WO2014173089A1 - 取向膜预固化设备 - Google Patents

取向膜预固化设备 Download PDF

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Publication number
WO2014173089A1
WO2014173089A1 PCT/CN2013/085111 CN2013085111W WO2014173089A1 WO 2014173089 A1 WO2014173089 A1 WO 2014173089A1 CN 2013085111 W CN2013085111 W CN 2013085111W WO 2014173089 A1 WO2014173089 A1 WO 2014173089A1
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WO
WIPO (PCT)
Prior art keywords
support
alignment film
needle
film pre
substrate
Prior art date
Application number
PCT/CN2013/085111
Other languages
English (en)
French (fr)
Inventor
王平
金相旭
左长云
张建政
方园
Original Assignee
合肥京东方光电科技有限公司
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 合肥京东方光电科技有限公司, 京东方科技集团股份有限公司 filed Critical 合肥京东方光电科技有限公司
Priority to US14/235,278 priority Critical patent/US20150323249A1/en
Publication of WO2014173089A1 publication Critical patent/WO2014173089A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • F26B3/18—Drying solid materials or objects by processes involving the application of heat by conduction, i.e. the heat is conveyed from the heat source, e.g. gas flame, to the materials or objects to be dried by direct contact
    • F26B3/20—Drying solid materials or objects by processes involving the application of heat by conduction, i.e. the heat is conveyed from the heat source, e.g. gas flame, to the materials or objects to be dried by direct contact the heat source being a heated surface, e.g. a moving belt or conveyor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B23/00—Heating arrangements
    • F26B23/04—Heating arrangements using electric heating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
    • F26B25/001—Handling, e.g. loading or unloading arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Definitions

  • Embodiments of the present invention relate to an oriented film pre-curing apparatus. Background technique
  • the alignment film pre-curing device is a device which heats the substrate at a low temperature and then pre-cures the alignment film after the alignment film is printed, before the high-temperature curing.
  • the substrate is pre-cured by a hot plate heating method.
  • a conventional alignment film pre-curing apparatus includes a table 10, a heating plate 20 disposed under the table, and a plurality of support pins 30 disposed on the table 10 for supporting the substrate 40.
  • the conventional support pin 30 has a tip diameter of 1.8 mm.
  • Embodiments of the present invention provide an oriented film pre-curing apparatus which can avoid affecting the quality of an oriented film and the quality of a display screen.
  • An alignment film pre-curing apparatus comprising: a work table, a heating plate disposed under the work surface, and a plurality of support pins, the plurality of support pins are for supporting the substrate, and the plurality of support pins Provided between the substrate and the worktable, a diameter of a top end of each of the plurality of support pins is in a range of 0.5 to 0.8 mm, and at least a top end of the support pin is included in each of the support pins
  • the part is made of a heat resistant thermal insulating material.
  • the heat resistant thermal insulation material has a heat resistance temperature between 50 and 340 ° C and a heat transfer coefficient between 0 and 0.5 w/m 2 .k.
  • each of the support pins includes a support post and a support needle, the support post being located below the support needle and for supporting the support needle, wherein the support needle is insulated by the heat resistant heat Made of materials.
  • the tip of the support needle has a diameter of about 0.5 mm.
  • the support post is made of a stainless steel SUS material.
  • the support needle is conical and the support post is cylindrical.
  • the heat resistant thermal insulating material is polyetherether copper, or polyimide.
  • the plurality of support pins pass through the table and the heating plate.
  • the alignment film pre-curing apparatus further includes a fixing device located below the heating plate and used to fix the support pin, and the fixing device is not in contact with the heating plate.
  • the alignment film pre-curing apparatus further includes a lifting device for driving the fixing device to ascend and descend.
  • the alignment film pre-curing apparatus further includes an exhaust device disposed around the table, and a distance between the exhaust device and the support pin is greater than a thickness of the substrate.
  • FIG. 1 is a schematic structural view of a conventional alignment film pre-curing device
  • FIG. 2 is a schematic structural view of an alignment film pre-curing device according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural view of an alignment film pre-curing device according to Embodiment 2 of the present invention.
  • FIG. 4 is a schematic structural view of an alignment film pre-curing device including a fixing device according to an embodiment of the present invention
  • FIG. 5 is a schematic structural view of an alignment film pre-curing device including a lifting device according to an embodiment of the present invention
  • Figure 6 is a schematic view showing the structure of an oriented film pre-curing device according to a third embodiment of the present invention.
