WO2014155830A1 - 描画装置、露光描画装置、プログラムを記録した記録媒体及び描画方法 - Google Patents

描画装置、露光描画装置、プログラムを記録した記録媒体及び描画方法 Download PDF

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Publication number
WO2014155830A1
WO2014155830A1 PCT/JP2013/081671 JP2013081671W WO2014155830A1 WO 2014155830 A1 WO2014155830 A1 WO 2014155830A1 JP 2013081671 W JP2013081671 W JP 2013081671W WO 2014155830 A1 WO2014155830 A1 WO 2014155830A1
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WIPO (PCT)
Prior art keywords
unit
substrate
exposed
correction
amount
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PCT/JP2013/081671
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English (en)
French (fr)
Japanese (ja)
Inventor
浩明 菊池
Original Assignee
株式会社アドテックエンジニアリング
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Application filed by 株式会社アドテックエンジニアリング filed Critical 株式会社アドテックエンジニアリング
Priority to KR1020157023787A priority Critical patent/KR102138066B1/ko
Priority to CN201380074439.2A priority patent/CN105143985B/zh
Publication of WO2014155830A1 publication Critical patent/WO2014155830A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Definitions

  • the present invention relates to a drawing apparatus, an exposure drawing apparatus, a recording medium, and a drawing method, and more particularly, a drawing apparatus that draws a drawing pattern on a substrate, an exposure drawing apparatus that draws a drawing pattern on a substrate by exposure, and the above drawing
  • the present invention relates to a recording medium on which a program executed by an apparatus is recorded and a drawing method for drawing a drawing pattern on a substrate.
  • Japanese Patent Application Laid-Open No. 2005-157326 and Japanese Patent Application Laid-Open No. 2011-95742 disclose from a drawing pattern on the design of a drawn drawing pattern without complicating image processing.
  • a drawing apparatus capable of suppressing the deviation is disclosed.
  • the drawing apparatus disclosed in Japanese Patent Application Laid-Open No. 2005-157326 obtains substrate deformation information in advance, and based on the deformation information, a drawing pattern recorded on the substrate after deformation is indicated by raster data.
  • the raster data is converted so as to have the same shape as the pattern. Then, a drawing pattern is recorded on the substrate before deformation based on the converted raster data.
  • the drawing apparatus of Patent Document 2 uses a drawing data having a position coordinate that defines an area to be drawn and a position of a reference point provided in the area, to change the displacement mode of the position coordinate of the substrate. Based on this, the position of the reference point is corrected. Then, based on the corrected position of the reference point, each coordinate in the area is corrected while maintaining the shape of the area.
  • the mounting pad and the electronic device are finally combined with the change in the size of the drawing target region from the size of the region before correction.
  • the position of the component with respect to the electrode is displaced and it is difficult to mount the electronic component on the substrate.
  • the present invention has been made in view of the above problems, and a drawing apparatus and an exposure drawing apparatus capable of realizing highly accurate alignment between layers while suppressing a pitch shift between a mounting pad and an electrode of an electronic component.
  • An object is to provide a program and a drawing method.
  • a drawing apparatus uses coordinate data indicating a first position, which is a design position of a plurality of reference marks provided on a substrate to be exposed, as a reference based on the first position.
  • An acquisition unit that acquires coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed and defined as coordinate data indicating a second position that is an actual position of each of the plurality of reference marks;
  • a physical quantity indicating the magnitude of distortion of the substrate to be exposed is derived on the basis of the position and the second position, and the first position and the second position are determined for each of the plurality of reference marks.
  • the acquisition unit determines the coordinate data indicating the first position, which is the design position of the plurality of reference marks provided on the substrate to be exposed, based on the first position.
  • the coordinate data indicating the drawing pattern to be drawn on the exposed substrate and the coordinate data indicating the second position which is the actual position of each of the plurality of reference marks are acquired.
  • the deriving unit derives a physical quantity indicating the magnitude of distortion of the substrate to be exposed based on the first position and the second position, and for each of the plurality of reference marks, the first quantity is derived. And a correction amount for the shift of the second position is derived.
  • the reduction unit reduces the larger amount as the physical quantity increases from each of the correction amounts derived by the derivation unit.
  • the correction unit when the correction unit draws the drawing pattern on the substrate to be exposed with the second position as a reference, the drawing pattern is based on the correction amount reduced by the reduction unit.
  • the coordinate data indicating is corrected.
  • the drawing apparatus reduces the amount of correction from each of the correction amounts derived from the deviation amount between the design position of the reference mark and the actual position, and the reduced correction amount as the physical quantity increases. Based on the above, the coordinate data indicating the drawing pattern is corrected.
