WO2014036767A1 - 印刷电路板及其与柔性电路板的压合方法及液晶显示装置 - Google Patents
印刷电路板及其与柔性电路板的压合方法及液晶显示装置 Download PDFInfo
- Publication number
- WO2014036767A1 WO2014036767A1 PCT/CN2012/082256 CN2012082256W WO2014036767A1 WO 2014036767 A1 WO2014036767 A1 WO 2014036767A1 CN 2012082256 W CN2012082256 W CN 2012082256W WO 2014036767 A1 WO2014036767 A1 WO 2014036767A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- printed circuit
- flexible circuit
- nip
- area
- Prior art date
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000010030 laminating Methods 0.000 title claims 3
- 238000003475 lamination Methods 0.000 claims abstract 11
- 238000003825 pressing Methods 0.000 claims description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 17
- 239000010931 gold Substances 0.000 description 17
- 229910052737 gold Inorganic materials 0.000 description 17
- 238000006073 displacement reaction Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002277 temperature effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
Definitions
- the present invention relates to the field of liquid crystal display devices and manufacturing, and more particularly to a printed circuit board and a method of pressing the same with a flexible circuit board and a liquid crystal display device.
- Figure 1 shows a schematic diagram of a current liquid crystal display driver printed circuit board assembly 100 (PCBA).
- the printed circuit board assembly 100 is provided with a gold finger region 101 and a nip region 102.
- the flexible circuit board 200 is bonded to the printed circuit board assembly 100 at the nip region 102 by the high temperature bonding die 300.
- the lines (gold fingers) on the printed circuit board assembly 100 are connected to the traces 201 on the flexible circuit board.
- the PCB sheet often thermally expands, and the entire printed circuit board assembly 100 is expanded in such a manner that the center of the region where the high temperature bonding head 300 contacts is expanded toward both sides.
- the entire flexible circuit board 200 is aligned to the gold finger 103 of the nip area 102 of the printed circuit board assembly 100, as shown in FIG.
- the technical problem to be solved by the present invention is to provide a printed circuit board having a good connection between a printed circuit board assembly and a flexible circuit board, a method of pressing the same with the flexible circuit board, and a liquid crystal display device.
- a method for pressing a flexible circuit board and a printed circuit board assembly comprising the steps of: A: on one side of a nip area of a printed circuit board assembly and a flexible circuit board or A sump is provided on both sides, B: The flexible circuit board is pressed with the printed circuit board assembly using a high temperature nip head to connect the two to the nip area.
- one or more avoidance slots are disposed between the adjacent two nip regions.
- the provision of one or more cutouts between the two nip regions facilitates reducing the expansion of the printed circuit board assembly between the two nip regions.
- only one escaping groove is disposed between the adjacent two nip regions, and the escaping groove starts at the boundary of one nip area and ends at the boundary of the other nip area. Only one sump is provided, which spans from one nip to the other, so that the nip is only as close as possible to the nip, minimizing the expansion of the printed circuit board assembly.
- a liquid crystal display device comprising a driving printed circuit board assembly and a flexible circuit board, wherein the driving printed circuit board assembly is provided with one side or both sides of a pressing area pressed against the flexible circuit board Empty slot.
- one or more escaping grooves are disposed between two adjacent nip regions.
- One or more cutouts are provided between the two nip regions to facilitate reducing the expansion of the printed circuit board assembly between the two nip regions.
- only one escaping groove is disposed between the adjacent two nip regions, and the escaping groove starts at the boundary of one nip area and ends at the boundary of the other nip area. Only one escaping groove is provided, which spans from one nip area to the other nip area, so that the nip head is only in contact with the nip area as much as possible, thereby minimizing the expansion of the printed circuit board assembly.
- a printed circuit board for connecting to a flexible circuit board, comprising a nip area pressed against the flexible circuit board, wherein one or both sides of the nip area are provided with a sluice preventing groove.
- each of the nip areas of the printed circuit board is provided with a sluice groove, and each of the escaping slots terminates at a boundary of an adjacent nip area.
- Use the avoidance slot to avoid expansion of the printed circuit board sheet and add it to the nip area.
- one or more escaping grooves are disposed between two adjacent nip regions.
- One or more cutouts are provided between the two nip regions to facilitate reducing the expansion of the printed circuit board sheet between the two nip regions.
