KR20230125518A - A bare board testing apparatus and method - Google Patents

Abstract

A printed circuit board electrical inspection apparatus according to an embodiment of the present invention includes a stacker module loaded with a printed circuit board; a first pickup module that picks up the printed circuit board loaded on the stacker module; a shuttle module configured to receive the printed circuit board from the first pick-up module and to be movable in a state in which the printed circuit board is fixedly seated; an inspection module performing an electrical inspection of the printed circuit board seated on the shuttle module; and a second pick-up module that picks up the printed circuit board on which the electrical test is completed by the test module and transfers it to the stacker module.

Description

Printed circuit board electrical inspection device and electrical inspection method {A BARE BOARD TESTING APPARATUS AND METHOD}

The present invention relates to an electrical inspection device and method for electrical inspection of a printed circuit board, and more specifically, to an electrical inspection device and method capable of quickly and accurately performing an electrical inspection of a printed circuit board using one shuttle. will be.

A printed circuit board (PCB) is configured to attach various semiconductors and passive elements, and is configured to connect each part to each other. As a core part that forms the basis of all electronic products ranging from industrial to industrial, it plays an important role in influencing the technology and production activities of electronic products.

A plurality of pads for mounting electronic components are formed on the printed circuit board, and an electrical test is performed to check electrical connections between the respective pads before shipment of the printed circuit board.

Recently, as the degree of integration of electronic components increases and the demand for thin-type printed circuit boards increases, the demand for highly reliable electrical inspection devices capable of performing electrical inspection of micro-pattern and thin-type printed circuit boards is required. There is a situation.

In particular, a device that performs electrical inspection of a printed circuit board by operating two shuttles at the same time has been proposed to improve the inspection speed as well as high reliability. Therefore, it is necessary to propose an electrical inspection device and method to improve this.

On the other hand, the following prior art documents disclose an electric inspection device for a printed circuit board, an inspection jig, and a method for confirming the fixation of the inspection jig, which can reduce the size and cost of the device and at the same time eliminates the need for adjustment work, and the technical summary of the present invention is not disclosed.

Republic of Korea Patent Publication No. 10-2007-0045099

The purpose of the printed circuit board electrical inspection apparatus and electrical inspection method according to an embodiment of the present invention is to solve the problems described above.

It is to provide an electrical inspection device and an electrical inspection method capable of performing an accurate and rapid electrical inspection of a printed circuit board even using one shuttle.

The problems of the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

A printed circuit board electrical inspection apparatus according to an embodiment of the present invention includes a stacker module loaded with a printed circuit board; a first pickup module that picks up the printed circuit board loaded on the stacker module; a shuttle module configured to receive the printed circuit board from the first pick-up module and to be movable in a state in which the printed circuit board is fixedly seated; an inspection module performing an electrical inspection of the printed circuit board seated on the shuttle module; and a second pick-up module that picks up the printed circuit board on which the electrical test is completed by the test module and transfers it to the stacker module.

The stacker module includes a load stacker loaded with a printed circuit board before electrical inspection; A pass stacker for loading printed circuit boards that have been judged to be good products from the inspection module after electrical inspection; A re-inspection stacker for loading the printed circuit board determined to require re-inspection from the inspection module after the electrical inspection; and a pail stacker for stacking printed circuit boards that have been judged to be defective by the inspection module after the electrical inspection.

The first pickup module transfers the printed circuit board loaded on the load stacker to the shuttle module, and the second pickup module transfers the inspected printed circuit board to at least one of the pass stacker, the review stacker, and the pail stacker. It is desirable to do

The laser marking module further includes a laser marking module that performs laser marking before transferring the printed circuit board that has been determined to be defective received from the second pick-up module to the pail stacker, wherein the laser marking module includes the printed circuit board that has been determined to be defective. A laser marking table for seating the substrate; a laser marking unit for marking defective marks on the printed circuit board; and a dust collection unit that removes dust generated during the marking process of the laser marking unit, and the second pick-up unit transfers the printed circuit board marked with the defective mark to the pail stacker.