  • the correction amount decreases, so that the shape of the corrected drawing pattern approaches the distortion shape of the exposed substrate, It is possible to achieve highly accurate alignment between layers while suppressing a pitch shift between the mounting pad and the electrode of the electronic component.
  • the derivation unit may use the maximum value of the deviation amount of the first position and the second position for each of the plurality of reference marks as the physical quantity, and the deviation amount. You may make it derive
  • the reduction unit multiplies each correction amount derived by the deriving unit by a positive value less than 1 as the physical quantity increases, and the physical quantity increases.
  • Each of the correction amounts derived by the deriving unit by performing at least one of dividing by a larger value exceeding 1 and subtracting a positive value that is larger as the physical amount is larger and smaller than the correction amount. Therefore, the larger the physical quantity, the smaller the quantity may be reduced. Thereby, the correction amount can be reduced by a simple calculation.
  • the drawing pattern is a circuit pattern indicating an electronic wiring
  • the correction unit reduces the correction amount reduced by the reduction unit to the inside of the land in the drawing pattern. If the value is larger than the first correction amount determined to fall within the range, the coordinate data indicating the drawing pattern may be corrected based on the first correction amount. As a result, it is possible to prevent the chipping of the land that causes the defective substrate to be exposed (the protrusion of the conductive via to the outside of the land).
  • the drawing pattern is a solder resist pattern indicating an opening hole for component mounting of the solder resist layer
  • the correction unit has a correction amount reduced by the reduction unit described above.
  • the opening hole is larger than a second correction amount determined to be accommodated in the conductor pad for joining with the component
  • the coordinate data indicating the drawing pattern is corrected based on the second correction amount. May be.
  • the derivation unit may detect a deviation due to parallel movement of the substrate to be exposed, a deviation due to rotation, and a deviation due to expansion / contraction from the deviation amount between the first position and the second position.
  • the correction amount may be derived based on a shift amount obtained by subtracting at least one. Thereby, the pitch shift
  • the drawing apparatus further includes a reception unit that receives input of reduction information in which the physical quantity and the reduction rate of the correction amount are associated with each other, and the reduction unit receives the reduction received by the reception unit.
  • the correction amount derived by the deriving unit may be reduced using a reduction rate associated with the physical quantity derived by the deriving unit in the information.
  • an exposure drawing apparatus includes the drawing apparatus according to the present invention and the drawing on the substrate to be exposed based on the coordinate data corrected by the correction unit of the drawing apparatus.
  • An exposure unit that exposes and draws the pattern.
  • the exposure drawing apparatus since it operates in the same manner as the drawing apparatus according to the present invention, as in the drawing apparatus, while suppressing the pitch deviation between the mounting pad and the electrode of the electronic component, High-precision alignment between layers can be realized.
  • the exposure drawing apparatus provides the acquisition unit, the derivation unit, the reduction unit, the correction unit, and the exposure when drawing a plurality of layers of drawing patterns on the substrate to be exposed.
  • a control unit that controls each of the plurality of layers to perform acquisition by the acquisition unit, derivation by the derivation unit, reduction by the reduction unit, correction by the correction unit, and exposure by the exposure unit May be further provided.
  • the exposure drawing apparatus further includes a storage unit that stores allowable amount information indicating a maximum allowable amount of the physical quantity that is an upper limit allowed as a magnitude of distortion of the exposed substrate, and the control unit
  • allowable amount information indicating a maximum allowable amount of the physical quantity that is an upper limit allowed as a magnitude of distortion of the exposed substrate
  • a program recorded on a recording medium stores a first position, which is a design position of a plurality of reference marks provided on a substrate to be exposed, on a computer.
  • Coordinate data indicating coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed, which is determined based on the first position, and coordinates indicating a second position which is an actual position of each of the plurality of reference marks.
  • a physical quantity indicating the magnitude of distortion of the substrate to be exposed is derived based on the first position and the second position, and for each of the plurality of reference marks, the first A correction amount for the position and the second position deviation is derived, and from each of the derived correction amounts, a larger amount is reduced as the physical amount increases, and the substrate to be exposed is defined with respect to the second position.
  • drawing a serial drawing pattern it corrects the coordinate data representing the drawing pattern based on reduced the amount of correction to perform the process.
  • the computer can be operated in the same manner as the drawing apparatus according to the present invention. It is possible to achieve highly accurate alignment between layers while suppressing pitch deviation from the electrodes.
  • the drawing method includes coordinate data indicating a first position, which is a design position of a plurality of reference marks provided on a substrate to be exposed, the first position. Coordinate data indicating a drawing pattern to be drawn on the substrate to be exposed and defined as a reference, and coordinate data indicating a second position, which is an actual position of each of the plurality of reference marks, is acquired, and the first A physical quantity indicating the magnitude of distortion of the substrate to be exposed is derived based on the position and the second position, and the first position and the second position are shifted for each of the plurality of reference marks.
