WO2014057626A1

WO2014057626A1 - Film-forming device

Info

Publication number: WO2014057626A1
Application number: PCT/JP2013/005843
Authority: WO
Inventors: 藤井　博文; 隆裕結城
Original assignee: 株式会社神戸製鋼所
Priority date: 2012-10-11
Filing date: 2013-10-01
Publication date: 2014-04-17
Also published as: JP5847054B2; BR112015007816A2; JP2014077177A

Abstract

[Problem] To provide a film-forming device that can reduce substrate-temperature increases effectively with a simple structure that minimizes increases in manufacturing cost. [Solution] This film-forming device, which performs PVD on the surfaces of workpieces (W) by evaporating an evaporation source (3), is provided with the following: a vacuum chamber (1); an evaporation source (3) provided inside said vacuum chamber (1); and a workpiece table (2) that has a plurality of workpiece-placement parts (2a) on which a plurality of workpieces (W) are placed, respectively, and that rotates said workpieces (W) around the evaporation source (3). This film-forming device is further provided with a plurality of shield plates (4) that are laid out between the workpieces so as to be separated from each other by said workpieces. The workpiece table (2) rotates said shield plates (4), together with the workpieces (W), around the evaporation source (3). The shield plates (4) capture the evaporated particles that, having evaporated from the evaporation source (3), move towards the vacuum chamber (1).

Description

Deposition equipment

The present invention relates to a film forming apparatus that performs PVD processing.

For the purpose of improving the wear resistance of cutting tools and improving the sliding characteristics of the sliding surfaces of machine parts, physical vapor deposition (deposition target) on the base material (film formation target) that will be the cutting tool and machine parts ( A hard film (TiN, TiAlN, CrN, etc.) is formed by a PVD method. As an apparatus used for forming such a hard film, there are film forming apparatuses such as an arc ion plating (AIP) apparatus and a sputtering apparatus.

Generally, an AIP apparatus tends to be hotter than a sputtering apparatus because of its principle. Therefore, it is necessary to prevent the temperature of various parts of the AIP apparatus from becoming too high. For this reason, in a film forming apparatus that tends to be high in temperature, various devices have been devised in order to suppress a temperature rise during film formation on the surface of a substrate.

For example, the arc ion plating apparatus disclosed in Patent Document 1 has a rod-shaped evaporation source provided in a vacuum chamber and a cooling device for cooling the rod-shaped evaporation source. The vacuum chamber includes a lower lid on which the workpiece is mounted and a main body to which an upper end of the rod-shaped evaporation source is fixed. The lower lid is movable in the vertical direction relative to the main body. Further, in the arc ion plating apparatus, the work is mounted on a work table mounted on the lower lid, and a shield plate is mounted on the work table together with the work.

This shield plate covers the entire outer periphery of a plurality of workpieces mounted on the work table. This shield plate prevents the inner wall of the vacuum chamber from being contaminated by metal ions by capturing metal ions from the evaporation source toward the vacuum chamber in front of the vacuum chamber.

Further, the film forming apparatus disclosed in Patent Document 2 has an evaporation source for forming a film on the work and a cooling device for cooling the work in the vacuum chamber. The workpiece has a cylindrical shape and has an internal space extending in the vertical direction communicating with the outside through the opening. The cooling device has a cylindrical refrigerant container for flowing a cooling medium therein. The cooling container is inserted into the internal space from the opening of the work in a state where a gap is left between the work and the refrigerant container. The workpiece is cooled from the inside by the cooling container. Such a film forming apparatus described in Patent Document 2 effectively cools a workpiece having a large volume.

Each of the film forming apparatuses described in

Patent Documents

1 and 2 described above has a final purpose of efficiently forming a high-quality hard film on the surface of the workpiece. However, in the film forming apparatus described in each patent document, the object to be cooled is different.

Patent Document 1 discloses an AIP device provided with a cooling mechanism inside an evaporation source. By this cooling mechanism, the temperature rise of the evaporation source can be suppressed. However, the AIP device described in Patent Document 1 does not have cooling means other than this cooling mechanism, and the shield plate is configured to surround the entire outer periphery of a plurality of workpieces mounted on the work table. . Therefore, it seems that the surface temperature of the workpiece rises to about 450 ° C to 500 ° C. Thus, when the surface temperature of a workpiece | work becomes high, it will become difficult to employ | adopt as a workpiece | work the low-grade steel which has the property which becomes dull and comparatively low at low temperature. Therefore, it is difficult to reduce the manufacturing cost of the product after film formation.

