WO2015049723A1 - Machine d'assemblage - Google Patents

Machine d'assemblage Download PDF

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Publication number
WO2015049723A1
WO2015049723A1 PCT/JP2013/076715 JP2013076715W WO2015049723A1 WO 2015049723 A1 WO2015049723 A1 WO 2015049723A1 JP 2013076715 W JP2013076715 W JP 2013076715W WO 2015049723 A1 WO2015049723 A1 WO 2015049723A1
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WIPO (PCT)
Prior art keywords
image data
component
processing
super
imaging
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PCT/JP2013/076715
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English (en)
Japanese (ja)
Inventor
弘健 江嵜
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富士機械製造株式会社
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Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2015540288A priority Critical patent/JP6309962B2/ja
Priority to PCT/JP2013/076715 priority patent/WO2015049723A1/fr
Publication of WO2015049723A1 publication Critical patent/WO2015049723A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Definitions

  • the present invention relates to an assembling machine that transfers a part acquired at a supply position to an assembly position and assembles the part to an assembly target.
  • the assembly machine is used as a manufacturing equipment for assembling a component mounting machine that mounts a plurality of electronic components on a circuit board to produce an electronic circuit product, or a power module.
  • a component mounting machine for example, in Patent Document 1, an electronic component at a supply position is sucked by a suction nozzle of a holding device, and the electronic component is mounted at an assembly position (predetermined coordinate position on a circuit board).
  • the holding state of the electronic component is recognized based on image data acquired by imaging the electronic component held by the suction nozzle. Then, the component mounter improves the accuracy of the mounting control by reflecting the recognized holding state in the mounting control.
  • an imaging device for imaging a component in an assembly machine such as a component mounter is a lens unit in which the focal distance is set constant in consideration of the fact that the distance to the object to be imaged is substantially constant and the equipment cost. Is often adopted.
  • imaging is performed with a predetermined camera field of view and resolution of an imaging element mounted on the imaging apparatus.
  • the lens unit when the camera field of view is set so that large parts with large external dimensions can be accommodated, the area of the small parts occupied in the image data is small when capturing small parts with small external dimensions, and sufficient resolution is ensured. It may not be possible.
  • Patent Document 2 a plurality of pieces of image data are obtained by repeatedly performing relative movement and imaging of a large component with respect to the imaging apparatus, and based on these image data, combined data that fits the large component is generated. .
  • JP 2013-26278 A Japanese Patent Laid-Open No. 10-13097
  • the imaging apparatus has a configuration that employs a lens unit having a zoom function that can change the focal length, for example, and a configuration that employs a high-resolution imaging device.
  • a high-resolution imaging device there is a concern that the equipment cost increases and the load of image processing and communication processing increases as the data size increases.
  • the present invention has been made in view of such circumstances, and it is possible to acquire image data used for recognizing the holding state of the part by the holding device corresponding to various parts, and improve the accuracy of assembly control.
  • An object of the present invention is to provide an assembling machine that can be used.
  • An assembling machine is based on a holding device that acquires and holds a component supplied to a supply position, an imaging device that images the component held by the holding device, and image data acquired by imaging.
  • a region setting unit that performs processing for setting a processing region in which part of the component is included in the image data
  • a super-resolution processing unit that performs super-resolution processing on the processing region in the image data
  • a partial Based on the image data that has undergone super-resolution processing
  • a holding state recognition unit that recognizes a holding state that includes the position and angle of the component with respect to the holding device, and the component that has been recognized as a control program stored in advance
  • a control device for controlling the movement of the holding device based on the holding state and transferring the component to a predetermined assembly position in the assembly target.
  • the image data partially super-resolved is used for recognition of the component holding state by the holding device.
  • Super-resolution processing is image processing that generates high-resolution image data by interpolating high-frequency components in the spatial frequency of image data.
  • a plurality of types of processing methods such as a multi-frame type are known, but in any case, a certain processing time is required.
  • the assembly machine pays attention to the fact that, for example, it is sufficient to recognize the characteristic part of the part for the recognition of the holding state of the part by the holding device, and it is a super solution only for the processing region including the part.
  • the image processing is performed.
  • the processing time can be shortened as compared with the case where the super-resolution processing is performed on the entire area of the image data.
