WO2015022875A1 - Printed circuit board inspection device - Google Patents

Printed circuit board inspection device Download PDF

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Publication number
WO2015022875A1
WO2015022875A1 PCT/JP2014/070549 JP2014070549W WO2015022875A1 WO 2015022875 A1 WO2015022875 A1 WO 2015022875A1 JP 2014070549 W JP2014070549 W JP 2014070549W WO 2015022875 A1 WO2015022875 A1 WO 2015022875A1
Authority
WO
WIPO (PCT)
Prior art keywords
inspection
printed circuit
circuit board
tray
unit
Prior art date
Application number
PCT/JP2014/070549
Other languages
French (fr)
Japanese (ja)
Inventor
利晃 花岡
成崇 中野
裕一 上村
Original Assignee
太洋工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 太洋工業株式会社 filed Critical 太洋工業株式会社
Priority to KR1020157036531A priority Critical patent/KR101735992B1/en
Priority to CN201480032844.2A priority patent/CN105358994B/en
Publication of WO2015022875A1 publication Critical patent/WO2015022875A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G01R1/07335—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards for double-sided contacting or for testing boards with surface-mounted devices (SMD's)
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2805—Bare printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing

Definitions

  • the present invention relates to a printed circuit board inspection apparatus for inspecting a continuity failure and insulation failure of a printed circuit board.
  • a pin contact method and a non-contact method are known as methods for inspecting a continuity failure and insulation failure of a printed circuit board.
  • each end of the plurality of inspection pins is electrically connected via a connector to a control unit that determines the electrical continuity state of the inspection target substrate.
  • electrical_connection and insulation is determined by applying a voltage between test
  • a printed circuit board for inspection is placed on a plate to which a vacuum pad is attached, and inspection is performed in a state where the flexible printed circuit board is vacuum-adsorbed and fixed to the plate. ing. If the inspection is performed in such a state, the printed circuit board is not deformed even if the inspection pin touches the pad, so that an accurate inspection can be performed.
  • the edge of the flexible printed circuit board is pulled in a state clamped by a clamper, and the printed circuit board forms a flat surface.
  • the tip is in contact with the pad on the printed circuit board.
  • inspection can be performed without adhering and fixing the printed circuit board with a vacuum pad. Furthermore, since both sides of the inspection can be performed simultaneously, the time required for the inspection can be shortened.
  • a plurality of wiring patterns having the same shape are formed on one sheet-shaped printed circuit board, and after the inspection is completed, the sheet-shaped printed circuit board is often cut and separated into individual printed circuit boards. .
  • Such a printed circuit board is inspected in the form of a sheet.
  • the present invention has been made in view of the above-described problems, and an object thereof is to provide an inspection apparatus that does not need to suck or pull the printed circuit board and can simultaneously inspect both surfaces of the printed circuit board.
  • a printed circuit board inspection apparatus brings an inspection pin into contact with a predetermined portion of a wiring of a printed circuit board having wiring formed on at least one surface, and two selected A printed circuit board inspection apparatus that inspects the continuity or insulation of the printed circuit board by applying a voltage between the inspection pins through the wiring, A plate-like tray formed of an insulating material on which the printed circuit board is placed; An upper inspection jig for inspecting wiring on the upper surface of the printed circuit board and a lower inspection jig for inspecting wiring on the lower surface; The upper inspection jig placed above the lower inspection jig is lowered, and the printed circuit board placed on the tray is sandwiched between the upper inspection jig and the lower inspection jig, thereby An elevating unit for contacting the inspection pin of the inspection jig and the wiring of the printed circuit board; An inspection unit that applies a voltage between two selected inspection pins of the upper inspection jig and measures a resistance value between them; And
  • the inspection pin of the lower inspection jig contacts the wiring on the lower surface of the printed circuit board through the opening formed in the tray, and the inspection unit selects the upper inspection jig and the lower inspection jig. It is preferable to apply a voltage between the two inspection pins and measure a resistance value between them.
  • a first guide pin inserted into a positioning hole formed in the printed board is attached to the upper surface of the tray.
  • a second guide pin that is inserted into a positioning hole formed in each of the printed circuit board and the tray is attached to the upper surface of the lower inspection jig.
  • a printed circuit board inspection apparatus includes a pair of substrate transport units that transport a printed circuit board placed on the tray in a horizontal direction, and the substrate transport unit has an end of the tray placed thereon. And a tray base having a third guide pin inserted into a positioning hole formed in the tray attached to the upper surface, and a chuck for gripping the tray with the tray base. .
  • the substrate transport unit is configured so that the tray table can move in the vertical direction, and after the inspection is finished, the tray placed on the tray table is raised, and the lower inspection jig
  • the second guide pin is preferably removed from the positioning hole of the printed board.
  • the substrate transport unit raises the tray base to a position where it does not contact the lower inspection jig when transporting a tray placed on the tray base, and when performing inspection, It is preferable that the tray table is lowered to a position where the tray is placed on the lower inspection jig.
  • the substrate transport unit releases the grip of the tray by the chuck when the tray is placed on the lower inspection jig.
  • the substrate reversing unit for reversing the direction of the printed circuit board placed on the tray between the pair of slide tables installed along the movement path of the pair of substrate transport units.
  • the substrate reversing unit is composed of a table for placing the tray, a rotating means for rotating the table, and a first elevating means for moving the table in the vertical direction. preferable.
  • an identification mark applying means for applying an identification mark to the wiring pattern determined to have poor insulation is installed.
  • the identification mark applying means is composed of a punching unit, and the punching unit collides with each other so as to sandwich the printed circuit board and opens a hole in the printed circuit board, and the upper puncher and the lower puncher.
  • the inspection apparatus of the present invention If the inspection apparatus of the present invention is used, the printed circuit board is transported and inspected in a state where it is placed on the tray, and it is not necessary to consider warping or twisting of the printed circuit board. As a result, the device can be manufactured at low cost. Moreover, since both sides of the printed circuit board can be inspected simultaneously, the time required for the inspection can be shortened.
  • FIG. 1 is a front view of main components of the printed circuit board inspection apparatus according to the first embodiment of the present invention.
  • FIG. 2 is a plan view of the printed circuit board inspection apparatus according to the first embodiment, as viewed from the line XX in FIG.
  • FIG. 3 is a block diagram of an electrical system configuration of the printed circuit board inspection apparatus according to the first embodiment.
  • FIG. 4 is a plan view showing an example of a tray and a printed circuit board placed on the tray.
  • FIG. 5 is a diagram showing a state in which a part of the printed circuit board 2 placed on the tray is looked up from below.
  • FIG. 6 is a cross-sectional view of a main part of the upper inspection jig according to the first embodiment.
  • FIG. 7 is a front view of the substrate transfer unit according to the first embodiment.
  • FIG. 8 is a plan view of the substrate transfer unit.
  • FIG. 9 is a side view of the substrate transport unit.
  • FIG. 10 is a flowchart for explaining the operation of the printed circuit board inspection apparatus.
  • FIG. 11 is a main part front view for explaining the operation of the upper inspection jig and the lower inspection jig.
  • FIG. 12 is a plan view illustrating the configuration of the substrate reversing unit and the punching unit of the printed circuit board inspection apparatus according to the second embodiment.
  • FIG. 1 is a diagram of main components of a printed circuit board inspection apparatus (hereinafter simply referred to as “inspection apparatus”) according to a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view taken along line XX in FIG.
  • FIG. 3 is a block diagram showing the configuration of the electrical system of the inspection apparatus.
  • the support column 601 is omitted, and only the outline of the tray 3 is indicated by a two-dot chain line in consideration of easy viewing.
  • the inspection apparatus 1 is mainly used for inspection of a flexible printed circuit board (hereinafter simply referred to as “printed circuit board”) in which wiring is formed on both front and back surfaces, and performs inspection of wiring on the upper surface of the printed circuit board 2.
  • the first characteristic point of the inspection apparatus is that the inspection is performed in a state where the above-described flexible printed circuit board 2 is placed on the flat tray 3.
  • the printed circuit board is vacuum-adsorbed and fixed to the plate so that inspection defects due to warping or twisting of the printed circuit board do not occur. Or inspected with the edge of the substrate pulled by a clamper.
  • inspection is performed in a state where the printed circuit board 2 placed on the flat tray 3 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5. If the inspection of the flexible printed circuit board 2 is performed in a state where it is placed on the tray 3, no warping or twisting occurs on the printed circuit board, so there is no need to suck the printed circuit board or pull it with a clamper. Furthermore, since a simple configuration in which the printed circuit board 2 placed on the tray 3 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5 can be employed, the cost of the inspection apparatus can be significantly reduced.
  • FIG. 4 (a) shows an example of the tray 3
  • FIG. 4 (b) shows an example of the printed circuit board 2 placed on the tray 3.
  • the flat tray 3 made of an insulating synthetic resin is formed with four guide pins 301, a plurality of positioning holes 302 and 303, and a plurality of openings 304.
  • wiring 201 and a plurality of positioning holes 202 are formed in the printed circuit board 2.
  • the guide pins 301 also serve to prevent the printed circuit board 2 from falling off. By inserting the guide pins 301 into the four holes 202 provided at opposite positions of the printed circuit board 2, the printed circuit board 2 is firmly attached to the tray 3. Fixed. Therefore, when the tray 3 is transported using the substrate transport unit 7, the printed circuit board 2 is not dropped from the tray 3 or shifted in position.
  • the four holes 302 formed at the left and right ends of the tray 3 are used when the tray 3 is transported using the substrate transport unit 7, and guide pins 713 ( If the tray 3 is transported in a state in which it is inserted, the tray 3 will not fall out of the substrate transport unit 7.
  • the other holes 303 formed in the tray 3 and the holes 202 formed at positions facing the printed circuit board 2 are positioning holes for the inspection jig, and are provided in the lower inspection jig 5 in these holes. By inserting the guide pins 504, the printed circuit board 2 is accurately positioned with respect to the lower inspection jig 5.
  • the plurality of openings 304 provided in the tray 3 are used for bringing the inspection pins of the lower inspection jig 5 into contact with the inspection target portions (for example, pads) of the wiring 201 formed on the lower surface of the printed board 2 at the time of inspection. Is.
  • the inspection can be performed without any trouble even when the printed circuit board 2 is placed on the tray 3.
  • the upper inspection jig 4 is lowered using the lifting unit 6, and the printed circuit board 2 placed on the flat tray 3 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5.
  • the inspection pins provided on each inspection jig are brought into contact with the pads of the printed circuit board 2 to inspect for wiring continuity and insulation defects.
  • FIG. 5 shows a state in which a part of the printed circuit board 2 placed on the tray 3 is looked up from below.
  • the satin-like portion indicates the printed circuit board 2
  • the two-dot chain line indicates the opening 304.
  • 5A and FIG. 5B the size and number of the opening portions 304 formed in the tray 3 are different.
  • the size of the opening 304 is kept to the minimum necessary, and in particular, in the place where the slit is formed in the printed circuit board 2, consideration is given to the position and size of the opening so that the printed circuit board 2 is not warped or twisted. There is a need to.
  • the printed circuit board 2 shown in FIGS. 5A and 5B includes three branch portions 2a, 2b, and 2c, and slits are formed around the branch portions. Further, a pad 203 which is a part of the wiring 201 is formed at each branch portion. In the inspection, the printed circuit board 2 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5, and the inspection pins of the lower inspection jig 5 are in contact with the pads 203 through the openings 304. Apply voltage to
  • the ends of the branches 2a, 2b, and 2c are self-weighted. May cause warping or twisting, and the inspection pin may not contact the target pad 203 in some cases.
  • FIG. 5B if openings 304 having a relatively small area are formed at positions facing the pads of the three branches 2a, 2b and 2c, the branches 2a, 2b and 2c are hardly bent, and the risk that the inspection pin does not contact the pad 203 due to warping or twisting can be avoided.
  • the printed circuit board 2 is inspected while being sandwiched between the upper inspection jig 4 and the lower inspection jig 5 and accurately positioned by the guide pins 504 and the positioning holes 202. High inspection is possible. The inspection process will be described in detail later with reference to FIGS.
  • the positions and sizes of the guide pins 301, the holes 302 and 303, and the openings 304 of the tray 3 vary depending on the shape of the wiring pattern formed on the printed circuit board 2 and the repeated pitch. Therefore, it is necessary to prepare a tray having a shape corresponding to the target printed circuit board.
  • the second feature of the inspection apparatus is that the inspection of the printed circuit board 2 on which a plurality of wiring patterns having the same shape are formed is performed a plurality of times by dividing the target area. As described above, when a printed circuit board is manufactured, a plurality of wiring patterns having the same shape are formed on a single sheet-like printed circuit board 2 having a large area, and after the inspection is completed, they are cut into individual patterns. Separated into printed circuit boards. The inspection apparatus of the present invention inspects the sheet-like printed circuit board 2 before being cut.
  • a total of 10 wiring patterns are regularly arranged on the printed circuit board 2 in five rows each having a pair of wiring patterns of the same shape. If these ten wiring patterns are to be inspected simultaneously, a huge number of inspection pins are required for the inspection jig, which makes the inspection jig expensive. In addition, the proportion of poor contact with the substrate increases. In order to avoid this, in the inspection apparatus of the present invention, inspection is performed using an inspection jig provided with a number of inspection pins corresponding to a pair of left and right wiring patterns.
  • the tray 3 is transported in the horizontal direction (direction indicated by arrow A in FIG. 2) by the pair of substrate transport units 7 and 7 disposed on the left and right of the lower inspection jig 5. Is done.
  • the substrate transport unit 7 has a function of transporting the tray 3 placed on the tray base 712 in the horizontal direction with the end of the tray 3 sandwiched between the chucks 725, and a function of placing the tray 3 on the lower inspection jig 5. It has.
  • the substrate transport unit 7 will be described in detail later with reference to the drawings.
  • the inspection apparatus according to the present invention is optimal as an inspection apparatus for a flexible printed board having wirings formed on both sides, but is not limited to the inspection of a flexible printed board having wirings formed on both sides. . Even in the inspection of a flexible printed circuit board or a hard printed circuit board in which wiring is formed only on one surface, the inspection of the printed circuit board can be performed automatically and in a short time by taking advantage of the two feature points described above.
  • the inspection apparatus according to the present invention is used for inspection of a flexible printed circuit board in which wiring is formed only on one surface, the same shape and structure as the lower inspection jig 5 instead of the lower inspection jig 5 A dummy jig having an inspection pin but no inspection pin is prepared, and a tray is placed thereon for inspection.
  • the inspection apparatus 1 applies a voltage between the control unit 8 that controls the operation of the elevating unit 6 and the substrate transport unit 7 and the inspection pins of the upper inspection jig 4 and the lower inspection jig 5, and the resistance therebetween. And an inspection unit 9 for measuring values.
  • the control unit 8 and the inspection unit 9 are accommodated in a casing of an inspection apparatus that is separately installed.
  • the control unit 8 is composed of a programmable logic controller, and controls the operations of the elevating unit 6 and the substrate transport unit 7 based on data input from the input display unit 801 and stored in the storage unit 802.
  • the lifting unit 6 moves the upper inspection jig 4 in the vertical direction by driving the air cylinder.
  • the board transport unit 7 drives the motor and the air cylinder to transport the tray 3 on which the printed circuit board 2 is placed in the horizontal direction or move it in the vertical direction.
  • the input display unit 801 of the control unit 8 is composed of a touch panel type liquid crystal device, and inputs data necessary for operating the elevating unit 6 and the substrate transport unit 7 and displays the data.
  • the storage unit 802 includes a flash memory or the like and stores data input from the input display unit 801.
  • the inspection unit 9 is composed of a personal computer, and includes an input display unit 901, a measurement unit 902, a storage unit 903, and a control unit 904.
  • the function of the control unit 904 is realized by executing a program read from the storage unit 903 by a CPU (Central processing Unit, not shown).
  • the input display unit 901 of the inspection unit 9 is composed of a touch panel type liquid crystal device, and is used for inputting data necessary for determining the quality of continuity and insulation, and for displaying the result of determination of quality of continuity and insulation.
  • the measuring unit 902 applies a voltage between the two inspection pins selected from the inspection pins of the upper inspection jig 4 and the lower inspection jig 5 via the wiring 201 of the printed circuit board 2, and between them Measure the resistance value.
  • the storage unit 903 is usually composed of an HDD (Hard Disk Drive), and is used to store programs and data input from the input display unit 901, data of determination results, and the like.
  • HDD Hard Disk Drive
  • the control unit 904 compares the resistance value measured by the measurement unit 902 with the resistance value of a good printed circuit board stored in the storage unit 903, and determines whether the target printed circuit board is conductive or insulated. The determination result is stored in the storage unit 903 and displayed on the input display unit 901 as necessary.
  • the lifting unit 6 and the upper inspection jig 4 will be described.
  • the lifting / lowering unit 6 moves the upper inspection jig 4 in the vertical direction.
  • the lifting unit 6 includes a top plate 602 supported by four columns 601 installed on the base 101, a plate 603 that supports the upper inspection jig 4, and a cylinder body attached to the top plate 602.
  • An air cylinder 604 whose tip is fixed to the plate 603 via a joint, and a linear guide 606 that is attached to four corners of the plate 603 and guides the vertical movement of the plate 603 together with the column 601.
  • the upper inspection jig 4 is attached to the plate 603. Specifically, a pair of left and right long fixtures 607 and 607 are installed on the lower surface of the plate 603, and the left and right ends of the support plate 402 of the upper inspection jig 4 are inserted into the grooves of the fixture 607. By doing so, the upper inspection jig 4 is attached to the plate 603.
  • the upper inspection jig 4 includes an inspection board 401 having a plurality of inspection pins, a support plate 402 made of a flat plate-shaped synthetic resin for attaching the upper inspection jig 4 to the plate 603 of the elevating unit 6, and an inspection board It is composed of a plurality of columns 403 for fixing 401 to the support plate 402.
  • the space between the inspection board 401 and the support plate 402 is a passage for a lead wire drawn out from the inspection pin of the inspection board 401.
  • FIG. 6 is a cross-sectional view of the main part of the inspection board 401.
  • FIG. 6A shows a state before inspection
  • FIG. 6B shows a state during inspection.
  • the inspection board 401 is a laminate of two boards 411 and 412 made of an insulating resin. A push member 413 and a probe 417 are attached to the main board 411, and a guide hole 424 for guiding the inspection pin is formed in the guide board 412.
  • the pushing member 413 presses the guide board 412 in a direction away from the main board 411.
