WO2014065248A1 - ガラスフィルムの切断方法 - Google Patents

ガラスフィルムの切断方法 Download PDF

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Publication number
WO2014065248A1
WO2014065248A1 PCT/JP2013/078510 JP2013078510W WO2014065248A1 WO 2014065248 A1 WO2014065248 A1 WO 2014065248A1 JP 2013078510 W JP2013078510 W JP 2013078510W WO 2014065248 A1 WO2014065248 A1 WO 2014065248A1
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WO
WIPO (PCT)
Prior art keywords
glass film
cutting
cutting line
glass
initial crack
Prior art date
Application number
PCT/JP2013/078510
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
孝英 藤居
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Publication of WO2014065248A1 publication Critical patent/WO2014065248A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/0235—Ribbons
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets

Definitions

  • the present invention relates to an improvement in glass film cutting technology.
  • FPD field emission display devices
  • the organic EL used for the organic EL display device has a characteristic of self-emission, it is also used as a lighting device in a single color, and in order to ensure airtightness in the organic EL lighting device as well.
  • a glass substrate is often used.
  • the glass substrate is flexible, the light emitting surface can be freely deformed, and the range of use as the lighting device can be dramatically expanded. Therefore, also in the glass substrate used for the said organic EL lighting apparatus, the glass film in which thinning was promoted from a viewpoint of ensuring high flexibility is drawing attention.
  • a glass substrate that has been thinned in response to the request that is, a glass film
  • a glass film generally forms a scribe line along a cutting line on a surface with a cutter such as a diamond cutter, and folds along the scribe line.
  • the scribe line is formed by scratching the surface of the glass substrate with a cutter.
  • minute cracks for example, lateral cracks
  • the scribe line is formed by scratching the surface of the glass substrate with a cutter.
  • minute cracks for example, lateral cracks
  • the cut end surface of the glass substrate even after cutting, along with the formation part of the scribe line Micro cracks that cause damage remain. Therefore, if the glass substrate after cutting is bent or the like and stress acts on the cut end surface where the microcracks remain, there may be a problem that the glass substrate is easily damaged.
  • the scribe line when forming the scribe line on the surface of the glass substrate, it is necessary to press the cutter against the surface of the glass substrate, but the scribe line is formed as the thickness becomes thinner like a glass film. Since the depth becomes shallower, the pressing force of the cutter is inevitably reduced. As a result, it is difficult to adjust the pressing force of the cutter to an appropriate range, and there is a problem that a scribe line cannot be properly formed and a cutting defect is likely to occur.
  • Patent Document 1 a method of cutting the glass film along the planned cutting line by forming an initial crack in a state where tensile stress is applied to the planned cutting line of the glass film.
  • Patent Document 2 a method of cutting the glass film along the planned cutting line by forming an initial crack in a state where tensile stress is applied to the planned cutting line of the glass film.
  • JP 2011-121791 A WO2011 / 155314 Publication JP 2011-116611 A
  • Patent Document 1 as a specific method, a planned cutting line is obtained by bending the glass film so that the other surface side of the glass film is convex in a state where one surface of the glass film is supported by a support member.
  • a method of applying a tensile stress to the film is disclosed.
  • the support member is raised to bend the glass film, the planned cutting line of the glass film is easily displaced from the central axis of the support member, and it is necessary to re-align both, so precise processing is required. There is a problem that workability is poor when it is performed.
  • the glass plate is deformed by depressurizing the concave portion of the jig in a state in which the glass plate is arranged on the jig having the uneven portion formed on the surface.
  • scratches caused by contact with the jig are easily formed.
  • a stress more than necessary is applied to the glass plate, and the cut surfaces come into contact with each other simultaneously with the cutting, resulting in defects in the cut surface of the glass plate.
  • the strength tends to decrease.
  • the laser cleaving apparatus described in Patent Document 3 is expensive, and the entire cutting apparatus may be complicated due to incidental facilities. Moreover, when the thickness of glass becomes small, it becomes difficult to produce the tensile stress by a thermal stress. In addition, in order to give a sufficient difference in thermal stress to a thin glass plate, it is necessary to slow down the cutting speed, which may reduce the efficiency of the cutting process.
