WO2014112334A1 - 被覆酸化マグネシウム粉末及びその製造方法 - Google Patents
被覆酸化マグネシウム粉末及びその製造方法 Download PDFInfo
- Publication number
- WO2014112334A1 WO2014112334A1 PCT/JP2014/000055 JP2014000055W WO2014112334A1 WO 2014112334 A1 WO2014112334 A1 WO 2014112334A1 JP 2014000055 W JP2014000055 W JP 2014000055W WO 2014112334 A1 WO2014112334 A1 WO 2014112334A1
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- WIPO (PCT)
- Prior art keywords
- resin
- magnesium oxide
- oxide powder
- phosphate
- coated
- Prior art date
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- 239000000395 magnesium oxide Substances 0.000 title claims abstract description 111
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 title claims abstract description 111
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 title claims abstract description 111
- 239000000843 powder Substances 0.000 title claims abstract description 103
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 45
- 239000011342 resin composition Substances 0.000 claims abstract description 33
- 239000011148 porous material Substances 0.000 claims abstract description 31
- 239000002245 particle Substances 0.000 claims abstract description 29
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 24
- 239000011574 phosphorus Substances 0.000 claims abstract description 23
- 239000011247 coating layer Substances 0.000 claims abstract description 17
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052753 mercury Inorganic materials 0.000 claims abstract description 16
- 239000000945 filler Substances 0.000 claims abstract description 15
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000011800 void material Substances 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 7
- -1 magnesium phosphate compound Chemical class 0.000 claims description 36
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 24
- 239000000347 magnesium hydroxide Substances 0.000 claims description 24
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 24
- 229910019142 PO4 Inorganic materials 0.000 claims description 22
- 239000010452 phosphate Substances 0.000 claims description 22
- 239000004137 magnesium phosphate Substances 0.000 claims description 20
- 229960002261 magnesium phosphate Drugs 0.000 claims description 20
- 229910000157 magnesium phosphate Inorganic materials 0.000 claims description 20
- 235000010994 magnesium phosphates Nutrition 0.000 claims description 20
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 18
- 239000002253 acid Substances 0.000 claims description 13
- 230000002378 acidificating effect Effects 0.000 claims description 9
- 239000000292 calcium oxide Substances 0.000 claims description 9
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- 238000001354 calcination Methods 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 229910052791 calcium Inorganic materials 0.000 claims description 3
- QPPQHRDVPBTVEV-UHFFFAOYSA-N isopropyl dihydrogen phosphate Chemical compound CC(C)OP(O)(O)=O QPPQHRDVPBTVEV-UHFFFAOYSA-N 0.000 claims description 3
- LJKDOMVGKKPJBH-UHFFFAOYSA-N 2-ethylhexyl dihydrogen phosphate Chemical compound CCCCC(CC)COP(O)(O)=O LJKDOMVGKKPJBH-UHFFFAOYSA-N 0.000 claims description 2
- 239000004641 Diallyl-phthalate Substances 0.000 claims description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 2
- 239000004640 Melamine resin Substances 0.000 claims description 2
- 229920000877 Melamine resin Polymers 0.000 claims description 2
- 229930182556 Polyacetal Natural products 0.000 claims description 2
- 239000004962 Polyamide-imide Substances 0.000 claims description 2
- 239000004697 Polyetherimide Substances 0.000 claims description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 2
- 229920000180 alkyd Polymers 0.000 claims description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 claims description 2
- FJTUUPVRIANHEX-UHFFFAOYSA-N butan-1-ol;phosphoric acid Chemical compound CCCCO.OP(O)(O)=O FJTUUPVRIANHEX-UHFFFAOYSA-N 0.000 claims description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- UHGIMQLJWRAPLT-UHFFFAOYSA-N octadecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCCCCCCCOP(O)(O)=O UHGIMQLJWRAPLT-UHFFFAOYSA-N 0.000 claims description 2
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920006122 polyamide resin Polymers 0.000 claims description 2
- 229920002312 polyamide-imide Polymers 0.000 claims description 2
- 229920001230 polyarylate Polymers 0.000 claims description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 claims description 2
- 229920005668 polycarbonate resin Polymers 0.000 claims description 2
- 239000004431 polycarbonate resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920001601 polyetherimide Polymers 0.000 claims description 2
- 229920006324 polyoxymethylene Polymers 0.000 claims description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 2
- 229920005749 polyurethane resin Polymers 0.000 claims description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 239000004696 Poly ether ether ketone Substances 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 claims 1
- 229920002530 polyetherether ketone Polymers 0.000 claims 1
- 238000011049 filling Methods 0.000 abstract description 10
- 230000000704 physical effect Effects 0.000 description 20
