WO2013190717A1 - Carte de circuit imprimé, ensemble carte de circuit imprimé, procédé de fabrication d'une carte de circuit imprimé, et appareil d'éclairage - Google Patents

Carte de circuit imprimé, ensemble carte de circuit imprimé, procédé de fabrication d'une carte de circuit imprimé, et appareil d'éclairage Download PDF

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Publication number
WO2013190717A1
WO2013190717A1 PCT/JP2012/074704 JP2012074704W WO2013190717A1 WO 2013190717 A1 WO2013190717 A1 WO 2013190717A1 JP 2012074704 W JP2012074704 W JP 2012074704W WO 2013190717 A1 WO2013190717 A1 WO 2013190717A1
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WO
WIPO (PCT)
Prior art keywords
printed wiring
wiring board
protective film
material layer
film
Prior art date
Application number
PCT/JP2012/074704
Other languages
English (en)
Japanese (ja)
Inventor
俊治 永良
Original Assignee
住友電工プリントサーキット株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友電工プリントサーキット株式会社 filed Critical 住友電工プリントサーキット株式会社
Priority to CN201280036217.7A priority Critical patent/CN103703579A/zh
Publication of WO2013190717A1 publication Critical patent/WO2013190717A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask

Definitions

  • the present invention relates to a printed wiring board, a printed wiring board assembly, a printed wiring board manufacturing method, and an illumination device. Specifically, the present invention relates to a printed wiring board or the like that can increase the light utilization efficiency of an LED light-emitting element without causing damage to a reflector layer in a manufacturing process or the like.
  • LED light-emitting elements In recent years, the use range of LED light-emitting elements has been expanded with increasing efficiency. For example, it is often used not only for an illumination device as an alternative light source such as an incandescent bulb or a halogen bulb, but also for a large illumination device such as a backlight of a liquid crystal display device.
  • a reflective material layer is provided on the flexible printed wiring board on which the LED light emitting element is mounted, and the light traveling toward the surface of the flexible printed wiring board is reflected by the reflective material layer. Can be increased.
  • a white reflective material in which a pigment such as titanium oxide is blended with an epoxy resin-based resin material is often employed.
  • the reflector layer is often configured by applying an epoxy resin coating material to an insulating coating layer covering the conductive pattern of the printed wiring board. Moreover, the reflective material layer is formed before the LED light emitting element is mounted, and thereafter, the electronic component mounting process for mounting the LED light emitting element and the processing steps such as the punching process are performed on the printed wiring board. Applied.
  • the reflecting surface of an illumination device or the like is often a curved surface or a stepped shape
  • a flexible printed wiring board equipped with LEDs is often employed.
  • the flexible printed wiring board is flexible, the reflector layer is likely to be scratched or wrinkled, and dust and dust are easily adsorbed, which tends to cause a problem that the reflectance is reduced during the manufacturing process.
  • An object of the present invention is to solve the above-described problems and to provide a printed wiring board that can prevent the reflector layer from being scratched in the manufacturing process and can prevent adsorption of dust and dirt.
  • the present invention is a printed wiring board configured with a reflective material layer, wherein the reflective material layer is formed with an opening provided in a predetermined region, While providing the corresponding opening part, it is comprised including the protective film laminated
  • stacked so that peeling was possible with respect to the reflective surface of the said reflecting material layer is provided.
  • the protective film is provided with an opening corresponding to the opening of the reflective material layer. For this reason, the process process with respect to the said opening part etc. can be performed in the state which laminated
  • the protective film is preferably removed after the printed wiring board is mounted on a lighting device or the like.
  • the portion where the opening is provided is not particularly limited. For example, it can be provided in the component mounting area, connection area, or processing area of the printed wiring board.
  • LED light emitting elements In addition to LED light emitting elements, other electronic components can be mounted in the opening. For example, a semiconductor chip for controlling an LED light emitting element can be mounted. Moreover, connection parts, such as a connector, can also be mounted.
  • the film having various characteristics can be adopted as the protective film according to the manufacturing process performed in a state where the protective film is laminated.