  • the present invention suppresses the occurrence of micro cracks that cause breakage on the cut end face of the glass film, and is capable of cutting the glass film along the planned cutting line with good workability. It is a technical problem to provide a cutting method.
  • the method for producing a glass film of the present invention which was created to solve the above-described problems, supported one surface of the glass film with a support member after forming an initial crack in a part of the planned cutting line of the glass film.
  • the initial crack propagates along the planned cutting line. It is characterized by cutting.
  • the initial crack when tensile stress acts on the planned cutting line where the initial crack is formed, the initial crack propagates along the planned cutting line while tearing the glass film by the tensile stress. Therefore, since the glass film can be cut only by the tearing force due to the tensile stress without forming scribe lines on the surface of the glass film, the ratio of occurrence of micro cracks that cause breakage on the cut end face is reduced as much as possible. It becomes possible.
  • the glass film in the state where one surface of the glass film is supported by the support member, the glass film is bent so that the other surface side of the glass film is convex, so the weight of the glass film is supported by the support member, The magnitude of the tensile stress acting on the glass film can be stabilized, and the glass film can be cut in a stable state.
  • the tensile stress is applied to the planned cutting line by bending the glass film so that the other surface side of the glass film is convex, the tensile stress is applied easily and reliably to the planned cutting line of the glass film. In addition, the tensile stress can be easily maintained at a constant level while the glass film is being cut.
  • the initial crack is formed in advance on the planned cutting line of the glass film and a tensile stress is applied, the initial crack can be reliably propagated along the planned cutting line, and a precise cutting process with good workability is performed. It becomes possible.
  • the initial crack is preferably formed in the vicinity of the end of the glass film.
  • the initial crack can be efficiently propagated along the planned cutting line by tensile stress.
  • support members are arranged on both sides of the planned cutting line in parallel with the planned cutting line.
  • the glass film can be cut in a more stable state.
  • a holding member for holding the glass film in a fixed position is disposed at a position separated from the support member.
  • the glass film has a thickness of 300 ⁇ m or less, preferably 200 ⁇ m or less, more preferably 100 ⁇ m or less.
  • the tearing force of the initial crack due to the tensile stress easily acts suitably.
  • the glass film having a thickness within the range has sufficient flexibility. Therefore, it can be easily bent into a convex shape.
  • the thickness of the glass film is 1 ⁇ m or more, preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, further preferably 30 ⁇ m or more, and most preferably 50 ⁇ m or more.
  • the tensile stress is applied to the planned cutting line, so the initial crack formed on a part of the planned cutting line. Automatically advances along the planned cutting line by the tearing force due to the tensile stress. Therefore, since the glass film can be cut without forming scribe lines in advance, it is possible to reliably reduce the proportion of micro cracks that cause breakage on the cut end surface of the glass film.
  • the initial cracks will automatically develop along the planned cutting line, and the glass film can be easily removed without complicated operations and complicated controls. It becomes possible to cut.
  • FIG. 1A and 1B are perspective views for explaining a basic method of cutting a glass film according to the first embodiment of the present invention.
  • an initial crack 3 is formed in a part of the planned cutting line 2 of the glass film 1.
  • the initial crack 3 may be formed by any method.
  • the crack imparting member 4 is brought into contact with a part of the planned cutting line 2 of the glass film 1 to form the initial crack 3 on a part of the planned cutting line 2. To do.
  • the glass film 1 is bent so that the other surface side of the glass film 1 is convex, thereby cutting the glass film 1.
  • a tensile stress 6 is applied to the wire 2. Specifically, the tensile stress 6 is applied in any direction in the longitudinal direction of the planned cutting line 2 in a direction perpendicular to the planned cutting line 2 and along the surface of the glass film 1.
  • the tensile stress 6 acting on the planned cutting line 2 becomes a certain level or more, the tearing force due to the stress concentration of the tensile stress 6 acts on the tip of the initial crack 3, and the initial crack 3 is cut.
  • the cutting end face 7 is formed at a position corresponding to the planned cutting line 2 continuously extending along the planned line 2.
