WO2014057626A1 - Dispositif de formation de film - Google Patents

Dispositif de formation de film Download PDF

Info

Publication number
WO2014057626A1
WO2014057626A1 PCT/JP2013/005843 JP2013005843W WO2014057626A1 WO 2014057626 A1 WO2014057626 A1 WO 2014057626A1 JP 2013005843 W JP2013005843 W JP 2013005843W WO 2014057626 A1 WO2014057626 A1 WO 2014057626A1
Authority
WO
WIPO (PCT)
Prior art keywords
vacuum chamber
workpiece
evaporation source
work
film forming
Prior art date
Application number
PCT/JP2013/005843
Other languages
English (en)
Japanese (ja)
Inventor
藤井　博文
隆裕 結城
Original Assignee
株式会社神戸製鋼所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社神戸製鋼所 filed Critical 株式会社神戸製鋼所
Priority to BR112015007816A priority Critical patent/BR112015007816A2/pt
Publication of WO2014057626A1 publication Critical patent/WO2014057626A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases

Definitions

  • the present invention relates to a film forming apparatus that performs PVD processing.
  • a hard film (TiN, TiAlN, CrN, etc.) is formed by a PVD method.
  • film forming apparatuses such as an arc ion plating (AIP) apparatus and a sputtering apparatus.
  • an AIP apparatus tends to be hotter than a sputtering apparatus because of its principle. Therefore, it is necessary to prevent the temperature of various parts of the AIP apparatus from becoming too high. For this reason, in a film forming apparatus that tends to be high in temperature, various devices have been devised in order to suppress a temperature rise during film formation on the surface of a substrate.
  • the arc ion plating apparatus disclosed in Patent Document 1 has a rod-shaped evaporation source provided in a vacuum chamber and a cooling device for cooling the rod-shaped evaporation source.
  • the vacuum chamber includes a lower lid on which the workpiece is mounted and a main body to which an upper end of the rod-shaped evaporation source is fixed.
  • the lower lid is movable in the vertical direction relative to the main body.
  • the work is mounted on a work table mounted on the lower lid, and a shield plate is mounted on the work table together with the work.
  • This shield plate covers the entire outer periphery of a plurality of workpieces mounted on the work table. This shield plate prevents the inner wall of the vacuum chamber from being contaminated by metal ions by capturing metal ions from the evaporation source toward the vacuum chamber in front of the vacuum chamber.
  • the film forming apparatus disclosed in Patent Document 2 has an evaporation source for forming a film on the work and a cooling device for cooling the work in the vacuum chamber.
  • the workpiece has a cylindrical shape and has an internal space extending in the vertical direction communicating with the outside through the opening.
  • the cooling device has a cylindrical refrigerant container for flowing a cooling medium therein. The cooling container is inserted into the internal space from the opening of the work in a state where a gap is left between the work and the refrigerant container. The workpiece is cooled from the inside by the cooling container.
  • Such a film forming apparatus described in Patent Document 2 effectively cools a workpiece having a large volume.
  • Each of the film forming apparatuses described in Patent Documents 1 and 2 described above has a final purpose of efficiently forming a high-quality hard film on the surface of the workpiece.
  • the object to be cooled is different.
  • Patent Document 1 discloses an AIP device provided with a cooling mechanism inside an evaporation source. By this cooling mechanism, the temperature rise of the evaporation source can be suppressed.
  • the AIP device described in Patent Document 1 does not have cooling means other than this cooling mechanism, and the shield plate is configured to surround the entire outer periphery of a plurality of workpieces mounted on the work table. . Therefore, it seems that the surface temperature of the workpiece rises to about 450 ° C to 500 ° C.
  • work becomes high it will become difficult to employ
  • Patent Document 2 discloses a film forming apparatus provided with a cooling device for cooling a workpiece.
  • a cooling device for cooling a workpiece.
  • this cooling device By this cooling device, the temperature rise of the workpiece surface can be suppressed. According to this, it is possible to realize suppression of the surface temperature of the workpiece, which was difficult with the AIP device described in Patent Document 1.
  • this AIP apparatus has a complicated structure in which a cylindrical refrigerant container is arranged in the internal space of the work, and a cooling medium is supplied into the refrigerant container to cool the work from the inside. Such a complicated structure increases the manufacturing cost of the AIP device and makes maintenance difficult.
  • Patent Document 2 various techniques for suppressing an increase in the surface temperature of a workpiece have been developed as in Patent Document 2 and the like.