The shuttle module may include a seating unit for seating the printed circuit board; a clamp unit for fixing the printed circuit board seated on the seating unit; and a transfer rail for guiding movement of the clamp unit to the inspection module.

Preferably, the shuttle module further includes a surface plate disposed under the transfer rail to support the transfer rail.

The clamp unit may include a first clamp unit clamping one side of the printed circuit board; and a second clamp part disposed to face the first clamp part and clamping the other side of the printed circuit board, wherein at least one of the first clamp part and the second clamp part is formed to be movable in the X-axis direction. it is desirable to be

The first clamp unit includes a first clamp, a second clamp, and a third clamp sequentially spaced apart from each other at predetermined intervals, and the second clamp unit corresponds to the first clamp, the second clamp, and the third clamp, respectively. A fourth clamp, a fifth clamp, and a sixth clamp are included, and the first to sixth clamps are preferably driven independently of each other.

The second clamp and the fifth clamp are fixedly installed in the first clamp part and the second clamp part, respectively, and the first clamp and the third clamp are configured to be movable by a preset distance within the first clamp part, , The fourth clamp and the sixth clamp are preferably configured to be movable by a predetermined distance within the second clamp unit.

The second clamp and the fifth clamp are fixedly installed in the first clamp part and the second clamp part, respectively, and the first clamp and the third clamp are configured to be rotatable by a preset angle within the first clamp part, , It is preferable that the fourth clamp and the sixth clamp are configured to be rotatable by a preset distance within the second clamp unit.

a first camera that checks a fiducial mark of the printed circuit board and detects a position of a pad in the printed circuit board; and a second camera for checking whether the position of the pad identified by the first camera and the position of the jig press of the inspection module match.

A printed circuit board electrical inspection method according to an embodiment of the present invention includes the steps of a first pick-up module picking up a printed circuit board loaded on a load stacker and transferring it to a shuttle module; fixing and flattening the printed circuit board by the shuttle module; Conducting, by an inspection module, an electrical inspection of the printed circuit board received from the shuttle module; and transferring, by a second pick-up module, the printed circuit board on which the electric test is completed to at least one of a pass stacker, a retest stacker, and a fail stacker based on the test result of the test module.

The shuttle module includes a seating unit for seating the printed circuit board; a clamp unit for fixing the printed circuit board seated on the seating unit; and a transfer rail for guiding movement of the seating unit to the inspection module. The step of fixing and flattening the printed circuit board may include: seating the printed circuit board delivered by the first pick-up module to the seating unit; moving the printed circuit board upward by the seating unit so that the horizontal position of the printed circuit board corresponds to the clamp unit; clamping and flattening the printed circuit board by the clamp unit; identifying a position of a pad in the printed circuit board by checking a fiducial mark of the printed circuit board by a first camera; and moving the clamp unit to the inspection module through the transfer rail.

The clamp unit includes a first clamp part clamping one side of the printed circuit board; and a second clamp part disposed to face the first clamp part and clamping the other side of the printed circuit board. The first clamp unit includes a first clamp, a second clamp, and a third clamp disposed sequentially spaced apart at predetermined intervals, and the second clamp unit corresponds to the first clamp, the second clamp, and the third clamp, respectively. A fourth clamp, a fifth clamp, and a sixth clamp are included, and the first to sixth clamps preferably operate independently of each other.

In the step of clamping and flattening the printed circuit board by the clamp unit, at least one of the first clamp part and the second clamp part moves in the X-axis direction and contacts one side and the other side of the printed circuit board, respectively. ; clamping one side and the other side of the printed circuit board by the second clamp and the fifth clamp; clamping one side of the printed circuit board with the first clamp and the third clamp, and clamping the other side of the printed circuit board with the fourth clamp and the sixth clamp; It is preferable to include; moving at least one of the first clamp part and the second clamp part to move away from each other along the X-axis direction to apply tension in the X-axis direction of the printed circuit board.