  • the pushing member 413 includes a bottomed cylindrical case 414 fixed to the main board 411, a columnar pushing pin 415 inserted into the case 414, and a compression spring 416 inserted between the case 414 and the pushing pin 415. It consists of The guide board 412 is separated from the main board 411 by the repulsive force of the compression spring 416 when not inspected.
  • the probe 417 abuts the inspection pin 418 on the inspection target portion (for example, the pad 203 shown in FIG. 5) during the inspection.
  • the probe 417 is fixed to the inspection pin 418 and the main board 411.
  • a bottomed cylindrical socket 419, a compression spring 420 inserted between the socket 419 and the rear end 421 of the inspection pin 418, and an insulating pipe 422 for preventing electric shock attached to the rear end of the socket 419 It consists of
  • the inspection pin 418, the compression spring 420, and the socket 419 are made of conductive metal, and a lead wire 423 is connected to the rear end of the socket 419. As shown in FIG. 6A, the inspection pin 418 is always biased toward the guide board 412 by the compression spring 420.
  • the pushing member 413 and the probe 417 are attached to the main board 411 one by one. However, in the actual inspection board 401, the pushing member 413 is arranged so that the force pushing the guide board 412 is equalized. These are attached to the four corners of the rectangular parallelepiped main board 411, respectively. Probes 417 are attached to positions on the printed circuit board 2 that are opposed to the inspection target portions.
  • the inspection pin 418, the socket 419 and the compression spring 420 are made of a conductive material, when a constant voltage is applied between the two inspection pins 418 selected by the inspection unit 9. A current flows between the inspection pins via the wiring 201.
  • the resistance value between the inspection pins is measured by a measuring instrument built in the measuring unit 902 and the value is compared with the value of a non-defective printed circuit board stored in the storage unit 903 in the control unit 904, The quality of continuity and insulation can be determined.
  • the structure of the inspection board 401 shown in FIG. 6 is an example, and is not limited to this structure.
  • An inspection board having another structure may be adopted as long as the same function can be exhibited.
  • the lower inspection jig 5 inspects the wiring formed on the lower surface of the printed circuit board 2.
  • the inspection board 501 having a plurality of inspection pins and the lower inspection jig 5 are fixed to the base 101.
  • the lower inspection jig 5 is attached to a plate 102 fixed to the base 101.
  • a pair of long fixtures 103 are provided on the left and right sides of the plate 102. By inserting the left and right ends of the support plate 502 of the lower inspection jig 5 into the grooves of the fixture 103, The inspection jig 5 is attached to the plate 102.
  • the difference between the upper inspection jig 4 and the lower inspection jig 5 described above is that the upper inspection jig 4 can be moved in the vertical direction by the lifting unit 6, whereas the lower inspection jig 5 is based on the plate 102.
  • a guide pin 504 for positioning the printed circuit board 2 is attached to the point fixed to the base 101 and the inspection board 501, and a hole (not shown) for accommodating the guide pin 504 is provided at a position facing the upper inspection jig 4. ) Is formed.
  • the printed circuit board 2 becomes a lower inspection jig. 5 is accurately positioned, and the inspection pin comes into contact with the wiring (for example, pad) 201 of the inspection object portion without error.
  • the lift unit 6 is driven to lower the plate 603, and the printed circuit board 2 placed on the tray 3 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5. After the inspection is completed, the lift unit 6 is driven to raise the plate 603 and then held at the position shown in FIG.
  • FIGS. 7 is a front view of the left unit of the pair of substrate transfer units 7 and 7 in FIG. 1, FIG. 8 is a plan view of the unit, and FIG. 9 is a side view of the unit.
  • tubes, valves, motors and various sensors for supplying compressed air to the air cylinder and wiring for connecting the control unit 8 are omitted.
  • bolts and nuts for fixing the members are shown in the figure, these are general-purpose fastening members and will not be described with reference numerals.
  • the substrate transport unit 7 transports the tray 3 on which the printed circuit board 2 is placed in the horizontal direction.
  • a pair of slide tables 701 having a rectangular cross section are installed on the left and right sides of the lower inspection jig 5 along the movement path.
  • the slide table 701 is a member for transporting the tray 3 in the horizontal direction.
  • a ball screw (not shown) accommodated in the table is rotated, the slide block 702 is indicated by an arrow A on the slide table 701. Move in the direction.
  • a guide mounting plate 704 and a first air cylinder 705 are mounted on the upper surface of the support plate 703 by bolts or the like.
  • One end of the first connecting plate 707 is attached to the upper portion of the piston rod 706 of the air cylinder 705 via a joint, and the other end of the first connecting plate 707 is sandwiched between the guide attaching plate 704.
  • An arm base 711 having an L-shaped cross section is attached.
  • 1st linear guide 708 which guides the raising / lowering of the arm base 711 is attached to the side surface of the guide attachment plate 704.
  • the first linear guide 708 includes a rail 709 attached to the guide attachment plate 704 and a block 710 attached to the arm base 711.
  • the connecting plate 707 is moved up and down by contracting or extending the piston rod 706 of the first air cylinder 705
  • the block 710 moves up and down along the rail 709, thereby enabling the arm base 711 to move up and down smoothly. Yes.
  • a tray base 712 having guide pins 713 installed at both ends is attached to the top surface of the tip of the arm base 711. As shown in FIG. 1, the end of the tray 3 is placed on the tray base 712. The tray 3 is transported. At this time, the guide pins 713 are inserted into the positioning holes 302 (see FIG. 3) formed at the end of the tray 3.
  • a second air cylinder 715 is attached to the lower surface of the first connecting plate 707, and a second connecting plate 717 having an L-shaped cross section is attached to the tip of the piston rod 716 via a joint. ing. Further, a pair of cylinder mounting plates 718 and 718 having a U-shaped cross section are attached to both ends of the second connecting plate 717 via bolts, respectively.
  • a third air cylinder 721 is accommodated in the groove of the cylinder mounting plate 718.
  • the rear portion of the air cylinder 721 is rotatably attached to the cylinder attachment plate 718 via a pin 722, and the front end of the piston rod 723 is connected to the chuck 725 via a hinge pin 724.
  • the chuck 725 sandwiches the end of the tray 3 placed on the tray base 712, and is attached to the cylinder mounting plate 718 in a rotatable state via a pin 726 disposed at the lower part.
  • the piston rod 723 is contracted, the chuck 725 rotates counterclockwise around the pin 726 as shown by a two-dot chain line in FIG. 7, and the tray 3 is released from gripping by the chuck 725.
  • a urethane sheet 727 is affixed to the lower surface of the chuck 725 to prevent rattling that occurs when the tray 3 is sandwiched between the chuck 725 and the tray base 712.
  • a second linear guide 731 is installed between the cylinder mounting plate 718 and the arm base 711. As shown in FIG. 9, the second linear guide 731 includes a rail 732 attached to the upper surface of the arm base 711 in parallel with the cylinder attachment plate 718 and a block 733 attached to the lower surface of the cylinder attachment plate 718. Then, the movement of the cylinder mounting plate 718 in the horizontal direction (the direction indicated by the arrow C in FIGS. 7 and 8) is guided.
  • the reason why the cylinder mounting plate 718 can be moved in the horizontal direction is to prevent the chuck 725 from getting in the way when the operator attaches the tray 3 to the tray base 712 or removes the tray 3 from the tray base 712. It is. As the cylinder mounting plate 718 moves backward, the chuck 725 is retracted to a position where the tray 3 does not contact.
  • FIG. 10 is a flowchart showing the flow of the operation of the inspection apparatus 1
  • FIG. 11 is a side view of the main part for explaining the operations of the upper inspection jig 4 and the lower inspection jig 5.
  • the substrate transfer unit 7 stands by at the position shown in FIG.
  • the tray table 712 is held at a position higher than the lower inspection jig 5.
  • the chuck 725 is in an open state, and the chuck 725 is further retracted by the linear guide 731, so that it does not get in the way when the operator places the tray 3 on the tray base 712.
  • the operator attaches both end portions of the tray 3 to the tray bases 712 of the pair of substrate transport units 7 (step S11).
  • the operator inserts the four guide pins 713 attached to the tray base 712 into the four positioning holes 302 (see FIG. 4) formed at both ends of the tray 3, respectively. It mounts on the stand 712 (refer FIG. 2).
  • the operator places the printed circuit board 2 on the tray 3, and sets the guide pins 301 of the tray 3 so that the printed circuit board 2 does not fall out of the tray 3.
  • the second hole 202 is inserted (step S13). Thus, preparation for transporting the tray 3 is completed.
  • step S14 The subsequent operations are automatically performed based on the data stored in the storage unit 802 (see FIG. 3) of the control unit 8.
  • the slide table 701 is driven to move the slide block 702 in the horizontal direction, and the wiring pattern for the first inspection on the tray 3 is placed above the lower inspection jig 5. Transport until it comes (step S14)
  • Step S15 When the slide block 702 moves to the designated position and stops, the first air cylinder 705 of the tray transport unit 7 is driven, the piston rod 706 is contracted, and the arm base 711 is lowered. As the arm base 711 is lowered, the piston rod 723 of the third air cylinder 721 contracts and the chuck 725 rotates around the pin 726 (see FIG. 7), and the tray 3 is released from the grip of the chuck 725. (Step S15).
  • step S16 by driving the air cylinder 604 of the elevating unit 6 and extending the piston rod 605, the upper inspection jig 4 is lowered, and as shown in FIG. 11 (c), the inspection board 401 of the upper inspection jig 4 and The tray 3 is stopped while the tray 3 is sandwiched between the inspection boards 501 of the lower inspection jig 5 (step S16).
  • the compression spring 416 of the upper inspection jig 4 is pressed by pressure.
  • the tip of the inspection pin 418 is exposed from the guide hole 424 and contacts the wiring 201 formed on the upper surface of the printed board 2.
  • the wiring 201 formed on the lower surface of the printed circuit board 2 is also formed on the lower surface of the printed circuit board 2 in the same manner as the upper inspection jig 4 because the compression spring contracts and the tip of the inspection pin is exposed from the guide hole. 201 is contacted.
  • the continuity or insulation of the printed circuit board 2 is inspected (step S17). Specifically, the measurement unit 902 of the inspection unit 9 applies a voltage between the two selected inspection pins 418, measures the resistance value between the inspection pins, and sends the value to the control unit 904. .
  • the control unit 904 compares the measured resistance value between the inspection pins with the resistance value of a non-defective printed circuit board stored in the storage unit 903, and determines whether the printed circuit board to be inspected is conductive or insulated. Pass / fail judgment is performed. The determination result is displayed on the input display unit 901 by the control unit 904 and further written in the storage unit 903.
  • the air cylinder 604 of the elevating unit 6 is driven to contract the piston rod 605, whereby the upper inspection jig 4 is raised to the position shown in FIG. S18).
  • the position of the upper inspection jig 4 shown in FIG. 11 (d) is set lower than the position of the upper inspection jig 4 shown in FIG. 11 (b). This is for shortening the descent time of the upper inspection jig 4 when performing the next inspection.
  • the first air cylinder 705 of the substrate transport unit 7 is driven, the piston rod 706 is extended, the arm base 711 is raised, and the tray 3 is separated from the lower inspection jig 5.
  • the third air cylinder 721 of the substrate transport unit 7 operates slightly later than the start of raising the tray 3, the piston rod 723 extends, the chuck 725 rotates clockwise around the pin 726, and between the tray table 712. Then, the end of the tray 3 is gripped again (step S19).
  • the tray 3 When the tray 3 is raised, the printed circuit board 2 fixed to the lower inspection jig 5 by the guide pins 504 is detached from the lower inspection jig 5 with the guide pins 504 removed from the positioning holes 202. Finally, the tray 3 is raised to the position shown in FIG.
  • the control unit 904 of the inspection unit 9 confirms from the inspection data stored in the storage unit 903 whether or not the inspection of all the wiring patterns on the printed circuit board 2 has been completed (step S20). (No in the same step), the process returns to step S14, and the processes of steps S14 to S19 are repeated.
  • control unit 904 determines that the inspection of all the wiring patterns of the printed circuit board 2 has been completed (Yes in step S20)
  • the control unit 904 transmits data indicating that the inspection has been completed to the control unit 8.
  • the control unit 8 raises the upper inspection jig 4 to the initial position shown in FIG. 11A, and drives the slide table 701 to move the substrate transport unit 7 to the initial position (step S21).
  • the operator removes the printed circuit board 2 placed on the tray 3 from the tray 3 (step S22).
  • the operator determines that conduction or insulation is poor among the printed circuit boards 2 removed from the tray 3 based on the inspection result displayed on the input display unit 901 of the inspection unit 9.
  • a sticker on which an identification mark is displayed is pasted at the place of the printed wiring pattern.
  • the printed circuit board 2 on which the identification seal is affixed is separated for each wiring pattern by a cutter (not shown). Of the individually separated printed boards, the board with the identification sticker is discarded, and only good printed boards are shipped as products.
  • step S23 the operator determines whether or not the inspection of all the printed circuit boards to be inspected has been completed. If there is no printed circuit board (No), the process returns to step S13 to place a new printed circuit board 2 on the tray 3.
  • Step S23 when the inspection has been completed for all the printed boards (Yes in Step S23), the process proceeds to Step S24, and the operator removes the tray 3 from the board transport unit 7. Specifically, when the operator presses the button of the control unit 8, the piston rod 723 of the third air cylinder 721 of the substrate transport unit 7 is contracted, the chuck 725 is rotated around the pin 726, and the tray 3 is chucked. Release from gripping by 725. Further, the piston rod 716 of the second air cylinder 715 contracts and the chuck 725 moves backward.
  • the operator removes the tray 3 from the tray base 712. At this time, since the chuck 7 is in the retracted position, it does not get in the way when the tray 3 is removed from the tray base 712.
  • the inspection apparatus when the inspection apparatus according to the present embodiment is used, it is not necessary to consider warping or twisting of the flexible printed circuit board, so that the configuration of the apparatus is simplified, and as a result, the inspection apparatus can be manufactured at low cost. . Moreover, since the wiring on both sides of the printed circuit board can be inspected simultaneously, the time required for the inspection can be shortened.
  • air cylinders are used as driving means for the elevating unit 6 and the substrate transport unit 7, but the present invention is not limited to this. It goes without saying that the same function can be realized even if a hydraulic cylinder or an actuator driven by an electromagnet is used as the driving means.
  • FIG. 12 shows the substrate reversing unit 11 and the punching unit 12 disposed in the vicinity of the rear portion of the slide table 701.
  • ⁇ Substrate reversing unit> As shown in FIG. 4B described above, a plurality of the same wiring patterns are regularly formed on the printed circuit board 2. After the inspection of the printed circuit board 2 is completed, the printed circuit board 2 is cut and separated into individual printed circuit boards.
  • the wiring pattern shown in FIG. 4B will be further described.
  • one wiring pattern and a wiring pattern obtained by inverting the wiring pattern are arranged close to each other. It is a thing.
  • the wiring pattern direction may be reversed for each pitch.
  • the entire board can be inspected simply by repeatedly carrying the printed board 2 by the board carrying unit 7.
  • the upper inspection jig 4 and the lower inspection jig 5 having the number of inspection pins 418 corresponding to the pair of wiring patterns are used.
  • the printed circuit board 2 By inspecting the printed circuit board 2 as a whole by repeating the inspection while shifting the wiring pattern by one pitch by the substrate transport unit 7.
  • the printed circuit board is rotated by 180 degrees using the substrate reversing unit 11, and then the wiring pattern in the reverse direction is used.
  • the wiring is inspected in the same manner as in the forward direction. In this way, it is not necessary to prepare an inspection jig having two types of inspection pins, so that inspection costs can be reduced.
  • the configuration and operation of the substrate reversing unit 11 will be described with reference to FIG.
  • the substrate reversing unit 11 is controlled by the control unit 8 described in the first embodiment.
  • the substrate reversing unit 11 includes a table 111 on which the tray 3 transported by the substrate transport unit 7 is placed, an air cylinder 112 that rotates the table 111, and an air cylinder 113 that moves the table 111 up and down.
  • FIG. 12 shows the outline of the tray 3 placed on the table 111 with a two-dot chain line.
  • Guide pins 114 are provided at the four corners of the table 111, respectively. By inserting the guide pins 114 into the holes formed at the opposite positions of the tray 3, the tray 3 is positioned with respect to the table 111 and further prevents the tray 3 from dropping from the table 111.
  • the rotating shaft of the air cylinder 112 which is a driving means is connected to the lower surface of the center of the table 111. Since the rotation shaft is installed at the intermediate point between the pair of slide tables 701 and 701, when the tray 3 placed on the table 111 is rotated 180 degrees by the air cylinder 113, the tray 3 is the same with respect to the slide table 701. Held in position.
  • the operation of the substrate reversing unit 11 will be described.
  • the piston rod (not shown) of the air cylinder 113 is contracted so as not to hinder the transport of the tray 3 by the substrate transport unit 7, so positioned.
  • the printed circuit board 2 for which the inspection of the wiring pattern in the forward direction has been completed is transported to the position indicated by the two-dot chain line in FIG. Thereafter, the tray 3 is released from the grip of the chuck 725, and the chuck 725 is further retracted to a position where it does not interfere with the removal of the tray 3 by the linear guide 731.
  • the tray 3 stops above the tray base 712, and the air cylinder 112 rotates at that position to rotate the tray 3 180 degrees.
  • the piston rod (not shown) of the air cylinder 113 is contracted to lower the table 111, and the inverted tray 3 is placed on the tray base 712.
  • the table 111 is lowered to the bottom of the tray table 712 and then stops.
  • the chuck 725 moves forward by the linear guide 731 and further grips the end of the tray 3 placed on the tray base 712.
  • the inverted tray 3 is transported to a position where the inspection by the inspection jigs 4 and 5 is performed, and the wiring pattern in the reverse direction is inspected according to the above-described procedure.
  • ⁇ Punching unit> As described with reference to the flowchart of FIG. 10, the printed circuit board 2 that has been inspected is separated for each wiring pattern, and only a board that is determined to be non-defective is shipped. If an identification mark is given to a wiring pattern determined to have poor conduction or insulation failure at the time of separation, only the substrate needs to be discarded after the division, so that the time required for separation can be shortened.
  • the seal is pasted as an identification mark on the wiring pattern that is determined to be defective by the operator.
  • manual operation by the operator is necessary, which causes an increase in cost.
  • the time required for the inspection becomes longer.