- only one escaping groove is disposed between the adjacent two nip regions, and the escaping groove starts at the boundary of one nip area and ends at the boundary of the other nip area. Only one escaping groove is provided, which spans from one nip area to the other nip area, so that the nip head is only in contact with the nip area as much as possible, thereby minimizing the expansion of the printed circuit board sheet.
- the present invention provides a cutout on one side or both sides of a nip region where a printed circuit board assembly (PCBA) and a flexible circuit board (COF) are pressed, such that one or both sides of the nip area of the printed circuit board assembly Without being affected by the high temperature of the pressing cutter head, the deformation of the printed circuit board sheets on both sides is reduced to the printed circuit board sheet on the nip area, causing a large displacement of the gold fingers in the nip area. That is to say, since the printed circuit board sheet on one side or both sides of the nip area is removed, the deformation of the printed circuit board sheet in the nip area is reduced, so that the gold finger of the nip area does not become large. Displacement improves the accuracy of the connection of the leads of the flexible circuit board to the gold fingers on the printed circuit board assembly.
- PCBA printed circuit board assembly
- COF flexible circuit board
- FIG. 1 is a schematic structural view of a driving printed circuit board assembly of a conventional liquid crystal display device
- FIG. 2 is a schematic view showing a connection manner between a driving printed circuit board assembly and a flexible circuit board of a conventional liquid crystal display device
- 3 is a alignment state before the driving printed circuit board assembly of the conventional liquid crystal display device and the flexible circuit board are not connected
- 4 is a alignment of a driving printed circuit board assembly of a conventional liquid crystal display device after being connected to a flexible circuit board
- FIG. 5 is a schematic structural view of a driving printed circuit board assembly of a liquid crystal display device according to Embodiment 1 of the present invention
- FIG. 6 is a schematic view showing a connection manner between a driving printed circuit board assembly and a flexible circuit board of the liquid crystal display device according to Embodiment 1 of the present invention
- Figure ⁇ is a alignment of a driving printed circuit board assembly and a flexible circuit board of a liquid crystal display device according to an embodiment of the present invention
- FIG. 8 is a view showing alignment of a driving printed circuit board assembly and a flexible circuit board of a liquid crystal display device according to an embodiment of the present invention
- FIG. 9 is a flow chart showing the connection between a driving printed circuit board assembly and a flexible circuit board of a liquid crystal display device according to an embodiment of the present invention.
- FIG. 10 is a schematic structural view of a driving printed circuit board assembly of a liquid crystal display device according to Embodiment 2 of the present invention
- FIG. 11 is a schematic view showing a connection manner between a driving printed circuit board assembly and a flexible circuit board of the liquid crystal display device according to Embodiment 2 of the present invention.
- 100 printed circuit board assembly, 101, gold finger area, 102, nip area, 103, gold finger, 120, sump, 200, flexible circuit board, 201, routing, 300, nip head.
- the present invention will be described by taking, as an example, a method of connecting a printed circuit board assembly of a liquid crystal display device to a flexible circuit board.
- the method of connecting the printed circuit board assembly 100 (PCBA) to the flexible circuit board 200 (COF) includes the steps of:
- a cutout 120 is provided on one or both sides of the nip region 102 of the printed circuit board assembly 100 and the flexible circuit board 200.
- the flexible circuit board 200 is pressed into the printed circuit board assembly 100 using a high temperature nip head 300 to connect the two to the nip region 102.
- the driving printed circuit board assembly 100 of the liquid crystal display device is provided with two nip regions 102, and only one escaping groove 120 is disposed between the adjacent two nip regions, and the escaping groove 120 is disposed.
- the nip 102 Starting at the boundary of one nip 102 and terminating at the boundary of the other nip 102, to minimize the contact area of the printed circuit board assembly 100 with the nip 300, only the nip 102 and The nip head 300 is in contact so that heat deformation occurs as much as possible within the nip 102.
- the other side opposite to the avoidance groove 120 between the two pressing regions 102 is also provided with a cutout 120.
- the two pressing regions 102 are At the edge of the board body of the printed circuit board assembly 100, the printed circuit board sheet at the edge can be directly removed when the cutout 120 is opened at the edge.
- the gold fingers 103 and the wiring 201 can be aligned.
