WO2014017063A1 - 半導体基板、半導体基板の製造方法及び複合基板の製造方法 - Google Patents
半導体基板、半導体基板の製造方法及び複合基板の製造方法 Download PDFInfo
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- WO2014017063A1 WO2014017063A1 PCT/JP2013/004439 JP2013004439W WO2014017063A1 WO 2014017063 A1 WO2014017063 A1 WO 2014017063A1 JP 2013004439 W JP2013004439 W JP 2013004439W WO 2014017063 A1 WO2014017063 A1 WO 2014017063A1
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- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
- H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
- H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
Definitions
- the present invention relates to a semiconductor substrate, a method for manufacturing a semiconductor substrate, and a method for manufacturing a composite substrate.
- Non-Patent Document 1 discloses a CMOSFET structure in which an N-channel MOSFET using a III-V group compound semiconductor as a channel and a P-channel MOSFET using Ge as a channel are formed on a single substrate.
- Non-Patent Document 2 discloses a technique in which an AlAs layer is formed as a sacrificial layer on a GaAs substrate, and the Ge layer formed on the sacrificial layer (AlAs layer) is transferred to a silicon substrate.
- Non-Patent Document 1 S. Takagi, et al., SSE, vol. 51, pp. 526-536, 2007.
- Non-Patent Document 2 Y. Bai and E. A. Fitzgerald, ECS Transactions, 33 (6) 927-932 (2010)
- An N-channel MISFET having a III-V group compound semiconductor as a channel Metal-Insulator-Semiconductor-Field-Effect-Transistor, sometimes referred to simply as "nMISFET” in this specification
- nMISFET Metal-Insulator-Semiconductor-Field-Effect-Transistor
- P-channel having a group IV semiconductor as a channel
- pMISFET Group III-V compound semiconductor crystal layer for nMISFET and a group IV semiconductor for pMISFET
- a technique for forming a crystal layer on a single substrate is required.
- nMISFET and pMISFET As LSI (Large Scale Integration), it is possible to form a semiconductor crystal layer for nMISFET or pMISFET on a silicon substrate capable of utilizing existing manufacturing equipment and existing processes. preferable.
- a group III-V compound semiconductor crystal layer and a group IV semiconductor crystal layer can be formed on a single substrate, and these semiconductor crystal layers are formed on a silicon substrate advantageous for manufacturing. Can be formed.
- the semiconductor crystal layer is separated from the semiconductor crystal layer forming substrate by etching and removing the sacrificial layer. Therefore, when the semiconductor crystal layer is separated, it is necessary to use an etchant having a large etching selection ratio of the sacrificial layer to the semiconductor crystal layer, that is, an etchant having a large etching rate of the sacrificial layer while the semiconductor crystal layer is not substantially etched. is there. Since the sacrificial layer is based on the premise that the semiconductor crystal layer can be formed thereon by the epitaxial growth method, it is necessary to satisfy both the requirement that the semiconductor crystal layer can be epitaxially grown and the requirement that the etching selectivity is sufficient.
- the selection of the sacrificial layer and the etchant may be difficult depending on the material of the semiconductor crystal layer.
- the semiconductor crystal layer is a group III-V compound semiconductor
- an electronic device is often created using a heterojunction
- the semiconductor crystal layer is often a stack of a plurality of layers.
- the etching selection ratio of the sacrificial layer is required for all of the plurality of semiconductor crystal layers constituting the stacked layer, so that the selection of the etching agent tends to be more difficult, and an appropriate etching agent is required. May not exist.
- An object of the present invention is to provide a technique capable of selecting an appropriate combination of a sacrificial layer and an etching agent regardless of the material or structure of the semiconductor crystal layer when the semiconductor crystal layer is separated from the substrate using the sacrificial layer. There is to do.
- a semiconductor crystal layer has a first semiconductor crystal layer, a second semiconductor crystal layer, and a third semiconductor crystal layer on a semiconductor crystal layer forming substrate.
- the layer formation substrate, the first semiconductor crystal layer, the second semiconductor crystal layer, and the third semiconductor crystal layer are positioned in the order of the semiconductor crystal layer formation substrate, the first semiconductor crystal layer, the second semiconductor crystal layer, and the third semiconductor crystal layer.
- both the etching rate of the first semiconductor crystal layer by the first etching agent and the etching rate of the third semiconductor crystal layer by the first etching agent are higher than the etching rate of the second semiconductor crystal layer by the first etching agent.
- Both the etching rate of the first semiconductor crystal layer by the second etchant and the etching rate of the third semiconductor crystal layer by the second etchant are the same as those of the second semiconductor crystal layer. Providing smaller semiconductor substrate than the etching rate with the quenching agent.
- the semiconductor crystal layer forming substrate, the first semiconductor crystal layer, the second semiconductor crystal layer, the third semiconductor crystal layer, and the fourth semiconductor crystal layer may be a semiconductor crystal layer.
- the forming substrate, the first semiconductor crystal layer, the second semiconductor crystal layer, the third semiconductor crystal layer, and the fourth semiconductor crystal layer are positioned in this order, and the etching rate of the first semiconductor crystal layer by the first etchant and the third semiconductor crystal layer
- the etching rate of the first etching agent is higher than the etching rate of the fourth semiconductor crystal layer by the first etching agent, and the etching rate of the first semiconductor crystal layer by the second etching agent and the third semiconductor crystal layer Any of the etching rates by the second etching agent may be smaller than the etching rate by the second etching agent of the fourth semiconductor crystal layer.
- the etching rate of the semiconductor crystal layer forming substrate by the first etching agent may be equal to the etching rate of the second semiconductor crystal layer by the first etching agent, and the etching rate of the semiconductor crystal layer forming substrate by the second etching agent is The etching rate of the second semiconductor crystal layer by the second etchant may be equivalent.
- the first semiconductor crystal layer and the third semiconductor crystal layer may be made of InGaAs or InAs, and the second semiconductor crystal layer may be made of InP.
- the semiconductor substrate further includes a fourth semiconductor crystal layer, the fourth semiconductor crystal layer may be made of InP.
- the third semiconductor crystal layer may have a semiconductor multilayer structure.
- the semiconductor multilayer structure is preferably composed of a plurality of semiconductor layers lattice-matched or pseudo-lattice-matched to InP.
- the semiconductor crystal layer forming substrate is made of GaAs or Ge
- the first semiconductor crystal layer and the third semiconductor crystal layer may be made of SiGe
- the second semiconductor crystal layer may be made of Ge.
- the semiconductor substrate further includes a fourth semiconductor crystal layer
- the fourth semiconductor crystal layer may be made of Ge.
- the first semiconductor crystal layer, the second semiconductor crystal layer, and the third semiconductor crystal layer are formed on the semiconductor crystal layer forming substrate, the first semiconductor crystal layer, the second semiconductor crystal layer, The first semiconductor crystal layer, the second semiconductor crystal layer, and the third semiconductor crystal layer are etched by the first etching agent in the order of the third semiconductor crystal layer by an epitaxial growth method.
- the etching rate of the third semiconductor crystal layer by the first etching agent is higher than the etching rate of the second semiconductor crystal layer by the first etching agent, and the etching rate of the first semiconductor crystal layer by the second etching agent and Any of the etching rates of the third semiconductor crystal layer by the second etching agent is the etching rate of the second semiconductor crystal layer by the second etching agent.
- the first semiconductor crystal layer, the second semiconductor crystal layer, the third semiconductor crystal layer, and the fourth semiconductor crystal layer are formed on the semiconductor crystal layer forming substrate.
- the etching rate of the first semiconductor crystal layer by the second etchant is higher than any of the etching rates of the first semiconductor crystal layer by the first etchant and the fourth semiconductor crystal layer.
- Each of the etching rates of the semiconductor crystal layer by the second etching agent is smaller than both the etching rate of the second semiconductor crystal layer by the second etching agent and the etching rate of the fourth semiconductor crystal layer by the second etching agent.
- a second etching step for etching the first semiconductor crystal layer is removed by etching using a first etchant, and the second semiconductor crystal layer and the third semiconductor crystal layer covered with the second cover layer are removed from the semiconductor crystal layer.