  • identification mark applying means for applying an identification mark to a wiring pattern determined to be defective among the wiring patterns of the printed circuit board. Specifically, a hole is made as an identification mark in the wiring pattern determined to be defective using the punching unit 12 so that the wiring pattern determined to be poor conduction or insulation failure can be seen at a glance.
  • the punching unit 12 includes an upper puncher 121, a lower puncher 122, an air cylinder 123 that moves the lower puncher 122 up and down, and a slider 124 that moves the air cylinder 123 in the horizontal direction.
  • the punching unit 12 is controlled by the control unit 8 in the same manner as the substrate reversing unit 11.
  • the upper puncher 121 and the lower puncher 122 are attached to the upper end portion and the lower end portion of the U-shaped arm, and are configured to be moved integrally in the horizontal direction by the slider 124.
  • the upper puncher 121 is also provided with an air cylinder for moving the puncher up and down. However, since this performs the same function as the air cylinder 123, it is omitted in FIG. is doing.
  • the upper puncher 121 When the upper puncher 121 is not in operation, the upper puncher 121 is held at a position higher than the tray base 712 so as not to prevent the substrate transport unit 7 from transporting the tray 3 by driving an air cylinder (not shown). Similarly, the lower puncher 122 is held at a position lower than the tray base 712 by driving the air cylinder 123.
  • the tray 3 is transported to the rear part of the slide table 701 by the substrate transport unit 7.
  • the substrate transport unit 7 stops. Thereafter, by driving the slider 124, the upper puncher 121 and the lower puncher 122 stop at a position where the opening 304 of the tray 3 is located.
  • the printed circuit board 2 in which the hole is formed in the wiring pattern having poor conduction or insulation failure is transported to the initial position by the board transport unit 7 and then removed from the tray 3 by the operator's hand.
  • the printed circuit board 2 removed from the tray 3 is separated for each wiring pattern. However, since the wiring pattern with poor conduction and insulation is perforated, the quality of the printed circuit board can be easily identified.
  • the printed board is perforated as a mark for identifying a wiring pattern having poor conduction or insulation, but the identification mark is not limited to this.
  • a sticker may be attached to a corresponding portion of the printed board.
  • an air cylinder is used as a driving means for the substrate reversing unit 11 and the punching unit 12 as in the case of the lifting unit 6 and the substrate transport unit 7, but an actuator using a hydraulic cylinder or an electromagnet instead of these. It goes without saying that may be used.
  • the table 111 of the substrate reversing unit 11 and the slider 124 of the punching unit 12 are installed in a partially overlapping state, but this is intended for effective use of space. If there is no hindrance to raising and lowering the table 111 and the lower puncher 122, there is no particular problem even if they are installed at overlapping positions.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Environmental & Geological Engineering (AREA)

Abstract

Provided is an inspection device for inspecting the quality of the conduction and insulation of a printed circuit board, wherein there is no need to take the warping and twisting of the printed circuit board into consideration and both sides of the printed circuit board can be inspected simultaneously. An inspection device (1) according to the present invention inspects a printed circuit board (2) placed on a plate-like tray (3) in a state in which the printed circuit board (2) is held between an upper inspection jig (4) and a lower inspection jig (5). At the time of the inspection, a lifting and lowering unit (6) is used to lower the upper inspection jig (4), and the printed circuit board (2) placed on the plate-like tray (3) is sandwiched between the upper inspection jig (4) and lower inspection jig (5). In this state, an inspection pin provided in the upper inspection jig (4) is made to come into contact with wiring formed on the upper surface of the printed circuit board (2), and the conduction or insulation between the inspection pin and the wiring is inspected.

Description

プリント基板検査装置Printed circuit board inspection equipment
　本発明は、プリント基板の導通不良および絶縁不良を検査するプリント基板検査装置に関する。 The present invention relates to a printed circuit board inspection apparatus for inspecting a continuity failure and insulation failure of a printed circuit board.
　一般に、プリント基板の導通不良および絶縁不良を検査する方式として、ピンコンタクト方式と非接触方式が知られている。このうちピンコンタクト方式の検査装置では、検査対象基板の電気的な導通の状態を判定する制御部に、複数の検査ピンのそれぞれの端部がコネクタを介して電気的に接続されている。そして、検査ピンの先端を検査対象基板に設けられた配線に接触させた状態で検査ピン間に電圧を印加して抵抗値を計測することにより、導通および絶縁の良否を判定している。 Generally, a pin contact method and a non-contact method are known as methods for inspecting a continuity failure and insulation failure of a printed circuit board. Among these, in the pin contact type inspection apparatus, each end of the plurality of inspection pins is electrically connected via a connector to a control unit that determines the electrical continuity state of the inspection target substrate. And the quality of conduction | electrical_connection and insulation is determined by applying a voltage between test | inspection pins in the state which made the front-end | tip of a test | inspection pin contact the wiring provided in the test object board | substrate, and measuring resistance value.
　上述のピンコンタクト方式の検査装置において、検査対象がフレキシブルプリント基板の場合には、プリント基板のそりやねじれにより検査不良が生じないように、様々な対策が施されている。 In the above-described pin contact type inspection apparatus, when the inspection target is a flexible printed circuit board, various measures are taken so that inspection defects do not occur due to warping or twisting of the printed circuit board.
　特許文献１の背景技術の欄に記載の検査装置では、真空パッドが取り付けられたプレート上に検査用プリント基板を載置し、フレキシブルプリント基板を真空吸着してプレートに固定した状態で検査を行っている。このような状態で検査を行えば、検査ピンがパッドに当触してもプリント基板が変形しないため、正確な検査が行える。 In the inspection apparatus described in the background art section of Patent Document 1, a printed circuit board for inspection is placed on a plate to which a vacuum pad is attached, and inspection is performed in a state where the flexible printed circuit board is vacuum-adsorbed and fixed to the plate. ing. If the inspection is performed in such a state, the printed circuit board is not deformed even if the inspection pin touches the pad, so that an accurate inspection can be performed.
　これに対し、特許文献１の実施の形態の欄に記載の検査装置では、フレキシブルプリント基板の縁部をクランパでクランプした状態で引っ張り、プリント基板が平面をなすようにした状態で、検査ピンの先端をプリント基板のパッドに接触させている。 On the other hand, in the inspection apparatus described in the column of the embodiment of Patent Document 1, the edge of the flexible printed circuit board is pulled in a state clamped by a clamper, and the printed circuit board forms a flat surface. The tip is in contact with the pad on the printed circuit board.
　この検査装置によれば、プリント基板を真空パッドで吸着して固定しなくても検査が行える。更に、両面の検査を同時に行うことができるため、検査に必要な時間を短縮できる。 According to this inspection device, inspection can be performed without adhering and fixing the printed circuit board with a vacuum pad. Furthermore, since both sides of the inspection can be performed simultaneously, the time required for the inspection can be shortened.
　一方、フレキシブルプリント基板の製造に際しては、一枚のシート状プリント基板に同一形状の配線パターンを複数形成し、検査終了後、シート状プリント基板を切断して個別のプリント基板に分離する場合が多い。このようなプリント基板はシートの状態で検査が行われる。 On the other hand, when manufacturing a flexible printed circuit board, a plurality of wiring patterns having the same shape are formed on one sheet-shaped printed circuit board, and after the inspection is completed, the sheet-shaped printed circuit board is often cut and separated into individual printed circuit boards. . Such a printed circuit board is inspected in the form of a sheet.
　プリント基板を検査する場合、プリント基板の検査箇所に対応する位置に検査ピンを配置した専用の治具を作成する必要がある。この治具は、検査ピンの数が多くなるほど高価になるため、上述したシート状プリント基板では、個別のプリント基板に対応した数の検査ピンを有する検査治具を用意し、シートの位置をずらしながら、個別のプリント基板の検査を行っている。 When inspecting a printed circuit board, it is necessary to create a dedicated jig in which inspection pins are arranged at positions corresponding to the inspection locations of the printed circuit board. Since this jig becomes more expensive as the number of inspection pins increases, an inspection jig having a number of inspection pins corresponding to the individual printed circuit board is prepared for the above-described sheet-like printed board, and the position of the sheet is shifted. However, individual printed circuit boards are inspected.
特表２００７－５２９００８号公報Special table 2007-529008 gazette
　特許文献１の背景技術の欄に記載されたような、プリント基板を吸着した状態で検査するタイプの検査装置では、プリント基板の片面毎に検査を行う必要がある。またプリント基板の移動にあわせてプレートを移動させるか、移動ごとに吸着を解除し、移動後にプリント基板を再度吸着する必要があるため、検査装置の構造が複雑化し、また大型化する。 In an inspection apparatus of a type that inspects a printed circuit board while adsorbed as described in the background art section of Patent Document 1, it is necessary to perform inspection on each side of the printed circuit board. Further, since it is necessary to move the plate in accordance with the movement of the printed circuit board or to release the suction every time the movement is performed and to suck the printed circuit board again after the movement, the structure of the inspection apparatus becomes complicated and larger.
　更に、プリント基板を吸着した状態で検査する検査装置では、両面に配線が形成されたプリント基板について片面ごとに検査を行い、片面の検査終了後にシートをひっくり返す必要があるため、検査を完了するまでに時間がかかる。 Furthermore, in the inspection apparatus that inspects the printed circuit board while adsorbing the printed circuit board, it is necessary to inspect the printed circuit board on both sides of each side and turn the sheet upside down after completing the inspection on one side. Takes time.
　一方、特許文献１の実施の形態の欄に記載されたような、フレキシブルプリント基板の縁部をクランパでクランプした状態で検査を行う装置では、両面の検査を同時に行うことができるが、検査が終了するまでの間、そりやねじれが生じないようにプリント基板を引っ張り続ける必要があり、張力を正確に制御できるクランパが必要となるため、検査装置が高価になる。 On the other hand, in an apparatus that inspects the edge of a flexible printed circuit board as clamped by a clamper, as described in the embodiment of Patent Document 1, both sides can be inspected simultaneously. Until the process is completed, it is necessary to continue to pull the printed circuit board so that warping and twisting do not occur, and a clamper that can accurately control the tension is required, which makes the inspection apparatus expensive.
　本発明は上述の問題点に鑑みてなされたもので、プリント基板を吸着したり引っ張ったりする必要がなく、しかもプリント基板の両面を同時に検査できる検査装置を提供することを目的とする。 The present invention has been made in view of the above-described problems, and an object thereof is to provide an inspection apparatus that does not need to suck or pull the printed circuit board and can simultaneously inspect both surfaces of the printed circuit board.
　上記目的を達成するため、本発明にかかるプリント基板検査装置は、少なくとも一方の面に配線が形成されたプリント基板の当該配線の所定の箇所に検査ピンを接触させると共に、選択された２本の検査ピンの間に、前記配線を介して電圧を印加して前記プリント基板の導通または絶縁の良否を検査するプリント基板検査装置であって、
　前記プリント基板を載置する、絶縁材料で形成された板状のトレイと、
　前記プリント基板の上面の配線の検査を行う上検査治具および下面の配線の検査を行う下検査治具と、
　前記下検査治具の上方に配置された前記上検査治具を下降させ、かつ前記トレイに載置された状態のプリント基板を前記上検査治具および下検査治具で挟むことにより、前記上検査治具の検査ピンと前記プリント基板の配線とを接触させる昇降ユニットと、
　前記上検査治具の選択された２本の検査ピンの間に電圧を印加すると共に、それらの間の抵抗値を計測する検査ユニットと、
　前記昇降ユニットの動作を制御する制御ユニットと、を備えたことを特徴とする。 In order to achieve the above object, a printed circuit board inspection apparatus according to the present invention brings an inspection pin into contact with a predetermined portion of a wiring of a printed circuit board having wiring formed on at least one surface, and two selected A printed circuit board inspection apparatus that inspects the continuity or insulation of the printed circuit board by applying a voltage between the inspection pins through the wiring,
A plate-like tray formed of an insulating material on which the printed circuit board is placed;
An upper inspection jig for inspecting wiring on the upper surface of the printed circuit board and a lower inspection jig for inspecting wiring on the lower surface;
The upper inspection jig placed above the lower inspection jig is lowered, and the printed circuit board placed on the tray is sandwiched between the upper inspection jig and the lower inspection jig, thereby An elevating unit for contacting the inspection pin of the inspection jig and the wiring of the printed circuit board;
An inspection unit that applies a voltage between two selected inspection pins of the upper inspection jig and measures a resistance value between them;
And a control unit for controlling the operation of the lifting unit.
　ここで、前記下検査治具の検査ピンは、前記トレイに形成された開口部を通して前記プリント基板の下面の配線に接触し、前記検査ユニットは、前記上検査治具および下検査治具の選択された２本の検査ピンの間に電圧を印加すると共に、それらの間の抵抗値を計測することが好ましい。 Here, the inspection pin of the lower inspection jig contacts the wiring on the lower surface of the printed circuit board through the opening formed in the tray, and the inspection unit selects the upper inspection jig and the lower inspection jig. It is preferable to apply a voltage between the two inspection pins and measure a resistance value between them.
　また前記トレイの上面には、前記プリント基板に形成された位置決め用の孔に挿入される第１のガイドピンが取り付けられていることが好ましい。同様に、前記下検査治具の上面には、前記プリント基板およびトレイのそれぞれに形成された位置決め用の孔に挿入される第２のガイドピンが取り付けられていることが好ましい。 Further, it is preferable that a first guide pin inserted into a positioning hole formed in the printed board is attached to the upper surface of the tray. Similarly, it is preferable that a second guide pin that is inserted into a positioning hole formed in each of the printed circuit board and the tray is attached to the upper surface of the lower inspection jig.
　本発明にかかるプリント基板検査装置は、前記トレイに載置されたプリント基板を水平方向に搬送する一対の基板搬送ユニットを備え、当該基板搬送ユニットは、前記トレイの端部が載置されると共に、当該トレイに形成された位置決め用の孔に挿入される第３のガイドピンが上面に取り付けられたトレイ台と、当該トレイ台とで前記トレイを把持するチャックと、を備えていることが好ましい。 A printed circuit board inspection apparatus according to the present invention includes a pair of substrate transport units that transport a printed circuit board placed on the tray in a horizontal direction, and the substrate transport unit has an end of the tray placed thereon. And a tray base having a third guide pin inserted into a positioning hole formed in the tray attached to the upper surface, and a chuck for gripping the tray with the tray base. .
　ここで、前記基板搬送ユニットは、前記トレイ台が上下方向に移動できるように構成されており、検査が終了した後、前記トレイ台に載置されたトレイを上昇させ、前記下検査治具の第２のガイドピンを、前記プリント基板の位置決め用の孔から外すことが好ましい。同様に、前記基板搬送ユニットは、前記トレイ台に載置されたトレイを搬送する際には、前記トレイ台を前記下検査治具に接触しない位置まで上昇させ、検査を行う際には、前記トレイ台を前記トレイが前記下検査治具に載置される位置まで下降させることが好ましい。 Here, the substrate transport unit is configured so that the tray table can move in the vertical direction, and after the inspection is finished, the tray placed on the tray table is raised, and the lower inspection jig The second guide pin is preferably removed from the positioning hole of the printed board. Similarly, the substrate transport unit raises the tray base to a position where it does not contact the lower inspection jig when transporting a tray placed on the tray base, and when performing inspection, It is preferable that the tray table is lowered to a position where the tray is placed on the lower inspection jig.
　また前記基板搬送ユニットは、前記トレイが前記下検査治具に載置されたとき、前記チャックによる前記トレイの把持を開放することが好ましい。 Further, it is preferable that the substrate transport unit releases the grip of the tray by the chuck when the tray is placed on the lower inspection jig.
　本発明にかかるプリント基板検査装置において、前記一対の基板搬送ユニットの移動経路に沿って設置された一対のスライドテーブルの間に、前記トレイに載置されたプリント基板の方向を反転させる基板反転ユニットが設置され、当該基板反転ユニットは、前記トレイを載置するテーブルと、当該テーブルを回転させる回転手段と、当該テーブルを上下方向に移動させる第１の昇降手段と、で構成されていることが好ましい。 In the printed circuit board inspection apparatus according to the present invention, the substrate reversing unit for reversing the direction of the printed circuit board placed on the tray between the pair of slide tables installed along the movement path of the pair of substrate transport units. And the substrate reversing unit is composed of a table for placing the tray, a rotating means for rotating the table, and a first elevating means for moving the table in the vertical direction. preferable.
　また本発明にかかるプリント基板検査装置において、前記一対の基板搬送ユニットの移動経路に沿って設置された一対のスライドテーブルの間に、前記プリント基板に形成された複数の配線パターンのうち導通不良または絶縁不良と判定された配線パターンに識別用のマークを付与する識別マーク付与手段が設置されていることが好ましい。 Further, in the printed circuit board inspection apparatus according to the present invention, between the plurality of wiring patterns formed on the printed circuit board between the pair of slide tables installed along the movement path of the pair of circuit board transport units, It is preferable that an identification mark applying means for applying an identification mark to the wiring pattern determined to have poor insulation is installed.
　ここで、前記識別マーク付与手段はパンチングユニットで構成され、当該パンチングユニットは、前記プリント基板を挟むように互いに衝突して当該プリント基板に孔を開ける上パンチャーおよび下パンチャーと、当該上パンチャーおよび下パンチャーを、前記基板搬送ユニットによる搬送方向と直交する方向に移動させるスライダーと、当該上パンチャーおよび下パンチャーのそれぞれを、上下方向に移動させる第２および第３の昇降手段と、を備えていることが好ましい。 Here, the identification mark applying means is composed of a punching unit, and the punching unit collides with each other so as to sandwich the printed circuit board and opens a hole in the printed circuit board, and the upper puncher and the lower puncher. A slider for moving the puncher in a direction perpendicular to the transfer direction by the substrate transfer unit; and second and third lifting means for moving each of the upper puncher and the lower puncher in the vertical direction. Is preferred.
　本発明の検査装置を用いれば、プリント基板をトレイに載置した状態で搬送および検査が行われ、プリント基板のそりやねじれを考慮する必要がないため、検査装置の構造が単純になり、結果として装置を安価に製造できる。また、プリント基板の両面を同時に検査できるため、検査に必要な時間を短縮できる。 If the inspection apparatus of the present invention is used, the printed circuit board is transported and inspected in a state where it is placed on the tray, and it is not necessary to consider warping or twisting of the printed circuit board. As a result, the device can be manufactured at low cost. Moreover, since both sides of the printed circuit board can be inspected simultaneously, the time required for the inspection can be shortened.
