WO2014126013A1 - ネガ型感光性着色組成物、硬化膜、タッチパネル用遮光パターン及びタッチパネルの製造方法 - Google Patents
ネガ型感光性着色組成物、硬化膜、タッチパネル用遮光パターン及びタッチパネルの製造方法 Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
Definitions
- the present invention relates to a negative photosensitive coloring composition, a cured film, a light shielding pattern for a touch panel, and a method for manufacturing a touch panel.
- a projected capacitive touch panel has an ITO (Indium Tin Oxide) film pattern formed in a screen region, and a metal wiring portion such as molybdenum is further formed in the periphery thereof. And in order to hide such a metal wiring part, the light shielding pattern of black or white is often formed inside the cover glass of the projected capacitive touch panel.
- ITO Indium Tin Oxide
- the touch panel system is an out-cell type in which a touch panel layer is formed between a cover glass and a liquid crystal panel, an on-cell type in which a touch panel layer is formed on the liquid crystal panel, and an in-cell type in which a touch panel layer is formed inside the liquid crystal panel. It is roughly divided into cell type and OGS (One Glass Solution) type that directly forms a touch panel layer on the cover glass, but since it can be made thinner and lighter than before, the development of OGS type touch panel is thriving It has become to.
- OGS One Glass Solution
- Patent Documents 1 to 4 negative photosensitive compositions containing a silicon oxide compound are known.
- JP 2010-03905 A Japanese Patent No. 5078475 Japanese Patent No. 4110401 International Publication No. 2010/061744
- the inventors of the present invention are not suitable for forming a white light-shielding pattern in the production of a touch panel because a negative photosensitive composition containing a silicon oxide compound is generally excellent in heat resistance. I thought. However, there is no specific example in which a white pigment is included in a conventional negative photosensitive composition, and when they contain a white pigment, yellowing or cracking may occur in the resulting cured film due to high-temperature treatment. Therefore, it has been difficult to use for manufacturing OGS type touch panels that require high temperature treatment such as ITO film formation.
- the present invention is not only excellent in chemical resistance but also extremely excellent in heat resistance, and does not cause yellowing or cracks even after high temperature treatment, and is suitable for forming a white light-shielding pattern.
- the purpose is to provide goods.
- the inventors of the present invention have made extensive studies by paying attention to the structure of polysiloxane in a negative photosensitive composition containing a white pigment and containing a silicon oxide compound. And it discovered that a remarkable effect was exhibited when the polysiloxane obtained by combining several alkoxysilane compounds which have a specific structure, and co-hydrolyzing-condensing them was contained. That is, this invention provides the negative photosensitive coloring composition described below, the cured film formed by hardening it, and the like.
- a white pigment (B) a compound represented by the following general formula (1), a compound represented by the following general formula (2) and an alkoxysilane compound containing the compound represented by the following general formula (3) are cohydrolyzed.
- a negative photosensitive coloring composition containing polysiloxane obtained by product condensation, (C) polyfunctional acrylic monomer, (D) photoradical polymerization initiator, and (E) an organic solvent.
- R 1 independently represents a methyl group or a phenyl group
- R 2 each independently represents hydrogen or an alkyl group having 1 to 4 carbon atoms.
- R 3 represents a methyl group or hydrogen
- R 4 represents an alkylene group having 1 to 4 carbon atoms
- R 5 each independently represents hydrogen or an alkyl group having 1 to 4 carbon atoms
- R 6 represents each Independently, it represents an alkyl group having 1 to 6 carbon atoms
- n represents an integer of 1 to 3.
- R 7 represents an alkylene group having 1 to 4 carbon atoms
- R 8 independently represents hydrogen or 1 to 4 carbon atoms
- each R 9 independently represents an alkyl group having 1 to 6 carbon atoms.
- a white cured film that not only has excellent chemical resistance but also excellent heat resistance and does not cause yellowing or cracks even after high-temperature treatment. It becomes possible to form.
- the negative photosensitive coloring composition of the present invention comprises (A) a white pigment, (B) a compound represented by the following general formula (1), a compound represented by the following general formula (2), and the following general formula (3). Containing a polysiloxane obtained by cohydrolyzate condensation of an alkoxysilane compound containing the compound shown, (C) a polyfunctional acrylic monomer, (D) a photoradical polymerization initiator, and (E) an organic solvent. It is characterized by.
- R 1 independently represents a methyl group or a phenyl group
- R 2 each independently represents hydrogen or an alkyl group having 1 to 4 carbon atoms.
- R 3 represents a methyl group or hydrogen
- R 4 represents an alkylene group having 1 to 4 carbon atoms
- R 5 independently represents hydrogen or an alkyl group having 1 to 4 carbon atoms
- R 6 represents Independently, it represents an alkyl group having 1 to 6 carbon atoms
- n represents an integer of 1 to 3.
- Examples of the compound represented by the general formula (1) include dimethoxydimethylsilane, diethoxydimethylsilane, dimethoxydiphenylsilane, diethoxydiphenylsilane, dihydroxydiphenylsilane, dimethoxy (methyl) (phenyl) silane, diethoxy (methyl) ( Phenyl) silane, dimethoxy (methyl) (phenethyl) silane, dicyclopentyldimethoxysilane, or cyclohexyldimethoxy (methyl) silane, but in order to improve crack resistance, dimethoxydiphenylsilane, diethoxydiphenylsilane, or dihydroxydipheny
- the proportion of the compound represented by the general formula (1) in the alkoxysilane compound to be subjected to cohydrolyzate condensation is preferably 25 to 75 mol%.
- the proportion of dimethoxydiphenylsilane, diethoxydiphenylsilane and dihydroxydiphenylsilane in the alkoxysilane compound to be subjected to cohydrolyzate condensation is preferably 10 to 45 mol%.
- Examples of the compound represented by the general formula (2) include 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, Examples include 3-methacryloxypropylmethyldiethoxysilane, 3-acryloxypropylmethyldimethoxysilane, 3-acryloxypropyltriethoxysilane, or 3-acryloxypropylmethyldiethoxysilane.
- the proportion of the compound represented by the general formula (2) in the alkoxysilane compound to be subjected to cohydrolyzate condensation is preferably 10 to 45 mol%. Chemical resistance falls that the compound shown by General formula (2) is less than 10 mol%. On the other hand, when it exceeds 45 mol%, heat resistance will fall.
- Examples of the compound represented by the general formula (3) include 3-trimethoxysilylpropyl succinic anhydride, 3-triethoxysilylpropyl succinic anhydride, 3-trimethoxysilylethyl succinic anhydride, and 3-trimethoxysilylbutyl. Examples thereof include succinic anhydride, 3-diethoxymethylsilylpropyl succinic anhydride, 3-dimethoxymethylsilylethyl succinic anhydride, and 3-dimethoxymethylsilylbutyl succinic anhydride.
- the proportion of the compound represented by the general formula (3) in the alkoxysilane compound to be subjected to cohydrolyzate condensation is preferably 1 to 20 mol%. When the compound represented by the general formula (3) is less than 1 mol%, the margin for the development residue is reduced. On the other hand, when it exceeds 20 mol%, chemical resistance will fall.
- the alkoxysilane compound to be subjected to cohydrolyzate condensation preferably further includes a compound represented by the general formula (5) in order to improve the chemical resistance of the resulting cured film.
- Examples of the compound represented by the general formula (5) include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane, 3 -(3,4-epoxycyclohexyl) propyltriethoxysilane.
- the proportion of the compound represented by the general formula (5) in the alkoxysilane compound to be subjected to cohydrolyzate condensation is preferably 10 mol% or less.
- the compound represented by the general formula (5) exceeds 10 mol%, the heat resistance is lowered.
- R 12 represents a monovalent organic group having a carbon number epoxy group
- R 13 each independently represents an alkyl group having 1 to 4 carbon atoms.
- alkoxysilane compounds other than the compounds represented by the general formulas (1) to (3) and (5) include methyltrimethoxysilane, ethyltrimethoxysilane, phenyltrimethoxysilane, phenethyltrimethoxysilane, and naphthyl.
- Examples include trimethoxysilane, methyltriethoxysilane, ethyltriethoxysilane, phenyltriethoxysilane, phenethyltriethoxysilane, naphthyltriethoxysilane, tetramethoxysilane, and tetraethoxysilane.
- the polysiloxane (B) contained in the thermosetting coloring composition of the present invention includes a compound represented by the general formula (1), a compound represented by the general formula (2), and a compound represented by the general formula (3). It is obtained by co-hydrolyzate condensation, that is, hydrolysis and partial condensation of an alkoxysilane compound.
- a general method can be used for cohydrolyzate condensation. For example, a method of adding an organic solvent, water and, if necessary, a catalyst to the mixture and heating and stirring at 50 to 150 ° C. for about 0.5 to 100 hours can be used. During heating and stirring, if necessary, hydrolysis by-products (alcohols such as methanol) and condensation by-products (water) may be distilled off by distillation.
- the organic solvent used for the cohydrolyzate condensation is preferably the same as the organic solvent (C) contained in the thermosetting coloring composition of the present invention.
- the addition amount of the organic solvent is preferably 10 to 1000 parts by mass with respect to 100 parts by mass of the alkoxysilane compound subjected to cohydrolyzate condensation.
- the amount of water added is preferably 0.5 to 2 moles per mole of hydrolyzable groups.
- the catalyst added as necessary for the cohydrolyzate condensation is preferably an acid catalyst or a base catalyst.
- the acid catalyst include acetic acid, trifluoroacetic acid, formic acid or polyvalent carboxylic acid or anhydride thereof, hydrochloric acid, nitric acid, sulfuric acid, hydrofluoric acid, phosphoric acid, or an ion exchange resin.
- Examples of the base catalyst include triethylamine, tripropylamine, tributylamine, tripentylamine, trihexylamine, triheptylamine, trioctylamine, diethylamine, triethanolamine, diethanolamine, sodium hydroxide, potassium hydroxide, amino group
- An alkoxysilane or ion exchange resin having The addition amount of the catalyst is preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the alkoxysilane compound to be subjected to cohydrolyzate condensation.
- the added catalyst may be removed.
- the catalyst removal method include water washing or ion exchange resin treatment.
- the water washing refers to a method in which an organic layer obtained by diluting a polysiloxane solution with an appropriate hydrophobic solvent and washing several times with water is concentrated with an evaporator.
- the treatment with an ion exchange resin refers to a method of bringing a polysiloxane solution into contact with an appropriate ion exchange resin.
- the weight average molecular weight (hereinafter referred to as “Mw”) of the polysiloxane obtained by cohydrolyzate condensation is preferably 500 to 10,000, more preferably 700 to 5,000 in terms of polystyrene measured by GPC.
- Mw weight average molecular weight
- the negative photosensitive coloring composition of the present invention contains (A) a white pigment.
- white pigment refers to an opaque pigment having no specific absorption in the visible region and having a large refractive index.
- examples of the white pigment (A) include titanium dioxide, magnesium oxide, zinc oxide, and lead white. Titanium dioxide having excellent shielding properties and easy industrial use is preferable, and the crystal structure of titanium dioxide is anatase type. , Rutile type and brookite type. Among them, rutile type titanium oxide is preferable because it has no photocatalytic activity. Moreover, in order to improve the dispersibility in a negative photosensitive coloring composition, the light resistance of a cured film, and heat resistance, the titanium dioxide by which the surface of the particle was processed is more preferable.