- the third semiconductor crystal layer may be etched using the first etching agent.
- the second semiconductor crystal layer and the third semiconductor crystal layer, which are removed by etching and covered with the third cover layer, are formed into a semiconductor.
- the third semiconductor crystal layer may be etched using the first etching agent.
- the step of forming the pattern of the first cover layer on the semiconductor substrate having the fourth semiconductor crystal layer described above, and the fourth semiconductor crystal layer using the first cover layer as a mask A first etching step for etching, a second etching step for etching the third semiconductor crystal layer using the first cover layer or the fourth semiconductor crystal layer patterned in the first etching step as a mask, and a first etching step Forming a pattern of the fourth cover layer covering the patterned fourth semiconductor crystal layer and the third semiconductor crystal layer patterned in the second etching step; and using the second cover agent as a mask and using the second etchant
- a third etching step for etching the second semiconductor crystal layer A step of separating the second semiconductor crystal layer, the third semiconductor crystal layer, and the fourth semiconductor crystal layer, which are removed by etching using a ching agent and covered with the fourth cover layer, from the semiconductor crystal layer forming substrate.
- a manufacturing method is provided. In the first etching step, the fourth semiconductor crystal layer may be etched using
- the step of forming the pattern of the first cover layer on the semiconductor substrate having the fourth semiconductor crystal layer described above, and the fourth semiconductor crystal layer using the first cover layer as a mask A first etching step of etching the second semiconductor crystal layer using a second etchant; a fourth semiconductor crystal layer patterned in the first etching step; a third semiconductor crystal; Forming a pattern of a fifth cover layer covering the layer and the second semiconductor crystal layer, and removing the first semiconductor crystal layer by etching using a first etchant and covering the second cover layer with the fifth cover layer And a step of separating the semiconductor crystal layer, the third semiconductor crystal layer, and the fourth semiconductor crystal layer from the semiconductor crystal layer forming substrate.
- the second cover layer, the third cover layer, the fourth cover layer, and the fifth cover layer are each composed of a third semiconductor crystal layer or the like according to the respective aspects. And the back surface and side surface of the semiconductor crystal layer forming substrate may be covered.
- the surface of the semiconductor substrate on which the third semiconductor crystal layer is formed faces the surface of the transfer destination substrate, and the semiconductor substrate
- the semiconductor crystal layer including the second semiconductor crystal layer and the third semiconductor crystal layer is left on the transfer destination substrate.
- the semiconductor substrate and the transfer destination substrate can be separated.
- a step of forming a sixth cover layer covering the entire surface of the semiconductor substrate and a step of patterning and removing a part of the sixth cover layer on the third semiconductor crystal layer Using the sixth cover layer on the third semiconductor crystal layer as a mask, etching the third semiconductor crystal layer, removing the second semiconductor crystal layer by etching using a second etchant, Separating the third semiconductor crystal layer from the semiconductor crystal layer forming substrate covered with the cover layer and the first semiconductor crystal layer.
- the method may further include a step of etching the second semiconductor crystal layer using the second cover agent using the sixth cover layer as a mask.
- the semiconductor crystal layer forming substrate includes a first semiconductor crystal layer, a second semiconductor crystal layer, and a third semiconductor crystal layer.
- Both the etching rate by the second etching agent and the etching rate by the second etching agent of the second semiconductor crystal layer are the etching rate by the second etching agent of the first semiconductor crystal layer and the second etching agent of the third semiconductor crystal layer.
- FIG. 1 is a cross-sectional view showing a semiconductor substrate 100.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using the semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using the semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using the semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using the semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using the semiconductor substrate 100 in the order of steps.
- FIG. FIG. 6 is a cross-sectional view showing a modification example in an example of a method for manufacturing a composite substrate using a semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view showing a modification example in an example of a method for manufacturing a composite substrate using a semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view illustrating another example of a method for manufacturing a composite substrate using a semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view illustrating another example of a method for manufacturing a composite substrate using a semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view illustrating another example of a method for manufacturing a composite substrate using a semiconductor substrate 100 in the order of steps.
- 2 is a cross-sectional view showing a semiconductor substrate 200.
- FIG. FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 6 is a cross-sectional view showing an example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 10 is a cross-sectional view illustrating another example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 10 is a cross-sectional view illustrating another example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 10 is a cross-sectional view illustrating another example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 10 is a cross-sectional view illustrating still another example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 10 is a cross-sectional view illustrating still another example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 10 is a cross-sectional view illustrating still another example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 10 is a cross-sectional view illustrating still another example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 10 is a cross-sectional view illustrating still another example of a method for manufacturing a composite substrate using a semiconductor substrate 200 in the order of steps.
- FIG. 10 is a cross-sectional view illustrating still another
- FIG. 6 is a cross-sectional view illustrating still another example of a method for manufacturing a composite substrate using a semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view illustrating still another example of a method for manufacturing a composite substrate using a semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view illustrating still another example of a method for manufacturing a composite substrate using a semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view illustrating still another example of a method for manufacturing a composite substrate using a semiconductor substrate 100 in the order of steps.
- FIG. 6 is a cross-sectional view illustrating still another example of a method for manufacturing a composite substrate using a semiconductor substrate 100 in the order of steps.
- FIG. 1 is a cross-sectional view showing a semiconductor substrate 100.
- the semiconductor substrate 100 has a first semiconductor crystal layer 104, a second semiconductor crystal layer 106, and a third semiconductor crystal layer 108 on a semiconductor crystal layer formation substrate 102.
- the semiconductor crystal layer formation substrate 102, the first semiconductor crystal layer 104, the second semiconductor crystal layer 106, and the third semiconductor crystal layer 108 are the semiconductor crystal layer formation substrate 102, the first semiconductor crystal layer 104, the second semiconductor crystal layer 106,
- the third semiconductor crystal layer 108 is located in this order.
- the first semiconductor crystal layer 104 is a layer that functions as a sacrificial layer
- the second semiconductor crystal layer 106 is a layer that functions as an etching stopper
- the third semiconductor crystal layer 108 is transferred and used as an active layer of a semiconductor device or the like. Is the layer to be played.
- the semiconductor crystal layer forming substrate 102 is a substrate for forming the high-quality third semiconductor crystal layer 108.
- a preferable material of the semiconductor crystal layer forming substrate 102 depends on a material, a forming method, and the like of the third semiconductor crystal layer 108.
- the semiconductor crystal layer forming substrate 102 is preferably made of a material that lattice matches or pseudo-lattice matches with the third semiconductor crystal layer 108 to be formed.
- the semiconductor crystal layer forming substrate 102 is preferably an InP single crystal substrate, and a GaAs substrate, a Si substrate, or the like can be selected.
- the semiconductor crystal layer formation substrate 102 is preferably a GaAs single crystal substrate, and a single crystal substrate of InP, sapphire, Ge, or SiC. Can be selected.
- the semiconductor crystal layer forming substrate 102 is a GaAs single crystal substrate or an InP single crystal substrate, the plane orientation on which the third semiconductor crystal layer 108 is formed includes the (100) plane or the (111) plane.
- the first semiconductor crystal layer 104 is a sacrificial layer for separating the semiconductor crystal layer formation substrate 102 from the second semiconductor crystal layer 106 and the third semiconductor crystal layer 108. By removing the first semiconductor crystal layer 104 by etching, the semiconductor crystal layer forming substrate 102 is separated from the second semiconductor crystal layer 106 and the third semiconductor crystal layer 108.
- an InP single crystal substrate is selected as the semiconductor crystal layer forming substrate 102 and an InP layer is selected as the second semiconductor crystal layer 106
- an InGaAs layer or InAs layer can be selected as the first semiconductor crystal layer 104
- an InAs layer or In x Ga layer can be selected.
- a 1-x As layer (1>x> 0.53) is preferred.
- the first semiconductor crystal layer 104 is preferably a SiGe layer.
