WO2014030326A1 - 部品実装装置及び部品実装方法 - Google Patents

部品実装装置及び部品実装方法 Download PDF

Info

Publication number
WO2014030326A1
WO2014030326A1 PCT/JP2013/004879 JP2013004879W WO2014030326A1 WO 2014030326 A1 WO2014030326 A1 WO 2014030326A1 JP 2013004879 W JP2013004879 W JP 2013004879W WO 2014030326 A1 WO2014030326 A1 WO 2014030326A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
component
unit
mounting
component mounting
Prior art date
Application number
PCT/JP2013/004879
Other languages
English (en)
French (fr)
Inventor
味村　好裕
隆二 浜田
明 亀田
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012182911A external-priority patent/JP5834212B2/ja
Priority claimed from JP2012192890A external-priority patent/JP5845417B2/ja
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to CN201380044132.8A priority Critical patent/CN104584712B/zh
Priority to US14/422,512 priority patent/US9780514B2/en
Publication of WO2014030326A1 publication Critical patent/WO2014030326A1/ja

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048—Crimping apparatus or processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
    • H01L2224/2733—Manufacturing methods by local deposition of the material of the layer connector in solid form
    • H01L2224/27334—Manufacturing methods by local deposition of the material of the layer connector in solid form using preformed layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32104—Disposition relative to the bonding area, e.g. bond pad
    • H01L2224/32105—Disposition relative to the bonding area, e.g. bond pad the layer connector connecting bonding areas being not aligned with respect to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/756—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/75621—Holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7565—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75701—Means for aligning in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75702—Means for aligning in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75754—Guiding structures
    • H01L2224/75755—Guiding structures in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/758—Means for moving parts
    • H01L2224/75801—Lower part of the bonding apparatus, e.g. XY table
    • H01L2224/75804—Translational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/759—Means for monitoring the connection process
    • H01L2224/75901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/83132—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed outside the semiconductor or solid-state body, i.e. "off-chip"
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Definitions