On the other hand, Patent Document 2 discloses a film forming apparatus provided with a cooling device for cooling a workpiece. By this cooling device, the temperature rise of the workpiece surface can be suppressed. According to this, it is possible to realize suppression of the surface temperature of the workpiece, which was difficult with the AIP device described in Patent Document 1. However, this AIP apparatus has a complicated structure in which a cylindrical refrigerant container is arranged in the internal space of the work, and a cooling medium is supplied into the refrigerant container to cool the work from the inside. Such a complicated structure increases the manufacturing cost of the AIP device and makes maintenance difficult.

As described above, various techniques for suppressing an increase in the surface temperature of a workpiece have been developed as in Patent Document 2 and the like. However, in consideration of the manufacturing cost and difficulty of maintenance of the film forming apparatus when introducing a complicated cooling structure that allows the cooling medium to pass through the film forming apparatus with many movable parts, the work (base material) has a simple structure. There is a demand for a technique that can suppress the increase in the surface temperature of the glass.

Japanese Patent No. 3195492 Japanese Patent No. 4413567

An object of the present invention is to provide a film forming apparatus that has a simple structure that suppresses an increase in manufacturing cost and that effectively suppresses an increase in temperature of a substrate.

The film forming apparatus of the present invention is a film forming apparatus that performs a PVD process on the surface of a workpiece by evaporating an evaporation source, the vacuum chamber, the evaporation source provided in the vacuum chamber, A work table for placing a work and turning the plurality of works around the evaporation source and the work table intermittently disposed between the plurality of works, and turning around the evaporation source together with the work by the work table. And a shielding member for collecting evaporated particles moving toward the vacuum chamber among the evaporated particles evaporated from the evaporation source.

It is a diagram showing a schematic configuration of the vacuum chamber and its interior according to an embodiment of the film forming apparatus of the present invention, (a) is a diagram showing the configuration when the interior of the vacuum chamber and the vacuum chamber is viewed from above, (B) is a figure which shows a structure when the inside of a vacuum chamber and a vacuum chamber is seen from the side. It is a figure which shows another schematic structure of the vacuum chamber by the modification of the film-forming apparatus of this invention, and its inside, (a) shows the structure when the modification of a vacuum chamber and its inside are seen from upper direction. It is a figure, (b) is a figure which shows the structure when the modified example of this vacuum chamber and its inside are seen from the side.

Next, a PVD processing apparatus (film forming apparatus) according to an embodiment of the present invention will be described with reference to the drawings.

The PVD processing apparatus according to the present embodiment is an apparatus that forms a hard film (performs a film forming process) on the surface of a workpiece using a PVD (Physical Vapor Deposition) method. In the PVD method, a substance (target) formed as a hard film on the surface of a base material (work) is evaporated by arc discharge to generate evaporated particles of the target, or ions are collided with the target. In this method, the target is made into particles using a physical method such as flipping particles, and the hardened film is formed by depositing the particles on the surface of the workpiece.

The PVD processing apparatus adopting this PVD method includes an AIP (Arc Ion Plating) device that forms a film using an arc ion plating method, a sputtering device that forms a film using a sputtering method, and the like. In the following description, the PVD processing apparatus according to the present embodiment will be described by taking an AIP apparatus as an example.

FIG. 1 is a diagram showing a vacuum chamber 1 and an internal configuration of the vacuum chamber 1 of the AIP apparatus according to the present embodiment. Specifically, FIG. 1A is a diagram showing a configuration when the vacuum chamber 1 and the inside of the vacuum chamber 1 are viewed from above, and FIG. 1B is a diagram of the vacuum chamber 1 and the vacuum chamber 1. It is a figure which shows a structure when the inside is seen from the side.

In the following description, the vertical direction toward the paper surface in FIG. 1 is defined as the vertical direction of the AIP device and the vacuum chamber 1 in FIG. 1B, and the horizontal direction toward the paper surface in FIG. ) And the left-right direction of the vacuum chamber 1.

