WO2014059824A1 - 触控面板及其制作方法 - Google Patents

触控面板及其制作方法 Download PDF

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Publication number
WO2014059824A1
WO2014059824A1 PCT/CN2013/082282 CN2013082282W WO2014059824A1 WO 2014059824 A1 WO2014059824 A1 WO 2014059824A1 CN 2013082282 W CN2013082282 W CN 2013082282W WO 2014059824 A1 WO2014059824 A1 WO 2014059824A1
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WO
WIPO (PCT)
Prior art keywords
touch
touch panel
substrate
sensing electrode
electrode matrix
Prior art date
Application number
PCT/CN2013/082282
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English (en)
French (fr)
Inventor
方芳
吴春彦
纪贺勋
Original Assignee
宸鸿科技(厦门)有限公司
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Application filed by 宸鸿科技(厦门)有限公司 filed Critical 宸鸿科技(厦门)有限公司
Publication of WO2014059824A1 publication Critical patent/WO2014059824A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/169—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Definitions

  • the invention relates to an input device, in particular to a touch panel and a manufacturing method thereof.
  • touch panels have been widely used.
  • Touch panels using touch panels also known as “touch screens” and “touch screens”, are inductive display devices that can receive input signals generated by touch operations.
  • touch panel is the most simple, convenient and natural human-computer interaction method.
  • Touch panels have been widely used in consumer, communication, computer and other electronic products, such as game machines, smart phones, tablet computers, etc., which are widely used at present, as input and output interfaces of many electronic products.
  • the display part of these electronic products is generally integrated by the touch panel and the display panel, and the user can select the action to be performed by using a finger or a stylus according to the function options on the display screen, thereby eliminating the need for Inputs of other conventional types of input devices (eg, buttons, keyboards, or joysticks) operate greatly, greatly increasing the convenience of the input.
  • input devices eg, buttons, keyboards, or joysticks
  • the touch panel generally includes a substrate and passes through the light lithography
  • the (Photolithography) process sequentially patterns the sensing electrode matrix, the insulating layer, the conductive line, the protective layer, and the like formed on the substrate.
  • the use of the mask is involved in the patterning process, but each size of the customized touch panel, the reserved side width, the layout of the conductive lines, and the outlet position are different, so each mass production At the same time, the required mask is redesigned and the original mask cannot be used.
  • the masks and processes between different touch panels are different, it is necessary to frequently switch production lines for different products during manufacturing, which is difficult to integrate.
  • Such a method of manufacturing a touch panel according to different specifications inevitably results in a large defect rate, which in turn wastes a lot of manpower, financial resources and material resources.
  • the invention improves the structure of the touch panel, so that the patterning process of the touch panel only creates the sensing electrode matrix on the substrate, and the customized structure parts other than the sensing electrode matrix are not made in the same On the substrate. In order to allow the patterning process to use a single-standard template and process to create a touch panel of different sizes.
  • a touch panel including:
  • the touch sensor includes a touch substrate and a sensing electrode matrix, wherein the sensing electrode matrix is formed on a surface of the touch substrate and a connection end of the sensing electrode matrix is dispersedly distributed in the sensing electrode matrix And at least two sides; and a connecting plate provided with a conductive line connected to the touch sensor, wherein the conductive line is electrically connected to the connection end of the sensing electrode matrix.
  • the sensing electrode matrix is aligned with an edge of the touch substrate.
  • the sensing electrode matrix includes a plurality of conductive units, and the conductive unit located at an edge of the touch substrate is half of an area of the central conductive unit of the touch substrate.
  • the connecting board is a flexible printed circuit board, and the flexible printed circuit board is laminated to the touch sensor portion.
  • the flexible printed circuit board and the touch sensor are connected by an anisotropic conductive adhesive, and the conductive circuit of the flexible printed circuit board and the sensing electrode of the touch sensor are The matrix is electrically connected by the anisotropic conductive paste.
  • the protective glue is formed at a boundary between the touch sensor and the flexible printed circuit board.
  • a protective layer covering an edge of the touch substrate is further included.
  • the method further includes bonding a protective substrate to the touch sensor and the flexible printed circuit board by using an optical adhesive, and the touch panel includes a visible area and is disposed on the visible A masking area around the area, the masking area being used to shield the flexible printed circuit board.
  • a shielding layer disposed on an upper surface or a lower surface of the protective substrate and defining the shielding region is further included.
  • the connecting board is a protective substrate
  • the touch panel includes a visible area and a shielding area disposed around the visible area, and the conductive line is disposed in the shielding area.
  • a shielding layer disposed on an upper surface or a lower surface of the protective substrate and defining the shielding region is further included.
  • the conductive trace of the protective substrate is made of silver paste for electrically connecting the sensing electrode matrix of the touch sensor.
  • the visible area of the protective substrate is connected to the touch sensor by an optical glue.
  • a touch panel manufacturing method includes the following steps: fabricating a touch sensor including a touch substrate and a sensing electrode matrix, wherein the sensing electrode matrix is formed on a surface of the touch substrate and the sensing electrode The connection ends of the matrix are distributed on at least two sides of the sensing electrode matrix; and a connection plate provided with a conductive line is connected to the touch sensor to electrically connect the conductive line to the sensing electrode matrix .
  • the step of fabricating a touch sensor including a touch substrate and a sensing electrode matrix includes: forming a transparent conductive layer on at least one surface of the mother substrate; patterning the transparent conductive layer to form the Sensing a pattern of the electrode matrix; and cutting the mother substrate to form a plurality of the touch sensors.
  • the sensing electrode matrix is aligned with an edge of the touch substrate.
  • the sensing electrode matrix includes a plurality of conductive units, and the conductive unit located at an edge of the touch substrate is half of an area of a conductive unit located in a middle portion of the touch substrate.
  • the connecting board is a flexible printed circuit board, and the flexible printed circuit board is laminated to the touch sensor portion.
  • the flexible printed circuit board and the touch sensor are connected by an anisotropic conductive adhesive.
  • the method further includes forming a protective glue at a junction of the touch sensor and the flexible printed circuit.
  • the method further includes covering the edge of the touch substrate with the protective layer.
  • the method further includes bonding the protection substrate to the touch sensor and the flexible printed circuit board by using an optical adhesive, wherein the touch panel includes a visible area and is disposed in the visible area. a surrounding shielding area for correspondingly shielding the flexible printed circuit board.
  • the connecting board is a protective substrate
  • the touch panel includes a visible area and a shielding area disposed around the visible area, and the conductive line is disposed in the shielding area.
  • the conductive traces are made using silver paste printing.
  • the visible area of the touch panel is connected to the touch sensor through an optical glue.
  • the present invention transfers the conductive lines that need to be customized to the connection board to be connected to the connection ends distributed on at least two sides of the sensing electrode matrix, so that the edge regions of the touch substrate are no longer provided with conductive lines.
  • the touch substrate can only form a matrix of sensing electrodes fabricated by a patterning process. In this way, in the process of making the touch sensor, the same template and process can be used in all production lines, and after a large number of non-customized touch sensors are produced, the connection board is connected, thereby greatly improving the production efficiency. And yield, while saving a lot of manpower, material and financial resources.