- FIG. 8 when the nip area 102 is heated and pressurized by the nip head 300, the printed circuit board sheet in the area is deformed and expanded from the middle to the both sides, but since the nip area 102 is small, it is accumulated. The expansion deformation is also small, the displacement of the gold finger 103 is small, the orientation 201 on the flexible circuit board 200 is still able to be well connected to the gold finger 103, and the displacement of the gold finger 103 near the center of the nip area 102 is The smallest. Such slight deformation ensures the connection accuracy between the flexible circuit board 200 and the printed circuit board assembly 100, and from another point, the product yield of the liquid crystal display device is also ensured.
- the cutouts 120 are disposed on both sides of the nip region 102 where the printed circuit board assembly 100 and the flexible circuit board 200 are pressed, the nip area 102 of the printed circuit board assembly 100 is not subjected to the pressing knives.
- the high temperature effect of the head 300 prevents the deformation of the printed circuit board sheet on both sides of the nip region 102 from accumulating to the printed circuit board sheet on the nip region 102, causing a large displacement of the gold finger 103 of the nip region 102.
- the printed circuit board sheets on both sides of the nip area 102 are removed, the printed circuit board sheets of the nip area 102 are not affected by the deformation accumulation, so that the gold fingers of the nip area 102 do not become large. Displacement, ensuring the trace 201 of the flexible circuit board 200 and printing The connection accuracy of the gold fingers 103 on the brush circuit board assembly 100.
- two cutouts 120 are disposed between the two nips 102, and the printed circuit board is still retained between the two cutouts 120, which can be expanded.
- the wiring area of the printed circuit board can also prevent deformation of the printed circuit board sheet remaining between the two cutouts 120 from being applied to the nip region 102 when expanded.
- the escaping grooves 120 between the two nip regions 102 are disposed on one side of the nip area 102, and the other side of the nip area 102 is also provided with the escaping grooves 120, that is, each nip area 102. Both sides are provided with avoidance slots, and each of the cutouts 120 terminates at the boundary of the adjacent nip 102.
