WO2015008564A1 - Procédé de fabrication en continu de feuille de métal formée par dépôt électrolytique et dispositif de fabrication en continu de feuille de métal formée par dépôt électrolytique - Google Patents

Procédé de fabrication en continu de feuille de métal formée par dépôt électrolytique et dispositif de fabrication en continu de feuille de métal formée par dépôt électrolytique Download PDF

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WO2015008564A1
WO2015008564A1 PCT/JP2014/065717 JP2014065717W WO2015008564A1 WO 2015008564 A1 WO2015008564 A1 WO 2015008564A1 JP 2014065717 W JP2014065717 W JP 2014065717W WO 2015008564 A1 WO2015008564 A1 WO 2015008564A1
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Prior art keywords
metal foil
anode
electrolytic
diaphragm
cathode drum
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PCT/JP2014/065717
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English (en)
Japanese (ja)
Inventor
卓生 伊藤
昭博 加藤
篤実 竹内
克己 濱口
幸徳 井口
岸　剛陸
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ペルメレック電極株式会社
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Publication of WO2015008564A1 publication Critical patent/WO2015008564A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Definitions

  • the present invention relates to an electrolytic metal foil continuous production method and an electrolytic metal foil continuous production apparatus suitable for continuous production of various electrolytic metal foils, particularly electrolytic copper foils.
  • the lead alloy electrode has acid resistance against a high concentration acidic metal salt solution such as a copper sulfate solution. Moreover, since the lead alloy electrode has a low melting point of lead, which is a constituent component, it is easy to form a facing surface of the facing curved anode along the shape of the drum surface of the cathode, and the electrolytic device There was also an advantage that processing at the installation site was easy. That is, lead alloy electrodes have been widely used because they exhibit good workability and are excellent in workability.
  • the lead alloy electrode is greatly consumed due to electrolysis, the shape of the electrode surface is likely to change, the maintenance cost also increases, and the lead component that goes out of the consumed electrode into the electrolyte is metal lead, lead ion, It changed into components, such as lead acid and lead oxide, and may mix in electrolytic copper foil, and caused various product defects.
  • an insoluble metal electrode in which a surface of a valve metal such as titanium is coated with a conductive electrode material containing a platinum group metal or an oxide thereof is used in recent years instead of a lead alloy electrode. It became so.
  • the insoluble metal anode to be used is an insoluble metal anode having a circular arc cross-section surrounding a part of the periphery of the cathode drum, and its shape is complicated, and the anode is used as a conventional lead alloy electrode.
  • the anode is used as a conventional lead alloy electrode.
  • an anode frame or a power supply plate having an arc cross section that faces the cathode drum and surrounds a part of the periphery thereof is provided.
  • a thin plate-like insoluble metal anode having an electrode coating formed on at least a part of the electrolysis surface of a plate-like or curved electrode substrate is fixed to the surface of the power supply plate with a detachable attachment means such as a screw.
  • An insoluble electrode structure having an electrode coating formed on the contact surface with a thin plate-like insoluble metal anode has come to be used.
  • Copper foil is used in large quantities as an electronic and electrical material, especially for printed wiring boards.
  • Printed wiring boards have been improved in performance and reliability. Therefore, required characteristics are complicated and diversified.
  • severe quality requirements have been imposed on copper foil, which is one of the constituent materials of this printed wiring board.
  • foil management standards have become stricter, and foil thickness balance standards have become stricter.
  • various additives that affect the copper foil quality are used, the catalyst consumption of the insoluble electrode is increased, and the life is shortened.
  • an electrolytic copper foil in an electrolytic copper foil, a demand for suppressing thickness variation in the same plane is remarkable. That is, in the case of electrolytic copper foil, it is thinner because of the improvement of processing accuracy such as the formation of fine pitch circuits on the printed wiring board manufactured using the electrolytic copper foil, thinning of the multilayer printed wiring board, downsizing, etc. In addition, there is a demand for an electrolytic copper foil with little thickness variation. Therefore, the electrolytic metal foil continuous manufacturing apparatus capable of suppressing the thickness variation in the same plane of the electrolytic metal foil including the electrolytic copper foil, and the thickness obtained by using the electrolytic metal foil continuous manufacturing apparatus An electrolytic metal foil with little variation has been desired.