- the surface treatment agent metal oxides and / or hydrates of metal oxides are preferable, and Al 2 O 3 , SiO 2 and / or ZrO 2 are more preferable. Among these, it is preferable to contain SiO 2 from the viewpoint of light resistance and heat resistance.
- the mass occupied by the surface treatment agent is preferably 10% by mass or less from the viewpoint of shielding properties.
- the average primary particle diameter of the above-mentioned titanium oxide is preferably 0.1 to 0.5 ⁇ m, more preferably 0.2 to 0.3 ⁇ m. When the average primary particle diameter is less than 0.1 ⁇ m, the shielding property is lowered, while when it exceeds 0.5 ⁇ m, the white cured film becomes yellowish.
- titanium dioxide pigments examples include CR-97; manufactured by Ishihara Sangyo Co., Ltd. (rutile type, Al 2 O 3 / ZrO 2 treatment, average primary particle size 0.25 ⁇ m), JR-301; manufactured by Teika Co., Ltd. (Rutile type, Al 2 O 3 treatment, average primary particle size 0.30 ⁇ m), JR-405; manufactured by Teika Co., Ltd. (rutile type, Al 2 O 3 treatment, average primary particle size 0.21 ⁇ m), JR -600A; manufactured by Teika Co., Ltd. (rutile type, Al 2 O 3 treatment, average primary particle size 0.25 ⁇ m), JR-603; manufactured by Teika Co., Ltd.
- the amount of (A) white pigment added is preferably 20 to 300 parts by weight, more preferably 50 to 150 parts by weight, based on a total of 100 parts by weight of (B) polysiloxane and (C) polyfunctional acrylic monomer.
- the negative photosensitive coloring composition of the present invention may contain (A) a colorant other than the white pigment.
- a colorant other than the white pigment include dyes, organic pigments, and inorganic pigments. From the viewpoint of heat resistance, phthalocyanine-based organic pigments, carbon black, and inorganic pigments are preferable.
- organic pigment examples include Pigment Yellow 12, 13, 17, 20, 24, 83, 86, 93, 95, 109, 110, 117, 125, 129, 137, 138, 139, 147, 148, 150, 153.
- Yellow organic pigments such as 154, 166, 168 or 185, orange organic pigments such as pigment orange 13, 36, 38, 43, 51, 55, 59, 61, 64, 65 or 71, pigment red 9, 48, Red organic pigments such as 97, 122, 123, 144, 149, 166, 168, 177, 179, 180, 192, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240 or 254 Pigment Violet 19, 23, 29, 30, 32, 37, 40 or 50 Purple organic pigments, blue organic pigments such as pigment blue 15, 15: 3, 15: 4, 15: 6, 22, 60 or 64, green organic pigments such as pigment green 7, 10 or 36, or carbon Examples include black organic pigments such as black, perylene black
- organic pigments may be subjected to surface treatment such as rosin treatment, acidic group treatment or basic treatment, if necessary.
- the inorganic pigment for example, iron oxide, cadmium sulfide, titanium nickel antimony, titanium nickel barium, strontium chromate, viridian, chromium oxide, cobalt aluminate or titanium nitride, metal fine particles, metal oxide, composite oxide, A metal sulfide, a metal nitride, or a metal oxynitride is mentioned.
- These inorganic pigments may be surface-treated with other inorganic components or organic components, but are preferably surface-treated with other inorganic components from the viewpoint of heat resistance.
- the negative photosensitive transparent material of the present invention does not contain a colorant other than (A) a white pigment
- (A) the white pigment has a lower shielding property than other colorants.
- the film thickness of the resulting cured film must be 10 ⁇ m or more, preferably 15 ⁇ m or more, and more preferably 20 ⁇ m or more. In this case, the crack resistance of the cured film obtained is very important.
- the negative photosensitive coloring composition of the present invention may contain a pigment dispersant in order to improve dispersibility.
- the negative photosensitive composition of the present invention contains (C) a polyfunctional acrylic monomer.
- (C) polyfunctional acrylic monomer refers to a compound having a plurality of (meth) acryloyl groups.
- Examples of (C) polyfunctional acrylic monomers include bisphenol A diglycidyl ether (meth) acrylate, poly (meth) acrylate carbamate, modified bisphenol A epoxy (meth) acrylate, and 1,6-hexanediol (meth) acrylic acid adipic acid.
- Acid ester phthalic anhydride propylene oxide (meth) acrylic acid ester, trimellitic acid diethylene glycol (meth) acrylic acid ester, rosin-modified epoxy di (meth) acrylate or alkyd-modified (meth) acrylate oligomer, tripropylene glycol di (meth) Acrylate, 1,6-hexanediol di (meth) acrylate, bisphenol A diglycidyl ether di (meth) acrylate, trimethylolpropane tri (meth) acrylate Rate, pentaerythritol tri (meth) acrylate, triacryl formal, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol penta (meth) acrylate, tripentaerythritol hepta (meth) acrylate, tri Pentaery
- Examples of the compound represented by the general formula (4) include ethoxylated isocyanuric acid diacrylate, ethoxylated isocyanuric acid triacrylate, and ⁇ -caprolactone-modified tris- (2-acryloxyethyl) isocyanurate.
- the negative photosensitive coloring composition of the present invention contains (D) a radical photopolymerization initiator.
- the photoradical polymerization initiator refers to one that decomposes and / or reacts with light (including ultraviolet rays and electron beams) to generate radicals.
- Examples of (D) photo radical polymerization initiators include 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl 2-dimethylamino-1- (4-morpho Linophenyl) -butan-1-one, 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinophenyl) -butan-1-one, 2, 4,6-trimethylbenzoylphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, bis (2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl) -phosphine Oxide, 1,2-octanedione, 1- [4- (phenylthio) -2- (O-benzoyloxime)], ethanone, 1- [ -Ethyl-6- (2-methylbenzoyl)
- the negative photosensitive transparent material of the present invention does not contain a colorant other than (A) a white pigment, 2,4,6-trimethylbenzoylphenylphosphine oxide, bis (2 Acylphosphine oxide photopolymerization initiators such as, 4,6-trimethylbenzoyl) -phenylphosphine oxide or bis (2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl) -phosphine oxide preferable.
- a colorant other than (A) a white pigment 2,4,6-trimethylbenzoylphenylphosphine oxide, bis (2 Acylphosphine oxide photopolymerization initiators such as, 4,6-trimethylbenzoyl) -phenylphosphine oxide or bis (2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl) -phosphine oxide preferable.
- the negative photosensitive coloring composition of the present invention contains (E) an organic solvent.
- the organic solvent is preferably an alcohol compound, an ester compound or an ether compound in order to uniformly dissolve each component of the composition, but from the viewpoint of pigment dispersibility, an ester compound or an ether compound is more preferred. preferable.
- a compound having a boiling point of 110 ° C. to 250 ° C. under atmospheric pressure is preferable. Since the negative photosensitive coloring composition of the present invention is supposed to be applied by a printing method such as spin coater, slit coater, screen printing, ink jet or bar coater, the organic solvent is dried when the boiling point is less than 110 ° C. The speed is fast and defects in coating uniformity are likely to occur. On the other hand, when the boiling point exceeds 250 ° C., the organic solvent remains in the obtained cured film, and the heat resistance of the cured film is deteriorated.
- Examples of the organic solvent include propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diacetone alcohol, ethylene glycol mononormal butyl ether, 2-ethoxyethyl acetate, 1-methoxypropyl-2-acetate, 3-methoxy- 3-methylbutanol, 3-methoxy-3-methylbutanol acetate, 3-methoxybutyl acetate, 1,3-butylene glycol diacetate, ethylene glycol monobutyl ether acetate, diethylene glycol monobutyl ether acetate, ethyl lactate, butyl lactate, ethyl acetoacetate Alternatively, ⁇ -butyrolactone can be mentioned.
- thermosetting coloring composition of the present invention may contain a surfactant in order to improve applicability.
- a surfactant include a fluorine-based surfactant, a silicone-based surfactant, a polyalkylene oxide-based surfactant, and a poly (meth) acrylate-based surfactant.
- the negative photosensitive coloring composition of the present invention may contain (F) a polyfunctional thiol compound.
- (F) The taper shape of a pattern edge becomes loose by containing a polyfunctional thiol compound. Moreover, adhesiveness with glass can be improved and development peeling can be suppressed. Furthermore, the tolerance with respect to the chemical
- the addition amount of the polyfunctional thiol compound is preferably 0.1 to 5 parts by mass with respect to 100 parts by mass in total of (B) polysiloxane and (C) polyfunctional acrylic monomer. (F) If the addition amount of the polyfunctional thiol compound is less than 0.1 parts by mass, the effect of improving the chemical resistance may not be sufficiently obtained. The characteristic odor becomes stronger.
- an ester compound of a polyhydric alcohol compound and a carboxylic acid compound having a secondary or tertiary mercapto group is preferable from the viewpoint of storage stability of the composition.
- polyhydric alcohol compound examples include alkylene glycol (wherein the alkylene group has 2 to 10 carbon atoms and may be branched), diethylene glycol, dipropylene glycol, glycerin, trimethylolpropane, tris ( 2-hydroxyethyl) isocyanurate, pentaerythritol or dipentaerythritol.
- Examples of the carboxylic acid compound having a secondary or tertiary mercapto group include 2-mercaptopropionic acid, 3-mercaptobutanoic acid, 2-mercaptoisobutanoic acid, 4-mercaptopentanoic acid, and 3-mercaptopentanoic acid.
- thiol compounds examples include pentaerythritol tetrakis (2-mercaptopropionate), trimethylolpropane tris (2-mercaptopropionate), trimethylol ethanetris (2-mercaptopropionate), glycerin tris ( 2-mercaptopropionate), tris (2-mercaptopropionate) ethoxy isocyanurate, ethylene glycol bis (2-mercaptopropionate), 1,2-propylene glycol (2-mercaptopropionate), 1, 4-butylene glycol (2-mercaptopropionate), diethylene glycol bis (2-mercaptopropionate), dipropylene glycol bis (2-mercaptopropionate), pentaerythritol tetrakis (3-mercaptobutyrate), trimethylolpropane tris (3-mercaptobutyrate), trimethylolethane tris (3-mercaptobutyrate), glycerin tris (3-mercaptobut
- Examples of other thiol compounds include 1,4-butanedithiol, 1,5-pentanedithiol, 1,6-hexanedithiol, 1,9-nonanedithiol, pentaerythritol tetrakis (3-mercaptopropionate), tri Methylolpropane tris (3-mercaptopropionate), trimethylolethane tris (3-mercaptopropionate), glycerin tris (3-mercaptopropionate), tris (3-mercaptopropionate) ethoxyisocyanurate, ethylene Glycol bis (3-mercaptopropionate), 1,2-propylene glycol (3-mercaptopropionate), 1,4-butylene glycol (3-mercaptopropionate), diethylene glycol bis (3-mercapto Propionate) or dipropylene glycol bis (3-mercaptopropionate) and the like.