As shown in FIG. 1, the AIP apparatus according to the present embodiment includes a vacuum chamber 1. Further, in the vacuum chamber 1, a work table 2 having a plurality of work placing portions 2 a on which a work (base material) W is placed, and an evaporation source serving as a raw material for a film formed on the surface of the work W 3. Further, the AIP device swirls around the evaporation source 3 together with the workpiece W placed on the workpiece placing portion 2a by the work table 2, and moves toward the vacuum chamber 1 among the evaporated particles evaporated from the evaporation source 3. A shield plate 4 for collecting the evaporated particles is provided. Due to this shield plate 4, evaporated particles that have reached a very high temperature do not adhere to the inner wall of the vacuum chamber 1, and radiant heat from the evaporation source 3 does not reach, so the temperature of the inner wall of the vacuum chamber 1 is kept low. Can do.

Hereinafter, the configuration of the AIP device according to the present embodiment will be described in detail.

The vacuum chamber 1 provided in the AIP apparatus is a sealed container having a hexahedral shape such as a cube or a rectangular parallelepiped. Specifically, the vacuum chamber 1 has a ceiling portion 5A that constitutes the upper wall surface, a bottom portion 5B that constitutes the lower wall surface, and a side wall portion 5C that constitutes four side surfaces. It can be hermetically sealed. These six surfaces constituting the vacuum chamber 1 do not necessarily have to be fixed so as to be integrated. For example, the vacuum chamber 1 may have a configuration in which the ceiling portion 5A moves up and down away from the side wall portion 5C, and may have a configuration in which the side wall portion 5C opens and closes.

Such a vacuum chamber 1 has a cylindrical shape in which the bottom 5B and the ceiling 5A are formed in a circular shape, and the side wall 5C has a vertical axis that passes through the bottom 5B and the ceiling 5A in the vertical direction (vertical direction). A cylindrical airtight container formed as described above may be used.

An exhaust pipe (not shown) communicating with the inside of the vacuum chamber 1 is connected to the vacuum chamber 1, and a vacuum pump (not shown) is connected to the exhaust pipe. By operating this vacuum pump, the inside of the vacuum chamber 1, which is a sealed container, is depressurized to be in a low pressure or vacuum state. Further, a gas supply pipe (not shown) communicating with the inside of the vacuum chamber 1 is connected to the vacuum chamber 1, and an inert gas or a reaction gas (process gas) is transferred from the gas supply pipe to the inside of the vacuum chamber 1. Supplied.

The evaporation source 3 provided in the vacuum chamber 1 is a film forming material (metal such as Ti, Zr, Cr) that is a raw material of a film (hard film such as TiN, ZrN, CrN) formed on the surface of the work W. Is formed in a rod shape (bar shape). When film formation is performed on the surface of the workpiece W, the evaporation source 3 is disposed at a substantially central portion of the vacuum chamber 1 such that the longitudinal direction thereof is along the height direction of the vacuum chamber 1.

The evaporation source 3 is provided, for example, so as to be suspended from the ceiling portion 5A of the vacuum chamber 1, and moves up and down in accordance with the elevation of the ceiling portion 5A. When the ceiling portion 5A is in the position of FIG. 1B, the lower end of the evaporation source 3 is disposed in a space surrounded by a plurality of workpieces W and not in contact with the work table 2.

As shown in FIG. 1, a work table 2 for holding a work W is disposed in the vacuum chamber 1. The work table 2 is a disk-shaped member, and has a plurality of work placement portions 2a on the upper surface thereof. The workpieces W are respectively placed on the upper surfaces of the plurality of workpiece placement units 2a. The work placement units 2a are arranged so as to be arranged at substantially equal intervals along the turning direction (circumferential direction) of the work table 2. As shown in FIGS. 1A and 1B, the outer shape of the workpiece mounting portion 2 a matches the outer shape of the workpiece W. The disc-shaped work table 2 is supported at the center portion of the circular lower surface by a rotary support 6 formed of a motor or the like. When film formation is performed on the surface of the work W, the work table 2 is arranged and held at a position substantially parallel to the ceiling 5A and the bottom 5B of the vacuum chamber 1 below the vacuum chamber 1. At this time, the rotation support body 6 supports the work table 2 so that its own rotation axis is substantially coincident with the axis passing through the center of the work table 2. Therefore, when the rotary support 6 rotates around the axis, the work table 2 also rotates around the same axis as the rotary support 6.

