WO2014041713A1 - Procédé de montage de composant et système de montage de composant - Google Patents

Procédé de montage de composant et système de montage de composant Download PDF

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Publication number
WO2014041713A1
WO2014041713A1 PCT/JP2013/001454 JP2013001454W WO2014041713A1 WO 2014041713 A1 WO2014041713 A1 WO 2014041713A1 JP 2013001454 W JP2013001454 W JP 2013001454W WO 2014041713 A1 WO2014041713 A1 WO 2014041713A1
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WO
WIPO (PCT)
Prior art keywords
solder
correction value
component
mounting
substrate
Prior art date
Application number
PCT/JP2013/001454
Other languages
English (en)
Japanese (ja)
Inventor
中村　光男
伊藤　克彦
永井　大介
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2014041713A1 publication Critical patent/WO2014041713A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0817—Monitoring of soldering processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a component mounting method and a component mounting system for mounting a component by printing solder on an electrode of a substrate.
  • the component mounting system that prints solder on the board and mounts the parts on the board has a solder printing section that prints the solder on each electrode of the board, and the parts are mounted at the target mounting position on the board where the solder is printed by the solder printing section.
  • a component mounting portion is provided.
  • Some of such component mounting systems include a solder position detection unit that detects the position of each solder with respect to the electrodes by imaging the solder printed on each electrode of the substrate by the imaging unit using an imaging unit. (For example, patent document 1). Further, a corrected target mounting position obtained by calculating a correction value of the target mounting position of the component based on the position of each solder detected by the solder position detection unit and correcting the target mounting position with the calculated correction value.
  • the cause of the mounting failure is the solder position detection process in the solder position detection process and the correction value in the correction value calculation process. It is difficult to specify which of the calculation process and the component mounting process in the component mounting process. For this reason, there is a possibility that the production efficiency of the substrate is lowered due to a delay in the treatment for the mounting failure.
  • An object of the present invention is to provide a component mounting method and a component mounting system that can easily identify the cause of a mounting failure when a component mounting failure occurs on a board.
  • the component mounting method includes a solder printing process for printing solder on each electrode of a board, and detecting the position of the solder on the board by imaging the solder printed on the board in the solder printing process. Determining a relative positional relationship of the solder with respect to the corresponding electrode from the position of the solder on the substrate and the position of the electrode corresponding to the solder detected in the solder position detecting step A correction value calculating step of calculating a correction value of the target mounting position of the component based on the positional relationship, and a corrected target mounting position obtained by correcting the target mounting position with the correction value calculated in the correction value calculating step Calculated in a component mounting step of mounting the component on the substrate, a relative positional relationship of the solder obtained in the correction value calculation step with respect to the corresponding electrode, the target mounting position, and the correction value calculation step Based on the correction value, a display step for simultaneously displaying the direction of positional deviation of the solder with respect to the corresponding electrode and the correction direction of the target mounting position
  • a production program and data related to the component mounting unit for mounting the component at the corrected target mounting position are displayed, and the mounting failure is based on the displayed production program and data related to the component mounting unit. Judgment of the cause of the mounting failure of the component in which the occurrence of the failure occurs.
  • a component mounting system includes a solder printing unit that prints solder on each electrode of a board, and the position of the solder on the board by imaging the solder printed on the board by the solder printing unit.
  • a relative position relationship of the solder with respect to the corresponding electrode is obtained from the solder position detection unit to be detected, the position of the solder on the substrate detected by the solder position detection unit, and the position of the electrode corresponding to the solder.
  • a correction value calculation unit that calculates a correction value of the target mounting position of the component based on the relative positional relationship, and a corrected value obtained by correcting the target mounting position with the correction value calculated by the correction value calculation unit.
  • the component mounting unit that mounts the component at the target mounting position, the relative positional relationship of the solder obtained by the correction value calculation unit with respect to the corresponding electrode, the target mounting position, and the previous calculated by the correction value calculation unit Based on the correction value, and a display unit that displays the solder orientation of positional deviation with respect to the corresponding electrodes and orientation of the correction of the target mounting position by the correction value at the same time.
  • the direction of the positional deviation of each solder printed on the board with respect to the corresponding electrode and the direction of correction of the target mounting position of the component by the correction value are displayed at the same time, and when the mounting failure of the component on the board is found Is a process of detecting the position of the solder in the solder position detecting step, based on the direction of the positional deviation of each displayed solder with respect to the corresponding electrode and the direction of correction of the target mounting position based on the correction value. It is possible to easily identify the correction value calculation process in the correction value calculation process and the component mounting process in the component mounting process. For this reason, it is possible to quickly deal with the mounting failure, and it is possible to prevent the substrate production efficiency from being lowered.