  • the larger amount is reduced as the physical amount increases from each of the derived correction amounts, and the drawing pattern is drawn on the substrate to be exposed with the second position as a reference. Is Correcting the coordinate data representing the drawing pattern based on the correction amount.
  • the drawing method according to the present invention operates in the same manner as the drawing apparatus according to the present invention. Therefore, as in the case of the drawing apparatus, the pitch deviation between the mounting pad and the electrode of the electronic component is suppressed and Accurate alignment between layers can be realized.
  • the exposure drawing apparatus which concerns on embodiment, it is a top view which shows an example of the area
  • it is a top view which shows another example of the area
  • it is a top view which shows another example of the area
  • the exposure drawing apparatus which concerns on 1st Embodiment it is a top view which shows an example of the target image when not performing coordinate conversion according to distortion of a to-be-exposed board
  • the exposure drawing apparatus which concerns on 1st Embodiment it is a top view which shows an example of the target image after coordinate conversion at the time of performing coordinate conversion according to distortion of a to-be-exposed board
  • the present invention relates to a drawing pattern such as a circuit pattern, a solder resist pattern showing an opening hole for component mounting of a solder resist layer by exposing a light beam to a substrate to be exposed (exposed substrate C described later).
  • a drawing pattern such as a circuit pattern, a solder resist pattern showing an opening hole for component mounting of a solder resist layer by exposing a light beam to a substrate to be exposed (exposed substrate C described later).
  • a drawing apparatus for drawing will be described as an example.
  • substrate flat board
  • the substrate to be exposed as an exposure drawing target has a rectangular shape.
  • the exposure drawing apparatus 10 includes a flat plate stage 12 for fixing the substrate C to be exposed.
  • a plurality of suction holes for sucking air are provided on the upper surface of the stage 12.
  • the stage 12 is supported by a flat base 16 that is movably provided on the upper surface of a table-like base 14. That is, one or a plurality of (in this embodiment, two) guide rails 18 are provided on the upper surface of the base body 14.
  • the base 16 is supported by the guide rail 18 so as to be freely movable along the guide rail 18, and is moved by being driven by a drive mechanism (stage drive unit 42 described later) constituted by a motor, a hydraulic pump, and the like. To do. Therefore, the stage 12 moves along the guide rail 18 in conjunction with the movement of the base 16.
  • the direction in which the stage 12 moves is defined as the Y direction
  • the direction perpendicular to the Y direction in the horizontal plane is defined as the X direction
  • the direction to do is defined as the Z direction.
  • a gate 20 is provided on the upper surface of the base 14 so as to straddle the two guide rails 18.
  • the exposed substrate C placed on the stage 12 moves so as to enter and exit the opening of the gate 20 along the guide rail 18.
  • An exposure unit 22 that exposes a light beam toward the opening is attached to the upper part of the opening of the gate 20.
  • the stage 12 moves along the guide rail 18 and is positioned in the opening by the exposure unit 22, the light beam is exposed on the upper surface of the exposure target substrate C placed on the stage 12.
  • the exposure unit 22 includes a plurality of (in this embodiment, 10) exposure heads 22a. Further, an optical fiber 26 drawn from a light source unit 24 described later and a signal cable 30 drawn from an image processing unit 28 described later are connected to the exposure unit 22.
  • Each of the exposure heads 22a has a digital micromirror device (DMD) as a reflective spatial light modulation element.
  • the exposure drawing apparatus 10 includes a light source unit 24 that emits a light beam to the exposure head 22a, and an image processing unit 28 that outputs image information to the exposure head 22a.
  • the exposure head 22 a modulates the light beam from the light source unit 24 by controlling the DMD based on the image information input from the image processing unit 28.
  • the exposure drawing apparatus 10 exposes the substrate C to be exposed by irradiating the substrate C with this modulated light beam.
  • the spatial light modulation element is not limited to the reflection type, and may be a transmission type spatial light modulation element such as liquid crystal.
  • a gate 32 is provided on the upper surface of the base body 14 so as to straddle the two guide rails 18.
  • the exposed substrate C placed on the stage 12 moves so as to enter and exit the opening of the gate 32 along the guide rail 18.
  • the photographing unit 34 is a CCD camera or the like having a built-in strobe with a very short light emission time.
  • rails 34a are provided at the upper part of the opening of the gate 32 along a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 12 in the horizontal plane. It is provided so that it can move by being guided by 34a.
  • the imaging unit 34 images the upper surface of the substrate C to be exposed placed on the stage 12.
  • an image area 22 b that is an area exposed by the exposure head 22 a according to the present embodiment has one side with a predetermined inclination angle with respect to the moving direction (Y direction) of the stage 12. It is a rectangular shape inclined at.