図１は、本発明の実施の形態１にかかるプリント基板検査装置の主要構成部材の正面図である。FIG. 1 is a front view of main components of the printed circuit board inspection apparatus according to the first embodiment of the present invention. 図２は、図１のＸ－Ｘ線から下方を見た、実施の形態１にかかるプリント基板検査装置の平面図である。FIG. 2 is a plan view of the printed circuit board inspection apparatus according to the first embodiment, as viewed from the line XX in FIG. 図３は、実施の形態１にかかるプリント基板検査装置の電気系の構成を示すブロック図である。FIG. 3 is a block diagram of an electrical system configuration of the printed circuit board inspection apparatus according to the first embodiment. 図４は、トレイおよびトレイに載置されたプリント基板の一例を示す平面図である。FIG. 4 is a plan view showing an example of a tray and a printed circuit board placed on the tray. 図５は、トレイに載置されたプリント基板２の一部を、下方から見上げた状態を示す図である。FIG. 5 is a diagram showing a state in which a part of the printed circuit board 2 placed on the tray is looked up from below. 図６は、実施の形態１の上検査治具の要部断面図である。FIG. 6 is a cross-sectional view of a main part of the upper inspection jig according to the first embodiment. 図７は、実施の形態１の基板搬送ユニットの正面図である。FIG. 7 is a front view of the substrate transfer unit according to the first embodiment. 図８は、同基板搬送ユニットの平面図である。FIG. 8 is a plan view of the substrate transfer unit. 図９は、同基板搬送ユニットの側面図である。FIG. 9 is a side view of the substrate transport unit. 図１０は、プリント基板検査装置の動作を説明するフローチャートである。FIG. 10 is a flowchart for explaining the operation of the printed circuit board inspection apparatus. 図１１は、上検査治具と下検査治具の動作を説明する要部正面図である。FIG. 11 is a main part front view for explaining the operation of the upper inspection jig and the lower inspection jig. 図１２は、実施の形態２にかかるプリント基板検査装置の基板反転ユニットとパンチングユニットの構成を示す平面図である。FIG. 12 is a plan view illustrating the configuration of the substrate reversing unit and the punching unit of the printed circuit board inspection apparatus according to the second embodiment.
　以下、本発明の実施の形態にかかるプリント基板検査装置について、図面を参照して説明する。 Hereinafter, a printed circuit board inspection apparatus according to an embodiment of the present invention will be described with reference to the drawings.
　（実施の形態１）
　＜プリント基板検査装置の構成＞
　図１は、本発明の実施の形態１にかかるプリント基板検査装置（以降、単に「検査装置」という）の主要構成部材を正面から見た図、図２は、図１のＸ－Ｘ線から下方を見た図、図３は、検査装置の電気系の構成を示すブロック図である。なお、図２では支柱６０１を省略し、また見易さを考慮して、トレイ３については輪郭のみを２点鎖線で示している。 (Embodiment 1)
<Configuration of printed circuit board inspection device>
FIG. 1 is a diagram of main components of a printed circuit board inspection apparatus (hereinafter simply referred to as “inspection apparatus”) according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line XX in FIG. FIG. 3 is a block diagram showing the configuration of the electrical system of the inspection apparatus. In FIG. 2, the support column 601 is omitted, and only the outline of the tray 3 is indicated by a two-dot chain line in consideration of easy viewing.
　本実施の形態にかかる検査装置１は、主として表裏両面に配線が形成されたフレキシブルプリント基板（以降、単に「プリント基板」とも云う）の検査に用いられ、プリント基板２の上面の配線の検査を行う上検査治具４、同じく下面の配線の検査を行う下検査治具５、上検査治具４を上下方向に移動させる昇降ユニット６、およびプリント基板２が載置されたトレイ３を水平方向に搬送する一対の基板搬送ユニット７で構成されている。 The inspection apparatus 1 according to the present embodiment is mainly used for inspection of a flexible printed circuit board (hereinafter simply referred to as “printed circuit board”) in which wiring is formed on both front and back surfaces, and performs inspection of wiring on the upper surface of the printed circuit board 2. The upper inspection jig 4 to be performed, the lower inspection jig 5 for inspecting the wiring on the lower surface, the elevating unit 6 for moving the upper inspection jig 4 in the vertical direction, and the tray 3 on which the printed board 2 is placed in the horizontal direction. It is comprised of a pair of substrate transfer units 7 that are transferred to each other.
　検査装置１の各部の構成について説明する前に、本発明にかかる検査装置の特徴点について説明する。 Before describing the configuration of each part of the inspection apparatus 1, the features of the inspection apparatus according to the present invention will be described.
　本発明にかかる検査装置の第１の特徴点は、上述のフレキシブルプリント基板２を平板状のトレイ３に載置した状態で検査を行うことである。背景技術の欄で説明したように、フレキシブルプリント基板を対象とする従来の検査装置では、プリント基板のそりやねじれによる検査不良が生じないように、プリント基板を真空吸着してプレートに固定した状態で検査したり、基板の縁部をクランパで引っ張った状態で検査を行っていた。 The first characteristic point of the inspection apparatus according to the present invention is that the inspection is performed in a state where the above-described flexible printed circuit board 2 is placed on the flat tray 3. As explained in the background art section, in the conventional inspection device for flexible printed circuit boards, the printed circuit board is vacuum-adsorbed and fixed to the plate so that inspection defects due to warping or twisting of the printed circuit board do not occur. Or inspected with the edge of the substrate pulled by a clamper.
　これに対し、本発明の検査装置では、平板状のトレイ３に載置されたプリント基板２を、上検査治具４と下検査治具５で挟んだ状態で検査を行う。フレキシブルプリント基板２の検査を、トレイ３に載置された状態で行えば、プリント基板にそりやねじれが生じないため、プリント基板を吸着したりクランパで引っ張る必要がない。更に、トレイ３に載置されたプリント基板２を、上検査治具４と下検査治具５で挟むという単純な構成を採用できるため、検査装置の大幅なコストダウンを実現できる。 On the other hand, in the inspection apparatus of the present invention, inspection is performed in a state where the printed circuit board 2 placed on the flat tray 3 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5. If the inspection of the flexible printed circuit board 2 is performed in a state where it is placed on the tray 3, no warping or twisting occurs on the printed circuit board, so there is no need to suck the printed circuit board or pull it with a clamper. Furthermore, since a simple configuration in which the printed circuit board 2 placed on the tray 3 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5 can be employed, the cost of the inspection apparatus can be significantly reduced.
　図４（ａ）にトレイ３の一例、図４（ｂ）にトレイ３に載置されたプリント基板２の一例を示す。絶縁性の合成樹脂で作製された平板状のトレイ３には、４本のガイドピン３０１、複数の位置決め用の孔３０２および３０３、ならびに複数の開口部３０４が形成されている。一方、プリント基板２には、配線２０１と位置決め用の複数の孔２０２が形成されている。 FIG. 4 (a) shows an example of the tray 3, and FIG. 4 (b) shows an example of the printed circuit board 2 placed on the tray 3. FIG. The flat tray 3 made of an insulating synthetic resin is formed with four guide pins 301, a plurality of positioning holes 302 and 303, and a plurality of openings 304. On the other hand, wiring 201 and a plurality of positioning holes 202 are formed in the printed circuit board 2.
　ガイドピン３０１はプリント基板２の脱落防止を兼ねており、プリント基板２の対向する位置に設けられた４つの孔２０２にガイドピン３０１をそれぞれ挿入することにより、プリント基板２はトレイ３にしっかりと固定される。従って、基板搬送ユニット７を用いてトレイ３を搬送する際、プリント基板２がトレイ３から脱落したり位置がずれたりすることはない。 The guide pins 301 also serve to prevent the printed circuit board 2 from falling off. By inserting the guide pins 301 into the four holes 202 provided at opposite positions of the printed circuit board 2, the printed circuit board 2 is firmly attached to the tray 3. Fixed. Therefore, when the tray 3 is transported using the substrate transport unit 7, the printed circuit board 2 is not dropped from the tray 3 or shifted in position.
　トレイ３の左右両端部に形成された４つの孔３０２は、基板搬送ユニット７を用いてトレイ３を搬送する際に用いられるもので、孔３０２に、トレイ台７１２に取り付けられたガイドピン７１３（図７参照）を挿入した状態でトレイ３を搬送すれば、トレイ３が基板搬送ユニット７から脱落することはない。 The four holes 302 formed at the left and right ends of the tray 3 are used when the tray 3 is transported using the substrate transport unit 7, and guide pins 713 ( If the tray 3 is transported in a state in which it is inserted, the tray 3 will not fall out of the substrate transport unit 7.
　トレイ３に形成された他の孔３０３と、プリント基板２の対向する位置に形成された孔２０２は、検査治具に対する位置決め用の孔であり、これらの孔に下検査治具５に設けられたガイドピン５０４を挿入することにより、プリント基板２は下検査治具５に対して正確に位置決めされる。 The other holes 303 formed in the tray 3 and the holes 202 formed at positions facing the printed circuit board 2 are positioning holes for the inspection jig, and are provided in the lower inspection jig 5 in these holes. By inserting the guide pins 504, the printed circuit board 2 is accurately positioned with respect to the lower inspection jig 5.
　トレイ３に設けられた複数の開口部３０４は、検査の際に下検査治具５の検査ピンをプリント基板２の下面に形成された配線２０１の検査対象箇所（例えばパッド）に接触させるためのものである。トレイ３に開口部３０４を設けることにより、プリント基板２がトレイ３に載置された状態でも、支障なく検査を行うことができる。 The plurality of openings 304 provided in the tray 3 are used for bringing the inspection pins of the lower inspection jig 5 into contact with the inspection target portions (for example, pads) of the wiring 201 formed on the lower surface of the printed board 2 at the time of inspection. Is. By providing the opening 304 in the tray 3, the inspection can be performed without any trouble even when the printed circuit board 2 is placed on the tray 3.
　検査の際には、昇降ユニット６を用いて上検査治具４を下降させて、平板状のトレイ３に載置されたプリント基板２を上検査治具４と下検査治具５で挟む。この状態において、各検査治具に設けられた検査ピンをプリント基板２のパッド等に接触させて、配線の導通不良や絶縁不良の検査を行う。 In the inspection, the upper inspection jig 4 is lowered using the lifting unit 6, and the printed circuit board 2 placed on the flat tray 3 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5. In this state, the inspection pins provided on each inspection jig are brought into contact with the pads of the printed circuit board 2 to inspect for wiring continuity and insulation defects.
　図５を参照して、トレイ３に形成された開口部３０４の位置と大きさについて説明する。図５は、トレイ３に載置されたプリント基板２の一部を、下方から見上げた状態を示している。図中、梨地状の部分はプリント基板２を示し、２点鎖線の枠は開口部３０４を示している。図５（ａ）と図５（ｂ）では、トレイ３に形成された開口部３０４の大きさと数が異なっている。 The position and size of the opening 304 formed in the tray 3 will be described with reference to FIG. FIG. 5 shows a state in which a part of the printed circuit board 2 placed on the tray 3 is looked up from below. In the figure, the satin-like portion indicates the printed circuit board 2, and the two-dot chain line indicates the opening 304. 5A and FIG. 5B, the size and number of the opening portions 304 formed in the tray 3 are different.
　開口部３０４の大きさは必要最小限に留め、特にプリント基板２にスリットが形成された箇所については、プリント基板２にそりやねじれが生じないように、開口部を設ける位置と大きさに配慮する必要がある。 The size of the opening 304 is kept to the minimum necessary, and in particular, in the place where the slit is formed in the printed circuit board 2, consideration is given to the position and size of the opening so that the printed circuit board 2 is not warped or twisted. There is a need to.
　図５（ａ）（ｂ）に示したプリント基板２は、３本の枝部２ａ、２ｂおよび２ｃを備えており、枝部の周囲にスリットが形成されている。またそれぞれの枝部には、配線２０１の一部であるパッド２０３が形成されている。検査の際には、プリント基板２を上検査治具４と下検査治具５で挟み、下検査治具５の検査ピンを、開口部３０４を通してパッド２０３に接触させた状態で、検査ピン間に電圧を印加する。 The printed circuit board 2 shown in FIGS. 5A and 5B includes three branch portions 2a, 2b, and 2c, and slits are formed around the branch portions. Further, a pad 203 which is a part of the wiring 201 is formed at each branch portion. In the inspection, the printed circuit board 2 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5, and the inspection pins of the lower inspection jig 5 are in contact with the pads 203 through the openings 304. Apply voltage to
　図５（ａ）に示すように、３本の枝部２ａ、２ｂおよび２ｃのパッド２０３が全て含まれるような大きさの開口部３０４を設けると、枝部２ａ、２ｂおよび２ｃの先端が自重によってたわんでそりやねじれが生じ、検査ピンが、目的とするパッド２０３に接触しない場合がある。これに対し、図５（ｂ）に示すように、３本の枝部２ａ、２ｂおよび２ｃのパッドに対向する位置に、比較的小さな面積の開口部３０４をそれぞれ形成すれば、枝部２ａ、２ｂおよび２ｃはほとんどたわまず、そりやねじれによって検査ピンがパッド２０３に接触しなくなる危険性を回避できる。 As shown in FIG. 5A, when the opening 304 having a size that includes all the pads 203 of the three branches 2a, 2b, and 2c is provided, the ends of the branches 2a, 2b, and 2c are self-weighted. May cause warping or twisting, and the inspection pin may not contact the target pad 203 in some cases. On the other hand, as shown in FIG. 5B, if openings 304 having a relatively small area are formed at positions facing the pads of the three branches 2a, 2b and 2c, the branches 2a, 2b and 2c are hardly bent, and the risk that the inspection pin does not contact the pad 203 due to warping or twisting can be avoided.
　以上説明したように、プリント基板２は上検査治具４と下検査治具５に挟まれ、かつガイドピン５０４と位置決め用の孔２０２によって正確に位置決めされた状態で検査が行われるため、精度の高い検査が可能となる。検査工程については、後に図１０および図１１を参照して詳述する。 As described above, the printed circuit board 2 is inspected while being sandwiched between the upper inspection jig 4 and the lower inspection jig 5 and accurately positioned by the guide pins 504 and the positioning holes 202. High inspection is possible. The inspection process will be described in detail later with reference to FIGS.
　なお、トレイ３のガイドピン３０１、孔３０２、３０３および開口部３０４の位置や大きさは、プリント基板２に形成された配線パターンの形状や繰り返しのピッチによって異なる。従って、対象となるプリント基板に対応した形状のトレイを用意する必要がある。 Note that the positions and sizes of the guide pins 301, the holes 302 and 303, and the openings 304 of the tray 3 vary depending on the shape of the wiring pattern formed on the printed circuit board 2 and the repeated pitch. Therefore, it is necessary to prepare a tray having a shape corresponding to the target printed circuit board.
　本発明にかかる検査装置の第２の特徴点は、同一形状の配線パターンが複数形成されたプリント基板２の検査を、対象エリアを分けて複数回行うことである。前述したように、プリント基板を作製する際には、面積の広い１枚のシート状プリント基板２に、同一形状の配線パターンを複数形成し、検査が終了した後に、それらを切断して個別のプリント基板に分離している。本発明の検査装置は、切断される前のシート状プリント基板２を対象として検査を行っている。 The second feature of the inspection apparatus according to the present invention is that the inspection of the printed circuit board 2 on which a plurality of wiring patterns having the same shape are formed is performed a plurality of times by dividing the target area. As described above, when a printed circuit board is manufactured, a plurality of wiring patterns having the same shape are formed on a single sheet-like printed circuit board 2 having a large area, and after the inspection is completed, they are cut into individual patterns. Separated into printed circuit boards. The inspection apparatus of the present invention inspects the sheet-like printed circuit board 2 before being cut.
　図４（ｂ）に示す例では、プリント基板２に、同一形状の配線パターンが左右一対ずつ５列、計１０個の配線パターンが規則正しく配列されている。これら１０個の配線パターンの検査を同時に行おうとすると、検査治具に膨大な数の検査ピンが必要となるため、検査治具が高価になる。また、基板に対する接触不良の割合が増える。これを避けるために、本発明の検査装置では、左右一対の配線パターンに対応した数の検査ピンを備えた検査治具を用いて検査を行っている。 In the example shown in FIG. 4B, a total of 10 wiring patterns are regularly arranged on the printed circuit board 2 in five rows each having a pair of wiring patterns of the same shape. If these ten wiring patterns are to be inspected simultaneously, a huge number of inspection pins are required for the inspection jig, which makes the inspection jig expensive. In addition, the proportion of poor contact with the substrate increases. In order to avoid this, in the inspection apparatus of the present invention, inspection is performed using an inspection jig provided with a number of inspection pins corresponding to a pair of left and right wiring patterns.
　このような検査治具を用いて検査を行う場合、プリント基板２に形成された全ての配線パターンを検査するためには、プリント基板２が載置されたトレイ３を、水平方向に移動させる必要がある。一対の基板搬送ユニット７、７はそのために用いられる。 When inspecting using such an inspection jig, in order to inspect all the wiring patterns formed on the printed circuit board 2, it is necessary to move the tray 3 on which the printed circuit board 2 is placed in the horizontal direction. There is. The pair of substrate transfer units 7 and 7 are used for that purpose.
　トレイ３は、左右一対の配線パターンの検査を行う都度、下検査治具５の左右に配置された一対の基板搬送ユニット７、７により、水平方向（図２に矢印Ａで示す方向）に搬送される。基板搬送ユニット７は、トレイ台７１２に載置されたトレイ３の端部をチャック７２５で挟んだ状態で水平方向に搬送する機能、およびトレイ３を下検査治具５の上に載置する機能を備えている。基板搬送ユニット７については、後に図面を参照して詳述する。 Each time the pair of left and right wiring patterns is inspected, the tray 3 is transported in the horizontal direction (direction indicated by arrow A in FIG. 2) by the pair of substrate transport units 7 and 7 disposed on the left and right of the lower inspection jig 5. Is done. The substrate transport unit 7 has a function of transporting the tray 3 placed on the tray base 712 in the horizontal direction with the end of the tray 3 sandwiched between the chucks 725, and a function of placing the tray 3 on the lower inspection jig 5. It has. The substrate transport unit 7 will be described in detail later with reference to the drawings.