  • the electrolytic chamber is a chamber formed between the cathode drum and the insoluble metal electrode.
  • the lead-containing electrolyte solution is deposited as lead oxide on the insoluble metal electrode during the production of the foil.
  • the precipitated lead oxide falls off during operation, causing uneven current distribution.
  • the attached lead oxide is converted to lead sulfate, which is a defective conductor when electrolysis is stopped, causing non-uniform current distribution and shortening the life of the insoluble metal electrode. Further, the attached lead is dropped into the electrolytic solution in the state of a lead compound.
  • the lead compound is engulfed in the copper foil, and the insoluble electrode is replaced due to the deterioration of the foil quality and the pinhole.
  • gelatin has been mainly used as an additive, but recently, additives such as thiourea and HEC (hydroxyethyl cellulose) and combinations thereof have been used as additives for copper foil. They accelerate the catalyst consumption of the insoluble electrode and become a factor in shortening the life of the electrode. In addition, oxygen bubbles generated on the insoluble metal electrode adhere to the cathode drum and cause pinholes.
  • Patent Document 3 As a copper plating technology from acid-based copper plating baths such as copper plating for printing rolls, through-hole copper plating for printed wiring boards, and electrolytic copper foil, the anode chamber and cathode chamber are separated by a cation exchange membrane. A method of performing this is disclosed in Patent Document 3.
  • a soluble copper anode is provided together with an insoluble metal anode in an anode chamber, and these anodes are shielded and separated by a cation exchange membrane.
  • an anode slime generated from the copper anode is formed in the anode chamber.
  • Patent Document 3 a plating solution containing an additive is not supplied to the anode chamber that houses the anode, but copper sulfate / sulfuric acid, which is the same component as the plating solution, is supplied.
  • the cation exchange membrane is attached to the wall surface of the cylindrical anode chamber frame, and the cation exchange membrane is provided apart from the anode and directly on the surface of the anode. It is not retained and is not zero-gapped with the insoluble metal anode.
  • Patent Document 3 has the disadvantage that bubbles in the liquid are generated between the anode and the cathode, the liquid resistance is increased, and the voltage and power are increased. Furthermore, patent document 3 is a technique which manufactures an electrolytic metal in a batch type, and cannot manufacture an electrolytic metal foil continuously.
  • Patent Document 4 relates to copper plating technology from a copper sulfate plating bath such as copper plating of a printing roll, through-hole copper plating of a printed wiring board, and electrolytic copper foil, as in Patent Document 3.
  • a soluble copper anode is not housed in the anode chamber.
  • a rectangular anode chamber frame is provided, in which an insoluble metal anode is housed, and a cation exchange membrane. Is attached to the side wall of the rectangular anode chamber frame in the same manner as in Patent Document 3, and is not zero-gap or phiniteed with an insoluble metal anode, and has the same drawbacks as the technique described in Patent Document 3. Have.
  • Patent Document 5 does not relate to a plating apparatus but relates to an insoluble metal anode for plating.
  • a rectangular anode chamber frame is provided as an anode chamber frame, and an insoluble metal is included therein.
  • the anode is accommodated or an insoluble metal anode is formed on a part of the wall, and the cation exchange membrane is attached to the side wall of the rectangular anode chamber frame as in Patent Document 3, but is insoluble. It is not zero gap or phinite with the metal anode, and has the same defects as the technique described in Patent Document 3.
  • Patent Documents 6 and 7 are inventions related to a method for producing a flexible copper clad laminate, and there is a description of separating an anode and a cathode by a cation exchange membrane, but the structure as a device is completely disclosed.
  • the configuration for separating the anode and the cathode by the cation exchange membrane is not known, and of course, the configuration requirements for making the cation exchange membrane and the insoluble metal anode zero-gap or phinite are described. It has not been.
  • Patent Documents 3 to 7 disclose electrolysis methods in which an anode chamber and a cathode chamber are separated by a cation exchange membrane.
  • the cation exchange membrane is an insoluble metal.
  • the cation exchange membrane and the insoluble metal anode are not spaced apart from the anode, and are considered to be caused by this.