  • the protective film and the adhesive layer that is laminated so as to be peelable are solder reflow. Consists of heat resistance to processing.
  • a film or adhesive having no heat resistance can be employed.
  • a protective film formed of polyimide resin, polyamideimide resin, polyesterimide resin, fluorine resin, or the like it is preferable to employ a protective film formed of polyimide resin, polyamideimide resin, polyesterimide resin, fluorine resin, or the like.
  • a film formed from polyethylene terephthalate, polyethylene naphthalate, or the like can be employed.
  • a transparent protective film can also be employed in order to inspect the scratches or the like of the reflective material layer in a state where the protective film is laminated in the middle of the printed wiring board processing step or after the printed wiring board processing step is completed. .
  • the protective film can be formed by directly applying a liquid film material to the reflective surface of the reflective material layer, or the reflective surface of the reflective material layer via an adhesive layer capable of peeling a film having a predetermined thickness. It can also be laminated. Further, when the protective film is required to have heat resistance, the adhesive layer is also required to have heat resistance. For example, a silicone-based adhesive or an ester-based adhesive can be employed. The adhesive may be applied to the protective film or the reflective surface when the protective film is laminated on the reflective surface of the reflective material layer, or may be applied in advance to the protective film, It can also be laminated on the reflective surface of the reflective material layer by pressure bonding or the like.
  • the protective film can be provided by being laminated via the adhesive layer on the reflective surface of the reflective material layer laminated on the printed wiring board. Moreover, it laminates
  • the form and configuration of the reflective material layer are not particularly limited.
  • it can be formed by blending a heat resistant resin component with a white pigment or the like.
  • the resin component for example, ethylene / tetrafluoroethylene copolymer, tetrafluoroethylene / hexafluoropolypyrene copolymer, perfluoroalkoxy fluororesin, polytetrafluoroethylene, natural rubber, silicone resin, silicone rubber, And those composed of one or more resin components selected from the group consisting of polypropylene.
  • the white pigment for example, a pigment containing at least one substance selected from the group consisting of titanium oxide, barium sulfate, aluminum oxide, calcium carbonate, and zinc oxide can be employed.
  • the reflective material layer does not need to be white, and various colors and forms can be adopted as long as the light generated from the LED light emitting element can be reflected.
  • a metal thin film having a high reflection efficiency can be coated and a film or the like can be employed as the reflective material layer.
  • the material form of the reflector layer is not particularly limited.
  • the reflective material layer can be formed by coating and laminating a coating material formed from the resin composition on an insulating coating layer of a printed wiring board. Moreover, it can also form by carrying out the lamination
  • the insulating coating layer itself can be formed as a reflector layer.
  • the type of printed wiring board to which the present invention is applied is not particularly limited.
  • the present invention can be applied not only to rigid printed wiring boards but also to flexible printed wiring boards. Moreover, it can be applied not only to single-sided and double-sided flexible printed wiring boards but also to multilayer flexible printed wiring boards.
  • the present invention can be applied to one printed wiring board. Further, the present invention can be applied to a printed wiring board assembly in which a plurality of printed wiring boards are integrally formed.
  • a printed wiring board assembly in which a plurality of printed wiring boards are connected and held can be configured using the protective film and the adhesive layer according to the present invention.
  • the printed wiring board according to the present invention includes a step of preparing a printed wiring board original plate on which a conductive pattern of one or two or more printed wiring boards is formed, and the reflection having an opening in a predetermined area on the printed wiring board original plate.
  • An electronic component mounting process for mounting an electronic component and a printed wiring board processing process performed in a state where the protective film is laminated are manufactured.
  • the method for manufacturing a printed wiring board according to the present invention can be applied to a method for manufacturing a printed wiring board having one conductive pattern, or can be applied to a method for manufacturing a printed wiring board assembly having a plurality of conductive patterns. You can also.
  • the protective film lamination step is performed before the printed wiring board processing step. And an electronic component mounting process and a predetermined printed wiring board processing process are performed in the state which laminated
  • the reflecting material layer forming step can be performed, for example, by applying a reflecting material paint to the insulating coating layer laminated on the printed wiring board original plate.
