JP2008039725A5 - - Google Patents
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- Publication number
- JP2008039725A5 JP2008039725A5 JP2006218062A JP2006218062A JP2008039725A5 JP 2008039725 A5 JP2008039725 A5 JP 2008039725A5 JP 2006218062 A JP2006218062 A JP 2006218062A JP 2006218062 A JP2006218062 A JP 2006218062A JP 2008039725 A5 JP2008039725 A5 JP 2008039725A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- inspection
- probe
- probes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 claims 58
- 239000000523 sample Substances 0.000 claims 18
- 239000004020 conductor Substances 0.000 claims 10
- 230000000875 corresponding Effects 0.000 claims 2
- 230000001070 adhesive Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
Claims (17)
各2本合計4本配置し、検査を行う導体回路両端の2つの検査ポイントが、両方共プリント配線板の第1面に位置する第1の導体回路群と、両方共プリント配線板の第2面に位置する第2の導体回路群と、互いにプリント配線板の異なった面に位置する第3の導体回路群に分類し、各導体回路群毎に各導体回路の2つの検査ポイントのそれぞれが位置する面と同一面側に配置した2つのプローブに検査用プローブを、残りの2つのプローブに保持用プローブをそれぞれ装着した後に検査する請求項10記載のプリント配線板の電気検査方法。 A total of four probes, each having a tip that can be replaced with an inspection probe and a holding probe, are arranged on both sides of the printed wiring board. A first conductor circuit group located on one surface, a second conductor circuit group both located on the second surface of the printed wiring board, and a third conductor circuit group located on different surfaces of the printed wiring board. For each conductor circuit group, inspection probes are placed on the two probes arranged on the same side as the surface where each of the two inspection points of each conductor circuit is located, and holding probes are placed on the remaining two probes. The electrical inspection method for a printed wiring board according to claim 10, wherein the electrical inspection is performed after each mounting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006218062A JP4835317B2 (en) | 2006-08-10 | 2006-08-10 | Electrical inspection method for printed wiring boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006218062A JP4835317B2 (en) | 2006-08-10 | 2006-08-10 | Electrical inspection method for printed wiring boards |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008039725A JP2008039725A (en) | 2008-02-21 |
JP2008039725A5 true JP2008039725A5 (en) | 2009-09-17 |
JP4835317B2 JP4835317B2 (en) | 2011-12-14 |
Family
ID=39174886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006218062A Expired - Fee Related JP4835317B2 (en) | 2006-08-10 | 2006-08-10 | Electrical inspection method for printed wiring boards |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4835317B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5314328B2 (en) * | 2008-06-06 | 2013-10-16 | 日置電機株式会社 | Arm offset acquisition method |
JP5236506B2 (en) * | 2009-01-06 | 2013-07-17 | 日置電機株式会社 | Board inspection equipment |
JP5310195B2 (en) * | 2009-03-31 | 2013-10-09 | Tdk株式会社 | Substrate holder, electronic component inspection apparatus, and electronic component inspection method |
JP5797240B2 (en) * | 2013-08-12 | 2015-10-21 | 太洋工業株式会社 | Printed circuit board inspection equipment |
JP6782001B2 (en) * | 2016-05-23 | 2020-11-11 | ヤマハファインテック株式会社 | Electrical inspection equipment |
KR101819033B1 (en) | 2016-08-05 | 2018-01-17 | (주)티이에스 | method for manufacturing battery protection apparatus |
KR102657408B1 (en) | 2016-12-22 | 2024-04-16 | 미쓰이금속광업주식회사 | Manufacturing method of multilayer wiring board |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06102301A (en) * | 1992-02-28 | 1994-04-15 | I D Syst:Kk | Inspection device for printed circuit board |
JP2899492B2 (en) * | 1992-12-18 | 1999-06-02 | 株式会社テスコン | Printed circuit board inspection method and inspection equipment |
JPH0735808A (en) * | 1993-07-21 | 1995-02-07 | Matsushita Electric Ind Co Ltd | Moving contact probe type double side inspecting device for circuit board |
JPH112653A (en) * | 1997-06-13 | 1999-01-06 | Toppan Printing Co Ltd | Inspection method for printed wiring plate |
JP2004191166A (en) * | 2002-12-11 | 2004-07-08 | Toppan Printing Co Ltd | Conveyance mechanism for sheet or tape-like substrate, and inspection device using the same |
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2006
- 2006-08-10 JP JP2006218062A patent/JP4835317B2/en not_active Expired - Fee Related
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