The second clamp and the fifth clamp are fixedly installed in the first clamp part and the second clamp part, respectively, and the first clamp and the third clamp move within the first clamp part by a preset distance or set in advance. It is configured to be rotatable by an angle, and the fourth clamp and the sixth clamp are preferably configured to be movable by a preset distance or rotatable by a preset angle within the second clamp unit.

applying tension in the X-axis direction of the printed circuit board; Thereafter, applying tension in the X-axis direction to the edge region of the printed circuit board by moving the first clamp, the third clamp, and the fourth clamp and the sixth clamp in opposite directions. It is preferable to include

applying tension in an X-axis direction to an edge area of the printed circuit board; Thereafter, applying tension in the Y-axis direction to the edge region of the printed circuit board by moving the first clamp, the fourth clamp, and the third clamp and the sixth clamp in opposite directions. It is preferable to include

When it is determined that the printed circuit board is defective as a result of inspection by the inspection module, the second pick-up module transfers the printed circuit board on which the electrical inspection is completed to at least one of a pass stacker, a recheck stacker, and a pail stacker; picking up, by the second pickup module, the printed circuit board on which the electrical test is completed; seating the printed circuit board on a laser marking table by the second pickup module; Marking a defective mark on the printed circuit board by a laser marking unit; Preferably, the second pick-up module picks up the printed circuit board marked with the defect mark and transfers it to the pail stacker.

In the printed circuit board electrical inspection apparatus and electrical inspection method according to an embodiment of the present invention, since a plurality of shuttles are not driven simultaneously, inspection accuracy is reduced due to vibration that may occur in the process of performing an electrical inspection by one of the shuttles. can be expected to prevent

In addition, in the case of the conventional two-shuttle method, when installing the inspection jig, the two shuttles must be set in the same alignment, which requires a long-term setting by a skilled technician. However, the printed circuit according to an embodiment of the present invention Since the board electrical inspection device and electrical inspection method operate only one shuttle, even if you are not a highly skilled technician, you can easily set the inspection jig, so the effect of solving the problems of the above-described two-shuttle method can be expected.

In addition, even if a high-power motor is applied for rapid electrical inspection with only one shuttle, vibration can be minimized, thereby improving the reliability of the electrical inspection of the printed circuit board and increasing the inspection efficiency.

Furthermore, by providing a flattening process of the printed circuit board in various ways, an effect of performing an accurate electrical inspection of the thin printed circuit board can be expected.

Effects of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

1 is a conceptual diagram briefly illustrating a printed circuit board electrical inspection apparatus according to an embodiment of the present invention.
Figure 2 is a perspective view of the shuttle module of the configuration of the printed circuit board electrical inspection device according to an embodiment of the present invention.
3 is a plan view of the clamp unit in FIG. 2;
4 to 7 are plan views for explaining the planarization process of the printed circuit board performed by the clamp unit.
8 is a flowchart illustrating a printed circuit board electrical inspection method in time series according to an embodiment of the present invention.
FIG. 9 is a flowchart illustrating steps of fixing and flattening the printed circuit board in FIG. 8 in a time-sequential manner.
FIG. 10 is a flowchart illustrating steps of clamping and flattening the printed circuit board in FIG. 9 chronologically.
FIG. 11 time-sequentially illustrates steps in which the second pick-up module transfers the printed circuit board for which electrical inspection has been completed to at least one of the pail stackers when it is determined that the printed circuit board is defective as a result of inspection by the inspection module in FIG. 10; It is a flowchart.

With reference to the accompanying drawings, a preferred embodiment according to the present invention will be described in detail, but the same or similar components are assigned the same reference numerals regardless of reference numerals, and redundant description thereof will be omitted.

In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description will be omitted. In addition, it should be noted that the accompanying drawings are only for easily understanding the spirit of the present invention, and should not be construed as limiting the spirit of the present invention by the accompanying drawings.

Hereinafter, a printed circuit board electrical inspection device and electrical inspection method according to an embodiment of the present invention will be described with reference to FIGS. 1 to 7.

A printed circuit board electrical inspection apparatus according to an embodiment of the present invention is for inspecting the connection state between pads formed on a printed circuit board, and as shown in FIG. 1, the stacker module 100, the first pickup module ( 210), the shuttle module 300, the inspection module 400, the second pickup module 220 and the laser marking module 500.