  • the camera field of view is set so that a large component can be accommodated in the lens unit of the imaging device, it is possible to generate image data having a resolution sufficient for recognizing the holding state of the small component without using a high-resolution imaging device. . Therefore, it is possible to acquire image data used for recognition of the holding state corresponding to various parts, and the accuracy of assembly control can be improved.
  • FIG. 1 is an overall view showing a component mounter in an embodiment. It is a block diagram which shows the control apparatus of a component mounting machine. It is a flowchart which shows the mounting process by a component mounting machine. It is an activity diagram which shows the recognition process of a holding state. It is a figure which shows the image data to which the process area was set. It is a figure which shows the image data by which the super-resolution process was carried out partially.
  • the assembly machine is a component mounting machine for circuit board products produced by mounting electronic components on a circuit board (an assembly target).
  • the component mounter is a device that mounts a plurality of electronic components on a circuit board, for example, in an integrated circuit manufacturing process. For example, cream solder is applied to the mounting position (assembly position) of the electronic component by a screen printing machine, and the circuit board is sequentially transported through a plurality of component mounting machines to mount the electronic component. Thereafter, the circuit board on which the electronic component is mounted is transported to a reflow furnace and soldered to constitute an integrated circuit as a circuit board product.
  • the component mounter 1 includes a substrate transfer device 10, a component supply device 20, a component transfer device 30, a component camera 50, a substrate camera 60, and a control device 70.
  • the devices 10, 20, 30 and the component camera 50 are provided on the base 2 of the component mounter 1.
  • the horizontal direction of the component mounter 1 (direction from the upper left to the lower right in FIG. 1) is the X-axis direction, and the horizontal longitudinal direction of the component mounter 1 (from the upper right to the lower left in FIG. 1).
  • the direction of heading is the Y-axis direction, and the vertical height direction (vertical direction in FIG. 1) is the Z-axis direction.
  • the substrate transport apparatus 10 transports the circuit board B in the X-axis direction and positions the circuit board B at a predetermined position.
  • substrate conveyance apparatus 10 is a double conveyor type comprised by the some conveyance mechanism 11 arranged in parallel by the Y-axis direction.
  • the transport mechanism 11 includes a pair of guide rails 12 and 13 that guide a circuit board B that is mounted on a conveyor belt (not shown) and transported. In the electronic component mounting process, the transport mechanism 11 carries the circuit board B to a predetermined position in the X-axis direction and clamps the circuit board B with a clamp device. Then, when an electronic component is mounted on the circuit board B, the transport mechanism 11 unclamps the circuit board B and carries the circuit board B out of the component mounting machine 1.
  • the component supply device 20 is a device that supplies electronic components mounted on the circuit board B.
  • the component supply device 20 is disposed on the front side in the Y-axis direction of the component mounter 1 (lower left side in FIG. 1).
  • the component supply apparatus 20 is a feeder system that uses a plurality of cassette-type feeders 21.
  • the feeder 21 includes a feeder main body portion 21a that is detachably attached to the base 2, and a reel housing portion 21b that is provided on the rear end side of the feeder main body portion 21a.
  • the feeder 21 holds a supply reel 22 around which a component packaging tape is wound by a reel accommodating portion 21b.
  • the above-described component packaging tape includes a carrier tape in which electronic components are stored at a predetermined pitch, and a top tape that is bonded to the upper surface of the carrier tape and covers the electronic components.
  • the feeder 21 pitch feeds the component packaging tape drawn from the supply reel 22 by a pitch feed mechanism (not shown).
  • the feeder 21 peels the top tape from the carrier tape to expose the electronic component.
  • the feeder 21 supplies the electronic component so that the suction nozzle 42 of the component transfer device 30 can suck the electronic component at the supply position Ps located on the front end side of the feeder main body 21a.
  • the component transfer device 30 holds the electronic component supplied to the supply position Ps and transfers the electronic component to the mounting position on the circuit board B.
  • the component transfer device 30 is an orthogonal coordinate type disposed above the substrate transfer device 10 and the component supply device 20.
  • a Y-axis slide 32 is provided on a pair of Y-axis rails 31 extending in the Y-axis direction so as to be movable in the Y-axis direction.