　なお、本発明にかかる検査装置は、両面に配線が形成されたフレキシブルプリント基板の検査装置として最適なものであるが、両面に配線が形成されたフレキシブルプリント基板の検査に限定されるものではない。一方の面だけに配線が形成されたフレキシブルプリント基板や硬質のプリント基板の検査においても、上述した２つの特徴点を生かして、プリント基板の検査を、自動的かつ短時間に行うことができる。 The inspection apparatus according to the present invention is optimal as an inspection apparatus for a flexible printed board having wirings formed on both sides, but is not limited to the inspection of a flexible printed board having wirings formed on both sides. . Even in the inspection of a flexible printed circuit board or a hard printed circuit board in which wiring is formed only on one surface, the inspection of the printed circuit board can be performed automatically and in a short time by taking advantage of the two feature points described above.
　本発明にかかる検査装置を、一方の面だけに配線が形成されたフレキシブルプリント基板の検査に使用する場合には、下検査治具５の代わりに、下検査治具５と同一の形状および構造を有しているが、検査ピンを有しないダミーの治具を用意し、その上にトレイを載置して検査を行う。 When the inspection apparatus according to the present invention is used for inspection of a flexible printed circuit board in which wiring is formed only on one surface, the same shape and structure as the lower inspection jig 5 instead of the lower inspection jig 5 A dummy jig having an inspection pin but no inspection pin is prepared, and a tray is placed thereon for inspection.
　次に、図３を参照して、検査装置１の電気系の構成について説明する。検査装置１は、昇降ユニット６および基板搬送ユニット７の動作を制御する制御ユニット８と、上検査治具４および下検査治具５の検査ピン間に電圧を印加すると共に、それらの間の抵抗値を計測する検査ユニット９とを備えている。図示しないが、制御ユニット８および検査ユニット９は、別途設置された検査装置の筐体内に収容されている。 Next, the configuration of the electrical system of the inspection apparatus 1 will be described with reference to FIG. The inspection apparatus 1 applies a voltage between the control unit 8 that controls the operation of the elevating unit 6 and the substrate transport unit 7 and the inspection pins of the upper inspection jig 4 and the lower inspection jig 5, and the resistance therebetween. And an inspection unit 9 for measuring values. Although not shown, the control unit 8 and the inspection unit 9 are accommodated in a casing of an inspection apparatus that is separately installed.
　制御ユニット８は、プログラマブルロジックコントローラで構成され、入力表示部８０１から入力され、記憶部８０２に格納されたデータに基づいて、昇降ユニット６および基板搬送ユニット７の動作を制御する。 The control unit 8 is composed of a programmable logic controller, and controls the operations of the elevating unit 6 and the substrate transport unit 7 based on data input from the input display unit 801 and stored in the storage unit 802.
　具体的に説明すると、昇降ユニット６については、エアシリンダを駆動することで上検査治具４を上下方向に移動させる。一方、基板搬送ユニット７については、モータやエアシリンダを駆動することで、プリント基板２が載置されたトレイ３を水平方向に搬送したり、垂直方向に移動させたりする。 More specifically, the lifting unit 6 moves the upper inspection jig 4 in the vertical direction by driving the air cylinder. On the other hand, the board transport unit 7 drives the motor and the air cylinder to transport the tray 3 on which the printed circuit board 2 is placed in the horizontal direction or move it in the vertical direction.
　制御ユニット８のうち入力表示部８０１はタッチパネル式の液晶デバイスで構成され、昇降ユニット６および基板搬送ユニット７を動作させる上で必要なデータを入力し、またそのデータを表示する。記憶部８０２はフラッッシュメモリ等で構成され、入力表示部８０１から入力されたデータを格納する。 The input display unit 801 of the control unit 8 is composed of a touch panel type liquid crystal device, and inputs data necessary for operating the elevating unit 6 and the substrate transport unit 7 and displays the data. The storage unit 802 includes a flash memory or the like and stores data input from the input display unit 801.
　一方、検査ユニット９はパーソナルコンピュータで構成され、入力表示部９０１、計測部９０２、記憶部９０３および制御部９０４を備えている。このうち制御部９０４の機能は、記憶部９０３から読み出されたプログラムをＣＰＵ（Central processing Unit、図示せず）で実行することにより実現される。 On the other hand, the inspection unit 9 is composed of a personal computer, and includes an input display unit 901, a measurement unit 902, a storage unit 903, and a control unit 904. Among these, the function of the control unit 904 is realized by executing a program read from the storage unit 903 by a CPU (Central processing Unit, not shown).
　検査ユニット９のうち入力表示部９０１はタッチパネル式の液晶デバイスで構成され、導通や絶縁の良否判定に必要なデータを入力するため、および導通や絶縁の良否判定結果を表示するために用いられる。 The input display unit 901 of the inspection unit 9 is composed of a touch panel type liquid crystal device, and is used for inputting data necessary for determining the quality of continuity and insulation, and for displaying the result of determination of quality of continuity and insulation.
　計測部９０２は、上検査治具４および下検査治具５の検査ピンのうち選択された２本の検査ピンの間に、プリント基板２の配線２０１を介して電圧を印加すると共に、その間の抵抗値を計測する。 The measuring unit 902 applies a voltage between the two inspection pins selected from the inspection pins of the upper inspection jig 4 and the lower inspection jig 5 via the wiring 201 of the printed circuit board 2, and between them Measure the resistance value.
　記憶部９０３は、通常、ＨＤＤ（ハードディスクドライブ）で構成され、入力表示部９０１から入力されたプログラムやデータ、判定結果のデータ等を格納するのに用いられる。 The storage unit 903 is usually composed of an HDD (Hard Disk Drive), and is used to store programs and data input from the input display unit 901, data of determination results, and the like.
　制御部９０４は、計測部９０２で計測した抵抗値と、記憶部９０３に格納された良品のプリント基板の抵抗値とを比較して、対象であるプリント基板の導通または絶縁の良否を判定する。判定結果は記憶部９０３に格納され、また必要に応じて入力表示部９０１に表示される。 The control unit 904 compares the resistance value measured by the measurement unit 902 with the resistance value of a good printed circuit board stored in the storage unit 903, and determines whether the target printed circuit board is conductive or insulated. The determination result is stored in the storage unit 903 and displayed on the input display unit 901 as necessary.
　次に、図１に示す検査装置１の各構成部材について説明する。最初に、昇降ユニット６および上検査治具４について説明する。昇降ユニット６は、上検査治具４を上下方向に移動させるものである。 Next, each component of the inspection apparatus 1 shown in FIG. 1 will be described. First, the lifting unit 6 and the upper inspection jig 4 will be described. The lifting / lowering unit 6 moves the upper inspection jig 4 in the vertical direction.
　昇降ユニット６は、基台１０１に設置された４本の支柱６０１によって支えられた天板６０２、上検査治具４を支持するプレート６０３、シリンダ本体が天板６０２に取り付けられ、ピストンロッド６０５の先端がジョイントを介してプレート６０３に固定されたエアシリンダ６０４、およびプレート６０３の四隅に取り付けられ、支柱６０１と共にプレート６０３の上下動をガイドするリニアガイド６０６で構成されている。 The lifting unit 6 includes a top plate 602 supported by four columns 601 installed on the base 101, a plate 603 that supports the upper inspection jig 4, and a cylinder body attached to the top plate 602. An air cylinder 604 whose tip is fixed to the plate 603 via a joint, and a linear guide 606 that is attached to four corners of the plate 603 and guides the vertical movement of the plate 603 together with the column 601.
　上検査治具４はプレート６０３に取り付けられている。具体的には、プレート６０３の下面に左右一対の長尺の取付具６０７、６０７が設置されており、この取付具６０７の溝に、上検査治具４の支持板４０２の左右両端部を挿入することによって、上検査治具４はプレート６０３に取り付けられる。 The upper inspection jig 4 is attached to the plate 603. Specifically, a pair of left and right long fixtures 607 and 607 are installed on the lower surface of the plate 603, and the left and right ends of the support plate 402 of the upper inspection jig 4 are inserted into the grooves of the fixture 607. By doing so, the upper inspection jig 4 is attached to the plate 603.
　エアシリンダ６０４のピストンロッド６０５を縮めると、プレート６０３は支柱６０１に沿って上昇し、逆にピストンロッド６０５を伸ばすと、プレート６０３は支柱６０１に沿って下降する。なお、図では煩雑さを避けるため、エアシリンダ６０４に圧縮空気を供給するチューブやパイプを省略している。 When the piston rod 605 of the air cylinder 604 is contracted, the plate 603 rises along the column 601, and conversely, when the piston rod 605 is extended, the plate 603 descends along the column 601. In the figure, tubes and pipes for supplying compressed air to the air cylinder 604 are omitted to avoid complication.
　次に、上検査治具４について説明する。上検査治具４は、複数の検査ピンを有する検査ボード４０１、上検査治具４を昇降ユニット６のプレート６０３に取り付けるための、平板状の合成樹脂で作製された支持板４０２、および検査ボード４０１を支持板４０２に固定する複数の支柱４０３で構成されている。図示しないが、検査ボード４０１と支持板４０２との間の空間は、検査ボード４０１の検査ピンから引き出されたリードワイヤの通路になっている。 Next, the upper inspection jig 4 will be described. The upper inspection jig 4 includes an inspection board 401 having a plurality of inspection pins, a support plate 402 made of a flat plate-shaped synthetic resin for attaching the upper inspection jig 4 to the plate 603 of the elevating unit 6, and an inspection board It is composed of a plurality of columns 403 for fixing 401 to the support plate 402. Although not shown, the space between the inspection board 401 and the support plate 402 is a passage for a lead wire drawn out from the inspection pin of the inspection board 401.
　図６は、検査ボード４０１の要部断面図である。図６（ａ）は検査前の状態を示し、図６（ｂ）は検査中の状態を示す。 FIG. 6 is a cross-sectional view of the main part of the inspection board 401. FIG. 6A shows a state before inspection, and FIG. 6B shows a state during inspection.
　検査ボード４０１は、絶縁性の樹脂で作製された２枚のボード４１１および４１２が積層されたものである。メインボード４１１には、押出部材４１３とプローブ４１７が取り付けられており、ガイドボード４１２には、検査ピンを案内するガイド孔４２４が形成されている。 The inspection board 401 is a laminate of two boards 411 and 412 made of an insulating resin. A push member 413 and a probe 417 are attached to the main board 411, and a guide hole 424 for guiding the inspection pin is formed in the guide board 412.
　押出部材４１３は、ガイドボード４１２をメインボード４１１から離間させる方向に押圧するものである。押出部材４１３は、メインボード４１１に固定された有底円筒状のケース４１４、ケース４１４に挿入された円柱状の押出ピン４１５、およびケース４１４と押出ピン４１５との間に挿入された圧縮バネ４１６で構成されている。ガイドボード４１２は、非検査時には、圧縮バネ４１６の反発力によりメインボード４１１から離間している。 The pushing member 413 presses the guide board 412 in a direction away from the main board 411. The pushing member 413 includes a bottomed cylindrical case 414 fixed to the main board 411, a columnar pushing pin 415 inserted into the case 414, and a compression spring 416 inserted between the case 414 and the pushing pin 415. It consists of The guide board 412 is separated from the main board 411 by the repulsive force of the compression spring 416 when not inspected.
　プローブ４１７は、検査の際に検査ピン４１８をプリント基板２の検査対象箇所（例えば図５に示したパッド２０３に当接させるものである。プローブ４１７は、検査ピン４１８、メインボード４１１に固定された有底円筒状のソケット４１９、ソケット４１９と検査ピン４１８の後端部４２１との間に挿入された圧縮バネ４２０、およびソケット４１９の後端部に取り付けられた、感電防止用の絶縁パイプ４２２で構成されている。 The probe 417 abuts the inspection pin 418 on the inspection target portion (for example, the pad 203 shown in FIG. 5) during the inspection. The probe 417 is fixed to the inspection pin 418 and the main board 411. A bottomed cylindrical socket 419, a compression spring 420 inserted between the socket 419 and the rear end 421 of the inspection pin 418, and an insulating pipe 422 for preventing electric shock attached to the rear end of the socket 419 It consists of
　検査ピン４１８、圧縮バネ４２０およびソケット４１９は導電性の金属で作製され、ソケット４１９の後端部にはリードワイヤ４２３が接続されている。図６（ａ）に示すように、検査ピン４１８は、圧縮バネ４２０によって常にガイドボード４１２側に付勢されている。 The inspection pin 418, the compression spring 420, and the socket 419 are made of conductive metal, and a lead wire 423 is connected to the rear end of the socket 419. As shown in FIG. 6A, the inspection pin 418 is always biased toward the guide board 412 by the compression spring 420.
　なお、図６では、メインボード４１１に押出部材４１３とプローブ４１７が１つずつ取り付けられているが、実際の検査ボード４０１では、ガイドボード４１２を押す力が均等になるように、押出部材４１３が、直方体状のメインボード４１１の４隅にそれぞれ取り付けられている。またプローブ４１７は、プリント基板２の検査対象箇所に対向する位置にそれぞれ取り付けられている。 In FIG. 6, the pushing member 413 and the probe 417 are attached to the main board 411 one by one. However, in the actual inspection board 401, the pushing member 413 is arranged so that the force pushing the guide board 412 is equalized. These are attached to the four corners of the rectangular parallelepiped main board 411, respectively. Probes 417 are attached to positions on the printed circuit board 2 that are opposed to the inspection target portions.
　検査の際、昇降ユニット６により上検査治具４を下降させ、プリント基板２およびトレイ３を挟んで下検査治具５に接触させると、図６（ｂ）に示すように、エアシリンダ６０４の圧力によって圧縮バネ４１６が縮む。その結果、検査ピン４１８の先端がガイド孔４２４から露出してプリント基板２の配線２０１に接触する。 At the time of inspection, when the upper inspection jig 4 is lowered by the elevating unit 6 and is brought into contact with the lower inspection jig 5 with the printed circuit board 2 and the tray 3 interposed therebetween, as shown in FIG. The compression spring 416 is contracted by the pressure. As a result, the tip of the inspection pin 418 is exposed from the guide hole 424 and contacts the wiring 201 of the printed circuit board 2.
　前述したように、検査ピン４１８、ソケット４１９および圧縮バネ４２０は導電性の材料で作製されているため、検査ユニット９によって選択された２本の検査ピン４１８の間に定電圧が印加されると、配線２０１を介して、それらの検査ピン間に電流が流れる。計測部９０２に内蔵された計測器で検査ピン間の抵抗値を計測し、制御部９０４において、その値を記憶部９０３に格納されている良品のプリント基板の値と比較すれば、プリント基板の導通や絶縁の良否を判定できる。 As described above, since the inspection pin 418, the socket 419 and the compression spring 420 are made of a conductive material, when a constant voltage is applied between the two inspection pins 418 selected by the inspection unit 9. A current flows between the inspection pins via the wiring 201. When the resistance value between the inspection pins is measured by a measuring instrument built in the measuring unit 902 and the value is compared with the value of a non-defective printed circuit board stored in the storage unit 903 in the control unit 904, The quality of continuity and insulation can be determined.
　なお、図６に示した検査ボード４０１の構造は一例であり、この構造に限定されるものではない。同様の機能を発揮できるものであれば、他の構造の検査ボードを採用してもよい。 In addition, the structure of the inspection board 401 shown in FIG. 6 is an example, and is not limited to this structure. An inspection board having another structure may be adopted as long as the same function can be exhibited.
　図１および図２の説明に戻り、下検査治具５について説明する。下検査治具５は、プリント基板２の下面に形成された配線の検査を行うもので、複数の検査ピンを有する検査ボード５０１、下検査治具５を、基台１０１に固定されたプレート１０２に取り付けるための、平板状の合成樹脂で作製された支持板５０２、および検査ボード５０１を支持板５０２に固定する複数の支柱５０３で構成されている。検査ボード５０１、支持板５０２および支柱５０３の機能は、上検査治具４の検査ボード４０１、支持板４０２および支柱４０３のそれぞれの機能と変わりがないため、説明は省略する。 Returning to the description of FIGS. 1 and 2, the lower inspection jig 5 will be described. The lower inspection jig 5 inspects the wiring formed on the lower surface of the printed circuit board 2. The inspection board 501 having a plurality of inspection pins and the lower inspection jig 5 are fixed to the base 101. And a plurality of support columns 503 for fixing the inspection board 501 to the support plate 502. Since the functions of the inspection board 501, the support plate 502, and the support column 503 are the same as the functions of the inspection board 401, the support plate 402, and the support column 403 of the upper inspection jig 4, description thereof will be omitted.
　下検査治具５は、基台１０１に固定されたプレート１０２に取り付けられている。プレート１０２の左右には一対の長尺の取付具１０３、１０３が設置されており、この取付具１０３の溝に、下検査治具５の支持板５０２の左右両端部を挿入することによって、下検査治具５はプレート１０２に取り付けられる。 The lower inspection jig 5 is attached to a plate 102 fixed to the base 101. A pair of long fixtures 103 are provided on the left and right sides of the plate 102. By inserting the left and right ends of the support plate 502 of the lower inspection jig 5 into the grooves of the fixture 103, The inspection jig 5 is attached to the plate 102.
　上述した上検査治具４と下検査治具５の相違点は、上検査治具４が昇降ユニット６によって上下方向に移動できるのに対して、下検査治具５はプレート１０２を介して基台１０１に固定されている点、および検査ボード５０１にプリント基板２の位置決め用のガイドピン５０４が取り付けられ、上検査治具４の対向する箇所に、ガイドピン５０４を収容する穴（図示せず）が形成されている点である。 The difference between the upper inspection jig 4 and the lower inspection jig 5 described above is that the upper inspection jig 4 can be moved in the vertical direction by the lifting unit 6, whereas the lower inspection jig 5 is based on the plate 102. A guide pin 504 for positioning the printed circuit board 2 is attached to the point fixed to the base 101 and the inspection board 501, and a hole (not shown) for accommodating the guide pin 504 is provided at a position facing the upper inspection jig 4. ) Is formed.
　プリント基板２の対向する位置に形成された位置決め用の孔２０２（図４参照）に、検査ボード５０１の４箇所に設けられたガイドピン５０４を挿入することにより、プリント基板２は下検査治具５に対して正確に位置決めされ、検査ピンが検査対象箇所の配線（例えばパッド）２０１に誤りなく接触する。 By inserting guide pins 504 provided at four locations on the inspection board 501 into positioning holes 202 (see FIG. 4) formed at positions facing the printed circuit board 2, the printed circuit board 2 becomes a lower inspection jig. 5 is accurately positioned, and the inspection pin comes into contact with the wiring (for example, pad) 201 of the inspection object portion without error.