- F When adding a polyfunctional thiol compound to the negative
- the negative photosensitive coloring composition of the present invention may contain (G) an alicyclic epoxy compound.
- G Since the alicyclic epoxy compound has high heat resistance, yellowing after the additional heat treatment can be suppressed while improving chemical resistance.
- the addition amount of the alicyclic epoxy compound is preferably 0.1 to 15 parts by mass or less with respect to 100 parts by mass in total of (B) polysiloxane and (C) polyfunctional acrylic monomer.
- the addition amount of the alicyclic epoxy compound is less than 0.1 parts by mass, the effect of improving the adhesion may not be sufficiently obtained, and when it exceeds 15 parts by mass, the storage stability of the composition May be reduced, making it difficult to handle the composition.
- Examples of (G) alicyclic epoxy compounds include 3 ', 4'-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, 1,2-epoxy of 2,2-bis (hydroxymethyl) -1-butanol -4- (2-oxiranyl) cyclohexane adduct, ⁇ -caprolactone modified 3 ′, 4′-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarboxylate, 1,2-epoxy-4-vinylcyclohexane, butanetetracarboxylic Acid tetra (3,4-epoxycyclohexylmethyl) modified ⁇ -caprolactone, 3,4-epoxycyclohexylmethyl methacrylate, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol E diglycidyl Ether, hydrogenated bisphenol A bis (prop
- the negative photosensitive coloring composition of the present invention may contain (H) a silane coupling agent represented by the following general formula (6).
- a silane coupling agent represented by the following general formula (6) is 0.1 to 15 parts by mass with respect to 100 parts by mass in total of (B) polysiloxane and (C) polyfunctional acrylic monomer. preferable.
- the addition amount of the silane coupling agent represented by the following general formula (6) is less than 0.1 parts by mass, the effect of improving the adhesion may not be sufficiently obtained.
- the cured film may turn yellow.
- R 14 independently represents an alkyl group having 1 to 6 carbon atoms or a substituent thereof.
- P represents 0 or 1.
- R 15 represents a trivalent organic group having 3 to 30 carbon atoms.
- R 16 each independently represents an alkyl group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a phenyl group or a phenoxy group, or a substituent thereof.
- R 14 a methyl group, an ethyl group, and a butyl group are preferable, and a methyl group and an ethyl group are particularly preferable from the viewpoint of obtaining raw materials.
- R 15 is preferably an alkyl group, and particularly preferably an alkyl group having 3 to 10 carbon atoms from the viewpoint of solubility in an organic solvent.
- Examples of the silane coupling agent represented by the general formula (6) include 3- (tert-butylcarbamoyl) -6- (trimethoxysilyl) hexanoic acid and 2- (2- (tert-butyl).
- silane coupling agent represented by the general formula (6) When the silane coupling agent represented by the general formula (6) is added to the negative photosensitive coloring composition of the present invention, it may be used alone or may be mixed.
- a more preferable combination is 3- (tert-butylcarbamoyl) -6- (trimethoxysilyl) hexanoic acid, 2- (2- (tert-butylamino) -2-oxoethyl, from the viewpoint of easy availability of raw materials. ) -5- (trimethoxysilyl) pentanoic acid or 3- (tert-pentylcarbamoyl) -6- (trimethoxysilyl) hexanoic acid, 2- (2- (tert-pentylamino) -2-oxoethyl) A combination of -5- (trimethoxysilyl) pentanoic acid is preferred.
- the negative photosensitive coloring composition of the present invention may contain (I) an ultraviolet absorber.
- an ultraviolet absorber By containing the ultraviolet absorber, the resolution can be improved while maintaining the tapered shape of the pattern edge portion.
- the addition amount of the ultraviolet absorber is preferably 0.01 to 10 parts by mass, and 0.1 to 5 parts by mass with respect to 100 parts by mass in total of (B) polysiloxane and (C) polyfunctional acrylic monomer. More preferred.
- the addition amount of the ultraviolet absorber is less than 0.01 parts by mass, the effect of improving the pattern shape control may not be sufficiently obtained, and when it exceeds 10 parts by mass, the cured film may turn yellow. is there.
- the ultraviolet absorber is preferably a benzotriazole compound, a benzophenone compound or a triazine compound from the viewpoint of transparency and non-coloring properties, and more preferably a triazine compound from the viewpoint of heat resistance.
- UV absorbers for benzotriazole compounds include 2- (2H-benzotriazol-2-yl) phenol, 2- (2H-benzotriazol-2-yl) -4,6-tert-pentylphenol, 2- (2H-benzotriazol-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol, 2 (2H-benzotriazol-2-yl) -6-dodecyl-4-methylphenol, 2- (2′-hydroxy-5′-methacryloxyethylphenyl) -2H-benzotriazole, 2- (2H-benzotriazol-2-yl) -4,6-bis (1-methyl-1-phenylethyl) phenol, 2- (2H-Bentriazol-2-yl) -4-methyl-6- (3,4,5,6-tetrahydrophthalimido-yl- Til) phenol or 2- (2H-benzotriazol-2-yl) -6- (1-methyl-1-phenyle
- Examples of the benzophenone-based ultraviolet absorber include 2-hydroxy-4-methoxybenzophenone.
- Examples of the ultraviolet absorber of the triazine compound include 2- (4,6-diphenyl-1,3,5 triazin-2-yl) -5-[(hexyl) oxy] -phenol, 2- (4,6 A reaction product of bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl-5-hydroxyphenyl and oxirane [(C10-C16 mainly C12-C13 alkyloxy) methyl] oxirane; 2- [2-Hydroxy-4- [3- (2-ethylhexyl-1-oxy) -2-hydroxypropyloxy] phenyl] -4,6-bis (2,4-dimethylphenyl) -1,3,5 -Triazine, 2,4-bis [2-hydroxy-4-butoxyphenyl] -6- (2,4-dibutoxyphenyl) -1,3,
- the negative photosensitive coloring composition of the present invention and the negative photosensitive coloring composition of the present invention may contain (J) a radical scavenger. (J) Due to the antioxidant effect of the radical scavenger, yellowing after the heat treatment in the subsequent step is suppressed, and light resistance is improved.
- the addition amount of the radical scavenger is preferably 0.01 to 10 parts by mass, more preferably 0.15 parts by mass or less, with respect to 100 parts by mass in total of (B) polysiloxane and (C) polyfunctional acrylic monomer. preferable.
- the addition amount of the radical scavenger is less than 0.01 parts by mass, the effect of improving the pattern shape control may not be sufficiently obtained, and when it exceeds 10 parts by mass, the cured film may turn yellow. is there.
- a hindered phenol compound or a hindered amine compound having an Mw of 300 or more or having a radical polymerizable group is preferable because it is excellent in the effect of suppressing discoloration of the cured film. If Mw is less than 300 and does not contain a radically polymerizable group, it may sublime at the time of thermosetting, and a sufficient antioxidant effect may not be obtained. Further, the amount of the phenol group or amino group in one molecule is preferably 2 or more and more preferably 4 or more because a radical scavenging effect is easily obtained.
- hindered phenol compound examples include tert-butylpyrocatechol, dibutylhydroxytoluene, okdadecyl 3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate, hexamethylenebis [3 (3,5- Di-t-butyl-4-hydroxyphenylpropionate, thiodiethylenebis [3 (3,5-di-t-butyl-4-hydroxyphenylpropionate, ethylenebis (oxyethylene) bis (3- (5-t -Butyl-4-hydroxy-m-tolyl) propionate, tris- (3,5-di-t-butyl-4-hydroxybenzyl) -isocyanurate, 1,3,5-trimethyl-2,4,6-tris (3,5-di-tert-butyl-4-hydroxybenzyl) benzene, pentaerythritol tetra Kis (3- (3,5-di-tert-butyl-4-
- hindered amine compound examples include bis (1,2,2,6,6-pentamethyl-4-piperidyl) [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] butylmalo.
- a typical method for producing the negative photosensitive coloring composition of the present invention will be described below.
- a mixed liquid of (A) white pigment, (B) polysiloxane and (E) organic solvent is dispersed using a mill type disperser filled with zirconia beads to obtain a pigment dispersion.
- (B) polysiloxane, (C) polyfunctional acrylic monomer, (D) photoradical polymerization initiator, (E) organic solvent and other additives are dissolved by stirring to obtain a diluted solution.
- a negative photosensitive coloring composition is obtained by mixing, stirring, and filtering a dispersion liquid and a dilution liquid.
- the following five steps (i) to (v) can be used so that the display and the semiconductor manufacturing apparatus can be used as they are. Because there is, it is preferable.
- substrate examples include spin coater, slit coater, screen printing, ink jet, and bar coater.
- the heating method include a heating device such as a hot plate or an oven. The heating conditions are generally 60 to 15 ° C. and 30 seconds to 3 minutes. The film thickness after pre-baking after drying is preferably 5 to 30 ⁇ m.
- Examples of the step exposure method for exposing the dried substrate through a mask include an exposure machine such as a stepper, a mirror projection mask aligner (MPA), or a parallel light mask aligner (hereinafter referred to as “PLA”). .
- an exposure intensity of about 10 to 4000 J / m 2 (wavelength 365 nm exposure amount conversion) is generally used.
- Examples of the exposure light source include ultraviolet rays such as i-line, g-line, and h-line, KrF (wavelength 248 nm) laser, and ArF (wavelength 193 nm) laser.
- a step of developing the exposed substrate using a developer to form a pattern is preferable to immerse in a developer for 5 seconds to 10 minutes by a method such as shower, dipping or paddle.
- the developer include inorganic alkalis such as alkali metal hydroxides, carbonates, phosphates, silicates and borates, amines such as 2-diethylaminoethanol, monoethanolamine and diethanolamine, or tetramethyl Examples include aqueous solutions of quaternary ammonium salts such as ammonium hydroxide and choline.
- (V) A step of curing the substrate after development by heating.
- the heating method include a heating device such as a hot plate or an oven.
- the heating conditions are preferably 120 to 250 ° C. and 15 minutes to 2 hours.
- the method for forming a cured film from the negative photosensitive resin composition of the present invention through the above five steps (i) to (v) is excellent in pattern dimensions and pattern linearity.
- the cured film obtained is suitable as a light shielding pattern in an OGS type touch panel because it is excellent in light shielding properties and reflection color characteristics.
- the OD value of the light shielding pattern is preferably 0.6 or more and more preferably 0.7 or more because the wiring formed on the light shielding pattern can be shielded.
- a negative photosensitive coloring composition is spin-coated on a 10 cm square alkali-free glass substrate at an arbitrary rotation number, and the substrate is heated to 100 ° C. using a hot plate (SCW-636; manufactured by Dainippon Screen Mfg. Co., Ltd.). For 2 minutes to form a cured film having a thickness of 10 ⁇ m.
- PLA PLA-501F; manufactured by Canon Inc.
- an ultrahigh pressure mercury lamp as a light source
- an exposure amount of 200 mJ through a mask having line & space patterns of 150 ⁇ m width, 100 ⁇ m width and 80 ⁇ m width) i line
- the developed pattern was observed with an optical microscope, and the narrowest line width with no residue in the unexposed area was defined as the resolution.