  • the block diagram of the component mounting system in one embodiment of this invention The perspective view of the solder position detector which comprises the component mounting system in one embodiment of this invention
  • the block diagram which shows the control system of the solder position detector in one embodiment of this invention The top view of the board
  • substrate which the component mounting system in one embodiment of this invention makes object of component mounting 1 is a partially enlarged plan view of a board that is a component mounting target of a component mounting system according to an embodiment of the present invention;
  • the block diagram which shows the control system of the component mounting machine in one embodiment of this invention 1 is a partially enlarged plan view of a board that is a component mounting target of a component mounting system according to an embodiment of the present invention; (A), (b) and (c) are side views of the substrate for explaining the self-alignment effect in the component mounting system according to the embodiment of the present invention.
  • the component mounting system 1 shown in FIG. 1 prints solder Hd on the electrodes 3 of the substrate 2 and performs a component mounting operation for mounting the component 4 on the printed solder Hd.
  • the component mounting system 1 includes a solder printing machine 11, a solder position detector 12, a component mounting machine 13, and a reflow furnace 14 arranged in one direction (X-axis direction) in a horizontal plane in the following order.
  • a solder printer 11 carries in a substrate 2 input by an operator OP or from a substrate input device (not shown), positions it at a work position, and prints solder Hd on an electrode 3 provided on the substrate 2. Then, the substrate 2 is carried out to the solder position detector 12 on the downstream process side (solder printing process).
  • the solder position detector 12 is moved by a transport conveyor 22 that transports the substrate 2 on the base 21 in the X-axis direction, a head moving mechanism 23 composed of an orthogonal coordinate robot, and a head moving mechanism 23.
  • An inspection camera 24 is provided as an imaging means.
  • the head moving mechanism 23 includes a Y-axis table 23a provided on the base 21 extending in a horizontal plane direction (Y-axis direction) orthogonal to the X-axis direction, and extending in the X-axis direction, one end of which is a Y-axis table.
  • It has an X-axis table 23b provided on the X-axis table 23b so as to be movable in the Y-axis direction, and a moving stage 23c provided on the X-axis table 23b so as to be movable in the X-axis direction.
  • the inspection camera 24 is attached to the moving stage 23c with the imaging field of view directed downward.
  • the conveyance of the substrate 2 by the conveyor 22 and the positioning control to the working position, the movement control of the inspection camera 24 by the head moving mechanism 23, the imaging operation control of the inspection camera 24, and the imaging of the inspection camera 24 are performed.
  • Processing control of the image data obtained by the operation is performed by a detector control device 25 provided in the base 21.
  • the detector control device 25 When detecting that the substrate 2 has been sent from the solder printer 11, the detector control device 25 operates the conveyor 22 to carry in the substrate 2 and position it at a predetermined work position. Then, the detector control device 25 moves the inspection camera 24 to recognize the two marks m (FIGS. 2 and 4) provided at diagonal positions on the substrate 2, and the reference fixed to the substrate 2. Coordinates ( ⁇ coordinate system shown in FIG. 4) are set. Then, the detector control device 25 images the solder Hd (FIG. 5) printed on each electrode 3 of the substrate 2 by the solder printer 11, and the position (details) of each solder Hd with reference to the set ⁇ coordinate system. The position of the center PH of each solder Hd is detected (solder position detecting step).
  • the solder position detector 12 executes the solder position detection process, the solder position detector 12 carries the board 2 to the component mounting machine 13 on the downstream process side, and data on the position of each solder Hd on the board 2 detected in the solder position detection process. Is transmitted to the component mounting machine 13.
  • the component mounting machine 13 is moved on a base 31 by a transport conveyor 32 that transports the substrate 2 in the X-axis direction, a head moving mechanism 33 including a Cartesian coordinate robot, and a head moving mechanism 33.
  • the substrate camera 36 that is provided on the mounting head 34 and the imaging field of view is directed downward, and between the conveyor 32 and the parts feeder 35 on the base 31.
  • a component camera 37 is provided that has an imaging field of view directed upward.
  • the head moving mechanism 33 includes a Y-axis table 33a provided on the base 31 so as to extend in the Y-axis direction, and one end thereof is provided so as to be movable on the Y-axis table 33a in the Y-axis direction.
