WO2014205960A1 - 切割不规则图形基板的方法和显示装置 - Google Patents

切割不规则图形基板的方法和显示装置 Download PDF

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Publication number
WO2014205960A1
WO2014205960A1 PCT/CN2013/085208 CN2013085208W WO2014205960A1 WO 2014205960 A1 WO2014205960 A1 WO 2014205960A1 CN 2013085208 W CN2013085208 W CN 2013085208W WO 2014205960 A1 WO2014205960 A1 WO 2014205960A1
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WO
WIPO (PCT)
Prior art keywords
substrate
cutting
irregular pattern
line
lines
Prior art date
Application number
PCT/CN2013/085208
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English (en)
French (fr)
Inventor
姜力元
郑耀坤
曲连杰
王雅洁
姜延祺
Original Assignee
京东方科技集团股份有限公司
北京京东方显示技术有限公司
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Publication date
Application filed by 京东方科技集团股份有限公司, 北京京东方显示技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/347,138 priority Critical patent/US9416041B2/en
Publication of WO2014205960A1 publication Critical patent/WO2014205960A1/zh
Priority to US15/206,880 priority patent/US10414683B2/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
    • B23K28/02—Combined welding or cutting procedures or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54—Glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y10T225/12—With preliminary weakening
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49995—Shaping one-piece blank by removing material
    • Y10T29/49996—Successive distinct removal operations