  • the work (base material) has a simple structure.
  • An object of the present invention is to provide a film forming apparatus that has a simple structure that suppresses an increase in manufacturing cost and that effectively suppresses an increase in temperature of a substrate.
  • the film forming apparatus of the present invention is a film forming apparatus that performs a PVD process on the surface of a workpiece by evaporating an evaporation source, the vacuum chamber, the evaporation source provided in the vacuum chamber, A work table for placing a work and turning the plurality of works around the evaporation source and the work table intermittently disposed between the plurality of works, and turning around the evaporation source together with the work by the work table. And a shielding member for collecting evaporated particles moving toward the vacuum chamber among the evaporated particles evaporated from the evaporation source.
  • FIG. 1 It is a diagram showing a schematic configuration of the vacuum chamber and its interior according to an embodiment of the film forming apparatus of the present invention
  • (a) is a diagram showing the configuration when the interior of the vacuum chamber and the vacuum chamber is viewed from above
  • (B) is a figure which shows a structure when the inside of a vacuum chamber and a vacuum chamber is seen from the side.
  • (a) shows another schematic structure of the vacuum chamber by the modification of the film-forming apparatus of this invention, and its inside
  • (a) shows the structure when the modification of a vacuum chamber and its inside are seen from upper direction.
  • (b) is a figure which shows the structure when the modified example of this vacuum chamber and its inside are seen from the side.
  • PVD processing apparatus film forming apparatus
  • the PVD processing apparatus is an apparatus that forms a hard film (performs a film forming process) on the surface of a workpiece using a PVD (Physical Vapor Deposition) method.
  • a substance (target) formed as a hard film on the surface of a base material (work) is evaporated by arc discharge to generate evaporated particles of the target, or ions are collided with the target.
  • the target is made into particles using a physical method such as flipping particles, and the hardened film is formed by depositing the particles on the surface of the workpiece.
  • the PVD processing apparatus adopting this PVD method includes an AIP (Arc Ion Plating) device that forms a film using an arc ion plating method, a sputtering device that forms a film using a sputtering method, and the like.
  • AIP Arc Ion Plating
  • a sputtering device that forms a film using a sputtering method, and the like.
  • the PVD processing apparatus according to the present embodiment will be described by taking an AIP apparatus as an example.
  • FIG. 1 is a diagram showing a vacuum chamber 1 and an internal configuration of the vacuum chamber 1 of the AIP apparatus according to the present embodiment.
  • FIG. 1A is a diagram showing a configuration when the vacuum chamber 1 and the inside of the vacuum chamber 1 are viewed from above
  • FIG. 1B is a diagram of the vacuum chamber 1 and the vacuum chamber 1. It is a figure which shows a structure when the inside is seen from the side.
  • the vertical direction toward the paper surface in FIG. 1 is defined as the vertical direction of the AIP device and the vacuum chamber 1 in FIG. 1B, and the horizontal direction toward the paper surface in FIG. ) And the left-right direction of the vacuum chamber 1.
  • the AIP apparatus includes a vacuum chamber 1. Further, in the vacuum chamber 1, a work table 2 having a plurality of work placing portions 2 a on which a work (base material) W is placed, and an evaporation source serving as a raw material for a film formed on the surface of the work W 3. Further, the AIP device swirls around the evaporation source 3 together with the workpiece W placed on the workpiece placing portion 2a by the work table 2, and moves toward the vacuum chamber 1 among the evaporated particles evaporated from the evaporation source 3. A shield plate 4 for collecting the evaporated particles is provided. Due to this shield plate 4, evaporated particles that have reached a very high temperature do not adhere to the inner wall of the vacuum chamber 1, and radiant heat from the evaporation source 3 does not reach, so the temperature of the inner wall of the vacuum chamber 1 is kept low. Can do.
  • the vacuum chamber 1 provided in the AIP apparatus is a sealed container having a hexahedral shape such as a cube or a rectangular parallelepiped.
  • the vacuum chamber 1 has a ceiling portion 5A that constitutes the upper wall surface, a bottom portion 5B that constitutes the lower wall surface, and a side wall portion 5C that constitutes four side surfaces. It can be hermetically sealed. These six surfaces constituting the vacuum chamber 1 do not necessarily have to be fixed so as to be integrated.