  • the mounting head 34 has a plurality of suction nozzles 34a extending downward and capable of moving in the vertical axis direction (Z-axis direction) and rotating around the Z axis. In the mounting head 34, the suction nozzle 34a picks up the component 4 that each of the parts feeders 35 supplies to the component supply port 35a.
  • the conveyance of the substrate 2 by the conveyance conveyor 32 and the positioning control to the working position, the movement control of the mounting head 34 by the head moving mechanism 33, the supply operation of the component 4 by each parts feeder 35 and the suction nozzle 34a The image obtained by the operation control of the suction mechanism 38 that performs the suction operation of the component 4 supplied by the parts feeder 35, the imaging operation control of the board camera 36 and the part camera 37, and the imaging operation of the board camera 36 and the part camera 37.
  • Data processing control is performed by a mounting machine control device 39 provided in the base 31.
  • the loading machine control device 39 When the mounting machine control device 39 detects that the substrate 2 has been sent from the solder position detector 12, the loading machine control device 39 operates the transport conveyor 32 to carry in the substrate 2 and position it at a predetermined work position.
  • the mounting machine control device 39 receives the position data of each solder Hd on the substrate 2 detected by the solder position detector 12 and sent from the detector control device 25, and receives the solder position storage unit 39a (FIG. 7).
  • the correction value calculation unit 39b (FIG. 7) stores the received position of each solder Hd on the substrate 2 and the electrode 3 corresponding to each solder Hd stored in the electrode position storage unit 39c (FIG. 7). The relative positional relationship of each solder Hd with respect to the electrode 3 is obtained from the position data.
  • the correction value calculation unit 39b calculates a correction value of the target mounting position M0 of the component 4 mounted on the board 2 based on the obtained relative positional relationship, and calculates the correction value of each calculated component 4 as a correction value. It is stored in the storage unit 39d (FIG. 7) (correction value calculation step).
  • the data of the target mounting position M0 of each component 4 is stored in the target mounting position storage unit 39e (FIG. 7) of the mounting machine control device 39.
  • the correction value of the target mounting position M0 for each component 4 is based on the ⁇ coordinate of the position of the center PH of each solder Hd with respect to the position of each center PD of the plurality of electrodes 3 to which the plurality of terminals of the component 4 are connected.
  • the positional deviation ( ⁇ , ⁇ ) that is, the positional deviation of each solder Hd with respect to the corresponding electrode 3 (see the enlarged view shown at the lower right in FIG.
  • the mounting machine control device 39 After executing the correction value calculation step, the mounting machine control device 39 recognizes the two marks m (FIGS. 6 and 4) provided on the substrate 2 by the substrate camera 36 and is fixed to the substrate 2. Set the reference coordinates (the aforementioned ⁇ coordinates). Then, the mounting machine control device 39 corrects the target mounting position M0 with the correction value calculated in the correction value calculating step, and mounts the component 4 on the corrected target mounting position M1 (FIG. 8) obtained thereby (component). Mounting process).
  • the component mounting machine 13 carries out the substrate 2 to the reflow furnace 14 on the downstream process side after executing the component mounting process.
  • the reflow furnace 14 reflows the solder Hd on the substrate 2 with respect to the substrate received from the component mounting machine 13 (solder reflow process).
  • solder reflow process the component mounting machine 13 mounts the component 4 so that the terminal 4a contacts the position of the solder Hd printed on the substrate 2 (FIG. 9A). Therefore, the self-alignment effect is exhibited by the flow of the solder Hd during reflow of the solder Hd (arrow A shown in FIG. 9B), and the component 4 is mounted at the target mounting position M0 (FIG. 9C). ).
  • the display control unit 39f (FIG. 7) of the mounting machine control device 39 obtains the correction value calculation step when there is a predetermined input operation by the operator OP from the input device 40 (FIG. 7) connected to the mounting machine control device 39.
  • Data on the relative positional relationship of each solder Hd with respect to the electrode 3 position data of each electrode 3 on the substrate 2 stored in the electrode position storage section 39c and position data of each solder Hd stored in the solder position storage section 39a
  • target Based on the data of the target mounting position M0 of each component 4 stored in the mounting position storage unit 39e and the correction value data of each component 4 calculated in the correction value calculation process and stored in the correction value storage unit 39d.
  • a screen GM (FIG.
  • the outer shape of the electrode 3, the target mounting position M0, and the outer shape of the component 4 when the component 4 is mounted at the target mounting position M0 are indicated by thin lines.
