WO2015022935A1 - 円柱状ナノインプリント用モールドの製造方法、およびナノインプリント用再生モールドの製造方法 - Google Patents
円柱状ナノインプリント用モールドの製造方法、およびナノインプリント用再生モールドの製造方法 Download PDFInfo
- Publication number
- WO2015022935A1 WO2015022935A1 PCT/JP2014/071193 JP2014071193W WO2015022935A1 WO 2015022935 A1 WO2015022935 A1 WO 2015022935A1 JP 2014071193 W JP2014071193 W JP 2014071193W WO 2015022935 A1 WO2015022935 A1 WO 2015022935A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- outer peripheral
- aluminum base
- peripheral surface
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
- B05D3/102—Pretreatment of metallic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/16—Pretreatment, e.g. desmutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2905/00—Use of metals, their alloys or their compounds, as mould material
- B29K2905/02—Aluminium
Definitions
- the present invention relates to a method for producing a cylindrical nanoimprint mold, and a method for producing a nanoimprint reproduction mold.
- This application is filed in Japanese Patent Application Nos. 2013-168538, 2013-168537, 2013-168540, and 2013-168540 filed in Japan on August 14, 2013, and in Japan, filed on January 30, 2014. Claim priority based on Japanese Patent Application No. 2014-015864 and Japanese Patent Application No. 2014-016042, the contents of which are incorporated herein.
- nanoscale fine concavo-convex structure exhibits a function derived from the structure such as an antireflection function called a moth-eye effect and a water repellent function called a lotus effect. Therefore, industrial use of nanoscale fine concavo-convex structure (improvement of light extraction efficiency of organic EL elements, antireflection of image display device, improvement of image clarity of image display device, water repellent material of various members, etc.) Is actively planned.
- the following methods are known as methods for imparting a fine relief structure to the surface of an article.
- This method is suitable for industrial production because it can easily impart a fine concavo-convex structure to the surface of an article with few steps.
- an oxide film having a plurality of pores on the surface of an aluminum substrate for example, the following methods are known.
- a method of anodizing the surface of an aluminum substrate after polishing the surface of the aluminum substrate Patent Document 1.
- polishing the surface of the aluminum substrate before anodizing and making the surface roughness low and uniform until it becomes a mirror surface state the occurrence of unevenness in the oxide film can be suppressed.
- a method for polishing the entire outer peripheral surface of the columnar aluminum base material for example, the following method can be considered. As shown in FIG. 11, a cylindrical aluminum base material 112 installed on a rotating shaft 110 is rotated around the axis, and an abrasive body 116 is pressed against the outer peripheral surface 114 of the aluminum base material 112 and rubbed. 112. A method of reciprocating the polishing body 116 in a range from the first end 112a in the axial direction to the second end 112b in 112.
- the time in which the polishing body 116 is in contact with the vicinity of the first end portion 112a and the vicinity of the second end portion 112b of the aluminum base material 112 as compared with the central portion of the aluminum base material 112 in the axial direction Shorter.
- polishing is insufficient in the vicinity of the end portion, resulting in uneven surface roughness, and unevenness is likely to occur in the oxide film formed thereon. Therefore, in this case, the outer peripheral surface 114 used to form an oxide film and impart a fine uneven structure is limited to a range excluding the vicinity of the first end 112a and the second end 112b in the aluminum base 112. To do.
- this method of partially utilizing the outer peripheral surface 114 of the aluminum base 112 is disadvantageous in terms of production efficiency.
- the cylindrical aluminum base material before polishing is processed into a predetermined shape from an aluminum lump by machining such as cutting, and it is necessary to finish the outer peripheral surface to a mirror surface by polishing.
- a polishing method for finishing the machined outer peripheral surface to a mirror surface it is necessary to remove a rough portion of the surface shape formed by machining, and therefore, it is preferable to use a polishing method having a relatively high polishing rate.
- CMP chemical mechanical polishing
- polishing in stages, ie, primary CMP polishing using an acidic CMP slurry for removal of the machined surface, and then final CMP polishing using an alkaline CMP slurry finished to a mirror surface.
- the polishing solution stagnated on the outer peripheral surface of the cylindrical aluminum substrate is used to remove the polished aluminum substrate.
- a very thick oxide film may be generated on the outer peripheral surface, and a deterioration such as whitening of the outer peripheral surface may be observed.
- the thicker oxide film is generated and the degree of whitening is stronger, it takes much more time to polish the whitened portion in the final CMP polishing to obtain a mirror-finished aluminum substrate. The performance is greatly reduced.
- the present invention provides a method for producing a cylindrical nanoimprint mold in which the outer peripheral surface of a cylindrical aluminum substrate is uniformly polished and the outer peripheral surface can be used more effectively. Moreover, this invention provides the manufacturing method of the mold for cylindrical nanoimprint which can suppress the quality change of the outer peripheral surface of aluminum base materials, such as whitening, and can obtain high productivity after grinding
- the method for producing a cylindrical nanoimprint mold according to the first embodiment of the present invention is a method for producing a cylindrical nanoimprint mold in which an oxide film having a plurality of pores is formed on the outer peripheral surface of a cylindrical aluminum substrate.
- the polishing body is moved while relatively moving the polishing body having a shorter length in the axial direction than the length in the axial direction of the aluminum base material and the aluminum base material rotating around a central axis.
- At least a part of the polishing body that protrudes from the aluminum base is disposed on the support member, and the surface of the portion of the support member on which the polishing body is disposed is perpendicular to the axial direction of the aluminum base.
- the shape cut in the direction is a method of forming an arc that constitutes at least a part of a circumference having a diameter substantially equal to or less than the outer diameter of the aluminum substrate.
- the outer shape of the portion of the support member on which the polishing body is disposed is 0.97 times or more and 1 time the outer diameter of the aluminum substrate.
- a shape constituting at least a part of a cylindrical shape having the following outer diameter is preferable.
- the support member preferably has a cylindrical outer shape.
- the portion of the support member on which the abrasive body is disposed is made of the same material as the aluminum base material.
- the abrasive body does not protrude from the aluminum base material between the step (I) and the step (II).
- the method further includes a step (I ′) of polishing by relatively moving the polishing body in the axial direction.
- polishing is performed with the polishing body while supplying abrasive grains to the outer peripheral surface of the aluminum substrate, and It is preferable to remove residual abrasive grains remaining on the surface of the support member.
- a contact portion with the polishing body on the outer peripheral surface of the aluminum base material is used for chemical mechanical polishing. It is preferable to remove the polishing liquid by cleaning the outer peripheral surface of the aluminum base material behind the polishing body that supplies the polishing liquid and moves in the axial direction.
- the polishing body is moved in one direction from the first end portion to the second end portion in the axial direction of the aluminum base material. It is preferable to make it.
- the outer peripheral surface of the aluminum base material is further washed in front of the polishing body moving in the axial direction to remove the polishing liquid. It is preferable to do.
- gas is blown to the outer peripheral surface of the aluminum base on both sides in the axial direction of the polishing body.
- the method for producing a cylindrical nanoimprint mold according to the second embodiment of the present invention is a method for producing a cylindrical nanoimprint mold in which an oxide film having a plurality of pores is formed on the outer peripheral surface of a cylindrical aluminum substrate.
- the polishing body is moved while relatively moving the polishing body having a shorter length in the axial direction than the length of the aluminum base in the axial direction and the aluminum base material rotating around the axis. Rubbing the outer peripheral surface of the aluminum base material in step (I) and polishing the entire outer peripheral surface of the aluminum base material, and after the step (I), the oxidation is performed on the outer peripheral surface of the aluminum base material by anodization.
- a chemical mechanical polishing polishing liquid is applied to the contact portion of the outer peripheral surface of the aluminum base material with the polishing body. Feeding to and behind the said abrasive body to be moved in the axial direction, a method of removing the polishing solution was washed an outer peripheral surface of the aluminum substrate.
- the polishing body is moved in one direction from the first end to the second end in the axial direction of the aluminum substrate. Is preferred. Further, in the method for manufacturing a cylindrical nanoimprint mold according to the second embodiment of the present invention, the outer peripheral surface of the aluminum base material is further washed in front of the polishing body moving in the axial direction to remove the polishing liquid. It is preferable to do. Moreover, in the manufacturing method of the cylindrical nanoimprint mold based on the second embodiment of the present invention, it is preferable that gas is blown to the outer peripheral surface of the aluminum base on both sides in the axial direction of the polishing body.
- the oxide film and scratches on the used mold are removed by machining, traces of machining such as cutting streaks remain on the machined surface, so the traces of machining must also be removed before anodizing. is there. Therefore, if the oxide film and scratches on the used mold are removed so that the traces of machining and the work-affected layer are not formed, the trouble of removing the traces of machining and the work-affected layer is eliminated, and the anodization makes it possible to reduce the thickness.
- the present invention has been completed based on the idea that an oxide film in which pores are uniformly distributed is re-formed.
- the method for producing a nanoimprint reproduction mold according to the present invention comprises a polishing step for polishing a surface of a nanoimprint mold in which an oxide film having a plurality of pores is formed on the surface of an aluminum substrate, and a polished surface. And an oxide film forming step of re-forming an oxide film having a plurality of pores on the surface of the aluminum substrate.
- polishing process includes the process which removes the oxide film of the surface of the nanoimprint mold which has several pores chemically.
- polishing process it is preferable to carry out chemical mechanical polishing of the said aluminum base material.
- the outer shape of the aluminum base material is cylindrical, and the polishing step is along the axial direction rather than the axial length of the aluminum base material.
- the entire outer peripheral surface of the aluminum substrate is rubbed against the outer peripheral surface of the aluminum substrate with the polishing body while relatively moving the abrasive body having a short length and the aluminum substrate rotating around the central axis.
- support members are disposed at both ends in the central axis direction of the aluminum base material, and at least a part of the polishing body is a shaft of the aluminum base material.
- the polishing body is moved relative to the outer peripheral surface of the aluminum base material rotating about the axis so as to protrude from the end portion in the axial direction. At least a part of the protruding abrasive body is disposed on the support member, and the surface of the portion of the support member on which the abrasive body is disposed is cut in a direction perpendicular to the axial direction of the aluminum substrate. Is preferably in the shape of an arc constituting at least a part of a circumference having a diameter substantially equal to or less than the outer diameter of the aluminum substrate.
- the outer shape of the portion of the support member on which the abrasive body is disposed is an outer diameter of 0.97 times or more and 1 time or less of the outer diameter of the aluminum base material. It is preferable that it is the shape which comprises at least one part of this cylindrical shape.
- the polishing step may be performed after the step (I) so that the polishing body does not protrude from the aluminum base material in the axial direction. It is preferable to further have a step (I ′) of polishing by moving the target.
- a polishing solution for chemical mechanical polishing is supplied to the contact portion with the polishing body on the outer peripheral surface of the aluminum base material,
- the outer peripheral surface of the aluminum substrate is further washed to remove the polishing liquid even in front of the polishing body moving in the axial direction.
- a cylindrical nanoimprint mold in which the outer peripheral surface of a cylindrical aluminum substrate is uniformly polished and the outer peripheral surface can be used more effectively can be manufactured.
- the deterioration of the outer peripheral surface of the aluminum substrate such as whitening after primary CMP polishing using an acidic CMP slurry can be suppressed, and nanoimprint can be achieved with high productivity. Molds can be manufactured.
- a remanufactured mold for nanoimprinting can be produced at low cost by reusing a used mold.
- FIG. 1st edge part vicinity of the aluminum base material in FIG. It is an enlarged view of the 2nd edge part vicinity of the aluminum base material in FIG.
- the “pore” means a recess having a fine concavo-convex structure formed on an oxide film on the surface of an aluminum substrate.
- the “interval between pores” means a center-to-center distance between adjacent pores.
- “Cylindrical shape” means that it is a columnar shape as a whole, and includes a hollow columnar shape such as a cylindrical shape and a shape in which a plurality of through holes are formed.
- Protrusions refer to convex portions having a fine concavo-convex structure formed on the surface of a molded body.
- “Fine concavo-convex structure” means a structure having an average interval between convex portions or concave portions of 10 to 400 nm.
- “Mechanical polishing” is to physically polish the processed surface to make a mirror surface.
- physical polishing includes “tape polishing” and “chemical mechanical polishing (CMP polishing)”.
- the “polishing rate” is a polishing amount per unit time. “Finishing the surface” means mirroring until the arithmetic average roughness of the surface of the aluminum substrate becomes 15 nm or less.
- a polishing body 26 having a length L2 along the axial direction shorter than the axial length L1 of the cylindrical aluminum substrate 10 and rotating around the central axis
- the entire outer peripheral surface 14 of the aluminum base 10 is polished by rubbing the outer peripheral surface 14 of the aluminum base 10 with the polishing body 26 while relatively moving the aluminum base 10 to be moved.
- an oxide film having a plurality of pores is formed on the outer peripheral surface 14 of the aluminum substrate 10 by anodic oxidation.
- the manufacturing method of the 1st embodiment of this invention may further have the following process (I ') as needed.
- (I ′) Between the steps (I) and (II), the polishing body 26 is relatively moved in the axial direction for polishing so that the polishing body 26 does not protrude from the aluminum substrate 10.
- step (I) of this example the columnar aluminum substrate 10 is installed on the rotating shaft 16.
- the first support member 18 is disposed on the first axial end 10a side of the aluminum base 10 in the rotary shaft 16, and the second end in the axial direction of the aluminum base 10 in the rotary shaft 16 is further provided.
- the second support member 20 is installed on the 10b side.
- the first support member 18 is adjacent to the first end 10 a of the aluminum base 10.
- the second support member 20 is adjacent to the second end portion 10 b of the aluminum base material 10.
- disk-shaped stoppers 22 and 24 are installed on the outer sides of the first support member 18 and the second support member 20 on the rotary shaft 16, respectively.
- the outer shape of the first support member 18 and the second support member 20 in this example is cylindrical.
- the first support member 18 and the second support member 20 are configured to rotate simultaneously when the aluminum substrate 10 is rotated around the axis by the rotation shaft 16.
- the outer diameter d1 (FIG. 2) of the first support member 18 and the outer diameter d2 (FIG. 2) of the second support member 20 are the same as the outer diameter D (FIG. 2) of the aluminum base material 10. Yes.
- the polishing body 26 protrudes on the first end portion 10a side and the second end portion 10b side as described later, at least a part of the protruding portion of the polishing body 26 is the first end portion. It is disposed on and supported by the support member 18 and the second support member 20.
- the shape obtained by cutting the outer peripheral surface 18a, which is the surface of the portion where the polishing body 26 is disposed, in the first support member 18 of this example in the direction perpendicular to the axial direction is the outer diameter of the aluminum base material 10. It is a circle that forms the entire circumference of the same diameter as D.
- the shape obtained by cutting the outer peripheral surface 20a, which is the surface of the portion of the second support member 20 in this example where the polishing body 26 is disposed, in a direction perpendicular to the axial direction is the outer diameter D of the aluminum base 10. Is a circle that forms the entire circumference of the same diameter.
- the polishing means 12 includes a belt-like polishing body 26, a transport roll 28 that transports the polishing body 26 in the longitudinal direction thereof, and a polishing liquid supply means 30 that supplies a polishing liquid.
- the polishing body 26 has a length L2 (FIG. 2) along the axial direction of the aluminum base material 10 shorter than an axial length L1 (FIG. 2) of the aluminum base material 10.
- the polishing body 26 only needs to be capable of polishing the surface of the aluminum base material to a desired state, and examples thereof include a nonwoven fabric type and a suede type polishing pad.
- As the polishing body 26, a polishing paper in which SiC powder is embedded in durable paper, a polishing disk in which diamond powder is embedded in metal, or the like may be used.
- the transport roll 28 is configured to transport the polishing body 26 in the longitudinal direction while pressing the polishing body 26 against the outer peripheral surface 14 of the aluminum substrate 10.
- the polishing is performed so that the rotation direction of the aluminum base 10 and the direction in which the polishing body 26 is conveyed are opposite to each other at the portion where the outer peripheral surface 14 of the aluminum base 10 and the polishing body 26 are in contact with each other.
- the body 26 is transported by the transport roll 28.
- the polishing liquid supply means 30 has a pipe 30a for feeding the polishing liquid and a nozzle 30b provided at the tip of the pipe 30a.
- the polishing liquid supply means 30 is disposed so as to supply the polishing liquid between the outer peripheral surface 14 of the aluminum base 10 and the polishing body 26.
- polishing according to various objectives, such as mirroring the outer peripheral surface 14 of the aluminum base material 10, and uses well-known polishing liquid used when grind
- the polishing liquid for example, chemical mechanical polishing in which abrasive grains are dispersed in a slurry containing abrasive grains such as SiC, Al 2 O 3 , SiO 2 , ZrO 2, or acidic or alkaline solution having an effect of corroding aluminum ( CMP) polishing liquid (CMP slurry) and the like.
- CMP corroding aluminum
- acidic CMP slurry is preferable when the outer peripheral surface 14 of the aluminum base material 10 is rough by machining
- alkaline CMP slurry is preferable when it is finished to a mirror surface.
- the polishing means 12 can move in the axial direction of the aluminum substrate 10. That is, the polishing body 26 pressed against the outer peripheral surface 14 of the aluminum base material 10 is moved in the axial direction of the aluminum base material 10, so that the second end portion is moved from the first end portion 10 a of the aluminum base material 10. The entire outer peripheral surface 14 can be polished over 10b.
- the aluminum substrate 10 is rotated around the axis, and the abrasive body 26 is moved in the axial direction while pressing and rubbing the abrasive body 26 against the outer peripheral surface 14 of the aluminum substrate 10 to move the aluminum substrate 10 to the aluminum base.
- the entire outer peripheral surface 14 of the material 10 is polished.
- the polishing body 26 is moved so that at least a part of the polishing body 26 protrudes from the aluminum base 10 on the first end 10a side and the second end 10b side of the aluminum base 10.
- the polishing body 26 that has moved on the outer peripheral surface 14 of the aluminum base material 10 in the axial direction toward the first end portion 10 a is moved to the second end portion 10 b side. At the time of turning back, at least a part of the polishing body 26 is temporarily protruded from the first end 10 a of the aluminum base 10. That is, when the polishing body 26 is turned back on the first end portion 10 a side of the aluminum base material 10, the polishing body 26 overruns the first end portion 10 a of the aluminum base material 10.
- the portion of the polishing body 26 that protrudes from the first end 10 a of the aluminum base material 10 is disposed on the outer peripheral surface 18 a of the first support member 18, so that the outer periphery of the first support member 18. It contacts the surface 18a.
- the first support member 18 rotates around the axis together with the aluminum base material 10. Therefore, the outer peripheral surface 18 a of the first support member 18 is also polished together with the outer peripheral surface 14 of the aluminum base 10 by pressing and rubbing the portion of the polishing body 26 that protrudes from the aluminum base 10.
- the polishing body 26 that has moved on the outer peripheral surface 14 of the aluminum base material 10 in the axial direction toward the second end portion 10 b is returned to the first end portion 10 a side.
- at least a part of the polishing body 26 is temporarily protruded from the second end portion 10 b of the aluminum base 10. That is, when the polishing body 26 is turned back on the second end portion 10 b side of the aluminum base material 10, the polishing body 26 overruns the second end portion 10 b of the aluminum base material 10.
- the portion of the polishing body 26 that protrudes from the second end portion 10 b of the aluminum base 10 is disposed on the outer peripheral surface 20 a of the second support member 20, and thus the outer periphery of the second support member 20. It contacts the surface 20a.
- the second support member 20 since the second support member 20 also rotates around the axis together with the aluminum base material 10, the outer peripheral surface 20 a of the second support member 20 is also polished by the polishing body 26.
- step (I) of this embodiment when the polishing body 26 is moved in the axial direction of the aluminum base material 10 in this way, polishing is performed on each of the first end portion 10a side and the second end portion 10b side.
- the body 26 is reciprocated so that at least a part of the body 26 protrudes.
- the difference between the polishing time in the vicinity of the first end portion 10a and the vicinity of the second end portion 10b in the aluminum base 10 and the polishing time in the central portion is reduced. Therefore, the aluminum base material 10 with good uniformity of the surface roughness of the outer peripheral surface 14 is obtained from the first end 10a to the second end 10b.