The stacker module 100 has a configuration for loading the printed circuit board 10 before electrical inspection and the printed circuit board 10 after electrical inspection, and can be divided into a plurality of stacker units as shown in FIG. 1, Specifically, the stacker module 100 may be divided into a load stacker 110, a pass stacker 120, a review stacker 130, and a fail stacker 140 and the like.

The load stacker 110 is configured to load the printed circuit board 10 before the electrical inspection, and the pass stacker 120 is configured to load the printed circuit board 10 that has received a good quality judgment from the inspection module 400 after the electrical inspection. is a composition

The re-inspection stacker 130 is configured to load the printed circuit board 10 determined to require re-inspection from the inspection module 400 after the electrical inspection, and the fail stacker 140 is configured to load the printed circuit board 10 determined to be defective from the inspection module 400. It is a configuration for loading the printed circuit board (10).

The first pickup module 210 is a component that performs a function of picking up the printed circuit board 10 loaded on the load stacker 110 among the stacker modules 100 and delivering it to the shuttle module 300 .

The first pickup module 210 can pick up the printed circuit board 10 by vacuum adsorbing the upper surface of the printed circuit board 10 and transfer the picked up printed circuit board 10 to the shuttle module 300. It is preferably configured to be movable in three directions of the X-axis, Y-axis, and Z-axis so as to be.

The shuttle module 300 receives the printed circuit board 10 from the first pickup module 210 and is formed to be movable in a state in which the printed circuit board 10 is fixedly seated, as shown in FIG. Likewise, it is configured to include a seating unit 310, a clamp unit 320, a transfer rail 330, and a surface plate 340.

The seating unit 310 is a configuration in which the printed circuit board 10 delivered by the first pickup module 210 is seated, and is configured to be movable in the Z-axis direction, that is, up and down, and the clamp unit 320 is a seating unit It performs a function of fixing the printed circuit board 10 seated on the 310, and is composed of a pair of clamp parts 350 and 360 to clamp one side and the other side of the printed circuit board 10. .

That is, the printed circuit board 10 seated on the seating unit 310 moves upward until it reaches the same height as the pair of clamp parts 350 and 360 by the lifting of the seating unit 310 .

In particular, the shuttle module 300 may include a sensor capable of detecting the printed circuit board 10 in order to limit the movement of the printed circuit board 10 in the upper direction, and as an example shown in FIG. 2, a pair The laser sensor may be installed at a position corresponding to a height at which the clamp portions 350 and 360 of the printed circuit board 10 can be easily clamped.

At this time, when the printed circuit board 10 moving in the upward direction of the seating unit 310 touches the laser of the laser sensor, the driving of the seating unit 310 is stopped.

In addition, the clamp unit 320 is configured to include a pair of clamp parts 350 and 360 as described above, specifically, as shown in FIG. 3, the first clamp part 350 and the second clamp part 360 ) is configured to include.

The first clamp unit 350 is configured to clamp one side of the printed circuit board 10, and the second clamp unit 360 is arranged to face the first clamp unit 350 to clamp the other side of the printed circuit board. At least one of the first clamp unit 350 and the second clamp unit 360 is formed to be movable along the X-axis direction, that is, in the width direction of the printed circuit board 10 .

In particular, each of the first clamp unit 350 and the second clamp unit 360 includes three clamps. The first clamp unit 350 includes first clamps 351 sequentially spaced apart at preset intervals, It includes a second clamp 352 and a third clamp 353, and the second clamp part 360 corresponds to the first clamp 351, the second clamp 352, and the third clamp 353, respectively. Four clamps 361, a fifth clamp 362 and a sixth clamp 363 are provided.

Here, the second clamp 352 corresponds to the center clamp of the first clamp part 350, and the fifth clamp 362 corresponds to the center clamp of the second clamp part 360 and is the center clamp of the second clamp. 352 and the fifth clamp 362 are fixedly installed to the first clamp part 350 and the second clamp part 360, respectively.