- the first semiconductor crystal layer 104 is preferably an AlAs layer, and an InAlAs layer, InGaP layer, InAlP layer, InGaAlP A layer or an AlSb layer can be selected. As the thickness of the first semiconductor crystal layer 104 increases, the crystallinity of the third semiconductor crystal layer 108 tends to decrease.
- the second semiconductor crystal layer 106 is an etching stopper layer when etching the first semiconductor crystal layer 104 which is a sacrificial layer.
- the second semiconductor crystal layer 106 only needs to have an etching selectivity with respect to the first semiconductor crystal layer 104.
- a specific example of the second semiconductor crystal layer 106 is an InP layer, a Ge layer, or a GaAs layer as exemplified above.
- the thickness of the second semiconductor crystal layer 106 can ensure the function as an etching stopper layer. It is preferable to be as thin as possible.
- the function of the etching stopper layer is a function of protecting the third semiconductor crystal layer 108 when the first semiconductor crystal layer 104 is etched.
- the thickness of the second semiconductor crystal layer 106 can be selected in the range of 0.1 nm to 10 ⁇ m.
- Examples of the third semiconductor crystal layer 108 include a crystal layer made of a group III-V compound semiconductor, a crystal layer made of a group IV semiconductor, or a crystal layer made of a group II-VI compound semiconductor.
- the group III-V compound semiconductor Al u Ga v In 1- u-v N m P n As q Sb 1-m-n-q (0 ⁇ u ⁇ 1,0 ⁇ v ⁇ 1,0 ⁇ m ⁇ 1 0 ⁇ n ⁇ 1, 0 ⁇ q ⁇ 1), for example, GaAs, In y Ga 1-y As (0 ⁇ y ⁇ 1), InP, or GaSb.
- Examples of the group IV semiconductor include Ge or Ge x Si 1-x (0 ⁇ x ⁇ 1).
- the II-VI group compound semiconductor examples include ZnO, ZnSe, ZnTe, CdS, CdSe, and CdTe.
- the group IV semiconductor is Ge x Si 1-x
- the Ge composition ratio x of Ge x Si 1-x is preferably 0.9 or more. By setting the Ge composition ratio x to 0.9 or more, semiconductor characteristics close to Ge can be obtained.
- the third semiconductor crystal layer 108 is used as an active layer of a high mobility field effect transistor, in particular, a high mobility complementary field effect transistor. It becomes possible.
- the third semiconductor crystal layer 108 is not limited to those exemplified above, and semiconductor layers other than those exemplified are also applicable.
- the third semiconductor crystal layer 108 may be a semiconductor stacked body in which a plurality of types of semiconductor layers are stacked.
- Examples of the structure of the semiconductor laminate obtained in the present invention include an AlGaAs buffer layer, an n-type AlGaAs electron supply layer, an In x Ga 1-x As (0 ⁇ x ⁇ 0.4) channel layer, and an n-type AlGaAs electron supply layer.
- a HEMT (High Electron Mobility Transistor) structure having an n-type AlGaAs contact layer.
- the HBT Heterojunction Bipolar Transistor
- MESFET Metal-Semiconductor Field Effect Transistor
- VCSEL Vertical Cavity Surface Emitting LASER
- red LED Light Emitting Diode
- semiconductor laser structure photodiode Examples
- the examples given here are merely examples, and the present invention can be applied to all device structures using III-V semiconductor heterojunctions.
- the thickness of the third semiconductor crystal layer 108 can be appropriately selected within the range of 0.1 nm to 500 ⁇ m.
- the thickness of the third semiconductor crystal layer 108 is preferably 0.1 nm or more and less than 1 ⁇ m.
- the third semiconductor crystal layer 108 By setting the third semiconductor crystal layer 108 to be less than 1 ⁇ m, it can be used for a composite substrate suitable for manufacturing a high-performance transistor such as an ultra-thin body MISFET.
- the semiconductor crystal layer formation is performed.
- the relationship among the etching rates of the substrate 102, the first semiconductor crystal layer 104, the second semiconductor crystal layer 106, and the third semiconductor crystal layer 108 must satisfy the following conditions. That is, both the etching rate of the first semiconductor crystal layer 104 by the first etching agent and the etching rate of the third semiconductor crystal layer 108 by the first etching agent are both the etching rates of the second semiconductor crystal layer 106 by the first etching agent. Bigger than.
- Both the etching rate of the first semiconductor crystal layer 104 by the second etching agent and the etching rate of the third semiconductor crystal layer 108 by the second etching agent are both the etching rate of the second semiconductor crystal layer 106 by the second etching agent. Smaller than.
- the first semiconductor crystal layer 104 functions as a sacrificial layer
- the second semiconductor crystal layer 106 functions as an etching stopper layer.
- the third semiconductor crystal layer 108 can be separated from the semiconductor crystal layer formation substrate 102.
- the etching rate of the semiconductor crystal layer forming substrate 102 by the first etching agent may be equal to the etching rate of the second semiconductor crystal layer 106 by the first etching agent.
- the etching rate of the semiconductor crystal layer forming substrate 102 by the second etching agent may be equal to the etching rate of the second semiconductor crystal layer 106 by the second etching agent.
- “Etching agent” includes both “etching solution” and “etching gas”. That is, the etching in this specification includes both wet etching and dry etching.
- the semiconductor crystal layer forming substrate 102 may be made of InP, the first semiconductor crystal layer 104 and the third semiconductor crystal layer 108 may be made of InGaAs or InAs, and the second semiconductor crystal layer 106 may be made of InP.
- InGaAs or InAs used for the first semiconductor crystal layer 104 and the third semiconductor crystal layer 108 is lattice-matched to InP.
- InGaAs In x Ga 1-x As (1>x> 0.53) is preferable.
- the semiconductor crystal layer forming substrate 102 may be made of GaAs or Ge, the first semiconductor crystal layer 104 and the third semiconductor crystal layer 108 may be made of SiGe, and the second semiconductor crystal layer 106 may be made of Ge.
- the third semiconductor crystal layer 108 may have a semiconductor stacked structure.
- the semiconductor multilayer structure is composed of a plurality of semiconductor layers lattice-matched or pseudo-lattice-matched to InP.
- the semiconductor multilayer structure may constitute a quantum well.
- the semiconductor multilayer structure may be a strained superlattice structure designed so that the lattice constant gradually increases or decreases in the thickness direction of the third semiconductor crystal layer 108. In this case, even when a crystal layer is formed on the third semiconductor crystal layer 108, the crystal layer does not need to be lattice-matched or pseudo-lattice-matched to InP.
- the first semiconductor crystal layer 104, the second semiconductor crystal layer 106, and the third semiconductor crystal layer 108 are sequentially formed on the semiconductor crystal layer forming substrate 102 by an epitaxial growth method, a CVD (Chemical Vapor Deposition) method, a sputtering method, or an ALD (Atomic). It is formed by the layer deposition method.
- a MOCVD (Metal Organic Chemical Vapor Deposition) method or MBE (Molecular Beam Epitaxy) method can be used as the epitaxial growth method.
- TMGa trimethyl gallium
- TMA trimethyl
- Aluminum, TMIn trimethylindium
- AsH 3 arsine
- PH 3 phosphine
- a group IV semiconductor crystal layer is formed by the CVD method as the first semiconductor crystal layer 104, the second semiconductor crystal layer 106, or the third semiconductor crystal layer 108
- GeH 4 germane
- SiH 4 silane
- Si 2 H 6 diisilane
- Hydrogen can be used as the carrier gas.
- a compound in which a part of a plurality of hydrogen atom groups of the source gas is substituted with a chlorine atom or a hydrocarbon group can also be used.
- the reaction temperature can be appropriately selected within the range of 300 ° C to 900 ° C, preferably within the range of 400 to 800 ° C.
- the thickness of the first semiconductor crystal layer 104, the second semiconductor crystal layer 106, or the third semiconductor crystal layer 108 can be controlled by appropriately selecting the source gas supply amount and the reaction time.
- (Embodiment 2) 2 to 6 are cross-sectional views illustrating an example of a method of manufacturing a composite substrate using the semiconductor substrate 100 in the order of steps.