Definitions

  • Embodiments of the present invention relate to a method of cutting an irregular graphic substrate and a display device. Background technique
  • the base substrate is one of the key components constituting a display screen, a touch screen, and the like.
  • a display screen of a desired shape and size
  • the quality of the base substrate directly determines the production cost and market value of the screen.
  • the cutting method of the base substrate is usually as follows: First, the required shape and size are input in the numerically controlled machine tool, and then the cutter wheel is sequentially cut to cut out the sides of the regular pattern.
  • One aspect of the present invention provides a method of cutting an irregular pattern substrate, comprising: forming a cutting line on a substrate, wherein a closed area surrounded by the cutting line is a desired irregular pattern; A groove line is formed; an external force is applied to the substrate to divide the substrate at the groove line.
  • another aspect of the present invention provides a display device in which a substrate of the display device is fabricated by the method of cutting an irregular pattern substrate as described above.
  • the method for cutting an irregular graphic substrate provided by the embodiment of the invention can greatly improve the cutting precision and efficiency of the irregular graphic substrate, provide a high-precision irregular graphic substrate for the display device, and has high production efficiency and is suitable for mass production.
  • FIG. 1 is a flow chart showing a method of cutting an irregular pattern substrate according to an embodiment of the present invention
  • FIG. 2 is a flow chart showing an example of a method for cutting an irregular pattern substrate according to an embodiment of the present invention
  • Fig. 3 is a flow chart showing another example of a method of cutting an irregular pattern substrate in an embodiment of the present invention. detailed description
  • the cutting of the base substrate can be performed by using a cutting method of a regular graphic base substrate, that is, inputting a desired shape and size on a numerically controlled machine tool, and then controlling the cutter wheel to sequentially cut out irregular patterns.
  • a cutting method of a regular graphic base substrate that is, inputting a desired shape and size on a numerically controlled machine tool, and then controlling the cutter wheel to sequentially cut out irregular patterns.
  • the embodiment provides a method of cutting an irregular pattern substrate for improving the cutting precision and efficiency of the irregular pattern substrate.
  • the method for cutting an irregular pattern substrate in this embodiment includes the following steps 100-300.
  • Step 100 Form a cutting line on the substrate, wherein the closed area enclosed by the cutting line is a desired irregular pattern.
  • marking the cut line in advance can significantly improve the precision and efficiency of substrate cutting.
  • an example of this step includes the following steps 101-102, as shown in Figs. 2 and 3.
  • Step 101 Apply a photoresist covering the entire substrate on the substrate.
  • the photoresist can be a positive photoresist or a negative photoresist. Taking a positive photoresist as an example, after the photoresist is exposed and developed, the corresponding substrate of the photoresist completely reserved region has a pattern of irregular patterns required, and the substrate is protected during the substrate cutting process. effect.
  • Photoresist coated The method can be, for example, a method such as spin coating or doctor blade coating.
  • Step 102 performing exposure and development using a mask to form the photoresist into a completely remaining region and a completely removed region, wherein a boundary line of the photoresist completely remaining region and the dicing line of the dicing line have Corresponding to the pattern of the desired irregular pattern, so that the photoresist also has a pattern corresponding to the desired irregular pattern after exposure and development, and the photoresist pattern composed of the completely remaining region of the photoresist marks the cutting line.
  • Step 200 forming a groove line at the cutting line.
  • the thickness of the base substrate is usually thick, if the substrate is directly divided along the cutting line indicated by the photoresist pattern, the cutting time will be long.
  • the step of forming a groove line at the cutting line in advance can improve the efficiency of cutting.
  • a groove line at the cutting line there are more than four ways of forming a groove line at the cutting line, such as cutting along a cutting line on the substrate using a laser cutter to form a groove line at the cutting line, a flow chart using the method as shown in picture 2.
  • the laser source can be a carbon dioxide laser beam with a working power of 500 to 2500 watts.
  • etching may be performed along the dicing line on the substrate by dry etching or wet etching to form a groove line at the dicing line, and a flow chart using this mode is shown in Fig. 3. It is of course also possible to cut along the cutting line on the substrate by diamond or other hard alloy to form a groove line at the cutting line, which are all within the scope of the invention.
  • the wet etching method generally uses hydrofluoric acid at a concentration of 10% - 40% because hydrofluoric acid can dissolve glass and quartz which cannot be dissolved by many other acids.
  • the base substrate of the display device is usually a glass substrate or a quartz substrate.
  • the dry etching method generally uses sulfur hexafluoride gas, helium gas or argon gas, because they are all inert gases, and the molecules of the base substrate are driven out by the principle of ion bombardment to form groove lines without corroding the base substrate.
  • Step 300 Apply an external force to the substrate to divide the substrate at the slot line.
  • an external force is applied to the substrate by ultrasonic waves, for example, to divide the substrate at the groove line.
  • the ultrasonic waves cause the substrate to produce a minute fracture layer, and the fracture surface is also processed to reduce the load of subsequent cornering and/or edging processes.
  • the frequency range of ultrasonic waves is generally 20 kHz to 500 MHz. In this frequency range, it can ensure that the substrate is divided along the preset groove line, and it does not affect the rest of the substrate. Integrity.
  • the embodiment provides a display device.
  • the substrate of the display device is fabricated by the method of cutting irregular patterns in the first embodiment, and provides a high-precision irregular graphic substrate for the display device, and has high production efficiency and is suitable for mass production. Meet the needs of consumers.
  • a cutting line is formed on the substrate, and a closed area surrounded by the cutting line is a desired irregular pattern. This can improve the precision of the substrate cutting; then, the groove line is formed at the cutting line, which can shorten the cutting time of the substrate and improve the efficiency of substrate cutting.
  • the display device is provided with a high-precision irregular pattern substrate, and has high production efficiency and is suitable for mass production.
  • the cutting line can be formed on the substrate by a mask exposure process to improve the precision of the cutting line and further improve the precision of the substrate cutting.
  • an external force is applied to the substrate by ultrasonic waves to divide the substrate at the groove line. Since the ultrasonic plate generates a minute fracture layer, the fracture surface is processed to reduce the load of the subsequent cornering and/or edging process.

Abstract

一种切割不规则图形基板的方法和包括用此方法制成的基板的显示装置。所述方法包括：在基板上形成切割线，其中，所述切割线围成的闭合区域为所需的不规则图形；在所述切割线处形成槽线；对所述基板施加外力从而在所述槽线处分割所述基板。该方法能够提高不规则图形基板的切割精度和效率。