  • Y direction moving direction
  • Region 22c is formed.
  • each of the exposure heads 22a is arranged in a matrix in the exposure unit 22, and as shown in FIG. 4, the length of the long side of the image region 22b is set in the X direction. They are shifted by a distance that is a natural number times (in this embodiment, 1 time).
  • Each of the exposed regions 22c is formed so as to partially overlap the adjacent exposed region 22c.
  • the exposure drawing apparatus 10 is provided with a system control unit 40 that is electrically connected to each part of the apparatus.
  • the system control unit 40 controls each part of the exposure drawing apparatus 10. Be controlled.
  • the exposure drawing apparatus 10 includes a stage drive unit 42, an operation device 44, a shooting drive unit 46, and an external input / output unit 48.
  • the system control unit 40 has a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), and HDD (Hard Disk Drive) 40A. Further, the system control unit 40 causes the CPU to emit a light beam from the light source unit 24 and output corresponding image information at a timing according to the movement of the stage 12 by the image processing unit 28. Control the exposure of the light beam to C.
  • CPU Central Processing Unit
  • RAM Random Access Memory
  • ROM Read Only Memory
  • HDD Hard Disk Drive
  • the stage drive unit 42 has a drive mechanism including a motor, a hydraulic pump, and the like, and moves the stage 12 under the control of the system control unit 40.
  • the operation device 44 includes a display unit that displays various types of information under the control of the system control unit 40, and an input unit that inputs various types of information through user operations.
  • the imaging drive unit 46 has a drive mechanism constituted by a motor, a hydraulic pump, and the like, and moves the imaging unit 34 under the control of the system control unit 40.
  • the external input / output unit 48 inputs / outputs various information to / from an information processing apparatus such as a personal computer connected to the exposure drawing apparatus 10.
  • reference mark M is provided.
  • reference marks M1 to M4 (hereinafter, four are collectively referred to as “reference mark M”) at each corner of the substrate C to be exposed. .) Is provided. Specifically, the reference mark M1 is located at the upper left position of the substrate C to be exposed in FIG. 6A, the reference mark M2 is located at the upper right position, the reference mark M3 is located at the lower left position, and the reference mark M4 is located at the lower right position. Is provided.
  • the exposure drawing apparatus 10 has an image such as a drawing pattern (hereinafter referred to as “target image”) indicated by image information at a predetermined relative position with respect to each of the reference marks M on the substrate C to be exposed. .) 62 is drawn.
  • the outline shape of the target image 62 is a rectangular shape, but is not limited thereto, and may be an arbitrary shape such as an elliptical shape or a star shape.
  • the exposure drawing apparatus 10 When the exposure drawing apparatus 10 draws the target image 62, the exposure unit 10 photographs each of the reference marks M by the photographing unit 34 before exposing the light beam to the substrate C to be exposed, and each of the reference marks M from the photographed image. Measure the position of. Then, the exposure drawing apparatus 10 determines an area in which the target image 62 is drawn based on each position of the measured reference mark M, and draws the target image 62 in the determined area.
  • the distortion amount of the exposed substrate C is calculated from each position of the reference mark M. There was something to derive.
  • the shape of the target image 62 is corrected in accordance with the derived distortion magnitude.
  • the exposure / drawing apparatus 10 prevents a reduction in the accuracy of mounting the electronic component due to a difference between the shape of the design target image 62 and the shape of the drawn target image 62. Therefore, the correction amount for the distortion of the substrate C to be exposed in the target image 62 is reduced.
  • the exposure drawing apparatus 10 according to the present embodiment determines the magnitude of distortion of the substrate C to be exposed from the correction amount corresponding to each shift amount of the reference mark M (hereinafter referred to as “pure correction amount”). As the physical quantity shown increases, the larger quantity is reduced. Thereby, the deformation
  • the exposure drawing apparatus 10 uses, as the physical quantity, a design position for each reference mark M and a position (actual position) obtained by measurement.
  • the maximum value of the shift amount de is used.
  • the positions of the design reference marks M are shown connected by solid lines, and the positions of the reference marks M obtained by measurement are shown connected by dotted lines.
  • the front view left and right direction in FIG. 7 is the x direction
  • the front view vertical direction is the y direction
  • the deviation amount with respect to the x direction is the deviation amount dx
  • the deviation amount with respect to the y direction is the deviation amount dy
  • the deviation amount de is (1).
  • the maximum value of the shift amount is used as the physical quantity.
  • the present invention is not limited to this, and each average value of the shift amounts or each shift amount is used.
  • An integrated value may be used as the physical quantity. Further, a plurality of combinations of the maximum value, the average value, and the integrated value may be used as the physical quantity.