  • the thickness of the glass film 1 to be cut is thin, the cut end surface 7 formed by the development of the initial crack 3 is continuously formed across the front and back surfaces of the glass film 1, and the glass film 1 is full. Will be cut.
  • the thickness of the glass film 1 is 300 micrometers or less, for example, Preferably it is 200 micrometers or less, More preferably, it is 100 micrometers or less.
  • the position where the initial crack 3 is formed by the crack imparting member 4 is preferably the boundary between the surface and the end face of the glass film 1.
  • the largest tensile stress acts in the thickness direction of the glass film 1 among the end surfaces at the boundary portion, and the initial crack 3 can be stably imparted, so a very small range. Even when a small initial crack 3 is formed, the initial crack 3 can be efficiently advanced.
  • the formation position of the initial crack 3 is not limited to the boundary portion, and may be any position as long as it is a part of the planned cutting line 2.
  • the central portion in the thickness direction of the end face of the glass film 1 located on the planned cutting line 2 or the central portion in the longitudinal direction of the planned cutting line 2 may be used.
  • the initial crack 3 develops on both sides before and after the planned cutting line 2 with the initial crack 3 formed at the center of the planned cutting line 2 as a base point, and the glass film 1 is cut.
  • a method for forming the initial crack 3 it may be formed with a member or blade with a sharp tip, or may be formed with a laser or the like.
  • the shape of the initial crack 3 may be a dot shape or a groove shape having a length of 3 to 10 mm.
  • the initial crack 3 tears the glass film 1 by the tensile stress 6 as described above. However, it progresses along the planned cutting line 2. Therefore, since the glass film 1 can be cut only by the tearing force due to the tensile stress 6 without forming a scribe line on the surface of the glass film 1, the cause of damage to the cut end face 7 as in the case where the scribe line is formed. There will be no micro cracks. In addition, since the micro crack which causes a breakage does not arise in the cut end surface 7, it is not necessary to perform post-processing such as separately polishing the cut end surface 7 or acid treatment in order to remove the micro crack.
  • FIGS. 2A and 2B are perspective views showing a glass film cutting apparatus according to a second embodiment for embodying the glass film cutting method of the present invention.
  • This glass film cutting device includes a crack imparting member 4, a support member 5 that supports the center in the width direction of the glass film 1 from below, and a holding member 8 that holds and holds both ends in the width direction of the glass film 1 from above. It has.
  • the crack imparting member 4 is attached to the upper center of the base member 9 of the glass film cutting apparatus with the tip portion in contact with the glass film 1 facing downward, and can be moved up and down.
  • the support member 5 has a cylindrical shape, and is attached to the lower part of the center of the base member 9 so as to be able to be raised and lowered in order to bend the glass film 1. Since the supporting member 5 supports the central portion of the glass film 1 from below, the longitudinal dimension thereof is set to be equal to or larger than the dimension in the direction perpendicular to the width direction of the glass film 1. ing.
  • the holding member 8 also has a cylindrical shape and is provided on both sides of the base member 9 in the width direction.
  • the longitudinal direction dimension will not be specifically limited, However, From a viewpoint of pressing down the glass film 1 reliably, the width
  • the support member 5 and the holding member 8 each have a solid columnar shape, but a hollow cylindrical shape or a triangle whose cross section is perpendicular to the axis is a triangle other than a circle or other various shapes. It may have a square shape.
  • the support member 5 or the holding member 8 is in the form of a triangular prism or a polygonal column, the maximum stress portion at the time of applying a bending stress can be narrowed compared to the case of using a column, and the planned cutting line 2 It becomes possible to improve the accuracy of the straightness of the cutting line traveling upward.
  • the glass film 1 is stretched from below the holding member 8 on one side to above the supporting member 5 and below the holding member 8 on the other side.
  • the center portion in the width direction of the glass film 1 is supported from below by the support member 5, and both end portions in the width direction of the glass film 1 are pressed from above by the holding member 8.
  • the planned cutting line 2 of the glass film 1 is made to coincide with the position supported by the support member 5.
  • the crack imparting member 4 is lowered and brought into contact with the glass film 1 to form the initial crack 3 in a part of the planned cutting line 2, and then the crack imparting member 4 is raised and returned to the original position. .