  • the insulating coating layer of the printed wiring board can be formed by laminating and bonding the insulating coating film on which the reflective material layer is formed in advance to the printed wiring board original plate via an adhesive layer.
  • the printed wiring board base plate is provided with regions where electrodes are exposed in order to connect electronic components including LED light-emitting elements and connection components such as connectors, and the insulating coating layer is opened in the state where these regions are opened. And a reflective material layer is formed.
  • the protective film laminating step can be performed by laminating an adhesive layer that can peel off the protective film on the reflective material layer formed on the printed wiring board original plate. Moreover, the protective film lamination process which laminates
  • the peelable adhesive layer can be provided by coating or the like when the protective film is laminated on the reflector layer, or can be provided in advance on the protective film.
  • the electronic component mounting step can be performed before the protective film lamination step or after the protective film is laminated.
  • the method for performing the electronic component mounting process is not particularly limited.
  • the electronic component mounting process can be performed by a solder reflow process.
  • the protective film and an adhesive for bonding the protective film are formed of a material having heat resistance against the solder reflow processing.
  • the protective film laminating step is performed after the electronic component mounting step is performed by the solder reflow process, heat resistance is not required for the protective film and the adhesive that bonds the protective film. In this case, it suffices to have strength and workability applicable to the printed wiring board processing step.
  • Various printed wiring board processing steps can be performed in a state where the protective film is laminated.
  • a printed wiring board processing step a punching step, a connecting step for connecting with another connecting member, an attachment member mounting step, a bending step, an inspection step, and the like can be performed.
  • stacked the protective film What is necessary is just to perform at least 1 process.
  • the protective film by performing the electronic component mounting step and the printed wiring board processing step, the reflective material layer is protected in each printed wiring board processing step, the reflective material layer is scratched, Dust and dust can be prevented from being adsorbed.
  • a transparent protective film and laminating up to the final processing step it is possible to perform an inspection process for inspecting the reflector layer for scratches in the state where the protective film is laminated. Become.
  • the method and the number of times of performing the punching process are not particularly limited.
  • a flexible printed wiring board with a small thickness has flexibility, so it may be difficult to carry out the punching process with high accuracy.
  • the protective film by laminating the protective film to increase the rigidity, the punching process can be easily performed. Can be performed.
  • stacking the said protective film the handleability in each process process and a conveyance process also increases.
  • a coating curing film may be laminated on the reflector layer.
  • the above-mentioned film curing film is provided when the reflective material layer is formed by coating, and does not have heat resistance. Therefore, it is difficult to perform the electronic component mounting process by solder reflow according to the present invention in a state where the coating film curing film is laminated.
  • a laminated film comprising an insulating coating film, a reflective material layer laminated on the insulating coating film, and a coating curing film laminated on the reflective material layer through an adhesive layer that can be peeled off is prepared.
  • a printed wiring board in which a conductive pattern of one or two or more printed wiring boards is formed by a step, an opening forming step of forming an opening in a predetermined region of the laminated film, and an insulating coating film constituting the laminated film Insulating coating film laminating step for laminating on an original plate via an adhesive layer, coating film curing film removing step for peeling and removing the coating film curing film and the adhesive layer from the reflector layer, and coating film curing After the film removal step, an electronic component mounting step for mounting an electronic component in a predetermined opening, and after the electronic component mounting step, a holding unit having an opening corresponding to the opening.
  • a production method comprising a protective film laminating step of laminating a film on a reflective surface of the reflective material layer via
  • the reflective material layer can be protected by the coating film curing film until the electronic component mounting process is performed, and the reflective material layer can be protected by the protective film after the electronic component mounting process.
  • the LED light emitting element is mounted on the printed wiring board according to the present invention to form various LED light emitting element mounted printed wiring boards, and these LED light emitting element mounted printed wiring boards are used to provide not only a general lighting device but also a liquid crystal display device.
  • Various illumination devices such as backlights can be configured.