- the length along the axial direction of the aluminum base material 10 of the portion that protrudes on the first end 10a side of the polishing body 26 with respect to the length L2 (FIG. 3) along the axial direction of the aluminum base material 10 of the polishing body 26 The ratio L3 (FIG. 3) (L3 / L2) is preferably 0.4 or more, and more preferably 0.5 or more. If L3 / L2 is equal to or greater than the lower limit, the difference in polishing time between the vicinity of the first end portion 10a of the aluminum base 10 and the central portion becomes smaller, and the surface roughness of the outer peripheral surface 14 becomes more uniform.
- the upper limit value of L3 / L2 is 1.
- L3 / L2 being 1 means that the polishing body 26 completely protrudes to the first support member 18 side on the first end 10a side of the aluminum base 10. If L3 / L2 is 1, the difference in polishing time between the vicinity of the first end 10a of the aluminum substrate 10 and the central portion can be eliminated, so that the surface roughness of the outer peripheral surface 14 becomes more uniform.
- the outer peripheral surfaces 14 of the plurality of aluminum base materials 10 are polished, when the first support member 18 is continuously used without being replaced, the outer peripheral surface 18a of the first support member 18 is continuously polished.
- the outer diameter d1 of the first support member 18 may be smaller than the outer diameter D of the aluminum base 10.
- the outer peripheral surface 18a of the first support member 18 is lower than the outer peripheral surface 14 of the aluminum base material 10, and a step is formed. In this state, when the polishing body 26 is completely protruded on the first end portion 10a side of the aluminum base material 10, the first support member 18 and the aluminum are used when the polishing body 26 is turned back onto the aluminum base material 10.
- L3 / L2 is preferably 0.9 or less, and more preferably 0.8 or less. As a result, the polishing body 26 partially protruding from the first end 10a side of the aluminum substrate 10 can be returned more smoothly and stably.
- a preferable aspect of the ratio of protruding the polishing body 26 on the second end portion 10b side of the aluminum base material 10 is also the same as that on the first end portion 10a side of the aluminum base material 10. That is, along the axial direction of the aluminum base material 10 at the portion protruding from the second end 10b side of the polishing body 26 with respect to the length L2 (FIG. 4) along the axial direction of the aluminum base material 10 of the polishing body 26.
- the ratio (L4 / L2) of the length L4 (FIG. 4) is preferably 0.4 or more, and more preferably 0.5 or more.
- L4 / L2 is equal to or greater than the lower limit, the difference in polishing time between the vicinity of the second end portion 10b of the aluminum base 10 and the central portion becomes smaller, and the surface roughness of the outer peripheral surface 14 becomes more uniform.
- the upper limit value of L4 / L2 is 1. L4 / L2 being 1 means that the polishing body 26 completely protrudes to the second support member 20 side on the second end 10b side of the aluminum base 10. If L4 / L2 is 1, the difference in polishing time between the vicinity of the second end portion 10b and the center portion of the aluminum base material 10 can be eliminated, so that the surface roughness of the outer peripheral surface 14 becomes more uniform.
- the outer diameter d2 of the second support member 20 can be smaller than the outer diameter D of the aluminum base material 10 as in the case of the first support member 18.
- L4 / L2 is preferably 0.9 or less, and more preferably 0.8 or less.
- the purity of the aluminum of the aluminum base material 10 is more preferable 99.9 mass% or more. If the purity of aluminum is not less than the lower limit, highly regular pores can be formed with higher accuracy in step (II).
- aluminum substrate 10 is made of high-purity aluminum
- the aluminum substrate is sometimes too soft to process when processed into a columnar shape.
- what was processed into a columnar shape by adding magnesium to aluminum may be used as the aluminum substrate 10.
- the strength of aluminum is increased, which makes it easier to process.
- the amount of magnesium added is preferably 0.05 to 3% by mass with respect to the total mass of the aluminum substrate 10.
- the first support member 18 when the first support member 18 has a cylindrical shape and the outer peripheral surface 18a of the first support member 18 is polished together with the outer peripheral surface 14 of the aluminum base material 10, the first support member 18
- the material of the member 18 is preferably the same as the material of the aluminum substrate 10. That is, it is preferable that the material of the portion where the polishing body 26 is disposed in the first support member 18 is the same as the material of the aluminum base material. When there is a portion where the polishing body 26 is not disposed in the first support member 18, the material of the portion may be the same as or different from the material of the aluminum substrate 10. Thereby, it is possible to suppress generation of shavings harder than the aluminum base material 10 from the first support member 18.
- the material of the first support member 18 is the same as the material of the aluminum base material 10, the corrosivity of the first support member 18 and the aluminum base material 10 is comparable even when chemical mechanical polishing (CMP) is performed. become.
- CMP chemical mechanical polishing
- the first support member 18 and the aluminum base material 10 are polished to the same extent during chemical mechanical polishing, and a step is unlikely to occur. Therefore, it becomes easy to polish the vicinity of the first end portion 10a of the aluminum base material 10 to the same extent as the central portion in the axial direction.
- the material of the second support member 20 is preferably the same as the material of the aluminum substrate 10. That is, it is preferable that the material of the portion where the polishing body 26 is disposed in the second support member 20 is the same as the material of the aluminum base material. When there is a portion where the polishing body 26 is not disposed in the second support member 20, the material of the portion may be the same as or different from the material of the aluminum substrate 10.
- the material of the first support member 18 and the second support member 20 where the polishing body 26 is disposed and the aluminum base material 10 do not have to be completely the same, and the hardness and polishing conditions are not necessarily the same. Should be the same as long as they are not extremely different.
- the first support member 18 and the second support member 20 are preferably formed of aluminum having at least a surface purity of 99.5% by mass or more, and formed of aluminum having a purity of 99.9% by mass or more. More preferably. Further, 0.05 mass% to 3 mass% of magnesium may be added.
- the outer diameter d1 of the first support member 18 and the outer diameter D of the aluminum substrate 10 are the same.
- the outer diameter d1 of the first support member 18 and the outer diameter of the aluminum substrate 10 are the same.
- D may be a different embodiment.
- the outer diameter d2 of the second support member 20 and the outer diameter D of the aluminum base material 10 may be different.
- the outer diameter d1 of the first support member 18 and the outer diameter d2 of the second support member 20 are preferably substantially the same as or less than the outer diameter D of the aluminum base material 10.
- the polishing body 26 When the outer diameter d1 of the first support member 18 is smaller than the outer diameter D of the aluminum base material 10, the polishing body 26 is the first end portion 10a of the aluminum base material 10 as shown in FIG. It is deformed toward the central axis of the aluminum substrate 10 so as to cover the side end face 13 of the aluminum base 10. At this time, the polishing body 26 tends to apply a large polishing pressure locally to the first end portion 10a of the aluminum base 10. Thus, when a large polishing pressure is applied to the first end portion 10a of the aluminum substrate 10 as compared with the central portion in the axial direction, the first end portion 10a is excessively polished and the surface roughness is not good. May become uniform.
- the outer diameter d1 of the first support member 18 is smaller than the outer diameter D of the aluminum substrate 10, the outer diameter d1 of the first support member 18 is as close as possible to the outer diameter D of the aluminum substrate 10. It is preferable.
- the outer diameter d1 of the first support member 18 is more preferably equal to or less than the outer diameter D of the aluminum base material 10.
- the polishing body 26 rides on the first support member 18, as shown in FIG.
- the polishing body 26 is difficult to contact the first end portion 10a of the aluminum base 10.
- the polishing body 26 itself may be damaged or twisted, or the polishing means 12 may be overloaded.
- the outer diameter d1 of the first support member 18 is smaller than the outer diameter D of the aluminum substrate 10, but in the case of being larger, the outer peripheral surface 14 of the aluminum substrate 10 and the first support member 18
- the step amount ( ⁇ d1-D ⁇ / 2) of the outer peripheral surface 18a is preferably set to be equal to or less than the thickness of the polishing body 26.
- the ratio (d1 / D) of the outer diameter d1 of the first support member 18 to the outer diameter D of the aluminum substrate 10 is preferably 0.97 to 1 and more preferably 0.99 to 1 for the reason described above.
- d1 / D is within the above range, it becomes easy to form the outer peripheral surface 14 having a uniform surface roughness by polishing.
- the length L5 (FIG. 3) in the axial direction of the first support member 18 is preferably equal to or greater than the length L2 (FIG. 3) in the axial direction of the polishing body 26.
- a preferable aspect of the outer diameter d2 of the second support member 20 is the same as the preferable aspect of the outer diameter d1 of the first support member 18.
- the outer diameter d2 of the second support member 20 can be as large as the outer diameter D of the aluminum substrate 10. It is preferable to be close.
- the outer diameter d2 of the second support member 20 is more preferably equal to or smaller than the outer diameter D of the aluminum base material 10.
- the ratio (d2 / D) of the outer diameter d2 of the second support member 20 to the outer diameter D of the aluminum base material 10 is preferably 0.97 to 1, and more preferably 0.99 to 1.
- the axial length L6 (FIG. 4) of the second support member 20 is preferably equal to or greater than the axial length L2 (FIG. 3) of the polishing body 26.
- the shape of the stoppers 22 and 24 is not limited to a disk shape, and any shape can be used as long as the first support member 18 and the second support member 20 can be maintained on both sides of the aluminum base 10. Further, the sizes of the stoppers 22 and 24 are not limited to those larger than the aluminum base 10, the first support member 18, and the second support member 20, and the first support members are provided on both sides of the aluminum base 10. What is necessary is just the range which can hold
- the stoppers 22 and 24 are preferably made of a material having corrosion resistance to a corrosive polishing liquid, such as stainless steel; resins such as polyvinyl chloride (PVC) and polypropylene (PP).
- the moving speed of the polishing body 26 along the axial direction of the aluminum substrate 10 is preferably constant. This makes it easy to make the polishing time in the axial direction on the outer peripheral surface 14 of the aluminum base material 10 constant from the first end 10a to the second end 10b, and the surface roughness of the outer peripheral surface 14 of the aluminum base 10 It becomes easy to make uniform. In addition, as long as the effect of the present invention is not impaired, the moving speed of the polishing body 26 along the axial direction may be changed.
- the number of times of reciprocating the polishing body 26 in the axial direction on the outer peripheral surface 14 of the aluminum base material 10 may be set as appropriate according to the target conditions such as surface roughness, and may be once or twice or more. Further, in the step (I), polishing may be performed while cleaning and removing the attached polishing liquid in the portion of the outer peripheral surface 14 of the aluminum base 10 through which the polishing body 26 has passed. Thereby, it is possible to easily suppress the occurrence of problems such as corrosion caused by the polishing liquid at the polished portion of the outer peripheral surface 14 of the aluminum base 10.
- the outer peripheral surface 14 of the aluminum base material 10 after being polished in the step (I) is preferably mirror-finished.
- fine polishing scratches may remain on the outer peripheral surface 14 of the aluminum base material 10 after polishing.
- the factors that may cause the polishing flaw are as follows. As shown in FIG. 5, when the outer diameter D of the aluminum base 10 is larger than the outer diameter d1 of the first support member 18, the polishing body 26 overruns the first end 10a or the second end 10b. In this case, the first support member 18 and the polishing body 26 are separated from each other at the step portion between the first support member 18 and the aluminum base material 10, and a gap 40 is generated.
- the abrasive grains of the polishing liquid continue to remain during the polishing, and the remaining abrasive grains may aggregate to form aggregated abrasive grains far larger than normal abrasive grains. Further, the agglomerated abrasive grains are caught in the abrasive body 26 and brought onto the aluminum substrate 10 when the abrasive body 26 that has overrun and contacts the first support member 18 returns to the aluminum substrate 10. Sometimes. When the aggregated abrasive grains are brought onto the aluminum base material 10, the aggregated abrasive grains may cause polishing scratches on the outer peripheral surface 14 of the aluminum base material 10.
- the polishing body 26 has the first end portion 10a or the second end portion 10b.
- the aluminum substrate 10 and the polishing body 26 are separated and a gap 42 is generated. Therefore, in this case as well, agglomerated abrasive grains are generated in the gap 42, and the agglomerated abrasive grains may cause polishing flaws on the outer peripheral surface 14 of the aluminum base material 10.
- the residual abrasive removal means 50 is used to The aggregated abrasive grains remaining on the surface of one support member 18 may be removed. Thereby, it can suppress that an abrasive grain aggregates in the clearance gaps 40 and 42, As a result, generation
- the residual abrasive grain removing means 50 is not particularly limited, for example, means for removing residual abrasive grains by washing or suction using a fluid such as water, detergent, air, contact type removing means such as sponge, etc. Combination means and the like can be mentioned.
- a fluid such as water, detergent, air, contact type removing means such as sponge, etc.
- Combination means and the like can be mentioned.
- the concentration of the abrasive grains may be promoted by the change in the concentration of the polishing liquid on the surface of the first support member 18, so an optimum means is used depending on the polishing liquid used. It is preferable to select.
- step (I ′) the reciprocating movement of the polishing body 26 in the axial direction is within the range of the length L1 of the aluminum base 10, and the first end portion 10a and the second end portion 10b. Polishing is performed so that the polishing body 26 does not protrude from, ie, does not overrun. By performing polishing without overrunning the polishing body 26, the gaps 40 and 42 described above are not generated at the step portion between the aluminum base 10 and the first support member 18. As a result, aggregated abrasive grains are not generated, and therefore, when performing additional polishing in step (I ′), it is possible to polish to a good mirror surface state without generating new polishing scratches.
- polishing can be performed under the same conditions as in step (I), except that the range of reciprocation of polishing body 26 along the axial direction of aluminum substrate 10 has changed.
- a foreign matter filtering filter in the middle of the pipe 30a for supplying the polishing liquid in the step (I) and the step (I ').
- the optimum filter type may be selected from the abrasive particle size of the polishing liquid, the resistance to a corrosive polishing liquid, and the size of an allowable polishing flaw.
- step (I) when acidic or alkaline CMP slurry is used as the polishing liquid, if the CMP slurry stays on the outer peripheral surface 14 of the aluminum base material 10 for a long time, the outer peripheral surface 14 of the aluminum base material 10 changes in quality and becomes white. In some cases, a phenomenon may occur in which polishing becomes difficult to proceed. In such a case, it is preferable to remove the polishing liquid present in the portion of the outer peripheral surface 14 of the aluminum base 10 that has not been polished. Also in the step (I ′), when the CMP slurry is used, it is preferable to remove the polishing liquid as well. Specifically, it is preferable to remove the polishing liquid by washing behind the polishing body moving in the axial direction or both behind and in front of the polishing body.
- the cleaning liquid is supplied from the first cleaning means 31 behind the polishing body 26 moving in the axial direction to clean the outer peripheral surface 14 of the aluminum base 10 and remove the polishing liquid.
- cleaning means 31 has the piping 31a which sends a washing
- the first cleaning means 31 follows the relative movement of the aluminum base 10 and the polishing body 26 and moves relative to the axial direction of the aluminum base 10.
- the polishing liquid adhering to the portion of the outer peripheral surface 14 of the aluminum substrate 10 that has been polished is washed and removed by the cleaning liquid. No longer remains over time. Therefore, the outer peripheral surface 14 of the aluminum base material 10 is suppressed from being altered by the polishing liquid.
- the cleaning of the outer peripheral surface 14 of the aluminum substrate 10 behind the polishing body 26 is preferably performed immediately after the polishing body 26 has passed. That is, it is preferable to immediately wash the portion polished by the polishing body 26 on the outer peripheral surface 14 of the aluminum base 10 and remove the polishing liquid from the portion. Thereby, it can suppress more stably that the grinding
- the polishing body 26 is moved in the axial direction while continuously cleaning the outer peripheral surface 14 of the aluminum base material 10 behind the polishing body 26.
- the first cleaning means 31 follows immediately behind the polishing body 26 so that the cleaning liquid is continuously supplied to the portion of the outer peripheral surface 14 of the aluminum base 10 through which the polishing body 26 has passed, and cleaning is performed. It is preferable to carry out. Thereby, it can suppress more stably that the grinding
- the cleaning liquid is supplied from the second cleaning means 33 also in front of the polishing body 26 moving in the axial direction, so that the outer peripheral surface 14 of the aluminum substrate 10 is supplied. It is preferable to wash the substrate and remove the polishing liquid.
- the second cleaning means 33 has a pipe 33a for feeding a cleaning liquid and a nozzle 33b provided at the tip of the pipe 33a.
- the second cleaning means 33 moves relative to the front of the polishing body 26 in the axial direction of the aluminum base 10 in accordance with the relative movement of the aluminum base 10 and the polishing body 26.
- the cleaning of the outer peripheral surface 14 of the aluminum base 10 in front of the polishing body 26 is preferably performed at a position as close as possible to the contact portion 27 between the aluminum base 10 and the polishing body 26. Thereby, it can suppress more stably that the part before grinding
- the polishing body 26 it is more preferable to move the polishing body 26 in the axial direction while continuously cleaning the outer peripheral surface 14 of the aluminum base 10 in front of the polishing body 26.
- the second cleaning means 33 moves in front of the polishing body 26 in the axial direction so that the cleaning liquid is continuously supplied to the front portion of the polishing body 26 on the outer peripheral surface 14 of the aluminum base 10. It is preferable to perform cleaning. Thereby, it can suppress more stably that the part before grinding
- the cleaning liquid may be any cleaning liquid that can remove the polishing liquid adhering to the outer peripheral surface 14 by cleaning the outer peripheral surface 14 of the aluminum substrate 10.
- any cleaning liquid that can remove the polishing liquid adhering to the outer peripheral surface 14 by cleaning the outer peripheral surface 14 of the aluminum substrate 10.
- water, alcohol, or an acid that neutralizes the polishing liquid or An alkaline solution etc. are mentioned.
- cleaning liquid water is preferable from a viewpoint of preventing the corrosion etc. of an aluminum base material.
- gas is blown onto the outer peripheral surface 14 of the aluminum base 10 on both sides of the polishing body 26 by the first gas ejection means 35 and the second gas ejection means 37.
- the polishing liquid supplied to the contact portion 27 between the aluminum base 10 and the polishing body 26 is suppressed from flowing out to a portion other than the contact portion 27.
- the gas is blown to suppress the polishing liquid from adhering to the portion other than the contact portion 27 on the outer peripheral surface 14 of the aluminum base material 10, so that the outer peripheral surface 14 of the aluminum base material 10 is caused by the polishing liquid. Is more stably suppressed.
- the cleaning liquid can be prevented from entering the contact portion 27. Thereby, it can suppress more stably that the composition of polishing liquid changes with cleaning liquid at the time of grinding
- the gas blown to both sides of the polishing body 26 on the outer peripheral surface 14 of the aluminum base material 10 is not particularly limited, and examples thereof include nitrogen, carbon dioxide, and air. Especially, as a gas to spray, air is preferable from the point which can be utilized simply.
- the cleaning of the outer peripheral surface 14 of the aluminum base 10 to remove the polishing liquid is performed by moving the polishing body 26 in the axial direction from the first end 10a to the second end 10b of the aluminum base 10. It is particularly effective in the mode of moving in one direction. Specifically, the aspect in which the polishing body is moved in one direction to polish the entire outer peripheral surface of the aluminum base material performs the same level of polishing as compared with the aspect in which polishing is performed by reciprocating the polishing body in the axial direction. It is necessary to slow down the moving speed of the polishing body in the axial direction.
- the portion of the aluminum base material close to the end on the side where the polishing is started takes a very long time from the passage of the polishing body to the end of the polishing.
- the portion of the outer peripheral surface of the aluminum base material that has passed through the polishing body is washed to remove the polishing liquid. Therefore, even if the time from when the polishing body passes to the end of polishing becomes longer, the polishing liquid Can be stably suppressed.
- the polishing body 26 may be reciprocated in the axial direction on the outer peripheral surface 14 of the aluminum base 10.
- the number of times the polishing body 26 is reciprocated may be appropriately set according to the target conditions such as surface roughness, and may be one time or may be two or more times.
- cleaning the outer peripheral surface 14 of the aluminum base material 10 and removing polishing liquid is not specifically limited.
- rough polishing using a polishing liquid containing abrasive grains having a relatively large particle diameter for removing scratches on the outer peripheral surface 14 of the aluminum substrate 10 may be used.