  • FIG. 1 is a top plan view of a touch panel in a first embodiment of a touch panel
  • FIG. 2 is a cross-sectional view taken along line A-A of the touch panel of FIG. 1 after covering the protective substrate;
  • 3 is a plan view of the touch panel in the second embodiment
  • FIG. 5 is a flow chart of a method for manufacturing a touch panel
  • FIG. 6 is a flow chart of specific steps further included in the method for fabricating the touch panel in an embodiment
  • FIG. 7 is a flow chart of a specific step further included in a method for fabricating a touch panel in another embodiment
  • FIG. 8 is a schematic structural view of a mother substrate of a touch sensor.
  • FIG. 9 is a specific flow chart for fabricating a touch sensor including a touch substrate and a sensing electrode matrix.
  • a touch panel includes a touch sensor 100 and a connection board 200 connected to the touch sensor 100 .
  • the touch sensor 100 includes a touch substrate 110 and a sensing electrode matrix 120.
  • the sensing electrode matrix 120 is formed on the surface of the touch substrate 110 and the connection ends of the sensing electrode matrix 120 are dispersedly distributed in at least two of the sensing electrode matrix 120.
  • the connection end of the sensing electrode matrix 120 is a terminal terminal of the sensing electrode matrix 120 for receiving a driving signal to drive the sensing electrode matrix 120 or outputting an electrical signal indicating a sensing result of the sensing electrode matrix 120, for example, FIG.
  • the position indicated by reference numeral 121 is one of the connections.
  • the sensing electrode matrix 120 is generally distributed in a rectangular shape, and the connecting ends of the sensing electrode matrix 120 are distributedly distributed on at least two sides of the sensing electrode matrix 120, so that the conventional need to be disposed and connected on the touch substrate 110 can be omitted.
  • the space of the connected conductive lines are generally distributed in a rectangular shape, and the connecting ends of the sensing electrode matrix 120 are distributedly distributed on at least two sides of the sensing electrode matrix 120, so that the conventional need to be disposed and connected on the touch substrate 110 can be omitted.
  • the connecting board 200 is provided with a conductive line 210 and is connected to the touch sensor 100 to electrically connect the conductive line 210 to the connecting end of the sensing electrode matrix 120.
  • the conductive line 210 includes an externally connected centralized line interface 212.
  • the conductive line 210 receives a driving signal generated by a controller (not shown) through the concentrated line interface 212 to drive the sensing electrode matrix 120 and sense the sensing electrode matrix 120.
  • the measured touch signal is output to the controller for touch position recognition.
  • the touch panel transfers the customized conductive lines 210 to the connection board 200 to be electrically connected to the connection ends distributed on at least two sides of the sensing electrode matrix 120, so that the edge regions of the touch substrate 110 are no longer
  • the conductive substrate is provided, and the touch substrate 110 can only form the sensing electrode matrix 120 which is formed by a patterning process (such as a photolithography process or a printing process).
  • a patterning process such as a photolithography process or a printing process.
  • the sensing electrode matrix 120 includes a plurality of first axial electrodes 122 parallel to each other, a plurality of second axial electrodes 124 parallel to each other, and an insulating spacer 126 .
  • the first axial electrode 122 and the second axial electrode 124 are perpendicular to each other and insulated by the insulating spacer 126.
  • the first axial electrode 122 includes a plurality of first conductive units 122a and first wires 122b disposed on the surface of the touch substrate 110.
  • the insulating spacer 126 is disposed on the first wire 122b.
  • the second axial electrode 124 includes a plurality of second conductive units 124a disposed on the surface of the touch substrate 110 and a second conductive line 124b disposed on the insulating spacer 126.
  • the same photomask can be used to fabricate the above-mentioned sensing electrode matrix 120, and it is not necessary to design the photomask for products of different specifications, that is, the specifications of the obtained substrate 110 on which the sensing electrode matrix 120 is formed are uniform.
  • the sensing electrode matrix 120 is aligned with the edge of the touch substrate 110 .
  • the first conductive unit 122 a is aligned with the edge of the touch substrate 110 , and the first conductive layer is located at the edge.
  • the unit 122a is the connection end of the sensing electrode matrix 120. Aligning the sensing electrode matrix 120 with the edge of the touch substrate 110 is advantageous for improving the utilization ratio of the sensing electrode matrix 120 on the touch substrate 110.
  • the sensing electrode matrix 120 may also be disposed at a position that is a certain width from the edge of the touch substrate 110.
  • the first conductive unit 122 a and the second conductive unit 124 a (hereinafter collectively referred to as a conductive unit) in the middle of the touch substrate 110 have a diamond shape, and the conductive unit located at the edge of the touch substrate 110 is a diamond-shaped conductive.
  • the unit is divided into a half shape after being diagonally divided, that is, the conductive unit at the edge of the touch substrate 110 is half of the area of the conductive unit in the middle of the touch substrate 110, and the shape of the half is used as the sensing electrode matrix 120. Connection end.
  • the conductive unit may be rectangular or hexagonal in addition to the shape of a diamond.
  • the conductive unit at the edge of the touch substrate 110 is half of the area of the conductive unit in the middle of the touch substrate 110.
  • the contact sensor 100 is formed by cutting, so that the connection ends of the two touch substrates 110 are separated. There are suitable sizes to serve as the connection ends of the sensing electrode matrix 120, and the method of cutting will be described in more detail later.
  • connection board 200 is, for example, a flexible printed circuit board, and the connection board 200 is partially connected to the touch sensor 100.
  • the connecting plate 200 and the touch sensor 100 are not overlapped in the same plane, so that the contact area can be flexibly adjusted, and the connection is stable and firm.
  • the connecting board 200 and the touch sensor 100 are connected by the anisotropic conductive adhesive 300, so that the conductive line 210 of the connecting board 200 and the sensing electrode matrix 120 of the touch sensor 100 are sent through the anisotropic conductive adhesive 300. connection.
  • other embodiments may electrically connect the connection board 200 to the touch sensor 100 by soldering.
  • the touch panel further includes a protective adhesive 400 formed on the interface between the touch sensor 100 and the connecting board 200, that is, the protective adhesive 400 can cover the surface of the touch substrate 110 and the connecting board 200 provided with the sensing electrode matrix 120. Junction.
  • the protective glue 400 is used to cover the connection between the surface of the touch substrate 110 provided with the sensing electrode matrix 120 and the connecting board 200, so as to avoid the influence of the electrostatic discharge phenomenon on the circuit.
  • the touch panel further includes a protective layer 500 covering the edge of the touch substrate 110 .
  • the protective layer 500 may be the same as the component of the protective adhesive 400, such as a resin, or may be formed by using a sealant or an explosion-proof film.
  • the touch panel further includes a protective substrate 700 (eg, a cover glass) that is attached to the touch sensor 100 and the connection board 200 through the optical adhesive 600 .
  • the optical glue 600 can be water glue, OCA glue (Optical Clear Adhesive, an optically transparent layer of special double-sided tape).