In addition, the first clamp 351 and the third clamp 353 correspond to the side clamps of the first clamp part 350, and move within the first clamp part 350 by a preset distance or rotate by a preset angle. configured to be able to

Similarly, the fourth clamp 361 and the sixth clamp 363 correspond to the side clamps of the second clamp part 360, and move within the second clamp part 360 by a preset distance or rotate by a preset angle. configured to be able to

Due to the configuration of the clamp unit 320, even a thin printed circuit board 10 can be efficiently and precisely flattened, and in FIGS. Details about the planarization process are shown, and specific details thereof will be described in the contents of the printed circuit board electrical inspection method to be described later.

The transfer rail 330 performs a function of guiding the movement of the clamp unit 320 to the inspection module 400, and a driving motor that generates power for the clamp unit 320 to move along the transfer rail 330. can be provided

Specifically, the clamp unit 320 can move in a linear direction along the transfer rail 330 by using a ball-screw method, and it is preferable to apply a high-power motor for fast electrical inspection.

However, when using a high-power motor, fast movement of the clamp unit 320 can be secured, but vibration may occur in the printed circuit board electrical inspection device due to the movement of the clamp unit 320, and this vibration causes the inspection module 400 to There is a possibility that an error may occur in the process of performing an electrical test of the printed circuit board 10 .

In order to prevent the above-mentioned problem, the shuttle module 300 may be configured to support the transfer rail 330 by disposing a heavy surface plate 340 under the transfer rail 330 .

Even if the center of gravity of the entire printed circuit board electrical inspection device is lowered through such a heavy surface plate 340 and the clamp unit 320 moves quickly along the transfer rail 330 using a high-power motor, the clamp unit 320 Since the vibration generated during the moving process is buffered by the surface plate 340, vibration generated in the entire printed circuit board electrical inspection device can be reduced.

As a result, as the surface plate 340 is applied to the shuttle module 300, vibration due to high speed can be reduced, and furthermore, the servo axis, specifically, the transfer rail 330 can be implemented with high precision.

The inspection module 400 is a component that performs an electrical inspection of the printed circuit board 10 seated on the shuttle module 300, and a probe unit in which a plurality of probes are arranged and an inspection jig corresponding to the inserted printed circuit board 10. It is made of, and the electrical connection of the pattern formed inside the printed circuit board 10 is inspected.

Meanwhile, the printed circuit board electrical inspection device may further include a first camera and a second camera so that the probe or inspection jig can be accurately aligned at a position corresponding to the pad of the printed circuit board 10 .

The first camera checks the fiducial mark of the printed circuit board 10 before inspecting the printed circuit board 10 and locates the pad formed in the printed circuit board 10 based on the fiducial mark. perform the function of

The second camera performs a function of checking whether the position of the pad confirmed by the first camera and the position of the inspection jig of the inspection module 400 match.

The second pickup module 220 picks up the printed circuit board 10 that has been inspected by the inspection module 400 and transfers it to the stacker module 100 .

Specifically, the second pick-up module 220 transfers the printed circuit board 10 judged to be a good product in the inspection module 400 to the pass stacker 120, and re-inspects the printed circuit board 10 determined to require re-inspection. It is delivered to the dragon stacker 130.

Meanwhile, in the case of the printed circuit board 10 judged to be defective by the inspection module 400, the second pickup module 220 directly transfers the printed circuit board 10 to the stacker module 100, that is, the pail stacker 140. It is not transmitted, but first transmitted to the laser marking module 500.

The laser marking module 500 is a component that performs laser marking before transferring the printed circuit board 10 that has been determined to be defective received from the second pick-up module 220 to the pail stacker 120 .

This laser marking module 500 is specifically a laser marking table 510 for seating the printed circuit board 10 that has been judged to be defective, a laser marking unit for marking defective marks on the printed circuit board 10 using a laser, and It is configured to include a dust absorption unit 520 that removes dust generated during the marking process of the laser marking unit.

The printed circuit board 10 marked with the defective mark by the laser marking module 500 is transferred to the pail stacker 140 by the second pick-up unit 220 .