  • the present invention relates to a component mounting apparatus and a component mounting method for manufacturing a substrate such as a liquid crystal panel substrate by mounting the component on the substrate and then pressing the component onto the substrate.
  • an ACF adhering operation unit for adhering a tape-shaped ACF (Anisotropic Conductive Film) as an adhesive member to an end of the substrate, and an ACF tape for the substrate have been adhered
  • the ACF adhering work unit, the component mounting work unit, the first component crimping work unit, and the second component crimping work unit are arranged along the flow of the substrate. They are arranged in order (for example, refer to Patent Document 1). Then, the transfer of the substrate between the work steps is performed by a substrate transfer means such as an arm device having a substrate suction portion at the tip, and the processing can be advanced while the substrate is transferred between the work steps.
  • a substrate transfer means such as an arm device having a substrate suction portion at the tip
  • the conventional component mounting apparatus includes a type in which components are attached only to one side of the board.
  • the first component crimping operation unit and the second component crimping operation unit perform the same operation. Therefore, the substrate on which the component is mounted is subjected to the component crimping operation for each side of the substrate in the first component crimping working unit or the second component crimping working unit.
  • an object of the present invention is to provide a component mounting apparatus and a component mounting method that can shift to a component crimping operation without dropping a component mounted on a substrate.
  • the component mounting apparatus is provided with a component mounting operation unit that performs a component mounting operation on a board, and a position that sandwiches the component mounting operation unit from both sides.
  • the first component crimping operation unit and the second component crimping operation unit for crimping the component mounted on the board by the component mounting operation unit, the component mounting operation unit, and the first component crimping operation.
  • the substrate is transferred to the component mounting operation unit in a state where the substrate is placed on a substrate mounting stage, and the component is mounted on the substrate by the component mounting operation unit. After the mounting operation is performed, the substrate that has been placed on the substrate mounting stage is transferred to the first component crimping operation unit by moving to the first component crimping operation unit side.
  • First substrate transfer means for Between the component mounting operation unit and the second component crimping operation unit, a horizontal movement is provided, and the substrate is transferred to the component mounting operation unit while the substrate is placed on the substrate mounting stage. After the component mounting operation is performed on the substrate by the component mounting operation unit, the component mounting operation unit moves to the second component crimping operation unit side and remains mounted on the substrate mounting stage. Second board transfer means for transferring the board to the second component crimping operation section.
  • an adhesive member is provided at a location where the component is mounted by the substrate holding portion that holds the substrate carried in from the outside, and the component mounting operation portion of the substrate held by the substrate holding portion.
  • Adhering member adhering operation part for adhering, and the substrate mounting stage provided in the first substrate transferring means and the second substrate, wherein the substrate on which the adhering member is adhered by the adhesive member adhering operation part is provided.
  • Substrate transfer means for distributing and placing on the substrate placement stage provided in the transfer means.
  • the substrate transfer unit receives the substrate, on which the component is bonded by the first component bonding operation unit, from the substrate mounting stage included in the first substrate transfer unit.
  • the substrate on which the component has been crimped by the second component crimping operation unit is received from the substrate mounting stage provided in the second substrate transfer means, and the substrate is transferred to the substrate unloading unit.
  • the component mounting operation unit performs the mounting operation of the component on the substrate transferred by the first substrate transfer unit or the substrate transferred by the second substrate transfer unit.
  • a position recognition means for recognizing the position of the substrate with respect to the substrate placement stage provided in the first substrate transfer means or recognizing the position of the substrate with respect to the substrate placement stage provided in the second substrate transfer means is provided. .
  • the component mounted on the substrate by the component mounting operation unit has a film-like portion that protrudes outside the substrate in a state of being mounted on the substrate, and the first substrate transfer
  • the substrate placement stage included in the means and the substrate placement stage included in the second substrate transfer means include a film-like portion support portion that supports the film-like portion from below in a state where the component is mounted on the substrate.
  • the component mounting apparatus of the present invention comprises information acquisition means for recognizing the board placed on the board placement stage by recognition means and obtaining information regarding the position of the board, wherein the first board transfer means is Then, by moving the substrate mounting stage based on the information acquired by the information acquisition means, positioning of the substrate with respect to the component mounting working unit and positioning of the substrate with respect to the first component crimping working unit are performed. Do.
  • the first board transfer unit stores the information acquired by the information acquisition unit in a storage unit, and stores the positioning of the board with respect to the first component crimping unit. This is performed based on the information stored in the section.
  • the component mounting method includes a component mounting operation unit in which a component mounting operation is performed on a board and a position sandwiching the component mounting operation unit from both sides, and the component mounting operation is performed in the component mounting operation unit.
  • the first component crimping working unit and the second component crimping working unit for crimping the component mounted by the component mounting working unit on the board, and the component mounting working unit and the first component crimping A first substrate transfer means provided movably in the horizontal direction between the working parts, and a second board movably provided in the horizontal direction between the component mounting work part and the second component crimping work part.
  • a component mounting method using a component mounting apparatus including a substrate transfer unit, wherein the substrate is transferred to the component mounting operation unit in a state where the substrate is mounted on a substrate mounting stage included in the first substrate transfer unit.
  • the component mounting work unit After performing the mounting operation of the component on the substrate, the first substrate transfer means is moved to the first component crimping operation side and is mounted on the substrate mounting stage.
  • the substrate is transferred to the component mounting operation unit in a state where the component is placed, and after the component mounting operation unit performs the component mounting operation on the substrate, the second substrate transfer means is moved to the second substrate transfer unit.
  • the substrate that has been moved to the component crimping operation part and is still placed on the substrate mounting stage is transferred to the second component crimping operation unit, and the substrate is moved by the second component crimping operation unit. And crimping the component to No.
  • the information acquisition step of recognizing the substrate placed on the substrate placement stage and obtaining information on the position of the substrate, and the information obtained in the information acquisition step A first substrate positioning step of positioning the substrate with respect to the component mounting operation unit by moving the substrate mounting stage, and after the component mounting operation step, the substrate mounting stage is moved to the first component crimping operation.
  • the substrate is transferred to the component mounting operation section while being mounted on the substrate mounting stage provided in the first substrate transfer means or the second substrate transfer means, and the component mounting operation is performed. After the work, it is transferred to the first component crimping work section or the second component crimping work section while being placed on the substrate placing stage, and the parts are crimped there.
  • the substrate transfer means does not change the substrate, so that it is possible to shift to the component crimping operation without dropping the component mounted on the substrate.
  • the top view of the component mounting apparatus in one embodiment of this invention The figure which shows the advancing procedure of the component mounting operation
  • the block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention (A), (b) is a perspective view of the ACF sticking operation
  • (A), (b), (c) is a figure which shows the execution procedure of the sticking operation
  • (A), (b) is a perspective view of the component mounting operation part and the center board
  • work part in one embodiment of this invention (A), (b), (c) is a figure which shows the execution procedure of the component mounting operation
  • (A), (b), (c) is a figure which shows the execution procedure of the component mounting operation
  • FIG. 1 is the 1st component crimping operation part (2nd component crimping operation part) and the left board
  • Perspective view (A), (b), (c) is a figure which shows the execution procedure of the component crimping operation
  • the flowchart which shows the procedure of the component crimping operation which the component mounting apparatus in one embodiment of this invention performs is a figure which shows the execution procedure of the component crimping operation
  • substrate transfer part in one embodiment of this invention The fragmentary top view of the component mounting apparatus in one embodiment of this invention (A), (b), (c) is a figure which shows the execution procedure of the component mounting operation
  • (A), (b), (c) is a figure which shows the execution procedure of the component mounting operation
  • (A), (b), (c) is a figure which shows the execution procedure of the component mounting operation
  • (A), (b), (c) is a figure which shows the execution procedure of the component mounting operation
  • (A), (b), (c) is a figure which shows the execution procedure of the component mounting operation
  • (A), (b) is a figure which shows the execution procedure of the component mounting operation
  • a component mounting apparatus 1 for manufacturing a liquid crystal panel substrate shown in FIG. 1 has an ACF tape as an adhesive member on an electrode portion 2a provided at one end of four sides of a rectangular panel-like substrate 2 shown in FIG. After attaching 3, the component 4 is mounted on the attached ACF tape 3 (preliminary pressure bonding) and then pressure bonded (main pressure bonding), thereby performing the component mounting operation for mounting the component 4 on the substrate 2.
  • the component 4 used here is, for example, a drive circuit component and has a film-like portion 4a.
  • a base 11 of the component mounting apparatus 1 includes a left base 11 a and a center base from the left in the left-right direction as viewed from the operator OP (the left-right direction in FIG. 1 and the X-axis direction). 11b and the right base 11c are arranged in this order.
  • the left base 11a has a carry-in board placement unit 21, the central base 11b has a component mounting execution part 22, and the right base 11c has a carry-out board placement. Placement portions 23 are provided.
  • the operations of the carry-in substrate placement unit 21, the component mounting execution unit 22, and the carry-out substrate placement unit 23 are controlled by a control device 24 (FIG. 3) as control means.
  • Substrate 2 flows in the X-axis direction from the left side to the right side, that is, the carry-in board placement unit 21, the component mounting execution unit 22, and the carry-out board placement unit 23 in this order, and the work is sequentially performed.
  • the carry-in substrate placement unit 21 has two substrate placement stages 21s on the left side (upstream process side) and the right side (downstream process side). These two substrate mounting stages 21 s are provided so as to be movable up and down with respect to the left base 11 a, and the substrate 2 sent from the upstream process side of the component mounting apparatus 1 is placed on the two substrate mounting stages 21 s. Placed.
  • the component mounting execution unit 22 performs an operation of attaching the ACF tape 3 that is an adhesive member to the substrate 2, an ACF attaching operation portion (adhesive member attaching operation portion) 22 a, and an operation of mounting the component 4 on the substrate 2.
  • the ACF attaching work part 22a is provided in the left area of the central base 11b, and the component mounting work part 22b is provided in the central area of the central base 11b.
  • the first component crimping work part 22c is provided in a region between the ACF adhering work part 22a and the component mounting work part 22b on the central base 11b, and the second component crimping work part 22d is the central base. It is provided in the area on the right side of the component mounting work part 22b on 11b. That is, in the component mounting apparatus 1 according to the present embodiment, the first component crimping work part 22c and the second component crimping work part 22d are provided at positions sandwiching the component mounting work part 22b from the left and right sides.
  • a first base portion 31 is provided in the front area of the ACF attaching work portion 22a on the central base 11b (the front-rear direction viewed from the operator OP is the Y-axis direction).
  • a second base portion 32 is provided extending in the X-axis direction in the front region of the component mounting operation portion 22b, the first component crimping operation portion 22c, and the second component crimping operation portion 22d.
  • the first base portion 31 is provided with a left substrate transfer portion 33L.
  • the left substrate transfer portion 33L is provided on the first base portion 31 so as to extend in the Y-axis direction, and is provided on the first base portion 31 so as to be movable in the X-axis direction.
  • the moving stage 35 is provided so as to be movable in the Y-axis direction on the Y-axis table 34, and two substrate mounting stages 36 provided side by side in the X-axis direction on the upper surface of the moving stage 35. On the two substrate placement stages 36, the two substrates 2 are transferred and held from the two substrate placement stages 21s of the carry-in substrate placement portion 21.
  • the two substrate mounting stages 36 are provided so as to be movable up and down with respect to the moving stage 35.
  • the control device 24 moves the moving stage 35 in the Y-axis direction with respect to the Y-axis table 34 to transfer the substrate 2.
  • the two substrate placement stages 36 are moved up and down to raise and lower the two substrates 2 placed on the two substrate placement stages 36.
  • the ACF adhering work part 22a includes two adhering heads 41 arranged in the X-axis direction above the central base 11b, and the adhering heads 41.
  • Two backup stages 42 for attaching ACF are provided below and extending in the X-axis direction.
  • Each of the two sticking heads 41 feeds and feeds the ACF tape 3, cuts the fed ACF tape 3 into a predetermined length, and holds it in a horizontal position at a predetermined position, and a tape supply
  • a sticking tool 41b for pressing the ACF tape 3 held in a horizontal posture by the part 41a from above onto the backup stage 42 side for ACF sticking work is provided.
  • the control device 24 moves the moving stage 35 of the left substrate transfer part 33L on the Y-axis table 34 to the “substrate delivery position” (FIG. 4A) set to the front and the “work position” set to the rear (see FIG. 4A). 4 (b)).
  • the “substrate delivery position” is a position where the substrate 2 can be delivered to the two substrate placement stages 36
  • the “working position” is the two sheets placed on the two substrate placement stages 36. This is a position where the electrode portions 2a of the respective substrates 2 can be positioned above the two backup stages 42 for attaching the ACF.
  • the control device 24 operates the tape supply unit 41a to position the ACF tape 3 in a state cut to a predetermined length above the substrate 2 (electrode unit 2a).
  • the sticking tool 41b is lowered to press the ACF tape 3 together with the substrate 2 against the backup stage 42 for the ACF sticking work.
  • the sticking tool 41 b is raised with respect to the substrate 2. As a result, the ACF tape 3 having a predetermined length is attached to the substrate 2.
  • the second base portion 32 is provided with a central substrate transfer portion 33C and a right substrate transfer portion 33R.
  • the central substrate transfer unit 33C and the right substrate transfer unit 33R are the same type, and the central substrate transfer unit 33C is located to the left of the right substrate transfer unit 33R.
  • the central substrate transfer portion 33C (same as the right substrate transfer portion 33R) is provided to be movable in the X-axis direction along the second base portion 32, as shown in FIGS. 6 (a) and 6 (b).
  • the two substrate placement stages 53 can move in the horizontal direction by moving the Y-axis table 51 in the X-axis direction with respect to the second base portion 32 and moving the moving stage 52 with respect to the Y-axis table 51.
  • the two substrates 2 are transferred from the left substrate transfer part 33L.
  • the two substrate mounting stages 53 are provided so as to be movable up and down with respect to the moving stage 52, respectively.
  • the control device 24 moves the Y-axis table 51 in the X-axis direction with respect to the second base portion 32 and moves the moving stage 52 in the Y-axis direction with respect to the Y-axis table 51 to place the two substrate placement stages 53 in a horizontal plane.
  • the substrate 2 is transferred by moving inward, the two substrate placement stages 53 are moved up and down (FIG. 3), and the two substrates 2 placed on the two substrate placement stages 53 are moved up and down.
  • the landing / separation is made with respect to the upper surface of the backup stage 64.
  • the component mounting work unit 22b is provided to project rearward from the rear portion of the central base 11b and supply the component 4, and the central base unit 61b.
  • a central portion of the mounting head 63 and the second base portion 32 that is movable in a horizontal plane by a mounting head moving mechanism 62 provided at the center rear portion of the table 11b and sucks the component 4 supplied by the component supply unit 61 from above.
  • a backup stage 64 for component mounting work provided in the rear region in the Y-axis direction is provided.
  • the control device 24 controls the supply operation of the component 4 by the component supply unit 61, the movement operation of the mounting head 63 in the horizontal plane by the operation of the mounting head moving mechanism 62, and the suction operation of the component 4 by the mounting head 63. Thereby, a series of operations from adsorption (pickup) of the component 4 by the mounting head 63 to mounting of the component 4 on the substrate 2 is performed (FIG. 3).
  • two position recognition cameras 65 with the imaging visual field facing upward are provided side by side in the X-axis direction. These two position recognition cameras 65 are controlled by the control device 24 to perform an imaging operation, and the parts are passed through a transparent material part 64a (FIG. 6A) such as quartz glass provided on the upper part of the backup stage 64 for mounting parts. An object located above the mounting backup stage 64 is imaged.