  • the Y-axis slide 32 is controlled by the operation of the Y-axis motor 33 via a ball screw mechanism.
  • the Y-axis slide 32 is provided with a moving table 34 that can move in the X-axis direction.
  • the moving table 34 is controlled by the operation of the X-axis motor 35 via a ball screw mechanism (not shown).
  • the Y-axis slide 32 and the moving table 34 may be provided in a linear motion mechanism using a linear motor in addition to the above-described configuration and controlled by the operation of the linear motor.
  • a mounting head 40 is attached to the movable table 34.
  • the mounting head 40 supports a plurality of suction nozzles 42 so as to be movable up and down by a nozzle holder 41 that can rotate around an R axis parallel to the Z axis.
  • the mounting head 40 is fixed to the moving table 34 via a frame 43.
  • the nozzle holder 41 is connected to the output shaft of the R-axis motor 44 and is configured to be rotationally controlled by the R-axis motor 44.
  • the suction nozzle 42 is controlled to move in the Z-axis direction by an elevating mechanism including a Z-axis motor 45 and the like, and the rotation angle is controlled by a rotational drive of a ⁇ -axis motor (not shown).
  • the suction nozzle 42 constitutes a suction mechanism in the mounting head 40 and can suck electronic components by the supplied negative pressure.
  • the component camera 50 and the substrate camera 60 are digital imaging devices having imaging elements such as CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor).
  • the component camera 50 and the board camera 60 capture an image within a range that can be accommodated in the camera field of view based on a control signal from the control device 70 that is communicably connected, and send the image data acquired by the imaging to the control device 70.
  • the component camera 50 is fixed to the base 2 so that the optical axis is in the Z-axis direction, and is configured to be able to image an electronic component held by the suction nozzle 42.
  • the lens unit of the component camera 50 is set so that an object at a certain distance from the image sensor is focused.
  • the lens unit of the component camera 50 has a camera field of view so that the large component can be accommodated so that image data of the large component assumed to be mounted can be acquired by one imaging.
  • the control device 70 that has acquired the image data from the component camera 50 recognizes the holding state of the electronic component by the suction nozzle 42 by image processing. As described above, it is possible to improve the accuracy of mounting control by correcting the position and angle of the suction nozzle 42 according to the holding state of the electronic component. Details of the recognition processing of the holding state of the electronic component will be described later.
  • the board camera 60 is fixed to the moving base 34 so that the optical axis is in the Z-axis direction, and is configured to be able to image the circuit board B.
  • the control device 70 that has acquired the image data from the substrate camera 60 recognizes the positioning state of the circuit board B by the substrate transfer device 10 by recognizing, for example, a substrate mark attached to the substrate by image processing. Then, the control device 70 corrects the position of the moving table 34 according to the positioning state of the circuit board B, and performs control so as to mount the electronic component. As described above, by using the image data obtained by the board camera 60, it is possible to improve the accuracy of the mounting control.
  • the control device 70 is mainly configured by a CPU, various memories, and a control circuit, and controls the mounting of electronic components on the circuit board B based on image data acquired by imaging by the component camera 50 and the board camera 60.
  • an input / output interface 75 is connected to a mounting control unit 71, an image processing unit 72, and a storage unit 73 via a bus.
  • a motor control circuit 76 and an imaging control circuit 77 are connected to the input / output interface 75.
  • the mounting control unit 71 controls the position of the mounting head 40 and the operation of the suction mechanism via the motor control circuit 76. More specifically, the mounting control unit 71 inputs information output from various sensors provided in the component mounting machine 1 and results of various recognition processes. The mounting control unit 71 then sends a control signal to the motor control circuit 76 based on the control program stored in the storage unit 73, information from various sensors, and the results of image processing and recognition processing. Thereby, the position and rotation angle of the suction nozzle 42 supported by the mounting head 40 are controlled.
  • the image processing unit 72 acquires image data obtained by imaging the component camera 50 and the board camera 60 via the imaging control circuit 77, and executes image processing according to the application.
  • This image processing includes, for example, binarization of image data, filtering, hue extraction, super-resolution processing, and the like. Details of the image processing unit 72 will be described later.
  • the storage unit 73 is configured by an optical drive device such as a hard disk device or a flash memory.