  • An embodiment of the present invention provides an alignment film pre-curing apparatus including a table 10, a heating plate 20 disposed under the table 10, and a plurality of support pins 30 for The substrate 40 is supported, and the plurality of support pins 30 are disposed between the substrate 40 and the table 10.
  • the diameter of the top end of each of the plurality of support pins 30 is in the range of 0.5 to 0.8 mm, and a portion of each of the support pins 30 including at least the tip end of the support pin is made of a heat resistant heat insulating material.
  • the heat resistant thermal insulating material has a heat resistance temperature of 50 to 340 ° C and a heat transfer coefficient of 0 to 0.5 w/m 2 ⁇ k.
  • the heat resistant thermal insulating material is not limited.
  • it may be a polyether ether ketone (PEEK), or a polyimide (polyimide, PI), which has a high temperature resistance and a low thermal conductivity; or may be other heat resistance such as quartz. Materials that are high and have poor heat conduction are not limited here.
  • the number of the plurality of support pins 30 is not limited herein, and can be set according to actual needs.
  • the distribution of the plurality of support pins 30 is not limited herein as long as it can ensure that the supported substrate 40 does not bend when pre-cured.
  • the lengths of the plurality of support pins 30 are equal, and the length thereof is set according to actual needs, and is not limited herein.
  • the substrate 40 refers to a substrate including an alignment film.
  • the diameter of the tip end of the support pin is in the range of 0.5 to 0.8 mm, wherein the top end refers to the top end surface of the support pin 30 in contact with the substrate 40; wherein the diameter refers to: when the top end is circular, It is the diameter of the circle, and when the tip is non-circular, it is the longest distance of any two points on the non-circle.
  • a portion of each of the support pins 30 including at least the tip end of the support pin is made of the heat resistant heat insulating material.
  • the entire support pin 30 may be made of a heat resistant thermal insulating material PEEK or The PI is made so that the support pin 30 can be formed at one time, and the process is relatively simple; however, it is also possible to select that the portion of the support pin 30 including the tip end of the support pin is made of the heat-resistant heat insulating material, and the rest can be The choice is made of other materials that are resistant to high temperatures, for example, made of stainless steel SUS material.
  • the length of a portion of the top end including the support pin made of the heat resistant thermal insulating material it is possible to select a range as long as possible within the cost control range.
  • the amount of heat transmitted to the surface of the substrate 40 via the support pins 30 can be reduced as much as possible.
  • An embodiment of the present invention provides an alignment film pre-curing device including a work table 10, a heating plate 20 disposed under the work table 10, and a plurality of support pins 30 for supporting The substrate 40, and the plurality of support pins 30 are disposed between the substrate 40 and the table 10.
  • a diameter of a tip end of each of the plurality of support pins 30 is in a range of 0.5 to 0.8 mm, and a portion of each of the support pins 30 including at least a tip end of the support pin is made of a heat resistant thermal insulating material. production.
  • each support pin with the substrate 40 since the contact area of the top end of each support pin with the substrate 40 is small, and since the heat resistant heat insulating material has characteristics of high temperature resistance and low heat transfer coefficient, the transfer of the support pin 30 to the surface of the substrate 40 can be reduced. The heat. Therefore, all the positions of the substrate 40 can be uniformly heated, so that the alignment film solution is volatilized to avoid affecting the quality of the alignment film, thereby avoiding the phenomenon of poor picture quality.
  • the heat resistant thermal insulating material is PEEK, or PI.
  • An embodiment of the present invention provides an alignment film pre-curing device, as shown in FIG. 2, which includes a work table 10, a heating plate 20 disposed under the work table 10, and a plurality of support pins 30, the plurality of A support pin is used to support the substrate 40, and the plurality of support pins 30 are disposed between the substrate 40 and the table 10.
  • each of the plurality of support pins 30 is about 0.5 mm, and each of the support pins 30 is made of PEEK or PI.
  • the high temperature resistance of PI is reflected in its long-term use at 300 °C; the high temperature resistance of PEEK is reflected in its long-term use at 250 °C.
  • PI thermal conductivity was 0.3w / m 2 -k, the thermal conductivity of PEEK is 0.25w / m 2 -k.
  • each of the support pins 30 includes a support post 302 and a support pin 301.
  • the support post 302 is located below the support pin 301 and is used to support the support pin 301.