- the method for manufacturing a composite substrate according to the second embodiment uses the semiconductor substrate 100 described in the first embodiment.
- the first cover layer 120 may be either inorganic or organic.
- the inorganic material include Al 2 O 3 , SiO 2 , SiN, and ZrO 2 .
- the organic substance include a photoresist, wax (Apiezon-W, etc.), and silicone rubber (PDMS, etc.).
- the inorganic first cover layer 120 can be formed by atomic layer deposition (ALD) or CVD. The ALD method is desirable in view of good step coverage.
- the organic first cover layer 120 can be formed by spin coating or the like.
- the pattern of the first cover layer 120 can be formed in an arbitrary shape using a photoresist and lithography.
- the third semiconductor crystal layer 108 is etched using the first cover layer 120 as a mask and a first etchant (first etching step).
- first etching step an aqueous solution containing phosphoric acid and hydrogen peroxide can be exemplified as the first etching agent.
- a pattern of the second cover layer 130 covering the third semiconductor crystal layer 108 patterned in the first etching step is formed.
- the second cover layer 130 of this example covers the surface and side surfaces of the third semiconductor crystal layer 108.
- An end portion of the second cover layer 130 covering the side surface of the third semiconductor crystal layer 108 is in contact with the second semiconductor crystal layer 106. That is, the entire surface of the third semiconductor crystal layer 108 is covered with the second cover layer 130 and the second semiconductor crystal layer 106.
- the material and formation method of the second cover layer 130 are the same as those of the first cover layer 120.
- the first cover layer 120 may or may not be removed before the formation of the second cover layer 130. When the first cover layer 120 is not removed, the entire surface of the third semiconductor crystal layer 108 is covered with the first cover layer 120, the second cover layer 130, and the second semiconductor crystal layer 106.
- the second semiconductor crystal layer 106 is etched using the second cover layer 130 as a mask and a second etchant (second etching step).
- second etching step a hydrochloric acid aqueous solution can be exemplified as the second etching agent.
- the first semiconductor crystal layer 104 is removed by etching using the first etchant, and the second semiconductor crystal layer 106 and the third semiconductor crystal covered with the second cover layer 130 are removed.
- the layer 108 is separated from the semiconductor crystal layer forming substrate 102.
- the third semiconductor crystal layer 108 is separated from the second cover layer 130 and the second semiconductor crystal when the third semiconductor crystal layer 108 is separated from the semiconductor crystal layer forming substrate 102.
- a material similar to that of the first semiconductor crystal layer 104 can be used as the third semiconductor crystal layer 108, and the etching agent (first film) is not limited to the material of the third semiconductor crystal layer 108 used as the active layer. Etching agent) can be selected. Accordingly, the degree of freedom in manufacturing the composite substrate is improved, and the manufacturing is facilitated.
- the etching agent used for etching the third semiconductor crystal layer 108 may not be the first etching agent.
- the second cover layer 130 is bonded to the transfer destination substrate 220 as shown in FIG. 7, and the third semiconductor crystal layer 108 is replaced with the semiconductor crystal layer forming substrate as shown in FIG. It may be separated from 102.
- the separated third semiconductor crystal layer 108 including the second cover layer 130 and the second semiconductor crystal layer 106) is attached to the transfer destination substrate 220, the recovery becomes easy.
- FIG. 3 are cross-sectional views illustrating other examples of the method of manufacturing a composite substrate using the semiconductor substrate 100 in the order of steps.
- the pattern of the first cover layer 120 is formed on the semiconductor substrate 100, and the third semiconductor crystal layer 108 is etched using the first cover agent using the first cover layer 120 as a mask (first etching step). Is the same as in the second embodiment.
- the second semiconductor crystal layer 106 is etched using the first cover layer 120 or the third semiconductor crystal layer 108 patterned in the first etching step as a mask and using a second etchant. (Second etching step).
- a pattern of the third cover layer 140 covering the third semiconductor crystal layer 108 patterned in the first etching step and the second semiconductor crystal layer 106 patterned in the second etching step is formed.
- the third cover layer 140 of this example covers the surface and side surfaces of the third semiconductor crystal layer 108 and the side surfaces of the second semiconductor crystal layer 106.
- End portions of the third cover layer 140 covering the side surfaces of the second semiconductor crystal layer 106 and the third semiconductor crystal layer 108 are in contact with the first semiconductor crystal layer 104.
- the material and formation method of the third cover layer 140 are the same as those of the first cover layer 120.
- the first semiconductor crystal layer 104 is removed by etching using the first etchant, and the second semiconductor crystal layer 106 and the third semiconductor crystal layer covered with the third cover layer 140 are removed. 108 is separated from the semiconductor crystal layer forming substrate 102.
- the transfer destination substrate 220 can be applied as in the second embodiment.
- FIG. 12 is a cross-sectional view showing the semiconductor substrate 200.
- the semiconductor substrate 200 of the fourth embodiment is the same as the semiconductor substrate 100 of the first embodiment except that the fourth semiconductor crystal layer 210 is provided. Therefore, the duplicate description is omitted.
- the material of the fourth semiconductor crystal layer 210 is the same as that of the second semiconductor crystal layer 106. However, the fourth semiconductor crystal layer 210 forms a heterojunction with the third semiconductor crystal layer 108, and is used as an active layer of a semiconductor device.
- the method for manufacturing the fourth semiconductor crystal layer 210 is the same as the method for manufacturing the second semiconductor crystal layer 106.
- the semiconductor substrate 200 further includes a fourth semiconductor crystal layer 210.
- the layer 210 is positioned in the order of the semiconductor crystal layer formation substrate 102, the first semiconductor crystal layer 104, the second semiconductor crystal layer 106, the third semiconductor crystal layer 108, and the fourth semiconductor crystal layer 210. Both the etching rate of the first semiconductor crystal layer 104 by the first etching agent and the etching rate of the third semiconductor crystal layer 108 by the first etching agent are higher than the etching rate of the fourth semiconductor crystal layer 210 by the first etching agent. large.
- Both the etching rate of the first semiconductor crystal layer 104 by the second etching agent and the etching rate of the third semiconductor crystal layer 108 by the second etching agent are both the etching rate of the fourth semiconductor crystal layer 210 by the second etching agent. Smaller than. In this example, the etching rate of the second semiconductor crystal layer 106 and the etching rate of the fourth semiconductor crystal layer 210 are the same regardless of the etching agent.
- the semiconductor crystal layer forming substrate 102 is made of InP
- the first semiconductor crystal layer 104 and the third semiconductor crystal layer 108 are made of InGaAs or InAs
- the second semiconductor crystal layer 106 and the fourth semiconductor crystal layer 210 are made of InP. It can be illustrated.
- the semiconductor crystal layer forming substrate 102 is made of GaAs or Ge
- the first semiconductor crystal layer 104 and the third semiconductor crystal layer 108 are made of SiGe
- the second semiconductor crystal layer 106 and the fourth semiconductor crystal layer 210 are made of Ge. Things can be illustrated.
- FIG. 5 are cross-sectional views showing an example of a method of manufacturing a composite substrate using the semiconductor substrate 200 in the order of steps.
- a pattern of the first cover layer 120 is formed on the semiconductor substrate 200, and as shown in FIG. 14, the first cover layer 120 is used as a mask and a second etchant is used to form the fourth cover layer.
- the semiconductor crystal layer 210 is etched (first etching step).
- the third semiconductor crystal layer 108 is etched using the first cover layer 120 or the fourth semiconductor crystal layer 210 patterned in the first etching step as a mask and using the first etchant (first step). 2 etching step).
- the etching agent used for etching the third semiconductor crystal layer 108 may not be the first etching agent.
- the etchant used for etching the fourth semiconductor crystal layer 210 may not be the second etchant.
- a pattern of a fourth cover layer 150 covering the fourth semiconductor crystal layer 210 patterned in the first etching step and the third semiconductor crystal layer 108 patterned in the second etching step is formed.
- the second semiconductor crystal layer 106 is etched using the fourth cover layer 150 as a mask and a second etching agent (third etching step).