  • the maximum value of the difference between the corresponding distances between the design distances Pa1 to Pa6 between the reference marks M1 to M4 and the distances Pb1 to Pb6 obtained by the measurement is described above. It may be used as a physical quantity.
  • FIG. 8 as in FIG. 7, the positions of the design reference marks M are shown connected by solid lines, and the positions of the reference marks M obtained by measurement are shown connected by dotted lines. Yes.
  • an average value of each difference or an integrated value of each difference may be used as the physical quantity.
  • a plurality of combinations of the maximum value, the average value, and the integrated value may be used as the physical quantity.
  • the exposure drawing apparatus 10 uses position information in which each position of the design reference mark M is represented by coordinate data and reduction information 50 as a system.
  • the information is stored in advance in a predetermined area of the HDD 40A of the control unit 40.
  • the reduction information 50 includes physical quantity information indicating the physical quantity, reduction ratio information indicating a reduction ratio when the net correction amount is reduced, and processing on the substrate C to be exposed.
  • the process content information indicating the content is associated with each other. As shown in FIG. 9, when the reduction rate is indicated by a range in the reduction rate information, it indicates that the reduction rate increases linearly or curvedly within the range.
  • the exposure drawing apparatus 10 uses the reduction rate indicated by the reduction rate information associated with the physical quantity. The exposure drawing process is executed after reducing the pure correction amount.
  • the exposure drawing apparatus 10 removes the exposed substrate C from the exposure drawing apparatus without performing the exposure drawing process. 10 to discharge.
  • the processing content of the error processing is not limited to this, and the reduction rate with respect to the exposed substrate C is set to a fixed value, and after performing the exposure drawing processing, information indicating that an error has occurred is drawn on the exposed substrate C. You may do it.
  • the processing content when the physical quantity is 100 ⁇ m or more is an error process.
  • the reduction rate increases as the physical quantity increases.
  • the reduction amount with respect to the pure correction amount increases, that is, the reduction correction amount decreases.
  • the target image 62 is deformed to a shape closer to the distortion shape of the substrate C to be exposed than the design shape of the target image 62, compared to the case where the reduction correction amount is not used. Thereby, the position shift with the pad for mounting and the electrode of an electronic component is suppressed.
  • the reduction rate is increased stepwise as the physical quantity increases, but the method of increasing the reduction rate is not limited to this.
  • the reduction rate may be increased linearly as the physical quantity increases.
  • the reduction rate may be changed into a curve shape in which the increase amount of the reduction rate increases as the physical quantity increases, or a curve shape in which the increase amount of the reduction rate decreases as the physical quantity increases.
  • the exposure drawing apparatus 10 determines the reduction rate using the physical quantity and the reduction information 50, and derives the reduction correction amount from the pure correction amount and the reduction rate. Then, the exposure drawing apparatus 10 corrects each position of the reference mark M according to the derived reduction correction amount, deforms the target image 62 based on each corrected position of the reference mark M, and deformed the target. An image 62 is drawn on the substrate C to be exposed.
  • the user receives input of the reduction information 50 via the input unit of the operation device 44, and stores the received reduction information 50 in the HDD 40A of the system control unit 40.
  • the present invention is not limited to this.
  • each piece of information in the reduction information 50 may be stored in advance in the HDD 40A of the system control unit 40 as a fixed value.
  • the target image 62 when the target image 62 is deformed, as shown in FIG. 11A as an example, the entire region of the target image 62 is converted into a target region (FIG. 11A) that is a target of coordinate conversion. And a region indicated by a dot pattern in FIG. 11B) 64.
  • the target area 64 is not limited to this, and as an example, as shown in FIG. 11B, a rectangular area whose corner points are the positions of the centers of gravity of the four reference marks M1 to M4 may be used as the target area 64.
  • the entire surface to be exposed of the substrate C to be exposed may be the target region 64, or a part of the target image 62 may be the target region 64.
  • an image other than the circuit pattern such as the identification number of the substrate C to be exposed may be drawn on the edge of the substrate C to be exposed.
  • coordinate conversion is performed on the drawing region of the image.
  • FIG. 12 is a flowchart showing the flow of processing of an exposure control processing program executed by the system control unit 40 of the exposure drawing apparatus 10 when an execution instruction is input via the input unit of the operation device 44.
  • the program is stored in advance in the predetermined area of the ROM in the system control unit 40.
  • the image information is vector data indicating a drawing pattern, but is not limited thereto, and may be raster data.
  • step S101 image information which is coordinate data indicating the target image 62 to be drawn is acquired by reading from the HDD 40A.
  • the system control unit 40 may acquire image information by inputting image information from the outside via the external input / output unit 48.
  • the system control unit 40 acquires the position information by reading the position information from the HDD 40A.