　検査の際には、昇降ユニット６を駆動してプレート６０３を下降させ、トレイ３に載置されたプリント基板２を上検査治具４と下検査治具５で挟む。検査が終了した後は、昇降ユニット６を駆動してプレート６０３を上昇させた後、図１に示す位置に保持する。 In the inspection, the lift unit 6 is driven to lower the plate 603, and the printed circuit board 2 placed on the tray 3 is sandwiched between the upper inspection jig 4 and the lower inspection jig 5. After the inspection is completed, the lift unit 6 is driven to raise the plate 603 and then held at the position shown in FIG.
　次に、前述の図１および図２、ならびに図７～図９を参照して、基板搬送ユニット７について説明する。図７は、図１の一対の基板搬送ユニット７、７のうち左側のユニットの正面図、図８は同ユニットの平面図、図９は同ユニットの側面図である。 Next, the substrate transfer unit 7 will be described with reference to FIGS. 1 and 2 and FIGS. 7 is a front view of the left unit of the pair of substrate transfer units 7 and 7 in FIG. 1, FIG. 8 is a plan view of the unit, and FIG. 9 is a side view of the unit.
　なお、図では煩雑さを避けるため、エアシリンダに圧縮空気を供給するチューブやバルブ、モータや各種センサと制御ユニット８との間を接続する配線は省略している。また、図には部材を固定するボルトやナットが表示されているが、これらは汎用の締結部材であるので、符号を付して説明することはしない。 In the figure, in order to avoid complications, tubes, valves, motors and various sensors for supplying compressed air to the air cylinder and wiring for connecting the control unit 8 are omitted. Further, although bolts and nuts for fixing the members are shown in the figure, these are general-purpose fastening members and will not be described with reference numerals.
　前述したように基板搬送ユニット７は、プリント基板２が載置されたトレイ３を水平方向に搬送するものである。図２に示すように、下検査治具５の左右には、断面が矩形の一対のスライドテーブル７０１が、移動経路に沿って設置されている。スライドテーブル７０１は、トレイ３を水平方向に搬送するための部材であり、テーブル内に収容されたボールネジ（図示せず）を回転させると、スライドブロック７０２がスライドテーブル７０１上を、矢印Ａで示す方向に移動する。 As described above, the substrate transport unit 7 transports the tray 3 on which the printed circuit board 2 is placed in the horizontal direction. As shown in FIG. 2, a pair of slide tables 701 having a rectangular cross section are installed on the left and right sides of the lower inspection jig 5 along the movement path. The slide table 701 is a member for transporting the tray 3 in the horizontal direction. When a ball screw (not shown) accommodated in the table is rotated, the slide block 702 is indicated by an arrow A on the slide table 701. Move in the direction.
　ボルトによりスライドブロック７０２に固定された支持板７０３には、トレイ３を垂直方向（図７に矢印Ｂで示す方向）に移動させるための部材、および搬送されるトレイ３を支持するための部材が搭載されている。 On the support plate 703 fixed to the slide block 702 by bolts, there are a member for moving the tray 3 in the vertical direction (direction indicated by an arrow B in FIG. 7) and a member for supporting the tray 3 to be conveyed. It is installed.
　支持板７０３の上面には、ボルト等により、ガイド取付板７０４と第１のエアシリンダ７０５が取り付けられている。またエアシリンダ７０５のピストンロッド７０６の上部には、ジョイントを介して第１の連結板７０７の一方の端が取り付けられ、ガイド取付板７０４を挟んで第１の連結板７０７の他方の端には、断面がＬ字型のアームベース７１１が取り付けられている。 A guide mounting plate 704 and a first air cylinder 705 are mounted on the upper surface of the support plate 703 by bolts or the like. One end of the first connecting plate 707 is attached to the upper portion of the piston rod 706 of the air cylinder 705 via a joint, and the other end of the first connecting plate 707 is sandwiched between the guide attaching plate 704. An arm base 711 having an L-shaped cross section is attached.
　ガイド取付板７０４の側面には、アームベース７１１の昇降をガイドする第１のリニアガイド７０８が取り付けられている。第１のリニアガイド７０８は、ガイド取付板７０４に取り付けられたレール７０９と、アームベース７１１に取り付けられたブロック７１０で構成されている。第１のエアシリンダ７０５のピストンロッド７０６を縮めたり伸ばしたりして連結板７０７を上下動させると、ブロック７１０がレール７０９に沿って上下動して、アームベース７１１の円滑な昇降を可能にしている。 1st linear guide 708 which guides the raising / lowering of the arm base 711 is attached to the side surface of the guide attachment plate 704. The first linear guide 708 includes a rail 709 attached to the guide attachment plate 704 and a block 710 attached to the arm base 711. When the connecting plate 707 is moved up and down by contracting or extending the piston rod 706 of the first air cylinder 705, the block 710 moves up and down along the rail 709, thereby enabling the arm base 711 to move up and down smoothly. Yes.
　アームベース７１１の先端の上面には、両端にガイドピン７１３が設置されたトレイ台７１２が取り付けられており、図１に示すように、このトレイ台７１２にトレイ３の端部を乗せた状態でトレイ３の搬送が行われる。この際、トレイ３の端部に形成された位置決め用の孔３０２（図３参照）にガイドピン７１３を挿入する。 A tray base 712 having guide pins 713 installed at both ends is attached to the top surface of the tip of the arm base 711. As shown in FIG. 1, the end of the tray 3 is placed on the tray base 712. The tray 3 is transported. At this time, the guide pins 713 are inserted into the positioning holes 302 (see FIG. 3) formed at the end of the tray 3.
　第１の連結板７０７の下面には、第２のエアシリンダ７１５が取り付けられており、ピストンロッド７１６の先端には、断面がＬ字状の第２の連結板７１７がジョイントを介して取り付けられている。更に、この第２の連結板７１７の両端部には、断面がＵ字状の一対のシリンダ取付板７１８、７１８が、それぞれボルトを介して取り付けられている。 A second air cylinder 715 is attached to the lower surface of the first connecting plate 707, and a second connecting plate 717 having an L-shaped cross section is attached to the tip of the piston rod 716 via a joint. ing. Further, a pair of cylinder mounting plates 718 and 718 having a U-shaped cross section are attached to both ends of the second connecting plate 717 via bolts, respectively.
　シリンダ取付板７１８の溝には、第３のエアシリンダ７２１が収容されている。エアシリンダ７２１の後部は、ピン７２２を介してシリンダ取付板７１８に回転可能な状態で取り付けられ、ピストンロッド７２３の前端はヒンジピン７２４を介してチャック７２５に連結されている。 A third air cylinder 721 is accommodated in the groove of the cylinder mounting plate 718. The rear portion of the air cylinder 721 is rotatably attached to the cylinder attachment plate 718 via a pin 722, and the front end of the piston rod 723 is connected to the chuck 725 via a hinge pin 724.
　チャック７２５はトレイ台７１２に載置されたトレイ３の端部を挟むもので、下部に配置されたピン７２６を介してシリンダ取付板７１８に回転可能な状態で取り付けられている。ピストンロッド７２３を縮めると、図７に２点鎖線で示すようにチャック７２５はピン７２６を支点として反時計回りに回転し、トレイ３はチャック７２５による把持から開放される。チャック７２５の下面には、ウレタンシート７２７が貼り付けられており、チャック７２５とトレイ台７１２でトレイ３を挟んだ際に生じるガタツキを防止している。 The chuck 725 sandwiches the end of the tray 3 placed on the tray base 712, and is attached to the cylinder mounting plate 718 in a rotatable state via a pin 726 disposed at the lower part. When the piston rod 723 is contracted, the chuck 725 rotates counterclockwise around the pin 726 as shown by a two-dot chain line in FIG. 7, and the tray 3 is released from gripping by the chuck 725. A urethane sheet 727 is affixed to the lower surface of the chuck 725 to prevent rattling that occurs when the tray 3 is sandwiched between the chuck 725 and the tray base 712.
　シリンダ取付板７１８とアームベース７１１の間に、第２のリニアガイド７３１が設置されている。図９に示すように、第２のリニアガイド７３１は、アームベース７１１の上面に、シリンダ取付板７１８と平行に取り付けられたレール７３２と、シリンダ取付板７１８の下面に取り付けられたブロック７３３で構成され、シリンダ取付板７１８の水平方向（図７および図８において矢印Ｃで示す方向）への移動をガイドする。 A second linear guide 731 is installed between the cylinder mounting plate 718 and the arm base 711. As shown in FIG. 9, the second linear guide 731 includes a rail 732 attached to the upper surface of the arm base 711 in parallel with the cylinder attachment plate 718 and a block 733 attached to the lower surface of the cylinder attachment plate 718. Then, the movement of the cylinder mounting plate 718 in the horizontal direction (the direction indicated by the arrow C in FIGS. 7 and 8) is guided.
　シリンダ取付板７１８を水平方向に移動できるようにしたのは、作業者がトレイ３をトレイ台７１２に取り付ける際もしくはトレイ３をトレイ台７１２から取り外す際に、チャック７２５が邪魔にならないようにするためである。シリンダ取付板７１８が後退することにより、チャック７２５はトレイ３が接触しない位置まで退避する。 The reason why the cylinder mounting plate 718 can be moved in the horizontal direction is to prevent the chuck 725 from getting in the way when the operator attaches the tray 3 to the tray base 712 or removes the tray 3 from the tray base 712. It is. As the cylinder mounting plate 718 moves backward, the chuck 725 is retracted to a position where the tray 3 does not contact.
　＜基板検査装置の動作＞
　次に、図１０および図１１、更には前述の各図面を参照して、本発明にかかる検査装置１の動作を説明する。図１０は、検査装置１の動作の流れを示すフローチャート、図１１は、上検査治具４と下検査治具５の動作を説明する要部側面図である。 <Operation of board inspection device>
Next, the operation of the inspection apparatus 1 according to the present invention will be described with reference to FIGS. 10 and 11 and the respective drawings described above. FIG. 10 is a flowchart showing the flow of the operation of the inspection apparatus 1, and FIG. 11 is a side view of the main part for explaining the operations of the upper inspection jig 4 and the lower inspection jig 5.
　作業を開始する前、基板搬送ユニット７は図２に示す位置で待機している。またトレイ台７１２は、下検査治具５より高い位置に保持されている。このとき、チャック７２５は開放された状態にあり、更にチャック７２５はリニアガイド７３１によって後退しているため、作業者がトレイ３をトレイ台７１２に載置する際に邪魔にならない。 Before starting the work, the substrate transfer unit 7 stands by at the position shown in FIG. The tray table 712 is held at a position higher than the lower inspection jig 5. At this time, the chuck 725 is in an open state, and the chuck 725 is further retracted by the linear guide 731, so that it does not get in the way when the operator places the tray 3 on the tray base 712.
　最初に、作業者は、トレイ３の両端部を、一対の基板搬送ユニット７のそれぞれのトレイ台７１２に取り付ける（ステップＳ１１）。作業者は、トレイ３の両端部に形成された位置決め用の４つの孔３０２（図４参照）に、トレイ台７１２に取り付けられた４本のガイドピン７１３をそれぞれ挿入して、トレイ３をトレイ台７１２に載置する（図２参照）。 First, the operator attaches both end portions of the tray 3 to the tray bases 712 of the pair of substrate transport units 7 (step S11). The operator inserts the four guide pins 713 attached to the tray base 712 into the four positioning holes 302 (see FIG. 4) formed at both ends of the tray 3, respectively. It mounts on the stand 712 (refer FIG. 2).
　次に、作業者が制御ユニット８のボタンを押すと、第２のエアシリンダ７１５のピストンロッド７１６が伸びてシリンダ取付板７１８が前進し、その後、第３のエアシリンダ７２１のピストンロッド７２３が伸びてチャック７２５がピン７２６を中心に回転し、トレイ台７１２との間でトレイ３の端部を把持する（図７参照、ステップＳ１２）。 Next, when the operator presses the button of the control unit 8, the piston rod 716 of the second air cylinder 715 extends and the cylinder mounting plate 718 advances, and then the piston rod 723 of the third air cylinder 721 extends. Then, the chuck 725 rotates around the pin 726 and grips the end of the tray 3 with the tray base 712 (see FIG. 7, step S12).
　次に、作業者は、図４（ｂ）に示すように、トレイ３にプリント基板２を載置すると共に、プリント基板２がトレイ３から脱落しないように、トレイ３のガイドピン３０１をプリント基板２の孔２０２に挿入する（ステップＳ１３）。これによりトレイ３搬送の準備が完了する。 Next, as shown in FIG. 4B, the operator places the printed circuit board 2 on the tray 3, and sets the guide pins 301 of the tray 3 so that the printed circuit board 2 does not fall out of the tray 3. The second hole 202 is inserted (step S13). Thus, preparation for transporting the tray 3 is completed.
　これ以降の動作は、制御ユニット８の記憶部８０２（図３参照）に格納されたデータに基づいて自動で行われる。作業者が制御ユニット８のスタートボタンを押すと、スライドテーブル７０１が駆動されてスライドブロック７０２が水平方向に移動し、トレイ３を、最初に検査を行う配線パターンが下検査治具５の上方に来るまで搬送する（ステップＳ１４） The subsequent operations are automatically performed based on the data stored in the storage unit 802 (see FIG. 3) of the control unit 8. When the operator presses the start button of the control unit 8, the slide table 701 is driven to move the slide block 702 in the horizontal direction, and the wiring pattern for the first inspection on the tray 3 is placed above the lower inspection jig 5. Transport until it comes (step S14)
　この状態を図１１（ａ）に示す。チャック７２５によって把持されたトレイ３の下方には下検査治具５が位置し、上方には昇降ユニット６のプレート６０３に取り付けられた上検査治具４が位置している。 This state is shown in FIG. The lower inspection jig 5 is positioned below the tray 3 held by the chuck 725, and the upper inspection jig 4 attached to the plate 603 of the lifting unit 6 is positioned above the tray 3.
　スライドブロック７０２が指定された位置まで移動して停止すると、トレイ搬送ユニット７の第１のエアシリンダ７０５が駆動され、ピストンロッド７０６が縮んでアームベース７１１が下降する。またアームベース７１１の下降に併せて、第３のエアシリンダ７２１のピストンロッド７２３が縮んでチャック７２５がピン７２６を中心に回転し（図７参照）、トレイ３がチャック７２５の把持から開放される（ステップＳ１５）。 When the slide block 702 moves to the designated position and stops, the first air cylinder 705 of the tray transport unit 7 is driven, the piston rod 706 is contracted, and the arm base 711 is lowered. As the arm base 711 is lowered, the piston rod 723 of the third air cylinder 721 contracts and the chuck 725 rotates around the pin 726 (see FIG. 7), and the tray 3 is released from the grip of the chuck 725. (Step S15).
　その状態を図１１（ｂ）に示す。このとき、プリント基板２に形成された位置決め用の４つの孔２０２に、トレイ３に形成された孔３０３を介して下検査治具５に取り付けられた４本のガイドピン５０４がそれぞれ挿入される。位置決め用の孔２０２の直径とガイドピン５０４の付け根部分の直径はほぼ等しいため、プリント基板２はガイドピン５０４によって正確に位置決めされる。 The state is shown in FIG. At this time, four guide pins 504 attached to the lower inspection jig 5 are inserted into the four positioning holes 202 formed in the printed circuit board 2 through the holes 303 formed in the tray 3. . Since the diameter of the positioning hole 202 and the diameter of the base portion of the guide pin 504 are substantially equal, the printed circuit board 2 is accurately positioned by the guide pin 504.
　次に、昇降ユニット６のエアシリンダ６０４を駆動してピストンロッド６０５を伸ばすことにより上検査治具４が下降し、図１１（ｃ）に示すように、上検査治具４の検査ボード４０１と下検査治具５の検査ボード５０１でトレイ３を挟んだ状態で停止する（ステップＳ１６）。 Next, by driving the air cylinder 604 of the elevating unit 6 and extending the piston rod 605, the upper inspection jig 4 is lowered, and as shown in FIG. 11 (c), the inspection board 401 of the upper inspection jig 4 and The tray 3 is stopped while the tray 3 is sandwiched between the inspection boards 501 of the lower inspection jig 5 (step S16).
　上検査治具４の検査ボード４０１と下検査治具５の検査ボード５０１でトレイ３を挟んだ状態では、図６（ｂ）に示したように、圧力によって上検査治具４の圧縮バネ４１６が収縮して検査ピン４１８の先端がガイド孔４２４から露出して、プリント基板２の上面に形成された配線２０１に接触する。 In a state where the tray 3 is sandwiched between the inspection board 401 of the upper inspection jig 4 and the inspection board 501 of the lower inspection jig 5, as shown in FIG. 6B, the compression spring 416 of the upper inspection jig 4 is pressed by pressure. The tip of the inspection pin 418 is exposed from the guide hole 424 and contacts the wiring 201 formed on the upper surface of the printed board 2.
　プリント基板２の下面に形成された配線２０１も、上検査治具４と同様に、圧縮バネが収縮して検査ピンの先端がガイド孔から露出して、プリント基板２の下面に形成された配線２０１に接触する。 The wiring 201 formed on the lower surface of the printed circuit board 2 is also formed on the lower surface of the printed circuit board 2 in the same manner as the upper inspection jig 4 because the compression spring contracts and the tip of the inspection pin is exposed from the guide hole. 201 is contacted.
　この状態において、プリント基板２の導通または絶縁の検査が行われる（ステップＳ１７）。具体的には、検査ユニット９の計測部９０２は、選択された２本の検査ピン４１８の間に電圧を印加すると共に、検査ピン間の抵抗値を計測し、その値を制御部９０４に送る。 In this state, the continuity or insulation of the printed circuit board 2 is inspected (step S17). Specifically, the measurement unit 902 of the inspection unit 9 applies a voltage between the two selected inspection pins 418, measures the resistance value between the inspection pins, and sends the value to the control unit 904. .
　制御部９０４は、計測された検査ピン間の抵抗値と、記憶部９０３に格納されている良品のプリント基板の抵抗値とを比較して、検査の対象となったプリント基板の導通または絶縁の良否判定を行う。判定結果は、制御部９０４によって入力表示部９０１に表示され、更に記憶部９０３に書き込まれる。 The control unit 904 compares the measured resistance value between the inspection pins with the resistance value of a non-defective printed circuit board stored in the storage unit 903, and determines whether the printed circuit board to be inspected is conductive or insulated. Pass / fail judgment is performed. The determination result is displayed on the input display unit 901 by the control unit 904 and further written in the storage unit 903.