- “> 150 ⁇ m” was set.
- the developed substrate was cured for 30 minutes at 230 ° C. in air using an oven (IHPS-222; manufactured by Espec Corp.) to form a cured film.
- IHPS-222 manufactured by Espec Corp.
- a 150 ⁇ m-wide line & space pattern section of the obtained cured film was cut out and observed using a scanning electron microscope, and the pattern shape was evaluated based on the following criteria. However, no evaluation was performed when the resolution was “> 150 ⁇ m”.
- the cured film for film characteristic evaluation was additionally heat-treated at 240 ° C. in air for 2 hours using an oven (IHPS-222 manufactured by Espec Corp.). Using a spectrophotometer (UV-2450; manufactured by Shimadzu Corporation), the cured film after additional heat treatment was measured for the reflectance of the totally reflected light of the cured film after curing from the glass substrate side, and CIE 1976 (L *, The values displayed in the a *, b *) color space were compared with the evaluation results of the above color characteristics, and the color difference (hereinafter referred to as “ ⁇ Eab”) was calculated by the following equation (I).
- ⁇ Eab (X1 ⁇ 2 + X2 ⁇ 2 + X3 ⁇ 2) ⁇ 0.5 Formula (I) here, X1: ⁇ L * (0) ⁇ - ⁇ L * (1) ⁇ X2: ⁇ a * (0) ⁇ - ⁇ a * (1) ⁇ X3: ⁇ b * (0) ⁇ - ⁇ b * (1) ⁇ L * (0), a * (0), and b * (1) ⁇ L * (0), a * (0), and b * (1) ⁇ L * (0), a * (0), and b * (1) ⁇ L * (0), a * (0), and b * (0) respectively indicate the values of L *, a *, and b * of the cured film for film property evaluation, and L * (1) , A * (1), b * (1) respectively indicate the values of L *, a *, and b * of the cured film subjected to additional heat treatment.
- the negative photosensitive transparent composition was applied with a spin coater so that the film thickness after curing was 2 ⁇ m, and the substrate was heated at 100 ° C. for 2 minutes using a hot plate. Pre-baked to produce a cured film with a thickness of 2 ⁇ m.
- the entire surface was exposed using PLA with an ultrahigh pressure mercury lamp as a light source and an exposure amount of 100 mJ (i-line). Thereafter, using an automatic developing device, shower development was performed for 60 seconds with a 2.38 mass% aqueous tetramethylammonium hydroxide solution, followed by rinsing with water for 30 seconds. Finally, the film was cured in an oven at 230 ° C. for 30 minutes to form a transparent protective film on the cured film for film characteristic evaluation.
- ITO etching solution 200 g was put into a 500 cc glass beaker, and the internal temperature was adjusted to 50 ° C. with a hot water bath. There, the cured film having 100 squares was immersed for 2 minutes together with the glass substrate, and further immersed for 30 seconds in pure water prepared in another container.
- a resist stripping solution (N-300; manufactured by Nagase ChemteX Corp.) was placed in a glass beaker and adjusted so that the internal temperature became 70 ° C. with a hot water bath.
- the cured film treated with the ITO etching solution was immersed in the glass substrate for 4 minutes and further immersed in pure water prepared in another container for 30 seconds.
- the cured film subjected to the above treatment was evaluated in the same manner as the above-mentioned “Evaluation of Adhesiveness”.
- Synthesis Example 1 Synthesis of Siloxane Resin Solution (b-1) 6.01 g of dimethoxydimethylsilane (0.05 mol), 122.18 g of dimethoxydiphenylsilane (0.50 mol), 46.86 g of 3-acrylic acid Roxypropyltrimethoxysilane (0.20 mol), 13.12 g 3-trimethoxysilylpropyl succinic anhydride (0.05 mol), 12.32 g 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane (0.05 mol), 29.75 g phenyltrimethoxysilane (0.15 mol) and 156.52 g propylene glycol monomethyl ether acetate were charged into a 500 mL three-necked flask.
- Synthesis Example 6 Synthesis of Siloxane Resin Solution (b-6) First, the three-necked flask was charged with 48.09 g dimethoxydimethylsilane (0.40 mol), 36.65 g dimethoxydiphenylsilane (0.15 mol).
- siloxane resin solution (b-8) was obtained in the same manner as in Synthesis Example 1 except that propyltrimethoxysilane (0.05 mol) and 124.74 g of propylene glycol monomethyl ether acetate were used.
- siloxane resin solution (b-9) was obtained in the same manner as in Synthesis Example 1 except that propyltrimethoxysilane (0.05 mol) and 124.74 g of propylene glycol monomethyl ether acetate were used.
- siloxane resin solution (b-19) was obtained in the same manner as in Synthesis Example 1, except that propyltrimethoxysilane (0.05 mol) and 146.26 g of propylene glycol monomethyl ether acetate were used.
- siloxane resin solution (b-20) was obtained in the same manner as in Synthesis Example 1, except that propyltrimethoxysilane (0.05 mol) and 147.92 g of propylene glycol monomethyl ether acetate were used.
- siloxane resin solution (b-21) was obtained in the same manner as in Synthesis Example 1, except that propyltrimethoxysilane (0.05 mol) and 149.40 g of propylene glycol monomethyl ether acetate were used.
- Synthesis Example 22 Synthesis of Siloxane Resin Solution (b-22) First, the three-necked flask was charged with 66.12 g of dimethoxydimethylsilane (0.55 mol) and 46.86 g of 3-acryloxypropyltrimethoxysilane.
- siloxane resin solution (b-23) was obtained in the same manner as in Synthesis Example 1 except that propyltrimethoxysilane (0.05 mol) and 124.74 g of propylene glycol monomethyl ether acetate were used.
- siloxane resin solution (b-24) was obtained in the same manner as in Synthesis Example 1 except that (Synthesis Example 25) Synthesis of Siloxane Resin Solution (b-25) First, the three-necked flask was charged with 48.09 g of dimethoxydimethylsilane (0.40 mol), 85.53 g of dimethoxydiphenylsilane (0.35 mol).
- Synthesis Example 26 Synthesis of Siloxane Resin Solution (b-26) First, a three-necked flask was charged with 46.86 g of 3-acryloxypropyltrimethoxysilane (0.20 mol), 13.12 g of 3-trimethyl Methoxysilylpropyl succinic anhydride (0.05 mol), 12.32 g 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane (0.05 mol), 138.81 g phenyltrimethoxysilane (0.70) Mol) and 138.87 g of propylene glycol monomethyl ether acetate, a siloxane resin solution (b-26) was obtained in the same manner as in Synthesis Example 1.
- Methoxysilylpropyl succinic anhydride (0.05 mol), 12.32 g 3- (3,4-epoxycyclohexyl) propyltrimethoxysilane (0.05 mol), 27.24 g methyltrimethoxysilane (0.20) Mol), 79.32 g of phenyltrimethoxysilane (0.40 mol) and 134.62 g of propylene glycol monomethyl ether acetate, to obtain a siloxane resin solution (b-27) in the same manner as in Synthesis Example 1. .
- a siloxane resin solution (b-29) was obtained in the same manner as in Synthesis Example 1 except that phenyltrimethoxysilane (0.25 mol) and 131.21 g of propylene glycol monomethyl ether acetate were used.
- the obtained solution was diluted with PGMEA so that the solid content concentration was 20% by mass, and 3- (tert-butylcarbamoyl) -6- (trimethoxysilyl) hexanoic acid, 2- (2- (tert-butyl) was obtained.
- a mixed solution (g-1) of amino) -2-oxoethyl) -5- (trimethoxysilyl) pentanoic acid was obtained.
- Example 1 After mixing 13.00 g of white pigment, that is, titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd.), 26.00 g of siloxane resin solution (b-1) and 1.00 g of propylene glycol monomethyl ether, zirconia Dispersion was carried out using a mill type disperser filled with beads to obtain a pigment dispersion (MW-1).
- white pigment that is, titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd.
- siloxane resin solution (b-1) and 1.00 g of propylene glycol monomethyl ether, zirconia Dispersion was carried out using a mill type disperser filled with beads to obtain a pigment dispersion (MW-1).
- Example 2 A pigment dispersion (MW-2) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-2) was used instead of the siloxane resin solution (b-1). (W-2) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 3 A pigment dispersion (MW-3) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-3) was used instead of the siloxane resin solution (b-1). (W-3) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 4 A pigment dispersion (MW-4) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-4) was used instead of the siloxane resin solution (b-1). (W-4) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 5 A pigment dispersion (MW-5) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-5) was used instead of the siloxane resin solution (b-1). (W-5) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 6 A pigment dispersion (MW-6) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-6) was used instead of the siloxane resin solution (b-1). (W-6) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 7 A pigment dispersion (MW-7) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-7) was used instead of the siloxane resin solution (b-1). (W-7) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 8 A pigment dispersion (MW-8) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-8) was used instead of the siloxane resin solution (b-1). (W-8) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 9 A pigment dispersion (MW-9) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-9) was used instead of the siloxane resin solution (b-1). (W-9) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 10 A pigment dispersion (MW-10) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-11) was used instead of the siloxane resin solution (b-1). (W-10) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 11 A negative photosensitive coloring composition (W-11) was prepared in the same manner as in Example 10 except that pentaerythritol tetrakis (3-mercaptobutyrate) (Karenz MT-PE1; manufactured by Showa Denko KK) was not added. Obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 12 A pigment dispersion (MW-12) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-12) was used instead of the siloxane resin solution (b-1). (W-12) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 13 A pigment dispersion (MW-13) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-13) was used instead of the siloxane resin solution (b-1). (W-13) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 14 A pigment dispersion (MW-14) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-14) was used instead of the siloxane resin solution (b-1). (W-14) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 15 A pigment dispersion (MW-15) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-15) was used instead of the siloxane resin solution (b-1). (W-15) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 16 A pigment dispersion (MW-16) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-16) was used instead of the siloxane resin solution (b-1). (W-16) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 17 A pigment dispersion (MW-17) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-17) was used instead of the siloxane resin solution (b-1). (W-17) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 18 A pigment dispersion (MW-18) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-18) was used instead of the siloxane resin solution (b-1). (W-18) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 19 A pigment dispersion (MW-19) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-19) was used instead of the siloxane resin solution (b-1). (W-19) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 20 A pigment dispersion (MW-20) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-20) was used instead of the siloxane resin solution (b-1). (W-20) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 21 A pigment dispersion (MW-21) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-21) was used instead of the siloxane resin solution (b-1). (W-21) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 22 A pigment dispersion (MW-22) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-23) was used instead of the siloxane resin solution (b-1). (W-22) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 23 A pigment dispersion (MW-23) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-24) was used instead of the siloxane resin solution (b-1). (W-23) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 24 A pigment dispersion (MW-24) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-25) was used instead of the siloxane resin solution (b-1). (W-24) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 25 instead of 5.24 g of a mixture of ethoxylated isocyanuric acid diacrylate and ethoxylated isocyanuric acid triacrylate (Aronix M-315; manufactured by Toa Gosei Co., Ltd.), 5.24 g of dipentaerythritol pentaacrylate and dipentaerythritol hexa
- a negative photosensitive coloring composition (W-25) was obtained in the same manner as in Example 10, except that an acrylate mixture (Kayarad DPHA; manufactured by Nippon Kayaku Co., Ltd.) was used. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 26 Example 10 except that 13.00 g of titanium dioxide pigment (JR-301; manufactured by Teika) was used instead of 13.00 g of titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd.) In the same manner as described above, a pigment dispersion (MW-26) and a negative photosensitive coloring composition (W-26) were obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- JR-301 manufactured by Teika
- CR-97 manufactured by Ishihara Sangyo Co., Ltd.