As shown in FIG. 1 (a), the workpiece mounting portion 2a on the upper surface of the work table 2 has a cylindrical or columnar workpiece at substantially equal intervals along the turning direction (circumferential direction) of the work table 2. W (a base material to be formed) can be disposed. The eight workpieces W shown in FIG. 1A are arranged closer to the outer periphery than the center of the work table 2. In addition, as shown in FIG. 1B, these works W are erected upward from the work table 2 so that the longitudinal direction of the work W is in the vertical direction.

The workpiece placement unit 2a of the workpiece table 2 is arranged at the position of eight workpieces W arranged as shown in FIG. 1A and FIG. (Not shown). That is, a plurality of work holding devices are arranged on the upper surface of the work table 2 so as to be equidistant in the circumferential direction on a concentric circle with the axis of the work table 2. This work holding device is in the shape of a disk in the present embodiment, and is fixed to the center of the lower surface of the disk so that the rotation axis is a longitudinal (vertical) axial center. The upper surface is rotatably supported. The workpiece holding device holds each workpiece W such that its own rotation axis substantially coincides with the axis of the workpiece W.

The workpiece holding device itself rotates about the rotation axis, thereby rotating the held cylindrical or columnar workpiece W about the axis of the workpiece W. By the work holding unit, each of the eight works W is held at a predetermined position on the work table 2 and can be rotated without changing the held position.

Rotation shaft of work holding device is rotated by driving means (not shown). This drive means may be constituted by a motor, or may transmit the power of the rotation support 6 of the work table 2 to the rotation shaft of each work holding device via a gear transmission mechanism or the like.

With such a structure of the work table 2, each work W held on the work table 2 turns around the rotation center of the work table 2 and rotates at a held position on the work table 2 while turning. To do. Referring to FIG. 1A, for each workpiece W, turning around the rotation center of the work table 2 can be referred to as revolution with respect to the rotation center, and rotation at a held position on the work table 2 is defined as rotation. I can say that.

As shown in FIG. 1 (a), the work table 2 has a plurality of works W placed on each work placing part 2a on the upper surface thereof and held by the work holding device, that is, works adjacent to each other. Between W, the shield plate 4 is held as a shield member. Specifically, eight shield plates 4 are arranged between the eight workpieces W held at substantially equal intervals along the turning direction of the work table 2 so as not to contact the workpieces W. Thereby, the plurality of shield plates 4 are intermittently arranged so as to be aligned along the turning direction.

The shield plate 4 is a flat member and is made of the same material as the work table 2 and the vacuum chamber 1 and is made of a metal such as steel or stainless steel, for example. The shield plate 4 is a member that is the same as or slightly longer than the workpiece W placed on the workpiece placement portion 2a along the longitudinal direction of the flat plate shape. In other words, when the shield plate 4 is placed on the upper surface of the work table 2, the workpiece W This is a member having a height equal to or higher than the height.

Thereby, the end of the shield plate 4 on the side opposite to the work table 2 (that is, the upper end 4a in FIG. 1B) is the end of the workpiece W on the side opposite to the work table. (That is, it is arranged at a position farther from the work table 2 than the upper end Wa).

In other words, when the shield plate 4 is viewed from the evaporation source 3 with respect to the workpiece W and the shield plate 4, of the two ends in the longitudinal direction of the shield plate 4, the end on the side not facing the work table 2 ( The upper end 4a) is arranged so as to have a height equal to or higher than the end (upper end Wa) on the side not facing the work table among the two ends in the longitudinal direction of the work W. Thus, the shield plate 4 is a member having a length equal to or longer than the length along the longitudinal direction of the workpiece W. An end portion (upper end portion 4 a) in the length direction of the shield plate 4 exists outside the length range along the longitudinal direction of the workpiece W and protrudes from the length range of the workpiece W.

Further, as shown in FIG. 1A, the width L1 of the shield plate 4 is the smallest gap among the gaps formed between the adjacent workpieces W, that is, the interval between the adjacent workpieces W. It is larger than L2 (separation distance) and smaller than the distance L3 (axial center distance) between the axial centers of adjacent workpieces W. Specifically, the shield plate 4 has a width L1 that is equal to or greater than the distance L2 between the two workpieces W at the position where the adjacent workpieces W are closest.