  • the vacuum chamber 1 may have a configuration in which the ceiling portion 5A moves up and down away from the side wall portion 5C, and may have a configuration in which the side wall portion 5C opens and closes.
  • Such a vacuum chamber 1 has a cylindrical shape in which the bottom 5B and the ceiling 5A are formed in a circular shape, and the side wall 5C has a vertical axis that passes through the bottom 5B and the ceiling 5A in the vertical direction (vertical direction).
  • a cylindrical airtight container formed as described above may be used.
  • An exhaust pipe (not shown) communicating with the inside of the vacuum chamber 1 is connected to the vacuum chamber 1, and a vacuum pump (not shown) is connected to the exhaust pipe.
  • a vacuum pump By operating this vacuum pump, the inside of the vacuum chamber 1, which is a sealed container, is depressurized to be in a low pressure or vacuum state.
  • a gas supply pipe (not shown) communicating with the inside of the vacuum chamber 1 is connected to the vacuum chamber 1, and an inert gas or a reaction gas (process gas) is transferred from the gas supply pipe to the inside of the vacuum chamber 1. Supplied.
  • the evaporation source 3 provided in the vacuum chamber 1 is a film forming material (metal such as Ti, Zr, Cr) that is a raw material of a film (hard film such as TiN, ZrN, CrN) formed on the surface of the work W. Is formed in a rod shape (bar shape).
  • the evaporation source 3 is disposed at a substantially central portion of the vacuum chamber 1 such that the longitudinal direction thereof is along the height direction of the vacuum chamber 1.
  • the evaporation source 3 is provided, for example, so as to be suspended from the ceiling portion 5A of the vacuum chamber 1, and moves up and down in accordance with the elevation of the ceiling portion 5A.
  • the ceiling portion 5A is in the position of FIG. 1B, the lower end of the evaporation source 3 is disposed in a space surrounded by a plurality of workpieces W and not in contact with the work table 2.
  • a work table 2 for holding a work W is disposed in the vacuum chamber 1.
  • the work table 2 is a disk-shaped member, and has a plurality of work placement portions 2a on the upper surface thereof.
  • the workpieces W are respectively placed on the upper surfaces of the plurality of workpiece placement units 2a.
  • the work placement units 2a are arranged so as to be arranged at substantially equal intervals along the turning direction (circumferential direction) of the work table 2.
  • the outer shape of the workpiece mounting portion 2 a matches the outer shape of the workpiece W.
  • the disc-shaped work table 2 is supported at the center portion of the circular lower surface by a rotary support 6 formed of a motor or the like.
  • the work table 2 When film formation is performed on the surface of the work W, the work table 2 is arranged and held at a position substantially parallel to the ceiling 5A and the bottom 5B of the vacuum chamber 1 below the vacuum chamber 1. At this time, the rotation support body 6 supports the work table 2 so that its own rotation axis is substantially coincident with the axis passing through the center of the work table 2. Therefore, when the rotary support 6 rotates around the axis, the work table 2 also rotates around the same axis as the rotary support 6.
  • the workpiece mounting portion 2a on the upper surface of the work table 2 has a cylindrical or columnar workpiece at substantially equal intervals along the turning direction (circumferential direction) of the work table 2.
  • W a base material to be formed
  • the eight workpieces W shown in FIG. 1A are arranged closer to the outer periphery than the center of the work table 2.
  • these works W are erected upward from the work table 2 so that the longitudinal direction of the work W is in the vertical direction.
  • the workpiece placement unit 2a of the workpiece table 2 is arranged at the position of eight workpieces W arranged as shown in FIG. 1A and FIG. (Not shown). That is, a plurality of work holding devices are arranged on the upper surface of the work table 2 so as to be equidistant in the circumferential direction on a concentric circle with the axis of the work table 2.
  • This work holding device is in the shape of a disk in the present embodiment, and is fixed to the center of the lower surface of the disk so that the rotation axis is a longitudinal (vertical) axial center.
  • the upper surface is rotatably supported.
  • the workpiece holding device holds each workpiece W such that its own rotation axis substantially coincides with the axis of the workpiece W.
  • the workpiece holding device itself rotates about the rotation axis, thereby rotating the held cylindrical or columnar workpiece W about the axis of the workpiece W.
  • each of the eight works W is held at a predetermined position on the work table 2 and can be rotated without changing the held position.