- the retained portion is expanded and deformed toward both sides by the heating of the nip head 300, but the expansion deformation is not added to the nip region 102 due to the presence of the sluice groove 120, or The expansion deformation has less influence on the nip area 102, so that the expansion deformation of the nip area is still small, and the gold finger does not undergo large displacement.
- more than two escaping slots can be provided, and the area of the printed circuit board can be ensured while ensuring that the expansion deformation does not affect the nip area.
- the present invention can also provide a printed circuit board having the above structure, and the circuit board having such a structure can be specifically used for connection with a flexible circuit board, so that mass production can be performed as needed.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
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Abstract
提供了一种印刷电路板及其与柔性电路板的连接方法及液晶显示装置，连接方法包括步骤：A：在印刷电路板组件（100）与柔性电路板（200）的压合区域（102）一侧或两侧设置避空槽（120），B：使用高温压合刀头（300）将柔性电路板（200）与印刷电路板组件（100）压合使二者连接于压合区域（102）。
Description
印刷电路板及其与柔性电路板的压合方法及液晶显示装置
【技术领域】
本发明涉及液晶显示装置及制造领域， 更具体的说， 涉及一种印刷电路板 及其与柔性电路板的压合方法及液晶显示装置。
【背景技术】
在现今液晶显示器的制造工艺中， 常涉及到柔性电路板 ( COF, 即 Chip on FPC )和印刷电路板 ( PCB )之间的互连， 显示屏电极和柔性电路之间的互连。 在这些连接中， 广泛釆用各向异性导电膜， 将其置于需要被连接的部件之间， 然后对其加压加热形成部件之间稳定可靠的机械、 电气连接。
图 1 所示为目前液晶显示器驱动印刷电路板组件 100 ( PCBA ) 示意图。 印刷电路板组件 100上设置有金手指区域 101和压合区域 102, 如图 2所示， 柔 性电路板 200通过高温压合刀头 300,在压合区域 102与印刷电路板组件 100做 接合， 将印刷电路板组件 100上的线路（金手指） 与柔性电路板上的走线 201 做连接。
如 2所示， 但在加热加压过程中， PCB板材常发生热膨胀， 整个印刷电路 板组件 100膨胀的方式是高温压合刀头 300接触到的区域中心向两边膨胀。 而 PCBA板子越长，膨胀量越大， 累加到两边的膨胀变形致使压合区域 102发生较 大的偏移， 压合区域 102与柔性电路板 200之间的接触发生偏移， 造成无法有 效连接。 如图 3所示， 在压合前， 整颗柔性电路板 200左、 中、 右是对齐到印 刷电路板组件 100压合区域 102的金手指 103上， 如图 4所示， 在压合后， 因 为 PCBA膨胀， 整体的膨胀会累加到压合区域 102从而使得压合区域 102的金 手指 103与整个柔性电路板 200左、 中、 右上的走线 201都会有较大的错位， 影响连接性， 甚至可能断路造成产品无法正常使用。 目前克服的方式会从设计 上提前做缩小， 以及同设备机台温度去调控来克服， 但是从设计上或是设备调 控， 都会有难度， 且需要多次实验才能得到合理的条件和设计值， 且调控不好
会导致不良产品的发生。 因此， 亟需对此进行改进。 【发明内容】
本发明所要解决的技术问题是提供一种印刷电路板组件与柔性电路板之间 连接良好的印刷电路板及其与柔性电路板的压合方法及液晶显示装置。
本发明的目的是通过以下技术方案来实现的： 一种柔性电路板与印刷电路 板组件的压合方法， 包括步骤： A: 在印刷电路板组件与柔性电路板的压合区域 的一侧或两侧设置避空槽， B: 使用高温压合刀头将所述柔性电路板与所述印刷 电路板组件压合使二者连接于所述压合区域。