- the polishing may be a finish polishing using a polishing liquid containing abrasive grains having a relatively small particle diameter to make a mirror surface, or both.
- an acidic polishing liquid is often used. Since the acidic polishing liquid easily alters the aluminum substrate, the production method of the present invention is particularly effective when performing rough polishing using an acidic polishing liquid.
- polishing is performed while washing as described above in the rough polishing as long as the effect of the present invention is not impaired.
- polishing may be performed without cleaning.
- an oxide film (anodized porous alumina) having a plurality of pores is formed on the outer peripheral surface 14 by anodic oxidation.
- the method for forming the oxide film include a method having the following steps (a) to (f).
- the concentration of oxalic acid is preferably 0.7 M or less. If the concentration of oxalic acid is 0.7 M or less, it is easy to suppress the current value from becoming too high and the surface of the oxide film 32 from becoming rough.
- the applied voltage is preferably 30 to 60V. If the applied voltage is within the above range, highly regular pores 36 are likely to be formed.
- the temperature of the electrolytic solution is preferably 60 ° C. or lower, and more preferably 45 ° C. or lower. If the temperature of the electrolytic solution is 60 ° C. or less, it is easy to suppress the phenomenon of so-called “burning”, and it is easy to form highly regular pores 36.
- the concentration of sulfuric acid is preferably 0.7 M or less. If the concentration of sulfuric acid is 0.7 M or less, it becomes easy to suppress the current value from becoming too high, and it becomes easy to maintain a constant voltage.
- the applied voltage is preferably 25 to 30V. If the applied voltage is within the above range, highly regular pores 36 are likely to be formed.
- the temperature of the electrolytic solution is preferably 30 ° C. or less, and more preferably 20 ° C. or less. If the temperature of the electrolytic solution is 30 ° C. or lower, it is easy to suppress the phenomenon of so-called “burning”, so that highly regular pores 36 are easily formed.
- ⁇ Process (b) ⁇ A part or all of the oxide film 32 is once removed, and this is used as an anodized pore generation point 34. Thereby, the regularity of a pore can be improved. Even if the oxide film 32 is not completely removed, but remains in a state where the regularity is sufficiently high in the remaining portion of the oxide film 32, the effect of removing the oxide film can be obtained.
- the method for removing the oxide film include a method in which aluminum is not dissolved but is dissolved and removed in a solution that selectively dissolves the oxide film. Examples of such a solution include a mixed solution of chromic acid and phosphoric acid.
- Step (d) A process of expanding the diameter of the pores 36 (hereinafter referred to as “pore diameter expanding process”) is performed.
- the pore diameter expansion process is a process for expanding the diameter of the pores obtained by anodic oxidation by immersing the oxide film in a solution that dissolves the oxide film.
- the solution for dissolving the oxide film include a phosphoric acid aqueous solution of about 5% by mass. The longer the pore diameter expansion processing time, the larger the pore diameter.
- step (d) when the aluminum substrate 10 is anodized again, cylindrical pores 36 having a small diameter and extending downward from the bottom of the cylindrical pores 36 are further formed. Anodization may be performed under the same conditions as in step (a). Deeper pores 36 can be formed as the anodic oxidation time is lengthened.
- the total number of repetitions of step (d) and step (e) is preferably 3 times or more, and more preferably 5 times or more. If the number of repetitions is 3 or more, it is easy to obtain the mold 1 in which the oxide film 32 having the pores 36 having a sufficient diameter is formed. Therefore, in the article in which the moth-eye structure is transferred by the mold 1, the reflectance reduction effect and the like are easily obtained.
- the shape of the pore 36 examples include a substantially conical shape, a pyramid shape, and a cylindrical shape.
- the shape of the pores 36 is preferably a shape in which the pore cross-sectional area in the direction orthogonal to the depth direction continuously decreases from the outermost surface in the depth direction, such as a cone shape or a pyramid shape.
- the average interval between the pores 36 is preferably not more than the wavelength of visible light, that is, not more than 400 nm.
- the average interval between the pores 36 is preferably 20 nm or more.
- the average interval between the pores 36 was measured by measuring the distance between adjacent pores 36 (distance from the center of the pore 36 to the center of the adjacent pore 36) by electron microscope observation, and averaging these values. It is a thing.
- the depth of the pores 36 is preferably 80 to 500 nm, more preferably 120 to 400 nm, and particularly preferably 150 to 300 nm when the average interval is 100 nm.
- the depth of the pore 36 is a value obtained by measuring the distance between the bottom of the pore 36 and the top of the convex portion existing between the pores 36 when observed with an electron microscope at a magnification of 30000. It is.
- the aspect ratio of the pores 36 is preferably 0.8 to 5.0, more preferably 1.2 to 4.0, and 1.5 to 3.0. Is particularly preferred.
- Polishing is performed so as not to protrude from the surface of the material. However, when polishing the entire outer peripheral surface of the cylindrical aluminum base material, if polishing is performed so that the polishing body does not protrude from the outer peripheral surface, polishing in the vicinity of the axial end portion of the outer peripheral surface is performed as described above. The time is shorter than the polishing time of the central portion, and the surface roughness is non-uniform.
- the polishing bodies 26 is provided on the first end portion 10a side and the second end portion 10b side of the cylindrical aluminum base material 10.
- the polishing body 26 is moved in the axial direction so that the portion protrudes from the aluminum substrate 10. Therefore, in the outer peripheral surface 14 of the aluminum base material 10, the difference in polishing time can be reduced from the first end portion 10a to the second end portion 10b.
- the outer peripheral surface 14 of the aluminum base material 10 is ground to the same extent from the first end portion 10a to the second end portion 10b, the uniformity of the surface roughness of the outer peripheral surface 14 is good. become.
- the polishing body 26 when at least a part of the polishing body 26 protrudes on the first end portion 10a side and the second end portion 10b side of the aluminum base material 10, The protruding portion of the polishing body 26 is supported in contact with the first support member 18 and the second support member 20. Thereby, it is possible to suppress an excessive polishing pressure from being locally applied to the first end portion 10 a and the second end portion 10 b of the aluminum base material 10 by the polishing body 26. Therefore, the vicinity of the first end portion 10a and the vicinity of the second end portion 10b on the outer peripheral surface 14 of the aluminum base material 10 are polished to the same extent as the central portion in the axial direction, and the surface roughness is uniform. Become good.
- the outer peripheral surface 14 of the cylindrical aluminum base material 10 is uniformly polished, and the outer peripheral surface 14 can be used more effectively. Is obtained. Further, in the manufacturing method of the first embodiment of the present invention, the moving speed of the polishing body is controlled so that the contact time of the polishing body becomes longer on the end side in the axial direction of the aluminum base, Compared with a method that attempts to make the polishing time in the direction uniform, the control is simple, and polishing with more uniform surface roughness is possible.
- the polishing is finished first.
- a part of the aluminum base material may change in quality and whitening may occur. This is particularly remarkable when rough polishing is performed with an acidic polishing liquid.
- Such a whitening phenomenon is presumed to be caused by the formation of an oxide layer (aluminum oxide layer) on the outer peripheral surface of the aluminum base material by the polishing liquid.
- the whitened part in an aluminum base material is hard to be shaved by grinding
- the aluminum base is moved in front of the polishing body 26 moved in the axial direction, or both in front and rear.
- the outer peripheral surface 14 of the material 10 is washed to remove the polishing liquid.
- polishing body 26 in the outer peripheral surface 14 of the aluminum base material 10 becomes short, the time which is in contact with polishing liquid, and it suppresses that a quality change with polishing liquid.
- a mold can be manufactured with high productivity.
- the mold manufacturing method according to the first embodiment of the present invention is not limited to the above-described mold 1 manufacturing method.
- the polishing body 26 may not be reciprocated along the axial direction of the aluminum base material 10.
- the polishing body 26 may be moved only once in the axial direction of the aluminum base 10 toward the second support member 20.
- the support member installed in the axial direction edge part side of an aluminum base material and the aluminum base material may be spaced apart.
- the first support member 18 and the aluminum substrate 10 may be separated from each other as long as the first support member 18 is in a range supported in contact with the outer peripheral surface 18a.
- the first support member 18 ⁇ / b> A that does not rotate independently of the rotating shaft 16 is closer to the polishing body 26 than the rotating shaft 16 on the first end 10 a side of the aluminum substrate 10. It may be a mode of installing. 10, parts that are the same as those in FIG. 3 are given the same reference numerals, and descriptions thereof will be omitted.
- the first support member 18 ⁇ / b> A has a curved surface similar to the outer peripheral surface 14 of the aluminum substrate 10 in the shape of the surface 18 b with which the polishing body 26 contacts, and protrudes from the first end 10 a of the aluminum substrate 10.
- the polishing body 26 is supported. That is, the shape obtained by cutting the surface 18b of the portion of the first support member 18A where the polishing body 26 is disposed in a direction perpendicular to the axial direction of the aluminum base 10 is substantially the same as the outer diameter of the aluminum base 10 or It has an arc shape that constitutes a part of a circumference with a diameter smaller than that. Further, since the first support member 18A is not rotated by the rotating shaft 16 and is fixed in position, the first support member 18A is not polished even if the polishing body 26 protruding from the aluminum base material 10 contacts.
- the outer shape of the portion where the polishing body 26 of the first support member 18A is disposed preferably has a shape that forms part of a cylindrical shape having an outer diameter of 0.97 times or more and 1 time or less of the outer diameter of the aluminum base 10.
- a shape constituting a part of a columnar shape having an outer diameter of 0.99 times or more and 1 time or less of the outer diameter of the aluminum substrate 10 is more preferable.
- the support member is installed on both end sides in the axial direction of the aluminum base, and at least a part of the polishing body is placed on both end sides. It does not limit to the aspect protruded from an aluminum base material.
- the support member is installed only on one end side in the axial direction of the aluminum base material, and at least a part of the polishing body is aluminum only on the end side. A method of moving the polishing body so as to protrude from the substrate may be used.
- the aluminum base material is compared with the case where the abrasive body does not protrude at all from the outer peripheral surface of the aluminum base material.
- the uniformity of the surface roughness of the outer peripheral surface is improved.
- the surface roughness of the outer peripheral surface of the aluminum base becomes more uniform, and the outer peripheral surface can be used more effectively.
- an aluminum substrate is used.
- a method may be used in which the polishing liquid is not supplied to the contact portion between the outer peripheral surface and the polishing body.
- the manufacturing method of 1st embodiment of this invention should just move an abrasive body relatively to an axial direction with respect to the outer peripheral surface of an aluminum base material, and the aspect which moves an abrasive body to an axial direction It is not limited to.
- the polishing body may move relative to the outer peripheral surface of the aluminum base material in the axial direction by moving the aluminum base material in the axial direction with the position of the polishing body fixed. .
- the manufacturing method of the first embodiment of the present invention may be a method of cleaning the outer peripheral surface of the aluminum base both in front and rear of the polishing body moved in the axial direction. It is good also as a method of washing
- the polishing liquid always adheres to the polished part of the aluminum base material behind the polishing body, whereas the polishing liquid does not necessarily adhere to the front part of the aluminum body before polishing. Further, even when the polishing liquid to be supplied to the contact portion with the polishing body on the outer peripheral surface of the aluminum base material accidentally adheres to the front of the polishing body, the portion to which the polishing liquid adheres is greatly separated from the contact portion.
- the manufacturing method of the 1st embodiment of this invention is good also as a method of not wash
- each cleaning means 39 has a pipe 39a for feeding a cleaning liquid and a nozzle 39b provided at the tip of the pipe 39a. Further, the position of each cleaning means 39 is fixed.
- the manufacturing method of the first embodiment of the present invention may be a method in which gas is not sprayed on both sides of the outer peripheral surface of the aluminum base material in the axial direction of the polishing body.
- the method for cleaning the outer peripheral surface of the aluminum substrate is not limited to the method for cleaning with the cleaning liquid.
- the method of cleaning the outer peripheral surface of the aluminum base material may be a method of removing the polishing liquid from the outer peripheral surface of the aluminum base material with a sponge or the like.
- the mold manufacturing method according to the second embodiment of the present invention is a mold manufacturing method in which an oxide film having a plurality of pores is formed on the outer peripheral surface of a cylindrical aluminum substrate.
- an example of the polishing apparatus used in the mold manufacturing method according to the second embodiment of the present invention will be described.
- the polishing apparatus 2 of the present embodiment includes a polishing body 26, a rubbing means 15, a polishing liquid supply means 30, a first cleaning means 31, and a second cleaning means. 33, a first gas ejection means 35, and a second gas ejection means 37.
- the polishing body 26 is the same as that described in the first embodiment.
- the polishing body 26 has a length L2 (FIG. 18) along the axial direction of the aluminum base material 10 shorter than an axial length L1 (FIG. 18) of the aluminum base material 10. Further, the polishing body 26 in this example has a strip shape, but the polishing body 26 is not limited to the strip shape.
- the rubbing means 15 is means for rubbing the aluminum substrate 10 and the polishing body 26. That is, it is a means for moving the abrasive bodies 26 so as to rub against each other in a state in which the abrasive body 26 is in contact with the outer peripheral surface 14 of the aluminum substrate 10.
- the rubbing means 15 in this example includes a rotary shaft 16 on which the aluminum base material 10 is installed, a shaft drive unit (not shown) that rotates the rotary shaft 16 about the axis, and a transport roll that transports the belt-shaped polishing body 26. 28 and a roll drive unit (not shown) for driving the transport roll 28.
- a rotary shaft 16 on which the aluminum base material 10 is installed By rotating the rotating shaft 16 around the axis by the shaft driving unit, the aluminum base material 10 is rotated around the axis. Further, by driving the transport roll 28 by the roll driving unit, the polishing body 26 is transported in the longitudinal direction while pressing the polishing body 26 against the outer peripheral surface 14 of the aluminum base material 10.
- the rotation direction of the aluminum base 10 and the direction in which the polishing body 26 is conveyed are opposite to each other So that they rub against each other.
- the rubbing means 15 is not limited to this mode.
- a rubbing means for rubbing the aluminum base material 10 and the polishing body 26 only by rotating the aluminum base material 10 around the axis without providing the transport roll and the roll driving unit, and transporting the polishing body 26. It is good.
- the polishing body 26 and the aluminum base 10 can be moved relative to each other in the axial direction of the aluminum base 10 by a moving means (not shown).
- the moving means includes the aluminum base 10 and the polishing body in a state where the polishing body 26 is pressed against the outer peripheral surface 14 of the aluminum base 10 from the first end 10a to the second end 10b of the aluminum base 10. 26 is relatively moved in the axial direction of the aluminum substrate 10. In this way, the entire outer peripheral surface 14 of the aluminum substrate 10 can be polished with the polishing body 26 by moving the polishing body 26 in the axial direction with respect to the aluminum base 10.
- the moving means may be a means for moving only the polishing body 26 and relatively moving the polishing body 26 and the aluminum base material 10 in the axial direction, and moving only the aluminum base material 10 to move the polishing body 26 and the aluminum base material.
- a means for moving the material 10 relative to the axial direction may be used, or both the polishing body 26 and the aluminum base material 10 may be moved to move the polishing body 26 and the aluminum base material 10 relative to each other in the axial direction. Good.
- the polishing liquid supply means 30 supplies the polishing liquid to the contact portion 27 of the outer peripheral surface 14 of the aluminum base 10 with the polishing body 26, that is, the portion of the outer peripheral surface 14 of the aluminum base 10 that contacts the polishing body 26.
- the polishing liquid supply means 30 has, for example, a pipe 30a for feeding the polishing liquid and a nozzle 30b provided at the tip of the pipe 30a.
- the polishing liquid supply means 30 is disposed so as to supply the polishing liquid to the contact portion 27 of the outer peripheral surface 14 of the aluminum base 10 with the polishing body 26, and follows the relative movement of the aluminum base 10 and the polishing body 26. And move relative.
- the polishing liquid supply means 30 is not limited to the above-described embodiment as long as the polishing liquid can be supplied to the contact portion 27 with the polishing body 26 on the outer peripheral surface 14 of the aluminum base 10.
- the first cleaning means 31 is means for cleaning the outer peripheral surface 14 of the aluminum base 10 and removing the polishing liquid behind the polishing body 26 moving in the axial direction. In the polishing apparatus 2, the first cleaning means 31 cleans the portion of the outer peripheral surface 14 of the aluminum base 10 through which the polishing body 26 has passed, that is, the portion where polishing has been completed, so that the polishing liquid is removed. Yes.
- the first cleaning means 31 is preferably a means for supplying the cleaning liquid to the outer peripheral surface 14 of the aluminum substrate 10 and removing the polishing liquid, as in this example, because the removal efficiency of the polishing liquid is high.
- the first cleaning means 31 has a pipe 31a for feeding a cleaning liquid and a nozzle 31b provided at the tip of the pipe 26a.
- the first cleaning means 31 is arranged so as to supply the cleaning liquid to the rear surface of the polishing body 26 moving in the axial direction on the outer peripheral surface 14 of the aluminum base 10. Further, the first cleaning means 31 follows the relative movement of the aluminum base 10 and the polishing body 26 and moves relative to the aluminum base 10 in the axial direction.
- the second cleaning means 33 is means for cleaning the outer peripheral surface 14 of the aluminum base 10 and removing the polishing liquid in front of the polishing body 26 moving in the axial direction.
- the second cleaning means 33 cleans the portion of the outer peripheral surface 14 of the aluminum base 10 before being polished by the polishing body 26, and removes the polishing liquid erroneously attached to this portion. It has become.
- the second cleaning means 33 is a means for supplying the cleaning liquid to the outer peripheral surface 14 of the aluminum substrate 10 and removing the polishing liquid as in this example. preferable.
- the second cleaning means 33 has a pipe 33a for feeding a cleaning liquid and a nozzle 33b provided at the tip of the pipe 33a.
- the second cleaning means 33 is arranged to supply the cleaning liquid to the front surface of the polishing body 26 moving in the axial direction on the outer peripheral surface 14 of the aluminum base 10. Further, the second cleaning means 33 is configured to relatively move in front of the polishing body 26 in the axial direction of the aluminum base 10 in accordance with the relative movement of the aluminum base 10 and the polishing body 26.
- the first gas ejection means 35 is disposed behind the polishing body 26 moving in the axial direction, and the cleaning liquid is supplied from the contact portion 27 of the outer peripheral surface 14 of the aluminum base 10 with the polishing body 26 and the first cleaning means 31. It is a means to eject gas between the supplied parts.
- gas is blown onto the outer peripheral surface 14 of the aluminum base material 10 behind the polishing body 26 that moves in the axial direction by the first gas ejection means 35, so that the contact between the aluminum base material 10 and the polishing body 26 is achieved.
- the polishing liquid supplied to the portion 27 is prevented from flowing out behind the contact portion 27.
- the first gas ejection means 35 in this example is between the contact portion 27 with the polishing body 26 on the outer peripheral surface 14 of the aluminum base 10 and the portion to which the cleaning liquid is supplied from the first cleaning means 31.
- the gas is blown like a curtain so as to divide.
- the second gas ejection means 37 is provided in front of the polishing body 26 moving in the axial direction, and the cleaning liquid from the contact portion 27 with the polishing body 26 on the outer peripheral surface 14 of the aluminum base 10 and the second cleaning means 33. It is a means to eject gas between the supplied parts.
- gas is blown onto the outer peripheral surface 14 of the aluminum base 10 in front of the polishing body 26 moving in the axial direction by the second gas ejection means 37, so that the contact between the aluminum base 10 and the polishing body 26 is achieved.
- the polishing liquid supplied to the portion 27 is prevented from flowing out in front of the contact portion 27.
- the second gas ejection means 37 in this example is similar to the first gas ejection means 35 in the outer peripheral surface 14 of the aluminum substrate 10, the contact portion 27 with the polishing body 26, and the second cleaning means.
- a gas is sprayed in a curtain shape so as to divide the portion from which the cleaning liquid is supplied from 33. Thereby, mixing of the cleaning liquid into the polishing liquid supplied to the contact portion 27 at the time of polishing is suppressed, and the change in the composition of the polishing liquid can be more stably suppressed.