  • the storage unit 73 includes a control program for operating the component mounting machine 1, image data transferred from the component camera 50 and the board camera 60 to the control device 70 via a bus or a communication cable, and processing performed by the image processing unit 72. Temporary data and the like are stored.
  • the input / output interface 75 is interposed between the CPU and the storage unit 73 and the control circuits 76 and 77, and adjusts data format conversion and signal strength.
  • the motor control circuit 76 controls the Y-axis motor 33, the X-axis motor 35, the R-axis motor 44, the Z-axis motor 45, and the ⁇ -axis motor based on the control signal from the mounting control unit 71. Thereby, the mounting head 40 is positioned in each axial direction, and the suction nozzle 42 is controlled to have a predetermined angle.
  • the imaging control circuit 77 controls imaging by the component camera 50 and the board camera 60 based on imaging control signals by the CPU of the control device 70 and the like. Further, the imaging control circuit 77 acquires image data obtained by imaging by the component camera 50 and the board camera 60 and stores the acquired image data in the storage unit 73 via the input / output interface 75.
  • the various image processing performed by the image processing unit 72 includes processing for recognizing the holding state of the electronic component used when the mounting control unit 71 corrects the position and angle of the suction nozzle 42.
  • image data obtained by imaging by the component camera 50 is used.
  • the lens unit of the component camera 50 has a constant focal length and a camera field of view based on a large component.
  • the image processing unit 72 performs the partial super-resolution process, thereby suppressing the increase in processing load and performing the holding state recognition process. The accuracy is improved.
  • a plurality of types of processing methods are known for super-resolution processing, but in any case, a certain processing time is required.
  • the image processing unit 72 pays attention to the fact that the mounting head 40 can recognize the holding state of the electronic component, for example, if it can recognize a characteristic portion of the electronic component, and only the processing region including the portion is recognized. Is configured to perform super-resolution processing. As illustrated in FIG. 2, the image processing unit 72 includes an area setting unit 721, a super-resolution processing unit 722, and a holding state recognition unit 723.
  • the region setting unit 721 performs processing region setting processing in which a part of the electronic component is included in the image data based on the first acquired image data.
  • the “processing area” is a part of the entire area of the image data that is a target of super-resolution processing by a super-resolution processing unit 722 described later.
  • the region setting unit 721 needs to recognize the position of the electronic component in the image data to some extent in order to set the processing region.
  • a method for recognizing the position of the electronic component a method based on the coordinate value of the suction nozzle 42 positioned at the time of imaging or the result of performing predetermined image processing on the image data can be considered.
  • the area setting unit 721 employs a recognition method using image data and component information. Specifically, the area setting unit 721 first acquires component information relating to the electronic component from the storage unit 73 during the processing area setting process. This component information includes the external shape of the electronic component and the position information of the part to be super-resolution processed. Next, the region setting unit 721 generally recognizes the position and angle of the electronic component in the image data based on the component information and the image data.
  • the region setting unit 721 recognizes the position and angle of the electronic component by comparing the electronic component outer shape that is grasped in advance based on the component information with the electronic component in the image data. Further, the part information includes position information of a part to be subjected to super-resolution processing, that is, position information of a part that becomes a characteristic part when the holding state of the electronic part is recognized.
  • the region setting unit 721 is configured to recognize the holding state of the electronic component as described above and set the processing region with a predetermined margin so that the characteristic part of the electronic component is included.
  • the super-resolution processing unit 722 performs super-resolution processing on the processing area in the image data.
  • Super-resolution processing is image processing for increasing the resolution of input image data, and a plurality of types of processing methods such as a single frame type, a multi-frame type, and a learning type are known.
  • the super-resolution processing unit 722 employs multi-frame type super-resolution processing. Specifically, the super-resolution processing unit 722 performs super-resolution processing using a plurality of image data captured at imaging positions where the relative positions of the component camera 50 with respect to the electronic component are different from each other. Also, the super-resolution processing unit 722 performs partial super-resolution processing only on the processing region set by the region setting unit 721 in the image data.
  • imaging positions with different relative positions are relative positions at which a plurality of image data that can be used for multi-frame super-resolution processing is imaged. That is, any two imaging positions are shifted by an amount obtained by adding a distance obtained by multiplying the pixel width by an integer to a distance smaller than the pixel width of the image sensor.