  • the support pin 301 is the Made of heat-resistant thermal insulation material.
  • the lengths of the supporting needle 301 and the supporting column 302 are set according to actual needs, and the length of the supporting needle 301 is as long as possible.
  • the tip end of the support needle 301 has a diameter of about 0.5 mm.
  • the support post 302 is made of a stainless steel SUS material.
  • Stainless steel SUS is resistant to corrosion by weak corrosive media such as air, steam, water, and chemically etched media such as acids, alkalis, and salts, and is relatively inexpensive.
  • weak corrosive media such as air, steam, water, and chemically etched media such as acids, alkalis, and salts
  • the heat transfer coefficient is relatively large relative to PEEK or PI, since the support post 302 of the stainless steel SUS material is located below the support needle 301, and the length of the support post 302 and the support needle 301 can be appropriately set, the support can also be reduced. The effect of the needle 30 passing to the corresponding heat on the surface of the substrate 40.
  • the support column 302 is made of a relatively inexpensive stainless steel SUS material, the cost of supporting the needle 30 can be saved.
  • the support needle 301 is conical, and the support post 302 is cylindrical.
  • Embodiment 2
  • the pre-curing device includes a work table 10, a heating plate 20 disposed under the table 10, and a plurality of support pins 30.
  • a plurality of support pins 30 are used to support the substrate 40, and the plurality of support pins 30 are disposed between the substrate 40 and the table 10.
  • Each support pin 30 includes a support needle 301 and a support post 302, and the support post 302 is located at the support pin Below the head 301, and for supporting the support needle 301.
  • the support needle 301 is conical and has a tip having a diameter of about 0.5 mm; the support post 302 is cylindrical.
  • the support needle 301 is made of PEEK, or PI material; the support post 302 is made of stainless steel SUS material.
  • the supporting needle 301 made of PEEK or PI can reduce the amount of heat transmitted to the surface of the substrate 40 via the supporting pin 30.
  • the diameter of the tip end of the supporting needle 301 is only about 0.5 mm, that is, the contact area of each of the supporting pins 30 with the substrate 40 is small, heat transferred to the corresponding portion of the surface of the substrate 40 can be further reduced, thereby making the substrate 40 Uniform heating can be achieved at all positions, and the alignment film solution can be uniformly volatilized to avoid affecting the quality of the alignment film, thereby avoiding the phenomenon of poor picture quality.
  • the alignment film pre-curing apparatus further includes a fixing device 50 located below the heating plate and for fixing the support pin 30, and the fixing device 50 is not heated The board 20 is in contact.
  • the fixing device 50 may be a flat plate, and the bottom end of the support post 302 of the plurality of support pins 30 may be fixed to the fixing device 50.
  • the fixing device 50 can function to fix the support pin 30.
  • the plurality of support pins 30 pass through the table 10 and the heating plate 20.
  • a plurality of hollow regions may be provided on the table 10 and the heating plate 20, and the hollow region on the table 10 corresponds to the hollow region on the heating plate 20, so that when the support pin 30 is provided, the support can be supported.
  • Portions of the needle 30 are disposed in the hollow regions in the table 10 and the heater plate 20, for example, a portion is located above the table 10 and the remainder is located below the heater plate 20.
  • the alignment film pre-curing device further includes a lifting device 60, the lifting device
  • a lifting device 60 for driving the lifting and lowering of the fixing device 50 may be provided below the fixing device 50.
  • the support pin 30 fixed to the fixing device 50 can be driven to operate.
  • the lifting device 60 drives the fixing device 50 to move the supporting pin 30 thereon to a certain position
  • the substrate 40 is heated to volatilize the alignment film solution to perform a pre-cure operation;
  • the operation of picking and placing the substrate 40 can be performed by the upstream and downstream robots.
  • the alignment film pre-curing apparatus further includes an exhaust device 70 disposed around the table 10, and a distance between the exhaust device 70 and the support pin 30 is greater than a thickness of the substrate 40.
  • the distance between the exhaust device 70 and the support pin 30 is greater than the thickness of the substrate 40, meaning that it does not come into contact with the exhaust device 70 regardless of the position of the substrate 40 supported by the support pin 30. .
  • the exhaust unit 70 can continuously discharge the gas, on the one hand, the position of the substrate 40 can be further uniformly heated, and on the other hand, the solvent in the alignment film solution can be volatilized.