  • the glass film 1 is made convex so that the portion corresponding to the planned cutting line 2 of the glass film 1 becomes the apex.
  • the tensile stress 6 is applied to the planned cutting line 2 by bending. At this time, the tensile stress 6 acts on the surface opposite to the side in contact with the support member 5, that is, the planned cutting line 2 on the surface (upper surface) side of the glass film 1.
  • the initial crack 5 is caused by the tearing force due to the tensile stress 6 acting on the planned cutting line 2. It progresses along the planned cutting line 2 and the glass film 1 is fully cut along the planned cutting line 2.
  • FIGS. 3A and 3B are views showing a glass film cutting device according to a third embodiment for embodying the glass film cutting method of the present invention.
  • the glass film cutting device according to the third embodiment differs from the glass film cutting device according to the second embodiment in that the support member 5 that supports the central portion of the glass film 1 is connected to the planned cutting line 2. It exists in the point arrange
  • the front and back surfaces of the glass film 1 corresponding to the planned cutting line 2 are kept in a non-contact state with other members. Therefore, in this state, there is no resistance that unreasonably hinders the progress of the initial crack 3, so that the initial crack 3 can be efficiently advanced by the tensile stress 6. Moreover, it can suppress that a damage
  • FIG. 4 is a view showing a glass film cutting device according to a fourth embodiment for embodying the glass film cutting method of the present invention.
  • the glass film cutting device according to the fourth embodiment differs from the glass film cutting device according to the second embodiment in that the glass film 1 is held from below at the both ends in the width direction of the glass film 1.
  • the member 10 is further arranged, and both end portions in the width direction of the glass film 1 are sandwiched by the holding members 8 and 10 from both upper and lower sides.
  • the glass film 1 is held in a fixed position by the upper and lower holding members 8 and 10. In this way, the glass film 1 can be held in the same posture as before cutting even in the cutting process.
  • the support member 7 and the holding members 8 and 10 have been described as being cantilevered. However, for example, when the glass film 1 is wide, the support is supported. If the member 7 and the holding members 8 and 10 are supported at both ends, more stable cutting is possible.
  • FIGS. 5A and 5B are views showing a glass film cutting device according to a fifth embodiment for embodying the glass film cutting method of the present invention.
  • the glass film cutting device according to the fifth embodiment differs from the glass film cutting device according to the second to fourth embodiments described above in that the cutting device also serves as a conveying device for the glass film 1. It is in.
  • this glass film cutting apparatus includes a transport roller 11 for transporting the glass film 1.
  • the transport roller 11 is divided into three parts: a center roller 11a and side rollers 11b disposed on both sides in the width direction of the center roller 11a.
  • the support member 5 is arrange
  • the side roller 11b is configured to be retractable downward from the work position S1 for conveying the glass film 1.
  • the side roller 11b is configured to swing between the work position S1 and the retracted position S2.
  • FIGS. 7A to 7C are views showing a glass film cutting apparatus according to a sixth embodiment for embodying the glass film cutting method described above.
  • the glass film cutting device according to the sixth embodiment is different from the glass film cutting device according to the second to fifth embodiments described above in that the long glass film 1 is wound around the outer periphery of the core 12. It is in the point which is making the glass roll 13 made into a cutting
  • the support member 5 is disposed substantially parallel to the core 12 above the side of the glass roll 13,
  • the cutting line 2 is set on the glass film 1 drawn out from the core 12 to the support member 5, and an initial crack is formed on a part of the cutting line 2 (end portion in the illustrated example) by a crack applying member (not shown).
  • the glass film 1 is bent over the support member 5.
  • the difference between FIGS. 1A to 1C is the position in the height direction of the support member 5 on which the glass film 1 is hung.
  • the supporting member 5 is located above the side of the glass roll 13 in FIG. A, on the side of the glass roll 13 and in the same height as the core 12 in FIG.
  • positioned below each side is illustrated.
  • the holding members 8a and 8b may be omitted, when the glass film 1 is pressed by providing the holding member 8a and further by providing the holding member 8b, more stable and linear cutting is performed. be able to.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
PCT/JP2013/078510 2012-10-25 2013-10-22 ガラスフィルムの切断方法 WO2014065248A1 (ja)