As shown in FIG. 1A, the shield plate 4 having such a configuration is arranged between the adjacent workpieces W from the axis of the work table 2 (swivel center axis) rather than the axis of the adjacent workpieces W. It is arranged at a distant position. That is, the shield plate 4 is disposed at a position farther from the evaporation source 3 than the position at which the adjacent workpieces W are closest to each other (that is, the position of the interval L2 that is the minimum gap). At this time, the eight shield plates 4 are arranged such that the respective width directions are along the turning direction (circumferential direction) of the work table 2. As a result, the shield plate 4 has a width L1 equal to or greater than the distance L2 between the two workpieces W at the position where the adjacent workpieces W are closest to each other.

FIG. 1B is a view of a state in which the work table 2 holding the work W includes the above-described shield plate 4 as viewed from the side, that is, from the side of the side wall portion 5C of the vacuum chamber 1. As shown in FIG. 1B, since the gap between adjacent workpieces W is blocked by the shield plate 4, the central portion of the work table 2 surrounded by the eight workpieces W from the side wall portion 5C side. Can't see. In other words, when the outer peripheral direction of the work table 2 is viewed from the center of the work table 2, the periphery is surrounded by the work W or the shield plate 4, and the outside of the work table 2 (specifically, the side wall portion 5C). ) Cannot be seen.

In other words, the width L1 of the shield plate 4 is determined so that the center portion of the work table 2 surrounded by the eight works W cannot be seen from the side of the side wall 5C.

As will be described in detail later, when the film forming process is performed as an AIP apparatus, if the work table 2 holding the workpiece W and the shield plate 4 is held in the vacuum chamber 1, the center of the work table 2 is formed. The above-described evaporation source 3 is arranged. Since the inner wall (specifically, the side wall portion 5C) of the vacuum chamber 1 outside the work table 2 cannot be seen from the evaporation source 3 arranged at the center portion of the work table 2, the work from the evaporation source 3 to the work The evaporated particles moving in the outer peripheral direction of the table 2 adhere to the workpiece W or the shield plate 4 and cannot reach the inner wall of the vacuum chamber 1.

Note that the shape of the shield plate 4 is not limited to a flat plate shape. The flat shield plate 4 may be bent or bent in the width direction.

The AIP device having the above-described configuration further includes an arc power source and a bias power source (both not shown). By connecting the cathode of the arc power source to the evaporation source 3, the evaporation source 3 functions as a target (cathode). The anode of the arc power supply is connected to the vacuum chamber 1. The work W is connected to the cathode of the bias power source. In addition, the arc power supply has an auxiliary anode (not shown) for spark discharge. An arc is generated between the auxiliary anode and the target. The film forming material of the evaporation source 3 evaporated by the arc discharge is deposited on the surface of the work W, and a hard film is formed.

A procedure for performing a film forming process using the above-described AIP apparatus will be described.

First, the side wall 5C of the vacuum chamber 1 is opened, the work table 2 is drawn out from the vacuum chamber 1, and the work W is placed on each of the work holding devices of the drawn out work table 2. In addition, a shield plate 4 is placed between adjacent workpieces W.

The work table 2 on which the work W and the shield plate 4 are placed is returned to the vacuum chamber 1. The work table 2 is arranged and held so that the axis of the rotary support 6 of the work table 2 is located at a substantially central portion when the vacuum chamber 1 is viewed from the ceiling 5A.

After the work table 2 is held in the vacuum chamber 1, the side wall portion 5C of the vacuum chamber 1 is closed, and the ceiling portion 5A from which the evaporation source 3 is suspended is lowered to seal the vacuum chamber 1. After the vacuum chamber 1 is sealed, the internal space of the vacuum chamber 1 is decompressed. Thereafter, the film forming process is started.

At this time, in the vacuum chamber 1, the evaporation source 3 disposed in the central portion of the vacuum chamber 1 is held at a substantially central position on the upper surface of the work table 2, so that the plurality of workpieces W and the evaporation source 3 are surrounded. A plurality of shield plates 4 are arranged.

Each work W is rotated by the work holding device while revolving around the evaporation source 3 by the rotation of the work table 2. That is, the workpiece W faces the entire circumference of the evaporation source 3 by revolution, and the entire circumference of the side surface of the workpiece W faces the evaporation source 3 by rotation. By this combination of revolution and rotation, the evaporated particles that move radially from the entire circumference of the evaporation source 3 along the radial direction of the work table 2 are uniformly attached and deposited on the entire surface of the work W.