  • they adhere to the insoluble metal electrode. It is not possible to improve the copper foil quality deterioration and yield due to the current non-uniformity due to lead or bubbles generated on the insoluble electrode, and it is impossible to prevent the influence of bubbles and attached lead, and to reduce the cell voltage Can not.
  • the accelerated consumption of the insoluble electrode by the additive could not be prevented.
  • JP 2001-81592 A Japanese Patent Laid-Open No. 5-202498 Japanese Patent No. 3455705 Japanese Patent No. 3903120 Japanese Patent No. 3928013 JP 2006-316328 A Japanese Patent No. 4560726
  • the object of the present invention is to solve these problems of the prior art, to prevent current nonuniformity due to lead adhering to the insoluble metal anode and to prevent copper foil quality deterioration due to bubbles generated on the insoluble metal anode, and to reduce the yield. It is to provide an electrolytic metal foil continuous production method and production apparatus capable of improving, eliminating the influence of bubbles and attached lead, lowering the cell voltage, and preventing acceleration of insoluble metal anode consumption due to additives. .
  • the first solving means of the present invention is a cylindrical cathode drum having a structure rotating partly immersed in an electrolytic solution for producing a metal foil, and facing a part of the periphery of the cathode drum. And an insoluble metal anode having an arc-shaped cross section surrounding a part of the periphery of the metal foil, and supplying the electrolytic solution for generating the metal foil to the surface of the cathode drum, and the metal foil on the cathode drum.
  • the device has a diaphragm in close contact with the arc-shaped surface of the insoluble metal anode, and A cathode chamber is formed between the cathode drum and the diaphragm; It has a structure in which an anode chamber is formed on the back side of the insoluble metal anode, Supplying the electrolytic solution for generating metal foil into the cathode chamber; Electrolysis is performed by supplying an acid solution into the anode chamber, The metal foil electrolytically deposited on the surface of the cathode drum is peeled from the cathode drum, Continuously manufacturing metal foil, It is providing the electrolytic metal foil continuous manufacturing method characterized by the above-mentioned.
  • the metal foil is a copper foil
  • the metal foil generating electrolyte is a copper sulfate solution
  • the acid solution is a pure sulfuric acid solution.
  • the third solution of the present invention provides a method for continuously producing an electrolytic metal foil, wherein the diaphragm is a cation exchange membrane in order to achieve the above object.
  • the fourth solution of the present invention provides a method for continuously producing electrolytic metal foil, wherein the diaphragm is an anion exchange membrane in order to achieve the above object.
  • the sixth solution of the present invention provides a method for continuously producing electrolytic metal foil, wherein the cation exchange membrane is a perfluorosulfonic acid membrane in order to achieve the above object.
  • a cylindrical cathode drum having a structure in which it is rotated by being partially immersed in an electrolytic solution for producing a metal foil, and a part of the periphery of the cathode drum face each other.
  • An insoluble metal anode having a circular arc cross-section surrounding a part of the periphery, an apparatus for supplying the metal foil generating electrolyte to the surface of the cathode drum and electrodepositing the metal foil on the cathode drum;
  • an apparatus for continuously producing electrolytic metal foil for continuously producing metal foil comprising a device for peeling off the attached metal foil from the cathode drum, A diaphragm disposed in close contact with the arcuate surface of the insoluble metal anode; A cathode chamber formed between the cathode drum and the diaphragm; An electrolytic chamber having an anode chamber formed on the back side of the insoluble metal anode; An apparatus for supplying an electrolytic solution for producing a metal foil into the cathode chamber; An apparatus for supplying an acid solution into the anode chamber; An apparatus for peeling the metal foil electrolytically deposited on the surface of the cathode drum from the cathode drum and continuously winding the metal foil; It is providing
  • the arrangement of the diaphragm in close contact with the surface of the arc-shaped cross section of the insoluble metal anode means that the insoluble metal anode and the diaphragm are in close contact with each other (a zero gap state).
  • it is meant to include any of the states (finitized state) arranged with a minute interval.
  • a cylindrical cathode drum having a structure in which a part thereof is rotated by being immersed in an electrolytic solution for producing a metal foil, and an insoluble metal anode having an arc-shaped cross section disposed so as to face a part of the drum
  • the following remarkable effect is obtained by adopting a configuration in which the diaphragm is newly disposed in close contact with the surface of the insoluble metal anode having an arc cross section.
