WO2014178282A1 - 有機エレクトロルミネッセンス素子 - Google Patents
有機エレクトロルミネッセンス素子 Download PDFInfo
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- WO2014178282A1 WO2014178282A1 PCT/JP2014/060802 JP2014060802W WO2014178282A1 WO 2014178282 A1 WO2014178282 A1 WO 2014178282A1 JP 2014060802 W JP2014060802 W JP 2014060802W WO 2014178282 A1 WO2014178282 A1 WO 2014178282A1
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- light emitting
- electrode
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/32—Stacked devices having two or more layers, each emitting at different wavelengths
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/19—Tandem OLEDs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80522—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/351—Thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to an organic electroluminescence element.
- the present invention relates to an organic electroluminescence element that is excellent in translucency due to the thinning of the intermediate electrode, and that has ensured conductivity by suppressing disconnection and high resistance of the intermediate electrode.
- organic electroluminescence elements (hereinafter also referred to as “organic EL elements”) have been actively developed and used as display devices and illumination devices.
- An organic EL element is a thin-film type complete solid-state element that can emit light at a low voltage of several V to several tens V, and has many excellent features such as high brightness, high luminous efficiency, thinness, and light weight.
- the organic EL element is configured by sandwiching a light emitting unit made of an organic material between a pair of electrodes, and emitted light generated by the light emitting unit passes through the electrode and is extracted outside.
- organic EL elements As means for colorizing emitted light, for example, organic EL elements having different emission colors such as red, green, and blue are arranged in a stripe shape, for example, and the emission intensity of each color is adjusted.
- a means for obtaining an arbitrary emission color is known.
- a so-called coating method in which organic EL elements of each emission color are individually patterned on a substrate using a high-definition metal mask, or a color filter is previously formed in an arbitrary pattern on the substrate.
- a method called a color filter method in which a white organic EL element is stacked thereon is used.
- organic EL elements having different emission colors are not arranged in a planar shape, but light emitting units of each emission color are stacked in the thickness direction of the element via an intermediate electrode, and each light emitting unit is
- a method of obtaining an arbitrary emission color by emitting light independently see, for example, Patent Document 1.
- the aperture ratio of each luminescent color can be practically as close as possible to 100%, and as a result, the loss of luminous efficiency can be greatly reduced.
- the manufacturing process can be simplified, and the manufacturing cost can be reduced and the yield can be improved.
- the above-described light emission efficiency and the manufacturing process are as described above. It can be said that it is superior to the two methods.
- the intermediate electrode interposed between the light emitting units is preferably formed in a thin film in order to efficiently extract emitted light from each light emitting unit. Specifically, although depending on the material, the film thickness is 20 nm or less. It is desirable that it be formed. On the other hand, various constituent layers including a light emitting unit are laminated between the intermediate electrode and the substrate, and when the intermediate electrode is pulled out to connect with an external power source, the intermediate electrode is patterned so as to get over the step of each layer. Need to be formed.
- the intermediate electrode is disconnected at the step portion of each layer, or the intermediate electrode is thinned at the step portion, so that the continuity of the thickness of the intermediate electrode is impaired.
- the laminated system has a problem that it is difficult to achieve both high translucency and high conductivity of the intermediate electrode.
- the present invention has been made in view of the above problems, and the problem to be solved is that since the intermediate electrode is thinned, it has excellent translucency, and the disconnection and high resistance of the intermediate electrode are suppressed, and the conductive property is reduced. An organic electroluminescence element with ensured properties is provided.
- the light-emitting unit adjacent to the intermediate electrode is patterned so that a part of the intermediate electrode is exposed when viewed from the stacking direction.
- the first lead-out wiring for connecting to the external power supply is connected to the exposed portion of the intermediate electrode, so that even if the intermediate electrode is thinned, the intermediate electrode does not cause disconnection or increase in resistance. It has been found that an organic EL element that can be connected to a power source can be provided. That is, the said subject which concerns on this invention is solved by the following means.
- a plurality of light emitting units including at least a light emitting layer are stacked between a first electrode formed on a substrate and a second electrode facing the first electrode, and an intermediate electrode provided between the light emitting units.
- the light emitting unit is an organic electroluminescence element that independently emits light
- the light emitting unit adjacent on the intermediate electrode is patterned so that a part of the intermediate electrode is exposed when viewed from the stacking direction, The organic electroluminescence element, wherein the first extraction wiring is connected to an exposed portion of the intermediate electrode.
- a second extraction wiring connected to an external power source is further provided on the substrate, 2.
- an organic electroluminescence device that has excellent translucency due to the thinning of the intermediate electrode by the above-described means of the present invention, and that has ensured conductivity by suppressing disconnection and high resistance of the intermediate electrode. Can do.
- the expression mechanism or action mechanism of the effect of the present invention is as follows. That is, the light emitting unit adjacent on the intermediate electrode is patterned so that a part of the intermediate electrode is exposed when viewed from the stacking direction, and the first extraction wiring is connected to the exposed part of the intermediate electrode. Therefore, the intermediate electrode does not need to be patterned so as to exceed the step, and since it is formed in a planar shape between the light emitting units, disconnection or high resistance is not caused even if the film is sufficiently thinned. For this reason, it can be set as the organic electroluminescent element which made the high translucency and high electroconductivity of an intermediate electrode compatible.
- the top view which shows an example of a structure of the organic electroluminescent element which concerns on this invention 1 is a sectional view taken along the line II-II in FIG. 1 is a sectional view taken along the line III-III in FIG.
- the top view which shows the modification of the structure of the organic electroluminescent element which concerns on this invention is a sectional view taken along the line III-III in FIG.
- the top view which shows the modification of the structure of the organic electroluminescent element which concerns on this invention The top view which shows the modification of the structure of the organic electroluminescent element which concerns on this invention
- a plurality of light emitting units including at least a light emitting layer are stacked between a first electrode formed on a substrate and a second electrode facing the first electrode, and the light emitting unit An intermediate electrode provided between them is connected to an external power source via a first lead-out wiring, so that the light emitting unit is an organic electroluminescence element that independently emits light, and is adjacent to the intermediate electrode
- the light emitting unit is patterned so that a part of the intermediate electrode is exposed when viewed from the stacking direction, and the first extraction wiring is connected to the exposed part of the intermediate electrode.
- a second extraction wiring connected to an external power source is further provided on the substrate, and the first extraction wiring is connected to the second extraction wiring.
- the wiring resistance in the organic EL element can be reduced, and the connectivity with the external power source can be improved.
- the first lead-out wiring is divided into a plurality of locations and patterned.
- the pattern formation of the first extraction wiring is performed by a vapor deposition method using a metal mask, the first extraction wiring is formed as a single film on a large area on the substrate. It is necessary to set a large opening, and strength reduction and deflection of the metal mask may occur.