  • an embodiment of the present invention provides an alignment film pre-curing device, which includes: a work table 10 , a heating plate 20 disposed under the work table 10 , and a plurality of support pins 30 .
  • the plurality of support pins 30 are used to support the substrate 40, and the plurality of support pins 30 are disposed between the substrate 40 and the table 10 and pass through the table 10 and the heating plate 20.
  • the alignment film pre-curing apparatus further includes: a fixing device 50 that fixes the support pin 30, a lifting device 60 that drives the fixing device 50 to elevate, and an exhaust device 70 disposed around the table 10.
  • Each of the support pins 30 includes a support needle 301 and a support column 302, and the support column
  • the fixture 50 is located below the heating plate 20 and is not in contact with the heating plate.
  • the support needle 301 is conical and has a tip having a diameter of about 0.5 mm; the post 302 is cylindrical.
  • the support needle 301 is made of PEEK, or PI material; the support post 302 is made of stainless steel SUS material.
  • the length of the support pin 30 can be selected to be about 144.2 mm. Considering the cost factor of supporting the needle 301, the length of the support needle 301 can be set to about 20 mm. In this case, the support post 302 The length is about 124.2 mm.
  • the length of the support pin 30 and the length of the support needle 301 and the support post 302 can be set according to actual needs, and the length of the support needle 301 is as long as possible.
  • the support needle 301 made of PEEK or PI can reduce the amount of heat passing through the support pin 30 to the surface of the substrate 40.
  • the diameter of the tip end of the supporting needle 301 is only about 0.5 mm, that is, the contact area of each of the supporting pins 30 with the substrate 40 is small, heat transferred to the corresponding portion of the surface of the substrate 40 can be further reduced, thereby making the substrate 40 All positions can be hooked up, so that the alignment film solution is volatilized to avoid affecting the quality of the alignment film, thereby avoiding the phenomenon of poor picture quality.