  • Rotation shaft of work holding device is rotated by driving means (not shown).
  • This drive means may be constituted by a motor, or may transmit the power of the rotation support 6 of the work table 2 to the rotation shaft of each work holding device via a gear transmission mechanism or the like.
  • each work W held on the work table 2 turns around the rotation center of the work table 2 and rotates at a held position on the work table 2 while turning.
  • rotation rotation
  • the work table 2 has a plurality of works W placed on each work placing part 2a on the upper surface thereof and held by the work holding device, that is, works adjacent to each other.
  • the shield plate 4 is held as a shield member.
  • eight shield plates 4 are arranged between the eight workpieces W held at substantially equal intervals along the turning direction of the work table 2 so as not to contact the workpieces W.
  • the plurality of shield plates 4 are intermittently arranged so as to be aligned along the turning direction.
  • the shield plate 4 is a flat member and is made of the same material as the work table 2 and the vacuum chamber 1 and is made of a metal such as steel or stainless steel, for example.
  • the shield plate 4 is a member that is the same as or slightly longer than the workpiece W placed on the workpiece placement portion 2a along the longitudinal direction of the flat plate shape. In other words, when the shield plate 4 is placed on the upper surface of the work table 2, the workpiece W This is a member having a height equal to or higher than the height.
  • the end of the shield plate 4 on the side opposite to the work table 2 (that is, the upper end 4a in FIG. 1B) is the end of the workpiece W on the side opposite to the work table. (That is, it is arranged at a position farther from the work table 2 than the upper end Wa).
  • the shield plate 4 when the shield plate 4 is viewed from the evaporation source 3 with respect to the workpiece W and the shield plate 4, of the two ends in the longitudinal direction of the shield plate 4, the end on the side not facing the work table 2 ( The upper end 4a) is arranged so as to have a height equal to or higher than the end (upper end Wa) on the side not facing the work table among the two ends in the longitudinal direction of the work W.
  • the shield plate 4 is a member having a length equal to or longer than the length along the longitudinal direction of the workpiece W.
  • An end portion (upper end portion 4 a) in the length direction of the shield plate 4 exists outside the length range along the longitudinal direction of the workpiece W and protrudes from the length range of the workpiece W.
  • the width L1 of the shield plate 4 is the smallest gap among the gaps formed between the adjacent workpieces W, that is, the interval between the adjacent workpieces W. It is larger than L2 (separation distance) and smaller than the distance L3 (axial center distance) between the axial centers of adjacent workpieces W. Specifically, the shield plate 4 has a width L1 that is equal to or greater than the distance L2 between the two workpieces W at the position where the adjacent workpieces W are closest.
  • the shield plate 4 having such a configuration is arranged between the adjacent workpieces W from the axis of the work table 2 (swivel center axis) rather than the axis of the adjacent workpieces W. It is arranged at a distant position. That is, the shield plate 4 is disposed at a position farther from the evaporation source 3 than the position at which the adjacent workpieces W are closest to each other (that is, the position of the interval L2 that is the minimum gap).
  • the eight shield plates 4 are arranged such that the respective width directions are along the turning direction (circumferential direction) of the work table 2.
  • the shield plate 4 has a width L1 equal to or greater than the distance L2 between the two workpieces W at the position where the adjacent workpieces W are closest to each other.
  • FIG. 1B is a view of a state in which the work table 2 holding the work W includes the above-described shield plate 4 as viewed from the side, that is, from the side of the side wall portion 5C of the vacuum chamber 1.
  • the shield plate 4 since the gap between adjacent workpieces W is blocked by the shield plate 4, the central portion of the work table 2 surrounded by the eight workpieces W from the side wall portion 5C side. Can't see.
  • the periphery is surrounded by the work W or the shield plate 4, and the outside of the work table 2 (specifically, the side wall portion 5C). ) Cannot be seen.
  • the width L1 of the shield plate 4 is determined so that the center portion of the work table 2 surrounded by the eight works W cannot be seen from the side of the side wall 5C.
  • the film forming process is performed as an AIP apparatus, if the work table 2 holding the workpiece W and the shield plate 4 is held in the vacuum chamber 1, the center of the work table 2 is formed.