Hereinafter, a printed circuit board electrical inspection method according to an embodiment of the present invention will be described with reference to FIGS. In consideration of the electrical inspection method using the printed circuit board electrical inspection apparatus according to the embodiment, detailed descriptions of the contents overlapping with those described above will be omitted.

In the printed circuit board electrical inspection method according to an embodiment of the present invention, as shown in FIG. 8, the first pickup module 210 picks up the printed circuit board 10 loaded on the load stacker (!10) Transferring to the shuttle module 300 (S100), the shuttle module 300 fixing and flattening the printed circuit board 10 (S200), printing the inspection module 400 received from the shuttle module 300 Conducting an electrical test of the circuit board 10 (S300), based on the test result of the test module 400, the second pickup module 220 transfers the electrically tested printed circuit board 10 to the pass stacker 120. ), the step of delivering to at least one of the recheck stacker 130 and the fail stacker 140 (S400) is sequentially performed.

In particular, among the above steps, the step of fixing and flattening the printed circuit board 10 by the shuttle module 300 (S200) can be subdivided into five steps as shown in FIG.

First, the step of seating the printed circuit board delivered by the first pick-up module 210 on the seating unit 310 of the shuttle module 300 (S210) and the horizontal position of the printed circuit board 10 is the shuttle module 300 The step (S220) of moving the printed circuit board 10 in an upward direction by the seating unit 310 so as to correspond to the clamp unit 320 of the is sequentially performed.

Thereafter, the clamp unit 320 clamps and flattens the printed circuit board 10 (S230), and the first camera checks the fiducial mark of the printed circuit board 10 to determine the printed circuit board 10. The step of determining the position of the pad inside (S240) proceeds sequentially, and finally, the step of moving the clamp unit 320 to the inspection module 400 through the transfer rail 330 (S250) is performed.

Among the above steps, in particular, the step (S230) of clamping and flattening the printed circuit board 10 by the clamp unit 320 may be subdivided into a plurality of steps as shown in FIG. 10 .

First, at least one of the first clamp unit 350 and the second clamp unit 360 formed to face each other in the clamp unit 320 moves along the X-axis direction, that is, in the width direction of the printed circuit board 10, so as to move the printed circuit board. A step (S231) of contacting one side and the other side of the substrate 10 is performed.

Then, the second clamp 352, which is the center clamp of the first clamp unit 350, and the fifth clamp 362, which is the center clamp of the second clamp unit 360, clamp one side and the other side of the printed circuit board 10. In step S232, the first clamp 351 and the third clamp 353, which are side clamps of the first clamp unit 350, clamp one side of the printed circuit board 10, and the second clamp unit 360 The step (S233) of clamping the other side of the printed circuit board 10 by the fourth clamp 361 and the sixth clamp 363, which are side clamps, is sequentially performed.

Next, a step (S234) of applying tension in the X-axis direction to the printed circuit board 10 is performed. Specifically, as shown in FIG. 4, in a state in which all clamps are clamping the printed circuit board 10 At least one of the first clamp unit 350 and the second clamp unit 360 moves away from each other along the X-axis direction, that is, along the width direction of the printed circuit board 10, thereby moving in the X-axis direction of the printed circuit board 10. will apply tension to

Thereafter, a step of applying tension in the X-axis direction to the edge region of the printed circuit board 10 (S235) is performed. Specifically, as shown in FIG. 5, the side of the first clamp unit 350 The first clamp 351 and the third clamp 353, which are clamps, and the fourth clamp 361 and the sixth clamp 363, which are side clamps of the second clamp unit 360, are moved in opposite directions along the X axis. By moving, tension in the X-axis direction is applied to the edge area of the printed circuit board.

On the other hand, considering that a more precise flattening process is required in the case of the thin type printed circuit board 10, after the step of applying tension in the X-axis direction to the edge area of the printed circuit board 10 (S235) A step of applying tension in the Y-axis direction, that is, the longitudinal direction of the printed circuit board 10 to the edge region of the printed circuit board 10 (S236) may be performed.

Specifically, as shown in FIG. 6, the printed circuit board is moved by moving the first clamp 351 and the fourth clamp 361 and the third clamp 353 and the sixth clamp 363 in opposite directions. Tension in the Y-axis direction is applied to the edge region of (10).