- the opening of the metal mask can be divided and formed in a plurality of locations, and the strength reduction and deflection of the metal mask can be suppressed.
- the second electrode and the first extraction wiring are made of the same conductive material. Thereby, a 2nd electrode and 1st extraction wiring can be formed simultaneously, and an organic EL element can be made into a simple structure. Moreover, since the second electrode and the first extraction wiring can be formed in one step, the organic EL element can be easily manufactured.
- ⁇ is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value.
- the organic electroluminescence element according to the present invention can take various configurations, and examples are shown in FIGS. 1 is a plan view of the organic EL element 100, FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1, and FIG. 3 is an arrow taken along the line III-III in FIG.
- FIG. 4 is a plan view of an organic EL element 100A that is a modification of the organic EL element 100, and
- FIG. 5 is a plan view of an organic EL element 100B that is still another modification of the organic EL element 100.
- the organic EL element 100 includes a light-transmitting substrate 1, a first electrode 2 formed on the substrate 1, and a second electrode 3 facing the first electrode 2.
- Light emitting units 4 to 6, which are organic layer groups including at least a light emitting layer, provided between the first electrode 2 and the second electrode 3, and intermediate electrodes 7, 8 provided between the light emitting units 4 to 6, respectively.
- the second extraction wirings 12 to 15 and the like directly connected to the power supply are provided.
- the organic EL element 100 is configured as a bottom emission type in which the first electrode 2 is translucent and the second electrode 3 is reflective, so that the light emitted from the light emitting units 4 to 6 is extracted from the substrate 1 side. However, it may be configured as a top emission type. In this case, the first electrode 2 is configured to have reflectivity, and the second electrode 3 is configured to have translucency.
- the organic EL element 100 may be a see-through (double-sided light emitting) element in which all of the substrate 1, the first electrode 2, and the second electrode 3 have translucency.
- Each of the light emitting units 4 to 6 functions as an organic EL layer that generates light of different colors, and the emission color of the emitted light extracted outside can be adjusted by adjusting the emission intensity of each of the light emitting units 4 to 6.
- the emission color of the emitted light extracted outside can be adjusted by adjusting the emission intensity of each of the light emitting units 4 to 6.
- at least one of the light emitting units 4 to 6 has a different light emission color, but the light emission units 4 to 6 do not necessarily have to have different light emission colors. It is possible to arbitrarily change the emission color of 6.
- the light emitting units 4 and 5 may have the same light emission color, only the light emission unit 6 may have a different light emission color, or the light emission units 4 to 6 may all have the same light emission color.
- the light emitting unit 5 adjacent on the intermediate electrode 7 is patterned so that a part of the intermediate electrode 7 is exposed when viewed from the stacking direction of each layer, as shown in FIGS. Is formed. Thereby, an exposed portion 71 in which a part of the intermediate electrode 7 is exposed is formed.
- the light emitting unit 6 adjacent on the intermediate electrode 8 is patterned so that a part of the intermediate electrode 8 is exposed when viewed from the stacking direction of each layer. Yes. Thereby, an exposed portion 81 in which a part of the intermediate electrode 8 is exposed is formed.
- These exposed portions 71 and 81 may be formed so as to be in contact with the first lead-out wirings 10 and 11, respectively, so that the intermediate electrodes 7 and 8 are electrically connected to the first lead-out wirings 10 and 11,
- the area and the like are not particularly limited.
- the auxiliary wiring 9 is formed so as to connect the first electrode 2 and the second lead-out wiring 12, whereby the first electrode 2 is connected to an external power source.
- the first extraction wiring 10 is formed so as to connect the exposed portion 71 of the intermediate electrode 7 and the second extraction wiring 13.
- the first lead-out wiring 10 does not need to be thinned, and is formed sufficiently thick, so that the first lead-out wiring 10 is not disconnected or increased in resistance.
- the first lead-out wiring 11 is formed so as to connect the exposed portion 81 of the intermediate electrode 8 and the second lead-out wiring 14, and the intermediate electrode 8 is connected to an external power source. Can be connected to. Thereby, it is possible to individually apply a voltage to each of the light emitting units 4 to 6, and the light emission intensity of each of the light emitting units 4 to 6 can be adjusted.
- the auxiliary wiring 9 is divided into a plurality of locations so as to connect the first electrode 2 and the second extraction wiring 12, and the first extraction wirings 10, 11 are intermediate electrodes. 7 and 8 and the second take-out wirings 13 and 14 are divided and formed at a plurality of locations.
- the auxiliary wiring 9 and the first extraction wirings 10 and 11 may be formed as a single pattern and may be one continuous film. As shown in FIG.
- the auxiliary wiring 9a and the first take-out wirings 10a and 11a are not divided into a plurality of places and formed into a pattern, but are formed as a single pattern at a predetermined place. Thus, one continuous film is formed. Thereby, the pattern formation process of the auxiliary wiring 9a and the first extraction wirings 10a and 11a can be simplified.
- the second extraction wirings 12 to 15 are provided in the vicinity of the periphery on the substrate 1 and connected to an external power source (not shown). That is, the auxiliary wiring 9 is connected to the external power supply via the second extraction wiring 12, the first extraction wirings 10 and 11 are connected to the external power supply via the second extraction wirings 13 and 14, and the second electrode 3 is It is connected to an external power source via a second extraction wiring 15.
- the second lead-out wirings 12 to 15 are provided for the purpose of reducing the wiring resistance in the substrate 1 and improving the connectivity with an external power source. As shown in FIG. It can be omitted as necessary. As shown in FIG. 5, in the organic EL element 100B, the second extraction wiring is not provided, and the second electrode 3b, the auxiliary wiring 9b, and the first extraction wirings 10b and 11b extend to the peripheral portion on the substrate 1. It is extended. Thereby, the process of forming the second extraction wirings 12 to 15 is omitted, and the organic EL element 100 having a simple structure can be obtained. Note that also in the organic EL element 100B, as in the organic EL element 100A, the auxiliary wiring 9b and the first extraction wirings 10b and 11b are each integrally formed at a predetermined location to form a continuous film. Also good.
- each of the intermediate electrodes 7 and 8 is formed with a very thin film thickness in order to efficiently extract emitted light from each of the light emitting units 4 to 6. Since the first extraction wirings 10 and 11 are formed so as to be in contact with the exposed portions 71 and 81 of the intermediate electrodes 7 and 8 and to be connected to the second extraction wirings 13 and 14, the thin intermediate electrodes 7 and 8 are formed. It is not necessary to be formed over the steps of the light emitting units 4-6. Thereby, the organic EL element 100 also has good electrical connectivity while maintaining high translucency.
- the light emitting unit has three layers.
- the light emitting unit may have two layers or four or more layers.
- an intermediate electrode is provided between each light emitting unit, an exposed portion is formed in each intermediate electrode, and the first extraction wiring is connected to the exposed portion.