Among the evaporated particles that move radially from the entire circumference of the evaporation source 3, the evaporated particles that move toward the vacuum chamber 1 without adhering to the surface of the workpiece W are separated by the shield plate 4 disposed between the adjacent workpieces W. It is collected.

In this way, almost all of the evaporated particles that move radially along the radial direction of the work table 2 from the entire circumference of the evaporation source 3 are collected by the work W or the shield plate 4, so that the evaporated particles are vacuumed. It hardly adheres to the inner wall of the chamber 1.

According to the above-described embodiment, the use of the shield plate 4 can prevent the evaporated particles from the evaporation source 3 from adhering to the inner wall of the vacuum chamber 1. The use of such a shield plate 4 produces the following effects.

First, it is possible to prevent contamination of the inner wall of the vacuum chamber 1 (specifically, the side wall portion 5c; the same applies hereinafter) due to adhering evaporated particles. Next, the temperature of the inner wall of the vacuum chamber 1 can be kept low because the evaporated particles that have reached a very high temperature do not adhere to the inner wall of the vacuum chamber 1 and the radiant heat from the evaporation source 3 does not reach. it can. As a result, the surface of the entire circumference of the workpiece W facing the inner wall of the vacuum chamber 1 is removed, so that the temperature of the workpiece W can be kept low. That is, the high-temperature portion caused by the evaporated particles can be limited to only the portion surrounded by the workpiece W and the shield plate 4, and the temperature of the other portion, that is, the portion outside the work table 2 can be kept low. Can do.

In addition, by using the shield plate 4 described in the present embodiment, a shield that covers the inner surface of the vacuum chamber 1 that has been conventionally used becomes unnecessary. Therefore, it is possible to reduce the manufacturing cost of the AIP device and to reduce maintenance work.

Furthermore, since the temperature of the workpiece W can be kept low without providing a cooling device or the like in the AIP device according to the present embodiment, there is no obstacle such as a cooling pipe required when the cooling device is provided. Thereby, the work W can be easily placed on the work table 2.

In the above-described embodiment, the shield plate 4 may be held on the upper surface of the work table 2, but the shield plate 4 may be suspended from above the work table 2. When the shield plate 4 is suspended, a column is erected on the work table 2, and a frame for hanging the shield plate 4 is attached to the column. A stand for suspending the shield plate 4 from above the work table 2 can be configured by such a column and a frame.

Compared with the case where the shield plate 4 is held on the work table 2, the following advantages are obtained when the shield plate 4 is suspended from above the work table 2.

As a result of deposition of evaporated particles from the evaporation source 3, a film is also formed on the shield plate 4, and the shield plate 4 expands due to radiant heat from the evaporation source 3 and the workpiece W. That is, since the size of the shield plate 4 varies, the space (clearance) secured between the workpiece W and the workpiece W also varies. In such a case, when the shield plate 4 is suspended from above the work table 2, the position of the shield plate 4 can be easily changed, and an appropriate clearance from the workpiece W can be maintained. .

As described above, according to the AIP apparatus according to the present embodiment, the temperature rise of the workpiece W can be effectively suppressed with a simple structure that suppresses an increase in manufacturing cost, and the maintenance of the inner wall of the vacuum chamber 1 is easy. It becomes. Further, since the size of the shield plate 4 is smaller than that of the conventional shield that covers the inside of the vacuum chamber 1 widely, maintenance is also facilitated in this respect.

For the above-described AIP apparatus, the temperature rise of the workpiece W is further effectively suppressed by improving the configuration of the vacuum chamber 1. Therefore, a modification of the vacuum chamber 1 that can more effectively suppress the temperature rise of the workpiece W will be described below.

FIG. 2 is a view showing a modified example of the vacuum chamber 1 of the AIP device according to the present embodiment and a configuration inside the vacuum chamber 1. Specifically, FIG. 2A is a diagram illustrating a modification of the vacuum chamber 1 and a configuration when the inside is viewed from above, and FIG. 2B is a modification of the vacuum chamber 1 and It is a figure which shows a structure when the inside is seen from the side.