  • a transparent material part 64a such as quartz glass
  • the control device 24 sets the moving stage 52 of the central substrate transfer unit 33C to the “substrate transfer position” (FIG. 6A) set in front of the Y-axis table 51 and the “work position” set in the rear (FIG. 6). 6 (b)).
  • the “substrate delivery position” is a position where the substrate 2 can be delivered to the two substrate placement stages 53.
  • the “working position” indicates that the ACF tape 3 attached to the electrode portion 2a of the substrate 2 placed on the two substrate placement stages 53 is positioned above the backup stage 64 for component placement work (further, component crimping described later). This is a position that can be positioned above the work backup stage 72.
  • Step ST1 shown in the flowchart of FIG. 7
  • the two position recognition cameras 65 image and recognize two position recognition marks m (FIG. 2) of the board 2 positioned above the component mounting backup stage 64 (FIG. 8A).
  • step ST2 information acquisition step.
  • the position correction amount data of the substrate 2 held on the substrate placement stage 53 on the left side of the central substrate transfer unit 33C with respect to the substrate placement stage 53 is information on the position of the substrate 2 in the first of the storage unit 24a. It is stored in the correction data storage area KR1. Similarly, the position correction amount data for the substrate 2 held on the substrate placement stage 53 on the right side of the central substrate transfer unit 33C is stored in the second correction data storage area KR2. Further, the position correction amount data of the substrate 2 held on the left substrate placement stage 53 of the right substrate transfer unit 33R with respect to the substrate placement stage 53 is stored in the third correction data storage area KR3, and the right substrate placement stage 53R. The position correction data for the substrate 2 held on the mounting stage 53 is stored in the fourth correction data storage area KR4.
  • control stage 24 When the control device 24 (component mounting operation control unit SR1) finishes the information acquisition process, the control stage 24 temporarily moves the moving stage 52 forward to move the electrode unit 2a of the substrate 2 from the upper position (mounting operation position) of the backup stage 64. Then, the mounting head 63 is lowered, and the component 4 is moved to the backup stage 64 (to the position recognition camera 65 side) (to the mounting work position) (step ST3). Step ST4). Then, a position recognition mark (not shown) of the component 4 is picked up and recognized by the two position recognition cameras 65 (FIG. 8C), and information on the position of the component 4 (position information of the component 4 with respect to the mounting head 63). Is calculated (acquired), the position correction amount of the component 4 is obtained, and the result is stored in the storage unit 24a (step ST5).
  • the control device 24 After storing the position information of the substrate 2 and the position information of the component 4 in the storage unit 24a as described above, the control device 24 (the component mounting operation control unit SR1) raises the mounting head 63 (FIG. 9 ( a)) The moving stage 52 is positioned again at the “working position”.
  • the central substrate transfer part 33C is controlled so that the electrode part 2a on the substrate 2 side is vertically aligned, and the substrate 2 is positioned with respect to the component mounting work part 22b (directly with respect to the component 4) ( 9B, a first substrate positioning step, step ST6).
  • the position recognition camera 65 included in the component mounting operation unit 22b of the component mounting apparatus 1 is the substrate 2 transferred by the central substrate transfer unit 33C or the substrate transferred by the right substrate transfer unit 33R. 2, the position recognition of the substrate 2 with respect to the substrate placement stage 53 provided in the central substrate transfer unit 33 ⁇ / b> C or the position recognition of the substrate 2 with respect to the substrate placement stage 53 provided in the right substrate transfer unit 33 ⁇ / b> R is performed. It is a position recognition means for performing.
  • step ST7 Component mounting step, step ST7.
  • the pressing force of the mounting head 63 at this time is supported by the backup stage 64 for mounting components.
  • the control device 24 raises the mounting head 63 (step ST8).
  • each of the two substrate placement stages 53 provided in the central substrate transfer portion 33C (the same applies to the right substrate transfer portion 33R) has a horizontal portion 54a extending behind the substrate placement stage 53 in the X-axis direction.
  • a frame-like film-shaped partial support portion 54 is provided. As shown in FIG. 2 and the like, the component 4 mounted on the substrate 2 by the component mounting operation unit 22 b protrudes from the substrate 2 in the state where the component 4 is mounted on the substrate 2.
  • the film-like portion support portion 54 is provided on each substrate mounting stage 53, the film-like portion 4 a of the component 4 protruding from the substrate 2 in a state where the component 4 is mounted on the substrate 2. Is supported from below by the horizontal part 54a of the film-like part support part 54. Thereby, it is prevented that the film-like part 4a of the component 4 in the state mounted on the board
  • substrate 2 will be in the state hung down below.
  • the first component crimping work part 22c (same as the second component crimping work part 22d) includes two pieces arranged side by side in the X-axis direction.
  • a crimping head 71 and two backup stages 72 for crimping the two components provided below the respective crimping heads 71 in the Y-axis direction are provided.
  • the component crimping operation control unit SR2 (FIG. 3) of the control device 24 controls the ascending and descending operations of the crimping head 71 provided in the first component crimping operation unit 22c and the crimping head 71 provided in the second component crimping operation unit 22d. ( Figure 3).
  • the control device 24 finishes the mounting operation of the component 4 by the mounting head 63 on the two substrates 2 mounted on the two substrate mounting stages 53 provided in the central substrate transfer unit 33C. Then, the Y-axis table 51 is moved to the left along the second base portion 32 (that is, in the horizontal direction toward the first component crimping work portion 22c) and placed on the two substrate placement stages 53. The portion of each of the two substrates 2 to which the respective ACF tapes 3 are adhered is positioned above the backup stage 72 for two component crimping operations (below the two crimping heads 71) (FIG. 10A). .
  • the substrate mounting stage 53 is moved based on the information regarding the position of the substrate 2 stored in the storage unit 24a, and the substrate 2 is positioned with respect to the first component crimping operation unit 22c (FIG. 10A).
  • Second substrate positioning step Specifically, the substrate 2 held on the left substrate placement stage 53 is positioned using the position correction amount data read from the first correction data storage area KR1, and the right substrate placement stage 53 is loaded. The held substrate 2 is positioned using the position correction amount data read from the second correction data storage area KR2. Then, the two crimping heads 71 provided in the first component crimping work unit 22c are sequentially lowered, and the component 4 mounted by the component mounting work unit 22b is crimped to the two substrates 2 (FIG. 11A ⁇ FIG. 11). 11 (b) ⁇ FIG. 11 (c) Component crimping process.
  • control device 24 performs component 4 by the mounting head 63 on the two substrates 2 placed on the two substrate placement stages 53 provided in the right substrate transfer unit 33R.
  • the Y-axis table 51 is moved to the right (that is, the second component crimping operation portion 22d side) along the second base portion 32 as it is and placed on the two substrate placement stages 53.
  • the part on which the component 4 of the two substrates 2 placed is mounted is positioned above the backup stage 72 for two component crimping operations (below the two crimping heads 71) (FIG. 10A).
  • the substrate mounting stage 53 is moved based on the information related to the position of the substrate 2 acquired in the information acquisition step described above, and the substrate 2 is positioned with respect to the second component crimping work part 22d (FIG. 10A).
  • Second substrate positioning step Specifically, the substrate 2 held on the left substrate placement stage 53 is positioned using the position correction amount data read from the third correction data storage area KR3, and the right substrate placement stage 53 is loaded. The held substrate 2 is positioned using the position correction amount data read from the fourth correction data storage area KR4. Then, the two crimping heads 71 provided in the second component crimping work unit 22d are sequentially lowered, and the component 4 mounted by the component mounting work unit 22b is crimped to the two substrates 2 (FIG. 11A ⁇ FIG. 11). 11 (b) ⁇ FIG. 11 (c) Component crimping process.
  • the control device 24 positions a portion where the components 4 of the two substrates 2 placed on the two substrate placement stages 53 are mounted above the backup stage 72 (FIG. Step ST11 shown in the flowchart of FIG. At this time, information on the position of the substrate 2 (left substrate placement stage 53) acquired in the above-described component mounting operation and stored in the first correction data storage region KR1 (or the third correction data storage region KR3) of the storage unit 24a.
  • the moving stage 52 is moved on the basis of the position correction amount data of the substrate 2 held in (1). Thereby, one (here, the left side) board
  • step ST12 In this state, the left pressure bonding head 71 is lowered to clamp the substrate 2 between the backup stage 72 and the pressure bonding head 71, and the component 4 is pressure bonded to the left substrate 2 (FIG. 13B). Step ST13). Then, while the clamped state is maintained, the left substrate placement stage 53 is slightly lowered to release the support state of the substrate 2 by the substrate placement stage 53 (FIG. 13 (c), step ST14).
  • the moving stage 52 when the moving stage 52 can be moved independently of the left-side substrate 2, the second correction data storage area KR ⁇ b> 2 (or the fourth correction data storage area 24 a) is obtained in the same component mounting operation as described above.
  • the moving stage 52 is moved based on the information on the position of the substrate 2 stored in the correction data storage area KR4 (position correction amount data of the substrate 2 held on the right substrate mounting stage 53), and the other (here) Then, the substrate 2 on the right side is positioned with respect to the corresponding pressure bonding head 71 (step ST15).
  • Step ST16 After the component 4 is crimped to the right substrate 2, the control device 24 (component crimping operation control unit SR 2) raises the left substrate mounting stage 53 to support the substrate 2, and then the left crimping head. 71 is raised (FIG. 13 (e), step ST17), and then the right crimping head 71 is raised (FIG. 13 (f), step ST18). Thereby, the crimping operation of the component 4 to the two substrates 2 is completed.
  • control device 24 moves the moving stage 52 forward along the Y-axis table 51, and moves the moving stage 52. Is returned to the “board transfer position”.
  • the component mounting apparatus 1 includes the component mounting operation unit 22b that performs the mounting operation of the component 4 on the substrate 2, and the substrate 2 on which the mounting operation of the component 4 is performed in the component mounting operation unit 22b.
  • the first component crimping operation unit 22c and the second component crimping operation unit 22d for crimping the component 4 mounted in the component mounting operation unit 22b and the substrate 2 are held, and the component mounting operation unit 22b and the first component crimping operation are performed.
  • the substrate mounting stage 53 and the substrate mounting stage 53 that are movably provided between the component mounting unit 22c and the component mounting operation unit 22b and the second component crimping operation unit 22d are moved to the component mounting operation unit 22b.
  • the substrate mounting stage 53 is moved to the first component crimping operation unit 22c.
  • a control device 24 as a stage movement control means for moving the second component crimping work part 22d to position the substrate 2 relative to the first component crimping work part 22c or the second component crimping work part 22d. It has become.
  • the control device 24 also functions as information acquisition means for recognizing the substrate 2 placed on the substrate placement stage 53 by the recognition means and obtaining information relating to the position of the substrate 2, and controls as stage movement control means.
  • the apparatus 24 moves the substrate mounting stage 53 based on the information (information relating to the position of the substrate 2) acquired as information acquisition means, thereby positioning the substrate 2 with respect to the component mounting operation unit 22b and the first component crimping.
  • the substrate 2 is positioned with respect to the working part 22c or the second component crimping working part 22d.
  • the positioning of the crimping head 71 with respect to the substrates 2 placed on the two substrate placement stages 53 and the crimping of the component 4 by the crimping head 71 are not performed individually on the left and right substrates 2 as described above, but at the same time. You may go. In that case, the average value of the positional deviation of the left substrate 2 relative to the left substrate placement stage 53 and the positional deviation of the right substrate 2 relative to the right substrate placement stage 53 obtained in the component mounting operation is calculated, The right substrate mounting stage 53 is simultaneously positioned with respect to the corresponding pressure bonding head 71. Thereafter, the component 4 is simultaneously crimped to the substrate 2 by the crimping head 71. In this case, the tact time can be shortened although the positioning accuracy is slightly lowered as compared with the individual positioning.
  • the carry-out substrate placement unit 23 has two substrate placement stages 23 s on the left side (upstream process side) and the right side (downstream process side). These two left and right substrate mounting stages 23s are provided so as to be movable up and down with respect to the right base 11c, and the first component pressing operation portion 22c or the second component pressing operation is provided on the two substrate mounting stages 23s. Two substrates 2 on which the crimping operation of the component 4 has been completed in the part 22d are placed. The two substrates 2 placed on the two substrate placement stages 23 s are sent to another device provided on the lower side of the component mounting apparatus 1 by a substrate unloading means (not shown).
  • a moving base 81 extending in the X-axis direction is provided in the front region of the base 11 over the left base 11a, the central base 11b, and the right base 11c.
  • On the moving base 81 there are provided three substrate transfer portions 82, a left substrate transfer portion 82a, a central substrate transfer portion 82b, and a right substrate transfer portion 82c in order from the left.
  • each substrate transfer unit 82 includes a base 91 provided so as to be movable in the X-axis direction with respect to the moving base 81 and two arm units 92 provided on the base 91.
  • Each arm unit 92 includes an arm base 93 fixed to the base portion 91 and two arms 94 provided to extend horizontally rearward from the arm base 93.
  • Each arm 94 is provided with a plurality of suction pads 95 with suction surfaces facing downward.
  • Each arm unit 92 can vacuum-suck a single substrate 2 through a total of four suction pads 95 provided on the two arms 94.
  • the control device 24 keeps the suction pads 95 of the two arms 94 positioned above the substrate 2.
  • the mounting stage 21s is moved up and down.
  • the control device 24 lifts and lowers the substrate mounting stage 36 with the suction pads 95 of the two arms 94 positioned above the substrate 2.
  • the arm unit 92 receives the substrate 2 on the substrate placement stage 53 of the central substrate transfer unit 33C or the right substrate transfer unit 33R, or the substrate 2 adsorbed by the arm unit 92 is placed on the substrate placement stage 53.
  • the control device 24 raises and lowers the substrate placement stage 53 with the suction pads 95 of the two arms 94 positioned above the substrate 2.
  • the controller 24 moves the left substrate transfer unit 82a, the central substrate transfer unit 82b, and the right substrate transfer unit 82c in the X-axis direction along the movement base 81, and suction pads in each arm unit 92.
  • substrate 2 through 95 is controlled (FIG. 3).
  • the control device 24 operates the left substrate transfer unit 82a to transfer the substrate 2 from the carry-in substrate mounting unit 21 to the left substrate transfer unit 33L, and operates the central substrate transfer unit 82b. Then, the substrate 2 is transferred from the left substrate transfer unit 33L to the central substrate transfer unit 33C or the right substrate transfer unit 33R.
  • the two substrate placement stages 53 provided in the central substrate transfer portion 33C and the two substrate placement stages 53 provided in the right substrate transfer portion 33R include the substrate 2 on which the ACF tape 3 is attached by the ACF attachment operation portion 22a. Sort and place.
  • the control device 24 operates the right substrate transfer unit 82c to transfer the substrate 2 from the central substrate transfer unit 33C or the right substrate transfer unit 33R to the carry-out substrate mounting unit 23.
  • the component mounting operation (component mounting method) by the component mounting apparatus 1 is a step of recognizing the substrate 2 held on the substrate mounting stage 53 and acquiring information on the position of the substrate 2 (described above).
  • Information acquisition step the step of positioning the substrate 2 with respect to the component mounting work unit 22b by moving the substrate mounting stage 53 based on the information on the position of the substrate 2 acquired in the information acquisition step (the above-mentioned first information acquisition step).
  • the substrate mounting stage 53 is moved to the first component crimping operation unit 22c or the second component crimping operation unit 22d, and is moved to the position of the substrate 2 acquired in the information acquisition process.
  • the step of positioning the substrate 2 with respect to the first component crimping work part 22c or the second component crimping work unit 22d by moving the substrate mounting stage 53 based on the information to be performed (the aforementioned second substrate positioning step).
  • the control device 24 has, as positions that can be taken by the three substrate transfer units 82, a front position (first position P ⁇ b> 1) of the carry-in substrate mounting unit 21, and a front position of the ACF attaching work unit 22 a. (Second position P2), the front position of the first component crimping work section 22c (third position P3), the front position of the component mounting work section 22b (fourth position P4), the front of the second component crimping work section 22d. The position (fifth position P5) and the front position (sixth position P6) of the carry-out substrate placement part 23 are determined.
  • the control device 24 When performing the mounting operation of the component 4 on the board 2, the control device 24 first sets the left board transfer part 82a to the first position P1, the center board transfer part 82b to the second position P2, and the right side.
  • the substrate transfer unit 82c is positioned at the fourth position P4, the central substrate transfer unit 33C is positioned in front of the component mounting operation unit 22b, and the right substrate transfer unit 33R is positioned in front of the second component crimping operation unit 22d.