  • an anode chamber and a cathode chamber are formed by being separated by a diaphragm, the insoluble metal anode is disposed in an anode chamber separated from the cathode chamber by the diaphragm, and pure sulfuric acid is placed in the anode chamber.
  • the cathode is placed in a cathode chamber separated from the anode chamber by the diaphragm, and the cathode chamber contains a copper sulfate solution containing lead and additives.
  • an insoluble metal anode is contacted only with an anolyte made of a pure acid solution, and a catholyte made of a copper sulfate solution containing lead and additives.
  • the insoluble metal anode there is no risk of lead or additives precipitating on the insoluble metal anode.
  • lead oxide does not deposit on the insoluble metal anode during the foil production, so the current distribution due to the dropped lead compound is eliminated, and the uniformity of the copper foil is maintained over a long period of time. Therefore, it is not necessary to replace the insoluble metal anode due to the influence of attached lead.
  • the catalyst consumption of the insoluble metal anode is not accelerated by the additive in the electrolytic solution for forming the metal foil such as the copper sulfate solution, the life of the insoluble metal anode can be extended.
  • the lead compound is not involved in the copper foil, and the yield can be improved by improving the foil quality and reducing the pinholes.
  • the diaphragm is directly disposed on the surface of the insoluble metal anode, and the anode and the diaphragm are disposed in close contact with each other, so that bubbles generated in the insoluble metal anode are directly discharged from the anode chamber. Since there is no transfer to the cathode chamber, it is possible to eliminate pinholes due to bubbles in the metal foil that is electrolytically deposited on the cathode surface. Therefore, according to the present invention, it is possible to prevent the copper foil quality from being deteriorated due to bubbles generated on the insoluble metal anode, and to improve the yield.
  • FIG. 1 shows the basic structure of an apparatus for continuously producing an electrolytic copper foil, which is one embodiment of the electrolytic metal foil continuous production apparatus of the present invention.
  • a cylindrical cathode drum 2 made of titanium or nickel is installed in an electrolytic cell 1.
  • the cathode drum 2 has a rotatable structure and is disposed in the electrolytic cell 1 so as to rotate in a state where it is partially immersed (almost lower half) in the electrolytic solution for generating metal foil. Yes.
  • An insoluble metal anode 3 having a circular arc shape is provided so as to surround the lower outer half of the cathode drum 1, and the lower outer half of the cathode drum 2 is in a state in which the insoluble metal anode 3 is disposed facing each other. It has become.
  • a constant gap is provided between the cathode drum 2 and the insoluble metal anode 3 at the facing portion, and the diaphragm 4 is formed on the surface of the insoluble metal anode 3 having a circular arc cross section. Are provided in close contact with each other.
  • a gap is formed between the cathode drum 2 and the diaphragm 4 provided in close contact with the surface of the insoluble metal anode 3, and this gap is used as the cathode chamber 5. .
  • the insoluble metal anode 3 is attached to the power supply plate 6, and the back side of the insoluble metal anode 3 opposite to the one where the diaphragm 4 is provided.
  • a gap with the inner wall of the power supply plate 6 is defined as an anode chamber 7.
  • the intervals in the gap are not different from those of the conventional apparatus for continuously producing electrolytic metal foil having the same configuration, and may have the same design. What is important in the present invention is that the diaphragm 4 is provided in close contact with the surface of the insoluble metal anode 3 to partition the cathode chamber 5 and the anode chamber 7.
  • the cathode chamber 5 is connected to an electrolyte solution supply pipe 8 for producing a metal foil.
  • the anode chamber is separated from the cathode chamber 5 via an insoluble metal anode 3 having a diaphragm 4 in close contact with the surface.
  • 7 is connected to a pure acid solution supply pipe 9.
  • an electrolytic solution for producing metal foil such as a copper sulfate solution is introduced into the cathode chamber 5 from the electrolytic solution tank for producing metal foil, and a pure acid solution such as sulfuric acid is introduced into the anode chamber 7 through the pipes. Is done.
  • the electrolytic solution for producing a metal foil such as a copper sulfate solution is overflowed from the cathode chamber 5 to the overflow tank 20 and stored in the copper sulfate solution storage tank 21 in the flow shown in FIG.