  • the above-described evaporation source 3 is arranged. Since the inner wall (specifically, the side wall portion 5C) of the vacuum chamber 1 outside the work table 2 cannot be seen from the evaporation source 3 arranged at the center portion of the work table 2, the work from the evaporation source 3 to the work The evaporated particles moving in the outer peripheral direction of the table 2 adhere to the workpiece W or the shield plate 4 and cannot reach the inner wall of the vacuum chamber 1.
  • the shape of the shield plate 4 is not limited to a flat plate shape.
  • the flat shield plate 4 may be bent or bent in the width direction.
  • the AIP device having the above-described configuration further includes an arc power source and a bias power source (both not shown).
  • an arc power source By connecting the cathode of the arc power source to the evaporation source 3, the evaporation source 3 functions as a target (cathode).
  • the anode of the arc power supply is connected to the vacuum chamber 1.
  • the work W is connected to the cathode of the bias power source.
  • the arc power supply has an auxiliary anode (not shown) for spark discharge. An arc is generated between the auxiliary anode and the target.
  • the film forming material of the evaporation source 3 evaporated by the arc discharge is deposited on the surface of the work W, and a hard film is formed.
  • the side wall 5C of the vacuum chamber 1 is opened, the work table 2 is drawn out from the vacuum chamber 1, and the work W is placed on each of the work holding devices of the drawn out work table 2.
  • a shield plate 4 is placed between adjacent workpieces W.
  • the work table 2 on which the work W and the shield plate 4 are placed is returned to the vacuum chamber 1.
  • the work table 2 is arranged and held so that the axis of the rotary support 6 of the work table 2 is located at a substantially central portion when the vacuum chamber 1 is viewed from the ceiling 5A.
  • the side wall portion 5C of the vacuum chamber 1 is closed, and the ceiling portion 5A from which the evaporation source 3 is suspended is lowered to seal the vacuum chamber 1.
  • the internal space of the vacuum chamber 1 is decompressed. Thereafter, the film forming process is started.
  • the evaporation source 3 disposed in the central portion of the vacuum chamber 1 is held at a substantially central position on the upper surface of the work table 2, so that the plurality of workpieces W and the evaporation source 3 are surrounded.
  • a plurality of shield plates 4 are arranged.
  • Each work W is rotated by the work holding device while revolving around the evaporation source 3 by the rotation of the work table 2. That is, the workpiece W faces the entire circumference of the evaporation source 3 by revolution, and the entire circumference of the side surface of the workpiece W faces the evaporation source 3 by rotation.
  • revolution and rotation the evaporated particles that move radially from the entire circumference of the evaporation source 3 along the radial direction of the work table 2 are uniformly attached and deposited on the entire surface of the work W.
  • the evaporated particles that move radially from the entire circumference of the evaporation source 3 are separated by the shield plate 4 disposed between the adjacent workpieces W. It is collected.
  • the use of the shield plate 4 can prevent the evaporated particles from the evaporation source 3 from adhering to the inner wall of the vacuum chamber 1.
  • the use of such a shield plate 4 produces the following effects.
  • the temperature of the inner wall of the vacuum chamber 1 can be kept low because the evaporated particles that have reached a very high temperature do not adhere to the inner wall of the vacuum chamber 1 and the radiant heat from the evaporation source 3 does not reach. it can.
  • the surface of the entire circumference of the workpiece W facing the inner wall of the vacuum chamber 1 is removed, so that the temperature of the workpiece W can be kept low. That is, the high-temperature portion caused by the evaporated particles can be limited to only the portion surrounded by the workpiece W and the shield plate 4, and the temperature of the other portion, that is, the portion outside the work table 2 can be kept low. Can do.
  • the temperature of the workpiece W can be kept low without providing a cooling device or the like in the AIP device according to the present embodiment, there is no obstacle such as a cooling pipe required when the cooling device is provided. Thereby, the work W can be easily placed on the work table 2.
  • the shield plate 4 may be held on the upper surface of the work table 2, but the shield plate 4 may be suspended from above the work table 2.
  • a column is erected on the work table 2, and a frame for hanging the shield plate 4 is attached to the column.
  • a stand for suspending the shield plate 4 from above the work table 2 can be configured by such a column and a frame.