2A and 2B, a vacuum chamber 1 which is a modification of the vacuum chamber 1 has a cooling channel (cooling) for cooling the vacuum chamber 1 outside the side wall portion 5C. A flow path through which the agent circulates. The cooling pipe 7 constituting the cooling channel is made of the same material as the vacuum chamber 1 and is made of a metal such as steel or stainless steel, for example. The cooling pipe 7 has a prismatic shape with a hollow inside. A plurality of cooling pipes 7 are provided outside the side wall 5C of the vacuum chamber 1 along the height direction of the vacuum chamber 1, that is, at substantially equal intervals.

The plurality of cooling pipes 7 are provided on the outer surface side of the side wall part 5C so as to be spanned between the ceiling part 5A and the bottom part 5B of the vacuum chamber 1, and each cooling pipe 7 is in contact with the side wall part 5C. The plurality of cooling pipes 7 are connected to one of the adjacent cooling pipes 7 and one of the upper end on the ceiling 5A side and the lower end on the bottom 5B side, and the other cooling pipe 7 is connected to the upper end And the remaining end of the lower end.

That is, the plurality of cooling pipes 7 form a cooling channel that zigzags continuously while meandering on the side wall portion 5C. The number of the cooling pipes 7 used for constituting one cooling channel is arbitrary and may be selected in accordance with a desired cooling performance.

FIG. 2B shows a state in which the refrigerant is supplied from below to the cooling channel provided in the left side wall portion 5C and discharged from the lower side of the cooling channel provided in the right side wall portion 5C. Yes. As the refrigerant, water is generally used, but it is not limited to a liquid such as water, and a gas (gas) having a low boiling point may be used.

Thus, by providing the cooling channel on the outer wall of the vacuum chamber 1, the inner wall of the vacuum chamber 1 can be kept at a lower temperature. As a result, the surface of the entire circumference of the workpiece W toward the inner wall of the vacuum chamber 1 is more effectively removed, so that the temperature of the workpiece W can be kept lower.

Here, the side wall portion 5C may be constituted by two opposing wall plates, and a cooling channel may be interposed between the two wall plates. If the cooling channel is sandwiched between two wall plates, a configuration having a cooling channel inside the side wall portion 5C (a configuration having a so-called cooling jacket) is obtained. Therefore, the transfer of heat from the inner side wall plate of the vacuum chamber 1 to the outer side wall plate can be largely blocked. As a result, even if the operator (operator) touches the outside of the side wall 5C of the vacuum chamber 1, there is no possibility of burns or the like.

The present invention is not limited to the above-described embodiment, and the shape, structure, material, combination, and the like of each member can be appropriately changed without departing from the essence of the invention. Further, in the embodiment disclosed this time, matters that are not explicitly disclosed, for example, operating conditions and operating conditions, various parameters, dimensions, weights, volumes, and the like of a component deviate from a range that a person skilled in the art normally performs. However, matters that can be easily assumed by those skilled in the art are employed.

For example, the shield plate 4 only needs to be arranged at a position where the inner wall of the vacuum chamber 1 outside the work table 2 cannot be seen from the evaporation source 3. It is possible to arrange other than the described positions.

In the above-described embodiment, as shown in FIG. 1A, the shield plate 4 is disposed at a position farther from the evaporation source 3 than the position at which the adjacent workpieces W are closest. However, the shield plate 4 can also be arranged at a position closer to the evaporation source 3 than the position at which the adjacent workpieces W are closest to each other along the turning direction.

If the shield plate 4 is arranged at a position close to the evaporation source 3 in this way, the ratio of the side surface facing the inner wall side of the vacuum chamber 1 in the entire circumference of the side surface of the work W that is a cylindrical body or a columnar body increases. Therefore, the film forming apparatus can have a configuration advantageous for cooling the workpiece W.

In the above-described embodiment, as shown in FIGS. 1 and 2, when the vacuum chamber 1 is placed vertically, the evaporation source 3, the work W, and the shield plate 4 are vertically aligned toward the paper surface. Are arranged. Therefore, in the above-described embodiment, the shield plate 4 and the workpiece W are compared with each other as a reference, and the shield plate 4 has a height equal to or higher than the height of the workpiece W when placed on the work table 2. It is described that.