  • the copper sulfate solution stored in the copper sulfate solution storage tank 21 is supplied with a new copper sulfate solution generated by dissolving metal copper in the copper dissolution tank 22 as needed, and the copper component used by electrolysis is replenished.
  • the pure sulfuric acid solution that is circulated and supplied to the anode chamber 7 overflows from the anode chamber 7 and is stored in the sulfuric acid solution storage tank 23 for circulation.
  • 10 is a metal foil as a product
  • 11 is a metal foil winding roll.
  • FIG. 2 is a partially cutaway perspective view of an embodiment in which a diaphragm is disposed on the surface of an insoluble metal anode used in the electrolytic metal foil continuous production apparatus of the present invention
  • FIG. 3 is a cross-sectional view of FIG. FIG.
  • the insoluble metal anode 3 is a power supply plate in which a plurality of rectangular mesh-shaped anode pieces 12 formed in a strip shape are formed in an arc shape of a quarter of the circumference. 6 are arranged so as to be in contact with each other, and are detachably fixed to the plurality of power supply bosses 13 with countersunk screws 14 and assembled along the arc of the power supply plate 6.
  • the power supply plates 6 formed in an arc shape of a quarter of the circumference are provided on both sides of the lower part of the cylindrical cathode drum 2 with the electrolytic solution supply pipe 8 and the acid solution supply pipe 9 for generating the metal foil interposed therebetween. .
  • the diaphragm 4 is stretched on the surface of the insoluble metal anode 3 assembled in this way, the four sides of the diaphragm 4 are overlapped with the flange portion 15 of the power supply plate 6, the overlapped portion is covered with the packing 16, and the flange 17 is placed thereon. Put. After that, the packing 16 sandwiched between the flange 17 and the flange portion 15 (including the portion overlapping the film) is detachably fastened to the countersunk screw 18 and the flange 17 with a cap nut 19 (sealed and welded around). In this way, the diaphragm 4 is pressed and sealed with the packing 16 on the four sides of the power supply plate 6, thereby forming a liquid flow path (anode chamber 7) flowing on the inner wall side of the power supply plate 6.
  • the metal foil is a copper foil
  • the electrolytic solution for producing the metal foil is a copper sulfate solution
  • the acid solution is a pure sulfuric acid solution.
  • the cylindrical cathode drum 2 made of titanium or nickel installed in the electrolytic cell 1 is partially immersed (substantially in the lower half) in a copper sulfate solution which is an electrolytic solution for generating metal foil, as shown in FIG. Rotate in the direction of the arrow.
  • a copper sulfate solution which is an electrolyte for generating a metal foil is supplied from an electrolyte supply pipe 8 for generating a metal foil from below the center of the cathode drum 2. Is infused.
  • This copper sulfate solution contains many additives such as gelatin in order to improve the properties of the copper foil to be formed, and is configured to circulate. Copper is dissolved and added to the copper sulfate solution to adjust the concentration of the copper sulfate solution.
  • a pure sulfuric acid solution which is an acid solution
  • an acid solution is fed into an anode chamber 7 formed on the inner wall side of the power supply plate 6 on the back side of the insoluble metal anode 3 from an acid solution supply pipe 9 below the central portion of the cathode drum 2. Is infused.
  • This pure sulfuric acid solution is also configured to circulate.
  • a predetermined voltage is loaded between the cathode drum 2 and the insoluble metal anode 3 via a rectifier (not shown), and electrolysis is performed.
  • the cathode drum 2 rotates, the copper electrodeposited from the copper sulfate solution increases in thickness, and when the thickness exceeds a certain thickness, the copper foil as the metal foil 10 is peeled off and continuously applied to the metal foil winding roll 11. Wind up.
  • the various electrolytic metal foils according to the present invention in particular, the electrolytic metal foil continuous production method and the electrolytic metal foil continuous production apparatus suitable for the production of the electrolytic copper foil can exhibit the following operational effects.
  • the insoluble metal anode 3 is isolated from the electrolytic solution for producing metal foil such as a copper sulfate solution containing many additives by the diaphragm 4, and the additive and lead ions in the electrolytic solution are in contact with each other.
  • it can be kept in an acid solution such as a pure sulfuric acid solution, and as a result, the life of the anode can be improved.