- 238000010304 firing Methods 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 238000005259 measurement Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 239000011734 sodium Substances 0.000 description 8
- 230000001186 cumulative effect Effects 0.000 description 7
- 239000000460 chlorine Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 239000011575 calcium Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000007088 Archimedes method Methods 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- FSBVERYRVPGNGG-UHFFFAOYSA-N dimagnesium dioxido-bis[[oxido(oxo)silyl]oxy]silane hydrate Chemical compound O.[Mg+2].[Mg+2].[O-][Si](=O)O[Si]([O-])([O-])O[Si]([O-])=O FSBVERYRVPGNGG-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910001629 magnesium chloride Inorganic materials 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- NFMWFGXCDDYTEG-UHFFFAOYSA-N trimagnesium;diborate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]B([O-])[O-].[O-]B([O-])[O-] NFMWFGXCDDYTEG-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F5/00—Compounds of magnesium
- C01F5/02—Magnesia
- C01F5/06—Magnesia by thermal decomposition of magnesium compounds
- C01F5/08—Magnesia by thermal decomposition of magnesium compounds by calcining magnesium hydroxide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
- C09C1/02—Compounds of alkaline earth metals or magnesium
- C09C1/028—Compounds containing only magnesium as metal
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/32—Spheres
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/14—Pore volume
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/16—Pore diameter
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/06—Treatment with inorganic compounds
- C09C3/063—Coating
Definitions
- the present invention relates to a coated magnesium oxide powder that can be used as a filler for a resin, and a method for producing the same. Moreover, this invention relates to the heat radiating member which consists of the resin composition containing the said covering magnesium oxide powder, and the said resin composition.
- the electronic device is composed of electronic parts such as a laminate, a printed wiring board, and a multilayer wiring board.
- resin compositions are usually used for prepregs, spacers, sealants, adhesive sheets, and the like, and various performances or characteristics are required for the resin compositions. For example, as a recent trend, mounting of large-capacity power elements in electronic devices and high-density mounting are seen, and accordingly, heat dissipation and moisture resistance superior to conventional ones are required for resin compositions and their applications. ing.
- silica silicon dioxide
- alumina aluminum oxide
- the thermal conductivity of silica is low, and heat dissipation corresponding to an increase in the amount of heat generated due to high integration, high power, high speed, etc. is insufficient, causing problems in stable operation of the semiconductor.
- alumina having higher thermal conductivity than silica is used, the heat dissipation is improved, but since alumina has a high hardness, there has been a problem that the wear of the kneader, the molding machine and the mold becomes severe.
- magnesium oxide which has a thermal conductivity that is an order of magnitude higher than that of silica and approximately twice that of alumina, has been studied as a material for resin fillers for semiconductor encapsulation.
- the magnesium oxide powder has higher hygroscopicity than the silica powder. Therefore, when magnesium oxide powder is used as a resin filler for semiconductor encapsulation, the absorbed water and magnesium oxide are hydrated and the volume of the filler expands, resulting in cracks, reduced thermal conductivity, etc. The problem was occurring. For this reason, providing moisture resistance to the magnesium oxide powder used as the resin filler for semiconductor encapsulation has been a major issue in ensuring long-term stable operation of the semiconductor.
- Patent Document 1 and Patent Document 2 include mixing an aluminum salt or a silicon compound and magnesium oxide powder, filtering off solids, drying, and firing. There is disclosed a method for producing a coated magnesium oxide powder, wherein the surface of the magnesium oxide powder is coated with a coating layer containing aluminum or a double oxide of silicon and magnesium.
- the coated magnesium oxide powder obtained by the above-described method has improved moisture resistance, the powder particles have an angular shape, so that the filling property to the resin is low, and the obtained resin composition There is a problem of low fluidity.
- the object of the present invention is to solve the above-mentioned problems, and is excellent in moisture resistance in addition to thermal conductivity. Further, when used as a filler for a resin, the fluidity of the resin composition after filling is high.
- An object of the present invention is to provide a coated magnesium oxide powder excellent in moldability and a method for producing the same.
- Another object of the present invention is to provide a resin composition containing the coated magnesium oxide powder and a heat dissipating member comprising the resin composition.