  • the touch panel includes a visible area V and a masking area NV disposed around the visible area V, and the touch panel includes an upper surface or a lower surface for defining the shielding area NV and disposed on the protective substrate 700.
  • the shielding layer 800 is disposed on the lower surface of the protective substrate 700.
  • the shielding layer 800 is used to correspondingly shield the connecting board 200 and other peripheral components located in the shielding area NV.
  • the shielding layer 800 can be made of materials such as inks and photoresists.
  • the sensing electrode matrix 120 may be further covered with a passivation layer (not shown), such as a silicide layer.
  • a passivation layer such as a silicide layer.
  • the layer or the like is used to protect the sensing electrode matrix 120.
  • the protective substrate 700 is bonded to the passivation layer and the connecting board 200 through the optical adhesive 600.
  • connection board 200 is described by taking a flexible printed circuit board as an example.
  • the protection board 900 for example, cover glass
  • the conductive line 910 of the embodiment is directly disposed on the protective substrate 900.
  • the touch panel since the touch panel includes the visible area V and the shielding area NV disposed around the visible area V, the conductive line 910 is disposed in the shielding area NV of the protection substrate 900, and is touched.
  • the control panel further includes a shielding layer 920 for defining the shielding region NV and disposed on the lower surface of the protective substrate 900.
  • the conductive wiring 910 of the present embodiment is disposed on the lower surface of the shielding layer 920 of the protective substrate 900.
  • the shielding layer 920 may also be disposed on the upper surface of the protection substrate 900.
  • the conductive line 910 is disposed on the lower surface of the protection substrate 900 corresponding to the shielding area NV.
  • the conductive line 910 is located at the edge of the protection substrate 900.
  • the portion of the protection substrate 900 in the visible area V is bonded to the touch sensor 100 through the optical adhesive 600, and the conductive line 910 located in the shielding area NV is passed through the anisotropic conductive adhesive.
  • the 300 is electrically connected to the connection end of the sensing electrode matrix 120 of the touch sensor 100. Therefore, the structure of the protection substrate 900 directly serving as the connection board can further simplify the structure of the touch panel.
  • connection end of the conductive line 910 and the sensing electrode matrix 120 by the anisotropic conductive paste 300 can also use surface mount technology (Surface Mounted
  • the protective substrate 900 is electrically connected to the touch sensor 100.
  • the conductive line 910 can be made of conductive silver glue.
  • the conductive line 910 made of conductive silver glue can be formed in the conductive line 910.
  • the connection ends of the sensing electrode matrix 120 on the touch substrate 110 are electrically connected to realize the transmission of electrical signals.
  • the sensing electrode matrix 120 may be further covered with a passivation layer, such as a silicide layer.
  • a passivation layer such as a silicide layer.
  • the layer or the like is used to protect the sensing electrode matrix 120.
  • the portion of the protective substrate 900 located in the visible region V is bonded to the passivation layer by the optical adhesive 600.
  • the protective substrate 900 is attached to the sensing electrode matrix 120 to protect the front surface of the sensing electrode matrix 120, the conductive substrate is still exposed at the edge of the touch substrate 110, and the touch panel may further include an edge covering the touch substrate 110.
  • Protective layer 500 can be realized by using a frame glue or an explosion-proof film.
  • FIG. 5 is an embodiment of a method for manufacturing a touch panel. The embodiment is described based on the touch panel architecture of FIG. 1 and FIG. 2 , and includes steps S510 to S520 , which are specifically described as follows:
  • Step S510 the touch sensor 100 including the touch substrate 110 and the sensing electrode matrix 120 is formed, wherein the sensing electrode matrix 120 is formed on the surface of the touch substrate 110 and the connection ends of the sensing electrode matrix 120 are dispersedly distributed on the sensing electrodes. At least two sides of the matrix 120.
  • the connection end of the sensing electrode matrix 120 is a terminal terminal of the sensing electrode matrix 120 for receiving a driving signal to drive the sensing electrode matrix 120 or outputting an electrical signal representing the sensing result of the sensing electrode matrix 120.
  • the position indicated by reference numeral 121 in Fig. 1 is one of the connection ends.
  • the sensing electrode matrix 120 is generally distributed in a rectangular shape, and the connecting ends of the sensing electrode matrix 120 are distributedly distributed on at least two sides of the sensing electrode matrix 120, so that the conventional need to be disposed and connected on the touch substrate 110 can be omitted.
  • the space of the connected conductive lines are generally distributed in a rectangular shape, and the connecting ends of the sensing electrode matrix 120 are distributedly distributed on at least two sides of the sensing electrode matrix 120, so that the conventional need to be disposed and connected on the touch substrate 110 can be omitted.
  • step S520 the connection board 200 with the conductive line 210 is connected to the touch sensor 100 to electrically connect the conductive line 210 and the sensing electrode matrix 120.
  • the manufacturing method of the touch panel requires that the customized conductive line 210 be transferred to the connection board 200 to be connected to the connection ends distributed on at least two sides of the sensing electrode matrix 120, so that the edge area of the touch substrate 110 is The conductive circuit is no longer provided, and the touch substrate 110 is formed only by the sensing electrode matrix 120 formed by the patterning process. In this way, in the process of manufacturing the touch sensor 100, the same template and process can be used in all production lines, and after the non-customized touch sensor 100 is mass-produced, the connection board 200 is connected, thereby greatly improving Production efficiency and yield, while saving a lot of manpower, material and financial resources.
  • the connecting board 200 is exemplified by a flexible printed circuit board, which is connected to the touch sensor 100 in a layered manner.
  • the flexible printed circuit board and the touch sensor 100 are connected by the anisotropic conductive adhesive 300, and the conductive circuit 210 of the flexible printed circuit board and the sensing electrode matrix 120 of the touch sensor 100 pass the anisotropy.
  • the conductive adhesive 300 is electrically connected.
  • the touch panel manufacturing method of this embodiment further includes the following steps: Step S610, forming a protective adhesive 400 at the interface between the touch sensor 100 and the flexible printed circuit, that is, covering the joint of the protective adhesive 400 on the surface of the touch substrate 110 provided with the sensing electrode matrix 120 and the flexible printed circuit board. .
  • ESD Electro-Static Discharge
  • step S620 the protective layer 500 is covered on the edge of the touch substrate 110.
  • the protective layer 500 may be the same as the component of the protective adhesive 400, or may be implemented by using a sealant or an explosion-proof film.
  • the protective substrate 700, the touch sensor 100, and the flexible printed circuit board are bonded together by the optical adhesive 600.
  • Optical glue 600 can be water glue, OCA glue (Optical Clear Adhesive, an optically transparent layer of special double-sided adhesive).
  • the touch panel further includes a shielding layer 800 disposed on the upper surface or the lower surface of the protective substrate 700 and forming a shielding region NV.
  • the shielding layer 800 is disposed on the protective substrate 700. The lower surface. The shielding layer 800 is used to correspondingly shield the flexible printed circuit board and other peripheral components located in the shielding area NV, so as to prevent the user from directly seeing the flexible printed circuit board.