  • the lead compound does not precipitate on the insoluble metal anode 3, a reduction in cell voltage can be expected.
  • the method of placing the diaphragm 4 in close contact with the surface of the insoluble metal anode 3 is not particularly limited. Instead of providing the packing 16, the flange 17, the countersunk screw 18, and the cap nut 19 as described above, the diaphragm 4 is pressed with a micro mesh. A method, a method of pressing with a lateral support, a method of pressing with a PTFE yarn, or the like may be used. Further, when the diaphragm 4 is stretched on the surface of the insoluble metal anode 3, it is necessary to place the diaphragm 4 in close contact with the surface of the insoluble metal anode 3. 4 may be in a state of being in close contact with the entire surface or in part (zero gap formation state) or in a state of being arranged with a minute interval (finite formation state). This can be done by changing the thickness of the packing 16.
  • the insoluble metal anode 3 is configured such that a plurality of rectangular mesh-shaped anode pieces 12 formed in a strip shape are in contact with each other on the surface of the power supply plate 6 processed into a phase shape.
  • a mesh-like plate-like body formed in a single arc shape so as to follow the shape of the power supply plate 6 may be used.
  • the insoluble metal anode 3 is not limited to the method of directly attaching to the power supply plate 6 exemplified above, and may be attached to the power supply plate 6 via, for example, an electrode mount processed into a phase shape.
  • the insoluble metal anode 3 used in the present invention is preferably one in which an electrode base is formed of a valve metal such as titanium and an electrode coating is formed on the surface thereof.
  • any electrode coating can be formed according to the purpose of use of the electrode. For example, when a sulfuric acid solution is used as the acid solution, the electrode coating is performed with a coating containing iridium oxide. Is preferably used.
  • a cation exchange membrane, an anion exchange membrane, and a neutral diaphragm can be used as the diaphragm 4 used for this invention.
  • Table 1 whichever diaphragm was used, as shown in Table 1, there was no mixing of lead particles into the copper foil as a product, and there was no significant difference in copper foil quality and copper foil appearance.
  • Table 1 when a cation exchange membrane is used as the diaphragm 4, the cell voltage, current efficiency, and anode life are longer than when an anion exchange membrane or a neutral diaphragm is used. More preferable results were obtained. The reason for this is presumed that when a cation exchange membrane is used, the exchange of charges with copper ions is rate-controlled by proton transfer in the membrane.
  • Example 1 1) Production conditions for insoluble metal anode (A) The surface of the JIS class 1 titanium plate is dry-blasted with iron grit (# 120 size), then pickled in a 20% sulfuric acid aqueous solution (105 ° C) for 10 minutes to clean the electrode substrate. It was. The cleaned electrode substrate was set in an arc ion plating apparatus, and arc ion plating coating of pure titanium material was performed. The coating conditions are as follows.
  • Target JIS Class 1 titanium disc (back side is water cooled) Degree of vacuum: 1.0 ⁇ 10 -2 Torr (Ar gas replacement introduced) Input power: 500W (3.0KV) Substrate temperature: 150 ° C (during arc ion plating) Time: 35 minutes Coating thickness: 2 microns (in terms of weight increase)
  • iridium tetrachloride and tantalum pentachloride are dissolved in 35% hydrochloric acid to form a coating solution.
  • the coating solution is brushed on the arc ion plating-coated substrate, dried, and then air-circulated electric Thermal decomposition coating was performed in a furnace (550 ° C., 20 minutes) to form an electrode catalyst layer made of a solid solution of iridium oxide and tantalum oxide.
  • the amount of the coating solution was set so that the thickness of one application of brush coating was approximately 1.0 g / m 2 in terms of iridium metal.
  • a product obtained by repeating this coating to baking operation 12 times was produced.
  • the insoluble metal anode thus produced was electrolyzed under the following conditions using the electrolytic copper foil continuous production apparatus shown in FIG.
  • Example 2 1) Production conditions for insoluble metal anode (B) The surface of the JIS class 1 titanium plate is dry-blasted with iron grit (# 120 size), then pickled in a 20% sulfuric acid aqueous solution (105 ° C) for 10 minutes to clean the electrode substrate. It was. Dissolve tantalum pentachloride and titanium tetrachloride in 35% hydrochloric acid on the cleaned electrode substrate to make a coating solution, and perform thermal decomposition coating in an air circulating electric furnace (550 ° C, 20 minutes) to form an intermediate layer did.