  • the left substrate transfer unit 82a receives the two substrates 2 carried in from the upstream process side apparatus and placed on the carry-in substrate placement unit 21 (FIG. 16A).
  • the control device 24 When receiving the two substrates 2 from the carry-in substrate platform 21 by the left substrate transfer unit 82a, the control device 24 sets the left substrate transfer unit 82a to the second position P2 and the central substrate transfer unit 82b. By positioning the right substrate transfer unit 82c at the fourth position P4 at the sixth position P6, the two substrates 2 received by the left substrate transfer unit 82a are transferred to the two substrates of the left substrate transfer unit 33L. Transfer to the mounting stage 36 (FIG. 16B). Then, the moving stage 35 of the left substrate transfer unit 33L is moved to the “working position”, and the ACF adhering operation to the two substrates 2 by the ACF adhering operation unit 22a is executed (FIG. 16C). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.
  • the control device 24 When the control device 24 performs the ACF attaching operation to the two substrates 2 by the ACF attaching operation portion 22a, the control device 24 moves the moving stage 35 of the ACF left substrate transfer portion 33L to the “substrate delivery position”, and then to the left
  • the substrate transfer unit 82a is positioned at the first position P1
  • the central substrate transfer unit 82b is positioned at the second position P2
  • the right substrate transfer unit 82c is positioned at the fourth position P4. Then, the two substrates 2 on the carry-in substrate placement unit 21 are received by the left substrate transfer unit 82a, and the two substrates 2 on the left substrate transfer unit 33L are received by the central substrate transfer unit 82b ( FIG. 17 (a)).
  • the control device 24 receives the two substrates 2 from the carry-in substrate placement unit 21 by the left substrate transfer unit 82a, and receives the two substrates 2 on the left substrate transfer unit 33L by the central substrate transfer unit 82b. Then, the left substrate transfer section 82a is positioned at the second position P2, the central substrate transfer section 82b is positioned at the fourth position P4, and the right substrate transfer section 82c is positioned at the sixth position P6.
  • the two substrates 2 received by the transfer unit 82a are placed on the two substrate placement stages 36 of the left substrate transfer unit 33L, and the two substrates 2 received by the central substrate transfer unit 82b are transferred to the central substrate. Placed on the two substrate placement stages 53 of the section 33C (FIG. 17B).
  • control device 24 positions the moving stage 35 of the left substrate transfer unit 33L at the “working position” and executes the ACF adhering operation to the two substrates 2 by the ACF adhering operation unit 22a, while the central substrate
  • the moving stage 52 of the transfer unit 33C is moved to the “working position” and the left substrate 2 of the two substrates 2 is positioned above the backup stage 64 for component mounting work (first transfer step).
  • a component mounting operation is performed on the left board 2 by the component mounting operation unit 22b (FIG. 17C, first component mounting operation step).
  • the control device 24 moves the central substrate transfer unit 33C to the left (second transfer step), and the two of the central substrate transfer unit 33C.
  • the right substrate 2 of the two substrates 2 placed on the substrate placement stage 53 is positioned above the backup stage 64 for component mounting work, and the right substrate 2 by the component mounting work unit 22b.
  • a component mounting operation is executed (FIG. 18A, second component mounting operation step). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.
  • the control device 24 moves the central substrate transfer unit 33C to the left (the first component crimping operation unit 22c side) as it is and moves it to the substrate mounting stage 53.
  • the substrate 2 that has been placed is transferred to the first component crimping work unit 22c (the moving process to the first component crimping work unit 22c), and 2 placed on the two substrate placing stages 53.
  • the two substrates 2 are positioned above the two component crimping work backup stages 72, and the component crimping operation is performed on the two substrates 2 by the first component crimping operation unit 22c (first component crimping operation).
  • the component crimping operation process by the part 22c (FIG. 18B).
  • the left substrate transfer portion 82a is positioned at the first position P1, and the two substrates 2 placed on the carry-in substrate placement portion 21 are moved by the left substrate transfer portion 82a.
  • the central substrate transfer unit 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer unit 33L being positioned at the “substrate transfer position”. The two substrates 2 on the substrate transfer unit 33L are received.
  • the right substrate transfer part 33R is positioned at the front position of the component mounting work part 22b, and the right substrate transfer part 82c is positioned at the fourth position P4 (FIG. 18B).
  • the control device 24 positions the right substrate transfer portion 82c at the sixth position P6, and then positions the central substrate transfer portion 82b at the fourth position P4, thereby moving the left substrate transfer portion.
  • the two substrates 2 received from 33L are transferred to the two substrate mounting stages 53 of the right substrate transfer unit 33R, and the left substrate transfer unit 82a is positioned at the second position P2, thereby loading the loaded substrate.
  • the two substrates 2 received from the unit 21 are transferred to the two substrate placement stages 36 of the left substrate transfer unit 33L (FIG. 18C).
  • the moving stage 35 of the left-side substrate transfer unit 33L is positioned at the “working position” and the ACF adhering work unit 22a. While the ACF attaching operation to the two substrates 2 is performed, the moving stage 52 of the right substrate transfer unit 33R is moved to the “operation position”, and the right substrate 2 of the two substrates 2 is mounted. By positioning it above the work backup stage 64 (third transfer step), the component mounting operation is performed on the right substrate 2 by the component mounting operation unit 22b (FIG. 19A). Mounting work process).
  • the control device 24 moves the right substrate transfer unit 33R to the right (fourth transfer step), Component mounting is performed by positioning the left substrate 2 of the two substrates 2 placed on the two substrate mounting stages 53 of the right substrate transfer unit 33R above the backup stage 64 for mounting components.
  • a component mounting operation is performed on the left substrate 2 by the working unit 22b (FIG. 19B, a fourth component mounting operation step). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.
  • the control device 24 moves the right substrate transfer unit 33R to the right (the second component crimping operation unit 22d side) as it is, and the substrate placement stage 53.
  • the substrate 2 that has been placed on the substrate 2 is transferred to the second component crimping working unit 22d (moving step to the second component crimping working unit 22d) and placed on the two substrate placing stages 53.
  • the two substrates 2 are positioned above the two component crimping work backup stages 72, and the component crimping operation is performed on the two substrates 2 by the second component crimping operation unit 22d (second component crimping operation).
  • Component crimping operation process by the working unit 22d (FIG. 19C).
  • the left substrate transfer unit 82a receives the two substrates 2 placed on the carry-in substrate mounting unit 21 with the left substrate transfer unit 82a positioned at the first position P1.
  • the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”, and the left substrate is moved by the central substrate transfer portion 82b.
  • the two substrates 2 on the transfer unit 33L are received.
  • the central substrate transfer unit 33C while moving the moving stage 52 of the central substrate transfer unit 33C to the “substrate delivery position”, the central substrate transfer unit 33C is positioned in front of the component mounting operation unit 22b and is positioned in front of the component mounting operation unit 22b.
  • the two substrates 2 on the central substrate transfer unit 33C are received by the right substrate transfer unit 82c (FIG. 19C).
  • the control device 24 positions the right substrate transfer portion 82c at the sixth position P6 to place the two substrates 2 on the carry-out substrate placement portion 23, while the central substrate transfer portion 82b. Is transferred to the fourth position P4, the two substrates 2 received from the left substrate transfer unit 33L are transferred to the two substrate placement stages 53 of the central substrate transfer unit 33C, and the left substrate transfer unit 82a. Is placed at the second position P2, and the two substrates 2 received from the carry-in substrate platform 21 are transferred to the two substrate platforms 36 of the left substrate transfer unit 33L (FIG. 20A). .
  • the moving stage 35 of the left substrate transfer unit 33L is positioned at the “working position” and the ACF adhering operation unit 22a performs the operation.
  • the moving stage 52 of the central substrate transfer unit 33C is positioned at the “operation position”, and the left substrate 2 of the two substrates 2 is mounted on the component. Is placed above the backup stage 64 (first transfer step), the component mounting operation is performed on the left substrate 2 by the component mounting operation unit 22b (FIG. 20B). Working process).
  • the control device 24 moves the central substrate transfer unit 33C to the left (second transfer process), Of the two substrates 2 placed on the two substrate placement stages 53 of the substrate transfer unit 33C, the right substrate 2 is positioned above the backup stage 64 for component placement work, and the component placement work unit A component mounting operation is performed on the right substrate 2 by 22b (FIG. 20 (c), second component mounting operation step). During this time, two new substrates 2 are placed (loaded in) on the carry-in substrate placement unit 21.
  • the control device 24 moves the central substrate transfer unit 33C to the left (the first component crimping operation unit 22c side) as it is and moves it to the substrate mounting stage 53.
  • the substrate 2 that has been placed is transferred to the first component crimping work unit 22c (the moving process to the first component crimping work unit 22c), and 2 placed on the two substrate placing stages 53.
  • the two substrates 2 are positioned above the two component crimping work backup stages 72, and the component crimping operation is performed on the two substrates 2 by the first component crimping operation unit 22c (first component crimping operation).
  • Component crimping work process by the part 22c (FIG. 21A).
  • the left substrate transfer unit 82a receives the two substrates 2 placed on the carry-in substrate mounting unit 21 with the left substrate transfer unit 82a positioned at the first position P1.
  • the central substrate transfer portion 82b is positioned at the second position P2 in accordance with the movement stage 35 of the left substrate transfer portion 33L being positioned at the “substrate transfer position”, and the left substrate is moved by the central substrate transfer portion 82b.
  • the two substrates 2 on the transfer unit 33L are received.
  • the right board transfer section 33R while moving the moving stage 52 of the right board transfer section 33R to the “board delivery position”, the right board transfer section 33R is positioned in front of the component mounting work section 22b, and is already positioned in front of the component mounting work section 22b.
  • the two substrates 2 on the right substrate transfer unit 33R are received by the right substrate transfer unit 82c (FIG. 21A).
  • the control device 24 positions the right substrate transfer portion 82c at the sixth position P6 to place the two substrates 2 on the carry-out substrate placement portion 23 and the central substrate transfer portion.
  • 82b is positioned at the fourth position P4, the two substrates 2 received from the left substrate transfer unit 33L are transferred to the two substrate placement stages 53 of the right substrate transfer unit 33R, and the left substrate transfer unit 82a is transferred.
  • the two substrates 2 received from the carry-in substrate platform 21 are transferred to the two substrate platforms 36 of the left substrate transfer unit 33L (FIG. 21B).
  • the component mounting apparatus 1 is provided at a position where the component mounting operation unit 22b for mounting the component 4 on the board 2 and the component mounting operation unit 22b are sandwiched from both sides.
  • the mounting work part 22b and the first component crimping work part 22c it is provided so as to be movable in the horizontal direction, and the substrate 2 is mounted on the component mounting work part 22b in a state where the substrate 2 is mounted on the substrate mounting stage 53.
  • a central substrate transfer unit 33C (first substrate transfer means) for transferring to the first component crimping operation unit 22c and a component mounting operation unit 22b and a second component crimping operation unit 22d are provided so as to be movable in the horizontal direction.
  • the substrate 2 is transferred to the component mounting operation unit 22b, and after the component mounting operation for mounting the component 4 on the substrate 2 is performed by the component mounting operation unit 22b,
  • the right substrate transfer unit 33R (the second substrate transfer unit 33R) moves to the second component crimping operation unit 22d and transfers the substrate 2 that has been placed on the substrate mounting stage 53 to the second component crimping operation unit 22d.
  • Substrate transfer means ).
  • the left substrate transfer unit 33L is a substrate holding unit that holds the substrate 2 carried in from the outside, and the ACF adhering work unit 22a is a component mounting operation of the substrate 2 held by the left substrate transfer unit 33L.
  • This is an adhesive member adhering operation unit for adhering the ACF tape 3 as an adhesive member to a place where the component 4 is mounted by the portion 22b.
  • the central substrate transfer unit 82b which is the substrate transfer unit 82, includes a substrate mounting stage 53 provided in the central substrate transfer unit 33C and the right side of the substrate 2 on which the ACF tape 3 is attached by the ACF attaching operation unit 22a.
  • the right substrate transfer unit 82c which is the substrate transfer unit 82, receives the substrate 2 on which the component 4 is bonded by the first component crimping operation unit 22c from the substrate mounting stage 53 provided in the central substrate transfer unit 33C.
  • the substrate 2 on which the component 4 is crimped by the second component crimping operation unit 22d is received from the substrate platform stage 53 provided in the right substrate transport unit 33R, and the substrate 2 is an unloading substrate platform that is a substrate unloading unit. Pass to 23.
  • the substrate mounting stage 53 recognizes the substrate 2 and acquires information related to the position of the substrate 2, and moves the substrate mounting stage 53 based on the information thus obtained, thereby moving the component mounting work unit. Both the positioning of the board 2 with respect to 22b and the positioning of the board 2 with respect to the component crimping work part (first component crimping work part 22c or second component crimping work part 22d) are performed. Thus, the number of times the substrate 2 is recognized can be reduced, and accordingly, the work process can be shortened and the productivity of the substrate 2 can be improved.
  • the recognition means for recognizing the substrate 2 is only required to recognize the substrate 2 by the component mounting work unit 22b, and the function as the stage movement control means of the substrate mounting stage 53 and the control device 24 is also the component mounting work unit. 22b and the component crimping unit (the first component crimping unit 22c or the second component crimping unit 22d) only need to be provided, so that the apparatus configuration can be simplified and the manufacturing cost can be reduced accordingly. Can also be planned.
  • the component mounting method by the component mounting apparatus 1 in the present embodiment is that the substrate 2 is placed in a state where the substrate 2 is placed on the substrate placement stage 53 provided in the central substrate transfer unit 33C (first substrate transfer means). Is transferred to the component mounting operation unit 22b (the first transfer step and the second transfer step described above), and the component 4 is mounted on the substrate 2 by the component mounting operation unit 22b (the first component described above). Mounting work process and second component mounting work process), the substrate 2 as it is placed on the substrate placing stage 53 by moving the central substrate transfer part 33C to the first component crimping work part 22c side.
  • Step of transferring to the first component crimping work part 22c (moving process to the first component crimping work part 22c described above), and crimping of the component 4 to the substrate 2 by the first component crimping work part 22c (described above) 1 parts crimping work part 22c Component mounting operation step), and the substrate 2 is transferred to the component mounting operation unit 22b in a state where the substrate 2 is mounted on the substrate mounting stage 53 provided in the right substrate transfer unit 33R (second substrate transfer means). Then, after mounting the component 4 on the substrate 2 by the component mounting operation unit 22b (the aforementioned third transfer step and fourth transfer step) (the above-described third component mounting operation step and fourth component).
  • the substrate 2 that has been placed on the substrate mounting stage 53 is moved to the second component crimping work portion 22d by moving the right substrate transfer portion 33R to the second component crimping work portion 22d side. 22d (moving step to the above-described second component crimping operation portion 22d), and a step of crimping the component 4 to the substrate 2 by the second component crimping operation portion 22d (the above-described second component crimping operation portion 22d).
  • Component crimping work process There.
  • the substrate 2 is provided in the central substrate transfer unit 33C (first substrate transfer unit) or the right substrate transfer unit 33R (second substrate transfer unit).
  • the component 4 is transferred to the component mounting operation unit 22b in a state of being mounted on the mounting stage 53, and the component 4 is mounted. After the component 4 is mounted, the component 4 is mounted on the substrate mounting stage 53.
  • the process is transferred to the first component crimping work section 22c or the second component crimping work section 22d, where the crimping operation of the component 4 is performed, and the process of shifting from the mounting operation of the component 4 to the crimping operation of the component 4 is performed.
  • the substrate transfer unit 82 substrate transfer means
  • the transfer of the substrate 2 to the central substrate transfer unit 33C or the right substrate transfer unit 33R by the substrate transfer unit 82 (central substrate transfer unit 82b) is not limited to the order shown in the embodiment. After transferring to the right substrate transfer part 33R, it may be transferred to the central substrate transfer part 33C.
  • the component mounting operation and the component crimping operation in the component mounting operation unit 22b, the first component crimping operation unit 22c, and the second component crimping operation unit 22d are respectively performed by the corresponding substrate transfer units (left substrate transfer unit 33L, center). You may carry out from the left-right board
  • left base 11a, the center base 11b, and the right base 11c may be formed as an integral base or as separate bases.
  • a component mounting apparatus and a component mounting method capable of shifting to a component crimping operation without dropping a component mounted on a board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