- the polishing apparatus 2 the aluminum base material 10 to be polished is placed on the rotating shaft 16 of the rubbing means 15, and the rotating shaft 16 is rotated around the axis by the shaft driving unit. Thereby, the aluminum base material 10 is rotated around the axis. Further, the conveying roll 28 is driven by the roll driving unit of the rubbing means 15 to convey the polishing body 26 in its length direction. At this time, at the contact portion 27 between the outer peripheral surface 14 of the aluminum base 10 and the polishing body 26, the polishing body 26 is such that the rotation direction of the aluminum base 10 and the direction in which the polishing body 26 is conveyed are opposite to each other. Transport.
- polishing is started from the first end portion 10a of the aluminum base material 10, and the polishing body 26 is moved from the first end portion 10a of the aluminum base material 10 to the second end portion 10b by the moving means. It is relatively moved in the axial direction of the aluminum substrate 10. As a result, the entire outer peripheral surface 14 of the aluminum substrate 10 is polished by the polishing body 26.
- the first cleaning unit 31 cleans the portion of the outer peripheral surface 14 of the aluminum base 10 that has been polished, and removes the polishing liquid. Thereby, since the polishing liquid does not remain on the outer peripheral surface 14 of the aluminum base material 10 for a long time after polishing, the aluminum base material 10 is prevented from being altered by the polishing liquid. Further, the polishing liquid to be supplied to the contact portion 27 between the aluminum base material 10 and the polishing body 26 may accidentally adhere to the front side of the polishing body 26 on the outer peripheral surface 14 of the aluminum base material 10. However, in the polishing apparatus 2, the second cleaning means 33 cleans the front portion of the outer peripheral surface 14 of the aluminum base material 10 relative to the polishing body 26. The polishing liquid is removed. Therefore, the deterioration of the aluminum substrate 10 by the polishing liquid is more stably suppressed.
- gas is blown before and after the polishing body 26 on the outer peripheral surface 14 of the aluminum base 10 by the first gas ejection means 35 and the second gas ejection means 37.
- the polishing liquid on the outer peripheral surface of the cylindrical aluminum base material is cleaned and removed by the cleaning means, so that the polishing liquid does not remain on the outer peripheral surface of the aluminum base material for a long time. Therefore, it can suppress that the outer peripheral surface of an aluminum base material changes with this polishing liquid.
- the polishing apparatus used in the manufacturing method of the second embodiment of the present invention is not limited to the polishing apparatus 2 described above.
- the polishing apparatus used in the manufacturing method of the second embodiment of the present invention is an apparatus that does not have the second cleaning means 33 and does not clean the outer peripheral surface of the substrate in front of the polishing body that is moved in the axial direction. May be.
- the polishing liquid does not always adhere to the portion of the substrate before the polishing body before polishing. Further, even if the polishing liquid is mistakenly attached to the front of the polishing body, the portion to which the polishing liquid adheres is not largely separated from the contact portion, and the portion is polished in a relatively short time. .
- the adverse effect of alteration such as whitening due to the polishing liquid mistakenly attached to the front of the polishing body is less likely to occur than the adverse effect due to the polishing liquid remaining behind the polishing body, and the second cleaning means 33 is not provided. Also, the deterioration of the substrate can be sufficiently suppressed.
- the polishing apparatus used in the manufacturing method of the second embodiment of the present invention is not limited to an embodiment in which the first cleaning means 31 and the second cleaning means 32 move in the axial direction together with the polishing body 26.
- the polishing apparatus 3 illustrated in FIG. 19 may be used.
- the polishing apparatus 3 is within the range from the first end portion 10 a to the second end portion 10 b of the aluminum substrate 10 along the axial direction. This is the same mode as the polishing apparatus 2 except that the plurality of cleaning means 39 are arranged at equal intervals.
- Each cleaning means 39 has a pipe 39a for feeding a cleaning liquid and a nozzle 39b provided at the tip of the pipe 39a, and the position is fixed.
- cleaning liquid is sequentially supplied from the respective cleaning means 39 in accordance with the movement of the polishing body 26 in the axial direction, and cleaning is performed behind the polishing body 26 or in front of and behind the polishing body 26. Remove the polishing liquid.
- the polishing apparatus used in the manufacturing method of the second embodiment of the present invention may be an apparatus that does not have one or both of the first gas ejection means 35 and the second gas ejection means 37. Further, the polishing apparatus used in the manufacturing method of the second embodiment of the present invention is not limited to one having a cleaning means for supplying a cleaning liquid to the outer peripheral surface of the aluminum base material. For example, a polishing apparatus provided with a sponge or the like that wipes and removes the polishing liquid from the outer peripheral surface of the aluminum base may be used as the cleaning means.
- the polishing apparatus used in the manufacturing method of the second embodiment of the present invention may be a polishing apparatus that performs polishing by reciprocating a polishing body in the axial direction of a cylindrical aluminum substrate.
- a support member having a diameter substantially the same as that of the aluminum base material 10 is attached to the end portion in the central axis direction of the aluminum base material 10, and used in the manufacturing method of the first embodiment described above. be able to.
- a residual abrasive grain removing means for removing the aggregated abrasive grains remaining on the surface of the support member may be further provided.
- the mold manufacturing method of the present embodiment includes the following step (I) and step (II).
- step (I) As shown in FIG. 1 and FIG. 2, the outer peripheral surface of the aluminum substrate 10 by the polishing body 26 while relatively moving the polishing body 26 and the aluminum base material 10 rotating around the axis in the axial direction. 14 is polished.
- step (II) After step (I), an oxide film having a plurality of pores is formed on the outer peripheral surface 14 of the aluminum substrate 10 by anodic oxidation.
- Step (I) In the step (I) of this example, the aluminum base material 10 is rotated around the axis, and the polishing body 26 is pressed against the outer peripheral surface 14 of the aluminum base material 10 and rubbed while being rubbed from the first end portion 10a. The polishing body 26 is moved in the axial direction to the end 10b, and the entire outer peripheral surface 14 of the aluminum substrate 10 is polished. At this time, the polishing liquid for chemical mechanical polishing is supplied from the polishing liquid supply means 30 to the contact portion 27 of the outer peripheral surface 14 of the aluminum base 10 with the polishing body 26.
- the moving speed of the polishing body 26 along the axial direction of the aluminum substrate 10 may be constant or may be changed.
- an acidic CMP slurry is used when the outer peripheral surface 14 of the aluminum base material 10 is rough by machining, and an alkaline CMP slurry is used for a mirror finish. Is preferable.
- the cleaning liquid is supplied from the first cleaning means 31 to clean the outer peripheral surface 14 of the aluminum base 10 and the polishing liquid is removed.
- the cleaning of the outer peripheral surface 14 of the aluminum substrate 10 behind the polishing body 26 is performed for the same reason as in the case of cleaning the polishing liquid in the first embodiment. It is preferable to carry out immediately after 26 passes. That is, it is preferable to immediately wash the portion polished by the polishing body 26 on the outer peripheral surface 14 of the aluminum base 10 and remove the polishing liquid from the portion. Further, it is more preferable to move the polishing body 26 in the axial direction while continuously cleaning the outer peripheral surface 14 of the aluminum base material 10 behind the polishing body 26.
- the first cleaning means 31 follows immediately behind the polishing body 26 so that the cleaning liquid is continuously supplied to the portion of the outer peripheral surface 14 of the aluminum base 10 through which the polishing body 26 has passed, and cleaning is performed. It is preferable to carry out.
- the cleaning liquid is supplied from the second cleaning means 33 to clean the outer peripheral surface 14 of the aluminum substrate 10 and remove the polishing liquid even in front of the polishing body 26 moving in the axial direction.
- the outer peripheral surface 14 of the aluminum base 10 is altered by the polishing liquid that is mistakenly attached before polishing by the polishing body 26. It is suppressed.
- cleaning of the outer peripheral surface 14 of the aluminum base 10 in front of the polishing body 26 is performed as close as possible to the contact portion 27 between the aluminum base 10 and the polishing body 26. Is preferred. Thereby, it can suppress more stably that the part before grinding
- the polishing body 26 is moved in the axial direction while continuously cleaning the outer peripheral surface 14 of the aluminum base 10 in front of the polishing body 26. It is more preferable to let it go.
- the second cleaning means 33 moves in front of the polishing body 26 in the axial direction so that the cleaning liquid is continuously supplied to the front portion of the polishing body 26 on the outer peripheral surface 14 of the aluminum base 10. It is preferable to perform cleaning.
- the cleaning liquid include the same ones as those described in the first embodiment, and preferred embodiments are also the same.
- the outer periphery of the aluminum base material 10 is formed on both sides of the polishing body 26 by the first gas ejection means 35 and the second gas ejection means 37. Gas is blown onto the surface 14 to prevent the supplied polishing liquid from flowing out to a portion other than the contact portion 27. Moreover, by spraying gas in the shape of a curtain from the first gas ejection means 35 and the second gas ejection means 37 so as to divide the contact portion 27 and the other portion on the outer peripheral surface 14 of the aluminum base material 10. Further, the cleaning liquid can be prevented from entering the contact portion 27. Examples of the gas blown to both sides of the polishing body 26 on the outer peripheral surface 14 of the aluminum base material 10 include the same as those mentioned in the first embodiment, and the preferred embodiments are also the same.
- the polishing body 26 is moved from the first end 10a to the second end 10b of the aluminum base material 10 in the same manner as in the case of cleaning the polishing liquid in the first embodiment. This is particularly effective in a mode in which it is moved in one direction in the axial direction.
- the polishing body 26 may be reciprocated in the axial direction on the outer peripheral surface 14 of the aluminum substrate 10. In this case, the number of times the polishing body 26 is reciprocated may be appropriately set according to the target conditions such as surface roughness, and may be one time or may be two or more times.
- polishing in process (I) is not specifically limited.
- the rough polishing mentioned in the first embodiment, the final polishing, or both may be used.
- the acidic polishing liquid easily alters the aluminum base material
- the production method of the second embodiment of the present invention is particularly effective when performing rough polishing using an acidic polishing liquid.
- the outer peripheral surface 14 of the aluminum base material 10 after being polished in the step (I) is mirror-finished.
- polishing in the production method of the second embodiment of the present invention, for example, when rough polishing is performed with an acidic polishing liquid and then final polishing is performed with an alkaline polishing liquid, as long as the effects of the present invention are not impaired, In rough polishing, polishing may be performed while cleaning, and in final polishing, polishing may be performed without cleaning.
- Step (II) in the production method of the second embodiment of the present invention can be performed in the same manner as step (II) in the first embodiment.
- the manufacturing method of the 2nd embodiment of this invention is not limited to an above described manufacturing method.
- the manufacturing method according to the second embodiment of the present invention may be a method in which the outer peripheral surface of the aluminum base is not cleaned in front of the polishing body moved in the axial direction.
- the manufacturing method of the second embodiment of the present invention may be a method using the polishing apparatus 3. In this method, in accordance with the movement of the polishing body 26 in the axial direction, cleaning liquid is sequentially supplied from the respective cleaning means 39 to perform cleaning behind the polishing body 26 or in front of and behind the polishing body 26.
- the manufacturing method of the second embodiment of the present invention may be a method in which gas is not sprayed on both sides of the outer peripheral surface of the aluminum substrate in the axial direction of the polishing body.
- the method for cleaning the outer peripheral surface of the aluminum base is not limited to the method for cleaning with the cleaning liquid.
- the method of cleaning the outer peripheral surface of the aluminum substrate may be a method of removing the polishing liquid from the surface of the aluminum substrate with a sponge or the like.
- the polishing body may be moved in the axial direction with respect to the outer peripheral surface of the fixed aluminum base material, and the aluminum base material is fixed in a state where the position of the polishing body is fixed. You may move to the axial direction, and you may move both an aluminum base material and a grinding
- the manufacturing method of the nanoimprint reproduction mold of the present embodiment includes a polishing step and an oxide film forming step.
- the polishing step is a step of polishing the surface of a used nanoimprint mold (hereinafter also referred to as “used mold”).
- the used mold means that the mold is repeatedly used, so that the curable resin composition is deposited on the mold surface, the mold surface is scratched, or the fine uneven structure is deformed.
- the used mold is obtained by forming an oxide film having a plurality of pores on the surface of an aluminum substrate, that is, an oxide film having a fine concavo-convex structure having a period equal to or shorter than the wavelength of visible light.
- the shape of the used mold is not particularly limited, and examples thereof include a columnar shape (including a circular tube (cylindrical shape)), a flat plate shape, and a sheet shape.
- polishing is performed until at least the oxide film is removed. If the used mold surface is scratched, the surface is polished until the scratch is removed. When the oxide film and scratches are removed by polishing, the state returns to the state of the aluminum substrate used as the material of the used mold.
- the method for polishing the surface of a used mold is not particularly limited as long as an oxide film and scratches can be removed, but mechanical polishing is preferable. In particular, it is preferable to mechanically polish the surface of the used mold a plurality of times so that the polishing rate is lowered stepwise. When the surface of a used mold is polished a plurality of times, the oxide film and scratches are removed by polishing at a high polishing rate, and the polishing surface is finished by polishing at a low polishing rate.
- polishing is performed so that the polishing rate is lowered stepwise, an aluminum substrate with a polished mirror surface can be obtained as compared with the case where the surface of the used mold is polished only by polishing with a high polishing rate. In addition, even if the surface of the used mold is polished only by polishing at a low polishing rate, an aluminum substrate having a polished mirror surface can be obtained, but it takes time to polish. If the polishing is performed so that the polishing rate is lowered stepwise, an aluminum substrate having a polished surface with a mirror finish can be obtained in a short time.
- a polishing method having a high polishing rate includes fixed abrasive polishing such as tape polishing. Further, when polishing with a high polishing rate is performed by loose abrasive polishing such as chemical mechanical polishing (CMP polishing), abrasive particles having a large average particle diameter may be used. Specifically, it is preferable to use abrasive grains having an average particle diameter of 0.5 ⁇ m or more, more preferably 1 ⁇ m or more, and further preferably 3 ⁇ m or more. As the abrasive, Al 2 O 3 or the like is suitable.
- the average particle diameter of the abrasive grains can be measured by using a slurry in which the abrasive grains are dispersed in a solvent such as water, using a dynamic light scattering particle size distribution measuring device or a laser diffraction particle size distribution measuring device. Further, the abrasive grains can be directly observed and measured with an electron microscope such as SEM or TEM.
- polishing method having a low polishing rate free abrasive polishing such as CMP polishing can be mentioned.
- the abrasive grains having a smaller average particle diameter are used, the polishing rate tends to be lower.
- SiO 2 or the like is suitable.
- the used mold surface is polished by a polishing method having a high polishing rate and then polished by a polishing method having a low polishing rate.
- a polishing method having a high polishing rate it is preferable to perform CMP polishing as a polishing method with a low polishing rate.
- the CMP polishing here is preferably performed twice or more by changing the abrasive grains.
- fixed abrasive polishing is “pretreatment polishing”
- first CMP polishing is “rough polishing”
- second and subsequent CMP polishing is “ It is also called “finish polishing”.
- both the polishing method with a high polishing rate and the polishing method with a low polishing rate are performed by CMP polishing
- at least two CMP polishings are performed in the polishing step.
- the first CMP polishing is referred to as “pretreatment polishing”
- the second This CMP polishing is also referred to as “rough polishing”
- the third and subsequent CMP polishings are also referred to as “finish polishing”.
- a method for polishing the surface of a used mold by fixed abrasive polishing or CMP polishing is not particularly limited, and a known method can be adopted. Moreover, a well-known polishing apparatus can also be used.
- a method of polishing the surface of the used mold by CMP polishing in the case of a used mold having a columnar aluminum substrate, step (I) of the first embodiment and the second embodiment described above. Alternatively, a method such as step (I ′) can be used.
- a longitudinal section or surface of an aluminum substrate obtained by polishing the surface of a used mold is platinum-deposited for 1 minute, and the section or surface is observed using a field emission scanning electron microscope, and an oxide film or scratches are observed. Check if there is any.
- polishing process may be performed by methods (other processing methods) other than mechanical polishing, and you may use together mechanical polishing and another processing method.
- other processing methods other than mechanical polishing, and you may use together mechanical polishing and another processing method.
- a work-affected layer is formed on the surface, or traces of machining such as cutting streaks remain. Therefore, it is necessary to remove the work-affected layer and traces of machining, but it takes time and effort to anodize, leading to an increase in cost. Therefore, machining is not performed in the present invention.
- Other suitable processing methods are etching, electrolytic polishing, chemical polishing, and the like.
- the order thereof is not limited, but it is preferable to mechanically polish the surface of the mold that has been used in other processing methods after some treatment. If mechanical polishing is performed after other treatment methods, the surface of the aluminum substrate after the polishing step is obtained in a more mirror-finished state. However, considering the removal time and workability, the polishing step is preferably performed only by mechanical polishing.
- the oxide film forming step can be performed in the same manner as the step (II) of the first embodiment.
- the oxide film and scratches are not removed by machining such as cutting, but are removed by polishing. There is no possibility that traces of processing are formed on the surface of the aluminum substrate. Therefore, since the trouble of removing the work-affected layer and the trace of machining can be saved, the cost can be reduced. In addition, since the work-affected layer is not formed on the surface of the aluminum substrate, an anodized film having pores uniformly distributed can be re-formed when anodized.
- a used mold can be reused to form an oxide film in which pores are uniformly distributed, and an article having a low haze can be obtained.
- a remanufacturing mold for nanoimprinting can be manufactured at low cost.
- the polishing step may include an oxide film removal treatment and a resin removal step described below.
- the oxide film removal process is a process of chemically removing the oxide film on the surface of the used mold in the polishing process.
- the oxide film formed on the surface of the mold often has a higher hardness than the aluminum material used for the mold substrate.
- the processing time may become long. Therefore, if the oxide film is chemically removed in advance, the polishing time for removing the oxide film in the polishing process can be shortened.
- the aluminum substrate is chemically mechanically polished after the oxide film is chemically removed in the polishing step.
- a method of chemically removing the oxide film a method of dissolving and removing the oxide film using a solution that hardly dissolves the aluminum base material of the mold and selectively dissolves only the oxide film is preferable.
- a solution a mixed solution of chromic acid and phosphoric acid is preferable.
- the mold is usually manufactured by anodizing an aluminum base material in a state where a surface alteration layer generated by mirroring and cutting is removed. Therefore, if the oxide film on the surface of the used mold is removed, the oxide film having a fine concavo-convex structure can be re-formed by anodizing the surface after removal.
- the oxide film is chemically removed, the surface of the mold after removal (that is, the surface of the aluminum substrate) is slightly dissolved, and the surface state is deteriorated. Further, when the surface of the used mold is scratched, the scratch cannot be sufficiently removed in the oxide film removing step. Therefore, after the oxide film removing step, the above-described polishing step is performed.
- the polishing step after the oxide film removal step By performing the polishing step after the oxide film removal step, if an oxide film that could not be removed in the oxide film removal step remains, the oxide film can be removed in the polishing step. Further, when the surface of the used mold is scratched, the scratch can be removed. Furthermore, when the surface state of the mold after the oxide film removing step is deteriorated, the surface can be smoothed.
- the oxide film is harder than the aluminum material used for the aluminum substrate. Therefore, the outer peripheral surface of a columnar aluminum base material having an oxide film formed on the surface is polished by a polishing body having an axial length shorter than that of the aluminum base material while moving the polishing body in the axial direction. In many cases, longer polishing is required. That is, the contact time between the acidic or alkaline polishing liquid used for polishing and the mold tends to be long. For this reason, the present inventors have found that when an oxide film is removed by polishing from a mold having an oxide film formed on the surface, the aluminum substrate tends to deteriorate and whitening tends to occur.
- the whitened portion of the aluminum substrate is less likely to be polished by polishing than the other portions. For this reason, once whitening occurs on the outer peripheral surface of the aluminum base, it takes a long time to remove the whitened portion and make it mirror-finished. As a result, in addition to the time required to remove the hard oxide film, it takes a long time to remove the whitened portion, which requires a very long time for the production of the reclaimed mold.