  • the touch panel is a touch panel structure as shown in FIG. 3 and FIG. 4, the touch panel is a protective substrate 900 (for example, a cover glass), and the manufacturing method shown in FIG. The steps are as follows: Step S510, the touch sensor 100 including the touch substrate 110 and the sensing electrode matrix 120 is formed, wherein the sensing electrode matrix 120 is formed on the surface of the touch substrate 110 and the connection ends of the sensing electrode matrix 120 are dispersed.
  • the touch panel further includes a shielding layer 920 for defining a shielding region NV and disposed on a lower surface of the protective substrate 900.
  • the shielding layer 920 may also be disposed on the upper surface of the protective substrate 900 in different embodiments.
  • step S520 the protective substrate 900 is bonded to the touch sensor 100 through the optical adhesive 600 in the portion of the visible area V, and the conductive line 910 located in the shielding area NV passes through the anisotropic conductive adhesive 300 and the touch sensor 100.
  • the connection ends of the sensing electrode matrix 120 are electrically connected.
  • the structure of the protection substrate 900 directly serving as the connection board can further simplify the structure of the touch panel.
  • Optical glue can be water gel, OCA glue (Optical Clear Adhesive, an optically transparent layer of special double-sided adhesive).
  • surface mount technology can also be used (Surface Mounted)
  • the conductive line 910 of the protective substrate 900 is electrically connected to the touch substrate 110.
  • the conductive line 910 of the protective substrate 900 can be made of conductive silver paste, and the bonding process of the protective substrate 900 and the touch substrate 110 is performed.
  • the conductive line 910 made of conductive silver paste is electrically connected to the sensing electrode matrix 120 on the touch substrate 110 to realize the transmission of subsequent electrical signals.
  • the protective substrate 900 is adhered to the sensing electrode matrix 120 to protect the front surface of the sensing electrode matrix, the edge of the touch substrate 110 still exposes the axial electrode, so the touch panel with the protective substrate as the connecting plate can be manufactured.
  • the step S710 shown in FIG. 7 is further included to cover the protective layer 500 on the edge of the touch substrate 110. The leakage or electrostatic influence is prevented by covering the protective layer 500 at the edge of the touch substrate 110.
  • the protective layer 500 may be the same as the component of the protective adhesive 400 described above, or may be implemented by using a frame glue or an explosion-proof film.
  • Step S910 forming a transparent conductive layer on at least one surface of the mother substrate 110a.
  • This step can be the same as the conventional touch panel forming a transparent conductive layer.
  • Step S920 patterning the transparent conductive layer to form a pattern of the sensing electrode matrix 120.
  • the pattern of the sensing electrode matrix 120 can be formed, for example, by photolithographic etching.
  • the sensing electrode matrix 120 includes a plurality of first axial electrodes 122 parallel to each other, a plurality of second axial electrodes 124 parallel to each other, and insulating spacers 126.
  • the first axial electrode 122 and the second axial electrode 124 are perpendicular to each other and insulated by the insulating spacer 126.
  • the first axial electrode 122 includes a plurality of first conductive units 122a and first wires 122b disposed on the surface of the touch substrate 110.
  • the second axial electrode 124 includes a plurality of second conductive units 124a and second wires 124b disposed on the surface of the touch substrate 110.
  • the step of forming the sensing electrode matrix 120 on the touch substrate 110 specifically includes: arranging the first wires 122b on the touch substrate 110; and laying the first wires 122b at intervals Corresponding insulating spacers 126; the first conductive unit 122a, the second conductive unit 124a and the second conductive line 124b are simultaneously formed at one time.
  • the first conductive unit 122a is disposed on the first wire 122b on both sides of the insulating spacer 126 and is connected in series by the first wire 122b
  • the second conductive unit 124a is disposed on both sides of the first wire 122b.
  • the two wires 124b span the insulating spacers 126 and are connected in series with the second conductive unit 124a.
  • the first conductive unit 122a, the second conductive unit 124a, and the first conductive line 122b or the second conductive line 124b may be formed at the same time. If the first conductive unit 122a, the second conductive unit 124a and the first conductive line 122b are simultaneously formed, wherein the first conductive line 122b is connected in series with the first conductive unit 122a, then a corresponding insulating spacer is formed on each of the first conductive lines 122b.
  • the sheet 126 is further formed on the insulating spacer 126 with a second wire 124b connecting the second conductive unit 124a.
  • step S930 the mother substrate 110a is cut to form a plurality of the touch sensors.
  • FIG. 8 can be cut into two touch sensors of the touch sensor 102 and the touch sensor 104. Cutting can be done by mechanical, chemical or laser methods.
  • the sensing electrode matrix belonging to each of the touch sensors 102, 104 after cutting is respectively included. 120 is aligned with the edge of the touch substrate 110 of each of the touch sensors 102, 104 to facilitate subsequent electrical connection with the conductive lines of the connection board.
  • the conductive unit has a diamond shape.
  • the cutting line can be cut along the diagonal of the diamond-shaped conductive unit, for example, as shown by the touch sensor 102, so that the utilization of the mother substrate 110 can be maximized. Rate, ideally, the entire mother substrate 110 can be 100% utilized.
  • the cutting line can also be cut at any position along the sensing electrode matrix 120, as shown, for example, by the touch sensor 104. The position of the cutting line that actually cuts the touch sensor is not limited by the present invention.
  • the obtained touch sensor is further connected to a connection board provided with a customized conductive line to obtain a customized touch panel.
  • touch panel manufacturing method and structure can be used for other touch panels in addition to the capacitive touch panel, and the touch panel can be used as long as there is an array of sensing electrode matrix. Method and structure.