- the intermediate electrode and the first extraction wiring are provided with n ⁇ 1 layers.
- the organic EL element 100 is provided with a sealing material (not shown) on the substrate 1 for the purpose of preventing deterioration of the light emitting units 4 to 6 and the like.
- the sealing material may be a plate-shaped sealing member provided via an adhesive, or a film that covers each layer on the substrate 1. Also good.
- the end portions of the second lead-out wirings 12 to 15 are exposed from the sealing material while maintaining insulation from each other.
- the end portions of the second electrode 3b, the auxiliary wiring 9b, and the first lead-out wirings 10b and 11b are exposed from the sealing material while maintaining insulation from each other. Yes.
- the first electrode 2 is formed on the substrate 1.
- the light emitting unit 4 is formed on the first electrode 2. Specifically, the light emitting unit 4 is patterned so that a part of the first electrode 2 is exposed so that the auxiliary wiring 9 can connect the first electrode 2 and the second extraction wiring 12. .
- the intermediate electrode 7 is formed on the light emitting unit 4. Specifically, the intermediate electrode 7 needs to be formed in a pattern so that the intermediate electrode 7 and the first electrode 2 are not electrically connected, and the pattern is arranged so as to fit inside the upper surface of the light emitting unit 4. It is desirable that it be formed.
- the light emitting unit 5 is formed on the intermediate electrode 7.
- the light emitting unit 5 is partially exposed so that the intermediate electrode 7 can be connected to the first extraction wiring 10 on the light emitting unit 4 when viewed from the stacking direction.
- a pattern is formed.
- the intermediate electrode 8 is formed on the light emitting unit 5. Specifically, it is necessary to pattern the intermediate electrode 8 so that the intermediate electrode 8 is not electrically connected to the first electrode 2 or the intermediate electrode 7, and is formed on the inner side of the upper surface of the light emitting unit 5. It is desirable that the pattern is formed so as to fit.
- the light emitting unit 6 is formed on the intermediate electrode 8.
- the light emitting unit 6 is partially exposed so that the intermediate electrode 8 can be connected to the first extraction wiring 11 on the light emitting unit 5 when viewed from the stacking direction.
- a pattern is formed.
- the second electrode 3 is formed on the light emitting unit 6. Specifically, the second electrode 3 is patterned so that the second electrode 3 is not electrically connected to the first electrode 2 and the intermediate electrodes 7 and 8. Moreover, when taking out emitted light from the 1st electrode 2 side, since the 2nd electrode 3 does not need to have translucency, it is possible to ensure sufficient film thickness. For this reason, it is not necessary to consider disconnection due to a step or increase in resistance, and the pattern can be formed so that the end of the second electrode 3 is directly connected to the second extraction wiring 15. Note that, similarly to the intermediate electrodes 7 and 8, a first extraction wiring may be separately formed, and the second electrode 3 and the second extraction wiring 15 may be connected via the first extraction wiring.
- the auxiliary wiring 9 is patterned so as to contact the first electrode 2 and the second extraction wiring 12. Thereby, the 1st electrode 2 and the 2nd extraction wiring 12 are electrically connected. At this time, in order to prevent an electrical short circuit, it is necessary to form a pattern so that the auxiliary wiring 9 is not electrically connected to the second electrode 3, the intermediate electrodes 7 and 8, or the second extraction wirings 13 to 15.
- the first extraction wiring 10 is patterned so as to contact the exposed portion 71 of the intermediate electrode 7 and the second extraction wiring 13. Thereby, the intermediate electrode 7 and the second extraction wiring 13 are electrically connected. At this time, in order to prevent an electrical short circuit, the first extraction wiring 10 is electrically connected to the first electrode 2, the second electrode 3, the intermediate electrode 8, the auxiliary wiring 9, or the second extraction wirings 12, 14, 15. It is necessary to form a pattern so as not to occur.
- the first lead-out wiring 11 is patterned so as to contact the exposed portion 81 of the intermediate electrode 8 and the second lead-out wiring 14. Thereby, the intermediate electrode 8 and the second extraction wiring 14 are electrically connected. At this time, in order to prevent an electrical short circuit, the first extraction wiring 11 is connected to the first electrode 2, the second electrode 3, the intermediate electrode 7, the auxiliary wiring 9, the first extraction wiring 10, the second extraction wirings 12, 13, Therefore, it is necessary to form a pattern so as not to be electrically connected to 15.
- the auxiliary wiring 9 and the first extraction wirings 10 and 11 may be formed separately.
- the auxiliary wiring 9 and the first extraction wirings 10 and 11 may be formed at the same time by, for example, mask patterning. Also good. By doing so, the number of times of film formation can be reduced, and the number of film formation chambers and the number of vapor deposition masks can be reduced. Further, when the second electrode 3, the auxiliary wiring 9, and the first extraction wirings 10 and 11 are simultaneously patterned by a vacuum deposition method, the organic EL element 100 can be manufactured using an existing manufacturing apparatus.
- Each constituent layer of the organic EL element 100 can be formed by a method described later. However, when each constituent layer is formed by a vacuum deposition method, an existing vacuum deposition apparatus line is used. The organic EL element 100 can be easily manufactured. Even when a part of each constituent layer is formed by a coating method, the organic EL element 100 can be manufactured in the same manner by adjusting the film forming pressure of the constituent layer.
- Type organic EL element 100 can be manufactured.
- the substrate 1 that can be used in the organic EL device 100 of the present invention is not particularly limited, such as glass and plastic, and may be transparent or opaque. In the illustrated example, since the light is extracted from the substrate 1 side, the substrate 1 is transparent. Examples of the transparent substrate 1 preferably used include glass, quartz, and a transparent resin film. Particularly preferred is a resin film that can give flexibility to the organic EL element 100.
- the thickness of the substrate 1 is not particularly limited, and may be any thickness.
- polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), polyethylene, polypropylene, cellophane, cellulose diacetate, cellulose triacetate (TAC), cellulose acetate butyrate, cellulose acetate propionate ( CAP), cellulose esters such as cellulose acetate phthalate, cellulose nitrate or derivatives thereof, polyvinylidene chloride, polyvinyl alcohol, polyethylene vinyl alcohol, syndiotactic polystyrene, polycarbonate, norbornene resin, polymethylpentene, polyether ketone, polyimide , Polyethersulfone (PES), polyphenylene sulfide, polysulfones Cycloolefin resins such as polyetherimide, polyetherketoneimide, polyamide, fluororesin, nylon, polymethylmethacrylate, acrylic or polyarylate, Arton (trade name, manufactured by JSR) or Appel (trade name, manufactured by J
- a gas barrier film made of an inorganic material, an organic material, or both may be formed on the surface of the resin film.