However, when the vacuum chamber 1 shown in FIGS. 1 and 2 is placed horizontally, the evaporation source 3, the workpiece W, and the shield plate 4 are arranged so that their longitudinal directions are along the left-right direction toward the drawings. Is done. In this case, the shield plate 4 and the workpiece W can be compared based on the length, instead of using the height as described in the above embodiment. In that case, it can be said that the shield plate 4 is a member having a length equal to or longer than the length of the workpiece W when placed on the workpiece table 2.

In the above embodiment, the shield plate 4 has been described as an example of the shield member. However, the present invention is not limited to such a plate-shaped shield. In this invention, if it is arrange | positioned between the some workpiece | work W mounted in the workpiece | work table 2, and can collect the evaporation particles which evaporated from the evaporation source between the workpiece | work W, it will be various shapes or structures. A thing can be adopted as a shield member. For example, it is possible to employ a prismatic or cylindrical shield member.

The specific embodiments described above mainly include inventions having the following configurations.

The film forming apparatus of the present embodiment is a film forming apparatus that performs PVD processing on the surface of a work by evaporating an evaporation source, and includes a vacuum chamber, the evaporation source provided in the vacuum chamber, and a plurality of evaporation sources A work table having a plurality of work placement parts on which each of the works is placed, and turning the plurality of works around the evaporation source in a state of being placed on the work placement part; Evaporated particles arranged between the plurality of workpieces placed on the placement unit, thereby intermittently arranged with each other, swirling around the evaporation source together with the workpieces by the work table, and evaporated from the evaporation source And a plurality of shield members for collecting evaporated particles moving toward the vacuum chamber.

According to the film forming apparatus of the present embodiment, with the above configuration, it is possible to effectively suppress the temperature rise of the substrate with a simple structure that suppresses an increase in manufacturing cost.

Here, the plurality of work placement parts are arranged so as to be aligned along the turning direction of the work table, and the shield members are formed of adjacent works among works placed on the work placement part. Preferably, the plurality of shield members are arranged so as to be arranged along the turning direction.

Further, the shield member is a work placed on the work placing portion, and is closer to the evaporation source than the position of the smallest gap among the gaps formed between the works adjacent to each other. It is preferable that they are arranged at separate positions.

Furthermore, it is preferable that the shield member has a width larger than the minimum gap among the gaps between the adjacent workpieces.

The shield member is a member having a length equal to or longer than the length of the workpiece placed on the workpiece placement portion, and an end portion of the shield member in the length direction. However, it is preferable to be provided outside the length range along the longitudinal direction of the workpiece.

Furthermore, it is preferable that the vacuum chamber has a water cooling channel for cooling a chamber wall of the vacuum chamber.

Claims

A film forming apparatus that performs PVD treatment on the surface of a workpiece by evaporating an evaporation source,
A vacuum chamber;
The evaporation source provided in the vacuum chamber;
A work table that has a plurality of work placement parts on which each of the plurality of works is placed, and rotates the plurality of works around the evaporation source in a state of being placed on the work placement part;
Arranged between the plurality of workpieces placed on the workpiece placement unit, thereby intermittently arranged, swirled around the evaporation source together with the workpiece by the work table, and evaporated from the evaporation source A film forming apparatus comprising: a plurality of shield members that collect evaporated particles moving toward the vacuum chamber among the evaporated particles.
The plurality of work placement units are arranged so as to be arranged along a turning direction of the work table,
Each of the shield members is disposed between adjacent workpieces among the workpieces placed on the workpiece placement unit, whereby the plurality of shield members are arranged in line along the turning direction. The film forming apparatus according to claim 1.
The shield member is a workpiece placed on the workpiece placement portion, and is farther from the evaporation source than the position of the smallest gap that is the smallest portion of the gaps formed between adjacent workpieces. The film forming apparatus according to claim 2, wherein the film forming apparatus is disposed at a position.
4. The film forming apparatus according to claim 3, wherein the shield member has a width larger than the minimum gap among the gaps between the adjacent workpieces.
The shield member is a member having a length equal to or longer than the length of the workpiece placed on the workpiece placement portion, and an end portion of the shield member in the length direction is The film forming apparatus according to claim 1, wherein the film forming apparatus is provided so as to exist outside a length range along a longitudinal direction of the workpiece.
The film forming apparatus according to claim 1, wherein the vacuum chamber has a water cooling channel for cooling a chamber wall of the vacuum chamber.