  • the above description is only an exemplary embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Many variations and substitutions are obvious to those skilled in the art within the scope of the present disclosure, and such changes or substitutions are intended to be included within the scope of the present invention.

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  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
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Abstract

一种取向膜预固化设备，该取向膜预固化设备包括工作台（10），设置于所述工作台（10）下方的加热板（20），以及多个支撑针（30），所述多个支撑针（30）用于支撑基板（40），所述多个支撑针（30）设置于所述基板（40）和所述工作台（10）之间，所述多个支撑针（30）中每一个支撑针（30）的顶端的直径在0.5〜0.8mm范围内，以及所述每一个支撑针（30）中至少包括支撑针（30）的顶端的部分由耐热热绝缘材料制成。

Description

取向膜预固化设备 技术领域
本发明的实施例涉及一种取向膜预固化设备。 背景技术
取向膜预固化设备是在取向膜印刷后， 高温固化前， 对基板进行 中低温加热， 使取向膜干燥预固化的设备。 目前， 一般采用热板式加 热方式对基板进行预固化。
例如， 如图 1所示， 常规的取向膜预固化设备包括工作台 10 , 设 置在工作台下方的加热板 20 ,以及设置在工作台 10上的若干个支撑针 30 , 用以支撑基板 40。 常规的支撑针 30顶端直径为 1.8mm。
然而， 由于加热板 20加热后， 会造成支撑针 30的温度高于周围 环境温度， 导致与支撑针 30接触的涂覆有取向膜的基板 40的表面取 向膜溶液因温度高而较快地挥发掉， 影响取向膜的质量， 会使显示器 出现亮点， 导致显示器出现画面品质不良 （mum ) 现象。 发明内容
本发明的实施例提供一种取向膜预固化设备， 其可避免影响取向 膜的质量及显示器画面品质。
根据本发明的一个方面，
提供一种取向膜预固化设备， 其包括： 工作台， 设置于所述工作 台下方的加热板， 以及多个支撑针， 所述多个支撑针用于支撑基板， 且所述多个支撑针设置于所述基板和所述工作台之间， 所述多个支撑 针中每一个支撑针的顶端的直径在 0.5 ~ 0.8mm范围内， 并且所述每一 个支撑针中至少包括支撑针的顶端的部分由耐热热绝缘材料制成。
在一个示例中， 所述耐热热绝缘材料的耐热温度在 50 ~ 340 °C之 间， 热传导系数在 0 ~ 0.5 w/m2.k之间。
在一个示例中， 所述每一个支撑针包括支撑柱和支撑针头， 所述 支撑柱位于所述支撑针头的下方， 并用于支撑所述支撑针头， 其中所 述支撑针头由所述耐热热绝缘材料制成。 在一个示例中， 所述支撑针头的顶端直径为约 0.5mm。 在一个示例中， 所述支撑柱由不锈钢 SUS材料制成。
在一个示例中， 所述支撑针头为圓锥形， 所述支撑柱为圓柱型。 在一个示例中， 所述耐热热绝缘材料为聚醚醚铜， 或聚酰亚胺。 在一个示例中， 所述多个支撑针穿过所述工作台和所述加热板。 在一个示例中， 所述取向膜预固化设备还包括固定装置， 所述固 定装置位于所述加热板下方并用于固定所述支撑针， 并且所述固定装 置不与所述加热板接触。
在一个示例中， 所述取向膜预固化设备还包括升降装置， 所述升 降装置用于驱动所述固定装置进行升降。
在一个示例中， 所述取向膜预固化设备还包括设置于所述工作台 周围的排气装置， 且所述排气装置与所述支撑针之间的距离大于所述 基板的厚度。 附图说明
以下将结合附图对本发明的实施例进行更详细的说明， 以使本领域普通 技术人员更加清楚地理解本发明， 其中：
图 1为常规的取向膜预固化设备的结构示意图；
图 2 为本发明实施例一提供的一种取向膜预固化设备的结构示意 图；
图 3 为本发明实施例二提供的一种取向膜预固化设备的结构示意 图；
图 4 为本发明实施例提供的一种包括固定装置的取向膜预固化设 备的结构示意图；