- a water vapor permeability (25 ⁇ 0.5 ° C., relative humidity (90 ⁇ 2)% RH) measured by a method according to JIS K 7129-1992 is 0.01 g. / (M 2 ⁇ 24 h) or less is preferable, and the oxygen permeability measured by a method according to JIS K 7126-1987 is 1 ⁇ 10 ⁇ 3 ml / (m 2
- the material for forming the gas barrier film may be any material as long as it has a function of suppressing intrusion of elements that cause deterioration of elements such as moisture and oxygen.
- silicon oxide, silicon dioxide, silicon nitride, and the like can be used.
- the method for forming the gas barrier film is not particularly limited.
- the vacuum deposition method, sputtering method, reactive sputtering method, molecular beam epitaxy method, cluster ion beam method, ion plating method, plasma polymerization method, atmospheric pressure plasma weight A combination method, a plasma CVD method, a laser CVD method, a thermal CVD method, a coating method, and the like can be used, but an atmospheric pressure plasma polymerization method as described in JP-A-2004-68143 is particularly preferable.
- the opaque support substrate examples include a metal plate such as aluminum and stainless steel, an opaque resin substrate, and a ceramic substrate.
- the first electrode 2 it is possible to use all electrodes that can be normally used for organic EL elements. Specifically, aluminum, silver, magnesium, lithium, magnesium / same mixture, magnesium / silver mixture, magnesium / aluminum mixture, magnesium / indium mixture, indium, lithium / aluminum mixture, rare earth metal, ITO, ZnO, SnO 2 , Examples thereof include oxide semiconductors such as TiO 2 doped with aluminum.
- the first electrode 2 is preferably a transparent electrode, and more preferably a transparent metal electrode. Note that the transparency of the first electrode 2 means that the light transmittance at a wavelength of 550 nm is 50% or more.
- the first electrode 2 for example, a known spin coating, vapor deposition method, sputtering method, or the like can be used as appropriate.
- the patterning method include patterning by known photolithography, patterning by a pattern mask, and the like. Can be used depending on the situation.
- the transmittance be greater than 10%, and the sheet resistance as the first electrode 2 is preferably several hundred ⁇ / ⁇ or less.
- the film thickness of the first electrode 2 depends on the material, it is usually selected in the range of 10 to 1000 nm, preferably 10 to 200 nm.
- the first electrode 2 may have a two-layer structure including a base layer formed on the substrate 1 and an electrode layer formed thereon.
- the electrode layer is, for example, a layer composed of silver or an alloy containing silver as a main component
- the underlayer is, for example, a layer composed of a compound containing nitrogen atoms. It is done.
- the main component means that the content in the electrode layer is 98% by mass or more.
- the second electrode 3 is an electrode film that functions as a cathode for supplying electrons to the light emitting units 4 to 6, and a metal, an alloy, an organic or inorganic conductive compound, and a mixture thereof are used. Specifically, aluminum, silver, magnesium, lithium, magnesium / copper mixture, magnesium / silver mixture, magnesium / aluminum mixture, magnesium / indium mixture, indium, lithium / aluminum mixture, rare earth metal, ITO, ZnO, TiO 2 , An oxide semiconductor such as SnO 2 can be given. As a material of the second electrode 3, aluminum or silver is preferable from the viewpoint of handleability and the like.
- the second electrode 3 As a method for forming the second electrode 3, a known method such as a vapor deposition method by resistance heating under vacuum, a sputtering method, an EB (Electron-Beam) vapor deposition method, or the like can be used. However, when the organic EL element 100 is mass-produced In view of continuous productivity, the sputtering method or the EB vapor deposition method is preferable. Further, the sheet resistance as the second electrode 3 is preferably several hundred ⁇ / ⁇ or less. The film thickness of the second electrode 3 depends on the material, but is preferably selected within the range of 100 to 300 nm. When the film thickness is 300 nm or less, the formation time of the second electrode 3 can be shortened, generation of film stress can be suppressed, and peeling can be prevented more reliably.
- the organic EL element 100 is a thing which takes out emitted light also from the 2nd electrode 3 side
- a conductive material with favorable light transmittance is selected from the conductive materials mentioned above, and the second electrode is selected. 3 may be configured.
- the light emitting units 4 to 6 include at least a light emitting layer that is directly involved in light emission, and various organic layers such as a carrier (hole and electron) injection layer, a blocking layer, and a transport layer.
- the thickness of each light emitting unit 4 to 6 is preferably within the range of 80 to 200 nm per light emitting unit from the viewpoint of light extraction. By setting the thickness of each light emitting unit 4 to 6 to 80 nm or more, leakage can be more reliably suppressed and durability can be improved. By setting the thickness to 200 nm or less, driving voltage can be improved. Can be suppressed.
- the present invention is not particularly limited to the following examples as long as the light emitting layer is included.
- the light emitting units 4 to 6 may have a single layer structure having only a light emitting layer.
- the layers described above are usually provided on the first electrode 2 side, and are then laminated on the second electrode 3 side in the order described below.
- Each of the light emitting units 4 to 6 may have a different layer structure.
- a known method such as a vapor deposition method by resistance heating under vacuum, a spin coating method, or an ink-jet coating method can be used.
- the light-emitting layer is injected directly from the first electrode 2 or via a hole transport layer or the like, and directly from the second electrode 3 or via an electron transport layer or the like. It is a layer that emits light by recombination with electrons. Note that the portion that emits light may be inside the light emitting layer, or may be an interface between the light emitting layer and a layer adjacent thereto. In addition, a plurality of light emitting layers may be provided for one light emitting unit.
- the light emitting layer is preferably formed of an organic light emitting material containing a host compound (host material) and a light emitting material (light emitting dopant).
- a host compound host material
- a light emitting material light emitting dopant
- an arbitrary emission color can be obtained by appropriately adjusting the emission wavelength of the light emitting material, the type of the light emitting material to be contained, and the like.
- the total thickness of the light emitting layers can be appropriately set according to, for example, desired light emission characteristics.
- the total thickness of the light emitting layer is 1 to 200 nm from the viewpoints of homogeneity of the light emitting layer, prevention of unnecessary application of a high voltage during light emission, and improvement of stability of light emission color with respect to driving current. It is preferable.
- the total thickness of the light emitting layers is preferably 30 nm or less.
- the host compound contained in the light emitting layer is preferably a compound having a phosphorescence quantum yield of phosphorescence emission at room temperature (25 ° C.) of 0.1 or less, more preferably 0.01 or less.
- the volume ratio of the host compound in the light emitting layer is preferably 50% or more of various compounds contained in the light emitting layer.
- the light emitting material contained in the light emitting layer for example, a phosphorescent light emitting material (phosphorescent compound, phosphorescent light emitting compound), a fluorescent light emitting material, or the like can be used.
- one light emitting layer may contain one type of light emitting material, or may contain a plurality of types of light emitting materials having different light emission maximum wavelengths.
- a plurality of lights having different emission wavelengths can be mixed to emit light, whereby light of any emission color can be obtained.