- the time for removing the hard oxide film by polishing is shortened by polishing the surface of the aluminum substrate by chemical mechanical polishing after performing the method of chemically removing the oxide film. Therefore, it is possible to suppress the occurrence of alteration such as a whitening phenomenon due to the polishing liquid on the outer peripheral surface of the polished aluminum base material. As a result, it is possible to produce a nanoimprint reproduction mold with high productivity.
- the resin removal step is a step of removing a resin (photo-curing resin or the like) attached (deposited) on the surface of a used mold before the oxide film removal step.
- a resin photo-curing resin or the like
- the resin cannot be sufficiently removed in the oxide film removing step.
- the resin may interfere with chemical removal of the oxide film in the oxide film removal step. If the resin is removed in advance, the oxide film can be removed easily and in a short time in the oxide film removal step.
- a method of removing the resin a method of washing and removing the resin using a solution that hardly dissolves the aluminum base material of the mold and selectively dissolves only the resin is preferable.
- Such a solution is determined according to the type of resin, and examples thereof include solvents such as acetone and ethanol.
- the resin attached to the surface of the used mold may be removed before the polishing step.
- the resin can be removed also in the polishing step, if the resin is removed in advance, the polishing time for removing the oxide film in the polishing step can be shortened.
- Example 1 As shown in FIGS. 1 to 4, the first support member 18 and the second support member 20 are installed on the first end portion 10a side and the second end portion 10b side of the cylindrical aluminum base material 10, respectively. Then, the entire outer peripheral surface 14 of the aluminum substrate 10 was polished by the polishing means 12.
- the aluminum base material 10 a cylindrical aluminum base material having an aluminum purity of 99.99% and an axial length L1 of 700 mm was used.
- the polishing body 26 a polishing pad (polyester nonwoven fabric, foamed polyurethane suede) having a length L2 of 100 mm along the axial direction of the aluminum substrate 10 was used.
- first support member 18 and the second support member 20 cylindrical sleeves made of the same material as the aluminum substrate 10 and having a length along the axial direction of the aluminum substrate 10 of 100 mm were used.
- the outer diameter D of the aluminum substrate 10, the outer diameter d1 of the first support member 18, and the outer diameter d2 of the second support member 20 were the same.
- As the polishing slurry a slurry containing SiO 2 particles having an average particle diameter of 0.1 ⁇ m was used.
- the polishing body 26 was reciprocated at a moving speed of 20 cm / min along the axial direction to polish the entire outer peripheral surface 14 of the aluminum substrate 10.
- polishing body 26 passed in the outer peripheral surface 14 of the aluminum base material 10, it grind
- a photocurable resin was applied on the outer peripheral surface 14 of the aluminum base material 10, and a cured resin layer was formed by irradiating with ultraviolet rays to produce a mold replica.
- a photocurable resin composition the thing of the composition of following Table 1 was used.
- Example 1 The first support member 18 and the second support member 20 are not installed, and polishing is performed so that the polishing body 26 does not protrude from the first end portion 10a to the second end portion 10b of the aluminum base 10. Except that, polishing was performed in the same manner as in Example 1 to produce a mold replica.
- the measurement results of the surface roughness in Example 1 and Comparative Example 1 are shown in FIG.
- Example 1 where the polishing was performed so that a part of the polishing body 26 protruded from the first end 10 a side and the second end 10 b side of the aluminum base material 10, the polishing body 26 was used. Compared with the comparative example 1 which grind
- Example 2 As shown in FIGS. 17 and 18, the abrasive body 26 is moved in one axial direction from the first end portion 10a to the second end portion 10b of the columnar aluminum base material 10, and the aluminum base material is moved. The entire 10 outer peripheral surfaces 14 were roughly polished until the arithmetic average roughness Ra reached 20 nm.
- the aluminum base material a cylindrical aluminum base material having an aluminum purity of 99.99% and an axial length L1 of 700 mm was used.
- the polishing body 26 a polyester non-woven polishing pad having a length L2 along the axial direction of the aluminum base 10 of 100 mm was used.
- polishing liquid an acidic slurry having a pH of 2 to 6 and containing Al 2 O 3 particles having an average particle diameter of 1 ⁇ m was used.
- the moving speed along the axial direction of the polishing body 26 was 20 cm / min, and the outer peripheral surface 14 of the aluminum base 10 was cleaned with a cleaning liquid in front and rear of the polishing body 26. Pure water was used as the cleaning liquid. No gas was blown before and after the polishing body 26 in the axial direction.
- a mirror surface having an arithmetic average roughness Ra of 5 nm is obtained in the same manner as the above-described rough polishing except that a slurry having a pH of 8 to 14 containing SiO 2 particles having an average particle diameter of 0.1 ⁇ m is used as the polishing liquid. Finished polishing until. The total time required for rough polishing and finish polishing was 100 minutes.
- Example 2 Rough polishing and finish polishing were performed in the same manner as in Example 2 except that the outer peripheral surface 14 of the aluminum base material 10 was not washed in front of and behind the polishing body 26. A whitening phenomenon was observed on the outer peripheral surface 14 of the aluminum substrate 10 after the rough polishing, and a total of 170 minutes was required for the rough polishing and the final polishing.
- Example 3 After continuously producing articles having fine irregularities on the surface, a mold on which an aluminum base oxide film having an aluminum purity of 99.9% was formed was prepared by using 6% by mass phosphoric acid and 1.8% by mass. The oxide film was dissolved and removed by dipping in a 70 ° C. aqueous solution mixed with% chromic acid. Thereafter, the surface of the aluminum base material was roughly polished by the same method as in Example 2 until the arithmetic surface roughness became 30 nm. The time required for rough polishing was 35 minutes.
- Step (f) The step (d) and the step (e) were repeated alternately three times, and then the step (d) was finally performed. That is, the process (e) was performed 4 times in total, and the process (d) was performed 5 times in total.
- the oxide film is washed with deionized water, and water on the surface is further removed by air blow, and a columnar oxide film having substantially conical pores with an average interval of 100 nm and an average depth of about 200 nm is formed.
- a recycled mold for nanoimprinting was obtained.
- Example 4 After continuously producing an article having fine irregularities on the surface, it was not immersed in a 70 ° C. aqueous solution in which 6% by mass of phosphoric acid and 1.8% by mass of chromic acid were mixed. The aluminum substrate was roughly polished until the arithmetic average roughness reached 30 nm by the above method. The time required for rough polishing was 70 minutes.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
本願は、2013年8月14日に日本に出願された特願2013-168538号、特願2013-168537号、特願2013-168540号、および2014年1月30日に日本に出願された特願2014-015864号、特願2014-016042号に基づき優先権を主張し、その内容をここに援用する。
円柱状のアルミニウム基材の外周面に、複数の細孔を有する酸化皮膜(陽極酸化ポーラスアルミナ)を形成した円柱状ナノインプリント用モールドを用いて、物品の表面に微細凹凸構造を転写する方法。
該方法は、少ない工程で簡便に物品の表面に微細凹凸構造を付与できるため、工業生産に適している。
アルミニウム基材の表面を研磨した後に、該アルミニウム基材の表面を陽極酸化する方法(特許文献1)。
陽極酸化を行う前にアルミニウム基材の表面を研磨し、鏡面状態になるまで表面粗さを低く均一化することで、酸化皮膜にムラが生じることを抑制できる。その結果、より精度の高い微細凹凸構造を物品に付与することが可能となる。
図11に示すように、回転軸110に設置した円柱状のアルミニウム基材112を軸周りに回転させ、そのアルミニウム基材112の外周面114に研磨体116を押し当てて擦りつつ、アルミニウム基材112における軸方向の第1の端部112aから第2の端部112bまでの範囲で研磨体116を往復させる方法。
しかし、このようにアルミニウム基材112の外周面114を部分的に利用する方法は、生産効率の面で不利である。
また、本発明の第1実施態様に基づく円柱状ナノインプリント用モールドの製造方法では、前記支持部材の前記研磨体が配置される部分が、前記アルミニウム基材と同じ材質からなることが好ましい。
また、本発明の第1実施態様に基づく円柱状ナノインプリント用モールドの製造方法では、前記工程(I)と前記工程(II)との間に、前記研磨体が前記アルミニウム基材からはみ出さないように前記研磨体を軸方向に相対的に移動させて研磨する工程(I’)をさらに有することが好ましい。
また、本発明の第1実施態様に基づく円柱状ナノインプリント用モールドの製造方法では、前記工程(I)において、前記アルミニウム基材の外周面に砥粒を供給しつつ前記研磨体で研磨し、かつ前記支持部材の表面上に残留した残留砥粒を除去することが好ましい。
また、本発明の第1実施態様に基づく円柱状ナノインプリント用モールドの製造方法では、前記工程(I)において、前記アルミニウム基材の外周面における前記研磨体との接触部分に、化学機械研磨用の研磨液を供給し、かつ軸方向に移動する前記研磨体の後方で、前記アルミニウム基材の外周面を洗浄して前記研磨液を除去することが好ましい。
また、本発明の第1実施態様に基づく円柱状ナノインプリント用モールドの製造方法では、前記研磨体を、前記アルミニウム基材の軸方向の第1の端部から第2の端部まで一方向に移動させることが好ましい。
また、本発明の第1実施態様に基づく円柱状ナノインプリント用モールドの製造方法では、さらに、軸方向に移動する前記研磨体の前方でも前記アルミニウム基材の外周面を洗浄して前記研磨液を除去することが好ましい。
また、本発明の第1実施態様に基づく円柱状ナノインプリント用モールドの製造方法では、前記研磨体の軸方向の両側で前記アルミニウム基材の外周面にガスを吹き付けることが好ましい。
また、本発明の第2実施態様に基づく円柱状ナノインプリント用モールドの製造方法では、さらに、軸方向に移動する前記研磨体の前方でも前記アルミニウム基材の外周面を洗浄して前記研磨液を除去することが好ましい。
また、本発明の第2実施態様に基づく円柱状ナノインプリント用モールドの製造方法では、前記研磨体の軸方向の両側で前記アルミニウム基材の外周面にガスを吹き付けることが好ましい。
そこで、機械加工の痕跡や加工変質層が形成されないように使用済みモールドの酸化皮膜や傷を除去すれば、機械加工の痕跡や加工変質層を除去する手間が省け、しかも陽極酸化することで細孔が均一に分布した酸化皮膜が再形成されるとの着想に基づき、本発明を完成するに至った。
また、本発明に基づくナノインプリント用再生モールドの製造方法では、クロム酸およびリン酸の混合溶液を用いて前記酸化皮膜を化学的に除去することが好ましい。
また、本発明に基づくナノインプリント用再生モールドの製造方法では、前記研磨工程の前に、複数の細孔を表面に有するナノインプリント用モールドの表面に付着した樹脂を除去する樹脂除去工程を有することが好ましい。
また、本発明に基づくナノインプリント用再生モールドの製造方法では、前記研磨工程において、酸化皮膜を化学的に除去した後に、前記アルミニウム基材を化学機械研磨することが好ましい。
また、本発明に基づくナノインプリント用再生モールドの製造方法では、前記支持部材の前記研磨体が配置される部分の外形は、前記アルミニウム基材の外径の0.97倍以上1倍以下の外径の円柱状の少なくとも一部を構成する形状であることが好ましい。
また、本発明に基づくナノインプリント用再生モールドの製造方法では、前記研磨工程は、前記工程(I)の後に、前記研磨体が前記アルミニウム基材からはみ出さないように前記研磨体を軸方向に相対的に移動させて研磨する工程(I’)をさらに有することが好ましい。
また、本発明に基づくナノインプリント用再生モールドの製造方法では、前記工程(I)において、前記アルミニウム基材の外周面における前記研磨体との接触部分に、化学機械研磨用の研磨液を供給し、かつ軸方向に移動する前記研磨体の後方で、前記アルミニウム基材の外周面を洗浄して前記研磨液を除去することが好ましい。
また、本発明に基づくナノインプリント用再生モールドの製造方法では、前記研磨体を、前記アルミニウム基材の軸方向の第1の端部から第2の端部まで一方向に移動させることが好ましい。
また、本発明に基づくナノインプリント用再生モールドの製造方法では、さらに、軸方向に移動する前記研磨体の前方でも前記アルミニウム基材の外周面を洗浄して前記研磨液を除去することが好ましい。
また、本発明に基づくナノインプリント用再生モールドの製造方法では、前記研磨体の軸方向の両側で前記アルミニウム基材の外周面にガスを吹き付けることが好ましい。
また、本発明の円柱状ナノインプリント用モールドの製造方法によれば、酸性のCMPスラリーを用いた1次CMP研磨後における白化等のアルミニウム基材の外周面の変質を抑制でき、高い生産性でナノインプリント用モールドを製造できる。
また、本発明のナノインプリント用再生モールドの製造方法によれば、使用済みのモールドを再利用して、低コストでナノインプリント用再生モールドを製造できる。
「細孔の間隔」とは、隣接する細孔同士の中心間距離を意味する。
「円柱状」とは、全体として円柱形状であることを意味し、円筒形状などの中空円柱形状や、複数の貫通孔が形成されているような形状も円柱状に含むものとする。
「突起」とは、成形体の表面に形成された微細凹凸構造の凸部のことをいう。
「微細凹凸構造」は、凸部または凹部の平均間隔が10~400nmである構造を意味する。
「機械研磨」とは物理的に加工表面を研磨して鏡面化することである。本発明において、物理的な研磨には「テープ研磨」「化学機械研磨(CMP研磨)」も含まれる。