  • the present invention is applied to a flexible printed wiring board.
  • the present invention can also be applied to rigid printed wiring boards.
  • FIG. 1 shows a cross section of a flexible printed wiring board original plate 1 for forming a flexible printed wiring board according to the present invention.
  • a flexible printed wiring board original plate 1 shown in FIG. 1 is used for manufacturing a plurality of flexible printed wiring boards for mounting LED light emitting elements, and although not shown, a plurality of conductive materials are provided on an insulating substrate 2. Pattern 3 is formed.
  • the flexible printed wiring board original plate 1 is formed of an insulating base 2 formed from a polyimide resin or the like, and a copper foil layer laminated on the insulating base 2 and a conductive layer constituting the conductive pattern 3 18, an insulating coating layer 5 formed of polyimide resin or the like and laminated and bonded to the conductive layer 18 via the adhesive layer 4, and a reflective material layer 6 provided on the insulating coating layer 5. It is configured.
  • the thickness of each layer of the flexible printed wiring board original plate 1 is not particularly limited.
  • the thickness of the insulating substrate 2 can be set to 5 to 50 ⁇ m, preferably 12 to 25 ⁇ m. If the thickness is less than 5 ⁇ m, insulation cannot be secured. On the other hand, when the thickness exceeds 50 ⁇ m, flexibility as a flexible printed wiring board cannot be secured.
  • the thickness of the conductive layer 18 can be set to 5 to 50 ⁇ m, preferably 12 to 35 ⁇ m. If the thickness is less than 5 ⁇ m, insulation cannot be secured. On the other hand, when the thickness exceeds 50 ⁇ m, flexibility as a flexible printed wiring board cannot be secured.
  • the thickness of the insulating coating layer 5 conductive pattern 3 can be set to 5 to 50 ⁇ m, preferably 12 to 25 ⁇ m. If the thickness is less than 5 ⁇ m, insulation cannot be secured. On the other hand, when the thickness exceeds 50 ⁇ m, flexibility as a flexible printed wiring board cannot be secured.
  • the reflective material layer 6 forms a reflective material film also serving as a conductive protective film by applying and laminating a coating material constituting the reflective material layer 6 on the insulating film constituting the insulating coating layer 5 in advance. This is laminated and bonded to the insulating base 2 and the conductive layer 18.
  • the said reflecting material layer 6 can also be apply
  • the reflective material layer 6 according to the present embodiment is formed by applying a white reflective resin ink to the film material constituting the insulating coating layer 5 by a screen printing method so as to have a thickness of 25 ⁇ m.
  • the reflector layer 6 can be formed by blending a heat resistant resin component with a white pigment or the like.
  • a resin component for example, ethylene / tetrafluoroethylene copolymer, tetrafluoroethylene / hexafluoropolypyrene copolymer, perfluoroalkoxy fluororesin, polytetrafluoroethylene, natural rubber, silicone resin, silicone rubber, And those composed of one or more resin components selected from the group consisting of polypropylene.
  • the white pigment for example, a pigment containing at least one substance selected from the group consisting of titanium oxide, barium sulfate, aluminum oxide, calcium carbonate, and zinc oxide can be employed.
  • the reflective material layer 6 is formed by applying a white reflective resin ink.
  • the reflective material is formed of various materials.
  • a layer can be provided.
  • the insulating coating layer and the reflective material layer can be formed using an insulating film including a metal coating layer having reflective performance.
  • the insulating coating layer 5 and the reflector layer 6 according to the present embodiment are provided with openings 9 through which the electronic component connecting electrodes 7 and 8 of the conductive pattern 3 are exposed. As will be described later, an LED light emitting element or other electronic component is mounted in the opening 9.
  • the protective film 10 is laminated
  • the protective film 10 according to the present embodiment is formed of a heat-resistant film that can withstand the temperature acting in the solder reflow process, and the adhesive layer 11 on which the protective film 10 is laminated also has heat resistance. It has been adopted.
  • the adhesive layer 11 according to this embodiment is laminated in advance on the protective film 10.