  • the acquisition method is not limited to this, and the external input / output unit 48 is used.
  • a method of inputting position information from the outside may be used.
  • the stage 12 is moved so that the exposed substrate C passes through the position where each of the reference marks M is included in the imaging region of the imaging unit 34.
  • each position of the reference mark M is measured using the captured image.
  • the measurement is not limited to this, and the measurement is performed by an external apparatus. Information to be shown may be input from the outside via the external input / output unit 48.
  • the rotation of the substrate C to be exposed is determined based on the deviation amount between each position of the design reference mark M acquired in the process of step S103 and each position of the reference mark M measured in the process of step S107.
  • Each of the amount, the offset amount, and the expansion / contraction magnification is derived.
  • the above-mentioned rotation amount here corresponds to the actual position corresponding to the position of the design reference mark M in a predetermined orthogonal coordinate system (in this embodiment, the xy coordinate system shown in FIG. 9 as an example). This is the rotation angle to the position of the reference mark M.
  • the offset amount here is a parallel movement amount from the position of the designed reference mark M to the corresponding position of the actual reference mark M in the orthogonal coordinate system.
  • the expansion / contraction magnification is an enlargement or reduction magnification from the position of the designed reference mark M to the corresponding position of the actual reference mark M in the orthogonal coordinate system.
  • the system control unit 40 performs an x-direction offset amount ofsx, an y-direction offset amount ofsy, an x-direction expansion / contraction magnification kx, a y-direction expansion / contraction magnification ky, by a least-squares method using each position coordinate of the reference mark M. And the parameter of the rotation amount ⁇ are derived for each of the exposed substrates C.
  • the position of the design reference mark M and the position of each measured reference mark M include the parameters without considering the distortion of the substrate C to be exposed. Assume that there is a unique relationship. Then, the parameters are determined so that the average deviation of the parameters is minimized (see, for example, JP-A-61-44429). Since the method for determining each parameter is a known method using affine transformation or the like, description thereof is omitted.
  • step S111 the position coordinates of each reference mark M measured in the process of step S107 are converted based on the rotation amount, the offset amount, and the expansion / contraction magnification derived in the process of step S109. Thereby, the displacement amount of each position of the reference mark M due to the displacement of the placement position when placing the substrate to be exposed C on the stage 12 is canceled.
  • the position coordinates of the reference mark M measured in the process of step S107 are based on the rotation amount, the offset amount, and the expansion / contraction magnification of the substrate C to be exposed.
  • conversion may be performed based on any one of the rotation amount, the offset amount, and the expansion / contraction magnification of the substrate C to be exposed, or may be performed based on a plurality of combinations.
  • a pure correction amount is derived based on the position coordinates of each of the reference marks M whose coordinates have been converted in the process of step S111.
  • the pure correction amounts of the reference marks M1, M2, M3, and M4 are respectively represented as (dx0, dy0), (dx1, dy1), (dx2, dy2), and (dx3, dy3).
  • step S114 based on the position information acquired in step S103 and the position coordinates of the reference mark M coordinate-converted in the process of step S111, the physical quantity (in this embodiment, the reference mark M The maximum value of the deviation amount of each of (1) is derived.
  • the reduction information 50 is read from the HDD 40A of the system control unit 40.
  • step S117 whether or not the processing content indicated by the processing content information associated with the physical quantity information indicating the physical quantity derived in the processing of step S114 in the read reduction information 50 is the exposure drawing process. judge.
  • step S117 determines whether the exposure to be exposed C is removed from the stage 12, and the execution of this exposure control processing program is completed. To do. In this case, the exposed substrate C is removed from the stage 12 without being subjected to the exposure drawing process, and is discharged to the outside of the exposure drawing apparatus 10.
  • step S119 in the read reduction information 50, the net correction amount is reduced by using the reduction rate N indicated by the reduction rate information associated with the physical quantity information indicating the physical quantity derived in the process of step S114.
  • a reduction correction amount is derived.
  • the reduction correction amounts of the reference marks M1, M2, M3, M4 are respectively (dx0 ′, dy0 ′), (dx1 ′, dy1 ′), (dx2 ′, dy2 ′), (dx3 ′, dy3 ′). It expresses.
  • the reduction correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) are reduced to the bottom with respect to the pure correction amounts (dx0, dy0) to (dx3, dy3). It is obtained by multiplying the rate N and is expressed by the following equation (2).
  • step S127 coordinate conversion of each coordinate in the target area 64 of the target image 62 is performed using the reduction correction amount (dx ', dy') obtained by the process of step S119.
  • the system control unit 40 divides the target image 62 into a plurality of (four in this embodiment) regions based on the coordinates to be subjected to coordinate transformation, The areas SA0 to SA3 of the divided regions are derived.