「研磨レート」とは、単位時間当たりの研磨量のことである。
「表面を仕上げる」とは、アルミニウム基材の表面の算術平均粗さが15nm以下となるまで、鏡面化することである。
(第1実施態様)
本発明の第1実施態様の円柱状ナノインプリント用モールド(以下、単に「モールド」という。)の製造方法は、円柱状のアルミニウム基材の外周面に、複数の細孔を有する酸化皮膜が形成されたモールドの製造方法である。
以下、本発明の第1実施態様のモールドの製造方法の一例を示して説明する。本実施形態のモールドの製造方法は、下記の工程(I)および工程(II)を有する。
(I)図1および図2に示すように、円柱状のアルミニウム基材10の軸方向の長さL1よりも該軸方向に沿った長さL2が短い研磨体26と、中心軸回りに回転するアルミニウム基材10とを相対的に移動させながら、研磨体26でアルミニウム基材10の外周面14を擦って、アルミニウム基材10の外周面14の全体を研磨する。
(II)工程(I)の後に、陽極酸化によってアルミニウム基材10の外周面14に、複数の細孔を有する酸化皮膜を形成する。
(I’)工程(I)と工程(II)との間に、研磨体26がアルミニウム基材10からはみ出さないように研磨体26を軸方向に相対的に移動させて研磨する。
この例の工程(I)では、円柱状のアルミニウム基材10を回転軸16に設置する。また、回転軸16におけるアルミニウム基材10の軸方向の第1の端部10a側に第1の支持部材18を設置し、さらに回転軸16におけるアルミニウム基材10の軸方向の第2の端部10b側に第2の支持部材20を設置する。第1の支持部材18は、アルミニウム基材10の第1の端部10aに隣接させる。第2の支持部材20は、アルミニウム基材10の第2の端部10bに隣接させる。
また、回転軸16における第1の支持部材18と第2の支持部材20のさらに外側には、それぞれ円盤状のストッパー22,24が設置される。
また、第1の支持部材18の外径d1(図2)および第2の支持部材20の外径d2(図2)は、アルミニウム基材10の外径D(図2)と同じになっている。これにより、後述のように第1の端部10a側と第2の端部10b側で研磨体26をはみ出させた際に、研磨体26におけるそのはみ出した部分の少なくとも一部が、第1の支持部材18および第2の支持部材20上に配置され、それらによって支持される。
このように、この例の第1の支持部材18における研磨体26が配置される部分の表面である外周面18aを軸方向に対して垂直方向に切断した形状は、アルミニウム基材10の外径Dと同一の直径の円周の全部を構成する円状になっている。同様に、この例の第2の支持部材20における研磨体26が配置される部分の表面である外周面20aを軸方向に対して垂直方向に切断した形状は、アルミニウム基材10の外径Dと同一の直径の円周の全部を構成する円状になっている。
研磨体26は、アルミニウム基材10の軸方向に沿った長さL2(図2)が、アルミニウム基材10の軸方向の長さL1(図2)よりも短くなっている。
研磨体26は、アルミニウム基材の表面を所望の状態まで研磨できるものであればよく、例えば、不織布タイプ、スウェードタイプの研磨パッド等が挙げられる。また、研磨体26としては、SiC粉末を耐久紙に埋め込んだ研磨紙、ダイヤモンド粉末を金属に埋め込んだ研磨盤等を用いてもよい。
この例では、アルミニウム基材10の外周面14と研磨体26とが接触する部分において、アルミニウム基材10の回転方向と、研磨体26が搬送される方向とが逆方向となるように、研磨体26が搬送ロール28によって搬送されるようになっている。
研磨液としては、例えば、SiC、Al2O3、SiO2、ZrO2等の砥粒を含むスラリー、アルミニウムを腐食させる効果を有する酸性またはアルカリ性の溶液に砥粒が分散された化学機械研磨(CMP)用の研磨液(CMPスラリー)等が挙げられる。なかでも、アルミニウム基材10の外周面14が機械加工によって粗い表面状態の場合には酸性のCMPスラリー、鏡面に仕上げる場合にはアルカリ性のCMPスラリーがそれぞれ研磨効率の点で好ましい。
ここで、研磨体26におけるアルミニウム基材10の第1の端部10aからはみ出した部分は、第1の支持部材18の外周面18a上に配置されることで、第1の支持部材18の外周面18aに接する。この例では、第1の支持部材18はアルミニウム基材10と共に軸周りに回転する。そのため、研磨体26におけるアルミニウム基材10からはみ出した部分が押し当てられて擦られることで、第1の支持部材18の外周面18aもアルミニウム基材10の外周面14と共に研磨される。
ここで、研磨体26におけるアルミニウム基材10の第2の端部10bからはみ出した部分は、第2の支持部材20の外周面20a上に配置されることで、第2の支持部材20の外周面20aに接する。この例では、第2の支持部材20もアルミニウム基材10と共に軸周りに回転しているため、第2の支持部材20の外周面20aも研磨体26によって研磨される。
L3/L2の上限値は1である。L3/L2が1であるとは、アルミニウム基材10の第1の端部10a側において、研磨体26が完全に第1の支持部材18側にはみ出すことを意味する。L3/L2が1であれば、アルミニウム基材10の第1の端部10a近傍と中央部分とで研磨時間の差をなくすことができるため、外周面14の表面粗さがより均一になる。
このことから、第1の支持部材18を継続使用する場合では、L3/L2は、0.9以下が好ましく、0.8以下がより好ましい。これにより、アルミニウム基材10の第1の端部10a側で一部をはみ出させた研磨体26を、よりスムーズに安定して引き返させることができるようになる。
L4/L2の上限値は1である。L4/L2が1であるとは、アルミニウム基材10の第2の端部10b側において、研磨体26が完全に第2の支持部材20側にはみ出すことを意味する。L4/L2が1であれば、アルミニウム基材10の第2の端部10b近傍と中央部分とで研磨時間の差をなくすことができるため、外周面14の表面粗さがより均一になる。
アルミニウムにマグネシウムを添加する場合、マグネシウムの添加量は、アルミニウム基材10の総質量に対して0.05~3質量%が好ましい。
これにより、第1の支持部材18からアルミニウム基材10よりも硬い削り屑が生じることを抑制できる。そのため、アルミニウム基材10よりも硬い削り屑が研磨体26とアルミニウム基材10の外周面14との間に入り込んで、外周面14に傷が付くことを容易に抑制できる。
また、第1の支持部材18の材質がアルミニウム基材10の材質と同じであれば、化学機械研磨(CMP)を行う場合でも第1の支持部材18とアルミニウム基材10の腐食性が同程度になる。これにより、化学機械研磨の際に第1の支持部材18とアルミニウム基材10が同程度に研磨され、段差が生じ難くなる。そのため、アルミニウム基材10の第1の端部10a近傍を軸方向の中央部分と同程度に研磨することが容易になる。
なお、第1の支持部材18および第2の支持部材20における研磨体26が配置される部分と、アルミニウム基材10との材質は、完全に同一である必要はなく、硬さや研磨のされ具合が極端に異ならない程度に同じであればよい。第1の支持部材18と第2の支持部材20とは、少なくともその表面の純度が99.5質量%以上のアルミニウムで形成されることが好ましく、純度が99.9質量%以上のアルミニウムで形成されることがより好ましい。また、0.05質量%~3質量%のマグネシウムが添加されていてもよい。
このことから、第1の支持部材18の外径d1がアルミニウム基材10の外径Dよりも小さい場合、第1の支持部材18の外径d1はアルミニウム基材10の外径Dにできるだけ近いことが好ましい。また、第1の支持部材18の外径d1は、アルミニウム基材10の外径Dと同等以下であることがより好ましい。
具体的には、第2の支持部材20の外径d2がアルミニウム基材10の外径Dよりも小さい場合、第2の支持部材20の外径d2はアルミニウム基材10の外径Dにできるだけ近いことが好ましい。また、第2の支持部材20の外径d2は、アルミニウム基材10の外径Dと同等以下であることがより好ましい。また、第2の支持部材20の外径d2がアルミニウム基材10の外径Dよりも大きい場合も、第2の支持部材20の外径d2はアルミニウム基材10の外径Dにできるだけ近いことが好ましい。
また、アルミニウム基材10の外径Dに対する第2の支持部材20の外径d2の比(d2/D)は、0.97~1が好ましく、0.99~1がより好ましい。
また、ストッパー22,24の大きさも、アルミニウム基材10、第1の支持部材18および第2の支持部材20よりも大きいものには限定されず、アルミニウム基材10の両側に第1の支持部材18と第2の支持部材20を設置した状態を保持できる範囲であればよい。
また、ストッパー22,24の材質は、腐食性のある研磨液に耐食性を持つものが好ましく、例えば、ステンレス;ポリ塩化ビニル(PVC)、ポリプロピレン(PP)等の樹脂等が挙げられる。
また、工程(I)では、アルミニウム基材10の外周面14における研磨体26が通過した部分において、付着した研磨液を洗浄除去しつつ研磨を行ってもよい。これにより、アルミニウム基材10の外周面14における研磨した部分で、研磨液によって腐食が生じる等の不具合が生じることを容易に抑制できる。
工程(I)で研磨した後のアルミニウム基材10の外周面14は、鏡面化されていることが好ましい。
図5に示すように、アルミニウム基材10の外径Dが第1の支持部材18の外径d1より大きいと、研磨体26が第1の端部10aまたは第2の端部10bをオーバーランした際に、第1の支持部材18とアルミニウム基材10の段差部分で第1の支持部材18と研磨体26が離間して隙間40が発生する。隙間40では、研磨中に研磨液の砥粒分が残留し続け、残留砥粒同士が凝集して通常の砥粒より遥かに大きい凝集砥粒となる場合がある。また、該凝集砥粒は、オーバーランして第1の支持部材18と接触した研磨体26がアルミニウム基材10上に戻る際に、研磨体26に巻き込まれてアルミニウム基材10上に持ち込まれることがある。凝集砥粒がアルミニウム基材10上に持ち込まれると、該凝集砥粒によってアルミニウム基材10の外周面14に研磨傷が発生してしまう場合がある。
水による洗浄については、使用する研磨液によっては第1の支持部材18表面の研磨液の濃度変化により砥粒分の凝集が促進される可能性もあるため、使用する研磨液によって最適な手段を選定することが好ましい。
工程(I)にてアルミニウム基材10の外周面14の全面を均一に研磨した後に、外周面14に微細な研磨傷(スクラッチ)が残っている場合には、該研磨傷を無くして良好な外周面にするための追加研磨を行う必要がある。この場合は、工程(I)から、アルミニウム基材10からはみ出さないように研磨体26を軸方向に移動させて研磨を行う工程(I’)に切り替えることが好ましい。
なお、工程(I)でアルミニウム基材10の外周面14の全面を鏡面に研磨した状態で、外周面14に微細な研磨傷が発生してなければ工程(I’)を行う必要はない。
工程(I’)では、研磨体26の、アルミニウム基材10の軸方向に沿った往復移動の範囲が変わった以外は、工程(I)と同様の条件で研磨を行える。
工程(I)において、研磨液として酸性やアルカリ性のCMPスラリーを用いる場合、該CMPスラリーがアルミニウム基材10の外周面14に長時間滞在すると、アルミニウム基材10の外周面14が変質して白化してしまい、研磨が進みにくくなってしまう現象が発生する場合がある。このような場合は、アルミニウム基材10の外周面14のうち、研磨が行われていない部分に存在する研磨液を除去することが好ましい。工程(I’)においても、CMPスラリーを用いる場合は同様に研磨液を除去することが好ましい。具体的には、軸方向に移動する研磨体の後方、または該研磨体の後方および前方の両方で洗浄により研磨液を除去することが好ましい。
アルミニウム基材10の外周面14における研磨が終了した部分に付着している研磨液が、洗浄液によって洗浄されて除去されることで、アルミニウム基材10の外周面14には研磨後に研磨液が長時間にわたって残存しなくなる。そのため、アルミニウム基材10の外周面14が研磨液によって変質されることが抑制される。
研磨体26の前方でもアルミニウム基材10の外周面14を洗浄することで、研磨体26による研磨の前に誤って付着した研磨液によってアルミニウム基材10の外周面14が変質することが抑制される。
具体的には、研磨体を一方向に移動させてアルミニウム基材の外周面全体を研磨する態様は、研磨体を軸方向に往復させて研磨を行う態様に比べて、同程度の研磨を行うには研磨体の軸方向の移動速度を遅くする必要がある。そのため、研磨体を一方向に移動させる態様では、アルミニウム基材における研磨を開始した側の端部に近い部分は、研磨体が通過してから研磨が終了するまでの時間が非常に長くなる。本発明では、アルミニウム基材の外周面における研磨体が通過した部分を洗浄して研磨液を除去するため、研磨体が通過してから研磨が終了するまでの時間が長くなっても、研磨液による変質を安定して抑制できる。
前記粗研磨では、酸性の研磨液が用いられることが多い。酸性の研磨液はアルミニウム基材を変質させやすいことから、本発明の製造方法は、酸性の研磨液が用いられる粗研磨を行う場合に特に有効である。
工程(I)でアルミニウム基材10の外周面14を研磨した後に、陽極酸化によって外周面14に、複数の細孔を有する酸化皮膜(陽極酸化ポーラスアルミナ)を形成する。前記酸化皮膜を形成する方法としては、例えば、下記工程(a)~(f)を有する方法が挙げられる。
(a)アルミニウム基材10を電解液中において定電圧下で陽極酸化して、図7に示すように、アルミニウム基材10の外周面14に酸化皮膜32を形成する。
(b)酸化皮膜32の一部または全てを除去し、アルミニウム基材10の外周面14に陽極酸化の細孔発生点34を形成する。
(c)アルミニウム基材10を電解液中で再度陽極酸化し、細孔発生点34に細孔36を有する酸化皮膜32を形成する。
(d)酸化皮膜32の一部を除去し、細孔36の径を拡大させる。
(e)工程(d)の後、アルミニウム基材10を電解液中で再度陽極酸化する。
(f)工程(d)と工程(e)を繰り返し行い、外周面14に複数の細孔36を有する酸化皮膜32が形成された円柱状ナノインプリント用モールド1(以下、「モールド1」という。)を得る。
アルミニウム基材10を電解液中で、定電圧下で陽極酸化すると、外周面14に、細孔36を有する酸化皮膜32が形成される。
電解液としては、硫酸水溶液、シュウ酸水溶液、リン酸水溶液等が挙げられる。
また、この場合、印加電圧は、30~60Vが好ましい。印加電圧が前記範囲内であれば、規則性の高い細孔36を形成しやすい。
また、電解液の温度は、60℃以下が好ましく、45℃以下がより好ましい。電解液の温度が60℃以下であれば、いわゆる「ヤケ」といわれる現象が起こることを抑制しやすくなるため、規則性の高い細孔36を形成しやすい。
また、この場合、印加電圧は、25~30Vが好ましい。印加電圧が前記範囲内であれば、規則性の高い細孔36を形成しやすい。
また、電解液の温度は、30℃以下が好ましく、20℃以下がより好ましい。電解液の温度が30℃以下であれば、いわゆる「ヤケ」といわれる現象が起こることを抑制しやすくなるため、規則性の高い細孔36を形成しやすい。
酸化皮膜32の一部または全てを一旦除去し、これを陽極酸化の細孔発生点34にする。これにより、細孔の規則性を高めることができる。酸化皮膜32の全てを除去せずに一部を残した状態としても、酸化皮膜32の残存した部分において規則性が充分に高くなっていれば、酸化皮膜除去による効果が得られる。
酸化皮膜を除去する方法としては、アルミニウムを溶解せず、酸化皮膜を選択的に溶解する溶液に溶解させて除去する方法が挙げられる。このような溶液としては、例えば、クロム酸とリン酸の混合液等が挙げられる。
酸化皮膜32の少なくとも一部を除去したアルミニウム基材10を再度、陽極酸化すると、円柱状の細孔36を有する酸化皮膜32が形成される。
陽極酸化は、工程(a)と同様の条件で行えばよい。陽極酸化の時間を長くするほど深い細孔36を形成できる。工程(b)の効果が失われない範囲であれば、工程(c)での陽極酸化の電圧、電解液の種類、温度等は適宜調整できる。
細孔36の径を拡大させる処理(以下、「細孔径拡大処理」という。)を行う。
細孔径拡大処理は、酸化皮膜を溶解する溶液に、酸化皮膜を浸漬して陽極酸化で得られた細孔の径を拡大させる処理である。酸化皮膜を溶解する溶液としては、例えば、5質量%程度のリン酸水溶液等が挙げられる。
細孔径拡大処理の時間を長くするほど、細孔径は大きくなる。
工程(d)の後に、アルミニウム基材10を、再度、陽極酸化すると、円柱状の細孔36の底部から下に延びる、直径の小さい円柱状の細孔36がさらに形成される。
陽極酸化は、工程(a)と同様の条件で行えばよい。陽極酸化の時間を長くするほど深い細孔36を形成できる。
工程(d)の細孔径拡大処理と、工程(e)の陽極酸化を繰り返すと、アルミニウム基材10の外周面14に、直径が開口部から深さ方向に連続的に減少する形状の細孔36を有する酸化皮膜32が形成されたモールド1が得られる。
最後は工程(d)で終わることが好ましい。
細孔36間の平均間隔は、電子顕微鏡観察によって隣接する細孔36間の間隔(細孔36の中心から隣接する細孔36の中心までの距離)を50点測定し、これらの値を平均したものである。
細孔36の深さは、電子顕微鏡観察によって倍率30000倍で観察したときにおける、細孔36の最底部と、細孔36間に存在する凸部の最頂部との間の距離を測定した値である。
細孔36のアスペクト比(細孔の深さ/細孔間の平均間隔)は、0.8~5.0が好ましく、1.2~4.0がより好ましく、1.5~3.0が特に好ましい。
円柱状のアルミニウム基材の外周面全体を研磨する場合に、該アルミニウム基材の軸方向の長さよりも該軸方向に沿った長さが長い研磨体を用いることは、研磨体の入手容易性、研磨体の交換の作業性等を勘案すると現実的ではない。そのため、円柱状のアルミニウム基材の軸方向の長さよりも該軸方向の長さが短い研磨体を、軸方向に移動させつつアルミニウム基材の外周面全体を研磨することが現実的である。
一方、一般に、基材の表面全体を研磨する際には、基材表面の端部近傍が過度に研磨されないようにすること、研磨体を傷み難くすること等の目的で、該研磨体が基材の表面からはみ出さないようにして研磨が行われる。しかし、円柱状のアルミニウム基材の外周面全体を研磨する際に、該外周面から研磨体をはみ出させないように研磨を行えば、前述したように該外周面における軸方向の端部近傍の研磨時間が中央部分の研磨時間に比べて短くなり、表面粗さが不均一になる。
また、第1実施態様のモールド1の製造方法では、アルミニウム基材10の第1の端部10a側と第2の端部10b側において、研磨体26の少なくとも一部をはみ出させた際に、その研磨体26のはみ出した部分が第1の支持部材18および第2の支持部材20に接して支持されるようになっている。これにより、アルミニウム基材10の第1の端部10aや第2の端部10bに、研磨体26によって局所的に過度な研磨圧力が加わることが抑制される。そのため、アルミニウム基材10の外周面14における第1の端部10a近傍および第2の端部10b近傍が、軸方向の中央部分と同程度に研磨されることとなり、表面粗さの均一性が良好になる。
また、本発明の第1実施態様の製造方法は、アルミニウム基材の軸方向の端部側で研磨体の接触時間が長くなるように研磨体の移動速度を制御して、アルミニウム基材の軸方向の研磨時間を均一にしようとする方法に比べて、制御が簡便であるうえ、より表面粗さの均一性が良好な研磨が可能である。
また、アルミニウム基材における白化した部分は、それ以外の部分に比べて研磨によって削られ難い。そのため、アルミニウム基材の外周面に一旦白化が生じると、その白化部分を取り除いて鏡面化するには非常に長時間を要する。
例えば、工程(I)では、研磨体26をアルミニウム基材10の軸方向に沿って往復させなくてもよい。例えば、図8に示すように、研磨体26の少なくとも一部が第1の支持部材18側にはみ出している状態から、研磨体26の少なくとも一部を第2の支持部材20側にはみ出させるように、研磨体26をアルミニウム基材10の軸方向に第2の支持部材20側に向かって1回だけ移動させる方法であってもよい。図8において、図3と同じ部分には同符号を付して説明を省略する。
本発明では、アルミニウム基材の軸方向の端部側に設置する支持部材と、アルミニウム基材とは隣接していることが好ましい。
例えば、図10に例示したように、アルミニウム基材10の第1の端部10a側における、回転軸16よりも研磨体26側に、回転軸16とは独立した回転しない第1の支持部材18Aを設置する態様であってもよい。図10において、図3と同じ部分には同符号を付して説明を省略する。
例えば、本発明の第1実施態様のモールドの製造方法は、アルミニウム基材の軸方向の一方の端部側のみに支持部材を設置し、その端部側のみで研磨体の少なくとも一部がアルミニウム基材からはみ出すように該研磨体を移動させる方法であってもよい。この場合も、研磨体をはみ出させる端部側では軸方向の中央部分との研磨時間の差が小さくなるため、アルミニウム基材の外周面から研磨体を全くはみ出させない場合に比べて、アルミニウム基材の外周面の表面粗さの均一性が向上する。
本発明の第1実施態様では、アルミニウム基材の外周面の表面粗さがより均一になり、該外周面をより有効に活用できる点から、アルミニウム基材の軸方向の両方の端部側にそれぞれ支持部材を設置し、その両方の端部側で研磨体の少なくとも一部をアルミニウム基材からはみ出させる方法が好ましい。
また、本発明の第1実施態様の製造方法は、軸方向に移動させる研磨体の前方と後方の両方でアルミニウム基材の外周面を洗浄しない方法としてもよい。
それぞれの洗浄手段39は、洗浄液を送液する配管39aと、配管39aの先端に設けられたノズル39bと、を有している。また、それぞれの洗浄手段39は、位置が固定されている。
また、本発明の第1実施態様の製造方法では、アルミニウム基材の外周面を洗浄する方法は、洗浄液によって洗浄する方法には限定されない。例えば、アルミニウム基材の外周面を洗浄する方法は、スポンジ等により研磨液をアルミニウム基材の外周面から除去する方法であってもよい。
本発明の第2実施態様のモールドの製造方法は、円柱状のアルミニウム基材の外周面に、複数の細孔を有する酸化皮膜が形成されたモールドの製造方法である。
以下、本発明の第2実施態様のモールドの製造方法に用いる研磨装置の一例について説明する。
本実施形態の研磨装置2は、図17および図18に示すように、研磨体26と、擦動手段15と、研磨液供給手段30と、第1の洗浄手段31と、第2の洗浄手段33と、第1のガス噴出手段35と、第2のガス噴出手段37と、を有している。
この例の擦動手段15では、アルミニウム基材10の外周面14と研磨体26とが接触する接触部分27において、アルミニウム基材10の回転方向と研磨体26が搬送される方向とが逆方向となるように動かし、それらが互いに擦れ合うようにする。
このように、アルミニウム基材10に対して研磨体26を軸方向に移動させることで、アルミニウム基材10の外周面14全体を研磨体26で研磨できるようになっている。
研磨液供給手段30は、例えば、研磨液を送液する配管30aと、配管30aの先端に設けられたノズル30bと、を有している。研磨液供給手段30は、アルミニウム基材10の外周面14における研磨体26との接触部分27に研磨液を供給するように配置されており、アルミニウム基材10と研磨体26の相対移動に追従して相対移動するようになっている。
研磨液供給手段30は、アルミニウム基材10の外周面14における研磨体26との接触部分27に研磨液を供給できるものであれば、前記した態様には限定されない。
第1の洗浄手段31は、研磨液の除去効率が高い点から、この例のように、アルミニウム基材10の外周面14に洗浄液を供給して研磨液を除去する手段であることが好ましい。
第2の洗浄手段33は、第1の洗浄手段31と同様の理由から、この例のように、アルミニウム基材10の外周面14に洗浄液を供給して研磨液を除去する手段であることが好ましい。
研磨装置2では、研磨対象であるアルミニウム基材10を擦動手段15の回転軸16に設置し、軸駆動部によって回転軸16を軸周りに回転させる。これにより、アルミニウム基材10が軸周りに回転される。また、擦動手段15のロール駆動部によって搬送ロール28を駆動し、研磨体26をその長さ方向に搬送する。このとき、アルミニウム基材10の外周面14と研磨体26との接触部分27において、アルミニウム基材10の回転方向と研磨体26が搬送される方向とが逆方向となるように、研磨体26を搬送する。これにより、アルミニウム基材10の外周面14と研磨体26とが接触部分27で互いに擦れ合う。接触部分27には、研磨液供給手段30から研磨液が供給される。これにより、研磨液を利用して研磨体26によってアルミニウム基材10の外周面14が研磨される。