- the first semiconductor crystal layer 104 is removed by etching using the first etching agent, and the second semiconductor crystal layer 106 and the third semiconductor crystal layer covered with the fourth cover layer 150. 108 and the fourth semiconductor crystal layer 210 are separated from the semiconductor crystal layer forming substrate 102.
- the third semiconductor crystal layer 108 and the fourth semiconductor crystal layer 210 are made of different materials and the selection of the etching agent is largely limited, the third semiconductor crystal layer 108 and the fourth semiconductor crystal layer 210 are surrounded by the fourth cover layer 150 and the second semiconductor crystal layer 106, so that they are easily corroded by the third semiconductor crystal layer 108 and the fourth semiconductor crystal layer 210, particularly the first etching agent.
- the third semiconductor crystal layer 108 is not exposed to the first etchant when the first semiconductor crystal layer 104 is etched.
- the fourth semiconductor crystal layer 210 is surrounded by the fourth cover layer 150 and the third semiconductor crystal layer 108, the fourth semiconductor crystal layer 210 that is easily corroded by the second etchant becomes the second semiconductor crystal layer. There is no exposure to the second etchant during the etching of 106. Therefore, the same material as the first semiconductor crystal layer 104 can be used for the third semiconductor crystal layer 108 and is limited to the material of the third semiconductor crystal layer 108 that forms a heterojunction with the fourth semiconductor crystal layer 210.
- the etching agent first etching agent
- the transfer destination substrate 220 can be applied as in the second embodiment.
- FIG. 19 to FIG. 21 are cross-sectional views showing another example of a method of manufacturing a composite substrate using the semiconductor substrate 200 in the order of steps.
- a pattern of the first cover layer 120 is formed on the semiconductor substrate 200, the fourth cover crystal layer 210 is formed by using the first cover layer 120 as a mask, the fourth semiconductor crystal layer 210 by using the second etchant, and the third by using the first etchant.
- the process is the same as in the fifth embodiment until the semiconductor crystal layer 108 is etched.
- the second semiconductor crystal layer 106 is sequentially etched using a second etching agent (first etching step).
- first etching step first etching step
- a pattern of the fifth cover layer 160 covering the fourth semiconductor crystal layer 210, the third semiconductor crystal layer 108, and the second semiconductor crystal layer 106 patterned in the first etching step is formed.
- the first semiconductor crystal layer 104 is removed by etching using the first etching agent, and the second semiconductor crystal layer 106 and the third semiconductor crystal layer covered with the fifth cover layer 160 are obtained.
- 108 and the fourth semiconductor crystal layer 210 are separated from the semiconductor crystal layer forming substrate 102.
- the transfer destination substrate 220 can be applied as in the second embodiment.
- a plurality of sets of the crystal layer 108 and the fourth semiconductor crystal layer 210 may be repeatedly stacked on the semiconductor crystal layer forming substrate 102.
- the method for manufacturing the composite substrate is applied to the uppermost set.
- the second semiconductor crystal layer 106, the third semiconductor crystal layer 108, etc. are transferred to the transfer destination substrate 220, and then the second semiconductor crystal layer 106 and the third semiconductor crystal layer are similarly applied to the lower set. Transfer of 108 or the like can be performed. Thereby, the epitaxial growth process to the semiconductor crystal layer forming substrate 102 can be shortened.
- each of the second cover layer 130, the third cover layer 140, the fourth cover layer 150, and the fifth cover layer 160 covers the third semiconductor crystal layer 108 and the like according to the mode.
- the back surface and side surfaces of the semiconductor crystal layer forming substrate 102 may be covered.
- the fourth cover layer 150 covers the back surface and side surfaces of the semiconductor crystal layer forming substrate 102 will be described.
- 22 to 25 are cross-sectional views showing still another example of a method of manufacturing a composite substrate using the semiconductor substrate 200 in the order of steps.
- the fourth semiconductor crystal layer 210 and the third semiconductor crystal layer 108 are patterned by dry etching, as shown in FIG. 22, the fourth semiconductor crystal layer 210 and the third semiconductor crystal layer 108 are covered and the semiconductor crystal layer forming substrate 102 is covered.
- a cover layer 302 (corresponding to the fourth cover layer 150) is formed to cover the back and side surfaces of the cover.
- the fourth semiconductor crystal layer 210 and the third semiconductor crystal layer 108 are divided into a plurality of divided bodies.
- the cover layer 302 of this example is also formed on the exposed surface of the second semiconductor crystal layer 106.
- an Al 2 O 3 layer (ALD-Al 2 O 3 layer) formed by using the ALD method can be exemplified.
- Examples of the growth temperature of the ALD-Al 2 O 3 layer include 300 ° C., and examples of the source gas include TMA (trimethylaluminum) and water (H 2 O).
- the thickness of the ALD-Al 2 O 3 layer can be set to 33 nm, for example.
- the ALD-Al 2 O 3 layer can be post-annealed after formation.
- the pattern of the cover layer 302 is formed so as to include the patterns of the fourth semiconductor crystal layer 210 and the third semiconductor crystal layer 108.
- a portion of the cover layer 302 that does not cover the fourth semiconductor crystal layer 210 and the third semiconductor crystal layer 108 is etched to form a pattern of the cover layer 302.
- the second semiconductor crystal layer 106 and the first semiconductor crystal layer 104 are etched using the cover layer 302 as a mask.
- the first semiconductor crystal layer 104 is removed by etching (for example, wet etching) using the first etchant, and the cover is formed.
- the third semiconductor crystal layer 108 and the fourth semiconductor crystal layer 210 covered with the layer 302 and the second semiconductor crystal layer 106 can be separated from the semiconductor crystal layer formation substrate 102.
- the method of forming the cover layer 302 shown in FIGS. 22 to 25 can be applied to any of the above-described embodiments. 22 to 25, the back surface and the side surface of the semiconductor crystal layer forming substrate 102 are covered with the cover layer 302, and the semiconductor crystal layer forming substrate 102 is protected.
- FIG. 7 are cross-sectional views showing still another example of a method for manufacturing a composite substrate using the semiconductor substrate 100 in the order of steps.
- the back surface and side surface of the semiconductor crystal layer forming substrate 102 are covered with the cover layer 402, and the surface is covered with the first semiconductor crystal layer 104, so that the semiconductor crystal layer forming substrate 102 is selectively etched.
- the second semiconductor crystal layer 106 made of a material with no ratio can be used as a sacrificial layer.
- both the etching rate of the semiconductor crystal layer forming substrate 102 by the second etching agent and the etching rate of the second semiconductor crystal layer 106 by the second etching agent are caused by the second etching agent of the first semiconductor crystal layer 104.
- the etching rate is higher than both the etching rate of the third semiconductor crystal layer 108 by the second etching agent.
- the entire surface of the semiconductor substrate 100 is covered with a cover layer 402.
- an Al 2 O 3 layer (ALD-Al 2 O 3 layer) formed by using an ALD method can be exemplified.
- the growth temperature of the ALD-Al 2 O 3 layer include 300 ° C.
- examples of the source gas include TMA (trimethylaluminum) and water (H 2 O).
- the thickness of the ALD-Al 2 O 3 layer can be set to 33 nm, for example.
- the ALD-Al 2 O 3 layer can be post-annealed after formation.
- the cover layer 402 is patterned on the third semiconductor crystal layer 108, and as shown in FIG. 28, the third semiconductor crystal layer 108 is etched using the patterned cover layer 402 as a mask.
- the second semiconductor crystal layer 106 may be etched by, for example, a dry etching method.
- the second semiconductor crystal layer 106 is removed by etching (for example, wet etching) using a second etching agent, and the first semiconductor crystal layer 106 is removed. 3
- the semiconductor crystal layer 108 can be separated from the semiconductor crystal layer forming substrate 102. Even if the semiconductor crystal layer forming substrate 102 is etched by the second etching agent, the semiconductor crystal layer forming substrate 102 is protected by the cover layer 402 and the first semiconductor crystal layer 104. It is not exposed and is protected from etching.