优选的， 所述步骤 A中， 在相邻的两个压合区域之间设置一个或多个避空 槽。 两个压合区域之间设置一个或多个避空槽， 有利于减小两个压合区域之间 的印刷电路板组件的膨胀。
优选的， 相邻的两个压合区域之间仅设置一个避空槽， 所述避空槽起始于 一个压合区域的边界并终结于另一个压合区域的边界。 仅设置一个避空槽， 其 跨越距离从一个压合区域到另一个压合区域， 使得压合刀头尽量只与压合区域 接触， 从而最大限度的降低印刷电路板组件的膨胀。
一种液晶显示装置， 包括驱动印刷电路板组件以及柔性电路板， 其特征在 于， 所述驱动印刷电路板组件上与所述柔性电路板压合的压合区域的一侧或两 侧设置有避空槽。
优选的， 相邻的两个压合区域之间设置有一个或多个避空槽。 两个压合区 域之间设置一个或多个避空槽， 有利于减小两个压合区域之间的印刷电路板组 件的膨胀。
优选的， 相邻的两个压合区域之间仅设置一个避空槽， 所述避空槽起始于 一个压合区域的边界并终结于另一个压合区域的边界。 仅设置一个避空槽， 其 跨越距离从一个压合区域到另一个压合区域， 使得压合刀头尽量只与压合区域 接触， 从而最大限度的降低印刷电路板组件的膨胀。
一种用于与柔性电路板连接的印刷电路板， 包括与柔性电路板压合的压合 区域， 其特征在于， 所述压合区域的一侧或两侧设置有避空槽。
优选的， 所述印刷电路板的每个压合区域的两侧皆设有避空槽， 所述每个 避空槽皆终结于相邻的压合区域的边界。 利用避空槽避免印刷电路板板材膨胀 累加到压合区域。
优选的， 相邻的两个压合区域之间设置有一个或多个避空槽。 两个压合区 域之间设置一个或多个避空槽， 有利于减小两个压合区域之间的印刷电路板板 材的膨胀。
优选的， 相邻的两个压合区域之间仅设置一个避空槽， 所述避空槽起始于 一个压合区域的边界并终结于另一个压合区域的边界。 仅设置一个避空槽， 其 跨越距离从一个压合区域到另一个压合区域， 使得压合刀头尽量只与压合区域 接触， 从而最大限度的降低印刷电路板板材的膨胀。
本发明由于在印刷电路板组件（PCBA )与柔性电路板 ( COF )压合的压合 区域的一侧或两侧设置避空槽， 使得印刷电路板组件的压合区域的一侧或两侧 不受到压合刀头的高温影响， 减少两侧的印刷电路板板材发生的变形累积到压 合区域上的印刷电路板板材而致使压合区域的金手指发生较大位移。 也就是说， 由于压合区域一侧或两侧的印刷电路板板材被去除， 从而减少了压合区域的印 刷电路板板材所受到的变形累加， 使得压合区域的金手指不会发生较大位移， 提高了柔性电路板的引线与印刷电路板组件上的金手指的连接准确性。
【附图说明】
图 1是现有液晶显示装置的驱动印刷电路板组件的结构简图，
图 2是现有液晶显示装置的驱动印刷电路板组件与柔性电路板的连接方式 示意图，
图 3是现有液晶显示装置的驱动印刷电路板组件与柔性电路板未连接前的 对位情况，
图 4是现有液晶显示装置的驱动印刷电路板组件与柔性电路板连接后的对 位情况，
图 5是本发明实施例一的液晶显示装置的驱动印刷电路板组件的结构简图， 图 6是本发明实施例一的液晶显示装置的驱动印刷电路板组件与柔性电路 板的连接方式示意图，
图 Ί是本发明实施例一液晶显示装置的驱动印刷电路板组件与柔性电路板 连接前的对位情况，
图 8是本发明实施例一液晶显示装置的驱动印刷电路板组件与柔性电路板 连接后的对位情况，
图 9是本发明实施例一液晶显示装置的驱动印刷电路板组件与柔性电路板 的连接流程图，
图 10是本发明实施例二液晶显示装置的驱动印刷电路板组件结构简图， 图 11是本发明实施例二液晶显示装置的驱动印刷电路板组件与柔性电路板 的连接方式示意图。
其中： 100、 印刷电路板组件， 101、 金手指区域， 102、 压合区域， 103、 金手指， 120、 避空槽， 200、 柔性电路板， 201、 走线， 300、 压合刀头。
【具体实施方式】
下面结合附图和较佳的实施例对本发明作进一步说明。
本发明以液晶显示装置的驱动印刷电路板组件与柔性电路板的连接方法为 例进行说明。
实施例一
如图 5-图 9所示， 印刷电路板组件 100 ( PCBA )与柔性电路板 200 ( COF ) 的连接方法包括步骤：
A、 如图 5所示， 在印刷电路板组件 100与柔性电路板 200的压合区域 102 的一侧或两侧设置避空槽 120。
B、 如图 6所示， 使用高温压合刀头 300将柔性电路板 200与所述印刷电路 板组件 100压合使二者连接于所述压合区域 102。
本实施例中， 液晶显示装置的驱动印刷电路板组件 100上设置有两个压合 区域 102,相邻的两个压合区域之间仅设置一个避空槽 120,并且所述避空槽 120 起始于一个压合区域 102的边界并终结于另一个压合区域 102的边界， 这样以 最大限度的减少印刷电路板组件 100与压合刀头 300的接触面积， 仅有压合区 域 102与压合刀头 300接触， 从而尽可能的使受热变形仅发生在压合区域 102 内。 另夕卜， 如图 5所示， 与两个压合区域 102之间的避空槽 120相对的另一侧， 也设置有避空槽 120, 本实施例中， 由于两个压合区域 102处于印刷电路板组件 100的板体边缘处，在该边缘处开设避空槽 120时直接去除边缘处的印刷电路板 板材即可。