In the case of the technical feature of applying tension to the edge region of the printed circuit board 10 described above, the side clamp is set in the X-axis direction or the Y-axis within the first clamp unit 350 or the second clamp unit 360 by a preset distance. Although it has been described on the premise that it is formed to be movable in the direction, the edge of the printed circuit board 10 is formed so that the side clamp is rotatable at a preset angle within the first clamp part 350 or the second clamp part 360. It is also possible to apply tension to the region.

In this case, as shown in FIG. 7 , the first clamp 351 and the sixth clamp 363 are rotated in one direction at a preset angle, while the third clamp 353 and the fourth clamp 361 are rotated in advance. When rotating in the other direction at a set angle, it is possible to simultaneously apply tension to the edge region of the printed circuit board 10 in the X-axis direction and the Y-axis direction (theta tension).

On the other hand, when the printed circuit board 10 is determined to be defective as a result of the inspection by the inspection module 400, the step of transferring the electrically inspected printed circuit board to the stacker module 100 (S400) is shown in FIG. 11 in detail. As shown, it can be subdivided into four detailed steps.

First, the second pick-up module 220 picks up the printed circuit board 10 for which the electrical test has been completed (S410), and the second pick-up module 220 places the printed circuit board 10 on the laser marking table 510. The step of doing (S420) is performed sequentially.

Thereafter, the laser marking unit marks the defective mark on the printed circuit board 10 (S430), and the second pickup module 220 picks up the printed circuit board 10 marked with the defective mark to the pail stacker 140. The delivery step (S440) is performed.

In the above, the present invention has been described in detail using preferred embodiments, but the scope of the present invention is not limited to specific embodiments, and should be interpreted according to the appended claims. In addition, those skilled in the art should understand that many modifications and variations are possible without departing from the scope of the present invention.

10: printed circuit board
100: stacker module
210: first pickup module
220: second pickup module
300: shuttle module
310: seating unit
320: clamp unit
330: transfer rail
340: face plate
350: first clamp part
360: second clamp part
400: inspection module
500: laser marking module
510: laser marking table
520: suction unit

Claims (13)