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Abstract

本发明提供一种触控面板，包括触控传感器及连接板。触控传感器包含触控基板及感测电极矩阵，其中所述感测电极矩阵形成于所述触控基板的表面并且所述感测电极矩阵的连接端分散分布在所述感测电极矩阵的至少两条边上。连接板布设有导电线路，并连接于所述触控传感器，使所述导电线路与所述感测电极矩阵的连接端电连接。此外，本发明还提供了一种触控面板的制作方法。

Description

触控面板及其制作方法 技术领域
本发明有关一种输入设备，尤指一种触控面板及其制作方法。
背景技术
近年来，触控面板得到广泛应用，采用触控面板的触摸屏又称为“触控屏”、“触摸屏”，是一种可接收触控操作产生输入信号的感应式显示设备。触控面板作为一种最新的输入设备，它是目前最简单、方便、自然的一种人机交互方式。触控面板已大量运用于消费、通讯、计算机等电子产品上，例如目前广泛使用的游戏机、智能手机、平板计算机等，作为众多电子产品的输入输出接口。这些电子产品的显示部分一般都是由触控面板与显示面板整合而成，可供使用者用手指或触控笔依照显示画面上的功能选项点选输入所要执行的动作，藉此可在无需其他传统类型的输入设备(如，按钮、键盘、或操作杆)操作下进行输入，极大的提高了输入的便利性。
触控面板一般包括基板、通过光微影 (Photolithography)制程来依序图案化形成于基板上的感测电极矩阵、绝缘层、导电线路及保护层等。然而，在图案化过程中会涉及到光罩的使用，但由于每一客制化触控面板的尺寸规格、预留边宽、导电线路的布局及出线位置等都不同，因此每次量产时，都要重新设计所需的光罩，无法沿用原本的光罩。再者，由于不同触控面板之间的光罩和制程不一样，制造生产时需要对不同产品频繁切换生产线，难以整合。这种根据不同规格制作触控面板的方法不可避免的会造成较大的不良率，进而浪费了很多的人力，财力和物力。
发明内容
本发明通过触控面板的结构性改良，让触控面板的图案化制程仅是在基板上制作出感测电极矩阵，而感测电极矩阵之外的客制化构造部分则不会制作于同一基板上。藉以让图案化制程采用单一制式规格的模板及制程即可配合来制作出不同尺寸规格的触控面板。
根据本发明的一实施例，提供一种触控面板，包括： 触控传感器，包含触控基板及感测电极矩阵，其中所述感测电极矩阵形成于所述触控基板的表面并且所述感测电极矩阵的连接端分散分布在所述感测电极矩阵的至少两条边上;及布设有导电线路的连接板，连接于所述触控传感器，其中所述导电线路与所述感测电极矩阵的连接端电连接。
在其中一个实施例中，所述感测电极矩阵对齐于所述触控基板的边缘。
在其中一个实施例中，所述感测电极矩阵包括复数个导电单元,位于所述触控基板的边缘的导电单元是位于所述触控基板的中部导电单元的面积的一半。
在其中一个实施例中，所述连接板为软性印刷电路板，并且所述软性印刷电路板与所述触控传感器部分层迭连接。
在其中一个实施例中，所述软性印刷电路板及所述触控传感器通过异方性导电胶来连接，使所述软性印刷电路板的导电线路及所述触控传感器的感测电极矩阵通过所述异方性导电胶来电连接。
在其中一个实施例中，还包括形成在所述触控传感器与所述软性印刷电路板交界处的保护胶。
在其中一个实施例中，还包括覆盖于所述触控基板的边缘的保护层。
在其中一个实施例中，还包括通过光学胶来贴合于所述触控传感器及所述软性印刷电路板的保护基板，并且所述触控面板包括可视区及设于所述可视区周围的遮蔽区，所述遮蔽区用来对应遮蔽所述软性印刷电路板。
在其中一个实施例中，还包括设置于所述保护基板的上表面或下表面并且定义出所述遮蔽区的遮蔽层。
在其中一个实施例中，所述连接板为保护基板，并且所述触控面板包括可视区及设于所述可视区周围的遮蔽区，所述导电线路布设于所述遮蔽区。
在其中一个实施例中，还包括设置于所述保护基板的上表面或下表面并且定义出所述遮蔽区的遮蔽层。
在其中一个实施例中，所述保护基板的导电线路采用银胶印刷所制成，用以电连接所述触控传感器的感测电极矩阵。
在其中一个实施例中，所述保护基板的可视区通过光学胶与所述触控传感器连接。
一种触控面板的制作方法，包括如下步骤：制作包含触控基板及感测电极矩阵的触控传感器，其中所述感测电极矩阵形成于所述触控基板的表面并且所述感测电极矩阵的连接端分散分布在所述感测电极矩阵的至少两条边上；及连接布设有导电线路的连接板于所述触控传感器，使所述导电线路与所述感测电极矩阵电连接。
在其中一个实施例中，所述制作包含触控基板及感测电极矩阵的触控传感器的步骤包括：形成透明导电层于母基板的至少一表面；图案化所述透明导电层以形成所述感测电极矩阵的图形；及切割所述母基板以制作成多个所述触控传感器。
在其中一个实施例中，所述感测电极矩阵对齐于所述触控基板的边缘。
在其中一个实施例中，所述感测电极矩阵包括复数个导电单元，位于所述触控基板的边缘的导电单元是位于所述触控基板中部的导电单元的面积的一半。
在其中一个实施例中，所述连接板为软性印刷电路板，并且所述软性印刷电路板与所述触控传感器部分层迭连接。
在其中一个实施例中，所述软性印刷电路板及所述触控传感器通过异方性导电胶连接。
在其中一个实施例中，还包括形成保护胶在触控传感器与软性印刷电路的交界处。
在其中一个实施例中，还包括覆盖保护层于所述触控基板的边缘。
在其中一个实施例中，还包括通过光学胶来贴合保护基板与所述触控传感器及所述软性印刷电路板，其中所述触控面板包括可视区及设于所述可视区周围的遮蔽区，所述遮蔽区用来对应遮蔽所述软性印刷电路板。
在其中一个实施例中，所述连接板为保护基板，并且所述触控面板包括可视区及设于所述可视区周围的遮蔽区，所述导电线路布设于所述遮蔽区。
在其中一个实施例中，所述导电线路采用银胶印刷所制成。
在其中一个实施例中，所述触控面板的可视区通过光学胶与所述触控传感器连接。
藉此，本发明将需要客制化的导电线路转移到连接板上来与分散分布在感测电极矩阵的至少两条边上的连接端连接，让触控基板的边缘区域不再设有导电线路，触控基板仅形成有图案化制程所制作出的感测电极矩阵即可。如此一来，在制作触控传感器的过程中，可以在所有生产在线使用同一模板和制程，并在大量地生产非客制化的触控传感器之后再来与连接板连接，藉以大大提高了生产效能和良率，同时节省了大量的人力、物力和财力。
附图说明
图 1 为 触控面板第一实施例中的触控面板的俯视图；
图 2 为 图 1 中第一实施例中的触控面板覆盖保护基板后的 A-A 向剖视图；
图 3 为 第二实施例中的触控面板的俯视图；
图 4 为 第二实施例中的触控面板的剖视图；
图 5 为 触控面板的制作方法的流程图；
图 6 为 一实施例中触控面板的制作方法进一步包括的具体步骤的流程图；
图 7 为 另一实施例中触控面板的制作方法进一步包括的具体步骤的流程图；
图 8 为 触控传感器的母基板的结构示意图；及
图 9 制作包含触控基板及感测电极矩阵的触控传感器的具体流程图。
具体实施方式
请参阅图1，一种触控面板，包括触控传感器100及与触控传感器100连接的连接板200。