Description

切割不规则图形基板的方法和显示装置 技术领域
本发明的实施例涉及一种切割不规则图形基板的方法和显示装置。 背景技术
基底基板是构成显示屏、 触摸屏等的关键元件之一。 为了获得所需形状 和尺寸的显示屏， 通常需要通过切割获得与屏形状和尺寸一致的基底基板。 而基底基板的质量好坏， 直接决定了屏的生产成本和市场价值。
由于传统的显示屏都^ J'j图形， 一般为矩形。 传统技术中基底基板的 切割方法通常为： 首先在数控机床中输入所需的形状和尺寸， 然后控制刀轮 依次切割出规则图形的各个边。
随着显示行业的蓬勃发展， 消费者的需求逐渐多样化， 也需要不规则图 形的显示屏。 利用传统技术中的切割方法来切割不规则图形的基底基板时， 需要经过多次切割分别切割出不规则图形的各个边， 累积误差大， 切割精度 低， 且切割效率也很低。 发明内容
本发明的一个方面提供了一种切割不规则图形基板的方法， 包括： 在基 板上形成切割线， 其中， 所述切割线围成的闭合区域为所需的不规则图形； 在所述切割线处形成槽线； 对所述基板施加外力从而在所述槽线处分割所述 基板。
同时， 本发明的另一个方面还提供了一种显示装置， 所述显示装置的基 板采用如上所述的切割不规则图形基板的方法制作。
本发明实施例提供的切割不规则图形基板的方法， 能够大大提高不规则 图形基板的切割精度和效率， 为显示装置提供高精度的不规则图形基板， 且 生产效率高， 适合大量生产。 附图说明 为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1所示为本发明实施例中切割不规则图形基板的方法的流程图； 图 2所示为本发明实施例中切割不规则图形基板的方法一个示例的流程 图；
图 3所示为本发明实施例中切割不规则图形基板的方法另一个示例的流 程图。 具体实施方式
下面结合附图和实施例， 对本发明的具体实施方式作进一步详细描述。 以下实施例用于说明本发明， 但不用来限制本发明的范围。
实施例一
对于具有不规则图形显示屏的显示装置， 其基底基板的切割如果利用规 则图形基底基板的切割方法， 即在数控机床上输入所需的形状和尺寸， 然后 控制刀轮依次切割出不规则图形的各个边时， 会出现累积误差大， 切割的精 度和效率都很低的问题。 本实施例提供一种切割不规则图形基板的方法， 用 以提高不规则图形基板的切割精度和效率。
如图 1所示， 本实施例中的切割不规则图形基板的方法， 包括以下步骤 100-300。
步骤 100、 在基板上形成切割线， 其中， 所述切割线围成的闭合区域为 所需的不规则图形。
通过首先在基板上形成切割线， 且该切割线围成的闭合区域为所需的不 规则图形， 事先标出切割线可以显著地提高基板切割的精度和效率。
为了提高形成的切割线的精度， 结合图 2和图 3所示， 该步骤的一个示 例包括以下步骤 101-102。
步骤 101、 在所述基板上涂覆覆盖整个基板的光刻胶。
该光刻胶可以为正性光刻胶或者负性光刻胶。 以正性光刻胶为例进行说 明， 即光刻胶曝光、 显影后， 光刻胶完全保留区域对应的基板具有所需的不 规则图形的图案， 在基板切割的过程中起到保护基板的作用。 涂覆光刻胶的 方法例如可以采用旋涂、 刮涂等方法。
步骤 102、 利用掩膜版进行曝光， 显影， 使所述光刻胶形成完全保留区 域和完全去除区域， 其中， 所述光刻胶完全保留区域的边界线与所述切割线 该掩膜版具有对应于所需的不规则图形的图案， 从而使得光刻胶在曝光 和显影后也具有对应于所需的不规则图形的图案， 由光刻胶完全保留区域构 成的光刻胶图案标示出切割线。
步骤 200、 在所述切割线处形成槽线。
由于基底基板的厚度通常较厚， 如果直接沿着光刻胶图案标示出的切割 线分割基板， 切割时间会比较长。 而预先在切割线处形成槽线的步骤， 可以 提高切割的效率。
在所述切割线处形成槽线的方式有 4艮多种， 如使用激光切割机在所述基 板上沿切割线进行切割， 以在所述切割线处形成槽线， 使用该方式的流程图 如图 2所示。例如，激光源可以选用二氧化碳激光束，工作功率为 500 ~ 2500 瓦。 或者， 可以通过干刻法或湿刻法在所述基板上沿切割线进行刻蚀， 以在 所述切割线处形成槽线， 使用该方式的流程图如图 3所示。 当然也可以通过 金刚石或其他硬质合金在所述基板上沿切割线进行切割， 以在所述切割线处 形成槽线， 其都属于本发明的保护范围。
在实际使用过程中， 湿刻法一般采用浓度为 10 % -40 %的氢氟酸， 因为 氢氟酸能够溶解很多其他酸都不能溶解的玻璃、 石英。 而显示装置的基底基 板通常为玻璃基板或石英基板。 而干刻法一般采用六氟化硫气体、 氦气或氩 气， 因为它们都属于惰性气体， 只是利用离子轰击的原理将基底基板的分子 打出来， 从而形成槽线， 不会腐蚀基底基板。
该步骤之后，可以剥离剩余的光刻胶，形成具有所需不规则图形的基板。 步骤 300、 对所述基板施加外力从而在所述槽线处分割所述基板。
结合图 2和图 3所示， 本实施例中例如通过超声波对所述基板施加外力 从而在所述槽线处分割所述基板。 超声波使所述基板产生微小的破碎层的同 时， 还会对破碎表面进行加工， 能降低后续修角和 /或磨边工艺的负荷。
例如， 超声波的频率范围一般为 20KHz~500MHz。 在此频率范围内， 既 可以保证基板沿预先设定的槽线分割， 同时， 也不会影响基板其他地方的完 整性。
实施例二
本实施例提供一种显示装置， 该显示装置的基板采用实施例一中的切割 不规则图形的方法制作， 为显示装置提供了高精度的不规则图形基板， 且生 产效率高， 适合大量生产， 满足了消费者的需求。
由以上实施例可以看出， 本发明的实施例所提供的切割不规则图形基板 的方法中， 首先， 在基板上形成切割线， 且切割线围成的闭合区域即为所需 的不规则图形， 这能够提高基板切割的精度； 然后， 在切割线处形成槽线， 这可以缩短基板切割的时间， 提高了基板切割的效率。 从而为显示装置提供 了高精度的不规则图形基板， 且生产效率高， 适合大量生产。 例如， 可以通 过掩膜曝光工艺在基板上形成该切割线， 提高切割线的精度， 进一步提高基 板切割的精度。 最后， 通过超声波对基板施加外力从而在槽线处分割基板， 由于超声波 板产生微小的破碎层的同时， 还会对破碎表面进行加工， 能 降低后续修角和 /或磨边工艺的负荷。
以上所述仅是本发明的优选实施方式， 应当指出， 对于本技术领域的普 通技术人员来说， 在不脱离本发明技术原理的前提下， 还可以做出若干改进 和替换， 这些改进和替换也应视为本发明的保护范围。