图 5 为本发明实施例提供的一种包括升降装置的取向膜预固化设 备的结构示意图；
图 6 为本发明实施例三提供的一种取向膜预固化设备的结构示意 图。
附图标记：
10-工作台； 20-加热板； 30-支撑针， 301-支撑针头， 302-支撑柱；
40-基板； 50-固定装置； 60-升降装置； 70-排气装置。 具体实施方式
为了使本发明的实施例的目的、 技术方案和优点更加清楚， 下面将结合 本发明实施例中的附图， 对本发明实施例中的技术方案进行清楚、 完整地描 述。 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是全部的实施 例。 基于本发明中的实施例， 本领域普通技术人员在无需做出创造性劳动前 提下所获得的所有其它实施例， 都属于本发明保护的范围。
本发明的实施例提供了一种取向膜预固化设备，其包括工作台 10 , 设置于所述工作台 10下方的加热板 20 , 以及多个支撑针 30 , 所述多 个支撑针 30用于支撑基板 40 , 并且所述多个支撑针 30设置于所述基 板 40和所述工作台 10之间。 所述多个支撑针 30中每一个支撑针的顶 端的直径在 0.5 ~ 0.8mm范围内， 并且所述每一个支撑针 30中至少包 括支撑针的顶端的部分由耐热热绝缘材料制成。
例如， 所述耐热热绝缘材料的耐热温度在 50 ~ 340 °C之间， 热传导 系数在 0 ~ 0.5w/m2.k之间。
需要说明的是， 第一， 对于所述耐热热绝缘材料不进行限制。 例 如可以是聚醚醚铜（Polyether ether ketone , 筒称 PEEK) , 或聚酰亚胺 ( polyimide, 筒称 PI ) 等具有耐高温且低热传导系数的塑料材料； 也 可以是石英等其他耐热性高且热传导不良的材料， 在此不做限制。
第二， 多个支撑针 30的数量在此不做限制， 可以根据实际需要进 行设定。
第三， 多个支撑针 30的分布情况在此不做限制， 只要能保证被支 撑的基板 40在预固化时不发生弯曲即可。
第四， 多个支撑针 30的长度均相等， 其长度根据实际需要进行设 定， 在此不做限制。
第五， 在本发明所有实施例中， 所述基板 40均指包括取向膜的基 板。
第六， 所述支撑针的顶端的直径在 0.5 ~ 0.8mm范围内， 其中顶端 是指所述支撑针 30与基板 40接触的顶端面； 其中的直径是指： 在该 顶端为圓形时， 为该圓的直径， 而在该顶端为非圓形时， 为该非圓上 任意两点的最长距离。 第七， 每一个支撑针 30中至少包括支撑针的顶端的部分由所述耐 热热绝缘材料制成， 例如， 如果不考虑生产成本， 整个支撑针 30可以 均由耐热热绝缘材料 PEEK或 PI制成， 这样所述支撑针 30可以一次 成型， 工艺相对筒单； 当然也可以选择将支撑针 30中包括支撑针的顶 端的部分由所述耐热热绝缘材料制成， 而其余部分可以选择由其它耐 高温的材料制成， 例如， 由不锈钢 SUS材料制成。
对于由所述耐热热绝缘材料制成的包括支撑针的顶端的一部分的 长度， 在成本控制范围内， 可以选择尽可能比较长的范围。 这样， 可 以尽可能多地减少经支撑针 30传至基板 40表面相应处的热量。
本发明实施例提供了一种取向膜预固化设备， 其包括工作台 10 , 设置于所述工作台 10下方的加热板 20, 以及多个支撑针 30, 所述多 个支撑针 30用于支撑基板 40, 并且所述多个支撑针 30设置于所述基 板 40和所述工作台 10之间。 例如， 所述多个支撑针 30中的每一个支 撑针的顶端的直径在 0.5 ~ 0.8mm 范围内， 并且所述每一个支撑针 30 中至少包括支撑针的顶端的部分由耐热热绝缘材料制成。 这样， 由于 每一个支撑针的顶端与基板 40的接触面积较小， 同时由于所述耐热热 绝缘材料具有耐高温以及低热传导系数的特性， 可减少经支撑针 30传 至基板 40表面相应处的热量。 因此， 使得基板 40所有位置可以实现 均匀受热， 从而使取向膜溶液均勾挥发， 避免影响取向膜的质量， 进 而避免出现画面品质不良的现象。
例如， 所述耐热热绝缘材料为 PEEK, 或 PI。
实施例一
本发明实施例提供了一种取向膜预固化设备， 如图 2所示， 其包 括工作台 10 , 设置于所述工作台 10下方的加热板 20 , 以及多个支撑 针 30, 所述多个支撑针用于支撑基板 40, 并且所述多个支撑针 30设 置于所述基板 40和所述工作台 10之间。
所述多个支撑针 30中每一个支撑针的顶端的直径为约 0.5mm, 并 且所述每一个支撑针 30均由 PEEK或 PI制成。