- the amount of voids in the particle is 0.3 to 0.8 cm 3 / g
- the mode diameter is 0.2 to 1.0 ⁇ m
- the inflection point diameter is 0.9 ⁇ m or more.
- a coating layer made of a magnesium phosphate compound on at least a part of the surface of the magnesium oxide powder, and the phosphorus content in the coated magnesium oxide powder is 0.1 to 10 mass % Of the coated magnesium oxide powder.
- the present invention also relates to a filler comprising the coated magnesium oxide powder.
- the present invention also relates to a resin composition containing a resin and the filler.
- the said resin composition can be used as heat radiating members, such as an adhesive agent or a semiconductor sealing agent.
- the present invention includes B in an amount of 100 to 1000 ppm, Na in an amount of 300 ppm or less, K in an amount of 300 ppm or less, Cl in an amount of 0.02 to 0.5 mass%, and Si in terms of SiO 2 in an amount of 0.02 to
- Magnesium oxide powder is obtained by calcining magnesium hydroxide having a purity of 98% or more, containing 0.5% by mass and 0.1 to 0.8% by mass of Ca in terms of CaO at 1000 ° C. to 1200 ° C. Thereafter, the magnesium oxide powder is mixed with a phosphorus compound and fired at 300 ° C. or higher to form a coating layer made of a magnesium phosphate compound on at least a part of the surface of the magnesium oxide powder.
- the invention also relates to a method for producing a coated magnesium oxide powder.
- the present invention in addition to thermal conductivity, it is excellent in moisture resistance, and further, it has excellent filling properties when used as a filler for a resin, and the fluidity of the resin composition after filling is high.
- the coated magnesium oxide powder having excellent moldability can be provided.
- the coated magnesium oxide powder of the present invention has a magnesium oxide powder exhibiting specific physical properties and a coating layer formed on the surface and made of a magnesium phosphate compound.
- the coating layer made of a magnesium phosphate compound may be formed on the entire surface of the magnesium oxide powder, or may be formed only on a part of the surface of the magnesium oxide powder. The surface of the magnesium oxide powder that is not covered with the coating layer made of the magnesium phosphate compound may be exposed.
- the magnesium oxide powder satisfies an inter-particle void amount of 0.3 to 0.8 cm 3 / g, a mode diameter of 0.2 to 1.0 ⁇ m, and an inflection point diameter of 0.9 ⁇ m or more.
- the coated magnesium oxide powder of the present invention can be suitably used as a thermally conductive filler.
- each measured value is a numerical value measured in a mercury intrusion type pore distribution measuring device.
- the inflection point diameter and the amount of voids in the particle can be obtained from the cumulative pore volume curve.
- the vertical axis represents the fine particle size obtained in order from the largest pore per unit weight of the sample.
- the cumulative pore volume which is the cumulative value of the pore volume, is represented, and the horizontal axis represents the pore diameter.
- the inflection point is the point where the cumulative pore volume curve rises rapidly.
- the number of inflection points is not limited to one, and there may be a plurality of inflection points, but the inflection point with the largest pore diameter is defined as the inflection point of the present invention.
- the inflection point diameter is the pore diameter at the inflection point.
- the inflection point diameter is less than 0.9 ⁇ m, since the amount of fine particles increases, a sudden increase in viscosity occurs when filling the resin.
- the inflection point diameter is 0.9 to 1.5 ⁇ m.
- the amount of voids in the particles is the amount of voids smaller than the aggregated particle diameter existing in the particles, and the amount of voids in the particles is the cumulative pores at pore diameters of 0.003 ⁇ 10 ⁇ 6 to 100 ⁇ 10 ⁇ 6 m.
- the total pore volume represented by the volume is represented by a volume obtained by subtracting the cumulative pore volume at the inflection point.
- the void amount in the particle of the magnesium oxide powder is less than 0.3 cm 3 / g, the void in the particle is small, a sufficient amount of resin does not penetrate into the particle, and the mechanical strength of the resin composition deteriorates. . Moreover, thermal conductivity is also reduced.
- the amount of voids in the particles exceeds 0.8 cm 3 / g, the voids in the particles exist deep inside the particles, so that the resin does not reach the inside of the voids sufficiently, and bubbles are generated between the particles and the resin to conduct heat. Sex is reduced.
- the amount of voids in the particle is 0.3 to 0.7 cm 3 / g.