　基板に搭載した部品を落下させることなく部品の圧着作業に移行することができるようにした部品実装装置及び部品実装方法を提供することを目的とする。　中央基板移送部３３Ｃが備える基板載置ステージ５３に基板２を載置させた状態でその基板２を部品搭載作業部２２ｂに移送し、部品搭載作業部２２ｂにより基板２に対する部品４の搭載作業を行った後、中央基板移送部３３Ｃを第１の部品圧着作業部２２ｃの側に移動させて基板載置ステージ５３に載置させた状態のままの基板２を第１の部品圧着作業部２２ｃに移送し、第１の部品圧着作業部２２ｃにより基板２に部品４を圧着する。

Description

部品実装装置及び部品実装方法
　本発明は、基板に部品を搭載した後、その部品を基板に圧着して液晶パネル基板等の基板の製造を行う部品実装装置及び部品実装方法に関するものである。
　従来、液晶パネル基板製造用の部品実装装置では、基板の端部に接着部材としてのテープ状のＡＣＦ（Ａｎｉｓｏｔｒｏｐｉｃ　Ｃｏｎｄｕｃｔｉｖｅ　Ｆｉｌｍ）を貼着するＡＣＦ貼着作業部、基板のＡＣＦテープが貼着された部分に駆動回路等のフィルム状部分を有する部品を搭載（仮圧着）する部品搭載作業部、部品搭載作業部において部品が搭載された基板にその部品を圧着（本圧着）する部品圧着作業部を備えている。ここで、部品圧着作業部は通常２基備えられており、基板の流れに沿ってＡＣＦ貼着作業部、部品搭載作業部、第１の部品圧着作業部及び第２の部品圧着作業部がこの順で並んでいる（例えば、特許文献１参照）。そして、上記作業工程間での基板の受け渡しは先端に基板の吸着部を備えたアーム装置等の基板移載手段によって行われ、基板を作業工程間で受け渡しながら処理を進められる。
　上記従来の部品実装装置には、基板の一辺にのみ部品を取り付けるタイプのものがある。そのような場合、第１の部品圧着作業部と第２の部品圧着作業部が同一の作業を行う。よって、部品の搭載作業がなされた基板は、第１の部品圧着作業部又は第２の部品圧着作業部において、それぞれ基板の一辺について部品の圧着作業を行う。
日本国特開２００５－１２９７５３号公報
　ところで、上記のように、基板の端部にフィルム状部分を有する部品を搭載する部品実装装置では、部品の搭載作業から部品の圧着作業に移行する過程の基板移載手段による基板の移し変え時に、基板に搭載した部品に衝撃を与えるなどして落下させてしまうおそれがある。
　そこで本発明は、基板に搭載した部品を落下させることなく部品の圧着作業に移行することができるようにした部品実装装置及び部品実装方法を提供することを目的とする。
　本発明の部品実装装置は、基板への部品の搭載作業を行う部品搭載作業部と、前記部品搭載作業部を両側方から挟む位置に設けられ、前記部品搭載作業部において前記部品の搭載作業が行われた前記基板に前記部品搭載作業部で搭載された前記部品を圧着する第１の部品圧着作業部及び第２の部品圧着作業部と、前記部品搭載作業部と前記第１の部品圧着作業部の間を水平方向に移動自在に設けられ、基板載置ステージに前記基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部による前記基板に対する前記部品の搭載作業が行われた後、前記第１の部品圧着作業部の側に移動して前記基板載置ステージに載置された状態のままの前記基板を前記第１の部品圧着作業部に移送する第１の基板移送手段と、前記部品搭載作業部と前記第２の部品圧着作業部の間を水平方向に移動自在に設けられ、前記基板載置ステージに前記基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部による前記基板に対する前記部品の搭載作業が行われた後、前記第２の部品圧着作業部の側に移動して前記基板載置ステージに載置された状態のままの前記基板を前記第２の部品圧着作業部に移送する第２の基板移送手段とを備える。
　本発明の部品実装装置は、外部より搬入された基板を保持する基板保持部と、前記基板保持部に保持された前記基板の前記部品搭載作業部により前記部品が搭載される箇所に接着部材を貼着する接着部材貼着作業部と、前記接着部材貼着作業部により前記接着部材が貼着された前記基板を前記第１の基板移送手段が備える前記基板載置ステージ及び前記第２の基板移送手段が備える前記基板載置ステージに振り分けて載置する基板移載手段とを備える。
　本発明の部品実装装置は、前記基板移載手段は、前記第１の部品圧着作業部により前記部品が圧着された前記基板を前記第１の基板移送手段が備える前記基板載置ステージから受け取って或いは前記第２の部品圧着作業部により前記部品が圧着された前記基板を前記第２の基板移送手段が備える前記基板載置ステージから受け取ってその基板を基板搬出部に受け渡す。
　本発明の部品実装装置は、前記部品搭載作業部は、前記第１の基板移送手段により移送された前記基板又は前記第２の基板移送手段により移送された前記基板に対する前記部品の搭載作業を行う前に、前記第１の基板移送手段が備える前記基板載置ステージに対する基板の位置認識又は前記第２の基板移送手段が備える前記基板載置ステージに対する前記基板の位置認識を行う位置認識手段を備える。
　本発明の部品実装装置は、前記部品搭載作業部によって前記基板に搭載される前記部品は前記基板に搭載された状態で前記基板の外にはみ出すフィルム状部分を有し、前記第１の基板移送手段が備える前記基板載置ステージ及び前記第２の基板移送手段が備える前記基板載置ステージは前記部品が前記基板に搭載された状態で前記フィルム状部分を下方から支持するフィルム状部分支持部を備える。
　本発明の部品実装装置は、認識手段により前記基板載置ステージに載置された前記基板を認識して前記基板の位置に関する情報を取得する情報取得手段を備え、前記第１の基板移送手段は、前記情報取得手段により取得された前記情報に基づいて前記基板載置ステージを移動させることにより、前記部品搭載作業部に対する前記基板の位置決め及び前記第１の部品圧着作業部に対する前記基板の位置決めを行う。
　本発明の部品実装装置は、前記第１の基板移送手段は、前記情報取得手段により取得された前記情報を記憶部に記憶し、前記第１の部品圧着作業部に対する前記基板の位置決めを前記記憶部に記憶した前記情報に基づいて行う。
　本発明の部品実装方法は、基板への部品の搭載作業が行われる部品搭載作業部と、前記部品搭載作業部を両側方から挟む位置に設けられ、前記部品搭載作業部において前記部品の搭載作業が行われた前記基板に前記部品搭載作業部で搭載された前記部品を圧着する第１の部品圧着作業部及び第２の部品圧着作業部と、前記部品搭載作業部と前記第１の部品圧着作業部の間を水平方向に移動自在に設けられた第１の基板移送手段及び前記部品搭載作業部と前記第２の部品圧着作業部の間を水平方向に移動自在に設けられた第２の基板移送手段とを備えた部品実装装置による部品実装方法であって、前記第１の基板移送手段が備える基板載置ステージに基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部により前記基板に対する前記部品の搭載作業を行った後、前記第１の基板移送手段を前記第１の部品圧着作業部の側に移動させて前記基板載置ステージに載置させた状態のままの前記基板を前記第１の部品圧着作業部に移送し、前記第１の部品圧着作業部により前記基板に前記部品を圧着する工程と、前記第２の基板移送手段が備える基板載置ステージに前記基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部により前記基板に対する前記部品の搭載作業を行った後、前記第２の基板移送手段を前記第２の部品圧着作業部の側に移動させて前記基板載置ステージに載置された状態のままの前記基板を前記第２の部品圧着作業部に移送し、前記第２の部品圧着作業部により前記基板に前記部品を圧着する工程とを含む。
　本発明の部品実装方法は、前記基板載置ステージに載置した前記基板を認識して前記基板の位置に関する情報を取得する情報取得工程と、前記情報取得工程で取得した前記情報に基づいて前記基板載置ステージを移動させることにより前記部品搭載作業部に対する前記基板の位置決めを行う第１の基板位置決め工程と、前記部品搭載作業工程の後、前記基板載置ステージを前記第１の部品圧着作業部に移動させ、前記情報取得工程で取得した前記情報に基づいて前記基板保持ステージを移動させることにより前記第１の部品圧着作業部に対する前記基板の位置決めを行う第２の基板位置決め工程と、を備える。
　本発明では、基板は第１の基板移送手段又は第２の基板移送手段が備える基板載置ステージに載置された状態で部品搭載作業部に移送されて部品の搭載作業がなされ、部品の搭載作業の後は基板載置ステージに載置された状態のまま第１の部品圧着作業部又は第２の部品圧着作業部に移送されてそこで部品の圧着作業が行われるようになっており、部品の搭載作業から部品の圧着作業に移行する過程において、基板移載手段による基板の移し変えがなされないので、基板に搭載した部品を落下させることなく部品の圧着作業に移行することができる。
本発明の一実施の形態における部品実装装置の平面図 本発明の一実施の形態における部品実装装置による基板に対する部品装着作業の進行手順を示す図 本発明の一実施の形態における部品実装装置の制御系統を示すブロック図 （ａ）、（ｂ）は本発明の一実施の形態における部品実装装置が備えるＡＣＦ貼着作業部及び左方基板移送部の斜視図 （ａ）、（ｂ）、（ｃ）は本発明の一実施の形態におけるＡＣＦ貼着作業部によるＡＣＦテープの貼着作業の実行手順を示す図 （ａ）、（ｂ）は本発明の一実施の形態における部品実装装置が備える部品搭載作業部及び中央基板移送部（右方基板移送部）の斜視図 本発明の一実施の形態における部品搭載作業部による部品搭載作業の実行手順を示すフローチャート （ａ）、（ｂ）、（ｃ）は本発明の一実施の形態における部品搭載作業部による部品搭載作業の実行手順を示す図 （ａ）、（ｂ）、（ｃ）は本発明の一実施の形態における部品搭載作業部による部品搭載作業の実行手順を示す図 （ａ）、（ｂ）は本発明の一実施の形態における部品実装装置が備える第１の部品圧着作業部（第２の部品圧着作業部）及び左方基板移送部（右方基板移送部）の斜視図 （ａ）、（ｂ）、（ｃ）は本発明の一実施の形態における第１の部品圧着作業部（第２の部品圧着作業部）作業部による部品圧着作業の実行手順を示す図 本発明の一実施の形態における部品実装装置が実行する部品圧着作業の手順を示すフローチャート （ａ）～（ｆ）は本発明の一実施の形態における第１の部品圧着作業部（第２の部品圧着作業部）による部品圧着作業の実行手順を示す図 本発明の一実施の形態における基板移載部の斜視図 本発明の一実施の形態における部品実装装置の部分平面図 （ａ）、（ｂ）、（ｃ）は本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図 （ａ）、（ｂ）、（ｃ）は本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図 （ａ）、（ｂ）、（ｃ）は本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図 （ａ）、（ｂ）、（ｃ）は本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図 （ａ）、（ｂ）、（ｃ）は本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図 （ａ）、（ｂ）は本発明の一実施の形態における部品実装装置による部品装着作業の実行手順を示す図
　以下、図面を参照して本発明の実施の形態について説明する。図１に示す液晶パネル基板製造用の部品実装装置１は、図２に示す長方形のパネル状の基板２の四辺のうちの一辺の端部に設けられた電極部２ａに接着部材としてのＡＣＦテープ３を貼着したうえで、その貼着したＡＣＦテープ３に部品４を搭載（仮圧着）してその後圧着（本圧着）することにより基板２に部品４を装着する部品装着作業を実行する。ここで用いる部品４は例えば駆動回路部品であり、フィルム状部分４ａを有する。
　図１において、部品実装装置１の基台１１は、オペレータＯＰから見た左右方向（図１における紙面左右方向であり、Ｘ軸方向とする）の左方から左方基台１１ａ、中央基台１１ｂ及び右方基台１１ｃがこの順で配置され、左方基台１１ａには搬入基板載置部２１、中央基台１１ｂには部品実装実行部２２、右方基台１１ｃには搬出基板載置部２３がそれぞれ備えられている。上記搬入基板載置部２１、部品実装実行部２２及び搬出基板載置部２３はそれぞれ制御手段としての制御装置２４（図３）によってその動作が制御されている。基板２はＸ軸方向を左側から右側に、すなわち搬入基板載置部２１、部品実装実行部２２、搬出基板載置部２３の順に流れて順次作業が施される。
　図１において、搬入基板載置部２１は左側（上流工程側）と右側（下流工程側）の２つの基板載置ステージ２１ｓを有している。これら２つの基板載置ステージ２１ｓは左方基台１１ａに対して昇降自在に設けられており、２つの基板載置ステージ２１ｓには部品実装装置１の上流工程側から送られてきた基板２が載置される。
　部品実装実行部２２は、基板２に接着部材であるＡＣＦテープ３を貼着する作業を行うＡＣＦ貼着作業部（接着部材貼着作業部）２２ａ、基板２への部品４の搭載作業を行う部品搭載作業部２２ｂ、部品搭載作業部２２ｂにおいて部品４の搭載作業が行われた基板２に部品搭載作業部２２ｂで搭載された部品４を圧着する第１の部品圧着作業部２２ｃ及び第２の部品圧着作業部２２ｄを有する。
　ＡＣＦ貼着作業部２２ａは中央基台１１ｂの左部領域に設けられており、部品搭載作業部２２ｂは中央基台１１ｂの中央領域に設けられている。第１の部品圧着作業部２２ｃは中央基台１１ｂ上のＡＣＦ貼着作業部２２ａと部品搭載作業部２２ｂとの間の領域に設けられており、第２の部品圧着作業部２２ｄは中央基台１１ｂ上の部品搭載作業部２２ｂの右側の領域に設けられている。すなわち、本実施の形態の部品実装装置１において、第１の部品圧着作業部２２ｃと第２の部品圧着作業部２２ｄは、部品搭載作業部２２ｂを左右両側方から挟む位置に設けられている。
　中央基台１１ｂ上のＡＣＦ貼着作業部２２ａの前方領域（オペレータＯＰから見た前後方向をＹ軸方向とする）には第１のベース部３１が設けられており、中央基台１１ｂ上の部品搭載作業部２２ｂ、第１の部品圧着作業部２２ｃ及び第２の部品圧着作業部２２ｄの前方領域には第２のベース部３２がＸ軸方向に延びて設けられている。
　図１，図４（ａ）及び図４（ｂ）において、第１のベース部３１には左方基板移送部３３Ｌが設けられている。この左方基板移送部３３Ｌは、第１のベース部３１上にＹ軸方向に延びて設けられ、第１のベース部３１上をＸ軸方向に移動自在に設けられたＹ軸テーブル３４と、Ｙ軸テーブル３４上をＹ軸方向に移動自在に設けられた移動ステージ３５と、移動ステージ３５の上面にＸ軸方向に並んで設けられた２つの基板載置ステージ３６を有する。２つの基板載置ステージ３６上には搬入基板載置部２１の２つの基板載置ステージ２１ｓから２枚の基板２が移載されて保持される。
　２つの基板載置ステージ３６はそれぞれ移動ステージ３５に対して昇降自在に設けられており、制御装置２４はＹ軸テーブル３４に対して移動ステージ３５をＹ軸方向に移動させて基板２の移送を行い、２つの基板載置ステージ３６を昇降させて、２つの基板載置ステージ３６に載置された２枚の基板２を上下させる。
　図４（ａ），図４（ｂ）において、ＡＣＦ貼着作業部２２ａは中央基台１１ｂの上方をＸ軸方向に並んで設けられた２つの貼着ヘッド４１と、各貼着ヘッド４１の下方にＸ軸方向に延びて設けられた２つのＡＣＦ貼着作業用のバックアップステージ４２を有する。
　２つの貼着ヘッド４１はそれぞれＡＣＦテープ３を繰り出し供給するとともに、その繰り出したＡＣＦテープ３を所定長さに切断してこれを所定の位置で水平姿勢に保持するテープ供給部４１ａと、テープ供給部４１ａが水平姿勢に保持したＡＣＦテープ３を上方からＡＣＦ貼着作業用のバックアップステージ４２の側に押し付ける貼着ツール４１ｂを備えている。
　制御装置２４は、左方基板移送部３３Ｌの移動ステージ３５をＹ軸テーブル３４上の前方に設定された「基板受け渡し位置」（図４（ａ））と後方に設定された「作業位置」（図４（ｂ））との間で移動させる。「基板受け渡し位置」は２つの基板載置ステージ３６に対して基板２の受け渡しを行うことができる位置であり、「作業位置」は、２つの基板載置ステージ３６に載置された２枚の基板２それぞれの電極部２ａを２つのＡＣＦ貼着作業用のバックアップステージ４２の上方に位置させることができる位置である。
　貼着ヘッド４１による基板２へのＡＣＦテープ３の貼着作業について図５（ａ）、図５（ｂ）、図５（ｃ）を参照しながら説明する。先ず図５（ａ）に示すように、制御装置２４が、テープ供給部４１ａを作動させて所定長さに切断した状態のＡＣＦテープ３を基板２（電極部２ａ）の上方に位置させる。次に図５（ｂ）に示すように、貼着ツール４１ｂを下降させてＡＣＦテープ３を基板２ごとＡＣＦ貼着作業用のバックアップステージ４２に押し付ける。最後に図５（ｃ）に示すように、貼着ツール４１ｂを基板２に対して上昇させる。結果、基板２に対して、所定長さのＡＣＦテープ３が貼着される。
　図１において、第２のベース部３２には中央基板移送部３３Ｃと右方基板移送部３３Ｒが設けられている。中央基板移送部３３Ｃと右方基板移送部３３Ｒは同型であり、中央基板移送部３３Ｃは右方基板移送部３３Ｒの左方に位置している。中央基板移送部３３Ｃは（右方基板移送部３３Ｒも同様）、図６（ａ），図６（ｂ）に示すように、第２のベース部３２に沿ってＸ軸方向に移動自在に設けられたＹ軸テーブル５１、Ｙ軸テーブル５１の上をＹ軸方向に移動自在に設けられた移動ステージ５２、移動ステージ５２の上面にＸ軸方向に並んで設けられた２つの基板載置ステージ５３を有する。２つの基板載置ステージ５３は第２のベース部３２に対するＹ軸テーブル５１のＸ軸方向への移動及びＹ軸テーブル５１に対する移動ステージ５２の移動によって水平方向への移動が自在であり、２つの基板載置ステージ５３上には左方基板移送部３３Ｌから２枚の基板２が移載される。
　２つの基板載置ステージ５３はそれぞれ移動ステージ５２に対して昇降自在に設けられている。制御装置２４は第２のベース部３２に対するＹ軸テーブル５１のＸ軸方向への移動及びＹ軸テーブル５１に対する移動ステージ５２のＹ軸方向への移動を行って２つの基板載置ステージ５３を水平面内方向に移動させることで基板２の移送を行い、２つの基板載置ステージ５３を昇降させて（図３）、２つの基板載置ステージ５３に載置された２枚の基板２を上下させて、バックアップステージ６４の上面に対して着地／離反させる。
　図１，図６（ａ）及び図６（ｂ）において、部品搭載作業部２２ｂは、中央基台１１ｂの後部から後方に張り出して設けられて部品４の供給を行う部品供給部６１、中央基台１１ｂの中央後部に設けられた搭載ヘッド移動機構６２によって水平面内で移動自在であり、部品供給部６１が供給する部品４を上方から吸着する搭載ヘッド６３及び第２のベース部３２の中央部後方領域にＹ軸方向に延びて設けられた部品搭載作業用のバックアップステージ６４を備える。制御装置２４は、部品供給部６１による部品４の供給動作制御、搭載ヘッド移動機構６２の作動による搭載ヘッド６３の水平面内での移動動作、搭載ヘッド６３による部品４の吸着動作を制御する。これにより、搭載ヘッド６３による部品４の吸着（ピックアップ）から部品４の基板２への搭載までの一連の作業が行われる（図３）。