研磨装置2では、アルミニウム基材10の第1の端部10aから研磨が開始され、移動手段によって、アルミニウム基材10の第1の端部10aから第2の端部10bにわたって、研磨体26がアルミニウム基材10の軸方向に相対的に移動される。これにより、アルミニウム基材10の外周面14全体が研磨体26によって研磨される。
また、アルミニウム基材10の外周面14における研磨体26よりも前方には、アルミニウム基材10と研磨体26の接触部分27に供給しようとした研磨液が誤って付着する可能性がある。しかし、研磨装置2では、第2の洗浄手段33によって、アルミニウム基材10の外周面14の研磨体26よりも前方部分が洗浄されるため、この部分に研磨液が誤って付着したとしても該研磨液が除去される。そのため、研磨液によるアルミニウム基材10の変質がより安定して抑制される。
例えば、本発明の第2実施態様の製造方法に用いる研磨装置は、第2の洗浄手段33を有さず、軸方向に移動させる研磨体の前方で基材の外周面を洗浄しない装置であってもよい。基材における研磨体の前方の研磨前の部分には必ずしも研磨液が付着するとは限らない。また、研磨体の前方に誤って付着する場合でも、その研磨液が付着する部分は前記接触部分から大きく離れていないことがほとんどであり、その部分は比較的短時間で研磨されることになる。そのため、研磨体の前方に誤って付着した研磨液による白化等の変質の悪影響は、研磨体の後方に残存する研磨液による悪影響に比べて生じ難く、第2の洗浄手段33を有さなくても基材の変質は充分に抑制することができる。
研磨装置3は、第1の洗浄手段31および第2の洗浄手段33の代わりに、アルミニウム基材10の第1の端部10aから第2の端部10bの範囲内に、軸方向に沿って複数の洗浄手段39が等間隔に配置されている以外は、研磨装置2と同様の態様である。
研磨装置2では、研磨体26の軸方向への移動に合わせて、それぞれの洗浄手段39から洗浄液を順次供給して、研磨体26の後方、または研磨体26の前方と後方で洗浄を行って研磨液を除去する。
また、本発明の第2実施態様の製造方法に用いる研磨装置は、アルミニウム基材の外周面に洗浄液を供給する洗浄手段を有するものには限定されない。例えば、洗浄手段として、アルミニウム基材の外周面から研磨液を拭き取って除去するスポンジ等を備えた研磨装置であってもよい。
また、本発明の第2実施態様の製造方法に用いる研磨装置は、研磨体を、円柱状のアルミニウム基材の軸方向に往復運動させて研磨を行う研磨装置であってもよい。
以下、本発明の第2実施態様のモールドの製造方法の一例として、研磨装置2を用いた製造方法について説明する。本実施形態のモールドの製造方法は、下記の工程(I)および工程(II)を有する。
(I)図1および図2に示すように、研磨体26と、軸周りに回転するアルミニウム基材10とを軸方向に相対的に移動させながら、研磨体26でアルミニウム基材10の外周面14を研磨する。
(II)工程(I)の後に、陽極酸化によってアルミニウム基材10の外周面14に、複数の細孔を有する酸化皮膜を形成する。
この例の工程(I)では、アルミニウム基材10を軸周りに回転させ、そのアルミニウム基材10の外周面14に研磨体26を押し当てて擦りながら、第1の端部10aから第2の端部10bまで研磨体26を軸方向に移動させて、アルミニウム基材10の外周面14全体を研磨する。このとき、アルミニウム基材10の外周面14における研磨体26との接触部分27には、研磨液供給手段30から化学機械研磨用の研磨液を供給する。
アルミニウム基材10の軸方向に沿った研磨体26の移動速度は、一定にしてもよく、変化させてもよい。
本発明の第2実施態様の製造方法では、第1実施態様における研磨液を洗浄する場合と同様の理由から、研磨体26の後方でのアルミニウム基材10の外周面14の洗浄は、研磨体26が通過してから直ぐに行うことが好ましい。すなわち、アルミニウム基材10の外周面14における研磨体26によって研磨した部分を直ぐに洗浄して、該部分から研磨液を除去することが好ましい。
また、研磨体26の後方で、アルミニウム基材10の外周面14を連続的に洗浄しながら、研磨体26を軸方向に移動させていくことがより好ましい。この例では、第1の洗浄手段31が研磨体26の直ぐ後ろを追従するようにして、アルミニウム基材10の外周面14における研磨体26が通過した部分に連続的に洗浄液を供給して洗浄を行うことが好ましい。
洗浄液としては、第1実施態様で挙げたものと同じものが挙げられ、好ましい態様も同じである。
アルミニウム基材10の外周面14における研磨体26の両側に吹き付けるガスとしては、第1実施態様で挙げたものと同じものが挙げられ、好ましい態様も同じである。
本発明の第2実施態様の製造方法では、工程(I)で研磨した後のアルミニウム基材10の外周面14は、鏡面化されていることが好ましい。
本発明の第2実施態様の製造方法における工程(II)は、第1実施態様における工程(II)と同様に行える。
以上説明した本発明の第2実施態様の製造方法では、前記した第1実施態様における研磨液を洗浄する場合と同様に、研磨後のアルミニウム基材10の外周面14に、研磨液による白化現象等の変質が生じることが抑制される。そのため、高い生産性でモールドを製造することができる。
例えば、本発明の第2実施態様の製造方法は、軸方向に移動させる研磨体の前方でアルミニウム基材の外周面を洗浄しない方法としてもよい。
また、本発明の第2実施態様の製造方法は、研磨装置3を用いる方法でもよい。該方法では、研磨体26の軸方向への移動に合わせて、それぞれの洗浄手段39から洗浄液を順次供給して、研磨体26の後方、または研磨体26の前方と後方で洗浄を行う。
また、本発明の第2実施態様の製造方法では、アルミニウム基材の外周面を洗浄する方法は、洗浄液によって洗浄する方法には限定されない。例えば、アルミニウム基材の外周面を洗浄する方法は、スポンジ等により研磨液をアルミニウム基材表面から除去する方法であってもよい。
以下、本発明の一実施態様に基づいたナノインプリント用再生モールドの製造方法の一例について説明する。本実施形態のナノインプリント用再生モールドの製造方法は、研磨工程と酸化被膜形成工程とを有する。
研磨工程は、使用済みのナノインプリント用モールド(以下、「使用済みのモールド」ともいう。)の表面を研磨する工程である。
なお、使用済みのモールドとは、モールドを繰り返し使用することで、モールド表面に硬化性樹脂組成物が堆積したり、モールド表面に傷がついたり、微細凹凸構造が変形したりするなどして、所定の微細凹凸構造が転写されなくなったもの、モールド表面の傷が模様となって転写されたり、所望の性能の転写物を得ることができないモールドのことをいう。
使用済みのモールドは、アルミニウム基材の表面に、複数の細孔を有する酸化皮膜、すなわち可視光の波長以下の周期の微細凹凸構造を有する酸化皮膜が形成されたものである。使用済みのモールドの形状については特に制限されず、円柱状(円管状(円筒状)も含む)、平板状、シート状等が挙げられる。
砥粒の平均粒子径は、砥粒が水などの溶媒に分散したスラリーを動的光散乱法粒径分布測定装置やレーザー回折式粒径分布測定装置を用いることによって測定することができる。また、SEMやTEM等の電子顕微鏡で砥粒を直接観察して測定することもできる。
固定砥粒研磨した後に2回以上のCMP研磨を行う場合、本発明では、固定砥粒研磨を「前処理研磨」、1回目のCMP研磨を「粗研磨」、2回目以降のCMP研磨を「仕上げ研磨」ともいう。
研磨レートの高い研磨方法と研磨レートの低い研磨方法の両方をCMP研磨で行い、かつ3回以上のCMP研磨を行う場合、本発明では、1回目のCMP研磨を「前処理研磨」、2回目のCMP研磨を「粗研磨」、3回目以降のCMP研磨を「仕上げ研磨」ともいう。
ここで、CMP研磨により使用済みのモールドの表面を研磨する方法については、円柱状のアルミニウム基材を有する使用済みのモールドの場合、上述の第1実施態様および第2実施態様の工程(I)や工程(I’)のような方法を用いることができる。
他の処理方法として適している方法は、エッチング、電解研磨、化学研磨などである。
機械研磨と他の処理方法とを併用する場合、その順序については制限されないが、他の処理方法で使用済みのモールドの表面をある程度処理した後に、機械研磨するのが好ましい。他の処理方法の後で機械研磨を行えば、研磨工程後のアルミニウム基材の表面がより鏡面化した状態で得られる。
ただし、除去時間や作業性を考慮すると、研磨工程は機械研磨のみで行うことが好ましい。
酸化皮膜形成工程は、第1実施態様の工程(II)と同様に行える。
上述したように、モールドを繰り返し使用すると、モールド表面に樹脂が堆積したり、モールド表面に傷がついたり、微細凹凸構造が変形したりして、モールドが寿命を迎える。
しかし、本発明のナノインプリント用再生モールドの製造方法であれば、研磨工程において使用済みのモールドの表面を研磨して酸化皮膜を除去することで、モールド表面に堆積した樹脂はもちろんのこと、微細凹凸構造そのものを除去できる。また、モールド表面に傷がついている場合には、この傷も研磨により除去できる。このように研磨工程において使用済みのモールドの表面を研磨することで、モールドの材料、すなわち元のアルミニウム基材の状態に戻る。このアルミニウム基材を陽極酸化して、可視光の波長以下の周期の微細凹凸構造を有する酸化皮膜を再形成するので、使用済みのモールドを再利用してナノインプリント用モールドを製造できる。
このように、本発明のナノインプリント用再生モールドの製造方法によれば、使用済みのモールドを再利用して、細孔が均一に分布した酸化皮膜を形成でき、ヘイズが低い物品を得ることができるナノインプリント用再生モールドを低コストで製造できる。
本発明のナノインプリント用再生モールドの製造方法では、研磨工程が、以下に説明する酸化皮膜除去処理や樹脂除去工程を有していてもよい。
酸化皮膜除去処理は、研磨工程において、使用済みのモールドの表面の酸化皮膜を化学的に除去する処理である。
モールドの表面に形成された酸化皮膜は、モールドの基材に用いられているアルミニウム材料と比較して硬度が高い場合が多い。このような硬質な酸化皮膜を研磨により除去しようとすると、加工時間が長くなってしまう場合がある。そのため、事前に酸化皮膜を化学的に除去しておけば、研磨工程で酸化皮膜を除去する研磨時間を短縮できる。本発明のナノインプリント用再生モールドの製造方法では、研磨工程において、酸化皮膜を化学的に除去した後に、アルミニウム基材を化学機械研磨することが好ましい。
しかし、酸化皮膜を化学的に除去すると、除去後のモールドの表面(すなわち、アルミニウム基材の表面)も僅かに溶解され、表面状態が悪化することとなる。また、使用済みのモールドの表面に傷がついている場合、酸化皮膜除去工程ではこの傷を十分に除去することはできない。
よって、酸化皮膜除去工程の後には、上述した研磨工程を行う。酸化皮膜除去工程の後に研磨工程を行うことで、酸化皮膜除去工程にて除去しきれなかった酸化皮膜が残存している場合には、その酸化皮膜を研磨工程にて除去できる。また、使用済みのモールドの表面に傷がついている場合は、この傷も除去できる。さらに、酸化皮膜除去工程後のモールドの表面状態が悪化している場合には、その表面を平滑にできる。
樹脂除去工程は、酸化皮膜除去工程の前に、使用済みのモールドの表面に付着(堆積)した樹脂(光硬化性樹脂等)を除去する工程である。
使用済みのモールド表面に樹脂が堆積している場合、酸化皮膜除去工程では樹脂を十分に除去できない。また、樹脂が酸化皮膜除去工程での酸化皮膜の化学的な除去の妨げになることもある。事前に樹脂を除去しておけば、酸化皮膜除去工程で酸化皮膜を容易に、かつ短時間で除去できる。
樹脂を除去する方法としては、モールドのアルミニウム基材を溶解しにくく、樹脂のみを選択的に溶解する溶液を用いて、樹脂を洗浄除去する方法が好ましい。このような溶液は、樹脂の種類に応じて決定されるが、例えばアセトン、エタノールなどの溶剤が挙げられる。
研磨工程でも樹脂を除去することはできるが、事前に樹脂を除去しておけば、研磨工程で酸化皮膜を除去する研磨時間を短縮できる。
[表面粗さ]
各例におけるアルミニウム基材の外周面において、株式会社東京精密製の表面粗さ形状測定機SURFCOM1500DXにてJIS B 0601:1994の規格に基づき、算術平均粗さRaを測定した。
また、各例で得られたレプリカの外周面において、株式会社東京精密製の表面粗さ形状測定機SURFCOM1500DXにてJIS B 0601:1994に規定の方法により、算術平均粗さRaを測定した。測定位置は、アルミニウム基材10の第1の端部10aから10mmの位置から、10mm毎に70mmまでとした。
図1~4に示したように、円柱状のアルミニウム基材10の第1の端部10a側と第2の端部10b側にそれぞれ第1の支持部材18および第2の支持部材20を設置し、研磨手段12によってアルミニウム基材10の外周面14全体を研磨した。
アルミニウム基材10としては、アルミニウムの純度が99.99%で、軸方向の長さL1が700mmの円柱状のアルミニウム基材を用いた。また、研磨体26としては、アルミニウム基材10の軸方向に沿った長さL2が100mmの研磨パッド(ポリエステル製不織布、発砲ポリウレタン製スウェード)を用いた。第1の支持部材18および第2の支持部材20としては、アルミニウム基材10の軸方向に沿った長さが100mmである、アルミニウム基材10と同じ材質の円柱状のスリーブを用いた。アルミニウム基材10の外径D、第1の支持部材18の外径d1、および第2の支持部材20の外径d2は同じとした。研磨スラリーとしては、平均粒径0.1μmのSiO2粒子を含むスラリーを用いた。
研磨体26を、軸方向に沿った移動速度を20cm/分として往復させて、アルミニウム基材10の外周面14全体を研磨した。またアルミニウム基材10の外周面14における研磨体26が通過した部分においては、研磨スラリーを純水で洗浄除去しながら研磨を行った。また、アルミニウム基材10の第1の端部10a側と第2の端部10b側において、研磨体26をはみ出させる部分の軸方向の長さをそれぞれ70mm(L3/L2=L4/L2=0.7)とした。
第1の支持部材18および第2の支持部材20を設置せず、アルミニウム基材10の第1の端部10aから第2の端部10bの範囲で、研磨体26がはみ出さないように研磨を行った以外は、実施例1と同様に研磨を行い、モールドのレプリカを作製した。
実施例1および比較例1における表面粗さの測定結果を図12に示す。
実施例1と同様にアルミニウム基材の研磨を行ったところ、アルミニウム基材の外周面に微細な研磨傷が発生した。この研磨傷を除去するため、実施例1と同様の研磨条件で、アルミニウム基材の研磨を継続した。実施例1と同様の研磨を3回繰り返し行ったところで、外周面に研磨傷もなく、端部近傍の表面粗さも均一となったアルミニウム基材を得ることができた。
実施例1と同様にアルミニウム基材の研磨を行ったところ、アルミニウム基材の外周面に微細な研磨傷が発生した。この研磨傷を除去するため、研磨体26がアルミニウム基材10からはみ出さないようにしてさらに研磨を行った。研磨体26をオーバーランさせない以外の研磨条件は実施例1と同様とした。アルミニウム基材の研磨を継続したところ、実施例1と同様の研磨を1回行ったところで、外周面に研磨傷もなく、端部近傍の表面粗さも均一となったアルミニウム基材を得ることができた。
図17および図18に示したように、円柱状のアルミニウム基材10の第1の端部10aから第2の端部10bまで研磨体26を軸方向に一方向に移動させて、アルミニウム基材10の外周面14全体を、算術平均粗さRaが20nmになるまで粗研磨した。
アルミニウム基材10としては、アルミニウムの純度が99.99%で、軸方向の長さL1が700mmの円柱状のアルミニウム基材を用いた。また、研磨体26としては、アルミニウム基材10の軸方向に沿った長さL2が100mmのポリエステル製不織布研磨パッドを用いた。研磨液としては、平均粒径1μmのAl2O3粒子を含む、pH2~6の酸性のスラリーを用いた。
研磨体26の軸方向に沿った移動速度を20cm/分とし、研磨体26の前方と後方でアルミニウム基材10の外周面14を洗浄液により洗浄した。洗浄液としては、純水を用いた。研磨体26の軸方向の前後におけるガスの吹き付けは行わなかった。
粗研磨の後、研磨液として、平均粒径0.1μmのSiO2粒子を含むpH8~14のスラリーを用いる以外は、前記した粗研磨と同様にして算術平均粗さRaが5nmの鏡面となるまで仕上げ研磨を行った。
粗研磨と仕上げ研磨に要した合計時間は100分であった。
研磨体26の前方と後方でアルミニウム基材10の外周面14を洗浄しなかった以外は、実施例2と同様にして粗研磨と仕上げ研磨を行った。
粗研磨後にアルミニウム基材10の外周面14に白化現象が見られ、粗研磨と仕上げ研磨には合計で170分を要した。
表面に微細な凹凸を有する物品を連続的に生産した後に、アルミニウムの純度が99.9%であるアルミニウム基材の酸化皮膜が形成されたモールドを、6質量%のリン酸と1.8質量%のクロム酸を混合した70℃の水溶液中に浸漬して酸化皮膜を溶解除去した。その後、実施例2と同様の方法で、算術表面粗さが30nmとなるまでアルミニウム基材の表面を粗研磨した。粗研磨に要した時間は35分であった。
工程(a):
0.3Mのシュウ酸水溶液を15.7℃に温度調整し、これにアルミニウム基材を浸漬して、40Vで3分間陽極酸化することで、細孔を有する酸化皮膜を形成した。
酸化皮膜が形成されたアルミニウム基材を、6質量%のリン酸と1.8質量%のクロム酸を混合した70℃の水溶液中に浸漬して酸化皮膜の少なくとも一部を溶解除去し、陽極酸化の細孔発生点を形成した。
細孔発生点を露出させたアルミニウム基材を、再び工程(a)と同一条件下において、40Vで60秒間陽極酸化して、細孔発生点に細孔を有する酸化皮膜をアルミニウム基材の表面に再び形成した。
酸化皮膜が形成されたアルミニウム基材を、5質量%リン酸の水溶液(30℃)中に9分間浸漬して、酸化皮膜の細孔を拡大する孔径拡大処理を施した。
工程(d)の後、酸化皮膜が形成されたアルミニウム基材を、再び工程(a)と同一条件下において、40Vで60秒間陽極酸化した。
前記工程(d)と前記工程(e)をさらに交互に3回繰り返した後、最後に工程(d)を行った。すなわち、工程(e)を合計で4回行い、工程(d)を合計で5回行った。
表面に微細な凹凸を有する物品を連続的に生産した後に、6質量%のリン酸と1.8質量%のクロム酸を混合した70℃の水溶液中に浸漬せずに、実施例2と同様の方法で算術平均粗さが30nmに達するまでアルミニウム基材を粗研磨した。粗研磨に要した時間は70分であった。
2、3 研磨装置
10 アルミニウム基材
10a 第1の端部
10b 第2の端部
12 研磨手段
14 外周面
15 擦動手段
16 回転軸
18 第1の支持部材
20 第2の支持部材
26 研磨体
28 搬送ロール
30 研磨液供給手段
31 第1の洗浄手段
33 第2の洗浄手段
35 第1のガス噴出手段
37 第2のガス噴出手段
39 洗浄手段
50 残留砥粒除去手段
32 酸化皮膜
36 細孔
40、42 隙間
Claims (26)
- 円柱状のアルミニウム基材の外周面に、複数の細孔を有する酸化皮膜が形成された円柱状ナノインプリント用モールドの製造方法であって、
前記アルミニウム基材の軸方向の長さよりも該軸方向に沿った長さが短い研磨体と、中心軸回りに回転する前記アルミニウム基材とを相対的に移動させながら、前記研磨体で前記アルミニウム基材の外周面を擦って、前記アルミニウム基材の外周面全体を研磨する工程(I)と、
前記工程(I)の後に、陽極酸化によって前記アルミニウム基材の外周面に前記酸化皮膜を形成する工程(II)と、を有し、
前記工程(I)において、前記アルミニウム基材の中心軸方向の両端部に支持部材を配置し、前記研磨体の少なくとも一部が前記アルミニウム基材の軸方向の端部からはみ出すように、軸周りに回転する前記アルミニウム基材の外周面に対して前記研磨体を軸方向に相対的に移動させて研磨し、
前記アルミニウム基材からはみ出した前記研磨体の少なくとも一部は、前記支持部材上に配置され、
前記支持部材の前記研磨体が配置される部分の表面を前記アルミニウム基材の軸方向に対して垂直方向に切断した形状は、前記アルミニウム基材の外径と略同一またはそれ以下の直径の円周の少なくとも一部を構成する円弧状である、円柱状ナノインプリント用モールドの製造方法。 - 前記支持部材の前記研磨体が配置される部分の外形は、前記アルミニウム基材の外径の0.97倍以上1倍以下の外径の円柱状の少なくとも一部を構成する形状である、請求項1に記載の円柱状ナノインプリント用モールドの製造方法。
- 前記支持部材は、外形が円柱状である、請求項2に記載の円柱状ナノインプリント用モールドの製造方法。
- 前記支持部材の前記研磨体が配置される部分が、前記アルミニウム基材と同じ材質からなる、請求項1に記載の円柱状ナノインプリント用モールドの製造方法。
- 前記工程(I)と前記工程(II)との間に、前記研磨体が前記アルミニウム基材からはみ出さないように前記研磨体を軸方向に相対的に移動させて研磨する工程(I’)をさらに有する、請求項1に記載の円柱状ナノインプリント用モールドの製造方法。
- 前記工程(I)において、前記アルミニウム基材の外周面に砥粒を供給しつつ前記研磨体で研磨し、かつ前記支持部材の表面上に残留した残留砥粒を除去する、請求項1に記載の円柱状ナノインプリント用モールドの製造方法。
- 前記工程(I)において、前記アルミニウム基材の外周面における前記研磨体との接触部分に、化学機械研磨用の研磨液を供給し、かつ軸方向に移動する前記研磨体の後方で、前記アルミニウム基材の外周面を洗浄して前記研磨液を除去する、請求項1に記載の円柱状ナノインプリント用モールドの製造方法。
- 前記研磨体を、前記アルミニウム基材の軸方向の第1の端部から第2の端部まで一方向に移動させる、請求項7に記載の円柱状ナノインプリント用モールドの製造方法。
- さらに、軸方向に移動する前記研磨体の前方でも前記アルミニウム基材の外周面を洗浄して前記研磨液を除去する、請求項7に記載の円柱状ナノインプリント用モールドの製造方法。
- 前記研磨体の軸方向の両側で前記アルミニウム基材の外周面にガスを吹き付ける、請求項7に記載の円柱状ナノインプリント用モールドの製造方法。
- 円柱状のアルミニウム基材の外周面に、複数の細孔を有する酸化皮膜が形成された円柱状ナノインプリント用モールドの製造方法であって、
前記アルミニウム基材の軸方向の長さよりも該軸方向に沿った長さが短い研磨体と、軸回りに回転する前記アルミニウム基材とを相対的に移動させながら、前記研磨体で前記アルミニウム基材の外周面を擦って、前記アルミニウム基材の外周面全体を研磨する工程(I)と、
前記工程(I)の後に、陽極酸化によって前記アルミニウム基材の外周面に前記酸化皮膜を形成する工程(II)と、を有し、
前記工程(I)では、前記アルミニウム基材の外周面における前記研磨体との接触部分に、化学機械研磨用の研磨液を供給し、かつ軸方向に移動する前記研磨体の後方で、前記アルミニウム基材の外周面を洗浄して前記研磨液を除去する、円柱状ナノインプリント用モールドの製造方法。 - 前記研磨体を、前記アルミニウム基材の軸方向の第1の端部から第2の端部まで一方向に移動させる、請求項11に記載の円柱状ナノインプリント用モールドの製造方法。
- さらに、軸方向に移動する前記研磨体の前方でも前記アルミニウム基材の外周面を洗浄して前記研磨液を除去する、請求項11に記載の円柱状ナノインプリント用モールドの製造方法。
- 前記研磨体の軸方向の両側で前記アルミニウム基材の外周面にガスを吹き付ける、請求項11に記載の円柱状ナノインプリント用モールドの製造方法。
- アルミニウム基材の表面に、複数の細孔を有する酸化皮膜が形成されたナノインプリント用モールドの表面を研磨する研磨工程と、
研磨された表面を陽極酸化して、アルミニウム基材の表面に複数の細孔を有する酸化皮膜を再形成する酸化皮膜形成工程とを有する、ナノインプリント用再生モールドの製造方法。 - 前記研磨工程は、複数の細孔を有するナノインプリント用モールドの表面の酸化皮膜を化学的に除去する処理を含む、請求項15に記載のナノインプリント用再生モールドの製造方法。
- クロム酸およびリン酸の混合溶液を用いて前記酸化皮膜を化学的に除去する、請求項16に記載のナノインプリント用再生モールドの製造方法。