触控传感器100包含触控基板110及感测电极矩阵120，其中感测电极矩阵120形成于触控基板110的表面并且感测电极矩阵120的连接端分散分布在感测电极矩阵120的至少两条边上。感测电极矩阵120的连接端是感测电极矩阵120的终端端子，用于接收驱动信号以驱动感测电极矩阵120或是输出表示感测电极矩阵120的感测结果的电信号，例如图1中标号121所指位置即为其中一个连接端。感测电极矩阵120通常呈矩形分布，将感测电极矩阵120的连接端分散分布在感测电极矩阵120的至少两条边上，从而可以省去传统需要在触控基板110上布设与连接端连接的导电线路的空间。
连接板200布设有导电线路210并与触控传感器100连接，使导电线路210与感测电极矩阵120的连接端电连接。导电线路210包括对外连接的集中的线路接口212，导电线路210通过集中的线路接口212来接收控制器(图未示)产生的驱动信号以驱动感测电极矩阵120并且将感测电极矩阵120感测的触控信号输出到控制器进行触控位置识别。
上述触控面板将需要客制化的导电线路210转移到连接板200上来与分散分布在感测电极矩阵120的至少两条边上的连接端电连接，让触控基板110的边缘区域不再设有导电线路，触控基板110仅形成以图案化制程(如光微影制程、印刷制程)所制作出的感测电极矩阵120即可。如此一来，在制作触控传感器100的过程中，可以在所有生产在线使用同一模板(如光罩)和制程，并在大量地生产非客制化的触控传感器100之后再来与连接板200连接，藉以大大提高了生产效能和良率，同时节省了大量的人力、物力和财力。
如图1所示，具体来说，感测电极矩阵120包括复数个相互平行的第一轴向电极122、复数个相互平行的第二轴向电极124及绝缘隔片126。第一轴向电极122与第二轴向电极124相互垂直且被绝缘隔片126绝缘隔开。第一轴向电极122包括设置于触控基板110表面上的复数个第一导电单元122a及第一导线122b。绝缘隔片126设置于第一导线122b上。第二轴向电极124包括设置于触控基板110表面上的复数个第二导电单元124a及设置于绝缘隔片126上的第二导线124b。制作上述感测电极矩阵120可以使用相同的光罩，不需要针对不同规格的产品对光罩进行设计，即获得的制作有感测电极矩阵120的基板110的规格是统一的。
在图1所示的实施例中，感测电极矩阵120对齐于触控基板110的边缘，例如图1中第一导电单元122a对齐于触控基板110的边缘，此时位于边缘的第一导电单元122a即是感测电极矩阵120的连接端。将感测电极矩阵120对齐于触控基板110的边缘，有利于提高感测电极矩阵120在触控基板110上的利用率。在其他实施例中，也可以将感测电极矩阵120设置在距离触控基板110的边缘一定宽度的位置。
如图1所示，触控基板110的中部的第一导电单元122a和第二导电单元124a（以下合称导电单元）呈菱形，而位于触控基板110的边缘的导电单元则是菱形的导电单元沿对角线分割后留下一半的形状，即触控基板110的边缘的导电单元是触控基板110的中部的导电单元的面积的一半，这一半的形状即作为感测电极矩阵120的连接端。当然，导电单元除了呈菱形的形状外，还可以是矩形或是六边形等。触控基板110的边缘的导电单元是触控基板110的中部的导电单元的面积的一半主要有利于采用切割的方法制得触控传感器100，使得切割分离的两块触控基板110的连接端都有合适的大小以便作为感测电极矩阵120的连接端，切割的方法将在后续进行更详细的说明。
请同时参阅图2，本实施例中，连接板200例如为软性印刷电路板，连接板200与触控传感器100部分层迭连接。连接后连接板200与触控传感器100不在同一平面的部分层迭的连接方式，使得接触面积可灵活调整，连接稳定牢固。本实施例中，连接板200与触控传感器100通过异方性导电胶300来连接，使连接板200的导电线路210及触控传感器100的感测电极矩阵120通过异方性导电胶300来电连接。除了异方性导电胶300外，其他实施例还可以使用焊料焊接的方式将连接板200与触控传感器100电连接。
为了防止触控传感器100表面与连接板200通过异方性导电胶300连接的连接处发生静电释放（ESD，Electro-Static Discharge），触控面板还包括形成在触控传感器100与连接板200交界处的保护胶400，即保护胶400可覆盖于设有感测电极矩阵120的触控基板110的表面与连接板200连接处。用保护胶400覆盖于设有感测电极矩阵120的触控基板110表面与连接板200的连接处，可以避免静电释放现象对电路造成的影响。
另外，为了保护触控基板110边缘外露的导电单元并且防止漏电或静电影响，触控面板还包括覆盖于触控基板110的边缘的保护层500。保护层500可以与保护胶400的成分相同，如树脂，也可以采用框胶或贴防爆膜等方式实现。
为了进一步保护触控基板110上的感测电极矩阵120，上述触控面板还包括通过光学胶600来贴合于触控传感器100及连接板200的保护基板700（例如盖板玻璃）。其中，这种光学胶600可以是水胶、OCA胶（Optical Clear Adhesive，光学透明的一层特种双面胶）等。
再者，触控面板包括可视区V及设于可视区V周围的遮蔽区NV，并且触控面板包括用来定义出所述遮蔽区NV并且设置于保护基板700的上表面或下表面的遮蔽层800。本实施例中，遮蔽层800设置于保护基板700的下表面。遮蔽层800用来对应遮蔽位于所述遮蔽区NV内的连接板200及其他外围组件。其中，遮蔽层800可例如采用油墨、光阻等材料。
上述实施例中，感测电极矩阵120上可以进一步覆盖有钝化层(图未示)，例如硅化物层（silicide layer）等，用来保护感测电极矩阵120，此时保护基板700则是通过光学胶600来贴合在钝化层及连接板200上。
除了上述实施例是以软性印刷电路板为例对连接板200进行了说明之外，请参阅图3及图4，本实施例是直接采用保护基板900（例如盖板玻璃）来实现连接板的功能及作用。换句话说，本实施例的导电线路910是直接布设于保护基板900上。此外，如图3和图4所示，由于触控面板包括可视区V及设于可视区V周围的遮蔽区NV，因此导电线路910是布设于保护基板900的遮蔽区NV，而触控面板另包括用来定义出遮蔽区NV并且设置于保护基板900的下表面的遮蔽层920，因此本实施例的导电线路910是布设于保护基板900的遮蔽层920的下表面。当然，在另一实施例中，遮蔽层920亦可设置于保护基板900的上表面，对此导电线路910则是对应于遮蔽区NV而布设于保护基板900的下表面。
导电线路910位于保护基板900边缘，保护基板900在位于可视区V的部分是通过光学胶600与触控传感器100贴合，而位于遮蔽区NV的导电线路910则是通过异方性导电胶300与触控传感器100的感测电极矩阵120的连接端电连接。藉此，本实施例将保护基板900直接作为连接板的架构更可进一步简化触控面板的结构。
除了上述通过异方性导电胶300来电连接导电线路910与感测电极矩阵120的连接端之外。另一实施例还可以使用表面贴装技术（Surface Mounted Technology）等将保护基板900与触控传感器100电连接。具体来讲，导电线路910可以采用导电银胶制成，在将保护基板900与触控传感器100的触控基板110的贴装过程中，导电银胶制成的导电线路910便可与形成在触控基板110上的感测电极矩阵120的连接端电连接，实现电信号的传递。