- the mode diameter can be obtained from mercury intrusion pore distribution measurement, and is the pore diameter corresponding to the maximum value of the log differential pore volume distribution curve.
- the mode diameter corresponds to the diameter of the gap between the magnesium oxide particles.
- the mode diameter of the magnesium oxide powder is less than 0.2 ⁇ m, the amount of fine particles increases, so that a sudden increase in viscosity occurs when filling the resin.
- the mode diameter exceeds 1.0 ⁇ m, the amount of large particles increases, so that the mechanical strength of the resin composition deteriorates. Moreover, thermal conductivity is also reduced.
- the mode diameter is 0.3 to 1.0 ⁇ m.
- a coating layer made of a magnesium phosphate compound is formed on such magnesium oxide powder. With this coating layer, the moisture resistance of the magnesium oxide powder can be improved.
- the coated magnesium oxide powder of the present invention has a coating layer made of a magnesium phosphate compound, it contains phosphorus as a constituent element.
- the phosphorus content is 0.1 to 10% by mass with respect to the coated magnesium oxide powder of the present invention.
- the coated magnesium oxide powder of the present invention can be made excellent in moisture resistance. If the phosphorus content is less than 0.1% by mass, sufficient moisture resistance cannot be exhibited. Conversely, when the phosphorus content exceeds 10% by mass, the magnesium phosphate compound not only coats the surface of the magnesium oxide powder, but the magnesium phosphate compound alone forms particles or is coated. Since the layer is too thick, there is a disadvantage that the thermal conductivity is lowered.
- the coated magnesium oxide powder of the present invention is excellent in filling property when filling into a resin and has an advantage that the fluidity of the resin composition after filling is high. can do.
- resin which can be used by this invention a thermosetting resin or a thermoplastic resin is mentioned, for example.
- a thermosetting resin For example, a phenol resin, a urea resin, a melamine resin, an alkyd resin, a polyester resin, an epoxy resin, a diallyl phthalate resin, a polyurethane resin, or a silicone resin is mentioned.
- the thermoplastic resin is not particularly limited.
- polyamide resin polyamide resin, polyacetal resin, polycarbonate resin, polybutylene terephthalate resin, polysulfone resin, polyamideimide resin, polyetherimide resin, polyarylate resin, polyphenylene sulfide resin, polyether ether
- examples include ketone resins, fluororesins, and liquid crystal polymers.
- the blending amount of the coated magnesium oxide powder in the resin composition of the present invention may be appropriately determined according to the specifics required for the resin composition, and is not particularly limited. However, as an example, it may be used in the range of 0.1 to 100 parts by mass of the coated magnesium oxide powder with respect to 100 parts by mass of the resin.
- the resin composition containing the coated magnesium oxide powder of the present invention can be used in various fields depending on the properties of the resin. However, since the coated magnesium oxide powder of the present invention is excellent in thermal conductivity, it can be suitably used particularly in applications where heat dissipation is required. Moreover, the resin composition of this invention can be utilized as a semiconductor sealing material excellent in thermal conductivity and moisture resistance.
- magnesium hydroxide showing predetermined physical properties is obtained by firing magnesium hydroxide.
- concentration of each impurity element contained in the magnesium hydroxide to be fired is adjusted to a predetermined concentration in advance, and the temperature at the time of firing is set to a range of 1000 to 1200 ° C. to obtain magnesium oxide exhibiting predetermined physical properties. It becomes possible.
- the different elements in magnesium hydroxide are as follows.
- the concentration of these different elements can be adjusted by a conventional method.
- B when B is insufficient, it can be adjusted by adding boric acid or magnesium borate.
- Cl when Cl is insufficient, it can be adjusted by adding hydrochloric acid or magnesium chloride.
- Si when Si is insufficient, it can be adjusted by adding sodium silicate, magnesium silicate, calcium silicate or the like.
- calcium when calcium is insufficient, it can be adjusted by adding calcium hydroxide, calcium oxide, calcium carbonate or the like.
- magnesium hydroxide When B in magnesium hydroxide exceeds 1000 ppm, or Na or K exceeds 300 ppm, the obtained magnesium oxide does not satisfy the above-mentioned conditions for the void amount in the particle and / or the inflection point diameter. Further, when Ca in magnesium hydroxide is out of the range of 0.1 to 0.8% by mass in terms of CaO, or when Si is out of the range of 0.02 to 0.5% by mass in terms of SiO 2 The obtained magnesium oxide does not satisfy the conditions of the mode diameter and / or the inflection point diameter described above, and the shape is not rounded. It is preferable to use magnesium hydroxide having a purity of 98% or more.