这样， 一方面， 由于 PEEK或 PI均具有耐高温及低热传导系数的 特性， 当每一个支撑针 30均由 PEEK或 PI制成时， 可减少经支撑针 30传至基板 40表面相应处的热量。 另一方面， 由于每一个支撑针的顶 端的直径只有约 0.5mm, 即每一个支撑针 30与基板 40的接触面积较 小， 可进一步减小传至基板 40表面相应处的热量， 从而使得基板 40 所有位置可以实现均匀受热， 进而可以使取向膜溶液均匀挥发， 避免 影响取向膜的质量， 进而避免出现画面品质不良的现象。
PI的耐高温特性体现在其可以在 300 °C温度下长期使用； PEEK的 耐高温特性体现在其可以在 250°C温度下长期使用。 PI 的热传导系数 为 0.3w/m2-k, PEEK的热传导系数为 0.25w/m2-k。
进一步的，所述每一个支撑针 30包括支撑柱 302和支撑针头 301 , 所述支撑柱 302位于所述支撑针头 301 的下方， 并用于支撑所述支撑 针头 301 , 所述支撑针头 301为所述耐热热绝缘材料制成。
此处需要说明的是， 所述支撑针头 301和支撑柱 302的长度根据 实际需要进行设定， 以所述支撑针头 301的长度尽可能长为优。
考虑到制备支撑针头 301 的工艺复杂度， 在该工艺能满足要求的 情况下， 例如， 所述支撑针头 301的顶端的直径为约 0.5mm。
例如， 所述支撑柱 302为不锈钢 SUS材料制成。
不锈钢 SUS具有耐空气、 蒸汽、 水等弱腐蚀性介质和酸、 碱、 盐 等化学浸蚀性介质腐蚀的特性， 并且价格相对较便宜。 虽然其热传导 系数相对 PEEK或 PI较大， 但由于不锈钢 SUS材料的支撑柱 302位 于支撑针头 301 的下方， 并且可以通过合理设置支撑柱 302和支撑针 头 301的长度， 因此， 同样可以达到减少经支撑针 30传至基板 40表 面相应处的热量的效果。
这样， 在保证能使基板 40所有位置实现均勾受热， 从而使取向膜 溶液均勾挥发的基础上， 由于所述支撑柱 302使用相对便宜的不锈钢 SUS材料制成， 可以节省支撑针 30的成本。
例如， 所述支撑针头 301为圓锥形， 所述支撑柱 302为圓柱型。 实施例二
本发明实施例提供了一种取向膜预固化设备， 如图 3 所示， 该预 固化设备包括工作台 10, 设置于所述工作台 10下方的加热板 20, 以 及多个支撑针 30 , 所述多个支撑针 30用于支撑基板 40, 并且所述多 个支撑针 30设置于所述基板 40和所述工作台 10之间。 每一个支撑针 30包括支撑针头 301和支撑柱 302 , 所述支撑柱 302位于所述支撑针 头 301的下方， 并且用于支撑所述支撑针头 301。
所述支撑针头 301 为圓锥形， 并且其顶端的直径为约 0.5mm; 所 述支撑柱 302为圓柱型。 所述支撑针头 301由 PEEK, 或 PI材料制成； 所述支撑柱 302由不锈钢 SUS材料制成。
这样， 一方面， 由于 PEEK或 PI具有耐高温及低热传导系数的特 性， 因此， 由 PEEK或 PI制成的支撑针头 301可减少经支撑针 30传 至基板 40表面相应处的热量。 另一方面， 由于支撑针头 301的顶端的 直径只有约 0.5mm, 即每一个支撑针 30与基板 40的接触面积较小， 可进一步减小传至基板 40表面相应处的热量， 从而使得基板 40所有 位置可以实现均匀受热， 进而可以使取向膜溶液均匀挥发， 避免影响 取向膜的质量， 进而避免出现画面品质不良的现象。
所述多个支撑针 30穿过所述工作台 10和所述加热板 20。 在此情 况下， 所述取向膜预固化设备还包括固定装置 50 , 所述固定装置 50 位于所述加热板下方并且用于固定所述支撑针 30, 而且所述固定装置 50不与所述加热板 20接触。
例如， 如图 4所示， 固定装置 50可以是一块平板， 所述多个支撑 针 30的支撑柱 302的底端可以固定在固定装置 50上。 这样， 该固定 装置 50便可以起到固定所述支撑针 30的作用。
此处， 所述多个支撑针 30穿过所述工作台 10和所述加热板 20。 例如， 可以在工作台 10和加热板 20上设置多个空心区域， 并且工作 台 10上的空心区域与加热板 20上的空心区域相对应， 这样， 在设置 支撑针 30时，便可以将支撑针 30的部分设置在工作台 10和加热板 20 中的空心区域中， 例如， 一部分位于工作台 10上方， 其余部分位于加 热板 20下方。
例如， 所述取向膜预固化设备还包括升降装置 60 , 所述升降装置
60用于驱动所述固定装置 50进行升降。
如图 5所示的示例， 可以在固定装置 50下方设置用于驱动所述固 定装置 50升降的升降装置 60。
这样， 便可以带动固定在固定装置 50上的支撑针 30进行动作。 当该升降装置 60带动固定装置 50使其上的支撑针 30移动到一定位置 后， 基板 40受热使取向膜溶液挥发， 以进行预固化操作； 当该升降装 置 60带动固定装置 50使其上的支撑针 30穿过工作台 10上升到一定 位置后， 便可由上下游机器人进行取放基板 40的操作。