- Example of Embodiment 7 A 100 nm In 0.53 Ga 0.47 As layer (first semiconductor crystal layer 104 functioning as a cover layer) and a 100 nm InP layer (functioning as a sacrificial layer) on a 2-inch InP substrate which is a semiconductor crystal layer forming substrate 102 A second semiconductor crystal layer 106) and a 200 nm In 0.53 Ga 0.47 As layer (third semiconductor crystal layer 108 functioning as an active layer) are sequentially formed using an epitaxial crystal growth method by a low-pressure MOCVD method, A multilayer substrate was produced. Thereafter, the multilayer substrate was introduced into an ALD apparatus and coated with Al 2 O 3 (cover layer 402) of about 33 nm by the ALD method.
- Al 2 O 3 cover layer 402
- the deposition conditions for ALD-Al 2 O 3 were 300 ° C., 300 cycles, TMA (trimethylaluminum) as the aluminum source, and H 2 O as the oxidizing agent.
- TMA trimethylaluminum
- H 2 O the oxidizing agent.
- uniform Al 2 O 3 could be deposited on the front surface, back surface, and side surfaces of the multilayer substrate.
- a post-annealing treatment in nitrogen was performed at 600 ° C. for 90 seconds.
- the coating effect of the Al 2 O 3 layer was separately confirmed with an InP substrate (a substrate on which no semiconductor crystal layer was epitaxially grown). That is, after coating the InP substrate with Al 2 O 3 under the same conditions as described above, the InP substrate was immersed in hydrochloric acid, but etching did not proceed even after 5 hours or more, and the state before immersion was maintained.
- a positive resist film having a line & space pattern (LS pattern) with a line width of 300 ⁇ m / pitch of 200 ⁇ m is formed on a multilayer substrate, and dry etching using CHF 3 gas is performed using the resist film as a mask.
- CHF 3 gas was used to etch the ALD-Al 2 O 3 layer.
- the resist was removed by washing with acetone and ashing, and the etched level difference was measured with a contact-type level gauge to obtain a measurement value of about 40 nm. It is slightly larger than the design value 33nm of the Al 2 O 3 layer, but is a part of In 0.53 Ga 0.47 As layer of the underlying the Al 2 O 3 layer has been etched.
- the In 0.53 Ga 0.47 As layer was etched using phosphoric acid: hydrogen peroxide aqueous solution (3: 1: 50). Since this etchant hardly dissolves InP, the etching stopped when it reached the InP layer (sacrificial layer, second semiconductor crystal layer 106). By the etching, the Al 2 O 3 / In 0.53 Ga 0.47 As layer (active layer, third semiconductor crystal layer 108) was divided into a plurality of divided bodies. Next, a process of laminating the Al 2 O 3 layer on the processed multilayer film substrate surface and the 4-inch Si substrate was performed.
- the surface of the Al 2 O 3 layer and the surface of the Si substrate as the transfer destination substrate were irradiated with an argon ion beam to activate the surface. Thereafter, the surface of the Al 2 O 3 layer and the surface of the Si substrate faced each other, and the processed multilayer film substrate and the Si substrate were bonded together. Crimping was performed at room temperature.
- an etching solution is introduced into a cavity formed by a groove between adjacent divided bodies of the Al 2 O 3 / In 0.53 Ga 0.47 As layer, and an InP layer (second semiconductor crystal layer 106) that is a sacrificial layer is formed.
- the multilayer substrate and the Si substrate were separated while being removed by etching and leaving the Al 2 O 3 / In 0.53 Ga 0.47 As layer on the Si substrate.
- Etching of the InP layer is performed by immersing the side surface of the bonded substrate in an etching solution (10% hydrogen chloride aqueous solution) having an HCl concentration of 10% by mass at 23 ° C., supplying the etching solution into the cavity by capillary action, and leaving it as it is. It was executed by doing.
- the In 0.53 Ga 0.47 As layer hardly dissolves in the HCl etchant. Moreover, since the InP substrate was protected by the Al 2 O 3 layer and the In 0.53 Ga 0.47 As layer (cover layer), it was protected without being exposed to the HCl etchant. As described above, a semiconductor crystal layer forming substrate having an In 0.53 Ga 0.47 As layer having a thickness of 200 nm and a 300/200 ⁇ mL S pattern on a 4-inch Si substrate was obtained.
- a second element when a second element is “on” a first element such as a layer or a substrate, the second element is disposed directly on the first element.
- a case where the second element is indirectly disposed on the first element by interposing other elements between the second element and the first element can also be included.