- the temperature at which magnesium hydroxide is fired is preferably in the range of 1000 to 1200 ° C.
- the obtained magnesium oxide does not satisfy the above-described conditions for the void amount in the particle, the mode diameter, and / or the inflection point diameter.
- a calcination temperature exceeds 1200 degreeC, the magnesium oxide obtained will not satisfy the conditions of the mode diameter and / or inflection point diameter mentioned above.
- the firing furnace and firing time are not particularly limited, and may be any firing furnace and firing time in which magnesium hydroxide can be converted to magnesium oxide at the temperature described above.
- the magnesium oxide obtained by firing magnesium hydroxide as described above is coarsely pulverized using a pulverizer as necessary. Thereby, a magnesium oxide powder is obtained.
- This magnesium oxide powder is mixed with a phosphorus compound and, if necessary, dried at a temperature of about 120 ° C. to 200 ° C. and then pulverized using a ball mill or the like to obtain a powder.
- a magnesium oxide powder in which a coating layer made of a magnesium phosphate compound is formed on at least a part of the surface can be obtained.
- the phosphorus compound is not particularly limited as long as it is a compound that can react with magnesium oxide to form a magnesium phosphate compound, and examples thereof include phosphoric acid, phosphate, and acidic phosphate. These may be used alone or in combination of two or more. Preferably it is acidic phosphate ester.
- the acidic phosphate ester include isopropyl acid phosphate, 2-ethylhexyl acid phosphate, oleyl acid phosphate, methyl acid phosphate, ethyl acid phosphate, propyl acid phosphate, butyl acid phosphate, lauryl acid phosphate, and stearyl acid phosphate.
- the amount of phosphorus compound used may be adjusted so that the phosphorus content relative to the entire coated magnesium oxide powder as the final product is 0.1 to 10% by mass.
- the phosphorus compound can be used in an amount of about 5 to 10% by mass with respect to the magnesium oxide powder.
- Calcination temperature is 300 ° C. or higher, preferably about 300 to 700 ° C.
- An example is firing at 500 ° C. for 1 hour. By this firing, the phosphorous compound is converted into a magnesium phosphate compound, whereby a coating layer made of the magnesium phosphate compound can be formed on the surface of the magnesium oxide powder.
- the concentration in the sample was calculated by measuring the mass using a spectrophotometer (trade name: UV-2550, manufactured by Shimadzu Corporation).
- the concentration in the sample was measured using a fluorescent X-ray apparatus (trade name: SPS-5100, manufactured by Seiko Instruments Inc.). However, respectively shown as the concentration of SiO 2 in terms and terms of CaO.
- the concentration in the sample was measured using an atomic absorption photometer (trade name: Z-2300, manufactured by Hitachi High-Technologies).
- the mercury As the mercury, a special grade mercury reagent having a purity of 99.5 mass% or more and a density of 13.5335 ⁇ 10 3 kg / m 3 was used.
- the measurement cell used was a powder sample cell having an internal volume of 5 ⁇ 10 ⁇ 6 m 3 and a stem volume of 0.38 ⁇ 10 ⁇ 6 m 3 .
- a measurement sample a sample having a uniform particle size with a 330 mesh standard sieve (JIS-R8801-87) is weighed precisely in a mass range of 0.10 ⁇ 10 ⁇ 3 to 0.13 ⁇ 10 ⁇ 3 kg, The measuring cell was filled.
- the inside of the cell was kept under a reduced pressure at a pressure of 50 ⁇ Hg (6.67 Pa) or less for 20 minutes.
- mercury was filled in the measurement cell until the pressure became 1.5 psia (10342 Pa).
- mercury was injected in a pressure range of 2 psia (13790 Pa) to 60000 psia (413.7 MPa), and the pore distribution was measured.
- the resin composition was measured according to JIS-K7210 at a measurement temperature of 230 ° C. and a load of 2.16 Kg.
- the resin composition used in the measurement of the melt flow rate was prepared by the following procedure. After 100 g of EEA (ethylene ethyl acrylate copolymer) was melted, 333 g of filler was added in small portions over about 10 minutes while observing the kneaded state, and finish kneading was further performed for 10 minutes. The roll interval at this time was 0.5 mm.