　図６（ａ）において、部品搭載作業用のバックアップステージ６４内には撮像視野を上方に向けた２つの位置認識カメラ６５がＸ軸方向に並んで設けられている。これら２つの位置認識カメラ６５は制御装置２４に制御されて撮像動作を行い、部品搭載用のバックアップステージ６４の上部に設けられた石英ガラス等の透明材料部６４ａ（図６（ａ））を通して部品搭載用のバックアップステージ６４の上方に位置する物体を撮像する。
　制御装置２４は、中央基板移送部３３Ｃの移動ステージ５２をＹ軸テーブル５１上の前方に設定された「基板受け渡し位置」（図６（ａ））と後方に設定された「作業位置」（図６（ｂ））との間で移動させる。「基板受け渡し位置」は２つの基板載置ステージ５３に対して基板２の受け渡しを行うことができる位置である。「作業位置」は、２つの基板載置ステージ５３に載置された基板２の電極部２ａに貼着されたＡＣＦテープ３を部品搭載作業用のバックアップステージ６４の上方（更には後述する部品圧着作業用のバックアップステージ７２の上方）に位置させることができる位置である。
　基板２に部品４を搭載する場合、制御装置２４は先ず、移動ステージ５２を「作業位置」に移動させることによって、基板２の電極部２ａをバックアップステージ６４の上方位置（搭載作業位置）に位置させる（図７のフローチャートに示すステップＳＴ１）。そして、２つの位置認識カメラ６５に、部品搭載用のバックアップステージ６４の上方に位置された基板２が有する２つの位置認識マークｍ（図２）を撮像・認識させ（図８（ａ））、２つの位置認識マークｍの位置情報に基づいて基板２の位置に関する情報（基板載置ステージ５３に対する基板２の位置情報）を算出（取得）し、その結果を制御装置２４の記憶部２４ａ（図３）に記憶する（ステップＳＴ２。情報取得工程）。
　具体的には、中央基板移送部３３Ｃの左側の基板載置ステージ５３に保持した基板２についての基板載置ステージ５３に対する位置補正量のデータが基板２の位置に関する情報として記憶部２４ａの第１補正データ記憶領域ＫＲ１に記憶される。同様に中央基板移送部３３Ｃの右側の基板載置ステージ５３に保持した基板２についての位置補正量のデータは第２補正データ記憶領域ＫＲ２に記憶される。また、右方基板移送部３３Ｒの左側の基板載置ステージ５３に保持した基板２についての基板載置ステージ５３に対する位置補正量のデータは第３補正データ記憶領域ＫＲ３に記憶され、右側の基板載置ステージ５３に保持した基板２についての位置補正データは第４補正データ記憶領域ＫＲ４に記憶される。
　制御装置２４（部品搭載作業制御部ＳＲ１）は、上記情報取得工程を終えたら、一旦移動ステージ５２を前方に移動させてバックアップステージ６４の上方位置（搭載作業位置）から基板２の電極部２ａを退避させ（図８（ｂ）。ステップＳＴ３）、次いで搭載ヘッド６３を下降させて、部品４をバックアップステージ６４に（位置認識カメラ６５の側）に近づく方向に（搭載作業位置に）移動させる（ステップＳＴ４）。そして、今度は２つの位置認識カメラ６５によって部品４が有する図示しない位置認識マークを撮像・認識し（図８（ｃ））、部品４の位置に関する情報（搭載ヘッド６３に対する部品４の位置情報）を算出（取得）したうえで部品４の位置補正量を求め、その結果を上記記憶部２４ａに記憶する（ステップＳＴ５）。
　制御装置２４（部品搭載作業制御部ＳＲ１）は、上記のようにして基板２の位置情報と部品４の位置情報を記憶部２４ａに記憶したら、搭載ヘッド６３を上昇させたうえで（図９（ａ））、移動ステージ５２を再度「作業位置」に位置させる。そして、記憶部２４ａに記憶した基板２の位置に関する情報（基板２の位置補正量）と部品４の位置に関する情報（部品４の位置補正量）に基づいて、部品４側の電極部（図示せず）と基板２側の電極部２ａが上下に合致するように中央基板移送部３３Ｃの作動制御を行い、部品搭載作業部２２ｂに対する（直接的には部品４に対する）基板２の位置決めを行う（図９（ｂ）。第１の基板位置決め工程。ステップＳＴ６）。
　このように、本実施の形態における部品実装装置１の部品搭載作業部２２ｂが備える位置認識カメラ６５は、中央基板移送部３３Ｃにより移送された基板２又は右方基板移送部３３Ｒにより移送された基板２に対する部品４の搭載作業を行う前に、中央基板移送部３３Ｃが備える基板載置ステージ５３に対する基板２の位置認識又は右方基板移送部３３Ｒが備える基板載置ステージ５３に対する基板２の位置認識を行う位置認識手段となっている。
　制御装置２４（部品搭載作業制御部ＳＲ１）は、このようにして部品搭載作業部２２ｂに対する基板２の位置決めを行ったら、搭載ヘッド６３を下降させ、搭載ヘッド６３に吸着させた部品４を基板２上のＡＣＦテープ３に押し付けて基板２に搭載する（図９（ｃ）。部品搭載工程。ステップＳＴ７）。なお、このときの搭載ヘッド６３の押し付け力は部品搭載用のバックアップステージ６４によって支持される。制御装置２４は、基板２に部品４を搭載したら、搭載ヘッド６３を上昇させる（ステップＳＴ８）。
　図６（ａ）、図６（ｂ）～図８（ａ）、図８（ｂ）、図８（ｃ）及び図９（ａ）、図９（ｂ）、図９（ｃ）に示すように、中央基板移送部３３Ｃ（右方基板移送部３３Ｒも同じ）が備える２つの基板載置ステージ５３のそれぞれには、その基板載置ステージ５３の後方をＸ軸方向に延びる水平部５４ａを有した枠状のフィルム状部分支持部５４が設けられている。図２等に示すように、部品搭載作業部２２ｂによって基板２に搭載された部品４は、基板２に搭載された状態でフィルム状部分４ａが基板２の外にはみ出す。しかしながら、上記フィルム状部分支持部５４が各基板載置ステージ５３に設けられていることにより、部品４が基板２に搭載された状態で基板２の外にはみ出している部品４のフィルム状部分４ａがフィルム状部分支持部５４の水平部５４ａによって下方から支持される。これにより、基板２に搭載された状態の部品４のフィルム状部分４ａが下方に垂れ下がった状態になることが防止される。
　図１０（ａ），図１０（ｂ）に示すように、第１の部品圧着作業部２２ｃは（第２の部品圧着作業部２２ｄも同様）は、Ｘ軸方向に並んで設けられた２つの圧着ヘッド７１と、各圧着ヘッド７１の下方にＹ軸方向に延びて設けられた２つの部品圧着作業用のバックアップステージ７２を備える。制御装置２４の部品圧着作業制御部ＳＲ２（図３）は、第１の部品圧着作業部２２ｃが備える圧着ヘッド７１及び第２の部品圧着作業部２２ｄが備える圧着ヘッド７１それぞれの昇降動作を制御する（図３）。
　制御装置２４（部品圧着作業制御部ＳＲ２）は、中央基板移送部３３Ｃが備える２つの基板載置ステージ５３に載置された２枚の基板２について、搭載ヘッド６３による部品４の搭載作業が終了したら、Ｙ軸テーブル５１をそのまま第２のベース部３２に沿って左方（すなわち第１の部品圧着作業部２２ｃの側に水平方向に）に移動させ、２つの基板載置ステージ５３に載置された２枚の基板２の各ＡＣＦテープ３が貼着された部分を２つの部品圧着作業用のバックアップステージ７２の上方（２つの圧着ヘッド７１の下方）に位置させる（図１０（ａ））。この際、記憶部２４ａに記憶した基板２の位置に関する情報に基づいて基板載置ステージ５３を移動させ、第１の部品圧着作業部２２ｃに対して基板２を位置決めする（図１０（ａ）。第２の基板位置決め工程）。具体的には、左側の基板載置ステージ５３に保持した基板２については第１補正データ記憶領域ＫＲ１から読み出した位置補正量のデータを使用して位置決めを行い、右側の基板載置ステージ５３に保持した基板２については第２補正データ記憶領域ＫＲ２から読み出した位置補正量のデータを使用して位置決めを行う。そして、第１の部品圧着作業部２２ｃが備える２つの圧着ヘッド７１を順次下降させて、部品搭載作業部２２ｂで搭載した部品４を２枚の基板２に圧着する（図１１（ａ）→図１１（ｂ）→図１１（ｃ）部品圧着作業工程）。
　また同様に、制御装置２４（部品圧着作業制御部ＳＲ２）は、右方基板移送部３３Ｒが備える２つの基板載置ステージ５３に載置された２枚の基板２について、搭載ヘッド６３による部品４の搭載作業が終了したら、Ｙ軸テーブル５１をそのまま第２のベース部３２に沿って右方（すなわち第２の部品圧着作業部２２ｄの側）に移動させ、２つの基板載置ステージ５３に載置された２枚の基板２の部品４が搭載された部分を２つの部品圧着作業用のバックアップステージ７２の上方（２つの圧着ヘッド７１の下方）に位置させる（図１０（ａ））。そして、前述の情報取得工程で取得した基板２の位置に関する情報に基づいて基板載置ステージ５３を移動させ、第２の部品圧着作業部２２ｄに対して基板２を位置決めする（図１０（ａ）。第２の基板位置決め工程）。具体的には、左側の基板載置ステージ５３に保持した基板２については第３補正データ記憶領域ＫＲ３から読み出した位置補正量のデータを使用して位置決めを行い、右側の基板載置ステージ５３に保持した基板２については第４補正データ記憶領域ＫＲ４から読み出した位置補正量のデータを使用して位置決めを行う。そして、第２の部品圧着作業部２２ｄが備える２つの圧着ヘッド７１を順次下降させて、部品搭載作業部２２ｂで搭載した部品４を２枚の基板２に圧着する（図１１（ａ）→図１１（ｂ）→図１１（ｃ）部品圧着作業工程）。
　第１の部品圧着作業部２２ｃ及び第２の部品圧着作業部２２ｄそれぞれが備える２つの圧着ヘッド７１による部品４の圧着作業では、２枚の基板２が載置される２つの基板載置ステージ５３は１つの移動ステージ５２に取り付けられているので、各基板２の対応する圧着ヘッド７１に対する位置決め（及びその後の部品圧着作業）は、タイミングをずらして順次行う。この動作を図１２、図１３（ａ）～図１３（ｆ）に従って詳細に説明する。
　制御装置２４（部品圧着作業制御部ＳＲ２）は、２つの基板載置ステージ５３に載置された２枚の基板２それぞれの部品４が搭載された部分をバックアップステージ７２の上方に位置させる（図１２のフローチャートに示すステップＳＴ１１）。この際、前述の部品搭載作業において取得し、記憶部２４ａの第１補正データ記憶領域ＫＲ１（又は第３補正データ記憶領域ＫＲ３）に記憶した基板２の位置に関する情報（左側の基板載置ステージ５３に保持された基板２の位置補正量データ）に基づいて移動ステージ５２を移動させる。これにより、一方の（ここでは左側の）基板２が対応する圧着ヘッド７１に対して位置決めされる（図１３（ａ）。ステップＳＴ１２）。そして、この状態で左側の圧着ヘッド７１を下降させて基板２をバックアップステージ７２と圧着ヘッド７１との間でクランプし、左側の基板２に対して部品４を圧着する（図１３（ｂ）。ステップＳＴ１３）。そして、そのクランプ状態を保持したまま、左側の基板載置ステージ５３をわずかに下降させて基板載置ステージ５３による基板２の支持状態を解除する（図１３（ｃ）。ステップＳＴ１４）。
　これにより左側の基板２とは独立して移動ステージ５２を移動させることができるようになったら、同じく前述の部品搭載作業において取得し、記憶部２４ａの第２補正データ記憶領域ＫＲ２（又は第４補正データ記憶領域ＫＲ４）に記憶した基板２の位置に関する情報（右側の基板載置ステージ５３に保持された基板２の位置補正量のデータ）に基づいて移動ステージ５２を移動させ、他方の（ここでは右側の）基板２を対応する圧着ヘッド７１に対して位置決めする（ステップＳＴ１５）。そして、この状態で右側の圧着ヘッド７１を下降させて基板２をバックアップステージ７２と圧着ヘッド７１との間でクランプし、右側の基板２に対して部品４を圧着する（図１３（ｄ）。ステップＳＴ１６）。制御装置２４（部品圧着作業制御部ＳＲ２）は、右側の基板２に対して部品４を圧着したら、左側の基板載置ステージ５３を上昇させて基板２を支持させたうえで、左側の圧着ヘッド７１を上昇させ（図１３（ｅ）。ステップＳＴ１７）、次いで右側の圧着ヘッド７１を上昇させる（図１３（ｆ）。ステップＳＴ１８）。これにより２枚の基板２に対する部品４の圧着作業が完了する。
　制御装置２４（部品圧着作業制御部ＳＲ２）は、上記の手順によって２枚の基板２に対して部品４を圧着したら、移動ステージ５２をＹ軸テーブル５１に沿って前方へ移動させ、移動ステージ５２を「基板受け渡し位置」に復帰させる。
　このように、本実施の形態における部品実装装置１は、基板２への部品４の搭載作業を行う部品搭載作業部２２ｂ、部品搭載作業部２２ｂにおいて部品４の搭載作業が行われた基板２に部品搭載作業部２２ｂで搭載された部品４を圧着する第１の部品圧着作業部２２ｃ及び第２の部品圧着作業部２２ｄ、基板２を保持し、部品搭載作業部２２ｂと第１の部品圧着作業部２２ｃとの間又は部品搭載作業部２２ｂと第２の部品圧着作業部２２ｄとの間を移動自在に設けられた基板載置ステージ５３、基板載置ステージ５３を部品搭載作業部２２ｂに移動させて部品搭載作業部２２ｂに対する基板２の位置決めを行い、部品搭載作業部２２ｂによる基板２への部品４の搭載作業が行われた後、基板載置ステージ５３を第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄに移動させて第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄに対する基板２の位置決めを行うステージ移動制御手段としての制御装置２４を備えたものとなっている。
　そして、制御装置２４は、認識手段により基板載置ステージ５３に載置された基板２を認識して基板２の位置に関する情報を取得する情報取得手段としても機能し、ステージ移動制御手段としての制御装置２４は、情報取得手段として取得した上記情報（基板２の位置に関する情報）に基づいて基板載置ステージ５３を移動させることにより、部品搭載作業部２２ｂに対する基板２の位置決め及び第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄに対する基板２の位置決めを行うようになっている。
　なお、２つの基板載置ステージ５３に載置された基板２に対する圧着ヘッド７１の位置決め及び圧着ヘッド７１による部品４の圧着は、上記したように左右の基板２に対して個別に行わず、同時に行ってもよい。その場合、部品搭載作業において取得した左側の基板載置ステージ５３に対する左側の基板２の位置ずれと右側の基板載置ステージ５３に対する右側の基板２の位置ずれとの平均値を算出し、左側と右側の基板載置ステージ５３をそれぞれの対応する圧着ヘッド７１に対して同時に位置決めする。その後、圧着ヘッド７１により同時に基板２に部品４を圧着させる。この場合、個別に位置決めするのに比べ、若干位置決め精度は下がるが、タクトタイムを短くすることができる。
　図１において、搬出基板載置部２３は左側（上流工程側）と右側（下流工程側）の２つの基板載置ステージ２３ｓを有している。これら左右２つの基板載置ステージ２３ｓは右方基台１１ｃに対して昇降自在に設けられており、２つの基板載置ステージ２３ｓには第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄにおいて部品４の圧着作業が終了した２枚の基板２が載置される。２つの基板載置ステージ２３ｓに載置された２枚の基板２は、図示しない基板搬出手段によって、部品実装装置１の下流工程下側に設けられた他の装置に送られる。
　図１において、基台１１の前方領域には左方基台１１ａ、中央基台１１ｂ及び右方基台１１ｃにわたってＸ軸方向に延びた移動ベース８１が設けられている。この移動ベース８１上には左方から順に左方基板移載部８２ａ、中央基板移載部８２ｂ及び右方基板移載部８２ｃの３つの基板移載部８２が設けられている。
　各基板移載部８２は、図１４に示すように、移動ベース８１に対してＸ軸方向に移動自在に設けられた基部９１及び基部９１上に設けられた２基のアームユニット９２を有する。各アームユニット９２は基部９１に固定されたアームベース９３と、アームベース９３から水平後方に延びて設けられた２つのアーム９４を備える。各アーム９４には吸着面を下方に向けた複数の吸着パッド９５が設けられている。各アームユニット９２は２つのアーム９４に設けられた計４個の吸着パッド９５を介して１枚の基板２を真空吸着することができる。
　搬入基板載置部２１の基板載置ステージ２１ｓ上の基板２をアームユニット９２に受け取らせるときには、制御装置２４は、基板２の上方に２つのアーム９４の吸着パッド９５を位置させた状態で基板載置ステージ２１ｓを昇降させる。また、左方基板移送部３３Ｌの基板載置ステージ３６上の基板２をアームユニット９２に受け取らせ、或いはアームユニット９２に吸着された基板２を基板載置ステージ３６に載置させるときには、制御装置２４は、基板２の上方に２つのアーム９４の吸着パッド９５を位置させた状態で基板載置ステージ３６を昇降させる。また、中央基板移送部３３Ｃ或いは右方基板移送部３３Ｒの基板載置ステージ５３上の基板２をアームユニット９２に受け取らせ、或いはアームユニット９２に吸着された基板２を基板載置ステージ５３に載置させるときには、制御装置２４は、基板２の上方に２つのアーム９４の吸着パッド９５を位置させた状態で基板載置ステージ５３を昇降させる。
　制御装置２４は、左方基板移載部８２ａ、中央基板移載部８２ｂ及び右方基板移載部８２ｃそれぞれの移動ベース８１に沿ったＸ軸方向への移動動作、各アームユニット９２における吸着パッド９５を介した基板２の吸着動作を制御する（図３）。具体的には、制御装置２４は、左方基板移載部８２ａを作動させて搬入基板載置部２１から左方基板移送部３３Ｌに基板２を移送し、中央基板移載部８２ｂを作動させて左方基板移送部３３Ｌから中央基板移送部３３Ｃ又は右方基板移送部３３Ｒに基板２を移送する。すなわち、ＡＣＦ貼着作業部２２ａによりＡＣＦテープ３が貼着された基板２を中央基板移送部３３Ｃが備える２つの基板載置ステージ５３及び右方基板移送部３３Ｒが備える２つの基板載置ステージ５３に振り分けて載置する。また、制御装置２４は、右方基板移載部８２ｃを作動させて、中央基板移送部３３Ｃ又は右方基板移送部３３Ｒから搬出基板載置部２３に基板２を移送する。
　このように、本実施の形態における部品実装装置１による部品実装作業（部品実装方法）は、基板載置ステージ５３に保持した基板２を認識して基板２の位置に関する情報を取得する工程（前述の情報取得工程）、情報取得工程で取得した基板２の位置に関する情報に基づいて基板載置ステージ５３を移動させることにより部品搭載作業部２２ｂに対する基板２の位置決めを行う工程（前述の第１の基板位置決め工程）、部品搭載作業部２２ｂに対して位置決めを行った基板２への部品搭載作業部２２ｂによる部品４の搭載作業を実行する工程（前述の部品搭載作業工程）、部品搭載作業工程の後、基板載置ステージ５３を第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄに移動させ、情報取得工程で取得した基板２の位置に関する情報に基づいて基板載置ステージ５３を移動させることにより第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄに対する基板２の位置決めを行う工程（前述の第２の基板位置決め工程）及び第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄに対して位置決めを行った基板２への第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄによる部品４の圧着作業を実行する工程（前述の部品圧着作業工程）を含むものとなっている。