- the case where the second element is formed “on” the first element can include the case where the second element is formed directly or indirectly on the first element, as described above.
- phrases indicating directions such as “up” and “down” indicate relative directions in the semiconductor substrate, the composite substrate, and the device, and do not indicate an absolute direction with respect to an external reference surface such as the ground. Also good.
- DESCRIPTION OF SYMBOLS 100 ... Semiconductor substrate, 102 ... Semiconductor crystal layer formation substrate, 104 ... 1st semiconductor crystal layer, 106 ... 2nd semiconductor crystal layer, 108 ... 3rd semiconductor crystal layer, 120 ... 1st cover layer, 130 ... 2nd cover layer 140 ... third cover layer, 150 ... fourth cover layer, 160 ... fifth cover layer, 200 ... semiconductor substrate, 210 ... fourth semiconductor crystal layer, 220 ... transfer destination substrate, 302 ... cover layer, 304 ... transfer destination Substrate, 402 ... cover layer, 404 ... transfer destination substrate
Abstract
Description
[非特許文献1] S. Takagi, et al., SSE, vol. 51, pp. 526-536, 2007.
[非特許文献2] Y. Bai and E. A. Fitzgerald, ECS Transactions, 33 (6) 927-932 (2010)
図1は、半導体基板100を示した断面図である。半導体基板100は、半導体結晶層形成基板102の上に、第1半導体結晶層104、第2半導体結晶層106および第3半導体結晶層108を有する。半導体結晶層形成基板102、第1半導体結晶層104、第2半導体結晶層106および第3半導体結晶層108は、半導体結晶層形成基板102、第1半導体結晶層104、第2半導体結晶層106、第3半導体結晶層108、の順に位置する。第1半導体結晶層104は犠牲層として機能する層であり、第2半導体結晶層106はエッチングストッパとして機能する層であり、第3半導体結晶層108は転写され、半導体デバイスの活性層等に利用される層である。
図2から図6は、半導体基板100を用いた複合基板の製造方法の一例を工程順に示した断面図である。本実施形態2の複合基板の製造方法は、実施形態1で説明した半導体基板100を用いる。
図9から図11は、半導体基板100を用いた複合基板の製造方法の他の例を工程順に示した断面図である。半導体基板100の上に第1カバー層120のパターンを形成し、第1カバー層120をマスクとして、第1エッチング剤を用いて、第3半導体結晶層108をエッチングする(第1エッチングステップ)までは、実施形態2と同様である。
図12は、半導体基板200を示した断面図である。本実施形態4の半導体基板200は、第4半導体結晶層210を有する点を除き、実施形態1の半導体基板100と同様である。よって、重複した説明は省略する。
図13から図18は、半導体基板200を用いた複合基板の製造方法の一例を工程順に示した断面図である。図13に示すように、半導体基板200の上に第1カバー層120のパターンを形成し、図14に示すように、第1カバー層120をマスクとし、第2エッチング剤を用いて、第4半導体結晶層210をエッチングする(第1エッチングステップ)。図15に示すように、第1カバー層120または第1エッチングステップでパターニングされた第4半導体結晶層210をマスクとし、第1エッチング剤を用いて、第3半導体結晶層108をエッチングする(第2エッチングステップ)。なお、第3半導体結晶層108のエッチングに用いるエッチング剤は、第1エッチング剤でなくともよい。また、第4半導体結晶層210のエッチングに用いるエッチング剤は、第2エッチング剤でなくともよい。
図19から図21は、半導体基板200を用いた複合基板の製造方法の他の例を工程順に示した断面図である。半導体基板200の上に第1カバー層120のパターンを形成し、第1カバー層120をマスクとし、第2エッチング剤を用いて第4半導体結晶層210を、第1エッチング剤を用いて第3半導体結晶層108を、エッチングするまでは実施形態5と同様である。本実施形態では、図19に示すように、さらに第2エッチング剤を用いて第2半導体結晶層106を順次エッチングする(第1エッチングステップ)。次に、図20に示すように、第1エッチングステップでパターニングされた第4半導体結晶層210、第3半導体結晶層108および第2半導体結晶層106を覆う第5カバー層160のパターンを形成する。さらに、図21に示すように、第1半導体結晶層104を、第1エッチング剤を用いたエッチングにより除去し、第5カバー層160で覆われた第2半導体結晶層106、第3半導体結晶層108および第4半導体結晶層210を半導体結晶層形成基板102から分離する。
図26から図30は、半導体基板100を用いた複合基板の製造方法のさらに他の例を工程順に示した断面図である。実施形態7の方法は、半導体結晶層形成基板102の裏面および側面をカバー層402で覆い、かつ、表面を第1半導体結晶層104で覆うことで、半導体結晶層形成基板102に対してエッチング選択比がない材質からなる第2半導体結晶層106であっても犠牲層として用いることができる例を説明する。本例では、半導体結晶層形成基板102の第2エッチング剤によるエッチング速度および第2半導体結晶層106の第2エッチング剤によるエッチング速度の何れもが、第1半導体結晶層104の第2エッチング剤によるエッチング速度および第3半導体結晶層108の第2エッチング剤によるエッチング速度の何れよりも大きい。
半導体結晶層形成基板102である2インチInP基板上に100nmのIn0.53Ga0.47As層(カバー層として機能する第1半導体結晶層104)、100nmのInP層(犠牲層として機能する第2半導体結晶層106)、200nmのIn0.53Ga0.47As層(活性層として機能する第3半導体結晶層108)を低圧MOCVD法によるエピタキシャル結晶成長法を用いて、順次形成し、多層膜基板を作製した。その後、多層膜基板をALD装置に導入し、ALD法により約33nmのAl2O3(カバー層402)でコーティングした。ALD-Al2O3の堆積条件は300℃、300サイクル、アルミニウム原料としてTMA(トリメチルアルミニウム)、酸化剤にH2Oを用いた。ALD法を用いることで多層膜基板の表面・裏面・側面に均一なAl2O3を堆積できた。ここで、ALD-Al2O3層のコーティング効果(酸性溶液に対する耐性)を強固なものとするために、窒素中でのポストアニール処理を600℃で90秒間行った。
Claims (25)
- 半導体結晶層形成基板の上に、第1半導体結晶層、第2半導体結晶層および第3半導体結晶層を有し、前記半導体結晶層形成基板、前記第1半導体結晶層、前記第2半導体結晶層および前記第3半導体結晶層が、前記半導体結晶層形成基板、前記第1半導体結晶層、前記第2半導体結晶層、前記第3半導体結晶層、の順に位置し、
前記第1半導体結晶層の第1エッチング剤によるエッチング速度および前記第3半導体結晶層の前記第1エッチング剤によるエッチング速度の何れもが、前記第2半導体結晶層の前記第1エッチング剤によるエッチング速度よりも大きく、
前記第1半導体結晶層の第2エッチング剤によるエッチング速度および前記第3半導体結晶層の前記第2エッチング剤によるエッチング速度の何れもが、前記第2半導体結晶層の前記第2エッチング剤によるエッチング速度よりも小さい
半導体基板。 - 第4半導体結晶層をさらに有し、前記半導体結晶層形成基板、前記第1半導体結晶層、前記第2半導体結晶層、前記第3半導体結晶層および前記第4半導体結晶層が、前記半導体結晶層形成基板、前記第1半導体結晶層、前記第2半導体結晶層、前記第3半導体結晶層、前記第4半導体結晶層の順に位置し、
前記第1半導体結晶層の第1エッチング剤によるエッチング速度および前記第3半導体結晶層の前記第1エッチング剤によるエッチング速度の何れもが、前記第4半導体結晶層の前記第1エッチング剤によるエッチング速度よりも大きく、
前記第1半導体結晶層の第2エッチング剤によるエッチング速度および前記第3半導体結晶層の前記第2エッチング剤によるエッチング速度の何れもが、前記第4半導体結晶層の前記第2エッチング剤によるエッチング速度よりも小さい
請求項1に記載の半導体基板。 - 前記半導体結晶層形成基板の前記第1エッチング剤によるエッチング速度が、前記第2半導体結晶層の前記第1エッチング剤によるエッチング速度と同等であり、
前記半導体結晶層形成基板の前記第2エッチング剤によるエッチング速度が、前記第2半導体結晶層の前記第2エッチング剤によるエッチング速度と同等である
請求項1に記載の半導体基板。 - 前記半導体結晶層形成基板がInPからなり、前記第1半導体結晶層および前記第3半導体結晶層がInGaAsまたはInAsからなり、前記第2半導体結晶層がInPからなる
請求項1に記載の半導体基板。 - 前記半導体結晶層形成基板がInPからなり、前記第1半導体結晶層および前記第3半導体結晶層がInGaAsまたはInAsからなり、前記第2半導体結晶層および前記第4半導体結晶層がInPからなる
請求項2に記載の半導体基板。 - 前記第3半導体結晶層が半導体積層構造であり、
前記半導体積層構造が、InPに格子整合または擬格子整合する、複数の半導体層からなる