　検査が終了すると、昇降ユニット６のエアシリンダ６０４を駆動してピストンロッド６０５を縮めることにより、上検査治具４が図１１（ｄ）に示す位置まで上昇し、その位置に保持される（ステップＳ１８）。図１１（ｄ）に示す上検査治具４の位置は、図１１（ｂ）に示す上検査治具４の位置より低く設定されている。これは、次の検査を行う際の上検査治具４の下降時間を短縮するためである。 When the inspection is completed, the air cylinder 604 of the elevating unit 6 is driven to contract the piston rod 605, whereby the upper inspection jig 4 is raised to the position shown in FIG. S18). The position of the upper inspection jig 4 shown in FIG. 11 (d) is set lower than the position of the upper inspection jig 4 shown in FIG. 11 (b). This is for shortening the descent time of the upper inspection jig 4 when performing the next inspection.
　次に、基板搬送ユニット７の第１のエアシリンダ７０５が駆動され、ピストンロッド７０６が伸び、アームベース７１１が上昇してトレイ３が下検査治具５から離れる。トレイ３の上昇開始より少し遅れて基板搬送ユニット７の第３のエアシリンダ７２１が動作し、ピストンロッド７２３が伸びてチャック７２５がピン７２６を中心に時計回りに回転し、トレイ台７１２との間でトレイ３の端部を再び把持する（ステップＳ１９）。 Next, the first air cylinder 705 of the substrate transport unit 7 is driven, the piston rod 706 is extended, the arm base 711 is raised, and the tray 3 is separated from the lower inspection jig 5. The third air cylinder 721 of the substrate transport unit 7 operates slightly later than the start of raising the tray 3, the piston rod 723 extends, the chuck 725 rotates clockwise around the pin 726, and between the tray table 712. Then, the end of the tray 3 is gripped again (step S19).
　トレイ３が上昇する際、ガイドピン５０４によって下検査治具５に固定されていたプリント基板２は、位置決め用の孔２０２からガイドピン５０４が外れて、下検査治具５から引き離される。最終的に、トレイ３は図１１（ａ）に示す位置まで上昇する。 When the tray 3 is raised, the printed circuit board 2 fixed to the lower inspection jig 5 by the guide pins 504 is detached from the lower inspection jig 5 with the guide pins 504 removed from the positioning holes 202. Finally, the tray 3 is raised to the position shown in FIG.
　検査ユニット９の制御部９０４は、記憶部９０３に格納された検査データから、プリント基板２の全ての配線パターンの検査が終了したかどうかを確認し（ステップＳ２０）、検査が終了していない場合（同ステップでＮｏ）、ステップＳ１４に戻って、ステップＳ１４～Ｓ１９の処理を繰り返す。 The control unit 904 of the inspection unit 9 confirms from the inspection data stored in the storage unit 903 whether or not the inspection of all the wiring patterns on the printed circuit board 2 has been completed (step S20). (No in the same step), the process returns to step S14, and the processes of steps S14 to S19 are repeated.
　一方、制御部９０４が、プリント基板２の全ての配線パターンの検査が終了したと判断した場合（ステップＳ２０でＹｅｓ）、制御ユニット８に検査が終了したことを示すデータを送信する。制御ユニット８は、その後、上検査治具４を図１１（ａ）に示す初期位置まで上昇させると共に、スライドテーブル７０１を駆動して基板搬送ユニット７を初期位置まで移動させる（ステップＳ２１）。その後、作業者は、トレイ３に載置されたプリント基板２をトレイ３から取り外す（ステップＳ２２）。 On the other hand, when the control unit 904 determines that the inspection of all the wiring patterns of the printed circuit board 2 has been completed (Yes in step S20), the control unit 904 transmits data indicating that the inspection has been completed to the control unit 8. Thereafter, the control unit 8 raises the upper inspection jig 4 to the initial position shown in FIG. 11A, and drives the slide table 701 to move the substrate transport unit 7 to the initial position (step S21). Thereafter, the operator removes the printed circuit board 2 placed on the tray 3 from the tray 3 (step S22).
　図１０には示していないが、作業者は、検査ユニット９の入力表示部９０１に表示された検査結果に基づいて、トレイ３から取り外されたプリント基板２のうち、導通または絶縁が不良と判定された配線パターンの箇所に識別用のマークが表示されたシールを貼る。 Although not shown in FIG. 10, the operator determines that conduction or insulation is poor among the printed circuit boards 2 removed from the tray 3 based on the inspection result displayed on the input display unit 901 of the inspection unit 9. A sticker on which an identification mark is displayed is pasted at the place of the printed wiring pattern.
　識別用のシールが貼られたプリント基板２は、図示しないカッターによって配線パターン毎に分離される。個々に分離されたプリント基板のうち、識別用のシールが貼られた基板は廃棄され、良品のプリント基板だけが製品として出荷される。 The printed circuit board 2 on which the identification seal is affixed is separated for each wiring pattern by a cutter (not shown). Of the individually separated printed boards, the board with the identification sticker is discarded, and only good printed boards are shipped as products.
　図１０の説明に戻って、ステップＳ２２の処理が終了した時点において、作業者は、検査対象である全てのプリント基板の検査が終了したかどうかを判断し（ステップＳ２３）、検査が終了していないプリント基板がある場合には（Ｎｏ）、ステップＳ１３の処理に戻って新しいプリント基板２をトレイ３に載置する。 Returning to the description of FIG. 10, at the time when the process of step S22 is completed, the operator determines whether or not the inspection of all the printed circuit boards to be inspected has been completed (step S23), and the inspection has been completed. If there is no printed circuit board (No), the process returns to step S13 to place a new printed circuit board 2 on the tray 3.
　一方、全てのプリント基板について検査が終了した場合には（ステップＳ２３でＹｅｓ）、ステップＳ２４の処理に移行し、作業者はトレイ３を基板搬送ユニット７から取り外す。具体的には、作業者が制御ユニット８のボタンを押すと、基板搬送ユニット７の第３のエアシリンダ７２１のピストンロッド７２３が縮んでチャック７２５がピン７２６を中心に回転し、トレイ３がチャック７２５による把持から開放される。更に、第２のエアシリンダ７１５のピストンロッド７１６が縮んで、チャック７２５が後退する。 On the other hand, when the inspection has been completed for all the printed boards (Yes in Step S23), the process proceeds to Step S24, and the operator removes the tray 3 from the board transport unit 7. Specifically, when the operator presses the button of the control unit 8, the piston rod 723 of the third air cylinder 721 of the substrate transport unit 7 is contracted, the chuck 725 is rotated around the pin 726, and the tray 3 is chucked. Release from gripping by 725. Further, the piston rod 716 of the second air cylinder 715 contracts and the chuck 725 moves backward.
　その後、作業者はトレイ台７１２からトレイ３を取り外す。この際、チャック７は退避位置にあるため、トレイ３をトレイ台７１２から外す際に邪魔にならない。 Thereafter, the operator removes the tray 3 from the tray base 712. At this time, since the chuck 7 is in the retracted position, it does not get in the way when the tray 3 is removed from the tray base 712.
　上述したように、本実施の形態にかかる検査装置を用いれば、フレキシブルプリント基板のそりやねじれを考慮する必要がないため、装置の構成が単純になり、結果として、検査装置を安価に製造できる。しかも、プリント基板の両面の配線を同時に検査できるため、検査に必要な時間を短縮できる。 As described above, when the inspection apparatus according to the present embodiment is used, it is not necessary to consider warping or twisting of the flexible printed circuit board, so that the configuration of the apparatus is simplified, and as a result, the inspection apparatus can be manufactured at low cost. . Moreover, since the wiring on both sides of the printed circuit board can be inspected simultaneously, the time required for the inspection can be shortened.
　なお、本実施の形態において、昇降ユニット６および基板搬送ユニット７の駆動手段としてエアシリンダを用いたが、これに限定されない。駆動手段として油圧のシリンダや、電磁石によって駆動されるアクチュエータを用いても、同様の機能を実現できることは云うまでもない。 In the present embodiment, air cylinders are used as driving means for the elevating unit 6 and the substrate transport unit 7, but the present invention is not limited to this. It goes without saying that the same function can be realized even if a hydraulic cylinder or an actuator driven by an electromagnet is used as the driving means.
　（実施の形態２）
　本実施の形態は、実施の形態１の検査装置１のスライドテーブル７０１の後部の近傍に基板反転ユニット１１とパンチングユニット１２を設置したものである。図１２に、スライドテーブル７０１の後部近傍に配された基板反転ユニット１１とパンチングユニット１２を示す。以下、それぞれのユニットを設ける理由と構成について説明する。 (Embodiment 2)
In the present embodiment, a substrate reversing unit 11 and a punching unit 12 are installed in the vicinity of the rear portion of the slide table 701 of the inspection apparatus 1 according to the first embodiment. FIG. 12 shows the substrate reversing unit 11 and the punching unit 12 disposed in the vicinity of the rear portion of the slide table 701. Hereinafter, the reason and structure of providing each unit are demonstrated.
　＜基板反転ユニット＞
　前述の図４（ｂ）に示すように、プリント基板２には同一の配線パターンが複数個規則正しく形成されている。プリント基板２の検査が終了した後、プリント基板２を切断して個別のプリント基板に分離する。 <Substrate reversing unit>
As shown in FIG. 4B described above, a plurality of the same wiring patterns are regularly formed on the printed circuit board 2. After the inspection of the printed circuit board 2 is completed, the printed circuit board 2 is cut and separated into individual printed circuit boards.
　図４（ｂ）に示した配線パターンについて更に説明すると、縦方向に５個配列された配線パターンのそれぞれは、１つの配線パターンと、それを反転させた配線パターンとが、近接して配置されたものである。このようにプリント基板によっては、配線の密度を高めるために、１ピッチごとに配線パターンの方向を反転させて配置する場合がある。 The wiring pattern shown in FIG. 4B will be further described. In each of the five wiring patterns arranged in the vertical direction, one wiring pattern and a wiring pattern obtained by inverting the wiring pattern are arranged close to each other. It is a thing. As described above, depending on the printed circuit board, in order to increase the wiring density, the wiring pattern direction may be reversed for each pitch.
　個々の配線パターンが同一の方向を向いている場合には、基板搬送ユニット７によるプリント基板２の搬送を繰り返すだけで基板全体の検査を行うことができる。例えば、１回の検査で左右に配列された一対の配線パターンの検査を行う場合、一対の配線パターンに対応する数の検査ピン４１８を有する上検査治具４と下検査治具５を用い、基板搬送ユニット７によって配線パターンを一ピッチずつずらしながら検査を繰り返すことにより、プリント基板２全体の検査を行うことができる。 When the individual wiring patterns are directed in the same direction, the entire board can be inspected simply by repeatedly carrying the printed board 2 by the board carrying unit 7. For example, when inspecting a pair of wiring patterns arranged on the left and right in one inspection, the upper inspection jig 4 and the lower inspection jig 5 having the number of inspection pins 418 corresponding to the pair of wiring patterns are used. By inspecting the printed circuit board 2 as a whole by repeating the inspection while shifting the wiring pattern by one pitch by the substrate transport unit 7.
　これに対し、１ピッチごとに配線パターンの方向を反転させたプリント基板を検査する場合、順方向の配列パターンに対応した検査ピンと、逆方向の配列パターンに対応した検査ピンの２種類の検査ピンを有する検査治具を用意する必要がある。しかし、検査ピンの数が多い場合には、検査治具４および５を作製するのに費用がかかり、コストアップの原因となる。 On the other hand, when inspecting a printed circuit board in which the direction of the wiring pattern is reversed for each pitch, there are two types of inspection pins: an inspection pin corresponding to the forward arrangement pattern and an inspection pin corresponding to the reverse arrangement pattern. It is necessary to prepare an inspection jig having However, when the number of inspection pins is large, it is expensive to produce the inspection jigs 4 and 5, which causes an increase in cost.
　そこで、本実施の形態では、このようなプリント基板に対し、順方向の配線パターンの検査が終了した後に、基板反転ユニット１１を用いてプリント基板を１８０度回転させ、その後、逆方向の配線パターンについて、順方向と同様の手順で配線の検査を行う。このようにすれば、２種類の検査ピンを有する検査治具を用意する必要がないため、検査コストを低減できる。 Therefore, in the present embodiment, after the inspection of the wiring pattern in the forward direction is completed for such a printed circuit board, the printed circuit board is rotated by 180 degrees using the substrate reversing unit 11, and then the wiring pattern in the reverse direction is used. The wiring is inspected in the same manner as in the forward direction. In this way, it is not necessary to prepare an inspection jig having two types of inspection pins, so that inspection costs can be reduced.
　図１２を参照して、基板反転ユニット１１の構成と動作を説明する。なお、基板反転ユニット１１の制御は、実施の形態１で説明した制御ユニット８により行われる。 The configuration and operation of the substrate reversing unit 11 will be described with reference to FIG. The substrate reversing unit 11 is controlled by the control unit 8 described in the first embodiment.
　基板反転ユニット１１は、基板搬送ユニット７によって搬送されたトレイ３を載置するテーブル１１１、テーブル１１１を回転させるエアシリンダ１１２、およびテーブル１１１を昇降させるエアシリンダ１１３で構成されている。 The substrate reversing unit 11 includes a table 111 on which the tray 3 transported by the substrate transport unit 7 is placed, an air cylinder 112 that rotates the table 111, and an air cylinder 113 that moves the table 111 up and down.
　図１２に、テーブル１１１に載置されたトレイ３の輪郭を２点鎖線で示す。テーブル１１１の４隅には、ガイドピン１１４がそれぞれ設けられている。ガイドピン１１４を、トレイ３の対向する位置に形成された孔に挿入することにより、トレイ３はテーブル１１１に対して位置決めされ、更にトレイ３がテーブル１１１から脱落するのを防止している。 FIG. 12 shows the outline of the tray 3 placed on the table 111 with a two-dot chain line. Guide pins 114 are provided at the four corners of the table 111, respectively. By inserting the guide pins 114 into the holes formed at the opposite positions of the tray 3, the tray 3 is positioned with respect to the table 111 and further prevents the tray 3 from dropping from the table 111.
　テーブル１１１の中心の下面には、駆動手段であるエアシリンダ１１２の回転軸が接続されている。回転軸は一対のスライドテーブル７０１、７０１の中間点に設置されているため、エアシリンダ１１３によりテーブル１１１に載置されたトレイ３が１８０度回転したとき、トレイ３はスライドテーブル７０１に対して同じ位置に保持される。 The rotating shaft of the air cylinder 112 which is a driving means is connected to the lower surface of the center of the table 111. Since the rotation shaft is installed at the intermediate point between the pair of slide tables 701 and 701, when the tray 3 placed on the table 111 is rotated 180 degrees by the air cylinder 113, the tray 3 is the same with respect to the slide table 701. Held in position.
　基板反転ユニット１１の動作を説明する。テーブル１１１は、非使用時には、基板搬送ユニット７によるトレイ３の搬送の妨げにならないように、エアシリンダ１１３のピストンロッド（図示せず）を縮めて、基板搬送ユニット７のトレイ台７１２の下方の位置している。 The operation of the substrate reversing unit 11 will be described. When the table 111 is not in use, the piston rod (not shown) of the air cylinder 113 is contracted so as not to hinder the transport of the tray 3 by the substrate transport unit 7, so positioned.
　順方向の配線パターンの検査が終了したプリント基板２は、基板搬送ユニット７によって図１２に２点鎖線で示す位置まで搬送される。その後、トレイ３はチャック７２５の把持から開放され、更にチャック７２５はリニアガイド７３１によりトレイ３の取り出しの邪魔にならない位置まで後退する。 The printed circuit board 2 for which the inspection of the wiring pattern in the forward direction has been completed is transported to the position indicated by the two-dot chain line in FIG. Thereafter, the tray 3 is released from the grip of the chuck 725, and the chuck 725 is further retracted to a position where it does not interfere with the removal of the tray 3 by the linear guide 731.
　この状態において、エアシリンダ１１３を駆動することによってテーブル１１１が上昇し、トレイ台７１２に載置されたトレイ３に当接してトレイ３を持ち上げる。この時、ガイドピン１１４がトレイ３の対向する位置に形成された孔に挿入される。 In this state, by driving the air cylinder 113, the table 111 is lifted and comes into contact with the tray 3 placed on the tray base 712 to lift the tray 3. At this time, the guide pin 114 is inserted into a hole formed at a position facing the tray 3.
　トレイ３はトレイ台７１２の上方で停止し、その位置でエアシリンダ１１２が回転してトレイ３を１８０度回転させる。 The tray 3 stops above the tray base 712, and the air cylinder 112 rotates at that position to rotate the tray 3 180 degrees.
　次に、エアシリンダ１１３のピストンロッド（図示せず）を縮めてテーブル１１１を下降させ、反転したトレイ３をトレイ台７１２に載置する。テーブル１１１はトレイ台７１２の下まで下降した後、停止する。 Next, the piston rod (not shown) of the air cylinder 113 is contracted to lower the table 111, and the inverted tray 3 is placed on the tray base 712. The table 111 is lowered to the bottom of the tray table 712 and then stops.
　その後、チャック７２５がリニアガイド７３１により前進し、更にトレイ台７１２に載置されたトレイ３の端部を把持する。反転されたトレイ３は、検査治具４、５による検査が行われる位置まで搬送され、前述の手順に従って逆方向の配線パターンの検査が行われる。 Thereafter, the chuck 725 moves forward by the linear guide 731 and further grips the end of the tray 3 placed on the tray base 712. The inverted tray 3 is transported to a position where the inspection by the inspection jigs 4 and 5 is performed, and the wiring pattern in the reverse direction is inspected according to the above-described procedure.
　＜パンチングユニット＞
　図１０のフローチャートを用いて説明したように、検査を終えたプリント基板２は、個々の配線パターン毎に分離され、良品と判定された基板のみ出荷される。分離の際、導通不良または絶縁不良と判定された配線パターンに識別マークが付与されていれば、分割後、その基板だけを廃棄すればよいため、分別にかかる時間を短縮できる。 <Punching unit>
As described with reference to the flowchart of FIG. 10, the printed circuit board 2 that has been inspected is separated for each wiring pattern, and only a board that is determined to be non-defective is shipped. If an identification mark is given to a wiring pattern determined to have poor conduction or insulation failure at the time of separation, only the substrate needs to be discarded after the division, so that the time required for separation can be shortened.