- Example 27 Example 10 except that 13.00 g of titanium dioxide pigment (JR-405; manufactured by Teika) was used instead of 13.00 g of titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd.) In the same manner as described above, a pigment dispersion (MW-27) and a negative photosensitive coloring composition (W-27) were obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- JR-405 manufactured by Teika
- CR-97 manufactured by Ishihara Sangyo Co., Ltd.
- Example 28 Example 10 except that 13.00 g of titanium dioxide pigment (JR-600A; manufactured by Teika) was used instead of 13.00 g of titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd.) In the same manner as described above, a pigment dispersion (MW-28) and a negative photosensitive coloring composition (W-28) were obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- JR-600A manufactured by Teika
- CR-97 manufactured by Ishihara Sangyo Co., Ltd.
- Example 29 Example 10 except that 13.00 g of titanium dioxide pigment (JR-603; manufactured by Teika) was used instead of 13.00 g of titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd.)
- a pigment dispersion (MW-29) and a negative photosensitive coloring composition (W-29) were obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 30 Example 10 except that 13.00 g of titanium dioxide pigment (R960; manufactured by DuPont) was used instead of 13.00 g of titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd.) Thus, a pigment dispersion (MW-30) and a negative photosensitive coloring composition (W-30) were obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 31 instead of 0.79 g of bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (Irgacure 819; manufactured by BASF), 0.79 g of 2-methyl-1- (4-methylthiophenyl) -2 A negative photosensitive coloring composition (W-31) was obtained in the same manner as in Example 10 except that -morpholinopropan-1-one (Irgacure 907; manufactured by BASF) was used. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 32 A pigment dispersion (MW-32) was obtained in the same manner as in Example 1, except that the siloxane resin solution (b-10) was used instead of the siloxane resin solution (b-1).
- Example 33 A pigment dispersion (MW-33) and a negative photosensitive coloring composition were used in the same manner as in Example 32 except that the siloxane resin solution (b-11) was used instead of the siloxane resin solution (b-10). (W-33) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 34 A pigment dispersion (MW-34) and a negative photosensitive coloring composition were used in the same manner as in Example 32 except that the siloxane resin solution (b-22) was used instead of the siloxane resin solution (b-10). (W-34) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 35 A pigment dispersion (MW-10) was obtained in the same manner as in Example 1 except that the siloxane resin solution (b-11) was used instead of the siloxane resin solution (b-1).
- 32.23 g of pigment dispersion (MW-10) 5.24 g of a mixture of ethoxylated isocyanuric acid diacrylate and ethoxylated isocyanuric acid triacrylate (Aronix M-315; manufactured by Toagosei Co., Ltd.), 0 79 g of bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (Irgacure 819; manufactured by BASF), 0.52 g of pentaerythritol tetrakis (3-mercaptobutyrate) (Karenz MT-PE1; Showa Denko) Co., Ltd.) and 11.22 g of propylene glycol monomethyl ether were mixed with stirring to obtain a negative photosensitive coloring composition (
- Example 36 A pigment dispersion (MW-10) was obtained in the same manner as in Example 1 except that the siloxane resin solution (b-11) was used instead of the siloxane resin solution (b-1).
- Example 37 A pigment dispersion (MW-10) was obtained in the same manner as in Example 1 except that the siloxane resin solution (b-11) was used instead of the siloxane resin solution (b-1).
- Example 38 A pigment dispersion (MW-10) was obtained in the same manner as in Example 1 except that the siloxane resin solution (b-11) was used instead of the siloxane resin solution (b-1).
- Example 39 A pigment dispersion (MW-10) was obtained in the same manner as in Example 1 except that the siloxane resin solution (b-11) was used instead of the siloxane resin solution (b-1).
- Example 40 A pigment dispersion (MW-10) was obtained in the same manner as in Example 1 except that the siloxane resin solution (b-11) was used instead of the siloxane resin solution (b-1).
- Example 41 instead of 13.00 g of titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd.), 13.74 g of titanium dioxide pigment (CR-97; manufactured by Ishihara Sangyo Co., Ltd.) and 0.26 g of titanium nitride
- a pigment dispersion (MG-1) and a negative photosensitive coloring composition (G-1) were prepared in the same manner as in Example 10 except that particles (Bk-1; manufactured by Nissin Engineering Co., Ltd.) were used. Obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated. However, since the obtained coating film was gray, the color characteristics were not evaluated.
- Example 42 Production of Touch Panel Substrate A touch panel substrate was produced by the following procedure.
- the resulting film was subjected to pattern exposure with an ultra-high pressure mercury lamp through a mask, followed by shower development with a 2.38 mass% TMAH aqueous solution for 90 seconds using an automatic developing device, and then rinsed with water for 30 seconds. . Thereafter, the ITO is etched by immersing in a 3.5 mass% oxalic acid aqueous solution for 150 seconds, and the photoresist is processed by treating with a stripping solution at 50 ° C. (“N-321” manufactured by Nagase ChemteX Corporation) for 120 seconds. The glass substrate was removed and annealed at 230 ° C. for 30 minutes to produce a 150 nm thick patterned ITO (reference numeral 3 in FIG. 1) (corresponding to b in FIG. 1).
- MAM wiring (reference numeral 5 in FIG. 1) having a film thickness of 250 nm was prepared (corresponding to d in FIG. 1) in the same manner as (1) except that a 3/5/27 (mass ratio) mixed solution was used, and the touch panel The substrate was completed (Fig. 1d, Fig. 2).
- a continuity test was performed on the obtained touch panel substrate.
- Example 1 A pigment dispersion (MWH-1) and a negative photosensitive coloring composition were used in the same manner as in Example 32 except that the siloxane resin solution (b-26) was used instead of the siloxane resin solution (b-10). (WH-1) was obtained. Using this composition, pattern processability and crack resistance were evaluated. At this time, cracks occurred in the cured film having a thickness of 10 ⁇ m, and thus various film characteristics were not evaluated.
- Example 2 A pigment dispersion (MWH-2) and a negative photosensitive coloring composition were used in the same manner as in Example 32 except that the siloxane resin solution (b-27) was used instead of the siloxane resin solution (b-10). (WH-2) was obtained. Using this composition, pattern processability and crack resistance were evaluated. At this time, cracks occurred in the cured film having a thickness of 10 ⁇ m, and thus various film characteristics were not evaluated.
- Example 3 A pigment dispersion (MWH-3) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-28) was used instead of the siloxane resin solution (b-1). (WH-3) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Example 4 A pigment dispersion (MWH-4) and a negative photosensitive coloring composition were used in the same manner as in Example 1 except that the siloxane resin solution (b-29) was used instead of the siloxane resin solution (b-1). (WH-4) was obtained. Using this composition, pattern processability, crack resistance, and various film properties were evaluated.
- Table 1 shows the composition of the alkoxysilane compound when synthesizing the siloxane resin solutions (b-1) to (b-29) used in the examples and comparative examples. Moreover, the component ratio of an Example and a comparative example is shown in Table 2, Table 3, and an evaluation result is shown in Table 4.
- the negative photosensitive coloring composition of the present invention not only is excellent in chemical resistance, it is extremely excellent in heat resistance and does not cause yellowing or cracks even after high temperature treatment, It is clear that a white light-shielding pattern can be formed.
- a Top view after forming a white light-blocking cured film
- b Top view after forming a transparent electrode
- c Top view after forming an insulating film
- d Top view after forming metal wiring 1: Glass substrate 2: White light-blocking cured film 3 : Transparent electrode 4: Transparent insulating film 5: Wiring electrode
- a cured film obtained by curing the negative photosensitive coloring composition of the present invention is suitably used as a light shielding pattern for a touch panel.