- white light can be obtained by including a blue light emitting material, a green light emitting material, and a red light emitting material (three kinds of light emitting materials) in the light emitting layer.
- the injection layer is a layer for reducing the drive voltage and improving the light emission luminance.
- the injection layer is usually provided between the electrode and the light emitting layer.
- the injection layer is roughly classified into a hole injection layer (anode buffer layer) for injecting holes (carriers) and an electron injection layer (cathode buffer layer) for injecting electrons (carriers).
- the hole injection layer is provided between the first electrode 2 and the light emitting layer or the hole transport layer.
- the electron injection layer is provided between the second electrode 3 and the light emitting layer or the electron transport layer.
- Blocking layer (hole blocking layer, electron blocking layer)
- the blocking layer is a layer for blocking the transport of carriers (holes, electrons).
- the blocking layer is roughly classified into a hole blocking layer that blocks hole (carrier) transport and an electron blocking layer that blocks electron (carrier) transport.
- the hole blocking layer is a layer having a function of an electron transport layer (electron transport function) described later in a broad sense.
- the hole blocking layer is formed of a material having an electron transport function and a small hole transport capability. By providing such a hole blocking layer, the injection balance between holes and electrons in the light emitting layer can be made suitable. Thereby, the recombination probability of electrons and holes can be improved.
- the structure of the electron carrying layer mentioned later is applicable similarly as needed. Further, when a hole blocking layer is provided, the hole blocking layer is preferably provided adjacent to the light emitting layer.
- the electron blocking layer is a layer having a function of a hole transport layer (hole transport function) described later in a broad sense.
- the electron blocking layer is formed of a material having a hole transport function and a small electron transport capability.
- the layer thickness of the blocking layer is not particularly limited, but is preferably 3 nm or more, more preferably 5 nm or more, and preferably 100 nm or less, more preferably 30 nm or less.
- the transport layer is a layer that transports carriers (holes and electrons).
- the transport layer is roughly classified into a hole transport layer that transports holes (carriers) and an electron transport layer that transports electrons (carriers).
- the hole transport layer is a layer that transports (injects) holes supplied from the first electrode 2 to the light emitting layer.
- the hole transport layer is provided between the first electrode 2 or the hole injection layer and the light emitting layer.
- the hole transport layer also acts as a barrier that prevents the inflow of electrons from the second electrode 3 side. Therefore, the term hole transport layer may be used in a broad sense to include a hole injection layer and / or an electron blocking layer. Note that only one hole transport layer may be provided, or a plurality of layers may be provided.
- the electron transport layer is a layer that transports (injects) electrons supplied from the second electrode 3 to the light emitting layer.
- the electron transport layer is provided between the second electrode 3 or the electron injection layer and the light emitting layer.
- the electron transport layer also acts as a barrier that prevents the inflow of holes from the first electrode 2. Therefore, the term electron transport layer may be used in a broad sense to include an electron injection layer and / or a hole blocking layer. Note that only one electron transport layer may be provided, or a plurality of layers may be provided.
- an electron transport layer having a single layer structure or a stacked structure as an electron transport material (also serving as a hole blocking material) constituting the electron transport layer provided on the light emitting layer side, electrons injected from the first electrode 2 are used as the light emitting layer.
- electrons injected from the first electrode 2 are used as the light emitting layer.
- intermediate electrodes 7 and 8 are required to have conductivity and translucency, it is desirable to use a metal thin film containing aluminum, silver, magnesium, lithium, calcium, or the like, specifically, a thin film of 20 nm or less.
- a thin film containing a metal compound such as lithium or cesium fluoride can also be used.
- a known method such as a vapor deposition method by resistance heating under vacuum, a sputtering method, or an EB vapor deposition method can be used.
- a vapor deposition method by resistance heating under vacuum a known method
- a sputtering method a sputtering method
- an EB vapor deposition method can be used.
- a vapor deposition method by heating is preferable.
- the film thickness of the intermediate electrodes 7 and 8 depends on the material, but is selected in the range of 1 to 30 nm.
- the exposed portions 71 and 81 are formed in the intermediate electrodes 7 and 8, and the exposed portions 71 and 81 are connected to the external power source via the first extraction wirings 10 and 11, so that the disconnection or high resistance is achieved. Therefore, it is not necessary to form the intermediate electrodes 7 and 8 thick in consideration of the increase in the size. Therefore, in the present invention, it is possible to set the film thickness to 20 nm or less without disconnecting the intermediate electrodes 7 and 8 and increasing the resistance, thereby obtaining good translucency. be able to.
- first lead-out wirings 10 and 11 a low-resistance material needs to be used in order to improve electrical connection.
- a material having a laminated structure of Al or Mo / Al / Mo can be used. However, it is not necessarily limited to these. Further, as the material of the first extraction wirings 10 and 11, the same material as that of the second electrode 3 described above can be used.
- the film thickness of the first extraction wirings 10 and 11 is not particularly limited, but is preferably in the range of 50 to 300 nm, and more preferably in the range of 100 to 300 nm.
- the film thickness of the first extraction wirings 10 and 11 refers to the film thickness in the stacking direction of the elements, and the thickness of the thinnest part and the thickness of the thickest part of the first extraction wirings 10 and 11 are respectively described above. It is preferable that it is set within the range.
- the first lead-out wirings 10 and 11 are formed over the step of each constituent layer of the organic EL element 100, a desired resistance can be ensured even if the thickness is set to 100 nm or more even if the thickness is over the step. A value can be obtained. Further, when the thickness is 300 nm or less, the formation time of the first extraction wirings 10 and 11 can be shortened, the generation of film stress can be suppressed, and peeling can be more reliably prevented.
- the auxiliary wiring 9 is formed in the same manner as the first extraction wirings 10 and 11.
- the second lead-out wirings 12 to 15 are provided to reduce the wiring resistance in the substrate 1 and to improve the connectivity with an external power source. For this reason, it is preferable to use a material having a low resistance and excellent corrosion resistance as the material of the second lead-out wirings 12 to 15, and an Al alloy or an Al alloy protected with a molybdenum layer, a titanium nitride layer, or the like. However, it is not limited to these.
- the second lead-out wirings 12 to 15 As a method for forming the second lead-out wirings 12 to 15, for example, a known spin coating, vapor deposition method, sputtering method or the like can be used as appropriate, and as a patterning method, for example, a known photolithography patterning or pattern mask is used. It is possible to use patterning or the like according to the situation.
- the film thickness of the second lead-out wirings 12 to 15 is not particularly limited, and is preferably 1 ⁇ m or more because the resistance can be reduced. However, from the viewpoint of film formation cost and patterning ease, 300 to 500 nm. It is preferable to select within the range.