  • the protective film 10 for example, a heat-resistant film formed from polyimide resin, polyamideimide resin, polyesterimide resin, fluororesin, or the like is employed.
  • the thickness of the protective film 10 is not particularly limited, and for example, a film having a thickness of 10 to 100 ⁇ m can be employed.
  • the adhesive layer 11 a layer formed from a heat resistant material such as a silicone resin or an acrylic resin is employed.
  • the thickness of the adhesive layer 11 is not particularly limited, and can be formed with a thickness of 10 to 100 ⁇ m.
  • the adhesive layer 11 has a peelable slightly adhesive property and is pre-coated on the protective film 10, and the protective film 10 is laminated on the reflective surface 6 a of the reflective material layer 6 by pressure bonding. Glued. Thereby, the flexible printed wiring board 100 shown in FIG. 3 is formed.
  • the adhesive a slightly sticky adhesive that can be peeled is used. Therefore, after the LED light emitting element and the electronic component are mounted and various printed wiring board processing steps are completed, the protective film 10 is easily peeled off. Can be removed.
  • the protective film 10 is provided with an opening 12 corresponding to the opening 9 formed in the insulating coating layer 5 and the reflective material layer 6. As shown in FIGS. 2 and 3, the protective film 10 is laminated and adhered so that the opening 12 corresponds to the opening 9 provided in the insulating coating layer 5 and the reflective material layer 6.
  • an electronic component mounting process and various printed wiring board processing steps are performed on the flexible printed wiring board 100 in a state where the protective film 10 is laminated.
  • an electronic component mounting process is performed in which the LED light emitting element 13 is mounted in the openings 9 and 12 by solder reflow processing in a state where the protective film 10 is laminated.
  • the electrodes 14 and 15 of the LED light emitting element 13 are connected to the electrodes 7 and 8 provided on the conductive layer 18 via a solder layer (not shown) by solder reflow processing. Thereby, the flexible printed wiring board 100a carrying the LED light emitting element 13 is formed.
  • the LED light emitting element 13 can be mounted without peeling or the like.
  • connection parts such as a connector, can also be connected to the electrodes 7 and 8 provided in the openings 9 and 12.
  • the flexible printed wiring board 100 is configured as a wiring board assembly used for manufacturing a plurality of flexible printed wiring boards for mounting LED light emitting elements, in order to separate each flexible printed wiring board. A punching process is performed.
  • the punching process is also performed in a state where the protective film 10 is laminated.
  • the part and the number of times the punching process is performed are not particularly limited.
  • assembly 100b with which the some flexible printed wiring board for LED light emitting element mounting was connected via the said part 20 of a printed wiring board is formed.
  • the protective film 10 is laminated on the reflective material layer 6, the reflective material layer 6 is scratched or dust or dust adheres in each processing step. There is no. For this reason, the reflective efficiency of the said reflecting material layer 6 does not fall, and a highly efficient illuminating device can be comprised.
  • the strength and rigidity of the flexible printed wiring board during processing is increased. For this reason, the handleability and workability in each processing step are enhanced.
  • the protective film 10 by adopting a transparent film as the protective film 10, it is possible to inspect the reflector layer for scratches and the like in a state where the protective film is laminated, and the inspection process of the printed wiring board can be performed with high accuracy. It is also possible to carry out easily.
  • stacking the protective film 10 is not specifically limited.
  • the punching process is performed in a state where the protective film is laminated, but a printed wiring board processing process such as a connection process, an attachment member mounting process, a bending process, and an inspection process can be performed.
  • a printed wiring board processing process such as a connection process, an attachment member mounting process, a bending process, and an inspection process can be performed.
  • an electronic component mounting process is performed before laminating
  • an electronic component mounting process and a printed wiring board processing process can also be performed in the state which laminated
  • a coating curing film may be provided on the surface of the reflective material layer 6.
  • the said film curing film is not equipped with the strength and heat resistance which can withstand the electronic component mounting process using the solder reflow process. For this reason, after peeling off and removing the said coating film curing film, the said protective film lamination process can be performed, and an electronic component mounting process and a printed wiring board processing process can be performed after that.