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Abstract
Description
一般式(1)で示される化合物としては、例えば、ジメトキシジメチルシラン、ジエトキシジメチルシラン、ジメトキシジフェニルシラン、ジエトキシジフェニルシラン、ジヒドロキシジフェニルシラン、ジメトキシ(メチル)(フェニル)シラン、ジエトキシ(メチル)(フェニル)シラン、ジメトキシ(メチル)(フェネチル)シラン、ジシクロペンチルジメトキシシラン又はシクロヘキシルジメトキシ(メチル)シランが挙げられるが、クラック耐性を向上させるため、ジメトキシジフェニルシラン、ジエトキシジフェニルシラン又はジヒドロキシジフェニルシランが好ましい。
上記の一般式(1)~(3)及び(5)で示される化合物以外のアルコキシシラン化合物としては、例えば、メチルトリメトキシシラン、エチルトリメトキシシラン、フェニルトリメトキシシラン、フェネチルトリメトキシシラン、ナフチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリエトキシシラン、フェニルトリエトキシシラン、フェネチルトリエトキシシラン、ナフチルトリエトキシシラン、テトラメトキシシラン又はテトラエトキシシランが挙げられる。
本発明のネガ型感光性着色組成物は、(D)光ラジカル重合開始剤を含有する。ここで(D)光ラジカル重合開始剤とは、光(紫外線、電子線を含む)により分解及び/又は反応し、ラジカルを発生させるものをいう。
ここで、R14としては、メチル基、エチル基、ブチル基が好ましく、特に原料入手の点からメチル基、エチル基が好ましい。R15としては、アルキル基が好ましく、特に有機溶剤への溶解性の点から炭素数3~10のアルキル基が好ましい。
塗布方式としては、例えば、スピンコーター、スリットコーター、スクリーン印刷、インクジェット又はバーコーターが挙げられる
(ii)塗布後の基板を減圧及び/又は加熱により乾燥(プリベーク)する工程。
加熱方法としては、例えば、ホットプレート又はオーブン等の加熱装置が挙げられる。加熱条件としては、60~15℃で30秒~3分間が一般的である。また、乾燥後のプリベーク後の膜厚は、5~30μmが好ましい。
露光方法としては、例えば、ステッパー、ミラープロジェクションマスクアライナー(MPA)又はパラレルライトマスクアライナー(以下、「PLA」)等の露光機が挙げられる。露光条件としては、露光強度10~4000J/m2程度(波長365nm露光量換算)が一般的である。露光光源としては、例えば、i線、g線若しくはh線等の紫外線、KrF(波長248nm)レーザー又はArF(波長193nm)レーザーが挙げられる。
現像方法としては、シャワー、ディッピング又はパドル等の方法で、現像液に5秒~10分間浸漬することが好ましい。現像液としては、例えば、アルカリ金属の水酸化物、炭酸塩、リン酸塩、ケイ酸塩若しくはホウ酸塩等の無機アルカリ、2-ジエチルアミノエタノール、モノエタノールアミン若しくはジエタノールアミン等のアミン類又はテトラメチルアンモニウムヒドロキサイド若しくはコリン等の4級アンモニウム塩の水溶液が挙げられる。現像後、水でリンスすることが好ましく、続いて50~140℃で乾燥ベークをしても構わない。
加熱方法としては、例えば、ホットプレート又はオーブン等の加熱装置が挙げられる。加熱条件としては、120~250℃で15分~2時間が好ましい。
10cm角の無アルカリガラス基板上に、ネガ型感光性着色組成物を任意の回転数でスピンコートし、基板をホットプレート(SCW-636;大日本スクリーン製造(株)製)を用いて100℃で2分間プリベークし、膜厚10μmの硬化膜を形成した。次に、PLA(PLA-501F;キヤノン(株)製)を用いて超高圧水銀灯を光源とし、150μm幅、100μm幅及び80μm幅のライン&スペースパターンを有したマスクを介して、露光量200mJ(i線)、マスクギャップ150μmで露光した。その後、自動現像装置(滝沢産業(株)製;AD-2000)を用いて、2.38質量%水酸化テトラメチルアンモニウム水溶液(ELM-D;三菱ガス化学(株)製)で60秒間シャワー現像し、次いで水で30秒間リンスした。
A:テーパー角60°未満
B:テーパー角60°以上、90°未満
C:テーパー角90°以上(アンダーカット形状)
<クラック耐性の評価>
10cm角の無アルカリガラス基板上に、ネガ型感光性着色組成物をキュア後の膜厚が5μm、10μm、15μm、及び、20μmとなるようにスピンコーター(1H-360S;ミカサ(株)製)にてそれぞれ塗布し、基板をホットプレートを用いて100℃で2分間プリベークし、硬化膜を形成した。次に、PLAを用いて超高圧水銀灯を光源とし、露光量200mJ(i線)で全面露光した。その後、自動現像装置を用いて、2.38質量%水酸化テトラメチルアンモニウム水溶液で60秒間シャワー現像し、次いで水で30秒間リンスした。最後に、オーブン(IHPS-222;エスペック(株)製)を用いて空気中230℃で1時間キュアして、硬化膜を形成した。得られた硬化膜のクラックの発生有無を目視にて確認し1つでもクラックがあれば、その膜厚でのクラック耐性はないと判断した。例えば、膜厚15μmではクラックがなく、膜厚20μmではクラックがあった場合には、耐クラック膜厚を「>15μm」と判定した。また、20μmでもクラックがない場合の耐クラック膜厚を「>20μm」、5μmでもクラックがある場合の耐クラック膜厚を「<5μm」と、それぞれ判定した。
10cm角の無アルカリガラス基板上に、ネガ型感光性着色組成物をキュア後の膜厚が10μmとなるようにスピンコーターにてそれぞれ塗布し、以降クラック耐性の評価と同様の方法で、膜特性評価用の硬化膜を形成した。なお、硬化膜にクラックがあった場合については、残りの評価を実施しなかった。
ネガ型感光性着色組成物が着色剤として白色顔料のみを含有する場合に、色特性を評価した。
ネガ型感光性着色組成物が着色剤として白色顔料のみを含有する場合に、色変化を評価した。また、追加熱処理をした硬化膜にクラックが生じた場合にも、評価を実施しなかった。
ΔEab=(X1^2+X2^2+X3^2)^0.5 ・・・ 式(I)
ここで、
X1 : {L*(0)}-{L*(1)}
X2 : {a*(0)}-{a*(1)}
X3 : {b*(0)}-{b*(1)}
であり、L*(0)、a*(0)、b*(0)は、それぞれ、膜特性評価用の硬化膜のL*,a*,b*の値を示し、L*(1)、a*(1)、b*(1)は、それぞれ、追加熱処理した硬化膜のL*,a*,b*の値を示す。
膜特性評価用の硬化膜を、カッターナイフを用いて1mm間隔で縦横に切断して、1mm×1mmのマス目を100個作製した。続いて、全てのマス目が覆われるようにセロハン粘着テープ(幅=18mm、粘着力=3.7N/10mm)を貼り付け、消しゴム(JIS S6050合格品)で擦って密着させた。その後、セロハン粘着テープの一端を持ち、これをガラス基板に直角に保ちながら瞬間的に剥離した後のマス目の残存数を確認し。剥離したマス目の割合すなわち剥離面積比率を求めた。以下の評価基準に基づき、剥離面積比率を5段階に区分した。
5B : 剥離面積=0%
4B : 剥離面積=1~4%
3B : 剥離面積=5~14%
2B : 剥離面積=15~34%
1B : 剥離面積=35~64%
0B : 剥離面積=65~100%
<ネガ型感光性透明組成物の調製>
500mLのフラスコに、3gの2,2’-アゾビス(イソブチロニトリル)及び50gのプロピレングリコールメチルエーテルアセテートを仕込んだ。その後、30gのメタクリル酸、22.48gのスチレン及び25.13gのシクロヘキシルメタクリレートを仕込み、室温でしばらく撹拌し、フラスコ内を窒素置換した後、70℃で5時間加熱撹拌した。次に、得られた溶液に、15gのメタクリル酸グリシジル、1gのジメチルベンジルアミン、0.2gのp-メトキシフェノール及び100gのプロピレングリコールモノメチルエーテルアセテートを添加し、90℃で4時間加熱撹拌した。得られたアクリル樹脂溶液を固形分濃度が40質量%になるようにプロピレングリコールモノメチルエーテルアセテートを加え、アクリル樹脂溶液を得た。得られたアクリル樹脂のMwは13500、酸価は100mgKOH/gであった。
膜特性評価用の硬化膜の表面に、ネガ型感光性透明組成物をキュア後の膜厚が2μmとなるように、スピンコーターにて塗布し、基板をホットプレートを用いて100℃で2分間プリベークし、膜厚2μmの硬化膜を作製した。次にPLAを用いて超高圧水銀灯を光源とし、露光量100mJ(i線)、で全面露光した。その後、自動現像装置を用いて、2.38質量%水酸化テトラメチルアンモニウム水溶液で60秒間シャワー現像し、次いで水で30秒間リンスした。最後に、オーブンを用いて空気中230℃で30分間キュアして、膜特性評価用の硬化膜上に透明保護膜を形成した。
500gの36質量%塩化ナトリウム水溶液、100gの60質量%硝酸水溶液及び400gの純水を混合したものを、ITOエッチング液とした。
膜特性評価用の硬化膜及び透明保護膜付き硬化膜を、それぞれ、カッターナイフを用いて1mm間隔で縦横に切断して、1mm×1mmのマス目を100個作製した。
6.01gのジメトキシジメチルシラン(0.05モル)、122.18gのジメトキシジフェニルシラン(0.50モル)、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、29.75gのフェニルトリメトキシシラン(0.15モル)及び156.52gのプロピレングリコールモノメチルエーテルアセテートを、500mLの三ツ口フラスコに仕込んだ。溶液を室温で撹拌しながら、54.0gの水に2.0gのリン酸を溶かしたリン酸水溶液を30分かけて添加した。その後、フラスコを40℃のオイルバスに浸けて30分撹拌した後、オイルバスを70℃に設定して30分間加熱し、さらにオイルバスを110℃にまで昇温した。昇温開始3時間後に、反応を終了した。このとき、溶液の内温はオイルバスの設定より5℃程度低い温度まで上昇した。反応中に生成するメタノールや消費されなかった水は、蒸留により取り除いた。得られたポリシロキサンのプロピレングリコールモノメチルエーテルアセテート溶液が、ポリマー濃度が50質量%となるようにプロピレングリコールモノメチルエーテルアセテートを加えて、シロキサン樹脂溶液(b-1)を得た。
最初に三ツ口フラスコに仕込むものを、18.03gのジメトキシジメチルシラン(0.15モル)、97.74gのジメトキシジフェニルシラン(0.40モル)、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、29.75gのフェニルトリメトキシシラン(0.15モル)及び145.06gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-2)を得た。
最初に三ツ口フラスコに仕込むものを、60.11gのジメトキシジメチルシラン(0.50モル)、12.22gのジメトキシジフェニルシラン(0.05モル)、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、29.75gのフェニルトリメトキシシラン(0.15モル)及び104.96gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-3)を得た。
最初に三ツ口フラスコに仕込むものを、48.09gのジメトキシジメチルシラン(0.40モル)、36.65gのジメトキシジフェニルシラン(0.15モル)、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、29.75gのフェニルトリメトキシシラン(0.15モル)及び116.42gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-4)を得た。
最初に三ツ口フラスコに仕込むものを、48.09gのジメトキシジメチルシラン(0.40モル)、36.65gのジメトキシジフェニルシラン(0.15モル)、49.67gの3-メタクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、29.75gのフェニルトリメトキシシラン(0.15モル)及び119.01gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-5)を得た。
最初に三ツ口フラスコに仕込むものを、48.09gのジメトキシジメチルシラン(0.40モル)、36.65gのジメトキシジフェニルシラン(0.15モル)、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、13.92gの3-グリシジロキシシプロピルトリメトキシシラン(0.05モル)、29.75gのフェニルトリメトキシシラン(0.15モル)及び117.89gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-6)を得た。
最初に三ツ口フラスコに仕込むものを、36.07gのジメトキシジメチルシラン(0.30モル)、85.53gのジメトキシジフェニルシラン(0.35モル)、35.15gの3-アクリロキシプロピルトリメトキシシラン(0.15モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、13.92gの3-グリシジロキシシプロピルトリメトキシシラン(0.05モル)、19.83gのフェニルトリメトキシシラン(0.10モル)及び131.94gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-7)を得た。
最初に三ツ口フラスコに仕込むものを、48.09gのジメトキシジメチルシラン(0.40モル)、85.53gのジメトキシジフェニルシラン(0.35モル)、35.15gの3-アクリロキシプロピルトリメトキシシラン(0.15モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、13.92gの3-グリシジロキシシプロピルトリメトキシシラン(0.05モル)及び124.74gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-8)を得た。
最初に三ツ口フラスコに仕込むものを、48.09gのジメトキシジメチルシラン(0.40モル)、85.53gのジメトキシジフェニルシラン(0.35モル)、37.25gの3-メタクリロキシプロピルトリメトキシシラン(0.15モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、13.92gの3-グリシジロキシシプロピルトリメトキシシラン(0.05モル)及び124.74gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-9)を得た。
最初に三ツ口フラスコに仕込むものを、48.87gのジメトキシジフェニルシラン(0.20モル)、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、99.15gのフェニルトリメトキシシラン(0.50モル)及び147.37gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-10)を得た。
最初に三ツ口フラスコに仕込むものを、36.07gのジメトキシジメチルシラン(0.30モル)、73.31gのジメトキシジフェニルシラン(0.30モル)、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、13.92gの3-グリシジロキシシプロピルトリメトキシシラン(0.05モル)、19.83gのフェニルトリメトキシシラン(0.10モル)及び131.48gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-11)を得た。