  • the electronic component held by the suction nozzle 42 is relatively moved by moving the mounting head 40 of the component transfer device 30 with respect to the component camera 50 fixed to the base 2.
  • the direction of relative movement may be one or both of the X-axis direction and the Y-axis direction.
  • the holding state recognition unit 723 displays a holding state including the position and angle of the electronic component held by the suction nozzle 42 of the component transfer device 30 that is a holding device, based on the partially super-resolution image data. recognize.
  • the holding state of the electronic component is recognized with high accuracy as much as the resolution of the image data is increased as compared with what is generally recognized by the region setting unit 721 when setting the processing region.
  • the image processing unit 72 recognizes the position of the electronic component in the X-axis direction and the Y-axis direction with respect to the suction nozzle 42 and the rotation angle of the electronic component with respect to the central axis of the suction nozzle 42 as a holding state, and stores it in the storage unit 73.
  • the image processing unit 72 recognizes the position of the electronic component in the X-axis direction and the Y-axis direction with respect to the suction nozzle 42 and the rotation angle of the electronic component with respect to the central axis of the suction nozzle 42 as a holding state, and stores it in
  • step 11 (hereinafter, “step” is expressed as “S”)
  • step S the suction process
  • step S13 the mounting process for sequentially mounting electronic components to the circuit board B
  • the above processing (S11 to S14) is repeated until the mounting is completed.
  • the electronic component holding state recognition process is executed based on the image data captured by the component camera 50.
  • the mounting control unit 71 corrects the position and angle of the suction nozzle 42 based on the holding state of the electronic component by each suction nozzle 42 and controls the mounting of the electronic component.
  • the control device 70 first performs an imaging process for the electronic component (S21). Specifically, the control device 70 inputs from the motor control circuit 76 that the suction nozzle 42 held by the mounting head 40 is located above the component camera 50, and sends it to the component camera 50 via the imaging control circuit 77. A control command is sent out to perform imaging. As a result, the electronic component held by the suction nozzle 42 is imaged, and image data obtained by the imaging is stored in the storage unit 73.
  • the recognition processing of the holding state uses image data that has been partially super-resolution processed.
  • This super-resolution processing is a multi-frame type in which the resolution is increased by a plurality of image data.
  • the control device 70 moves the suction nozzle 42 in the X-axis direction or the Y-axis direction by a distance corresponding to half the pixel width in the image sensor (S31).
  • control apparatus 70 performs the imaging process of the electronic component which moved only the half pixel similarly to said imaging process (S21) (S32).
  • the control device 70 determines whether or not imaging at the four imaging positions has been completed (S33), and if not completed (S33: No), repeats S31 to S33.
  • the storage unit 73 stores image data shifted by half a pixel in the X-axis direction, Y Image data shifted by a half pixel in the axial direction and image data shifted by a half pixel in the X-axis direction and the Y-axis direction are stored.
  • the region setting unit 721 performs parallel processing during a period in which the component camera 50 acquires a plurality of image data by imaging a plurality of times, that is, a period in which the control device executes the above processing (S31 to S33). Then, the processing area Fp is set. Specifically, the area setting unit 721 first acquires component information from the storage unit 73 (S41). Next, based on the acquired component information and the image data obtained by the first imaging process (S21), the region setting unit 721 performs a process for recognizing the rough position of the electronic component in the image data (S42).
  • the position and angle of the electronic component are determined by comparing the external shape of the electronic component recognized based on the component information with the electronic component in the image data obtained by the first imaging process (S21). This process is generally recognized. Subsequently, the region setting unit 721 performs processing for setting a processing region Fp to be a target of super-resolution processing to be executed later in the image data obtained by the first imaging processing (S21) (S43).
  • the region setting unit 721 first acquires position information of a part to be subjected to super-resolution processing included in the part information.
  • the electronic component is an IC chip having a large number of lead portions on the outer periphery, and the lead portions are designated as the characteristic portions.
  • the area setting unit 721 sets the processing area Fp with a predetermined margin so that any lead part is included with respect to the coarse position of the electronic component recognized in the image data.