- the sealing material covers the organic EL element body (light emitting units 4 to 6 and various electrodes and wiring) on the substrate 1, and the plate-like (film-like) sealing member is bonded to the substrate 1 by an adhesive. It may be fixed on top or a sealing film. In any configuration, the sealing material seals the organic EL element 100 with the end portions of the second extraction wirings 12 to 15 exposed. In the wiring structure such as the organic EL element 100B shown in FIG. 5, the sealing material is in a state where the end portions of the second electrode 3, the auxiliary wiring 9, and the first extraction wirings 10 and 11 are exposed. The organic EL element 100B is sealed.
- the sealing member is composed of a plate-like (film-like) sealing member
- a substantially plate-like base material in which a concave portion is formed on one surface that is, a concave plate-like sealing member is used. It may be used, or a plate-like substrate having a flat surface, that is, a flat sealing member may be used.
- the plate-like (concave plate or flat plate) sealing material is disposed at a position facing the substrate 1 with the organic EL element main body interposed therebetween.
- a transparent substrate such as a glass plate, a polymer plate, or a metal plate
- a transparent substrate such as a glass plate, a polymer plate, or a metal plate
- the glass plate for example, a substrate formed of a material such as alkali-free glass, soda-lime glass, barium / strontium-containing glass, lead glass, aluminosilicate glass, borosilicate glass, barium borosilicate glass, or quartz is used. be able to.
- the board substrate formed with materials, such as a polycarbonate, an acryl, a polyethylene terephthalate, a polyether sulfide, a polysulfone, can be used, for example.
- the metal plate is formed of, for example, one or more metals or alloys selected from the group consisting of stainless steel, iron, copper, aluminum, magnesium, nickel, zinc, chromium, titanium, molybdenum, silicon, germanium, and tantalum. Substrates can be used.
- the gap between the sealing material and the organic EL element body (light emitting units 4 to 6, various electrodes and wiring)
- an inert gas such as nitrogen or argon, or an inert liquid such as fluorinated hydrocarbon or silicon oil.
- gap between a sealing material and an organic EL element main-body part may be made into a vacuum state, and you may enclose a hygroscopic compound in a space
- thermosetting type or chemical hardening type (two-component mixing) adhesives such as an epoxy type, as an adhesive agent.
- a sealing film may be used as the sealing material.
- the sealing film can be composed of a film made of an inorganic material or an organic material.
- the sealing film is made of a material having a function of suppressing intrusion of substances such as moisture and oxygen, which causes deterioration of the light emitting units 4 to 6.
- the material having such properties include inorganic materials such as silicon oxide, silicon dioxide, and silicon nitride.
- the structure of the sealing film may be a multilayer structure in which a film made of these inorganic materials and a film made of an organic material are laminated.
- any method can be used as the method for forming the sealing film described above.
- a vacuum deposition method a sputtering method, a reactive sputtering method, a molecular beam epitaxy method, a cluster ion beam method, an ion plating method, plasma Techniques such as a polymerization method, an atmospheric pressure plasma polymerization method, a plasma CVD method, a laser CVD method, a thermal CVD method, and a coating method can be used.
- the organic EL device according to the present invention may further include a protective film or a protective plate on the sealing material.
- the protective film or the protective plate mechanically protects the organic EL element main body by sandwiching the organic EL element main body (light emitting units 4 to 6, various electrodes and wiring) and a sealing material between the protective film or the protective plate and the substrate 1. It is.