　次に、部品実装装置１が基板２への部品４の装着作業を行うときの各部の動作を説明する。制御装置２４は、図１５に示すように、３つの基板移載部８２が取り得る位置として、搬入基板載置部２１の前方位置（第１位置Ｐ１）、ＡＣＦ貼着作業部２２ａの前方位置（第２位置Ｐ２）、第１の部品圧着作業部２２ｃの前方位置（第３位置Ｐ３）、部品搭載作業部２２ｂの前方位置（第４位置Ｐ４）、第２の部品圧着作業部２２ｄの前方位置（第５位置Ｐ５）及び搬出基板載置部２３の前方位置（第６位置Ｐ６）を定めている。
　基板２への部品４の装着作業を行う場合には、制御装置２４は先ず、左方基板移載部８２ａを第１位置Ｐ１に、中央基板移載部８２ｂを第２位置Ｐ２に、右方基板移載部８２ｃを第４位置Ｐ４に位置させ、また中央基板移送部３３Ｃを部品搭載作業部２２ｂの前方位置に、右方基板移送部３３Ｒを第２の部品圧着作業部２２ｄの前方位置に位置させた状態で、上流工程側の装置から搬入されて搬入基板載置部２１に載置されている２枚の基板２を左方基板移載部８２ａによって受け取る（図１６（ａ））。
　制御装置２４は、左方基板移載部８２ａによって搬入基板載置部２１から２枚の基板２を受け取ったら、左方基板移載部８２ａを第２位置Ｐ２に、中央基板移載部８２ｂを第４位置Ｐ４に、右方基板移載部８２ｃを第６位置Ｐ６に位置させることによって、左方基板移載部８２ａが受け取った２枚の基板２を左方基板移送部３３Ｌの２つの基板載置ステージ３６に受け渡す（図１６（ｂ））。そして、左方基板移送部３３Ｌの移動ステージ３５を「作業位置」に移動させ、ＡＣＦ貼着作業部２２ａによる２枚の基板２に対するＡＣＦ貼着作業を実行する（図１６（ｃ））。なお、この間、搬入基板載置部２１には、新たな２枚の基板２が載置（搬入）される。
　制御装置２４は、ＡＣＦ貼着作業部２２ａによる２枚の基板２に対するＡＣＦ貼着作業を実行したら、ＡＣＦ左方基板移送部３３Ｌの移動ステージ３５を「基板受け渡し位置」に移動させ、そのうえで左方基板移載部８２ａを第１位置Ｐ１に、中央基板移載部８２ｂを第２位置Ｐ２に、右方基板移載部８２ｃを第４位置Ｐ４に位置させる。そして、左方基板移載部８２ａによって搬入基板載置部２１上の２枚の基板２を受け取り、中央基板移載部８２ｂによって、左方基板移送部３３Ｌ上の２枚の基板２を受け取る（図１７（ａ））。
　制御装置２４は、左方基板移載部８２ａによって搬入基板載置部２１から２枚の基板２を受け取り、中央基板移載部８２ｂによって左方基板移送部３３Ｌ上の２枚の基板２を受け取ったら、左方基板移載部８２ａを第２位置Ｐ２に、中央基板移載部８２ｂを第４位置Ｐ４に、右方基板移載部８２ｃを第６位置Ｐ６に位置させることによって、左方基板移載部８２ａが受け取った２枚の基板２を左方基板移送部３３Ｌの２つの基板載置ステージ３６に載置させ、中央基板移載部８２ｂが受け取った２枚の基板２を中央基板移送部３３Ｃの２つの基板載置ステージ５３に載置させる（図１７（ｂ））。
　制御装置２４は、次いで、左方基板移送部３３Ｌの移動ステージ３５を「作業位置」に位置させてＡＣＦ貼着作業部２２ａによる２枚の基板２に対するＡＣＦ貼着作業を実行する一方、中央基板移送部３３Ｃの移動ステージ５２を「作業位置」に移動させ、２枚の基板２のうち左方の基板２を部品搭載作業用のバックアップステージ６４の上方に位置させることによって（第１の移送工程）、部品搭載作業部２２ｂによる左方の基板２に対する部品搭載作業を実行する（図１７（ｃ）。第１の部品搭載作業工程）。
　制御装置２４は、上記部品搭載作業部２２ｂによる左方の基板２に対する部品搭載作業を実行したら、中央基板移送部３３Ｃを左動させ（第２の移送工程）、中央基板移送部３３Ｃの２つの基板載置ステージ５３に載置された２枚の基板２のうちの右方の基板２を部品搭載作業用のバックアップステージ６４の上方に位置させて、部品搭載作業部２２ｂによる右方の基板２に対する部品搭載作業を実行する（図１８（ａ）。第２の部品搭載作業工程）。なお、この間、搬入基板載置部２１には、新たな２枚の基板２が載置（搬入）される。
　制御装置２４は、上記部品搭載作業部２２ｂによる部品搭載作業を実行したら、中央基板移送部３３Ｃをそのまま左方（第１の部品圧着作業部２２ｃの側）へ移動させて基板載置ステージ５３に載置させた状態のままの基板２を第１の部品圧着作業部２２ｃに移送し（第１の部品圧着作業部２２ｃへの移動工程）、２つの基板載置ステージ５３に載置された２枚の基板２を２つの部品圧着作業用のバックアップステージ７２の上方に位置させて、第１の部品圧着作業部２２ｃによる２枚の基板２に対する部品圧着作業を実行する（第１の部品圧着作業部２２ｃによる部品圧着作業工程。図１８（ｂ））。また、これと併せて、左方基板移載部８２ａを第１位置Ｐ１に位置させて、搬入基板載置部２１に載置されている２枚の基板２を左方基板移載部８２ａによって受け取る一方、左方基板移送部３３Ｌの移動ステージ３５を「基板受け渡し位置」に位置させるのに合わせて中央基板移載部８２ｂを第２位置Ｐ２に位置させ、中央基板移載部８２ｂによって左方基板移送部３３Ｌ上の２枚の基板２を受け取る。また、右方基板移送部３３Ｒを部品搭載作業部２２ｂの前方位置に位置させるとともに、右方基板移載部８２ｃを第４位置Ｐ４に位置させる（図１８（ｂ））。
　制御装置２４は上記作業が終了したら、右方基板移載部８２ｃを第６位置Ｐ６に位置させたうえで、中央基板移載部８２ｂを第４位置Ｐ４に位置させて、左方基板移送部３３Ｌから受け取った２枚の基板２を右方基板移送部３３Ｒの２つの基板載置ステージ５３に受け渡し、また左方基板移載部８２ａを第２位置Ｐ２に位置させることによって、搬入基板載置部２１から受け取った２枚の基板２を左方基板移送部３３Ｌの２つの基板載置ステージ３６に受け渡す（図１８（ｃ））。
　制御装置２４は、右方基板移送部３３Ｒと左方基板移送部３３Ｌに基板２を受け渡したら、左方基板移送部３３Ｌの移動ステージ３５を「作業位置」に位置させてＡＣＦ貼着作業部２２ａによる２枚の基板２に対するＡＣＦ貼着作業を実行する一方、右方基板移送部３３Ｒの移動ステージ５２を「作業位置」に移動させ、２枚の基板２のうち右方の基板２を部品搭載作業用のバックアップステージ６４の上方に位置させることによって（第３の移送工程）、部品搭載作業部２２ｂによる右方の基板２に対する部品搭載作業を実行する（図１９（ａ）。第３の部品搭載作業工程）。
　制御装置２４は、上記ＡＣＦ貼着作業部２２ａによるＡＣＦ貼着作業と、部品搭載作業部２２ｂによる部品搭載作業を実行したら、右方基板移送部３３Ｒを右動させ（第４の移送工程）、右方基板移送部３３Ｒの２つの基板載置ステージ５３に載置された２枚の基板２のうちの左方の基板２を部品搭載作業用のバックアップステージ６４の上方に位置させて、部品搭載作業部２２ｂによる左方の基板２に対する部品搭載作業を実行する（図１９（ｂ）。第４の部品搭載作業工程）。なお、この間、搬入基板載置部２１には、新たな２枚の基板２が載置（搬入）される。
　制御装置２４は、上記部品搭載作業部２２ｂによる部品搭載作業を実行したら、右方基板移送部３３Ｒをそのまま右方（第２の部品圧着作業部２２ｄの側）へ移動させて基板載置ステージ５３に載置させた状態のままの基板２を第２の部品圧着作業部２２ｄに移送し（第２の部品圧着作業部２２ｄへの移動工程）、２つの基板載置ステージ５３に載置された２枚の基板２を２つの部品圧着作業用のバックアップステージ７２の上方に位置させて、第２の部品圧着作業部２２ｄによる２枚の基板２に対する部品圧着作業を実行する（第２の部品圧着作業部２２ｄによる部品圧着作業工程。図１９（ｃ））。また、これと併せて、左方基板移載部８２ａを第１位置Ｐ１に位置させて搬入基板載置部２１に載置されている２枚の基板２を左方基板移載部８２ａによって受け取る一方、左方基板移送部３３Ｌの移動ステージ３５を「基板受け渡し位置」に位置させるのに合わせて中央基板移載部８２ｂを第２位置Ｐ２に位置させ、中央基板移載部８２ｂによって左方基板移送部３３Ｌ上の２枚の基板２を受け取る。また、中央基板移送部３３Ｃの移動ステージ５２を「基板受け渡し位置」に移動させつつ中央基板移送部３３Ｃを部品搭載作業部２２ｂの前方位置に位置させ、部品搭載作業部２２ｂの前方に位置させている右方基板移載部８２ｃによって、中央基板移送部３３Ｃ上の２枚の基板２を受け取る（図１９（ｃ））。
　制御装置２４は上記作業が終了したら、右方基板移載部８２ｃを第６位置Ｐ６に位置させて２枚の基板２を搬出基板載置部２３に載置する一方、中央基板移載部８２ｂを第４位置Ｐ４に位置させて、左方基板移送部３３Ｌから受け取った２枚の基板２を中央基板移送部３３Ｃの２つの基板載置ステージ５３に受け渡し、また、左方基板移載部８２ａを第２位置Ｐ２に位置させることによって、搬入基板載置部２１から受け取った２枚の基板２を左方基板移送部３３Ｌの２つの基板載置ステージ３６に受け渡す（図２０（ａ））。
　制御装置２４は、中央基板移送部３３Ｃと左方基板移送部３３Ｌに基板２を受け渡したら、左方基板移送部３３Ｌの移動ステージ３５を「作業位置」に位置させてＡＣＦ貼着作業部２２ａによる２枚の基板２に対するＡＣＦ貼着作業を実行する一方、中央基板移送部３３Ｃの移動ステージ５２を「作業位置」に位置させ、２枚の基板２のうちの左方の基板２を部品搭載作業用のバックアップステージ６４の上方に位置させることによって（第１の移送工程）、部品搭載作業部２２ｂによる左方の基板２に対する部品搭載作業を実行する（図２０（ｂ）。第１の部品搭載作業工程）。
　制御装置２４は、上記ＡＣＦ貼着作業部２２ａによるＡＣＦ貼着作業と、部品搭載作業部２２ｂによる部品搭載作業を実行したら、中央基板移送部３３Ｃを左動させ（第２の移送工程）、中央基板移送部３３Ｃの２つの基板載置ステージ５３に載置された２枚の基板２のうちの右方の基板２を部品搭載作業用のバックアップステージ６４の上方に位置させて、部品搭載作業部２２ｂによる右方の基板２に対する部品搭載作業を実行する（図２０（ｃ）。第２の部品搭載作業工程）。なお、この間、搬入基板載置部２１には、新たな２枚の基板２が載置（搬入）される。
　制御装置２４は、上記部品搭載作業部２２ｂによる部品搭載作業を実行したら、中央基板移送部３３Ｃをそのまま左方（第１の部品圧着作業部２２ｃの側）に移動させて基板載置ステージ５３に載置させた状態のままの基板２を第１の部品圧着作業部２２ｃに移送し（第１の部品圧着作業部２２ｃへの移動工程）、２つの基板載置ステージ５３に載置された２枚の基板２を２つの部品圧着作業用のバックアップステージ７２の上方に位置させて、第１の部品圧着作業部２２ｃによる２枚の基板２に対する部品圧着作業を実行する（第１の部品圧着作業部２２ｃによる部品圧着作業工程。図２１（ａ））。また、これと併せて、左方基板移載部８２ａを第１位置Ｐ１に位置させて搬入基板載置部２１に載置されている２枚の基板２を左方基板移載部８２ａによって受け取る一方、左方基板移送部３３Ｌの移動ステージ３５を「基板受け渡し位置」に位置させるのに合わせて中央基板移載部８２ｂを第２位置Ｐ２に位置させ、中央基板移載部８２ｂによって左方基板移送部３３Ｌ上の２枚の基板２を受け取る。また、右方基板移送部３３Ｒの移動ステージ５２を「基板受け渡し位置」に移動させつつ右方基板移送部３３Ｒを部品搭載作業部２２ｂの前方に位置させ、既に部品搭載作業部２２ｂの前方に位置させている右方基板移載部８２ｃによって、右方基板移送部３３Ｒ上の２枚の基板２を受け取る（図２１（ａ））。
　制御装置２４は、上記作業が終了したら、右方基板移載部８２ｃを第６位置Ｐ６に位置させて２枚の基板２を搬出基板載置部２３に載置するとともに、中央基板移載部８２ｂを第４位置Ｐ４に位置させて左方基板移送部３３Ｌから受け取った２枚の基板２を右方基板移送部３３Ｒの２つの基板載置ステージ５３に受け渡し、左方基板移載部８２ａを第２位置Ｐ２に位置させることによって、搬入基板載置部２１から受け取った２枚の基板２を左方基板移送部３３Ｌの２つの基板載置ステージ３６に受け渡す（図２１（ｂ））。
　この図２１（ｂ）の状態は図１８（ｃ）の状態と全く同じであるので、以後、図１８（ｃ）～図２１（ａ）の工程を繰り返すことによって、搬入基板載置部２１への基板２の搬入から基板２への部品４の装着を経て搬出基板載置部２３への搬出に至る一連の動作を繰り返し実行して連続的な基板生産を行うことができる。
　以上説明したように、本実施の形態における部品実装装置１は、基板２への部品４の搭載作業を行う部品搭載作業部２２ｂ、部品搭載作業部２２ｂを両側方から挟む位置に設けられ、部品搭載作業部２２ｂにおいて部品４の搭載作業が行われた基板２に部品搭載作業部２２ｂで搭載された部品４を圧着する第１の部品圧着作業部２２ｃ及び第２の部品圧着作業部２２ｄ、部品搭載作業部２２ｂと第１の部品圧着作業部２２ｃの間を水平方向に移動自在に設けられ、基板載置ステージ５３に基板２を載置させた状態でその基板２を部品搭載作業部２２ｂに移送し、部品搭載作業部２２ｂによる基板２に対する部品４の搭載作業が行われた後、第１の部品圧着作業部２２ｃの側に移動して基板載置ステージ５３に載置された状態のままの基板２を第１の部品圧着作業部２２ｃに移送する中央基板移送部３３Ｃ（第１の基板移送手段）及び部品搭載作業部２２ｂと第２の部品圧着作業部２２ｄの間を水平方向に移動自在に設けられ、基板載置ステージ５３に基板２を載置させた状態でその基板２を部品搭載作業部２２ｂに移送し、部品搭載作業部２２ｂによる基板２に対する部品４の搭載作業が行われた後、第２の部品圧着作業部２２ｄの側に移動して基板載置ステージ５３に載置された状態のままの基板２を第２の部品圧着作業部２２ｄに移送する右方基板移送部３３Ｒ（第２の基板移送手段）を備えたものとなっている。
　また、左方基板移送部３３Ｌは、外部より搬入された基板２を保持する基板保持部であり、ＡＣＦ貼着作業部２２ａは、左方基板移送部３３Ｌに保持された基板２の部品搭載作業部２２ｂにより部品４が搭載される箇所に接着部材としてのＡＣＦテープ３を貼着する接着部材貼着作業部である。
　また、基板移載部８２である中央基板移載部８２ｂは、ＡＣＦ貼着作業部２２ａによりＡＣＦテープ３が貼着された基板２を中央基板移送部３３Ｃが備える基板載置ステージ５３及び右方基板移送部３３Ｒが備える基板載置ステージ５３に振り分けて載置する基板移載手段である。
　また、基板移載部８２である右方基板移載部８２ｃは、第１の部品圧着作業部２２ｃにより部品４が圧着された基板２を中央基板移送部３３Ｃが備える基板載置ステージ５３から受け取って或いは第２の部品圧着作業部２２ｄにより部品４が圧着された基板２を右方基板移送部３３Ｒが備える基板載置ステージ５３から受け取ってその基板２を基板搬出部である搬出基板載置部２３に受け渡す。
　また、基板載置ステージ５３に保持された基板２を認識して基板２の位置に関する情報を取得し、これにより得られた情報に基づいて基板載置ステージ５３を移動させることにより部品搭載作業部２２ｂに対する基板２の位置決めと部品圧着作業部（第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄ）に対する基板２の位置決めの双方を行うようになっており、基板２の位置決め回数に対する基板２の認識回数を減らすことができるので、その分作業工程を短縮でき、基板２の生産性の向上を図ることができる。更に、基板２を認識する認識手段は部品搭載作業部２２ｂで基板２を認識するものだけでよく、また、基板載置ステージ５３や制御装置２４のステージ移動制御手段としての機能も部品搭載作業部２２ｂと部品圧着作業部（第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄ）で共用するものだけ備えればよいので、その分、装置構成が簡素化できて製造コストの低減を図ることもできる。
　また、本実施の形態における部品実装装置１による部品実装方法は、中央基板移送部３３Ｃ（第１の基板移送手段）が備える基板載置ステージ５３に基板２を載置させた状態でその基板２を部品搭載作業部２２ｂに移送し（前述の第１の移送工程及び第２の移送工程）、部品搭載作業部２２ｂにより基板２に対する部品４の搭載作業を行った後（前述の第１の部品搭載作業工程及び第２の部品搭載作業工程）、中央基板移送部３３Ｃを第１の部品圧着作業部２２ｃの側に移動させて基板載置ステージ５３に載置させた状態のままの基板２を第１の部品圧着作業部２２ｃに移送し（前述の第１の部品圧着作業部２２ｃへの移動工程）、第１の部品圧着作業部２２ｃにより基板２に部品４を圧着する工程（前述の第１の部品圧着作業部２２ｃによる部品圧着作業工程）と、右方基板移送部３３Ｒ（第２の基板移送手段）が備える基板載置ステージ５３に基板２を載置させた状態でその基板２を部品搭載作業部２２ｂに移送し（前述の第３の移送工程及び第４の移送工程）、部品搭載作業部２２ｂにより基板２に対する部品４の搭載作業を行った後（前述の第３の部品搭載作業工程及び第４の部品搭載作業工程）、右方基板移送部３３Ｒを第２の部品圧着作業部２２ｄの側に移動させて基板載置ステージ５３に載置された状態のままの基板２を第２の部品圧着作業部２２ｄに移送し（前述の第２の部品圧着作業部２２ｄへの移動工程）、第２の部品圧着作業部２２ｄにより基板２に部品４を圧着する工程（前述の第２の部品圧着作業部２２ｄによる部品圧着作業工程）を含むものとなっている。
　本実施の形態における部品実装装置１及びその部品実装方法では、基板２は中央基板移送部３３Ｃ（第１の基板移送手段）又は右方基板移送部３３Ｒ（第２の基板移送手段）が備える基板載置ステージ５３に載置された状態で部品搭載作業部２２ｂに移送されて部品４の搭載作業がなされ、部品４の搭載作業の後は基板載置ステージ５３に載置された状態のまま第１の部品圧着作業部２２ｃ又は第２の部品圧着作業部２２ｄに移送されてそこで部品４の圧着作業が行われるようになっており、部品４の搭載作業から部品４の圧着作業に移行する過程において、基板移載部８２（基板移載手段）による基板２の移し変えがなされないので、基板２に搭載した部品４を落下させることなく部品４の圧着作業に移行することができる。
　なお、基板移載部８２（中央基板移載部８２ｂ）による中央基板移送部３３Ｃ又は右方基板移送部３３Ｒへの基板２の移載は、実施の形態に示された順番に限られず、先ず右方基板移送部３３Ｒへ移載した後に、中央基板移送部３３Ｃへ移載してもよい。
　また、部品搭載作業部２２ｂ、第１の部品圧着作業部２２ｃ及び第２の部品圧着作業部２２ｄにおける部品搭載作業及び部品圧着作業は、それぞれ対応する基板移送部（左方基板移送部３３Ｌ、中央基板移送部３３Ｃ又は右方基板移送部３３Ｒ）が備える左右いずれの基板載置ステージ３６、５３から行っても構わない。
　また、左方基台１１ａ、中央基台１１ｂ、右方基台１１ｃは、一体の基台として形成されていても、それぞれ別個の基台として形成されていてもよい。
　本出願は、2012年8月22日出願の日本国特許出願（特願2012-182911）および2012年9月3日出願の日本国特許出願（特願2012-192890）に基づくものであり、それらの内容はここに参照として取り込まれる。
　基板に搭載した部品を落下させることなく部品の圧着作業に移行することができるようにした部品実装装置及び部品実装方法を提供する。
　１　部品実装装置
　２　基板
　３　ＡＣＦテープ（接着部材）
　４　部品
　４ａ　フィルム状部分
　２２ａ　ＡＣＦ貼着作業部（接着部材貼着作業部）
　２２ｂ　部品搭載作業部
　２２ｃ　第１の部品圧着作業部
　２２ｄ　第２の部品圧着作業部
　２３　搬出基板載置部（基板搬出部）
　３３Ｌ　左方基板移送部（基板保持部）
　３３Ｃ　中央基板移送部（第１の基板移送手段）
　３３Ｒ　右方基板移送部（第２の基板移送手段）
　５３　基板載置ステージ
　５４　フィルム状部分支持部
　６５　位置認識カメラ（位置認識手段）
　８２　基板移載部（基板移載手段）