　実施の形態１では、作業者が不良と判断された配線パターンに識別マークとしてシールを貼り付けていたが、このような方法では、作業者による手作業が必要であるためコストアップの原因となり、更には検査に要する時間が長くなる。 In the first embodiment, the seal is pasted as an identification mark on the wiring pattern that is determined to be defective by the operator. However, in this method, manual operation by the operator is necessary, which causes an increase in cost. Furthermore, the time required for the inspection becomes longer.
　本実施の形態では、それを解決するための手段として、プリント基板の配線パターンのうち不良と判定された配線パターンに識別用のマークを付与する識別マーク付与手段を設けている。具体的には、導通不良または絶縁不良と判定された配線パターンが一目でわかるように、パンチングユニット１２を用いて不良と判定された配線パターンに、識別マークとして孔を開けている。 In this embodiment, as means for solving this problem, there is provided identification mark applying means for applying an identification mark to a wiring pattern determined to be defective among the wiring patterns of the printed circuit board. Specifically, a hole is made as an identification mark in the wiring pattern determined to be defective using the punching unit 12 so that the wiring pattern determined to be poor conduction or insulation failure can be seen at a glance.
　図１２に示すように、パンチングユニット１２は、上パンチャー１２１と下パンチャー１２２、下パンチャー１２２を上下動させるエアシリンダ１２３、およびエアシリンダ１２３を水平方向に移動させるスライダー１２４で構成されている。パンチングユニット１２の制御は、基板反転ユニット１１と同様、制御ユニット８により行われる。 12, the punching unit 12 includes an upper puncher 121, a lower puncher 122, an air cylinder 123 that moves the lower puncher 122 up and down, and a slider 124 that moves the air cylinder 123 in the horizontal direction. The punching unit 12 is controlled by the control unit 8 in the same manner as the substrate reversing unit 11.
　図示しないが、上パンチャー１２１と下パンチャー１２２は、コ字状のアームの上端部と下端部に取り付けられており、スライダー１２４によって水平方向に一体で移動できるように構成されている。なお、上パンチャー１２１にも、パンチャーを上下動させるエアシリンダが設けられているが、これはエアシリンダ１２３と同様の機能を発揮するものであるため、見易さの観点より、図１２では省略している。 Although not shown, the upper puncher 121 and the lower puncher 122 are attached to the upper end portion and the lower end portion of the U-shaped arm, and are configured to be moved integrally in the horizontal direction by the slider 124. Note that the upper puncher 121 is also provided with an air cylinder for moving the puncher up and down. However, since this performs the same function as the air cylinder 123, it is omitted in FIG. is doing.
　上パンチャー１２１は、非動作時には、図示しないエアシリンダを駆動することにより、基板搬送ユニット７によるトレイ３の搬送を妨げないように、トレイ台７１２より高い位置に保持される。同様に、下パンチャー１２２は、エアシリンダ１２３を駆動することにより、トレイ台７１２より低い位置に保持されている。 When the upper puncher 121 is not in operation, the upper puncher 121 is held at a position higher than the tray base 712 so as not to prevent the substrate transport unit 7 from transporting the tray 3 by driving an air cylinder (not shown). Similarly, the lower puncher 122 is held at a position lower than the tray base 712 by driving the air cylinder 123.
　パンチングユニット１２の動作を説明する。検査が終了した後、基板搬送ユニット７によりトレイ３はスライドテーブル７０１の後部に搬送される。トレイ３に載置されたプリント基板２のうち不良の配線パターンがスライダー１２４上に来たとき、基板搬送ユニット７は停止する。その後、スライダー１２４を駆動させることによって、上パンチャー１２１と下パンチャー１２２は、トレイ３の開口部３０４がある位置で停止する。 The operation of the punching unit 12 will be described. After the inspection is completed, the tray 3 is transported to the rear part of the slide table 701 by the substrate transport unit 7. When a defective wiring pattern on the printed circuit board 2 placed on the tray 3 comes on the slider 124, the substrate transport unit 7 stops. Thereafter, by driving the slider 124, the upper puncher 121 and the lower puncher 122 stop at a position where the opening 304 of the tray 3 is located.
　この状態において、エアシリンダ（図示せず）を駆動して上パンチャー１２１を降下させ、またエアシリンダ１２３を駆動して下パンチャー１２２を上昇させると、上パンチャー１２１と下パンチャー１２２がプリント基板２を挟んだ状態で衝突し、パンチングによりプリント基板２に孔が形成される。 In this state, when the air cylinder (not shown) is driven to lower the upper puncher 121 and the air cylinder 123 is driven to raise the lower puncher 122, the upper puncher 121 and the lower puncher 122 move the printed circuit board 2. Colliding in a sandwiched state, holes are formed in the printed circuit board 2 by punching.
　このようにして、導通不良または絶縁不良の配線パターンに孔が形成されたプリント基板２は、基板搬送ユニット７によって初期位置まで搬送された後、作業者の手によってトレイ３から取り外される。 In this way, the printed circuit board 2 in which the hole is formed in the wiring pattern having poor conduction or insulation failure is transported to the initial position by the board transport unit 7 and then removed from the tray 3 by the operator's hand.
　トレイ３から取り外されたプリント基板２は、配線パターン毎に分離されるが、導通や絶縁が不良の配線パターンには孔が開けられているため、プリント基板の良否を簡単に見分けることができる。 The printed circuit board 2 removed from the tray 3 is separated for each wiring pattern. However, since the wiring pattern with poor conduction and insulation is perforated, the quality of the printed circuit board can be easily identified.
　なお、本実施の形態では、導通や絶縁が不良の配線パターンを識別するマークとして、プリント基板に孔を開けたが、識別マークはこれに限定されない。実施の形態１で説明したように、プリント基板の該当する箇所にシールを貼り付けるようにしてもよい。 In this embodiment, the printed board is perforated as a mark for identifying a wiring pattern having poor conduction or insulation, but the identification mark is not limited to this. As described in the first embodiment, a sticker may be attached to a corresponding portion of the printed board.
　また本実施の形態では、昇降ユニット６や基板搬送ユニット７と同様に、基板反転ユニット１１およびパンチングユニット１２の駆動手段としてエアシリンダを用いたが、これらの代わりに油圧シリンダや電磁石を利用したアクチュエータを用いてもよいことは云うまでもない。 Further, in the present embodiment, an air cylinder is used as a driving means for the substrate reversing unit 11 and the punching unit 12 as in the case of the lifting unit 6 and the substrate transport unit 7, but an actuator using a hydraulic cylinder or an electromagnet instead of these. It goes without saying that may be used.
　また図１２では、基板反転ユニット１１のテーブル１１１とパンチングユニット１２のスライダー１２４が一部重なる状態で設置されているが、これはスペースの有効活用を意図したものである。テーブル１１１および下パンチャー１２２の昇降に支障がなければ、重なる位置に設置しても特に問題は生じない。 Also, in FIG. 12, the table 111 of the substrate reversing unit 11 and the slider 124 of the punching unit 12 are installed in a partially overlapping state, but this is intended for effective use of space. If there is no hindrance to raising and lowering the table 111 and the lower puncher 122, there is no particular problem even if they are installed at overlapping positions.
　　１　基板検査装置
　　２　プリント基板
　　３　トレイ
　　４　上検査治具
　　５　下検査治具
　　６　昇降ユニット
　　７　基板搬送ユニット
　　８　制御ユニット
　　９　検査ユニット
　１１　基板反転ユニット
　１２　パンチングユニット
１０１　基台
１０２、６０３　プレート
１０３、６０７　取付具
１１１　テーブル
１１２　回転軸
１１３、１２３、６０４、７０５、７１５、７２１　エアシリンダ
１２１　上パンチャー
１２２　下パンチャー
１２４　スライダー
２０１　配線
２０２、３０２、３０３　位置決め用孔
２０３　パッド
３０１、５０４、７１３　ガイドピン
３０４　開口部
４０１、５０１　検査ボード
４０２、５０２　支持板
４０３、５０３、６０１　支柱
４１１、４１２　ボード
４１３　押出部材
４１４　ケース
４１５　押出ピン
４１６、４２０　圧縮バネ
４１７　プローブ
４１８　検査ピン
４１９　ソケット
４２２　絶縁パイプ
４２３　リードワイヤ
６０２　天板
６０５、７０６、７１６、７２３　ピストンロッド
６０６、７０８、７３１　リニアガイド
７０１　スライドテーブル
７０２　スライドブロック
７０４　ガイド取付板
７０７、７１７　連結板
７１１　アームベース
７１２　トレイ台
７１８　シリンダ取付板
７２４、７１６　ピン
７２７　ウレタンフォーム
８００　プロセッサ
８０１、９０１　入力表示部
８０２、９０３　記憶部
９０２　計測部
９０４　制御部 DESCRIPTION OF SYMBOLS 1 Board inspection device 2 Printed circuit board 3 Tray 4 Upper inspection jig 5 Lower inspection jig 6 Lifting unit 7 Substrate conveyance unit 8 Control unit 9 Inspection unit 11 Substrate reversing unit 12 Punching unit 101 Base 102, 603 Plate 103, 607 Tool 111 Table 112 Rotating shaft 113, 123, 604, 705, 715, 721 Air cylinder 121 Upper puncher 122 Lower puncher 124 Slider 201 Wiring 202, 302, 303 Positioning hole 203 Pad 301, 504, 713 Guide pin 304 Opening 401 , 501 Inspection board 402, 502 Support plate 403, 503, 601 Post 411, 412 Board 413 Extrusion member 414 Case 415 Extrusion pin 416, 420 Compression spring 417 Probe 418 Inspection pin 19 Socket 422 Insulation pipe 423 Lead wire 602 Top plate 605, 706, 716, 723 Piston rod 606, 708, 731 Linear guide 701 Slide table 702 Slide block 704 Guide mounting plate 707, 717 Connection plate 711 Arm base 712 Tray base 718 Cylinder Mounting plate 724, 716 pin 727 Urethane foam 800 Processor 801, 901 Input display unit 802, 903 Storage unit 902 Measurement unit 904 Control unit

Claims (11)

  1. 　少なくとも一方の面に配線が形成されたプリント基板の当該配線の所定の箇所に検査ピンを接触させると共に、選択された２本の検査ピンの間に、前記配線を介して電圧を印加して前記プリント基板の導通または絶縁の良否を検査するプリント基板検査装置であって、
    　前記プリント基板を載置する、絶縁材料で形成された板状のトレイと、
    　前記プリント基板の上面の配線の検査を行う上検査治具および下面の配線の検査を行う下検査治具と、
    　前記下検査治具の上方に配置された前記上検査治具を下降させ、かつ前記トレイに載置された状態のプリント基板を前記上検査治具および下検査治具で挟むことにより、前記上検査治具の検査ピンと前記プリント基板の配線とを接触させる昇降ユニットと、
    　前記上検査治具の選択された２本の検査ピンの間に電圧を印加すると共に、それらの間の抵抗値を計測する検査ユニットと、
    　前記昇降ユニットの動作を制御する制御ユニットと、を備えたことを特徴とするプリント基板検査装置。     An inspection pin is brought into contact with a predetermined portion of the wiring of the printed circuit board on which wiring is formed on at least one surface, and a voltage is applied between the selected two inspection pins via the wiring. A printed circuit board inspection device that inspects the continuity or insulation of a printed circuit board,
    A plate-like tray formed of an insulating material on which the printed circuit board is placed;
    An upper inspection jig for inspecting wiring on the upper surface of the printed circuit board and a lower inspection jig for inspecting wiring on the lower surface;
    The upper inspection jig placed above the lower inspection jig is lowered, and the printed circuit board placed on the tray is sandwiched between the upper inspection jig and the lower inspection jig, thereby An elevating unit for contacting the inspection pin of the inspection jig and the wiring of the printed circuit board;
    An inspection unit that applies a voltage between two selected inspection pins of the upper inspection jig and measures a resistance value between them;
    And a control unit for controlling the operation of the elevating unit.
  2. 　前記下検査治具の検査ピンは、前記トレイに形成された開口部を通して前記プリント基板の下面の配線に接触し、
    　前記検査ユニットは、前記上検査治具および下検査治具の選択された２本の検査ピンの間に電圧を印加すると共に、それらの間の抵抗値を計測する、請求項１に記載のプリント基板検査装置。     The inspection pin of the lower inspection jig contacts the wiring on the lower surface of the printed circuit board through the opening formed in the tray,
    The print according to claim 1, wherein the inspection unit applies a voltage between two selected inspection pins of the upper inspection jig and the lower inspection jig and measures a resistance value therebetween. Board inspection equipment.
  3. 　前記トレイの上面には、前記プリント基板に形成された位置決め用の孔に挿入される第１のガイドピンが取り付けられている、請求項１または２に記載のプリント基板検査装置。 The printed circuit board inspection apparatus according to claim 1 or 2, wherein a first guide pin inserted into a positioning hole formed in the printed circuit board is attached to an upper surface of the tray.
  4. 　前記下検査治具の上面には、前記プリント基板およびトレイのそれぞれに形成された位置決め用の孔に挿入される第２のガイドピンが取り付けられている、請求項１ないし３のいずれかに記載のプリント基板検査装置。 The 2nd guide pin inserted in the hole for positioning formed in each of the said printed circuit board and a tray is attached to the upper surface of the said lower inspection jig. Printed circuit board inspection equipment.
  5. 　前記トレイに載置されたプリント基板を水平方向に搬送する一対の基板搬送ユニットを備え、
    　当該基板搬送ユニットは、
    　　前記トレイの端部が載置されると共に、当該トレイに形成された位置決め用の孔に挿入される第３のガイドピンが上面に取り付けられたトレイ台と、
    　　当該トレイ台とで前記トレイを把持するチャックと、を備えている、請求項１ないし４のいずれかに記載のプリント基板検査装置。     A pair of substrate transport units that transport the printed circuit boards placed on the tray in the horizontal direction,
    The board transfer unit
    A tray base on which an end portion of the tray is placed and a third guide pin to be inserted into a positioning hole formed in the tray is attached to the upper surface;
    The printed circuit board inspection apparatus according to claim 1, further comprising: a chuck that grips the tray with the tray base.
  6. 　前記基板搬送ユニットは、前記トレイ台が上下方向に移動できるように構成されており、
    　検査が終了した後、前記トレイ台に載置されたトレイを上昇させ、前記下検査治具の第２のガイドピンを、前記プリント基板の位置決め用の孔から外す、請求項４に記載のプリント基板検査装置。     The substrate transport unit is configured such that the tray table can move in the vertical direction,
    5. The print according to claim 4, wherein after the inspection is finished, the tray placed on the tray table is raised, and the second guide pin of the lower inspection jig is removed from the positioning hole of the printed circuit board. Board inspection equipment.
  7. 　前記基板搬送ユニットは、
    　前記トレイ台に載置されたトレイを搬送する際には、前記トレイ台を前記下検査治具に接触しない位置まで上昇させ、
    　検査を行う際には、前記トレイ台を前記トレイが前記下検査治具に載置される位置まで下降させる、請求項５または６に記載のプリント基板検査装置。     The substrate transport unit is
    When transporting the tray placed on the tray table, raise the tray table to a position where it does not contact the lower inspection jig,
    The printed circuit board inspection apparatus according to claim 5 or 6, wherein when performing inspection, the tray base is lowered to a position where the tray is placed on the lower inspection jig.
  8. 　前記基板搬送ユニットは、前記トレイが前記下検査治具に載置されたとき、前記チャックによる前記トレイの把持を開放する、請求項５ないし７のいずれかに記載のプリント基板検査装置。 The printed circuit board inspection apparatus according to any one of claims 5 to 7, wherein the substrate transport unit releases gripping of the tray by the chuck when the tray is placed on the lower inspection jig.
  9. 　前記一対の基板搬送ユニットの移動経路に沿って設置された一対のスライドテーブルの間に、前記トレイに載置されたプリント基板の方向を反転させる基板反転ユニットが設置され、
    　当該基板反転ユニットは、
    　　前記トレイを載置するテーブルと、
    　　当該テーブルを回転させる回転手段と、
    　　当該テーブルを上下方向に移動させる第１の昇降手段と、で構成されていることを特徴とする、請求項１ないし８のいずれかに記載のプリント基板検査装置。     A substrate reversing unit for reversing the direction of the printed circuit board placed on the tray is installed between a pair of slide tables installed along the movement path of the pair of substrate transport units,
    The substrate reversing unit is
    A table on which the tray is placed;
    Rotating means for rotating the table;
    9. The printed circuit board inspection apparatus according to claim 1, further comprising a first lifting / lowering unit that moves the table in a vertical direction.
  10. 　前記一対の基板搬送ユニットの移動経路に沿って設置された一対のスライドテーブルの間に、前記プリント基板に形成された複数の配線パターンのうち導通不良または絶縁不良と判定された配線パターンに識別用のマークを付与する識別マーク付与手段が設置されている、請求項１ないし９のいずれかに記載のプリント基板検査装置。 Among the plurality of wiring patterns formed on the printed circuit board between the pair of slide tables installed along the movement path of the pair of substrate transport units, the wiring patterns determined to be defective in conduction or insulation are identified. The printed circuit board inspection apparatus according to claim 1, wherein identification mark applying means for applying the mark is provided.
  11. 　前記識別マーク付与手段はパンチングユニットで構成され、
    　当該パンチングユニットは、
    　　前記プリント基板を挟むように互いに衝突して当該プリント基板に孔を開ける上パンチャーおよび下パンチャーと、
    　　当該上パンチャーおよび下パンチャーを、前記基板搬送ユニットによる搬送方向と直交する方向に移動させるスライダーと、
    　　当該上パンチャーおよび下パンチャーのそれぞれを、上下方向に移動させる第２および第３の昇降手段と、を備えた、請求項１０に記載のプリント基板検査装置。     The identification mark applying means is composed of a punching unit,
    The punching unit is
    An upper puncher and a lower puncher that collide with each other so as to sandwich the printed circuit board and open a hole in the printed circuit board;
    A slider for moving the upper puncher and the lower puncher in a direction perpendicular to the transport direction by the substrate transport unit;
    The printed circuit board inspection apparatus according to claim 10, further comprising second and third elevating units that move the upper puncher and the lower puncher in the vertical direction.
PCT/JP2014/070549 2013-08-12 2014-08-05 Printed circuit board inspection device WO2015022875A1 (en)

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CN201480032844.2A CN105358994B (en) 2013-08-12 2014-08-05 Printed base plate checks device

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JP2013-167429 2013-08-12

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