如图 7所示， 压合前的印刷电路板组件 100与柔性电路板 200之间， 金手 指 103与走线 201可以 4艮好的对位。 如图 8所示， 当压合区域 102受到压合刀 头 300 的加热加压后， 该区域的印刷电路板板材由中间向两侧发生变形膨胀， 但是由于该压合区域 102较小， 累加的膨胀变形也就较小， 金手指 103发生的 位移很小， 柔性电路板 200上的走向 201依然能够与金手指 103很好的连接， 并且， 靠近压合区域 102中心的金手指 103的位移最小。 这样的微小变形保证 了柔性电路板 200与印刷电路板组件 100之间的连接准确性， 从另一点来说， 也保证了液晶显示装置的产品良率。
本实施例中， 由于在印刷电路板组件 100与柔性电路板 200压合的压合区 域 102两侧设置避空槽 120,使得印刷电路板组件 100的压合区域 102两侧不受 到压合刀头 300的高温影响， 避免压合区域 102两侧的印刷电路板板材发生的 变形累积到压合区域 102上的印刷电路板板材而致使压合区域 102的金手指 103 发生较大位移。 也就是说， 由于压合区域 102 两侧的印刷电路板板材被去除， 从而使得压合区域 102 的印刷电路板板材不在受到变形累加的影响， 使得压合 区域 102的金手指不会发生较大位移， 保证了柔性电路板 200的走线 201与印
刷电路板组件 100上的金手指 103的连接准确性。
实施例二
如图 10所示， 与实施例一不同的是， 在两个压合区域 102之间设置了两个 避空槽 120, 两个避空槽 120之间依然保留印刷电路板板材， 这样可扩大印刷电 路板的布线面积， 这样还可以避免两个避空槽 120之间保留的印刷电路板板材 发生膨胀时变形累加到压合区域 102。两个压合区域 102之间的避空槽 120均设 置在压合区域 102的一侧， 而压合区域 102的另一侧也设置有避空槽 120, 也就 是说每个压合区域 102的两侧皆设有避空槽， 并且每个避空槽 120皆终结于相 邻的压合区域 102的边界。
如图 11所示， 保留部分虽然受到压合刀头 300的加热而向两侧发生膨胀变 形， 但是由于有避空槽 120的存在， 该膨胀变形不会累加到压合区域 102上， 或是该膨胀变形对压合区域 102 的影响较小， 从而压合区域的膨胀变形还是很 小， 金手指不会发生大的位移。
当然， 对于本实施例来说， 也可以设置二个以上的避空槽， 在保证印刷电 路板板材面积的同时也能保证膨胀变形不会影响到压合区域。
根据上述实施例， 本发明同时还可以提供一种具有上述结构的印刷电路板， 具有该种结构的电路板可以专门用于与柔性电路板进行连接， 因此可以根据需 要而进行批量的生产。
以上内容是结合具体的优选实施方式对本发明所作的进一步详细说明， 不 能认定本发明的具体实施只局限于这些说明。 对于本发明所属技术领域的普通 技术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干简单推演或替 换， 都应当视为属于本发明的保护范围。
Claims
1、 一种柔性电路板与印刷电路板组件的压合方法， 包括步骤：
A: 在印刷电路板组件与柔性电路板的压合区域的一侧或两侧设置避空槽， B:使用高温压合刀头将所述柔性电路板与所述印刷电路板组件压合使二者 连接于所述压合区域。
2、 如权利要求 1所述的柔性电路板与印刷电路板组件的压合方法， 所述步 骤 A中， 相邻的两个压合区域之间设置一个或多个避空槽。
3、 如权利要求 2所述的柔性电路板与印刷电路板组件的压合方法， 相邻的 两个压合区域之间仅设置一个避空槽， 所述避空槽起始于一个压合区域的边界 并终结于另一个压合区域的边界。
4、 一种液晶显示装置， 包括驱动印刷电路板组件以及柔性电路板， 所述驱 动印刷电路板组件上与所述柔性电路板压合的压合区域的一侧或两侧设置有避 空槽。
5、 如权利要求 4所述的液晶显示装置， 相邻的两个压合区域之间设置有一 个或多个避空槽。
6、 如权利要求 5所述的液晶显示装置， 相邻的两个压合区域之间仅设置一 个避空槽， 所述避空槽起始于一个压合区域的边界并终结于另一个压合区域的 边界。
7、 一种用于与柔性电路板连接的印刷电路板， 包括与柔性电路板压合的压 合区域， 所述压合区域的一侧或两侧设置有避空槽。
8、 如权利要求 7所述的用于与柔性电路板连接的印刷电路板， 所述印刷电 路板的每个压合区域的两侧皆设有避空槽， 所述每个避空槽皆终结于相邻的压 合区域的边界。
9、 如权利要求 7所述的用于与柔性电路板连接的印刷电路板， 相邻的两个 压合区域之间设置有一个或多个避空槽。
10、 如权利要求 9所述的用于与柔性电路板连接的印刷电路板， 相邻的两 个压合区域之间仅设置一个避空槽， 所述避空槽起始于一个压合区域的边界并 终结于另一个压合区域的边界。
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| KR102005426B1 (ko) * | 2013-05-09 | 2019-07-31 | 삼성디스플레이 주식회사 | 연성회로기판의 접합 방법, 패널 및 연성회로기판 조립체 및 이를 구비한 디스플레이 장치 |
| CN103424905B (zh) * | 2013-07-10 | 2016-02-10 | 友达光电（苏州）有限公司 | 显示模组 |
| CN108037604A (zh) * | 2017-12-15 | 2018-05-15 | 北海星沅电子科技有限公司 | 一种pcb压合方法 |
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