja) * 2018-12-27 2021-11-04 富士フイルム株式会社 導電性転写材料、パターンつき基板の製造方法、回路基板の製造方法、積層体、及びタッチパネル
JPWO2020137797A1 (ja) * 2018-12-27 2021-11-11 富士フイルム株式会社 導電性転写材料、パターンつき基板の製造方法、積層体、及びタッチパネル
US20220371310A1 (en) * 2019-10-18 2022-11-24 Showa Denko K.K. Transparent conducting film laminate and processing method thereof
JP2022160982A (ja) * 2021-04-07 2022-10-20 カンブリオス フィルム ソリューションズ（シアメン） コーポレーション オンセルタッチディスプレイ及びその製造方法
JP7268097B2 (ja) 2021-04-07 2023-05-02 カンブリオス フィルム ソリューションズ（シアメン） コーポレーション オンセルタッチディスプレイの製造方法
WO2023070699A1 (fr) * 2021-11-01 2023-05-04 东南大学 Tissu à changement de couleur à motif coloré à base d'encre électronique et procédé de préparation

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