  • the target image 62 is divided into four regions by drawing a straight line inside the target image 62 that is parallel to each side and passes through the coordinates to be converted.
  • the area of the lower right region in front view of FIG. 10 that is a region facing the reference mark M1 (that is, a region including the reference mark M4) is represented as SA0.
  • the area of the lower left region, which is a region facing the reference mark M2 (that is, a region including the reference mark M3) is represented as SA1.
  • the area of the upper right region, which is a region facing the reference mark M3 (that is, a region including the reference mark M2) is represented as SA2.
  • the area of the upper left region, which is a region facing the reference mark M4 (that is, a region including the reference mark M1) is represented as SA3.
  • the system control unit 40 obtains the areas of the divided areas SA0 to SA3 obtained in this way and the reduction correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) obtained by the process of step S115. Are substituted into the following equation (3).
  • the value obtained as a result is the correction amount (ddx, ddy) for the distortion of the substrate C to be exposed at the coordinates to be subjected to the coordinate conversion.
  • ddx (3 ⁇ 1 + 9 ⁇ 2 + 3 ⁇ 5 + 1 ⁇ 10) /16 ⁇ 2.9.
  • each side of the target image 62 is internally divided by drawing a perpendicular to each side of the target image 62 from the position A (x, y) that is a predetermined position of the target image 62 before coordinate conversion. Thereby, the internal division ratio of each side of the target image 62 with respect to the position A is obtained.
  • the position B corresponding to the internal ratio in the target image 62 after the coordinate conversion may be determined, and the deviation amount between the position A and the position B may be determined as a correction amount (ddx, ddy).
  • the system control unit 40 adjusts the correction amount (ddx, ddy) of each coordinate in the target image 62, the offset amount ofsx in the x direction, the offset amount ofsy in the y direction, the scaling factor kx in the x direction, and the scaling factor in the y direction.
  • the ky and the rotation amount ⁇ are substituted into the following equation (4). From this equation (4), coordinates (xm, ym) after coordinate conversion for each coordinate (xl, yl) to be subjected to coordinate conversion are obtained.
  • the stage drive unit 42 is controlled to move the stage 12 to a position where the upper surface of the substrate C to be exposed is exposed by the light beam emitted from the exposure unit 22.
  • the exposure head 22a is controlled via the light source unit 24 and the image processing unit 28 so that the target image 62 is drawn on the substrate C to be exposed using the coordinates (xm, ym) after the coordinate conversion.
  • the system control unit 40 draws the target image 62 on the exposed substrate C while moving the exposed substrate C by controlling the stage driving unit 42 so as to move the stage 12 at a predetermined speed. Then, the exposure head 22a is controlled.
  • step S133 the stage 12 is moved to a position where the substrate C to be exposed is removed from the stage 12, and the execution of this exposure control processing program is terminated.
  • the system control unit 40 determines the substrate C to be exposed.
  • the target image 62 is drawn without reducing the correction amount for the distortion of the image.
  • the system control unit 40 reduces the correction amount for the distortion of the exposed substrate C according to the reduction rate.
  • the target image 62 is deformed and drawn above. 14A and 14B, the land 66 is provided at the position of the reference mark M of the layer to be drawn so that the drawing pattern to be drawn can easily understand the positional relationship between the land 66 and the conductive via 68.
  • the conductive via 68 is provided at the position of the reference mark M on the other layer.
  • a general exposure drawing apparatus for example, as shown in FIG. 15, when drawing a plurality of layers (for example, four layers) of drawing patterns 62 ⁇ / b> A to 62 ⁇ / b> D in order from the lower side, as shown in FIG. Every time drawing is completed, chemical processing such as development, etching, and peeling is performed. Further, in a general exposure drawing apparatus, in order to further overlap layers, prepreg layer lamination, conductive via processing, filled via plating, roughening treatment, DFR (Dry Film photoResist) lamination, and the like are performed. Therefore, as shown in FIG. 16, the first layer drawing pattern 62A, the second layer drawing pattern 62B, the third layer drawing pattern 62C, the fourth layer drawing pattern 62D, and the substrate to be exposed each time the layers are stacked. It is assumed that the distortion of C increases.
  • the exposure drawing apparatus 10 when drawing a drawing pattern, the amount of correction for distortion of the substrate C to be exposed is reduced while the amount of reduction increases as the physical quantity increases for each layer. Let Thereby, an electronic component can be mounted on a substrate with high accuracy.
  • the net correction amount is reduced by multiplying each correction amount of the reference mark M by a positive value (reduction rate) smaller than 1. It is not limited. That is, the pure correction amount may be reduced by dividing the pure correction amount by a value exceeding 1 or by subtracting a positive value from the pure correction amount. Alternatively, the pure correction amount may be reduced by combining a plurality of multiplications, divisions, and subtractions.