- a sealing film is used as the sealing material, it is preferable that a protective film or a protective plate is provided because mechanical protection of the organic EL element body is not sufficient.
- a glass plate As the protective film or protective plate, a glass plate, a polymer plate, a thin polymer film, a metal plate, a thin metal film, a polymer material film or a metal material film is used.
- a polymer film is preferably used from the viewpoint of light weight and thinning of the element.
- the present invention provides an organic electroluminescence element that has excellent translucency due to the thinning of the intermediate electrode, and that has ensured conductivity by suppressing disconnection and high resistance of the intermediate electrode. Suitable for doing.
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Abstract
Description
有機EL素子は、数V~数十V程度の低電圧で発光が可能な薄膜型の完全固体素子であり、高輝度、高発光効率、薄型、軽量といった多くの優れた特徴を有している。有機EL素子は、一対の電極間に、有機材料からなる発光ユニットが挟持されて構成され、当該発光ユニットで生じた発光光が電極を透過して外部に取り出される。
特に、照明装置のように画素を必要とせず、比較的大面積の発光エリアを有する装置において発光色を任意に変化させようとする場合、この積層方式によれば、発光効率及び製造プロセスにおいて上記二つの方式よりも優れているといえる。
発光ユニット同士の間に介在される中間電極は、各発光ユニットから発光光を効率良く取り出すために薄膜に形成されていることが好ましく、材料にもよるが具体的には20nm以下の膜厚に形成されていることが望ましい。
一方で、中間電極と基板との間には発光ユニットを含む各種構成層が積層されており、中間電極を外部電源と接続させるために引き出すと、当該中間電極が各層の段差を乗り越えるようにパターン形成される必要がある。ここで、中間電極の膜厚が上記20nm以下であると、各層の段差部分で中間電極の断線が生じたり、段差部分で中間電極が薄膜化することで中間電極の厚さの連続性が損なわれ高抵抗化したりするといった問題があった。
つまり、積層方式においては中間電極の高透光性と高導電性の両立が困難であるといった問題があった。
すなわち、本発明に係る上記課題は、以下の手段により解決される。
前記中間電極上に隣接する前記発光ユニットが、積層方向から見て当該中間電極の一部が露出するようにパターン形成され、
前記第一取り出し配線が、前記中間電極の露出された部分に接続されることを特徴とする有機エレクトロルミネッセンス素子。
前記第一取り出し配線が、前記第二取り出し配線に接続されることを特徴とする第1項に記載の有機エレクトロルミネッセンス素子。
本発明の効果の発現機構ないし作用機構は、以下のとおりである。
すなわち、中間電極上に隣接する発光ユニットが、積層方向から見て当該中間電極の一部が露出するようにパターン形成され、第一取り出し配線が、中間電極の露出された部分に接続されることにより、中間電極が段差を越えるようにパターン形成されている必要がなく、各発光ユニット間に平面状に形成されているため十分に薄膜化しても断線や高抵抗化を引き起こすことがない。このため、中間電極の高透光性と高導電性とを両立した有機エレクトロルミネッセンス素子とすることができる。
また、本発明は、基板上に、外部電源に接続される第二取り出し配線が更に設けられ、前記第一取り出し配線が、前記第二取り出し配線に接続されることが好ましい。これにより、有機EL素子における配線抵抗を低抵抗化することができ、また、外部電源との接続性を良好にすることができる。
また、本発明は、前記第一取り出し配線が複数箇所に分割されてパターン形成されていることが好ましい。ここで、第一取り出し配線のパターン形成が、金属マスクを用いた蒸着法により行われる場合、第一取り出し配線が一つの膜として基板上に広面積に形成されるものであると、金属マスクの開口部を大きく設定する必要があり、当該金属マスクの強度低下やたわみが生じ得る。第一取り出し配線が複数箇所に分割してパターン形成されていることにより、金属マスクの開口部を複数個所に分割して形成することができ、金属マスクの強度低下やたわみを抑制することができる。
また、本発明は、前記第二電極と前記第一取り出し配線とが同一の導電性材料からなることが好ましい。これにより、第二電極と第一取り出し配線とを同時に形成することができ、有機EL素子を簡易な構造にすることができる。また、第二電極と第一取り出し配線を一つの工程で形成することができるため、当該有機EL素子を容易に製造することができる。
本発明に係る有機エレクトロルミネッセンス素子(以下「有機EL素子」ともいう。)は、種々の構成を採り得るが、一例を図1~5に示す。図1は、有機EL素子100の平面図、図2は、図1におけるII-II線に沿った面の矢視断面図、図3は、図1におけるIII-III線に沿った面の矢視断面図である。また、図4は、有機EL素子100の変形例である有機EL素子100Aの平面図、図5は、有機EL素子100の更に別の変形例である有機EL素子100Bの平面図である。
同様に、中間電極8の上に隣接する発光ユニット6は、図1及び図2に示すように、各層の積層方向から見て当該中間電極8の一部が露出されるようにパターン形成されている。これにより、中間電極8の一部が露出した露出部81が形成されている。
これら露出部71,81は、第一取り出し配線10,11にそれぞれ接触して、中間電極7,8が第一取り出し配線10,11に電気的に接続されるように形成されていれば良く、その面積等は特に限定されるものではない。
同様に、第一取り出し配線11は、図1及び図2に示すように、中間電極8の露出部81と第二取り出し配線14とを接続するように形成されており、中間電極8を外部電源に接続することができる。
これにより、各発光ユニット4~6に対して個別に電圧を印加することが可能であり、各発光ユニット4~6の発光強度をそれぞれ調整することができる。
図4に示すように、有機EL素子100Aにおいては、補助配線9a及び第一取り出し配線10a,11aがそれぞれ、複数箇所に分割されてパターン形成されているものではなく、所定箇所に一体としてパターン形成されて、連続する一つの膜を形成している。
これにより、補助配線9a及び第一取り出し配線10a,11aのパターン形成工程を簡易にすることができる。
図5に示すように、有機EL素子100Bにおいては、第二取り出し配線が設けられておらず、第二電極3b、補助配線9b及び第一取り出し配線10b,11bが、基板1上の周縁部まで延設されている。
これにより、第二取り出し配線12~15の形成工程が省略され、簡易な構造の有機EL素子100とすることができる。なお、有機EL素子100Bにおいても、上記有機EL素子100Aのように、補助配線9b及び第一取り出し配線10b,11bがそれぞれ、所定箇所に一体として形成され、連続する一つの膜を形成していても良い。
なお、図5に示す有機EL素子100Bにおいては、第二電極3b、補助配線9b及び第一取り出し配線10b,11bの各端部が、互いに絶縁性を保った状態で封止材から露出されている。
上記したように構成される有機EL素子100の製造方法について以下説明する。
また、第二電極3と補助配線9及び第一取り出し配線10,11とが真空蒸着法により同時にパターン形成される場合には、既存の製造装置を用いて有機EL素子100を製造できる。
本発明の有機EL素子100に用いることのできる基板1としては、ガラス、プラスチック等、特に限定はなく、また透明であっても不透明であっても良い。図示例では、基板1側から光を取り出すため、基板1は透明である。好ましく用いられる透明な基板1としては、ガラス、石英、透明樹脂フィルムを挙げることができる。特に好ましくは、有機EL素子100にフレキシブル性を与えることが可能な樹脂フィルムである。
基板1の厚さとしては、特に制限されるものではなく、いずれの厚さであっても良い。
第一電極2は、通常有機EL素子に使用可能な全ての電極を使用することができる。具体的には、アルミニウム、銀、マグネシウム、リチウム、マグネシウム/同混合物、マグネシウム/銀混合物、マグネシウム/アルミニウム混合物、マグネシウム/インジウム混合物、インジウム、リチウム/アルミニウム混合物、希土類金属、ITO、ZnO、SnO2、アルミニウムをドープしたTiO2等の酸化物半導体等が挙げられる。