  • the processing region Fp is a region surrounded by two broken lines in FIG. 5 and a hatched region.
  • the super-resolution processing unit 722 acquires various data necessary for image processing (S22).
  • the various data includes a plurality of pieces of image data picked up from different viewpoints in the image pickup processing (S21, S32), a control position of the mounting head 40 when the image pickup processing (S21, S32) is performed, and a set processing region Fp. Information is included. Then, the super-resolution processing unit 722 performs super-resolution processing on the processing area Fp in the image data (S23).
  • the super-resolution processing (S23) adopts a multi-frame type in the present embodiment, and uses four pieces of image data shifted by half a pixel to increase the resolution in the processing region Fp. Is generated. Specifically, the super-resolution processing unit 722 first determines the position of each image data based on the control position of the mounting head 40 (corresponding to the coordinate value of the suction nozzle 42) when each of the plurality of image data is captured. Align. Next, the super-resolution processing unit 722 performs a process for increasing the resolution in the processing region Fp by a MAP (Maximum A-Posterior) method, an IBP (Iterative Back-Projection) method, or the like.
  • MAP Maximum A-Posterior
  • IBP Iterative Back-Projection
  • the image processing unit 72 acquires image data that has undergone super-resolution processing only on the processing region Fp including the characteristic portion of the electronic component. Then, the holding state recognition unit 723 recognizes the precise position of the electronic component in the image data based on the partially super-resolution image data (S24). Specifically, the holding state recognition process is performed by matching the lead part of the electronic component in the partially super-resolved image data with the outer shape of the electronic component included in the component information.
  • the holding state recognition unit 723 recognizes the holding state including the position and angle of the electronic component with respect to the suction nozzle 42 based on the recognized precise position of the electronic component (S25).
  • the image processing unit 72 stores, as the holding state, the deviation amount ( ⁇ X, ⁇ Y) of the electronic component with respect to the suction nozzle 42 and the rotation angle ⁇ of the electronic component with respect to the central axis of the suction nozzle 42. 73, and the holding state recognition process is terminated.
  • the assembly machine (component mounting machine 1) acquires a component (electronic component) supplied to the supply position Ps and holds it, and a component held by the holding device.
  • An imaging device (component camera 50) that captures an image
  • an area setting unit 721 that performs a setting process for a processing area Fp that includes a part of the component in the image data based on image data acquired by imaging, and a processing area in the image data
  • a super-resolution processing unit 722 that performs super-resolution processing on Fp, and a holding state that recognizes a holding state that includes the position and angle of the component with respect to the holding device, based on partially super-resolution image data
  • the movement of the holding device is controlled based on the recognition unit 723, the control program stored in advance and the recognized holding state of the component, and a predetermined assembly position in the assembly (circuit board B).
  • a control unit 70 which causes transfer of parts, and the.
  • the mounting head 40 in assembly control (mounting control) in which an electronic component is transferred to a predetermined assembly position (mounting position) on the circuit board B, the mounting head 40 partially recognizes the holding state of the electronic component.
  • the image data that has been subjected to resolution processing is used.
  • the processing time can be shortened as compared with the case where the super-resolution processing is performed on the entire area of the image data.
  • image data having a resolution sufficient for recognizing the holding state of the small component can be generated without using a high-resolution image sensor. Can do. Therefore, it is possible to acquire image data used for holding state recognition corresponding to various electronic components, and the accuracy of mounting control can be improved.
  • the super-resolution processing unit 722 performs super-resolution on the processing region Fp using a plurality of image data captured at imaging positions where the relative position of the imaging device (component camera 50) with respect to the electronic component is different from each other.
  • Perform image processing That is, the super-resolution processing unit 722 is configured to adopt a multi-frame type using a plurality of image data among a plurality of types of processing methods.
  • This multi-frame type super-resolution processing is to interpolate high-frequency components from actual image data captured from different viewpoints. Therefore, in the multi-frame type, it is possible to suppress the occurrence of a position error corresponding to the shift between the real image and the image of the super-resolution processed area. Therefore, the image processing unit 72 can generate suitable super-resolution image data to be used for recognizing the holding state of the electronic component by the mounting head 40.
  • multi-frame super-resolution processing requires alignment of each image data as described above.