  • the distortion of the substrate to be exposed C need not be corrected. good.
  • the present invention is not limited to this. . That is, the present invention can be applied to an arbitrary drawing apparatus that draws an image to be drawn based on the position of the reference mark M provided on the drawing object.
  • the present invention may be applied to a laser processing apparatus and a drill processing apparatus that form conductive vias or the like that electrically connect layers of each drawing pattern.
  • the present invention may be applied to an exposure drawing apparatus and a processing apparatus for forming a component mounting hole in a solder resist layer for protecting a drawing pattern on a substrate. Thereby, an electronic component can be mounted on a substrate with high accuracy.
  • the exposure drawing apparatus 10 according to the second embodiment has the same configuration as the exposure drawing apparatus 10 according to the first embodiment, description of each configuration is omitted.
  • the reduction correction amount (dx ′, dy ′) is limited according to the value of the annular ring.
  • the annular ring is an annular region surrounding the entire circumference of the conductive via 68 when the conductive via 68 is opened inside the land 66, where the land diameter is D and the hole diameter is d.
  • information indicating the land diameter D of the land 66 and the hole diameter d of the conductive via 68 is stored in advance in the HDD 40A of the system control unit 40.
  • FIG. 18 is a flowchart showing the flow of processing of an exposure control processing program executed by the system control unit 40 of the exposure drawing apparatus 10 according to the second embodiment when an execution instruction is input via the operation device 44. It is.
  • the program is stored in advance in a predetermined area of the ROM of the system control unit 40. Further, steps in FIG. 18 that perform the same processing as in FIG. 12 are denoted by the same step numbers as in FIG. 12, and description thereof is omitted as much as possible.
  • step S119 After performing the process of step S119, the process proceeds to step S121.
  • step S121 information indicating the width L of the annular ring is acquired.
  • information indicating the land diameter D of the land 66 and the hole diameter d of the conductive via 68 is read from the HDD 40A of the system control unit 40, and the values of the land diameter D and the hole diameter d are as follows. By substituting into the equation (5), the width L of the annular ring is derived.
  • the land diameter D and the hole diameter d may be input by the user via the operation device 44 based on the type of the substrate to be exposed C and the design value of the drawing pattern.
  • the method for obtaining the annular ring width L is not limited to this.
  • the acquisition method may be, for example, a method of inputting via an external input / output unit 48 from an information processing apparatus connected to the outside.
  • the acquisition method may be a method in which information indicating the annular ring width L (for example, 30 ⁇ m) is stored in advance in a storage unit such as the RAM or the HDD 40A of the system control unit 40 and is read out from the storage unit. .
  • the conductive via 68 does not protrude from the land 66 by considering the error of the placement position of the substrate C to be exposed, the error of the drawing position, etc., and making the value of the width L of the annular ring narrower than the actual one. You may make it have a margin.
  • step S123 the value obtained by subtracting the reduction correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) from the pure correction amounts (dx0, dy0) to (dx3, dy3) is the width L of the annular ring. Determine if greater than. At this time, the determination is made for each of the reference marks M, and an affirmative determination is made when even one of the conditions is satisfied. If the determination in step S123 is negative, the process proceeds to step S127. If the determination is affirmative, the process proceeds to step S126.
  • step S126 the reduction correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) are used in order to avoid the occurrence of misalignment between the land 66 and the conductive via 68 due to the correction for the distortion of the substrate C to be exposed. ).
  • the values obtained by substituting the pure correction amounts (dx0, dy0) to (dx3, dy3) and the annular ring width L into the following equation (6) are used as the reduction correction amounts (dx0 ′, dy0 ′). To (dx3 ′, dy3 ′).
  • the shift amount obtained by limiting the reduction correction amounts (dx0 ′, dy0 ′) to (dx3 ′, dy3 ′) as described above is set as the shift amount de ′.
  • the correction amount for the distortion of the exposed substrate C is reduced so that the conductive via 68 is accommodated in the land 66 while ensuring the minimum correction amount for the exposed substrate C.
  • the image is deformed.
  • the conductive via 68 is accommodated in the land 66, and the electronic component can be mounted on the substrate C to be exposed with high accuracy.
  • Various processes for realizing the exposure control process by the exposure drawing apparatus 10 configured as described above may be realized by a software configuration using a computer by executing a program.
  • the implementation is not limited to the software configuration, and may be realized by a hardware configuration or a combination of the hardware configuration and the software configuration.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PCT/JP2013/081671 2013-03-29 2013-11-25 描画装置、露光描画装置、プログラムを記録した記録媒体及び描画方法 WO2014155830A1 (ja)

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KR102138066B1 (ko) 2020-07-27
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