最初に三ツ口フラスコに仕込むものを、36.07gのジメトキシジメチルシラン(0.30モル)、85.53gのジメトキシジフェニルシラン(0.35モル)、70.29gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)及び133.23gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-12)を得た。
最初に三ツ口フラスコに仕込むものを、36.07gのジメトキシジメチルシラン(0.30モル)、73.31gのジメトキシジフェニルシラン(0.30モル)、35.15gの3-アクリロキシプロピルトリメトキシシラン(0.15モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、24.64gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.10モル)、19.83gのフェニルトリメトキシシラン(0.10モル)及び130.56gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-13)を得た。
最初に三ツ口フラスコに仕込むものを、36.07gのジメトキシジメチルシラン(0.30モル)、73.31gのジメトキシジフェニルシラン(0.30モル)、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、24.64gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.10モル)、6.81gのメチルトリメトキシシラン(0.05モル)及び129.36gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-14)を得た。
最初に三ツ口フラスコに仕込むものを、36.07gのジメトキシジメチルシラン(0.30モル)、73.31gのジメトキシジフェニルシラン(0.30モル)、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、24.64gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.10モル)、10.42gのテトラエトキシシラン(0.05モル)及び132.68gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-15)を得た。
最初に三ツ口フラスコに仕込むものを、36.07gのジメトキシジメチルシラン(0.30モル)、73.31gのジメトキシジフェニルシラン(0.30モル)、11.72gの3-アクリロキシプロピルトリメトキシシラン(0.05モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、24.64gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.10モル)、39.66gのフェニルトリメトキシシラン(0.20モル)及び127.24gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-16)を得た。
最初に三ツ口フラスコに仕込むものを、12.02gのジメトキシジメチルシラン(0.10モル)、73.31gのジメトキシジフェニルシラン(0.30モル)、93.72gの3-アクリロキシプロピルトリメトキシシラン(0.40モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、19.83gのフェニルトリメトキシシラン(0.10モル)及び151.06gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-17)を得た。
最初に三ツ口フラスコに仕込むものを、12.02gのジメトキシジメチルシラン(0.10モル)、73.31gのジメトキシジフェニルシラン(0.30モル)、117.15gの3-アクリロキシプロピルトリメトキシシラン(0.50モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)及び154.38gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-18)を得た。
最初に三ツ口フラスコに仕込むものを、24.04gのジメトキシジメチルシラン(0.20モル)、97.74gのジメトキシジフェニルシラン(0.40モル)、70.29gの3-アクリロキシプロピルトリメトキシシラン(0.30モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、13.92gの3-グリシジロキシシプロピルトリメトキシシラン(0.05モル)及び146.26gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-19)を得た。
最初に三ツ口フラスコに仕込むものを、24.04gのジメトキシジメチルシラン(0.20モル)、73.31gのジメトキシジフェニルシラン(0.30モル)、70.29gの3-アクリロキシプロピルトリメトキシシラン(0.30モル)、39.35gの3-トリメトキシシリルプロピル無水コハク酸(0.15モル)、13.92gの3-グリシジロキシシプロピルトリメトキシシラン(0.05モル)及び147.92gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-20)を得た。
最初に三ツ口フラスコに仕込むものを、24.04gのジメトキシジメチルシラン(0.20モル)、73.31gのジメトキシジフェニルシラン(0.30モル)、70.29gの3-アクリロキシプロピルトリメトキシシラン(0.30モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、41.76gの3-グリシジロキシシプロピルトリメトキシシラン(0.05モル)及び149.40gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-21)を得た。
最初に三ツ口フラスコに仕込むものを、66.12gのジメトキシジメチルシラン(0.55モル)、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、29.75gのフェニルトリメトキシシラン(0.15モル)及び99.23gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-22)を得た。
最初に三ツ口フラスコに仕込むものを、48.09gのジメトキシジメチルシラン(0.40モル)、85.53gのジメトキシジフェニルシラン(0.35モル)、34.85gの3-メタクリロキシプロピルメチルジメトキシシラン(0.15モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、13.92gの3-グリシジロキシシプロピルトリメトキシシラン(0.05モル)及び124.74gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-23)を得た。
(合成例24) シロキサン樹脂溶液(b-24)の合成
最初に三ツ口フラスコに仕込むものを、48.09gのジメトキシジメチルシラン(0.40モル)、109.97gのジメトキシジフェニルシラン(0.45モル)、24.83gの3-メタクリロキシプロピルメチルジメトキシシラン(0.15モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)及び124.74gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-24)を得た。
(合成例25) シロキサン樹脂溶液(b-25)の合成
最初に三ツ口フラスコに仕込むものを、48.09gのジメトキシジメチルシラン(0.40モル)、85.53gのジメトキシジフェニルシラン(0.35モル)、37.25gの3-メタクリロキシプロピルトリメトキシシラン(0.15モル)、12.32gの3-ジメトキシメチルシリルプロピル無水コハク酸(0.05モル)、13.92gの3-グリシジロキシシプロピルトリメトキシシラン(0.05モル)及び124.74gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-25)を得た。
(合成例26) シロキサン樹脂溶液(b-26)の合成
最初に三ツ口フラスコに仕込むものを、46.86gの3-アクリロキシプロピルトリメトキシシラン(0.20モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、138.81gのフェニルトリメトキシシラン(0.70モル)及び138.87gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-26)を得た。
最初に三ツ口フラスコに仕込むものを、74.51gの3-メタクリロキシプロピルトリメトキシシラン(0.30モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、27.24gのメチルトリメトキシシラン(0.20モル)、79.32gのフェニルトリメトキシシラン(0.40モル)及び134.62gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-27)を得た。
最初に三ツ口フラスコに仕込むものを、36.07gのジメトキシジメチルシラン(0.30モル)、73.31gのジメトキシジフェニルシラン(0.30モル)、70.29gの3-アクリロキシプロピルトリメトキシシラン(0.30モル)、27.84gの3-グリシジロキシシプロピルトリメトキシシラン(0.10モル)及び135.54gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-28)を得た。
最初に三ツ口フラスコに仕込むものを、30.06gのジメトキシジメチルシラン(0.25モル)、97.74gのジメトキシジフェニルシラン(0.40モル)、13.12gの3-トリメトキシシリルプロピル無水コハク酸(0.05モル)、12.32gの3-(3,4-エポキシシクロヘキシル)プロピルトリメトキシシラン(0.05モル)、49.58gのフェニルトリメトキシシラン(0.25モル)及び131.21gのプロピレングリコールモノメチルエーテルアセテートとした以外は、合成例1と同様にしてシロキサン樹脂溶液(b-29)を得た。
PGMEA200gに3-トリメトキシシリルプロピルコハク酸無水物41.97g(0.160モル)とt-ブチルアミン11.70g(0.160モル)を加えてしばらく室温にて撹拌した後、40℃にて2時間撹拌した。その後80℃まで昇温し、6時間反応させた。得られた溶液を固形分濃度が20質量%になるようにPGMEAで希釈し、3-(tert-ブチルカルバモイル)-6-(トリメトキシシリル)へキサン酸、2-(2-(tert-ブチルアミノ)-2-オキソエチル)-5-(トリメトキシシリル)ペンタン酸の混合溶液(g-1)を得た。
13.00gの白色顔料すなわち二酸化チタン顔料(CR-97;石原産業(株)製)、26.00gのシロキサン樹脂溶液(b-1)及び1.00gのプロピレングリコールモノメチルエーテルを混合した後、ジルコニアビーズが充填されたミル型分散機を用いて分散し、顔料分散液(MW-1)を得た。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-2)を使用する以外は、実施例1と同様にして、顔料分散液(MW-2)及びネガ型感光性着色組成物(W-2)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-3)を使用する以外は、実施例1と同様にして、顔料分散液(MW-3)及びネガ型感光性着色組成物(W-3)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-4)を使用する以外は、実施例1と同様にして、顔料分散液(MW-4)及びネガ型感光性着色組成物(W-4)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-5)を使用する以外は、実施例1と同様にして、顔料分散液(MW-5)及びネガ型感光性着色組成物(W-5)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-6)を使用する以外は、実施例1と同様にして、顔料分散液(MW-6)及びネガ型感光性着色組成物(W-6)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-7)を使用する以外は、実施例1と同様にして、顔料分散液(MW-7)及びネガ型感光性着色組成物(W-7)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-8)を使用する以外は、実施例1と同様にして、顔料分散液(MW-8)及びネガ型感光性着色組成物(W-8)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-9)を使用する以外は、実施例1と同様にして、顔料分散液(MW-9)及びネガ型感光性着色組成物(W-9)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-11)を使用する以外は、実施例1と同様にして、顔料分散液(MW-10)及びネガ型感光性着色組成物(W-10)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
ペンタエリスリトールテトラキス(3-メルカプトブチレート)(カレンズMT-PE1;昭和電工(株)製)を添加しない以外は、実施例10と同様にして、ネガ型感光性着色組成物(W-11)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-12)を使用する以外は、実施例1と同様にして、顔料分散液(MW-12)及びネガ型感光性着色組成物(W-12)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-13)を使用する以外は、実施例1と同様にして、顔料分散液(MW-13)及びネガ型感光性着色組成物(W-13)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-14)を使用する以外は、実施例1と同様にして、顔料分散液(MW-14)及びネガ型感光性着色組成物(W-14)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-15)を使用する以外は、実施例1と同様にして、顔料分散液(MW-15)及びネガ型感光性着色組成物(W-15)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-16)を使用する以外は、実施例1と同様にして、顔料分散液(MW-16)及びネガ型感光性着色組成物(W-16)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-17)を使用する以外は、実施例1と同様にして、顔料分散液(MW-17)及びネガ型感光性着色組成物(W-17)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-18)を使用する以外は、実施例1と同様にして、顔料分散液(MW-18)及びネガ型感光性着色組成物(W-18)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-19)を使用する以外は、実施例1と同様にして、顔料分散液(MW-19)及びネガ型感光性着色組成物(W-19)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-20)を使用する以外は、実施例1と同様にして、顔料分散液(MW-20)及びネガ型感光性着色組成物(W-20)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-21)を使用する以外は、実施例1と同様にして、顔料分散液(MW-21)及びネガ型感光性着色組成物(W-21)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-23)を使用する以外は、実施例1と同様にして、顔料分散液(MW-22)及びネガ型感光性着色組成物(W-22)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-24)を使用する以外は、実施例1と同様にして、顔料分散液(MW-23)及びネガ型感光性着色組成物(W-23)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-25)を使用する以外は、実施例1と同様にして、顔料分散液(MW-24)及びネガ型感光性着色組成物(W-24)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