  • this alignment process is important.
  • the component mounter 1 that performs super-resolution processing enables precise mounting control, and can accurately grasp the control position of the mounting head 40 when imaging an electronic component.
  • the focal length of the lens unit of the component camera 50 is fixed, so that the scale change in each image data can be reliably prevented. For this reason, the above alignment process can be simplified, so that the processing load can be reduced and the processing time can be shortened.
  • the region setting unit 721 performs processing region Fp setting processing (S43) during a period in which the imaging device (component camera 50) acquires a plurality of pieces of image data by performing imaging a plurality of times. According to such a configuration, since the imaging process (S31 to S33) and the process area Fp setting process (S41 to S43) are performed in parallel, the time required for the entire process for recognizing the holding state can be reduced.
  • the region setting unit 721 acquires component information including the outer shape of the electronic component and the position information of the part to be super-resolution processed (S41), and based on the component information and the image data, The position and angle of the electronic component in the image data are generally recognized (S42), and the processing area Fp is set (S43).
  • the region setting unit 721 is a part used in the precision position recognition process (S24) on the assumption that the electronic object is an object to be imaged in advance. (Such as a lead portion of an IC chip) is recognized in advance.
  • S24 the precision position recognition process
  • the processing area Fp can be set. As a result, the processing area can be narrowed down according to the necessary portion, so that the efficiency of the super-resolution processing can be improved.
  • the holding device (mounting head 40) has a suction nozzle 42 that sucks and holds electronic components.
  • the assembly machine is a component mounter 1 that mounts electronic components held by the suction nozzle 42 on the circuit board B that is an assembly target under the control of the control device 70.
  • the component mounting machine 1 is diversified in use so as to handle from large parts to small parts, especially in various assembly machines. Further, the component mounter 1 is required to reduce the size of the entire equipment and reduce equipment costs, and the imaging apparatus may employ a lens unit that does not have a zoom function or an imaging device that does not have excessive resolution. is there. Even when the function of the imaging apparatus is limited as described above, the configuration having the image processing unit 72 using the partial super-resolution processing as in the present embodiment makes it possible to maintain various types of components. This is particularly useful because it enables state recognition processing.
  • the super-resolution processing unit 722 adopts a multi-frame type, and uses four image data captured at four imaging positions where the relative positions of the component camera 50 with respect to the electronic component are different from each other. .
  • the super-resolution processing unit 722 may appropriately change the number of frames according to the size of the electronic component that is the object to be imaged.
  • the super-resolution processing unit 722 may adopt a single frame type or a learning type in addition to the multi-frame type. In the single frame type and the learning type, it is possible to shorten the processing time because the imaging process for a plurality of times becomes unnecessary.
  • the multi-frame type is suitable as the super-resolution processing for the image data used for the component recognition processing.
  • the region setting unit 721 performs a coarse position recognition process based on the component information and the image data (S42), and performs a setting process of the processing region Fp based on the processing result (S43). .
  • the region setting unit 721 pays attention to the fact that the portion (characteristic portion) that is noticed when recognizing the holding state of the electronic component is a part of the outer shape of the electronic component in many cases.
  • the processing region Fp may be set by a method that does not use.
  • the region setting unit 721 first performs at least one of binarization and edge extraction on the image data obtained by the first imaging process (S21). Next, the area setting unit 721 generally recognizes the external shape of the electronic component in the image data based on the image data subjected to the image processing and a threshold value stored in advance. Then, the area setting unit 721 performs the setting process of the processing area Fp with a certain margin according to the outer shape of the electronic component.
  • the processing area setting unit 721 can set the processing area Fp without depending on the part information, there are various types.
  • the versatility of super-resolution processing can be improved.
  • by adding a device capable of performing image processing as described above to an existing facility it is possible to add a function for recognizing the position and the like of an electronic component using super-resolution processing.
  • the configuration in which the assembly machine is the component mounting machine 1 has been described as an example.
  • the assembly machine transfers the part acquired at the supply position to the assembly position and assembles the part to the assembly target, it is based on the holding state of the part recognized by using partial super-resolution processing.
  • the assembly machine may constitute a manufacturing facility for assembling a power module or the like, for example. Even in such a configuration, the same effect as the present embodiment can be obtained.