上述实施例中，感测电极矩阵120上可以进一步覆盖有钝化层，例如硅化物层（silicide layer）等，用来保护感测电极矩阵120，此时保护基板900在位于可视区V的部分则是通过光学胶600来贴合在钝化层上。
另外，虽然保护基板900贴合在感测电极矩阵120上保护了感测电极矩阵120正面，但是触控基板110边缘仍然外露导电单元，触控面板还可以包括覆盖于触控基板110的边缘的保护层500。保护层500可以采用框胶或贴防爆膜等方式实现。
为了实现不同规格的产品可以使用统一的模板和制程进行生产，需要将触控面板的制作方法进行改良。请参阅图5，为触控面板的制作方法实施例，本实施例是基于图1及图2的触控面板架构来进行说明，其包括步骤S510至S520，具体说明如下：
步骤S510，制作包含触控基板110及感测电极矩阵120的触控传感器100，其中感测电极矩阵120形成于触控基板110的表面并且感测电极矩阵120的连接端分散分布在感测电极矩阵120的至少两条边上。感测电极矩阵120的连接端是感测电极矩阵120的终端端子,用于接收驱动信号以驱动感测电极矩阵120或是输出表示感测电极矩阵120的感测结果的电信号。例如图1中标号121所指位置即为其中一个连接端。感测电极矩阵120通常呈矩形分布，将感测电极矩阵120的连接端分散分布在感测电极矩阵120的至少两条边上，从而可以省去传统需要在触控基板110上布设与连接端连接的导电线路的空间。
步骤S520，连接布设有导电线路210的连接板200于触控传感器100，使导电线路210与感测电极矩阵120电连接。
上述触控面板的制作方法将需要客制化的导电线路210转移到连接板200上来与分散分布在感测电极矩阵120的至少两条边上的连接端连接，让触控基板110的边缘区域不再设有导电线路，触控基板110仅形成有图案化制程所制作出的感测电极矩阵120即可。如此一来，在制作触控传感器100的过程中，可以在所有生产在线使用同一模板和制程，并在大量地生产非客制化的触控传感器100之后再来与连接板200连接，藉以大大提高了生产效能和良率，同时节省了大量的人力、物力和财力。
上述图5实施例中，连接板200是以软性印刷电路板来举例说明，所述软性印刷电路板与触控传感器100是采部分层迭连接。软性印刷电路板及触控传感器100是通过异方性导电胶300来连接，使所述软性印刷电路板的导电线路210及触控传感器100的感测电极矩阵120通过所述异方性导电胶300来电连接。
接下来，在完成软性印刷电路板及触控传感器100的连接之后，请进一步基于图2的触控面板架构来参阅图6。如图6所示，本实施例的触控面板制作方法还包括如下步骤： 步骤S610，形成保护胶400在触控传感器100与软性印刷电路的交界处，即覆盖保护胶400于设有感测电极矩阵120的触控基板110的表面与软性印刷电路板的连接处。为了防止触控传感器100表面与软性印刷电路板通过异方性导电胶300连接的连接处发生静电释放（ESD，Electro-Static Discharge）,用保护胶400覆盖于切割好的设有感测电极矩阵120的触控基板110表面与软性印刷电路板的连接处，可以避免静电释放现象对电路造成的影响。
步骤S620，覆盖保护层500于触控基板110的边缘。为了保护触控基板110边缘外露的导电单元，通过覆盖保护层500于触控基板110的边缘防止漏电或静电影响。保护层500可以与保护胶400的成分相同，也可以采用框胶或贴防爆膜实现。
步骤S630，通过光学胶600来贴合保护基板700与触控传感器100及软性印刷电路板。光学胶600可以是水胶、OCA胶（Optical Clear Adhesive，光学透明的一层特种双面胶）等。为了达到较好的遮蔽效果，上述触控面板还包括设置于保护基板700的上表面或下表面并且形成遮蔽区NV的遮蔽层800，图2的实施例中，遮蔽层800设置于保护基板700的下表面。遮蔽层800用来对应遮蔽位于所述遮蔽区NV内的软性印刷电路板及其他外围组件，避免用户直接看到软性印刷电路板。
在另一实施例中，若如图3及图4所示的触控面板架构，触控面板是采用保护基板900（例如盖板玻璃）来作为连接板时，则图5所示的制作方法的步骤说明如下：步骤S510，制作包含触控基板110及感测电极矩阵120的触控传感器100，其中感测电极矩阵120形成于触控基板110的表面并且感测电极矩阵120的连接端分散分布在感测电极矩阵120的至少两条边上，而触控面板另包括用来定义出遮蔽区NV并且设置于保护基板900的下表面的遮蔽层920。当然，遮蔽层920在不同实施例中，亦可设置于保护基板900的上表面。步骤S520，保护基板900在位于可视区V的部分是通过光学胶600与触控传感器100贴合，而位于遮蔽区NV的导电线路910则是通过异方性导电胶300与触控传感器100的感测电极矩阵120的连接端电连接。
藉此，本实施例将保护基板900直接作为连接板的架构更可进一步简化了触控面板的结构。光学胶可以是水胶、OCA胶（Optical Clear Adhesive，光学透明的一层特种双面胶）等。除了异方性导电胶300外，还可以使用表面贴装技术（Surface Mounted Technology）等将保护基板900的导电线路910与触控基板110电连接，其中保护基板900中的导电线路910可以采用导电银胶制成，在将保护基板900与触控基板110的贴合过程中，导电银胶制成的导电线路910与触控基板110上的感测电极矩阵120电连接，实现后续电信号的传递。
另外，虽然保护基板900黏接在感测电极矩阵120上保护了感测电极矩阵正面，但是触控基板110边缘仍然外露轴向电极，因此在以保护基板为连接板的触控面板的制作方法中还可以包括如图7所示的步骤S710，覆盖保护层500于触控基板110的边缘。通过覆盖保护层500于触控基板110的边缘防止漏电或静电影响。保护层500可以与上述的保护胶400的成分相同,也可以采用框胶或贴防爆膜等方式实现。
前述触控面板的实施例皆是以一个触控传感器来进行说明。然而，为了充分说明本发明的量产制作流程，请进一步参阅图8及图9，用来进一步说明制作触控传感器的流程：
步骤S910，形成透明导电层于母基板110a的至少一表面。此步骤可以与常规触控面板形成透明导电层的方法相同。
步骤S920，图案化所述透明导电层以形成感测电极矩阵120的图形。例如可以通过光微影蚀刻的方法形成感测电极矩阵120的图形。以图8所示感测电极矩阵120为例，感测电极矩阵120包括复数个相互平行的第一轴向电极122、复数个相互平行的第二轴向电极124及绝缘隔片126。第一轴向电极122与第二轴向电极124相互垂直且被绝缘隔片126绝缘隔开。第一轴向电极122包括设置于触控基板110表面上的复数个第一导电单元122a及第一导线122b。第二轴向电极124包括设置于触控基板110表面上的复数个第二导电单元124a及第二导线124b。