例如， 所述取向膜预固化设备还包括设置于所述工作台 10周围的 排气装置 70 , 并且所述排气装置 70与所述支撑针 30之间的距离大于 所述基板 40的厚度。
此处， 排气装置 70与所述支撑针 30之间的距离大于所述基板 40 的厚度， 是指不管被支撑针 30支撑的基板 40位于哪个位置， 都不会 与排气装置 70接触到。
由于排气装置 70可以不断地排出气体， 一方面可以进一步使得基 板 40所有位置实现均匀受热， 另一方面可以促进取向膜溶液中的溶剂 挥发。
实施例三
如图 6所示， 本发明实施例提供了一种取向膜预固化设备， 该预 固化设备包括： 工作台 10 , 设置于所述工作台 10下方的加热板 20 , 以及多个支撑针 30 , 所述多个支撑针 30用于支撑基板 40 , 并且所述 多个支撑针 30设置于所述基板 40和所述工作台 10之间并穿过工作台 10和所述加热板 20。 所述取向膜预固化设备还包括： 固定所述支撑针 30的固定装置 50 , 驱动所述固定装置 50升降的升降装置 60 , 以及设 置在所述工作台 10周围的排气装置 70。
所述每一个支撑针 30包括支撑针头 301和支撑柱 302 , 所支撑柱
302位于所述支撑针头 301的下方， 并用于支撑所述支撑针头 301。 所 述固定装置 50位于所述加热板 20下方并且不与所述加热板接触。
所述支撑针头 301 为圓锥形， 并且其顶端的直径为约 0.5mm; 所 述支柱 302为圓柱型。 所述支撑针头 301由 PEEK, 或 PI材料制成； 所述支撑柱 302由不锈钢 SUS材料制成。
在本实施例中， 可以选择将所述支撑针 30 的长度设置为约 144.2mm, 考虑支撑针头 301的成本因素， 可以将支撑针头 301的长度 设置为约 20mm, 在此情况下， 支撑柱 302的长度则为约 124.2mm。
需要说明的是， 对于所述支撑针 30的长度， 以及支撑针头 301和 支撑柱 302 的长度可以根据实际需要进行设定， 以所述支撑针头 301 的长度尽可能长为优。 这样， 一方面， 由于 PEEK或 PI具有耐高温及低热传导系数的特 性， 因此， 由 PEEK或 PI制成的支撑针头 301便可减少经支撑针 30 至基板 40表面相应处的热量。 另一方面， 由于支撑针头 301的顶端的 直径只有约 0.5mm, 即每一个支撑针 30与基板 40的接触面积较小， 可进一步减小传至基板 40表面相应处的热量， 从而使得基板 40所有 位置可以实现均勾受热， 进而使取向膜溶液均勾挥发， 避免影响取向 膜的质量， 进而避免出现画面品质不良的现象。 以上所述仅为本发明的示例性实施方式， 但本发明的保护范围并 不局限于此。 本技术领域的普通技术人员在本发明公开的范围内， 可 容易想到许多变化或替换， 而这些变化或替换都应涵盖在本发明的保 护范围之内。

Claims

权利要求书
1、 一种取向膜预固化设备， 包括：
工作台，
设置于所述工作台下方的加热板， 以及
多个支撑针， 所述多个支撑针用于支撑基板， 所述多个支撑针设 置于所述基板和所述工作台之间， 所述多个支撑针中每一支撑针的顶 端的直径在 0.5 ~ 0.8mm范围内， 以及所述每一个支撑针中至少包括支 撑针的顶端的部分由耐热热绝缘材料制成。
2、 根据权利要求 1所述的取向膜预固化设备， 其中， 所耐热热绝 缘材料的耐热温度在 50 ~ 340 °C之间，以及热传导系数在 0 ~ 0.5w/m2-k 之间。
3、 根据权利要求 1或 2所述的取向膜预固化设备， 其中， 所述每 一个支撑针包括支撑柱和支撑针头， 所述支撑柱位于所述支撑针头的 下方， 并用于支撑所述支撑针头， 以及所述支撑针头由所述耐热热绝 缘材料制成。
4、 根据权利要求 1-3任一项所述的取向膜预固化设备， 其中所述 支撑针头的顶端的直径约为 0.5mm。
5、 根据权利要求 1-4任一项所述的取向膜预固化设备， 其中所述 支撑柱由不锈钢 SUS材料制成。
6、 根据权利要求 1-5任一项所述的取向膜预固化设备， 其中所支 撑针头为圓锥形， 以及所述支撑柱为圓柱型。
7、 根据权利要求 1-6任一项所述的取向膜预固化设备， 其中所述 耐热热绝缘材料为聚醚醚铜， 或聚酰亚胺。
8、 根据权利要求 7所述的取向膜预固化设备， 其中所述多个支撑 针穿过所述工作台和所述加热板。
9、 根据权利要求 8所述的取向膜预固化设备， 还包括固定装置， 所述固定装置位于所述加热板下方并用于固定所述支撑针， 并且所述 固定装置不与所述加热板接触。
10、 根据权利要求 9所述的取向膜预固化设备， 还包括升降装置， 所述升降装置用于驱动所述固定装置进行升降。
11、 根据权利要求 1-10任一项所述的取向膜预固化设备， 还包括 设置于所述工作台周围的排气装置， 所述排气装置与所述支撑针之间 的距离大于所述基板的厚度。
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