  • SYMBOLS 1 Component mounting machine (assembly machine) 2: Base 10: Board

Abstract

L'invention concerne une machine d'assemblage qui permet d'acquérir des données d'image correspondant à des composants variés utilisés pour reconnaître les états de retenue des composants retenus par un dispositif de maintien, et d'améliorer la précision de commande d'assemblage. La machine d'assemblage comprend : une unité de réglage de région qui, en fonction de données d'image acquises par capture d'image, règle une région de traitement dans les données d'image dans lesquelles certains composants sont inclus ; une unité de traitement à super-résolution qui exécute un traitement à super- résolution sur la région de traitement dans les données d'image ; et une unité de reconnaissance d'état de maintien qui, en fonction de données d'image qui ont été partiellement soumises à un traitement à super-résolution, reconnait les états de retenue des composants, tels que des états comprenant les positions et les angles des composants par rapport au dispositif de maintien.
PCT/JP2013/076715 2013-10-01 2013-10-01 Machine d'assemblage WO2015049723A1 (fr)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017126025A1 (fr) * 2016-01-19 2017-07-27 富士機械製造株式会社 Appareil de montage et procédé de traitement d'images
JP2017168637A (ja) * 2016-03-16 2017-09-21 富士機械製造株式会社 部品実装機及びヘッドユニット
WO2018154691A1 (fr) 2017-02-23 2018-08-30 株式会社Ｆｕｊｉ Dispositif de travail sur substrat et procédé de traitement d'image
WO2018235186A1 (fr) 2017-06-21 2018-12-27 株式会社Ｆｕｊｉ Appareil de conduite de travail sur un substrat

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05340738A (ja) * 1992-06-09 1993-12-21 Ezel Inc Ｉｃの傾き検査方法
JPH0618243A (ja) * 1992-06-29 1994-01-25 Ezel Inc Ｉｃの傾き検査方法
JPH07297598A (ja) * 1994-04-28 1995-11-10 Yamaha Motor Co Ltd チップ部品の認識方法及び同装置
JPH11191157A (ja) * 1997-12-25 1999-07-13 Toshiba Corp 画像処理装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5527035B2 (ja) * 2010-06-16 2014-06-18 株式会社ニコン 画像処理プログラム、画像処理装置および撮像装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05340738A (ja) * 1992-06-09 1993-12-21 Ezel Inc Ｉｃの傾き検査方法
JPH0618243A (ja) * 1992-06-29 1994-01-25 Ezel Inc Ｉｃの傾き検査方法
JPH07297598A (ja) * 1994-04-28 1995-11-10 Yamaha Motor Co Ltd チップ部品の認識方法及び同装置
JPH11191157A (ja) * 1997-12-25 1999-07-13 Toshiba Corp 画像処理装置

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017126025A1 (fr) * 2016-01-19 2017-07-27 富士機械製造株式会社 Appareil de montage et procédé de traitement d'images
JPWO2017126025A1 (ja) * 2016-01-19 2018-11-08 株式会社Ｆｕｊｉ 実装装置および撮像処理方法
US10869421B2 (en) 2016-01-19 2020-12-15 Fuji Corporation Mounting device and imaging processing method
JP2017168637A (ja) * 2016-03-16 2017-09-21 富士機械製造株式会社 部品実装機及びヘッドユニット
WO2018154691A1 (fr) 2017-02-23 2018-08-30 株式会社Ｆｕｊｉ Dispositif de travail sur substrat et procédé de traitement d'image
US10863661B2 (en) 2017-02-23 2020-12-08 Fuji Corporation Substrate working device and image processing method
WO2018235186A1 (fr) 2017-06-21 2018-12-27 株式会社Ｆｕｊｉ Appareil de conduite de travail sur un substrat
CN110771277A (zh) * 2017-06-21 2020-02-07 株式会社富士 对基板作业装置
JPWO2018235186A1 (ja) * 2017-06-21 2020-02-27 株式会社Ｆｕｊｉ 対基板作業装置
CN110771277B (zh) * 2017-06-21 2021-06-01 株式会社富士 对基板作业装置
JP7094282B2 (ja) 2017-06-21 2022-07-01 株式会社Fuji 対基板作業装置

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