  • 2nd Embodiment performs the process to an electronic component mounting process in the state which laminated
  • an insulating coating film 205 As shown in FIG. 8, in the present embodiment, an insulating coating film 205, a reflective material layer 206 laminated on the insulating coating film 205, and an adhesive layer 251 that can be peeled off from the reflective material layer 206 are used.
  • the process of preparing the laminated film 260 provided with the laminated coating film curing film 250 is performed.
  • An adhesive layer 204 is laminated on the side of the insulating coating film 205 opposite to the reflective material layer 206.
  • the coating film curing film 250 a film having no heat resistance formed from polyethylene terephthalate, polyethylene naphthalate or the like is employed.
  • the adhesive constituting the adhesive layer 251 is not required to have heat resistance.
  • an opening forming process is performed in which an opening 252 is formed in a predetermined region of the laminated film 260.
  • the opening forming process is performed by a punching process as in the first embodiment.
  • the laminated film 260 having the opening 252 formed thereon is laminated and bonded to the printed wiring board original plate 201 via the adhesive layer 204, whereby the printed wiring board original plate 201 shown in FIG. 9 is formed.
  • the coating curing film 250 and the adhesive layer 251 do not endure the temperature acting in the electronic component mounting process using the solder reflow process. For this reason, in this embodiment, as shown in FIG. 10, the coating-curing film removal process which removes the coating-curing film 250 and the adhesive bond layer 251 is performed. Thereafter, an electronic component mounting step is performed, and an electronic component 213 such as an LED light emitting element is mounted as shown in FIG.
  • a protective film lamination step of laminating the protective film 210 is performed so that the reflection surface 206a of the reflective material layer 206 is not damaged.
  • the said protective film lamination process is performed by laminating
  • the reflective material layer 206 is protected by the coating film curing film 250 in the manufacturing process up to the electronic component mounting process, and in the printed wiring board processing process after the electronic component mounting process.
  • the reflective material layer 206 can be protected by the protective film 210.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Led Device Packages (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

La présente invention a trait à une carte de circuit imprimé souple (100) qui est conçue de manière à être pourvue d'une couche de matériau réfléchissant (6). La couche de matériau réfléchissant est formée de manière à être dotée d'une ouverture (9) qui est prévue dans une région prédéterminée, et la carte de circuit imprimé souple est conçue de manière à être pourvue d'un film de protection (10), qui est doté d'une ouverture (12) qui correspond à l'ouverture de la couche de matériau réfléchissant (6), et qui est stratifié de façon amovible sur la surface réfléchissante (6a) de la couche de matériau réfléchissant.
PCT/JP2012/074704 2012-06-21 2012-09-26 Carte de circuit imprimé, ensemble carte de circuit imprimé, procédé de fabrication d'une carte de circuit imprimé, et appareil d'éclairage WO2013190717A1 (fr)

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CN201280036217.7A CN103703579A (zh) 2012-06-21 2012-09-26 印刷配线板、印刷配线板集合体、印刷配线板的制造方法以及照明装置

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JP2012-139493 2012-06-21
JP2012139493A JP2014003260A (ja) 2012-06-21 2012-06-21 プリント配線板、プリント配線板集合体、プリント配線板の製造方法及び照明装置。

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WO2018091230A1 (fr) * 2016-11-16 2018-05-24 Epcos Ag Module de puissance à vulnérabilité aux défauts réduite et son utilisation
CN112911819A (zh) * 2019-11-19 2021-06-04 同扬光电（江苏）有限公司 线路板及其制作方法、发光装置及其制作方法

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GB2530307A (en) * 2014-09-19 2016-03-23 Johnson Electric Sa LED lighting assembly
WO2018091230A1 (fr) * 2016-11-16 2018-05-24 Epcos Ag Module de puissance à vulnérabilité aux défauts réduite et son utilisation
CN112911819A (zh) * 2019-11-19 2021-06-04 同扬光电（江苏）有限公司 线路板及其制作方法、发光装置及其制作方法

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