5.24gのエトキシ化イソシアヌル酸ジアクリレート及びエトキシ化イソシアヌル酸トリアクリレートの混合物(アロニックスM-315;東亜合成(株)製)の代わりに、5.24gのジペンタエリスリトールペンタアクリレート及びジペンタエリスリトールヘキサアクリレートの混合物(カヤラッドDPHA;日本化薬(株)製)を使用する以外は、実施例10と同様にして、ネガ型感光性着色組成物(W-25)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
13.00gの二酸化チタン顔料(CR-97;石原産業(株)製)の代わりに、13.00gの二酸化チタン顔料(JR-301;テイカ(株)製)を使用する以外は、実施例10と同様にして、顔料分散液(MW-26)及びネガ型感光性着色組成物(W-26)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
13.00gの二酸化チタン顔料(CR-97;石原産業(株)製)の代わりに、13.00gの二酸化チタン顔料(JR-405;テイカ(株)製)を使用する以外は、実施例10と同様にして、顔料分散液(MW-27)及びネガ型感光性着色組成物(W-27)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
13.00gの二酸化チタン顔料(CR-97;石原産業(株)製)の代わりに、13.00gの二酸化チタン顔料(JR-600A;テイカ(株)製)を使用する以外は、実施例10と同様にして、顔料分散液(MW-28)及びネガ型感光性着色組成物(W-28)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
13.00gの二酸化チタン顔料(CR-97;石原産業(株)製)の代わりに、13.00gの二酸化チタン顔料(JR-603;テイカ(株)製)を使用する以外は、実施例10と同様にして、顔料分散液(MW-29)及びネガ型感光性着色組成物(W-29)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
(実施例30)
13.00gの二酸化チタン顔料(CR-97;石原産業(株)製)の代わりに、13.00gの二酸化チタン顔料(R960;デュポン(株)製)を使用する以外は、実施例10と同様にして、顔料分散液(MW-30)及びネガ型感光性着色組成物(W-30)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
0.79gのビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(イルガキュア819;BASF社製)の代わりに、0.79gの2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オン(イルガキュア907;BASF社製)を使用する以外は、実施例10と同様にして、ネガ型感光性着色組成物(W-31)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-10)を使用する以外は、実施例1と同様にして、顔料分散液(MW-32)を得た。次に、20.15gの顔料分散液(MW-32)、15.71gのシロキサン樹脂溶液(b-10)、5.24gのエトキシ化イソシアヌル酸ジアクリレート及びエトキシ化イソシアヌル酸トリアクリレートの混合物(アロニックスM-315;東亜合成(株)製)、0.79gのビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(イルガキュア819;BASF社製)、0.52gのペンタエリスリトールテトラキス(3-メルカプトブチレート)(カレンズMT-PE1;昭和電工(株)製)及び7.59gのプロピレングリコールモノメチルエーテルを撹拌混合し、ネガ型感光性着色組成物(W-32)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-10)の代わりに、シロキサン樹脂溶液(b-11)を使用する以外は、実施例32と同様にして、顔料分散液(MW-33)及びネガ型感光性着色組成物(W-33)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-10)の代わりに、シロキサン樹脂溶液(b-22)を使用する以外は、実施例32と同様にして、顔料分散液(MW-34)及びネガ型感光性着色組成物(W-34)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-11)を使用する以外は、実施例1と同様にして、顔料分散液(MW-10)を得た。次に、32.23gの顔料分散液(MW-10)、5.24gのエトキシ化イソシアヌル酸ジアクリレート及びエトキシ化イソシアヌル酸トリアクリレートの混合物(アロニックスM-315;東亜合成(株)製)、0.79gのビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(イルガキュア819;BASF社製)、0.52gのペンタエリスリトールテトラキス(3-メルカプトブチレート)(カレンズMT-PE1;昭和電工(株)製)及び11.22gのプロピレングリコールモノメチルエーテルを撹拌混合し、ネガ型感光性着色組成物(W-35)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-11)を使用する以外は、実施例1と同様にして、顔料分散液(MW-10)を得た。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-11)を使用する以外は、実施例1と同様にして、顔料分散液(MW-10)を得た。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-11)を使用する以外は、実施例1と同様にして、顔料分散液(MW-10)を得た。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-11)を使用する以外は、実施例1と同様にして、顔料分散液(MW-10)を得た。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-11)を使用する以外は、実施例1と同様にして、顔料分散液(MW-10)を得た。
13.00gの二酸化チタン顔料(CR-97;石原産業(株)製)の代わりに、13.74gの二酸化チタン顔料(CR-97;石原産業(株)製)及び0.26gのチタン窒化物粒子(Bk-1;日清エンジニアリング(株)製)を使用する以外は、実施例10と同様にして、顔料分散液(MG-1)及びネガ型感光性着色組成物(G-1)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。ただし、得られる塗膜は灰色であるため、色特性の評価は実施しなかった。
以下の手順により、タッチパネル基板を作製した。
10cm×10cm、厚み0.7mmの強化ガラス上に、調製例1で得られたネガ型感光性白色組成物(W-1)をキュア後の膜厚が15μmとなるようにスピンコートし、基板をホットプレートを用いて100℃で3分間プリベークした。次に、PLAを用いて超高圧水銀灯を光源とし、タッチパネル用の遮光パターンを有したマスクを介して、露光量200mJ(i線)、マスクギャップ150μmで露光した。その後、自動現像装置を用いて、2.38質量%TMAH水溶液で120秒間シャワー現像し、次いで水で30秒間リンスした。最後に基板をオーブンを用いて空気中230℃で30分間キュアして、白色遮光パターンを有するガラス基板を作製した(図1のaに相当)。
上記(1)で得られたガラス基板にスパッタリング装置HSR-521A((株)島津製作所製)を用いて、RFパワー1.4kW、真空度6.65×10-1Paで12.5分間スパッタリングすることにより、膜厚が150nmのITOを成膜し、ポジ型フォトレジスト(東京応化工業(株)製「OFPR-800」)を塗布し、80℃で20分間プリベークして膜厚1.1μmのレジスト膜を得た。PLAを用いて、得られた膜に超高圧水銀灯をマスクを介してパターン露光した後、自動現像装置を用いて2.38質量%TMAH水溶液で90秒間シャワー現像し、次いで水で30秒間リンスした。その後、3.5質量%シュウ酸水溶液に150秒浸すことでITOをエッチングし、50℃の剥離液(ナガセケムテックス(株)製「N-321」)で120秒処理することでフォトレジストを除去し、230℃で30分アニール処理を加え、膜厚150nmのパターン加工されたITO(図1の符号3)を有するガラス基板を作製した(図1のbに相当)。
上記(2)で得られたガラス基板上に調製例50で得たネガ型感光性透明組成物(Cr-1)を用いて、膜厚を2μmとし、パターンマスクを介して露光を行う以外は(1)と同様にして、透明絶縁膜(図1の符号4)を作製した(図1のcに相当)。
上記(3)で得られたガラス基板上に、ターゲットとしてモリブデン及びアルミニウムを用いて、エッチング液としてH3PO4/HNO3/CH3COOH/H2O=65/3/5/27(質量比)混合溶液を用いた以外は(1)と同様にして、膜厚250nmのMAM配線(図1の符号5)を作製し(図1のdに相当)、タッチパネル基板を完成させた(図1のd、図2)。
シロキサン樹脂溶液(b-10)の代わりに、シロキサン樹脂溶液(b-26)を使用する以外は、実施例32と同様にして、顔料分散液(MWH-1)及びネガ型感光性着色組成物(WH-1)を得た。この組成物を用いて、パターン加工性、クラック耐性を評価した。このとき10μm厚の硬化膜にクラックが発生したため、各種膜特性の評価は実施しなかった。
シロキサン樹脂溶液(b-10)の代わりに、シロキサン樹脂溶液(b-27)を使用する以外は、実施例32と同様にして、顔料分散液(MWH-2)及びネガ型感光性着色組成物(WH-2)を得た。この組成物を用いて、パターン加工性、クラック耐性を評価した。このとき10μm厚の硬化膜にクラックが発生したため、各種膜特性の評価は実施しなかった。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-28)を使用する以外は、実施例1と同様にして、顔料分散液(MWH-3)及びネガ型感光性着色組成物(WH-3)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
シロキサン樹脂溶液(b-1)の代わりに、シロキサン樹脂溶液(b-29)を使用する以外は、実施例1と同様にして、顔料分散液(MWH-4)及びネガ型感光性着色組成物(WH-4)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
0.79gのビス(2,4,6-トリメチルベンゾイル)-フェニルフォスフィンオキサイド(イルガキュア819;BASF社製)の代わりに、0.79gの2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オン(イルガキュア907;BASF社製)を使用する以外は、比較例4と同様にして、ネガ型感光性着色組成物(WH-5)を得た。この組成物を用いて、パターン加工性、クラック耐性、各種膜特性を評価した。
b:透明電極形成後の上面図
c:絶縁膜形成後の上面図
d:金属配線形成後の上面図
1:ガラス基板
2:白色遮光硬化膜
3:透明電極
4:透明絶縁膜
5:配線電極
Claims (15)
- (A)白色顔料、
(B)下記一般式(1)で示される化合物、下記一般式(2)で示される化合物及び下記一般式(3)で示される化合物を含むアルコキシシラン化合物を共加水分解物縮合して得られるポリシロキサン、
(C)多官能アクリルモノマ、
(D)光ラジカル重合開始剤、並びに、
(E)有機溶媒、を含有する、ネガ型感光性着色組成物。
- 前記アルコキシシラン化合物に占める、一般式(1)で示される化合物の割合が25~75モル%であり、一般式(2)で示される化合物の割合が10~45モル%であり、かつ、一般式(3)で示される化合物の割合が1~20モル%である、請求項1記載のネガ型感光性着色組成物。
- 前記(A)白色顔料は、二酸化チタンである、請求項1又は2記載のネガ型感光性着色組成物。
- 前記一般式(1)で示される化合物は、ジアルコキシジフェニルシラン又はジヒドロキシジフェニルシランである、請求項1~3のいずれか一項のネガ型感光性着色組成物。
- 前記(D)光ラジカル重合開始剤は、アシルフォスフィンオキサイド系光重合開始剤である、請求項1~4のいずれか一項記載のネガ型感光性着色組成物。
- (F)多官能チオール化合物を含有する、請求項1~7のいずれか一項記載のネガ型感光性着色組成物。
- (G)脂環式エポキシ化合物を含有する、請求項1~8のいずれか一項記載のネガ型感光性着色組成物。
- (I)紫外線吸収剤を含有する、請求項1~10のいずれか一項記載のネガ型感光性着色組成物。
- (J)ラジカル捕捉剤を含有する、請求項1~11のいずれか一項記載のネガ型感光性着色組成物。
- 請求項1~12のいずれか一項記載のネガ型感光性着色組成物を硬化させてなる、硬化膜。
- 請求項13記載の硬化膜を備える、タッチパネル用遮光パターン。
- 少なくとも、請求項1~12のいずれか一項記載のネガ型感光性着色組成物を、(i)基板上に塗布する工程、(ii)塗布後の基板を減圧及び/又は加熱により乾燥する工程、(iii)乾燥後の基板にマスクを介して露光する工程、(iv)露光後の基板を現像液を用いて現像し、パターンを形成する工程、(v)現像後の基板を加熱により硬化させる工程を備える、タッチパネルの製造方法。
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TW201437764A (zh) | 2014-10-01 |
US9651865B2 (en) | 2017-05-16 |
JPWO2014126013A1 (ja) | 2017-02-02 |
KR102145232B1 (ko) | 2020-08-18 |
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KR20150118091A (ko) | 2015-10-21 |
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