  • iridium tetrachloride and tantalum pentachloride are dissolved in 35% hydrochloric acid to form a coating solution, and the intermediate layer-formed substrate is brush-dried and dried in an air-circulating electric furnace (550 ° C., 20 minutes).
  • Thermal decomposition coating was performed to form an electrode catalyst layer made of a solid solution of iridium oxide and tantalum oxide.
  • the amount of the coating solution was set so that the thickness of one application of brush coating was approximately 1.0 g / m 2 in terms of iridium metal.
  • a product obtained by repeating this coating to baking operation 12 times was produced.
  • the insoluble metal anode thus produced was electrolyzed under the following conditions using the electrolytic copper foil continuous production apparatus shown in FIG.
  • Example 3 1) Manufacturing conditions of insoluble metal anode The manufacturing conditions were the same as in Example 1 (A). 2) Diaphragm Using the same cation exchange membrane as in Example 1, it was in close contact with the insoluble metal anode to form a zero gap. 3) Electrolysis conditions The same electrolysis conditions as in Example 1 were used except that the current density was changed to 30 A / dm 2 . As shown in Table 1, good results were obtained in all of the cell voltage, foil production current efficiency, anode life, copper foil quality, and copper foil appearance.
  • Example 4 1) Manufacturing conditions of insoluble metal anode The manufacturing conditions were the same as in Example 1 (A). 2) Diaphragm Using the same cation exchange membrane as in Example 1, it was in close contact with the insoluble metal anode to form a zero gap. 3) Electrolysis conditions The same electrolysis conditions as in Example 1 were used except that the current density was changed to 80 A / dm 2 . As shown in Table 1, good results were obtained in all of the cell voltage, foil production current efficiency, anode life, copper foil quality, and copper foil appearance.
  • Example 5 1) Manufacturing conditions of insoluble metal anode The manufacturing conditions were the same as in Example 1 (A). 2) Diaphragm The following cation exchange membrane was used and adhered to the insoluble metal anode. Nafion 117 (registered trademark of Deyupon) 3) Electrolysis conditions The same electrolysis conditions as in Example 1 were used. As shown in Table 1, good results were obtained in all of the cell voltage, foil production current efficiency, anode life, copper foil quality, and copper foil appearance.
  • Example 6 1) Manufacturing conditions of insoluble metal anode The manufacturing conditions were the same as in Example 1 (A). 2) Diaphragm Using the following anion exchange membrane, it was in close contact with the insoluble metal anode to form a zero gap. Neoscepter A-0300 (registered trademark of Astom Corp.) 3) Electrolysis conditions The same electrolysis conditions as in Example 1 were used. As shown in Table 1, the cell voltage was slightly increased and the foil production current efficiency was slightly decreased, but favorable results were obtained for the anode life, copper foil quality, and copper foil appearance.
  • Example 7 1) Manufacturing conditions for insoluble metal anode The anode was manufactured under the same conditions (B) as in Example 2. 2) Diaphragm Using the following anion exchange membrane, it was in close contact with the insoluble metal anode to form a zero gap. Neoscepter A-0300 (registered trademark of Astom Corp.) 3) Electrolysis conditions The same electrolysis conditions as in Example 1 were used. As shown in Table 1, the cell voltage was slightly increased and the foil production current efficiency was slightly decreased, but favorable results were obtained for the anode life, copper foil quality, and copper foil appearance.
  • Example 8 1) Manufacturing conditions of insoluble metal anode The manufacturing conditions were the same as in Example 1 (A). 2) Diaphragm Using the following neutral diaphragm, it was in close contact with the insoluble metal anode to form a zero gap. Yumicron Y9201T (registered trademark of Yuasa Membrane Systems) 3) Electrolysis conditions The same electrolysis conditions as in Example 1 were used. As a result, as shown in Table 1, the anode life was slightly reduced, but good results were obtained in terms of cell voltage, foil-making current efficiency, anode life, copper foil quality, and copper foil appearance.