請求項4に記載の半導体基板。 - 前記半導体結晶層形成基板がGaAsまたはGeからなり、前記第1半導体結晶層および前記第3半導体結晶層がSiGeからなり、前記第2半導体結晶層がGeからなる
請求項1に記載の半導体基板。 - 前記半導体結晶層形成基板がGaAsまたはGeからなり、前記第1半導体結晶層および前記第3半導体結晶層がSiGeからなり、前記第2半導体結晶層および前記第4半導体結晶層がGeからなる
請求項2に記載の半導体基板。 - 半導体結晶層形成基板の上に、第1半導体結晶層、第2半導体結晶層および第3半導体結晶層を、前記第1半導体結晶層、前記第2半導体結晶層、前記第3半導体結晶層の順に、エピタキシャル成長法により形成するステップを有し、
前記第1半導体結晶層、前記第2半導体結晶層および前記第3半導体結晶層が、前記第1半導体結晶層の第1エッチング剤によるエッチング速度および前記第3半導体結晶層の前記第1エッチング剤によるエッチング速度の何れもが、前記第2半導体結晶層の前記第1エッチング剤によるエッチング速度よりも大きく、前記第1半導体結晶層の第2エッチング剤によるエッチング速度および前記第3半導体結晶層の前記第2エッチング剤によるエッチング速度の何れもが、前記第2半導体結晶層の前記第2エッチング剤によるエッチング速度よりも小さいものである
半導体基板の製造方法。 - 半導体結晶層形成基板の上に、第1半導体結晶層、第2半導体結晶層、第3半導体結晶層および第4半導体結晶層を、前記第1半導体結晶層、前記第2半導体結晶層、前記第3半導体結晶層、前記第4半導体結晶層の順に、エピタキシャル成長法により形成するステップを有し、
前記第1半導体結晶層、前記第2半導体結晶層、前記第3半導体結晶層および前記第4半導体結晶層が、前記第1半導体結晶層の第1エッチング剤によるエッチング速度および前記第3半導体結晶層の前記第1エッチング剤によるエッチング速度の何れもが、前記第2半導体結晶層の前記第1エッチング剤によるエッチング速度および前記第4半導体結晶層の前記第1エッチング剤によるエッチング速度の何れよりも大きく、前記第1半導体結晶層の第2エッチング剤によるエッチング速度および前記第3半導体結晶層の前記第2エッチング剤によるエッチング速度の何れもが、前記第2半導体結晶層の前記第2エッチング剤によるエッチング速度および前記第4半導体結晶層の前記第2エッチング剤によるエッチング速度の何れよりも小さいものである
半導体基板の製造方法。 - 請求項1に記載の半導体基板の上に第1カバー層のパターンを形成するステップと、
前記第1カバー層をマスクとし、前記第3半導体結晶層をエッチングする第1エッチングステップと、
前記第1エッチングステップでパターニングされた前記第3半導体結晶層を覆う第2カバー層のパターンを形成するステップと、
前記第2カバー層をマスクとし、前記第2エッチング剤を用いて、前記第2半導体結晶層をエッチングする第2エッチングステップと、
前記第1半導体結晶層を、前記第1エッチング剤を用いたエッチングにより除去し、前記第2カバー層で覆われた前記第2半導体結晶層および前記第3半導体結晶層を前記半導体結晶層形成基板から分離するステップと
を有する複合基板の製造方法。 - 前記第1エッチングステップにおいて、前記第1エッチング剤を用いて前記第3半導体結晶層をエッチングする
請求項11に記載の複合基板の製造方法。 - 前記第2カバー層が、前記第3半導体結晶層を覆うとともに、前記半導体結晶層形成基板の裏面および側面を覆う
請求項11に記載の複合基板の製造方法。 - 請求項1に記載の半導体基板の上に第1カバー層のパターンを形成するステップと、
前記第1カバー層をマスクとし、前記第3半導体結晶層をエッチングする第1エッチングステップと、
前記第1カバー層または前記第1エッチングステップでパターニングされた前記第3半導体結晶層をマスクとし、前記第2エッチング剤を用いて、前記第2半導体結晶層をエッチングする第2エッチングステップと、
前記第1エッチングステップでパターニングされた前記第3半導体結晶層および前記第2エッチングステップでパターニングされた前記第2半導体結晶層を覆う第3カバー層のパターンを形成するステップと、
前記第1半導体結晶層を、前記第1エッチング剤を用いたエッチングにより除去し、前記第3カバー層で覆われた前記第2半導体結晶層および前記第3半導体結晶層を前記半導体結晶層形成基板から分離するステップと
を有する複合基板の製造方法。 - 前記第3カバー層が、前記第3半導体結晶層および前記第2半導体結晶層を覆うとともに、前記半導体結晶層形成基板の裏面および側面を覆う
請求項14に記載の複合基板の製造方法。 - 請求項2に記載の半導体基板の上に第1カバー層のパターンを形成するステップと、
前記第1カバー層をマスクとし、前記第4半導体結晶層をエッチングする第1エッチングステップと、
前記第1カバー層または前記第1エッチングステップでパターニングされた前記第4半導体結晶層をマスクとし、前記第3半導体結晶層をエッチングする第2エッチングステップと、
前記第1エッチングステップでパターニングされた前記第4半導体結晶層および前記第2エッチングステップでパターニングされた前記第3半導体結晶層を覆う第4カバー層のパターンを形成するステップと、
前記第4カバー層をマスクとし、前記第2エッチング剤を用いて、前記第2半導体結晶層をエッチングする第3エッチングステップと、
前記第1半導体結晶層を、前記第1エッチング剤を用いたエッチングにより除去し、前記第4カバー層で覆われた前記第2半導体結晶層、前記第3半導体結晶層および前記第4半導体結晶層を前記半導体結晶層形成基板から分離するステップと
を有する複合基板の製造方法。 - 前記第1エッチングステップにおいて、前記第2エッチング剤を用いて前記第4半導体結晶層をエッチングし、
前記第2エッチングステップにおいて、前記第1エッチング剤を用いて前記第3半導体結晶層をエッチングする
請求項16に記載の複合基板の製造方法。 - 前記第4カバー層が、前記第4半導体結晶層および前記第3半導体結晶層を覆うとともに、前記半導体結晶層形成基板の裏面および側面を覆う
請求項16に記載の複合基板の製造方法。 - 請求項2に記載の半導体基板の上に第1カバー層のパターンを形成するステップと、
前記第1カバー層をマスクとし、前記第4半導体結晶層および前記第3半導体結晶層をエッチングし、更に前記第2エッチング剤を用いて前記第2半導体結晶層をエッチングする第1エッチングステップと、
前記第1エッチングステップでパターニングされた前記第4半導体結晶層、前記第3半導体結晶層および前記第2半導体結晶層を覆う第5カバー層のパターンを形成するステップと、
前記第1半導体結晶層を、前記第1エッチング剤を用いたエッチングにより除去し、前記第5カバー層で覆われた前記第2半導体結晶層、前記第3半導体結晶層および前記第4半導体結晶層を前記半導体結晶層形成基板から分離するステップと
を有する複合基板の製造方法。 - 前記第5カバー層が、前記第4半導体結晶層、前記第3半導体結晶層および前記第2半導体結晶層を覆うとともに、前記半導体結晶層形成基板の裏面および側面を覆う
請求項19に記載の複合基板の製造方法。 - 前記分離するステップの前に、前記半導体基板の前記第3半導体結晶層が形成された側の表面と、転写先基板の表面とを向い合せ、前記半導体基板と前記転写先基板とを貼り合せるステップをさらに有し、
前記分離するステップにおいて、前記第2半導体結晶層および前記第3半導体結晶層を含む半導体結晶層を前記転写先基板に残した状態で、前記半導体基板と前記転写先基板とを分離する
請求項11に記載の複合基板の製造方法。 - 請求項1に記載の半導体基板の全面を覆う第6カバー層を形成するステップと、
前記第3半導体結晶層の上の前記第6カバー層の一部をパターニングして除去するステップと、
前記第3半導体結晶層の上の前記第6カバー層をマスクとし、前記第3半導体結晶層をエッチングするステップと、
前記第2半導体結晶層を、前記第2エッチング剤を用いたエッチングにより除去し、前記第6カバー層および前記第1半導体結晶層で覆われた前記半導体結晶層形成基板から前記第3半導体結晶層を分離するステップと、
を有する複合基板の製造方法。 - 前記第3半導体結晶層をエッチングするステップの後、前記分離するステップの前に、前記第3半導体結晶層の表面と転写先基板の表面とを向い合せ、前記半導体基板と前記転写先基板とを貼り合せるステップをさらに有し、
前記分離するステップにおいて、前記第3半導体結晶層を前記転写先基板に残した状態で、前記半導体基板と前記転写先基板とを分離する
請求項22に記載の複合基板の製造方法。 - 前記第3半導体結晶層をエッチングするステップの後、前記貼り合せるステップの前に、前記第6カバー層をマスクとし、前記第2エッチング剤を用いて前記第2半導体結晶層をエッチングするステップをさらに有する
請求項23に記載の複合基板の製造方法。 - 半導体結晶層形成基板の上に、第1半導体結晶層、第2半導体結晶層および第3半導体結晶層を有し、前記半導体結晶層形成基板、前記第1半導体結晶層、前記第2半導体結晶層および前記第3半導体結晶層が、前記半導体結晶層形成基板、前記第1半導体結晶層、前記第2半導体結晶層、前記第3半導体結晶層、の順に位置し、
前記半導体結晶層形成基板の第2エッチング剤によるエッチング速度および前記第2半導体結晶層の前記第2エッチング剤によるエッチング速度の何れもが、前記第1半導体結晶層の前記第2エッチング剤によるエッチング速度および前記第3半導体結晶層の前記第2エッチング剤によるエッチング速度の何れよりも大きい半導体基板を用いて複合基板を製造する製造方法であって、
前記半導体基板の全面を覆う第6カバー層を形成するステップと、
前記第3半導体結晶層上の第6カバー層の一部をパターニングして除去するステップと、
前記第3半導体結晶層上の前記第6カバー層をマスクとし、前記第3半導体結晶層をエッチングするステップと、
前記第2半導体結晶層を、前記第2エッチング剤を用いたエッチングにより除去し、前記第6カバー層および前記第1半導体結晶層で覆われた前記半導体結晶層形成基板から前記第3半導体結晶層を分離するステップと、
を有する複合基板の製造方法。
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US20150137187A1 (en) | 2015-05-21 |
JPWO2014017063A1 (ja) | 2016-07-07 |
TW201411713A (zh) | 2014-03-16 |
KR20150038217A (ko) | 2015-04-08 |
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