- EEA ethylene ethyl acrylate copolymer
- the compound was peeled off, and the recovered compound was cut into about 5 mm square and dried in a vacuum dryer at 90 ° C. for 1 hour to obtain a sample for measuring melt flow rate.
- Example 1 Firing the CaO in the magnesium oxide can be 0.23 mass%, the SiO 2 0.07 wt%, a Cl 0.16 wt%, B of 402Ppm, Na is 11 ppm, K is 9 ppm, the so as to adjust The magnesium hydroxide having a purity of 99.2% was baked in an electric furnace at 1100 ° C. for 1 hour to prepare magnesium oxide.
- the obtained coated magnesium oxide powder was measured for the impurity element concentration, BET specific surface area, pore distribution, moisture resistance, thermal conductivity, and melt flow rate based on the above-mentioned method, and the results are shown in Table 1.
- composition of the coating layer on the surface of the obtained coated magnesium oxide powder was measured based on the method described above, it was found to be Mg 2 P 2 O 7 .
- FIG. 1 is an electron micrograph of the obtained coated magnesium oxide powder.
- the particle shape of the coated magnesium oxide powder was spherical.
- a spherical powder refers to a powder composed of rounded particles without corners
- an amorphous powder refers to a powder composed of angular particles in which a plurality of crystal particles are combined. Point to.
- Example 2 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the firing temperature of magnesium hydroxide was changed to 1175 ° C. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.
- Example 3 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the CaO concentration of magnesium oxide was adjusted to 0.48% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.
- Example 4 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the SiO 2 concentration of magnesium oxide was adjusted to 0.12% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.
- Example 5 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the B concentration of magnesium hydroxide was adjusted to 700 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.
- Example 6 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the Na concentration of magnesium hydroxide was adjusted to 200 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.
- Example 7 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the K concentration of magnesium hydroxide was adjusted to 200 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.
- Example 8 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the amount of acidic phosphate used was changed so that the phosphorus content in the coated magnesium oxide powder was 0.18% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.
- Example 9 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the amount of acidic phosphate used was changed so that the phosphorus content in the coated magnesium oxide powder was 4.6% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 1.
- Example 1 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the firing temperature of magnesium hydroxide was changed to 950 ° C. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.
- Example 2 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the firing temperature of magnesium hydroxide was changed to 1400 ° C. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.
- Example 3 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the CaO concentration of magnesium hydroxide was changed to 1% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.
- Example 4 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the SiO 2 concentration of magnesium hydroxide was changed to 4% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.
- Example 5 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the B concentration of magnesium hydroxide was changed to 1200 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.
- Example 6 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the Na concentration of magnesium hydroxide was changed to 400 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.
- Example 7 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the K concentration of magnesium hydroxide was changed to 400 ppm. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.
- Example 8 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the amount of acidic phosphate used was changed so that the phosphorus content relative to the entire coated magnesium oxide powder was 0.058% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.
- Example 9 A coated magnesium oxide powder was obtained under the same conditions as in Example 1 except that the amount of acidic phosphate used was changed so that the phosphorus content relative to the entire coated magnesium oxide powder was 12.1% by mass. Each physical property was measured in the same manner as in Example 1, and the results are shown in Table 2.
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CN116134611A (zh) * | 2020-09-15 | 2023-05-16 | 电化株式会社 | 氧化镁粉末、填料组合物、树脂组合物和散热部件 |
WO2024004736A1 (ja) * | 2022-06-28 | 2024-01-04 | デンカ株式会社 | 酸化マグネシウム粉末及びそれを用いた樹脂組成物 |
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JP6789297B2 (ja) * | 2016-08-09 | 2020-11-25 | 神島化学工業株式会社 | 酸化マグネシウム顆粒 |
JP6817235B2 (ja) * | 2017-02-17 | 2021-01-20 | タテホ化学工業株式会社 | 球状酸化マグネシウム及びその製造方法 |
CN111233012B (zh) * | 2018-11-28 | 2021-10-08 | 中国科学院大连化学物理研究所 | 电工级氧化镁粉及其制备方法 |
WO2024190205A1 (ja) * | 2023-03-10 | 2024-09-19 | 宇部マテリアルズ株式会社 | 酸化マグネシウム粒子融着体及びその製造方法 |
JP2025117542A (ja) * | 2024-01-30 | 2025-08-12 | 宇部マテリアルズ株式会社 | 酸化マグネシウム粉末及びその製造方法 |
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