a stacker module configured to load printed circuit boards and including at least one of a load stacker, a pass stacker, a review stacker, and a fail stacker;
a first pickup module that picks up the printed circuit board loaded on the stacker module;
a shuttle module configured to receive the printed circuit board from the first pick-up module and to be movable in a state in which the printed circuit board is fixedly seated;
an inspection module performing an electrical inspection of the printed circuit board seated on the shuttle module; and
a second pick-up module that picks up the printed circuit board on which the electrical test is completed by the test module and transfers it to the stacker module;
Printed circuit board electrical inspection device comprising a.
The method of claim 1,
The first pickup module transfers the printed circuit board loaded on the load stacker to the shuttle module,
The second pickup module transfers the tested printed circuit board to at least one of the pass stacker, the re-inspection stacker, and the fail stacker.
The method of claim 2,
A laser marking module that performs laser marking before transferring the printed circuit board that has been determined to be defective received from the second pick-up module to the fail stacker;
The laser marking module may include: a laser marking table for seating the printed circuit board having received the defective determination; a laser marking unit for marking defective marks on the printed circuit board; And a dust absorption unit for removing dust generated in the marking process of the laser marking unit; includes,
The second pickup unit transfers the printed circuit board marked with the defect mark to the pail stacker.
The method according to claim 1, wherein the shuttle module,
a seating unit for seating the printed circuit board;
a clamp unit for fixing the printed circuit board seated on the seating unit; and
a transfer rail for guiding movement of the clamp unit to the inspection module;
Printed circuit board electrical inspection device comprising a.
The method according to claim 4, wherein the shuttle module,
a surface plate disposed under the transfer rail to support the transfer rail;
Printed circuit board electrical inspection device further comprising a.
The method according to claim 4, wherein the clamp unit,
a first clamp unit clamping one side of the printed circuit board;
a second clamp part disposed to face the first clamp part and clamping the other side of the printed circuit board;
including,
At least one of the first clamp part and the second clamp part is formed to be movable in the X-axis direction.
The method of claim 6,
The first clamp unit includes a first clamp, a second clamp, and a third clamp sequentially spaced apart at predetermined intervals,
The second clamp unit includes a fourth clamp, a fifth clamp, and a sixth clamp respectively corresponding to the first clamp, the second clamp, and the third clamp,
The first to sixth clamps are printed circuit board electrical inspection apparatus, characterized in that driven independently of each other.
The method of claim 7,
The second clamp and the fifth clamp are fixedly installed to the first clamp part and the second clamp part, respectively;
The first clamp and the third clamp are configured to be movable by a preset distance within the first clamp unit,
The fourth clamp and the sixth clamp are configured to be movable by a preset distance within the second clamp unit.
A first pick-up module picking up the printed circuit board loaded on the load stacker and transferring it to the shuttle module;
fixing and flattening the printed circuit board by the shuttle module;
Conducting, by an inspection module, an electrical inspection of the printed circuit board received from the shuttle module; and
transferring, by a second pick-up module, the printed circuit board on which the electric test has been completed to at least one of a pass stacker, a re-inspection stacker, and a fail stacker based on the test result of the test module;
Printed circuit board electrical inspection method comprising a.
The method of claim 9,
The shuttle module includes a seating unit for seating the printed circuit board; a clamp unit for fixing the printed circuit board seated on the seating unit; and a transfer rail for guiding movement of the seating unit to the inspection module. include,
The step of fixing and flattening the printed circuit board,
seating the printed circuit board delivered by the first pickup module to the seating unit;
moving the printed circuit board upward by the seating unit so that the horizontal position of the printed circuit board corresponds to the clamp unit;
clamping and flattening the printed circuit board by the clamp unit;
identifying a position of a pad in the printed circuit board by checking a fiducial mark of the printed circuit board by a first camera; and
moving the clamp unit to the inspection module through the transfer rail;
Printed circuit board electrical inspection method comprising a.
The method of claim 10,
The clamp unit includes a first clamp part clamping one side of the printed circuit board; and a second clamp part disposed to face the first clamp part and clamping the other side of the printed circuit board,
The first clamp unit includes a first clamp, a second clamp, and a third clamp sequentially spaced apart from each other at predetermined intervals, and the second clamp unit corresponds to the first clamp, the second clamp, and the third clamp, respectively. It includes a fourth clamp, a fifth clamp and a sixth clamp, wherein the first to sixth clamps are driven independently of each other,
The step of clamping and flattening the printed circuit board by the clamp unit,
moving at least one of the first clamp part and the second clamp part in the X-axis direction to contact one side and the other side of the printed circuit board, respectively;
clamping one side and the other side of the printed circuit board by the second clamp and the fifth clamp;
clamping one side of the printed circuit board with the first clamp and the third clamp, and clamping the other side of the printed circuit board with the fourth clamp and the sixth clamp;
moving at least one of the first clamp part and the second clamp part away from each other along the X-axis direction to apply tension to the printed circuit board in the X-axis direction;
Printed circuit board electrical inspection method comprising a.
The method of claim 11,
The second clamp and the fifth clamp are fixedly installed in the first clamp part and the second clamp part, respectively, and the first clamp and the third clamp move within the first clamp part by a preset distance or set in advance. It is configured to be rotatable by an angle, and the fourth clamp and the sixth clamp are configured to move by a preset distance or rotate by a preset angle within the second clamp unit,
applying tension in the X-axis direction of the printed circuit board; Afterwards,
applying tension in an X-axis direction to an edge region of the printed circuit board by moving the first and third clamps, and the fourth and sixth clamps in opposite directions;
Printed circuit board electrical inspection method characterized in that it further comprises.
The method according to claim 12, Applying a tension in the X-axis direction to the edge area of the printed circuit board; after that
applying tension in a Y-axis direction to an edge region of the printed circuit board by moving the first clamp, the fourth clamp, and the third clamp and the sixth clamp in opposite directions;
Printed circuit board electrical inspection method characterized in that it further comprises.

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