Claims (9)

  1. 　基板への部品の搭載作業を行う部品搭載作業部と、
    　前記部品搭載作業部を両側方から挟む位置に設けられ、前記部品搭載作業部において前記部品の搭載作業が行われた前記基板に前記部品搭載作業部で搭載された前記部品を圧着する第１の部品圧着作業部及び第２の部品圧着作業部と、
    　前記部品搭載作業部と前記第１の部品圧着作業部の間を水平方向に移動自在に設けられ、基板載置ステージに前記基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部による前記基板に対する前記部品の搭載作業が行われた後、前記第１の部品圧着作業部の側に移動して前記基板載置ステージに載置された状態のままの前記基板を前記第１の部品圧着作業部に移送する第１の基板移送手段と、
    　前記部品搭載作業部と前記第２の部品圧着作業部の間を水平方向に移動自在に設けられ、前記基板載置ステージに前記基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部による前記基板に対する前記部品の搭載作業が行われた後、前記第２の部品圧着作業部の側に移動して前記基板載置ステージに載置された状態のままの前記基板を前記第２の部品圧着作業部に移送する第２の基板移送手段とを備えたことを特徴とする部品実装装置。
  2. 　外部より搬入された基板を保持する基板保持部と、前記基板保持部に保持された前記基板の前記部品搭載作業部により前記部品が搭載される箇所に接着部材を貼着する接着部材貼着作業部と、前記接着部材貼着作業部により前記接着部材が貼着された前記基板を前記第１の基板移送手段が備える前記基板載置ステージ及び前記第２の基板移送手段が備える前記基板載置ステージに振り分けて載置する基板移載手段とを備えたことを特徴とする請求項１に記載の部品実装装置。
  3. 　前記基板移載手段は、前記第１の部品圧着作業部により前記部品が圧着された前記基板を前記第１の基板移送手段が備える前記基板載置ステージから受け取って或いは前記第２の部品圧着作業部により前記部品が圧着された前記基板を前記第２の基板移送手段が備える前記基板載置ステージから受け取ってその基板を基板搬出部に受け渡すことを特徴とする請求項２に記載の部品実装装置。
  4. 　前記部品搭載作業部は、前記第１の基板移送手段により移送された前記基板又は前記第２の基板移送手段により移送された前記基板に対する前記部品の搭載作業を行う前に、前記第１の基板移送手段が備える前記基板載置ステージに対する基板の位置認識又は前記第２の基板移送手段が備える前記基板載置ステージに対する前記基板の位置認識を行う位置認識手段を備えたことを特徴とする請求項１乃至３の何れかに記載の部品実装装置。
  5. 　前記部品搭載作業部によって前記基板に搭載される前記部品は前記基板に搭載された状態で前記基板の外にはみ出すフィルム状部分を有し、前記第１の基板移送手段が備える前記基板載置ステージ及び前記第２の基板移送手段が備える前記基板載置ステージは前記部品が前記基板に搭載された状態で前記フィルム状部分を下方から支持するフィルム状部分支持部を備えたことを特徴とする請求項１に記載の部品実装装置。
  6. 　認識手段により前記基板載置ステージに載置された前記基板を認識して前記基板の位置に関する情報を取得する情報取得手段を備え、
    　前記第１の基板移送手段は、前記情報取得手段により取得された前記情報に基づいて前記基板載置ステージを移動させることにより、前記部品搭載作業部に対する前記基板の位置決め及び前記第１の部品圧着作業部に対する前記基板の位置決めを行うことを特徴とする請求項１に記載の部品実装装置。
  7. 　前記第１の基板移送手段は、前記情報取得手段により取得された前記情報を記憶部に記憶し、前記第１の部品圧着作業部に対する前記基板の位置決めを前記記憶部に記憶した前記情報に基づいて行うことを特徴とする請求項６に記載の部品実装装置。
  8. 　基板への部品の搭載作業が行われる部品搭載作業部と、前記部品搭載作業部を両側方から挟む位置に設けられ、前記部品搭載作業部において前記部品の搭載作業が行われた前記基板に前記部品搭載作業部で搭載された前記部品を圧着する第１の部品圧着作業部及び第２の部品圧着作業部と、前記部品搭載作業部と前記第１の部品圧着作業部の間を水平方向に移動自在に設けられた第１の基板移送手段及び前記部品搭載作業部と前記第２の部品圧着作業部の間を水平方向に移動自在に設けられた第２の基板移送手段とを備えた部品実装装置による部品実装方法であって、
    　前記第１の基板移送手段が備える基板載置ステージに基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部により前記基板に対する前記部品の搭載作業を行った後、前記第１の基板移送手段を前記第１の部品圧着作業部の側に移動させて前記基板載置ステージに載置させた状態のままの前記基板を前記第１の部品圧着作業部に移送し、前記第１の部品圧着作業部により前記基板に前記部品を圧着する工程と、
    　前記第２の基板移送手段が備える基板載置ステージに前記基板を載置させた状態でその基板を前記部品搭載作業部に移送し、前記部品搭載作業部により前記基板に対する前記部品の搭載作業を行った後、前記第２の基板移送手段を前記第２の部品圧着作業部の側に移動させて前記基板載置ステージに載置された状態のままの前記基板を前記第２の部品圧着作業部に移送し、前記第２の部品圧着作業部により前記基板に前記部品を圧着する工程とを含むことを特徴とする部品実装方法。
  9. 　前記基板載置ステージに載置した前記基板を認識して前記基板の位置に関する情報を取得する情報取得工程と、
    　前記情報取得工程で取得した前記情報に基づいて前記基板載置ステージを移動させることにより前記部品搭載作業部に対する前記基板の位置決めを行う第１の基板位置決め工程と、
    　前記搭載作業の後、前記基板載置ステージを前記第１の部品圧着作業部に移動させ、前記情報取得工程で取得した前記情報に基づいて前記基板載置ステージを移動させることにより前記第１の部品圧着作業部に対する前記基板の位置決めを行う第２の基板位置決め工程と、を備える請求項８に記載の部品実装方法。
PCT/JP2013/004879 2012-08-22 2013-08-16 部品実装装置及び部品実装方法 WO2014030326A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380044132.8A CN104584712B (zh) 2012-08-22 2013-08-16 元件安装装置和安装方法
US14/422,512 US9780514B2 (en) 2012-08-22 2013-08-16 Component mounting method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012-182911 2012-08-22
JP2012182911A JP5834212B2 (ja) 2012-08-22 2012-08-22 部品実装装置及び部品実装方法
JP2012-192890 2012-09-03
JP2012192890A JP5845417B2 (ja) 2012-09-03 2012-09-03 部品実装装置及び部品実装方法

Publications (1)

Publication Number Publication Date
WO2014030326A1 true WO2014030326A1 (ja) 2014-02-27

Family

ID=50149653

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/004879 WO2014030326A1 (ja) 2012-08-22 2013-08-16 部品実装装置及び部品実装方法

Country Status (3)

Country Link
US (1) US9780514B2 (ja)
CN (1) CN104584712B (ja)
WO (1) WO2014030326A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015177086A (ja) * 2014-03-17 2015-10-05 パナソニックＩｐマネジメント株式会社 部品実装装置及び部品実装方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6467622B2 (ja) * 2014-10-20 2019-02-13 パナソニックＩｐマネジメント株式会社 部品圧着装置
DE102015220746A1 (de) * 2015-10-23 2017-04-27 Ersa Gmbh Verfahren und Vorrichtung zur Platzierung elektronischer Bauteile
JP6998508B2 (ja) * 2017-11-07 2022-01-18 パナソニックＩｐマネジメント株式会社 圧着装置及び圧着方法
CN112566485B (zh) * 2019-09-25 2022-05-13 芝浦机械电子装置株式会社 电子零件的安装装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11261214A (ja) * 1998-03-09 1999-09-24 Shibaura Mechatronics Corp 部品実装装置
JP2006093534A (ja) * 2004-09-27 2006-04-06 Matsushita Electric Ind Co Ltd ワークの組立装置および組立方法
JP2006222286A (ja) * 2005-02-10 2006-08-24 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP2010171088A (ja) * 2009-01-20 2010-08-05 Panasonic Corp 圧着装置及び圧着方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3765075A (en) * 1972-01-03 1973-10-16 Honeywell Inf Systems Method and apparatus for inserting pins into a circuit board
US4748741A (en) * 1987-03-31 1988-06-07 Northern Telecom Limited Pin insertion apparatus and method of inserting pins
US6076394A (en) * 1996-09-02 2000-06-20 Fuji Machine Mfg. Co., Ltd. Electric component transferring apparatus having function of testing negative-pressure suction, and apparatus and method for testing negative-pressure suction
JP3879730B2 (ja) 2003-10-24 2007-02-14 松下電器産業株式会社 圧着対象物の圧着方法
US7654512B2 (en) * 2004-09-16 2010-02-02 Canon Kabushiki Kaisha Image forming system, image forming method and image forming apparatus
WO2006085462A1 (ja) 2005-02-10 2006-08-17 Matsushita Electric Industrial Co., Ltd. 部品実装装置、及び基板搬送方法
JP4965113B2 (ja) 2005-11-22 2012-07-04 パナソニック株式会社 接合シート貼付装置及び方法
JP2011199056A (ja) * 2010-03-19 2011-10-06 Hitachi High-Technologies Corp Ｆｐｄモジュールの組立装置
JP6467622B2 (ja) * 2014-10-20 2019-02-13 パナソニックＩｐマネジメント株式会社 部品圧着装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11261214A (ja) * 1998-03-09 1999-09-24 Shibaura Mechatronics Corp 部品実装装置
JP2006093534A (ja) * 2004-09-27 2006-04-06 Matsushita Electric Ind Co Ltd ワークの組立装置および組立方法
JP2006222286A (ja) * 2005-02-10 2006-08-24 Matsushita Electric Ind Co Ltd 部品実装装置及び部品実装方法
JP2010171088A (ja) * 2009-01-20 2010-08-05 Panasonic Corp 圧着装置及び圧着方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015177086A (ja) * 2014-03-17 2015-10-05 パナソニックＩｐマネジメント株式会社 部品実装装置及び部品実装方法

Also Published As

Publication number Publication date
CN104584712A (zh) 2015-04-29
CN104584712B (zh) 2017-03-08
US20150222071A1 (en) 2015-08-06
US9780514B2 (en) 2017-10-03

Similar Documents

Publication Publication Date Title
JP5834212B2 (ja) 部品実装装置及び部品実装方法
WO2014030326A1 (ja) 部品実装装置及び部品実装方法
JP6528116B2 (ja) Ａｃｆ貼着方法及びａｃｆ貼着装置
TW201203408A (en) FPD module assembling apparatus
JP5845446B2 (ja) 部品実装装置及び部品実装方法
CN109643666A (zh) 安装方法和安装装置
JP6043962B2 (ja) 部品実装装置及び部品実装方法
JP5845417B2 (ja) 部品実装装置及び部品実装方法
JP2003059975A (ja) ボンディング方法
JP6340580B2 (ja) 部品実装装置
JP6413078B2 (ja) 部品搭載装置
JP6051409B2 (ja) 部品実装装置
JP6393904B2 (ja) Ａｃｆ貼着方法及びａｃｆ貼着装置
CN106061133B (zh) 部件安装装置以及部件安装方法
JP6051410B2 (ja) 部品実装装置
JP6393903B2 (ja) Ａｃｆ貼着方法及びａｃｆ貼着装置
JP2016164902A (ja) 検査用基板の準備方法および部品圧着装置における圧着動作検査方法
JP5370280B2 (ja) テープ貼付け装置およびテープ貼付け方法
JP6244550B2 (ja) 部品実装装置における保護シート交換方法
JP6405522B2 (ja) 部品実装装置及び部品実装方法
JP7304505B2 (ja) 部品実装装置及び部品実装方法
JP7129645B2 (ja) 圧着方法および圧着装置
JP2023017936A (ja) 部品実装方法及び部品実装ライン
JP6547126B2 (ja) 部品実装装置及び部品支持部材の取り付け状態の判定方法
JP2016009700A (ja) 部品実装装置及び部品実装装置における作業者の支援方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13830297

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 14422512

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13830297

Country of ref document: EP

Kind code of ref document: A1