  • the temperature rise of the workpiece W can be effectively suppressed with a simple structure that suppresses an increase in manufacturing cost, and the maintenance of the inner wall of the vacuum chamber 1 is easy. It becomes. Further, since the size of the shield plate 4 is smaller than that of the conventional shield that covers the inside of the vacuum chamber 1 widely, maintenance is also facilitated in this respect.
  • the temperature rise of the workpiece W is further effectively suppressed by improving the configuration of the vacuum chamber 1. Therefore, a modification of the vacuum chamber 1 that can more effectively suppress the temperature rise of the workpiece W will be described below.
  • FIG. 2 is a view showing a modified example of the vacuum chamber 1 of the AIP device according to the present embodiment and a configuration inside the vacuum chamber 1.
  • FIG. 2A is a diagram illustrating a modification of the vacuum chamber 1 and a configuration when the inside is viewed from above
  • FIG. 2B is a modification of the vacuum chamber 1 and It is a figure which shows a structure when the inside is seen from the side.
  • a vacuum chamber 1 which is a modification of the vacuum chamber 1 has a cooling channel (cooling) for cooling the vacuum chamber 1 outside the side wall portion 5C.
  • the cooling pipe 7 constituting the cooling channel is made of the same material as the vacuum chamber 1 and is made of a metal such as steel or stainless steel, for example.
  • the cooling pipe 7 has a prismatic shape with a hollow inside.
  • a plurality of cooling pipes 7 are provided outside the side wall 5C of the vacuum chamber 1 along the height direction of the vacuum chamber 1, that is, at substantially equal intervals.
  • the plurality of cooling pipes 7 are provided on the outer surface side of the side wall part 5C so as to be spanned between the ceiling part 5A and the bottom part 5B of the vacuum chamber 1, and each cooling pipe 7 is in contact with the side wall part 5C.
  • the plurality of cooling pipes 7 are connected to one of the adjacent cooling pipes 7 and one of the upper end on the ceiling 5A side and the lower end on the bottom 5B side, and the other cooling pipe 7 is connected to the upper end And the remaining end of the lower end.
  • the plurality of cooling pipes 7 form a cooling channel that zigzags continuously while meandering on the side wall portion 5C.
  • the number of the cooling pipes 7 used for constituting one cooling channel is arbitrary and may be selected in accordance with a desired cooling performance.
  • FIG. 2B shows a state in which the refrigerant is supplied from below to the cooling channel provided in the left side wall portion 5C and discharged from the lower side of the cooling channel provided in the right side wall portion 5C.
  • the refrigerant water is generally used, but it is not limited to a liquid such as water, and a gas (gas) having a low boiling point may be used.
  • the inner wall of the vacuum chamber 1 can be kept at a lower temperature.
  • the surface of the entire circumference of the workpiece W toward the inner wall of the vacuum chamber 1 is more effectively removed, so that the temperature of the workpiece W can be kept lower.
  • the side wall portion 5C may be constituted by two opposing wall plates, and a cooling channel may be interposed between the two wall plates. If the cooling channel is sandwiched between two wall plates, a configuration having a cooling channel inside the side wall portion 5C (a configuration having a so-called cooling jacket) is obtained. Therefore, the transfer of heat from the inner side wall plate of the vacuum chamber 1 to the outer side wall plate can be largely blocked. As a result, even if the operator (operator) touches the outside of the side wall 5C of the vacuum chamber 1, there is no possibility of burns or the like.
  • the present invention is not limited to the above-described embodiment, and the shape, structure, material, combination, and the like of each member can be appropriately changed without departing from the essence of the invention. Further, in the embodiment disclosed this time, matters that are not explicitly disclosed, for example, operating conditions and operating conditions, various parameters, dimensions, weights, volumes, and the like of a component deviate from a range that a person skilled in the art normally performs. However, matters that can be easily assumed by those skilled in the art are employed.
  • the shield plate 4 only needs to be arranged at a position where the inner wall of the vacuum chamber 1 outside the work table 2 cannot be seen from the evaporation source 3. It is possible to arrange other than the described positions.
  • the shield plate 4 is disposed at a position farther from the evaporation source 3 than the position at which the adjacent workpieces W are closest.