Claims

权利要求书
1、 一种切割不规则图形基板的方法， 包括：
在基板上形成切割线， 其中， 所述切割线围成的闭合区域为所需的不规 则图形；
在所述切割线处形成槽线；
对所述基板施加外力从而在所述槽线处分割所述基板。
2、根据权利要求 1所述的切割不规则图形基板的方法， 其中， 在基板上 形成切割线包括：
在所述基板上涂覆覆盖整个基板的光刻胶；
利用掩膜版进行曝光， 显影， 使所述光刻胶形成完全保留区域和完全去 除区域， 其中， 所述光刻胶完全保留区域的边界线与所述切割线重合。
3、根据权利要求 1或 2所述的切割不规则图形基板的方法， 其中， 在所 述切割线处形成槽线包括：
使用激光束在所述基板上沿切割线进行切割， 以在所述切割线处形成槽 线。
4、根据权利要求 1或 2所述的切割不规则图形基板的方法， 其中， 在所 述切割线处形成槽线包括：
通过干刻法或湿刻法在所述基板上沿切割线进行刻蚀， 以在所述切割线 处形成槽线。
5、根据权利要求 4所述的切割不规则图形基板的方法， 其中， 通过干刻 法在所述基板上沿切割线进行刻蚀包括：
通过六氟化硫气体、 氦气或氩气在所述基板上沿切割线进行刻蚀。
6、根据权利要求 4所述的切割不规则图形基板的方法， 其中， 通过湿刻 法在所述基板上沿切割线进行刻蚀包括：
通过氢氟酸在所述基板上沿切割线进行刻蚀。
7、 根据权利要求 1-6任一所述的切割不规则图形基板的方法， 其中， 对 所述基板施加外力从而在所述槽线处分割所述基板包括：
通过超声波对所述基板施加外力从而在所述槽线处分割所述基板。
8、根据权利要求 7所述的切割不规则图形基板的方法， 其中， 所述超声 波的频率范围为 20KHz~500MHz。
9、 根据权利要求 1-8任一所述的切割不规则图形基板的方法， 其中， 对 所述基板施加外力从而在所述槽线处分割所述基板之后， 还包括：
对具有所需的不规则图形的基板的边缘进行修角和 /或磨边工艺。
10、 一种显示装置， 其中， 所述显示装置的基板采用权利要求 1-9任一 项所述的切割不规则图形基板的方法制作。
PCT/CN2013/085208 2013-06-26 2013-10-15 切割不规则图形基板的方法和显示装置 WO2014205960A1 (zh)

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