  • the outer shape of the solder Hd printed on the substrate 2, the corrected target mounting position M1, and the external shape of the component 4 when the component 4 is mounted at the corrected target mounting position M1 are shown. Shown in bold lines.
  • the screen GM shows arrows V1, V2, V3, V4 from the position of the center PD of the electrode 3 to the position of the center PH of the solder Hd so that the direction of the positional deviation of the solder Hd with respect to the electrode 3 can be seen.
  • the screen GM shows an arrow R from the target mounting position M0 to the corrected target mounting position M1 so that the correction direction of the target mounting position M0 of the component 4 based on the correction value can be seen.
  • the screen GM shown in FIG. 10 shows arrows V1, V2, V3, V4 indicating the direction of misalignment of the solder Hd with respect to the electrode 3, and an arrow R indicating the direction of correction of the target mounting position M0.
  • the lines in the screen GM are color-coded to print the outer shape of the electrode 3, the target mounting position M0, the outer shape of the component 4 when the component 4 is mounted at the target mounting position M0, and each electrode 3. If the outer shape of the solder Hd, the corrected target mounting position M1, and the outer shape of the component 4 when the component 4 is mounted at the corrected target mounting position M1, can be clearly shown in FIG.
  • the arrows V1, V2, V3, V4 indicating the direction of misalignment of the solder Hd with respect to each electrode 3 and the arrow R indicating the correction direction of the target mounting position M0 can be omitted. Further, as shown in FIG. 12, the outer shape of the electrode 3 and the target mounting position M0, and arrows V1, V2, V3, V4 indicating the direction of the positional deviation of the solder Hd with respect to each electrode 3 and the target mounting position M0 are corrected. Only the arrow R indicating the direction may be shown.
  • the screen GM displayed on the display device 41 is based on the relative positional relationship of each solder Hd obtained in the correction value calculation process with respect to the corresponding electrode 3, the target mounting position M0, and the correction value calculated in the correction value calculation process.
  • the display format is not particularly limited as long as the direction of displacement of each solder Hd with respect to the corresponding electrode 3 and the direction of correction of the target mounting position M0 by the correction value are displayed simultaneously.
  • the operator OP of the component mounting system 1 picks up the board 2 and inspects the mounting state of the parts 4.
  • the operator OP visually checks whether or not the component 4 is mounted at the original (before correction) target mounting position M0, and the mounting is not performed at the target mounting position M0.
  • an input operation is performed from the input device 40 described above.
  • the operator OP simultaneously displays the screen GM indicating the direction of the positional deviation of each solder Hd from the electrode 3 and the correction direction of the target mounting position M0 based on the correction value on the component 4 having the mounting failure. 41 is displayed.
  • the operator OP detects the position of the solder Hd in the solder position detection process performed by the solder position detector 12 and causes the component 4 to be defective. It is determined which of the correction value calculation process in the correction value calculation process performed by the machine 13 and the component mounting process in the component mounting process performed by the component mounting machine 13 has a problem (determination process). In this determination step, the operator OP determines that there is a problem in the detection process of the position of the solder Hd unless the direction of the positional deviation of each solder Hd is the same, and the direction of the positional deviation of the solder Hd is the same.
  • the display control unit 39f responds to an input operation from the input device 40, and the production program and data related to the component mounting unit that mounts the component 4 on the corrected target mounting position M1 on the display device 41, that is, the component mounting machine 13. Is displayed. For this reason, the operator OP determines the cause of the mounting failure for the component 4 in which the mounting failure has occurred (specifically, the component mounting step) based on the production program and data regarding the component mounting machine 13 displayed on the display device 41. It is possible to determine which part has caused the cause during execution.
  • the component mounting system 1 is printed on the board 2 by the solder printer 11 (solder printing unit) that prints the solder Hd on each electrode 3 of the board 2.
  • a solder position detector 12 solder position detector
  • a component mounting unit component mounting machine that mounts the component 4 at the corrected target mounting position M1 obtained by correcting the target mounting position M0 of the component 4 with the correction value calculated by the value calculation unit 39b and the correction value calculation unit 39b.
  • a display device 41 is provided as a display unit that simultaneously displays the direction of displacement with respect to the electrode 3 and the direction of correction of the target mounting position M0 by the correction value.
  • the component mounting method by the component mounting system 1 includes a solder printing process in which solder Hd is printed on each electrode 3 of the board 2, and images of the solder Hd printed on the board 2 in the solder printing process.