  • the shield plate 4 can also be arranged at a position closer to the evaporation source 3 than the position at which the adjacent workpieces W are closest to each other along the turning direction.
  • the film forming apparatus can have a configuration advantageous for cooling the workpiece W.
  • the shield plate 4 and the workpiece W are compared with each other as a reference, and the shield plate 4 has a height equal to or higher than the height of the workpiece W when placed on the work table 2. It is described that.
  • the shield plate 4 and the workpiece W can be compared based on the length, instead of using the height as described in the above embodiment. In that case, it can be said that the shield plate 4 is a member having a length equal to or longer than the length of the workpiece W when placed on the workpiece table 2.
  • the shield plate 4 has been described as an example of the shield member.
  • the present invention is not limited to such a plate-shaped shield.
  • work table 2 and can collect the evaporation particles which evaporated from the evaporation source between the workpiece
  • a thing can be adopted as a shield member. For example, it is possible to employ a prismatic or cylindrical shield member.
  • the film forming apparatus of the present embodiment is a film forming apparatus that performs PVD processing on the surface of a work by evaporating an evaporation source, and includes a vacuum chamber, the evaporation source provided in the vacuum chamber, and a plurality of evaporation sources A work table having a plurality of work placement parts on which each of the works is placed, and turning the plurality of works around the evaporation source in a state of being placed on the work placement part; Evaporated particles arranged between the plurality of workpieces placed on the placement unit, thereby intermittently arranged with each other, swirling around the evaporation source together with the workpieces by the work table, and evaporated from the evaporation source And a plurality of shield members for collecting evaporated particles moving toward the vacuum chamber.
  • the film forming apparatus of the present embodiment with the above configuration, it is possible to effectively suppress the temperature rise of the substrate with a simple structure that suppresses an increase in manufacturing cost.
  • the plurality of work placement parts are arranged so as to be aligned along the turning direction of the work table, and the shield members are formed of adjacent works among works placed on the work placement part.
  • the plurality of shield members are arranged so as to be arranged along the turning direction.
  • the shield member is a work placed on the work placing portion, and is closer to the evaporation source than the position of the smallest gap among the gaps formed between the works adjacent to each other. It is preferable that they are arranged at separate positions.
  • the shield member has a width larger than the minimum gap among the gaps between the adjacent workpieces.
  • the shield member is a member having a length equal to or longer than the length of the workpiece placed on the workpiece placement portion, and an end portion of the shield member in the length direction. However, it is preferable to be provided outside the length range along the longitudinal direction of the workpiece.
  • the vacuum chamber has a water cooling channel for cooling a chamber wall of the vacuum chamber.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention fournit un dispositif de formation de film permettant d'inhiber efficacement l'élévation de température d'un matériau de base à l'aide d'une structure simple dont l'augmentation du coût de production est inhibée. Le dispositif de formation de film exécute un traitement de dépôt physique en phase vapeur à la surface de pièces (W) par évaporation d'une source d'évaporation (3). Ce dispositif de formation de film est équipé : d'une chambre à vide (1) ; de la source d'évaporation (3) agencée à l'intérieur de la chambre à vide (1) ; et d'une table porte-pièces (2) qui possède une pluralité de parties installation de pièce (2a) sur lesquelles chacune des pièces (W) sont installées, et sur laquelle la pluralité de pièces (W) tournent autour de la source d'évaporation (3). Ce dispositif de formation de film est en outre équipé d'une pluralité de plaques de blindage (4). Ces plaques de blindage (4) sont disposées entre ladite pluralité de pièces et donc de manière intermittente les unes par rapports aux autres, tournent autour de la source d'évaporation (3) avec les pièces (W) à l'aide de la table porte-pièces (2), et collectent des particules d'évaporation qui se déplacent vers la chambre à vide (1) parmi celles s'évaporant de la source d'évaporation (3).
PCT/JP2013/005843 2012-10-11 2013-10-01 Dispositif de formation de film WO2014057626A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
BR112015007816A BR112015007816A2 (pt) 2012-10-11 2013-10-01 dispositivo de formação de filme