- 前記研磨工程の前に、複数の細孔を表面に有するナノインプリント用モールドの表面に付着した樹脂を除去する樹脂除去工程を有する、請求項16または17に記載のナノインプリント用再生モールドの製造方法。
- 前記研磨工程において、酸化皮膜を化学的に除去した後に、前記アルミニウム基材を化学機械研磨する、請求項16に記載のナノインプリント用再生モールドの製造方法。
- 前記アルミニウム基材は、外形が円柱状であり、
前記研磨工程は、前記アルミニウム基材の軸方向の長さよりも該軸方向に沿った長さが短い研磨体と、中心軸回りに回転する前記アルミニウム基材とを相対的に移動させながら、前記研磨体で前記アルミニウム基材の外周面を擦って、前記アルミニウム基材の外周面全体を研磨する工程(I)を有し、
前記工程(I)において、前記アルミニウム基材の中心軸方向の両端部に支持部材を配置し、前記研磨体の少なくとも一部が前記アルミニウム基材の軸方向の端部からはみ出すように、軸周りに回転する前記アルミニウム基材の外周面に対して前記研磨体を軸方向に相対的に移動させて研磨し、
前記アルミニウム基材からはみ出した前記研磨体の少なくとも一部は、前記支持部材上に配置され、
前記支持部材の前記研磨体が配置される部分の表面を前記アルミニウム基材の軸方向に対して垂直方向に切断した形状は、前記アルミニウム基材の外径と略同一またはそれ以下の直径の円周の少なくとも一部を構成する円弧状である、請求項19に記載のナノインプリント用再生モールドの製造方法。 - 前記支持部材の前記研磨体が配置される部分の外形は、前記アルミニウム基材の外径の0.97倍以上1倍以下の外径の円柱状の少なくとも一部を構成する形状である、請求項20に記載のナノインプリント用再生モールドの製造方法。
- 前記研磨工程は、前記工程(I)の後に、前記研磨体が前記アルミニウム基材からはみ出さないように前記研磨体を軸方向に相対的に移動させて研磨する工程(I’)をさらに有する、請求項20または21に記載のナノインプリント用再生モールドの製造方法。
- 前記工程(I)において、前記アルミニウム基材の外周面における前記研磨体との接触部分に、化学機械研磨用の研磨液を供給し、かつ軸方向に移動する前記研磨体の後方で、前記アルミニウム基材の外周面を洗浄して前記研磨液を除去する、請求項20に記載のナノインプリント用再生モールドの製造方法。
- 前記研磨体を、前記アルミニウム基材の軸方向の第1の端部から第2の端部まで一方向に移動させる、請求項23に記載のナノインプリント用再生モールドの製造方法。
- さらに、軸方向に移動する前記研磨体の前方でも前記アルミニウム基材の外周面を洗浄して前記研磨液を除去する、請求項24に記載のナノインプリント用再生モールドの製造方法。
- 前記研磨体の軸方向の両側で前記アルミニウム基材の外周面にガスを吹き付ける、請求項25に記載のナノインプリント用再生モールドの製造方法。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020167003408A KR101879797B1 (ko) | 2013-08-14 | 2014-08-11 | 원기둥형상 나노임프린트용 몰드의 제조방법 및 나노임프린트용 재생 몰드의 제조방법 |
| JP2014541466A JP6265127B2 (ja) | 2013-08-14 | 2014-08-11 | 円柱状ナノインプリント用モールドの製造方法、およびナノインプリント用再生モールドの製造方法 |
| US14/910,956 US9457493B2 (en) | 2013-08-14 | 2014-08-11 | Method for producing cylindrical nanoimprinting mold and method for producing nanoimprinting reproduction mold |
| CN201480044603.XA CN105451966B (zh) | 2013-08-14 | 2014-08-11 | 圆柱状纳米压印用模具的制造方法,和纳米压印用再生模具的制造方法 |
Applications Claiming Priority (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-168538 | 2013-08-14 | ||
| JP2013168538 | 2013-08-14 | ||
| JP2013168540 | 2013-08-14 | ||
| JP2013-168537 | 2013-08-14 | ||
| JP2013-168540 | 2013-08-14 | ||
| JP2013168537 | 2013-08-14 | ||
| JP2014015864 | 2014-01-30 | ||
| JP2014-015864 | 2014-01-30 | ||
| JP2014-016042 | 2014-01-30 | ||
| JP2014016042 | 2014-01-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2015022935A1 true WO2015022935A1 (ja) | 2015-02-19 |
Family
ID=52468321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2014/071193 Ceased WO2015022935A1 (ja) | 2013-08-14 | 2014-08-11 | 円柱状ナノインプリント用モールドの製造方法、およびナノインプリント用再生モールドの製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9457493B2 (ja) |
| JP (1) | JP6265127B2 (ja) |
| KR (1) | KR101879797B1 (ja) |
| CN (1) | CN105451966B (ja) |
| TW (1) | TWI569946B (ja) |
| WO (1) | WO2015022935A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016155224A (ja) * | 2015-02-23 | 2016-09-01 | 三菱レイヨン株式会社 | ナノインプリント用モールドの製造方法 |
| JP2017155297A (ja) * | 2016-03-02 | 2017-09-07 | 株式会社ミツバ | アルミニウム鋳造加工品の製造方法 |
| WO2018221435A1 (ja) * | 2017-05-31 | 2018-12-06 | 東洋アルミニウム株式会社 | アルミニウム積層体およびその製造方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101879827B1 (ko) * | 2013-08-14 | 2018-07-18 | 미쯔비시 케미컬 주식회사 | 나노임프린트용 몰드의 제조방법 및 반사방지물품 |
| KR20250055027A (ko) | 2023-10-17 | 2025-04-24 | (주)나노에코 | 전사 롤, 전사 롤의 양극산화장치와 양극산화방법 및 전사 롤로 전사한 물품 |
| KR20250055849A (ko) | 2023-10-18 | 2025-04-25 | (주)나노에코 | 알루미늄 원통-스핀들 세트, 알루미늄 원통 전해연마장치와 알루미늄 원통 전해연마방법 및 이에 의해 연마한 물품 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007030146A (ja) * | 2005-07-29 | 2007-02-08 | Fujifilm Corp | ナノ構造体の製造方法 |
| WO2008001847A1 (fr) * | 2006-06-30 | 2008-01-03 | Mitsubishi Rayon Co., Ltd. | Moule, procÉdÉ pour fabriquer un moule et procÉdÉ de fabrication d'une tole |
| WO2009054513A1 (ja) * | 2007-10-25 | 2009-04-30 | Mitsubishi Rayon Co., Ltd. | スタンパとその製造方法、成形体の製造方法、およびスタンパ用のアルミニウム原型 |
| WO2009107294A1 (ja) * | 2008-02-27 | 2009-09-03 | シャープ株式会社 | ローラー型ナノインプリント装置、ローラー型ナノインプリント装置用金型ロール、ローラー型ナノインプリント装置用固定ロール、及び、ナノインプリントシートの製造方法 |
| WO2009145049A1 (ja) * | 2008-05-27 | 2009-12-03 | ザ・インクテック株式会社 | 反射防止膜及びその製造方法 |
| WO2011030850A1 (ja) * | 2009-09-11 | 2011-03-17 | 日本軽金属株式会社 | スタンパ用アルミニウム原型用素材、スタンパ用アルミニウム原型及びスタンパ |
| JP2012037670A (ja) * | 2010-08-05 | 2012-02-23 | Dainippon Printing Co Ltd | 反射防止フィルム製造用金型の製造方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63288620A (ja) * | 1987-05-22 | 1988-11-25 | Kobe Steel Ltd | アルミニウムの電解複合超鏡面加工方法 |
| JP3902883B2 (ja) * | 1998-03-27 | 2007-04-11 | キヤノン株式会社 | ナノ構造体及びその製造方法 |
| US7079250B2 (en) * | 2002-01-08 | 2006-07-18 | Fuji Photo Film Co., Ltd. | Structure, structure manufacturing method and sensor using the same |
| US20060234396A1 (en) * | 2005-04-18 | 2006-10-19 | Fuji Photo Film Co., Ltd. | Method for producing structure |
| US8597767B2 (en) * | 2008-03-04 | 2013-12-03 | Sharp Kabushiki Kaisha | Optical element, roller type nanoimprinting apparatus, and process for producing die roll |
| EP2405036B1 (en) | 2009-03-05 | 2017-11-08 | Sharp Kabushiki Kaisha | Mold manufacturing method and electrode structure for use therein |
| WO2010125795A1 (ja) * | 2009-04-30 | 2010-11-04 | シャープ株式会社 | 型およびその製造方法 |
| JP4796217B2 (ja) * | 2009-10-09 | 2011-10-19 | シャープ株式会社 | 型および型の製造方法ならびに反射防止膜 |
| EP2495355B1 (en) * | 2009-10-28 | 2022-04-27 | Sharp Kabushiki Kaisha | Mold, method for manufacturing a mold, and antireflective film |
| JP5843784B2 (ja) * | 2009-12-22 | 2016-01-13 | スリーエム イノベイティブ プロパティズ カンパニー | 加圧ローラーを使用するマイクロコンタクトプリンティングのための装置及び方法 |
| WO2011105206A1 (ja) * | 2010-02-24 | 2011-09-01 | シャープ株式会社 | 型および型の製造方法ならびに反射防止膜の製造方法 |
| CN102791453B (zh) * | 2010-03-08 | 2014-08-06 | 夏普株式会社 | 脱模处理方法、模具、防反射膜的制造方法、脱模处理装置以及模具的清洗干燥装置 |
| US9108351B2 (en) * | 2010-03-09 | 2015-08-18 | Sharp Kabushiki Kaisha | Method for forming anodized layer, method for producing mold and method for producing antireflective film |
| US8524134B2 (en) * | 2010-07-12 | 2013-09-03 | Graham J. Hubbard | Method of molding polymeric materials to impart a desired texture thereto |
| TWI508872B (zh) * | 2010-07-26 | 2015-11-21 | Mitsubishi Rayon Co | 奈米壓印用模具的製造裝置以及奈米壓印用模具的製造方法 |
| US8999133B2 (en) * | 2010-08-30 | 2015-04-07 | Sharp Kabushiki Kaisha | Method for forming anodized layer and mold production method |
| KR101960105B1 (ko) * | 2010-09-29 | 2019-03-19 | 니폰 라이트 메탈 컴퍼니 리미티드 | 스탬퍼, 물품 및 그들의 제조 방법 |
| WO2012073820A1 (ja) * | 2010-11-30 | 2012-06-07 | シャープ株式会社 | 電極構造、基材保持装置および陽極酸化層の形成方法 |
| JP5971890B2 (ja) * | 2010-12-16 | 2016-08-17 | セイコーインスツル株式会社 | 時計部品の製造方法および時計部品 |
| CN103260841B (zh) * | 2011-05-26 | 2015-12-23 | 三菱丽阳株式会社 | 表面具有微细凹凸结构的物品的制造方法 |
| CN103890986A (zh) * | 2011-10-19 | 2014-06-25 | 富士胶片株式会社 | 热电转换元件及其制造方法 |
| TW201325884A (zh) * | 2011-12-29 | 2013-07-01 | Hon Hai Prec Ind Co Ltd | 光學薄膜壓印滾輪及該滾輪之製作方法 |
-
2014
- 2014-08-11 US US14/910,956 patent/US9457493B2/en active Active
- 2014-08-11 WO PCT/JP2014/071193 patent/WO2015022935A1/ja not_active Ceased
- 2014-08-11 CN CN201480044603.XA patent/CN105451966B/zh active Active
- 2014-08-11 JP JP2014541466A patent/JP6265127B2/ja active Active
- 2014-08-11 KR KR1020167003408A patent/KR101879797B1/ko active Active
- 2014-08-13 TW TW103127696A patent/TWI569946B/zh active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007030146A (ja) * | 2005-07-29 | 2007-02-08 | Fujifilm Corp | ナノ構造体の製造方法 |
| WO2008001847A1 (fr) * | 2006-06-30 | 2008-01-03 | Mitsubishi Rayon Co., Ltd. | Moule, procÉdÉ pour fabriquer un moule et procÉdÉ de fabrication d'une tole |
| WO2009054513A1 (ja) * | 2007-10-25 | 2009-04-30 | Mitsubishi Rayon Co., Ltd. | スタンパとその製造方法、成形体の製造方法、およびスタンパ用のアルミニウム原型 |
| WO2009107294A1 (ja) * | 2008-02-27 | 2009-09-03 | シャープ株式会社 | ローラー型ナノインプリント装置、ローラー型ナノインプリント装置用金型ロール、ローラー型ナノインプリント装置用固定ロール、及び、ナノインプリントシートの製造方法 |
| WO2009145049A1 (ja) * | 2008-05-27 | 2009-12-03 | ザ・インクテック株式会社 | 反射防止膜及びその製造方法 |
| WO2011030850A1 (ja) * | 2009-09-11 | 2011-03-17 | 日本軽金属株式会社 | スタンパ用アルミニウム原型用素材、スタンパ用アルミニウム原型及びスタンパ |
| JP2012037670A (ja) * | 2010-08-05 | 2012-02-23 | Dainippon Printing Co Ltd | 反射防止フィルム製造用金型の製造方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016155224A (ja) * | 2015-02-23 | 2016-09-01 | 三菱レイヨン株式会社 | ナノインプリント用モールドの製造方法 |
| JP2017155297A (ja) * | 2016-03-02 | 2017-09-07 | 株式会社ミツバ | アルミニウム鋳造加工品の製造方法 |
| WO2018221435A1 (ja) * | 2017-05-31 | 2018-12-06 | 東洋アルミニウム株式会社 | アルミニウム積層体およびその製造方法 |
| JPWO2018221435A1 (ja) * | 2017-05-31 | 2020-04-09 | 東洋アルミニウム株式会社 | アルミニウム積層体およびその製造方法 |
| JP7065087B2 (ja) | 2017-05-31 | 2022-05-11 | 東洋アルミニウム株式会社 | アルミニウム積層体およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160032148A (ko) | 2016-03-23 |
| CN105451966B (zh) | 2017-03-15 |
| JP6265127B2 (ja) | 2018-01-24 |
| TW201515816A (zh) | 2015-05-01 |
| US9457493B2 (en) | 2016-10-04 |
| CN105451966A (zh) | 2016-03-30 |
| JPWO2015022935A1 (ja) | 2017-03-02 |
| US20160200006A1 (en) | 2016-07-14 |
| KR101879797B1 (ko) | 2018-07-18 |
| TWI569946B (zh) | 2017-02-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6265127B2 (ja) | 円柱状ナノインプリント用モールドの製造方法、およびナノインプリント用再生モールドの製造方法 | |
| TWI788070B (zh) | 拋光物和用於製造化學機械拋光物的整合系統 | |
| JP5402391B2 (ja) | 半導体用合成石英ガラス基板の加工方法 | |
| JP6162417B2 (ja) | 半導体装置の製造方法 | |
| CN100513075C (zh) | 用于信息记录介质的玻璃衬底及其制造方法 | |
| JP5428793B2 (ja) | ガラス基板研磨方法および磁気記録媒体用ガラス基板の製造方法 | |
| JP7224128B2 (ja) | 基板用洗浄具、基板洗浄装置、基板処理装置、基板処理方法および基板用洗浄具の製造方法 | |
| US10829411B2 (en) | Rectangular glass substrate and method for preparing the same | |
| US20140154960A1 (en) | Cmp pad conditioner | |
| JP7313377B2 (ja) | 仕上げ媒体および仕上げ懸濁液 | |
| JP4998815B2 (ja) | ガラス基板洗浄装置及びガラス基板洗浄方法 | |
| JP6601271B2 (ja) | マスクブランク用ガラス基板 | |
| JP5923353B2 (ja) | 研磨パッド用シート及びその製造方法、研磨パッド及びその製造方法、並びに研磨方法 | |
| WO2023034874A1 (en) | Tools for chemical planarization | |
| JP6507706B2 (ja) | ナノインプリント用モールドの製造方法 | |
| US20200198090A1 (en) | Cmp apparatus and method of performing ceria-based cmp process | |
| JP2005081388A (ja) | フィルム基材またはテープ基材の加工機械に設置するローラーの製造方法 | |
| CN1315116C (zh) | 用于信息记录介质的玻璃衬底及其制造方法 | |
| CN117464554A (zh) | 一种研磨垫修整装置 | |
| JP6977657B2 (ja) | 両面研磨装置用キャリアの保管方法及びウェーハの両面研磨方法 | |
| KR100492771B1 (ko) | 토너카트리지 자기현상롤라의 재생방법 | |
| CN111805433B (zh) | 研磨装置以及研磨方法 | |
| CN108138331B (zh) | 基材的表面处理方法以及模具的制造方法 | |
| US20120015205A1 (en) | Surface Finishing Process for Indirect or Offset Printing Components | |
| JP6548919B2 (ja) | パッドのクリーニング方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 201480044603.X Country of ref document: CN |
|
| ENP | Entry into the national phase |
Ref document number: 2014541466 Country of ref document: JP Kind code of ref document: A |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14836583 Country of ref document: EP Kind code of ref document: A1 |
|
| ENP | Entry into the national phase |
Ref document number: 20167003408 Country of ref document: KR Kind code of ref document: A |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 14910956 Country of ref document: US |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 14836583 Country of ref document: EP Kind code of ref document: A1 |