  • a solder position detecting step for detecting the position of the solder Hd, a position of each solder Hd on the substrate 2 detected in the solder position detecting step, and a position of the electrode 3 corresponding to each solder Hd relative to the corresponding electrode 3 of each solder Hd.
  • a positional relationship is obtained, a correction value calculating step for calculating a correction value for the target mounting position M0 of the component 4 based on the obtained relative positional relationship, and the target mounting position M0 is corrected with the correction value calculated in the correction value calculating step.
  • the cause of the mounting failure of the component 4 in which mounting failure has occurred after execution of the component mounting process based on the direction of displacement of each solder Hd with respect to the corresponding electrode 3 and the correction direction of the target mounting position based on the correction value. Includes a determination step of determining which of the position detection process of each solder Hd in the solder position detection step, the correction value calculation step in the correction value calculation step, and the component 4 mounting step in the component mounting step.
  • the target mounting position based on the direction of displacement and the correction value of each solder Hd printed on the substrate 2 with respect to the corresponding electrode 3.
  • the target mounting position based on the direction of the positional deviation of the displayed solder Hd with respect to the corresponding electrode 3 and the correction value.
  • the cause of the mounting failure is the detection process of the position of the solder Hd in the solder position detection process, the calculation process of the correction value in the correction value calculation process, and the mounting process of the component 4 in the component mounting process. It is possible to easily identify where it is. For this reason, it is possible to quickly deal with the mounting failure, and it is possible to prevent the production efficiency of the substrate 2 from being lowered.
  • a component mounting method and a component mounting system that can easily identify the cause of a mounting failure when a component mounting failure occurs on a board.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Selon la présente invention, sur la base d'une relation de positionnement relative par rapport à une électrode correspondant à une soudure sur un substrat, une position de fixation cible d'un composant, et une valeur de correction pour la position de fixation cible, l'orientation d'un déplacement de position par rapport à l'électrode correspondant à la soudure et l'orientation de la correction de la position de fixation cible selon la valeur de correction sont affichées de manière simultanée sur un dispositif d'affichage. Il est déterminé, pour un composant dans lequel un défaut de fixation s'est produit après une fixation de composant, si la cause du défaut de fixation est dans le processus de détection de la position de la soudure, le processus de calcul de la valeur de correction, ou le processus de fixation du composant.
PCT/JP2013/001454 2012-09-14 2013-03-07 Procédé de montage de composant et système de montage de composant WO2014041713A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-202568 2012-09-14
JP2012202568A JP5909649B2 (ja) 2012-09-14 2012-09-14 部品実装方法及び部品実装システム

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WO2014041713A1 true WO2014041713A1 (fr) 2014-03-20

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JP6343667B2 (ja) * 2014-06-18 2018-06-13 株式会社日立製作所 位置決めシステム
DE102018102288B4 (de) * 2018-02-01 2019-09-05 Asm Assembly Systems Gmbh & Co. Kg Verfahren und Vorrichtung zum Bestimmen der Orientierung eines Bauelements mit gebogenen Anschlusskontakten anhand von charakteristischen Reflexen, Bestückautomat.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002271096A (ja) * 2001-03-06 2002-09-20 Matsushita Electric Ind Co Ltd 電子部品実装方法及び装置、電子部品実装システム、電子部品実装データ作成方法、実装データ作成装置、並びにこれに用いるプログラム
JP2007096022A (ja) * 2005-09-29 2007-04-12 Omron Corp はんだ印刷検査方法およびはんだ印刷検査装置
JP2008270696A (ja) * 2006-07-14 2008-11-06 Juki Corp 部品搭載位置補正方法及び部品実装装置
JP2008300526A (ja) * 2007-05-30 2008-12-11 Yamaha Motor Co Ltd 実装ライン、実装基板の検査装置および検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002271096A (ja) * 2001-03-06 2002-09-20 Matsushita Electric Ind Co Ltd 電子部品実装方法及び装置、電子部品実装システム、電子部品実装データ作成方法、実装データ作成装置、並びにこれに用いるプログラム
JP2007096022A (ja) * 2005-09-29 2007-04-12 Omron Corp はんだ印刷検査方法およびはんだ印刷検査装置
JP2008270696A (ja) * 2006-07-14 2008-11-06 Juki Corp 部品搭載位置補正方法及び部品実装装置
JP2008300526A (ja) * 2007-05-30 2008-12-11 Yamaha Motor Co Ltd 実装ライン、実装基板の検査装置および検査方法

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