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-226268 2012-10-11
JP2012226268A JP5847054B2 (ja) 2012-10-11 2012-10-11 成膜装置

Publications (1)

Publication Number Publication Date
WO2014057626A1 true WO2014057626A1 (fr) 2014-04-17

Family

ID=50477110

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/005843 WO2014057626A1 (fr) 2012-10-11 2013-10-01 Dispositif de formation de film

Country Status (3)

Country Link
JP (1) JP5847054B2 (fr)
BR (1) BR112015007816A2 (fr)
WO (1) WO2014057626A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170016392A (ko) 2014-05-30 2017-02-13 다우 코닝 도레이 캄파니 리미티드 유기 규소 화합물, 경화성 실리콘 조성물, 및 반도체 장치
CN104651783B (zh) * 2015-02-12 2017-09-01 烟台首钢磁性材料股份有限公司 一种永磁钕铁硼磁钢表面镀铝的方法
CN104674169A (zh) * 2015-02-12 2015-06-03 烟台首钢磁性材料股份有限公司 一种永磁钕铁硼磁钢表面电镀复合镀层的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0625846A (ja) * 1992-07-09 1994-02-01 Nachi Fujikoshi Corp 複合スパッタリング装置
JPH10265946A (ja) * 1997-03-27 1998-10-06 Toyo Metallizing Co Ltd 蒸着装置およびこれを用いた薄膜の製造方法
JPH1143767A (ja) * 1997-07-23 1999-02-16 Nippon Shinku Kogaku Kk 高周波イオン衝撃装置
JP2005029848A (ja) * 2003-07-07 2005-02-03 Kobe Steel Ltd 真空蒸着装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0625846A (ja) * 1992-07-09 1994-02-01 Nachi Fujikoshi Corp 複合スパッタリング装置
JPH10265946A (ja) * 1997-03-27 1998-10-06 Toyo Metallizing Co Ltd 蒸着装置およびこれを用いた薄膜の製造方法
JPH1143767A (ja) * 1997-07-23 1999-02-16 Nippon Shinku Kogaku Kk 高周波イオン衝撃装置
JP2005029848A (ja) * 2003-07-07 2005-02-03 Kobe Steel Ltd 真空蒸着装置

Also Published As

Publication number Publication date
JP5847054B2 (ja) 2016-01-20
BR112015007816A2 (pt) 2017-07-04
JP2014077177A (ja) 2014-05-01

Similar Documents

Publication Publication Date Title
JP5632072B2 (ja) 成膜装置
WO2014057626A1 (fr) Dispositif de formation de film
IL267523A (en) Spray purpose with rear cooling slots
WO2016052239A1 (fr) Système de dépôt de film
JP6275755B2 (ja) 物理的気相堆積用のチャンバ
JP2017133111A (ja) 物理気相堆積チャンバターゲット用の冷却リング
WO2014076947A1 (fr) Dispositif de dépôt
JP2014525516A5 (fr)
TWI500795B (zh) Film forming device
TWI410512B (zh) 鍍膜裝置
KR20040034432A (ko) 성막 시스템 및 이를 이용한 성막 방법
US20130239894A1 (en) Chemical vapor deposition apparatus
JP2017503080A (ja) 大気圧未満の圧力でロータとコレクタとの間に電気的接続を有する回転可能なターゲットのエンドブロック
RU2693229C1 (ru) Установка для нанесения ионно-плазменных покрытий на лопатки блиска
RU2595187C1 (ru) Установка для нанесения покрытий на поверхности деталей
JP2009108384A (ja) 成膜装置
JP2017515000A5 (ja) 回転カソード用のシールド装置、回転カソード、及び堆積機器中の暗部のシールド方法
JP4413567B2 (ja) 成膜装置及び成膜方法
US10907246B2 (en) Film-forming apparatus, method for producing film-formed product using same, and cooling panel
JP2021134405A (ja) 真空蒸着装置
JP4561814B2 (ja) ミリング装置
EP3088561B1 (fr) Four à vide hybride
JP2016113675A (ja) 真空処理方法および真空処理装置
JPS621228Y2 (fr)
US20110266147A1 (en) Sputtering device with rotatable targets

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13845656

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

REG Reference to national code

Ref country code: BR

Ref legal event code: B01A

Ref document number: 112015007816

Country of ref document: BR

122 Ep: pct application non-entry in european phase

Ref document number: 13845656

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 112015007816

Country of ref document: BR

Kind code of ref document: A2

Effective date: 20150408