Applications Claiming Priority (2)

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JP2012235260 2012-10-25
JP2012-235260 2012-10-25

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105226143A (zh) * 2015-09-29 2016-01-06 山东浪潮华光光电子股份有限公司 一种GaAs基LED芯片的切割方法
WO2016011114A1 (en) * 2014-07-18 2016-01-21 Corning Incorporated Methods and apparatus for controlled laser cutting of flexible glass
JP6284670B1 (ja) * 2017-04-25 2018-02-28 住友化学株式会社 有機デバイスの製造方法
JP2018185925A (ja) * 2017-04-25 2018-11-22 住友化学株式会社 有機デバイスの製造方法
CN112004781A (zh) * 2018-05-31 2020-11-27 日本电气硝子株式会社 玻璃膜的制造方法
CN112020482A (zh) * 2018-05-31 2020-12-01 日本电气硝子株式会社 玻璃膜的制造方法
CN110176553B (zh) * 2019-05-30 2021-04-27 京东方科技集团股份有限公司 一种显示基板的制备方法及显示基板
CN113955932A (zh) * 2021-10-28 2022-01-21 河北光兴半导体技术有限公司 一种超薄玻璃裂片装置及裂片方法

Families Citing this family (3)

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Publication number Priority date Publication date Assignee Title
CN107466288A (zh) 2015-01-29 2017-12-12 康宁股份有限公司 用于从玻璃薄板条制造各区段的方法和设备
JP6669988B2 (ja) * 2016-06-02 2020-03-18 日本電気硝子株式会社 ガラスフィルムの製造方法
JP2019167270A (ja) * 2018-03-23 2019-10-03 日東電工株式会社 ガラス構造体片の製造方法

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JPH01292313A (ja) * 1988-05-20 1989-11-24 Matsushita Electric Ind Co Ltd セルの割断装置および割断方法
JPH0952725A (ja) * 1995-08-11 1997-02-25 Nippon Electric Glass Co Ltd 薄板ガラスの切断方法及び装置
JP2011121791A (ja) * 2009-12-08 2011-06-23 Nippon Electric Glass Co Ltd ガラスフィルムの切断方法及びその切断装置
WO2011155314A1 (ja) * 2010-06-07 2011-12-15 日本電気硝子株式会社 ガラス板の切断方法

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JPH01292313A (ja) * 1988-05-20 1989-11-24 Matsushita Electric Ind Co Ltd セルの割断装置および割断方法
JPH0952725A (ja) * 1995-08-11 1997-02-25 Nippon Electric Glass Co Ltd 薄板ガラスの切断方法及び装置
JP2011121791A (ja) * 2009-12-08 2011-06-23 Nippon Electric Glass Co Ltd ガラスフィルムの切断方法及びその切断装置
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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016011114A1 (en) * 2014-07-18 2016-01-21 Corning Incorporated Methods and apparatus for controlled laser cutting of flexible glass
CN105226143A (zh) * 2015-09-29 2016-01-06 山东浪潮华光光电子股份有限公司 一种GaAs基LED芯片的切割方法
JP6284670B1 (ja) * 2017-04-25 2018-02-28 住友化学株式会社 有機デバイスの製造方法
WO2018198655A1 (ja) * 2017-04-25 2018-11-01 住友化学株式会社 有機デバイスの製造方法
JP2018185925A (ja) * 2017-04-25 2018-11-22 住友化学株式会社 有機デバイスの製造方法
CN112020482A (zh) * 2018-05-31 2020-12-01 日本电气硝子株式会社 玻璃膜的制造方法
CN112004781A (zh) * 2018-05-31 2020-11-27 日本电气硝子株式会社 玻璃膜的制造方法
KR20210016328A (ko) * 2018-05-31 2021-02-15 니폰 덴키 가라스 가부시키가이샤 유리 필름의 제조 방법
CN112004781B (zh) * 2018-05-31 2022-10-21 日本电气硝子株式会社 玻璃膜的制造方法
CN112020482B (zh) * 2018-05-31 2022-12-23 日本电气硝子株式会社 玻璃膜的制造方法
TWI809112B (zh) * 2018-05-31 2023-07-21 日商日本電氣硝子股份有限公司 玻璃膜的製造方法
KR102665651B1 (ko) 2018-05-31 2024-05-20 니폰 덴키 가라스 가부시키가이샤 유리 필름의 제조 방법
CN110176553B (zh) * 2019-05-30 2021-04-27 京东方科技集团股份有限公司 一种显示基板的制备方法及显示基板
CN113955932A (zh) * 2021-10-28 2022-01-21 河北光兴半导体技术有限公司 一种超薄玻璃裂片装置及裂片方法
CN113955932B (zh) * 2021-10-28 2023-10-20 河北光兴半导体技术有限公司 一种超薄玻璃裂片装置及裂片方法

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