本発明においては、第一電極2が透明電極であることが好ましく、更には透明金属電極であることが好ましい。なお、第一電極2の透明とは、波長550nmでの光透過率が50%以上であることをいう。
更に、第一電極2の膜厚は材料にもよるが、通常10~1000nm、好ましくは10~200nmの範囲で選ばれる。
第二電極3は、発光ユニット4~6に電子を供給するカソードとして機能する電極膜であり、金属、合金、有機又は無機の導電性化合物、及びこれらの混合物が用いられる。具体的には、アルミニウム、銀、マグネシウム、リチウム、マグネシウム/銅混合物、マグネシウム/銀混合物、マグネシウム/アルミニウム混合物、マグネシウム/インジウム混合物、インジウム、リチウム/アルミニウム混合物、希土類金属、ITO、ZnO、TiO2、SnO2等の酸化物半導体等が挙げられる。第二電極3の材料としては、取扱い性等の観点から、アルミニウム又は銀が好ましい。
発光ユニット4~6は、少なくとも発光に直接関与する発光層を備えている他、例えば、キャリア(正孔及び電子)の注入層、阻止層及び輸送層等の各種有機層を備えている。また、各発光ユニット4~6の厚さは、光取り出し性の観点から、一つの発光ユニットにつき80~200nmの範囲内で形成されていることが好ましい。各発光ユニット4~6の厚さを、80nm以上とすることで、リークをより確実に抑制することができるとともに、耐久性を向上させることができ、200nm以下とすることで駆動電圧の向上を抑制することができる。
(2)正孔輸送層/発光層
(3)正孔輸送層/発光層/電子輸送層
(4)正孔輸送層/発光層/正孔阻止層/電子輸送層
(5)正孔輸送層/発光層/正孔阻止層/電子輸送層/電子注入層(陰極バッファー層)
(6)正孔注入層(陽極バッファー層)/正孔輸送層/発光層/正孔阻止層/電子輸送層/電子注入層
(7)正孔注入層/正孔輸送層/発光層/電子輸送層/電子注入層
発光層は、第一電極2から直接、又は正孔輸送層等を介して注入される正孔と、第二電極3から直接、又は電子輸送層等を介して注入される電子とが再結合することにより、発光する層である。なお、発光する部分は、発光層の内部であっても良いし、発光層とそれに隣接する層との間の界面であっても良い。また、発光層は、一つの発光ユニットに対して複数層設けられていても良い。
注入層は、駆動電圧の低下や発光輝度の向上を図るための層である。注入層は、通常は、電極及び発光層の間に設けられる。注入層は、正孔(キャリア)を注入する正孔注入層(陽極バッファー層)と、電子(キャリア)を注入する電子注入層(陰極バッファー層)とに大別される。正孔注入層は、第一電極2と、発光層又は正孔輸送層との間に設けられる。また、電子注入層は、第二電極3と、発光層又は電子輸送層との間に設けられる。
阻止層は、キャリア(正孔、電子)の輸送を阻止するための層である。阻止層は、正孔(キャリア)の輸送を阻止する正孔阻止層と、電子(キャリア)の輸送を阻止する電子阻止層とに大別される。
なお、正孔阻止層としては、必要に応じて、後述する電子輸送層の構成が同様に適用可能である。更に、正孔阻止層が設けられる場合、正孔阻止層は、発光層に隣接して設けられることが好ましい。
なお、電子阻止層としては、必要に応じて、後述する正孔輸送層の構成が同様に適用可能である。
輸送層は、キャリア(正孔及び電子)を輸送する層である。輸送層は、正孔(キャリア)を輸送する正孔輸送層と、電子(キャリア)を輸送する電子輸送層とに大別される。
中間電極7,8は、導電性と透光性が求められることからアルミニウム、銀、マグネシウム、リチウム又はカルシウム等を含む金属薄膜、具体的には20nm以下の薄膜を用いることが望ましいが、フッ化リチウムやフッ化セシウムなどの金属化合物を含む薄膜を用いることもできる。
第一取り出し配線10,11としては、電気的な接続を良好とするために低抵抗な材料が用いられる必要があり、例えば、AlやMo/Al/Moの積層構造の材料を使うことができるが、特にこれらに限定されるわけではない。また、第一取り出し配線10,11の材料としては、上記した第二電極3と同じ材料を用いることができる。
また、第一取り出し配線10,11の膜厚は特に限定されるものではないが、50~300nmの範囲内であると好ましく、100~300nmの範囲内であるとより好ましい。ここで、第一取り出し配線10,11の膜厚とは、素子の積層方向における膜厚をいい、第一取り出し配線10,11の最も薄い部分の厚さ及び最も厚い部分の厚さがそれぞれ上記範囲内に設定されていることが好ましい。第一取り出し配線10,11は、有機EL素子100の各構成層の段差を乗り越えて形成されるため、厚さを100nm以上とすることで、段差を乗り越えて形成されても確実に所望の抵抗値を得ることができる。また、厚さを300nm以下とすると、第一取り出し配線10,11の形成時間が短縮できるとともに、膜応力の発生を抑制でき剥離をより確実に防止することができる。
第二取り出し配線12~15は、基板1内での配線抵抗の低抵抗化や外部電源との接続性向上のために設けられる。このため、第二取り出し配線12~15の材料としては、低抵抗で耐腐食性に優れたものを使用することが好ましく、Al合金や、Al合金をモリブデン層や窒化チタン層等で保護したものが用いられるが、これらに限定されるものではない。
第二取り出し配線12~15の膜厚は、特に限定されるものではなく、1μm以上であると低抵抗化することができるため好ましいが、成膜コストとパターニング容易性の観点から、300~500nmの範囲内で選択されることが好ましい。
封止材は、基板1上において、有機EL素子本体部(発光ユニット4~6や各種電極及び配線)を覆うものであって、板状(フィルム状)の封止部材が接着剤によって基板1上に固定されるものであっても良いし、封止膜であっても良い。いずれの構成においても封止材は、第二取り出し配線12~15の端部を露出させた状態で、有機EL素子100を封止する。なお、図5に示す有機EL素子100Bのような配線構造においては、封止材は、第二電極3、補助配線9及び第一取り出し配線10,11の各端部を露出させた状態で、有機EL素子100Bを封止する。
封止膜としては、無機材料や有機材料からなる膜で構成することができる。ただし、封止膜は、発光ユニット4~6の劣化をもたらす、水分や酸素等の物質の浸入を抑制する機能を有する材料で構成する。このような性質を有する材料としては、例えば、酸化ケイ素、二酸化ケイ素、窒化ケイ素等の無機材料が挙げられる。更に、封止膜の脆弱性を改良するために、封止膜の構造を、これらの無機材料からなる膜と、有機材料からなる膜とを積層した多層構造としても良い。
本発明に係る有機EL素子は、封止材の上に保護膜又は保護板を更に備えていても良い。
保護膜又は保護板は、基板1との間に有機EL素子本体部(発光ユニット4~6、各種電極及び配線)及び封止材を挟んで、有機EL素子本体部を機械的に保護するものである。特に、封止材として封止膜が用いられている場合には、有機EL素子本体部に対する機械的な保護が十分ではないため、保護膜又は保護板が設けられていることが好ましい。
2 第一電極
3,3b 第二電極
4~6 発光ユニット
7,8 中間電極
9,9a,9b 補助配線
10,10a,10b,11,11a,11b 第一取り出し配線
12~15 第二取り出し配線
71,81 露出部
100,100A,100B 有機EL素子
Claims (7)
- 基板上に形成された第一電極と、前記第一電極に対向する第二電極との間に、少なくとも発光層を含む発光ユニットが複数積層され、前記発光ユニット同士の間に設けられた中間電極が第一取り出し配線を介して外部電源に接続されることで、前記発光ユニットがそれぞれ独立に発光する有機エレクトロルミネッセンス素子であって、
前記中間電極上に隣接する前記発光ユニットが、積層方向から見て当該中間電極の一部が露出するようにパターン形成され、
前記第一取り出し配線が、前記中間電極の露出された部分に接続されることを特徴とする有機エレクトロルミネッセンス素子。 - 前記基板上に、外部電源に接続される第二取り出し配線が更に設けられ、
前記第一取り出し配線が、前記第二取り出し配線に接続されることを特徴とする請求項1に記載の有機エレクトロルミネッセンス素子。 - 前記第一取り出し配線が複数個所に分割されてパターン形成されていることを特徴とする請求項1又は請求項2に記載の有機エレクトロルミネッセンス素子。
- 前記第二電極と前記第一取り出し配線とが同一の導電性材料からなることを特徴とする請求項1から請求項3までのいずれか一項に記載の有機エレクトロルミネッセンス素子。
- 複数積層された前記発光ユニットのうち少なくとも一つが異なる発光色であることを特徴とする請求項1から請求項4までのいずれか一項に記載の有機エレクトロルミネッセンス素子。
- 複数積層された前記発光ユニットの発光強度を各々調整することで外部に取り出される発光光の発光色を調整可能であることを特徴とする請求項5に記載の有機エレクトロルミネッセンス素子。
- 前記中間電極が、アルミニウム、銀、マグネシウム及びカルシウムから選択される少なくとも1種の金属元素を含有することを特徴とする請求項1から請求項6までのいずれか一項に記載の有機エレクトロルミネッセンス素子。
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