  • Example 1 1) Manufacturing conditions of insoluble metal anode The manufacturing conditions were the same as in Example 1 (A). 2) Diaphragm It was set as the non-diaphragm. 3) Electrolysis conditions The same electrolysis conditions as in Example 1 were used. However, only the catholyte was used and no anolyte was used. As a result, as shown in Table 1, the anode life was significantly reduced.
  • the present invention current non-uniformity due to lead adhering to the insoluble metal anode that has occurred in the manufacturing method using the conventional apparatus, and copper foil quality deterioration due to bubbles generated on the insoluble metal anode are prevented,
  • the product yield of the metal foil can be improved, the influence of bubbles and adhering lead can be eliminated, the cell voltage can be lowered, and the accelerated consumption of the insoluble metal anode by the additive can be prevented.
  • a good electrolytic metal foil can be produced continuously with high efficiency, and can be used in the field of production of electrolytic copper foil and other various electrolytic metal foils.
  • Electrolytic cell 2 Cathode drum 3: Insoluble metal anode 4: Diaphragm 5: Cathode chamber 6: Feed plate 7: Anode chamber 8: Electrolyte supply pipe 9 for generating metal foil 9: Acid solution supply pipe 10: Metal foil 11: Metal foil winding roll 12: Rectangular anode mesh formed in a strip shape constituting insoluble metal anode 3 13: Power feeding boss 14: Countersunk screw 15: Flange portion 16 of power feeding plate 6: Packing 17: Flange 18: Dish Screw 19: Cap nut 20: Overflow tank 21: Copper sulfate solution storage tank 22: Copper dissolution tank 23: Sulfuric acid solution storage tank

Abstract

L'invention porte sur un procédé et un dispositif de fabrication en continu de feuille de métal formée par dépôt électrolytique, qui permet d'éviter la non-uniformité de courant provoquée par du plomb adhérant à des anodes métalliques insolubles, qui permet d'éviter des réductions de qualité de la feuille de métal à cause de bulles produites dans ces anodes, qui permet d'améliorer le rendement de production, qui permet de réduire la tension de la cellule électrolytique et qui permet d'éviter la consommation accélérée d'anodes métalliques insolubles par des additifs. Le procédé et le dispositif de fabrication en continu de feuille de métal formée par dépôt électrolytique selon l'invention utilisent un dispositif ayant un tambour cathodique cylindrique tournant qui est partiellement immergé dans un électrolyte pour la formation d'une feuille de métal et une anode métallique insoluble ayant une forme de type arc et une partie en regard du tambour et sont caractérisés en ce que le dispositif a une structure telle qu'un film barrière est disposé de façon à adhérer à la surface de l'anode métallique insoluble, une chambre cathodique est formée entre le tambour cathodique et le film barrière et une chambre anodique est formée sur le côté arrière de l'anode et en ce qu'un électrolyte pour la formation de la feuille de métal est disposé à l'intérieur de la chambre cathodique, une solution d'acide est apportée à l'intérieur de la chambre anodique, une électrolyse est effectuée, une feuille de métal qui est déposée par voie électrolytique sur la surface du tambour cathodique est décollée du tambour cathodique et la feuille de métal est fabriquée en continu.
PCT/JP2014/065717 2013-07-18 2014-06-13 Procédé de fabrication en continu de feuille de métal formée par dépôt électrolytique et dispositif de fabrication en continu de feuille de métal formée par dépôt électrolytique WO2015008564A1 (fr)

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JP2013-149687 2013-07-18
JP2013149687A JP2015021154A (ja) 2013-07-18 2013-07-18 電解金属箔の連続製造方法及び電解金属箔連続製造装置

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CN108425135A (zh) * 2017-02-15 2018-08-21 金居开发股份有限公司 电解铜箔的生产设备及其电流调整控制装置
CN108649183A (zh) * 2018-05-14 2018-10-12 山东金宝电子股份有限公司 一种锂离子电池负极集流体用微孔铜箔的制备方法
CN114686961A (zh) * 2022-04-21 2022-07-01 河南理工大学 一种电铸成型、打孔一体化的多孔铜箔制造系统及方法

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WO2018173231A1 (fr) * 2017-03-23 2018-09-27 Ykk株式会社 Dispositif de revêtement par électrodéposition

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