补充说明的是，在一实施方式中，在触控基板110上制作感测电极矩阵120的步骤具体包括：在触控基板110上布设第一导线122b；在每一第一导线122b上间隔布设相对应的绝缘隔片126；一次布设同时形成第一导电单元122a、第二导电单元124a和第二导线124b。对于同一轴向电极，第一导电单元122a设置于绝缘隔片126两侧的第一导线122b上而被第一导线122b串接，第二导电单元124a分置于第一导线122b两侧，第二导线124b横跨于绝缘隔片126上并串接第二导电单元124a。此外，在另一实施方式中，可以先一次布设同时形成第一导电单元122a、第二导电单元124a及第一导线122b或第二导线124b。如果同时形成第一导电单元122a、第二导电单元124a与第一导线122b，其中第一导线122b串接第一导电单元122a，则接着在每一第一导线122b上间隔形成相对应的绝缘隔片126，再在绝缘隔片126上形成连接第二导电单元124a的第二导线124b。
步骤S930，切割母基板110a以制作成多个所述触控传感器。例如图8可以切割成触控传感器102和触控传感器104两个触控传感器。切割可以采用机械、化学或者激光等方法。
对母基板110a进行切割的步骤中，由于本实施例是在母基板110a上图案化形成整面的感测电极矩阵120，因此切割后分别属于每一触控传感器102、104的感测电极矩阵120得以对齐于每一触控传感器102、104的触控基板110的边缘，方便后续制程与连接板的导电线路电连接。此外，本实施例中，导电单元呈菱形，在切割的步骤中，切割线可例如触控传感器102所示的是沿菱形的导电单元的对角线切割，如此能最大化母基板110的利用率，理想状态下，整块母基板110都可以得到100%的利用。当然，切割线也可例如触控传感器104所示的是沿感测电极矩阵120任意位置来进行切割。实际切割触控传感器的切割线位置并非为本发明所限制。
藉由本实施例的说明，即可实现大量生产非客制化的触控传感器。如此一来，进一步将制得的触控传感器连接于布设有客制化导电线路的连接板，以获得客制化的触控面板。
容易理解,上述触控面板的制作方法及结构除可用于电容式触控面板外，还可用于其他触控面板,只要是存在数组式的感测电极矩阵，都可以使用上述触控面板的制作方法及结构。
以上所述仅为本发明的较佳实施例而已，并非用以限定本发明的权利要求；凡其它未脱离发明所揭示的精神下所完成的等效改变或修饰，均应包含在权利要求内。

Claims (25)

  1. 一种触控面板，其特征在于，包括：
    触控传感器，包含触控基板及感测电极矩阵，其中所述感测电极矩阵形成于所述触控基板的表面并且所述感测电极矩阵的连接端分散分布在所述感测电极矩阵的至少两条边上；及
    布设有导电线路的连接板，连接于所述触控传感器，其中所述导电线路与所述感测电极矩阵的连接端电连接。
  2. 根据权利要求1所述的触控面板，其特征在于，所述感测电极矩阵对齐于所述触控基板的边缘。
  3. 根据权利要求2所述的触控面板，其特征在于，所述感测电极矩阵包括复数个导电单元，位于所述触控基板的边缘的导电单元是位于所述触控基板中部的导电单元的面积的一半。
  4. 根据权利要求1所述的触控面板，其特征在于，所述连接板为软性印刷电路板，并且所述软性印刷电路板与所述触控传感器部分层迭连接。
  5. 根据权利要求4所述的触控面板，其特征在于，所述软性印刷电路板及所述触控传感器通过异方性导电胶来连接，使所述软性印刷电路板的导电线路及所述触控传感器的感测电极矩阵通过所述异方性导电胶来电连接。
  6. 根据权利要求4所述的触控面板，其特征在于，还包括形成在所述触控传感器与所述软性印刷电路板交界处的保护胶。
  7. 根据权利要求4所述的触控面板，其特征在于，还包括覆盖于所述触控基板的边缘的保护层。
  8. 根据权利要求4所述的触控面板，其特征在于，还包括通过光学胶来贴合于所述触控传感器及所述软性印刷电路板的保护基板，并且所述触控面板包括可视区及设于所述可视区周围的遮蔽区，所述遮蔽区用来对应遮蔽所述软性印刷电路板。
  9. 根据权利要求8所述的触控面板，其特征在于，还包括设置于所述保护基板的上表面或下表面并且定义出所述遮蔽区的遮蔽层。
  10. 根据权利要求1所述的触控面板，其特征在于，所述连接板为保护基板，并且所述触控面板包括可视区及设于所述可视区周围的遮蔽区，所述导电线路布设于所述遮蔽区。
  11. 根据权利要求10所述的触控面板，其特征在于，还包括设置于所述保护基板的上表面或下表面并且定义出所述遮蔽区的遮蔽层。
  12. 根据权利要求10所述的触控面板，其特征在于，所述保护基板的导电线路采用银胶印刷所制成，用以电连接所述触控传感器的感测电极矩阵。
  13. 根据权利要求10所述的触控面板，其特征在于，所述保护基板的可视区通过光学胶与所述触控传感器连接。
  14. 一种触控面板的制作方法，其特征在于，包括如下步骤：
    制作包含触控基板及感测电极矩阵的触控传感器，其中所述感测电极矩阵形成于所述触控基板的表面并且所述感测电极矩阵的连接端分散分布在所述感测电极矩阵的至少两条边上；及
    连接布设有导电线路的连接板于所述触控传感器，使所述导电线路与所述感测电极矩阵电连接。
  15. 根据权利要求14所述的触控面板的制作方法，其特征在于，所述制作包含触控基板及感测电极矩阵的触控传感器的步骤包括：
    形成透明导电层于母基板的至少一表面；
    图案化所述透明导电层以形成所述感测电极矩阵的图形；及
    切割所述母基板以制作成多个所述触控传感器。
  16. 根据权利要求14所述的触控面板的制作方法，其特征在于，所述感测电极矩阵对齐于所述触控基板的边缘。
  17. 根据权利要求16所述的触控面板的制作方法，其特征在于，所述感测电极矩阵包括复数个导电单元，位于所述触控基板的边缘的导电单元是位于所述触控基板中部的导电单元的面积的一半。
  18. 根据权利要求14所述的触控面板的制作方法，其特征在于，所述连接板为软性印刷电路板，并且所述软性印刷电路板与所述触控传感器部分层迭连接。
  19. 根据权利要求18所述的触控面板的制作方法，其特征在于，所述软性印刷电路板及所述触控传感器通过异方性导电胶连接。
  20. 根据权利要求18所述的触控面板的制作方法，其特征在于，还包括形成保护胶在触控传感器与软性印刷电路的交界处。
  21. 根据权利要求18所述的触控面板的制作方法，其特征在于，还包括覆盖保护层于所述触控基板的边缘。
  22. 根据权利要求18所述的触控面板的制作方法，其特征在于，还包括通过光学胶来贴合保护基板与所述触控传感器及所述软性印刷电路板，其中所述触控面板包括可视区及设于所述可视区周围的遮蔽区，所述遮蔽区用来对应遮蔽所述软性印刷电路板。
  23. 根据权利要求14所述的触控面板的制作方法，其特征在于，所述连接板为保护基板，并且所述触控面板包括可视区及设于所述可视区周围的遮蔽区，所述导电线路布设于所述遮蔽区。
  24. 根据权利要求23所述的触控面板的制作方法，其特征在于，所述导电线路采用银胶印刷所制成。
  25. 根据权利要求23所述的触控面板的制作方法，其特征在于，所述触控面板的可视区通过光学胶与所述触控传感器连接。
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